WO2023103401A1 - Control method and apparatus for air conditioner, and air conditioner and storage medium - Google Patents

Control method and apparatus for air conditioner, and air conditioner and storage medium Download PDF

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Publication number
WO2023103401A1
WO2023103401A1 PCT/CN2022/108081 CN2022108081W WO2023103401A1 WO 2023103401 A1 WO2023103401 A1 WO 2023103401A1 CN 2022108081 W CN2022108081 W CN 2022108081W WO 2023103401 A1 WO2023103401 A1 WO 2023103401A1
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WIPO (PCT)
Prior art keywords
air conditioner
temperature value
current
semiconductor component
defrosting
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PCT/CN2022/108081
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French (fr)
Chinese (zh)
Inventor
张正林
许文明
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青岛海尔空调器有限总公司
海尔智家股份有限公司
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Publication of WO2023103401A1 publication Critical patent/WO2023103401A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/30Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
    • F24F11/41Defrosting; Preventing freezing
    • F24F11/42Defrosting; Preventing freezing of outdoor units
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/50Control or safety arrangements characterised by user interfaces or communication
    • F24F11/61Control or safety arrangements characterised by user interfaces or communication using timers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/62Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63Electronic processing
    • F24F11/64Electronic processing using pre-stored data
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/62Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63Electronic processing
    • F24F11/65Electronic processing for selecting an operating mode
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/88Electrical aspects, e.g. circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F2110/00Control inputs relating to air properties
    • F24F2110/10Temperature
    • F24F2110/12Temperature of the outside air
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Definitions

  • the present application relates to the technical field of intelligent air conditioners, for example, to methods and devices for air conditioner control, air conditioners and storage media.
  • Air conditioners have been widely used as a common smart device for adjusting the temperature and humidity of indoor environments.
  • the air conditioner can use a vapor compression refrigeration cycle to adjust the indoor temperature, which has the advantage of high energy efficiency.
  • the air conditioner may have a problem of low cooling or heating capacity when cooling at high temperature or heating at low temperature.
  • two groups of semiconductor components can be added to the air conditioner, and each group of semiconductor components is connected to the air conditioner internal unit and the air conditioner external unit respectively.
  • the cooling operation of the air conditioner can control the operation of a group of semiconductor components.
  • the evaporator inlet pipeline of the air conditioner is precooled, and the condenser inlet pipeline of the air conditioner external unit is preheated, which improves the cooling capacity of the air conditioner; while the air conditioner is heating, it can control the operation of another group of semiconductor components.
  • the evaporator inlet pipeline in the air conditioner internal unit is preheated, while the condenser inlet pipeline in the air conditioner external unit is precooled, which improves the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions.
  • the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, which meets the cooling and heating needs under severe working conditions.
  • the external unit of the air conditioner is more prone to frost.
  • the air conditioner can automatically switch to the defrosting mode. And after the defrosting mode is finished, switch to the heating mode again. This defrosting process is still time-consuming, and the defrosting efficiency and defrosting effect need to be improved.
  • Embodiments of the present disclosure provide a method, device, air conditioner and storage medium for air conditioner control, so as to solve the technical problem that the defrosting efficiency of the air conditioner needs to be enhanced.
  • the air conditioner includes two groups of semiconductor components, wherein the first cooling terminal of the first semiconductor component is connected to the internal unit of the air conditioner, the first heating terminal of the first semiconductor component is connected to the external unit of the air conditioner, and the second semiconductor component is connected to the external unit of the air conditioner.
  • the second cooling terminal of the component is connected to the air conditioner external unit, and the second heating terminal of the second semiconductor component is connected to the air conditioner internal unit.
  • the method includes:
  • the air conditioner is controlled to operate in the current operation mode, and the first semiconductor component is controlled to start operation within the first time matching the current operation mode.
  • the device includes:
  • the first acquisition module is configured to acquire the current average outdoor temperature value and the current average defrosting temperature value within the current set time period of the air conditioner running in the heating mode;
  • a determining module configured to determine the current average outdoor temperature value and the average current defrosting temperature value corresponding to the current average defrosting temperature value in the case of determining that the The current operating mode of the air conditioner;
  • the first control module is configured to control the air conditioner to operate in a current operation mode, and control the first semiconductor component to start operation within a first time that matches the current operation mode.
  • the device for air conditioner control includes a processor and a memory storing program instructions, and the processor is configured to execute the above method for air conditioner control when executing the program instructions.
  • the air conditioner includes the above-mentioned device for air conditioner control.
  • the storage medium stores program instructions, and when the program instructions are executed, the above method for air conditioner control is executed.
  • the method, device, air conditioner, and storage medium for air conditioner control provided by the embodiments of the present disclosure can achieve the following technical effects:
  • Two sets of semiconductor components are configured in the air conditioner, so that when it is determined that the outdoor unit of the air conditioner is frosted, the operation of the first semiconductor component can be controlled within the first time that matches the heating mode or defrosting mode, In this way, in the first time, the indoor side precooling and the outdoor side preheating speed up the defrosting process of the outdoor unit of the air conditioner, and different defrosting temperature values correspond to different operating gears of the first semiconductor components, further improving the defrosting process. Efficiency of air conditioner defrosting.
  • Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure
  • Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure
  • Fig. 3-1 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure
  • Fig. 3-2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure
  • Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
  • Fig. 5 is a schematic structural diagram of an air-conditioning control device provided by an embodiment of the present disclosure
  • Fig. 6 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
  • A/B means: A or B.
  • a and/or B means: A or B, or, A and B, these three relationships.
  • each group of semiconductor components is respectively connected to the air conditioner internal unit and the air conditioner external unit.
  • the heat meets the cooling and heating needs under severe working conditions.
  • Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure.
  • the air conditioner includes: an air conditioner inner unit 100 , an air conditioner outer unit 200 and two groups of semiconductor components, namely a first semiconductor component 310 and a second semiconductor component 320 .
  • the first cooling terminal 311 of the first semiconductor component 310 is connected to the air conditioner indoor unit 100
  • the first heating terminal 312 of the first semiconductor component 310 is connected to the air conditioner external unit 200 .
  • the second cooling terminal 321 of the second semiconductor component 320 is connected to the air conditioner external unit 200 , and the second heating terminal 322 of the second semiconductor component 320 is connected to the air conditioner internal unit 100 .
  • the semiconductor component can use the thermoelectric effect of the semiconductor to connect two metals with different physical properties with a conductor and connect a direct current, so that the temperature at one end can be lowered and the temperature at the other end can be increased. It is often used in electronic components and micro heat exchange Cooling of the device. There are multiple sets of hotspot elements inside the semiconductor components, which can realize the cooling and heating effect of 40-50°C at the hot end, -10--20°C at the cold end, and a temperature difference of 60°C.
  • the two ends can also achieve temperature reduction and temperature rise respectively.
  • the first semiconductor component 310 and the second semiconductor component 320 can cooperate with the indoor evaporator and the outdoor condenser of the air conditioner to pre-cool and preheat the inlet pipeline of the evaporator and the inlet pipeline of the condenser respectively.
  • one end of the first cooling end 311 is connected to the evaporator of the air conditioner 100 through the indoor connector 110
  • the other end is connected to one end of the first heating end 312 through the first semiconductor component connecting pipe 313 .
  • the other end of the first heating end 312 is connected to the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
  • One end of the second heating end 322 is connected to the evaporator of the air conditioner 100 through the indoor connector 110, and the other end is connected to one end of the second cooling end 321 through the second semiconductor assembly connecting pipe 323, and the other end of the second cooling end 321 One end is connected with the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
  • the arrangement of the two ends of the first semiconductor component and the second semiconductor component is reversed, and opposite temperature changes can be realized after the start-up operation. That is, when cooling, if the first semiconductor component is turned on, the evaporator inlet pipeline in the air conditioner internal unit can be precooled, and the condenser inlet pipeline in the air conditioner external unit can be preheated, so as to realize indoor precooling and indoor cooling. External preheating; when heating, if the second semiconductor component is turned on, the evaporator inlet pipeline in the air conditioner internal unit can be preheated, and the condenser inlet pipeline in the air conditioner external unit can be precooled to realize indoor cooling. Side preheating and outdoor side precooling, so that the indoor cooling capacity can be increased when the external temperature is high, and the indoor heating capacity can be increased when the external temperature is low, meeting the cooling and heating requirements under severe working conditions.
  • both ends of the two groups of semiconductor components can be equipped with exhaust fans to enhance air circulation, which can strengthen the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side, so as to realize the cooling capacity/heating capacity of the system. compensate.
  • the air conditioner can also include: four exhaust fans; wherein, the first exhaust fan 410 is located on the first cooling end 311, the second exhaust fan 420 is located on the first heating end 312, and the third exhaust fan 420 is located on the first heating end 312.
  • the exhaust fan 430 is located on the second heating end 322 , and the fourth exhaust fan position 440 is located on the second cooling end 321 .
  • the air conditioner is equipped with two sets of semiconductor components, or after configuring two sets of semiconductor components and their corresponding exhaust fans, the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, which meets the requirements of severe working conditions. Cooling and heating demand under.
  • the semiconductor components can not only increase the cooling capacity or heating capacity of the air conditioner, but also improve the defrosting efficiency of the air conditioner during the defrosting process of the air conditioner.
  • Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure.
  • the air conditioner can be configured with two sets of semiconductor components, or equipped with two sets of semiconductor components and their corresponding exhaust fans.
  • the processes used for air conditioning control include:
  • Step 2001 Obtain the current average outdoor temperature value and the current average defrosting temperature value within the current set duration of the air conditioner running in the heating mode.
  • frost may occur on the outdoor unit of the air conditioner. For example, if the air conditioner is running in the heating mode for 15 minutes, 20 minutes, or 40 minutes, etc., frost may appear on the outdoor unit of the air conditioner.
  • the air-conditioning control in the embodiments of the present disclosure may be controlled once after the air-conditioning and heating operation or automatically and continuously. Therefore, the current set duration corresponds to the current average outdoor temperature value and the current average defrosting temperature value.
  • the set duration can be 10 minutes, 20 minutes, 25 minutes, 30 minutes and so on.
  • Step 2002 When it is determined that the current average outdoor temperature value and the average current defrosting temperature value respectively satisfy the corresponding setting conditions, determine the current operating mode of the air conditioner corresponding to the current average defrosting temperature value.
  • the outdoor unit demand of the air conditioner can be determined.
  • the defrosting is carried out, that is, the current average outdoor temperature value and the average current defrosting temperature value meet the corresponding setting conditions respectively.
  • the degree of frosting of the outdoor unit of the air conditioner may be determined according to the current average defrosting temperature value, and different degrees of frosting correspond to different operating modes of the air conditioner.
  • the heating mode is determined as the current operating mode of the air conditioner; when the current average outdoor temperature value is less than or equal to the first outdoor defrosting temperature value, if the current average defrosting temperature value When the temperature value is less than or equal to the third set outdoor defrosting temperature value, the defrosting mode is determined as the current operating mode of the air conditioner.
  • the first set outdoor defrosting temperature value can be 5°C, 3°C, 0°C, -2°C, etc.
  • the second set outdoor defrosting temperature value can be 0.5°C, 0.3°C, 0°C, -0.2°C, etc. etc.
  • the third set outdoor defrosting temperature value can be -2.5°C, -2.8°C, -3°C, -3.2°C and so on.
  • the first set outdoor defrosting temperature value, the second set outdoor defrosting temperature value, and the third set outdoor defrosting temperature value can be determined according to the geographical location of the air conditioner and the performance of the air conditioner.
  • the air conditioner may only be slightly frosted. At this time, the current operating mode of the air conditioner can be determined to be heating Mode, that is, the air conditioner does not switch the operating mode. However, when the current average outdoor temperature Taop ⁇ -2°C and the current average defrosting temperature Tcp ⁇ -3°C, the air conditioner may have been severely frosted, and the current operating mode of the air conditioner can be determined to be the defrosting mode Entered the default defrost mode of the air conditioner.
  • Step 2003 Control the air conditioner to run in the current operating mode, and control the first semiconductor component to start running within the first time that matches the current operating mode.
  • the air conditioner can be controlled to operate in heating mode or defrosting mode, and the first semiconductor component can be controlled to start operation during the operation of the air conditioner.
  • the first cooling terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first heating terminal of the first semiconductor component is connected to the external unit of the air conditioner, in this way, after the first semiconductor component starts running, the indoor forecasting can be realized. Cold and preheated outside.
  • the first cooling end of the first semiconductor component is connected to the evaporator of the air conditioner internal unit through the indoor connection piece, and the first heating end is connected to the condenser of the air conditioner external unit through the outdoor connection piece, thus, It can pre-cool the evaporator inlet pipeline in the air conditioner internal unit, and preheat the condenser inlet pipeline in the air conditioner external unit, thereby speeding up the defrosting process of the air conditioner external unit and improving the defrosting efficiency of the air conditioner .
  • different air conditioner operating modes correspond to different starting and operating times of the first semiconductor component.
  • the first semiconductor component when the current operating mode is the heating mode, can be controlled to start running within the operating time of the set operating cycle of the semiconductor component; while the current operating mode is defrosting In the case of the defrosting mode, the first semiconductor component is controlled to start running within the set defrosting time corresponding to the defrosting mode.
  • semiconductor components are limited by materials, and long-term continuous operation will lead to reduced reliability of components. Therefore, in some embodiments, semiconductor components can be set to run in units of operating cycles, and within the set operating cycle, within a period of time The semiconductor components are running, and the semiconductor components are down for the rest of the time. For example: set the operating cycle to be 20 minutes, so that during the periodic operation of semiconductor components, it can be operated in the manner of running for 10 minutes and then stopping for 10 minutes. Alternatively, the operating cycle can be set to 30 minutes. In this way, during the periodic operation of semiconductor components, it can be operated in the manner of running for 20 minutes and then stopping for 10 minutes, etc.
  • the first time matching the heating mode can be the operation time of the set operation cycle, for example: if the operation cycle is set for 10 minutes within 20 minutes, the first time can be controlled The semiconductor components start and run for 10 minutes. Alternatively, 20 minutes within the 30 minutes of the operation cycle is set, that is, the first semiconductor component is controlled to start and run for 20 minutes, and so on.
  • the first time to match the heating mode can also be preset, and can be set according to the defrosting efficiency and the power consumption of semiconductor components, for example: 10min, 12min, or 15min, etc. .
  • the air conditioner operates in cooling mode, and can automatically stop the defrosting mode operation according to the collected outdoor temperature value. Therefore, when the current operating mode is the defrosting mode, the first defrosting mode matching One time may be the running time of the defrosting mode, that is, the set defrosting time, so that the first semiconductor component is controlled to start running within the set defrosting time.
  • the operation of the first semiconductor component can be controlled within the first time that matches the heating mode or the defrosting mode.
  • the first The indoor side precooling and the outdoor side preheating within a certain period of time speed up the defrosting process of the outdoor unit of the air conditioner and improve the defrosting efficiency of the air conditioner.
  • the heating operation mode of the air conditioner will not be changed.
  • the user experience can be improved; and in the case of severe frost, the defrosting efficiency and defrosting effect of the air conditioner can be improved through the operation of the defrosting mode and the start-up operation of the first semiconductor component, and the user experience is further improved.
  • the power of semiconductor components is adjustable, and the corresponding output cooling or heat is also different. Therefore, under the same control input voltage, according to different control input currents, semiconductor components can output different cooling or heat.
  • the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component is, the higher the corresponding operating gear is, and the greater the output energy is.
  • the control input voltage is 220V
  • the control input current is 0.5A, 1A, and 1.5A respectively.
  • semiconductor components correspond to three gears of low, medium, and high. Of course, semiconductor components can also only correspond to low and high gears and so on.
  • the current operating gear of the first semiconductor component can be determined according to the current average defrosting temperature value no matter whether the air conditioner is in the heating mode or the defrosting mode position, and control the start-up operation of the first semiconductor component, which may specifically include: determining the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value; The first semiconductor component operates in the current operating gear.
  • determining the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value includes: when the current average defrosting temperature value is within the first temperature range In this case, the first gear is determined to be the current operating gear of the first semiconductor component; when the current average defrosting temperature value is within the second temperature range, the second gear is determined to be the current operating gear of the first semiconductor component.
  • the operating gear when the current average defrosting temperature value is within the third temperature range, determine the third gear as the current operating gear of the first semiconductor component.
  • the upper limit value of the first temperature range is equal to the second set outdoor defrosting temperature value
  • the lower limit value of the first temperature range is equal to the upper limit value of the second temperature range
  • the lower limit value of the second temperature range is equal to
  • the upper limit value of the third temperature range is equal
  • the lower limit value of the third temperature range is equal to the third set outdoor defrosting temperature value
  • the control input current of the semiconductor components corresponding to the third gear is greater than that corresponding to the second gear.
  • the control input current of the semiconductor components corresponding to the second gear is greater than the control input current of the semiconductor components corresponding to the first gear.
  • the second set outdoor defrosting temperature value is 0.3°C
  • the third set outdoor defrosting temperature value is -2.5°C
  • the first temperature range can be (-1,0.3]
  • the second temperature range can be (-2,-1]
  • the third temperature range can be (-2.5,-2].
  • the current average defrosting temperature value Tcp is within the first temperature range, that is, -1°C ⁇
  • the first gear can be determined as the current operating gear of the first semiconductor component
  • the second gear can be determined as the current operating gear of the first semiconductor component gear
  • the third gear can be determined as the current operating gear of the first semiconductor component.
  • determining the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value includes: when the current average defrosting temperature value is within the fourth temperature range In this case, the first gear is determined to be the current operating gear of the first semiconductor component; when the current average defrosting temperature value is within the fifth temperature range, the second gear is determined to be the current operating gear of the first semiconductor component.
  • the upper limit value of the fourth temperature range is equal to the third set outdoor defrosting temperature value
  • the lower limit value of the fourth temperature range is equal to the upper limit value of the fifth temperature range
  • the lower limit value of the fifth temperature range is equal to
  • the upper limit values of the sixth temperature range are equal; the control input current of the semiconductor components corresponding to the third gear is greater than the control input current of the semiconductor components corresponding to the second gear, and the control input current of the semiconductor components corresponding to the second gear The current is greater than the control input current of the semiconductor component corresponding to the first gear.
  • the third set outdoor defrosting temperature value is -3.5°C
  • the fourth temperature range can be (-5,-3.5]
  • the fifth temperature range can be (-7,- 5]
  • the sixth temperature range can be (- ⁇ ,-7].
  • the first gear can be determined position is the current operating gear of the first semiconductor component
  • the second gear can be determined as the current operating gear of the first semiconductor component
  • Tcp ⁇ -7°C The third gear can be determined as the current operating gear of the first semiconductor component.
  • the semiconductor components correspond to two, four, five, etc. operating gears, and the current operating gears of the corresponding first semiconductor components can be determined according to the current average defrosting temperature value, which will not be described in detail. .
  • the first semiconductor component can be controlled to run at the current operating gear within the first time that matches the current operating mode.
  • the air conditioner can be controlled to operate in heating mode, and it can be operated in 10min of the 20min set operation cycle of semiconductor components Within a certain period of time, a voltage of 220v and a current of 1A can be provided to the first semiconductor component to control the first semiconductor component to operate in the middle range.
  • the air conditioner can be controlled to run in defrost mode, and, within the start and end time of defrost mode operation, that is, the set defrost time, A voltage of 220v and a current of 1.5A can be provided to the first semiconductor component to control the operation of the first semiconductor component at a high level.
  • different current average defrosting temperature values correspond to different operating gears of the first semiconductor components, that is, correspond to different output energies of the semiconductor components, thereby further speeding up the defrosting efficiency of the air conditioner.
  • controlling the start-up operation of the first semiconductor component further includes: controlling the first exhaust fan on the first cooling end of the first semiconductor component Close; control the operation of the second exhaust fan on the first heating end of the first semiconductor component.
  • the embodiment of the present disclosure is defrosting during the air-conditioning and heating process. Therefore, when the first time matching the current operating mode is reached, the air-conditioning and heating mode is controlled to operate, and the first semiconductor component is controlled to stop operating. .
  • the air conditioner when the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the second set outdoor defrosting temperature value and greater than the third set
  • the outdoor defrosting temperature is reached, the air conditioner is always in the heating mode.
  • the semiconductor components consume energy during operation, and their reliability will be reduced if they run for a long time. Therefore, between arrival and current operation In case of the first time of pattern matching, the first semiconductor component can be controlled to stop running.
  • the first time is the 10-minute running time of the 20-minute set operation cycle of the semiconductor component, and then the first semiconductor component starts to run for 10 minutes, that is, it reaches the first time matching the current operation mode, thus, the control
  • the first semiconductor component stops operating, while the air conditioner is still operating in the heating mode.
  • the air conditioner While the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the third set outdoor defrosting temperature value, the air conditioner has automatically switched to the defrosting temperature value.
  • the frost mode is running, that is, the air conditioner is running, and within the set defrosting time corresponding to the defrosting mode, that is, the start and end time of the defrosting mode, the first semiconductor component starts to run, and the defrosting mode is over, reaching the At the first moment matching the current operating mode, not only the air conditioner is switched to the heating mode, but also the first semiconductor component needs to be controlled to stop operating.
  • the corresponding drain fan also needs to be turned off when the first semiconductor component is controlled to stop running.
  • the defrosting control in the air-conditioning and heating process in the embodiments of the present disclosure can be controlled once after the air-conditioning and heating operation or automatically and continuously. Therefore, in some embodiments, the current average outdoor temperature value and the current The average defrosting temperature value includes: when the first semiconductor component is in a stopped state, and the duration of the air conditioner in the heating mode operation state reaches the preset sampling time, record the current set time, and the air conditioner is in the heating mode.
  • the outdoor temperature value and defrosting temperature value according to the recorded outdoor temperature value and defrosting temperature value, the current average outdoor temperature value and the current average defrosting temperature value within the current set time period are obtained.
  • the preset sampling time can be 10, 15, 18, 20, 25 minutes, etc., in this way, within the preset sampling time, the first semiconductor component has not started to run, and the air conditioner has been running in the heating mode. , the temperature sampling and recording within the current set time period can be carried out, thus, the current average outdoor temperature value and the current average defrosting temperature value within the current set time period can be obtained, and then the temperature judgment and the corresponding defrosting temperature value can be continued. process.
  • the air conditioner has a communication function, so that the air conditioner can also control the operation of semiconductor components according to the received instructions.
  • the operation of the semiconductor component in the air conditioner is controlled according to the control instruction of the semiconductor component. In this way, users can control the operation of semiconductor components through the APP, which improves the intelligence and user experience of the air conditioner.
  • the operation process is integrated into a specific embodiment to illustrate the air-conditioning control process provided by the embodiment of the present disclosure.
  • the air conditioner may include two sets of semiconductor components and four exhaust fans as shown in FIG. 1 .
  • the first set outdoor defrosting temperature stored in the air conditioner is 5°C
  • the second set outdoor defrosting temperature is 0.5°C
  • the third set outdoor defrosting temperature is -3°C.
  • the semiconductor components correspond to three operating gears, the output energy of the third gear is greater than the output energy of the second gear, and the output energy of the second gear is greater than the output energy of the first gear.
  • the first temperature range may be (-1,0.5], the second temperature range may be (-2,-1], the third temperature range may be (-3,-2]; the fourth temperature range may be ( -5,-3], the fifth temperature range can be (-7,-5], and the sixth temperature range can be (- ⁇ ,-7].
  • the setting time can be 20min, and the setting operation cycle of semiconductor components It can also be 20 minutes, and the running time of the set running cycle is 10 minutes; and the preset sampling time can also be 20 minutes.
  • Fig. 3-1 and Fig. 3-2 are schematic flowcharts of a method for controlling an air conditioner provided by an embodiment of the present disclosure. Combining Figure 1 and Figure 3-1, Figure 3-2, the process for air conditioning control includes:
  • Step 3001 Determine if the first semiconductor component is in a stopped state, and whether the duration of the air conditioner in the heating mode is greater than or equal to 20 minutes? If yes, execute step 3002; otherwise, return to step 3001.
  • Step 3002 Record the outdoor temperature and defrost temperature of the air conditioner in heating mode within 20 minutes, and obtain the current average outdoor temperature and current average defrost temperature within 20 minutes.
  • Step 3003 Determine whether the current average outdoor temperature value Taop ⁇ 5°C holds true? If yes, execute step 3004, otherwise, return to step 3002.
  • Step 3004 Determine whether -1 ⁇ current average defrosting temperature value Tcp ⁇ 0.5 holds true? If yes, go to step 3005; otherwise, go to step 3006.
  • Step 3005 Determine the heating mode as the current operating mode of the air conditioner, and determine the first gear as the current operating gear of the first semiconductor component, and proceed to step 3016.
  • Step 3006 Determine whether -2 ⁇ Tcp ⁇ -1 holds true? If yes, go to step 3007; otherwise, go to step 3008.
  • Step 3007 Determine the heating mode as the current operating mode of the air conditioner, and determine the second gear as the current operating gear of the first semiconductor component, and proceed to step 3016.
  • Step 3008 Determine whether -3 ⁇ Tcp ⁇ -2 holds true? If yes, go to step 3009; otherwise, go to step 3010.
  • Step 3009 Determine the heating mode as the current operating mode of the air conditioner, and determine the third gear as the current operating gear of the first semiconductor component, and proceed to step 3016.
  • Step 3010 Determine whether -5 ⁇ Tcp ⁇ -3 holds true? If yes, go to step 3011; otherwise, go to step 3012.
  • Step 3011 Determine the defrosting mode as the current operating mode of the air conditioner, and determine the first gear as the current operating gear of the first semiconductor component, and proceed to step 3018.
  • Step 3012 Determine whether -7 ⁇ Tcp ⁇ -5 holds true? If yes, go to step 3013; otherwise, go to step 3014.
  • Step 3013 Determine the defrosting mode as the current operating mode of the air conditioner, and determine the second gear as the current operating gear of the first semiconductor component, and proceed to step 3018.
  • Step 3014 Determine whether Tcp ⁇ -7 is established? If yes, execute step 3015; otherwise, return to step 3002.
  • Step 3015 Determine the defrosting mode as the current operating mode of the air conditioner, and determine the third gear as the current operating gear of the first semiconductor component, and proceed to step 3018.
  • Step 3016 Control the operation of the air conditioner in the heating mode, and control the first semiconductor component to run at the current operating gear, and control the first exhaust fan on the first cooling end of the first semiconductor component to turn off, and the first heating end The second exhaust fan on the
  • Step 3017 Determine whether the running time of the set running cycle of the semiconductor component is 10 minutes? If yes, execute step 3020, otherwise, return to step 3016.
  • Step 3018 Control the defrosting mode of the air conditioner, and control the first semiconductor component to run at the current operating gear, and control the first exhaust fan on the first cooling end of the first semiconductor component to turn off, and the first heating end The second exhaust fan on the
  • Step 3019 Determine whether the set defrosting time corresponding to the defrosting mode has been reached? If yes, execute step 3020, otherwise, return to step 3018.
  • Step 3020 Control the operation of the air conditioner in the heating mode, control the first semiconductor component to stop running, and control the second drainage fan to close. Return to step 3001.
  • two sets of semiconductor components are configured in the air conditioner, so that when it is determined that the outdoor unit of the air conditioner is frosted, the air conditioner operating mode matching the average defrosting temperature value can be determined, and the first semiconductor The gear position of the components, so that the operation of the first semiconductor components can be controlled within the first time that matches the heating mode or the defrosting mode.
  • the indoor side precooling and the outdoor side preheating can be accelerated in the first time.
  • the defrosting process of the outdoor unit of the air conditioner is improved, and different average defrosting temperature values correspond to different operating gears of the first semiconductor component, thereby further improving the defrosting efficiency of the air conditioner.
  • an apparatus for air-conditioning control can be constructed.
  • Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
  • the air conditioner includes two sets of semiconductor components, or two sets of semiconductor components and their corresponding exhaust fans.
  • the air conditioner control device includes: a first acquisition module 4100 , a determination module 4200 and a first control module 4300 .
  • the first acquiring module 4100 is configured to acquire the current average outdoor temperature value and the current average defrosting temperature value within the current set duration of running the air conditioner in the heating mode.
  • the determining module 4200 is configured to determine the current operating mode of the air conditioner corresponding to the current average defrosting temperature value when it is determined that the current average outdoor temperature value and the average current defrosting temperature value respectively satisfy corresponding setting conditions.
  • the first control module 4300 is configured to control the air conditioner to operate in the current operation mode, and control the first semiconductor component to start operation within the first time matching the current operation mode.
  • determining module 4200 includes:
  • the first mode determining unit is configured to: if the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the second set outdoor defrosting temperature value , and is greater than the third set outdoor defrosting temperature value, the heating mode is determined as the current operating mode of the air conditioner.
  • the second mode determination unit is configured to: if the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the third set outdoor defrosting temperature value , the defrosting mode is determined as the current operating mode of the air conditioner.
  • the first control module 4300 includes:
  • the heating control unit is configured to control the first semiconductor component to start running within the running time of the set running cycle of the semiconductor component when the current running mode is the heating mode.
  • the defrosting control unit is configured to control the first semiconductor component to start running within the set defrosting time corresponding to the defrosting mode when the current operating mode is the defrosting mode.
  • the first control module 4300 is specifically configured to determine the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value; The first semiconductor component operates at the current operating gear; wherein, the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component is, the higher the corresponding operating gear is.
  • the first control module 4300 is further configured to control the closing of the first exhaust fan on the first cooling end of the first semiconductor component; The second exhaust fan operates.
  • it further includes: a second control module configured to control the first semiconductor component to stop running and control the air-conditioning and heating mode to run when the first time matching the current running mode is reached.
  • the first acquisition module 4100 is specifically configured to record the current setting when the first semiconductor component is in a stopped state and the duration of the air conditioner in the heating mode reaches the preset sampling time.
  • the outdoor temperature value and defrosting temperature value of the air conditioner in the heating mode during the time period; according to the recorded outdoor temperature value and defrosting temperature value, the current average outdoor temperature value and the current average defrosting temperature value within the current set time period are obtained .
  • the following is an example to illustrate the air-conditioning control process performed by the device for air-conditioning control provided by the embodiments of the present disclosure.
  • the air conditioner can be shown in Figure 1, including two sets of semiconductor components and four exhaust fans.
  • the first set outdoor defrosting temperature stored in the air conditioner is 3°C
  • the second set outdoor defrosting temperature is 0°C
  • the third set outdoor defrosting temperature is -3°C.
  • the semiconductor components correspond to two operating gears, and the output energy of the second gear is greater than that of the first gear.
  • the first temperature range may be (-1.5,0], the second temperature range may be (-3,--1.5]; the third temperature range may be (-6,-3], and the fourth temperature range may be (- ⁇ ,-6].
  • the set duration can be 15 minutes
  • the set operating cycle of semiconductor components can also be 20 min
  • the running time of the set operating cycle can be 10 min
  • the preset sampling time can also be 18 min.
  • Fig. 5 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
  • the air conditioner control device includes: a first acquisition module 4100, a determination module 4200, a first control module 4300, and a second control module 4400, and the determination module 4200 includes a first determination unit 4210 and a second determination unit 4200 Unit 4220 , the first control module 4300 includes: a heating control unit 4310 and a defrosting control unit 4320 .
  • the first acquisition module 4100 can record the outdoor temperature value and the defrosting temperature value of the air conditioner in the heating mode within 15 minutes , and get the current average outdoor temperature value and the current average defrosting temperature value within 15 minutes.
  • the first determining unit 4210 may determine the heating mode as the current operating mode of the air conditioner.
  • the heating control unit 4310 can control the operation of the air conditioner in the heating mode, and control the first semiconductor component to operate in the first gear within 10 minutes of the running time of the set operation cycle, and control the second The first exhaust fan on the first cooling end of a semiconductor component is turned off, and the second exhaust fan on the first heating end is running.
  • the heating control unit 4310 can control the air conditioner to run in the heating mode, and control the first semiconductor component to run in the second gear within 10 minutes of the running time of the set running cycle, and control The first exhaust fan on the first cooling end of the first semiconductor component is turned off, and the second exhaust fan on the first heating end is running.
  • the second determining unit 4220 may determine the defrosting mode as the current operating mode of the air conditioner. Moreover, when -6 ⁇ Tcp ⁇ 3, the defrost control unit 4320 can control the air conditioner to operate in the defrost mode, and control the first semiconductor component to operate in the first gear within the set defrost time corresponding to the defrost mode, and The first exhaust fan on the first cooling end of the first semiconductor component is controlled to be turned off, and the second exhaust fan on the first heating end is operated.
  • the defrosting control unit 4320 can control the air conditioner to operate in the defrosting mode, and control the first semiconductor component to operate in the second gear within the set defrosting time corresponding to the defrosting mode, and control the second gear to operate.
  • the first exhaust fan on the first cooling end of a semiconductor component is turned off, and the second exhaust fan on the first heating end is running.
  • the second control module 4400 may control the air conditioner to operate in the heating mode, and control the first semiconductor component to stop operating.
  • the second control module 4400 can also control the second drainage fan to be turned off.
  • two sets of semiconductor components are configured in the air conditioner, so that when it is determined that the outdoor unit of the air conditioner is frosted, the device for air conditioner control can determine the air conditioner to operate at an average defrosting temperature value. mode, and the gear of the first semiconductor component, so that the operation of the first semiconductor component can be controlled within the first time that matches the heating mode or defrosting mode, so that the interior of the room is precooled within the first time
  • An embodiment of the present disclosure provides a device for air conditioning control, the structure of which is shown in Figure 6, including:
  • a processor (processor) 1000 and a memory (memory) 1001 may also include a communication interface (Communication Interface) 1002 and a bus 1003. Wherein, the processor 1000 , the communication interface 1002 , and the memory 1001 can communicate with each other through the bus 1003 . Communication interface 1002 may be used for information transfer.
  • the processor 1000 can call the logic instructions in the memory 1001 to execute the method for air conditioner control in the above embodiments.
  • the above logic instructions in the memory 1001 may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as an independent product.
  • the memory 1001 can be used to store software programs and computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure.
  • the processor 1000 executes function applications and data processing by running program instructions/modules stored in the memory 1001 , that is, implements the method for air-conditioning control in the above method embodiments.
  • the memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required by a function; the data storage area may store data created according to the use of the terminal air conditioner, and the like.
  • the memory 1001 may include a high-speed random access memory, and may also include a non-volatile memory.
  • An embodiment of the present disclosure provides an air-conditioning control device, including: a processor and a memory storing program instructions, and the processor is configured to execute an air-conditioning control method when executing the program instructions.
  • An embodiment of the present disclosure provides an air conditioner, including the above-mentioned control device for an air conditioner.
  • An embodiment of the present disclosure provides a computer-readable storage medium, which stores computer-executable instructions, and the computer-executable instructions are configured to execute the above method for controlling an air conditioner.
  • An embodiment of the present disclosure provides a computer program product, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program includes program instructions, and when the program instructions are executed by a computer, the The computer executes the above method for air conditioning control.
  • the above-mentioned computer-readable storage medium may be a transitory computer-readable storage medium, or a non-transitory computer-readable storage medium.
  • the technical solutions of the embodiments of the present disclosure can be embodied in the form of software products.
  • the computer software products are stored in a storage medium and include one or more instructions to make a computer air conditioner (which can be a personal computer, a server, or a network air conditioner, etc.) execute all or part of the steps of the method described in the embodiments of the present disclosure.
  • the aforementioned storage medium can be a non-transitory storage medium, including: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc.
  • a first element could be called a second element, and likewise, a second element could be called a first element, as long as all occurrences of "first element” are renamed consistently and all occurrences of "Second component” can be renamed consistently.
  • the first element and the second element are both elements, but may not be the same element.
  • the terms used in this application are used to describe the embodiments only and are not used to limit the claims. As used in the examples and description of the claims, the singular forms "a”, “an” and “the” are intended to include the plural forms as well unless the context clearly indicates otherwise .
  • the term “and/or” as used in this application is meant to include any and all possible combinations of one or more of the associated listed ones.
  • the term “comprise” and its variants “comprises” and/or comprising (comprising) etc. refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these.
  • an element defined by the statement “comprising a " does not exclude the presence of additional identical elements in the process, method or condition comprising said element.
  • the disclosed methods and products can be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units may only be a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined Or it can be integrated into another system, or some features can be ignored, or not implemented.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
  • each functional unit in the embodiments of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
  • each block in a flowchart or block diagram may represent a module, program segment, or part of code that includes one or more Executable instructions.
  • the functions noted in the block may occur out of the order noted in the figures.
  • two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved.
  • the operations or steps corresponding to different blocks may also occur in a different order than that disclosed in the description, and sometimes there is no specific agreement between different operations or steps.
  • each block in the block diagrams and/or flowcharts, and combinations of blocks in the block diagrams and/or flowcharts can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by dedicated hardware implemented in combination with computer instructions.

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Abstract

A control method for an air conditioner. The air conditioner comprises two groups of semiconductor devices. The method comprises: acquiring the current average outdoor temperature and the current average defrosting temperature within the current set duration of an air conditioner, which is running in a heating mode; when it is determined that the current average outdoor temperature and the current average defrosting temperature respectively meet corresponding set conditions, determining a current running mode of the air conditioner that corresponds to the current average defrosting temperature; and controlling the air conditioner to run in the current running mode, and controlling, within a first period of time matching the current running mode, a first semiconductor device to start to run. In this way, the defrosting efficiency of an air conditioner is improved. Further disclosed are a control apparatus for an air conditioner, and an air conditioner and a storage medium.

Description

用于空调控制的方法、装置、空调及存储介质Method, device, air conditioner and storage medium for air conditioner control
本申请基于申请号为202111480589.6、申请日为2021年12月6日的中国专利申请提出,并要求该中国专利申请的优先权,该中国专利申请的全部内容在此引入本申请作为参考。This application is based on a Chinese patent application with application number 202111480589.6 and a filing date of December 6, 2021, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.
技术领域technical field
本申请涉及智能空调技术领域,例如涉及用于空调控制的方法、装置、空调及存储介质。The present application relates to the technical field of intelligent air conditioners, for example, to methods and devices for air conditioner control, air conditioners and storage media.
背景技术Background technique
空调作为一种常见调节室内环境温湿度的智能设备已被广泛应用。相关技术中,空调可采用蒸气压缩式制冷循环,来实现室内温度的调节,具有能效高的优点,但是,在高温制冷或低温制热时,空调可能会出现制冷量或制热量低的问题。Air conditioners have been widely used as a common smart device for adjusting the temperature and humidity of indoor environments. In the related art, the air conditioner can use a vapor compression refrigeration cycle to adjust the indoor temperature, which has the advantage of high energy efficiency. However, the air conditioner may have a problem of low cooling or heating capacity when cooling at high temperature or heating at low temperature.
目前,可在空调中增加了两组半导体元器件,每组半导体元器件分别与空调内机和空调外机连接,这样,空调制冷运行,可控制一组半导体元器件运行,对空调内机中的蒸发器入口管路进行预冷,而对空调外机中的冷凝器入口管路进行预热,提高了空调的制冷量;而空调制热运行,可控制另一组半导体元器件运行,对空调内机中的蒸发器入口管路进行预热,而对空调外机中的冷凝器入口管路进行预冷,提高了空调的制热量,满足了在恶劣工况下的制冷制热需求。At present, two groups of semiconductor components can be added to the air conditioner, and each group of semiconductor components is connected to the air conditioner internal unit and the air conditioner external unit respectively. In this way, the cooling operation of the air conditioner can control the operation of a group of semiconductor components. The evaporator inlet pipeline of the air conditioner is precooled, and the condenser inlet pipeline of the air conditioner external unit is preheated, which improves the cooling capacity of the air conditioner; while the air conditioner is heating, it can control the operation of another group of semiconductor components. The evaporator inlet pipeline in the air conditioner internal unit is preheated, while the condenser inlet pipeline in the air conditioner external unit is precooled, which improves the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions.
可见,空调配置了两组半导体元器件后,可通过控制半导体元器件的运行来提高空调的制冷量或制热量,满足了在恶劣工况下的制冷制热需求。但是,空调制热运行时,空调外机比较容易结霜,目前,可通过空调外机上的除霜温度传感器采集的除霜温度值小于设定值时,空调可自动切换到除霜模式运行,并在除霜模式运行结束后,再次切换到制热模式,这种除霜过程还比较耗时,除霜效率以及除霜效果还有待加强。It can be seen that after the air conditioner is equipped with two sets of semiconductor components, the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, which meets the cooling and heating needs under severe working conditions. However, when the air conditioner is in heating operation, the external unit of the air conditioner is more prone to frost. At present, when the defrosting temperature value collected by the defrosting temperature sensor on the external unit of the air conditioner is lower than the set value, the air conditioner can automatically switch to the defrosting mode. And after the defrosting mode is finished, switch to the heating mode again. This defrosting process is still time-consuming, and the defrosting efficiency and defrosting effect need to be improved.
发明内容Contents of the invention
为了对披露的实施例的一些方面有基本的理解,下面给出了简单的概括。所述概括不是泛泛评述,也不是要确定关键/重要组成元素或描绘这些实施例的保护范围,而是作为后面的详细说明的序言。In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. The summary is not intended to be an extensive overview nor to identify key/important elements or to delineate the scope of these embodiments, but rather serves as a prelude to the detailed description that follows.
本公开实施例提供了一种用于空调控制的方法、装置、空调和存储介质,以解决空调除霜效率有待加强的技术问题。所述空调包括两组半导体元器件,其中,第一半导体元器件的第一制冷端与空调内机连接,所述第一半导体元器件的第一制热端与空调外机连接,第二半导体元器件的第二制冷端与所述空调外机连接,所述第二半导体元器件的第二制热端与所述空调内机连接。Embodiments of the present disclosure provide a method, device, air conditioner and storage medium for air conditioner control, so as to solve the technical problem that the defrosting efficiency of the air conditioner needs to be enhanced. The air conditioner includes two groups of semiconductor components, wherein the first cooling terminal of the first semiconductor component is connected to the internal unit of the air conditioner, the first heating terminal of the first semiconductor component is connected to the external unit of the air conditioner, and the second semiconductor component is connected to the external unit of the air conditioner. The second cooling terminal of the component is connected to the air conditioner external unit, and the second heating terminal of the second semiconductor component is connected to the air conditioner internal unit.
在一些实施例中,所述方法包括:In some embodiments, the method includes:
获取处于制热模式运行空调当前设定时长内的当前平均室外温度值和当前平均除霜温度值;Obtain the current average outdoor temperature value and current average defrosting temperature value within the current set time of running the air conditioner in heating mode;
在确定所述当前平均室外温度值和所述平均当前除霜温度值分别满足对应的设定条件的情况下,确定与所述当前平均除霜温度值对应的所述空调的当前运行模式;When it is determined that the current average outdoor temperature value and the average current defrosting temperature value respectively satisfy corresponding setting conditions, determine the current operating mode of the air conditioner corresponding to the current average defrosting temperature value;
控制所述空调以当前运行模式进行运行,并在与所述当前运行模式匹配的第一时间内,控制所述 第一半导体元器件启动运行。The air conditioner is controlled to operate in the current operation mode, and the first semiconductor component is controlled to start operation within the first time matching the current operation mode.
在一些实施例中,所述装置包括:In some embodiments, the device includes:
第一获取模块,被配置为获取处于制热模式运行空调当前设定时长内的当前平均室外温度值和当前平均除霜温度值;The first acquisition module is configured to acquire the current average outdoor temperature value and the current average defrosting temperature value within the current set time period of the air conditioner running in the heating mode;
确定模块,被配置为在在确定所述当前平均室外温度值和所述平均当前除霜温度值分别满足对应的设定条件的情况下,确定与所述当前平均除霜温度值对应的所述空调的当前运行模式;A determining module configured to determine the current average outdoor temperature value and the average current defrosting temperature value corresponding to the current average defrosting temperature value in the case of determining that the The current operating mode of the air conditioner;
第一控制模块,被配置为控制所述空调以当前运行模式进行运行,并在与所述当前运行模式匹配的第一时间内,控制所述第一半导体元器件启动运行。The first control module is configured to control the air conditioner to operate in a current operation mode, and control the first semiconductor component to start operation within a first time that matches the current operation mode.
在一些实施例中,所述用于空调控制的装置,包括处理器和存储有程序指令的存储器,所述处理器被配置为在执行所述程序指令时,执行上述用于空调控制方法。In some embodiments, the device for air conditioner control includes a processor and a memory storing program instructions, and the processor is configured to execute the above method for air conditioner control when executing the program instructions.
在一些实施例中,所述空调,包括上述用于空调控制的装置。In some embodiments, the air conditioner includes the above-mentioned device for air conditioner control.
在一些实施例中,所述存储介质,存储有程序指令,所述程序指令在运行时,执行上述用于空调控制的方法。In some embodiments, the storage medium stores program instructions, and when the program instructions are executed, the above method for air conditioner control is executed.
本公开实施例提供的用于空调控制的方法、装置、空调和存储介质,可以实现以下技术效果:The method, device, air conditioner, and storage medium for air conditioner control provided by the embodiments of the present disclosure can achieve the following technical effects:
空调中配置了两组半导体元器件,这样,在确定空调的室外机有结霜的情况下,可在与制热模式或除霜模式匹配的第一时间内,控制第一半导体元器件运行,这样,第一时间内,室内侧预冷和室外侧预热,加快了空调室外机的除霜进程,并且,不同的除霜温度值,对应第一半导体元器件的不同运行档位,进一步提高了空调除霜的效率。Two sets of semiconductor components are configured in the air conditioner, so that when it is determined that the outdoor unit of the air conditioner is frosted, the operation of the first semiconductor component can be controlled within the first time that matches the heating mode or defrosting mode, In this way, in the first time, the indoor side precooling and the outdoor side preheating speed up the defrosting process of the outdoor unit of the air conditioner, and different defrosting temperature values correspond to different operating gears of the first semiconductor components, further improving the defrosting process. Efficiency of air conditioner defrosting.
以上的总体描述和下文中的描述仅是示例性和解释性的,不用于限制本申请。The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.
附图说明Description of drawings
一个或多个实施例通过与之对应的附图进行示例性说明,这些示例性说明和附图并不构成对实施例的限定,附图中具有相同参考数字标号的元件示为类似的元件,附图不构成比例限制,并且其中:One or more embodiments are exemplified by the corresponding drawings, and these exemplifications and drawings do not constitute a limitation to the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, The drawings are not limited to scale and in which:
图1是本公开实施例提供的一种空调的结构示意图;Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure;
图2是本公开实施例提供的一种用于空调控制方法的流程示意图;Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;
图3-1是本公开实施例提供的一种用于空调控制方法的流程示意图;Fig. 3-1 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;
图3-2是本公开实施例提供的一种用于空调控制方法的流程示意图;Fig. 3-2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;
图4是本公开实施例提供的一种用于空调控制装置的结构示意图;Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure;
图5是本公开实施例提供的一种用于空调控制装置的结构示意图;Fig. 5 is a schematic structural diagram of an air-conditioning control device provided by an embodiment of the present disclosure;
图6是本公开实施例提供的一种用于空调控制装置的结构示意图。Fig. 6 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
具体实施方式Detailed ways
为了能够更加详尽地了解本公开实施例的特点与技术内容,下面结合附图对本公开实施例的实现进行详细阐述,所附附图仅供参考说明之用,并非用来限定本公开实施例。在以下的技术描述中,为方便解释起见,通过多个细节以提供对所披露实施例的充分理解。然而,在没有这些细节的情况下,一个 或多个实施例仍然可以实施。在其它情况下,为简化附图,熟知的结构和装置可以简化展示。In order to understand the characteristics and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present disclosure. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.
本公开实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便这里描述的本公开实施例的实施例。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含。The terms "first", "second" and the like in the description and claims of the embodiments of the present disclosure and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the data so used may be interchanged under appropriate circumstances so as to facilitate the embodiments of the disclosed embodiments described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion.
除非另有说明,术语“多个”表示两个或两个以上。Unless stated otherwise, the term "plurality" means two or more.
本公开实施例中,字符“/”表示前后对象是一种“或”的关系。例如,A/B表示:A或B。In the embodiments of the present disclosure, the character "/" indicates that the preceding and following objects are an "or" relationship. For example, A/B means: A or B.
术语“和/或”是一种描述对象的关联关系,表示可以存在三种关系。例如,A和/或B,表示:A或B,或,A和B这三种关系。The term "and/or" is an associative relationship describing objects, indicating that there can be three relationships. For example, A and/or B means: A or B, or, A and B, these three relationships.
本公开实施例中,空调中增加了两组半导体元器件,每组半导体元器件分别与空调内机和空调外机连接,这样,可通过控制半导体元器件的运行来提高空调的制冷量或制热量,满足了在恶劣工况下的制冷制热需求。In the embodiment of the present disclosure, two groups of semiconductor components are added to the air conditioner, and each group of semiconductor components is respectively connected to the air conditioner internal unit and the air conditioner external unit. The heat meets the cooling and heating needs under severe working conditions.
图1是本公开实施例提供的一种空调的结构示意图。如图1所示,空调包括:空调内机100、空调外机200以及两组半导体元器件,分别是第一半导体元器件310和第二半导体元器件320。Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure. As shown in FIG. 1 , the air conditioner includes: an air conditioner inner unit 100 , an air conditioner outer unit 200 and two groups of semiconductor components, namely a first semiconductor component 310 and a second semiconductor component 320 .
第一半导体元器件310的第一制冷端311与空调内机100连接,第一半导体元器件310的第一制热端312与空调外机200连接。The first cooling terminal 311 of the first semiconductor component 310 is connected to the air conditioner indoor unit 100 , and the first heating terminal 312 of the first semiconductor component 310 is connected to the air conditioner external unit 200 .
第二半导体元器件320的第二制冷端321与空调外机200连接,第二半导体元器件320的第二制热端322与空调内机100连接。The second cooling terminal 321 of the second semiconductor component 320 is connected to the air conditioner external unit 200 , and the second heating terminal 322 of the second semiconductor component 320 is connected to the air conditioner internal unit 100 .
本公开实施例中,半导体元器件可利用半导体的热电效应,用导体连接两块不同物性不同的金属并接通直流电,可以实现一端温度降低、一端温度升高,常用于电子元件和微型换热器的冷却。半导体元器件内部存在多组热点元件,可以实现热端40~50℃,冷端-10~-20℃,温差60℃的制冷制热效果。In the embodiment of the present disclosure, the semiconductor component can use the thermoelectric effect of the semiconductor to connect two metals with different physical properties with a conductor and connect a direct current, so that the temperature at one end can be lowered and the temperature at the other end can be increased. It is often used in electronic components and micro heat exchange Cooling of the device. There are multiple sets of hotspot elements inside the semiconductor components, which can realize the cooling and heating effect of 40-50°C at the hot end, -10--20°C at the cold end, and a temperature difference of 60°C.
其中,第一半导体元器件310开启运行后,第一制冷端311中有多组热点元件,可实现温度降低,而第一制热端312中也有多组热点元件,但可实现温度升高。第二半导体元器件320开启运行后,两端也可分别实现温度降低和温度升高,其中,第二制冷端321中有多组热点元件,可实现温度降低,而第二制热端322中也多组热点元件,可实现温度升高。Wherein, after the first semiconductor component 310 is turned on and operated, there are multiple sets of hotspot elements in the first cooling end 311 to lower the temperature, and there are also multiple sets of hotspot elements in the first heating end 312 to increase the temperature. After the second semiconductor component 320 is turned on and running, the two ends can also achieve temperature reduction and temperature rise respectively. Among them, there are multiple groups of hotspot elements in the second cooling end 321, which can realize temperature reduction, while the second heating end 322 There are also multiple sets of hot spot elements to achieve temperature rise.
在一些实施例中,第一半导体元器件310,第二半导体元器件320可与空调室内蒸发器和室外冷凝器配合,分别对蒸发器入口管路和冷凝器入口管路进行预冷和预热。可如图1所示,第一制冷端311的一端通过室内连接件110与空调内机100的蒸发器连接,另一端通过第一半导体组件连接管313与第一制热端312的一端连接,第一制热端312的另一端通过室外连接件210与空调外机200的冷凝器连接。In some embodiments, the first semiconductor component 310 and the second semiconductor component 320 can cooperate with the indoor evaporator and the outdoor condenser of the air conditioner to pre-cool and preheat the inlet pipeline of the evaporator and the inlet pipeline of the condenser respectively. . As shown in FIG. 1 , one end of the first cooling end 311 is connected to the evaporator of the air conditioner 100 through the indoor connector 110 , and the other end is connected to one end of the first heating end 312 through the first semiconductor component connecting pipe 313 . The other end of the first heating end 312 is connected to the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
第二制热端322的一端通过室内连接件110与空调内机100的蒸发器连接,另一端通过第二半导体组件连接管323与第二制冷端321的一端连接,第二制冷端321的另一端通过室外连接件210与空调外机200的冷凝器连接。One end of the second heating end 322 is connected to the evaporator of the air conditioner 100 through the indoor connector 110, and the other end is connected to one end of the second cooling end 321 through the second semiconductor assembly connecting pipe 323, and the other end of the second cooling end 321 One end is connected with the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
可见,第一半导体元器件和第二半导体元器件的两端布置相反,开启运行后可以实现相反的温度变化。即制冷时,若开启第一半导体元器件,可以对空调内机中的蒸发器入口管路进行预冷,而对空调外机中的冷凝器入口管路进行预热,实现室内测预冷和室外侧预热;制热时,若开启第二半导体元器件, 可以对空调内机中的蒸发器入口管路进行预热,而对空调外机中的冷凝器入口管路进行预冷,实现室内侧预热和室外侧预冷,从而,可以在外界高温时提高室内制冷量,在外界低温时提高室内制热量,满足了在恶劣工况下的制冷制热需求。It can be seen that the arrangement of the two ends of the first semiconductor component and the second semiconductor component is reversed, and opposite temperature changes can be realized after the start-up operation. That is, when cooling, if the first semiconductor component is turned on, the evaporator inlet pipeline in the air conditioner internal unit can be precooled, and the condenser inlet pipeline in the air conditioner external unit can be preheated, so as to realize indoor precooling and indoor cooling. External preheating; when heating, if the second semiconductor component is turned on, the evaporator inlet pipeline in the air conditioner internal unit can be preheated, and the condenser inlet pipeline in the air conditioner external unit can be precooled to realize indoor cooling. Side preheating and outdoor side precooling, so that the indoor cooling capacity can be increased when the external temperature is high, and the indoor heating capacity can be increased when the external temperature is low, meeting the cooling and heating requirements under severe working conditions.
在一些实施例中,两组半导体元器件的两端均可配有加强空气循环的排风扇,可以强化半导体元器件两端与室内/室外侧的热量交换,从而实现对系统制冷量/制热量的补偿。如图1所示,空调还可包括:四个排气扇;其中,第一排气扇位于410第一制冷端311上,第二排气扇420位于第一制热端312上,第三排气扇430位于第二制热端322上,第四排气扇位440位于第二制冷端321上。In some embodiments, both ends of the two groups of semiconductor components can be equipped with exhaust fans to enhance air circulation, which can strengthen the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side, so as to realize the cooling capacity/heating capacity of the system. compensate. As shown in Figure 1, the air conditioner can also include: four exhaust fans; wherein, the first exhaust fan 410 is located on the first cooling end 311, the second exhaust fan 420 is located on the first heating end 312, and the third exhaust fan 420 is located on the first heating end 312. The exhaust fan 430 is located on the second heating end 322 , and the fourth exhaust fan position 440 is located on the second cooling end 321 .
当然,在一些实施例中,可以空调也可只有一个、两个或三个排气扇,可位于任意一个半导体元器件中的任意一端。Of course, in some embodiments, there may be an air conditioner or only one, two or three exhaust fans, which may be located at any end of any semiconductor component.
空调配置了两组半导体元器件,或配置了两组半导体元器件及其对应的排气扇后,可通过控制半导体元器件的运行来提高空调的制冷量或制热量,满足了在恶劣工况下的制冷制热需求。The air conditioner is equipped with two sets of semiconductor components, or after configuring two sets of semiconductor components and their corresponding exhaust fans, the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, which meets the requirements of severe working conditions. Cooling and heating demand under.
本公开实施例中,半导体元器件不仅可提高空调的制冷量或制热量,而且,还可在空调除霜过程中,提高空调除霜的效率。In the embodiments of the present disclosure, the semiconductor components can not only increase the cooling capacity or heating capacity of the air conditioner, but also improve the defrosting efficiency of the air conditioner during the defrosting process of the air conditioner.
图2是本公开实施例提供的一种用于空调控制方法的流程示意图。空调可如上述,配置了两组半导体元器件,或配置了两组半导体元器件及其对应的排气扇。如图2所示,用于空调控制的过程包括:Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure. As mentioned above, the air conditioner can be configured with two sets of semiconductor components, or equipped with two sets of semiconductor components and their corresponding exhaust fans. As shown in Figure 2, the processes used for air conditioning control include:
步骤2001:获取处于制热模式运行空调当前设定时长内的当前平均室外温度值和当前平均除霜温度值。Step 2001: Obtain the current average outdoor temperature value and the current average defrosting temperature value within the current set duration of the air conditioner running in the heating mode.
一般,在空调的制热模式运行过程中,空调的室外机可能出现结霜情况。例如:空调制热模式运行15分钟、20分钟、或40分钟等等,空调的室外机可能出现结霜情况。Generally, during the operation of the heating mode of the air conditioner, frost may occur on the outdoor unit of the air conditioner. For example, if the air conditioner is running in the heating mode for 15 minutes, 20 minutes, or 40 minutes, etc., frost may appear on the outdoor unit of the air conditioner.
本公开实施例中,可通过设定时长内的平均室外温度值和平均除霜温度值,来确定空调的室外机是否出现结霜情况。即可记录设定时长内,通过温度采集装置,采集的室外温度值和除霜温度值,然后,根据记录的室外温度值和除霜温度值,以及设定时长,即可得到平均室外温度值和平均除霜温度值。In the embodiment of the present disclosure, it may be determined whether the outdoor unit of the air conditioner is frosted according to the average outdoor temperature value and the average defrosting temperature value within a set period of time. It can record the outdoor temperature value and defrost temperature value collected by the temperature acquisition device within the set time period, and then, according to the recorded outdoor temperature value, defrost temperature value, and the set time period, the average outdoor temperature value can be obtained and the average defrost temperature value.
当然,本公开实施例中的空调控制可空调制热运行后一次控制或自动连续控制,因此,当前设定时长对应当前平均室外温度值和当前平均除霜温度值。设定时长可为10分钟、20分钟、25分钟、30分钟等等。Certainly, the air-conditioning control in the embodiments of the present disclosure may be controlled once after the air-conditioning and heating operation or automatically and continuously. Therefore, the current set duration corresponds to the current average outdoor temperature value and the current average defrosting temperature value. The set duration can be 10 minutes, 20 minutes, 25 minutes, 30 minutes and so on.
步骤2002:在确定当前平均室外温度值和平均当前除霜温度值分别满足对应的设定条件的情况下,确定与当前平均除霜温度值对应的空调的当前运行模式。Step 2002: When it is determined that the current average outdoor temperature value and the average current defrosting temperature value respectively satisfy the corresponding setting conditions, determine the current operating mode of the air conditioner corresponding to the current average defrosting temperature value.
在当前平均室外温度值小于或等于第一设定室外除霜温度值,且当前平均除霜温度值小于或等于第二设定室外除霜温度值的情况下,即可确定空调的室外机需进行除霜了,即当前平均室外温度值和平均当前除霜温度值分别满足对应的设定条件了。When the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, and the current average defrosting temperature value is less than or equal to the second set outdoor defrosting temperature value, the outdoor unit demand of the air conditioner can be determined. The defrosting is carried out, that is, the current average outdoor temperature value and the average current defrosting temperature value meet the corresponding setting conditions respectively.
本公开实施例中,可根据当前平均除霜温度值,确定空调室外机的结霜程度,不同的结霜程度,对应不同空调运行模式。In the embodiments of the present disclosure, the degree of frosting of the outdoor unit of the air conditioner may be determined according to the current average defrosting temperature value, and different degrees of frosting correspond to different operating modes of the air conditioner.
在一些实施例中,在当前平均室外温度值小于或等于第一设定室外除霜温度值的情况下,若当前平均除霜温度值小于或等于第二设定室外除霜温度值,且大于第三设定室外除霜温度值时,将制热模式确定为空调的当前运行模式;在当前平均室外温度值小于或等于第一设定室外除霜温度值的情况下,若 当前平均除霜温度值小于或等于第三设定室外除霜温度值时,将除霜模式确定为空调的当前运行模式。In some embodiments, when the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the second set outdoor defrosting temperature value, and greater than When the third outdoor defrosting temperature value is set, the heating mode is determined as the current operating mode of the air conditioner; when the current average outdoor temperature value is less than or equal to the first outdoor defrosting temperature value, if the current average defrosting temperature value When the temperature value is less than or equal to the third set outdoor defrosting temperature value, the defrosting mode is determined as the current operating mode of the air conditioner.
第一设定室外除霜温度值可为5℃、3℃、0℃、-2℃等等,第二设定室外除霜温度值可为0.5℃、0.3℃、0℃、-0.2℃等等,而第三设定室外除霜温度值可为-2.5℃、-2.8℃、-3℃、-3.2℃等等。第一设定室外除霜温度值,第二设定室外除霜温度值,以及第三设定室外除霜温度值都可根据空调所在地理位置,以及空调性能确定的。The first set outdoor defrosting temperature value can be 5°C, 3°C, 0°C, -2°C, etc., and the second set outdoor defrosting temperature value can be 0.5°C, 0.3°C, 0°C, -0.2°C, etc. etc., and the third set outdoor defrosting temperature value can be -2.5°C, -2.8°C, -3°C, -3.2°C and so on. The first set outdoor defrosting temperature value, the second set outdoor defrosting temperature value, and the third set outdoor defrosting temperature value can be determined according to the geographical location of the air conditioner and the performance of the air conditioner.
例如:当前平均室外温度值Taop≤5℃,且当前平均除霜温度值-3℃<Tcp≤0.5℃时,空调可能仅仅是轻微结霜,此时,可确定空调的当前运行模式为制热模式,即空调不切换运行模式。而当前平均室外温度值Taop≤-2℃,且当前平均除霜温度值Tcp≤-3℃时,空调可能已经结霜较严重了,可确定空调的当前运行模式为除霜模式,即空调自动进入了空调预设的除霜模式了。For example: when the current average outdoor temperature Taop≤5°C and the current average defrosting temperature -3°C<Tcp≤0.5°C, the air conditioner may only be slightly frosted. At this time, the current operating mode of the air conditioner can be determined to be heating Mode, that is, the air conditioner does not switch the operating mode. However, when the current average outdoor temperature Taop≤-2°C and the current average defrosting temperature Tcp≤-3°C, the air conditioner may have been severely frosted, and the current operating mode of the air conditioner can be determined to be the defrosting mode Entered the default defrost mode of the air conditioner.
步骤2003:控制空调以当前运行模式进行运行,并在与当前运行模式匹配的第一时间内,控制第一半导体元器件启动运行。Step 2003: Control the air conditioner to run in the current operating mode, and control the first semiconductor component to start running within the first time that matches the current operating mode.
可控制空调进行制热模式运行或除霜模式运行,并在空调运行的过程中,控制第一半导体元器件启动运行。The air conditioner can be controlled to operate in heating mode or defrosting mode, and the first semiconductor component can be controlled to start operation during the operation of the air conditioner.
由于第一半导体元器件的第一制冷端与空调内机连接,第一半导体元器件的第一制热端与空调外机连接,这样,第一半导体元器件启动运行后,可以实现室内测预冷和室外侧预热。在一些实施例中,由于第一半导体元器件的第一制冷端通过室内连接件与空调内机的蒸发器连接,第一制热端通过室外连接件与空调外机的冷凝器连接,这样,可对空调内机中的蒸发器入口管路进行预冷,而对空调外机中的冷凝器入口管路进行预热,从而,可加快空调外机的除霜进程,提高空调除霜的效率。Since the first cooling terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first heating terminal of the first semiconductor component is connected to the external unit of the air conditioner, in this way, after the first semiconductor component starts running, the indoor forecasting can be realized. Cold and preheated outside. In some embodiments, since the first cooling end of the first semiconductor component is connected to the evaporator of the air conditioner internal unit through the indoor connection piece, and the first heating end is connected to the condenser of the air conditioner external unit through the outdoor connection piece, thus, It can pre-cool the evaporator inlet pipeline in the air conditioner internal unit, and preheat the condenser inlet pipeline in the air conditioner external unit, thereby speeding up the defrosting process of the air conditioner external unit and improving the defrosting efficiency of the air conditioner .
其中,不同的空调运行模式对应第一半导体元器件不同的启动运行时间。在一些实施例中,可在当前运行模式为制热模式的情况下,在半导体元器件的设定运行周期的运行时间内,控制第一半导体元器件启动运行;而在当前运行模式为除霜模式的情况下,在除霜模式对应的设定除霜时间内,控制第一半导体元器件启动运行。Wherein, different air conditioner operating modes correspond to different starting and operating times of the first semiconductor component. In some embodiments, when the current operating mode is the heating mode, the first semiconductor component can be controlled to start running within the operating time of the set operating cycle of the semiconductor component; while the current operating mode is defrosting In the case of the defrosting mode, the first semiconductor component is controlled to start running within the set defrosting time corresponding to the defrosting mode.
目前,半导体元器件受材料限制,长期连续运行会导致部件可靠性降低,因此,在一些实施例中,半导体元器件可以设定运行周期为单位运行,并在设定运行周期内,一段时间内半导体元器件运行,而剩下时间内半导体元器件停机。例如:设定运行周期可为20min,这样,半导体元器件周期性运行过程中,可按照运行10min后停机10min的方式运行。或者,设定运行周期可为30min,这样,半导体元器件周期性运行过程中,可按照运行20min后停机10min的方式运行等等。At present, semiconductor components are limited by materials, and long-term continuous operation will lead to reduced reliability of components. Therefore, in some embodiments, semiconductor components can be set to run in units of operating cycles, and within the set operating cycle, within a period of time The semiconductor components are running, and the semiconductor components are down for the rest of the time. For example: set the operating cycle to be 20 minutes, so that during the periodic operation of semiconductor components, it can be operated in the manner of running for 10 minutes and then stopping for 10 minutes. Alternatively, the operating cycle can be set to 30 minutes. In this way, during the periodic operation of semiconductor components, it can be operated in the manner of running for 20 minutes and then stopping for 10 minutes, etc.
因此,在当前运行模式为制热模式的情况下,与制热模式匹配的第一时间可为设定运行周期的运行时间,例如:若设定运行周期20min内的10min,即可控制第一半导体元器件启动运行10分钟。或者,设定运行周期30min内的20min,即控制第一半导体元器件启动运行20分钟等等。Therefore, when the current operation mode is the heating mode, the first time matching the heating mode can be the operation time of the set operation cycle, for example: if the operation cycle is set for 10 minutes within 20 minutes, the first time can be controlled The semiconductor components start and run for 10 minutes. Alternatively, 20 minutes within the 30 minutes of the operation cycle is set, that is, the first semiconductor component is controlled to start and run for 20 minutes, and so on.
当然,在一些实施例中,与制热模式匹配的第一时间也可预先设定,可根据兼顾除霜效率以及半导体元器件的功耗进行设定,例如:10min、12min、或15min等等。Of course, in some embodiments, the first time to match the heating mode can also be preset, and can be set according to the defrosting efficiency and the power consumption of semiconductor components, for example: 10min, 12min, or 15min, etc. .
而空调的自动除霜模式中,空调制冷运行,并且,根据采集的室外温度值可自动停止除霜模式运行,因此,在当前运行模式为除霜模式的情况下,与除霜模式匹配的第一时间可为除霜模式的运行时间,即设定除霜时间,从而,在设定除霜时间内,控制第一半导体元器件启动运行。In the automatic defrosting mode of the air conditioner, the air conditioner operates in cooling mode, and can automatically stop the defrosting mode operation according to the collected outdoor temperature value. Therefore, when the current operating mode is the defrosting mode, the first defrosting mode matching One time may be the running time of the defrosting mode, that is, the set defrosting time, so that the first semiconductor component is controlled to start running within the set defrosting time.
可见,本公开实施例中,在确定空调的室外机有结霜的情况下,可在与制热模式或除霜模式匹配的第一时间内,控制第一半导体元器件运行,这样,第一时间内,室内侧预冷和室外侧预热,加快了空调室外机的除霜进程,提高了空调除霜的效率,并且,在轻微结霜的情况下,并不改变空调的制热运行模式,可提高用户体验;而在较严重结霜的情况下,通过除霜模式运行以及第一半导体元器件的启动运行,可提高空调除霜的效率以及除霜效果,也进一步提高了用户体验。It can be seen that in the embodiment of the present disclosure, when it is determined that there is frost on the outdoor unit of the air conditioner, the operation of the first semiconductor component can be controlled within the first time that matches the heating mode or the defrosting mode. In this way, the first The indoor side precooling and the outdoor side preheating within a certain period of time speed up the defrosting process of the outdoor unit of the air conditioner and improve the defrosting efficiency of the air conditioner. In addition, in the case of slight frosting, the heating operation mode of the air conditioner will not be changed. The user experience can be improved; and in the case of severe frost, the defrosting efficiency and defrosting effect of the air conditioner can be improved through the operation of the defrosting mode and the start-up operation of the first semiconductor component, and the user experience is further improved.
半导体元器件的功率是可调的,对应输出的冷量或热量也是不同,从而,在相同控制输入电压下,根据不同的控制输入电流,半导体元器件可输出不同的冷量或热量。在一些实施例中,半导体元器件对应两个或多个运行档位,半导体元器件的控制输入电流越大,对应的运行档位越高,输出能量也越多。例如:控制输入电压220V,控制输入电流分别为0.5A、1A、1.5A,这样,半导体元器件对应低、中、高三个档位。当然,半导体元器件也可仅仅对应低、高两个档位等等。The power of semiconductor components is adjustable, and the corresponding output cooling or heat is also different. Therefore, under the same control input voltage, according to different control input currents, semiconductor components can output different cooling or heat. In some embodiments, the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component is, the higher the corresponding operating gear is, and the greater the output energy is. For example: the control input voltage is 220V, and the control input current is 0.5A, 1A, and 1.5A respectively. In this way, semiconductor components correspond to three gears of low, medium, and high. Of course, semiconductor components can also only correspond to low and high gears and so on.
在半导体元器件对应两个或多个运行档位的情况下,无论空调处于制热模式运行还是除霜模式运行,都可根据当前平均除霜温度值,确定第一半导体元器件的当前运行档位,并控制第一半导体元器件启动运行,具体可包括:确定与当前平均除霜温度值对应的第一半导体元器件的当前运行档位;在与当前运行模式匹配的第一时间内,控制第一半导体元器件以当前运行档位运行。In the case that the semiconductor components correspond to two or more operating gears, the current operating gear of the first semiconductor component can be determined according to the current average defrosting temperature value no matter whether the air conditioner is in the heating mode or the defrosting mode position, and control the start-up operation of the first semiconductor component, which may specifically include: determining the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value; The first semiconductor component operates in the current operating gear.
其中,在当前运行模式为制热模式的情况下,确定与当前平均除霜温度值对应的第一半导体元器件的当前运行档位包括:在当前平均除霜温度值在第一温度范围内的情况下,确定第一档位为第一半导体元器件的当前运行档位;在当前平均除霜温度值在第二温度范围内的情况下,确定第二档位为第一半导体元器件的当前运行档位;在当前平均除霜温度值在第三温度范围内的情况下,确定第三档位为第一半导体元器件的当前运行档位。Wherein, when the current operating mode is the heating mode, determining the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value includes: when the current average defrosting temperature value is within the first temperature range In this case, the first gear is determined to be the current operating gear of the first semiconductor component; when the current average defrosting temperature value is within the second temperature range, the second gear is determined to be the current operating gear of the first semiconductor component. The operating gear: when the current average defrosting temperature value is within the third temperature range, determine the third gear as the current operating gear of the first semiconductor component.
其中,第一温度范围的上限值与第二设定室外除霜温度值相等,第一温度范围的下限值与第二温度范围的上限值相等,第二温度范围的下限值与第三温度范围的上限值相等,第三温度范围的下限值与第三设定室外除霜温度值相等,第三档位对应的半导体元器件的控制输入电流大于第二档位对应的半导体元器件的控制输入电流,第二档位对应的半导体元器件的控制输入电流大于第一档位对应的半导体元器件的控制输入电流。Wherein, the upper limit value of the first temperature range is equal to the second set outdoor defrosting temperature value, the lower limit value of the first temperature range is equal to the upper limit value of the second temperature range, and the lower limit value of the second temperature range is equal to The upper limit value of the third temperature range is equal, the lower limit value of the third temperature range is equal to the third set outdoor defrosting temperature value, and the control input current of the semiconductor components corresponding to the third gear is greater than that corresponding to the second gear. For the control input current of the semiconductor components, the control input current of the semiconductor components corresponding to the second gear is greater than the control input current of the semiconductor components corresponding to the first gear.
例如:第二设定室外除霜温度值为0.3℃,第三设定室外除霜温度值为-2.5℃,那么,与制热模式对应的,第一温度范围可为(-1,0.3],第二温度范围可为(-2,-1],第三温度范围可为(-2.5,-2]。这样,当前平均除霜温度值Tcp在第一温度范围内,即-1℃<Tcp≤0.3℃时,可确定第一档位为第一半导体元器件的当前运行档位;-2℃<Tcp≤-1℃时,可确定第二档位为第一半导体元器件的当前运行档位;而-2.5℃<Tcp≤-2℃时,可确定第三档位为第一半导体元器件的当前运行档位。For example: the second set outdoor defrosting temperature value is 0.3°C, and the third set outdoor defrosting temperature value is -2.5°C, then, corresponding to the heating mode, the first temperature range can be (-1,0.3] , the second temperature range can be (-2,-1], and the third temperature range can be (-2.5,-2]. In this way, the current average defrosting temperature value Tcp is within the first temperature range, that is, -1°C< When Tcp≤0.3℃, the first gear can be determined as the current operating gear of the first semiconductor component; when -2℃<Tcp≤-1℃, the second gear can be determined as the current operating gear of the first semiconductor component gear; and when -2.5°C<Tcp≤-2°C, the third gear can be determined as the current operating gear of the first semiconductor component.
当然,在当前运行模式为除霜模式的情况下,确定与当前平均除霜温度值对应的第一半导体元器件的当前运行档位包括:在当前平均除霜温度值在第四温度范围内的情况下,确定第一档位为第一半导体元器件的当前运行档位;在当前平均除霜温度值在第五温度范围内的情况下,确定第二档位为第一半导体元器件的当前运行档位;在当前平均除霜温度值在第六温度范围内的情况下,确定第三档位为第一半导体元器件的当前运行档位;Of course, when the current operating mode is the defrosting mode, determining the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value includes: when the current average defrosting temperature value is within the fourth temperature range In this case, the first gear is determined to be the current operating gear of the first semiconductor component; when the current average defrosting temperature value is within the fifth temperature range, the second gear is determined to be the current operating gear of the first semiconductor component. Operating gear; when the current average defrosting temperature value is within the sixth temperature range, determine the third gear as the current operating gear of the first semiconductor component;
其中,第四温度范围的上限值与第三设定室外除霜温度值相等,第四温度范围的下限值与第五温 度范围的上限值相等,第五温度范围的下限值与第六温度范围的上限值相等;第三档位对应的半导体元器件的控制输入电流大于第二档位对应的半导体元器件的控制输入电流,第二档位对应的半导体元器件的控制输入电流大于第一档位对应的半导体元器件的控制输入电流。Wherein, the upper limit value of the fourth temperature range is equal to the third set outdoor defrosting temperature value, the lower limit value of the fourth temperature range is equal to the upper limit value of the fifth temperature range, and the lower limit value of the fifth temperature range is equal to The upper limit values of the sixth temperature range are equal; the control input current of the semiconductor components corresponding to the third gear is greater than the control input current of the semiconductor components corresponding to the second gear, and the control input current of the semiconductor components corresponding to the second gear The current is greater than the control input current of the semiconductor component corresponding to the first gear.
例如:第三设定室外除霜温度值为-3.5℃,那么,与除霜模式对应的,第四温度范围可为(-5,-3.5],第五温度范围可为(-7,-5],第六温度范围可为(-∞,-7]。这样,当前平均除霜温度值Tcp在第四温度范围内,即-5℃<Tcp≤-3.5℃时,可确定第一档位为第一半导体元器件的当前运行档位;-7℃<Tcp≤-5℃时,可确定第二档位为第一半导体元器件的当前运行档位;而Tcp≤-7℃时,可确定第三档位为第一半导体元器件的当前运行档位。For example: the third set outdoor defrosting temperature value is -3.5°C, then, corresponding to the defrosting mode, the fourth temperature range can be (-5,-3.5], and the fifth temperature range can be (-7,- 5], the sixth temperature range can be (-∞,-7]. In this way, when the current average defrosting temperature value Tcp is within the fourth temperature range, that is, when -5°C<Tcp≤-3.5°C, the first gear can be determined position is the current operating gear of the first semiconductor component; when -7°C<Tcp≤-5°C, the second gear can be determined as the current operating gear of the first semiconductor component; and when Tcp≤-7°C, The third gear can be determined as the current operating gear of the first semiconductor component.
当然,半导体元器件对应两个、四个、五个等等运行档位,也是根据当前平均除霜温度值,可确定对应的第一半导体元器件的当前运行档位,具体就不详细描述了。Of course, the semiconductor components correspond to two, four, five, etc. operating gears, and the current operating gears of the corresponding first semiconductor components can be determined according to the current average defrosting temperature value, which will not be described in detail. .
确定了第一半导体元器件的当前运行档位,即可在与当前运行模式匹配的第一时间内,控制第一半导体元器件以当前运行档位运行。Once the current operating gear of the first semiconductor component is determined, the first semiconductor component can be controlled to run at the current operating gear within the first time that matches the current operating mode.
例如:Taop≤5℃,且当前平均除霜温度值-2℃<Tcp≤-1℃时,那么,可控制空调制热模式运行,并且,在半导体元器件的20min设定运行周期的10min运行时间内,可给第一半导体元器件提供220v的电压,1A的电流,控制第一半导体元器件以中档位运行。或者,Taop≤5℃,且当前平均除霜温度Tcp≤-7℃时,那么,可控制空调除霜模式运行,并且,在除霜模式运行的起止时间内,即设定除霜时间内,可给第一半导体元器件提供220v的电压,1.5A的电流,控制第一半导体元器件以高档位运行。For example: when Taop≤5℃, and the current average defrosting temperature value is -2℃<Tcp≤-1℃, then the air conditioner can be controlled to operate in heating mode, and it can be operated in 10min of the 20min set operation cycle of semiconductor components Within a certain period of time, a voltage of 220v and a current of 1A can be provided to the first semiconductor component to control the first semiconductor component to operate in the middle range. Or, when Taop≤5°C, and the current average defrosting temperature Tcp≤-7°C, then the air conditioner can be controlled to run in defrost mode, and, within the start and end time of defrost mode operation, that is, the set defrost time, A voltage of 220v and a current of 1.5A can be provided to the first semiconductor component to control the operation of the first semiconductor component at a high level.
可见,在一些实施例中,不同的当前平均除霜温度值,对应第一半导体元器件的不同运行档位,即对应半导体元器件不同的输出能量,从而,进一步加快了空调除霜的效率。It can be seen that in some embodiments, different current average defrosting temperature values correspond to different operating gears of the first semiconductor components, that is, correspond to different output energies of the semiconductor components, thereby further speeding up the defrosting efficiency of the air conditioner.
空调的半导体元器件中可能配置了对应的排气扇,排气扇可加强空气循环,强化半导体元器件两端与室内/室外侧的热量交换。在本公开实施例中,由于是在空调制热过程中进行除霜,因此,控制第一半导体元器件启动运行还包括:控制第一半导体元器件的第一制冷端上的第一排气扇关闭;控制第一半导体元器件的第一制热端上的第二排气扇运行。The semiconductor components of the air conditioner may be equipped with a corresponding exhaust fan. The exhaust fan can enhance air circulation and enhance the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side. In the embodiment of the present disclosure, since the defrosting is performed during the heating process of the air conditioner, controlling the start-up operation of the first semiconductor component further includes: controlling the first exhaust fan on the first cooling end of the first semiconductor component Close; control the operation of the second exhaust fan on the first heating end of the first semiconductor component.
这样,只强化室外测的热量交换,进一步提高空调除霜的效率。并且,室内侧对应的排气扇关闭,不会给用户带来吹冷风的不适,进一步提高了用户体验。In this way, only the heat exchange of the outdoor side is strengthened, and the defrosting efficiency of the air conditioner is further improved. Moreover, the corresponding exhaust fan on the indoor side is turned off, which will not bring discomfort to the user from blowing cold air, and further improves the user experience.
当然,本公开实施例是在空调制热过程进行的除霜,因此,在到达与当前运行模式匹配的第一时间的情况下,控制空调制热模式运行,并且控制第一半导体元器件停止运行。Of course, the embodiment of the present disclosure is defrosting during the air-conditioning and heating process. Therefore, when the first time matching the current operating mode is reached, the air-conditioning and heating mode is controlled to operate, and the first semiconductor component is controlled to stop operating. .
其中,在当前平均室外温度值小于或等于第一设定室外除霜温度值的情况下,若当前平均除霜温度值小于或等于第二设定室外除霜温度值,且大于第三设定室外除霜温度值时,空调一直处于制热模式运行,但是,半导体元器件运行过程中是需要耗能的,并且,长时间运行,其可靠性是会降低的,因此,在到达与当前运行模式匹配的第一时间的情况下,即可控制第一半导体元器件停止运行。例如:第一时间是半导体元器件的20分钟设定运行周期的10分钟运行时间,则第一半导体元器件启动运行10分钟后,即到达了与当前运行模式匹配的第一时间,从而,控制第一半导体元器件停止运行,而空调仍然处于制热模式运行。Wherein, when the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the second set outdoor defrosting temperature value and greater than the third set When the outdoor defrosting temperature is reached, the air conditioner is always in the heating mode. However, the semiconductor components consume energy during operation, and their reliability will be reduced if they run for a long time. Therefore, between arrival and current operation In case of the first time of pattern matching, the first semiconductor component can be controlled to stop running. For example: the first time is the 10-minute running time of the 20-minute set operation cycle of the semiconductor component, and then the first semiconductor component starts to run for 10 minutes, that is, it reaches the first time matching the current operation mode, thus, the control The first semiconductor component stops operating, while the air conditioner is still operating in the heating mode.
而在当前平均室外温度值小于或等于第一设定室外除霜温度值的情况下,若当前平均除霜温度值 小于或等于第三设定室外除霜温度值时,空调已经自动切换到除霜模式运行了,即空调制冷运行了,在除霜模式对应的设定除霜时间内,即除霜模式的起止时间内,第一半导体元器件启动运行,而除霜模式结束了,到达了与当前运行模式匹配的第一时间,不仅空调切换到了制热模式运行,还需控制第一半导体元器件停止运行。While the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the third set outdoor defrosting temperature value, the air conditioner has automatically switched to the defrosting temperature value. The frost mode is running, that is, the air conditioner is running, and within the set defrosting time corresponding to the defrosting mode, that is, the start and end time of the defrosting mode, the first semiconductor component starts to run, and the defrosting mode is over, reaching the At the first moment matching the current operating mode, not only the air conditioner is switched to the heating mode, but also the first semiconductor component needs to be controlled to stop operating.
当然,若第一半导体元器件上配置的对应的排气扇工作了,在控制第一半导体元器件停止运行时,也需将对应的排水扇关闭。Of course, if the corresponding exhaust fan configured on the first semiconductor component works, the corresponding drain fan also needs to be turned off when the first semiconductor component is controlled to stop running.
本公开实施例中的空调制热过程中的除霜控制可空调制热运行后一次控制或自动连续控制,因此,在一些实施例中,获取当前设定时长内的当前平均室外温度值和当前平均除霜温度值包括:在第一半导体元器件处于停止状态,且空调处于制热模式运行状态的持续时间到达预设采样时长的情况下,记录当前设定时长内,处于制热模式运行空调的室外温度值和除霜温度值;根据记录的室外温度值和除霜温度值,得到当前设定时长内的当前平均室外温度值和当前平均除霜温度值。The defrosting control in the air-conditioning and heating process in the embodiments of the present disclosure can be controlled once after the air-conditioning and heating operation or automatically and continuously. Therefore, in some embodiments, the current average outdoor temperature value and the current The average defrosting temperature value includes: when the first semiconductor component is in a stopped state, and the duration of the air conditioner in the heating mode operation state reaches the preset sampling time, record the current set time, and the air conditioner is in the heating mode. The outdoor temperature value and defrosting temperature value; according to the recorded outdoor temperature value and defrosting temperature value, the current average outdoor temperature value and the current average defrosting temperature value within the current set time period are obtained.
例如:预设采样时长可为10、15、18、20、25分钟等等,这样,在预设采样时长内,第一半导体元器件一直未启动运行,且空调也一直制热模式运行,此时,即可进行当前设定时间长内的温度采样并记录,从而,得到当前设定时长内的当前平均室外温度值和当前平均除霜温度值,然后继续进行温度判断,以及对应的除霜处理过程。For example: the preset sampling time can be 10, 15, 18, 20, 25 minutes, etc., in this way, within the preset sampling time, the first semiconductor component has not started to run, and the air conditioner has been running in the heating mode. , the temperature sampling and recording within the current set time period can be carried out, thus, the current average outdoor temperature value and the current average defrosting temperature value within the current set time period can be obtained, and then the temperature judgment and the corresponding defrosting temperature value can be continued. process.
目前,空调具有通讯功能,这样,空调还可根据接收到的指令,来控制半导体元器件的运行。在一些实施例中,在接收到配置控制应用APP终端发送的半导体元器件的控制指令的情况下,根据半导体元器件的控制指令,控制空调中的半导体元器件的运行。这样,用户可通过APP控制半导体元器件的运行,提高了空调的智能性以及用户体验。At present, the air conditioner has a communication function, so that the air conditioner can also control the operation of semiconductor components according to the received instructions. In some embodiments, when receiving the control instruction of the semiconductor component sent by the configuration control application APP terminal, the operation of the semiconductor component in the air conditioner is controlled according to the control instruction of the semiconductor component. In this way, users can control the operation of semiconductor components through the APP, which improves the intelligence and user experience of the air conditioner.
下面将操作流程集合到具体实施例中,举例说明本公开实施例提供的用于空调控制过程。In the following, the operation process is integrated into a specific embodiment to illustrate the air-conditioning control process provided by the embodiment of the present disclosure.
本实施例中,空调可如图1所示,包括两组半导体元器件和四个排气扇。并且,空调中保存的第一设定室外除霜温度值为5℃,第二设定室外除霜温度值位0.5℃,第三设定室外除霜温度值为-3℃。并且,半导体元器件对应3个运行档位,第三档位的输出能量大于第二档位的输出能量,而第二档位的输出能量大于第一档位的输出能量。并且,第一温度范围可为(-1,0.5],第二温度范围可为(-2,-1],第三温度范围可为(-3,-2];第四温度范围可为(-5,-3],第五温度范围可为(-7,-5],第六温度范围可为(-∞,-7]。设定时长可为20min,半导体元器件的设定运行周期也可为20min,而设定运行周期的运行时间为10min;而预设采样时长也可为20min。In this embodiment, the air conditioner may include two sets of semiconductor components and four exhaust fans as shown in FIG. 1 . In addition, the first set outdoor defrosting temperature stored in the air conditioner is 5°C, the second set outdoor defrosting temperature is 0.5°C, and the third set outdoor defrosting temperature is -3°C. Moreover, the semiconductor components correspond to three operating gears, the output energy of the third gear is greater than the output energy of the second gear, and the output energy of the second gear is greater than the output energy of the first gear. Also, the first temperature range may be (-1,0.5], the second temperature range may be (-2,-1], the third temperature range may be (-3,-2]; the fourth temperature range may be ( -5,-3], the fifth temperature range can be (-7,-5], and the sixth temperature range can be (-∞,-7]. The setting time can be 20min, and the setting operation cycle of semiconductor components It can also be 20 minutes, and the running time of the set running cycle is 10 minutes; and the preset sampling time can also be 20 minutes.
图3-1,图3-2是本公开实施例提供的一种用于空调控制方法的流程示意图。结合图1和图3-1,图3-2,用于空调控制的过程包括:Fig. 3-1 and Fig. 3-2 are schematic flowcharts of a method for controlling an air conditioner provided by an embodiment of the present disclosure. Combining Figure 1 and Figure 3-1, Figure 3-2, the process for air conditioning control includes:
步骤3001:判断第一半导体元器件处于停止状态,且空调处于制热模式运行状态的持续时间是否≥20min?若是,执行步骤3002,否则,返回步骤3001。Step 3001: Determine if the first semiconductor component is in a stopped state, and whether the duration of the air conditioner in the heating mode is greater than or equal to 20 minutes? If yes, execute step 3002; otherwise, return to step 3001.
步骤3002:记录20min内处于制热模式运行空调的室外温度值和除霜温度值,并得到20min内的当前平均室外温度值和当前平均除霜温度值。Step 3002: Record the outdoor temperature and defrost temperature of the air conditioner in heating mode within 20 minutes, and obtain the current average outdoor temperature and current average defrost temperature within 20 minutes.
步骤3003:判断当前平均室外温度值Taop≤5℃是否成立?若是,执行步骤3004,否则,返回步骤3002。Step 3003: Determine whether the current average outdoor temperature value Taop≤5°C holds true? If yes, execute step 3004, otherwise, return to step 3002.
步骤3004:判断-1<当前平均除霜温度值Tcp≤0.5是否成立?若是,执行步骤3005,否则,执行步骤3006。Step 3004: Determine whether -1<current average defrosting temperature value Tcp≤0.5 holds true? If yes, go to step 3005; otherwise, go to step 3006.
步骤3005:将制热模式确定为空调的当前运行模式,并确定第一档位为第一半导体元器件的当前运行档位,转入步骤3016。Step 3005: Determine the heating mode as the current operating mode of the air conditioner, and determine the first gear as the current operating gear of the first semiconductor component, and proceed to step 3016.
步骤3006:判断-2<Tcp≤-1是否成立?若是,执行步骤3007,否则,执行步骤3008。Step 3006: Determine whether -2<Tcp≤-1 holds true? If yes, go to step 3007; otherwise, go to step 3008.
步骤3007:将制热模式确定为空调的当前运行模式,并确定第二档位为第一半导体元器件的当前运行档位,转入步骤3016。Step 3007: Determine the heating mode as the current operating mode of the air conditioner, and determine the second gear as the current operating gear of the first semiconductor component, and proceed to step 3016.
步骤3008:判断-3<Tcp≤-2是否成立?若是,执行步骤3009,否则,执行步骤3010。Step 3008: Determine whether -3<Tcp≤-2 holds true? If yes, go to step 3009; otherwise, go to step 3010.
步骤3009:将制热模式确定为空调的当前运行模式,并确定第三档位为第一半导体元器件的当前运行档位,转入步骤3016。Step 3009: Determine the heating mode as the current operating mode of the air conditioner, and determine the third gear as the current operating gear of the first semiconductor component, and proceed to step 3016.
步骤3010:判断-5<Tcp≤-3是否成立?若是,执行步骤3011,否则,执行步骤3012。Step 3010: Determine whether -5<Tcp≤-3 holds true? If yes, go to step 3011; otherwise, go to step 3012.
步骤3011:将除霜模式确定为空调的当前运行模式,并确定第一档位为第一半导体元器件的当前运行档位,转入步骤3018。Step 3011: Determine the defrosting mode as the current operating mode of the air conditioner, and determine the first gear as the current operating gear of the first semiconductor component, and proceed to step 3018.
步骤3012:判断-7<Tcp≤-5是否成立?若是,执行步骤3013,否则,执行步骤3014。Step 3012: Determine whether -7<Tcp≤-5 holds true? If yes, go to step 3013; otherwise, go to step 3014.
步骤3013:将除霜模式确定为空调的当前运行模式,并确定第二档位为第一半导体元器件的当前运行档位,转入步骤3018。Step 3013: Determine the defrosting mode as the current operating mode of the air conditioner, and determine the second gear as the current operating gear of the first semiconductor component, and proceed to step 3018.
步骤3014:判断Tcp≤-7是否成立?若是,执行步骤3015,否则,返回步骤3002。Step 3014: Determine whether Tcp≤-7 is established? If yes, execute step 3015; otherwise, return to step 3002.
步骤3015:将除霜模式确定为空调的当前运行模式,并确定第三档位为第一半导体元器件的当前运行档位,转入步骤3018。Step 3015: Determine the defrosting mode as the current operating mode of the air conditioner, and determine the third gear as the current operating gear of the first semiconductor component, and proceed to step 3018.
步骤3016:控制空调制热模式运行,并控制第一半导体元器件以当前运行档位运行,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇运行。Step 3016: Control the operation of the air conditioner in the heating mode, and control the first semiconductor component to run at the current operating gear, and control the first exhaust fan on the first cooling end of the first semiconductor component to turn off, and the first heating end The second exhaust fan on the
步骤3017:判断是否达到半导体元器件的设定运行周期的运行时间10min?若是,执行步骤3020,否则,返回步骤3016。Step 3017: Determine whether the running time of the set running cycle of the semiconductor component is 10 minutes? If yes, execute step 3020, otherwise, return to step 3016.
步骤3018:控制空调除霜模式运行,并控制第一半导体元器件以当前运行档位运行,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇运行。Step 3018: Control the defrosting mode of the air conditioner, and control the first semiconductor component to run at the current operating gear, and control the first exhaust fan on the first cooling end of the first semiconductor component to turn off, and the first heating end The second exhaust fan on the
步骤3019:判断是否到达除霜模式对应的设定除霜时间?若是,执行步骤3020,否则,返回步骤3018。Step 3019: Determine whether the set defrosting time corresponding to the defrosting mode has been reached? If yes, execute step 3020, otherwise, return to step 3018.
步骤3020:控制空调制热模式运行,并控制第一半导体元器件停止运行,以及控制第二排水扇关闭。返回步骤3001。Step 3020: Control the operation of the air conditioner in the heating mode, control the first semiconductor component to stop running, and control the second drainage fan to close. Return to step 3001.
可见,本实施例中,空调中配置了两组半导体元器件,这样,在确定空调的室外机有结霜的情况下,可确定与平均除霜温度值匹配的空调运行模式,以及第一半导体元器件的档位,从而,可在与制热模式或除霜模式匹配的第一时间内,控制第一半导体元器件运行,这样,第一时间内,室内侧预冷和室外侧预热,加快了空调室外机的除霜进程,并且,不同的平均除霜温度值,对应第一半导体元器件的不同运行档位,进一步提高了空调除霜的效率。It can be seen that in this embodiment, two sets of semiconductor components are configured in the air conditioner, so that when it is determined that the outdoor unit of the air conditioner is frosted, the air conditioner operating mode matching the average defrosting temperature value can be determined, and the first semiconductor The gear position of the components, so that the operation of the first semiconductor components can be controlled within the first time that matches the heating mode or the defrosting mode. In this way, the indoor side precooling and the outdoor side preheating can be accelerated in the first time. The defrosting process of the outdoor unit of the air conditioner is improved, and different average defrosting temperature values correspond to different operating gears of the first semiconductor component, thereby further improving the defrosting efficiency of the air conditioner.
根据上述用于空调控制的过程,可构建一种用于空调控制的装置。According to the above process for air-conditioning control, an apparatus for air-conditioning control can be constructed.
图4是本公开实施例提供的一种用于空调控制装置的结构示意图。空调如上述,包括两组半导体元器件,或者,包括两组半导体元器件及其对应的排气扇。如图4所示,用于空调控制装置包括:第一获取模块4100,确定模块4200和第一控制模块4300。Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As mentioned above, the air conditioner includes two sets of semiconductor components, or two sets of semiconductor components and their corresponding exhaust fans. As shown in FIG. 4 , the air conditioner control device includes: a first acquisition module 4100 , a determination module 4200 and a first control module 4300 .
第一获取模块4100,被配置为获取处于制热模式运行空调当前设定时长内的当前平均室外温度值和当前平均除霜温度值。The first acquiring module 4100 is configured to acquire the current average outdoor temperature value and the current average defrosting temperature value within the current set duration of running the air conditioner in the heating mode.
确定模块4200,被配置为在在确定当前平均室外温度值和平均当前除霜温度值分别满足对应的设定条件的情况下,确定与当前平均除霜温度值对应的空调的当前运行模式。The determining module 4200 is configured to determine the current operating mode of the air conditioner corresponding to the current average defrosting temperature value when it is determined that the current average outdoor temperature value and the average current defrosting temperature value respectively satisfy corresponding setting conditions.
第一控制模块4300,被配置为控制空调以当前运行模式进行运行,并在与当前运行模式匹配的第一时间内,控制第一半导体元器件启动运行。The first control module 4300 is configured to control the air conditioner to operate in the current operation mode, and control the first semiconductor component to start operation within the first time matching the current operation mode.
在一些实施例中,确定模块4200包括:In some embodiments, determining module 4200 includes:
第一模式确定单元,被配置为在当前平均室外温度值小于或等于第一设定室外除霜温度值的情况下,若当前平均除霜温度值小于或等于第二设定室外除霜温度值,且大于第三设定室外除霜温度值时,将制热模式确定为空调的当前运行模式。The first mode determining unit is configured to: if the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the second set outdoor defrosting temperature value , and is greater than the third set outdoor defrosting temperature value, the heating mode is determined as the current operating mode of the air conditioner.
第二模式确定单元,被配置为在当前平均室外温度值小于或等于第一设定室外除霜温度值的情况下,若当前平均除霜温度值小于或等于第三设定室外除霜温度值时,将除霜模式确定为空调的当前运行模式。The second mode determination unit is configured to: if the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the third set outdoor defrosting temperature value , the defrosting mode is determined as the current operating mode of the air conditioner.
在一些实施例中,第一控制模块4300包括:In some embodiments, the first control module 4300 includes:
制热控制单元,被配置为在当前运行模式为制热模式的情况下,在半导体元器件的设定运行周期的运行时间内,控制第一半导体元器件启动运行。The heating control unit is configured to control the first semiconductor component to start running within the running time of the set running cycle of the semiconductor component when the current running mode is the heating mode.
除霜控制单元,被配置为在当前运行模式为除霜模式的情况下,在除霜模式对应的设定除霜时间内,控制第一半导体元器件启动运行。The defrosting control unit is configured to control the first semiconductor component to start running within the set defrosting time corresponding to the defrosting mode when the current operating mode is the defrosting mode.
在一些实施例中,第一控制模块4300,具体被配置为确定与当前平均除霜温度值对应的第一半导体元器件的当前运行档位;在与当前运行模式匹配的第一时间内,控制第一半导体元器件以当前运行档位运行;其中,半导体元器件对应两个或多个运行档位,半导体元器件的控制输入电流越大,对应的运行档位越高。In some embodiments, the first control module 4300 is specifically configured to determine the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value; The first semiconductor component operates at the current operating gear; wherein, the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component is, the higher the corresponding operating gear is.
在一些实施例中,第一控制模块4300,还被配置为控制第一半导体元器件的第一制冷端上的第一排气扇关闭;控制第一半导体元器件的第一制热端上的第二排气扇运行。In some embodiments, the first control module 4300 is further configured to control the closing of the first exhaust fan on the first cooling end of the first semiconductor component; The second exhaust fan operates.
在一些实施例中,还包括:第二控制模块,被配置为在到达与当前运行模式匹配的第一时间的情况下,控制第一半导体元器件停止运行,并控制空调制热模式运行。In some embodiments, it further includes: a second control module configured to control the first semiconductor component to stop running and control the air-conditioning and heating mode to run when the first time matching the current running mode is reached.
在一些实施例中,第一获取模块4100,具体被配置为在第一半导体元器件处于停止状态,且空调处于制热模式运行状态的持续时间到达预设采样时长的情况下,记录当前设定时长内,处于制热模式运行空调的室外温度值和除霜温度值;根据记录的室外温度值和除霜温度值,得到当前设定时长内的当前平均室外温度值和当前平均除霜温度值。In some embodiments, the first acquisition module 4100 is specifically configured to record the current setting when the first semiconductor component is in a stopped state and the duration of the air conditioner in the heating mode reaches the preset sampling time. The outdoor temperature value and defrosting temperature value of the air conditioner in the heating mode during the time period; according to the recorded outdoor temperature value and defrosting temperature value, the current average outdoor temperature value and the current average defrosting temperature value within the current set time period are obtained .
下面举例说明本公开实施例提供的用于空调控制的装置进行空调控制过程。The following is an example to illustrate the air-conditioning control process performed by the device for air-conditioning control provided by the embodiments of the present disclosure.
空调可如图1所示,包括两组半导体元器件和四个排气扇。并且,空调中保存的第一设定室外除 霜温度值为3℃,第二设定室外除霜温度值位0℃,第三设定室外除霜温度值为-3℃。并且,半导体元器件对应2个运行档位,第二档位的输出能量大于第一档位的输出能量。并且,第一温度范围可为(-1.5,0],第二温度范围可为(-3,--1.5];第三温度范围可为(-6,-3],第四温度范围可为(-∞,-6]。设定时长可为15min,半导体元器件的设定运行周期也可为20min,而设定运行周期的运行时间为10min;而预设采样时长也可为18min。The air conditioner can be shown in Figure 1, including two sets of semiconductor components and four exhaust fans. In addition, the first set outdoor defrosting temperature stored in the air conditioner is 3°C, the second set outdoor defrosting temperature is 0°C, and the third set outdoor defrosting temperature is -3°C. Moreover, the semiconductor components correspond to two operating gears, and the output energy of the second gear is greater than that of the first gear. Also, the first temperature range may be (-1.5,0], the second temperature range may be (-3,--1.5]; the third temperature range may be (-6,-3], and the fourth temperature range may be (-∞,-6]. The set duration can be 15 minutes, the set operating cycle of semiconductor components can also be 20 min, and the running time of the set operating cycle can be 10 min; and the preset sampling time can also be 18 min.
图5是本公开实施例提供的一种用于空调控制装置的结构示意图。如图5所示,用于空调控制装置包括:第一获取模块4100,确定模块4200、第一控制模块4300、第二控制模块4400,而确定模块4200中包括第一确定单元4210和第二确定单元4220,第一控制模块4300包括:制热控制单元4310和除霜控制单元4320。Fig. 5 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As shown in Figure 5, the air conditioner control device includes: a first acquisition module 4100, a determination module 4200, a first control module 4300, and a second control module 4400, and the determination module 4200 includes a first determination unit 4210 and a second determination unit 4200 Unit 4220 , the first control module 4300 includes: a heating control unit 4310 and a defrosting control unit 4320 .
其中,第一半导体元器件处于停止状态,且空调处于制热模式运行状态的持续时间达到18min后,第一获取模块4100可记录15min内处于制热模式运行空调的室外温度值和除霜温度值,并得到15min内的当前平均室外温度值和当前平均除霜温度值。Wherein, after the first semiconductor component is in the stopped state and the air conditioner is in the heating mode for 18 minutes, the first acquisition module 4100 can record the outdoor temperature value and the defrosting temperature value of the air conditioner in the heating mode within 15 minutes , and get the current average outdoor temperature value and the current average defrosting temperature value within 15 minutes.
这样,若当前平均室外温度值Taop≤3℃,且-3<当前平均除霜温度值Tcp≤0时,第一确定单元4210可将制热模式确定为空调的当前运行模式。并且,-1.5<Tcp≤0时,制热控制单元4310可控制空调制热模式运行,并在设定运行周期的运行时间10min内控制第一半导体元器件以第一档位运行,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇运行。而若-3<Tcp≤-1.5时,制热控制单元4310可控制空调制热模式运行,并在设定运行周期的运行时间10min内控制第一半导体元器件以第二档位运行,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇运行。In this way, if the current average outdoor temperature value Taop≤3°C and -3<current average defrosting temperature value Tcp≤0, the first determining unit 4210 may determine the heating mode as the current operating mode of the air conditioner. In addition, when -1.5<Tcp≤0, the heating control unit 4310 can control the operation of the air conditioner in the heating mode, and control the first semiconductor component to operate in the first gear within 10 minutes of the running time of the set operation cycle, and control the second The first exhaust fan on the first cooling end of a semiconductor component is turned off, and the second exhaust fan on the first heating end is running. And if -3<Tcp≤-1.5, the heating control unit 4310 can control the air conditioner to run in the heating mode, and control the first semiconductor component to run in the second gear within 10 minutes of the running time of the set running cycle, and control The first exhaust fan on the first cooling end of the first semiconductor component is turned off, and the second exhaust fan on the first heating end is running.
若当前平均室外温度值Taop≤3℃,且当前平均除霜温度值Tcp≤-3时,第二确定单元4220可将除霜模式确定为空调的当前运行模式。并且,-6<Tcp≤3时,除霜控制单元4320可控制空调除霜模式运行,并在除霜模式对应的设定除霜时间内控制第一半导体元器件以第一档位运行,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇运行。而若Tcp≤-6时,除霜控制单元4320可控制空调除霜模式运行,并在除霜模式对应的设定除霜时间内控制第一半导体元器件以第二档位运行,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇运行。If the current average outdoor temperature value Taop≤3°C and the current average defrosting temperature value Tcp≤-3, the second determining unit 4220 may determine the defrosting mode as the current operating mode of the air conditioner. Moreover, when -6<Tcp≤3, the defrost control unit 4320 can control the air conditioner to operate in the defrost mode, and control the first semiconductor component to operate in the first gear within the set defrost time corresponding to the defrost mode, and The first exhaust fan on the first cooling end of the first semiconductor component is controlled to be turned off, and the second exhaust fan on the first heating end is operated. And if Tcp≤-6, the defrosting control unit 4320 can control the air conditioner to operate in the defrosting mode, and control the first semiconductor component to operate in the second gear within the set defrosting time corresponding to the defrosting mode, and control the second gear to operate. The first exhaust fan on the first cooling end of a semiconductor component is turned off, and the second exhaust fan on the first heating end is running.
在到达与当前运行模式匹配的第一时间的情况下,第二控制模块4400可控制空调制热模式运行,并且控制第一半导体元器件停止运行。当然,第二控制模块4400还可控制第二排水扇关闭。When the first time matching the current operating mode is reached, the second control module 4400 may control the air conditioner to operate in the heating mode, and control the first semiconductor component to stop operating. Of course, the second control module 4400 can also control the second drainage fan to be turned off.
可见,本实施例中,空调中配置了两组半导体元器件,这样,在确定空调的室外机有结霜的情况下,用于空调控制的装置可确定与平均除霜温度值匹配的空调运行模式,以及第一半导体元器件的档位,从而,可在与制热模式或除霜模式匹配的第一时间内,控制第一半导体元器件运行,这样,第一时间内,室内侧预冷和室外侧预热,加快了空调室外机的除霜进程,并且,不同的平均除霜温度值,对应第一半导体元器件的不同运行档位,进一步提高了空调除霜的效率。It can be seen that in this embodiment, two sets of semiconductor components are configured in the air conditioner, so that when it is determined that the outdoor unit of the air conditioner is frosted, the device for air conditioner control can determine the air conditioner to operate at an average defrosting temperature value. mode, and the gear of the first semiconductor component, so that the operation of the first semiconductor component can be controlled within the first time that matches the heating mode or defrosting mode, so that the interior of the room is precooled within the first time Preheating with the outdoor side speeds up the defrosting process of the outdoor unit of the air conditioner, and different average defrosting temperature values correspond to different operating gears of the first semiconductor component, further improving the defrosting efficiency of the air conditioner.
本公开实施例提供了一种用于空调控制的装置,其结构如图6所示,包括:An embodiment of the present disclosure provides a device for air conditioning control, the structure of which is shown in Figure 6, including:
处理器(processor)1000和存储器(memory)1001,还可以包括通信接口(Communication Interface) 1002和总线1003。其中,处理器1000、通信接口1002、存储器1001可以通过总线1003完成相互间的通信。通信接口1002可以用于信息传输。处理器1000可以调用存储器1001中的逻辑指令,以执行上述实施例的用于空调控制的方法。A processor (processor) 1000 and a memory (memory) 1001 may also include a communication interface (Communication Interface) 1002 and a bus 1003. Wherein, the processor 1000 , the communication interface 1002 , and the memory 1001 can communicate with each other through the bus 1003 . Communication interface 1002 may be used for information transfer. The processor 1000 can call the logic instructions in the memory 1001 to execute the method for air conditioner control in the above embodiments.
此外,上述的存储器1001中的逻辑指令可以通过软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。In addition, the above logic instructions in the memory 1001 may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as an independent product.
存储器1001作为一种计算机可读存储介质,可用于存储软件程序、计算机可执行程序,如本公开实施例中的方法对应的程序指令/模块。处理器1000通过运行存储在存储器1001中的程序指令/模块,从而执行功能应用以及数据处理,即实现上述方法实施例中的用于空调控制的方法。The memory 1001, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 1000 executes function applications and data processing by running program instructions/modules stored in the memory 1001 , that is, implements the method for air-conditioning control in the above method embodiments.
存储器1001可包括存储程序区和存储数据区,其中,存储程序区可存储操作系统、至少一个功能所需的应用程序;存储数据区可存储根据终端空调的使用所创建的数据等。此外,存储器1001可以包括高速随机存取存储器,还可以包括非易失性存储器。The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required by a function; the data storage area may store data created according to the use of the terminal air conditioner, and the like. In addition, the memory 1001 may include a high-speed random access memory, and may also include a non-volatile memory.
本公开实施例提供了一种用于空调控制装置,包括:处理器和存储有程序指令的存储器,处理器被配置为在执行程序指令时,执行用于空调控制方法。An embodiment of the present disclosure provides an air-conditioning control device, including: a processor and a memory storing program instructions, and the processor is configured to execute an air-conditioning control method when executing the program instructions.
本公开实施例提供了一种空调,包括上述用于空调控制装置。An embodiment of the present disclosure provides an air conditioner, including the above-mentioned control device for an air conditioner.
本公开实施例提供了一种计算机可读存储介质,存储有计算机可执行指令,所述计算机可执行指令设置为执行上述用于空调控制方法。An embodiment of the present disclosure provides a computer-readable storage medium, which stores computer-executable instructions, and the computer-executable instructions are configured to execute the above method for controlling an air conditioner.
本公开实施例提供了一种计算机程序产品,所述计算机程序产品包括存储在计算机可读存储介质上的计算机程序,所述计算机程序包括程序指令,当所述程序指令被计算机执行时,使所述计算机执行上述用于空调控制方法。An embodiment of the present disclosure provides a computer program product, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program includes program instructions, and when the program instructions are executed by a computer, the The computer executes the above method for air conditioning control.
上述的计算机可读存储介质可以是暂态计算机可读存储介质,也可以是非暂态计算机可读存储介质。The above-mentioned computer-readable storage medium may be a transitory computer-readable storage medium, or a non-transitory computer-readable storage medium.
本公开实施例的技术方案可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质中,包括一个或多个指令用以使得一台计算机空调(可以是个人计算机,服务器,或者网络空调等)执行本公开实施例所述方法的全部或部分步骤。而前述的存储介质可以是非暂态存储介质,包括:U盘、移动硬盘、只读存储器(ROM,Read-Only Memory)、随机存取存储器(RAM,Random Access Memory)、磁碟或者光盘等多种可以存储程序代码的介质,也可以是暂态存储介质。The technical solutions of the embodiments of the present disclosure can be embodied in the form of software products. The computer software products are stored in a storage medium and include one or more instructions to make a computer air conditioner (which can be a personal computer, a server, or a network air conditioner, etc.) execute all or part of the steps of the method described in the embodiments of the present disclosure. The aforementioned storage medium can be a non-transitory storage medium, including: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc. A medium that can store program code, or a transitory storage medium.
以上描述和附图充分地示出了本公开的实施例,以使本领域的技术人员能够实践它们。其他实施例可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求,否则单独的部件和功能是可选的,并且操作的顺序可以变化。一些实施例的部分和特征可以被包括在或替换其他实施例的部分和特征。本公开实施例的范围包括权利要求书的整个范围,以及权利要求书的所有可获得的等同物。当用于本申请中时,虽然术语“第一”、“第二”等可能会在本申请中使用以描述各元件,但这些元件不应受到这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。比如,在不改变描述的含义的情况下,第一元件可以叫做第二元件,并且同样第,第二元件可以叫做第一元件,只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件,但可以不是相同的元件。而且,本申请中使用的用词仅用于描述实施例并且不用于限制权 利要求。如在实施例以及权利要求的描述中使用的,除非上下文清楚地表明,否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地,如在本申请中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外,当用于本申请中时,术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素,和/或组件的存在,但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。在没有更多限制的情况下,由语句“包括一个…”限定的要素,并不排除在包括所述要素的过程、方法或者空调中还存在另外的相同要素。本文中,每个实施例重点说明的可以是与其他实施例的不同之处,各个实施例之间相同相似部分可以互相参见。对于实施例公开的方法、产品等而言,如果其与实施例公开的方法部分相对应,那么相关之处可以参见方法部分的描述。The above description and drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, procedural, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present disclosure includes the full scope of the claims, and all available equivalents of the claims. When used in the present application, although the terms 'first', 'second', etc. may be used in the present application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without changing the meaning of the description, a first element could be called a second element, and likewise, a second element could be called a first element, as long as all occurrences of "first element" are renamed consistently and all occurrences of "Second component" can be renamed consistently. The first element and the second element are both elements, but may not be the same element. Also, the terms used in this application are used to describe the embodiments only and are not used to limit the claims. As used in the examples and description of the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well unless the context clearly indicates otherwise . Similarly, the term "and/or" as used in this application is meant to include any and all possible combinations of one or more of the associated listed ones. Additionally, when used in this application, the term "comprise" and its variants "comprises" and/or comprising (comprising) etc. refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these. Without further limitations, an element defined by the statement "comprising a ..." does not exclude the presence of additional identical elements in the process, method or condition comprising said element. Herein, what each embodiment focuses on may be the difference from other embodiments, and the same and similar parts of the various embodiments may refer to each other. For the method, product, etc. disclosed in the embodiment, if it corresponds to the method part disclosed in the embodiment, then the relevant part can refer to the description of the method part.
本领域技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,可以取决于技术方案的特定应用和设计约束条件。所述技术人员可以对每个特定的应用来使用不同方法以实现所描述的功能,但是这种实现不应认为超出本公开实施例的范围。所述技术人员可以清楚地了解到,为描述的方便和简洁,上述描述的系统、装置和单元的具体工作过程,可以参考前述方法实施例中的对应过程,在此不再赘述。Those skilled in the art can appreciate that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software may depend on the specific application and design constraints of the technical solution. Said artisans may implement the described functions using different methods for each particular application, but such implementation should not be regarded as exceeding the scope of the disclosed embodiments. The skilled person can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.
本文所披露的实施例中,所揭露的方法、产品(包括但不限于装置、空调等),可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,可以仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另外,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例。另外,在本公开实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, air conditioners, etc.) can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units may only be a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined Or it can be integrated into another system, or some features can be ignored, or not implemented. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to implement this embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
附图中的流程图和框图显示了根据本公开实施例的系统、方法和计算机程序产品的可能实现的体系架构、功能和操作。在这点上,流程图或框图中的每个方框可以代表一个模块、程序段或代码的一部分,所述模块、程序段或代码的一部分包含一个或多个用于实现规定的逻辑功能的可执行指令。在有些作为替换的实现中,方框中所标注的功能也可以以不同于附图中所标注的顺序发生。例如,两个连续的方框实际上可以基本并行地执行,它们有时也可以按相反的顺序执行,这可以依所涉及的功能而定。在附图中的流程图和框图所对应的描述中,不同的方框所对应的操作或步骤也可以以不同于描述中所披露的顺序发生,有时不同的操作或步骤之间不存在特定的顺序。例如,两个连续的操作或步骤实际上可以基本并行地执行,它们有时也可以按相反的顺序执行,这可以依所涉及的功能而定。框图和/或流程图中的每个方框、以及框图和/或流程图中的方框的组合,可以用执行规定的功能或动作的专用的基于硬件的系统来实现,或者可以用专用硬件与计算机指令的组合来实现。The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the disclosure. In this regard, each block in a flowchart or block diagram may represent a module, program segment, or part of code that includes one or more Executable instructions. In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than that disclosed in the description, and sometimes there is no specific agreement between different operations or steps. order. For example, two consecutive operations or steps may, in fact, be performed substantially concurrently, or they may sometimes be performed in the reverse order, depending upon the functionality involved. Each block in the block diagrams and/or flowcharts, and combinations of blocks in the block diagrams and/or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by dedicated hardware implemented in combination with computer instructions.

Claims (11)

  1. 一种用于空调控制的方法,其特征在于,所述空调包括两组半导体元器件,其中,第一半导体元器件的第一制冷端与空调内机连接,所述第一半导体元器件的第一制热端与空调外机连接,第二半导体元器件的第二制冷端与所述空调外机连接,所述第二半导体元器件的第二制热端与所述空调内机连接,所述方法包括:A method for air conditioner control, characterized in that the air conditioner includes two sets of semiconductor components, wherein the first refrigeration terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first cooling terminal of the first semiconductor component A heating terminal is connected to the air conditioner external unit, a second cooling terminal of the second semiconductor component is connected to the air conditioner external unit, and a second heating terminal of the second semiconductor component is connected to the air conditioner internal unit, so The methods described include:
    获取处于制热模式运行空调当前设定时长内的当前平均室外温度值和当前平均除霜温度值;Obtain the current average outdoor temperature value and current average defrosting temperature value within the current set time of running the air conditioner in heating mode;
    在确定所述当前平均室外温度值和所述平均当前除霜温度值分别满足对应的设定条件的情况下,确定与所述当前平均除霜温度值对应的所述空调的当前运行模式;When it is determined that the current average outdoor temperature value and the average current defrosting temperature value respectively satisfy corresponding setting conditions, determine the current operating mode of the air conditioner corresponding to the current average defrosting temperature value;
    控制所述空调以当前运行模式进行运行,并在与所述当前运行模式匹配的第一时间内,控制所述第一半导体元器件启动运行。The air conditioner is controlled to operate in a current operation mode, and the first semiconductor component is controlled to start operation within a first time period matching the current operation mode.
  2. 根据权利要求1所述的方法,其特征在于,所述确定与所述当前平均除霜温度值对应的所述空调的当前运行模式包括:The method according to claim 1, wherein the determining the current operating mode of the air conditioner corresponding to the current average defrosting temperature value comprises:
    在所述当前平均室外温度值小于或等于第一设定室外除霜温度值的情况下,若所述当前平均除霜温度值小于或等于第二设定室外除霜温度值,且大于第三设定室外除霜温度值时,将制热模式确定为所述空调的当前运行模式;In the case where the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the second set outdoor defrosting temperature value and greater than the third set outdoor defrosting temperature value When setting the outdoor defrosting temperature value, determine the heating mode as the current operating mode of the air conditioner;
    在所述当前平均室外温度值小于或等于第一设定室外除霜温度值的情况下,若所述当前平均除霜温度值小于或等于所述第三设定室外除霜温度值时,将除霜模式确定为所述空调的当前运行模式。When the current average outdoor temperature value is less than or equal to the first set outdoor defrosting temperature value, if the current average defrosting temperature value is less than or equal to the third set outdoor defrosting temperature value, the The defrosting mode is determined as the current operating mode of the air conditioner.
  3. 根据权利要求1所述的方法,其特征在于,所述控制所述第一半导体元器件启动运行包括:The method according to claim 1, wherein the controlling the start-up operation of the first semiconductor component comprises:
    在所述当前运行模式为所述制热模式的情况下,在所述半导体元器件的设定运行周期的运行时间内,控制所述第一半导体元器件启动运行;When the current operation mode is the heating mode, control the first semiconductor component to start operation within the operation time of the set operation cycle of the semiconductor component;
    在所述当前运行模式为除霜模式的情况下,在所述除霜模式对应的设定除霜时间内,控制所述第一半导体元器件启动运行。When the current operating mode is the defrosting mode, the first semiconductor component is controlled to start running within a set defrosting time corresponding to the defrosting mode.
  4. 根据权利要求3所述的方法,其特征在于,所述控制所述第一半导体元器件启动运行包括:The method according to claim 3, wherein the controlling the start-up operation of the first semiconductor component comprises:
    确定与所述当前平均除霜温度值对应的所述第一半导体元器件的当前运行档位;determining the current operating gear of the first semiconductor component corresponding to the current average defrosting temperature value;
    在与所述当前运行模式匹配的第一时间内,控制所述第一半导体元器件以所述当前运行档位运行;Controlling the first semiconductor component to operate at the current operating gear within a first time period matching the current operating mode;
    其中,所述半导体元器件对应两个或多个运行档位,半导体元器件的控制输入电流越大,对应的运行档位越高。Wherein, the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are.
  5. 根据权利要求1所述的方法,其特征在于,所述控制所述第一半导体元器件启动运行还包括:The method according to claim 1, wherein the controlling the start-up operation of the first semiconductor component further comprises:
    控制所述第一半导体元器件的第一制冷端上的第一排气扇关闭;controlling the first exhaust fan on the first refrigeration end of the first semiconductor component to be closed;
    控制所述第一半导体元器件的第一制热端上的第二排气扇运行。Controlling the operation of the second exhaust fan on the first heating end of the first semiconductor component.
  6. 根据权利要求1-5任一项所述的方法,其特征在于,还包括:The method according to any one of claims 1-5, further comprising:
    在到达与所述当前运行模式匹配的第一时间的情况下,控制所述第一半导体元器件停止运行, 并控制所述空调制热模式运行。When the first time matching the current operating mode is reached, the first semiconductor component is controlled to stop operating, and the air-conditioning and heating mode is controlled to operate.
  7. 根据权利要求6所述的方法,其特征在于,所述获取当前设定时长内的当前平均室外温度值和当前平均除霜温度值包括:The method according to claim 6, wherein said obtaining the current average outdoor temperature value and the current average defrosting temperature value within the current set time period comprises:
    在所述第一半导体元器件处于停止状态,且空调处于制热模式运行状态的持续时间到达预设采样时长的情况下,记录所述当前设定时长内,处于所述制热模式运行空调的室外温度值和除霜温度值;When the first semiconductor component is in a stopped state, and the duration of the air conditioner in the heating mode operation state reaches a preset sampling time length, record the number of times the air conditioner is running in the heating mode within the current set time length Outdoor temperature value and defrost temperature value;
    根据记录的所述室外温度值和所述除霜温度值,得到所述当前设定时长内的当前平均室外温度值和当前平均除霜温度值。According to the recorded outdoor temperature value and the defrosting temperature value, the current average outdoor temperature value and the current average defrosting temperature value within the current set time period are obtained.
  8. 一种用于空调控制的装置,其特征在于,所述空调包括两组半导体元器件,其中,第一半导体元器件的第一制冷端与空调内机连接,所述第一半导体元器件的第一制热端与空调外机连接,第二半导体元器件的第二制冷端与所述空调外机连接,所述第二半导体元器件的第二制热端与所述空调内机连接,所述装置包括:A device for air conditioner control, characterized in that the air conditioner includes two groups of semiconductor components, wherein the first cooling terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first cooling terminal of the first semiconductor component A heating terminal is connected to the air conditioner external unit, a second cooling terminal of the second semiconductor component is connected to the air conditioner external unit, and a second heating terminal of the second semiconductor component is connected to the air conditioner internal unit, so Said devices include:
    第一获取模块,被配置为获取处于制热模式运行空调当前设定时长内的当前平均室外温度值和当前平均除霜温度值;The first acquisition module is configured to acquire the current average outdoor temperature value and the current average defrosting temperature value within the current set time period of the air conditioner running in the heating mode;
    确定模块,被配置为在在确定所述当前平均室外温度值和所述平均当前除霜温度值分别满足对应的设定条件的情况下,确定与所述当前平均除霜温度值对应的所述空调的当前运行模式;A determining module configured to determine the current average outdoor temperature value and the average current defrosting temperature value corresponding to the current average defrosting temperature value in the case of determining that the The current operating mode of the air conditioner;
    第一控制模块,被配置为控制所述空调以当前运行模式进行运行,并在与所述当前运行模式匹配的第一时间内,控制所述第一半导体元器件启动运行。The first control module is configured to control the air conditioner to operate in a current operation mode, and control the first semiconductor component to start operation within a first time that matches the current operation mode.
  9. 一种用于空调控制的装置,所述空调包括两组半导体元器件,该装置包括处理器和存储有程序指令的存储器,其特征在于,所述处理器被配置为在执行所述程序指令时,执行如权利要求1至7任一项所述用于空调控制的方法。A device for controlling an air conditioner, the air conditioner includes two groups of semiconductor components, the device includes a processor and a memory storing program instructions, wherein the processor is configured to , executing the method for air conditioning control according to any one of claims 1 to 7.
  10. 一种空调,其特征在于,包括:如权利要求8或9所述用于空调控制的装置。An air conditioner, characterized by comprising: the device for air conditioner control according to claim 8 or 9.
  11. 一种存储介质,存储有程序指令,其特征在于,所述程序指令在运行时,执行如权利要求1至7任一项所述用于空调控制的方法。A storage medium storing program instructions, wherein the program instructions execute the method for air-conditioning control according to any one of claims 1 to 7 when running.
PCT/CN2022/108081 2021-12-06 2022-07-27 Control method and apparatus for air conditioner, and air conditioner and storage medium WO2023103401A1 (en)

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