WO2022197012A1

WO2022197012A1 - Key waterproof device and electronic device comprising key waterproof device

Info

Publication number: WO2022197012A1
Application number: PCT/KR2022/003390
Authority: WO
Inventors: 김상배; 이승현
Original assignee: 삼성전자 주식회사
Priority date: 2021-03-16
Filing date: 2022-03-10
Publication date: 2022-09-22
Also published as: KR20220129372A

Abstract

An electronic device according to various embodiments disclosed in the present document comprises: a circuit member including a switch; a housing including a seating portion that is formed so that the circuit member can be seated on at least a part thereof, and an insertion hole connected to the seating portion; a waterproof member which is arranged between the insertion hole and the seating portion and is arranged to face the insertion hole and cover the circuit member; a first adhesive member which is arranged between the waterproof member and the seating portion and adheres the waterproof member to the seating portion; and a button member, of which at least a part forms the exterior of the electronic device and which is inserted in the insertion hole. Various other embodiments are possible.

Description

Electronic device comprising a key waterproofing device and a key waterproofing device

Various embodiments described in this document relate to a key waterproof device and an electronic device including the key waterproof device.

The electronic device may include various buttons for controlling the electronic device. Among these buttons, a side key button connected to a switch for controlling volume control and power on/off of the electronic device may be located on the side of the electronic device. A flexible printed circuit board including a switch connected to a side key may be disposed inside the electronic device.

A separate space for arranging a flexible printed circuit board including a switch may be formed on the side of the housing of the electronic device. As a separate space is formed on the side surface of the housing, side rigidity of the housing may be lowered.

In addition, a separate auxiliary material for compressing the waterproof member may be used in a separate space formed on the side surface of the housing. Accordingly, the material cost of the electronic device may increase due to such separate subsidiary materials.

The key waterproof device and the electronic device including the key waterproof device according to various embodiments disclosed herein may provide an electronic device capable of reinforcing lateral rigidity of a support member and reducing material cost.

An electronic device according to various embodiments disclosed herein includes a circuit member including a switch, a housing including a seating portion formed to seat the circuit member on at least a portion of the circuit member, and an insertion hole connected to the seating portion, the insertion hole and A waterproof member disposed between the seating parts to face the insertion hole and cover the circuit member, a first adhesive member disposed between the waterproof member and the seating part to adhere the waterproof member to the seating part; At least a portion of the electronic device may include a button member that forms an exterior and is inserted into the insertion hole.

The key waterproof device according to various embodiments disclosed in this document is disposed between an insertion hole connected to a seating portion formed in a housing of the electronic device and faces the insertion hole so that a circuit member of an electronic device including a switch is seated. A waterproof member disposed to cover the circuit member, a first adhesive member disposed between the waterproof member and the seating portion to adhere the waterproof member to the seating portion, at least a portion of which forms an external appearance of the electronic device and the insertion hole It may include a button member that is inserted into the.

According to various embodiments disclosed herein, as the space in which the flexible printed circuit board is disposed in the housing of the electronic device is changed, the lateral rigidity of the housing may be increased.

In addition, the material cost of the electronic device can be reduced by not using an auxiliary material for pressing the waterproof member.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

1A is a block diagram of an electronic device in a network environment, according to various embodiments.

1B is a perspective view of a front side of a mobile electronic device according to various embodiments.

FIG. 1C is a perspective view of a rear surface of the electronic device of FIG. 1B .

FIG. 1D is an exploded perspective view of the electronic device of FIG. 1B .

2A is a rear plan view of an electronic device according to various embodiments of the present disclosure;

FIG. 2B is an exploded perspective view of the electronic device of FIG. 2A .

3A is a perspective view illustrating a state in which a circuit member is disposed on a seating portion formed in a housing of an electronic device.

3B is an enlarged view of a state in which a circuit member is disposed in the seating portion of FIG. 3A .

FIG. 3C is a perspective view in a state in which a waterproof member is disposed on the seating portion of FIG. 3A .

4A is a cross-sectional view of the electronic device of FIG. 2A taken along line A-A.

FIG. 4B is an enlarged view of the first protrusion of FIG. 4A .

FIG. 4C is an enlarged view of the second protrusion of FIG. 4A .

Fig. 4D is an enlarged view of the receiving portion of Fig. 4A.

5 is a perspective view of a button member of an electronic device and an insertion hole formed in a frame.

6A is a perspective view of a support member.

Fig. 6B is a cross-sectional view taken along the line B-B of the support member of Fig. 6A.

6C is a cross-sectional view taken along the line C-C of the support member of FIG. 6A.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments.

In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item unless the relevant context clearly dictates otherwise.

As used herein, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. that one (e.g. first) component is "coupled" or "connected" to another (e.g. second) component with or without the terms "functionally" or "communicatively" When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

1A is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1A , in the network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190 ). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Referring to FIGS. 1B and 1C , the electronic device 100 according to an embodiment includes a first surface (or front) 110A, a second surface (or rear) 110B, and a first surface 110A and The housing 110 may include a side surface 110C surrounding the space between the second surfaces 110B. In another embodiment (not shown), the housing may refer to a structure forming a part of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1B . According to an embodiment, the first surface 110A may be formed by the front plate 102-1 (eg, a glass plate including various coating layers or a polymer plate) at least a portion of which is substantially transparent. The second surface 110B may be formed by the substantially opaque back plate 111 . The back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be The side surface 110C is coupled to the front plate 102-1 and the rear plate 111 and may be formed by a side bezel structure (or “side member”) 118 including a metal and/or a polymer. have. In some embodiments, the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 102-1 includes two first regions 110D that extend seamlessly by bending from the first surface 110A toward the rear plate 111, the It may be included at both ends of a long edge of the front plate 102-1. In the illustrated embodiment (refer to FIG. 1C ), the rear plate 111 includes two second regions 110E that are bent from the second surface 110B toward the front plate 102-1 and extend seamlessly. It can be included on both ends of the long edge. In some embodiments, the front plate 102-1 (or the rear plate 111) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, some of the first regions 110D or the second regions 110E may not be included. In the above embodiments, when viewed from the side of the electronic device 100 , the side bezel structure 118 has a side surface that does not include the first regions 110D or the second regions 110E as described above. It may have a first thickness (or width), and may have a second thickness thinner than the first thickness at a side surface including the first regions 110D or the second regions 110E.

According to an embodiment, the electronic device 100 includes a display 101-1, an

audio module

103, 107, 114, a sensor module 104-1, 116, 119, and a

camera module

105, 112, 113. ), a key input device 117 , a light emitting element 106 , and at least one of

connector holes

108 and 109 . In some embodiments, the electronic device 100 may omit at least one of the components (eg, the key input device 117 or the light emitting device 106 ) or additionally include other components.

The display 101-1 may be exposed through a substantial portion of the front plate 102-1, for example. In some embodiments, at least a portion of the display 101-1 is exposed through the front plate 102-1 forming the first areas 110D of the first surface 110A and the side surface 110C. can be In some embodiments, the edge of the display 101-1 may be formed to be substantially the same as an adjacent outer shape of the front plate 102-1. In another embodiment (not shown), in order to expand the area to which the display 101-1 is exposed, the distance between the outer edge of the display 101-1 and the outer edge of the front plate 102-1 may be formed to be substantially the same. can

In another embodiment (not shown), a recess or opening is formed in a part of the screen display area of the display 101-1, and the audio module 114 is aligned with the recess or the opening. , a sensor module 104 - 1 , a camera module 105 , and at least one of a light emitting device 106 . In another embodiment (not shown), on the rear surface of the screen display area of the display 101-1, the audio module 114, the sensor module 104-1, the camera module 105, the fingerprint sensor 116, and It may include at least one or more of the light emitting devices 106 . In another embodiment (not shown), the display 101-1 is combined with a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen, or They may be disposed adjacent to each other. In some embodiments, at least a portion of the sensor module 104 - 1 , 119 , and/or at least a portion of a key input device 117 , includes the first regions 110D, and/or the second region ( 110E).

The

audio modules

103 , 107 , and 114 may include a microphone hole 103 and speaker holes 107 and 114 . In the microphone hole 103, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 107 and 114 may include an external speaker hole 107 and a receiver hole 114 for a call. In some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented as a single hole, or a speaker may be included without the speaker holes 107 and 114 (eg, a piezo speaker).

The sensor modules 104 - 1 , 116 , and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state. The sensor modules 104 - 1 , 116 , and 119 are, for example, a first sensor module 104 - 1 (eg, proximity sensor) and/or a second sensor disposed on the first surface 110A of the housing 110 . 2 sensor modules (not shown) (eg, a fingerprint sensor), and/or a third sensor module 119 (eg, HRM sensor) disposed on the second surface 110B of the housing 110 and/or the fourth It may include a sensor module 116 (eg, a fingerprint sensor). The fingerprint sensor may be disposed on the first surface 110A (eg, the display 101-1) as well as the second surface 110B of the housing 110. The electronic device 100 includes a sensor module, not shown. , for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104-1 It may further include at least one.

The

camera modules

105 , 112 , and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100 , and a second camera device 112 disposed on the second surface 110B of the electronic device 100 . ), and/or a flash 113 . The

camera devices

105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100 .

The key input device 117 may be disposed on the side surface 110C of the housing 110 . In another embodiment, the electronic device 100 may not include some or all of the above-mentioned key input devices 117 and the not included key input devices 117 are soft keys on the display 101-1. etc. may be implemented in other forms. In some embodiments, the key input device may include a sensor module 116 disposed on the second surface 110B of the housing 110 .

The light emitting device 106 may be disposed, for example, on the first surface 110A of the housing 110 . The light emitting device 106 may provide, for example, state information of the electronic device 100 in the form of light. In another embodiment, the light emitting device 106 may provide, for example, a light source that is interlocked with the operation of the camera module 105 . The light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 108 and 109 include a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 109 for accommodating a connector for transmitting and receiving audio signals.

Referring to FIG. 1D , the electronic device 100 includes a side bezel structure 100-1, a first support member 100-1A (eg, a bracket), a front plate 100-2, and a display 100-3. ), the printed circuit board 100-4, the battery 100-5, the second support member 100-6 (eg, the rear case), the antenna 100-7, and the rear plate 100-8. may include In some embodiments, the electronic device 100 omits at least one of the components (eg, the first support member 100-1A, or the second support member 100-6) or adds another component. may include At least one of the components of the electronic device 100 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1B or 1C , and overlapping descriptions will be omitted below.

The first support member 100-1A may be disposed inside the electronic device 100 and connected to the side bezel structure 100-1, or may be integrally formed with the side bezel structure 100-1. The first support member 100-1A may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 100-1A may have a display 100-3 coupled to one surface and a printed circuit board 100-4 coupled to the other surface. The printed circuit board 100 - 4 may be equipped with a processor, a memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 100 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 100 - 5 is a device for supplying power to at least one component of the electronic device 100 , and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. can At least a portion of the battery 100 - 5 may be disposed, for example, on the same plane as the printed circuit board 100 - 4 . The battery 100 - 5 may be integrally disposed inside the electronic device 100 , or may be disposed detachably from the electronic device 100 .

The antenna 100 - 7 may be disposed between the rear plate 100 - 8 and the battery 100 - 5 . The antenna 100 - 7 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 100 - 7 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, the antenna structure may be formed by a part of the side bezel structure 100 - 1 and/or the first support member 100 - 1A or a combination thereof.

In the following description, the same reference numerals are used for the same or similar components, except where otherwise indicated. Also, descriptions of the same reference numerals may be omitted.

2A is a rear plan view of an electronic device according to various embodiments of the present disclosure; FIG. 2B is an exploded perspective view of the electronic device of FIG. 2A .

According to various embodiments disclosed herein, the electronic device 201 (eg, the electronic device 101 of FIG. 1A or the electronic device 100 of FIGS. 1B to 1D ) includes a support member 202 (eg, FIG. 1D ). of the first support member 100-1A), the frame 205 (eg, the side bezel structure 118 in FIGS. 1B and 1C or the side bezel structure 100-1 in FIG. 1D), and the circuit member 207 , a waterproof member 208, a first adhesive member 209-1, a second adhesive member 209-2, and a button member 210 (eg, the key input device 117 of FIGS. 1B and 1C) are to be included. can At least some of the above-described components may be omitted, and other components may be added.

According to various embodiments, as shown in FIG. 2B , the housing 213 of the electronic device 201 includes the support member 202 on which the electronic component of the electronic device 201 is disposed and the side appearance of the electronic device 201 . A frame 205 constituting the may be included. Here, the housing 213 may include the housing 110 of FIGS. 1B and 1C . The circuit member 207 may be disposed on a side surface of the support member 202 . The waterproof member 208 may be disposed on a side surface of the support member 202 to cover the circuit member 207 . The frame 205 may surround the support member 202 so that the insertion hole 206 formed in the frame 205 may face at least a portion of the waterproof member 208 .

3A is a perspective view illustrating a state in which a circuit member is disposed on a seating portion formed in a housing of an electronic device. 3B is an enlarged view of a state in which a circuit member is disposed in the seating portion of FIG. 3A . FIG. 3C is a perspective view in a state in which a waterproof member is disposed on the seating portion of FIG. 3A .

According to various embodiments, the support member 202 (eg, the first support member 100 - 1A of FIG. 1D ) includes the electronic device 201 (eg, the electronic device 101 of FIG. 1A , FIGS. 1B to 1D ). A body 202-1 in which an electronic component of the electronic device 100 of the device 100 is disposed and an injection molding 202-2 surrounding a side surface of the body 202-1 may be included. According to an embodiment, the body 202-1 may be coupled to the frame 205 through the injection-molded product 202-2. According to another embodiment, the body 202-1 may be coupled to the frame 205 without the injection molding 202-2. For example, the body 202-1 and the frame 205 may be coupled between the body 202-1 and the frame 205 through a separate subsidiary material. According to another embodiment, the body 202-1 and the frame 205 may be coupled through a separate structure formed in the body 202-1 and the frame 205 . In addition to this, the body 202-1 and the frame 205 may be coupled in various ways. Here, the frame 205 may include the side bezel structure 118 of FIGS. 1B and 1C or the side bezel structure 100 - 1 of FIG. 1D . The body 202-1 and the injection-molded product 202-2 may be formed of various materials. For example, it may be formed of a metal material and/or a non-metal material. Here, the metal material may include alloys such as aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium, and the non-metal material may include synthetic resins, ceramics, and engineering plastics.

According to various embodiments, as shown in FIGS. 3A and 3B , the seating part 203 may be formed on a side surface of the support member 202 . Referring to FIG. 3A , the seating part 203 may be formed on a side surface of the injection-molded product 202 - 2 coupled to the frame 205 . According to another embodiment, the seating part 203 may be formed on a side surface of the body 202-1. A circuit member 207 may be disposed on the seating portion 203 . Referring to FIG. 3C , a waterproof member 208 covering the circuit member 207 may be disposed on the mounting part 203 . The seating portion 203 may have a larger area than the waterproof member 208 so that the waterproof member 208 can be disposed. A hole 204 may be formed in the seating portion 203 . The hole 204 connects the space in which the seating part 203 is formed and the space in which the printed circuit board 100 - 4 (eg, the printed circuit board 100 - 4 of FIG. 1D ) is disposed in the support member 202 . can be part For example, a connection line 207 - 4 connecting the circuit member 207 disposed on the seating portion 203 and the printed circuit board 100 - 4 of the electronic device 201 disposed inside the body 202-1. ) may pass through the hole 204 .

According to various embodiments, as shown in FIGS. 3A and 3B , the circuit member 207 includes a substrate 207-2 including a switch 207-1, and an electronic device 201 shown in FIG. 1D. A connection part 207-3 electrically connected to the printed circuit board 100-4 of the , and a connection line 207-4 connecting the board 207-2 and the connection part 207-3 may be included. According to an embodiment, the switch 207-1, the substrate 207-2, the connection part 207-3, and the connection line 207-4 constituting the circuit member 207 may be integrally formed and electrically connected. have. For example, the circuit member 207 is a flexible printed circuit board, and the switch 207-1, the substrate 207-2, the connection part 207-3, and the connection line 207-4 are It may be part of a flexible printed circuit board.

According to various embodiments, as shown in FIGS. 3A and 3B , the substrate 207 - 2 of the circuit member 207 may be disposed on the mounting part 203 . The substrate 207 - 2 may be adhered to the mounting portion 203 through an adhesive member. According to an exemplary embodiment, an adhesive member may be attached to the substrate 207 - 2 opposite to the surface on which the switch 207 - 1 is disposed to be adhered to the seating portion 203 . According to another exemplary embodiment, in the substrate 207-2, a substrate plate (not shown) supporting the substrate 207-2 is disposed on the opposite side where the switch 207-1 is disposed, and the substrate plate attaches the adhesive member to the substrate 207-2. It may be disposed on the seating part 203 as it is adhered to the seating part 203 through it. According to another embodiment, the substrate 207 - 2 may be disposed on the mounting part 203 through a separate structure formed in the mounting part 203 . In addition, the substrate 207 - 2 may be disposed on the mounting part 203 in various ways.

According to various embodiments, as shown in FIG. 3B , the connection portion 207 - 3 of the circuit member 207 is electrically connected to the printed circuit board 100 - 4 of the electronic device 201 , shown in FIG. 1D . It may be disposed inside the body 202-1 to be connected. The connection part 207 - 3 may be connected to the printed circuit board 100 - 4 in various ways. According to an embodiment, a cable existing in the connection part 207 - 3 may be inserted into a connector disposed on the printed circuit board 100 - 4 to be electrically connected. According to another embodiment, the connection part 207 - 3 may be electrically connected to the printed circuit board 100 - 4 using a soldering bonding method. In addition, the connection part 207 - 3 and the printed circuit board 100 - 4 may be connected in various ways. The connection part 207 - 3 may be electrically connected to the substrate 207 - 2 disposed on the seating part 203 through a connection line 207 - 4 disposed in the hole 204 .

According to various embodiments, as shown in FIG. 3C , the waterproof member 208 may be disposed on the mounting part 203 to cover the substrate 207 - 2 disposed on the mounting part 203 . Adhesive members 209 - 1 and 209 - 2 may be attached to one surface of the waterproof member 208 . The waterproof member 208 may be fixed to the mounting portion 203 through the adhesive members 209 - 1 and 209 - 2 . The waterproof member 208 may be manufactured in various shapes according to the shape of the seating part 203 . The waterproof member 208 may be formed of various materials. For example, the waterproof member 208 may be formed of at least one of rubber, urethane, and silicone.

4A is a cross-sectional view of the electronic device of FIG. 2A taken along line A-A. FIG. 4B is an enlarged view of the first protrusion of FIG. 4A . FIG. 4C is an enlarged view of the second protrusion of FIG. 4A . Fig. 4D is an enlarged view of the receiving portion of Fig. 4A.

According to various embodiments disclosed in this document, the waterproof member 208 includes a first protrusion 208-1 and a second protrusion 208-2 on which the first adhesive member 209-1 is disposed, and a circuit member ( The substrate 207 - 2 of the 207 may include a corresponding receiving portion 208 - 3 .

According to various embodiments, as shown in FIGS. 4A to 4D , the receiving part 208 - 3 may be a portion corresponding to the substrate 207 - 2 on which the waterproof member 208 is disposed on the receiving part 203 . can For example, the receiving portion 208 - 3 of the waterproof member 208 may be a portion having the same length as the length of the substrate 207 - 2 (eg, the length in the Y-axis direction of FIG. 4A ).

According to various embodiments, as shown in FIGS. 4A to 4D , the protrusions 208 - 1 and 208 - 2 have the receiving portion 208 - 3 of the waterproof member 208 against the substrate 207 - 2 . It may be a portion extending in the Y-axis direction of FIG. 4A . According to an exemplary embodiment, in the first protrusion 208 - 1 , one end of the receiving portion 208 - 3 extends in the first direction (eg, the +Y direction of FIG. 4A ) with respect to the substrate 207 - 2 . can mean The second protrusion 208-2 has the other end of the receiving part 208-3 extending in a second direction (eg, the -Y direction of FIG. 4A ) that is opposite to the first direction with respect to the substrate 207-2. It can mean part. The receiving portion 208 - 3 and the protrusions 208 - 1 and 208 - 2 may be part of the waterproof member 208 . The receiving portion 208-3 and the protrusions 208-1 and 208-2 are for explaining the size relationship between the waterproof member 208 and the substrate 207-2, and the receiving portion 208-3 and the protruding portions 208 -1 and 208 - 2 may not be distinguished on the waterproof member 208 .

According to various embodiments, as shown in FIGS. 4A to 4D , the first adhesive member 209-1 is disposed between the first protrusion 208-1 and the seating part 203 of the waterproof member 208 and is waterproof. It may be disposed between the second protrusion 208 - 2 and the seating portion 203 of the member 208 . The first adhesive member 209 - 1 may be attached to the mounting part 203 so that the waterproof member 208 covers the substrate 207 - 2 . The waterproof member 208 may be adhered to the seating part 203 so that a part of the receiving part 208 - 3 faces the switch 207 - 1 of the substrate 207 - 2 . The first adhesive member 209 - 1 is waterproof from a liquid, foreign matter, etc. introduced from the outside of the electronic device 201 (eg, the electronic device 101 of FIG. 1A and the electronic device 100 of FIGS. 1B to 1D ). It is possible to prevent inflow between the member 208 and the seating portion 203 .

According to various embodiments, as shown in FIGS. 4A to 4D , the second adhesive member 209-2 is disposed between the waterproof member 208 and the substrate 207-2 to attach the waterproof member 208 to the substrate. It can be attached to (207-2). For example, the second adhesive member 209 - 2 is disposed between the receiving portion 208 - 3 of the waterproof member 208 and the substrate 207 - 2 to attach the waterproof member 208 to the substrate 207 - 2 . can be attached to According to the embodiment disclosed in this document, the waterproof member 208 is a substrate 207 - 2 disposed on the mounting portion 203 using the first adhesive member 209 - 1 and the second adhesive member 209 - 2 . ) may be adhered to the seating portion 203 to cover it. Accordingly, the circuit member 207 may be sealed by the waterproof member 208 , the first adhesive member 209 - 1 , and the second adhesive member 209 - 2 . As described above, since the waterproof member 208 does not require any auxiliary materials other than the first adhesive member 209-1 and the second adhesive member 209-2 to seal the circuit member 207, the electronic device 201 is not required. ) can lower the manufacturing cost.

According to various embodiments, as shown in FIG. 4A , the frame 205 (eg, the side bezel structure 118 of FIGS. 1B and 1C or the side bezel structure 100-1 of FIG. 1D ) has an insertion hole ( 206) may be formed. The frame 205 is configured such that the insertion hole 206 is connected to the seating portion 203 formed on the side of the injection-molded product 202-2 of the support member 202 (eg, the first support member 100-1A in FIG. 1D). It may surround the side surface of the support member 202 . The frame 205 may surround the side surface of the support member 202 so that the insertion hole 206 may face at least a portion of the waterproof member 208 disposed in the seating portion 203 . Accordingly, the frame 205 may surround the side surface of the support member 202 and constitute at least a portion of the side surface of the electronic device 201 . The frame 205 may be formed of various materials. For example, it may be formed of a metal material and/or a non-metal material. Here, the metal material may include alloys such as aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium, and the non-metal material may include synthetic resins, ceramics, and engineering plastics.

According to various embodiments, as shown in FIG. 4A , a back plate adhesive member 211 may be disposed on the support member 202 . The back plate adhesive member 211 may be attached to the body 202-1 and the injection-molded product 202-2 of the support member 202 to adhere the back plate 212 to the support member 202 . Here, the rear plate 212 may include the rear plate 111 of FIGS. 1B and 1C or the rear plate 100 - 8 of FIG. 1D .

According to various embodiments disclosed herein, as shown in FIG. 5 , the button member 210 (eg, the key input device 117 of FIGS. 1B and 1C ) is connected to the electronic device 201 (eg, FIG. 1A ). of the frame 205 (eg, the side bezel structure 118 of FIGS. 1B and 1C or the side bezel structure of FIG. 1D ) from the outside to the inside of the electronic device 101 of FIGS. 1B to 1D ). It can be inserted through the insertion hole 206 formed in (100-1)). The button member 210 is configured such that the external force applied to the body 210 - 1 and the body 210 - 1 constituting the exterior of the electronic device 201 is transmitted to the switch 207 - 1 of the circuit member 207 . It may include an actuator 210 - 2 protruding from the body portion 210 - 1 toward the waterproof member 208 . Therefore, when an external force is applied to the body portion 210-1 of the button member 210 by the user, the switch 207-1 is in contact with the waterproof member 208 by pressing the waterproof member 208 through the actuator 210-2. ) can be pressurized.

According to various embodiments, the button member 210 may be formed with a hook (not shown). The locking part may serve to fix the button member 210 to the frame 205 so as not to be separated from the insertion hole 206 when the button member 210 is inserted through the insertion hole 206 . Therefore, when the button member 210 is inserted into the insertion hole 206, the button member 210 is again external as the locking part of the button member 210 is disposed on the locking jaw (not shown) formed in a part of the frame 205 . can be prevented from being separated. In addition to this, the button member 210 may be manufactured not to be separated from the insertion hole 206 in various ways.

6A is a perspective view of a support member. Fig. 6B is a cross-sectional view taken along the line B-B of the support member of Fig. 6A. 6C is a cross-sectional view taken along the line C-C of the support member of FIG. 6A.

According to various embodiments disclosed in this document, the support member 202 (eg, the first support member 100-1A in FIG. 1D ) includes a seating portion 203 on which the circuit member 207 is disposed is formed by the injection molded product 202- 2) may be formed on the side. According to the embodiment disclosed in this document, as shown in FIGS. 6B and 6C , there is a separate space for arranging the circuit member 207 between the side surface of the body 202-1 and the injection-molded product 202-2. may not be necessary. Accordingly, the lateral strength of the support member 202 may be increased. In addition, referring to FIG. 4A , the circuit member 207 is disposed on the seating portion 203 formed on the side surface of the injection-molded product 202-2 and is disposed between the side surface of the body 202-1 and the injection-molded product 202-2. A separate space for disposing the member 207 may not be formed. Accordingly, the lateral area of the support member 202 to which the back plate adhesive member 211 is adhered may increase. Accordingly, the adhesive force between the back plate 212 and the support member 202 may be increased. Here, the rear plate 212 may refer to the rear plate 111 of FIGS. 1B and 1C or the rear plate 100 - 8 of FIG. 1D .

The electronic device 201 (eg, the electronic device 101 of FIG. 1A ) according to various embodiments disclosed herein includes a circuit member 207 including a switch 207 - 1 , and at least a portion of the circuit member A housing 213 including a seating portion 203 formed to be seated and an insertion hole 206 connected to the seating portion, disposed between the insertion hole and the seating portion to face the insertion hole and cover the circuit member at least a portion of the waterproof member 208 disposed so as to form an external appearance of the electronic device; It may include a button member 210 (eg, the key input device 117 of FIGS. 1B and 1C) inserted into the insertion hole.

In addition, the housing includes a support member 202 in which the seating portion is formed and at least one electronic component included in the electronic device is disposed, and the insertion hole is formed in at least a portion of the housing, and the insertion hole and the waterproof member face each other. and a frame 205 (eg, the side bezel structure 118 of FIGS. 1B and 1C ) surrounding the support member to allow the support member.

In addition, the seating portion may have a larger area than the waterproof member so that the waterproof member can be seated on the seating portion.

In addition, the waterproof member includes a receiving portion 208-3 at least partially facing the switch, and projecting portions 208-1 and 208-2 that protrude in one direction with respect to the circuit member and to which the first adhesive member is attached. ) may be included.

In addition, the protrusion includes a first protrusion 208 - 1 extending in a first direction (eg, the +Y direction in FIG. 4A ) from the receiving part and to which the first adhesive member is attached, and the second protrusion in the receiving part. A second protrusion 208 - 2 extending in a second direction opposite to the first direction (eg, -Y direction of FIG. 4A ) and to which the first adhesive member is attached may be included.

In addition, the electronic device further includes a second adhesive member 209 - 2 disposed between the waterproof member and the circuit member, wherein the second adhesive member is disposed between the waterproof member and the circuit member. The waterproof member may be adhered to the circuit member.

Also, the second adhesive member may be disposed between the receiving portion of the waterproof member and the circuit member.

In addition, the circuit member includes a board 207-2 on which the switch is disposed, and a printed circuit board 100-4 of the electronic device disposed on the support member (eg, the printed circuit board 100- of FIG. 1D). 4)) may include a connection part 207-3 for electrically connecting the substrate and the substrate.

In addition, the support member may include a hole 204 formed in the support member to connect the portion on which the printed circuit board is disposed and the seating portion, and at least a portion of the connection portion may be disposed in the hole. .

In addition, the circuit member may further include a substrate plate (not shown) supporting the substrate, and the substrate plate may be fixed by being attached to the seating portion.

In addition, the button member protrudes from the body portion toward the waterproof member so that the body portion 210-1 inserted into the insertion hole of the frame and the external force applied to the body portion are transmitted to the switch of the circuit member. It may include an actuator 210 - 2 formed.

The key waterproof device according to various embodiments disclosed in this document is provided so that the circuit member 207 of the electronic device 201 (eg, the electronic device 101 of FIG. 1A ) including the switch 207 - 1 is seated. a waterproof member 208 disposed between the insertion hole 206 connected to the seating part 203 formed in the housing 213 of the electronic device to face the insertion hole and cover the circuit member; A first adhesive member 209-1 disposed between the seating portions to adhere the waterproof member to the seating portion, at least a portion of which forms the exterior of the electronic device and a button member 210 inserted into the insertion hole (eg : The key input device 117 of FIGS. 1B and 1C) may be included.

In addition, in the housing of the electronic device in which the parts of the key waterproofing device are disposed, the support member 202 on which the seating part is formed, the insertion hole is formed in at least a part, and the insertion hole and the waterproof member face each other. and a frame 205 (eg, the side bezel structure 118 of FIGS. 1B and 1C ) surrounding the support member.

Also, the seating portion of the electronic device in which the waterproof member of the key waterproof device is disposed may have a larger area than the waterproof member so that the waterproof member can be seated on the seating portion.

In addition, the protrusion includes a first protrusion 208 - 1 extending in a first direction (eg, the +Y direction in FIG. 4A ) from the accommodating part and to which the first adhesive member is attached, and the first protrusion 208 - 1 in the accommodating part. It may include a second protrusion 208 - 2 extending in a second direction opposite to the first direction (eg, the -Y direction of FIG. 4B ) and to which the first adhesive member is attached.

In addition, the key waterproof device further includes a second adhesive member 209-2 disposed between the waterproof member and the circuit member, wherein the second adhesive member is disposed between the waterproof member and the circuit member, The waterproof member may be adhered to the circuit member.

In addition, the support member of the electronic device on which the waterproof member of the key waterproofing device is disposed has a hole formed in the support member to connect a portion on which the printed circuit board of the electronic device disposed on the support member and the seating portion are disposed. ) (204).

And the embodiments disclosed in the present document disclosed in the present specification and drawings are merely presented as specific examples to easily explain the technical content according to the embodiments disclosed in this document and help the understanding of the embodiments disclosed in this document, It is not intended to limit the scope of the examples. Therefore, the scope of the various embodiments disclosed in this document is that, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical ideas of the various embodiments disclosed in this document are included in the scope of the various embodiments disclosed in this document. should be interpreted

Claims

In an electronic device,

a circuit member comprising a switch;

a housing including at least a portion of a seating portion formed to seat the circuit member and an insertion hole connected to the seating portion;

a waterproof member disposed between the insertion hole and the seating part to face the insertion hole and to cover the circuit member;

a first adhesive member disposed between the waterproof member and the seating part to adhere the waterproof member to the seating part; and

and a button member at least a part of which forms an exterior of the electronic device and is inserted into the insertion hole.
According to claim 1,

The housing is

a support member in which the seating portion is formed and at least one electronic component included in the electronic device is disposed; including electronic devices.
According to claim 1,

The seating part,

An electronic device having a larger area than the waterproof member so that the waterproof member can be seated on the seating portion.
The method of claim 1,

The waterproof member,

An electronic device comprising: a accommodating part at least partially facing the switch; and a protrusion part protruding in one direction with respect to the circuit member and to which the first adhesive member is attached.
5. The method of claim 4,

The protrusion is

a first protrusion extending in a first direction from the accommodating part and to which the first adhesive member is attached; and a second protrusion extending from the accommodating part in a second direction opposite to the first direction and to which the first adhesive member is attached An electronic device comprising a protrusion.
5. The method of claim 4,

The electronic device is

Further comprising; a second adhesive member disposed between the waterproof member and the circuit member,

The second adhesive member,

An electronic device disposed between the waterproof member and the circuit member to adhere the waterproof member to the circuit member.
7. The method of claim 6,

The second adhesive member,

An electronic device disposed between the receiving portion of the waterproof member and the circuit member.
3. The method of claim 2,

The circuit member is

An electronic device comprising: a substrate on which the switch is disposed; and a connection part electrically connecting a printed circuit board of the electronic device disposed on the support member to the substrate.
9. The method of claim 8,

The support member is

and a hole formed in the support member to connect the portion on which the printed circuit board is disposed and the seating portion;

At least a portion of the connection part is disposed in the hole.
10. The method of claim 9,

The circuit member is

Further comprising a substrate plate for supporting the substrate,

The substrate plate,

An electronic device that is attached to and fixed to the seating portion.
3. The method of claim 2,

The button member is

An electronic device comprising: a body part inserted into the insertion hole of the frame; and an actuator protruding from the body part toward the waterproof member so that an external force applied to the body part is transmitted to the switch of the circuit member.
In the key waterproofing device,

A waterproof member disposed between a seating portion formed in the housing of the electronic device and an insertion hole connected to the seating portion so that a circuit member of an electronic device including a switch is seated to face the insertion hole and cover the circuit member ;

a first adhesive member disposed between the waterproof member and the seating part to adhere the waterproof member to the seating part; and

and a button member, at least a portion of which forms an exterior of the electronic device and is inserted into the insertion hole.
13. The method of claim 12,

The waterproof member,

A key waterproofing device comprising: a receiving portion, at least a portion of which faces the switch;
14. The method of claim 13,

The protrusion is

a first protrusion extending in a first direction from the accommodating part and to which the first adhesive member is attached; and a second protrusion extending from the accommodating part in a second direction opposite to the first direction and to which the first adhesive member is attached A key waterproofing device comprising a protrusion.
14. The method of claim 13,

The key waterproof device,

Further comprising; a second adhesive member disposed between the waterproof member and the circuit member,

The second adhesive member,

A key waterproofing device disposed on the waterproof member and the circuit member to adhere the waterproof member to the circuit member.