WO2024001097A1 - 天线装置及终端 - Google Patents

天线装置及终端 Download PDF

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Publication number
WO2024001097A1
WO2024001097A1 PCT/CN2022/141106 CN2022141106W WO2024001097A1 WO 2024001097 A1 WO2024001097 A1 WO 2024001097A1 CN 2022141106 W CN2022141106 W CN 2022141106W WO 2024001097 A1 WO2024001097 A1 WO 2024001097A1
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WO
WIPO (PCT)
Prior art keywords
near field
field communication
communication chip
antenna radiator
coil
Prior art date
Application number
PCT/CN2022/141106
Other languages
English (en)
French (fr)
Inventor
万小勇
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2024001097A1 publication Critical patent/WO2024001097A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors

Definitions

  • the present application relates to packaging technology, and in particular to an antenna device and a terminal.
  • smartphones are becoming more and more widely used and have more and more functions, and have become an essential electronic device in people's daily lives.
  • a variety of antennas are often installed inside, such as cellular data antennas, wireless communication (WIFI) antennas, near field communication (Near Field Communication, NFC) antennas, etc.
  • WIFI wireless communication
  • NFC Near Field Communication
  • An embodiment of the present application provides an antenna device and a terminal.
  • the antenna device in the embodiment of the present application includes a first antenna radiator, a second antenna radiator, a first non-near field communication chip, and a near field communication chip.
  • the first antenna radiator includes a first feeding point and a first connection point, and the first connection point is used for grounding.
  • the second antenna radiator includes a second feed point and a second connection point. The second connection point is used for grounding.
  • the first antenna radiator and the second antenna radiator pass through the first connection point. point is connected to the second connection point.
  • the first non-near field communication chip is connected to the first feed point and/or the second feed point, and the first non-near field communication chip transmits electricity to the first feed point through the first feed point.
  • the antenna radiator transmits a first non-near field communication excitation current, and/or transmits the first non-near field communication excitation current to the second antenna radiator through the second feeding point. Both ends of the near field communication chip are respectively connected to the first feed point and the second feed point, and the near field communication chip transmits to the first antenna radiator through the first feed point. A near field communication excitation current is transmitted to the second antenna radiator through the second feeding point.
  • the terminal in the embodiment of the present application includes a housing and an antenna device.
  • the antenna device is provided on the housing.
  • the antenna device includes a first antenna radiator, a second antenna radiator, a first non-near field communication chip, and a near field communication chip.
  • the first antenna radiator includes a first feeding point and a first connection point, and the first connection point is used for grounding.
  • the second antenna radiator includes a second feed point and a second connection point.
  • the second connection point is used for grounding.
  • the first antenna radiator and the second antenna radiator pass through the first connection point. point is connected to the second connection point.
  • the first non-near field communication chip is connected to the first feed point and/or the second feed point, and the first non-near field communication chip transmits electricity to the first feed point through the first feed point.
  • the antenna radiator transmits a first non-near field communication excitation current, and/or transmits the first non-near field communication excitation current to the second antenna radiator through the second feeding point. Both ends of the near field communication chip are respectively connected to the first feed point and the second feed point, and the near field communication chip transmits to the first antenna radiator through the first feed point. A near field communication excitation current is transmitted to the second antenna radiator through the second feeding point.
  • Figure 1 is a schematic plan view of an antenna device according to certain embodiments of the present application.
  • Figure 2 is a schematic plan view of a terminal according to certain embodiments of the present application.
  • Figure 3 is a schematic plan view of an antenna device according to another embodiment of the present application.
  • Figure 4 is a schematic plan view of an antenna device according to another embodiment of the present application.
  • Figure 5 is a schematic plan view of an antenna device according to another embodiment of the present application.
  • Figure 6 is a schematic plan view of an antenna device according to another embodiment of the present application.
  • FIG. 7 is a schematic diagram of the installation of the antenna device of Figure 6;
  • Figure 8 is a schematic plan view of the internal structure of a terminal according to certain embodiments of the present application.
  • Figures 9 and 10 are schematic plan views of the coils and magnetic components of the antenna device according to certain embodiments of the present application.
  • Figure 11 is a schematic plan view of a terminal according to some embodiments of the present application.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features.
  • features defined as “first” and “second” may explicitly or implicitly include one or more of the described features.
  • “plurality” means two or more than two, unless otherwise explicitly and specifically limited.
  • connection should be understood in a broad sense.
  • connection or integral connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection, or indirect connection through an intermediary, it can be internal connection of two elements or interaction of two elements relation.
  • the term “above” or “below” a first feature on a second feature may include direct contact between the first and second features, or may also include the first and second features. Not in direct contact but through additional characteristic contact between them.
  • the terms “above”, “above” and “above” a first feature on a second feature include the first feature being directly above and diagonally above the second feature, or simply mean that the first feature is higher in level than the second feature.
  • “Below”, “under” and “under” the first feature is the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature is less horizontally than the second feature.
  • the antenna device in the embodiment of the present application includes a first antenna radiator, a second antenna radiator, a first non-near field communication chip and a near field communication chip.
  • the first antenna radiator includes a first feeding point and a first connection point, and the first connection point is used for grounding.
  • the second antenna radiator includes a second feed point and a second connection point, the second connection point is used for grounding, and the first antenna radiator and the second antenna radiator pass through the first connection point is connected to the second connection point.
  • a first non-near field communication chip the first non-near field communication chip is connected to the first feed point and/or the second feed point, and the first non-near field communication chip passes through the first
  • the feed point transmits a first non-near field communication excitation current to the first antenna radiator, and/or transmits the first non-near field communication excitation to the second antenna radiator through the second feed point current.
  • Both ends of the near field communication chip are connected to the first feed point and the second feed point respectively, and the near field communication chip transmits to the first antenna radiator through the first feed point.
  • a near field communication excitation current is transmitted to the second antenna radiator through the second feeding point.
  • the antenna device includes a first inductor and a second inductor, the first connection point and the second connection point are connected through the first inductor, and both ends of the near field communication chip The second inductor is respectively connected to the first feed point and the second feed point.
  • the antenna device further includes a capacitor, and the first non-near field communication chip is connected to the first feed point and/or the second feed point through the capacitor.
  • the antenna device includes magnetic components and coils.
  • the coil is disposed on the surface of the magnetic component, and the coil is connected to the near field communication chip.
  • the magnetic component includes a first magnetic part and a second magnetic part
  • the coil further includes a first coil wire and a second coil wire, the first coil wire and the third coil wire
  • the current directions of the two coil traces are opposite, the first magnetic part covers the first side of the first coil trace, the second coil trace is arranged on the second magnetic part and covers the second The second side of the coil trace, the first side and the second side are opposite.
  • the number of first coil traces is less than the number of second coil traces.
  • the number of turns of the coil is greater than one.
  • the antenna device further includes a second non-near field communication chip.
  • the first non-near field communication chip is connected to the first feed point
  • the second non-near field communication chip is connected to the second antenna radiator through the second feed point
  • the The second non-near field communication chip delivers a second non-near field communication excitation current to the second antenna radiator through the second feeding point.
  • the second non-near field communication chip when the first non-near field communication chip is connected to the second feed point, the second non-near field communication chip is connected to the third feed point through the first feed point.
  • An antenna radiator the second non-near field communication chip transmits a second non-near field communication excitation current to the first antenna radiator through the first feeding point.
  • the operating frequency of the near field communication chip is less than the operating frequency of the first non-near field communication chip.
  • the terminal in the embodiment of the present application includes a housing and an antenna device.
  • the antenna device is provided on the housing.
  • the antenna device includes a first antenna radiator, a second antenna radiator, a first non-near field communication chip and a near field communication chip.
  • the first antenna radiator includes a first feeding point and a first connection point, and the first connection point is used for grounding.
  • the second antenna radiator includes a second feed point and a second connection point.
  • the second connection point is used for grounding.
  • the first antenna radiator and the second antenna radiator pass through the first connection point. point is connected to the second connection point.
  • a first non-near field communication chip the first non-near field communication chip is connected to the first feed point and/or the second feed point, and the first non-near field communication chip passes through the first
  • the feed point transmits a first non-near field communication excitation current to the first antenna radiator, and/or transmits the first non-near field communication excitation to the second antenna radiator through the second feed point current.
  • Both ends of the near field communication chip are respectively connected to the first feed point and the second feed point, and the near field communication chip transmits to the first antenna radiator through the first feed point.
  • a near field communication excitation current is transmitted to the second antenna radiator through the second feeding point.
  • the magnetic component of the antenna device includes a first magnetic part and a second magnetic part
  • the terminal further includes a bracket and a main board
  • the bracket is disposed on the main board
  • the coil of the antenna device passes through
  • the magnetic component is disposed on the bracket
  • the first magnetic part is disposed on a side of the coil opposite to the first coil trace and the bracket
  • the second magnetic component is disposed on a third side of the coil. between the secondary coil traces and the bracket.
  • the antenna device includes a first inductor and a second inductor, the first connection point and the second connection point are connected through the first inductor, and both ends of the near field communication chip The second inductor is respectively connected to the first feed point and the second feed point.
  • the antenna device further includes a capacitor, and the first non-near field communication chip is connected to the first feed point and/or the second feed point through the capacitor.
  • the antenna device includes magnetic components and coils.
  • the coil is disposed on the surface of the magnetic component, and the coil is connected to the near field communication chip.
  • the magnetic component includes a first magnetic part and a second magnetic part
  • the coil further includes a first coil wire and a second coil wire, the first coil wire and the third coil wire
  • the current directions of the two coil traces are opposite, the first magnetic part covers the first side of the first coil trace, the second coil trace is arranged on the second magnetic part and covers the second The second side of the coil trace, the first side and the second side are opposite.
  • the number of first coil traces is less than the number of second coil traces.
  • the number of turns of the coil is greater than one.
  • the antenna device further includes a second non-near field communication chip.
  • the first non-near field communication chip is connected to the first feed point
  • the second non-near field communication chip is connected to the second antenna radiator through the second feed point
  • the The second non-near field communication chip delivers a second non-near field communication excitation current to the second antenna radiator through the second feeding point.
  • the second non-near field communication chip when the first non-near field communication chip is connected to the second feed point, the second non-near field communication chip is connected to the third feed point through the first feed point.
  • An antenna radiator the second non-near field communication chip transmits a second non-near field communication excitation current to the first antenna radiator through the first feeding point.
  • the operating frequency of the near field communication chip is less than the operating frequency of the first non-near field communication chip.
  • the terminal further includes a display screen.
  • the housing, coil, magnetic component, bracket, main board and display screen are stacked in sequence.
  • the terminal includes a front, a back and a side.
  • the first antenna radiator, the second antenna radiator and the bracket can all be arranged on the front, the back or the side, and the first antenna radiator, the second antenna radiate At least two of the body and the bracket are arranged in different positions.
  • the first antenna radiator and the second antenna radiator are disposed on the side and close to the top of the terminal, and the bracket is disposed close to the back surface.
  • the housing includes a metal frame, the metal frame is disposed on the side, and the first antenna radiator and the second antenna radiator are part of the metal frame.
  • an embodiment of the present application provides an antenna device 100 .
  • the antenna device 100 includes a first antenna radiator 10 , a second antenna radiator 20 , a first non-near field communication chip 30 , and a near field communication chip 40 .
  • the first antenna radiator 10 includes a first feeding point 11 and a first connection point 12, and the first connection point 12 is used for grounding.
  • the second antenna radiator 20 includes a second feed point 21 and a second connection point 22.
  • the second connection point 22 is used for grounding.
  • the first antenna radiator 10 and the second antenna radiator 20 pass through the first connection point 12 and the second connection point 22. Two connection points 22 are connected.
  • the first non-near field communication chip 30 is connected to the first feed point 11 and/or the second feed point 21 , and the first non-near field communication chip 30 transmits the first signal to the first antenna radiator 10 through the first feed point 11 .
  • the non-near field communication excitation current, and/or the first non-near field communication excitation current is transmitted to the second antenna radiator 20 through the second feeding point 21 .
  • Both ends of the near field communication chip 40 are connected to the first feed point 11 and the second feed point 21 respectively.
  • the near field communication chip 40 transmits the near field communication excitation current to the first antenna radiator 10 through the first feed point 11. And transmits the near field communication excitation current to the second antenna radiator 20 through the second feeding point 21 .
  • the first non-near field communication chip 30 can be a cellular data communication chip, a Bluetooth (Blue Tool, BT) communication chip, a Global Positioning System (Global Positioning System, GPS) communication chip, or a Wireless network (WIFI) communication chip.
  • the near field communication chip 40 is an NFC (Near Field Communication) chip. This application takes the first non-near field communication chip 30 as a cellular data communication chip as an example. It can be understood that the first non-near field communication chip 30 is not limited to a cellular data communication chip.
  • the first non-near field communication chip 30 can transmit the first non-near field communication excitation current to the first antenna radiator 10 through the first feed point 11, or through the second feed Point 21 transmits the first non-near field communication excitation current to the second antenna radiator 20, and the near field communication chip can also transmit the near field communication excitation current to the first antenna radiator 10 through the first feeding point 11, and can pass The second feeding point 21 transmits the near field communication excitation current to the second antenna radiator 20. It can be seen that both the first non-near field communication chip 30 and the near field communication chip 40 can pass through the first antenna radiator 10 and the second antenna radiator 20.
  • the antenna radiator 20 transmits signals, that is, the first non-near field communication chip 30 and the near field communication chip 40 share at least one of the first antenna radiator 10 and the second antenna radiator 20. In this way, the near field communication can be reduced.
  • the chip 40 occupies a space, thereby reducing the space required by the entire antenna device 100, which is beneficial to the miniaturization of the terminal.
  • the terminal 1000 includes an antenna device 100, a housing 200, a bracket 300, a motherboard 400 and a display screen 500.
  • the antenna device 100, the bracket 300, the motherboard 400 and the display screen 500 are all arranged on the housing 200.
  • the antenna device 100, the bracket 300, and the motherboard 400 are arranged inside the casing 200, and the display screen 500 is arranged on the casing 200.
  • the terminal 1000 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a head-mounted display device, a game console, etc.
  • the embodiment of the present application is explained by taking the terminal 1000 as a mobile phone as an example. It can be understood that the specific form of the terminal 1000 is not limited to a mobile phone.
  • the antenna device 100 includes a first antenna radiator 10 , a second antenna radiator 20 , a first non-near field communication chip 30 and a near field communication chip 40 .
  • the first non-near field communication chip 30 and the near field communication chip 40 may share at least one of the first antenna radiator 10 and the second antenna radiator 20 to transmit signals.
  • the first non-near field communication chip 30 is a cellular data communication chip
  • the near field communication chip 40 is an NFC chip.
  • the first antenna radiator 10 and the second antenna radiator 20 are antenna lines of the first non-near field communication chip 30 , and the near field communication chip 40 can transmit through the first antenna radiator 10 and the second antenna radiator 20
  • the signal that is, the near field communication chip 40 shares the antenna line of the first non-near field communication chip 30. In this way, the space occupied by the near field communication chip 40 can be reduced, thereby reducing the space required by the entire antenna device 100.
  • the first antenna radiator 10 and the second antenna radiator 20 can be any radiator structure in the terminal 1000 .
  • the first antenna radiator 10 and the second antenna radiator 20 can be independently arranged radiators, or they can be printed circuits on the main board 400 of the terminal 1000, or they can be metal branches formed on the shell 200 of the terminal 1000, etc. wait.
  • the first antenna radiator 10 and the second antenna radiator 20 may be rigid or flexible.
  • the materials of the first antenna radiator 10 and the second antenna radiator 20 may include materials with high conductivity such as copper, magnesium, aluminum, and silver.
  • the first antenna radiator 10 and the second antenna radiator 20 may be Flexible Printed Circuit (FPC) antennas.
  • the first linear radiator 10 and the second antenna radiator 20 may also be laser direct-structuring (Laser-Direct-structuring, LDS) antennas.
  • the first antenna radiator 10 includes a first feeding point 11 and a first connection point 12 .
  • the first connection point 12 may be connected to a ground point of the terminal 1000 .
  • the first connection point 12 is connected to a ground point on the motherboard 400 of the terminal 1000 .
  • the second antenna radiator 20 includes a second feeding point 21 and a second feeding point 22 .
  • the second connection point 22 may be connected to the ground point of the terminal 1000 .
  • the second connection point 22 is connected to a ground point of the mainboard 400 of the terminal 1000 .
  • the first antenna radiator 10 and the second antenna radiator 20 are connected through the first connection point 21 and the second connection point 22 .
  • first connection point 11 and the second connection point 21 can also be jointly connected to the ground point of the main board of the terminal 1000 to be electrically connected through the main board 400 of the terminal 1000, so that the first antenna radiator 10 and the second The two antenna radiators 20 are connected.
  • the first non-near field communication chip 30 can be connected to the first antenna radiator 10 through the first feed point 11 to transmit the first non-near field communication to the first antenna radiator 10 excitation current. That is, the first non-near field communication chip 30 may transmit signals through the first antenna radiator 10 .
  • the first non-near field communication chip 30 can be connected to the second antenna radiator 20 through the second feeding point 21 to transmit the first non-near field to the second antenna radiator 20 .
  • Communication excitation current That is, the first non-near field communication chip 30 may transmit signals through the second antenna radiator 20 .
  • the first non-near field communication chip 30 can also be connected to the first antenna radiator 10 through the first feed point 11 and the second antenna radiator 20 through the second feed point 21 to respectively A first non-near field communication excitation current is transmitted to the first antenna radiator 10 and the second antenna radiator 20 . That is, the first non-near field communication chip 30 may transmit signals through the first antenna radiator 10 and the second antenna radiator 20 . Wherein, when the first non-near field communication chip 30 transmits the first non-near field communication excitation current to the first antenna radiator 10 or the second antenna radiator 20, the first antenna radiator 10 or the second antenna radiator 20 The signal will be sent directly from terminal 1000.
  • the near field communication chip 40 can transmit the near field communication excitation current through the first feed point 11 and the second feed point 21 .
  • the near field communication chip 40 may send a positive near field communication excitation current through the first feed point 11 and a negative near field communication excitation current through the second feed point 21 . That is, one end of the near field communication chip 40 connected to the first feed point 11 is a positive port, and one end of the near field communication chip 40 connected to the second feed point 21 is a negative port.
  • the near field communication excitation current transmitted by the near field communication chip 40 can be transmitted through the first feed point 11 and flow back into the near field communication chip 40 via the second feed point 21, thereby forming a current loop.
  • the near field communication chip 40 may also send a negative near field communication excitation current through the first feed point 11 and send a positive near field communication excitation current through the second feed point 21 . That is, one end of the near field communication chip 40 connected to the first feed point 11 is a negative port, and one end of the near field communication chip 40 connected to the second feed point 21 is a positive port.
  • the near field communication excitation current transmitted by the near field communication chip 40 can be transmitted through the second feed point 21 and flow back into the near field communication chip 40 via the first feed point 11, thereby forming a current loop.
  • the antenna device 100 includes a first inductor 50 and a second inductor 60 .
  • the first non-near field communication chip 30 is a cellular data communication chip
  • the near field communication chip 40 is an NFC chip.
  • the working frequency of NFC chips is around 13.5 megahertz (MHz), while the working frequency of cellular data communication chips is above 600MHz. It can be understood that the operating frequency of the near field communication chip 40 is smaller than the operating frequency of the cellular data communication chip.
  • connection point 22 is connected to ground via first inductor 50 .
  • the first inductor 50 and the second inductor 60 may be disposed on the main board 400 of the terminal 1000 .
  • the near field communication chip 40 transmits the near field communication excitation current to the first antenna radiator 10 and the second antenna radiator 20 , it may be transmitted to the second inductor 60 connected to the first feeding point 11 through the main board 400 , and then transmitted to the second inductor 60 connected to the second feed point 21 through the first inductor 50, thereby transmitted back to the near field communication chip 40.
  • first inductor 50 can be connected to the ground point of the main board 400
  • first connection point 12 and the second connection point 22 can be connected to the ground point of the main board 400 through the first inductor 50 to perform grounding processing.
  • the first inductor 50 may not be connected to the ground point of the motherboard 400.
  • the near field communication chip 40 transmits the near field communication excitation current to the first antenna radiator 10 and the second antenna radiator 20, the near field communication The excitation current does not pass through the grounding point of the motherboard 400 to avoid losses caused by grounding to the near field communication excitation current, thereby avoiding the loss of magnetic field energy generated by the near field communication excitation current, so that the performance of the near field communication chip 40 is better .
  • the working principle of the first inductor 50 and the second inductor 60 is: passing low frequency and blocking high frequency. Therefore, when the near field communication chip 40 is working, the high frequency signal generated by the first non-near field communication chip 30 cannot be transmitted to the near field communication chip 40 through the first inductor 50 and the second inductor 60 , that is, the first non-near field communication chip 40 cannot be transmitted to the near field communication chip 40 through the first non-near field communication chip 40 .
  • the communication chip 30 transmits the first non-near field communication excitation current to the first antenna radiator 10 , the first non-near field communication excitation current will not be transmitted to the second antenna radiator 20 through the first inductor 50 .
  • the first non-near field communication chip 30 transmits the first non-near field communication excitation current to the second antenna radiator 20
  • the first non-near field communication excitation current will not be transmitted to the first non-near field communication excitation current through the first inductor 50.
  • the first non-NFC excitation current will not be transmitted to the NFC chip 40 through the second inductor 60 .
  • the first non-near field communication chip 30 and the near field communication chip 40 are working, the first non-near field communication excitation current transmitted by the first non-near field communication chip 30 will not affect the near field communication chip 40 produce an impact to ensure the normal operation of the antenna device 100.
  • the antenna device 100 may further include a capacitor 70 .
  • the first non-near field communication chip 30 can be connected to the first feed point 11 through the capacitor 70 , can also be connected to the second feed point 21 through the capacitor 70 , or can be connected to the first feed point through two capacitors 70 respectively.
  • Point 11 is connected to the second feed point 21 .
  • the capacitor 70 can also be disposed on the main board 400 of the terminal 1000.
  • the first non-near field communication chip 30 transmits the first non-near field communication excitation current to the first antenna radiator 10 and the second antenna radiator 20 , it may be transmitted to the first feeding point 11 through the mainboard 400 The connected capacitor 70 is thereby transmitted to the first antenna radiator 10 and to the second antenna radiator 20 through the capacitor 70 connected to the second feed point 21 .
  • the first non-near field communication chip 30 Since the first inductor 50 is provided between the first antenna radiator 10 and the second antenna radiator 20 , the first non-near field communication chip 30 transmits the first non-near field communication excitation current to the first antenna radiator 10 when, it will not be transmitted to the second antenna radiator 20. Similarly, when the first non-near field communication chip 30 transmits the first non-near field communication excitation current to the second antenna radiator 20 , it will not be transmitted to the first antenna radiator 10 .
  • capacitor 70 passing high frequency and blocking low frequency. Therefore, when the near field communication chip 40 transmits the near field communication excitation current to the first antenna radiator 10 and the second antenna radiator 20 , it cannot transmit it to the first non-near field communication chip 30 through the capacitor 70 .
  • the first non-near field communication excitation current transmitted by the first non-near field communication chip 30 will not affect the near field communication chip 40 influence, and the near field communication excitation current transmitted by the near field communication chip 40 will not affect the first non-near field communication chip 30, thereby achieving complete signal transmission between the first non-near field communication chip 30 and the near field communication chip 40. isolation to ensure the normal operation of the antenna device 100.
  • the antenna device 100 may further include a coil 80 and a magnetic component 90 .
  • the coil 80 is disposed on the surface of the magnetic component 90 .
  • the coil 80 is attached to the surface of the magnetic component 90 , and the surface of the magnetic component 90 that is not attached to the coil 80 can be disposed on the motherboard 400 and thus disposed in the casing 200 of the terminal 1000 .
  • the coil 80 is attached to the surface of the magnetic component 90 , and the surface of the magnetic component 90 that is not attached to the coil 80 can be disposed on the bracket 300 , and the bracket 300 is disposed on the motherboard 400 .
  • the bracket 300 is disposed on the motherboard 400 .
  • the coil 80 is connected to the near field communication chip 40. It can be understood that the coil 80 and the magnetic component 90 are antenna lines of the near field communication chip 40.
  • the near field communication chip 40 can transmit signals to the first antenna radiator 10 and the second antenna radiator 10 through the coil 80.
  • the antenna radiator 20 emits near field communication excitation current.
  • the near field communication chip 40 transmits the near field communication excitation current to the second antenna radiator 20 through the second inductor 60 connected to the second feeding point 21, and then transmits the near field communication excitation current to the second antenna radiator through the first inductor 50.
  • the first antenna radiator 10 is then transmitted to the coil 80 through the second inductor 60 connected to the first feed point 11, and finally transmitted back to the near field communication chip 40 through the coil 80 to form a complete loop.
  • the near field communication (NFC) chip 40 is restricted by surrounding components and becomes smaller and smaller.
  • the smaller space will cause the performance of the NFC chip to plummet, resulting in a poor card swiping experience for the user. Poor.
  • the antenna line (coil 80) of the near field communication chip 40 needs to be reduced by ferrite material.
  • ferrite is formed by sintering nickel-zinc-iron and other materials, then breaking them into pieces and bonding them with special glue.
  • ferrite is the magnetic component 90.
  • the magnetic component 90 can also be made of other materials and is not limited to ferrite.
  • the NFC chip that is, the near field communication chip 40
  • the antenna line (the first antenna radiator 10 or the second antenna radiator 20) of the first non-near field communication chip 30 is too close to the near field communication chip 40, (at positions L1 and L2 as shown in FIG. 8 )
  • it will cause the first non-near field communication chip 30 to transmit the first non-near field communication excitation current to the first antenna radiator 10 or the second antenna radiator 20
  • It will affect the near field communication excitation current transmitted by the near field communication chip 40 to the first antenna radiator 10 and the second antenna radiator 20 , thus causing the first non-near field communication chip 30 and the near field communication chip 40 to transmit There is interference in the signal.
  • the near field communication chip 40 is too close to the camera 600 of the terminal 1000 (at the L4 position as shown in FIG. 8 ), the metal in the camera 600 will also affect the signal transmitted by the near field communication chip 40 . Therefore, the distance at the L1, L2 and L4 positions needs to be large enough.
  • the coil 80 is disposed on the surface of the magnetic member 90, and the material of the magnetic member 90 has a great influence on the first antenna radiator 10 and the second antenna radiator 20, the position of the coil 80 cannot be directly moved.
  • the ferrite magnetic component 90
  • the distance L3 between the near field communication chip 40 and the battery 700 also needs to be large enough. As a result, a larger space is occupied when the near field communication chip 40 is installed.
  • the first non-near field communication chip 30 and the near field communication chip 40 share the first antenna radiator 10 and the second At least one of the antenna radiators 20 eliminates the need to consider the distance between the first antenna radiator 10 and the second antenna radiator 20 , the impact of ferrite on the battery 700 , and the relationship between the coil 80 and the camera 600 The problem of distance between L1, L2, L3 and L4 is satisfied, thereby ensuring better performance of the near field communication chip 40.
  • the coil 80 , the magnetic component 90 , the bracket 300 and the main board 400 are stacked in sequence. More specifically, please combine Figure 2 and Figure 6.
  • the display screen 500, the main board 400, the bracket 300, the magnetic component 90, and the coil 80 and the housing 200 are stacked in sequence.
  • the mainboard 400 is located on the side closest to the display screen 500 of the terminal 1000 , that is, the side furthest away from the casing 200 of the terminal 1000 .
  • the coil 80 is located on the side farthest from the display screen 500 of the terminal 1000 , that is, the side closest to the housing 200 of the terminal 1000 . That is, the coil 80 is installed on the bracket 300 through the magnetic component 90 , and then installed on the motherboard 400 through the bracket 300 , so as to be disposed inside the casing 200 .
  • the magnetic component 90 is located between the coil 80 and the bracket 300 and covers the coil (for example, the orthographic projection of the magnetic component 90 on the bracket 300 covers the orthographic projection of the coil 80 on the bracket 300).
  • the motherboard 400 and the bracket 300 can be isolated.
  • the metal on the coil 80 weakens the magnetic field generated by the coil 80 , thereby ensuring the performance of the antenna circuit of the near field communication chip 40 .
  • it can also be ensured that the magnetic field generated by the coil 80 will not diverge in the direction close to the display screen 500 to ensure the normal operation of the display screen 500. That is, the magnetic field generated by the coil 80 will only be emitted through the housing 200, thus ensuring the near field.
  • the performance of the communication chip 40 is provided between the coil 80 and the bracket 300 and covers the coil (for example, the orthographic projection of the magnetic component 90 on the bracket 300 covers the orthographic projection of the coil 80 on the bracket 300).
  • the magnetic component 90 may include a first magnetic part 91 and a second magnetic part 92 .
  • the coil 80 may include a first coil trace 81 and a second coil trace 82 .
  • the current direction of the first coil wire 81 is opposite to the current direction of the second coil wire 82 .
  • the first magnetic part 91 is disposed on the side of the coil 80 opposite to the bracket 300, and covers the first side of the first coil wiring 81 (the side away from the bracket 300).
  • the second magnetic part 92 is disposed between the bracket 300 and the second coil trace 82 and covers the second side (the side close to the bracket 300) of the second coil trace 82. It can be understood that the first side and the second side are opposite to each other. . Please combine FIG. 9 and FIG. 10 , and it can be seen that the first magnetic part 91 is located above the first coil trace 81 and partially covers the first coil trace 81 .
  • the second magnetic part 92 is located between the bracket 300 and the coil 80 and completely covers the coil 80 .
  • the first coil wire 81 since the current directions of the first coil wire 81 and the second coil wire 82 are opposite, when the first coil wire 81 and the second coil wire 82 are close to each other, the first coil wire 81 generates The magnetic field and the magnetic field generated by the second coil wire 82 interact with each other, thereby affecting the overall magnetic field strength of the coil 80 , resulting in a weakening of the overall magnetic field strength of the coil 80 .
  • the first magnetic part 91 covers the first coil wire 81, which can isolate the reverse current generated by the first coil 80, thereby isolating the magnetic field generated by the first coil wire 81, so that the direction of the current generated by the coil 80 is unified. Thus, a better magnetic field radiation effect is obtained, so that the communication performance of the near field communication chip 40 is better.
  • the second magnetic part 92 covers the coil 80, which can completely isolate the second coil wiring 82 and the bracket 300, thereby isolating the weakening of the magnetic field generated by the coil 80 by the metal on the motherboard 400 and the bracket 300, thereby ensuring the near field communication chip The overall performance of 40 is better.
  • the number of first coil wires 81 is smaller than the number of second coil wires 82 .
  • the number of second coil traces 82 may be N+1, etc., where N is a positive integer.
  • the second magnetic part 92 is located between the second coil trace 82 and the bracket 300 to isolate the bracket 300 and the second coil trace 82 .
  • the first magnetic part 91 only covers part of the first coil wiring 81 . Therefore, the side of the second coil trace 82 opposite to the back cover of the terminal 1000 is not covered by the magnetic component 90 . If the number of the first coil wires 81 is smaller than the number of the second coil wires 82, the magnetic field generated by the second coil wires 82 can be stronger. In this way, the intensity of the magnetic field emitted by the second coil wires 82 is stronger. This ensures that the overall performance of the near field communication chip 40 is better.
  • the number of turns of the coil 80 may be multiple turns, that is, greater than one turn.
  • the number of turns of the coil 80 may be two turns, three turns, four turns, or more. In this way, compared with the antenna of the single coil 80 , the first antenna line 81 of the multi-coil 80 has a larger inductance and stronger radiation capability, thereby ensuring that the overall performance of the near field communication chip 40 is better.
  • the antenna device 100 may further include a second non-near field communication chip (not shown).
  • the third antenna module can be a Bluetooth (Blue Tool, BT) antenna, a Global Positioning System (Global Positioning System, GPS) antenna, or a wireless network (WIFI) antenna.
  • the second non-near field communication chip 30 when the first non-near field communication chip 30 is connected to the first feed point 11 to transmit the first non-near field communication excitation current to the first antenna radiator 10 through the first feed point 11, the second non-near field communication chip 30 is The field communication chip can be connected to the second feed point 21 and transmit the second non-near field communication excitation current to the second antenna radiator 20 through the second feed point 12 to complete signal transmission.
  • the terminal 1000 can complete the transmission of multiple signals through the antenna device 100 .
  • the terminal 1000 may include a front 1001, a back 1002 and a side 1003.
  • the first antenna radiator 10, the second antenna radiator 20 and the bracket 300 can be arranged on the front 1001, the back 1002, or the side 1003, and the first antenna radiator 10, the second antenna At least two of the radiator 20 and the bracket 300 are installed in different positions.
  • the bracket 300 may be disposed on the back 1002.
  • the first non-near field communication chip 30 transmits the first non-near field communication excitation current, it can be emitted from the side 1003 of the terminal 1000 through the first antenna radiator 10 and the second antenna radiator 20 disposed on the side 1003 Signal.
  • the near field communication chip 30 transmits the near field communication excitation current, the signal can be sent from the side 1003 of the terminal 1000 through the first antenna radiator 10 and the second antenna radiator 20 arranged on the side 1003, or through the first antenna radiator 10 and the second antenna radiator 20.
  • the bracket 300 is provided on the back to send signals directly from the back 1002 of the terminal 1000 . In this way, the near field communication chip 40 can transmit signals in multiple directions and angles.
  • the first antenna radiator 10 and the second antenna radiator 20 are disposed on the side 1002 and close to the top 1004 of the terminal 1000, and the bracket 300 is disposed close to the back 1002.
  • the NFC function is not limited to the back 1002 of the terminal 1000, but can also be implemented on the side 1003, that is, the NFC function can be freely swiped in different directions and angles, thereby greatly improving the user experience. .
  • the housing 200 may also include a metal frame 201 .
  • the metal frame 201 is provided on the side 1003 of the terminal 1000.
  • the first antenna radiator 10 and the second antenna radiator 20 may be part of the metal frame 201 .
  • the first antenna radiator 10 and the second antenna radiator 20 are metal branches of the metal frame 201 , or they may be printed circuits on the metal frame 201 .
  • the first antenna radiator 10 and the second antenna radiator 20 can be located on the top 1004 of the terminal 1000.
  • the communication of the near field communication chip 40 is not only limited to the backside 1002 of the terminal 1000, but can also be realized on the backside 1002 of the terminal 1000.
  • the top 1004 implementation realizes the free swiping function of NFC function in different directions and angles, which greatly improves the user experience.
  • the housing 200 may also include a plastic frame (not shown).
  • the plastic frame may be disposed on the top 1004 of the terminal 1000.
  • the first antenna radiator 10 and the second antenna radiator 20 may also be FPC antennas. Or LDS antenna, the first antenna radiator 10 and the second antenna radiator 20 can be attached to the plastic frame.
  • the first non-near field communication chip 30 and the near field communication chip 40 share the first antenna radiator 10 and the second antenna radiator 20, so that the near field communication can be realized.
  • the field communication chip 40 can not only transmit signals through the first antenna radiator 10 and the second antenna radiator 20 , but also can realize signal transmission through the bracket 300 , thereby increasing the directions and angles in which the near field communication chip 40 can transmit signals. , thereby improving the user experience.
  • the way in which the first non-NFC chip 30 and the NFC chip 40 share the first antenna radiator 10 and the second antenna radiator 20 can also avoid the limitations of the installation method of the NFC chip 40 , thereby reducing the space required to install the near field communication chip 40, thereby reducing manufacturing costs.
  • the coil connected to the near field communication chip 40 includes multiple turns, asymmetrical coil wiring is provided and a smaller part of the coil wiring is covered by the magnetic member 90 to isolate the larger part.
  • the reverse current of a small part of the coil wires namely the first coil wire 81 , reduces the weakening of the magnetic field generated by the entire coil 80 due to the reverse current brought by the first coil wire 81 .
  • the current direction of the entire antenna line can be unified, thereby increasing the inductance of the entire antenna line, so that the overall performance of the near field communication chip 40 is better.
  • the error loss of the device can be reduced, and the overall consistency of the terminal 1000 can be better.

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Abstract

一种天线装置(100)及终端(1000)。第一非近场通信芯片(30)通过第一馈电点(11)和/或第二馈电点(21)分别向第一天线辐射体(10)和第二天线辐射体(20)传输第一非近场通信激励电流。近场通信芯片(40)通过第一馈电点(11)和第二馈电点(21)分别向第一天线辐射体(10)和第二天线辐射体(20)传输近场通信激励电流。

Description

天线装置及终端
优先权信息
本申请请求2022年06月27日向中国国家知识产权局提交的、专利申请号为2022107442750的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及封装技术，特别涉及一种天线装置及终端。
背景技术
随着科技的发展，智能手机使用越来越广泛，功能也越来越多，已经成为人们日常生活的必备的电子设备。在智能手机中，往往会在内部设置多种天线，如蜂窝数据天线、无线通信(WIFI)天线、近场通信(Near Field Communication，NFC)天线等。
发明内容
本申请实施方式提供一种天线装置及终端。
本申请实施方式的天线装置包括第一天线辐射体、第二天线辐射体、第一非近场通信芯片、近场通信芯片。所述第一天线辐射体包括第一馈电点和第一连接点，所述第一连接点用于接地。所述第二天线辐射体包括第二馈电点和第二连接点，所述第二连接点用于接地，所述第一天线辐射体和所述第二天线辐射体通过所述第一连接点和所述第二连接点连接。所述第一非近地通信芯片连接所述第一馈电点和/或所述第二馈电点，所述第一非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输第一非近场通信激励电流，和/或通过所述第二馈电点向所述第二天线辐射体传输所述第一非近场通信激励电流。所述近场通信芯片的两端分别连接所述第一馈电点和所述第二馈电点，所述近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输近场通信激励电流，并通过所述第二馈电点向所述第二天线辐射体传输所述近场通信激励电流。
本申请实施方式的终端包括壳体及天线装置。所述天线装置设置于所述壳体。所述天线装置包括第一天线辐射体、第二天线辐射体、第一非近场通信芯片、近场通信芯片。所述第一天线辐射体包括第一馈电点和第一连接点，所述第一连接点用于接地。所述第二天线辐射体包括第二馈电点和第二连接点，所述第二连接点用于接地，所述第一天线辐射体和所述第二天线辐射体通过所述第一连接点和所述第二连接点连接。所述第一非近地通信 芯片连接所述第一馈电点和/或所述第二馈电点，所述第一非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输第一非近场通信激励电流，和/或通过所述第二馈电点向所述第二天线辐射体传输所述第一非近场通信激励电流。所述近场通信芯片的两端分别连接所述第一馈电点和所述第二馈电点，所述近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输近场通信激励电流，并通过所述第二馈电点向所述第二天线辐射体传输所述近场通信激励电流。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请某些实施方式的天线装置的平面示意图；
图2是本申请某些实施方式的终端的平面示意图；
图3是本申请另一个实施方式的天线装置的平面示意图；
图4是本申请又一个实施方式的天线装置的平面示意图；
图5是本申请又一个实施方式的天线装置的平面示意图；
图6是本申请还一个实施方式的天线装置的平面示意图；
图7是图6的天线装置的安装示意图；
图8是本申请某些实施方式的终端内部结构的平面示意图；
图9和图10是本申请某些实施方式的天线装置的线圈和磁性件的平面示意图；
图11是本申请某些实施方式的终端的平面示意图。
具体实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中，相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的实施方式的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是 指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本申请实施方式的天线装置包括第一天线辐射体、第二天线辐射体、第一非近场通信芯片和近场通信芯片。所述第一天线辐射体包括第一馈电点和第一连接点，所述第一连接点用于接地。所述第二天线辐射体包括第二馈电点和第二连接点，所述第二连接点用于接地，所述第一天线辐射体和所述第二天线辐射体通过所述第一连接点和所述第二连接点连接。第一非近场通信芯片，所述第一非近地通信芯片连接所述第一馈电点和/或所述第二馈电点，所述第一非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输第一非近场通信激励电流，和/或通过所述第二馈电点向所述第二天线辐射体传输所述第一非近场通信激励电流。所述近场通信芯片的两端分别连接所述第一馈电点和所述第二馈电点，所述近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输近场通信激励电流，并通过所述第二馈电点向所述第二天线辐射体传输所述近场通信激励电流。
在某些实施方式中，所述天线装置包括第一电感和第二电感，所述第一连接点和所述第二连接点通过所述第一电感连接，所述近场通信芯片的两端通过所述第二电感分别与所述第一馈电点和所述第二馈电点连接。
在某些实施方式中，所述天线装置还包括电容，所述第一非近场通信芯片通过所述电容与所述第一馈电点和/或所述第二馈电点连接。
在某些实施方式中，所述天线装置包括磁性件及线圈。所述线圈设置于所述磁性件的表面，所述线圈连接所述近场通信芯片。
在某些实施方式中，所述磁性件包括第一磁性部和第二磁性部，所述线圈还包括第一线圈走线和第二线圈走线，所述第一线圈走线和所述第二线圈走线的电流方向相反，所述第一磁性部覆盖所述第一线圈走线的第一侧，所述第二线圈走线设置于所述第二磁性部，并覆盖所述第二线圈走线的第二侧，所述第一侧和所述第二侧相对。
在某些实施方式中，所述第一线圈走线的条数小于所述第二线圈走线的条数。
在某些实施方式中，所述线圈的圈数大于1。
在某些实施方式中，所述天线装置还包括第二非近场通信芯片。在所述第一非近地通信芯片连接所述第一馈电点的情况下，所述第二非近场信芯片通过所述第二馈电点连接所述第二天线辐射体，所述第二非近场通信芯片通过所述第二馈电点向所述第二天线辐射体传递第二非近场通信激励电流。
在某些实施方式中，在所述第一非近地通信芯片连接所述第二馈电点的情况下，所述第二非近场通信芯片通过所述第一馈电点连接所述第一天线辐射体，所述第二非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传递第二非近场通信激励电流。
在某些实施方式中，所述近场通信芯片的工作频率小于第一非近场通信芯片的工作频率。
本申请实施方式的终端包括壳体和天线装置。所述天线装置设置于所述壳体。天线装置包括第一天线辐射体、第二天线辐射体、第一非近场通信芯片和近场通信芯片。所述第一天线辐射体包括第一馈电点和第一连接点，所述第一连接点用于接地。所述第二天线辐射体包括第二馈电点和第二连接点，所述第二连接点用于接地，所述第一天线辐射体和所述第二天线辐射体通过所述第一连接点和所述第二连接点连接。第一非近场通信芯片，所述第一非近地通信芯片连接所述第一馈电点和/或所述第二馈电点，所述第一非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输第一非近场通信激励电流，和/或通过所述第二馈电点向所述第二天线辐射体传输所述第一非近场通信激励电流。所述近场通信芯片的两端分别连接所述第一馈电点和所述第二馈电点，所述近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输近场通信激励电流，并通过所述第二馈电点向所述第 二天线辐射体传输所述近场通信激励电流。
在某些实施方式中，所述天线装置的磁性件包括第一磁性部和第二磁性部，所述终端还包括支架和主板，所述支架设置在所述主板，所述天线装置的线圈通过所述磁性件设置在所述支架，所述第一磁性部设置在所述线圈的第一线圈走线与所述支架相背的一侧，所述第二磁性件设置在所述线圈的第二线圈走线和所述支架之间。
在某些实施方式中，所述天线装置包括第一电感和第二电感，所述第一连接点和所述第二连接点通过所述第一电感连接，所述近场通信芯片的两端通过所述第二电感分别与所述第一馈电点和所述第二馈电点连接。
在某些实施方式中，所述天线装置还包括电容，所述第一非近场通信芯片通过所述电容与所述第一馈电点和/或所述第二馈电点连接。
在某些实施方式中，所述天线装置包括磁性件及线圈。所述线圈设置于所述磁性件的表面，所述线圈连接所述近场通信芯片。
在某些实施方式中，所述磁性件包括第一磁性部和第二磁性部，所述线圈还包括第一线圈走线和第二线圈走线，所述第一线圈走线和所述第二线圈走线的电流方向相反，所述第一磁性部覆盖所述第一线圈走线的第一侧，所述第二线圈走线设置于所述第二磁性部，并覆盖所述第二线圈走线的第二侧，所述第一侧和所述第二侧相对。
在某些实施方式中，所述第一线圈走线的条数小于所述第二线圈走线的条数。
在某些实施方式中，所述线圈的圈数大于1。
在某些实施方式中，所述天线装置还包括第二非近场通信芯片。在所述第一非近地通信芯片连接所述第一馈电点的情况下，所述第二非近场信芯片通过所述第二馈电点连接所述第二天线辐射体，所述第二非近场通信芯片通过所述第二馈电点向所述第二天线辐射体传递第二非近场通信激励电流。
在某些实施方式中，在所述第一非近地通信芯片连接所述第二馈电点的情况下，所述第二非近场通信芯片通过所述第一馈电点连接所述第一天线辐射体，所述第二非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传递第二非近场通信激励电流。
在某些实施方式中，所述近场通信芯片的工作频率小于第一非近场通信芯片的工作频率。
在某些实施方式中，所述终端还包括显示屏。在所述显示屏的出光方向上，所述壳体、线圈、磁性件、支架、主板及显示屏依次堆叠设置。所述终端包括正面、背面和侧面。所述第一天线辐射体、所述第二天线辐射体和所述支架均可设置在所述正面、所述背面或所述侧面，且所述第一天线辐射体、所述第二天线辐射体和所述支架中的至少两个的设置位置不同。
在某些实施方式中，所述第一天线辐射体和所述第二天线辐射体设置在所述侧面且靠近所述终端的顶部，所述支架靠近所述背面设置
在某些实施方式中，所述壳体包括金属边框，所述金属边框设置于所述侧面，所述第一天线辐射体和所述第二天线辐射体为所述金属边框的一部分。
请参阅图1，本申请实施方式提供一种天线装置100。天线装置100包括天线装置100包括第一天线辐射体10、第二天线辐射体20、第一非近场通信芯片30、近场通信芯片40。第一天线辐射体10包括第一馈电点11和第一连接点12，第一连接点12用于接地。第二天线辐射体20包括第二馈电点21和第二连接点22，第二连接点22用于接地，第一天线辐射体10和第二天线辐射体20通过第一连接点12和第二连接点22连接。第一非近地通信芯片30连接第一馈电点11和/或第二馈电点21，第一非近场通信芯片30通过第一馈电点11向第一天线辐射体10传输第一非近场通信激励电流，和/或通过第二馈电点21向第二天线辐射体20传输第一非近场通信激励电流。近场通信芯片40的两端分别连接第一馈电点11和第二馈电点21，近场通信芯片40通过第一馈电点11向第一天线辐射体10传输近场通信激励电流，并通过第二馈电点21向第二天线辐射体20传输近场通信激励电流。
其中，第一非近场通信芯片30可以是蜂窝数据通信芯片，也可以是蓝牙(Blue Tool，BT)通信芯片，又可以是全球定位系统(Global Positioning System，GPS))通信芯片，还可以是无线网络(WIFI)通信芯片。近场通信芯片40为NFC(Near Field Communication)芯片。本申请以第一非近场通信芯片30为蜂窝数据通信芯片为例，可以理解，第一非近场通信芯片30并不限于蜂窝数据通信芯片。
目前，在设置天线时，为保证天线的通信质量，往往需要天线与智能手机内部的其他天线、元器件具有一定的间距，导致天线的占用空间较大，不利于电子设备的小型化。
本申请实施方式的天线装置100中，由于第一非近场通信芯片30能够通过第一馈电点11向第一天线辐射体10传输第一非近场通信激励电流，或者通过第二馈电点21向第二天线辐射体20传输第一非近场通信激励电流，而近场通信芯片同样能够通过第一馈电点11向第一天线辐射体10传输近场通信激励电流，并能够通过第二馈电点21向第二天线辐射体20传输近场通信激励电流，可以看出，第一非近场通信芯片30和近场通信芯片40均能够通过第一天线辐射体10和第二天线辐射体20发送信号，即第一非近场通信芯片30和近场通信芯片40共用了第一天线辐射体10和第二天线辐射体20中的至少一个，如此，则可减少近场通信芯片40的占用空间，从而减少天线装置100整体所需占用的空间，有利于终端的小型化。
下面结合附图作进一步说明。
请参阅图2，终端1000包括天线装置100、壳体200、支架300、主板400和显示屏 500。其中，天线装置100、支架300、主板400和显示屏500均设置于壳体200。天线装置100、支架300、主板400设置在壳体200的内部，显示屏500设置在壳体200上。
其中，终端1000可以是手机、平板电脑、笔记本电脑、智能手表、头显设备、游戏机等。本申请实施方式以终端1000是手机为例进行说明，可以理解，终端1000的具体形式并不限于手机。
请参阅图1，天线装置100包括第一天线辐射体10、第二天线辐射体20、第一非近场通信芯片30和近场通信芯片40。其中，第一非近场通信芯片30和近场通信芯片40可共用第一天线辐射体10和第二天线辐射体20中的至少一个发射信号。根据上述可知，第一非近场通信芯片30为蜂窝数据通信芯片，近场通信芯片40为NFC芯片。
具体地，第一天线辐射体10和第二天线辐射体20为第一非近场通信芯片30的天线线路，近场通信芯片40能够通过第一天线辐射体10和第二天线辐射体20传输信号，即，近场通信芯片40共用了第一非近场通信芯片30的天线线路，如此，可减少近场通信芯片40的占用空间，从而减少天线装置100整体所需占用的空间。
其中，第一天线辐射体10和第二天线辐射体20可以为终端1000中任意的辐射体结构。第一天线辐射体10和第二天线辐射体20可以为独立设置的辐射体，也可以为终端1000的主板400上的印刷线路，还可以为终端1000的壳体200上形成的金属枝节，等等。第一天线辐射体10和第二天线辐射体20可以为刚性的，也可以为柔性的。第一天线辐射体10和第二天线辐射体20的材质可以包括铜、镁、铝、银等导电率较高的材质。
例如，第一天线辐射体10和第二天线辐射体20可以是柔性电路板(Flexible Printed Circuit，FPC)天线。又例如，第一线辐射体10和第二天线辐射体20也可以是激光直接成型技术(Laser-Direct-structuring，LDS)天线。
请再次参阅图1，第一天线辐射体10包括第一馈电点11和第一连接点12。其中，第一连接点12可以连接至终端1000的接地点。例如，第一连接点12连接至终端1000的主板400上的接地点上。
第二天线辐射体20包括第二馈电点21和第二馈电点22。同样地，第二连接点22可以连接至终端1000的接地点。例如，第二连接点22连接至终端1000的主板400的接地点上。其中，第一天线辐射体10和第二天线辐射体20通过第一连接点21和第二连接点22连接。
在一个实施方式中，第一连接点11和第二连接点21还可以共同连接至终端1000主板的接地点上，以通过终端1000的主板400电连接，以使第一天线辐射体10和第二天线辐射体20连接。
在一个实施方式中，请结合图3，第一非近场通信芯片30可通过第一馈电点11连接 第一天线辐射体10，以向第一天线辐射体10传输第一非近场通信激励电流。即，第一非近场通信芯片30可以通过第一天线辐射体10传输信号。
在另一个实施方式中，请结合图4，第一非近场通信芯片30可通过第二馈电点21连接第二天线辐射体20，以向第二天线辐射体20传输第一非近场通信激励电流。即，第一非近场通信芯片30可以通过第二天线辐射体20传输信号。
此外，请结合图1，第一非近场通信芯片30还可通过第一馈电点11连接第一天线辐射体10，并通过第二馈电点21连接第二天线辐射体20，以分别向第一天线辐射体10和第二天线辐射体20传输第一非近场通信激励电流。即，第一非近场通信芯片30可以通过第一天线辐射体10和第二天线辐射体20发射信号。其中，当第一非近场通信芯片30将第一非近场通信激励电流传输至第一天线辐射体10或第二天线辐射体20时，第一天线辐射体10或第二天线辐射体20便会直接将信号从终端1000发出。
请结合图1，近场通信芯片40能够通过第一馈电点11和第二馈电点21传输近场通信激励电流。其中，近场通信芯片40可以是通过第一馈电点11发送正向的近场通信激励电流，并通过第二馈电点21发送负向的近场通信激励电流。即近场通信芯片40与第一馈电点11连接的一端为正端口，近场通信芯片40与第二馈电点21连接的一端为负端口。近场通信芯片40传输的近场通信激励电流可以通过第一馈电点11传输，并经由第二馈电点21回流到近场通信芯片40中，从而形成电流回路。
同样地，近场通信芯片40也可以是通过第一馈电点11发送负向的近场通信激励电流，并通过第二馈电点21发送正向的近场通信激励电流。即近场通信芯片40与第一馈电点11连接的一端为负端口，近场通信芯片40与第二馈电点21连接的一端为正端口。近场通信芯片40传输的近场通信激励电流可以通过第二馈电点21传输，并经由第一馈电点11回流到近场通信芯片40中，从而形成电流回路。
请结合图5，在某些实施方式中，天线装置100包括第一电感50和第二电感60。
根据上述可知，第一非近场通信芯片30为蜂窝数据通信芯片，近场通信芯片40为NFC芯片。一般的，NFC芯片的工作频率在13.5兆赫兹(MHz)左右，而蜂窝数据通信芯片的工作频率在600MHz以上。可以理解，近场通信芯片40工作频率是小于蜂窝数据通信芯片的工作频率的。
而结合图5，可以看出，近场通信芯片40的两端是通过第二电感60分别与第一馈电点11和第二馈电点21连接的，且第一连接点12和第二连接点22通过第一电感50接地。
其中，第一电感50和第二电感60可设置于终端1000的主板400上。当近场通信芯片40向第一天线辐射体10和第二天线辐射体20传输近场通信激励电流时，可以是通过主板400，以传输至与第一馈电点11连接的第二电感60，并通过第一电感50再传输至与 第二馈电点21连接的第二电感60，从而传输回近场通信芯片40。
此外，第一电感50可连接于主板400的接地点，第一连接点12和第二连接点22可以通过第一电感50以连接主板400的接地点，从而进行接地处理。
优选地，第一电感50也可不连接主板400的接地点，如此，当近场通信芯片40在向第一天线辐射体10和第二天线辐射体20传输近场通信激励电流时，近场通信激励电流并不会经过主板400的接地点，以避免接地对近场通信激励电流造成的损失，从而避免近场通信激励电流产生的磁场能量的损失，以使近场通信芯片40的性能较好。
具体地，第一电感50和第二电感60的工作原理为：通低频阻高频。由此，在近场通信芯片40工作时，第一非近场通信芯片30产生的高频信号无法通过第一电感50和第二电感60传输到近场通信芯片40，即第一非近场通信芯片30在向第一天线辐射体10传输第一非近场通信激励电流时，第一非近场通信激励电流并不会通过第一电感50传输至第二天线辐射体20。同样地，第一非近场通信芯片30在向第二天线辐射体20传输第一非近场通信激励电流时，第一非近场通信激励电流并不会通过第一电感50传输至第一天线辐射体10。且第一非近场通信激励电流还不会通过第二电感60传输到近场通信芯片40。
由此，则可保证第一非近场通信芯片30和近场通信芯片40在工作时，第一非近场通信芯片30传输的第一非近场通信激励电流不会对近场通信芯片40产生影响，以保证天线装置100的正常工作。
此外，请结合图5，在某些实施方式中，天线装置100还可包括电容70。其中，第一非近场通信芯片30可以通过电容70与第一馈电点11连接，也可以通过电容70与第二馈电点21连接，还可以通过两个电容70分别与第一馈电点11和第二馈电点21连接。
同样地，电容70也可以设置于终端1000的主板400上。当第一非近场通信芯片30向第一天线辐射体10和第二天线辐射体20传输第一非近场通信激励电流时，可以是通过主板400，以传输至与第一馈电点11连接的电容70从而传输至第一天线辐射体10，并通过与第二馈电点21连接的电容70从而传输至第二天线辐射体20。
而由于第一天线辐射体10和第二天线辐射体20之间设置有第一电感50，因此，第一非近场通信芯片30向第一天线辐射体10传输第一非近场通信激励电流时，不会传输至第二天线辐射体20。同样地，第一非近场通信芯片30向第二天线辐射体20传输第一非近场通信激励电流时，不会传输至第一天线辐射体10。
再有，电容70的工作原理为：通高频阻低频。因此，近场通信芯片40在向第一天线辐射体10和第二天线辐射体20传输近场通信激励电流时，无法通过电容70传输至第一非近场通信芯片30。
如此，则可保证第一非近场通信芯片30和近场通信芯片40在工作时，第一非近场通 信芯片30传输的第一非近场通信激励电流不会对近场通信芯片40产生影响，且近场通信芯片40传输的近场通信激励电流不会对第一非近场通信芯片30产生影响，从而实现第一非近场通信芯片30和近场通信芯片40之间的信号完全隔绝，以保证天线装置100的正常工作。
请结合图6，天线装置100还可包括线圈80和磁性件90。其中，线圈80设置于磁性件90的表面。
在一个实施方式中，线圈80贴合于磁性件90的表面，而磁性件90未贴合线圈80的表面可设置于主板400上，从而设置在终端1000的壳体200内。
在另一个实施方式中，请结合图7，线圈80贴合于磁性件90的表面，而磁性件90未贴合线圈80的表面可设置于支架300上，而支架300设置于主板400上，从而设置在终端1000的壳体200内。
具体地，线圈80连接近场通信芯片40，可以理解，线圈80和磁性件90为近场通信芯片40的天线线路，近场通信芯片40可通过线圈80向第一天线辐射体10和第二天线辐射体20发射近场通信激励电流。
例如，近场通信芯片40通过与第二馈电点21连接的第二电感60，以将近场通信激励电流传输至第二天线辐射体20，然后通过第一电感50将近场通信激励电流传输至第一天线辐射体10，再通过与第一馈电点11连接的第二电感60，传输至线圈80，最后通过线圈80传输回近场通信芯片40，以形成完整回路。
目前，在终端1000中，由于近场通信(NFC)芯片40受周围部件的制约，体积变得越来越小，较小的空间则会导致NFC芯片的性能直线下降，从而导致用户的刷卡体验较差。
请参阅图2和图8，由于近场通信芯片40在安装至终端1000后，近场通信芯片40的天线线路(线圈80)需要通过铁氧体材料来减少，终端1000的壳体200内的导体对线圈80产生的磁场的影响。其中，铁氧体是通过镍锌铁等材料烧结，并打碎后用特殊胶水粘接形成的。具体地，铁氧体即为磁性件90，此外，磁性件90还可以是由其他材料构成，并不限于铁氧体。
而在安装NFC芯片，即近场通信芯片40时，若第一非近场通信芯片30的天线线路(第一天线辐射体10或第二天线辐射体20)与近场通信芯片40距离过近(如图8所示的L1和L2位置处)，则会导致第一非近场通信芯片30向第一天线辐射体10或第二天线辐射体20传输的第一非近场通信激励电流，会对近场通信芯片40在向第一天线辐射体10和第二天线辐射体20传输的近场通信激励电流造成影响，从而导致第一非近场通信芯片30和近场通信芯片40传输的信号存在干扰。
且若近场通信芯片40与终端1000的摄像头600距离过近(如图8所示的L4位置处)，则会导致摄像头600内的金属同样会对近场通信芯片40传输的信号造成影响。因此，L1、L2和L4位置处的距离需足够大。
此外，由于线圈80设置于磁性件90的表面，而磁性件90的材料对第一天线辐射体10和第二天线辐射体20的影响很大，是无法对线圈80的位置直接进行移动的。
另一方面，由于铁氧体(磁性件90)易掉落碎末，为保证铁氧体掉落的碎末不会进入终端1000的电池700(如图8所示)的电芯中，以保证电池700不会起火，近场通信芯片40与电池700之间的距离L3同样需足够大。如此，则会导致在安装近场通信芯片40时，占用的空间较大。
而在本申请实施方式的天线装置100和终端1000中，如图1至图4所示，由于第一非近场通信芯片30和近场通信芯片40共用了第一天线辐射体10和第二天线辐射体20中的至少一个，从而省去了无需考虑与第一天线辐射体10和第二天线辐射体20之间的距离问题、铁氧体对电池700的影响及线圈80与摄像头600之间的距离问题，从而满足L1、L2、L3和L4的大小问题，从而保证近场通信芯片40的性能较好。
更具体地，如图7所示，线圈80、磁性件90、支架300和主板400依次堆叠放置。更具体地，请结合图2和图6，在终端1000的显示屏500的出光方向(如图2所示的Z方向)上，显示屏500、主板400、支架300、磁性件90、线圈80和壳体200依次堆叠设置。
根据该结构可知，主板400位于最靠近终端1000的显示屏500的一侧，即最远离终端1000的壳体200的一侧。则线圈80位于最远离终端1000的显示屏500的一侧，即最靠近终端1000的壳体200的一侧。即，线圈80通过磁性件90安装在支架300，再通过支架300安装在主板400上，以设置于壳体200的内部。
其中，磁性件90位于线圈80与支架300之间，并覆盖线圈(如磁性件90在支架300的正投影，覆盖线圈80在支架300的正投影)，如此，便可隔离主板400及支架300上的金属对线圈80产生的磁场的削弱，从而保证近场通信芯片40的天线线路的性能。另一方面，还可保证线圈80产生的磁场不会向靠近显示屏500的方向发散，以保证显示屏500的正常工作，即线圈80产生的仅会通过壳体200发射出去，从而保证近场通信芯片40的性能。
在另一个实施方式中，请结合图9和图10，磁性件90可包括第一磁性部91和第二磁性部92。线圈80可包括第一线圈走线81和第二线圈走线82。其中，第一线圈走线81的电流方向和第二线圈走线82的电流方向相反。
其中，第一磁性部91设置在线圈80与支架300相背的一侧，并覆盖第一线圈走线 81的第一侧(远离支架300的一侧)。第二磁性部92设置在支架300和第二线圈走线82之间并覆盖第二线圈走线82的第二侧(靠近支架300的一侧)，可以理解，第一侧和第二侧相对。请结合图9和图10，可以看出，第一磁性部91位于第一线圈走线81的上方，并部分覆盖第一线圈走线81。第二磁性部92位于支架300和线圈80之间并完全覆盖线圈80。
更具体地，由于第一线圈走线81和第二线圈走线82的电流方向相反，则会导致第一线圈走线81和第二线圈走线82接近时，第一线圈走线81产生的磁场和第二线圈走线82产生的磁场相互影响，从而影响线圈80整体的磁场强度，导致线圈80整体的磁场强度减弱。
而第一磁性部91覆盖第一线圈走线81，则可将第一线圈80产生的反向电流隔离，从而隔离第一线圈走线81产生的磁场，以使线圈80产生的电流方向统一，从而获得较好的磁场辐射效果，以使近场通信芯片40的通信性能较好。且第二磁性部92覆盖线圈80，即可完全隔离开第二线圈走线82和支架300，从而隔离主板400和支架300上的金属对线圈80产生的磁场的削弱，从而保证近场通信芯片40的整体性能较好。
其中，第一线圈走线81的条数小于第二线圈走线82的条数。例如，第一线圈走线81的条数为N条时，则第二线圈走线82的条数可是N+1条等，N为正整数。
结合图9和图10，可以看出，第二磁性部92位于第二线圈走线82和支架300之间，以将支架300和第二线圈走线82隔离。第一磁性部91仅覆盖第一线圈走线81的部分。因此，第二线圈走线82与终端1000的后盖相对的一侧，并未被磁性件90所覆盖。而第一线圈走线81的条数小于第二线圈走线82的条数，则可使第二线圈走线82产生的磁场更强，如此，第二线圈走线82发射磁场强度更强，从而保证近场通信芯片40的整体性能较好。
此外，线圈80的圈数可以是多圈，即大于1圈。如，线圈80的圈数可以是两圈、三圈、四圈及更多圈等。如此，相对于单线圈80的天线来说，多线圈80的第一天线线路81的电感量更大，辐射能力更强，从而保证近场通信芯片40的整体性能较好。
在某些实施方式中，天线装置100还可包括第二非近场通信芯片(图未示)。其中，第三天线模块可以是蓝牙(Blue Tool，BT)天线，也可以是全球定位系统(Global Positioning System，GPS))天线，还可以是无线网络(WIFI)天线。
具体地，当第一非近场通信芯片30连接第一馈电点11，以通过第一馈电点11向第一天线辐射体10传输第一非近场通信激励电流时，第二非近场通信芯片可与第二馈电点21连接，并通过第二馈电点12向第二天线辐射体20传输第二非近场通信激励电流，以完成信号的传输。
同理，当第一非近场通信芯片30连接第二馈电点21，以通过第一馈电点21向第二天线辐射体20传输第一非近场通信激励电流时，第二非近场通信芯片可与第一馈电点11连接，并通过第一馈电点11向第一天线辐射体10传输第二非近场通信激励电流，以完成信号的传输。如此，终端1000便可通过天线装置100完成对多个信号的传输。
请结合图1、图2和图8，终端1000可包括有正面1001、背面1002和侧面1003。
具体地，第一天线辐射体10、第二天线辐射体20和支架300可以设置在正面1001，也可以设置在背面1002，还可以设置在侧面1003，且第一天线辐射体10、第二天线辐射体20和支架300中的至少两个的设置位置不同。
例如，当第一天线辐射体10和第二天线辐射体20设置在侧面1003时，支架300可设置于背面1002。如此，当第一非近场通信芯片30传输第一非近场通信激励电流，可通过设置在侧面1003的第一天线辐射体10和第二天线辐射体20，以从终端1000的侧面1003发出信号。而当近场通信芯片30传输近场通信激励电流时，既可通过设置在侧面1003的第一天线辐射体10和第二天线辐射体20，以从终端1000的侧面1003发出信号，又可通过设置在背面的支架300，以直接从终端1000的背面1002发出信号。如此，近场通信芯片40便可在多个方向和角度上实现信号的发送。
优选地，第一天线辐射体10和第二天线辐射体20设置在侧面1002，且靠近终端1000的顶部1004设置，支架300靠近背面1002设置。如此，当用户需要通过NFC功能刷卡时，用户便可通过终端1000的背面1002或顶部与感应器接触，以便于完成刷卡。由此，则可使NFC功能并不仅局限于终端1000的背面1002实现，还可在侧面1003实现，即实现了NFC功能在不同方向、角度上的自由刷卡功能，以大大提高了用户的使用体验。
请参阅图2，壳体200还可包括金属边框201。其中，金属边框201设置于终端1000的侧面1003。
具体地，第一天线辐射体10和第二天线辐射体20可以为金属边框201的一部分。例如，第一天线辐射体10和第二天线辐射体20为金属边框201的金属枝节，也可以为金属边框201上的印刷电路。优选地，第一天线辐射体10和第二天线辐射体20可位于终端1000的顶部1004，如此，则可使近场通信芯片40的通信并不仅局限于终端1000的背面1002实现，还可在顶部1004实现，即实现了NFC功能在不同方向、角度上的自由刷卡功能，以大大提高了用户的使用体验。
在某些实施方式中，壳体200还可包括塑胶边框(图未示)，塑胶边框可设置于终端1000的顶部1004，第一天线辐射体10和第二天线辐射体20还可以为FPC天线或LDS天线，第一天线辐射体10和第二天线辐射体20可贴合于塑胶边框上。
在本申请实施方式的天线装置100和终端1000中，通过第一非近场通信芯片30和近 场通信芯片40共用第一天线辐射体10和第二天线辐射体20的方式，便可使近场通信芯片40既能够通过第一天线辐射体10和第二天线辐射体20信号的传输，又能够通过支架300实现信号的传输，以增加了能够实现近场通信芯片40信号传输的方向和角度，从而提高了用户的使用体验。
另一方面来说，第一非近场通信芯片30和近场通信芯片40共用第一天线辐射体10和第二天线辐射体20的方式，还可避免近场通信芯片40安装方式的局限性，从而减少安装近场通信芯片40所需的占用空间，从而减少制造成本。
还一方面来说，当与近场通信芯片40连接的线圈包括为多圈数时，通过设置不对称的线圈走线，并通过磁性件90覆盖较少部分的线圈走线，以隔离掉较少部分的线圈走线的反向电流，即第一线圈走线81，以降低了第一线圈走线81带来的反向电流对整个线圈80产生的磁场的削弱。同时便可使整个天线线路的电流方向统一，以增大了整个天线线路的电感量，从而近场通信芯片40的整体性能较好。且线圈90的电感增大，降低匹配近场通信芯片40的电路所用的电容值，则可减小器件的误差损耗，终端1000整体的一致性便可较好。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (21)

  1. 一种天线装置，其中，包括：
    第一天线辐射体，所述第一天线辐射体包括第一馈电点和第一连接点，所述第一连接点用于接地；
    第二天线辐射体，所述第二天线辐射体包括第二馈电点和第二连接点，所述第二连接点用于接地，所述第一天线辐射体和所述第二天线辐射体通过所述第一连接点和所述第二连接点连接；
    第一非近场通信芯片，所述第一非近地通信芯片连接所述第一馈电点和/或所述第二馈电点，所述第一非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输第一非近场通信激励电流，和/或通过所述第二馈电点向所述第二天线辐射体传输所述第一非近场通信激励电流；
    近场通信芯片，所述近场通信芯片的两端分别连接所述第一馈电点和所述第二馈电点，所述近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输近场通信激励电流，并通过所述第二馈电点向所述第二天线辐射体传输所述近场通信激励电流。
  2. 根据权利要求1所述的天线装置，其中，所述天线装置包括第一电感和第二电感，所述第一连接点和所述第二连接点通过所述第一电感连接，所述近场通信芯片的两端通过所述第二电感分别与所述第一馈电点和所述第二馈电点连接。
  3. 根据权利要求2所述的天线装置，其中，所述天线装置还包括电容，所述第一非近场通信芯片通过所述电容与所述第一馈电点和/或所述第二馈电点连接。
  4. 根据权利要求2所述的天线装置，其中，所述天线装置包括：
    磁性件；及
    线圈，所述线圈设置于所述磁性件的表面，所述线圈连接所述近场通信芯片。
  5. 根据权利要求4所述的天线装置，其中，所述磁性件包括第一磁性部和第二磁性部，所述线圈还包括第一线圈走线和第二线圈走线，所述第一线圈走线和所述第二线圈走线的电流方向相反，所述第一磁性部覆盖所述第一线圈走线的第一侧，所述第二线圈走线设置于所述第二磁性部，并覆盖所述第二线圈走线的第二侧，所述第一侧和所述第二侧相对。
  6. 根据权利要求5所述的天线装置，其中，所述第一线圈走线的条数小于所述第二线圈走线的条数。
  7. 根据权利要求4所述的天线装置，其中，所述线圈的圈数大于1。
  8. 根据权利要求1所述的天线装置，其中，所述天线装置还包括第二非近场通信芯片，
    在所述第一非近地通信芯片连接所述第一馈电点的情况下，所述第二非近场信芯片通过所述第二馈电点连接所述第二天线辐射体，所述第二非近场通信芯片通过所述第二馈电点向所述第二天线辐射体传递第二非近场通信激励电流；或
    在所述第一非近地通信芯片连接所述第二馈电点的情况下，所述第二非近场通信芯片通过所述第一馈电点连接所述第一天线辐射体，所述第二非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传递第二非近场通信激励电流。
  9. 根据权利要求1所述的天线装置，其中，所述近场通信芯片的工作频率小于第一非近场通信芯片的工作频率。
  10. 一种终端，其中，包括：
    壳体；
    天线装置，所述天线装置设置于所述壳体，所述天线装置包括：
    第一天线辐射体，所述第一天线辐射体包括第一馈电点和第一连接点，所述第一连接点用于接地；
    第二天线辐射体，所述第二天线辐射体包括第二馈电点和第二连接点，所述第二连接点用于接地，所述第一天线辐射体和所述第二天线辐射体通过所述第一连接点和所述第二连接点连接；
    第一非近场通信芯片，所述第一非近地通信芯片连接所述第一馈电点和/或所述第二馈电点，所述第一非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输第一非近场通信激励电流，和/或通过所述第二馈电点向所述第二天线辐射体传输所述第一非近场通信激励电流；
    近场通信芯片，所述近场通信芯片的两端分别连接所述第一馈电点和所述第二馈电点，所述近场通信芯片通过所述第一馈电点向所述第一天线辐射体传输近场通信激励电流，并 通过所述第二馈电点向所述第二天线辐射体传输所述近场通信激励电流。
  11. 根据权利要求10所述的终端，其中，所述天线装置包括第一电感和第二电感，所述第一连接点和所述第二连接点通过所述第一电感连接，所述近场通信芯片的两端通过所述第二电感分别与所述第一馈电点和所述第二馈电点连接。
  12. 根据权利要求11所述的终端，其中，所述天线装置还包括电容，所述第一非近场通信芯片通过所述电容与所述第一馈电点和/或所述第二馈电点连接。
  13. 根据权利要求11所述的终端，其中，所述天线装置包括：
    磁性件；及
    线圈，所述线圈设置于所述磁性件的表面，所述线圈连接所述近场通信芯片。
  14. 根据权利要求13所述的终端，其中，所述磁性件包括第一磁性部和第二磁性部，所述线圈还包括第一线圈走线和第二线圈走线，所述第一线圈走线和所述第二线圈走线的电流方向相反，所述第一磁性部覆盖所述第一线圈走线的第一侧，所述第二线圈走线设置于所述第二磁性部，并覆盖所述第二线圈走线的第二侧，所述第一侧和所述第二侧相对。
  15. 根据权利要求14所述的终端，其中，所述第一线圈走线的条数小于所述第二线圈走线的条数。
  16. 根据权利要求13所述的终端，其中，所述线圈的圈数大于1。
  17. 根据权利要求10所述的终端，其中，所述天线装置还包括第二非近场通信芯片，
    在所述第一非近地通信芯片连接所述第一馈电点的情况下，所述第二非近场信芯片通过所述第二馈电点连接所述第二天线辐射体，所述第二非近场通信芯片通过所述第二馈电点向所述第二天线辐射体传递第二非近场通信激励电流；或
    在所述第一非近地通信芯片连接所述第二馈电点的情况下，所述第二非近场通信芯片通过所述第一馈电点连接所述第一天线辐射体，所述第二非近场通信芯片通过所述第一馈电点向所述第一天线辐射体传递第二非近场通信激励电流。
  18. 根据权利要求10所述的终端，其中，所述近场通信芯片的工作频率小于第一非 近场通信芯片的工作频率。
  19. 根据权利要求10所述的终端，其中，所述天线装置的磁性件包括第一磁性部和第二磁性部，所述终端还包括支架和主板，所述支架设置在所述主板，所述天线装置的线圈通过所述磁性件设置在所述支架，所述第一磁性部设置在所述线圈的第一线圈走线与所述支架相背的一侧，所述第二磁性件设置在所述线圈的第二线圈走线和所述支架之间。
  20. 根据权利要求19所述的终端，其中，所述终端还包括显示屏，在所述显示屏的出光方向上，所述壳体、线圈、磁性件、支架、主板及显示屏依次堆叠设置，所述终端包括正面、背面和侧面，
    所述第一天线辐射体、所述第二天线辐射体和所述支架均可设置在所述正面、所述背面或所述侧面，且所述第一天线辐射体、所述第二天线辐射体和所述支架中的至少两个的设置位置不同；或
    所述第一天线辐射体和所述第二天线辐射体设置在所述侧面且靠近所述终端的顶部，所述支架靠近所述背面设置。
  21. 根据权利要求20所述的终端，其中，所述壳体包括金属边框，所述金属边框设置于所述侧面，所述第一天线辐射体和所述第二天线辐射体为所述金属边框的一部分。
PCT/CN2022/141106 2022-06-27 2022-12-22 天线装置及终端 WO2024001097A1 (zh)

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