WO2023282557A1 - Module de caméra de mise à la terre de dispositif électronique - Google Patents

Module de caméra de mise à la terre de dispositif électronique Download PDF

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Publication number
WO2023282557A1
WO2023282557A1 PCT/KR2022/009594 KR2022009594W WO2023282557A1 WO 2023282557 A1 WO2023282557 A1 WO 2023282557A1 KR 2022009594 W KR2022009594 W KR 2022009594W WO 2023282557 A1 WO2023282557 A1 WO 2023282557A1
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WIPO (PCT)
Prior art keywords
electronic device
mounting structure
camera module
housing
module
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PCT/KR2022/009594
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English (en)
Korean (ko)
Inventor
표선형
정화중
허민
Original Assignee
삼성전자 주식회사
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Publication of WO2023282557A1 publication Critical patent/WO2023282557A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit

Definitions

  • Various embodiments of the present disclosure relate to an electronic device, for example, an electronic device forming a ground path such that a camera module is grounded.
  • Various electronic components may be disposed inside an electronic device such as a mobile device for communication.
  • Electronic components disposed in the electronic device may be required to satisfy electromagnetic compatibility.
  • These electronic components must be designed and manufactured to minimize electromagnetic influence in order to satisfy electromagnetic compatibility characteristics.
  • the electronic device may include a camera module for taking pictures and/or videos and an antenna module for supporting wireless communication.
  • An antenna module included in an electronic device may process a radio frequency (RF) signal in a predetermined frequency band for wireless communication.
  • RF radio frequency
  • Such an RF signal may act as electromagnetic noise to parts included in an electronic device.
  • the electromagnetic noise may affect, for example, an operating frequency used in an image sensor (eg, a CMOS image sensor) of a camera module, and may interfere with taking pictures and/or videos in an electronic device.
  • One aspect of the present disclosure is to provide an electronic device having a ground structure for protecting a camera module from internal noise.
  • Another aspect of the present disclosure is to provide an electronic device including a path through which noise generated inside flows to the ground through a mounting structure for fixing a camera module.
  • an electronic device includes a camera module including a housing surrounding a lens barrel having a lens assembly therein, and a mounting structure used to mount the camera module to the electronic device, the housing comprising: Electrically connected to the mounting structure, noise introduced from the outside into the housing may be configured to flow to a grounding unit provided in the electronic device through the electrically connected mounting structure.
  • an electronic device has a camera module and an accommodating space into which the camera module can be inserted, and a structure in which the camera module is inserted into the accommodating space and fixed to the electronic device using a screw.
  • a mounting structure including a mounting structure, wherein the housing surrounding the lens barrel in the camera module inserted into the accommodation space may be electrically connected at at least one point where the mounting structure comes into contact with each other by welding.
  • the electronic device blocks internal electrical or electromagnetic noise from being introduced into the camera module, thereby stably driving the camera module.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2 is a block diagram illustrating a camera module, in accordance with various embodiments.
  • FIG 3 is an exploded perspective view of a camera module and a mounting structure, according to various embodiments.
  • FIG. 4 is a combined perspective view of a camera module and a mounting structure according to various embodiments.
  • FIG. 5 is a perspective view of a mounting structure configured to be continuously welded to an outer housing of a camera module along its entire outer periphery, according to one embodiment.
  • FIG. 6 is a plan view in which a camera module is mounted in an electronic device according to an embodiment.
  • FIG. 7 is a perspective view of a mounting structure configured to be welded to an outer housing of a camera module at a portion of an outer periphery, according to one embodiment.
  • FIG. 8 illustrates an example of a path for transferring noise that may flow into a camera module from an electronic device to a ground unit, according to various embodiments.
  • FIG. 1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
  • some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.
  • the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • software eg, the program 140
  • processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor.
  • NPU neural network processing unit
  • the secondary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function.
  • the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
  • the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, an image signal processor or a communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
  • the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
  • the memory 130 may include volatile memory 132 or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, a : a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips).
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
  • NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low latency
  • -latency communications can be supported.
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
  • the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
  • the wireless communication module 192 may be used to realize peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency (for realizing URLLC).
  • peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC.
  • DL downlink
  • UL uplink each of 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, a printed circuit board (PCB)).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna)
  • a communication method used in a communication network such as the first network 198 or the second network 199
  • At least one suitable antenna may be selected from the plurality of antennas by, for example, the communication module 190.
  • a signal or power is transferred between the communication module 190 and the outside through the selected at least one antenna.
  • other parts eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
  • one or more external electronic devices may be requested to perform the function or at least part of the service.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
  • the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a block diagram 200 illustrating a camera module 180, in accordance with various embodiments.
  • the camera module 180 includes a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (eg, a buffer memory), or an image signal processor. (260).
  • the lens assembly 210 may collect light emitted from a subject that is an image capturing target.
  • the lens assembly 210 may include one or more lenses.
  • the camera module 180 may include a plurality of lens assemblies 210 . In this case, the camera module 180 may form, for example, a dual camera, a 360-degree camera, or a spherical camera.
  • Some of the plurality of lens assemblies 210 may have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly may have the same lens properties as other lens assemblies. may have one or more lens properties different from the lens properties of .
  • the lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.
  • the flash 220 may emit light used to enhance light emitted or reflected from a subject.
  • the flash 220 may include one or more light emitting diodes (eg, a red-green-blue (RGB) LED, a white LED, an infrared LED, or an ultraviolet LED), or a xenon lamp.
  • the image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal.
  • the image sensor 230 is, for example, an image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, It may include a plurality of image sensors having a property, or a plurality of image sensors having other properties.
  • Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.
  • CCD charged coupled device
  • CMOS complementary metal oxide semiconductor
  • the image stabilizer 240 moves at least one lens or image sensor 230 included in the lens assembly 210 in a specific direction in response to movement of the camera module 180 or the electronic device 101 including the same. Operation characteristics of the image sensor 230 may be controlled (eg, read-out timing is adjusted, etc.). This makes it possible to compensate at least part of the negative effect of the movement on the image being taken.
  • the image stabilizer 240 may include a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180. It is possible to detect such a movement of the camera module 180 or the electronic device 101 by using.
  • the image stabilizer 240 may be implemented as, for example, an optical image stabilizer.
  • the memory 250 may at least temporarily store at least a portion of an image acquired through the image sensor 230 for a next image processing task. For example, when image acquisition is delayed according to the shutter, or a plurality of images are acquired at high speed, the acquired original image (eg, a Bayer-patterned image or a high-resolution image) is stored in the memory 250 and , a copy image (eg, a low resolution image) corresponding thereto may be previewed through the display module 160 . Thereafter, when a specified condition is satisfied (eg, a user input or a system command), at least a part of the original image stored in the memory 250 may be obtained and processed by the image signal processor 260 , for example. According to one embodiment, the memory 250 may be configured as at least a part of the memory 130 or as a separate memory operated independently of the memory 130 .
  • the image signal processor 260 may perform one or more image processes on an image obtained through the image sensor 230 or an image stored in the memory 250 .
  • the one or more image processes for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring, sharpening, or softening.
  • the image signal processor 260 may include at least one of the components included in the camera module 180 (eg, an image sensor). 230) may be controlled (eg, exposure time control, read-out timing control, etc.)
  • the image processed by the image signal processor 260 is stored again in the memory 250 for further processing.
  • the image signal processor 260 may be configured as at least a part of the processor 120 or may be configured as a separate processor that operates independently of the processor 120.
  • the image signal processor 260 may be configured as a processor 120 When configured as a separate processor, at least one image processed by the image signal processor 260 may be displayed through the display module 160 as it is or after additional image processing by the processor 120 .
  • the electronic device 101 may include a plurality of camera modules 180 each having different properties or functions.
  • at least one of the plurality of camera modules 180 may be a wide-angle camera, and at least the other may be a telephoto camera.
  • at least one of the plurality of camera modules 180 may be a front camera, and at least another one may be a rear camera.
  • FIG 3 is an exploded perspective view of a camera module and a mounting structure, according to various embodiments.
  • a camera module 330 may include a lens barrel 331 and an outer housing 333 .
  • the camera module 330 may be formed in a structure disposed on a printed circuit board 340 on which an image sensor (eg, the image sensor 230 of FIG. 2 ) is mounted.
  • the lens barrel 331 may include a lens assembly (eg, the lens assembly 210 of FIG. 2 ).
  • the outer housing 333 may be configured to surround the lens barrel 331 outside the lens barrel 331 .
  • the outer housing 333 may be configured to be located at the outermost part of the camera module 330 .
  • the outer housing 333 may be configured to perform a function of a shield can to shield electromagnetic waves from entering the lens assembly included in the camera module 330 .
  • the camera module 330 may further include an inner housing (not shown) surrounding the lens barrel 331 between the outer housing 333 and the lens barrel 331 .
  • a housing surrounding the lens barrel 331 in the camera module 330 may include an inner housing (not shown) and an outer housing 333 located outside the housing.
  • the inner housing may be formed of a lightweight material such as plastic, and the outer housing 333 is formed of a metal member (eg, a member formed of a conductive material such as metal). It may be configured to perform the function of a shield can.
  • the inner housing is not necessarily formed of a material such as plastic, and may be formed of a metal member similar to the outer housing 333 .
  • the housing of the camera module 330 when the housing of the camera module 330 is formed to include an inner housing (not shown) and an outer housing 333, electrical connection between the camera module 330 and the mounting structure 300 may be configured to be conducted through the outer housing 333 .
  • the mounting structure 300 may have an accommodation space 310 at its center.
  • the accommodating space 310 may have a structure in which the camera module 330 can be accommodated and electrically coupled.
  • a flange portion 320 may be provided on the outer periphery of the mounting structure 300 .
  • the flange part 320 may include one or more fastening parts 321 disposed along the circumferential direction. At least one through hole 323 may be formed in the fastening part 321 .
  • the outer housing 333 of the camera module 330 is accommodated in the accommodation space 310 formed in the mounting structure 300 so that the outer housing 333 of the camera module 330 is the planar surface of the mounting structure 300. It may be electrically coupled to branch 320 .
  • the outer housing 333 of the camera module 330 may be electrically coupled to the flange portion 320 provided on the mounting structure 300 by, for example, laser welding.
  • FIG. 4 is a combined perspective view of a camera module (eg, the camera module 330 of FIG. 3 ) and a mounting structure (eg, the mounting structure 300 of FIG. 3 ) according to various embodiments.
  • a camera module eg, the camera module 330 of FIG. 3
  • a mounting structure eg, the mounting structure 300 of FIG. 3
  • a camera module 330 (eg, the camera module 180 of FIG. 1 ) is electrically coupled to a mounting structure 300 so that the electronic It may be configured to be mounted on a set structure (eg, the set structure 800 of FIG. 8 ) of a device (eg, the electronic device 101 of FIG. 1 ).
  • At least one through hole 323 included in the mounting structure 300 may be fixed to the electronic device 101 by a set structure including a bolt member (not shown).
  • a space or a physical connector may be provided inside the electronic device 101 to mount the mounting structure 300 by the set structure.
  • the mounting structure 300 fixed to the set structure may be electrically coupled to the internal ground of the electronic device 101 by, for example, a separately provided conductive member (not shown).
  • the mounting structure 300 may be electrically coupled to the outer housing 333 included in the camera module 330. there is. In this case, a conductive path may be formed between the outer housing 333 of the camera module 330 and the mounting structure 300 .
  • the mounting structure 300 may be electrically connected to the outer housing 333 of the camera module 330 by welding.
  • the welding may preferably exist between a portion where the conductive material is disposed on the mounting structure 300 and a portion where the conductive material is disposed on the outer housing 333 .
  • the outer housing 333 of the camera module 330 and/or the mounting structure 300 may be partially or entirely formed of a conductive material such as metal.
  • a conductive material such as metal.
  • the electrical connection between the outer housing 333 and the mounting structure 300 is formed through a portion formed of a metal member. can be done through
  • the outer housing 333 of the camera module 330 and the mounting structure 300 are made of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS (stainless steel-based material). It may be formed of a metal material containing one or more of.
  • the outer housing 333 of the camera module 330 and the mounting structure 300 may be formed of, for example, any one of Zn, Al, Mg, and SUS.
  • the outer housing 333 of the camera module 330 and the mounting structure 300 may be formed of the same metal material to facilitate electrical connection through welding.
  • the outer housing 333 of the camera module 330 and the mounting structure 300 are along the entire outer periphery of the outer housing 333 of the camera module 330 and the mounting structure 300. It may be configured to be continuously welded (portions marked W1 to W6 in FIG. 5).
  • the outer housing 333 of the camera module 330 and the mounting structure 300 are localized between the outer housing 333 of the camera module 330 and the outer periphery of the mounting structure 300. It may also be configured to perform welding (the part marked W in FIG. 8) with.
  • the outer housing eg, the outer housing 333 of FIG. 3 or 4 of the camera module (eg, the camera module 330 of FIG. 3 or 4) on the entire outer periphery.
  • a perspective view of a mounting structure 300 configured to be continuously welded eg, the mounting structure 300 of FIG. 3 or 4 ).
  • At least one weldable region (W1, W2, W3, W4, W5, W6) composed of a conductor is formed in part or all of the entire outer periphery of the mounting structure 300. can be placed.
  • a conductive material is applied to each of the left, right, upper and/or lower rims constituting the outer periphery. It may be partially or wholly formed or disposed.
  • the weldable region independently formed on each of the left, right, upper and/or lower edges may be formed or disposed as one region or a plurality of regions separated from each other.
  • weldable regions W5 and W6 consisting of one region may be disposed on each of the upper and lower edges, and at least two separate weldable regions W1, W2 and W3 may be disposed on each of the left and right edges. and W4) may be disposed.
  • the mounting structure 300 has an accommodation space 310 (eg, FIG. 3 or FIG. It may be electrically coupled with an outer housing (eg, the outer housing 333 of FIG. 3 or 4) that is at least a part of the camera module 330 housed in the accommodation space 310 of 4).
  • the electrical coupling may be performed, for example, by laser welding.
  • the first to sixth weldable regions W1, W2, W3, W4, W5, and W6 in the mounting structure 300 include one or more of Zn, Al, Mg, and SUS. It can be formed of a metal member that does. As another example, at least one weldable region to be electrically coupled to the outer housing 333 provided in the camera module 330 among the first to sixth weldable regions W1 , W2 , W3 , W4 , W5 , and W6 . It may be formed of any one of silver, Zn, Al, Mg, and SUS metal material.
  • the outer housing 333 provided in the camera module 330 among the first to sixth weldable regions W1 , W2 , W3 , W4 , W5 , and W6 disposed on the mounting structure 300 .
  • At least one weldable region electrically coupled to the flange portion 320 of the mounting structure 300 for physical fastening with the set structure of the electronic device 101 (for example, the set structure 800 of FIG. 8 ). ) (eg, the flange portion 320 of FIG. 3 or 4) may have a structure electrically connected to at least one fastening part 321 (eg, the fastening part 321 of FIG. 3 or 4) formed on the there is.
  • the at least one fastening part 321 may include a through hole 323 (eg, the through hole 323 of FIG. 3 or 4 ).
  • the mounting structure 300 may be fixed to the set structure of the electronic device 101 by a bolt member inserted into the through hole 323 .
  • the fastening part 321 including the through hole 323 may be electrically connected to the internal ground of the electronic device 101 by a support member (not shown) made of a conductive material. Therefore, when the mounting structure 300 is mounted on the electronic device 101, the outer housing 333 provided on the camera module 330 is coupled to the flange portion 320 of the mounting structure 300. It may be electrically connected to the internal ground of the electronic device 101 through the unit 321 and the predetermined support member.
  • a ground structure (eg, PBA) provided in the electronic device 101 through an electrical connection (eg, a welding part), the mounting structure 300, and a set structure of the electronic device 101 coupled with the mounting structure 300. ground). Due to this, the camera module 330 can have an easy and stable grounding structure. In order to prevent the noise introduced from the outside from penetrating into the camera module 330, the outer housing 333 of the camera module 330 has a grounding unit provided inside the camera module 330 (not shown). ) and electrically separated from the configuration may be desirable.
  • FIG. 6 illustrates a camera module (eg, the camera module 180 of FIG. 1 or the camera module 330 of FIG. 3 or 4) in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment. ) is a plan view with the mounting.
  • the camera module 330 may be coupled to be electrically connected to the mounting structure 300 in a weldable region (W).
  • the mounting structure 300 in which the camera module 330 is accommodated is attached to the electronic device 101 by a fastening member (for example, the fastening part 321 of FIG. 3 or 4) formed on the mounting structure 300. Electrical coupling may be made to a provided space or a physical connector.
  • the mounting structure 300 may include a plurality of fastening parts.
  • the mounting structure 300 may include three fastening parts, and through-holes (eg, through-holes 323 of FIG. 3 or 4) may be formed in each of the three fastening parts. there is.
  • the mounting structure 300 may be fixed to be electrically coupled to the electronic device 101 by the screws 610 , 620 , and 630 inserted into the through holes of each of the three fastening parts.
  • the outer housing eg, the outer housing 333 of Fig. 3 or 4
  • the camera module eg, the camera module 330 of Fig. 3 or 4
  • a perspective view of a mounting structure 300 configured to be welded eg, mounting structure 300 of FIG. 3 or 4 ).
  • a mounting structure 300 may have a portion (dot-processed portion in the drawing) made of a metal member, and the remaining portion (not-dot-processed portion in the drawing) made of plastic. It may be configured to be formed of the same non-metallic member.
  • a portion of the mounting structure 300 to be formed of a metal member may be, for example, an insert 740 including a fastening portion 321 having a through hole 323 .
  • the mounting structure 300 may be provided with an accommodating space 310 capable of accommodating the camera module 330 in the center.
  • a flange portion 320 for mounting the mounting structure 300 to the set structure of the electronic device 101 may be provided at an outer portion of the accommodating space 310 .
  • An insert 740 including a fastening portion 321 having a through hole 323 may be provided at one side of the flange portion 320 .
  • the mounting structure 300 may be fixed to a set structure (eg, the set structure 800 of FIG. 8 ) of the electronic device 101 by inserting a bolt member through the through hole 323 .
  • the flange part 320 included in the mounting structure 300 may be configured to include an insert 740 formed of a metal member and an injection part 750 formed of a non-metal member such as plastic.
  • the mounting structure 300 for example, in a state in which an insert 740 formed of a metal member is placed in a mold, injects molten plastic into the mold, and the injection unit 750 is injected into the insert 740. It can be formed into a molded structure.
  • the mounting structure 300 includes at least one of the camera modules 330 housed in the accommodating space 310 (eg, the accommodating space 310 of FIG. 3 or 4) in at least one insert 740. It may be electrically coupled to a part of the outer housing (eg, the outer housing 333 of FIG. 3 or 4 ). The electrical coupling may be performed, for example, by laser welding.
  • the insert 740 of the mounting structure 300 may be formed of, for example, a metal member containing one or more of Zn, Al, Mg, and SUS.
  • the insert 740 of the mounting structure 300 may be formed of any one metal material among Zn, Al, Mg, and SUS.
  • the insert 740 may be formed of a metal member that can be electrically coupled to the outer housing 333 provided in the camera module 330 .
  • the insert 740 may include at least one fastening part 321 (eg, the fastening part 321 of FIG. 3 or 4 ) formed to physically fasten the electronic device 101 to the set structure.
  • the at least one fastening part 321 may include a through hole 323 (eg, the through hole 323 of FIG. 3 or 4 ).
  • the mounting structure 300 may be fixed to the set structure of the electronic device 101 by a bolt member inserted into the through hole 323 .
  • the fastening part 321 including the through hole 323 may be electrically connected to the internal ground of the electronic device 101 by a support member (not shown) made of a conductive material.
  • a support member (not shown) made of a conductive material.
  • the outer housing 333 of the camera module 330 and the insert 740 of the mounting structure 300 are formed of different metal materials, the outer housing 333 of the camera module 330 is mounted A connection part (not shown) made of the same metal material as the insert 740 of the structure 300 may be further included.
  • the insert 740 of the mounting structure 300 may be configured to be welded to the outer housing 333 of the camera module 330 through a connection portion (not shown) made of the same metal material.
  • a connection portion (not shown) provided on the outer housing 333 of the camera module 330 may be formed of a metal member containing one or more of Zn, Al, Mg, and SUS.
  • a connection part (not shown) provided on the outer housing 333 of the camera module 330 may be formed of any one metal material among Zn, Al, Mg, and SUS.
  • the mounting structure 300 may be configured to be electrically connected to the electronic device 101 through a through hole 323 formed in the fastening part 321 .
  • the mounting structure 300 may be configured to be electrically connected to the electronic device 101 using a member such as a bolt member or a bracket of a set structure.
  • the outer housing 333 of the camera module 330 due to the structure of the mounting structure 300, noise introduced from the outside into the outer housing 333 of the camera module 330, the outer housing 333 and the mounting structure 300 A grounding structure (eg, PBA) provided in the electronic device 101 through an electrical connection (eg, a welding part) between the mounting structure 300 and a set structure of the electronic device 101 coupled with the mounting structure 300 ground). Due to this, the camera module 330 can have an easy and stable grounding structure. In order to prevent the noise introduced from the outside from penetrating into the camera module 330, the outer housing 333 of the camera module 330 has a grounding unit (not shown) provided inside the camera module 330. It may be desirable to configure to be electrically separated from.
  • a grounding unit not shown
  • FIG. 8 illustrates noise that may flow from an electronic device (eg, the electronic device 101 of FIG. 1 ) to a camera module (eg, the camera module 330 of FIG. 3 or 4 ) according to various embodiments.
  • An example of a path that delivers to the ground is shown.
  • a mounting structure 300 (eg, the mounting structure 300 of FIG. 5 or the mounting structure 300 of FIG. 7) is a fastening part (eg, the fastening part of FIG. 5 ( 321) or the fastening part 321 of FIG. 7) to be electrically connected to the electronic device 101.
  • the mounting structure 300 may be fastened to the electronic device 101 by, for example, the set structure 800 .
  • the set structure 800 may include a bolt member and a bracket 810 formed of a conductive material around the bolt member. When fastened to the electronic device 101 by the bolt member, the mounting structure 300 may be electrically connected to the ground of the electronic device 101 through the bracket 810 .
  • the mounting structure 300 may be electrically connected to the outer housing 333 of the camera module 330 .
  • the electrical connection may be configured by, for example, welding between a metal member formed on the mounting structure 300 and a metal member formed on the outer housing 333 of the camera module 330 . Welding for the electrical connection may be performed, for example, at a location W (electrical connection portion) where the mounting structure 300 and the outer housing 333 are exposed to the outside and come into contact with each other.
  • noise introduced into the outer housing 333 of the camera module 330 from the outside does not penetrate into the camera module 330, and the outer housing 333 and the electrical connection portion (W) ) (eg, a welding part), the mounting structure 300, and the bracket 810 included in the set structure 800 transmit noise to be transmitted to the ground structure (eg, PBA Ground) provided in the electronic device 101 A route (shown as a solid line in the drawing) can be provided.
  • the ground structure eg, PBA Ground
  • the electronic device 101 includes a lens barrel (eg, the lens barrel 331 of FIG. 3 ) having a lens assembly (eg, the lens assembly 210 of FIG. 2 ) therein.
  • a camera module eg, the camera module 330 of FIGS. 3 and 4
  • an enclosing housing eg, the outer housing 333 of FIGS. 3 and 4
  • a mounting structure eg, the mounting structure 300 of FIGS. 3 and 4
  • the introduced noise may be configured to flow out to a grounding unit (not shown) provided in the electronic device through the mounting structure electrically connected thereto.
  • the housing may be configured to be electrically connected to the mounting structure through welding (eg, the weldable region W of FIG. 8 ).
  • the housing and the mounting structure may be formed of a metal member.
  • the metal member may be formed to include at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.
  • a fastening part (eg, a through hole 323 of FIGS. 3 and 4 ) configured to allow a bolt member to be inserted and fastened to the electronic device (eg, a through hole 323 of FIGS. 3 and 4 ).
  • the fastening part 321 of 4) is formed on one side of the mounting structure, and the fastening part may be formed of a metal member.
  • the mounting structure is formed by injection molding a plastic member on an insert formed of a metal member (eg, the insert 740 of FIG. 7 ), and the insert is welded to the housing to electrically It can be configured to be connected to.
  • a metal member eg, the insert 740 of FIG. 7
  • the insert may be formed of a metal member including at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.
  • the insert may include a fastening part configured to mount the mounting structure to the electronic device (eg, the fastening part 321 of FIG. 7 ).
  • the insert may be formed of a metal member including at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.
  • the housing has a connection part formed of the same material as the insert disposed on the mounting structure on one side, and the insert may be laser welded to the connection part provided in the housing.
  • connection part provided in the housing may be formed of a metal material including at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS. .
  • a set structure (eg, the set structure 800 of FIG. 8 ) configured to fix the mounting structure to the electronic device may be further included.
  • the set structure is a bracket (eg, the bracket of FIG. 8 ( 810)).
  • a camera module (eg, the camera module 330 of FIGS. 3 and 4); and an accommodating space into which the camera module can be inserted (e.g., the accommodating space 310 of FIG. 3), and a screw (e.g., the screws 610, 620, and 630 of FIG. 6) is used to allow the camera module to It includes a mounting structure (eg, the mounting structure 300 of FIGS. 3 and 4) having a structure inserted into the accommodation space and coupled to be fixed to the electronic device (eg, the electronic device 101 of FIG. 1), wherein, At least one housing (eg, the outer housing 333 of FIGS. 3 and 4 ) surrounding the lens barrel (eg, the lens barrel 331 of FIG. 3 ) in the camera module inserted into the accommodation space and the mounting structure come into contact with each other.
  • the electronic device may be configured to be electrically connected by welding (eg, the weldable region W of FIG. 8 ) at the point of .
  • an insert formed of a metal member (eg, insert 740 of FIG. 7 ) at the at least one point of the mounting structure that comes into contact with the housing is injection molded into a plastic member.
  • a metal member eg, insert 740 of FIG. 7
  • a plastic member may have a structure.
  • the metal member forming the insert may include at least one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.
  • the screw in order to fix the mounting structure, is inserted into a portion of the insert facing the set structure (eg, the set structure 800 of FIG. 8 ) configured in the electronic device to fix the set structure.
  • a fastening part eg, fastening part 321 of FIGS. 3 and 4
  • a through hole eg, through hole 323 of FIGS. 3 and 4
  • coupling structures may be included.
  • the mounting structure may be an injection-molded plastic product obtained by inserting a metal material into a position in contact with the housing.
  • the metal material may be one of zinc (Zn), aluminum (Al), magnesium (Mg), and SUS.
  • the housing may have a structure insulated from the lens barrel.
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first, second, or first or secondary may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited.
  • a (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits.
  • a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • a storage medium eg, internal memory 136 or external memory 138
  • a machine eg, electronic device 101
  • a processor eg, the processor 120
  • a device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.
  • a signal e.g. electromagnetic wave
  • the method according to various embodiments disclosed in this document may be included and provided in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • a computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store TM ) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • a device e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play Store TM
  • It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • at least part of the computer program product may be temporarily stored or temporarily created in a storage medium readable by a device such as a manufacturer's server, an application store server, or a relay server's memory.
  • each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is.
  • one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg modules or programs
  • the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. .
  • the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

Selon divers modes de réalisation, un dispositif électronique comprend : un module de caméra comprenant un barillet d'objectif dans lequel est disposé un ensemble objectif, et un boîtier externe entourant le barillet d'objectif; et une structure de montage utilisée pour monter le module de caméra sur le dispositif électronique. Le boîtier externe du module de caméra est électriquement connecté à la structure de montage de telle sorte qu'un bruit introduit depuis l'extérieur circule vers l'extérieur par l'intermédiaire d'une unité de connexion électrique vers une unité de mise à la terre disposée dans le dispositif électronique. Divers autres modes de réalisation sont également possibles.
PCT/KR2022/009594 2021-07-05 2022-07-04 Module de caméra de mise à la terre de dispositif électronique WO2023282557A1 (fr)

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KR10-2021-0087996 2021-07-05
KR1020210087996A KR20230007133A (ko) 2021-07-05 2021-07-05 카메라 모듈을 접지하는 전자 장치

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165646A (ja) * 2004-12-02 2006-06-22 Mitsubishi Electric Corp 撮像装置
KR20100100349A (ko) * 2009-03-06 2010-09-15 삼성전기주식회사 카메라모듈
KR20190086917A (ko) * 2018-01-15 2019-07-24 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 광학 장치
KR20200091264A (ko) * 2019-01-22 2020-07-30 엘지이노텍 주식회사 카메라 모듈
KR20200111526A (ko) * 2019-03-19 2020-09-29 (주)캠시스 보강 하우징 및 이를 포함하는 카메라 모듈

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165646A (ja) * 2004-12-02 2006-06-22 Mitsubishi Electric Corp 撮像装置
KR20100100349A (ko) * 2009-03-06 2010-09-15 삼성전기주식회사 카메라모듈
KR20190086917A (ko) * 2018-01-15 2019-07-24 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 광학 장치
KR20200091264A (ko) * 2019-01-22 2020-07-30 엘지이노텍 주식회사 카메라 모듈
KR20200111526A (ko) * 2019-03-19 2020-09-29 (주)캠시스 보강 하우징 및 이를 포함하는 카메라 모듈

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