CN116221923A

CN116221923A - Method and device for controlling air conditioner, air conditioner and storage medium

Info

Publication number: CN116221923A
Application number: CN202111477614.5A
Authority: CN
Inventors: 张正林; 许文明; 杨文钧
Original assignee: Qingdao Haier Air Conditioner Gen Corp Ltd; Qingdao Haier Air Conditioning Electric Co Ltd; Haier Smart Home Co Ltd
Current assignee: Qingdao Haier Air Conditioner Gen Corp Ltd; Qingdao Haier Air Conditioning Electric Co Ltd; Haier Smart Home Co Ltd
Priority date: 2021-12-06
Filing date: 2021-12-06
Publication date: 2023-06-06
Also published as: WO2023103528A1

Abstract

The application relates to the technical field of intelligent air conditioners, and discloses a method and device for controlling an air conditioner, the air conditioner and a storage medium. The air conditioner includes: two sets of semiconductor components. The method comprises the following steps: under the condition that the air conditioner starts the current working mode operation, controlling the air conditioner to start the operation, including: when the running time of the air conditioner running in the current working mode reaches the set starting time, if the average running frequency of the air conditioner compressor is larger than the first set frequency in the set starting time, acquiring a first average outdoor temperature value and a first absolute average temperature difference value of the air conditioner in a first set duration; determining a first operating frequency of the air conditioner compressor that matches the first absolute average temperature difference and a first operating state of the current semiconductor component; and controlling the air conditioner compressor to operate at a first operating frequency, and controlling the current semiconductor component to operate at a first operating state according to the first average outdoor temperature value.

Description

Method and device for controlling air conditioner, air conditioner and storage medium

Technical Field

The present application relates to the technical field of intelligent air conditioning, for example, to a method, an apparatus, an air conditioner, and a storage medium for controlling an air conditioner.

Background

Air conditioners are widely used as a common intelligent device for adjusting indoor environment temperature and humidity. In the related art, the air conditioner may use a vapor compression refrigeration cycle to realize the adjustment of indoor temperature, and has the advantage of high energy efficiency, but the air conditioner may have a problem of low refrigerating capacity or heating capacity when refrigerating at a high temperature or heating at a low temperature.

At present, two groups of semiconductor components can be added in the air conditioner, and each group of semiconductor components is respectively connected with an air conditioner inner unit and an air conditioner outer unit, so that the air conditioner can be operated in a refrigerating mode, one group of semiconductor components can be controlled to operate, an evaporator inlet pipeline in the air conditioner inner unit is precooled, a condenser inlet pipeline in the air conditioner outer unit is preheated, and the refrigerating capacity of the air conditioner is improved; the air conditioner can control the operation of the other group of semiconductor components, preheat the evaporator inlet pipeline in the air conditioner inner unit, precool the condenser inlet pipeline in the air conditioner outer unit, thereby improving the heating capacity of the air conditioner and meeting the cooling and heating requirements under severe working conditions.

Therefore, after the air conditioner is provided with two groups of semiconductor components, the refrigerating capacity or heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor components, and the refrigerating and heating requirements under severe working conditions are met. However, the semiconductor components are limited by materials, and after long-time wire operation, the refrigerating or heating efficiency is reduced, and the reliability is lowered, so that the operation efficiency and the reliability of the air conditioner are affected, and the power consumption of the air conditioner is relatively high when the semiconductor components are operated for a long time.

Disclosure of Invention

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.

The embodiment of the disclosure provides a method and a device for controlling an air conditioner, the air conditioner and a storage medium, so as to solve the technical problem that the power consumption of the air conditioner is overlarge under severe working conditions. The air conditioner includes two sets of semiconductor components.

In some embodiments, the method comprises:

when the running time of the air conditioner running in the current working mode reaches the set starting time, if the average running frequency of the air conditioner compressor is larger than a first set frequency in the set starting time, acquiring a first average indoor temperature value and a first average outdoor temperature value of the air conditioner running in the current working mode in a first set duration, and acquiring a first absolute average temperature difference value between the first average indoor temperature value and a target indoor temperature value;

determining a first operating frequency of the air conditioner compressor matched with the first absolute average temperature difference value and a first operating state of a current semiconductor component, wherein the current semiconductor component is matched with the current working mode;

And controlling the air conditioner compressor to operate at the first operating frequency, and controlling the current semiconductor component to operate at the first operating state according to the first average outdoor temperature value.

In some embodiments, the apparatus for air conditioning control includes a processor and a memory storing program instructions, the processor being configured to perform the above-described method for air conditioning control when executing the program instructions.

In some embodiments, the air conditioner comprises the device for controlling the air conditioner.

In some embodiments, the storage medium stores program instructions that, when executed, perform the method for air conditioning control described above.

The method and the device for controlling the air conditioner and the air conditioner provided by the embodiment of the disclosure can realize the following technical effects:

two groups of semiconductor components are configured in the air conditioner, and when the air conditioner starts the current working mode to run to reach the set starting time and the air conditioner compressor keeps running at high frequency, the running parameters and states of the air conditioner compressor and the semiconductor components can be adjusted according to the absolute average temperature difference value between the average indoor temperature value and the target indoor temperature value and the average outdoor temperature value, so that the power of the air conditioner is flexibly controlled, the refrigerating capacity or the heating capacity of the air conditioner is improved by controlling the running of the semiconductor components, the refrigerating and heating efficiency is improved, and the power consumption of the air conditioner is reduced.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:

fig. 1 is a schematic structural view of an air conditioner according to an embodiment of the present disclosure;

fig. 2 is a schematic flow chart of a method for controlling an air conditioner according to an embodiment of the present disclosure;

fig. 3-1 is a schematic flow chart of a method for controlling an air conditioner according to an embodiment of the present disclosure;

fig. 3-2 is a schematic flow chart of a method for controlling an air conditioner according to an embodiment of the present disclosure;

fig. 4 is a schematic structural view of an air conditioner control device according to an embodiment of the present disclosure;

fig. 5 is a schematic structural view of an air conditioner control device according to an embodiment of the present disclosure;

fig. 6 is a schematic structural view of an air conditioner control device according to an embodiment of the present disclosure.

Detailed Description

So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.

The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

The term "plurality" means two or more, unless otherwise indicated.

In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.

In the embodiment of the disclosure, two groups of semiconductor components are added in the air conditioner, and each group of semiconductor components is respectively connected with the air conditioner inner unit and the air conditioner outer unit, so that the refrigerating capacity or heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor components, the refrigerating and heating requirements under severe working conditions are met, and the refrigerating and heating efficiency of the air conditioner is also improved.

Fig. 1 is a schematic structural diagram of an air conditioner according to an embodiment of the present disclosure. As shown in fig. 1, the air conditioner includes: the air conditioner indoor unit 100, the air conditioner outdoor unit 200, and the two sets of semiconductor components are a first semiconductor component 310 and a second semiconductor component 320, respectively.

The first cooling end 311 of the first semiconductor component 310 is connected to the air conditioner indoor unit 100, and the first heating end 312 of the first semiconductor component 310 is connected to the air conditioner outdoor unit 200.

The second cooling end 321 of the second semiconductor component 320 is connected to the air conditioner external unit 200, and the second heating end 322 of the second semiconductor component 320 is connected to the air conditioner internal unit 100.

In the embodiment of the disclosure, the semiconductor component can utilize the thermoelectric effect of the semiconductor, and the conductor is used for connecting two metals with different physical properties and is connected with direct current, so that the temperature at one end is reduced, the temperature at one end is increased, and the semiconductor component is commonly used for cooling electronic elements and miniature heat exchangers. A plurality of groups of hot spot elements exist in the semiconductor component, and the refrigerating and heating effects of the hot end at 40-50 ℃, the cold end at-10-20 ℃ and the temperature difference at 60 ℃ can be realized.

After the first semiconductor component 310 is turned on, a plurality of sets of hot spot elements are disposed in the first cooling end 311, so as to reduce the temperature, and a plurality of sets of hot spot elements are disposed in the first heating end 312, so as to increase the temperature. After the second semiconductor component 320 is turned on, the two ends can also respectively realize temperature reduction and temperature increase, wherein, a plurality of groups of hot spot elements are arranged in the second cooling end 321, so that the temperature reduction can be realized, and a plurality of groups of hot spot elements are also arranged in the second heating end 322, so that the temperature increase can be realized.

In some embodiments, the first semiconductor component 310 and the second semiconductor component 320 may cooperate with an indoor evaporator and an outdoor condenser of an air conditioner to pre-cool and pre-heat the evaporator inlet line and the condenser inlet line, respectively. As shown in fig. 1, one end of the first refrigerating end 311 is connected to the evaporator of the air conditioner indoor unit 100 through the indoor connection 110, the other end is connected to one end of the first heating end 312 through the first semiconductor component connection pipe 313, and the other end of the first heating end 312 is connected to the condenser of the air conditioner outdoor unit 200 through the outdoor connection 210.

One end of the second heating end 322 is connected with the evaporator of the air conditioner indoor unit 100 through the indoor connecting piece 110, the other end is connected with one end of the second cooling end 321 through the second semiconductor component connecting pipe 323, and the other end of the second cooling end 321 is connected with the condenser of the air conditioner outdoor unit 200 through the outdoor connecting piece 210.

It can be seen that the first semiconductor component and the second semiconductor component are arranged at opposite ends, and opposite temperature changes can be realized after the operation is started. When the refrigerating device is used for refrigerating, the first semiconductor component is started, so that the inlet pipeline of the evaporator in the air conditioner inner unit can be precooled, and the inlet pipeline of the condenser in the air conditioner outer unit can be preheated, so that indoor pre-cooling measurement and outdoor side preheating are realized; when heating, the second semiconductor component is started, an evaporator inlet pipeline in the air conditioner inner unit can be preheated, and a condenser inlet pipeline in the air conditioner outer unit is precooled, so that indoor preheating and outdoor precooling are realized, indoor refrigerating capacity can be improved at an external high temperature, indoor heating capacity is improved at an external low temperature, and the refrigerating and heating requirements under severe working conditions are met.

In some embodiments, exhaust fans for enhancing air circulation can be arranged at two ends of the two groups of semiconductor components, so that heat exchange between the two ends of the semiconductor components and indoor/outdoor sides can be enhanced, and compensation of refrigerating capacity/heating capacity of the system is realized. As shown in fig. 1, the air conditioner may further include: four exhaust fans; wherein, the first exhaust fan is located 410 on the first refrigeration side 311, the second exhaust fan 420 is located on the first heating side 312, the third exhaust fan 430 is located on the second heating side 322, and the fourth exhaust fan 440 is located on the second refrigeration side 321.

Of course, in some embodiments, the air conditioner may also have only one, two or three exhaust fans, and may be located at any end of any semiconductor component.

After the air conditioner is provided with two groups of semiconductor components or two groups of semiconductor components and the exhaust fans corresponding to the semiconductor components, the refrigerating capacity or heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor components, so that the refrigerating and heating requirements under severe working conditions are met, and the refrigerating and heating efficiency of the air conditioner is also improved.

In the embodiment of the disclosure, when the air conditioner starts the current working mode to run and reaches the set starting time and the air conditioner compressor keeps running at high frequency, the running parameters and states of the air conditioner compressor and the semiconductor components can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value and the average outdoor temperature value, namely, the indoor temperature and the target temperature value are far apart, and when the outdoor working condition is severe, the semiconductor components can be started to supply supplementary cold or heat to the system after the air conditioner runs at high frequency for a long time, so that the power of the air conditioner is flexibly controlled, and the refrigerating capacity or the heating capacity of the air conditioner is improved by controlling the running of the semiconductor components, so that the refrigerating and heating efficiency is improved and the power consumption of the air conditioner is reduced.

Fig. 2 is a schematic flow chart of a method for controlling an air conditioner according to an embodiment of the present disclosure. The air conditioner can be configured with two groups of semiconductor components or two groups of semiconductor components and corresponding exhaust fans. As shown in fig. 2, the process for air conditioning control includes:

step 2001: when the running time of the air conditioner running in the current working mode reaches the set starting time, if the average running frequency of the air conditioner compressor is larger than the first set frequency in the set starting time, acquiring a first average indoor temperature value and a first average outdoor temperature value which are in the current working mode and run the air conditioner in the first set duration, and acquiring a first absolute average temperature difference value between the first average indoor temperature value and the target indoor temperature value.

In the embodiment of the disclosure, the air conditioner is started to operate in the current working mode, and at this time, vapor compression type operation can be adopted, namely, the operation of the air conditioner compressor is controlled according to the collected indoor and outdoor temperature values. The current operating mode may include: cooling, heating, dehumidifying and the like. If the outdoor working condition is bad, namely the outdoor temperature is too high or too low, the running frequency of the air conditioner compressor is high when the air conditioner runs in the current working mode. If the air conditioner operates in the current working mode for a period of time, and the operating frequency of the air conditioner compressor is always higher in the period of time, the condition that the air conditioner is in a severe environment working condition is indicated, the corresponding semiconductor components are required to be started for operation, and the refrigerating capacity or heating capacity required by the air conditioner is supplemented, so that the indoor temperature value regulated by the air conditioner can quickly reach the target temperature value.

It can be seen that a set start time can be preset, and the working state of the air conditioner is relatively stable after the air conditioner reaches the set start time after the air conditioner is started and operated, so that the set start time can be determined according to the performance parameters of the air conditioner, and can be 15, 20, 25, 30min and the like. The first set frequency may also be preconfigured, and may be 70%, 80%, 90% of the highest frequency of the air conditioner compressor, and so on.

If the running time of the air conditioner in the current working mode reaches the set starting time, for example: and running for 20min, wherein the air conditioner is in a stable running state, and if the average running frequency of the air conditioner compressor is larger than the first set frequency within the set starting time, the air conditioner compressor is always in high-frequency running, and at the moment, the air conditioner possibly needs to start semiconductor components to perform auxiliary refrigeration or heating operation. Therefore, the first average indoor temperature value and the first average outdoor temperature value of the air conditioner in the current working mode in the first set time period can be obtained, and the first absolute average temperature difference value between the first average indoor temperature value and the target indoor temperature value is obtained.

In the embodiment of the disclosure, an area where an air conditioner is located may be configured with an indoor temperature acquisition device, and an outdoor temperature acquisition device is also configured in an outdoor area of the air conditioner, so that after the air conditioner reaches a set start time, a first average indoor temperature value Trp1 and a first average outdoor temperature value Taop1 can be obtained by recording an indoor temperature value and an outdoor temperature value acquired by the indoor temperature acquisition device and the outdoor temperature acquisition device and then according to the recorded indoor temperature value and the outdoor temperature value and the set time. Wherein the set time period can be 1min, 5min, 10min, 15min, etc.

The first average indoor temperature value Trp1 is obtained, and a first absolute average temperature difference value |trp1-tset| between the first average indoor temperature value Trp1 and the target indoor temperature value Tset is obtained.

Step 2002: determining a first operating frequency of the air conditioner compressor that matches the first absolute average temperature difference and a first operating state of the current semiconductor component, wherein the current semiconductor component matches the current operating mode.

Generally, when an air conditioner is operated in modes of cooling, heating, dehumidifying and the like, the larger the first absolute average temperature difference value is, the larger the required cooling capacity or heating capacity is, and at this time, the semiconductor components need to be started to operate. And when the first absolute average temperature difference value is smaller, the air conditioner compressor can be kept running in the existing state.

Because the first refrigerating end of the first semiconductor component is connected with the air conditioner indoor unit, the first heating end of the first semiconductor component is connected with the air conditioner outdoor unit, and thus, after the first semiconductor component starts to operate, indoor pre-cooling and outdoor side preheating can be realized; the second refrigerating end of the second semiconductor component is connected with the air conditioner external unit, and the second heating end of the second semiconductor component is connected with the air conditioner internal unit, so that after the second semiconductor component starts to operate, the indoor preheating measurement and the outdoor precooling can be realized.

It can be seen that the current semiconductor component matched with the current operation mode can be determined according to the connection relation of the first semiconductor component and the second semiconductor component. When the current working mode is a refrigeration mode, the current semiconductor component is a first semiconductor component; when the front working mode is a heating mode, the front semiconductor component is a second semiconductor component.

Accordingly, in some embodiments, determining a first operating frequency of the air conditioning compressor that matches the first absolute average temperature difference, and the current first operating state of the semiconductor component includes: under the condition that the first absolute average temperature difference value is smaller than a second set temperature value, determining the acquired operating frequency of the air conditioner compressor as a first operating frequency, and determining a shutdown state as a first operating state of the current semiconductor component; and determining the starting operation state as the first operation state of the current semiconductor component under the condition that the first absolute average temperature difference value is larger than or equal to the second set temperature value.

The second set temperature value may be 3.5 ℃, 4.5 ℃, 5 ℃, 5.5 ℃, etc. Thus, when the air conditioner starts to run and reaches the set starting time, if the first absolute average temperature difference is greater than or equal to the second set temperature value, for example: when the first absolute average temperature difference value (Trp 1-Tset) is equal to or greater than 5.5 ℃, the indoor temperature is relatively high, and at the moment, the corresponding current semiconductor component is required to be started for operation, so that the first operation state of the current semiconductor component can be determined to be the starting operation state. If the first absolute average temperature difference is smaller than the second set temperature value, the current semiconductor component is not required to be started to operate, and the operation of the air conditioner compressor is maintained, so that the acquired operation frequency of the air conditioner compressor can be determined to be the first operation frequency, the continuous operation of the air conditioner compressor is maintained, and the closed and stopped state is determined to be the first operation state of the current semiconductor component.

For example, in the case of the air conditioner cooling mode operation, if the first absolute average temperature difference is greater than or equal to the second set temperature value, for example, when the value of the first absolute average temperature difference is equal to or greater than the second set temperature value, i.e., -Trp 1-Tset ∈1 ∈5 ℃, the first operation state of the first semiconductor component is determined to be the start-up operation state, so that after the first semiconductor component is started to operate, the evaporator inlet pipeline in the air conditioner inner unit can be precooled, and the condenser inlet pipeline in the air conditioner outer unit is preheated, thereby improving the cooling capacity of the air conditioner, and improving the cooling efficiency of the air conditioner. And under the condition of air conditioner heating mode operation, if the first absolute average temperature difference value is greater than or equal to the second set temperature value, for example, when the temperature-Trp 1-Tset I is more than or equal to 5 ℃, the first operation state of the second semiconductor component can be determined to be the starting operation state, so that after the second semiconductor component is started to operate, the evaporator inlet pipeline in the air conditioner inner unit can be preheated, and the condenser inlet pipeline in the air conditioner outer unit can be precooled, thereby improving the heating capacity of the air conditioner, and further improving the heating efficiency of the air conditioner.

Step 2003: and controlling the air conditioner compressor to operate at a first operating frequency, and controlling the current semiconductor component to operate at a first operating state according to the first average outdoor temperature value.

After the first operating frequency of the air conditioner compressor and the first operating state of the current semiconductor component are determined, the air conditioner compressor can be controlled to operate at the first operating frequency, and the current semiconductor component is controlled to operate at the first operating state.

When the first absolute average temperature difference value is larger than or equal to the second set temperature value, the semiconductor components can be controlled to be in a starting operation state all the time, however, the semiconductor components are limited by materials, the reliability of the components can be reduced due to long-term continuous operation, and the power consumption of the air conditioner can be increased due to long-term operation of the semiconductor. Therefore, when the first absolute average temperature difference is greater than or equal to the second set temperature value, the time of the current semiconductor component in the air conditioner in the starting operation state can be 5, 8, 10, 15min or the like.

Alternatively, in some embodiments, the semiconductor component does not continue to operate for a long period of time, the operation period may be set to be a unit operation, and the semiconductor component is operated for a period of time during the set operation period, and the semiconductor component is stopped for the remaining period of time, i.e., the set operation period includes: run time and stop time. For example: the set operation period can be 20min, so that the semiconductor component can be operated according to the mode of stopping for 10min after 10min in the periodic operation process, and at the moment, the operation time and the stop time are both 10min. Or, the set operation period may be 30min, so that the semiconductor component may be operated in a mode of stopping for 10min after 20min in the periodic operation process, and the operation time is 20min and the stop time is 10min.

Thus, in the present embodiment, controlling the current semiconductor component to operate in the first operating state may include: the current semiconductor component matched with the current operation mode is controlled to operate for one period in the first operation state. The method specifically comprises the following steps: controlling the current semiconductor component to be in a starting operation state in the operation time of the set operation period of the semiconductor component under the condition that the first absolute average temperature difference value is larger than or equal to the second set temperature value; and controlling the current semiconductor component to be in a closing and stopping state in the stopping time of the set running period of the semiconductor component. For example: when Trp1-Tset I is not less than 4.5 ℃, the current semiconductor component is controlled to be in a starting operation state only within 10min of the set operation period of the semiconductor component within 20min, and then the current semiconductor component can be controlled to be in a closing and stopping state. The current semiconductor components can be turned off after being started to operate for 10min, so that the refrigerating capacity or heating capacity of the air conditioner is improved by controlling the operation of the semiconductor components, the refrigerating and heating efficiency is improved, and the power consumption of the air conditioner is reduced.

Of course, in some embodiments, the semiconductor may perform periodic operation, but the current semiconductor component may not be periodically controlled, that is, the time of the air conditioner in the start-up operation state of the current semiconductor component may not be the operation time of the set operation period, which is not specifically exemplified.

In the embodiment of the disclosure, the power of the semiconductor component is adjustable, and the corresponding output cold or heat is different, so that the semiconductor component can output different cold or heat according to different control input currents under the same control input voltage. In some embodiments, the semiconductor components correspond to two or more operating ranges, and the greater the control input current to the semiconductor components, the higher the corresponding operating range, and the more output energy. For example: the control input voltage is 220V, and the control input currents are 0.5A, 1A and 1.5A respectively, so that the semiconductor component corresponds to three gears of low, medium and high. Of course, the semiconductor component may correspond to only two low and high gears, and so on.

It can be seen that in some embodiments, when the current semiconductor component is in the start-up operating state, different operating gears may be corresponding, and thus controlling the current semiconductor component to operate in the first operating state includes: determining a first operating gear of the current semiconductor component corresponding to the first average outdoor temperature value when the first average temperature difference is greater than or equal to the second set temperature value; and controlling the current semiconductor component to operate in the first operation gear within the operation time of the set operation period of the semiconductor component. The semiconductor component corresponds to two or more operation gears, and the larger the control input current of the semiconductor component is, the higher the corresponding operation gears are. Of course, the current semiconductor component can be controlled to be in a closed and stopped state within the stop time of the set operation period of the semiconductor component.

Wherein determining a first operating gear of the current semiconductor component corresponding to the first average outdoor temperature value comprises: determining a first gear as a first running gear of the current semiconductor component under the condition that the first average outdoor temperature value is in a first mode temperature range matched with the current working mode; determining a second gear as a first running gear of the current semiconductor component under the condition that the first average outdoor temperature value is in a second mode temperature range matched with the current working mode; and determining the third gear as the first operation gear of the current semiconductor component under the condition that the first average outdoor temperature value is in a third mode temperature range matched with the current operation mode.

The current working modes of the air conditioner are different, the corresponding first mode temperature range, the corresponding second mode temperature range and the corresponding third mode temperature range are different, the control input current of the semiconductor component corresponding to the third gear is larger than the control input current of the semiconductor component corresponding to the second gear, and the control input current of the semiconductor component corresponding to the second gear is larger than the control input current of the semiconductor component corresponding to the first gear.

For example: the current mode of operation is a cooling mode, the first mode temperature range may be [40, 43), the second mode temperature range may be [43, 45) and the third mode temperature range may be [45, ++). Thus, when the first average outdoor temperature value Taop1 is less than or equal to 40 ℃ and is less than 43 ℃, the first gear can be determined to be the first operation gear of the current semiconductor component; when the temperature of Taop1 is less than or equal to 43 ℃ and less than 45 ℃, the second gear can be determined to be the first operation gear of the current semiconductor component; and when the temperature is less than or equal to Taop1 and the temperature is less than or equal to 45 ℃, the third gear can be determined to be the first operation gear of the current semiconductor component.

The current working mode is a heating mode, the first mode temperature range can be (-7, 0), the second mode temperature range can be (-14, -7), and the third mode temperature range can be (+ -14), so that when the temperature of-7 ℃ is less than or equal to 0 ℃, the first gear can be determined to be the first operation gear of the current semiconductor component, when the temperature of-14 ℃ is less than or equal to 7 ℃, the second gear can be determined to be the first operation gear of the current semiconductor component, and when the temperature of the Tao p1 is less than or equal to 14 ℃, the third gear can be determined to be the first operation gear of the current semiconductor component.

Of course, the semiconductor components correspond to two, four, five, etc. operating gears, and the corresponding first operating gear of the current semiconductor component may also be determined according to the first average outdoor temperature value, which will not be described in detail.

The first operating gear of the current semiconductor component is determined, so that the current semiconductor component can be controlled to operate in the first operating gear, or the current semiconductor component can be controlled to operate in the first operating gear within a set time period. In some embodiments, the current semiconductor component may be controlled to operate in the first operating range during an operating time of a set operating cycle of the semiconductor component.

Therefore, in the embodiment of the disclosure, when the air conditioner starts the current working mode to run to reach the set starting time and the air conditioner compressor keeps running at high frequency, the running parameters and states of the air conditioner compressor and the semiconductor components can be adjusted according to the absolute average temperature difference value between the average indoor temperature value and the target indoor temperature value and the average outdoor temperature value, namely, the indoor temperature is far away from the target temperature value, and when the outdoor working condition is bad, the semiconductor components can be started to supply supplementary cold or heat to the system after the air conditioner runs at high frequency for a long time, so that the power of the air conditioner is flexibly controlled, the refrigerating capacity or the heating capacity of the air conditioner is improved by controlling the running of the semiconductor components, the refrigerating and heating efficiency is improved, and the power consumption of the air conditioner is reduced. And different first average outdoor temperature values correspond to different running gears of the semiconductor components, namely, correspond to different output energies of the semiconductor components, so that the refrigerating or heating efficiency of the air conditioner is further improved.

When the running time of the air conditioner running in the current working mode reaches the set starting time and the running time of the set running period of the semiconductor component is controlled to run in the first running gear, the air conditioner can be continuously controlled to run in the vapor compression mode, and the semiconductor component is not controlled to run any more. However, in order to improve the temperature adjustment efficiency of the air conditioner, in some embodiments, after controlling the current semiconductor component to operate in the first operation gear, the operation of the current semiconductor component may be further controlled according to the obtained current average indoor temperature value in the current set duration, which may include: under the condition that the current semiconductor component is in a closed and stopped state and the duration time of the air conditioner in the current mode running state reaches the preset sampling duration time, acquiring a current average indoor temperature value in the current set duration time of the area where the air conditioner is located, and acquiring a current absolute average temperature difference value between the current average indoor temperature value and a target indoor temperature value; determining a current operating state of the current semiconductor component that matches the current absolute average temperature difference; and controlling the current semiconductor component to operate in the current operation state.

And controlling the current semiconductor component to be in a closed shutdown state after the current semiconductor component is controlled to run in a first running gear within the running time of the set running period of the semiconductor component, wherein the air conditioner is run in a current mode, the preset sampling time can be 5, 10, 15, 25 minutes and the like under the condition that the duration time of the running state of the air conditioner in the current mode reaches the preset sampling time, namely, the semiconductor component is not started to run all the time within the preset sampling time, is in the closed shutdown state, and the air conditioner is also run in the current working mode all the time, at the moment, the indoor temperature value can be continuously sampled, the indoor temperature value acquired by the indoor temperature acquisition device within the set time is recorded, and then the average indoor temperature value can be obtained according to the recorded indoor temperature value and the set time.

Of course, after the current semiconductor component is controlled to operate in the first operation gear by the air conditioner in the embodiment of the disclosure, automatic continuous control can be performed, so that the current set duration corresponds to the current average indoor temperature value. Similarly, the set duration may be 1 minute, 5 minutes, 10 minutes, 20 minutes, or the like, and in some embodiments, the current set duration may be zero, where the current average indoor temperature value is the real-time current indoor temperature value acquired by the indoor temperature acquisition device.

The current average indoor temperature value Trp is obtained, and the current absolute average temperature difference value |trp-tset| between the current average indoor temperature value Trp and the target indoor temperature value Tset is obtained.

Then, a current operating state of the current semiconductor component that matches the current absolute average temperature difference may be determined, which may include: determining the shutdown state as a current running state of the current semiconductor component when the current absolute average temperature difference value is smaller than a first set temperature value; determining the starting operation state as the current operation state of the current semiconductor component under the condition that the current absolute average temperature difference value is larger than or equal to a first set temperature value; wherein the second set temperature value is greater than or equal to the first set temperature value.

The first set temperature value may be determined according to a location where the air conditioner is located, performance of the air conditioner, etc., and may be 1.5 c, 2 c, 3 c, etc.

In the current control process, the current semiconductor component can be controlled to be in a closed and stopped state or a starting and running state. And when the current absolute average temperature difference value is larger than or equal to the first set temperature value, controlling the current semiconductor component to be in a starting operation state only in the operation time of the set operation period of the semiconductor component. And controlling the current semiconductor component to be in a closing and stopping state in the stopping time of the set running period of the semiconductor component.

Also, during continuous control of the semiconductor components, the power of the semiconductor components is adjustable, i.e., the semiconductor components correspond to two or more operating ranges. Thus, in some embodiments, different operating gears may be associated when the current semiconductor component is in the start-up operating state, and thus controlling the current semiconductor component to operate in the current operating state includes: determining a current running gear of the current semiconductor component corresponding to the current absolute average temperature difference value under the condition that the current absolute average temperature difference value is larger than or equal to a first set temperature value; and controlling the current semiconductor component to operate in the current operating gear within the operating time of the set operating period of the semiconductor component. The semiconductor component corresponds to two or more operation gears, and the larger the control input current of the semiconductor component is, the higher the corresponding operation gears are. Of course, the current semiconductor component can be controlled to be in a closed and stopped state within the stop time of the set operation period of the semiconductor component.

Wherein determining a current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference comprises: determining a previous operating gear of the current semiconductor component as the current operating gear of the current semiconductor component under the condition that the current absolute average temperature difference value is larger than or equal to the first set temperature value and smaller than the second set temperature value; and under the condition that the current absolute average temperature difference value is larger than or equal to the second set temperature value, if the previous operation gear is not the highest gear, performing upshift processing on the current semiconductor component, determining the increased operation gear as the current operation gear of the current semiconductor component, and if the previous operation gear is the highest gear, determining the highest gear as the current operation gear of the current semiconductor component.

After the current semiconductor component is controlled to operate in the first operation gear, the current semiconductor component is continuously controlled, so that when the semiconductor component is controlled according to the current absolute average temperature difference value, the previous operation gear of the current semiconductor component can be obtained, and the current operation gear of the current semiconductor component is determined according to the current absolute average temperature difference value and the previous operation gear.

For example: the first set temperature is 1.5 ℃, and the second set temperature is 4.5 ℃, so that the current semiconductor device can be controlled to be in a closed and stopped state if the temperature of Trp-Tset is less than 1.5 ℃. If the temperature of the-Trp-Tset-is more than or equal to 1.5 ℃, the current semiconductor component can be controlled to be in a starting operation state, and when the temperature of the-Trp-Tset-is less than or equal to 1.5 ℃ and is less than or equal to 4.5 ℃, the gear of the current semiconductor component can be maintained unchanged, namely the previous operation gear of the current semiconductor component is determined as the current operation gear of the current semiconductor component; if the temperature is not higher than 4.5 ℃ but not higher than Trp-Tset, upshift processing is needed, and the upshift operation gear is determined as the current operation gear of the current semiconductor component.

And if the previous running gear is not the highest gear, determining the raised running gear as the current running gear of the current semiconductor component after upshifting. If the highest gear of the previous operation gear is not increased, the highest gear is still determined as the current operation gear of the current semiconductor component.

Because the current semiconductor device is already at the highest gear, but the-Trp-Tset-is still relatively large, greater than or equal to the second set temperature value, in some embodiments, the air conditioner compressor may be controlled to operate at the highest frequency, thus continuing to increase the conditioning capacity of the air conditioner and further increasing the temperature conditioning efficiency.

The semiconductor components of the air conditioner may be provided with corresponding exhaust fans, the exhaust fans can strengthen air circulation, and heat exchange between two ends of the semiconductor components and indoor/outdoor sides is enhanced, so that compensation of refrigerating capacity/heating capacity of the system is realized. Therefore, in some embodiments, when the current semiconductor component is in the start-up operation state, the operation of the exhaust fan corresponding to the current semiconductor component can be controlled according to the current operation mode.

When the first semiconductor component is in a starting operation state, controlling a first exhaust fan and a second exhaust fan which are arranged on the first semiconductor component to operate; and controlling the third exhaust fan and the fourth exhaust fan which are arranged on the second semiconductor component to operate under the condition that the second semiconductor component is in a starting operation state. In the air conditioner, a first exhaust fan is positioned on a first refrigerating end, a second exhaust fan is positioned on a first heating end, a third exhaust fan is positioned on a second heating end, and a fourth exhaust fan is positioned on a second refrigerating end.

In some embodiments, when the current semiconductor component is in a shutdown state, the corresponding exhaust fan on the current semiconductor component is controlled to be turned off. Namely, under the condition that the first semiconductor component stops running, controlling a first exhaust fan and a second exhaust fan which are arranged on the first semiconductor component to stop running; and under the condition that the second semiconductor component stops operating, controlling a third exhaust fan and a fourth exhaust fan which are arranged on the second semiconductor component to stop operating.

And, under the condition that the semiconductor components of the air conditioner are in a closed and stopped state, the air conditioner can still adopt vapor compression refrigeration cycle to realize the regulation of indoor temperature.

Currently, air conditioners have a communication function, and thus, the air conditioner can also control the operation of semiconductor components according to received instructions. In some embodiments, under the condition that a semiconductor switching instruction sent by the configuration control Application (APP) terminal is received, the switching operation of semiconductor components in the air conditioner is controlled according to the semiconductor switching instruction. Like this, the switch of user accessible APP control semiconductor components has improved the intelligent and the user experience of air conditioner.

The following integrates the operational flow into a specific embodiment, illustrating the use of the disclosed embodiments for an air conditioning control process.

In this embodiment, as shown in fig. 1, the air conditioner may include two groups of semiconductor components and four exhaust fans. The first set temperature value stored in the air conditioner is 2 ℃, and the second set temperature value is 5 ℃. And, the semiconductor components correspond to 3 operation gears, and the output energy of third gear is greater than the output energy of second gear, and the output energy of second gear is greater than the output energy of first gear. The first set frequency is 80% of the highest frequency of the air conditioner compressor. In addition, the set starting time can be 20min, the set duration and the first set duration can be 10min, the set running period of the semiconductor component can be 20min, and the running time of the set running period is 10min; the set starting time can be the running time of the set running period and is also 10 minutes; the preset sampling duration may also be 10 minutes. The current operation mode of the air conditioner is a cooling mode, and the corresponding current semiconductor component is a first semiconductor component, so the corresponding first mode temperature range may be [40, 43), the second mode temperature range may be [43, 45), and the third mode temperature range may be [45, +_).

Fig. 3-1 and 3-2 are schematic flow diagrams of a method for controlling an air conditioner according to an embodiment of the disclosure. With reference to fig. 1 and fig. 3-1, 3-2, the process for air conditioning control includes:

step 3001: judging whether the running time of the air conditioner for starting the cooling operation reaches the set starting time for 20min? If yes, the start-up operation is completed, step 3002 is executed, otherwise, step 3001 is returned.

Step 3002: judging whether the average running frequency of the air conditioner compressor is greater than the first set frequency in the set starting time? If yes, go to step 3003, otherwise, the flow ends.

Step 3003: and recording an indoor temperature value and an outdoor temperature value of the air conditioner which are in a refrigerating mode within 10 minutes, obtaining a first average indoor temperature value Trp1 and a first average outdoor temperature value Tao1 within 10 minutes, and obtaining a first absolute average temperature difference value-Trp 1-Tset-I according to the first average indoor temperature value Trp1 and the target indoor temperature value Tset.

Step 3004: determining that I Trp1-Tset I.gtoreq.5 is true? If yes, go to step 3006, otherwise, go to step 3005.

Step 3005: and determining the acquired operating frequency of the air conditioner compressor as a first operating frequency, and controlling the air conditioner compressor to operate at the first operating frequency.

Step 3006: judging whether or not Taop1<43 ℃ is true at 40 ℃ or less? If yes, go to step 3007, otherwise, go to step 3008.

Step 3007: the starting operation state is determined as a first operation state of the first semiconductor component, and the first gear is determined as a first operation gear of the first semiconductor component. Proceed to step 3012.

Step 3008: judging whether or not Taop1<45 ℃ is true at 43? If yes, go to step 3009, otherwise, go to step 3010.

Step 3009: the starting operation state is determined as a first operation state of the first semiconductor component, and the second gear is determined as a first operation gear of the first semiconductor component. Proceed to step 3012.

Step 3010: judging whether Taop1 is true at 45 ℃ or less? If yes, go to step 3011, otherwise, the flow ends.

Step 3011: and determining the starting operation state as a first operation state of the first semiconductor component, and determining the third gear as the first operation gear of the first semiconductor component. Proceed to step 3012.

Step 3012: and controlling the first semiconductor component to operate in a first operation gear, and controlling the first exhaust fan on the first refrigerating end of the first semiconductor component to operate and the second exhaust fan on the first heating end to operate.

Step 3013: judging whether the operation time of the set operation cycle of the semiconductor component is reached for 10min? If yes, go to step 3014, otherwise, return to step 3012.

Step 3014: and controlling the first semiconductor component to be in a closed and stopped state, and controlling the first exhaust fan on the first refrigerating end of the first semiconductor component to be closed, and controlling the second exhaust fan on the first heating end to be closed. And saves the first operating gear as the previous operating gear.

Step 3015: judging whether the first semiconductor component is in a closed and stopped state and the duration of the air conditioner in a refrigerating mode running state is more than or equal to 10min? If yes, go to step 3016, otherwise, return to step 3015.

Step 3016: determining that the current absolute average temperature difference |trp-Tset | <2 is true? If yes, go to step 3017, otherwise, go to step 3018.

Step 3017: and controlling the first semiconductor component to be in a closed and stopped state, and controlling the first exhaust fan on the first refrigerating end of the first semiconductor component to be closed, and controlling the second exhaust fan on the first heating end to be closed.

Step 3018: judging whether <2 < is equal to or less than |Trp-Tset | <5 is true? If yes, go to step 3019, otherwise, go to step 3020.

Step 3019: and determining the previous operation gear of the first semiconductor component as the current operation gear of the first semiconductor component. Proceed to step 3022.

If the previous running gear is the third gear, the current running gear is still the third gear; if the previous running gear is the first gear, the current running gear is still the first gear.

Step 3020: is it determined that the previous operating gear of the first semiconductor device is the highest gear? If yes, go to step 3023, otherwise, go to step 3021.

Step 3021: and performing upshift processing on the previous operation gear, and determining the increased operation gear as the current operation gear of the first semiconductor component. Proceed to step 3022.

Step 3022: and controlling the first semiconductor component to operate in the current operation gear. Proceed to step 3025.

Step 3023: the highest gear is determined as the current operating gear of the first semiconductor component.

Step 3024: the first semiconductor component is controlled to operate at the highest gear and the air conditioner compressor is controlled to operate at the highest frequency. Proceed to step 3025.

Step 3025: when the running time of the set running period of the semiconductor components reaches 10min, the first semiconductor components are controlled to be in a closed and stopped state, and the first exhaust fan on the first refrigerating end of the first semiconductor components is controlled to be closed, and the second exhaust fan on the first heating end is controlled to be closed. And saving the current running gear as the previous running gear. Proceed to step 3015.

In this embodiment, two groups of semiconductor components are configured in the air conditioner, and when the air conditioner starts the operation in the refrigeration mode to reach the set starting time and the air conditioner compressor keeps high-frequency operation, the operation parameters and states of the air conditioner compressor and the first semiconductor component, namely, the indoor temperature and the target temperature are far different, can be adjusted according to the absolute average temperature difference value between the average indoor temperature value and the target indoor temperature value and the average outdoor temperature value, and when the outdoor working condition is bad, the first semiconductor component can be started to supply supplementary cold energy to the system after the compressor operates for a long time and at high frequency, so that the power of the air conditioner is flexibly controlled, the refrigeration capacity of the air conditioner is improved by controlling the operation of the first semiconductor component, the refrigeration efficiency is improved, and the power consumption of the air conditioner is reduced.

According to the above-described procedure for air conditioning control, an apparatus for air conditioning control can be constructed.

Fig. 4 is a schematic structural view of an air conditioner control device according to an embodiment of the present disclosure. The air conditioner comprises two groups of semiconductor components or comprises two groups of semiconductor components and corresponding exhaust fans. As shown in fig. 4, the control device for an air conditioner includes: a first acquisition module 4100, a determination module 4200, and a first control module 4300.

The first obtaining module 4100 is configured to obtain, when the running time of the air conditioner running in the current working mode reaches the set starting time and if the average running frequency of the air conditioner compressor is greater than the first set frequency in the set starting time, a first average indoor temperature value and a first average outdoor temperature value of the air conditioner running in the current working mode in a first set duration, and obtain a first absolute average temperature difference value between the first average indoor temperature value and the target indoor temperature value.

A first determination module 4200 configured to determine a first operating frequency of the air conditioner compressor that matches the first absolute average temperature difference and a first operating state of a current semiconductor component, wherein the current semiconductor component matches a current operating mode.

The first control module 4300 is configured to control the air conditioning compressor to operate at a first operating frequency and to control the current semiconductor component to operate in a first operating state according to a first average outdoor temperature value.

In some embodiments, the first determination module 4200 includes:

and the first determining unit is configured to determine the acquired operating frequency of the air conditioner compressor as a first operating frequency and determine the shutdown state as a first operating state of the current semiconductor component under the condition that the first absolute average temperature difference value is smaller than a second set temperature value.

And a second determining unit configured to determine the start-up operation state as the first operation state of the current semiconductor component in the case where the first absolute average temperature difference value is greater than or equal to the second set temperature value.

In some embodiments, the first control module 4300 includes:

and a first gear determining unit configured to determine a first operating gear of the current semiconductor component corresponding to the first average outdoor temperature value, in the case where the first average temperature difference value is greater than or equal to the second set temperature value.

The first control unit is configured to control the current semiconductor component to operate in a first operation gear in the operation time of the set operation period of the semiconductor component; and controlling the current semiconductor component to be in a closing and stopping state within the stopping time of the set running period of the semiconductor component.

The semiconductor component corresponds to two or more operation gears, and the larger the control input current of the semiconductor component is, the higher the corresponding operation gears are.

In some embodiments, the apparatus further comprises:

the second obtaining module is configured to obtain a current average indoor temperature value in a current set time length of an area where the air conditioner is located and obtain a current absolute average temperature difference value between the current average indoor temperature value and a target indoor temperature value when the current semiconductor component is in a closed and stopped state and the duration time of the air conditioner in a current mode running state reaches a preset sampling time length.

And a second determination module configured to determine a current operating state of the current semiconductor component that matches the current absolute average temperature difference.

And the second control module is configured to control the current semiconductor component to operate in the current operation state.

In some embodiments, the second control module includes:

and the second gear determining unit is configured to determine the current running gear of the current semiconductor component corresponding to the current absolute average temperature difference value under the condition that the current absolute average temperature difference value is larger than or equal to the first set temperature value.

The second control unit is configured to control the current semiconductor component to operate in the current operation gear in the operation time of the set operation period of the semiconductor component; and controlling the current semiconductor component to be in a closing and stopping state within the stopping time of the set running period of the semiconductor component.

Wherein the second set temperature value is greater than or equal to the first set temperature value.

In some embodiments, the second determining unit is specifically configured to determine the previous operating gear of the current semiconductor component as the current operating gear of the current semiconductor component when the current absolute average temperature difference is greater than or equal to the first set temperature value and less than the second set temperature value; if the current absolute average temperature difference value is larger than or equal to the second set temperature value, if the previous running gear is not the highest gear, upshifting the current semiconductor component, and determining the upshifted running gear as the current running gear of the current semiconductor component; and when the current absolute average temperature difference value is larger than or equal to the second set temperature value, determining the highest gear as the current running gear of the current semiconductor component if the previous running gear is the highest gear.

In some embodiments, the second control module further comprises: and the third control unit is configured to control the air conditioner compressor to operate at the highest frequency if the previous operating gear is the highest gear under the condition that the current absolute average temperature difference value is larger than or equal to the second set temperature value.

The following illustrates an air conditioning control process performed by the apparatus for air conditioning control provided in the embodiment of the present disclosure.

The air conditioner may include two sets of semiconductor components and four exhaust fans as shown in fig. 1. The first set temperature value stored in the air conditioner is 2.5 ℃, and the second set temperature value is 5.5 ℃. And, the semiconductor components correspond to 3 operation gears, and the output energy of third gear is greater than the output energy of second gear, and the output energy of second gear is greater than the output energy of first gear. And the first set frequency is 70% of the highest frequency of the air conditioner compressor. The set start time may be 20min, the set duration and the first set duration may be 12min, the set operation period of the semiconductor component may be 30min, and the operation time of the set operation period may be 15min; the set starting time can be the running time of the set running period and is also 15 minutes; the preset sampling duration may also be 18 minutes. The current operation mode of the air conditioner is a heating mode, the corresponding current semiconductor component is a second semiconductor component, the corresponding first mode temperature range can be (-7, 0), the second mode temperature range can be (-15, -7), and the third mode temperature range can be (++15 ].

Fig. 5 is a schematic structural view of an air conditioner control device according to an embodiment of the present disclosure. As shown in fig. 5, the control device for an air conditioner includes: a first acquisition module 4100, a first determination module 4200, a first control module 4300, a second acquisition module 4400, a second determination module 4500, and a second control module 4600, wherein the first determination module 4200 comprises: the first determining unit 4210 and the second determining unit 4220, the first control module 4300 includes: a first gear determination unit 4310 and a first control unit. The second control module 4600 includes: a second gear determining unit 4610, a second control unit 4620 and a third control unit 4630.

When the air conditioner is started to perform heating mode starting, if the air conditioner heating operation time reaches 20min and the average operation frequency of the air conditioner compressor is greater than the first set frequency within 20min, the first acquisition module 4100 can record the indoor temperature value and the outdoor temperature value of the air conditioner in the heating mode operation within 12min, obtain a first average indoor temperature value Trp1 and a first average outdoor temperature value Tao1 within 12min, and obtain a current absolute average temperature difference value I Trp1-Tset according to the current average indoor temperature value Trp1 and the target indoor temperature value Tset.

Thus, if l Trp1-Tset l <5.5 ℃, the first determining unit 4210 in the first determining module 4200 may determine the obtained operation frequency of the air conditioner compressor as the first operation frequency and the shutdown state as the first operation state of the second semiconductor device. Thus, the first control module 4300 may control the air conditioning compressor to perform heating operation at the first operating frequency, and control the second semiconductor component to be in a closed-off state, and control the third exhaust fan on the second heating end of the second semiconductor component to be closed, and the fourth exhaust fan on the second cooling end to be closed.

If Trp1-Tset I is equal to or greater than 5.5 ℃, the second determining unit 4220 in the first determining module 4200 may determine the start-up operation status as the first operation status of the second semiconductor device. And, if the minus 7 ℃ < Taop1 is less than or equal to 0 ℃, the first gear determining unit 4310 in the first control module 4300 may determine that the first gear is the first operation gear of the second semiconductor component. If 15 ℃ below zero < Taop1 ℃ below zero is less than or equal to 7 ℃ below zero, the first gear determining unit 4310 can determine that the second gear is the first operation gear of the second semiconductor component. If Taop1 is less than or equal to-7 ℃, the first gear determining unit 4310 can determine that the third gear is the first operation gear of the second semiconductor component. Thus, the first control unit 4320 in the first control module 4300 can control the second semiconductor component to operate in the first operating range and the third exhaust fan on the second heating side of the second semiconductor component to operate and the fourth exhaust fan on the second cooling side to operate.

When the operation time of the set operation cycle of the semiconductor components reaches 15min, the first control unit 4320 can control the second semiconductor components to be in a closed and stopped state, and control the third exhaust fan on the second heating end of the second semiconductor components to be closed, and the fourth exhaust fan on the second cooling end to be closed. And saves the first operating gear as the previous operating gear.

And after the second semiconductor component is controlled to operate in the first operation gear, the second semiconductor component can be continuously controlled. Under the condition that the second semiconductor component is in a closed and stopped state and the duration time of the air conditioner in the current mode running state reaches the preset sampling duration 18min, the second obtaining module 4400 obtains a current average indoor temperature value Trp within a current set duration 12min of an area where the air conditioner is located, and obtains a current absolute average temperature difference value l Trp-Tset l between the current average indoor temperature value and the target indoor temperature value.

And, at the temperature of |trp-tset| <2.5 ℃, the second determining module 4500 may determine the shutdown state as the current operation state of the second semiconductor device, so that the second controlling module 4600 may control the second semiconductor device to be in the shutdown state and the third exhaust fan on the second heating side of the second semiconductor device to be turned off and the fourth exhaust fan on the second cooling side to be turned off.

And if the value of Trp-Tset is equal to or greater than 2.5 ℃, the second determination module 4500 may determine the start-up operation state as the current operation state of the second semiconductor device, and, when the value of Trp-Tset is equal to or greater than 2.5 ℃ and the value of Trp-Tset is equal to or less than 5.5 ℃, the second gear determination unit 4610 of the second control module 4600 determines the previous operation gear of the second semiconductor device as the current operation gear of the second semiconductor device, that is, the second control unit 4620 in the second control module 4600 may control the second semiconductor device to operate in the current operating range, and control the third exhaust fan on the second heating side of the second semiconductor device to operate, and the fourth exhaust fan on the second cooling side to operate. When the operation time of the set operation cycle of the semiconductor components reaches 15min, the second control unit 4620 may control the second semiconductor components to be in a shutdown state, and control the third exhaust fan on the second heating end of the second semiconductor components to be turned off, and the fourth exhaust fan on the second cooling end to be turned off. And saving the current running gear as the previous running gear.

If the temperature is equal to or lower than the temperature of-Trp-Tset-and the temperature is lower than or equal to 5.5 ℃, the second gear determining unit 4610 in the second control module 4600 can perform upshift processing, namely, if the previous operation gear is not the highest gear, upshift processing is performed on the second semiconductor component, and the elevated operation gear is determined as the current operation gear of the second semiconductor component; and if the previous operating gear is the highest gear, determining the highest gear as the current operating gear of the second semiconductor component.

That is, the second control unit 4620 in the second control module 4600 may control the second semiconductor device to operate in the current operating range, and control the third exhaust fan on the second heating side of the second semiconductor device to operate, and the fourth exhaust fan on the second cooling side to operate. When the operation time of the set operation cycle of the semiconductor components reaches 15min, the second control unit 4620 may control the second semiconductor components to be in a shutdown state, and control the third exhaust fan on the second heating end of the second semiconductor components to be turned off, and the fourth exhaust fan on the second cooling end to be turned off. And saving the current running gear as the previous running gear.

And, in case that the current absolute average temperature difference is greater than or equal to the second set temperature value, the third control unit 4630 of the second control module 4600 may control the air conditioner compressor to operate at the highest frequency if the previous operating gear is the highest gear.

Therefore, when the air conditioner starts the heating mode to run to reach the set starting time, and the air conditioner compressor keeps high-frequency running, the running parameters and states of the air conditioner compressor and the second semiconductor components can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value and the average outdoor temperature value, namely, the indoor temperature and the target temperature value are far different, and when the outdoor working condition is bad, the second semiconductor components can be started to supply supplementary cold energy to the system after the press runs for a long time and at a high frequency, so that the power of the air conditioner is flexibly controlled, and the heating quantity of the air conditioner is improved by controlling the running of the second semiconductor components, the heating efficiency is improved, and the power consumption of the air conditioner is reduced.

An embodiment of the present disclosure provides an apparatus for controlling an air conditioner, having a structure as shown in fig. 6, including:

a processor (processor) 1000 and a memory (memory) 1001, and may also include a communication interface (Communication Interface) 1002 and a bus 1003. The processor 1000, the communication interface 1002, and the memory 1001 may communicate with each other via the bus 1003. The communication interface 1002 may be used for information transfer. The processor 1000 may call logic instructions in the memory 1001 to perform the method for air conditioning control of the above-described embodiment.

Further, the logic instructions in the memory 1001 described above may be implemented in the form of software functional units and may be stored in a computer readable storage medium when sold or used as a stand alone product.

The memory 1001 is used as a computer readable storage medium for storing a software program and a computer executable program, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 1000 performs functional applications and data processing by executing program instructions/modules stored in the memory 1001, i.e., implements the method for air conditioning control in the above-described method embodiment.

The memory 1001 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, at least one application program required for functions; the storage data area may store data created according to the use of the terminal air conditioner, etc. In addition, the memory 1001 may include a high-speed random access memory, and may also include a nonvolatile memory.

The embodiment of the disclosure provides an air conditioner control device, comprising: the air conditioner control system includes a processor and a memory storing program instructions, the processor being configured to execute a control method for the air conditioner when the program instructions are executed.

The embodiment of the disclosure provides an air conditioner, which comprises the air conditioner control device.

Embodiments of the present disclosure provide a computer-readable storage medium storing computer-executable instructions configured to perform the above-described method for controlling an air conditioner.

The disclosed embodiments provide a computer program product comprising a computer program stored on a computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the above-described method for air conditioning control.

The computer readable storage medium may be a transitory computer readable storage medium or a non-transitory computer readable storage medium.

The technical solution of the embodiments of the present disclosure may be embodied in the form of a software product stored in a storage medium, where the software product includes one or more instructions for causing a computer air conditioner (which may be a personal computer, a server, or a network air conditioner, etc.) to perform all or part of the steps of the methods described in the embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium including: a plurality of media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or a transitory storage medium.

The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may involve structural, logical, electrical, process, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The scope of the embodiments of the present disclosure encompasses the full ambit of the claims, as well as all available equivalents of the claims. When used in this application, although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without changing the meaning of the description, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first element and the second element are both elements, but may not be the same element. Moreover, the terminology used in the present application is for the purpose of describing embodiments only and is not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a," "an," and "the" (the) are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, when used in this application, the terms "comprises," "comprising," and/or "includes," and variations thereof, mean that the stated features, integers, steps, operations, elements, and/or components are present, but that the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof is not precluded. Without further limitation, an element defined by the phrase "comprising one …" does not exclude the presence of additional identical elements in a process, method or air conditioner comprising said element. In this context, each embodiment may be described with emphasis on the differences from the other embodiments, and the same similar parts between the various embodiments may be referred to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method sections disclosed in the embodiments, the description of the method sections may be referred to for relevance.

Those of skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. The skilled artisan may use different methods for each particular application to achieve the described functionality, but such implementation should not be considered to be beyond the scope of the embodiments of the present disclosure. It will be clearly understood by those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.

In the embodiments disclosed herein, the disclosed methods, articles of manufacture (including but not limited to devices, air conditioners, etc.) may be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative, and for example, the division of the units may be merely a logical function division, and there may be additional divisions when actually implemented, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. In addition, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form. The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to implement the present embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowcharts and block diagrams in the figures, operations or steps corresponding to different blocks may also occur in different orders than that disclosed in the description, and sometimes no specific order exists between different operations or steps. For example, two consecutive operations or steps may actually be performed substantially in parallel, they may sometimes be performed in reverse order, which may be dependent on the functions involved. Each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

Claims

1. A method for air conditioning control, wherein the air conditioner comprises two groups of semiconductor components, wherein a first heating end of a first semiconductor component is connected with an air conditioner internal unit, a first heating end of the first semiconductor component is connected with an air conditioner external unit, a second heating end of a second semiconductor component is connected with the air conditioner external unit, and a second heating end of the second semiconductor component is connected with the air conditioner internal unit, the method comprising:

2. The method of claim 1, wherein the current semiconductor component is the first semiconductor component when the current operating mode is a cooling mode; and when the current working mode is a heating mode, the current semiconductor component is the second semiconductor component.

3. The method of claim 1, wherein the determining a first operating frequency of the air conditioning compressor that matches the first absolute average temperature difference value, and a first operating state of a current semiconductor component comprises:

under the condition that the first absolute average temperature difference value is smaller than the second set temperature value, determining the acquired operating frequency of the air conditioner compressor as the first operating frequency, and determining a closing and stopping state as a first operating state of the current semiconductor component;

and determining the starting operation state as the first operation state of the current semiconductor component under the condition that the first absolute average temperature difference value is larger than or equal to a second set temperature value.

4. A method according to any of claims 1-3, wherein said controlling the current semiconductor component to operate in the first operational state comprises:

determining a first operating gear of the current semiconductor component corresponding to the first average outdoor temperature value when the first average temperature difference value is greater than or equal to the second set temperature value;

controlling the current semiconductor component to operate in the first operation gear within the operation time of the set operation period of the semiconductor component;

controlling the current semiconductor component to be in a closing and stopping state within the stopping time of the set running period of the semiconductor component;

5. The method of claim 4, wherein after said controlling the current semiconductor component to operate in said first operating range, further comprising:

acquiring a current average indoor temperature value in a current set time length of an area where the air conditioner is located and acquiring a current absolute average temperature difference value between the current average indoor temperature value and a target indoor temperature value under the condition that the current semiconductor component is in a closed and stopped state and the duration time of the air conditioner in a current mode running state reaches a preset sampling time length;

Determining a current operating state of the current semiconductor component that matches the current absolute average temperature difference;

and controlling the current semiconductor component to operate in the current operation state.

6. The method of claim 5, wherein said controlling the current semiconductor component to operate in the current operating state comprises:

determining a current running gear of the current semiconductor component corresponding to the current absolute average temperature difference value under the condition that the current absolute average temperature difference value is larger than or equal to a first set temperature value;

controlling the current semiconductor component to operate in the current operation gear within the operation time of the set operation period of the semiconductor component;

7. The method of claim 6, wherein determining a current operating range of the current semiconductor component corresponding to the current absolute average temperature difference comprises:

determining a previous operating gear of the current semiconductor component as the current operating gear of the current semiconductor component under the condition that the current absolute average temperature difference value is larger than or equal to a first set temperature value and smaller than a second set temperature value;

If the current absolute average temperature difference value is greater than or equal to a second set temperature value, if the previous operation gear is not the highest gear, performing upshift processing on the current semiconductor component, and determining the upshift operation gear as the current operation gear of the current semiconductor component; and if the previous operating gear is the highest gear, determining the highest gear as the current operating gear of the current semiconductor component.

8. The method as recited in claim 7, further comprising:

and under the condition that the current absolute average temperature difference value is larger than or equal to a second set temperature value, if the previous running gear is the highest gear, controlling the air conditioner compressor to run at the highest frequency.

9. An apparatus for controlling an air conditioner comprising two sets of semiconductor components, the apparatus comprising a processor and a memory storing program instructions, wherein the processor is configured, when executing the program instructions, to perform the method for controlling an air conditioner as claimed in any one of claims 1 to 8.

10. An air conditioner, comprising: the apparatus for air conditioner control as set forth in claim 9.

11. A storage medium storing program instructions which, when executed, perform the method for air conditioning control of any one of claims 1 to 8.