WO2023284274A1 - 用于液冷电子设备性能测试的散热机柜 - Google Patents

用于液冷电子设备性能测试的散热机柜 Download PDF

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Publication number
WO2023284274A1
WO2023284274A1 PCT/CN2022/070950 CN2022070950W WO2023284274A1 WO 2023284274 A1 WO2023284274 A1 WO 2023284274A1 CN 2022070950 W CN2022070950 W CN 2022070950W WO 2023284274 A1 WO2023284274 A1 WO 2023284274A1
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WIPO (PCT)
Prior art keywords
liquid
fan assembly
heat dissipation
cooling
cabinet
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PCT/CN2022/070950
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English (en)
French (fr)
Inventor
刘方宇
陈前
高阳
巫跃凤
郭海丰
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深圳比特微电子科技有限公司
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Publication of WO2023284274A1 publication Critical patent/WO2023284274A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the technical field of liquid cooling and heat dissipation, and in particular to a heat dissipation cabinet for performance testing of liquid-cooled electronic equipment.
  • Electronic equipment usually needs to be tested for performance. For example, before shipment, it is necessary to conduct a series of tests on the electronic equipment under normal heat dissipation to ensure quality.
  • liquid-cooled electronic device an electronic device that uses liquid cooling to dissipate heat
  • the normal heat dissipation of the liquid-cooled electronic device needs to be immersed in a circulating cooling liquid.
  • liquid-cooled electronic equipment needs to be submerged in cooling liquid for performance testing before shipment, which leads to liquid-cooled electronic equipment that needs to be cleaned before packaging and transportation after performance testing, otherwise the residual cooling fluid will be damaged during transportation. Liquids can adversely affect liquid-cooled electronics.
  • the embodiment of the present application provides a heat dissipation cabinet for performance testing of liquid-cooled electronic equipment.
  • One direction is circumferentially closed and both ends are open.
  • a first fan assembly is provided at one end of the heat dissipation slot opposite to the first direction, and a second fan assembly is provided at the other end; wherein, the heat dissipation slot is used to carry liquid cooling.
  • the air outlet directions of the two fan assemblies are set in the same direction along the first direction; thus, when performing performance tests on liquid-cooled electronic equipment, the heat dissipation cabinet can be placed opposite to each other by using the two fan assemblies blowing in the same direction Liquid-cooled electronic equipment is air-cooled to dissipate heat to ensure the normal operation and performance testing of liquid-cooled electronic equipment.
  • two sets of fan assemblies are installed at both ends of the heat dissipation cabinet, and the air outlet directions of the two sets of fan assemblies are set in the same direction, so that when performing performance tests on liquid-cooled electronic equipment, air-cooled heat dissipation can be used instead of liquid-cooled Heat dissipation, so that there is no need to clean the coolant after the performance test, which solves the technical problem of increasing the coolant cleaning process and reducing the test efficiency due to the use of liquid cooling heat dissipation during the performance test, especially for the performance of large-scale liquid-cooled electronic equipment Test, improve the test efficiency, reduce the test cost.
  • An embodiment of the present application provides a cooling cabinet for performance testing of liquid-cooled electronic equipment.
  • the cooling cabinet includes:
  • the heat dissipation groove is arranged on the housing unit, and relative to the first direction, the heat dissipation groove is circumferentially closed and both ends are open;
  • a first fan assembly located at one end of the cooling slot opposite to the first direction
  • a second fan assembly located at the other end of the cooling slot opposite to the first direction
  • the heat sink is used to carry liquid-cooled electronic equipment, and the air outlet directions of the first fan assembly and the second fan assembly are set in the same direction along the first direction, so that the first fan assembly and the second fan assembly The second fan assembly cools and dissipates heat from the liquid-cooled electronic device.
  • FIG. 1 is a schematic structural diagram of the cooling cabinet described in the embodiment of the present application.
  • FIG. 2 is a structural schematic diagram of another angle of the heat dissipation mechanism in the embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of the electrical connection between the power supply socket and the liquid-cooled electronic device in the embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of the communication connection between the control interface and the first fan assembly, the second fan assembly, and the liquid-cooled electronic device in the embodiment of the present application.
  • FIG. 5 is a schematic structural view of the cooling liquid channel in the embodiment of the present application.
  • 10-housing unit 11-loading frame, 12-cabinet body panel, 13-cabinet body sub-panel, 14-rotating component, 15-buckle component, 16-first through hole, 17-second through hole, 18 - swivel wheels,
  • liquid-cooled electronic devices Electronic devices that use liquid cooling to dissipate heat are generally called liquid-cooled electronic devices. Liquid-cooled electronic devices need to be powered on and run for performance testing before shipment.
  • liquid-cooled electronic equipment Since liquid-cooled electronic equipment does not have a fan, it needs to be submerged in a cooling system with coolant for heat dissipation during performance testing to ensure normal operation, which leads to the need for each production plant to be equipped with a high-cost liquid-cooling system .
  • liquid-cooled electronic equipment that has been submerged in cooling fluid needs to be cleaned before packaging and transportation, that is, the cooling fluid on the liquid-cooled electronic equipment must be cleaned, otherwise the residual cooling fluid will damage the packaging of the liquid-cooled electronic equipment. transportation and subsequent use.
  • the embodiment of the present application provides a cooling cabinet for performance testing of liquid-cooled electronic equipment
  • the cooling cabinet includes a housing unit 10, a cooling slot 20, and a first fan assembly 30 and the second fan assembly 40;
  • the heat dissipation groove 20 is arranged on the housing unit 10, and relative to the first direction, the heat dissipation groove 20 is circumferentially closed and has two open ends;
  • the first fan assembly 30 is located in the heat dissipation groove 20 opposite to the first direction;
  • the second fan assembly 40 is located at the other end of the cooling slot 20 relative to the first direction;
  • the cooling slot 20 is used to carry the liquid-cooled electronic device 70, and the air outlet direction of the first fan assembly 30 and the second fan assembly 40 They are arranged in the same direction along the first direction, so that the first fan assembly 30 and the second fan assembly 40 can air-cool and dissipate the liquid-cooled electronic device 70 .
  • the heat dissipation cabinet of the embodiment of the present application uses air-cooled heat dissipation to replace the liquid-cooled heat dissipation of the prior art, and the test environment does not require the installation of a liquid-cooled heat dissipation system and professional equipment. Operators, the test process is simple and fast, and the cost is low; the liquid-cooled electronic equipment does not need to be immersed in the coolant, so that there will be no coolant left on the liquid-cooled electronic equipment, saving the cleaning of the coolant, and improving the test efficiency.
  • the housing unit of the heat dissipation cabinet is, for example, in the shape of a cuboid, and a heat dissipation groove is provided on it, and the heat dissipation groove is used to carry liquid-cooled electronic equipment.
  • the end is open-shaped, and the first direction X is, for example, the horizontal direction; then, a first fan assembly and a second fan assembly are respectively provided at the two ends of the cooling slot opposite to the first direction, and the air outlet directions of the two fan assemblies are in the same direction
  • the air outlet directions of the two fan assemblies are all towards the left or both are towards the right.
  • the two sets of fan assemblies located at both ends of the heat sink can perform air-cooling and heat dissipation on the liquid-cooled electronic device, meeting the heat dissipation requirements of the liquid-cooled electronic device, and the operation is simple.
  • An embodiment of the present application provides a heat dissipation cabinet for performance testing of liquid-cooled electronic equipment.
  • the heat dissipation cabinet includes a housing unit.
  • the housing unit is provided with a heat dissipation groove.
  • the heat dissipation groove is circumferentially closed relative to the first direction and has Arranged in an open shape, and then, a first fan assembly is provided at one end of the heat dissipation slot opposite to the first direction, and a second fan assembly is provided at the other end; wherein, the heat dissipation slot is used to carry liquid-cooled electronic equipment, and the output of the two fan assemblies
  • the wind direction is set in the same direction as the first direction.
  • the cooling cabinet can use two fan assemblies blowing in the same direction to perform air-cooling and heat dissipation on the liquid-cooled electronic equipment placed therebetween, ensuring the normal operation and performance of the liquid-cooled electronic equipment. test.
  • two sets of fan assemblies are installed at both ends of the heat dissipation cabinet, and the air outlet directions of the two sets of fan assemblies are set in the same direction. Cooling and heat dissipation, so that there is no need to clean the coolant after the performance test, which solves the technical problem of reducing the test efficiency due to the increase of the coolant cleaning process caused by the use of liquid cooling and heat dissipation during the performance test, especially for large-scale liquid-cooled electronic equipment Performance testing can significantly improve testing efficiency and reduce testing costs.
  • the liquid-cooled electronic device 70 may have a coolant flow channel 71 running through both ends, and the coolant flow channel 71 may be along the
  • the above-mentioned first direction X is set; in other words, relative to the liquid-cooled electronic equipment 70, the heat dissipation cabinet can be respectively provided with two sets of fan assemblies with the same direction of wind at both ends of the cooling liquid flow channel, and then the liquid-cooled electronic equipment 70 Placed between two sets of fan assemblies.
  • the two groups of fan assemblies respectively located at both ends can form a unidirectional airflow along the first direction in the heat dissipation groove, and when the cooling liquid flow channel is arranged along the first direction, the air flow can follow the direction of the cooling liquid flow.
  • the channels penetrate both ends of the liquid-cooled electronic equipment, thereby realizing heat dissipation for the liquid-cooled electronic equipment.
  • cooling slots may also be provided on the housing unit, and one cooling slot may carry one or more liquid-cooled electronic devices.
  • the cooling cabinet further includes a power supply unit 50 and a control unit 60, the power supply unit 50 is installed in the housing unit 10, and the power supply unit 50 is electrically connected to the liquid-cooled electronic equipment 70; the control unit 60 is installed in the housing unit 10.
  • the control unit 60 is connected in communication with the first fan assembly 30, the second fan assembly 40, and the liquid-cooled electronic device 70 respectively; wherein, the control unit 60 is used to control the first fan assembly 30 respectively according to the working parameters of the liquid-cooled electronic device 70 The first rotational speed of the second fan assembly 40 and the second rotational speed of the second fan assembly 40 .
  • the housing unit is also provided with a power supply unit and a control unit
  • the power supply unit is electrically connected with the liquid-cooled electronic equipment, and is used to provide power support for the normal operation of the liquid-cooled electronic equipment; then, the control unit and the first fan component, the second fan assembly, and the liquid-cooled electronic device are connected in communication at the same time, wherein, the control unit is connected in communication with the liquid-cooled electronic device, so that the control unit can receive the working parameters of the liquid-cooled electronic device, and then, the control unit then according to the working parameters
  • the parameters respectively control the speeds of the two groups of fan assemblies, that is, the first speed and the second speed.
  • the above-mentioned working parameters can be, for example, the working mode and working power of the liquid-cooled electronic equipment, and the greater the working power, the higher the speed of the two groups of fan assemblies; or, the above-mentioned working parameters can also be the The temperature of the device, etc.; the higher the temperature, the higher the speed of the two sets of fan assemblies.
  • the control unit by communicating the control unit with the liquid-cooled electronic equipment and two sets of fan assemblies at the same time, the speed of the fan assembly can be adjusted according to the working parameters of the liquid-cooled electronic equipment. For example, when the working power of the liquid-cooled electronic equipment is high, the control unit increases the speeds of the first fan assembly and the second fan assembly, or when the working power of the liquid-cooled electronic equipment is low, the control unit increases the speed of the first fan assembly and turn down the speed of the second fan assembly.
  • each heat sink can carry a liquid-cooled electronic device, for example.
  • Power respectively adjust the speed of the corresponding two sets of fan components, respectively meet the heat dissipation requirements of liquid-cooled electronic equipment with different working power, strong adaptability and energy saving.
  • the above-mentioned power supply unit can only provide power support for liquid-cooled electronic equipment, and at this time, the two groups of fan assemblies are powered by other power sources; or, the power supply unit can also provide power support for the two groups of fan assemblies.
  • the housing unit includes a bearing frame 11, and a heat dissipation groove 20 is provided on the bearing frame 11, and the heat dissipation groove 20 penetrates both ends of the bearing frame 11 along a first direction; on the bearing frame 11, at least one heat dissipation groove 20 are arranged along the second direction, and the second direction is perpendicular to the first direction.
  • the main body of the housing unit is a carrier, and the above-mentioned cooling groove is provided on the carrier, wherein, along the first direction, the cooling groove runs through both ends of the carrier; referring to Figures 1 and 2, the carrier is provided with
  • the plurality of heat dissipation grooves can be stacked and arranged along the second direction Y (vertical direction), and then, in one-to-one correspondence with the plurality of heat dissipation grooves, a plurality of first fan assemblies are arranged on one side of the carrier, Multiple second fan assemblies are arranged on the other side.
  • the heat dissipation grooves run through both ends of the carrier frame along the first direction, and the plurality of heat dissipation grooves are stacked and arranged along the second direction perpendicular to the first direction, which can avoid the mutual influence of the airflow between the heat dissipation grooves, and the structure is simple. Easy to operate.
  • a cabinet panel 12 is installed on the first end surface of the carrier frame 11 relative to the first direction, and at least one first fan assembly 30 is arranged on the cabinet panel 12, and at least one first fan assembly 30 is connected with at least one
  • the cooling grooves 20 correspond one-to-one
  • at least one cabinet sub-panel 13 is installed on the second end surface of the carrier frame 11 relative to the first direction, and at least one cabinet sub-panel 13 corresponds to at least one cooling slot 20
  • the cabinet sub-panel 13 One side of the cabinet body is connected to the bearing frame 11 through a rotating assembly 14, and the other side of the cabinet body sub-panel 13 is detachably connected to the carrier frame 11 through a buckle assembly 15.
  • the cabinet body sub-panel 13 is equipped with a second fan assembly 40.
  • an integrated cabinet panel 12 is fixedly installed on the first end surface of the carrier along the first direction, and the cabinet panel 12 is used to carry at least one first fan assembly. 30, that is, at least one first fan assembly is installed on the cabinet panel at the same time, and the position of the at least one first fan assembly corresponds to the at least one heat dissipation slot.
  • At least one cabinet sub-panel 13 is installed on the second end surface of the carrier frame 11 along the first direction, and a cabinet sub-panel 13 corresponds to a heat sink 20, and the cabinet sub-panel 13 is used for
  • the second fan assembly 40 is carried, that is, a second fan assembly is mounted on a cabinet sub-panel.
  • the sub-panel of the cabinet body is connected to the carrier frame through a relative rotating assembly 14 and a hasp assembly 15, and the common rotating assembly 14 is, for example, a hinge.
  • the first fan assembly at one end is fixedly installed, and the second fan assembly at the other end can be rotated and opened, so that it is convenient to put in and take out the liquid-cooled electronic device.
  • At least one first fan assembly can be arranged on the panel of the cabinet body as described above for easy installation, or, similar to the second fan assembly, a first fan assembly can also be installed on a sub-panel of the cabinet body.
  • a power supply unit 50 and a control unit 60 are respectively provided on two side walls of the casing unit 10 opposite to the first direction.
  • the power supply unit 50 includes at least one power supply socket 51 arranged along the second direction, and the at least one power supply socket 51 can be in one-to-one correspondence with at least one heat sink 20; Connected by the power cord 52 , the supporting frame 11 is provided with a first through hole 16 for the power cord 52 to pass through.
  • a power supply unit is provided on a side of the carrier frame opposite to the first direction, and the power supply unit provides power support for liquid-cooled electronic equipment.
  • the power supply unit includes, for example, at least one power supply socket, and the arrangement direction of the at least one power supply socket and the at least one heat sink is in the same vertical direction.
  • a power supply socket can correspond to a heat sink, and then, the power supply socket and the liquid-cooled electronic equipment in the heat sink are connected through a power cord, and the supporting frame is also provided with a first through hole for the power cord to pass through, through which the power supply The socket supplies power to the liquid-cooled electronic equipment separately, which is convenient for independent operation.
  • control unit 60 includes at least one control interface 61 arranged along the second direction, and the at least one control interface 61 corresponds to at least one cooling slot 20 one by one; the control interface 61 is connected to the first fan assembly 30, the second The fan assembly 40 and the liquid-cooled electronic device 70 are respectively connected by control wires 62 , and the supporting frame 11 is provided with a second through hole 17 through which the control wires 62 pass.
  • a control unit 60 is provided on the other side of the carrier frame relative to the first direction, and the control unit 60 is used to receive the working power of the liquid-cooled electronic device and control the speed of the two fan assemblies; similarly, the control unit 60 includes, for example At least one control interface, at least one control interface is in the same direction as the at least one heat dissipation slot, and both are vertical, so that one control interface can correspond to one heat dissipation slot, and then the control interface and the liquid-cooled electronic equipment in the heat dissipation slot and the fan assemblies at both ends are respectively connected by control wires, and the supporting frame is also provided with a second through hole for the control wires to pass through.
  • At least one control interface at least one control interface is in the same direction as the at least one heat dissipation slot, and both are vertical, so that one control interface can correspond to one heat dissipation slot, and then the control interface and the liquid-cooled electronic equipment in the heat dissipation slot and the fan assemblies at both ends are respectively connected by control
  • control interface 61 includes a first sub-interface 611, a second sub-interface 612 and a third sub-interface 613, the first sub-interface 611 is used to electrically connect with the first fan assembly 30, and the second sub-interface 612 It is used for electrical connection with the second fan assembly 40 , and the third sub-interface 613 is used for electrical connection with the liquid-cooled electronic device 70 .
  • control interface includes three sub-interfaces, and the three sub-interfaces are respectively electrically connected to the liquid-cooled electronic equipment and the fan assemblies at both ends, so as to meet the independent cooling requirements of the liquid-cooled electronic equipment.
  • the first fan assembly 30 includes at least one first fan
  • the second fan assembly 40 includes at least one second fan
  • the bottom end of the housing unit 10 is provided with a universal wheel 18 .
  • both the first fan assembly and the second fan assembly should include at least one fan, and the unidirectional flow of the internal airflow is caused by the same direction of the fans on both sides of the cooling groove, so as to perform air cooling and heat dissipation , for example, please refer to Figures 1-4, both fan assemblies include two fans; then, universal wheels are provided at the bottom of the shell unit for easy movement.
  • each component or each step can be decomposed and/or reassembled. These decompositions and/or recombinations should be considered equivalents of this application.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请公开了一种用于液冷电子设备性能测试的散热机柜，散热机柜包括壳体单元，壳体单元上设有散热槽，该散热槽相对第一方向呈周向封闭并且两端开口状布置，然后，在散热槽相对第一方向的一端设有第一风扇组件，另一端设有第二风扇组件；其中，该散热槽用于承载液冷电子设备，两个风扇组件的出风方向沿第一方向同向设置；从而，在液冷电子设备进行性能测试时，该散热机柜利用同向吹风的两个风扇组件即可对置于其间的液冷电子设备进行风冷散热。

Description

用于液冷电子设备性能测试的散热机柜
本申请要求于2021年7月15日提交中国专利局、申请号为202121615227.9、申请名称为“用于液冷电子设备性能测试的散热机柜”的中国专利申请的优先权。
技术领域
本申请涉及液冷散热技术领域，尤其涉及一种用于液冷电子设备性能测试的散热机柜。
发明背景
电子设备通常需要进行性能测试，例如在出厂出货前，需要在正常散热的情况下对电子设备进行一系列的测试以保证质量。
现有技术中，利用液冷方式进行散热的电子设备通常称为液冷电子设备，液冷电子设备的正常散热需要浸没在循环流动的冷却液中进行。由此，液冷电子设备在出货前需要浸没在冷却液中进行性能测试，这就导致液冷电子设备在性能测试后，还需要进行清洗处理才能打包运输，否则在运输途中，残留的冷却液会对液冷电子设备造成不利影响。
然而，上述性能测试方案中，尤其对于大批量的液冷电子设备而言，后续的冷却液清洗环节增加了性能测试过程的工序，降低了测试效率，给使用造成不便。
发明内容
针对上述技术问题的至少一个方面，本申请实施例提供了一种用于液冷电子设备性能测试的散热机柜，散热机柜包括壳体单元，壳体单元上设有散热槽，该散热槽相对第一方向呈周向封闭并且两端开口状布置，然后，在散热槽相对第一方向的一端设有第一风扇组件，另一端设有第二风扇组件；其中，该散热槽用于承载液冷电子设备，两个风扇组件的出风方向沿第一方向同向设置；从而，在液冷电子设备进行性能测试时，该散热机柜利用同向吹风的两个风扇组件即可对置于其间的液冷电子设备进行风冷散热，保证液冷电子设备的正常工作以及性能测试。
根据本申请实施例，散热机柜在两端分别设置两组风扇组件，两组风扇组件的出风方向为同向设置，这样在液冷电子设备进行性能测试时即可利用风冷散热替代液冷散热，从而在性能测试后不必再清洗冷却液，解决了在性能测试时由于使用液冷散热导致的增加冷却液清洗环节、降低测试效率的技术问题，尤其对于大批量的液冷电子设备的性能测试，提高了测试效率，降低了测试成本。
本申请实施例提供一种用于液冷电子设备性能测试的散热机柜，所述散热机柜包括：
壳体单元；
散热槽，设于所述壳体单元上，相对第一方向，所述散热槽呈周向封闭并且两端开口状设置；
第一风扇组件，位于于所述散热槽相对所述第一方向的一端；
第二风扇组件，位于于所述散热槽相对所述第一方向的另一端；
其中，所述散热槽用于承载液冷电子设备，所述第一风扇组件和所述第二风扇组件的出风方向沿所述第一方向同向设置，以使所述第一风扇组件和所述第二风扇组件对所述液冷电子设备风冷散热。
附图简要说明
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例中所述散热机柜的结构示意图。
图2为本申请实施例中所述散热机构另一角度的结构示意图。
图3为本申请实施例中所述供电插座与液冷电子设备电连接的结构示意图。
图4为本申请实施例中所述控制接口与第一风扇组件、第二风扇组件和液冷电子设备分别通信连接的结构示意图。
图5为本申请实施例中所述冷却液流道的结构示意图。
其中，附图标记：
10-壳体单元，11-承载架，12-柜体面板，13-柜体子面板，14-转动组件，15-搭扣组件，16-第一通孔，17-第二通孔，18-万向轮，
20-散热槽，
30-第一风扇组件，
40-第二风扇组件，
50-供电单元，51-供电插座，52-电源线，
60-控制单元，61-控制接口，62-控制线，
611-第一子接口，612-第二子接口，613-第三子接口，
70-液冷电子设备，71-冷却液流道，
X-第一方向，Y-第二方向。
实施方式
为了更好的理解上述技术方案，下面将参考附图详细地描述本申请的示例实施例，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例性实施例的限制。
利用液冷方式进行散热的电子设备通常称为液冷电子设备，液冷电子设备在出货前都需要通电运行，进行性能测试。
由于液冷电子设备并没有风扇，其在性能测试时，需要浸没在有冷却液的散热系统中进行散热才能保证正常工作，这就导致每个生产工厂都需要配备成本较高的液冷散热系统。此外，浸没过冷却液的液冷电子设备，在打包运输前，还需要进行 清洗处理，即，将液冷电子设备上的冷却液清洗干净，否则残留的冷却液会对液冷电子设备的包装运输和后续使用造成影响。另外，对于批量生产的液冷电子设备来说，需要快速高效的完成性能测试工序，才能提高工作效率，降低人工成本。
总之，针对液冷电子设备在性能测试时的散热需求，现有的采用液冷散热的技术方案造成很多不便。
针对上述情况并请结合图1、2、5，本申请实施例提供一种用于液冷电子设备性能测试的散热机柜，该散热机柜包括壳体单元10、散热槽20、第一风扇组件30和第二风扇组件40；散热槽20设于壳体单元10上，相对第一方向，该散热槽20呈周向封闭并且两端开口状设置；第一风扇组件30位于散热槽20相对第一方向的一端；第二风扇组件40位于散热槽20相对第一方向的另一端；其中，散热槽20用于承载液冷电子设备70，第一风扇组件30和第二风扇组件40的出风方向沿第一方向同向设置，以使第一风扇组件30和第二风扇组件40对液冷电子设备70风冷散热。
总体来说，针对液冷电子设备在性能测试时的散热需求，本申请实施例的散热机柜，利用风冷散热代替现有技术的液冷散热，测试环境不需要安装液冷散热系统和配备专业的操作人员，测试工序简单快捷，成本较低；液冷电子设备不必浸没在冷却液中，从而使得液冷电子设备上不会残留冷却液，省却了冷却液的清洗环节，提高了测试效率。
本申请实施例中，具体的，该散热机柜的壳体单元例如呈长方体状，其上设有散热槽，散热槽用于承载液冷电子设备，散热槽相对第一方向呈周向封闭并且两端开口状设置，该第一方向X例如为水平方向；然后，在散热槽相对第一方向的两端分别设有第一风扇组件和第二风扇组件，两个风扇组件的出风方向同向设置，例如参看图5，两个风扇组件的出风方向均朝向左侧或均朝向右侧。这样，在对散热槽内的液冷电子设备进行性能测试时，位于散热槽两端的两组风扇组件能够对液冷电子设备进行风冷散热，满足液冷电子设备的散热需求，并且操作简单。
本申请实施例提供了一种用于液冷电子设备性能测试的散热机柜，散热机柜包括壳体单元，壳体单元上设有散热槽，该散热槽相对第一方向呈周向封闭并且两端开口状布置，然后，在散热槽相对第一方向的一端设有第一风扇组件，另一端设有第二风扇组件；其中，该散热槽用于承载液冷电子设备，两个风扇组件的出风方向沿第一方向同向设置。从而，在液冷电子设备进行性能测试时，该散热机柜利用同向吹风的两个风扇组件即可对置于其间的液冷电子设备进行风冷散热，保证液冷电子设备的正常工作以及性能测试。
本申请实施例中，散热机柜在两端分别设置两组风扇组件，两组风扇组件的出风方向为同向设置，这样在液冷电子设备进行性能测试时，即可利用风冷散热替代液冷散热，从而在性能测试后不必再清洗冷却液，解决了在性能测试时由于使用液冷散热导致的增加冷却液清洗环节导致测试效率降低的技术问题，尤其对于大批量的液冷电子设备的性能测试，可以显著提高测试效率，降低测试成本。
更具体的，请继续结合图5，将液冷电子设备70置于散热槽20内，并且，该液 冷电子设备70可具有贯通两端的冷却液流道71，该冷却液流道71可沿上述第一方向X设置；换句话说，相对液冷电子设备70，该散热机柜可在沿着冷却液流道的两端分别设置同向出风的两组风扇组件，然后液冷电子设备70置于两组风扇组件之间。这样，相对散热槽，分别位于两端的两组风扇组件可在散热槽内形成沿第一方向单向流动的气流，并且在冷却液流道沿第一方向设置时，该气流可沿冷却液流道贯通液冷电子设备的两端，从而实现对液冷电子设备的散热。
本实施例中，方便理解的，该壳体单元上也可以设置多个散热槽，一个该散热槽可以承载一个或多个液冷电子设备。
一种可能实施方式中，该散热机柜还包括供电单元50和控制单元60，供电单元50安装于壳体单元10，供电单元50与液冷电子设备70电连接；控制单元60安装于壳体单元10，控制单元60分别与第一风扇组件30、第二风扇组件40和液冷电子设备70通信连接；其中，控制单元60用于根据液冷电子设备70的工作参数分别控制第一风扇组件30的第一转速和第二风扇组件40的第二转速。
由此可见，该壳体单元上还设有供电单元和控制单元，供电单元与液冷电子设备电连接，用于给液冷电子设备的正常工作提供电力支持；然后，控制单元与第一风扇组件、第二风扇组件和液冷电子设备同时进行通信连接，其中，控制单元与液冷电子设备进行通信连接，这样控制单元可以接收液冷电子设备的工作参数，然后，控制单元再根据该工作参数分别控制两组风扇组件的转速，即第一转速和第二转速。
具体的，上述的工作参数例如可以是液冷电子设备的工作模式、工作功率等，工作功率越大，两组风扇组件的转速越高；或者，上述的工作参数也可以是液冷电子设备内部器件的温度等；温度越高，两组风扇组件的转速越高。
能够理解，不同的液冷电子设备可以具有不同的工作功率，同一液冷电子设备也可以处于不同的工作模式，例如正常模式或超频模式等，这就导致散热需求不同。本实施例中，通过将控制单元同时与液冷电子设备和两组风扇组件进行通信连接，这样即可根据液冷电子设备的工作参数，调节风扇组件的转速。例如，液冷电子设备的工作功率较高时，控制单元将第一风扇组件和第二风扇组件的转速调高，或者，液冷电子设备的工作功率较低时，控制单元将第一风扇组件和第二风扇组件的转速调低。
方便理解的，该壳体单元上可以设置多个散热槽，每个散热槽例如承载一个液冷电子设备，此时，本实施例中，该控制单元可以根据多个液冷电子设备的不同工作功率，分别调节与之对应的两组风扇组件的转速，分别满足不同工作功率液冷电子设备的散热需求，适应性强且节能。
方便理解的，上述供电单元可仅为液冷电子设备提供电力支持，此时，两组风扇组件由其它电源提供电力；或者，该供电单元还可以为两组风扇组件提供电力支持。
一种可能实施方式中，壳体单元包括承载架11，承载架11上设有散热槽20，散热槽20沿第一方向贯通承载架11的两端；在承载架11上，至少一个散热槽20 沿第二方向排列，第二方向垂直于第一方向。
具体的，壳体单元的主体为承载架，上述散热槽设于承载架上，其中，沿着第一方向，该散热槽贯穿承载架的两端；结合图1、2，该承载架上设置多个散热槽时，多个散热槽可以沿第二方向Y(竖直方向)堆叠排列，然后，与多个散热槽一一对应的，在承载架的一侧设置多个第一风扇组件，另一侧设置多个第二风扇组件。
本实施例中，散热槽沿第一方向贯穿承载架的两端，并且多个散热槽沿与第一方向垂直的第二方向堆叠排列，可以避免散热槽之间气流的相互影响，结构简单，方便操作。
一种可能实施方式中，承载架11相对第一方向的第一端面安装有柜体面板12，柜体面板12上设有至少一个第一风扇组件30，至少一个第一风扇组件30与至少一个散热槽20一一对应；承载架11相对第一方向的第二端面安装有至少一个柜体子面板13，至少一个柜体子面板13与至少一个散热槽20一一对应；柜体子面板13的一侧与承载架11之间通过转动组件14转动连接，柜体子面板13的另一侧与承载架11之间通过搭扣组件15可拆卸连接，柜体子面板13上安装有第二风扇组件40。
本实施例中，进一步的，一方面，参看图2，在承载架沿第一方向的第一端面固定安装有一体的柜体面板12，该柜体面板12用于承载至少一个第一风扇组件30，即，至少一个第一风扇组件同时安装在该柜体面板上，并且，至少一个第一风扇组件的位置与至少一个散热槽一一对应。
另一方面，参看图3，在承载架11沿第一方向的第二端面安装至少一个柜体子面板13，一个柜体子面板13与一个散热槽20对应，该柜体子面板13用于承载第二风扇组件40，即，一个柜体子面板上安装有一个第二风扇组件。此外，该柜体子面板与承载架之间，通过相对的转动组件14和搭扣组件15连接，常见的转动组件14例如为合页等。
也就是说，相对散热槽，一端的第一风扇组件为固定安装，另一端的第二风扇组件可转动打开，从而方便将液冷电子设备放入与取出。至少一个第一风扇组件可以如上所述设置在柜体面板上，方便安装，或者，与第二风扇组件类似的，一个第一风扇组件也可以安装在一个柜体子面板上。
一种可能实施方式中，壳体单元10相对第一方向的两侧壁分别设有供电单元50和控制单元60。
一种可能实施方式中，供电单元50包括沿第二方向排列的至少一个供电插座51，至少一个供电插座51可与至少一个散热槽20一一对应；供电插座51与液冷电子设备70之间通过电源线52连接，承载架11上设有供电源线52穿过的第一通孔16。
结合图3，在承载架相对第一方向的一侧设置供电单元，供电单元为液冷电子设备提供电力支持。具体的，供电单元例如包括至少一个供电插座，至少一个供电插座与至少一个散热槽的排列方向一致，均为竖直方向。这样，一个供电插座可与一个散热槽对应，然后，供电插座与散热槽内的液冷电子设备之间通过电源线连接， 承载架还设有供电源线穿过的第一通孔，通过供电插座对液冷电子设备单独供电，方便独立操作。
一种可能实施方式中，控制单元60包括沿第二方向排列的至少一个控制接口61，至少一个控制接口61与至少一个散热槽20一一对应；控制接口61与第一风扇组件30、第二风扇组件40和液冷电子设备70之间分别通过控制线62连接，承载架11上设有供控制线62穿过的第二通孔17。
结合图2，在承载架相对第一方向的另一侧设置控制单元60，控制单元60用于接收液冷电子设备的工作功率和控制两个风扇组件的转速；类似的，控制单元60例如包括至少一个控制接口，至少一个控制接口与至少一个散热槽的排列方向一致，均为竖直方向，这样，一个控制接口可与一个散热槽对应，然后，控制接口与散热槽内的液冷电子设备以及两端的风扇组件分别通过控制线连接，承载架还设有供控制线穿过的第二通孔。
一种可能实施方式中，控制接口61包括第一子接口611、第二子接口612和第三子接口613，第一子接口611用于与第一风扇组件30电连接，第二子接口612用于与第二风扇组件40电连接，第三子接口613用于与液冷电子设备70电连接。
由此可见，该控制接口包括三个子接口，三个子接口分别与液冷电子设备和两端的风扇组件电连接，从而满足液冷电子设备独立的散热需求。
一种可能实施方式中，第一风扇组件30包括至少一个第一风扇，第二风扇组件40包括至少一个第二风扇，壳体单元10的底端设有万向轮18。
本实施例中，方便理解的，该第一风扇组件和第二风扇组件均应包括至少一个风扇，通过散热槽两侧风扇的同向出风引起内部气流的单向流动，从而进行风冷散热，例如请结合图1～4，两个风扇组件均包括两个风扇；然后，壳体单元底端设有万向轮方便移动。
以上结合具体实施例描述了本申请的基本原理，但是，需要指出的是，在本申请中提及的优点、优势、效果等仅是示例而非限制，不能认为这些优点、优势、效果等是本申请的各个实施例必须具备的。另外，上述公开的具体细节仅是为了示例的作用和便于理解的作用，而非限制，上述细节并不限制本申请为必须采用上述具体的细节来实现。
本申请中涉及的器件、装置、设备、系统的方框图仅作为例示性的例子并且不意图要求或暗示必须按照方框图示出的方式进行连接、布置、配置。如本领域技术人员将认识到的，可以按任意方式连接、布置、配置这些器件、装置、设备、系统。诸如“包括”、“包含”、“具有”等等的词语是开放性词汇，指“包括但不限于”，且可与其互换使用。这里所使用的词汇“或”和“和”指词汇“和/或”，且可与其互换使用，除非上下文明确指示不是如此。这里所使用的词汇“诸如”指词组“诸如但不限于”，且可与其互换使用。
还需要指出的是，在本申请的装置、设备和方法中，各部件或各步骤是可以分解和/或重新组合的。这些分解和/或重新组合应视为本申请的等效方案。
提供所公开的方面的以上描述以使本领域的任何技术人员能够做出或者使用本申请。对这些方面的各种修改对于本领域技术人员而言是非常显而易见的，并且在此定义的一般原理可以应用于其他方面而不脱离本申请的范围。因此，本申请不意图被限制到在此示出的方面，而是按照与在此公开的原理和新颖的特征一致的最宽范围。
为了例示和描述的目的已经给出了以上描述。此外，此描述不意图将本申请的实施例限制在此公开的形式。尽管以上已经讨论了多个示例方面和实施例，但是本领域技术人员将认识到其某些变型、修改、改变、添加和子组合均应包含在本申请保护的范围之内。

Claims (10)

  1. 一种用于液冷电子设备性能测试的散热机柜，所述散热机柜包括：
    壳体单元(10)；
    散热槽(20)，设于所述壳体单元(10)上，相对第一方向，所述散热槽(20)呈周向封闭并且两端开口状设置；
    第一风扇组件(30)，位于于所述散热槽(20)相对所述第一方向的一端；
    第二风扇组件(40)，位于于所述散热槽(20)相对所述第一方向的另一端；
    其中，所述散热槽(20)用于承载液冷电子设备(70)，所述第一风扇组件(30)和所述第二风扇组件(40)的出风方向沿所述第一方向同向设置，以使所述第一风扇组件(30)和所述第二风扇组件(40)对所述液冷电子设备(70)风冷散热。
  2. 根据权利要求1所述的散热机柜，还包括：
    供电单元(50)，安装于所述壳体单元(10)，所述供电单元(50)与所述液冷电子设备(70)电连接；
    控制单元(60)，安装于所述壳体单元(10)，所述控制单元(60)分别与所述第一风扇组件(30)、所述第二风扇组件(40)和所述液冷电子设备(70)通信连接；
    其中，所述控制单元(60)用于根据所述液冷电子设备(70)的工作参数，分别控制所述第一风扇组件(30)的第一转速和所述第二风扇组件(40)的第二转速。
  3. 根据权利要求2所述的散热机柜，其中，所述壳体单元(10)包括承载架(11)，所述承载架(11)上设有所述散热槽(20)，所述散热槽(20)沿所述第一方向贯通所述承载架(11)的两端；
    在所述承载架(11)上，至少一个所述散热槽(20)沿第二方向排列，所述第二方向垂直于所述第一方向。
  4. 根据权利要求3所述的散热机柜，其中，所述承载架(11)相对所述第一方向的第一端面安装有柜体面板(12)，所述柜体面板(12)上设有至少一个所述第一风扇组件(30)，至少一个所述第一风扇组件(30)与至少一个所述散热槽(20)一一对应。
  5. 根据权利要求3所述的散热机柜，其中，所述承载架(11)相对所述第一方向的第二端面安装有至少一个柜体子面板(13)，至少一个所述柜体子面板(13)与至少一个所述散热槽(20)一一对应；
    所述柜体子面板(13)的一侧与所述承载架(11)之间通过转动组件(14)转动连接，所述柜体子面板(13)的另一侧与所述承载架(11)之间通过搭扣组件(15)可拆卸连接，所述柜体子面板(13)上安装有所述第二风扇组件(40)。
  6. 根据权利要求3所述的散热机柜，其中，所述壳体单元(10)相对所述第一方向的两侧壁分别设有所述供电单元(50)和所述控制单元(60)。
  7. 根据权利要求6所述的散热机柜，其中，所述供电单元(50)包括沿所述第二方向排列的至少一个供电插座(51)，至少一个所述供电插座(51)与至少一个所 述散热槽(20)一一对应；所述供电插座(51)与所述液冷电子设备(70)之间通过电源线(52)连接，所述承载架(11)上设有供所述电源线(52)穿过的第一通孔(16)。
  8. 根据权利要求6所述的散热机柜，其中，所述控制单元(60)包括沿所述第二方向排列的至少一个控制接口(61)，至少一个所述控制接口(61)与至少一个所述散热槽(20)一一对应；所述控制接口(61)与所述第一风扇组件(30)之间、所述第二风扇组件(40)和所述液冷电子设备(70)之间，分别通过控制线(62)连接，所述承载架(11)上设有供所述控制线(62)穿过的第二通孔(17)。
  9. 根据权利要求8所述的散热机柜，其中，所述控制接口(61)包括第一子接口(611)、第二子接口(612)和第三子接口(613)，所述第一子接口(611)用于与所述第一风扇组件(30)电连接，所述第二子接口(612)用于与所述第二风扇组件(40)电连接，所述第三子接口(613)用于与所述液冷电子设备(70)电连接。
  10. 根据权利要求1所述的散热机柜，其中，所述第一风扇组件(30)包括至少一个第一风扇，所述第二风扇组件(40)包括至少一个第二风扇，所述壳体单元(10)的底端设有万向轮(18)。
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