WO2023282557A1

WO2023282557A1 - Electronic device grounding camera module

Info

Publication number: WO2023282557A1
Application number: PCT/KR2022/009594
Authority: WO
Inventors: 표선형; 정화중; 허민
Original assignee: 삼성전자 주식회사
Priority date: 2021-07-05
Filing date: 2022-07-04
Publication date: 2023-01-12
Also published as: KR20230007133A

Abstract

According to various embodiments, an electronic device comprises: a camera module including a lens barrel in which a lens assembly is provided, and an outer housing surrounding the lens barrel; and a mounting structure used to mount the camera module to the electronic device. The outer housing of the camera module is electrically connected to the mounting structure such that noise introduced from the outside flows out through an electrical connection unit to a grounding unit provided in the electronic device. Various other embodiments are also possible.

Description

Electronic device that grounds the camera module

Various embodiments of the present disclosure relate to an electronic device, for example, an electronic device forming a ground path such that a camera module is grounded.

Various electronic components may be disposed inside an electronic device such as a mobile device for communication. Electronic components disposed in the electronic device may be required to satisfy electromagnetic compatibility. These electronic components must be designed and manufactured to minimize electromagnetic influence in order to satisfy electromagnetic compatibility characteristics.

In order to improve electromagnetic compatibility characteristics of electronic components, it is desirable to secure a sufficient separation distance between electronic components inside an electronic device. However, electronic devices that are continuously miniaturized may have limitations in securing a sufficient separation distance between electronic components.

The electronic device may include a camera module for taking pictures and/or videos and an antenna module for supporting wireless communication. An antenna module included in an electronic device may process a radio frequency (RF) signal in a predetermined frequency band for wireless communication. Such an RF signal may act as electromagnetic noise to parts included in an electronic device. The electromagnetic noise may affect, for example, an operating frequency used in an image sensor (eg, a CMOS image sensor) of a camera module, and may interfere with taking pictures and/or videos in an electronic device.

One aspect of the present disclosure is to provide an electronic device having a ground structure for protecting a camera module from internal noise.

Another aspect of the present disclosure is to provide an electronic device including a path through which noise generated inside flows to the ground through a mounting structure for fixing a camera module.

According to various embodiments, an electronic device includes a camera module including a housing surrounding a lens barrel having a lens assembly therein, and a mounting structure used to mount the camera module to the electronic device, the housing comprising: Electrically connected to the mounting structure, noise introduced from the outside into the housing may be configured to flow to a grounding unit provided in the electronic device through the electrically connected mounting structure.

According to various embodiments, an electronic device has a camera module and an accommodating space into which the camera module can be inserted, and a structure in which the camera module is inserted into the accommodating space and fixed to the electronic device using a screw. A mounting structure including a mounting structure, wherein the housing surrounding the lens barrel in the camera module inserted into the accommodation space may be electrically connected at at least one point where the mounting structure comes into contact with each other by welding.

According to various embodiments proposed in the present disclosure, the electronic device blocks internal electrical or electromagnetic noise from being introduced into the camera module, thereby stably driving the camera module.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

2 is a block diagram illustrating a camera module, in accordance with various embodiments.

3 is an exploded perspective view of a camera module and a mounting structure, according to various embodiments.

4 is a combined perspective view of a camera module and a mounting structure according to various embodiments.

5 is a perspective view of a mounting structure configured to be continuously welded to an outer housing of a camera module along its entire outer periphery, according to one embodiment.

6 is a plan view in which a camera module is mounted in an electronic device according to an embodiment.

7 is a perspective view of a mounting structure configured to be welded to an outer housing of a camera module at a portion of an outer periphery, according to one embodiment.

8 illustrates an example of a path for transferring noise that may flow into a camera module from an electronic device to a ground unit, according to various embodiments.

Hereinafter, various embodiments will be described in detail with reference to the accompanying drawings. In the following description, specific details such as detailed configurations and elements are provided merely to facilitate a general understanding of embodiments of the present disclosure. Accordingly, it should be apparent to those skilled in the art that various changes and modifications of the embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and structures may be omitted for clarity and conciseness.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of other functionally related components (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 may be used to realize peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency (for realizing URLLC). Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, a printed circuit board (PCB)). According to , the antenna module 197 may include a plurality of antennas (eg, an array antenna) In this case, a communication method used in a communication network such as the first network 198 or the second network 199 At least one suitable antenna may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power is transferred between the communication module 190 and the outside through the selected at least one antenna. According to some embodiments, other parts (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram 200 illustrating a camera module 180, in accordance with various embodiments.

Referring to FIG. 2 , the camera module 180 includes a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (eg, a buffer memory), or an image signal processor. (260). The lens assembly 210 may collect light emitted from a subject that is an image capturing target. The lens assembly 210 may include one or more lenses. According to one embodiment, the camera module 180 may include a plurality of lens assemblies 210 . In this case, the camera module 180 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 may have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly may have the same lens properties as other lens assemblies. may have one or more lens properties different from the lens properties of . The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 220 may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash 220 may include one or more light emitting diodes (eg, a red-green-blue (RGB) LED, a white LED, an infrared LED, or an ultraviolet LED), or a xenon lamp. The image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to one embodiment, the image sensor 230 is, for example, an image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, It may include a plurality of image sensors having a property, or a plurality of image sensors having other properties. Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 240 moves at least one lens or image sensor 230 included in the lens assembly 210 in a specific direction in response to movement of the camera module 180 or the electronic device 101 including the same. Operation characteristics of the image sensor 230 may be controlled (eg, read-out timing is adjusted, etc.). This makes it possible to compensate at least part of the negative effect of the movement on the image being taken. According to one embodiment, the image stabilizer 240 may include a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180. It is possible to detect such a movement of the camera module 180 or the electronic device 101 by using. According to one embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer. The memory 250 may at least temporarily store at least a portion of an image acquired through the image sensor 230 for a next image processing task. For example, when image acquisition is delayed according to the shutter, or a plurality of images are acquired at high speed, the acquired original image (eg, a Bayer-patterned image or a high-resolution image) is stored in the memory 250 and , a copy image (eg, a low resolution image) corresponding thereto may be previewed through the display module 160 . Thereafter, when a specified condition is satisfied (eg, a user input or a system command), at least a part of the original image stored in the memory 250 may be obtained and processed by the image signal processor 260 , for example. According to one embodiment, the memory 250 may be configured as at least a part of the memory 130 or as a separate memory operated independently of the memory 130 .

The image signal processor 260 may perform one or more image processes on an image obtained through the image sensor 230 or an image stored in the memory 250 . The one or more image processes, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring, sharpening, or softening. Additionally or alternatively, the image signal processor 260 may include at least one of the components included in the camera module 180 (eg, an image sensor). 230) may be controlled (eg, exposure time control, read-out timing control, etc.) The image processed by the image signal processor 260 is stored again in the memory 250 for further processing. or may be provided as an external component of the camera module 180 (eg, the memory 130, the display module 160, the electronic device 102, the electronic device 104, or the server 108). According to an example, the image signal processor 260 may be configured as at least a part of the processor 120 or may be configured as a separate processor that operates independently of the processor 120. The image signal processor 260 may be configured as a processor 120 When configured as a separate processor, at least one image processed by the image signal processor 260 may be displayed through the display module 160 as it is or after additional image processing by the processor 120 .

According to an embodiment, the electronic device 101 may include a plurality of camera modules 180 each having different properties or functions. In this case, for example, at least one of the plurality of camera modules 180 may be a wide-angle camera, and at least the other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 may be a front camera, and at least another one may be a rear camera.

Referring to FIG. 3 , according to various embodiments, a camera module 330 (eg, the camera module 180 of FIG. 1 ) may include a lens barrel 331 and an outer housing 333 . The camera module 330 may be formed in a structure disposed on a printed circuit board 340 on which an image sensor (eg, the image sensor 230 of FIG. 2 ) is mounted. The lens barrel 331 may include a lens assembly (eg, the lens assembly 210 of FIG. 2 ). The outer housing 333 may be configured to surround the lens barrel 331 outside the lens barrel 331 . The outer housing 333 may be configured to be located at the outermost part of the camera module 330 . The outer housing 333 may be configured to perform a function of a shield can to shield electromagnetic waves from entering the lens assembly included in the camera module 330 .

According to one embodiment, the camera module 330 may further include an inner housing (not shown) surrounding the lens barrel 331 between the outer housing 333 and the lens barrel 331 . For example, a housing surrounding the lens barrel 331 in the camera module 330 may include an inner housing (not shown) and an outer housing 333 located outside the housing.

According to one embodiment, the inner housing (not shown) may be formed of a lightweight material such as plastic, and the outer housing 333 is formed of a metal member (eg, a member formed of a conductive material such as metal). It may be configured to perform the function of a shield can. However, the inner housing (not shown) is not necessarily formed of a material such as plastic, and may be formed of a metal member similar to the outer housing 333 .

According to one embodiment, when the housing of the camera module 330 is formed to include an inner housing (not shown) and an outer housing 333, electrical connection between the camera module 330 and the mounting structure 300 may be configured to be conducted through the outer housing 333 .

According to various embodiments, the mounting structure 300 may have an accommodation space 310 at its center. The accommodating space 310 may have a structure in which the camera module 330 can be accommodated and electrically coupled. A flange portion 320 may be provided on the outer periphery of the mounting structure 300 . The flange part 320 may include one or more fastening parts 321 disposed along the circumferential direction. At least one through hole 323 may be formed in the fastening part 321 .

According to the structure discussed above, at least a portion of the camera module 330 is accommodated in the accommodation space 310 formed in the mounting structure 300 so that the outer housing 333 of the camera module 330 is the planar surface of the mounting structure 300. It may be electrically coupled to branch 320 . The outer housing 333 of the camera module 330 may be electrically coupled to the flange portion 320 provided on the mounting structure 300 by, for example, laser welding.

4 is a combined perspective view of a camera module (eg, the camera module 330 of FIG. 3 ) and a mounting structure (eg, the mounting structure 300 of FIG. 3 ) according to various embodiments.

Referring to FIG. 4 , according to various embodiments, a camera module 330 (eg, the camera module 180 of FIG. 1 ) is electrically coupled to a mounting structure 300 so that the electronic It may be configured to be mounted on a set structure (eg, the set structure 800 of FIG. 8 ) of a device (eg, the electronic device 101 of FIG. 1 ).

According to one embodiment, at least one through hole 323 included in the mounting structure 300 may be fixed to the electronic device 101 by a set structure including a bolt member (not shown). A space or a physical connector may be provided inside the electronic device 101 to mount the mounting structure 300 by the set structure. The mounting structure 300 fixed to the set structure may be electrically coupled to the internal ground of the electronic device 101 by, for example, a separately provided conductive member (not shown).

As shown in FIG. 4 , when the camera module 330 is accommodated in the mounting structure 300, the mounting structure 300 may be electrically coupled to the outer housing 333 included in the camera module 330. there is. In this case, a conductive path may be formed between the outer housing 333 of the camera module 330 and the mounting structure 300 .

According to one embodiment, the mounting structure 300 may be electrically connected to the outer housing 333 of the camera module 330 by welding. The welding may preferably exist between a portion where the conductive material is disposed on the mounting structure 300 and a portion where the conductive material is disposed on the outer housing 333 .

According to one embodiment, the outer housing 333 of the camera module 330 and/or the mounting structure 300 may be partially or entirely formed of a conductive material such as metal. When the outer housing 333 and/or the mounting structure 300 are configured to be partially formed of a metal member, the electrical connection between the outer housing 333 and the mounting structure 300 is formed through a portion formed of a metal member. can be done through

According to one embodiment, the outer housing 333 of the camera module 330 and the mounting structure 300 are made of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS (stainless steel-based material). It may be formed of a metal material containing one or more of.

According to another embodiment, the outer housing 333 of the camera module 330 and the mounting structure 300 may be formed of, for example, any one of Zn, Al, Mg, and SUS.

According to one embodiment, the outer housing 333 of the camera module 330 and the mounting structure 300 may be formed of the same metal material to facilitate electrical connection through welding.

According to one embodiment, the outer housing 333 of the camera module 330 and the mounting structure 300 are along the entire outer periphery of the outer housing 333 of the camera module 330 and the mounting structure 300. It may be configured to be continuously welded (portions marked W1 to W6 in FIG. 5).

According to another embodiment, the outer housing 333 of the camera module 330 and the mounting structure 300 are localized between the outer housing 333 of the camera module 330 and the outer periphery of the mounting structure 300. It may also be configured to perform welding (the part marked W in FIG. 8) with.

Although shown in FIG. 4, the flange portion 320, the fastening portion 321, and the through hole 323, which are components for which detailed descriptions have not been made, have already been described with reference to FIG. 3, so a detailed description thereof has been omitted. .

5, according to an embodiment, the outer housing (eg, the outer housing 333 of FIG. 3 or 4) of the camera module (eg, the camera module 330 of FIG. 3 or 4) on the entire outer periphery. A perspective view of a mounting structure 300 configured to be continuously welded (eg, the mounting structure 300 of FIG. 3 or 4 ).

Referring to FIG. 5 , according to an embodiment, at least one weldable region (W1, W2, W3, W4, W5, W6) composed of a conductor is formed in part or all of the entire outer periphery of the mounting structure 300. can be placed. In the weldable regions W1 , W2 , W3 , W4 , W5 , and W6 of the mounting structure 300 , for example, a conductive material is applied to each of the left, right, upper and/or lower rims constituting the outer periphery. It may be partially or wholly formed or disposed. The weldable region independently formed on each of the left, right, upper and/or lower edges may be formed or disposed as one region or a plurality of regions separated from each other. For example, weldable regions W5 and W6 consisting of one region may be disposed on each of the upper and lower edges, and at least two separate weldable regions W1, W2 and W3 may be disposed on each of the left and right edges. and W4) may be disposed.

According to one embodiment, the mounting structure 300 has an accommodation space 310 (eg, FIG. 3 or FIG. It may be electrically coupled with an outer housing (eg, the outer housing 333 of FIG. 3 or 4) that is at least a part of the camera module 330 housed in the accommodation space 310 of 4). The electrical coupling may be performed, for example, by laser welding.

According to one embodiment, the first to sixth weldable regions W1, W2, W3, W4, W5, and W6 in the mounting structure 300 include one or more of Zn, Al, Mg, and SUS. It can be formed of a metal member that does. As another example, at least one weldable region to be electrically coupled to the outer housing 333 provided in the camera module 330 among the first to sixth weldable regions W1 , W2 , W3 , W4 , W5 , and W6 . It may be formed of any one of silver, Zn, Al, Mg, and SUS metal material.

According to an embodiment, the outer housing 333 provided in the camera module 330 among the first to sixth weldable regions W1 , W2 , W3 , W4 , W5 , and W6 disposed on the mounting structure 300 . At least one weldable region electrically coupled to the flange portion 320 of the mounting structure 300 for physical fastening with the set structure of the electronic device 101 (for example, the set structure 800 of FIG. 8 ). ) (eg, the flange portion 320 of FIG. 3 or 4) may have a structure electrically connected to at least one fastening part 321 (eg, the fastening part 321 of FIG. 3 or 4) formed on the there is. The at least one fastening part 321 may include a through hole 323 (eg, the through hole 323 of FIG. 3 or 4 ). The mounting structure 300 may be fixed to the set structure of the electronic device 101 by a bolt member inserted into the through hole 323 . The fastening part 321 including the through hole 323 may be electrically connected to the internal ground of the electronic device 101 by a support member (not shown) made of a conductive material. Therefore, when the mounting structure 300 is mounted on the electronic device 101, the outer housing 333 provided on the camera module 330 is coupled to the flange portion 320 of the mounting structure 300. It may be electrically connected to the internal ground of the electronic device 101 through the unit 321 and the predetermined support member.

Due to the structure of the mounting structure 300 according to the embodiment described above, noise introduced from the outside into the outer housing 333 of the camera module 330 is between the outer housing 333 and the mounting structure 300. A ground structure (eg, PBA) provided in the electronic device 101 through an electrical connection (eg, a welding part), the mounting structure 300, and a set structure of the electronic device 101 coupled with the mounting structure 300. ground). Due to this, the camera module 330 can have an easy and stable grounding structure. In order to prevent the noise introduced from the outside from penetrating into the camera module 330, the outer housing 333 of the camera module 330 has a grounding unit provided inside the camera module 330 (not shown). ) and electrically separated from the configuration may be desirable.

6 illustrates a camera module (eg, the camera module 180 of FIG. 1 or the camera module 330 of FIG. 3 or 4) in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment. ) is a plan view with the mounting.

Referring to FIG. 6 , according to one embodiment, the camera module 330 may be coupled to be electrically connected to the mounting structure 300 in a weldable region (W). The mounting structure 300 in which the camera module 330 is accommodated is attached to the electronic device 101 by a fastening member (for example, the fastening part 321 of FIG. 3 or 4) formed on the mounting structure 300. Electrical coupling may be made to a provided space or a physical connector.

According to one embodiment, the mounting structure 300 may include a plurality of fastening parts. Referring to FIG. 6 , the mounting structure 300 may include three fastening parts, and through-holes (eg, through-holes 323 of FIG. 3 or 4) may be formed in each of the three fastening parts. there is. The mounting structure 300 may be fixed to be electrically coupled to the electronic device 101 by the

screws

610 , 620 , and 630 inserted into the through holes of each of the three fastening parts.

Figure 7, according to one embodiment, the outer housing (eg, the outer housing 333 of Fig. 3 or 4) of the camera module (eg, the camera module 330 of Fig. 3 or 4) at a portion of the outer periphery A perspective view of a mounting structure 300 configured to be welded (eg, mounting structure 300 of FIG. 3 or 4 ).

Referring to FIG. 7 , according to one embodiment, a mounting structure 300 may have a portion (dot-processed portion in the drawing) made of a metal member, and the remaining portion (not-dot-processed portion in the drawing) made of plastic. It may be configured to be formed of the same non-metallic member. A portion of the mounting structure 300 to be formed of a metal member may be, for example, an insert 740 including a fastening portion 321 having a through hole 323 .

According to one embodiment, the mounting structure 300 may be provided with an accommodating space 310 capable of accommodating the camera module 330 in the center. A flange portion 320 for mounting the mounting structure 300 to the set structure of the electronic device 101 may be provided at an outer portion of the accommodating space 310 . An insert 740 including a fastening portion 321 having a through hole 323 may be provided at one side of the flange portion 320 . The mounting structure 300 may be fixed to a set structure (eg, the set structure 800 of FIG. 8 ) of the electronic device 101 by inserting a bolt member through the through hole 323 .

According to one embodiment, the flange part 320 included in the mounting structure 300 may be configured to include an insert 740 formed of a metal member and an injection part 750 formed of a non-metal member such as plastic. The mounting structure 300, for example, in a state in which an insert 740 formed of a metal member is placed in a mold, injects molten plastic into the mold, and the injection unit 750 is injected into the insert 740. It can be formed into a molded structure.

According to one embodiment, the mounting structure 300 includes at least one of the camera modules 330 housed in the accommodating space 310 (eg, the accommodating space 310 of FIG. 3 or 4) in at least one insert 740. It may be electrically coupled to a part of the outer housing (eg, the outer housing 333 of FIG. 3 or 4 ). The electrical coupling may be performed, for example, by laser welding. The insert 740 of the mounting structure 300 may be formed of, for example, a metal member containing one or more of Zn, Al, Mg, and SUS. For example, the insert 740 of the mounting structure 300 may be formed of any one metal material among Zn, Al, Mg, and SUS.

According to one embodiment, the insert 740 may be formed of a metal member that can be electrically coupled to the outer housing 333 provided in the camera module 330 . The insert 740 may include at least one fastening part 321 (eg, the fastening part 321 of FIG. 3 or 4 ) formed to physically fasten the electronic device 101 to the set structure. . The at least one fastening part 321 may include a through hole 323 (eg, the through hole 323 of FIG. 3 or 4 ). The mounting structure 300 may be fixed to the set structure of the electronic device 101 by a bolt member inserted into the through hole 323 . The fastening part 321 including the through hole 323 may be electrically connected to the internal ground of the electronic device 101 by a support member (not shown) made of a conductive material. When the mounting structure 300 is mounted on the electronic device 101, the outer housing 333 provided on the camera module 330 is an insert 740 formed on the flange portion 320 of the mounting structure 300. ), the fastening part 321 disposed on the insert 740, and a predetermined support member to be electrically connected to the internal ground of the electronic device 101.

According to one embodiment, when the outer housing 333 of the camera module 330 and the insert 740 of the mounting structure 300 are formed of different metal materials, the outer housing 333 of the camera module 330 is mounted A connection part (not shown) made of the same metal material as the insert 740 of the structure 300 may be further included. The insert 740 of the mounting structure 300 may be configured to be welded to the outer housing 333 of the camera module 330 through a connection portion (not shown) made of the same metal material.

According to one embodiment, a connection portion (not shown) provided on the outer housing 333 of the camera module 330 may be formed of a metal member containing one or more of Zn, Al, Mg, and SUS. For example, a connection part (not shown) provided on the outer housing 333 of the camera module 330 may be formed of any one metal material among Zn, Al, Mg, and SUS.

According to one embodiment, the mounting structure 300 may be configured to be electrically connected to the electronic device 101 through a through hole 323 formed in the fastening part 321 . For example, the mounting structure 300 may be configured to be electrically connected to the electronic device 101 using a member such as a bolt member or a bracket of a set structure.

According to another embodiment described above, due to the structure of the mounting structure 300, noise introduced from the outside into the outer housing 333 of the camera module 330, the outer housing 333 and the mounting structure 300 A grounding structure (eg, PBA) provided in the electronic device 101 through an electrical connection (eg, a welding part) between the mounting structure 300 and a set structure of the electronic device 101 coupled with the mounting structure 300 ground). Due to this, the camera module 330 can have an easy and stable grounding structure. In order to prevent the noise introduced from the outside from penetrating into the camera module 330, the outer housing 333 of the camera module 330 has a grounding unit (not shown) provided inside the camera module 330. It may be desirable to configure to be electrically separated from.

8 illustrates noise that may flow from an electronic device (eg, the electronic device 101 of FIG. 1 ) to a camera module (eg, the camera module 330 of FIG. 3 or 4 ) according to various embodiments. An example of a path that delivers to the ground is shown.

Referring to FIG. 8, according to an embodiment, a mounting structure 300 (eg, the mounting structure 300 of FIG. 5 or the mounting structure 300 of FIG. 7) is a fastening part (eg, the fastening part of FIG. 5 ( 321) or the fastening part 321 of FIG. 7) to be electrically connected to the electronic device 101. The mounting structure 300 may be fastened to the electronic device 101 by, for example, the set structure 800 . The set structure 800 may include a bolt member and a bracket 810 formed of a conductive material around the bolt member. When fastened to the electronic device 101 by the bolt member, the mounting structure 300 may be electrically connected to the ground of the electronic device 101 through the bracket 810 .

According to one embodiment, the mounting structure 300 may be electrically connected to the outer housing 333 of the camera module 330 . The electrical connection may be configured by, for example, welding between a metal member formed on the mounting structure 300 and a metal member formed on the outer housing 333 of the camera module 330 . Welding for the electrical connection may be performed, for example, at a location W (electrical connection portion) where the mounting structure 300 and the outer housing 333 are exposed to the outside and come into contact with each other.

Due to the structure shown in FIG. 8, noise introduced into the outer housing 333 of the camera module 330 from the outside does not penetrate into the camera module 330, and the outer housing 333 and the electrical connection portion (W) ) (eg, a welding part), the mounting structure 300, and the bracket 810 included in the set structure 800 transmit noise to be transmitted to the ground structure (eg, PBA Ground) provided in the electronic device 101 A route (shown as a solid line in the drawing) can be provided.

Although this disclosure has been particularly shown and described with reference to particular embodiments, various changes may be made in form and detail without departing from the spirit and scope of the disclosure as defined by the appended claims and equivalents thereto. It will be understood by those skilled in the art.

According to an embodiment of the present disclosure, the electronic device 101 includes a lens barrel (eg, the lens barrel 331 of FIG. 3 ) having a lens assembly (eg, the lens assembly 210 of FIG. 2 ) therein. A camera module (eg, the camera module 330 of FIGS. 3 and 4 ) including an enclosing housing (eg, the outer housing 333 of FIGS. 3 and 4 ); and a mounting structure (eg, the mounting structure 300 of FIGS. 3 and 4 ) used to mount the camera module to the electronic device, and the housing is electrically connected to the mounting structure so as to connect the housing from the outside. The introduced noise may be configured to flow out to a grounding unit (not shown) provided in the electronic device through the mounting structure electrically connected thereto.

According to one embodiment of the present disclosure, the housing may be configured to be electrically connected to the mounting structure through welding (eg, the weldable region W of FIG. 8 ).

According to one embodiment of the present disclosure, the housing and the mounting structure may be formed of a metal member.

According to one embodiment of the present disclosure, the metal member may be formed to include at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.

According to an embodiment of the present disclosure, a fastening part (eg, a through hole 323 of FIGS. 3 and 4 ) configured to allow a bolt member to be inserted and fastened to the electronic device (eg, a through hole 323 of FIGS. 3 and 4 ). The fastening part 321 of 4) is formed on one side of the mounting structure, and the fastening part may be formed of a metal member.

According to one embodiment of the present disclosure, the mounting structure is formed by injection molding a plastic member on an insert formed of a metal member (eg, the insert 740 of FIG. 7 ), and the insert is welded to the housing to electrically It can be configured to be connected to.

According to one embodiment of the present disclosure, the insert may be formed of a metal member including at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.

According to an embodiment of the present disclosure, the insert may include a fastening part configured to mount the mounting structure to the electronic device (eg, the fastening part 321 of FIG. 7 ).

According to one embodiment of the present disclosure, the housing has a connection part formed of the same material as the insert disposed on the mounting structure on one side, and the insert may be laser welded to the connection part provided in the housing.

According to one embodiment of the present disclosure, the connection part provided in the housing may be formed of a metal material including at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS. .

According to an embodiment of the present disclosure, a set structure (eg, the set structure 800 of FIG. 8 ) configured to fix the mounting structure to the electronic device may be further included.

According to one embodiment of the present disclosure, the set structure is a bracket (eg, the bracket of FIG. 8 ( 810)).

According to an embodiment of the present disclosure, a camera module (eg, the camera module 330 of FIGS. 3 and 4); and an accommodating space into which the camera module can be inserted (e.g., the accommodating space 310 of FIG. 3), and a screw (e.g., the

screws

610, 620, and 630 of FIG. 6) is used to allow the camera module to It includes a mounting structure (eg, the mounting structure 300 of FIGS. 3 and 4) having a structure inserted into the accommodation space and coupled to be fixed to the electronic device (eg, the electronic device 101 of FIG. 1), wherein, At least one housing (eg, the outer housing 333 of FIGS. 3 and 4 ) surrounding the lens barrel (eg, the lens barrel 331 of FIG. 3 ) in the camera module inserted into the accommodation space and the mounting structure come into contact with each other. The electronic device may be configured to be electrically connected by welding (eg, the weldable region W of FIG. 8 ) at the point of .

According to one embodiment of the present disclosure, in the mounting structure, an insert formed of a metal member (eg, insert 740 of FIG. 7 ) at the at least one point of the mounting structure that comes into contact with the housing is injection molded into a plastic member. may have a structure.

According to an embodiment of the present disclosure, the metal member forming the insert may include at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.

According to an embodiment of the present disclosure, in order to fix the mounting structure, the screw is inserted into a portion of the insert facing the set structure (eg, the set structure 800 of FIG. 8 ) configured in the electronic device to fix the set structure. A fastening part (eg, fastening part 321 of FIGS. 3 and 4 ) having a through hole (eg, through hole 323 of FIGS. 3 and 4 ) for coupling structures may be included.

According to one embodiment of the present disclosure, the mounting structure may be an injection-molded plastic product obtained by inserting a metal material into a position in contact with the housing.

According to an embodiment of the present disclosure, the metal material may be one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.

According to one embodiment of the present disclosure, in the camera module, the housing may have a structure insulated from the lens barrel.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^TM ) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a storage medium readable by a device such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

Claims

In electronic devices,

A camera module including a housing surrounding a lens barrel having a lens assembly therein;

A mounting structure used to mount the camera module to the electronic device;

The electronic device of claim 1 , wherein the housing is electrically connected to the mounting structure so that noise introduced into the housing from the outside flows out to a grounding unit provided in the electronic device through the electrically connected mounting structure.
According to claim 1,

The electronic device configured to electrically connect the housing to the mounting structure through welding.
According to claim 1,

The electronic device, wherein the housing and the mounting structure are formed of a first metal member.
According to claim 1,

A fastening part including a through hole through which a bolt member is inserted and fastened to the electronic device is formed on one side of the mounting structure,

The fastening part is formed of a second metal member.
According to claim 1,

The mounting structure is formed by injection molding a plastic member on an insert formed of a third metal member,

wherein the insert is welded to and electrically connected to the housing.
According to claim 5,

The electronic device of claim 1, wherein the insert includes a fastening portion configured to mount the mounting structure to the electronic device.
According to claim 1,

The housing has a connection portion formed of the same material as the insert disposed on the mounting structure on one side,

Wherein the connecting portion is laser welded to the insert.
The method of any one of claims 3, 4, 5, or 7,

The first metal member, the second metal member, the third metal member, or the connecting portion is formed to include at least one of zinc (Zn), aluminum (Al), magnesium (Mg), or SUS, electronic device.
According to claim 1,

further comprising a set structure configured to secure the mounting structure to the electronic device;

The electronic device of claim 1 , wherein the set structure includes a bracket installed between the mounting structure and the ground portion so that the mounting structure is electrically connected to the ground portion provided in the electronic device.
camera module; and

A mounting structure having an accommodating space into which the camera module can be inserted and having a structure in which the camera module is inserted into the accommodating space and fixed to an electronic device using a screw;

Here, the electronic device configured to electrically connect a housing surrounding a lens barrel in the camera module inserted into the accommodation space and at least one point where the mounting structure comes into contact with each other by welding.
According to claim 10,

The electronic device, wherein the mounting structure has a structure in which an insert formed of a first metal member is injection molded into a plastic member at the at least one point of the mounting structure that comes into contact with the housing.
According to claim 10,

The electronic device of claim 1 , wherein a part of the insert facing the set structure configured in the electronic device includes a fastening portion formed with a through hole to couple the set structure by inserting the screw to fix the mounting structure.
According to claim 10,

The mounting structure is an injection-molded plastic product obtained by inserting a second metal material into a position in contact with the housing.
According to claim 11 or 13,

The electronic device, wherein the first metal material or the second metal material includes one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.
According to claim 10,

In the camera module, the housing has a structure insulated from the lens barrel.