WO2023279872A1

WO2023279872A1 - Air conditioner control method and apparatus, and air conditioner

Info

Publication number: WO2023279872A1
Application number: PCT/CN2022/094645
Authority: WO
Inventors: 张正林; 许文明; 杨文钧
Original assignee: 青岛海尔空调器有限总公司; 青岛海尔空调电子有限公司; 海尔智家股份有限公司
Priority date: 2021-07-09
Filing date: 2022-05-24
Publication date: 2023-01-12
Also published as: CN113531830B; CN113531830A

Abstract

Provided are an air conditioner control method and apparatus, and an air conditioner. The air conditioner comprises two semiconductor refrigeration components. The air conditioner control method comprises: acquiring a current outdoor temperature value of an area where an air conditioner outdoor unit is located, and a first current indoor temperature value of an area where an air conditioner indoor unit is located; if the current outdoor temperature value is greater than a first temperature value, and a first temperature difference between the first current indoor temperature value and a preset indoor temperature value is greater than a first set value, controlling a first semiconductor refrigeration component (310) in the air conditioner to start to run; and if the current outdoor temperature value is less than a second temperature value, and a second temperature difference between the preset indoor temperature value and the first current indoor temperature value is greater than a second set value, controlling a second semiconductor refrigeration component (320) in the air conditioner to start to run. The refrigerating capacity or the heating capacity of the air conditioner is improved, and refrigerating and heating requirements in severe working conditions are met.

Description

Method and device for air conditioner control, and air conditioner

This application is based on a Chinese patent application with application number 202110780026.2 and a filing date of July 9, 2021, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.

technical field

The present application relates to the technical field of intelligent air conditioners, for example, to methods and devices for air conditioner control, and air conditioners.

Background technique

Air conditioners have been widely used as a common intelligent device for adjusting the temperature and humidity of indoor environments. In the related art, the air conditioner can use a vapor compression refrigeration cycle to adjust the indoor temperature, which has the advantage of high energy efficiency. However, when cooling at high temperature or heating at low temperature, the air conditioner may have the problem of low cooling or heating capacity.

At present, when heating at low temperature, the air conditioner can increase the heating capacity by adding electric heating tubes, but it is difficult to find a way to solve the problem of low cooling capacity when cooling at high temperature. It can be seen that it is still difficult for the air conditioner to provide more heating and cooling capacity to meet the cooling and heating needs under severe working conditions.

Contents of the invention

In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. The summary is not intended to be an extensive overview nor to identify key/important elements or to delineate the scope of these embodiments, but rather serves as a prelude to the detailed description that follows.

Embodiments of the present disclosure provide a method and device for controlling an air conditioner, and an air conditioner, so as to solve the technical problem of insufficient cooling or heating capacity of the air conditioner under severe working conditions. The air conditioner includes two sets of semiconductor refrigeration components.

In some embodiments, the method includes:

Obtain the current outdoor temperature value of the area where the air conditioner outdoor unit is located, and the first current indoor temperature value of the area where the air conditioner indoor unit is located;

When the current outdoor temperature value is greater than the first temperature value, if the first temperature difference between the first current indoor temperature value and the preset indoor temperature value is greater than the first set value, control the The first semiconductor refrigeration component in the air conditioner is started to run, wherein the first cooling end of the first semiconductor refrigeration component is connected to the inner unit of the air conditioner, and the first heating end of the first semiconductor refrigeration component is connected to the external unit of the air conditioner. machine connection;

When the current outdoor temperature value is less than a second temperature value, if the second temperature difference between the preset indoor temperature value and the first current indoor temperature value is greater than a second set value, control The second semiconductor refrigeration component in the air conditioner starts to run, wherein the second cooling end of the second semiconductor refrigeration component is connected to the external unit of the air conditioner, and the second heating of the second semiconductor refrigeration component The end is connected with the air conditioner internal unit;

The first temperature value is greater than the second temperature value.

In some embodiments, the device includes:

The first acquisition module is configured to acquire the current outdoor temperature value of the area where the air conditioner outdoor unit is located, and the first current indoor temperature value of the area where the air conditioner indoor unit is located;

The first start control module is configured to: if the current outdoor temperature value is greater than the first temperature value, if the first temperature difference between the first current indoor temperature value and the preset indoor temperature value is greater than the first temperature value When a set value is reached, the first semiconductor refrigeration component in the air conditioner is controlled to start running, wherein the first cooling end of the first semiconductor refrigeration component is connected to the internal unit of the air conditioner, and the first semiconductor refrigeration component The first heating end of the air conditioner is connected with the external unit of the air conditioner;

The second start control module is configured to, if the current outdoor temperature value is less than a second temperature value, if there is a second temperature difference between the preset indoor temperature value and the first current indoor temperature value When it is greater than the second set value, the second semiconductor refrigeration component in the air conditioner is controlled to start running, wherein the second refrigeration terminal of the second semiconductor refrigeration component is connected to the external unit of the air conditioner, and the second The second heating end of the semiconductor refrigeration component is connected to the air conditioner internal unit;

The first temperature value is greater than the second temperature value.

In some embodiments, the device for air-conditioning control includes a processor and a memory storing program instructions, and the processor is configured to execute the above-mentioned method for air-conditioning control when executing the program instructions.

In some embodiments, the air conditioner includes the above-mentioned device for air conditioner control.

The method, device and air conditioner for air conditioner control provided by the embodiments of the present disclosure can achieve the following technical effects:

Two sets of semiconductor refrigeration components are configured in the air conditioner, so that when the current outdoor temperature value is greater than the first temperature value, and the first temperature difference between the current indoor temperature value and the preset indoor temperature value is greater than the first set value, The cooling operation of the air conditioner can control the operation of a group of semiconductor refrigeration components to pre-cool the internal unit of the air conditioner and preheat the external unit of the air conditioner to increase the cooling capacity of the air conditioner; and the current outdoor temperature value is less than the second temperature value, and When the second temperature difference between the preset indoor temperature value and the current indoor temperature value is greater than the second set value, the air conditioner runs for heating, and another set of semiconductor refrigeration components can be controlled to run to preheat the inner unit of the air conditioner. The pre-cooling of the external unit of the air conditioner increases the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions.

The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.

Description of drawings

One or more embodiments are exemplified by the corresponding drawings, and these exemplifications and drawings do not constitute a limitation to the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, The drawings are not limited to scale and in which:

Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure;

Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;

Fig. 3 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;

Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure;

Fig. 5 is a schematic structural diagram of an air-conditioning control device provided by an embodiment of the present disclosure;

Fig. 6 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.

detailed description

In order to understand the characteristics and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present disclosure. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.

The terms "first", "second" and the like in the description and claims of the embodiments of the present disclosure and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the data so used may be interchanged under appropriate circumstances so as to facilitate the embodiments of the disclosed embodiments described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion.

Unless stated otherwise, the term "plurality" means two or more.

In the embodiments of the present disclosure, the character "/" indicates that the preceding and following objects are an "or" relationship. For example, A/B means: A or B.

The term "and/or" is an associative relationship describing objects, indicating that there can be three relationships. For example, A and/or B means: A or B, or, A and B, these three relationships.

In the embodiment of the present disclosure, two groups of semiconductor refrigeration components are added to the air conditioner, and each group of semiconductor refrigeration components is connected to the air conditioner internal unit and the air conditioner external unit respectively. In this way, the current outdoor temperature value is greater than the first temperature value, and the current indoor temperature When the first temperature difference between the indoor temperature value and the preset indoor temperature value is greater than the first set value, the air conditioner operates in cooling mode, and a group of semiconductor refrigeration components can be controlled to operate, and the evaporator inlet pipeline in the air conditioner internal unit can be pre-set. It is cold, and the condenser inlet pipeline in the air conditioner outdoor unit is preheated to increase the cooling capacity of the air conditioner; while the current outdoor temperature value is less than the second temperature value, and the difference between the preset indoor temperature value and the current indoor temperature value When the second temperature difference is greater than the second set value, the air conditioner is in heating operation, which can control the operation of another group of semiconductor refrigeration components, to preheat the evaporator inlet pipeline in the air conditioner internal unit, and to preheat the evaporator inlet pipeline in the air conditioner external unit. The inlet pipe of the condenser is pre-cooled, which improves the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions. In addition, semiconductor refrigeration components do not use halogenated hydrocarbon refrigerants, and have no impact on atmospheric emissions, which can reduce the emission pollution of the refrigeration system to the atmosphere, and are more energy-saving and environmentally friendly.

Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure. As shown in FIG. 1 , the air conditioner includes: an air conditioner internal unit 100 , an air conditioner external unit 200 and two sets of semiconductor refrigeration components, namely a first semiconductor refrigeration component 310 and a second semiconductor refrigeration component 320 .

The first cooling end 311 of the first semiconductor cooling component 310 is connected to the air conditioner inner unit 100 , and the first heating end 312 of the first semiconductor cooling component 310 is connected to the air conditioner outer unit 200 .

The second cooling terminal 321 of the second semiconductor refrigeration component 320 is connected to the air conditioner external unit 200 , and the second heating terminal 322 of the second semiconductor refrigeration component 320 is connected to the air conditioner internal unit 100 .

In the embodiment of the present disclosure, the semiconductor refrigeration component can use the thermoelectric effect of the semiconductor to connect two metals with different physical properties with a conductor and connect a direct current, so that the temperature at one end can be lowered and the temperature at the other end can be raised. Heater cooling. There are multiple sets of hotspot elements inside the semiconductor refrigeration components, which can realize the cooling and heating effect of 40-50°C at the hot end, -10-20°C at the cold end, and a temperature difference of 60°C.

Among them, after the first semiconductor refrigeration component 310 is turned on and running, there are multiple groups of hotspot elements in the first cooling end 311, which can reduce the temperature, and there are also multiple groups of hotspot elements in the first heating end 312, but the temperature can be increased. . After the second semiconductor refrigeration component 320 is turned on and running, the two ends can also realize temperature reduction and temperature rise respectively. Among them, there are many groups of hot spot elements in the second refrigeration end 321, which can realize temperature reduction, and the second heating end 322 There are also multiple sets of hotspot elements in the middle, which can realize temperature rise.

In some embodiments, the first semiconductor refrigeration component 310 and the second semiconductor refrigeration component 320 can cooperate with the indoor evaporator and the outdoor condenser of the air conditioner to pre-cool and cool the inlet pipeline of the evaporator and the inlet pipeline of the condenser respectively. warm up. As shown in FIG. 1 , one end of the first cooling end 311 is connected to the evaporator of the air conditioner 100 through the indoor connector 110 , and the other end is connected to one end of the first heating end 312 through the first semiconductor component connecting pipe 313 . The other end of the first heating end 312 is connected to the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .

One end of the second heating end 322 is connected to the evaporator of the air conditioner 100 through the indoor connector 110, and the other end is connected to one end of the second cooling end 321 through the second semiconductor assembly connecting pipe 323, and the other end of the second cooling end 321 One end is connected with the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .

It can be seen that the two ends of the first semiconductor refrigeration component and the second semiconductor refrigeration component are arranged oppositely, and opposite temperature changes can be realized after the start-up operation. That is, when cooling, turn on the first semiconductor refrigeration component to pre-cool the evaporator inlet pipeline in the air conditioner's inner unit, and preheat the condenser inlet pipeline in the air conditioner's outer unit, so as to realize indoor precooling and indoor cooling. External preheating; when heating, turn on the second semiconductor refrigeration component to preheat the evaporator inlet pipeline in the air conditioner internal unit, and precool the condenser inlet pipeline in the air conditioner external unit to realize indoor cooling. Side preheating and outdoor side precooling, so that the indoor cooling capacity can be increased when the external temperature is high, and the indoor heating capacity can be increased when the external temperature is low, meeting the cooling and heating requirements under severe working conditions.

In some embodiments, both ends of the two groups of semiconductor refrigeration components can be equipped with exhaust fans that enhance air circulation, which can strengthen the heat exchange between the two ends of the semiconductor refrigeration components and the indoor/outdoor side, thereby realizing the cooling capacity/cooling of the system. Compensation for heat. As shown in Figure 1, the air conditioner can also include: four exhaust fans; wherein, the first exhaust fan 410 is located on the first cooling end 311, the second exhaust fan 420 is located on the first heating end 312, and the third exhaust fan 420 is located on the first heating end 312. The exhaust fan 430 is located on the second heating end 322 , and the fourth exhaust fan position 440 is located on the second cooling end 321 .

Certainly, in some embodiments, the air conditioner may also have only one, two or three exhaust fans, which may be located at any end of any semiconductor refrigeration component.

After the air conditioner is equipped with two sets of semiconductor refrigeration components, or equipped with two sets of semiconductor refrigeration components and their corresponding exhaust fans, the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor refrigeration components. Refrigeration and heating requirements under severe working conditions.

Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure. As mentioned above, the air conditioner can be configured with two sets of semiconductor refrigeration components, or equipped with two sets of semiconductor refrigeration components and their corresponding exhaust fans. As shown in Figure 2, the processes used for air conditioning control include:

Step 2001: Obtain the current outdoor temperature value of the area where the air conditioner outdoor unit is located, and the first current indoor temperature value of the area where the air conditioner indoor unit is located.

In the embodiment of the present disclosure, the air conditioner includes an air conditioner internal unit and an air conditioner external unit. In this way, corresponding temperature values can be obtained through corresponding temperature acquisition devices, for example, the area where the air conditioner external unit is located can be obtained in real time or at regular intervals through an outdoor temperature sensor. The outdoor temperature value of each collection, the obtained temperature value is the current outdoor temperature value. Moreover, at each collection, the first current indoor temperature value of the area where the air conditioner indoor unit is located can also be obtained through indoor temperature sensing.

Step 2002: When the current outdoor temperature value is greater than the first temperature value, if the first temperature difference between the first current indoor temperature value and the preset indoor temperature value is greater than the first set value, control the The first semiconductor refrigeration component starts to run, wherein the first cooling end of the first semiconductor refrigeration component is connected to the air conditioner internal unit, and the first heating terminal of the first semiconductor refrigeration component is connected to the air conditioner external unit.

In the related art, when the air conditioner adopts the vapor compression refrigeration cycle, the air conditioner may have a problem of low cooling capacity or low heating capacity when cooling at high temperature or heating at low temperature. In the embodiment of the present disclosure, cooling capacity or heating capacity can be increased by controlling semiconductor refrigeration components. Therefore, a first temperature value can be configured to meet high temperature conditions, for example, the first temperature value can be 42°C, 43°C, or 45°C, etc. In this way, when the current outdoor temperature value is greater than the first temperature value, it can be determined that the area where the air conditioner is located is in high-temperature conditions, and the air conditioner is operating in cooling mode, and there may be a problem of insufficient cooling capacity. The power consumption is relatively large when the time is turned on. In the embodiment of the present disclosure, not only the outdoor temperature is relatively high, but also when the measured indoor temperature is greatly different from the preset indoor temperature, the first semiconductor refrigeration component in the air conditioner can be controlled to start. run. That is, when the current outdoor temperature value is greater than the first temperature value, if the first temperature difference between the first current indoor temperature value and the preset indoor temperature value is greater than the first set value, the first temperature in the air conditioner is controlled. The semiconductor refrigeration components start to run. The first set point can be 3°C, 4°C or 5°C and so on.

Since the first cooling terminal of the first semiconductor refrigeration component is connected to the air conditioner internal unit, and the first heating terminal of the first semiconductor refrigeration component is connected to the external unit of the air conditioner, in this way, after the first semiconductor refrigeration component starts running, it can realize Indoor precooling and outdoor preheating. In some embodiments, since the first cooling end of the first semiconductor refrigeration component is connected to the evaporator of the air conditioner internal unit through the indoor connection piece, the first heating end is connected to the condenser of the air conditioner external unit through the outdoor connection piece, thus , the evaporator inlet pipeline in the air conditioner internal unit can be precooled, and the condenser inlet pipeline in the air conditioner external unit can be preheated, thereby increasing the cooling capacity of the air conditioner.

Step 2003: When the current outdoor temperature value is lower than the second temperature value, if the second temperature difference between the preset indoor temperature value and the first current indoor temperature value is greater than the second set value, control the The second semiconductor refrigeration component is started to run, wherein, the second cooling end of the second semiconductor refrigeration component is connected to the external unit of the air conditioner, and the second heating terminal of the second semiconductor refrigeration component is connected to the internal unit of the air conditioner.

Of course, a second temperature value can be configured to meet low temperature conditions, for example, the second temperature value can be -5°C, -7°C, or -10°C, etc. Similarly, the second set value can also be configured, which can be 3°C, 4°C or 5°C and so on. In this way, when the current outdoor temperature value is lower than the second temperature value, it can be determined that the area where the air conditioner is located is in a low-temperature condition, and the air conditioner is operating in the heating mode, and there may be a problem of insufficient heating capacity. Similarly, the operating power of semiconductor refrigeration components is relatively high. Turning on for a long time consumes a lot of power. In the embodiment of the present disclosure, not only the outdoor temperature is relatively low, but also the second semiconductor refrigeration component in the air conditioner can be controlled only when the preset indoor temperature is greatly different from the indoor measured temperature. Start running. That is, when the current outdoor temperature value is lower than the second temperature value, if the second temperature difference between the preset indoor temperature value and the first current indoor temperature value is greater than the second set value, the second temperature in the air conditioner is controlled. The semiconductor refrigeration components start to run.

Since the second cooling terminal of the second semiconductor refrigeration component is connected to the external unit of the air conditioner, and the second heating terminal of the second semiconductor refrigeration component is connected to the internal unit of the air conditioner, after the second semiconductor refrigeration component starts running, it can realize Indoor preheating and outdoor precooling. In some embodiments, since the second heating end of the second semiconductor refrigeration component is connected to the evaporator of the air conditioner internal unit through the indoor connection piece, and the second cooling end is connected to the condenser of the air conditioner external unit through the outdoor connection piece, thus , the evaporator inlet pipeline in the air conditioner internal unit can be preheated, and the condenser inlet pipeline in the air conditioner external unit can be precooled, thereby increasing the heating capacity of the air conditioner.

It can be seen that in this embodiment, the start-up operation of the semiconductor refrigeration components can be controlled to increase the cooling or heating capacity of the air conditioner, which meets the cooling and heating requirements under severe working conditions. Moreover, semiconductor refrigeration components do not use halogenated hydrocarbon refrigerants, and have no impact on atmospheric emissions, which can reduce the emission pollution of the refrigeration system to the atmosphere, and are more energy-saving and environmentally friendly.

The semiconductor refrigeration components of the air conditioner may be equipped with a corresponding exhaust fan. The exhaust fan can strengthen the air circulation and strengthen the heat exchange between the two ends of the semiconductor refrigeration components and the indoor/outdoor side, so as to realize the control of the cooling capacity/heating capacity of the system. compensate. Therefore, in some embodiments, when the first semiconductor refrigeration component is running, the operation of the first exhaust fan and the second exhaust fan configured on the first semiconductor refrigeration component is controlled; In the case of running, control the operation of the third exhaust fan and the fourth exhaust fan arranged on the second semiconductor refrigeration component. Wherein, in the air conditioner, the first exhaust fan is located on the first cooling end, the second exhaust fan is located on the first heating end, the third exhaust fan is located on the second heating end, and the fourth exhaust fan is located on the second heating end. On the second refrigeration end.

In some embodiments, during cooling or heating operation, the air conditioner can also adjust the indoor temperature to the set value at the fastest speed by adjusting the frequency of the compressor or starting the electric heating device. Wherein, when the first semiconductor refrigeration component is running, the current operating frequency of the compressor of the air conditioner is adjusted to the highest cooling frequency matching the current outdoor temperature value; when the second semiconductor refrigeration component is running, the air conditioner is controlled to The electric heating device starts to operate.

When the air conditioner is in cooling operation, adjust the current operating frequency of the air conditioner compressor to the highest cooling frequency that matches the current outdoor temperature value, which can realize the maximum capacity and maximum power operation of the compressor, and cooperate with the pre-cooling of the first semiconductor refrigeration components, which can make the The indoor cooling effect is the best, achieving the effect of rapid cooling.

When the air conditioner is heating and running, turn on the electric heating device of the air conditioner to increase the indoor heating capacity, and cooperate with the preheating of the second semiconductor refrigeration component to make the indoor heating effect the best and achieve the effect of rapid heating.

The operation of semiconductor refrigeration components consumes energy. Therefore, in some embodiments, when the indoor temperature value of the area where the air conditioner’s indoor unit is located is relatively close to the preset indoor temperature value, the semiconductor refrigeration components can be turned off, thus reducing The power consumption of the air conditioner improves the overall energy efficiency of the air conditioner. When the semiconductor refrigeration components of the air conditioner are in operation, the second current indoor temperature value of the area where the air conditioner’s inner unit is located is obtained; the second current indoor temperature value is compared with the preset When the third temperature difference between the indoor temperature values is less than the third set value, the first semiconductor refrigeration component in the air conditioner is controlled to stop running; When the fourth temperature difference is smaller than the fourth set value, the second semiconductor refrigeration component in the air conditioner is controlled to stop running.

Since the indoor temperature value is relatively close to the preset indoor temperature value, the semiconductor refrigeration components are turned off, so the third set value can be 1°C, 2°C or 3°C, and similarly, the fourth set value can also be 1°C , 2°C or 3°C, etc.

When the semiconductor refrigeration components of the air conditioner are in the running state, the indoor temperature value of the area where the air conditioner’s internal unit is located can be obtained in real time or regularly through the indoor temperature secondary acquisition device, for example, the indoor temperature sensor. The temperature value is the second current indoor temperature value.

Therefore, in some embodiments, the semi-conductor refrigeration components of the air conditioner are in the running state, and the second current indoor temperature value of the area where the air conditioner indoor unit is located can be obtained when the set acquisition timing is reached. For example: after the semiconductor refrigeration component starts to run, the second current indoor temperature value can be collected every 3 minutes, 5 minutes or 6 minutes.

When the first semiconductor refrigeration component is in the running state, generally the air conditioner is in cooling operation, the second current indoor temperature value Tr2 is generally greater than the preset indoor temperature value Tset, so if Tr2-Tset<the third set value, for example: 2 , the first semiconductor refrigeration component in the air conditioner can be controlled to stop running. When the second semiconductor refrigeration component is in the operating state, the air conditioner is generally in the heating operation, and the second current indoor temperature value Tr2 is generally smaller than the preset indoor temperature value Tset. In this way, if Tset-Tr2<the fourth set value, for example : 3, it can control the second semiconductor refrigeration component in the air conditioner to stop running.

The semi-conductor refrigeration component stops running, and in order to further reduce energy consumption, the corresponding exhaust fan can also be closed. In some embodiments, when the first semi-conductor refrigeration component stops operating, control the first semiconductor refrigeration component The first exhaust fan and the second exhaust fan configured above stop running; when the second semiconductor refrigeration component stops running, control the third exhaust fan and the fourth exhaust fan configured on the second semiconductor refrigeration component The fan stops operating.

Of course, when the current outdoor temperature value is less than or equal to the first temperature value and greater than or equal to the second temperature value, the operating state of the semiconductor refrigeration components controlling the air conditioner remains unchanged, and the air conditioner can still use a vapor compression refrigeration cycle. to adjust the indoor temperature.

At present, the air conditioner has a communication function, so that the air conditioner can also control the operation of semiconductor refrigeration components according to the received instructions. In some embodiments, in the case of receiving the semiconductor switch instruction sent by the configuration control application APP terminal, according to the semiconductor switch instruction, the switching operation of the semiconductor refrigeration components in the air conditioner is controlled. In this way, the user can control the switch of semiconductor refrigeration components through the APP, which improves the intelligence and user experience of the air conditioner.

In the following, the operation process is combined into a specific embodiment to illustrate the air-conditioning control process provided by the embodiment of the present disclosure.

In this embodiment, the air conditioner may include two sets of semiconductor refrigeration components and four exhaust fans as shown in FIG. 1 . Moreover, the first temperature value stored in the air conditioner may be 42°C, the second temperature value may be -7°C, the first set value is 3°C, the second set value is 4°C, and the third set value is 2°C. °C, the fourth set value is 3 °C.

Fig. 3 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure. Combining Figure 1 and Figure 3, the process for air conditioning control includes:

Step 3001: Obtain the current outdoor temperature value Tao of the area where the air conditioner outdoor unit is located, and the first current indoor temperature value Tr1 of the area where the air conditioner indoor unit is located.

Step 3002: Determine whether the current outdoor temperature value Tao>42°C holds true? If yes, go to step 3003; otherwise, go to step 3009.

Step 3003: Determine whether the first temperature difference Tr1-Tset>3 between the first current indoor temperature value Tr1 and the preset indoor temperature value Tset holds? If yes, go to step 3004; otherwise, go to step 3016.

Step 3004: Control the first semiconductor refrigeration component in the air conditioner, and start the corresponding first exhaust fan and second exhaust fan.

Step 3005: Determine whether the preset sampling time has been reached? If yes, execute step 3006; otherwise, return to step 3005.

Step 3006: Obtain the second current indoor temperature value Tr2 of the area where the air conditioner indoor unit is located.

Step 3007: Determine whether Tr2-Tset<2°C holds true? If yes, execute step 3008; otherwise, return to step 3005.

Step 3008: Control the first semiconductor refrigeration component in the air conditioner, and stop the corresponding first exhaust fan and second exhaust fan, and this control process ends.

Step 3009: Determine whether Tao<-7°C is established? If yes, go to step 3010; otherwise, go to step 3016.

Step 3010: Determine whether the second temperature difference Tset-Tr1>4 between the preset indoor temperature value Tset and the first current indoor temperature value Tr1 holds true? If yes, go to step 311; otherwise, go to step 3016.

Step 3011: Control the second semiconductor refrigeration component in the air conditioner, and start the operation of the corresponding third and fourth exhaust fans.

Step 3012: Determine whether the preset sampling time has been reached? If yes, execute step 3013; otherwise, return to step 3012.

Step 3013: Obtain the second current indoor temperature value Tr2 of the area where the air conditioner indoor unit is located.

Step 3014: Determine whether Tset-Tr2<3°C holds true? If yes, execute step 3015, otherwise, return to step 3012.

Step 3015: Control the second semiconductor refrigeration component in the air conditioner, and the corresponding third exhaust fan and fourth exhaust fan to stop running, and this control process ends.

Step 3016: Control the air conditioner to operate the vapor compression refrigeration cycle.

It can be seen that in this embodiment, two sets of semiconductor refrigeration components are configured in the air conditioner, so that the current outdoor temperature value is greater than the first temperature value, and the first temperature difference between the current indoor temperature value and the preset indoor temperature value is greater than At the first set value, the air conditioner is in cooling operation, which can control the operation of a group of semiconductor refrigeration components to pre-cool the evaporator inlet pipeline in the air conditioner internal unit, and pre-cool the condenser inlet pipeline in the air conditioner external unit. When the current outdoor temperature value is lower than the second temperature value, and the second temperature difference between the preset indoor temperature value and the current indoor temperature value is greater than the second set value, the air conditioner will heat It can control the operation of another group of semiconductor refrigeration components, preheat the evaporator inlet pipeline in the air conditioner internal unit, and precool the condenser inlet pipeline in the air conditioner external unit, which improves the heating capacity of the air conditioner , to meet the cooling and heating needs under severe working conditions. Moreover, after the semiconductor refrigeration components are in operation, when the indoor temperature value is relatively close to the preset indoor temperature value, the operation of the semiconductor refrigeration components can be turned off, reducing the power consumption of the air conditioner and improving the overall energy efficiency of the air conditioner. Of course, semiconductor refrigeration components do not use halogenated hydrocarbon refrigerants, and have no impact on atmospheric emissions, which can reduce air-conditioning emissions and pollution to the atmosphere, and are more energy-saving and environmentally friendly.

According to the above process for air-conditioning control, an apparatus for air-conditioning control can be constructed.

Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As mentioned above, the air conditioner includes two sets of semiconductor cooling components, or two sets of semiconductor cooling components and their corresponding exhaust fans. As shown in FIG. 4 , the air conditioner control device includes: a first acquisition module 4100 , a first startup control module 4200 and a second startup control module 4300 .

The first acquiring module 4100 is configured to acquire the current outdoor temperature value of the area where the air conditioner outdoor unit is located, and the first current indoor temperature value of the area where the air conditioner indoor unit is located.

The first start control module 4200 is configured to: if the current outdoor temperature value is greater than the first temperature value, if the first temperature difference between the first current indoor temperature value and the preset indoor temperature value is greater than the first setting value, control the first semiconductor refrigeration component in the air conditioner to start running, wherein the first cooling end of the first semiconductor refrigeration component is connected to the air conditioner internal unit, and the first heating end of the first semiconductor refrigeration component is connected to the external machine connection.

The second start control module 4300 is configured to: if the current outdoor temperature value is lower than the second temperature value, if the second temperature difference between the preset indoor temperature value and the first current indoor temperature value is greater than the second setting value, control the second semiconductor refrigeration component in the air conditioner to start running, wherein, the second cooling terminal of the second semiconductor refrigeration component is connected to the external unit of the air conditioner, and the second heating terminal of the second semiconductor refrigeration component is connected to the internal machine connection.

Of course, the first temperature value is greater than the second temperature value.

In some embodiments, the first startup control module 4200 is further configured to control the first exhaust fan and the second exhaust fan configured on the first peltier element when the first peltier element is running run.

The second start control module 4300 is further configured to control the operation of the third exhaust fan and the fourth exhaust fan configured on the second semiconductor refrigeration component when the second semiconductor refrigeration component is running.

In some embodiments, also include:

The frequency adjustment module is configured to adjust the current operating frequency of the compressor of the air conditioner to the highest cooling frequency matching the current outdoor temperature value when the first semiconductor refrigeration component is running.

The heating control module is configured to control the electric heating device of the air conditioner to start running when the second semiconductor refrigeration component is running.

In some embodiments, also include:

The second acquisition module is configured to acquire the second current indoor temperature value of the area where the air conditioner indoor unit is located when the semiconductor refrigeration components of the air conditioner are in operation.

The first shutdown control module is configured to control the first semiconductor refrigeration component in the air conditioner when the third temperature difference between the second current indoor temperature value and the preset indoor temperature value is smaller than the third set value stop running.

The second shutdown control module is configured to control the second semiconductor refrigeration component in the air conditioner when the fourth temperature difference between the second preset indoor temperature value and the current indoor temperature value is less than the fourth set value stop running.

In some embodiments, the first shutdown control module is further configured to control the first exhaust fan and the second exhaust fan configured on the first semiconductor refrigeration component when the first semiconductor refrigeration component stops running stop running.

The second shutdown control module is further configured to control the third exhaust fan and the fourth exhaust fan configured on the second semiconductor refrigeration component to stop running when the second semiconductor refrigeration component stops running.

In some embodiments, also include:

The maintenance control module is configured to control the operating state of the semiconductor refrigeration components of the air conditioner when the current outdoor temperature value is less than or equal to the first temperature value and greater than or equal to the second temperature value.

In some embodiments, also include:

The instruction control module is configured to control the switching operation of the semiconductor refrigeration components in the air conditioner according to the semiconductor switch instruction when receiving the semiconductor switch instruction sent by the configuration control application APP terminal.

The following is an example to illustrate the air-conditioning control process performed by the device for air-conditioning control provided by the embodiments of the present disclosure.

The air conditioner can be shown in Figure 1, including two sets of semiconductor refrigeration components and four exhaust fans. Moreover, the first temperature value stored in the air conditioner may be 42°C, the second temperature value may be -7°C, both the first set value and the second set value may be 4°C, and the third set value and the second set value may be The four setting values can all be 3°C. Of course, when the air conditioner is running, the preset indoor temperature value Tset is also obtained.

Fig. 5 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As shown in Figure 5, the air conditioner control device includes: a first acquisition module 4100, a first startup control module 4200, a second startup control module 4300, a frequency adjustment module 4400, a heating control module 4500, a second acquisition module 4600, A shutdown control module 4700 , a second shutdown control module 4800 and a maintenance control module 4900 .

Wherein, the first obtaining module 4100 obtains the current outdoor temperature value Tao of the area where the air conditioner outdoor unit is located, and the first current indoor temperature value Tr1 of the area where the air conditioner indoor unit is located. In this way, when Tao>42°C and Tr1-Tset>4, The first start control module 4200 can control the first semiconductor refrigeration components in the air conditioner, and the corresponding first exhaust fan and the second exhaust fan start to run. In addition, the frequency adjustment module 4400 can also adjust the current operating frequency of the compressor of the air conditioner to the highest cooling frequency that matches the current outdoor temperature value, so as to realize the maximum capacity and maximum power operation of the compressor, and cooperate with the pre-set temperature of the first semiconductor refrigeration component. Cold, can make the indoor cooling effect to achieve the best, to achieve the effect of rapid cooling.

And when Tao<-7°C, and Tset-Tr1>4, the second start control module 4300 can control the second semiconductor refrigeration components in the air conditioner, and start the corresponding third exhaust fan and fourth exhaust fan run. In addition, the heating control module 4500 controls the electric heating device of the air conditioner to start and run. In this way, the indoor heating capacity can be increased, and with the preheating of the second semiconductor refrigeration components, the indoor heating effect can be optimized to achieve rapid heating. Effect.

After the semiconductor refrigeration components start running, the second acquisition module 4600 can collect the second current indoor temperature value Tr2 of the area where the air conditioner indoor unit is located in real time, and run the first semiconductor refrigeration components, that is, during the cooling process, if Tr2-Tset< At 3°C, the first shutdown control module 4700 controls the first semiconductor refrigeration component in the air conditioner, and the corresponding first and second exhaust fans stop running. While the second semiconductor refrigeration component is running, that is, during the heating process, if Tset-Tr2<3°C, the second shutdown control module 4800 can control the second semiconductor refrigeration component in the air conditioner and the corresponding third row The air fan and the fourth exhaust fan stop operating.

Of course, when -7°C≤Tao≤42°C, the control module 4900 can keep the operating state of the semiconductor refrigeration components of the air conditioner unchanged, and can control the air conditioner to operate the vapor compression refrigeration cycle. In addition, when Tao>42°C, and Tr1-Tset≤4, maintain the control module 4900 can also control the operating status of the semiconductor refrigeration components of the air conditioner, while Tao<-7°C, and Tset-Tr1>4≤4 , the control module 4900 can also control the operating status of the semiconductor refrigeration components of the air conditioner.

It can be seen that in this embodiment, two sets of semiconductor refrigeration components are configured in the air conditioner, so that the device for air conditioning control controls the semiconductor refrigeration components to start and run according to the outdoor temperature value, increasing the controlled cooling capacity or heating capacity, satisfying the Cooling and heating needs under harsh working conditions, and when the indoor temperature value is close to the preset indoor temperature value, the operation of semiconductor refrigeration components is turned off to reduce the power consumption of the air conditioner and improve the overall energy efficiency of the air conditioner.

An embodiment of the present disclosure provides a device for air conditioning control, the structure of which is shown in Figure 6, including:

A processor (processor) 1000 and a memory (memory) 1001 may also include a communication interface (Communication Interface) 1002 and a bus 1003. Wherein, the processor 1000 , the communication interface 1002 , and the memory 1001 can communicate with each other through the bus 1003 . Communication interface 1002 may be used for information transfer. The processor 1000 can call the logic instructions in the memory 1001 to execute the method for air conditioner control in the above embodiments.

In addition, the above logic instructions in the memory 1001 may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as an independent product.

The memory 1001, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 1000 executes function applications and data processing by running the program instructions/modules stored in the memory 1001 , that is, implements the method for air-conditioning control in the above method embodiments.

The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required by a function; the data storage area may store data created according to the use of the terminal air conditioner, and the like. In addition, the memory 1001 may include a high-speed random access memory, and may also include a non-volatile memory.

An embodiment of the present disclosure provides an air-conditioning control device, including: a processor and a memory storing program instructions, and the processor is configured to execute an air-conditioning control method when executing the program instructions.

An embodiment of the present disclosure provides an air conditioner, including the above-mentioned control device for an air conditioner.

An embodiment of the present disclosure provides a computer-readable storage medium, which stores computer-executable instructions, and the computer-executable instructions are configured to execute the above method for controlling an air conditioner.

An embodiment of the present disclosure provides a computer program product, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program includes program instructions, and when the program instructions are executed by a computer, the The computer executes the above method for air conditioning control.

The above-mentioned computer-readable storage medium may be a transitory computer-readable storage medium, or a non-transitory computer-readable storage medium.

The technical solutions of the embodiments of the present disclosure can be embodied in the form of software products. The computer software products are stored in a storage medium and include one or more instructions to make a computer air conditioner (which can be a personal computer, a server, or a network air conditioner, etc.) execute all or part of the steps of the method described in the embodiments of the present disclosure. The aforementioned storage medium can be a non-transitory storage medium, including: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc. A medium that can store program code, or a transitory storage medium.

The above description and drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, procedural, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present disclosure includes the full scope of the claims, and all available equivalents of the claims. When used in the present application, although the terms 'first', 'second', etc. may be used in the present application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without changing the meaning of the description, a first element could be called a second element, and likewise, a second element could be called a first element, as long as all occurrences of "first element" are renamed consistently and all occurrences of "Second component" can be renamed consistently. The first element and the second element are both elements, but may not be the same element. Also, the terms used in the present application are used to describe the embodiments only and are not used to limit the claims. As used in the examples and description of the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well unless the context clearly indicates otherwise . Similarly, the term "and/or" as used in this application is meant to include any and all possible combinations of one or more of the associated listed ones. Additionally, when used in this application, the term "comprise" and its variants "comprises" and/or comprising (comprising) etc. refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these. Without further limitations, an element defined by the statement "comprising a ..." does not exclude the presence of additional identical elements in the process, method or condition comprising said element. Herein, what each embodiment focuses on may be the difference from other embodiments, and the same and similar parts of the various embodiments may refer to each other. For the method, product, etc. disclosed in the embodiment, if it corresponds to the method part disclosed in the embodiment, then the relevant part can refer to the description of the method part.

Those skilled in the art can appreciate that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software may depend on the specific application and design constraints of the technical solution. Said artisans may implement the described functions using different methods for each particular application, but such implementation should not be regarded as exceeding the scope of the disclosed embodiments. The skilled person can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, air conditioners, etc.) can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units may only be a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined Or it can be integrated into another system, or some features can be ignored, or not implemented. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to implement this embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the disclosure. In this regard, each block in a flowchart or block diagram may represent a module, program segment, or part of code that includes one or more Executable instructions. In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than that disclosed in the description, and sometimes there is no specific agreement between different operations or steps. order. For example, two consecutive operations or steps may, in fact, be performed substantially concurrently, or they may sometimes be performed in the reverse order, depending upon the functionality involved. Each block in the block diagrams and/or flowcharts, and combinations of blocks in the block diagrams and/or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by dedicated hardware implemented in combination with computer instructions.

Claims

A method for air conditioning control, characterized in that the air conditioner includes two sets of semiconductor refrigeration components, and the method includes:

Obtain the current outdoor temperature value of the area where the air conditioner outdoor unit is located, and the first current indoor temperature value of the area where the air conditioner indoor unit is located;

When the current outdoor temperature value is greater than the first temperature value, if the first temperature difference between the first current indoor temperature value and the preset indoor temperature value is greater than the first set value, control the The first semiconductor refrigeration component in the air conditioner is started to run, wherein the first cooling end of the first semiconductor refrigeration component is connected to the inner unit of the air conditioner, and the first heating end of the first semiconductor refrigeration component is connected to the external unit of the air conditioner. machine connection;

When the current outdoor temperature value is less than a second temperature value, if the second temperature difference between the preset indoor temperature value and the first current indoor temperature value is greater than a second set value, control The second semiconductor refrigeration component in the air conditioner starts to run, wherein the second cooling end of the second semiconductor refrigeration component is connected to the external unit of the air conditioner, and the second heating of the second semiconductor refrigeration component The end is connected with the air conditioner internal unit;

The first temperature value is greater than the second temperature value.
The method according to claim 1, further comprising:

When the first semiconductor refrigeration component is running, control the operation of the first exhaust fan and the second exhaust fan configured on the first semiconductor refrigeration component;

When the second semiconductor refrigeration component is running, the third exhaust fan and the fourth exhaust fan arranged on the second semiconductor refrigeration component are controlled to operate.
The method according to claim 1, further comprising:

When the first semiconductor refrigeration component is running, adjust the current operating frequency of the compressor of the air conditioner to the highest cooling frequency that matches the current outdoor temperature value;

When the second semiconductor refrigeration component is running, the electric heating device for controlling the air conditioner is started to run.
The method according to any one of claims 1-3, further comprising:

When the semi-conductor refrigeration components of the air conditioner are in the running state, obtain the second current indoor temperature value of the area where the air conditioner inner unit is located;

When the third temperature difference between the second current indoor temperature value and the preset indoor temperature value is less than a third set value, control the first semiconductor refrigeration component in the air conditioner to stop running;

When the fourth temperature difference between the second preset indoor temperature value and the current indoor temperature value is smaller than a fourth set value, the second semiconductor refrigeration component in the air conditioner is controlled to stop running.
The method according to claim 4, further comprising:

When the first semiconductor refrigeration component stops running, control the first exhaust fan and the second exhaust fan configured on the first semiconductor refrigeration component to stop running;

When the second semiconductor refrigeration component stops running, the third exhaust fan and the fourth exhaust fan arranged on the second semiconductor refrigeration component are controlled to stop running.
The method according to claim 1, further comprising:

When the current outdoor temperature value is less than or equal to the first temperature value and greater than or equal to the second temperature value, the operating state of the semiconductor refrigeration components controlling the air conditioner remains unchanged.
The method according to claim 1, further comprising:

In the case of receiving the semiconductor switch instruction sent by the configuration control application APP terminal, according to the semiconductor switch instruction, the switch operation of the semiconductor refrigeration components in the air conditioner is controlled.
A device for air conditioning control, characterized in that the air conditioner includes two sets of semiconductor refrigeration components, and the device includes:

The first acquisition module is configured to acquire the current outdoor temperature value of the area where the air conditioner outdoor unit is located, and the first current indoor temperature value of the area where the air conditioner indoor unit is located;

The first start control module is configured to: if the current outdoor temperature value is greater than the first temperature value, if the first temperature difference between the first current indoor temperature value and the preset indoor temperature value is greater than the first temperature value When a set value is reached, the first semiconductor refrigeration component in the air conditioner is controlled to start running, wherein the first cooling end of the first semiconductor refrigeration component is connected to the internal unit of the air conditioner, and the first semiconductor refrigeration component The first heating end of the air conditioner is connected to the external unit;

The second start control module is configured to, if the current outdoor temperature value is less than a second temperature value, if there is a second temperature difference between the preset indoor temperature value and the first current indoor temperature value When it is greater than the second set value, the second semiconductor refrigeration component in the air conditioner is controlled to start running, wherein the second refrigeration terminal of the second semiconductor refrigeration component is connected to the external unit of the air conditioner, and the second The second heating end of the semiconductor refrigeration component is connected to the air conditioner internal unit;

The first temperature value is greater than the second temperature value.
A device for controlling an air conditioner, the air conditioner includes two sets of semiconductor refrigeration components, the device includes a processor and a memory storing program instructions, wherein the processor is configured to execute the program instructions , the method for air conditioning control according to any one of claims 1 to 7 is executed.
An air conditioner, characterized by comprising: the device for air conditioner control according to claim 8 or 9.