WO2023103400A1 - Method and device for controlling air conditioner, and air conditioner and storage medium - Google Patents

Method and device for controlling air conditioner, and air conditioner and storage medium Download PDF

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Publication number
WO2023103400A1
WO2023103400A1 PCT/CN2022/108004 CN2022108004W WO2023103400A1 WO 2023103400 A1 WO2023103400 A1 WO 2023103400A1 CN 2022108004 W CN2022108004 W CN 2022108004W WO 2023103400 A1 WO2023103400 A1 WO 2023103400A1
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current
air conditioner
operating
frequency
semiconductor component
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PCT/CN2022/108004
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French (fr)
Chinese (zh)
Inventor
张正林
许文明
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青岛海尔空调器有限总公司
海尔智家股份有限公司
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Publication of WO2023103400A1 publication Critical patent/WO2023103400A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/50Control or safety arrangements characterised by user interfaces or communication
    • F24F11/61Control or safety arrangements characterised by user interfaces or communication using timers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/62Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63Electronic processing
    • F24F11/64Electronic processing using pre-stored data
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/62Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63Electronic processing
    • F24F11/65Electronic processing for selecting an operating mode
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/70Control systems characterised by their outputs; Constructional details thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/70Control systems characterised by their outputs; Constructional details thereof
    • F24F11/80Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air
    • F24F11/86Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air by controlling compressors within refrigeration or heat pump circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F2110/00Control inputs relating to air properties
    • F24F2110/10Temperature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Definitions

  • the present application relates to the technical field of intelligent air conditioners, for example, to methods and devices for air conditioner control, air conditioners and storage media.
  • Air conditioners have been widely used as a common smart device for adjusting the temperature and humidity of indoor environments.
  • the air conditioner can use a vapor compression refrigeration cycle to adjust the indoor temperature, which has the advantage of high energy efficiency.
  • the air conditioner may have a problem of low cooling or heating capacity when cooling at high temperature or heating at low temperature.
  • two groups of semiconductor components can be added to the air conditioner, and each group of semiconductor components is connected to the air conditioner internal unit and the air conditioner external unit respectively.
  • the cooling operation of the air conditioner can control the operation of a group of semiconductor components.
  • the evaporator inlet pipeline of the air conditioner is precooled, and the condenser inlet pipeline of the air conditioner external unit is preheated, which improves the cooling capacity of the air conditioner; while the air conditioner is heating, it can control the operation of another group of semiconductor components.
  • the evaporator inlet pipeline in the air conditioner internal unit is preheated, while the condenser inlet pipeline in the air conditioner external unit is precooled, which improves the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions.
  • the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, which meets the cooling and heating needs under severe working conditions.
  • semiconductor components are limited by materials. After long-term connection operation, the cooling or heating efficiency will decrease, and the reliability will decrease, thus affecting the operating efficiency and reliability of the air conditioner. Consumption is relatively large.
  • Embodiments of the present disclosure provide a method, device, air conditioner and storage medium for air conditioner control, so as to solve the technical problem of excessive power consumption of the air conditioner under severe working conditions.
  • the air conditioner includes two sets of semiconductor components.
  • the method includes:
  • the air conditioner compressor is controlled to operate at the first operating frequency, and the current semiconductor component is controlled to operate at the first operating state.
  • the air conditioner includes the above-mentioned device for air conditioner control.
  • the storage medium stores program instructions, and when the program instructions are executed, the above method for air conditioner control is executed.
  • the method, device and air conditioner for air conditioner control provided by the embodiments of the present disclosure can achieve the following technical effects:
  • the air conditioner is equipped with two sets of semiconductor components, and when the air conditioner starts to run in the current working mode and reaches the set start time, and the air conditioner compressor keeps running at a high frequency, if the absolute difference between the average indoor temperature value and the target indoor temperature value If the average temperature difference is still relatively large, the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted. In this way, the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, and the cooling and heating efficiency can be improved. , Only when certain conditions are met can the semiconductor components be controlled, reducing the power consumption of the air conditioner.
  • Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure
  • Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure
  • Fig. 3-1 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure
  • Fig. 3-2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure
  • Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
  • Fig. 5 is a schematic structural diagram of an air-conditioning control device provided by an embodiment of the present disclosure
  • Fig. 6 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
  • A/B means: A or B.
  • a and/or B means: A or B, or, A and B, these three relationships.
  • each group of semiconductor components is respectively connected to the air conditioner internal unit and the air conditioner external unit.
  • the heat not only meets the cooling and heating needs under severe working conditions, but also improves the cooling and heating efficiency of the air conditioner.
  • Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure.
  • the air conditioner includes: an air conditioner inner unit 100 , an air conditioner outer unit 200 and two groups of semiconductor components, namely a first semiconductor component 310 and a second semiconductor component 320 .
  • the first cooling terminal 311 of the first semiconductor component 310 is connected to the air conditioner indoor unit 100
  • the first heating terminal 312 of the first semiconductor component 310 is connected to the air conditioner external unit 200 .
  • the second cooling terminal 321 of the second semiconductor component 320 is connected to the air conditioner external unit 200 , and the second heating terminal 322 of the second semiconductor component 320 is connected to the air conditioner internal unit 100 .
  • the semiconductor component can use the thermoelectric effect of the semiconductor to connect two metals with different physical properties with a conductor and connect a direct current, so that the temperature at one end can be lowered and the temperature at the other end can be increased. It is often used in electronic components and micro heat exchange Cooling of the appliance. There are multiple sets of hotspot elements inside the semiconductor components, which can realize the cooling and heating effect of 40-50°C at the hot end, -10--20°C at the cold end, and a temperature difference of 60°C.
  • the two ends can also achieve temperature reduction and temperature rise respectively.
  • the first semiconductor component 310 and the second semiconductor component 320 can cooperate with the indoor evaporator and the outdoor condenser of the air conditioner to pre-cool and preheat the inlet pipeline of the evaporator and the inlet pipeline of the condenser respectively.
  • one end of the first cooling end 311 is connected to the evaporator of the air conditioner 100 through the indoor connector 110
  • the other end is connected to one end of the first heating end 312 through the first semiconductor component connecting pipe 313 .
  • the other end of the first heating end 312 is connected to the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
  • One end of the second heating end 322 is connected to the evaporator of the air conditioner 100 through the indoor connector 110, and the other end is connected to one end of the second cooling end 321 through the second semiconductor assembly connecting pipe 323, and the other end of the second cooling end 321 One end is connected with the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
  • the arrangement of the two ends of the first semiconductor component and the second semiconductor component is reversed, and opposite temperature changes can be realized after the start-up operation. That is, when cooling, the first semiconductor component is turned on to pre-cool the evaporator inlet pipeline in the air conditioner's inner unit, and preheat the condenser inlet pipeline in the air conditioner's outer unit, so as to realize indoor precooling and outdoor side cooling. Preheating; when heating, turn on the second semiconductor component to preheat the evaporator inlet pipeline in the air conditioner’s inner unit, and precool the condenser inlet pipeline in the air conditioner’s outer unit to achieve indoor preheating.
  • the heat and the outdoor side are pre-cooled, so that the indoor cooling capacity can be increased when the external temperature is high, and the indoor heating capacity can be increased when the external temperature is low, which meets the cooling and heating needs under severe working conditions.
  • both ends of the two groups of semiconductor components can be equipped with exhaust fans to enhance air circulation, which can strengthen the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side, so as to realize the cooling capacity/heating capacity of the system. compensate.
  • the air conditioner can also include: four exhaust fans; wherein, the first exhaust fan 410 is located on the first cooling end 311, the second exhaust fan 420 is located on the first heating end 312, and the third exhaust fan 420 is located on the first heating end 312.
  • the exhaust fan 430 is located on the second heating end 322 , and the fourth exhaust fan position 440 is located on the second cooling end 321 .
  • the cooling capacity or heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor components, which not only meets The demand for cooling and heating under certain conditions also improves the efficiency of air conditioning cooling and heating.
  • the air conditioner when the air conditioner starts to run in the current working mode and reaches the set start time, and the air conditioner compressor keeps running at high frequency, if the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value is still relatively large , you can adjust the operating parameters and status of the air conditioner compressor and semiconductor components, that is, the indoor temperature is far from the target temperature value, and after the compressor has been running at high frequency for a long time, you can turn on the semiconductor components to provide supplementary cooling for the system or Therefore, the power of the air conditioner can be flexibly controlled, and the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of semiconductor components, and the cooling and heating efficiency can be improved while reducing the power consumption of the air conditioner.
  • Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure.
  • the air conditioner can be configured with two sets of semiconductor components, or equipped with two sets of semiconductor components and their corresponding exhaust fans.
  • the processes used for air conditioning control include:
  • Step 2001 When the running time of the air conditioner in the current working mode reaches the set start time, obtain the average running frequency of the air conditioner compressor within the set start time, and obtain the current work mode within the first set time period The first average indoor temperature value of the air conditioner is operated, and the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value is obtained.
  • the air conditioner is started to run in the current working mode.
  • the vapor compression operation can be adopted, that is, the operation of the air conditioner compressor is controlled according to the collected indoor and outdoor temperature values.
  • the current working mode may include: cooling, heating, dehumidification and other modes.
  • a set start time can be set in advance. After the air conditioner starts running and reaches the set start time, the air conditioner will be in a relatively stable working state. Therefore, the set start time can be determined according to the performance parameters of the air conditioner, which can be 15, 20, 25, 30 minutes and so on.
  • the running time of the air conditioner in the current working mode reaches the set start time, for example: it has been running for 20 minutes, it indicates that the air conditioner is in a stable running state, and the average operating frequency Pp of the air conditioner compressor within the set start time can be obtained.
  • the first average indoor temperature value of the air conditioner operating in the current working mode within the first set time period can be obtained, and the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value can be obtained.
  • the area where the air conditioner is located can be equipped with an indoor temperature acquisition device, so that after the air conditioner runs to the set start time, the indoor temperature collected by the indoor temperature acquisition device can be recorded within the first set time period according to the record. value, the first average indoor temperature value Trp1 can be obtained.
  • the first set duration may be 3, 5, 8, or 10 minutes, or may also be zero, that is, the first average indoor temperature value may be the acquired instant indoor temperature value.
  • between the first average indoor temperature value Trp1 and the target indoor temperature value Tset can be obtained.
  • Step 2002 When the first absolute average temperature difference is greater than or equal to the second set temperature value, determine the first operating frequency of the air conditioner compressor that matches the average operating frequency, and the first operating state of the current semiconductor components , where the current semiconductor component matches the current working mode.
  • the air conditioner when the air conditioner is operating in cooling, heating, dehumidification and other modes, the greater the first absolute average temperature difference, the greater the required cooling or heating capacity. At this time, semiconductor components need to be activated for operation. While the first absolute average temperature difference is relatively small, it is only necessary for the air conditioner compressor to continue to operate in the current state.
  • a relatively large second set temperature value can be preset, for example: 4.5°C, 5°C, or 6°C, etc., so that when the first absolute average temperature difference is greater than or equal to the second set temperature value
  • the indoor forecasting can be realized.
  • Cold and outdoor preheating while the second cooling terminal of the second semiconductor component is connected to the external unit of the air conditioner, and the second heating terminal of the second semiconductor component is connected to the internal unit of the air conditioner, therefore, after the second semiconductor component starts running , It can realize indoor preheating and outdoor precooling.
  • the current semiconductor component matching the current working mode can be determined.
  • the current semiconductor component is the first semiconductor component; when the current working mode is heating mode, the current semiconductor component is the second semiconductor component.
  • the air conditioner compressor and The operating parameters and status of the semiconductor components can determine the first operating frequency of the air-conditioning compressor that matches the average operating frequency, and the current first operating state of the semiconductor components.
  • it may include: when the average operating frequency is less than the first set In the case of a fixed frequency, the air conditioner compressor is frequency-up processed, and the increased operating frequency is determined as the first operating frequency, and the shutdown state is determined as the first operating state of the current semiconductor components; When the operating frequency is greater than or equal to the first set frequency and less than the second set frequency, the first operating frequency of the air conditioner compressor is determined according to the start-up adjustment strategy, and the start-up operation state is determined as the first set frequency of the current semiconductor components. An operating state; when the average operating frequency is greater than or equal to the second set frequency, the obtained operating frequency of the air conditioner compressor is determined as the first operating frequency, and the starting operating state is determined as the current semiconductor component The first operating state.
  • the air conditioner compressor and semiconductor components need to be adjusted according to the average operating frequency.
  • a first set frequency and a second set frequency can be preset, wherein the second set frequency can be greater than the first set frequency, for example: the first set frequency can be 45% of the maximum operating frequency of the air conditioner compressor %, 50%, or 55%, etc., and the second set frequency can be 70%, 80%, 85%, or 90% of the maximum operating frequency of the air conditioner compressor, etc.
  • the operating frequency of the air conditioner compressor when the average operating frequency is lower than the first set frequency, it means that the operating frequency of the air conditioner compressor is not high, and the operating frequency of the air conditioner compressor can also be increased through frequency up processing, thereby increasing the cooling capacity of the air conditioner or Heating capacity, that is, at this time, there is no need to start semiconductor components, just adjust the cooling capacity or heating capacity of the air conditioner by adjusting the operating frequency of the air conditioner compressor, thereby improving the efficiency of the air conditioner. Therefore, it can be determined that the off state is the first operating state of the current semiconductor components, and it is necessary to perform frequency up processing on the air conditioner compressor, and determine the increased operating frequency as the first operating frequency.
  • the average operating frequency is greater than or equal to the first set frequency, it indicates that the air conditioner has maintained a high frequency operation during the set start time, but the indoor temperature value is still lower than the target indoor temperature value. At this time, it is necessary to turn on the semiconductor components Perform auxiliary cooling or heating, that is, adjust the cooling or heating capacity of the air conditioner by turning on the semiconductor components, thereby improving the efficiency of the air conditioner, and then determine the start-up operation state as the first operation state of the current semiconductor components.
  • the operating frequency of the compressor can be further adjusted to adjust the cooling capacity or heating capacity of the air conditioner. Wherein, when the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency, the operating frequency of the air conditioner is not particularly high.
  • the compressor can be adjusted according to the preset starting adjustment strategy of the air conditioner
  • the operating frequency is to determine the first operating frequency of the air conditioner compressor according to the start-up adjustment strategy. If the average operating frequency is greater than or equal to the second set frequency, the air conditioner is operating at high frequency. Therefore, only the operating frequency of the air conditioner needs to be kept unchanged, and the acquired operating frequency of the air conditioner compressor is determined to be the first operating frequency.
  • the air conditioner when the air conditioner is running in refrigeration mode, if the first absolute average temperature difference is greater than or equal to the second set temperature value, such as: ⁇ Trp1-Tset ⁇ 5°C, according to the set start time, The average operating frequency of the air-conditioning compressor, and adjust the operating parameters and status of the air-conditioning compressor and semiconductor components. Wherein, if the average operating frequency Pp is greater than or equal to the first set frequency, the first operating state of the first semiconductor component can be determined as the start-up operating state.
  • the second set temperature value such as: ⁇ Trp1-Tset ⁇ 5°C
  • the air conditioner can The inlet pipeline of the evaporator in the indoor unit is precooled, and the inlet pipeline of the condenser in the outdoor unit of the air conditioner is preheated, thereby increasing the cooling capacity of the air conditioner, thereby improving the cooling efficiency of the air conditioner.
  • the first absolute average temperature difference is greater than or equal to the second set temperature value, such as: ⁇ Trp1-Tset ⁇ 5°C, wherein, if the average operating frequency Pp is greater than or equal to the first set frequency, then the first operating state of the second semiconductor component is determined as the start-up operating state, so that after the second semiconductor component is started to run, the evaporator inlet pipe in the air conditioner internal unit can be
  • the air conditioner is preheated, and the condenser inlet pipeline in the air conditioner external unit is precooled, thereby increasing the heating capacity of the air conditioner, thereby improving the heating efficiency of the air conditioner.
  • Step 2003 Control the air conditioner compressor to run at the first operating frequency, and control the current semiconductor components to run at the first operating state.
  • the air conditioner compressor After determining the first operating frequency of the air conditioner compressor and the first operating state of the current semiconductor components, the air conditioner compressor can be controlled to operate at the first operating frequency, and the current semiconductor components can be controlled to operate at the first operating state.
  • controlling the air conditioner compressor to run at the first operating frequency may include: if the average operating frequency is less than the first set frequency, the air conditioner compressor is raised Frequency processing to control the air conditioner compressor to run at the increased operating frequency. If the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency, the frequency of the air conditioner compressor can be adjusted according to the start-up adjustment strategy, and the air conditioner compressor is controlled to operate at the adjusted operating frequency. If the average running frequency is greater than or equal to the second set frequency, the air conditioner compressor needs to be controlled to run at a constant running frequency.
  • the semiconductor components when the first absolute average temperature difference is greater than or equal to the second set temperature value, and the average operating frequency is greater than or equal to the first set frequency, the semiconductor components can always be controlled to be in the start-up operation state, however, Semiconductor components are limited by materials, and long-term continuous operation will reduce the reliability of components. Moreover, long-term operation of semiconductors will also increase the power consumption of the air conditioner. Therefore, when the first absolute average temperature difference is greater than or equal to the second set temperature value, and the average operating frequency is greater than or equal to the first set frequency, the time that the current semiconductor components in the air conditioner are in the start-up state can be 5, 8, 10, or 15 minutes and so on.
  • the semiconductor components do not run continuously for a long time
  • the operation period can be set as a unit to operate, and within the set operation period, the semiconductor components operate for a period of time, and the semiconductor components operate for the rest of the time.
  • Stopping, that is, setting the running cycle includes: running time and stopping time.
  • set the operating cycle to be 20 minutes. In this way, during the periodic operation of semiconductor components, it can be operated in the manner of running for 10 minutes and then stopping for 10 minutes. At this time, the operating time and stopping time are both 10 minutes.
  • the set operation period can be 30 minutes, so that during the periodic operation of semiconductor components, it can be operated in the manner of running for 20 minutes and then stopping for 10 minutes, etc. At this time, the operation time is 20 minutes, and the stop time is 10 minutes.
  • controlling the current semiconductor component to operate in the first operating state may include: controlling the current semiconductor component matching the current operating mode to operate in the first operating state for one cycle. Specifically, it may include: when the first absolute average temperature difference is greater than or equal to the second set temperature value, and the average operating frequency is greater than or equal to the first set frequency, during the operating time of the set operating cycle of the semiconductor components Within the control period, the current semiconductor components are controlled to be in the start-up operation state; and within the stop time of the set operation cycle of the semiconductor components, the current semiconductor components are controlled to be in the shutdown state.
  • ⁇ Trp1-Tset ⁇ 4.5°C, and the average operating frequency Pp ⁇ 50% of the maximum operating frequency Pmax only need to control the current semiconductor components to start within 10 minutes within 20 minutes of the set operating cycle of the semiconductor components
  • the running state can control the current semiconductor components to be in the shutdown state. That is to say, the current semiconductor components only need to be started and run for 10 minutes before they can be turned off.
  • the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, and the cooling and heating efficiency can be improved while reducing the power consumption of the air conditioner.
  • the semiconductor can be operated periodically, but the current semiconductor components may not be periodically controlled, that is, the time that the current semiconductor components of the air conditioner are in the start-up operation state may not be the operation of the set operation cycle. Time, no specific examples.
  • the power of the semiconductor components is adjustable, and the corresponding output cooling or heat is also different. Therefore, under the same control input voltage, according to different control input currents, the semiconductor components can output different cooling. volume or heat.
  • the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component is, the higher the corresponding operating gear is, and the greater the output energy is.
  • the control input voltage is 220V
  • the control input current is 0.5A, 1A, and 1.5A respectively.
  • semiconductor components correspond to three gears of low, medium, and high.
  • semiconductor components can also only correspond to low and high gears and so on.
  • controlling the current semiconductor components to operate in the first operating state includes: when the average operating frequency is greater than or equal to the first In the case of setting the frequency, determine the first operating gear of the current semiconductor component corresponding to the average operating frequency; within the running time of the set operating cycle of the semiconductor component, control the current semiconductor component to the first operating gear run.
  • the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are.
  • the current semiconductor component can be controlled to be in a shutdown state.
  • determining the first operating gear of the current semiconductor components corresponding to the average operating frequency includes: determining the second gear when the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency is the first operating gear of the current semiconductor components; when the average operating frequency is greater than or equal to the second set frequency, determine the third gear as the first operating gear of the current semiconductor components.
  • the control input current of the semiconductor components corresponding to the third gear is greater than the control input current of the semiconductor components corresponding to the second gear
  • the control input current of the semiconductor components corresponding to the second gear is greater than the control input current of the semiconductor components corresponding to the first gear. Control input current for semiconductor components.
  • the second set temperature is 4°C
  • the first set frequency is 40% of the maximum frequency Pmax
  • the second set frequency is 65% of the maximum frequency Pmax.
  • the semiconductor components correspond to two, four, five, etc. operating gears, and the corresponding first operating gears of the current semiconductor components can also be determined according to the first average outdoor temperature value, which will not be described in detail. .
  • the first operating gear of the current semiconductor component is determined, so that the current semiconductor component can be controlled to run at the first operating gear, or, within a set time period, the current semiconductor component can be controlled to run at the first operating gear .
  • the current semiconductor component can be controlled to operate at the first operating gear within the operating time of the set operating cycle of the semiconductor component.
  • the air conditioner compressor when the air conditioner starts the current working mode and reaches the set start time, and the air conditioner compressor keeps running at a high frequency, if the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value If it is still relatively large, the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted. In this way, the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, the cooling and heating efficiency can be improved, and certain requirements can be met. Conditions to control the semiconductor components, reducing the power consumption of the air conditioner. Moreover, different average operating frequencies of the compressors correspond to different operating gears of the semiconductor components, that is, correspond to different output energies of the semiconductor components, thereby further speeding up the cooling or heating efficiency of the air conditioner.
  • the air conditioner can be continued to be controlled Operate in vapor compression mode and no longer control the operation of semiconductor components.
  • the current average indoor temperature value within the current set time period can also be periodically controlled.
  • the operation of the current semiconductor components and the operation of the air conditioner compressor may include: when the current semiconductor components are in the shutdown state and the duration of the air conditioner in the current mode of operation reaches the preset sampling time, obtain the current status of the area where the air conditioner is located.
  • the current semiconductor components can be in the shutdown state.
  • the air conditioner operates in the current mode.
  • the preset sampling time can be 5, 10, 15, 25 minutes, etc. Turn off the shutdown state, and the air conditioner has been running in the current working mode.
  • the air conditioner control in the embodiment of the present disclosure can perform automatic and continuous control after the current semiconductor components operate at the first operating gear. Therefore, the current set duration corresponds to the current average indoor temperature value.
  • the set duration can be 1 minute, 5 minutes, 10 minutes, or 20 minutes, etc. In some embodiments, the current set duration can be zero.
  • the current average indoor temperature value is obtained through the indoor temperature acquisition device. The collected real-time current indoor temperature value.
  • the current absolute average temperature difference ⁇ Trp-Tset ⁇ between the current average indoor temperature value Trp and the target indoor temperature value Tset can be obtained.
  • the current absolute average temperature difference can be determined according to the current absolute average temperature difference, as well as the operating parameters and status of the air conditioner compressor and semiconductor components in the previous control corresponding to the previous set duration.
  • the current operating frequency of the air conditioner compressor matched with the temperature difference, and the current operating status of the current semiconductor components.
  • the previous operating gear of the current semiconductor component when the previous operating gear of the current semiconductor component is the highest gear, it may include: when the current absolute average temperature difference is greater than or equal to the first set temperature value, the obtained air conditioner The operating frequency of the compressor is determined as the current operating frequency, and the highest gear is determined as the current operating gear in the start-up operation state of the current semiconductor components; when the current absolute average temperature difference is less than the first set temperature value Next, if the obtained operating frequency of the air conditioner compressor is greater than or equal to the second set frequency, the frequency reduction process is performed on the air conditioner compressor, and the reduced operating frequency is determined as the current operating frequency, and the highest gear is set to It is determined as the current operating gear in the start-up operation state of the current semiconductor components; when the current absolute average temperature difference is less than the first set temperature value, if the obtained operating frequency of the air conditioner compressor is less than the second set frequency, determine the obtained operating frequency of the air conditioner compressor as the current operating frequency, and perform downshift processing on the current semiconductor components, and determine the reduced operating gear as the current operating state
  • the cooling capacity or heating capacity of the air conditioner can be reduced by downgrading or downshifting.
  • the operation of semiconductor components can increase the cooling capacity or heating capacity of the air conditioner, improve the cooling and heating efficiency, and reduce the power consumption of the air conditioner.
  • the previous operating gear of the current semiconductor components is not the highest gear, and the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference and the current operating status of the current semiconductor components are determined It may include: when the current absolute average temperature difference is greater than or equal to the second set temperature value, determining the obtained operating frequency of the air conditioner compressor as the current operating frequency, and performing upshift processing on the current semiconductor components , determine the increased operating gear as the current operating gear in the current start-up operation state of the semiconductor components; when the current absolute average temperature difference is less than the second set temperature value and greater than or equal to the first set temperature value, determine the obtained operating frequency of the air conditioner compressor as the current operating frequency, and determine the previous operating gear as the current operating gear in the current start-up operating state of the semiconductor components; in the current absolute When the average temperature difference is less than the first set temperature value, according to the start-up adjustment strategy, determine the current operating frequency of the air conditioner compressor, and perform downshift processing on the current semiconductor components, and determine the reduced operating gear as the current The current operating gear
  • an upshift can be performed to increase the cooling or heating capacity of the semiconductor components.
  • the current absolute average temperature difference is large, it is not necessary to adjust the operating parameters of the air conditioner compressor and semiconductor components; and when the current absolute average temperature difference is small, downshift processing can be performed.
  • the operation of components can increase the cooling capacity or heating capacity of the air conditioner, improve the cooling and heating efficiency, and reduce the power consumption of the air conditioner.
  • shut down and shutdown state can be determined as the current temperature of the current semiconductor components. Operating status.
  • the first set temperature value is smaller than the second set temperature value, which can be determined according to the location of the air conditioner and the performance of the air conditioner.
  • the air conditioner compressor can be controlled to operate at the current operating frequency, and the current semiconductor components can be controlled to The current running state is running.
  • the first set temperature value is 1.5°C
  • the second set temperature value is 4.5°C
  • the last operating gear of the current semiconductor component is the highest gear, that is, the third gear, if ⁇ Trp-Tset ⁇ When ⁇ 1.5°C, the operating status of the air conditioner compressor and the current semiconductor components can be kept unchanged, and the operating frequency of the air conditioner compressor can still be controlled.
  • the current Semiconductor components operate in third gear.
  • the current semiconductor component is controlled to be in a shutdown state. If ⁇ Trp-Tset ⁇ 1.5°C, at this time, it is necessary to obtain the running frequency of the air conditioner compressor.
  • the frequency reduction process can be performed on the air conditioner compressor, for example, the frequency reduction can be performed at a rate of 1HZ/1min, and the air conditioner compressor can be controlled to run at the reduced operating frequency, still
  • the highest gear can be determined as the current operating gear in the start-up operation state of the current semiconductor component, that is, within the running time of the set operating cycle of the semiconductor component, control the current semiconductor component to still run in the third gear .
  • the frequency of the compressor may not be adjusted, and the current semiconductor component needs to be downshifted.
  • the current semiconductor component may not be adjusted, and the current semiconductor component needs to be downshifted.
  • the last operating gear of the current semiconductor components is not the highest gear, that is, it may be the second gear or the first gear, if ⁇ Trp-Tset ⁇ 4.5°C, the current absolute average temperature difference is a bit large, It is necessary to increase the cooling capacity or heating capacity of the air conditioner. Therefore, it is necessary to perform upshift processing, that is, to keep the operating frequency of the air conditioner compressor unchanged, and to perform upshift processing on the current semiconductor components, that is, to operate at the set operating frequency of the semiconductor components.
  • control the current semiconductor components to run at the raised operating gear that is, the previous operating gear is the second gear, and then it can be raised to the third gear for operation, and the previous operating gear If it is the first gear, it can be raised to the second gear for operation. If 1.5°C ⁇ Trp-Tset ⁇ 4.5°C, the running status of the air conditioner compressor and the current semiconductor can be kept unchanged.
  • the current semiconductor components can be controlled to be in shutdown state.
  • the semiconductor components of the air conditioner may be equipped with a corresponding exhaust fan.
  • the exhaust fan can enhance the air circulation and enhance the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side, so as to realize the compensation of the cooling capacity/heating capacity of the system. Therefore, in some embodiments, when the current semiconductor component is in the start-up state, the operation of the corresponding exhaust fan on the current semiconductor component can also be controlled according to the current working mode.
  • the first semiconductor component when the first semiconductor component is in the starting operation state, control the operation of the first exhaust fan and the second exhaust fan configured on the first semiconductor component; when the second semiconductor component is in the starting operation state Next, control the operation of the third exhaust fan and the fourth exhaust fan arranged on the second semiconductor component.
  • the first exhaust fan is located on the first cooling end
  • the second exhaust fan is located on the first heating end
  • the third exhaust fan is located on the second heating end
  • the fourth exhaust fan is located on the second heating end.
  • the semiconductor components stop running.
  • the corresponding exhaust fans can also be turned off.
  • control the corresponding The exhaust fan is switched off. That is, when the first semiconductor component stops running, control the first exhaust fan and the second exhaust fan configured on the first semiconductor component to stop running; The third exhaust fan and the fourth exhaust fan configured on the second semiconductor component stopped running.
  • the air conditioner can still use a vapor compression refrigeration cycle to adjust the indoor temperature.
  • the air conditioner has a communication function, so that the air conditioner can also control the operation of semiconductor components according to the received instructions.
  • the switching operation of the semiconductor components in the air conditioner is controlled according to the semiconductor switch instruction. In this way, the user can control the switching of semiconductor components through the APP, which improves the intelligence and user experience of the air conditioner.
  • the operation process is integrated into a specific embodiment to illustrate the air-conditioning control process provided by the embodiment of the present disclosure.
  • the air conditioner may include two sets of semiconductor components and four exhaust fans as shown in FIG. 1 .
  • the first set temperature value stored in the air conditioner is 2°C
  • the second set temperature value is 5°C
  • the semiconductor components correspond to three operating gears
  • the output energy of the third gear is greater than the output energy of the second gear
  • the output energy of the second gear is greater than the output energy of the first gear.
  • the first set frequency is 50% of the maximum frequency Pmax of the air conditioner compressor
  • the second set frequency is 80% of the maximum frequency Pmax of the air conditioner compressor.
  • the set startup time can be 20 minutes
  • the set duration and the first set duration can be 10 minutes
  • the set operation cycle of the semiconductor components can be 20 minutes
  • the operation time of the set operation cycle is 10 minutes
  • the set The startup time can be the running time of the set running cycle, which is also 10 minutes
  • the preset sampling time can also be 10 minutes.
  • the current operating mode of the air conditioner is cooling mode
  • the corresponding current semiconductor component is the first semiconductor component.
  • Fig. 3-1 and Fig. 3-2 are schematic flowcharts of a method for controlling an air conditioner provided by an embodiment of the present disclosure. Combining Figure 1 with Figure 3-1 and Figure 3-2, the process for air conditioning control includes:
  • Step 3001 Determine whether the running time of the air conditioner to start the cooling operation has reached the set start time of 20 minutes? If so, the start-up operation has been completed, and step 3002 is performed; otherwise, step 3001 is returned.
  • Step 3002 Obtain the average running frequency P of the air conditioner compressor within the set startup time.
  • Step 3003 Record the indoor temperature value of the air conditioner in the cooling mode within 10 minutes, and obtain the first average indoor temperature value Trp1 and the first average indoor temperature value Trp1 and the target indoor temperature value Tset within 10 minutes, and obtain the first Absolute mean temperature difference ⁇ Trp1-Tset ⁇ .
  • Step 3004 Determine whether ⁇ Trp1-Tset ⁇ 5 holds true? If yes, execute step 3005; otherwise, the process ends.
  • Step 3005 Determine whether the average running frequency Pp ⁇ 50% of Pmax holds true? If yes, go to step 3006; otherwise, go to step 3007.
  • Step 3006 Perform frequency up processing on the air conditioner compressor, and control the air conditioner compressor to run at the increased operating frequency, and control the first semiconductor component to be in a shutdown state.
  • Step 3007 Determine whether 50% of Pmax ⁇ Pp ⁇ 80% of Pmax holds true? If yes, go to step 3008; otherwise, go to step 3009.
  • Step 3008 Determine the first operating frequency of the air conditioner compressor according to the start-up adjustment strategy, determine the start-up operating state as the first operating state of the first semiconductor component, and determine the second gear as the first operating state of the first semiconductor component First operating gear. Go to step 3010.
  • Step 3009 Determine the obtained operating frequency of the air conditioner compressor as the first operating frequency, determine the start-up operating state as the first operating state of the first semiconductor component, and determine the third gear as the first The first operating gear of semiconductor components. Go to step 3010.
  • Step 3010 Control the air conditioner compressor to operate at the first operating frequency, control the first semiconductor component to operate at the first operating gear, and control the first exhaust fan on the first refrigeration end of the first semiconductor component to operate, the first The second exhaust fan on the heating side operates.
  • Step 3011 Determine whether the running time of the set running cycle of the semiconductor component is 10 minutes? If yes, execute step 3012; otherwise, return to step 3010.
  • Step 3012 Control the first semiconductor component to be in shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be turned off, and the second exhaust fan on the first heating end to be turned off. And save the first running gear as the previous running gear.
  • Step 3013 Determine if the first semiconductor component is in shutdown state, and whether the duration of the air conditioner in cooling mode is ⁇ 10 minutes? If yes, execute step 3014; otherwise, return to step 3013.
  • Step 3014 Determine whether the last running gear is the third running gear? If yes, go to step 3015; otherwise, go to step 3020.
  • Step 3015 Determine whether the current absolute average temperature difference ⁇ Trp-Tset ⁇ 2 holds true? If yes, go to step 3016; otherwise, go to step 3017.
  • Step 3016 Determine the obtained operating frequency of the air conditioner compressor as the current operating frequency of the air conditioner compressor, and determine the third gear as the current operating gear in the starting operation state of the first semiconductor component. Go to step 3026.
  • Step 3017 Is it true that the acquired operating frequency P ⁇ Pmax of the air conditioner compressor is established? If yes, go to step 3018; otherwise, go to step 3019.
  • Step 3018 Perform frequency reduction processing on the air-conditioning compressor, and determine the reduced operating frequency as the current operating frequency of the air-conditioning compressor, and determine the third gear as the current operating state of the first semiconductor component. Operating gear. Go to step 3026.
  • Step 3019 Determine the obtained operating frequency of the air conditioner compressor as the current operating frequency of the air conditioner compressor, and perform downshift processing on the first semiconductor component, and determine the second operating gear as the first semiconductor component’s operating frequency. Start the current running gear in the running state. Go to step 3026.
  • Step 3020 Determine whether the current absolute average temperature difference ⁇ Trp-Tset ⁇ 5 holds true? If yes, go to step 3021; otherwise, go to step 3022.
  • Step 3021 Determine the obtained operating frequency of the air conditioner compressor as the current operating frequency of the air conditioner compressor, and perform upshift processing on the first semiconductor component, and determine the increased operating gear as the first semiconductor component The current operating gear in the starting operating state of . Go to step 3026.
  • Step 3022 Determine if 2 ⁇ Trp-Tset ⁇ 5 holds true? If yes, go to step 3023; otherwise, go to step 3024.
  • Step 3023 Determine the obtained operating frequency of the air conditioner compressor as the current operating frequency, and determine the previous operating gear as the current operating gear in the start-up operating state of the first semiconductor component. Go to step 3026.
  • Step 3024 Determine whether the previous gear is the first gear? If yes, go to step 3028; otherwise, go to step 3025.
  • Step 3025 According to the start-up adjustment strategy, determine the current operating frequency of the air conditioner compressor, and perform downshift processing on the first semiconductor component, and determine the lowered operating gear as the current frequency in the start-up operation state of the first semiconductor component. Operating gear. Go to step 3026.
  • Step 3026 Control the air conditioner compressor to run at the current operating frequency, control the first semiconductor component to run at the current operating gear, and control the first exhaust fan on the first refrigeration end of the first semiconductor component to run, the first system The second exhaust fan on the hot end operates.
  • Step 3027 When the operating time of the set operating period of the semiconductor components reaches 10 minutes, control the first semiconductor components to be in a shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor components to close , the second exhaust fan on the first heating end is turned off. And save the current running gear as the previous running gear. Go to step 3013.
  • Step 3028 According to the start-up adjustment strategy, control the operation of the air conditioner compressor, and control the first semiconductor component to be in the shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be closed, the first system The second exhaust fan on the hot end is off.
  • two sets of semiconductor components are configured in the air conditioner, and when the air conditioner starts to run in the current working mode and reaches the set start time, and the air conditioner compressor keeps running at a high frequency, if the average indoor temperature value is equal to the target If the absolute average temperature difference between indoor temperature values is still relatively large, the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted, so that the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components. The cooling and heating efficiency is improved, and the semiconductor components are controlled only when certain conditions are met, thereby reducing the power consumption of the air conditioner.
  • an apparatus for air-conditioning control can be constructed.
  • Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
  • the air conditioner includes two sets of semiconductor components, or two sets of semiconductor components and their corresponding exhaust fans.
  • the air conditioner control device includes: a first acquisition module 4100 , a determination module 4200 and a first control module 4300 .
  • the first acquisition module 4100 is configured to acquire the average operating frequency of the air conditioner compressor within the set start time when the running time of the air conditioner in the current working mode reaches the set start time, and acquire the first set duration In the current working mode, the first average indoor temperature value of the air conditioner is operated, and the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value is obtained.
  • the first determination module 4200 is configured to determine the first operating frequency of the air conditioner compressor that matches the average operating frequency and the current A first operating state of the device, wherein the current semiconductor component matches the current operating mode.
  • the first control module 4300 is configured to control the air conditioner compressor to operate at the first operating frequency, and control the current semiconductor components to operate at the first operating state.
  • the first determining module 4200 includes:
  • the first determination unit is configured to perform up-frequency processing on the air conditioner compressor when the average operating frequency is less than the first set frequency, determine the increased operating frequency as the first operating frequency, and turn off the The shutdown state is determined as the first operating state of the current semiconductor component.
  • the second determination unit is configured to determine the first operating frequency of the air conditioner compressor according to the start-up adjustment strategy when the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency, and will start the The running state is determined as the first running state of the current semiconductor component.
  • the third determining unit is configured to determine the obtained operating frequency of the air conditioner compressor as the first operating frequency and determine the start-up operating state as the current when the average operating frequency is greater than or equal to the second set frequency The first operating state of a semiconductor component.
  • the first control module 4300 includes:
  • the first gear determining unit is configured to determine the first operating gear of the current semiconductor component corresponding to the average operating frequency when the average operating frequency is greater than or equal to the first set frequency.
  • the first control unit is configured to control the current semiconductor component to operate at the first operating gear during the operating time of the set operating cycle of the semiconductor component; during the stop time of the set operating cycle of the semiconductor component, control The current semiconductor components are in shutdown state.
  • the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are.
  • the device also includes:
  • the second acquiring module is configured to acquire the current average indoor air conditioner within the current set period of time in the area where the air conditioner is located when the current semiconductor components are in the shutdown state and the duration of the air conditioner in the current mode of operation reaches the preset sampling period. temperature value, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value.
  • the second determination module is configured to determine the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference, and the current operating state of the semiconductor components.
  • the second control module is configured to control the air conditioner compressor to operate at the current operating frequency, and to control the current semiconductor components to operate at the current operating state.
  • the second determination module when the previous operating gear of the current semiconductor component is the highest gear, includes:
  • the fourth determination unit is configured to determine the obtained running frequency of the air conditioner compressor as the current running frequency and set the maximum gear position to It is determined as the current operating gear in the start-up operating state of the current semiconductor component.
  • the fifth determining unit is configured to, when the current absolute average temperature difference is less than the first set temperature value, if the acquired operating frequency of the air conditioner compressor is greater than or equal to the second set frequency, the air conditioner compressor Perform frequency reduction processing, and determine the reduced operating frequency as the current operating frequency, and determine the highest gear as the current operating gear in the start-up operation state of the current semiconductor components;
  • the sixth determination unit is configured to compress the obtained air conditioner compressor to The operating frequency of the machine is determined as the current operating frequency, and the current semiconductor component is downshifted, and the reduced operating gear is determined as the current operating gear in the start-up operation state of the current semiconductor component.
  • the second determination module when the previous operating gear of the current semiconductor component is not the highest gear, includes:
  • the seventh determination unit is configured to determine the obtained operating frequency of the air conditioner compressor as the current operating frequency when the current absolute average temperature difference is greater than or equal to the second set temperature value, and determine the current operating frequency of the semiconductor element
  • the device performs an upshift process, and determines the elevated operating gear as the current operating gear in the current start-up operation state of the semiconductor component.
  • the eighth determination unit is configured to determine the obtained operating frequency of the air conditioner compressor as The current operating frequency, and determining the previous operating gear as the current operating gear in the current start-up operating state of the semiconductor component.
  • the ninth determination unit is configured to determine the current operating frequency of the air conditioner compressor according to the start-up adjustment strategy and perform downshift processing on the current semiconductor components when the current absolute average temperature difference is less than the first set temperature value. , determining the reduced operating gear as the current operating gear in the current start-up operating state of the semiconductor components.
  • the ninth determining unit is specifically configured to determine that the shutdown state is closed if the current absolute average temperature difference is less than the first set temperature value when the previous operating gear is the lowest gear. The current operating status of the current semiconductor component.
  • the following is an example to illustrate the air-conditioning control process performed by the device for air-conditioning control provided by the embodiments of the present disclosure.
  • the air conditioner can be shown in Figure 1, including two sets of semiconductor components and four exhaust fans.
  • the first set temperature value stored in the air conditioner is 2.5°C
  • the second set temperature value is 5.5°C.
  • the semiconductor components correspond to three operating gears
  • the output energy of the third gear is greater than the output energy of the second gear
  • the output energy of the second gear is greater than the output energy of the first gear.
  • the first set frequency is 50% of the highest frequency of the air conditioner compressor
  • the second set frequency is 80% of the highest frequency of the air conditioner compressor.
  • the set start time can be 20 minutes, the set duration and the first set duration can be 12 minutes, the set operation cycle of the semiconductor components can be 30 minutes, and the operation time of the set operation cycle is 15 minutes; and the set start time can be In order to set the running time of the running cycle, it is also 15 minutes; the preset sampling time can also be 15 minutes.
  • the current operating mode of the air conditioner is the heating mode, and the corresponding second semiconductor component is the second semiconductor component.
  • Fig. 5 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
  • the air conditioner control device includes: a first acquisition module 4100, a first determination module 4200, a first control module 4300, a second acquisition module 4400, a second determination module 4500 and a second control module 4600, wherein , the first determination module 4200 includes: a first determination unit 4210 , a second determination unit 4220 and a third determination unit 4320 , and the first control module 4300 includes: a first gear position determination unit 4310 and a first control unit 4320 .
  • the second determination module 4500 includes: a third determination unit 4510 , a fourth determination unit 4520 , a sixth determination unit 4530 , a seventh determination unit 4540 , an eighth determination unit 4550 and a ninth determination unit 4560 .
  • the first flower acquisition module 4100 can obtain the average operating frequency P of the air conditioner compressor within 20 minutes, and can record that it is running in the heating mode within 12 minutes.
  • the first average indoor temperature value Trp1 within 12 minutes is obtained, and based on the current average indoor temperature value Trp1 and the target indoor temperature value Tset, the current absolute average temperature difference ⁇ Trp1-Tset ⁇ is obtained.
  • the air conditioner operates normally for heating.
  • the first determination unit 4210 in the first determination module 4200 can increase the frequency of the air conditioner compressor, and increase the The operating frequency is determined as the first operating frequency, and the shutdown state is determined as the first operating state of the second semiconductor component. Therefore, the first control module 4300 can perform frequency up processing on the air conditioner compressor and control the air conditioner compressor. The machine runs at the increased operating frequency, and the second semiconductor component is controlled to be in a shutdown state.
  • the second determination unit 4220 in the first determination module 4200 determines the first operating frequency of the air conditioner compressor according to the start-up adjustment strategy , and determine the starting operating state as the first operating state of the second semiconductor component, and the first gear determination unit 4310 in the first control module 4300 determines the second gear as the first operating state of the second semiconductor component stalls.
  • the third determination unit 4230 in the first determination module 4200 determines the acquired operating frequency of the air conditioner compressor as the first operating frequency, and The startup operation state is determined as the first operation state of the second semiconductor component, and the first gear determining unit 4310 determines the third gear as the first operation gear of the second semiconductor component.
  • the first control unit 4320 in the first control module 4300 can control the air conditioner compressor to operate at the first operating frequency, control the second semiconductor components to operate at the first operating gear, and control the first operating frequency of the second semiconductor components.
  • the first exhaust fan on the heating side runs, and the second exhaust fan on the first heating side runs.
  • the first control unit 4320 can control the second semiconductor components to be in shutdown state, and control the second heating terminal of the second semiconductor components
  • the third exhaust fan on the heating end is turned off, and the fourth exhaust fan on the second heating end is turned off. And save the first running gear as the previous running gear.
  • the second semiconductor component After the second semiconductor component is controlled to operate at the first operating gear, the second semiconductor component can be continuously controlled.
  • the second acquisition module 4400 obtains the current time within 12 minutes of the current set time length of the area where the air conditioner is located.
  • the fourth determining unit 4510 in the second determining module 4500 can obtain the operating frequency of the air conditioner compressor, It is determined as the current operating frequency of the air conditioner compressor, and the third gear is determined as the current operating gear in the starting operation state of the second semiconductor component.
  • the fifth determination unit 4520 can perform frequency reduction processing on the air-conditioning compressor, and reduce the operating frequency of the air-conditioning compressor
  • the frequency is determined as the current operating frequency of the air conditioner compressor
  • the third gear is determined as the current operating gear in the start-up operating state of the second semiconductor component.
  • the sixth determination unit 4530 determines the obtained operating frequency of the air-conditioning compressor as the air-conditioning compressor The current operating frequency of the second semiconductor component is downshifted, and the second operating gear is determined as the current operating gear in the start-up operating state of the second semiconductor component.
  • the seventh determination unit 4540 can determine the acquired operating frequency of the air conditioner compressor as the current operating frequency of the air conditioner compressor frequency, and perform an upshift process on the second semiconductor component, and determine the raised operating gear as the current operating gear in the start-up operating state of the second semiconductor component.
  • the eighth determination unit 4550 can determine the obtained operating frequency of the air conditioner compressor as the current operating frequency, and determine the previous operating gear as the second The current operating gear in the start-up operating state of the semiconductor component.
  • the ninth determination unit 4560 determines the current operating frequency of the air conditioner compressor according to the start-up adjustment strategy, and performs downshift processing on the second semiconductor component to determine the reduced operating gear is the current operating gear in the start-up operating state of the second semiconductor component. Wherein, if the previous operating gear is the lowest gear, when downshifting the second semiconductor component, the ninth determination unit 4560 determines the shutdown state as the current operating state of the second semiconductor component.
  • the second control module 4600 can control the air conditioner compressor to operate at the current operating frequency, control the second semiconductor component to operate at the current operating gear, and control the first exhaust gas on the first heating terminal of the second semiconductor component
  • the fan is running, and the second exhaust fan on the first heating side is running.
  • the second control module 4600 can control the second semiconductor component to be in the shutdown state, and control the second heating terminal of the second semiconductor component
  • the third exhaust fan on the heating end is turned off
  • the fourth exhaust fan on the second heating end is turned off. And save the current running gear as the previous running gear.
  • two sets of semiconductor components are configured in the air conditioner.
  • the device for air conditioner control runs in the current working mode of the air conditioner and reaches the set start time, and the air conditioner compressor keeps running at a relatively high frequency, if If the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value is still relatively large, the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted, so that the air conditioner can be improved by controlling the operation of the semiconductor components.
  • the cooling capacity or heating capacity improves the cooling and heating efficiency, and the semiconductor components are controlled only when certain conditions are met, reducing the power consumption of the air conditioner.
  • An embodiment of the present disclosure provides a device for air conditioning control, the structure of which is shown in Figure 6, including:
  • a processor (processor) 1000 and a memory (memory) 1001 may also include a communication interface (Communication Interface) 1002 and a bus 1003. Wherein, the processor 1000 , the communication interface 1002 , and the memory 1001 can communicate with each other through the bus 1003 . Communication interface 1002 may be used for information transfer.
  • the processor 1000 can call the logic instructions in the memory 1001 to execute the method for air conditioner control in the above embodiments.
  • the above logic instructions in the memory 1001 may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as an independent product.
  • the memory 1001 can be used to store software programs and computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure.
  • the processor 1000 executes function applications and data processing by running program instructions/modules stored in the memory 1001 , that is, implements the method for air-conditioning control in the above method embodiments.
  • the memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required by a function; the data storage area may store data created according to the use of the terminal air conditioner, and the like.
  • the memory 1001 may include a high-speed random access memory, and may also include a non-volatile memory.
  • An embodiment of the present disclosure provides an air-conditioning control device, including: a processor and a memory storing program instructions, and the processor is configured to execute an air-conditioning control method when executing the program instructions.
  • An embodiment of the present disclosure provides an air conditioner, including the above-mentioned control device for an air conditioner.
  • An embodiment of the present disclosure provides a computer-readable storage medium, which stores computer-executable instructions, and the computer-executable instructions are configured to execute the above method for controlling an air conditioner.
  • An embodiment of the present disclosure provides a computer program product, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program includes program instructions, and when the program instructions are executed by a computer, the The computer executes the above method for air conditioning control.
  • the above-mentioned computer-readable storage medium may be a transitory computer-readable storage medium, or a non-transitory computer-readable storage medium.
  • the technical solutions of the embodiments of the present disclosure can be embodied in the form of software products.
  • the computer software products are stored in a storage medium and include one or more instructions to make a computer air conditioner (which can be a personal computer, a server, or a network air conditioner, etc.) execute all or part of the steps of the method described in the embodiments of the present disclosure.
  • the aforementioned storage medium can be a non-transitory storage medium, including: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc.
  • a first element could be called a second element, and likewise, a second element could be called a first element, as long as all occurrences of "first element” are renamed consistently and all occurrences of "Second component” can be renamed consistently.
  • the first element and the second element are both elements, but may not be the same element.
  • the terms used in the present application are used to describe the embodiments only and are not used to limit the claims. As used in the examples and description of the claims, the singular forms "a”, “an” and “the” are intended to include the plural forms as well unless the context clearly indicates otherwise .
  • the term “and/or” as used in this application is meant to include any and all possible combinations of one or more of the associated listed ones.
  • the term “comprise” and its variants “comprises” and/or comprising (comprising) etc. refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these.
  • an element defined by the statement “comprising a " does not exclude the presence of additional identical elements in the process, method or condition comprising said element.
  • the disclosed methods and products can be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units may only be a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined Or it can be integrated into another system, or some features can be ignored, or not implemented.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
  • each functional unit in the embodiments of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
  • each block in a flowchart or block diagram may represent a module, program segment, or part of code that includes one or more Executable instructions.
  • the functions noted in the block may occur out of the order noted in the figures.
  • two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved.
  • the operations or steps corresponding to different blocks may also occur in a different order than that disclosed in the description, and sometimes there is no specific agreement between different operations or steps.
  • each block in the block diagrams and/or flowcharts, and combinations of blocks in the block diagrams and/or flowcharts can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by dedicated hardware implemented in combination with computer instructions.

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Abstract

A method for controlling an air conditioner, the method comprising: when the operation time of an air conditioner operating in the current working mode reaches a set activation time, obtaining the average operation frequency of an air conditioner compressor within the set activation time, obtaining a first average indoor temperature of the air conditioner operating in the current working mode within a first set duration, and obtaining the first absolute average temperature difference between the first average indoor temperature and a target indoor temperature; when the first absolute average temperature difference is greater than or equal to a second set temperature, determining a first operation frequency of the air conditioner compressor matching the average operation frequency, and a first operation state of the current semiconductor component, wherein the current semiconductor component matches the current working mode; and controlling the air conditioner compressor to operate at the first operation frequency, and controlling the current semiconductor component to operate in the first operation state. Further disclosed are a device for controlling an air conditioner, and a storage medium and an air conditioner.

Description

用于空调控制的方法、装置、空调及存储介质Method, device, air conditioner and storage medium for air conditioner control
本申请基于申请号为202111481624.6、申请日为2021年12月6日的中国专利申请提出,并要求该中国专利申请的优先权,该中国专利申请的全部内容在此引入本申请作为参考。This application is based on a Chinese patent application with application number 202111481624.6 and a filing date of December 6, 2021, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.
技术领域technical field
本申请涉及智能空调技术领域,例如涉及用于空调控制的方法、装置、空调及存储介质。The present application relates to the technical field of intelligent air conditioners, for example, to methods and devices for air conditioner control, air conditioners and storage media.
背景技术Background technique
空调作为一种常见调节室内环境温湿度的智能设备已被广泛应用。相关技术中,空调可采用蒸气压缩式制冷循环,来实现室内温度的调节,具有能效高的优点,但是,在高温制冷或低温制热时,空调可能会出现制冷量或制热量低的问题。Air conditioners have been widely used as a common smart device for adjusting the temperature and humidity of indoor environments. In the related art, the air conditioner can use a vapor compression refrigeration cycle to adjust the indoor temperature, which has the advantage of high energy efficiency. However, the air conditioner may have a problem of low cooling or heating capacity when cooling at high temperature or heating at low temperature.
目前,可在空调中增加了两组半导体元器件,每组半导体元器件分别与空调内机和空调外机连接,这样,空调制冷运行,可控制一组半导体元器件运行,对空调内机中的蒸发器入口管路进行预冷,而对空调外机中的冷凝器入口管路进行预热,提高了空调的制冷量;而空调制热运行,可控制另一组半导体元器件运行,对空调内机中的蒸发器入口管路进行预热,而对空调外机中的冷凝器入口管路进行预冷,提高了空调的制热量,满足了在恶劣工况下的制冷制热需求。At present, two groups of semiconductor components can be added to the air conditioner, and each group of semiconductor components is connected to the air conditioner internal unit and the air conditioner external unit respectively. In this way, the cooling operation of the air conditioner can control the operation of a group of semiconductor components. The evaporator inlet pipeline of the air conditioner is precooled, and the condenser inlet pipeline of the air conditioner external unit is preheated, which improves the cooling capacity of the air conditioner; while the air conditioner is heating, it can control the operation of another group of semiconductor components. The evaporator inlet pipeline in the air conditioner internal unit is preheated, while the condenser inlet pipeline in the air conditioner external unit is precooled, which improves the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions.
可见,空调配置了两组半导体元器件后,可通过控制半导体元器件的运行来提高空调的制冷量或制热量,满足了在恶劣工况下的制冷制热需求。但是,半导体元器件受材料限制,长时间连线运行后,制冷或制热效率降低,可靠性下降,从而,影响空调运行效率以及可靠性,并且,长时间运行半导体元器件,会使得空调的功耗比较大。It can be seen that after the air conditioner is equipped with two sets of semiconductor components, the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, which meets the cooling and heating needs under severe working conditions. However, semiconductor components are limited by materials. After long-term connection operation, the cooling or heating efficiency will decrease, and the reliability will decrease, thus affecting the operating efficiency and reliability of the air conditioner. Consumption is relatively large.
发明内容Contents of the invention
为了对披露的实施例的一些方面有基本的理解,下面给出了简单的概括。所述概括不是泛泛评述,也不是要确定关键/重要组成元素或描绘这些实施例的保护范围,而是作为后面的详细说明的序言。In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. The summary is not intended to be an extensive overview nor to identify key/important elements or to delineate the scope of these embodiments, but rather serves as a prelude to the detailed description that follows.
本公开实施例提供了一种用于空调控制的方法、装置、空调和存储介质,以解决在恶劣工况下,空调功耗过大的技术问题。所述空调包括两组半导体元器件。Embodiments of the present disclosure provide a method, device, air conditioner and storage medium for air conditioner control, so as to solve the technical problem of excessive power consumption of the air conditioner under severe working conditions. The air conditioner includes two sets of semiconductor components.
在一些实施例中,所述方法包括:In some embodiments, the method includes:
在空调以当前工作模式运行的运行时间到达设定启动时间情况下,获取所述设定启动时间内,所述空调压缩机的平均运行频率,以及,获取第一设定时长内,处于当前工作模式运行空调的第一平均室内温度值,并得到所述第一平均室内温度值与目标室内温度值之间的第一绝对平均温度差值;When the running time of the air conditioner in the current working mode reaches the set start time, obtain the average running frequency of the air conditioner compressor within the set start time, and obtain the current working frequency within the first set time period Mode operation of the first average indoor temperature value of the air conditioner, and obtaining the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value;
在所述第一绝对平均温度差值大于或等于第二设定温度值的情况下,确定与所述平均运行频率匹配的所述空调压缩机的第一运行频率,以及当前半导体元器件的第一运行状态,其中,所述当前半导体元器件与所述当前工作模式匹配;When the first absolute average temperature difference is greater than or equal to the second set temperature value, determine the first operating frequency of the air-conditioning compressor that matches the average operating frequency, and the first operating frequency of the current semiconductor components an operating state, wherein the current semiconductor component matches the current working mode;
控制所述空调压缩机以所述第一运行频率运行,以及,控制所述当前半导体元器件以所述第一运行状态运行。The air conditioner compressor is controlled to operate at the first operating frequency, and the current semiconductor component is controlled to operate at the first operating state.
在一些实施例中,所述空调,包括上述用于空调控制的装置。In some embodiments, the air conditioner includes the above-mentioned device for air conditioner control.
在一些实施例中,所述存储介质,存储有程序指令,所述程序指令在运行时,执行上述用于空调控制的方法。In some embodiments, the storage medium stores program instructions, and when the program instructions are executed, the above method for air conditioner control is executed.
本公开实施例提供的用于空调控制的方法、装置和空调,可以实现以下技术效果:The method, device and air conditioner for air conditioner control provided by the embodiments of the present disclosure can achieve the following technical effects:
空调中配置了两组半导体元器件,并且,在空调启动当前工作模式运行到达设定启动时间,且空调压缩机保持较高频运行时,若平均室内温度值与目标室内温度值之间的绝对平均温度差值仍然比较大,则可调整空调压缩机以及半导体元器件的运行参数以及状态,这样,通过控制半导体元器件的运行来提高空调的制冷量或制热量,提高了制冷制热效率,并且,满足一定的条件才对半导体元器件进行控制,减少了空调的功耗。The air conditioner is equipped with two sets of semiconductor components, and when the air conditioner starts to run in the current working mode and reaches the set start time, and the air conditioner compressor keeps running at a high frequency, if the absolute difference between the average indoor temperature value and the target indoor temperature value If the average temperature difference is still relatively large, the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted. In this way, the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, and the cooling and heating efficiency can be improved. , Only when certain conditions are met can the semiconductor components be controlled, reducing the power consumption of the air conditioner.
以上的总体描述和下文中的描述仅是示例性和解释性的,不用于限制本申请。The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.
附图说明Description of drawings
一个或多个实施例通过与之对应的附图进行示例性说明,这些示例性说明和附图并不构成对实施例的限定,附图中具有相同参考数字标号的元件示为类似的元件,附图不构成比例限制,并且其中:One or more embodiments are exemplified by the corresponding drawings, and these exemplifications and drawings do not constitute a limitation to the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, The drawings are not limited to scale and in which:
图1是本公开实施例提供的一种空调的结构示意图;Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure;
图2是本公开实施例提供的一种用于空调控制方法的流程示意图;Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;
图3-1是本公开实施例提供的一种用于空调控制方法的流程示意图;Fig. 3-1 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;
图3-2是本公开实施例提供的一种用于空调控制方法的流程示意图;Fig. 3-2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;
图4是本公开实施例提供的一种用于空调控制装置的结构示意图;Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure;
图5是本公开实施例提供的一种用于空调控制装置的结构示意图;Fig. 5 is a schematic structural diagram of an air-conditioning control device provided by an embodiment of the present disclosure;
图6是本公开实施例提供的一种用于空调控制装置的结构示意图。Fig. 6 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
具体实施方式Detailed ways
为了能够更加详尽地了解本公开实施例的特点与技术内容,下面结合附图对本公开实施例的实现进行详细阐述,所附附图仅供参考说明之用,并非用来限定本公开实施例。在以下的技术描述中,为方便解释起见,通过多个细节以提供对所披露实施例的充分理解。然而,在没有这些细节的情况下,一个或多个实施例仍然可以实施。在其它情况下,为简化附图,熟知的结构和装置可以简化展示。In order to understand the characteristics and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present disclosure. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.
本公开实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便这里描述的本公开实施例的实施例。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含。The terms "first", "second" and the like in the description and claims of the embodiments of the present disclosure and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the data so used may be interchanged under appropriate circumstances so as to facilitate the embodiments of the disclosed embodiments described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion.
除非另有说明,术语“多个”表示两个或两个以上。Unless stated otherwise, the term "plurality" means two or more.
本公开实施例中,字符“/”表示前后对象是一种“或”的关系。例如,A/B表示:A或B。In the embodiments of the present disclosure, the character "/" indicates that the preceding and following objects are an "or" relationship. For example, A/B means: A or B.
术语“和/或”是一种描述对象的关联关系,表示可以存在三种关系。例如,A和/或B,表示:A或B,或,A和B这三种关系。The term "and/or" is an associative relationship describing objects, indicating that there can be three relationships. For example, A and/or B means: A or B, or, A and B, these three relationships.
本公开实施例中,空调中增加了两组半导体元器件,每组半导体元器件分别与空调内机和空调外机连接,这样,可通过控制半导体元器件的运行来提高空调的制冷量或制热量,不仅满足了在恶劣工况下的制冷制热需求,也提高了空调制冷制热的效率。In the embodiment of the present disclosure, two groups of semiconductor components are added to the air conditioner, and each group of semiconductor components is respectively connected to the air conditioner internal unit and the air conditioner external unit. The heat not only meets the cooling and heating needs under severe working conditions, but also improves the cooling and heating efficiency of the air conditioner.
图1是本公开实施例提供的一种空调的结构示意图。如图1所示,空调包括:空调内机100、空调外机200以及两组半导体元器件,分别是第一半导体元器件310和第二半导体元器件320。Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure. As shown in FIG. 1 , the air conditioner includes: an air conditioner inner unit 100 , an air conditioner outer unit 200 and two groups of semiconductor components, namely a first semiconductor component 310 and a second semiconductor component 320 .
第一半导体元器件310的第一制冷端311与空调内机100连接,第一半导体元器件310的第一制热端312与空调外机200连接。The first cooling terminal 311 of the first semiconductor component 310 is connected to the air conditioner indoor unit 100 , and the first heating terminal 312 of the first semiconductor component 310 is connected to the air conditioner external unit 200 .
第二半导体元器件320的第二制冷端321与空调外机200连接,第二半导体元器件320的第二制热端322与空调内机100连接。The second cooling terminal 321 of the second semiconductor component 320 is connected to the air conditioner external unit 200 , and the second heating terminal 322 of the second semiconductor component 320 is connected to the air conditioner internal unit 100 .
本公开实施例中,半导体元器件可利用半导体的热电效应,用导体连接两块不同物性不同的金属并接通直流电,可以实现一端温度降低、一端温度升高,常用于电子元件和微型换热器的冷却。半导体元器件内部存在多组热点元件,可以实现热端40~50℃,冷端-10~-20℃,温差60℃的制冷制热效果。In the embodiment of the present disclosure, the semiconductor component can use the thermoelectric effect of the semiconductor to connect two metals with different physical properties with a conductor and connect a direct current, so that the temperature at one end can be lowered and the temperature at the other end can be increased. It is often used in electronic components and micro heat exchange Cooling of the appliance. There are multiple sets of hotspot elements inside the semiconductor components, which can realize the cooling and heating effect of 40-50°C at the hot end, -10--20°C at the cold end, and a temperature difference of 60°C.
其中,第一半导体元器件310开启运行后,第一制冷端311中有多组热点元件,可实现温度降低,而第一制热端312中也有多组热点元件,但可实现温度升高。第二半导体元器件320开启运行后,两端也可分别实现温度降低和温度升高,其中,第二制冷端321中有多组热点元件,可实现温度降低,而第二制热端322中也多组热点元件,可实现温度升高。Wherein, after the first semiconductor component 310 is turned on and operated, there are multiple sets of hotspot elements in the first cooling end 311 to lower the temperature, and there are also multiple sets of hotspot elements in the first heating end 312 to increase the temperature. After the second semiconductor component 320 is turned on and running, the two ends can also achieve temperature reduction and temperature rise respectively. Among them, there are multiple groups of hotspot elements in the second cooling end 321, which can realize temperature reduction, while the second heating end 322 There are also multiple sets of hot spot elements to achieve temperature rise.
在一些实施例中,第一半导体元器件310,第二半导体元器件320可与空调室内蒸发器和室外冷凝器配合,分别对蒸发器入口管路和冷凝器入口管路进行预冷和预热。可如图1所示,第一制冷端311的一端通过室内连接件110与空调内机100的蒸发器连接,另一端通过第一半导体组件连接管313与第一制热端312的一端连接,第一制热端312的另一端通过室外连接件210与空调外机200的冷凝器连接。In some embodiments, the first semiconductor component 310 and the second semiconductor component 320 can cooperate with the indoor evaporator and the outdoor condenser of the air conditioner to pre-cool and preheat the inlet pipeline of the evaporator and the inlet pipeline of the condenser respectively. . As shown in FIG. 1 , one end of the first cooling end 311 is connected to the evaporator of the air conditioner 100 through the indoor connector 110 , and the other end is connected to one end of the first heating end 312 through the first semiconductor component connecting pipe 313 . The other end of the first heating end 312 is connected to the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
第二制热端322的一端通过室内连接件110与空调内机100的蒸发器连接,另一端通过第二半导体组件连接管323与第二制冷端321的一端连接,第二制冷端321的另一端通过室外连接件210与空调外机200的冷凝器连接。One end of the second heating end 322 is connected to the evaporator of the air conditioner 100 through the indoor connector 110, and the other end is connected to one end of the second cooling end 321 through the second semiconductor assembly connecting pipe 323, and the other end of the second cooling end 321 One end is connected with the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
可见,第一半导体元器件和第二半导体元器件的两端布置相反,开启运行后可以实现相反的温度变化。即制冷时,开启第一半导体元器件,可以对空调内机中的蒸发器入口管路进行预冷,而对空调外机中的冷凝器入口管路进行预热,实现室内测预冷和室外侧预热;制热时,开启第二半导体元器件,可以对空调内机中的蒸发器入口管路进行预热,而对空调外机中的冷凝器入口管路进行预冷,实现室内侧预热和室外侧预冷,从而,可以在外界高温时提高室内制冷量,在外界低温时提高室内制热量,满足了在恶劣工况下的制冷制热需求。It can be seen that the arrangement of the two ends of the first semiconductor component and the second semiconductor component is reversed, and opposite temperature changes can be realized after the start-up operation. That is, when cooling, the first semiconductor component is turned on to pre-cool the evaporator inlet pipeline in the air conditioner's inner unit, and preheat the condenser inlet pipeline in the air conditioner's outer unit, so as to realize indoor precooling and outdoor side cooling. Preheating; when heating, turn on the second semiconductor component to preheat the evaporator inlet pipeline in the air conditioner’s inner unit, and precool the condenser inlet pipeline in the air conditioner’s outer unit to achieve indoor preheating. The heat and the outdoor side are pre-cooled, so that the indoor cooling capacity can be increased when the external temperature is high, and the indoor heating capacity can be increased when the external temperature is low, which meets the cooling and heating needs under severe working conditions.
在一些实施例中,两组半导体元器件的两端均可配有加强空气循环的排风扇,可以强化半导体元器件两端与室内/室外侧的热量交换,从而实现对系统制冷量/制热量的补偿。如图1所示,空调还可包括:四个排气扇;其中,第一排气扇位于410第一制冷端311上,第二排气扇420位于第一制热端312上,第三排气扇430位于第二制热端322上,第四排气扇位440位于第二制冷端321上。In some embodiments, both ends of the two groups of semiconductor components can be equipped with exhaust fans to enhance air circulation, which can strengthen the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side, so as to realize the cooling capacity/heating capacity of the system. compensate. As shown in Figure 1, the air conditioner can also include: four exhaust fans; wherein, the first exhaust fan 410 is located on the first cooling end 311, the second exhaust fan 420 is located on the first heating end 312, and the third exhaust fan 420 is located on the first heating end 312. The exhaust fan 430 is located on the second heating end 322 , and the fourth exhaust fan position 440 is located on the second cooling end 321 .
当然,在一些实施例中,可以空调也可只有一个、两个或三个排气扇,可位于任意一个半导体元器件中的任意一端。Of course, in some embodiments, there may be an air conditioner or only one, two or three exhaust fans, which may be located at any end of any semiconductor component.
空调配置了两组半导体元器件,或配置了两组半导体元器件及其对应的排气扇后,可通过控制半导体元器件的运行来提高空调的制冷量或制热量,不仅满足了在恶劣工况下的制冷制热需求,也提高了空调制冷制热的效率。After the air conditioner is equipped with two sets of semiconductor components, or equipped with two sets of semiconductor components and their corresponding exhaust fans, the cooling capacity or heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor components, which not only meets The demand for cooling and heating under certain conditions also improves the efficiency of air conditioning cooling and heating.
本公开实施例中,在空调启动当前工作模式运行到达设定启动时间,且空调压缩机保持高频运行时,若平均室内温度值与目标室内温度值之间的绝对平均温度差值仍然比较大,则可调整空调压缩机以及半导体元器件的运行参数以及状态,即室内温度与目标温度值相差较远,且压机长时间高频运行后,可开启半导体元器件为系统提供补充冷量或热量,从而,灵活控制空调的功率,在通过控制半导体元器件的运行来提高空调的制冷量或制热量,提高制冷制热效率的同时,减少了空调的功耗。In the embodiment of the present disclosure, when the air conditioner starts to run in the current working mode and reaches the set start time, and the air conditioner compressor keeps running at high frequency, if the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value is still relatively large , you can adjust the operating parameters and status of the air conditioner compressor and semiconductor components, that is, the indoor temperature is far from the target temperature value, and after the compressor has been running at high frequency for a long time, you can turn on the semiconductor components to provide supplementary cooling for the system or Therefore, the power of the air conditioner can be flexibly controlled, and the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of semiconductor components, and the cooling and heating efficiency can be improved while reducing the power consumption of the air conditioner.
图2是本公开实施例提供的一种用于空调控制方法的流程示意图。空调可如上述,配置了两组半导体元器件,或配置了两组半导体元器件及其对应的排气扇。如图2所示,用于空调控制的过程包括:Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure. As mentioned above, the air conditioner can be configured with two sets of semiconductor components, or equipped with two sets of semiconductor components and their corresponding exhaust fans. As shown in Figure 2, the processes used for air conditioning control include:
步骤2001:在空调以当前工作模式运行的运行时间到达设定启动时间情况下,获取设定启动时间内,空调压缩机的平均运行频率,以及,获取第一设定时长内,处于当前工作模式运行空调的第一平均室内温度值,并得到第一平均室内温度值与目标室内温度值之间的第一绝对平均温度差值。Step 2001: When the running time of the air conditioner in the current working mode reaches the set start time, obtain the average running frequency of the air conditioner compressor within the set start time, and obtain the current work mode within the first set time period The first average indoor temperature value of the air conditioner is operated, and the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value is obtained.
本公开实施例中,空调以当前工作模式启动运行,此时,可采用蒸气压缩式运行,即根据采集到 的室内外温度值,控制空调压缩机的运行。当前工作模式可包括:制冷、制热、除湿等模式。可预先设定一个设定启动时间,空调启动运行后达到设定启动时间后,空调工作状态比较稳定了,因此,设定启动时间可根据空调的性能参数确定,可为15、20、25、30min等等。In the embodiment of the present disclosure, the air conditioner is started to run in the current working mode. At this time, the vapor compression operation can be adopted, that is, the operation of the air conditioner compressor is controlled according to the collected indoor and outdoor temperature values. The current working mode may include: cooling, heating, dehumidification and other modes. A set start time can be set in advance. After the air conditioner starts running and reaches the set start time, the air conditioner will be in a relatively stable working state. Therefore, the set start time can be determined according to the performance parameters of the air conditioner, which can be 15, 20, 25, 30 minutes and so on.
若空调以当前工作模式运行的运行时间到达设定启动时间了,例如:运行20min了,表明空调处于稳定的运行状态,并且,可得到设定启动时间内,空调压缩机的平均运行频率Pp,此时,可获取第一设定时长内,处于当前工作模式运行空调的第一平均室内温度值,并得到第一平均室内温度值与目标室内温度值之间的第一绝对平均温度差值。If the running time of the air conditioner in the current working mode reaches the set start time, for example: it has been running for 20 minutes, it indicates that the air conditioner is in a stable running state, and the average operating frequency Pp of the air conditioner compressor within the set start time can be obtained, At this time, the first average indoor temperature value of the air conditioner operating in the current working mode within the first set time period can be obtained, and the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value can be obtained.
本公开实施例中,空调所在区域可配置有室内温度采集装置,从而,可在空调运行到达设定启动时间后,根据记录的第一设定时长内,通过室内温度采集装置,采集的室内温度值,即可得到第一平均室内温度值Trp1。第一设定时长可为3、5、8、或10min分钟,或者,还可以为零,即第一平均室内温度值可为获取到即时室内温度值。In the embodiment of the present disclosure, the area where the air conditioner is located can be equipped with an indoor temperature acquisition device, so that after the air conditioner runs to the set start time, the indoor temperature collected by the indoor temperature acquisition device can be recorded within the first set time period according to the record. value, the first average indoor temperature value Trp1 can be obtained. The first set duration may be 3, 5, 8, or 10 minutes, or may also be zero, that is, the first average indoor temperature value may be the acquired instant indoor temperature value.
获取了第一平均室内温度值Trp1,即可得到第一平均室内温度值Trp1与目标室内温度值Tset之间的第一绝对平均温度差值│Trp1-Tset│。After obtaining the first average indoor temperature value Trp1, the first absolute average temperature difference |Trp1-Tset| between the first average indoor temperature value Trp1 and the target indoor temperature value Tset can be obtained.
步骤2002:在第一绝对平均温度差值大于或等于第二设定温度值的情况下,确定与平均运行频率匹配的空调压缩机的第一运行频率,以及当前半导体元器件的第一运行状态,其中,当前半导体元器件与当前工作模式匹配。Step 2002: When the first absolute average temperature difference is greater than or equal to the second set temperature value, determine the first operating frequency of the air conditioner compressor that matches the average operating frequency, and the first operating state of the current semiconductor components , where the current semiconductor component matches the current working mode.
一般,空调在制冷、制热、除湿等模式下运行时,第一绝对平均温度差值越大,表明需要的制冷量或制热量就会越大,此时,需要启动半导体元器件进行运行。而第一绝对平均温度差值比较小时,可只需空调压缩机继续保持现有状态运行。因此,可预设一个比较大一点的第二设定温度值,例如:4.5℃、5℃、或6℃等等,这样,在第一绝对平均温度差值大于或等于第二设定温度值的情况下,需要根据达设定启动时间内空调压缩机的平均运行频率,调整空调压缩机以及半导体元器件的运行参数以及状态,从而,通过控制半导体元器件的运行来提高空调的制冷量或制热量,提高了制冷制热效率。Generally, when the air conditioner is operating in cooling, heating, dehumidification and other modes, the greater the first absolute average temperature difference, the greater the required cooling or heating capacity. At this time, semiconductor components need to be activated for operation. While the first absolute average temperature difference is relatively small, it is only necessary for the air conditioner compressor to continue to operate in the current state. Therefore, a relatively large second set temperature value can be preset, for example: 4.5°C, 5°C, or 6°C, etc., so that when the first absolute average temperature difference is greater than or equal to the second set temperature value In some cases, it is necessary to adjust the operating parameters and status of the air conditioner compressor and semiconductor components according to the average operating frequency of the air conditioner compressor within the set start time, so as to increase the cooling capacity of the air conditioner by controlling the operation of semiconductor components or The heating capacity improves the cooling and heating efficiency.
由于第一半导体元器件的第一制冷端与空调内机连接,第一半导体元器件的第一制热端与空调外机连接,这样,第一半导体元器件启动运行后,可以实现室内测预冷和室外侧预热;而第二半导体元器件的第二制冷端与空调外机连接,第二半导体元器件的第二制热端与空调内机连接,因此,第二半导体元器件启动运行后,可以实现室内测预热和室外侧预冷。Since the first cooling terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first heating terminal of the first semiconductor component is connected to the external unit of the air conditioner, in this way, after the first semiconductor component starts running, the indoor forecasting can be realized. Cold and outdoor preheating; while the second cooling terminal of the second semiconductor component is connected to the external unit of the air conditioner, and the second heating terminal of the second semiconductor component is connected to the internal unit of the air conditioner, therefore, after the second semiconductor component starts running , It can realize indoor preheating and outdoor precooling.
由此可见,根据第一半导体元器件,第二半导体元器件的连接关系,可确定与当前工作模式匹配的当前半导体元器件。其中,当前工作模式为制冷模式时,当前半导体元器件为第一半导体元器件;当前工作模式为制热模式时,当前半导体元器件为第二半导体元器件。It can be seen that, according to the connection relationship between the first semiconductor component and the second semiconductor component, the current semiconductor component matching the current working mode can be determined. Wherein, when the current working mode is cooling mode, the current semiconductor component is the first semiconductor component; when the current working mode is heating mode, the current semiconductor component is the second semiconductor component.
在本公开实施例中,在第一绝对平均温度差值大于或等于第二设定温度值的情况下,可根据设定启动时间内,空调压缩机的平均运行频率,来调整空调压缩机以及半导体元器件的运行参数以及状态,即可确定与平均运行频率匹配的空调压缩机的第一运行频率,以及当前半导体元器件的第一运行状态,具体可包括:在平均运行频率小于第一设定频率的情况下,对空调压缩机进行升频处理,并将升高后的运行频率,确定为第一运行频率,并将关闭停机状态确定为当前半导体元器件的第一运行状态;在平均运行频率大于或等于第一设定频率,且小于第二设定频率的情况下,根据开机调整策略,确定空调压缩机的第一运行频率,并将启动运行状态确定为当前半导体元器件的第一运行状态;在平均运行频率大于或等于第二设定频率的情况下,将获取到的空调压缩机的运行频率,确定为第一运行频率,并将启动运行状态确定为当前半导体元器件的第一运行状态。In the embodiment of the present disclosure, when the first absolute average temperature difference is greater than or equal to the second set temperature value, the air conditioner compressor and The operating parameters and status of the semiconductor components can determine the first operating frequency of the air-conditioning compressor that matches the average operating frequency, and the current first operating state of the semiconductor components. Specifically, it may include: when the average operating frequency is less than the first set In the case of a fixed frequency, the air conditioner compressor is frequency-up processed, and the increased operating frequency is determined as the first operating frequency, and the shutdown state is determined as the first operating state of the current semiconductor components; When the operating frequency is greater than or equal to the first set frequency and less than the second set frequency, the first operating frequency of the air conditioner compressor is determined according to the start-up adjustment strategy, and the start-up operation state is determined as the first set frequency of the current semiconductor components. An operating state; when the average operating frequency is greater than or equal to the second set frequency, the obtained operating frequency of the air conditioner compressor is determined as the first operating frequency, and the starting operating state is determined as the current semiconductor component The first operating state.
这样,在空调启动运行到达设定启动时间时,若第一绝对平均温度差值大于或等于第二设定温度值,如:第一绝对平均温度差值│Trp1-Tset│≥5.5℃时,表明室内温度差比较大,此时,需要根据平 均运行频率调整空调压缩机以及半导体元器件的运行参数以及状态。In this way, when the start-up of the air conditioner reaches the set start time, if the first absolute average temperature difference is greater than or equal to the second set temperature value, for example: when the first absolute average temperature difference│Trp1-Tset│≥5.5°C, It indicates that the indoor temperature difference is relatively large. At this time, the operating parameters and status of the air conditioner compressor and semiconductor components need to be adjusted according to the average operating frequency.
其中,可预设一个第一设定频率,第二设定频率,其中,第二设定频率可大于第一设定频率,例如:第一设定频率可为空调压缩机最大运行频率的45%、50%、或55%等等,而第二设定频率可为空调压缩机最大运行频率的70%、80%、85%、或90%等等。这样,在平均运行频率小于第一设定频率的情况下,说明空调压缩机的运行频率还不大,还可通过升频处理,增加空调压缩机的运行频率,从而,提高空调的制冷量或制热量,即此时,不需要启动半导体元器件,只需通过调整空调压缩机的运行频率,来调整空调的制冷量或制热量,从而提高空调的效率。因此,可确定关闭停机状态为当前半导体元器件的第一运行状态,而需要对空调压缩机进行升频处理,并将升高后的运行频率,确定为第一运行频率。Wherein, a first set frequency and a second set frequency can be preset, wherein the second set frequency can be greater than the first set frequency, for example: the first set frequency can be 45% of the maximum operating frequency of the air conditioner compressor %, 50%, or 55%, etc., and the second set frequency can be 70%, 80%, 85%, or 90% of the maximum operating frequency of the air conditioner compressor, etc. In this way, when the average operating frequency is lower than the first set frequency, it means that the operating frequency of the air conditioner compressor is not high, and the operating frequency of the air conditioner compressor can also be increased through frequency up processing, thereby increasing the cooling capacity of the air conditioner or Heating capacity, that is, at this time, there is no need to start semiconductor components, just adjust the cooling capacity or heating capacity of the air conditioner by adjusting the operating frequency of the air conditioner compressor, thereby improving the efficiency of the air conditioner. Therefore, it can be determined that the off state is the first operating state of the current semiconductor components, and it is necessary to perform frequency up processing on the air conditioner compressor, and determine the increased operating frequency as the first operating frequency.
而若平均运行频率大于或等于第一设定频率,则表明空调在设定启动时间保持了较高频率运行,但是室内温度值仍然到不到目标室内温度值,此时,需要开启半导体元器件进行辅助制冷或制热,即通过开启半导体元器件来调整空调的制冷量或制热量,从而提高空调的效率,即可确定启动运行状态为当前半导体元器件的第一运行状态。并且,在一些实施例中,还可进一步调整压缩机的运行频率,来调整空调的制冷量或制热量。其中,在平均运行频率大于或等于第一设定频率,且小于第二设定频率时,空调的运行频率还不是特别高,此时,可根据空调预设的开机调整策略,调整压缩机的运行频率,即根据开机调整策略,确定空调压缩机的第一运行频率。若平均运行频率大于或等于第二设定频率时,空调处于高频运行了,因此,只需维持空调运行频率不变,即将获取到的空调压缩机的运行频率,确定为第一运行频率。And if the average operating frequency is greater than or equal to the first set frequency, it indicates that the air conditioner has maintained a high frequency operation during the set start time, but the indoor temperature value is still lower than the target indoor temperature value. At this time, it is necessary to turn on the semiconductor components Perform auxiliary cooling or heating, that is, adjust the cooling or heating capacity of the air conditioner by turning on the semiconductor components, thereby improving the efficiency of the air conditioner, and then determine the start-up operation state as the first operation state of the current semiconductor components. Moreover, in some embodiments, the operating frequency of the compressor can be further adjusted to adjust the cooling capacity or heating capacity of the air conditioner. Wherein, when the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency, the operating frequency of the air conditioner is not particularly high. At this time, the compressor can be adjusted according to the preset starting adjustment strategy of the air conditioner The operating frequency is to determine the first operating frequency of the air conditioner compressor according to the start-up adjustment strategy. If the average operating frequency is greater than or equal to the second set frequency, the air conditioner is operating at high frequency. Therefore, only the operating frequency of the air conditioner needs to be kept unchanged, and the acquired operating frequency of the air conditioner compressor is determined to be the first operating frequency.
例如,在空调制冷模式运行的情况下,若第一绝对平均温度差值大于或等于第二设定温度值时,如:│Trp1-Tset│≥5℃时,可根据设定启动时间内,空调压缩机的平均运行频率,调整空调压缩机以及半导体元器件的运行参数以及状态。其中,若平均运行频率Pp大于或等于第一设定频率,则可将第一半导体元器件的第一运行状态确定为启动运行状态,这样,启动第一半导体元器件进行运行后,可对空调内机中的蒸发器入口管路进行预冷,而对空调外机中的冷凝器入口管路进行预热,从而,提高了空调的制冷量,从而,提高了空调制冷效率。而在空调制热模式运行的情况下,若第一绝对平均温度差值大于或等于第二设定温度值时,如:│Trp1-Tset│≥5℃时,其中,若平均运行频率Pp大于或等于第一设定频率,则将第二半导体元器件的第一运行状态确定为启动运行状态,这样,启动了第二半导体元器件进行运行后,可对空调内机中的蒸发器入口管路进行预热,而对空调外机中的冷凝器入口管路进行预冷,从而,提高了空调的制热量,从而,提高了空调制热效率。For example, when the air conditioner is running in refrigeration mode, if the first absolute average temperature difference is greater than or equal to the second set temperature value, such as: │Trp1-Tset│≥5°C, according to the set start time, The average operating frequency of the air-conditioning compressor, and adjust the operating parameters and status of the air-conditioning compressor and semiconductor components. Wherein, if the average operating frequency Pp is greater than or equal to the first set frequency, the first operating state of the first semiconductor component can be determined as the start-up operating state. In this way, after the first semiconductor component is started to operate, the air conditioner can The inlet pipeline of the evaporator in the indoor unit is precooled, and the inlet pipeline of the condenser in the outdoor unit of the air conditioner is preheated, thereby increasing the cooling capacity of the air conditioner, thereby improving the cooling efficiency of the air conditioner. In the case of air-conditioning and heating mode operation, if the first absolute average temperature difference is greater than or equal to the second set temperature value, such as: │Trp1-Tset│≥5℃, wherein, if the average operating frequency Pp is greater than or equal to the first set frequency, then the first operating state of the second semiconductor component is determined as the start-up operating state, so that after the second semiconductor component is started to run, the evaporator inlet pipe in the air conditioner internal unit can be The air conditioner is preheated, and the condenser inlet pipeline in the air conditioner external unit is precooled, thereby increasing the heating capacity of the air conditioner, thereby improving the heating efficiency of the air conditioner.
步骤2003:控制空调压缩机以第一运行频率运行,以及,控制当前半导体元器件以第一运行状态运行。Step 2003: Control the air conditioner compressor to run at the first operating frequency, and control the current semiconductor components to run at the first operating state.
确定了空调压缩机的第一运行频率,以及当前半导体元器件的第一运行状态后,即可控制空调压缩机以第一运行频率运行,以及控制当前半导体元器件以第一运行状态运行。After determining the first operating frequency of the air conditioner compressor and the first operating state of the current semiconductor components, the air conditioner compressor can be controlled to operate at the first operating frequency, and the current semiconductor components can be controlled to operate at the first operating state.
其中,第一绝对平均温度差值大于或等于第二设定温度值,控制空调压缩机以第一运行频率运行可包括:若平均运行频率小于第一设定频率时,对空调压缩机进行升频处理,控制空调压缩机以升高后的运行频率的进行运行。若平均运行频率大于或等于第一设定频率,且小于第二设定频率时,可根据开机调整策略调整空调压缩机的频率,控制空调压缩机以调整后的运行频率的进行运行。若平均运行频率大于或等于第二设定频率,则需控制空调压缩机以不变的运行频率的进行运行。Wherein, the first absolute average temperature difference is greater than or equal to the second set temperature value, controlling the air conditioner compressor to run at the first operating frequency may include: if the average operating frequency is less than the first set frequency, the air conditioner compressor is raised Frequency processing to control the air conditioner compressor to run at the increased operating frequency. If the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency, the frequency of the air conditioner compressor can be adjusted according to the start-up adjustment strategy, and the air conditioner compressor is controlled to operate at the adjusted operating frequency. If the average running frequency is greater than or equal to the second set frequency, the air conditioner compressor needs to be controlled to run at a constant running frequency.
在一些实施例中,第一绝对平均温度差值大于或等于第二设定温度值,且平均运行频率大于或等于第一设定频率时,可一直控制半导体元器件处于启动运行状态,但是,半导体元器件受材料限制,长期连续运行会导致部件可靠性降低,并且,半导体长期运行,也会增加空调的功耗。因此,第一绝对平均温度差值大于或等于第二设定温度值,且平均运行频率大于或等于第一设定频率时,空调中当前半导 体元器件的处于启动运行状态的时间可为5、8、10、或15min等等。In some embodiments, when the first absolute average temperature difference is greater than or equal to the second set temperature value, and the average operating frequency is greater than or equal to the first set frequency, the semiconductor components can always be controlled to be in the start-up operation state, however, Semiconductor components are limited by materials, and long-term continuous operation will reduce the reliability of components. Moreover, long-term operation of semiconductors will also increase the power consumption of the air conditioner. Therefore, when the first absolute average temperature difference is greater than or equal to the second set temperature value, and the average operating frequency is greater than or equal to the first set frequency, the time that the current semiconductor components in the air conditioner are in the start-up state can be 5, 8, 10, or 15 minutes and so on.
或者,在一些实施例中,半导体元器件并不长期连续运行,可以设定运行周期为单位运行,并在设定运行周期内,一段时间内半导体元器件运行,而剩下时间内半导体元器件停机,即设定运行周期包括:运行时间和停止时间。例如:设定运行周期可为20min,这样,半导体元器件周期性运行过程中,可按照运行10min后停机10min的方式运行,此时,运行时间和停止时间都为10min。或者,设定运行周期可为30min,这样,半导体元器件周期性运行过程中,可按照运行20min后停机10min的方式运行等等,此时,运行时间为20min,而停止时间为10min。Or, in some embodiments, the semiconductor components do not run continuously for a long time, and the operation period can be set as a unit to operate, and within the set operation period, the semiconductor components operate for a period of time, and the semiconductor components operate for the rest of the time. Stopping, that is, setting the running cycle includes: running time and stopping time. For example: set the operating cycle to be 20 minutes. In this way, during the periodic operation of semiconductor components, it can be operated in the manner of running for 10 minutes and then stopping for 10 minutes. At this time, the operating time and stopping time are both 10 minutes. Alternatively, the set operation period can be 30 minutes, so that during the periodic operation of semiconductor components, it can be operated in the manner of running for 20 minutes and then stopping for 10 minutes, etc. At this time, the operation time is 20 minutes, and the stop time is 10 minutes.
因此,在本实施例中,控制当前半导体元器件以第一运行状态运行可包括:控制与当前工作模式匹配的当前半导体元器件以第一运行状态运行一个周期。具体可包括:在第一绝对平均温度差值大于或等于第二设定温度值,且平均运行频率大于或等于第一设定频率的情况下,在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件处于启动运行状态;而在半导体元器件的设定运行周期的停止时间内,控制当前半导体元器件处于关闭停机状态。例如:│Trp1-Tset│≥4.5℃,且平均运行频率Pp≥最高运行频率Pmax的50%时,只需在半导体元器件的设定运行周期20min内的10min内,控制当前半导体元器件处于启动运行状态,然后,可控制当前半导体元器件处于关闭停机状态。即当前半导体元器件只需启动运行10min后即可关闭,这样,通过控制半导体元器件的运行来提高空调的制冷量或制热量,提高制冷制热效率的同时,减少了空调的功耗。Therefore, in this embodiment, controlling the current semiconductor component to operate in the first operating state may include: controlling the current semiconductor component matching the current operating mode to operate in the first operating state for one cycle. Specifically, it may include: when the first absolute average temperature difference is greater than or equal to the second set temperature value, and the average operating frequency is greater than or equal to the first set frequency, during the operating time of the set operating cycle of the semiconductor components Within the control period, the current semiconductor components are controlled to be in the start-up operation state; and within the stop time of the set operation cycle of the semiconductor components, the current semiconductor components are controlled to be in the shutdown state. For example: │Trp1-Tset│≥4.5℃, and the average operating frequency Pp≥50% of the maximum operating frequency Pmax, only need to control the current semiconductor components to start within 10 minutes within 20 minutes of the set operating cycle of the semiconductor components The running state, then, can control the current semiconductor components to be in the shutdown state. That is to say, the current semiconductor components only need to be started and run for 10 minutes before they can be turned off. In this way, the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, and the cooling and heating efficiency can be improved while reducing the power consumption of the air conditioner.
当然,在一些实施例中,半导体可进行周期性运行,但是,也可不对当前半导体元器件进行周期性控制,即空调当前半导体元器件的处于启动运行状态的时间可不为设定运行周期的运行时间,具体就不例举了。Of course, in some embodiments, the semiconductor can be operated periodically, but the current semiconductor components may not be periodically controlled, that is, the time that the current semiconductor components of the air conditioner are in the start-up operation state may not be the operation of the set operation cycle. Time, no specific examples.
本公开实施例中,半导体元器件的功率是可调的,对应输出的冷量或热量也是不同,从而,在相同控制输入电压下,根据不同的控制输入电流,半导体元器件可输出不同的冷量或热量。在一些实施例中,半导体元器件对应两个或多个运行档位,半导体元器件的控制输入电流越大,对应的运行档位越高,输出能量也越多。例如:控制输入电压220V,控制输入电流分别为0.5A、1A、1.5A,这样,半导体元器件对应低、中、高三个档位。当然,半导体元器件也可仅仅对应低、高两个档位等等。In the embodiment of the present disclosure, the power of the semiconductor components is adjustable, and the corresponding output cooling or heat is also different. Therefore, under the same control input voltage, according to different control input currents, the semiconductor components can output different cooling. volume or heat. In some embodiments, the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component is, the higher the corresponding operating gear is, and the greater the output energy is. For example: the control input voltage is 220V, and the control input current is 0.5A, 1A, and 1.5A respectively. In this way, semiconductor components correspond to three gears of low, medium, and high. Of course, semiconductor components can also only correspond to low and high gears and so on.
可见,在一些实施例中,当前半导体元器件处于启动运行状态时,可对应不同的运行档位,因此,控制当前半导体元器件以第一运行状态运行包括:在平均运行频率大于或等于第一设定频率的情况下,确定与平均运行频率对应的当前半导体元器件的第一运行档位;在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以第一运行档位运行。其中,半导体元器件对应两个或多个运行档位,半导体元器件的控制输入电流越大,对应的运行档位越高。当然,在半导体元器件的设定运行周期的停止时间内,可控制当前半导体元器件处于关闭停机状态。It can be seen that, in some embodiments, when the current semiconductor components are in the starting operation state, they can correspond to different operating gears. Therefore, controlling the current semiconductor components to operate in the first operating state includes: when the average operating frequency is greater than or equal to the first In the case of setting the frequency, determine the first operating gear of the current semiconductor component corresponding to the average operating frequency; within the running time of the set operating cycle of the semiconductor component, control the current semiconductor component to the first operating gear run. Wherein, the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are. Of course, within the stop time of the set operating period of the semiconductor component, the current semiconductor component can be controlled to be in a shutdown state.
其中,确定与平均运行频率对应的当前半导体元器件的第一运行档位包括:在平均运行频率大于或等于第一设定频率,且小于第二设定频率的情况下,确定第二档位为当前半导体元器件的第一运行档位;在平均运行频率大于或等于第二设定频率的情况下,确定第三档位为当前半导体元器件的第一运行档位。其中,第三档位对应的半导体元器件的控制输入电流大于第二档位对应的半导体元器件的控制输入电流,第二档位对应的半导体元器件的控制输入电流大于第一档位对应的半导体元器件的控制输入电流。Wherein, determining the first operating gear of the current semiconductor components corresponding to the average operating frequency includes: determining the second gear when the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency is the first operating gear of the current semiconductor components; when the average operating frequency is greater than or equal to the second set frequency, determine the third gear as the first operating gear of the current semiconductor components. Wherein, the control input current of the semiconductor components corresponding to the third gear is greater than the control input current of the semiconductor components corresponding to the second gear, and the control input current of the semiconductor components corresponding to the second gear is greater than the control input current of the semiconductor components corresponding to the first gear. Control input current for semiconductor components.
例如:第二设定温度值为4℃,第一设定频率为最高频率Pmax的40%,第二设定频率为最高频率Pmax的65%。这样,│Trp1-Tset│≥4℃的情况下,若Pmax的40%≤平均运行频率Pp<Pmax的65%时,可确定第二档位为当前半导体元器件的第一运行档位;而若Pmax的65%≤Pp时,可确定第三档位为当前半导体元器件的第一运行档位。For example: the second set temperature is 4°C, the first set frequency is 40% of the maximum frequency Pmax, and the second set frequency is 65% of the maximum frequency Pmax. In this way, when │Trp1-Tset│≥4℃, if 40% of Pmax≤average operating frequency Pp<65% of Pmax, the second gear can be determined as the first operating gear of the current semiconductor components; and If 65% of Pmax≤Pp, the third gear can be determined as the first operating gear of the current semiconductor components.
当然,半导体元器件对应两个、四个、五个等等运行档位,也可根据第一平均室外温度值,确定对应的当前半导体元器件的第一运行档位,具体就不详细描述了。Of course, the semiconductor components correspond to two, four, five, etc. operating gears, and the corresponding first operating gears of the current semiconductor components can also be determined according to the first average outdoor temperature value, which will not be described in detail. .
确定了当前半导体元器件的第一运行档位,这样,可控制当前半导体元器件以第一运行档位运行,或者,在设定时间段内,控制当前半导体元器件以第一运行档位运行。在一些实施例中,可在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以第一运行档位运行。The first operating gear of the current semiconductor component is determined, so that the current semiconductor component can be controlled to run at the first operating gear, or, within a set time period, the current semiconductor component can be controlled to run at the first operating gear . In some embodiments, the current semiconductor component can be controlled to operate at the first operating gear within the operating time of the set operating cycle of the semiconductor component.
可见,本公开实施例中,在空调启动当前工作模式运行到达设定启动时间,且空调压缩机保持较高频运行时,若平均室内温度值与目标室内温度值之间的绝对平均温度差值仍然比较大,则可调整空调压缩机以及半导体元器件的运行参数以及状态,这样,通过控制半导体元器件的运行来提高空调的制冷量或制热量,提高了制冷制热效率,并且,满足一定的条件才对半导体元器件进行控制,减少了空调的功耗。并且,不同的压缩机平均运行频率,对应半导体元器件的不同运行档位,即对应半导体元器件不同的输出能量,从而,进一步加快了空调制冷或制热的效率。It can be seen that in the embodiment of the present disclosure, when the air conditioner starts the current working mode and reaches the set start time, and the air conditioner compressor keeps running at a high frequency, if the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value If it is still relatively large, the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted. In this way, the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, the cooling and heating efficiency can be improved, and certain requirements can be met. Conditions to control the semiconductor components, reducing the power consumption of the air conditioner. Moreover, different average operating frequencies of the compressors correspond to different operating gears of the semiconductor components, that is, correspond to different output energies of the semiconductor components, thereby further speeding up the cooling or heating efficiency of the air conditioner.
在空调以当前工作模式运行的运行时间到达设定启动时间时,并在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以第一运行档位运行之后,可继续控制空调采用蒸气压缩式模式运行,不再控制半导体元器件运行了。但是,为提高空调调节温度的效率,在一些实施例中,控制当前半导体元器件以第一运行档位运行之后,还可根据获取的当前设定时长内的当前平均室内温度值,周期性控制当前半导体元器件的运行以及空调压缩机的运行,可包括:在当前半导体元器件处于关闭停机状态,且空调处于当前模式运行状态的持续时间到达预设采样时长的情况下,获取空调所在区域当前设定时长内的当前平均室内温度值,并得到当前平均室内温度值与目标室内温度值之间的当前绝对平均温度差值;确定与当前绝对平均温度差值匹配的空调压缩机的当前运行频率,以及当前半导体元器件的当前运行状态;控制空调压缩机以当前运行频率运行,以及,控制当前半导体元器件以当前运行状态运行。When the running time of the air conditioner in the current working mode reaches the set start time, and within the running time of the set running cycle of the semiconductor components, after the current semiconductor components are controlled to run in the first operating gear, the air conditioner can be continued to be controlled Operate in vapor compression mode and no longer control the operation of semiconductor components. However, in order to improve the efficiency of air conditioning temperature regulation, in some embodiments, after the current semiconductor components are controlled to operate in the first operating gear, the current average indoor temperature value within the current set time period can also be periodically controlled. The operation of the current semiconductor components and the operation of the air conditioner compressor may include: when the current semiconductor components are in the shutdown state and the duration of the air conditioner in the current mode of operation reaches the preset sampling time, obtain the current status of the area where the air conditioner is located. Set the current average indoor temperature value within the duration, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value; determine the current operating frequency of the air conditioner compressor that matches the current absolute average temperature difference , and the current operating state of the current semiconductor components; controlling the air conditioner compressor to operate at the current operating frequency, and controlling the current semiconductor components to operate at the current operating state.
在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以第一运行档位运行之后,当前半导体元器件可处于关闭停机状态,此时,空调以当前模式运行,在空调处于当前模式运行状态的持续时间到达预设采样时长的情况下,预设采样时长可为5、10、15、25分钟等等,即在预设采样时长内,半导体元器件一直未启动运行,处于关闭停机状态,且空调也一直以当前工作模式运行,此时,可继续采样室内温度值,并记录设定时长内,通过室内温度采集装置,采集的室内温度值,然后,根据记录的室内温度值,以及设定时长,即可得到平均室内温度值。During the operating time of the set operating cycle of the semiconductor components, after the current semiconductor components are controlled to run at the first operating gear, the current semiconductor components can be in the shutdown state. At this time, the air conditioner operates in the current mode. When the duration of the current mode running state reaches the preset sampling time, the preset sampling time can be 5, 10, 15, 25 minutes, etc. Turn off the shutdown state, and the air conditioner has been running in the current working mode. At this time, you can continue to sample the indoor temperature value, and record the indoor temperature value collected by the indoor temperature acquisition device within the set time. Then, according to the recorded indoor temperature value, and the set time, you can get the average indoor temperature value.
当然,本公开实施例中的空调控制当前半导体元器件以第一运行档位运行之后,可进行自动连续控制,因此,当前设定时长对应当前平均室内温度值。设定时长可为1分钟、5分钟、10分钟、或20分钟等等,在一些实施例中,当前设定时长可为零,此时,当前平均室内温度值即为通过室内温度采集装置,采集的实时的当前室内温度值。Of course, the air conditioner control in the embodiment of the present disclosure can perform automatic and continuous control after the current semiconductor components operate at the first operating gear. Therefore, the current set duration corresponds to the current average indoor temperature value. The set duration can be 1 minute, 5 minutes, 10 minutes, or 20 minutes, etc. In some embodiments, the current set duration can be zero. At this time, the current average indoor temperature value is obtained through the indoor temperature acquisition device. The collected real-time current indoor temperature value.
获取了当前平均室内温度值Trp,即可得到当前平均室内温度值Trp与目标室内温度值Tset之间的当前绝对平均温度差值│Trp-Tset│。After obtaining the current average indoor temperature value Trp, the current absolute average temperature difference │Trp-Tset│ between the current average indoor temperature value Trp and the target indoor temperature value Tset can be obtained.
在周期性自动连续控制的过程中,可根据当前绝对平均温度差值,以及与前次设定时长对应的前次控制中空调压缩机和半导体元器件的运行参数以及状态,确定与当前绝对平均温度差值匹配的空调压缩机的当前运行频率,以及当前半导体元器件的当前运行状态。In the process of periodic automatic continuous control, the current absolute average temperature difference can be determined according to the current absolute average temperature difference, as well as the operating parameters and status of the air conditioner compressor and semiconductor components in the previous control corresponding to the previous set duration. The current operating frequency of the air conditioner compressor matched with the temperature difference, and the current operating status of the current semiconductor components.
在一些实施例中,当前半导体元器件的前次运行档位为最高档位时,可包括:在当前绝对平均温度差值大于或等于第一设定温度值的情况下,将获取到的空调压缩机的运行频率,确定为当前运行频率,以及将最高档位确定为当前半导体元器件的启动运行状态中的当前运行档位;在当前绝对平均温度差值小于第一设定温度值的情况下,若获取到的空调压缩机的运行频率大于或等于第二设定频率时,对空调压缩机进行降频处理,并将降低后的运行频率,确定为当前运行频率,以及将最高档位确定为当前半导 体元器件的启动运行状态中的当前运行档位;在当前绝对平均温度差值小于第一设定温度值的情况下,若获取到的空调压缩机的运行频率小于第二设定频率时,将获取到的空调压缩机的运行频率,确定为当前运行频率,以及对当前半导体元器件进行降档处理,将降低后的运行档位确定为当前半导体元器件的启动运行状态中的当前运行档位。In some embodiments, when the previous operating gear of the current semiconductor component is the highest gear, it may include: when the current absolute average temperature difference is greater than or equal to the first set temperature value, the obtained air conditioner The operating frequency of the compressor is determined as the current operating frequency, and the highest gear is determined as the current operating gear in the start-up operation state of the current semiconductor components; when the current absolute average temperature difference is less than the first set temperature value Next, if the obtained operating frequency of the air conditioner compressor is greater than or equal to the second set frequency, the frequency reduction process is performed on the air conditioner compressor, and the reduced operating frequency is determined as the current operating frequency, and the highest gear is set to It is determined as the current operating gear in the start-up operation state of the current semiconductor components; when the current absolute average temperature difference is less than the first set temperature value, if the obtained operating frequency of the air conditioner compressor is less than the second set frequency, determine the obtained operating frequency of the air conditioner compressor as the current operating frequency, and perform downshift processing on the current semiconductor components, and determine the reduced operating gear as the current operating state of the semiconductor components. Current operating gear.
即当前半导体元器件的前次运行档位为最高档位时,当前绝对平均温度差值比较少了,可通过降频或降档的方式,来减少空调的制冷量或制热量,在通过控制半导体元器件的运行来提高空调的制冷量或制热量,提高制冷制热效率的同时,减少了空调的功耗。That is to say, when the previous operating gear of the current semiconductor components is the highest gear, the current absolute average temperature difference is relatively small, and the cooling capacity or heating capacity of the air conditioner can be reduced by downgrading or downshifting. The operation of semiconductor components can increase the cooling capacity or heating capacity of the air conditioner, improve the cooling and heating efficiency, and reduce the power consumption of the air conditioner.
而在一些实施例中,当前半导体元器件的前次运行档位不为最高档位,确定与当前绝对平均温度差值匹配的空调压缩机的当前运行频率,以及当前半导体元器件的当前运行状态可包括:在当前绝对平均温度差值大于或等于第二设定温度值的情况下,将获取到的空调压缩机的运行频率,确定为当前运行频率,以及对当前半导体元器件进行升档处理,将升高后的运行档位确定为当前半导体元器件的启动运行状态中的当前运行档位;在当前绝对平均温度差值小于第二设定温度值,且大于或等于第一设定温度值的情况下,将获取到的空调压缩机的运行频率,确定为当前运行频率,以及,将前次运行档位确定为当前半导体元器件的启动运行状态中的当前运行档位;在当前绝对平均温度差值小于第一设定温度值的情况下,根据开机调整策略,确定空调压缩机的当前运行频率,以及对当前半导体元器件进行降档处理,将降低后的运行档位确定为当前半导体元器件的启动运行状态中的当前运行档位。However, in some embodiments, the previous operating gear of the current semiconductor components is not the highest gear, and the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference and the current operating status of the current semiconductor components are determined It may include: when the current absolute average temperature difference is greater than or equal to the second set temperature value, determining the obtained operating frequency of the air conditioner compressor as the current operating frequency, and performing upshift processing on the current semiconductor components , determine the increased operating gear as the current operating gear in the current start-up operation state of the semiconductor components; when the current absolute average temperature difference is less than the second set temperature value and greater than or equal to the first set temperature value, determine the obtained operating frequency of the air conditioner compressor as the current operating frequency, and determine the previous operating gear as the current operating gear in the current start-up operating state of the semiconductor components; in the current absolute When the average temperature difference is less than the first set temperature value, according to the start-up adjustment strategy, determine the current operating frequency of the air conditioner compressor, and perform downshift processing on the current semiconductor components, and determine the reduced operating gear as the current The current operating gear in the start-up operating state of the semiconductor component.
即当前半导体元器件的前次运行档位不为最高档位时,当前绝对平均温度差值很大时,可进行升档处理,提高半导体元器件的制冷量或制热量。而当前绝对平均温度差值较大时,可不调整空调压缩机以及半导体元器件的运行参数;而当前绝对平均温度差值较小时,即可进行降档处理,这样,在通过控制压缩机和半导体元器件的运行来提高空调的制冷量或制热量,提高制冷制热效率的同时,减少了空调的功耗。That is, when the previous operating gear of the current semiconductor components is not the highest gear, and the current absolute average temperature difference is large, an upshift can be performed to increase the cooling or heating capacity of the semiconductor components. When the current absolute average temperature difference is large, it is not necessary to adjust the operating parameters of the air conditioner compressor and semiconductor components; and when the current absolute average temperature difference is small, downshift processing can be performed. The operation of components can increase the cooling capacity or heating capacity of the air conditioner, improve the cooling and heating efficiency, and reduce the power consumption of the air conditioner.
当然,前次运行档位为最低档位时,若当前绝对平均温度差值小于第一设定温度值,需进行降档处理,那么,即可将关闭停机状态确定为当前半导体元器件的当前运行状态。Of course, when the last operating gear is the lowest gear, if the current absolute average temperature difference is less than the first set temperature value, downshifting processing is required, then the shut down and shutdown state can be determined as the current temperature of the current semiconductor components. Operating status.
第一设定温度值小第二设定温度值,可根据空调所在地位位置,以及空调性能确定。The first set temperature value is smaller than the second set temperature value, which can be determined according to the location of the air conditioner and the performance of the air conditioner.
确定了与当前绝对平均温度差值匹配的空调压缩机的当前运行频率,以及当前半导体元器件的当前运行状态后,即可控制空调压缩机以当前运行频率运行,以及,控制当前半导体元器件以当前运行状态运行。After the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference and the current operating state of the current semiconductor components are determined, the air conditioner compressor can be controlled to operate at the current operating frequency, and the current semiconductor components can be controlled to The current running state is running.
例如:第一设定温度值为1.5℃,第二设定温度值为4.5℃,则当前半导体元器件的前次运行档位为最高档位,即第三档位时,若│Trp-Tset│≥1.5℃时,则可保持空调压缩机和当前半导体元器件的运行状态不变,仍然控制空调压缩机的运行频率不变,在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以第三档位进行运行。当然,在半导体元器件的设定运行周期的停止时间内,控制当前半导体元器件处于关闭停机状态。若│Trp-Tset│<1.5℃,此时,还需获取到空调压缩机的运行频率,若获取到的空调压缩机的运行频率大于或等于第二设定频率时,表明空调压缩机高频运行,因为Trp已经比较接近Tset了,此时,可对空调压缩机进行降频处理,例如,可按照1HZ/1min的速率进行降频,并控制空调压缩机以降低后的运行频率运行,仍然可将最高档位确定为当前半导体元器件的启动运行状态中的当前运行档位,即在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件仍以第三档位进行运行。若获取到的空调压缩机的运行频率小于第二设定频率时,则可不调整压缩机频率,需对当前半导体元器件进行降档处理,在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以第二档位进行运行。For example: the first set temperature value is 1.5°C, and the second set temperature value is 4.5°C, then the last operating gear of the current semiconductor component is the highest gear, that is, the third gear, if│Trp-Tset │When ≥ 1.5°C, the operating status of the air conditioner compressor and the current semiconductor components can be kept unchanged, and the operating frequency of the air conditioner compressor can still be controlled. During the operating time of the set operating cycle of the semiconductor components, the current Semiconductor components operate in third gear. Certainly, during the stop time of the set operating cycle of the semiconductor component, the current semiconductor component is controlled to be in a shutdown state. If│Trp-Tset│<1.5℃, at this time, it is necessary to obtain the running frequency of the air conditioner compressor. If the obtained operating frequency of the air conditioner compressor is greater than or equal to the second set frequency, it indicates that the high frequency of the air conditioner compressor Running, because Trp is already relatively close to Tset, at this time, the frequency reduction process can be performed on the air conditioner compressor, for example, the frequency reduction can be performed at a rate of 1HZ/1min, and the air conditioner compressor can be controlled to run at the reduced operating frequency, still The highest gear can be determined as the current operating gear in the start-up operation state of the current semiconductor component, that is, within the running time of the set operating cycle of the semiconductor component, control the current semiconductor component to still run in the third gear . If the acquired operating frequency of the air conditioner compressor is lower than the second set frequency, the frequency of the compressor may not be adjusted, and the current semiconductor component needs to be downshifted. During the operating time of the set operating cycle of the semiconductor component, Control the current semiconductor components to run in the second gear.
当前半导体元器件的前次运行档位不为最高档位,即可能为第二档位或第一档位时,若│Trp-Tset │≥4.5℃时,当前绝对平均温度差值有点大,需要增大空调的制冷量或制热量,因此,需进行升档处理,即保持空调压缩机的运行频率不变,可对当前半导体元器件进行升档处理,即在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以升高后的运行档位运行,即前次运行档位是第二档位,则可升高为第三档位进行运行,前次运行档位是第一档位,则可升高为第二档位进行运行。若1.5℃≤│Trp-Tset│<4.5℃时,则可维持空调压缩机以及当前半导体的运行状态不变。若│Trp-Tset│<1.5℃时,则表明当前绝对平均温度差值很小了,则空调压缩机维持空调开机配置的开机调整策略进行调整,即根据开机调整策略,控制空调压缩机运行,而且还需进行降档处理,即在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以降低后的档位进行运行。When the last operating gear of the current semiconductor components is not the highest gear, that is, it may be the second gear or the first gear, if │Trp-Tset │≥4.5℃, the current absolute average temperature difference is a bit large, It is necessary to increase the cooling capacity or heating capacity of the air conditioner. Therefore, it is necessary to perform upshift processing, that is, to keep the operating frequency of the air conditioner compressor unchanged, and to perform upshift processing on the current semiconductor components, that is, to operate at the set operating frequency of the semiconductor components. During the running time of the cycle, control the current semiconductor components to run at the raised operating gear, that is, the previous operating gear is the second gear, and then it can be raised to the third gear for operation, and the previous operating gear If it is the first gear, it can be raised to the second gear for operation. If 1.5°C≤│Trp-Tset│<4.5°C, the running status of the air conditioner compressor and the current semiconductor can be kept unchanged. If │Trp-Tset│<1.5℃, it indicates that the current absolute average temperature difference is very small, and the air conditioner compressor maintains the start-up adjustment strategy of the air conditioner start-up configuration, that is, controls the operation of the air conditioner compressor according to the start-up adjustment strategy, In addition, downshifting processing is required, that is, within the operating time of the set operating cycle of the semiconductor component, the current semiconductor component is controlled to operate at a reduced gear.
其中,若前次运行档位为最低档位,例如第一档位时,则进行将降档处理时,即│Trp-Tset│<1.5℃时,可控制当前半导体元器件处于关闭停机状态。Wherein, if the last operating gear is the lowest gear, for example, the first gear, when performing downshift processing, that is, when │Trp-Tset│<1.5°C, the current semiconductor components can be controlled to be in shutdown state.
空调的半导体元器件中可能配置了对应的排气扇,排气扇可加强空气循环,强化半导体元器件两端与室内/室外侧的热量交换,从而实现对系统制冷量/制热量的补偿。因此,在一些实施例中,当前半导体元器件处于启动运行状态时,还可根据当前工作模式,控制当前半导体元器件上对应的排气扇运行。The semiconductor components of the air conditioner may be equipped with a corresponding exhaust fan. The exhaust fan can enhance the air circulation and enhance the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side, so as to realize the compensation of the cooling capacity/heating capacity of the system. Therefore, in some embodiments, when the current semiconductor component is in the start-up state, the operation of the corresponding exhaust fan on the current semiconductor component can also be controlled according to the current working mode.
其中,在第一半导体元器件处于启动运行状态的情况下,控制第一半导体元器件上配置的第一排气扇和第二排气扇运行;在第二半导体元器件处于启动运行状态的情况下,控制第二半导体元器件上配置的第三排气扇和第四排气扇运行。其中,空调中,第一排气扇位于第一制冷端上,第二排气扇位于第一制热端上,第三排气扇位于第二制热端上,第四排气扇位于第二制冷端上。Wherein, when the first semiconductor component is in the starting operation state, control the operation of the first exhaust fan and the second exhaust fan configured on the first semiconductor component; when the second semiconductor component is in the starting operation state Next, control the operation of the third exhaust fan and the fourth exhaust fan arranged on the second semiconductor component. Wherein, in the air conditioner, the first exhaust fan is located on the first cooling end, the second exhaust fan is located on the first heating end, the third exhaust fan is located on the second heating end, and the fourth exhaust fan is located on the second heating end. Second, on the refrigeration end.
半导体元器件停止运行了,为进一步减少能耗,可将对应的排气扇也关闭,在一些实施例中,在当前半导体元器件处于关闭停机状态的情况下,控制当前半导体元器件上对应的排气扇关闭。即在第一半导体元器件停止运行的情况下,控制第一半导体元器件上配置的第一排气扇和第二排气扇停止运行;在第二半导体元器件停止运行的情况下,控制第二半导体元器件上配置的第三排气扇和第四排气扇停止运行。The semiconductor components stop running. In order to further reduce energy consumption, the corresponding exhaust fans can also be turned off. In some embodiments, when the current semiconductor components are in the shutdown state, control the corresponding The exhaust fan is switched off. That is, when the first semiconductor component stops running, control the first exhaust fan and the second exhaust fan configured on the first semiconductor component to stop running; The third exhaust fan and the fourth exhaust fan configured on the second semiconductor component stopped running.
并且,在空调的半导体元器件处于关闭停机状态的情况下,空调仍可采用蒸气压缩式制冷循环,来实现室内温度的调节。Moreover, when the semiconductor components of the air conditioner are turned off, the air conditioner can still use a vapor compression refrigeration cycle to adjust the indoor temperature.
目前,空调具有通讯功能,这样,空调还可根据接收到的指令,来控制半导体元器件的运行。在一些实施例中,在接收到配置控制应用APP终端发送的半导体开关指令的情况下,根据半导体开关指令,控制空调中的半导体元器件的开关运行。这样,用户可通过APP控制半导体元器件的开关,提高了空调的智能性以及用户体验。At present, the air conditioner has a communication function, so that the air conditioner can also control the operation of semiconductor components according to the received instructions. In some embodiments, in the case of receiving the semiconductor switch instruction sent by the configuration control application APP terminal, the switching operation of the semiconductor components in the air conditioner is controlled according to the semiconductor switch instruction. In this way, the user can control the switching of semiconductor components through the APP, which improves the intelligence and user experience of the air conditioner.
下面将操作流程集合到具体实施例中,举例说明本公开实施例提供的用于空调控制过程。In the following, the operation process is integrated into a specific embodiment to illustrate the air-conditioning control process provided by the embodiment of the present disclosure.
本实施例中,空调可如图1所示,包括两组半导体元器件和四个排气扇。并且,空调中保存的第一设定温度值为2℃,第二设定温度值为5℃。并且,半导体元器件对应3个运行档位,第三档位的输出能量大于第二档位的输出能量,而第二档位的输出能量大于第一档位的输出能量。第一设定频率为空调压缩机最高频率Pmax的50%,第二设定频率为空调压缩机最高频率Pmax的80%。并且,设定启动时间可为20min,设定时长以及第一设定时长都可为10min,半导体元器件的设定运行周期可为20min,而设定运行周期的运行时间为10min;而设定启动时间可为设定运行周期的运行时间,也为10min;预设采样时长也可为10min。空调的当前运行模式为制冷模式,对应的当前半导体元器件为第一半导体元器件。In this embodiment, the air conditioner may include two sets of semiconductor components and four exhaust fans as shown in FIG. 1 . In addition, the first set temperature value stored in the air conditioner is 2°C, and the second set temperature value is 5°C. Moreover, the semiconductor components correspond to three operating gears, the output energy of the third gear is greater than the output energy of the second gear, and the output energy of the second gear is greater than the output energy of the first gear. The first set frequency is 50% of the maximum frequency Pmax of the air conditioner compressor, and the second set frequency is 80% of the maximum frequency Pmax of the air conditioner compressor. Moreover, the set startup time can be 20 minutes, the set duration and the first set duration can be 10 minutes, the set operation cycle of the semiconductor components can be 20 minutes, and the operation time of the set operation cycle is 10 minutes; and the set The startup time can be the running time of the set running cycle, which is also 10 minutes; the preset sampling time can also be 10 minutes. The current operating mode of the air conditioner is cooling mode, and the corresponding current semiconductor component is the first semiconductor component.
图3-1、图3-2是本公开实施例提供的一种用于空调控制方法的流程示意图。结合图1和图3-1、图3-2,用于空调控制的过程包括:Fig. 3-1 and Fig. 3-2 are schematic flowcharts of a method for controlling an air conditioner provided by an embodiment of the present disclosure. Combining Figure 1 with Figure 3-1 and Figure 3-2, the process for air conditioning control includes:
步骤3001:判断空调启动制冷运行的运行时间是否到达设定启动时间20min?若是,启动运行已 完成,执行步骤3002,否则,返回步骤3001。Step 3001: Determine whether the running time of the air conditioner to start the cooling operation has reached the set start time of 20 minutes? If so, the start-up operation has been completed, and step 3002 is performed; otherwise, step 3001 is returned.
步骤3002:获取设定启动时间内,空调压缩机的平均运行频率P。Step 3002: Obtain the average running frequency P of the air conditioner compressor within the set startup time.
步骤3003:记录10min内处于制冷模式运行空调的室内温度值,并得到10min内的第一平均室内温度值Trp1和,以及根据第一平均室内温度值Trp1,以及目标室内温度值Tset,得到第一绝对平均温度差值│Trp1-Tset│。Step 3003: Record the indoor temperature value of the air conditioner in the cooling mode within 10 minutes, and obtain the first average indoor temperature value Trp1 and the first average indoor temperature value Trp1 and the target indoor temperature value Tset within 10 minutes, and obtain the first Absolute mean temperature difference│Trp1-Tset│.
步骤3004:判断│Trp1-Tset│≥5是否成立?若是,执行步骤3005,否则,流程结束。Step 3004: Determine whether │Trp1-Tset│≥5 holds true? If yes, execute step 3005; otherwise, the process ends.
步骤3005:判断平均运行频率Pp<Pmax的50%是否成立?若是,执行步骤3006,否则,执行步骤3007。Step 3005: Determine whether the average running frequency Pp<50% of Pmax holds true? If yes, go to step 3006; otherwise, go to step 3007.
步骤3006:对空调压缩机进行升频处理,并控制空调压缩机以升高后的运行频率进行运行,以及控制第一半导体元器件处于关闭停机状态。Step 3006: Perform frequency up processing on the air conditioner compressor, and control the air conditioner compressor to run at the increased operating frequency, and control the first semiconductor component to be in a shutdown state.
步骤3007:判断Pmax的50%≤Pp<Pmax的80%是否成立?若是,执行步骤3008,否则,执行步骤3009。Step 3007: Determine whether 50% of Pmax≤Pp<80% of Pmax holds true? If yes, go to step 3008; otherwise, go to step 3009.
步骤3008:根据开机调整策略,确定空调压缩机的第一运行频率,并将启动运行状态确定为第一半导体元器件的第一运行状态,以及将第二档位确定为第一半导体元器件的第一运行档位。转入步骤3010。Step 3008: Determine the first operating frequency of the air conditioner compressor according to the start-up adjustment strategy, determine the start-up operating state as the first operating state of the first semiconductor component, and determine the second gear as the first operating state of the first semiconductor component First operating gear. Go to step 3010.
步骤3009:将获取到的空调压缩机的运行频率,确定为第一运行频率,并将启动运行状态确定为的第一半导体元器件的第一运行状态,以及将第三档位确定为第一半导体元器件的第一运行档位。转入步骤3010。Step 3009: Determine the obtained operating frequency of the air conditioner compressor as the first operating frequency, determine the start-up operating state as the first operating state of the first semiconductor component, and determine the third gear as the first The first operating gear of semiconductor components. Go to step 3010.
步骤3010:控制空调压缩机以第一运行频率运行,控制第一半导体元器件以第一运行档位运行,以及控制第一半导体元器件的第一制冷端上的第一排气扇运行,第一制热端上的第二排气扇运行。Step 3010: Control the air conditioner compressor to operate at the first operating frequency, control the first semiconductor component to operate at the first operating gear, and control the first exhaust fan on the first refrigeration end of the first semiconductor component to operate, the first The second exhaust fan on the heating side operates.
步骤3011:判断是否达到半导体元器件的设定运行周期的运行时间10min?若是,执行步骤3012,否则,返回步骤3010。Step 3011: Determine whether the running time of the set running cycle of the semiconductor component is 10 minutes? If yes, execute step 3012; otherwise, return to step 3010.
步骤3012:控制第一半导体元器件处于关闭停机状态,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇关闭。并将第一运行档位保存为前次运行档位。Step 3012: Control the first semiconductor component to be in shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be turned off, and the second exhaust fan on the first heating end to be turned off. And save the first running gear as the previous running gear.
步骤3013:判断第一半导体元器件处于关闭停机状态,且空调处于制冷模式运行状态的持续时间是否≥10min?若是,执行步骤3014,否则,返回步骤3013。Step 3013: Determine if the first semiconductor component is in shutdown state, and whether the duration of the air conditioner in cooling mode is ≥ 10 minutes? If yes, execute step 3014; otherwise, return to step 3013.
步骤3014:判断前次运行档位是否为第三运行档位?若是,执行步骤3015,否则,执行步骤3020。Step 3014: Determine whether the last running gear is the third running gear? If yes, go to step 3015; otherwise, go to step 3020.
步骤3015:判断当前绝对平均温度差值│Trp-Tset│≥2是否成立?若是,执行步骤3016,否则,执行步骤3017。Step 3015: Determine whether the current absolute average temperature difference│Trp-Tset│≥2 holds true? If yes, go to step 3016; otherwise, go to step 3017.
步骤3016:将获取到的空调压缩机的运行频率,确定为空调压缩机的当前运行频率,以及将第三档位确定为第一半导体元器件的启动运行状态中的当前运行档位。转入步骤3026。Step 3016: Determine the obtained operating frequency of the air conditioner compressor as the current operating frequency of the air conditioner compressor, and determine the third gear as the current operating gear in the starting operation state of the first semiconductor component. Go to step 3026.
步骤3017:获取到的空调压缩机的运行频率P≥Pmax的80%是否成立?若是,步骤3018,否则,执行步骤3019。Step 3017: Is it true that the acquired operating frequency P≥Pmax of the air conditioner compressor is established? If yes, go to step 3018; otherwise, go to step 3019.
步骤3018:对空调压缩机进行降频处理,并将降低后的运行频率,确定为空调压缩机的当前运行频率,以及将第三档位确定为第一半导体元器件的启动运行状态中的当前运行档位。转入步骤3026。Step 3018: Perform frequency reduction processing on the air-conditioning compressor, and determine the reduced operating frequency as the current operating frequency of the air-conditioning compressor, and determine the third gear as the current operating state of the first semiconductor component. Operating gear. Go to step 3026.
步骤3019:将获取到的空调压缩机的运行频率,确定为空调压缩机的当前运行频率,以及对第一半导体元器件进行降档处理,将第二运行档位确定为第一半导体元器件的启动运行状态中的当前运行档位。转入步骤3026。Step 3019: Determine the obtained operating frequency of the air conditioner compressor as the current operating frequency of the air conditioner compressor, and perform downshift processing on the first semiconductor component, and determine the second operating gear as the first semiconductor component’s operating frequency. Start the current running gear in the running state. Go to step 3026.
步骤3020:判断当前绝对平均温度差值│Trp-Tset│≥5是否成立?若是,执行步骤3021,否则,执行步骤3022。Step 3020: Determine whether the current absolute average temperature difference│Trp-Tset│≥5 holds true? If yes, go to step 3021; otherwise, go to step 3022.
步骤3021:将获取到的空调压缩机的运行频率,确定为空调压缩机当前运行频率,以及对第一半导体元器件进行升档处理,将升高后的运行档位确定为第一半导体元器件的启动运行状态中的当前运行档位。转入步骤3026。Step 3021: Determine the obtained operating frequency of the air conditioner compressor as the current operating frequency of the air conditioner compressor, and perform upshift processing on the first semiconductor component, and determine the increased operating gear as the first semiconductor component The current operating gear in the starting operating state of . Go to step 3026.
步骤3022:判断2≤│Trp-Tset│<5是否成立?若是,执行步骤3023,否则,执行步骤3024。Step 3022: Determine if 2≤│Trp-Tset│<5 holds true? If yes, go to step 3023; otherwise, go to step 3024.
步骤3023:将获取到的空调压缩机的运行频率,确定为当前运行频率,以及,将前次运行档位确定为第一半导体元器件的启动运行状态中的当前运行档位。转入步骤3026。Step 3023: Determine the obtained operating frequency of the air conditioner compressor as the current operating frequency, and determine the previous operating gear as the current operating gear in the start-up operating state of the first semiconductor component. Go to step 3026.
步骤3024:判断前次档位是否为第一档位?若是,执行步骤3028,否则,执行步骤3025。Step 3024: Determine whether the previous gear is the first gear? If yes, go to step 3028; otherwise, go to step 3025.
步骤3025:根据开机调整策略,确定空调压缩机的当前运行频率,以及对第一半导体元器件进行降档处理,将降低后的运行档位确定为第一半导体元器件的启动运行状态中的当前运行档位。转入步骤3026。Step 3025: According to the start-up adjustment strategy, determine the current operating frequency of the air conditioner compressor, and perform downshift processing on the first semiconductor component, and determine the lowered operating gear as the current frequency in the start-up operation state of the first semiconductor component. Operating gear. Go to step 3026.
步骤3026:控制空调压缩机以当前运行频率运行,控制第一半导体元器件以当前运行档位运行,以及控制第一半导体元器件的第一制冷端上的第一排气扇运行,第一制热端上的第二排气扇运行。Step 3026: Control the air conditioner compressor to run at the current operating frequency, control the first semiconductor component to run at the current operating gear, and control the first exhaust fan on the first refrigeration end of the first semiconductor component to run, the first system The second exhaust fan on the hot end operates.
步骤3027:在达到半导体元器件的设定运行周期的运行时间10min时,控制第一半导体元器件处于关闭停机状态,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇关闭。并将当前运行档位保存为前次运行档位。转入步骤3013。Step 3027: When the operating time of the set operating period of the semiconductor components reaches 10 minutes, control the first semiconductor components to be in a shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor components to close , the second exhaust fan on the first heating end is turned off. And save the current running gear as the previous running gear. Go to step 3013.
步骤3028:根据开机调整策略,控制空调压缩机运行,并控制第一半导体元器件处于关闭停机状态,以及控制第一半导体元器件的第一制冷端上的第一排气扇关闭,第一制热端上的第二排气扇关闭。Step 3028: According to the start-up adjustment strategy, control the operation of the air conditioner compressor, and control the first semiconductor component to be in the shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be closed, the first system The second exhaust fan on the hot end is off.
可见,本实施例中,空调中配置了两组半导体元器件,并且,在空调启动当前工作模式运行到达设定启动时间,且空调压缩机保持较高频运行时,若平均室内温度值与目标室内温度值之间的绝对平均温度差值仍然比较大,则可调整空调压缩机以及半导体元器件的运行参数以及状态,这样,通过控制半导体元器件的运行来提高空调的制冷量或制热量,提高了制冷制热效率,并且,满足一定的条件才对半导体元器件进行控制,减少了空调的功耗。It can be seen that in this embodiment, two sets of semiconductor components are configured in the air conditioner, and when the air conditioner starts to run in the current working mode and reaches the set start time, and the air conditioner compressor keeps running at a high frequency, if the average indoor temperature value is equal to the target If the absolute average temperature difference between indoor temperature values is still relatively large, the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted, so that the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components. The cooling and heating efficiency is improved, and the semiconductor components are controlled only when certain conditions are met, thereby reducing the power consumption of the air conditioner.
根据上述用于空调控制的过程,可构建一种用于空调控制的装置。According to the above process for air-conditioning control, an apparatus for air-conditioning control can be constructed.
图4是本公开实施例提供的一种用于空调控制装置的结构示意图。空调如上述,包括两组半导体元器件,或者,包括两组半导体元器件及其对应的排气扇。如图4所示,用于空调控制装置包括:第一获取模块4100,确定模块4200和第一控制模块4300。Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As mentioned above, the air conditioner includes two sets of semiconductor components, or two sets of semiconductor components and their corresponding exhaust fans. As shown in FIG. 4 , the air conditioner control device includes: a first acquisition module 4100 , a determination module 4200 and a first control module 4300 .
第一获取模块4100,被配置为在空调以当前工作模式运行的运行时间到达设定启动时间情况下,获取设定启动时间内,空调压缩机的平均运行频率,以及,获取第一设定时长内,处于当前工作模式运行空调的第一平均室内温度值,并得到第一平均室内温度值与目标室内温度值之间的第一绝对平均温度差值。The first acquisition module 4100 is configured to acquire the average operating frequency of the air conditioner compressor within the set start time when the running time of the air conditioner in the current working mode reaches the set start time, and acquire the first set duration In the current working mode, the first average indoor temperature value of the air conditioner is operated, and the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value is obtained.
第一确定模块4200,被配置为在第一绝对平均温度差值大于或等于第二设定温度值的情况下,确定与平均运行频率匹配的空调压缩机的第一运行频率,以及当前半导体元器件的第一运行状态,其中,当前半导体元器件与当前工作模式匹配。The first determination module 4200 is configured to determine the first operating frequency of the air conditioner compressor that matches the average operating frequency and the current A first operating state of the device, wherein the current semiconductor component matches the current operating mode.
第一控制模块4300,被配置为控制空调压缩机以第一运行频率运行,以及,控制当前半导体元器件以第一运行状态运行。The first control module 4300 is configured to control the air conditioner compressor to operate at the first operating frequency, and control the current semiconductor components to operate at the first operating state.
在一些实施例中,第一确定模块4200包括:In some embodiments, the first determining module 4200 includes:
第一确定单元,被配置为在平均运行频率小于第一设定频率的情况下,对空调压缩机进行升频处理,并将升高后的运行频率,确定为第一运行频率,并将关闭停机状态确定为当前半导体元器件的第一运行状态。The first determination unit is configured to perform up-frequency processing on the air conditioner compressor when the average operating frequency is less than the first set frequency, determine the increased operating frequency as the first operating frequency, and turn off the The shutdown state is determined as the first operating state of the current semiconductor component.
第二确定单元,被配置为在平均运行频率大于或等于第一设定频率,且小于第二设定频率的情况 下,根据开机调整策略,确定空调压缩机的第一运行频率,并将启动运行状态确定为当前半导体元器件的第一运行状态。The second determination unit is configured to determine the first operating frequency of the air conditioner compressor according to the start-up adjustment strategy when the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency, and will start the The running state is determined as the first running state of the current semiconductor component.
第三确定单元,被配置为在平均运行频率大于或等于第二设定频率的情况下,将获取到的空调压缩机的运行频率,确定为第一运行频率,并将启动运行状态确定为当前半导体元器件的第一运行状态。The third determining unit is configured to determine the obtained operating frequency of the air conditioner compressor as the first operating frequency and determine the start-up operating state as the current when the average operating frequency is greater than or equal to the second set frequency The first operating state of a semiconductor component.
在一些实施例中,第一控制模块4300包括:In some embodiments, the first control module 4300 includes:
第一档位确定单元,被配置为在平均运行频率大于或等于第一设定频率的情况下,确定与平均运行频率对应的当前半导体元器件的第一运行档位。The first gear determining unit is configured to determine the first operating gear of the current semiconductor component corresponding to the average operating frequency when the average operating frequency is greater than or equal to the first set frequency.
第一控制单元,被配置为在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以第一运行档位运行;在半导体元器件的设定运行周期的停止时间内,控制当前半导体元器件处于关闭停机状态。The first control unit is configured to control the current semiconductor component to operate at the first operating gear during the operating time of the set operating cycle of the semiconductor component; during the stop time of the set operating cycle of the semiconductor component, control The current semiconductor components are in shutdown state.
其中,半导体元器件对应两个或多个运行档位,半导体元器件的控制输入电流越大,对应的运行档位越高。Wherein, the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are.
在一些实施例中,该装置还包括:In some embodiments, the device also includes:
第二获取模块,被配置为在当前半导体元器件处于关闭停机状态,且空调处于当前模式运行状态的持续时间到达预设采样时长的情况下,获取空调所在区域当前设定时长内的当前平均室内温度值,并得到当前平均室内温度值与目标室内温度值之间的当前绝对平均温度差值。The second acquiring module is configured to acquire the current average indoor air conditioner within the current set period of time in the area where the air conditioner is located when the current semiconductor components are in the shutdown state and the duration of the air conditioner in the current mode of operation reaches the preset sampling period. temperature value, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value.
第二确定模块,被配置为确定与当前绝对平均温度差值匹配的空调压缩机的当前运行频率,以及当前半导体元器件的当前运行状态。The second determination module is configured to determine the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference, and the current operating state of the semiconductor components.
第二控制模块,被配置为控制空调压缩机以当前运行频率运行,以及,控制当前半导体元器件以当前运行状态运行。The second control module is configured to control the air conditioner compressor to operate at the current operating frequency, and to control the current semiconductor components to operate at the current operating state.
在一些实施例中,在当前半导体元器件的前次运行档位为最高档位的情况下,第二确定模块包括:In some embodiments, when the previous operating gear of the current semiconductor component is the highest gear, the second determination module includes:
第四确定单元,被配置为在当前绝对平均温度差值大于或等于第一设定温度值的情况下,将获取到的空调压缩机的运行频率,确定为当前运行频率,以及将最高档位确定为当前半导体元器件的启动运行状态中的当前运行档位。The fourth determination unit is configured to determine the obtained running frequency of the air conditioner compressor as the current running frequency and set the maximum gear position to It is determined as the current operating gear in the start-up operating state of the current semiconductor component.
第五确定单元,被配置为在当前绝对平均温度差值小于第一设定温度值的情况下,若获取到的空调压缩机的运行频率大于或等于第二设定频率时,对空调压缩机进行降频处理,并将降低后的运行频率,确定为当前运行频率,以及将最高档位确定为当前半导体元器件的启动运行状态中的当前运行档位;The fifth determining unit is configured to, when the current absolute average temperature difference is less than the first set temperature value, if the acquired operating frequency of the air conditioner compressor is greater than or equal to the second set frequency, the air conditioner compressor Perform frequency reduction processing, and determine the reduced operating frequency as the current operating frequency, and determine the highest gear as the current operating gear in the start-up operation state of the current semiconductor components;
第六确定单元,被配置为在当前绝对平均温度差值小于第一设定温度值的情况下,若获取到的空调压缩机的运行频率小于第二设定频率时,将获取到的空调压缩机的运行频率,确定为当前运行频率,以及对当前半导体元器件进行降档处理,将降低后的运行档位确定为当前半导体元器件的启动运行状态中的当前运行档位。The sixth determination unit is configured to compress the obtained air conditioner compressor to The operating frequency of the machine is determined as the current operating frequency, and the current semiconductor component is downshifted, and the reduced operating gear is determined as the current operating gear in the start-up operation state of the current semiconductor component.
在一些实施例中,在当前半导体元器件的前次运行档位不为最高档位的情况下,第二确定模块包括:In some embodiments, when the previous operating gear of the current semiconductor component is not the highest gear, the second determination module includes:
第七确定单元,被配置为在当前绝对平均温度差值大于或等于第二设定温度值的情况下,将获取到的空调压缩机的运行频率,确定为当前运行频率,以及对当前半导体元器件进行升档处理,将升高后的运行档位确定为当前半导体元器件的启动运行状态中的当前运行档位。The seventh determination unit is configured to determine the obtained operating frequency of the air conditioner compressor as the current operating frequency when the current absolute average temperature difference is greater than or equal to the second set temperature value, and determine the current operating frequency of the semiconductor element The device performs an upshift process, and determines the elevated operating gear as the current operating gear in the current start-up operation state of the semiconductor component.
第八确定单元,被配置为在当前绝对平均温度差值小于第二设定温度值,且大于或等于第一设定温度值的情况下,将获取到的空调压缩机的运行频率,确定为当前运行频率,以及,将前次运行档位确定为当前半导体元器件的启动运行状态中的当前运行档位。The eighth determination unit is configured to determine the obtained operating frequency of the air conditioner compressor as The current operating frequency, and determining the previous operating gear as the current operating gear in the current start-up operating state of the semiconductor component.
第九确定单元,被配置为在当前绝对平均温度差值小于第一设定温度值的情况下,根据开机调整 策略,确定空调压缩机的当前运行频率,以及对当前半导体元器件进行降档处理,将降低后的运行档位确定为当前半导体元器件的启动运行状态中的当前运行档位。The ninth determination unit is configured to determine the current operating frequency of the air conditioner compressor according to the start-up adjustment strategy and perform downshift processing on the current semiconductor components when the current absolute average temperature difference is less than the first set temperature value. , determining the reduced operating gear as the current operating gear in the current start-up operating state of the semiconductor components.
在一些实施例中,第九确定单元,具体被配置为前次运行档位为最低档位的情况下,若当前绝对平均温度差值小于第一设定温度值时,将关闭停机状态确定为当前半导体元器件的当前运行状态。In some embodiments, the ninth determining unit is specifically configured to determine that the shutdown state is closed if the current absolute average temperature difference is less than the first set temperature value when the previous operating gear is the lowest gear. The current operating status of the current semiconductor component.
下面举例说明本公开实施例提供的用于空调控制的装置进行空调控制过程。The following is an example to illustrate the air-conditioning control process performed by the device for air-conditioning control provided by the embodiments of the present disclosure.
空调可如图1所示,包括两组半导体元器件和四个排气扇。空调中保存的第一设定温度值为2.5℃,第二设定温度值为5.5℃。并且,半导体元器件对应3个运行档位,第三档位的输出能量大于第二档位的输出能量,而第二档位的输出能量大于第一档位的输出能量。并且,第一设定频率为空调压缩机最高频率的50%、第二设定频率为空调压缩机最高频率的80%。设定启动时间可为20min,设定时长以及第一设定时长可为12min,半导体元器件的设定运行周期可为30min,而设定运行周期的运行时间为15min;而设定启动时间可为设定运行周期的运行时间,也为15min;预设采样时长也可为15min。空调的当前运行模式为制热模式,对应的第二半导体元器件为第二半导体元器件。The air conditioner can be shown in Figure 1, including two sets of semiconductor components and four exhaust fans. The first set temperature value stored in the air conditioner is 2.5°C, and the second set temperature value is 5.5°C. Moreover, the semiconductor components correspond to three operating gears, the output energy of the third gear is greater than the output energy of the second gear, and the output energy of the second gear is greater than the output energy of the first gear. Moreover, the first set frequency is 50% of the highest frequency of the air conditioner compressor, and the second set frequency is 80% of the highest frequency of the air conditioner compressor. The set start time can be 20 minutes, the set duration and the first set duration can be 12 minutes, the set operation cycle of the semiconductor components can be 30 minutes, and the operation time of the set operation cycle is 15 minutes; and the set start time can be In order to set the running time of the running cycle, it is also 15 minutes; the preset sampling time can also be 15 minutes. The current operating mode of the air conditioner is the heating mode, and the corresponding second semiconductor component is the second semiconductor component.
图5是本公开实施例提供的一种用于空调控制装置的结构示意图。如图5所示,用于空调控制装置包括:第一获取模块4100,第一确定模块4200,第一控制模块4300、第二获取模块4400、第二确定模块4500和第二控制模块4600,其中,第一确定模块4200包括:第一确定单元4210、第二确定单元4220和第三确定单元4320,第一控制模块4300包括:第一档位确定单元4310和第一控制单元4320。第二确定模块4500包括:第三确定单元4510、第四确定单元4520、第六确定单元4530、第七确定单元4540、第八确定单元4550和第九确定单元4560。Fig. 5 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As shown in Figure 5, the air conditioner control device includes: a first acquisition module 4100, a first determination module 4200, a first control module 4300, a second acquisition module 4400, a second determination module 4500 and a second control module 4600, wherein , the first determination module 4200 includes: a first determination unit 4210 , a second determination unit 4220 and a third determination unit 4320 , and the first control module 4300 includes: a first gear position determination unit 4310 and a first control unit 4320 . The second determination module 4500 includes: a third determination unit 4510 , a fourth determination unit 4520 , a sixth determination unit 4530 , a seventh determination unit 4540 , an eighth determination unit 4550 and a ninth determination unit 4560 .
空调开机进行制热模式启动,这样,空调制热运行时间到达20min时,第一花获取模块4100可获取20min内,空调压缩机的平均运行频率P,并可记录12min内,处于制热模式运行空调的室内温度值,得到12min内的第一平均室内温度值Trp1,并以及根据当前平均室内温度值Trp1,以及目标室内温度值Tset,得到当前绝对平均温度差值│Trp1-Tset│。Turn on the air conditioner to start the heating mode. In this way, when the heating operation time of the air conditioner reaches 20 minutes, the first flower acquisition module 4100 can obtain the average operating frequency P of the air conditioner compressor within 20 minutes, and can record that it is running in the heating mode within 12 minutes. For the indoor temperature value of the air conditioner, the first average indoor temperature value Trp1 within 12 minutes is obtained, and based on the current average indoor temperature value Trp1 and the target indoor temperature value Tset, the current absolute average temperature difference │Trp1-Tset│ is obtained.
这样,若│Trp1-Tset│<5.5℃,空调正常制热运行。而若│Trp1-Tset│≥5.5℃,且平均运行频率Pp<Pmax的50%时,第一确定模块4200中的第一确定单元4210可对空调压缩机进行升频处理,并将升高后的运行频率,确定为第一运行频率,并将关闭停机状态确定为第二半导体元器件的第一运行状态,从而,第一控制模块4300可对空调压缩机进行升频处理,并控制空调压缩机以升高后的运行频率进行运行,以及控制第二半导体元器件处于关闭停机状态。In this way, if │Trp1-Tset│<5.5°C, the air conditioner operates normally for heating. And if │Trp1-Tset│≥5.5°C, and the average operating frequency Pp<50% of Pmax, the first determination unit 4210 in the first determination module 4200 can increase the frequency of the air conditioner compressor, and increase the The operating frequency is determined as the first operating frequency, and the shutdown state is determined as the first operating state of the second semiconductor component. Therefore, the first control module 4300 can perform frequency up processing on the air conditioner compressor and control the air conditioner compressor. The machine runs at the increased operating frequency, and the second semiconductor component is controlled to be in a shutdown state.
若│Trp1-Tset│≥5.5℃,且Pmax的50%≤Pp<Pmax的80%时,第一确定模块4200中的第二确定单元4220根据开机调整策略,确定空调压缩机的第一运行频率,并将启动运行状态确定为第二半导体元器件的第一运行状态,以及第一控制模块4300中的第一档位确定单元4310将第二档位确定为第二半导体元器件的第一运行档位。If │Trp1-Tset│≥5.5°C, and 50% of Pmax≤Pp<80% of Pmax, the second determination unit 4220 in the first determination module 4200 determines the first operating frequency of the air conditioner compressor according to the start-up adjustment strategy , and determine the starting operating state as the first operating state of the second semiconductor component, and the first gear determination unit 4310 in the first control module 4300 determines the second gear as the first operating state of the second semiconductor component stalls.
若│Trp1-Tset│≥5.5℃,且Pmax的80%≤Pp时,第一确定模块4200中的第三确定单元4230将获取到的空调压缩机的运行频率,确定为第一运行频率,并将启动运行状态确定为的第二半导体元器件的第一运行状态,以及第一档位确定单元4310将第三档位确定为第二半导体元器件的第一运行档位。If │Trp1-Tset│≥5.5°C, and 80% of Pmax≤Pp, the third determination unit 4230 in the first determination module 4200 determines the acquired operating frequency of the air conditioner compressor as the first operating frequency, and The startup operation state is determined as the first operation state of the second semiconductor component, and the first gear determining unit 4310 determines the third gear as the first operation gear of the second semiconductor component.
从而,第一控制模块4300中的第一控制单元4320可控制空调压缩机以第一运行频率运行,控制第二半导体元器件以第一运行档位运行,以及控制第二半导体元器件的第一制热端上的第一排气扇运行,第一制热端上的第二排气扇运行。以及,在到达与半导体元器件的设定运行周期的运行时间15min时,第一控制单元4320则可控制第二半导体元器件处于关闭停机状态,以及控制第二半导体元器件的第二制热端上的第三排气扇关闭,第二制热端上的第四排气扇关闭。并将第一运行档位保存为前次运行档位。Therefore, the first control unit 4320 in the first control module 4300 can control the air conditioner compressor to operate at the first operating frequency, control the second semiconductor components to operate at the first operating gear, and control the first operating frequency of the second semiconductor components. The first exhaust fan on the heating side runs, and the second exhaust fan on the first heating side runs. And, when reaching the running time of 15 minutes with the set running cycle of the semiconductor components, the first control unit 4320 can control the second semiconductor components to be in shutdown state, and control the second heating terminal of the second semiconductor components The third exhaust fan on the heating end is turned off, and the fourth exhaust fan on the second heating end is turned off. And save the first running gear as the previous running gear.
而控制第二半导体元器件以第一运行档位运行之后,可继续连续控制第二半导体元器件。其中,在第二半导体元器件处于关闭停机状态,且空调处于当前模式运行状态的持续时间到达预设采样时长15min的情况下,第二获取模块4400获取空调所在区域当前设定时长12min内的当前平均室内温度值Trp,并得到当前平均室内温度值与目标室内温度值之间的当前绝对平均温度差值│Trp-Tset│。After the second semiconductor component is controlled to operate at the first operating gear, the second semiconductor component can be continuously controlled. Wherein, when the second semiconductor component is in the shutdown state, and the duration of the air conditioner in the current mode operation state reaches the preset sampling time length of 15 minutes, the second acquisition module 4400 obtains the current time within 12 minutes of the current set time length of the area where the air conditioner is located. The average indoor temperature value Trp, and the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value│Trp-Tset│.
并且,获取的前次运行档位为第三运行档位时,若│Trp-Tset│≥2.5℃,第二确定模块4500中第四确定单元4510可将获取到的空调压缩机的运行频率,确定为空调压缩机的当前运行频率,以及将第三档位确定为第二半导体元器件的启动运行状态中的当前运行档位。而若│Trp-Tset│<2.5℃,但是获取到的空调压缩机的运行频率P≥Pmax的80%时,第五确定单元4520可对空调压缩机进行降频处理,并将降低后的运行频率,确定为空调压缩机的当前运行频率,以及将第三档位确定为第二半导体元器件的启动运行状态中的当前运行档位。若│Trp-Tset│<2.5℃,但是获取到的空调压缩机的运行频率P<Pmax的80%时,第六确定单元4530则将获取到的空调压缩机的运行频率,确定为空调压缩机的当前运行频率,以及对第二半导体元器件进行降档处理,将第二运行档位确定为第二半导体元器件的启动运行状态中的当前运行档位。In addition, when the previously obtained operating gear is the third operating gear, if │Trp-Tset│≥2.5°C, the fourth determining unit 4510 in the second determining module 4500 can obtain the operating frequency of the air conditioner compressor, It is determined as the current operating frequency of the air conditioner compressor, and the third gear is determined as the current operating gear in the starting operation state of the second semiconductor component. And if │Trp-Tset│<2.5°C, but the obtained operating frequency P≥Pmax of the air-conditioning compressor is 80%, the fifth determination unit 4520 can perform frequency reduction processing on the air-conditioning compressor, and reduce the operating frequency of the air-conditioning compressor The frequency is determined as the current operating frequency of the air conditioner compressor, and the third gear is determined as the current operating gear in the start-up operating state of the second semiconductor component. If │Trp-Tset│<2.5°C, but the obtained operating frequency P of the air-conditioning compressor is less than 80% of Pmax, the sixth determination unit 4530 determines the obtained operating frequency of the air-conditioning compressor as the air-conditioning compressor The current operating frequency of the second semiconductor component is downshifted, and the second operating gear is determined as the current operating gear in the start-up operating state of the second semiconductor component.
获取的前次运行档位不为第三运行档位时,若│Trp-Tset│≥5.5℃,第七确定单元4540可将获取到的空调压缩机的运行频率,确定为空调压缩机当前运行频率,以及对第二半导体元器件进行升档处理,将升高后的运行档位确定为第二半导体元器件的启动运行状态中的当前运行档位。而若2.5℃≤│Trp-Tset│<5.5℃时,第八确定单元4550可将获取到的空调压缩机的运行频率,确定为当前运行频率,以及,将前次运行档位确定为第二半导体元器件的启动运行状态中的当前运行档位。而│Trp-Tset│<2.5℃时,第九确定单元4560根据开机调整策略,确定空调压缩机的当前运行频率,以及对第二半导体元器件进行降档处理,将降低后的运行档位确定为第二半导体元器件的启动运行状态中的当前运行档位。其中,若前次运行档位是最低档位是,对第二半导体元器件进行降档处理时,第九确定单元4560将关闭停机状态确定为第二半导体元器件的当前运行状态。When the acquired previous operating gear is not the third operating gear, if │Trp-Tset│≥5.5°C, the seventh determination unit 4540 can determine the acquired operating frequency of the air conditioner compressor as the current operating frequency of the air conditioner compressor frequency, and perform an upshift process on the second semiconductor component, and determine the raised operating gear as the current operating gear in the start-up operating state of the second semiconductor component. And if 2.5°C≦│Trp-Tset│<5.5°C, the eighth determination unit 4550 can determine the obtained operating frequency of the air conditioner compressor as the current operating frequency, and determine the previous operating gear as the second The current operating gear in the start-up operating state of the semiconductor component. When │Trp-Tset│<2.5°C, the ninth determination unit 4560 determines the current operating frequency of the air conditioner compressor according to the start-up adjustment strategy, and performs downshift processing on the second semiconductor component to determine the reduced operating gear is the current operating gear in the start-up operating state of the second semiconductor component. Wherein, if the previous operating gear is the lowest gear, when downshifting the second semiconductor component, the ninth determination unit 4560 determines the shutdown state as the current operating state of the second semiconductor component.
从而,第二控制模块4600可控制空调压缩机以当前运行频率运行,控制第二半导体元器件以当前运行档位运行,以及控制第二半导体元器件的第一制热端上的第一排气扇运行,第一制热端上的第二排气扇运行。以及,在到达与半导体元器件的设定运行周期的运行时间15min时,第二控制模块4600则可控制第二半导体元器件处于关闭停机状态,以及控制第二半导体元器件的第二制热端上的第三排气扇关闭,第二制热端上的第四排气扇关闭。并将当前运行档位保存为前次运行档位。Therefore, the second control module 4600 can control the air conditioner compressor to operate at the current operating frequency, control the second semiconductor component to operate at the current operating gear, and control the first exhaust gas on the first heating terminal of the second semiconductor component The fan is running, and the second exhaust fan on the first heating side is running. And, when the running time of the set running cycle of the semiconductor component reaches 15 minutes, the second control module 4600 can control the second semiconductor component to be in the shutdown state, and control the second heating terminal of the second semiconductor component The third exhaust fan on the heating end is turned off, and the fourth exhaust fan on the second heating end is turned off. And save the current running gear as the previous running gear.
可见,本实施例中,空调中配置了两组半导体元器件,这样,用于空调控制的装置在空调启动当前工作模式运行到达设定启动时间,且空调压缩机保持较高频运行时,若平均室内温度值与目标室内温度值之间的绝对平均温度差值仍然比较大,则可调整空调压缩机以及半导体元器件的运行参数以及状态,这样,通过控制半导体元器件的运行来提高空调的制冷量或制热量,提高了制冷制热效率,并且,满足一定的条件才对半导体元器件进行控制,减少了空调的功耗。It can be seen that in this embodiment, two sets of semiconductor components are configured in the air conditioner. In this way, when the device for air conditioner control runs in the current working mode of the air conditioner and reaches the set start time, and the air conditioner compressor keeps running at a relatively high frequency, if If the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value is still relatively large, the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted, so that the air conditioner can be improved by controlling the operation of the semiconductor components. The cooling capacity or heating capacity improves the cooling and heating efficiency, and the semiconductor components are controlled only when certain conditions are met, reducing the power consumption of the air conditioner.
本公开实施例提供了一种用于空调控制的装置,其结构如图6所示,包括:An embodiment of the present disclosure provides a device for air conditioning control, the structure of which is shown in Figure 6, including:
处理器(processor)1000和存储器(memory)1001,还可以包括通信接口(Communication Interface)1002和总线1003。其中,处理器1000、通信接口1002、存储器1001可以通过总线1003完成相互间的通信。通信接口1002可以用于信息传输。处理器1000可以调用存储器1001中的逻辑指令,以执行上述实施例的用于空调控制的方法。A processor (processor) 1000 and a memory (memory) 1001 may also include a communication interface (Communication Interface) 1002 and a bus 1003. Wherein, the processor 1000 , the communication interface 1002 , and the memory 1001 can communicate with each other through the bus 1003 . Communication interface 1002 may be used for information transfer. The processor 1000 can call the logic instructions in the memory 1001 to execute the method for air conditioner control in the above embodiments.
此外,上述的存储器1001中的逻辑指令可以通过软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。In addition, the above logic instructions in the memory 1001 may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as an independent product.
存储器1001作为一种计算机可读存储介质,可用于存储软件程序、计算机可执行程序,如本公 开实施例中的方法对应的程序指令/模块。处理器1000通过运行存储在存储器1001中的程序指令/模块,从而执行功能应用以及数据处理,即实现上述方法实施例中的用于空调控制的方法。As a computer-readable storage medium, the memory 1001 can be used to store software programs and computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 1000 executes function applications and data processing by running program instructions/modules stored in the memory 1001 , that is, implements the method for air-conditioning control in the above method embodiments.
存储器1001可包括存储程序区和存储数据区,其中,存储程序区可存储操作系统、至少一个功能所需的应用程序;存储数据区可存储根据终端空调的使用所创建的数据等。此外,存储器1001可以包括高速随机存取存储器,还可以包括非易失性存储器。The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required by a function; the data storage area may store data created according to the use of the terminal air conditioner, and the like. In addition, the memory 1001 may include a high-speed random access memory, and may also include a non-volatile memory.
本公开实施例提供了一种用于空调控制装置,包括:处理器和存储有程序指令的存储器,处理器被配置为在执行程序指令时,执行用于空调控制方法。An embodiment of the present disclosure provides an air-conditioning control device, including: a processor and a memory storing program instructions, and the processor is configured to execute an air-conditioning control method when executing the program instructions.
本公开实施例提供了一种空调,包括上述用于空调控制装置。An embodiment of the present disclosure provides an air conditioner, including the above-mentioned control device for an air conditioner.
本公开实施例提供了一种计算机可读存储介质,存储有计算机可执行指令,所述计算机可执行指令设置为执行上述用于空调控制方法。An embodiment of the present disclosure provides a computer-readable storage medium, which stores computer-executable instructions, and the computer-executable instructions are configured to execute the above method for controlling an air conditioner.
本公开实施例提供了一种计算机程序产品,所述计算机程序产品包括存储在计算机可读存储介质上的计算机程序,所述计算机程序包括程序指令,当所述程序指令被计算机执行时,使所述计算机执行上述用于空调控制方法。An embodiment of the present disclosure provides a computer program product, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program includes program instructions, and when the program instructions are executed by a computer, the The computer executes the above method for air conditioning control.
上述的计算机可读存储介质可以是暂态计算机可读存储介质,也可以是非暂态计算机可读存储介质。The above-mentioned computer-readable storage medium may be a transitory computer-readable storage medium, or a non-transitory computer-readable storage medium.
本公开实施例的技术方案可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质中,包括一个或多个指令用以使得一台计算机空调(可以是个人计算机,服务器,或者网络空调等)执行本公开实施例所述方法的全部或部分步骤。而前述的存储介质可以是非暂态存储介质,包括:U盘、移动硬盘、只读存储器(ROM,Read-Only Memory)、随机存取存储器(RAM,Random Access Memory)、磁碟或者光盘等多种可以存储程序代码的介质,也可以是暂态存储介质。The technical solutions of the embodiments of the present disclosure can be embodied in the form of software products. The computer software products are stored in a storage medium and include one or more instructions to make a computer air conditioner (which can be a personal computer, a server, or a network air conditioner, etc.) execute all or part of the steps of the method described in the embodiments of the present disclosure. The aforementioned storage medium can be a non-transitory storage medium, including: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc. A medium that can store program code, or a transitory storage medium.
以上描述和附图充分地示出了本公开的实施例,以使本领域的技术人员能够实践它们。其他实施例可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求,否则单独的部件和功能是可选的,并且操作的顺序可以变化。一些实施例的部分和特征可以被包括在或替换其他实施例的部分和特征。本公开实施例的范围包括权利要求书的整个范围,以及权利要求书的所有可获得的等同物。当用于本申请中时,虽然术语“第一”、“第二”等可能会在本申请中使用以描述各元件,但这些元件不应受到这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。比如,在不改变描述的含义的情况下,第一元件可以叫做第二元件,并且同样第,第二元件可以叫做第一元件,只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件,但可以不是相同的元件。而且,本申请中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的,除非上下文清楚地表明,否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地,如在本申请中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外,当用于本申请中时,术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素,和/或组件的存在,但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。在没有更多限制的情况下,由语句“包括一个…”限定的要素,并不排除在包括所述要素的过程、方法或者空调中还存在另外的相同要素。本文中,每个实施例重点说明的可以是与其他实施例的不同之处,各个实施例之间相同相似部分可以互相参见。对于实施例公开的方法、产品等而言,如果其与实施例公开的方法部分相对应,那么相关之处可以参见方法部分的描述。The above description and drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, procedural, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present disclosure includes the full scope of the claims, and all available equivalents of the claims. When used in the present application, although the terms 'first', 'second', etc. may be used in the present application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without changing the meaning of the description, a first element could be called a second element, and likewise, a second element could be called a first element, as long as all occurrences of "first element" are renamed consistently and all occurrences of "Second component" can be renamed consistently. The first element and the second element are both elements, but may not be the same element. Also, the terms used in the present application are used to describe the embodiments only and are not used to limit the claims. As used in the examples and description of the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well unless the context clearly indicates otherwise . Similarly, the term "and/or" as used in this application is meant to include any and all possible combinations of one or more of the associated listed ones. Additionally, when used in this application, the term "comprise" and its variants "comprises" and/or comprising (comprising) etc. refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these. Without further limitations, an element defined by the statement "comprising a ..." does not exclude the presence of additional identical elements in the process, method or condition comprising said element. Herein, what each embodiment focuses on may be the difference from other embodiments, and the same and similar parts of the various embodiments may refer to each other. For the method, product, etc. disclosed in the embodiment, if it corresponds to the method part disclosed in the embodiment, then the relevant part can refer to the description of the method part.
本领域技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够 以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,可以取决于技术方案的特定应用和设计约束条件。所述技术人员可以对每个特定的应用来使用不同方法以实现所描述的功能,但是这种实现不应认为超出本公开实施例的范围。所述技术人员可以清楚地了解到,为描述的方便和简洁,上述描述的系统、装置和单元的具体工作过程,可以参考前述方法实施例中的对应过程,在此不再赘述。Those skilled in the art can appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software may depend on the specific application and design constraints of the technical solution. Said artisans may implement the described functions using different methods for each particular application, but such implementation should not be regarded as exceeding the scope of the disclosed embodiments. The skilled person can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.
本文所披露的实施例中,所揭露的方法、产品(包括但不限于装置、空调等),可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,可以仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另外,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例。另外,在本公开实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, air conditioners, etc.) can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units may only be a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined Or it can be integrated into another system, or some features can be ignored, or not implemented. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to implement this embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
附图中的流程图和框图显示了根据本公开实施例的系统、方法和计算机程序产品的可能实现的体系架构、功能和操作。在这点上,流程图或框图中的每个方框可以代表一个模块、程序段或代码的一部分,所述模块、程序段或代码的一部分包含一个或多个用于实现规定的逻辑功能的可执行指令。在有些作为替换的实现中,方框中所标注的功能也可以以不同于附图中所标注的顺序发生。例如,两个连续的方框实际上可以基本并行地执行,它们有时也可以按相反的顺序执行,这可以依所涉及的功能而定。在附图中的流程图和框图所对应的描述中,不同的方框所对应的操作或步骤也可以以不同于描述中所披露的顺序发生,有时不同的操作或步骤之间不存在特定的顺序。例如,两个连续的操作或步骤实际上可以基本并行地执行,它们有时也可以按相反的顺序执行,这可以依所涉及的功能而定。框图和/或流程图中的每个方框、以及框图和/或流程图中的方框的组合,可以用执行规定的功能或动作的专用的基于硬件的系统来实现,或者可以用专用硬件与计算机指令的组合来实现。The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the disclosure. In this regard, each block in a flowchart or block diagram may represent a module, program segment, or part of code that includes one or more Executable instructions. In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than that disclosed in the description, and sometimes there is no specific agreement between different operations or steps. order. For example, two consecutive operations or steps may, in fact, be performed substantially concurrently, or they may sometimes be performed in the reverse order, depending upon the functionality involved. Each block in the block diagrams and/or flowcharts, and combinations of blocks in the block diagrams and/or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by dedicated hardware implemented in combination with computer instructions.

Claims (11)

  1. 一种用于空调控制的方法,其特征在于,所述空调包括两组半导体元器件,其中,第一半导体元器件的第一制冷端与空调内机连接,所述第一半导体元器件的第一制热端与空调外机连接,第二半导体元器件的第二制冷端与所述空调外机连接,所述第二半导体元器件的第二制热端与所述空调内机连接,所述方法包括:A method for air conditioner control, characterized in that the air conditioner includes two sets of semiconductor components, wherein the first refrigeration terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first cooling terminal of the first semiconductor component A heating terminal is connected to the air conditioner external unit, a second cooling terminal of the second semiconductor component is connected to the air conditioner external unit, and a second heating terminal of the second semiconductor component is connected to the air conditioner internal unit, so The methods described include:
    在空调以当前工作模式运行的运行时间到达设定启动时间情况下,获取所述设定启动时间内,所述空调压缩机的平均运行频率,以及,获取第一设定时长内,处于当前工作模式运行空调的第一平均室内温度值,并得到所述第一平均室内温度值与目标室内温度值之间的第一绝对平均温度差值;When the running time of the air conditioner in the current working mode reaches the set start time, obtain the average running frequency of the air conditioner compressor within the set start time, and obtain the current working frequency within the first set time period Mode operation of the first average indoor temperature value of the air conditioner, and obtaining the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value;
    在所述第一绝对平均温度差值大于或等于第二设定温度值的情况下,确定与所述平均运行频率匹配的所述空调压缩机的第一运行频率,以及当前半导体元器件的第一运行状态,其中,所述当前半导体元器件与所述当前工作模式匹配;When the first absolute average temperature difference is greater than or equal to the second set temperature value, determine the first operating frequency of the air-conditioning compressor that matches the average operating frequency, and the first operating frequency of the current semiconductor components an operating state, wherein the current semiconductor component matches the current working mode;
    控制所述空调压缩机以所述第一运行频率运行,以及,控制所述当前半导体元器件以所述第一运行状态运行。The air conditioner compressor is controlled to operate at the first operating frequency, and the current semiconductor component is controlled to operate at the first operating state.
  2. 根据权利要求1所述的方法,其特征在于,所述当前工作模式为制冷模式时,所述当前半导体元器件为所述第一半导体元器件;所述当前工作模式为制热模式时,所述当前半导体元器件为所述第二半导体元器件。The method according to claim 1, wherein when the current working mode is cooling mode, the current semiconductor component is the first semiconductor component; when the current working mode is heating mode, the The current semiconductor component is the second semiconductor component.
  3. 根据权利要求1所述的方法,其特征在于,所述确定与所述平均运行频率匹配的所述空调压缩机的第一运行频率,以及当前半导体元器件的第一运行状态包括:The method according to claim 1, wherein the determining the first operating frequency of the air-conditioning compressor matching the average operating frequency and the current first operating state of the semiconductor components comprises:
    在所述平均运行频率小于第一设定频率的情况下,对所述空调压缩机进行升频处理,并将升高后的运行频率,确定为所述第一运行频率,并将关闭停机状态确定为所述当前半导体元器件的第一运行状态;When the average operating frequency is less than the first set frequency, the air conditioner compressor is subjected to frequency up processing, and the increased operating frequency is determined as the first operating frequency, and the shutdown state is turned off determined as the first operating state of the current semiconductor component;
    在所述平均运行频率大于或等于第一设定频率,且小于第二设定频率的情况下,根据开机调整策略,确定所述空调压缩机的第一运行频率,并将启动运行状态确定为所述当前半导体元器件的第一运行状态;When the average operating frequency is greater than or equal to the first set frequency and less than the second set frequency, the first operating frequency of the air-conditioning compressor is determined according to the start-up adjustment strategy, and the start-up operating state is determined as the first operating state of the current semiconductor component;
    在所述平均运行频率大于或等于第二设定频率的情况下,将获取到的所述空调压缩机的运行频率,确定为所述第一运行频率,并将启动运行状态确定为所述当前半导体元器件的第一运行状态。When the average operating frequency is greater than or equal to the second set frequency, the acquired operating frequency of the air conditioner compressor is determined as the first operating frequency, and the starting operating state is determined as the current The first operating state of a semiconductor component.
  4. 根据权利要求1-3任一项所述的方法,其特征在于,所述控制所述当前半导体元器件以所述第一运行状态运行包括:The method according to any one of claims 1-3, wherein the controlling the current semiconductor component to operate in the first operating state comprises:
    在所述平均运行频率大于或等于第一设定频率的情况下,确定与所述平均运行频率对应的当前半导体元器件的第一运行档位;When the average operating frequency is greater than or equal to the first set frequency, determine the first operating gear of the current semiconductor component corresponding to the average operating frequency;
    在半导体元器件的设定运行周期的运行时间内,控制当前半导体元器件以所述第一运行档位运行;Controlling the current semiconductor component to operate at the first operating gear within the operating time of the set operating cycle of the semiconductor component;
    在所述半导体元器件的设定运行周期的停止时间内,控制所述当前半导体元器件处于关闭停机状态;During the stop time of the set operating cycle of the semiconductor component, control the current semiconductor component to be in a shutdown state;
    其中,所述半导体元器件对应两个或多个运行档位,半导体元器件的控制输入电流越大,对应的运行档位越高。Wherein, the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are.
  5. 根据权利要求4所述的方法,其特征在于,所述控制当前半导体元器件以所述第一运行档 位运行之后,还包括:The method according to claim 4, wherein, after said controlling the current semiconductor components to run with the first operating gear, it also includes:
    在所述当前半导体元器件处于关闭停机状态,且所述空调处于当前模式运行状态的持续时间到达预设采样时长的情况下,获取所述空调所在区域当前设定时长内的当前平均室内温度值,并得到所述当前平均室内温度值与目标室内温度值之间的当前绝对平均温度差值;In the case that the current semiconductor components are in the shutdown state and the duration of the air conditioner in the current mode operation state reaches the preset sampling time length, obtain the current average indoor temperature value within the current set time length of the area where the air conditioner is located , and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value;
    确定与所述当前绝对平均温度差值匹配的所述空调压缩机的当前运行频率,以及所述当前半导体元器件的当前运行状态;determining the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference, and the current operating state of the current semiconductor components;
    控制所述空调压缩机以所述当前运行频率运行,以及,控制所述当前半导体元器件以所述当前运行状态运行。The air conditioner compressor is controlled to operate at the current operating frequency, and the current semiconductor components are controlled to operate at the current operating state.
  6. 根据权利要求5所述的方法,其特征在于,在当前半导体元器件的前次运行档位为最高档位的情况下,所述确定与所述当前绝对平均温度差值匹配的所述空调压缩机的当前运行频率,以及所述当前半导体元器件的当前运行状态包括:The method according to claim 5, characterized in that, in the case that the previous operating gear of the current semiconductor components is the highest gear, said determining the air-conditioning compression that matches the current absolute average temperature difference The current operating frequency of the machine, and the current operating status of the current semiconductor components include:
    在所述当前绝对平均温度差值大于或等于第一设定温度值的情况下,将获取到的所述空调压缩机的运行频率,确定为所述当前运行频率,以及将所述最高档位确定为所述当前半导体元器件的启动运行状态中的当前运行档位;In the case that the current absolute average temperature difference is greater than or equal to the first set temperature value, the obtained operating frequency of the air conditioner compressor is determined as the current operating frequency, and the highest gear position is set to Determined as the current operating gear in the start-up operating state of the current semiconductor component;
    在所述当前绝对平均温度差值小于第一设定温度值的情况下,若获取到的所述空调压缩机的运行频率大于或等于第二设定频率时,对所述空调压缩机进行降频处理,并将降低后的运行频率,确定为所述当前运行频率,以及将所述最高档位确定为所述当前半导体元器件的启动运行状态中的当前运行档位;When the current absolute average temperature difference is less than the first set temperature value, if the obtained operating frequency of the air conditioner compressor is greater than or equal to the second set frequency, the air conditioner compressor is decelerated. frequency processing, and determine the reduced operating frequency as the current operating frequency, and determine the highest gear as the current operating gear in the start-up operation state of the current semiconductor components;
    在所述当前绝对平均温度差值小于第一设定温度值的情况下,若获取到的所述空调压缩机的运行频率小于第二设定频率时,将获取到的所述空调压缩机的运行频率,确定为所述当前运行频率,以及对所述当前半导体元器件进行降档处理,将降低后的运行档位确定为所述当前半导体元器件的启动运行状态中的当前运行档位。In the case where the current absolute average temperature difference is less than the first set temperature value, if the acquired operating frequency of the air conditioner compressor is less than the second set frequency, the acquired operating frequency of the air conditioner compressor will be The operating frequency is determined as the current operating frequency, and the current semiconductor component is downshifted, and the reduced operating gear is determined as the current operating gear in the start-up operation state of the current semiconductor component.
  7. 根据权利要求6所述的方法,其特征在于,在当前半导体元器件的前次运行档位不为最高档位的情况下,所述确定与所述当前绝对平均温度差值匹配的所述空调压缩机的当前运行频率,以及所述当前半导体元器件的当前运行状态包括:The method according to claim 6, characterized in that, in the case that the previous operating gear of the current semiconductor component is not the highest gear, said determining the air conditioner that matches the current absolute average temperature difference The current operating frequency of the compressor, and the current operating state of the current semiconductor components include:
    在所述当前绝对平均温度差值大于或等于第二设定温度值的情况下,将获取到的所述空调压缩机的运行频率,确定为所述当前运行频率,以及对所述当前半导体元器件进行升档处理,将升高后的运行档位确定为所述当前半导体元器件的启动运行状态中的当前运行档位;When the current absolute average temperature difference is greater than or equal to the second set temperature value, the obtained operating frequency of the air conditioner compressor is determined as the current operating frequency, and the current semiconductor element The device performs an upshift process, and determines the elevated operating gear as the current operating gear in the start-up operation state of the current semiconductor component;
    在所述当前绝对平均温度差值小于第二设定温度值,且大于或等于第一设定温度值的情况下,将获取到的所述空调压缩机的运行频率,确定为所述当前运行频率,以及,将所述前次运行档位确定为所述当前半导体元器件的启动运行状态中的当前运行档位;When the current absolute average temperature difference is less than the second set temperature value and greater than or equal to the first set temperature value, the obtained operating frequency of the air conditioner compressor is determined as the current operating frequency frequency, and determining the previous operating gear as the current operating gear in the start-up operating state of the current semiconductor component;
    在所述当前绝对平均温度差值小于第一设定温度值的情况下,根据开机调整策略,确定所述空调压缩机的当前运行频率,以及对所述当前半导体元器件进行降档处理,将降低后的运行档位确定为所述当前半导体元器件的启动运行状态中的当前运行档位。If the current absolute average temperature difference is less than the first set temperature value, according to the start-up adjustment strategy, determine the current operating frequency of the air conditioner compressor, and perform downshift processing on the current semiconductor components, and set The reduced operating gear is determined as the current operating gear in the start-up operating state of the current semiconductor component.
  8. 根据权利要求7所述的方法,其特征在于,所述对所述当前半导体元器件进行降档处理包括:The method according to claim 7, wherein the downshifting of the current semiconductor components comprises:
    在所述前次运行档位为最低档位的情况下,将关闭停机状态确定为所述当前半导体元器件的当前运行状态。In the case that the previous operating gear is the lowest gear, the shutdown state is determined as the current operating state of the semiconductor components.
  9. 一种用于空调控制的装置,所述空调包括两组半导体元器件,该装置包括处理器和存储有 程序指令的存储器,其特征在于,所述处理器被配置为在执行所述程序指令时,执行如权利要求1至8任一项所述用于空调控制的方法。A device for controlling an air conditioner, the air conditioner includes two groups of semiconductor components, the device includes a processor and a memory storing program instructions, wherein the processor is configured to , executing the method for air conditioning control according to any one of claims 1 to 8.
  10. 一种空调,其特征在于,包括:如权利要求9所述用于空调控制的装置。An air conditioner, characterized by comprising: the device for air conditioner control according to claim 9 .
  11. 一种存储介质,存储有程序指令,其特征在于,所述程序指令在运行时,执行如权利要求1至8任一项所述用于空调控制的方法。A storage medium storing program instructions, wherein the program instructions execute the air-conditioning control method according to any one of claims 1 to 8 when running.
PCT/CN2022/108004 2021-12-06 2022-07-26 Method and device for controlling air conditioner, and air conditioner and storage medium WO2023103400A1 (en)

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