WO2023279757A1

WO2023279757A1 - Heat dissipation apparatus and electronic device

Info

Publication number: WO2023279757A1
Application number: PCT/CN2022/080750
Authority: WO
Inventors: 段智伟; 徐青松; 刘帆
Original assignee: 中兴通讯股份有限公司
Priority date: 2021-07-07
Filing date: 2022-03-14
Publication date: 2023-01-12
Also published as: CN115597409A

Abstract

A heat dissipation apparatus and an electronic device, comprising an evaporator (100), a condenser (300), a steam pipeline (200), and a return pipeline (400). The steam pipeline (200) is communicated with the evaporator (100) and the condenser (300), and is configured to convey a gas working medium obtained by evaporation of the evaporator (100) to the condenser (300); the return pipeline (400) is communicated with the condenser (300) and the evaporator (100), and is configured to convey a liquid working medium obtained by condensation of the condenser (300) to the evaporator (100); a liquid seal structure (410) is provided at one end of the return pipeline (400) in communication with the evaporator (100), and is configured to fill the liquid working medium to prevent the gas working medium inside the evaporator (100) from entering the return pipeline (400) by means of the liquid seal structure (410).

Description

Heat sinks and electronics

Cross References to Related Applications

This application is based on a Chinese patent application with application number 202110768813.5 and a filing date of July 7, 2021, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.

technical field

The embodiments of the present application relate to but are not limited to the technical field of heat dissipation, and in particular, relate to a heat dissipation device and electronic equipment.

Background technique

For the existing thermosyphon, it is mainly divided into straight-tube thermosyphon and loop-type thermosyphon. Among them, for the straight-tube thermosyphon, at the bottom of the thermosyphon, the heat source heats the internal working medium through the tube shell. Inside, the working fluid boils and evaporates, and the working fluid steam rises to the top of the thermosiphon tube to condense and release heat, and the condensate will flow back along the inner wall of the tube to the bottom to be heated and evaporated again, and the heat is transferred from the heat source to the cold source through the phase change of the working fluid cycle , so as to achieve efficient heat transfer. However, during the working process of the straight-tube thermosiphon, since the gaseous working medium and the liquid working medium move in opposite directions, when the heat transfer power is greater, the moving speed of the gaseous working medium and the liquid working medium is faster, so that mutual resistance affects And the bigger it is, the ultimate limitation on the limit heat transfer power.

In this regard, a loop-type thermosiphon has been launched on the market, which can make the gaseous working medium and liquid working medium flow in two different pipelines, avoiding their mutual influence, thereby increasing the limit heat transfer power. However, the existing loop-type thermosiphon cannot achieve complete gas-liquid separation, and there will still be gas-liquid mixing under the condition of high heat flux density and large heat load.

Contents of the invention

The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the claims.

Embodiments of the present application provide a heat dissipation device and electronic equipment.

In the first aspect, the embodiment of the present application provides a heat dissipation device, including: an evaporator; a condenser; a steam pipeline, which communicates with the evaporator and the condenser, and the steam pipeline is configured to transfer the evaporator The gaseous working medium obtained by evaporating the condenser is transported to the condenser; the return pipeline is connected with the condenser and the evaporator, and the return pipeline is set to transport the liquid working medium condensed by the condenser to the In the evaporator, one end of the return line connected to the evaporator is provided with a liquid seal structure, and the liquid seal structure is configured to fill the liquid working medium to avoid the gaseous working medium inside the evaporator It enters into the return pipeline through the liquid seal structure.

In the second aspect, the embodiment of the present application also provides an electronic device, including a device to be dissipated and the heat dissipation device described in the first aspect above, wherein the evaporator in the heat dissipation device is configured to absorb the The heat of the device to be dissipated.

Additional features and advantages of the application will be set forth in the description which follows, and, in part, will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Description of drawings

The accompanying drawings are used to provide a further understanding of the technical solution of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical solution of the present application, and do not constitute a limitation to the technical solution of the present application.

FIG. 1 is a schematic structural diagram of a heat dissipation device in a horizontal arrangement scenario provided by an embodiment of the present application;

Fig. 2 is a cross-sectional view of a heat dissipation device in a horizontal arrangement scenario provided by an embodiment of the present application;

Fig. 3 is a working schematic diagram of a heat dissipation device in a horizontal arrangement scenario provided by an embodiment of the present application;

Fig. 4 is a cross-sectional view of a heat sink in a vertical arrangement scenario provided by an embodiment of the present application;

Fig. 5 is a working diagram of a heat dissipation device in a vertical arrangement scenario provided by an embodiment of the present application.

detailed description

In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.

It should be noted that although the functional modules are divided in the schematic diagram of the device, and the logical sequence is shown in the flowchart, in some cases, it can be executed in a different order than the module division in the device or the flowchart in the flowchart. steps shown or described. The terms "first", "second" and the like in the specification, claims or the above drawings are used to distinguish similar objects, and not necessarily used to describe a specific order or sequence.

In some cases, a thermosiphon is a type of heat pipe, which is similar in principle to ordinary heat pipes, and uses the vaporization and condensation cycles of the working fluid to transfer heat. The difference from ordinary heat pipes is that there is no liquid-absorbing wick in the tube, and the return of the liquefied substance from the condenser to the evaporator does not rely on the capillary force generated by the liquid-absorbed wick, but relies on the gravity of the liquefied substance itself.

For the existing thermosyphon, it is mainly divided into straight-tube thermosyphon and loop-type thermosyphon. Among them, for the straight-tube thermosyphon, at the bottom of the thermosyphon, the heat source heats the internal working medium through the tube shell. Inside, the working fluid boils and evaporates, and the working fluid steam rises to the top of the thermosiphon tube to condense and release heat, and the condensate will flow back along the inner wall of the tube to the bottom to be heated and evaporated again, and the heat is transferred from the heat source to the cold source through the phase change of the working fluid cycle , so as to achieve efficient heat transfer. However, during the working process of the straight-tube thermosiphon, since the gaseous working medium and the liquid working medium move in opposite directions, when the heat transfer power is greater, the moving speed of the gaseous working medium and the liquid working medium is faster, so that mutual resistance affects The larger the value is, the limit heat transfer power is finally limited, and the limit heat transfer power is the carrying limit.

As for the loop-type thermosiphon, the gaseous working medium and the liquid working medium can flow in two different pipelines, avoiding their mutual influence, thereby increasing the limit heat transfer power. For the existing loop thermosiphon, including but not limited to the following two cases: In the first case, a capillary structure is set in the evaporator, the steam pipe is not inserted into the capillary structure, and the return line is inserted into the capillary structure, when the evaporator When the working fluid is heated and evaporated, it will preferentially enter the steam pipe with less resistance, so as to realize the directional flow of the working fluid circulation. In the second case, the diameter of the steam pipeline is designed to be thicker, and the diameter of the return pipeline is designed to be thinner. When the working medium is heated and evaporated in the evaporator, the gas will preferentially flow into the thicker pipe and Steam pipeline with less resistance, so as to realize the directional flow of working medium circulation.

However, based on the above two conditions of the loop thermosiphon, the existing loop thermosiphon adopts the design of the non-uniform flow resistance pipeline in the gas-liquid separation, so that the high-pressure gas after the evaporation of the working fluid tends to Pipeline flow with low flow resistance, however, the existing loop thermosiphon cannot achieve complete gas-liquid separation, and there will still be gas-liquid mixing under the condition of high heat flux density and large heat load .

Based on the above situation, embodiments of the present application provide a heat dissipation device and electronic equipment. The heat dissipation device includes an evaporator, a condenser, a steam pipeline and a return pipeline, wherein the steam pipeline is connected to the evaporator and the condenser, and the steam The pipeline is set to transport the gaseous working medium evaporated by the evaporator to the condenser; the return line is connected to the condenser and the evaporator, and the return line is set to transport the liquid working medium condensed by the condenser to the evaporator, Wherein, one end of the return pipeline connected to the evaporator is provided with a liquid seal structure, and the liquid seal structure is set to be filled with a liquid working medium to prevent the gaseous working medium inside the evaporator from entering the return pipeline through the liquid seal structure. According to the technical solution of the embodiment of the present application, the heat dissipation device of the embodiment of the present application designs the return line at the inlet of the evaporator as a liquid-sealed structure, which prevents the gaseous working medium inside the evaporator from entering the return line through the liquid-sealed structure. The gaseous working medium evaporated by the evaporator can only flow away through the steam pipeline, so that the liquid working medium and the gaseous working medium are completely separated and flow in the return pipeline and the steam pipeline respectively. Therefore, the embodiment of the present application can make The efficient circulation of the working medium inside the cooling device improves the heat transfer performance of the cooling device.

The embodiments of the present application will be further described below in conjunction with the accompanying drawings.

As shown in Figure 1 and Figure 2, Figure 1 is a schematic structural diagram of a heat dissipation device in a horizontal arrangement scenario provided by an embodiment of the present application, and Figure 2 is a schematic diagram of a heat dissipation device in a horizontal arrangement scenario provided by an embodiment of the present application Sectional view.

Specifically, the heat dissipation device of the embodiment of the present application includes an evaporator 100, a condenser 300, a steam pipeline 200, and a return pipeline 400, wherein the steam pipeline 200 is connected to the evaporator 100 and the condenser 300, and the steam pipeline 200 is It is set to transport the gaseous working medium evaporated by the evaporator 100 to the condenser 300; the return line 400 is connected to the condenser 300 and the evaporator 100, and the return line 400 is set to transport the liquid working medium obtained by condensing the condenser 300 To the evaporator 100, wherein, one end of the return line 400 connected to the evaporator 100 is provided with a liquid seal structure 410, and the liquid seal structure 410 is set to be filled with liquid working fluid to prevent the gaseous working fluid inside the evaporator 100 from passing through the liquid seal structure 410 into the return line 400.

According to the technical solution of the embodiment of the present application, in the heat dissipation device of the embodiment of the present application, the return line 400 at the inlet of the evaporator 100 is designed as a liquid seal structure 410, which prevents the gaseous working medium inside the evaporator 100 from entering through the liquid seal structure 410 To the return pipeline 400, so that the gaseous working medium evaporated by the evaporator 100 can only flow away through the steam pipeline 200, so that the liquid working medium and the gaseous working medium are completely separated and are respectively in the return pipeline 400 and the steam pipeline 200 Therefore, the embodiments of the present application can efficiently circulate the working fluid inside the heat sink, improving the heat transfer performance of the heat sink.

It should be noted that the heat dissipation device in the embodiment of the present application is not limited to being a loop heat pipe or a loop thermosiphon. Specifically, the difference between the loop heat pipe and the loop thermosiphon is that the cavity and the return pipe 400 are sintered with capillary structures, and the circulation of the working fluid is mainly driven by capillary force.

In addition, it should be noted that the liquid seal structure 410 of the embodiment of the present application includes a first end 411, a second end 412 and a liquid storage chamber 413, the liquid storage chamber 413 communicates with the evaporator 100 through the first end 411, and the liquid storage chamber 413 communicates with the condenser 300 through the second end 412 , and the height of the liquid storage cavity 413 is lower than that of the first end 411 and the second end 412 .

It can be understood that, regarding the liquid seal structure 410 in the embodiment of the present application, its shape is not limited to being U-shaped, S-shaped or semi-rectangular.

It is worth noting that, with regard to the traditional loop-type thermosiphon, if the return line 400 is to be filled with liquid working fluid to avoid the entry of gaseous working medium, its filling rate needs to reach about 50%; and in most practical cases It is difficult to do this under the circumstances, so it will cause the mixing of gaseous and liquid working fluids, which will affect the heat dissipation performance of the loop thermosiphon. However, when the heat dissipation device of the embodiment of the present application is in normal operation, the liquid seal structure 410 at the inlet of the evaporator 100 is submerged by the condensed liquid working medium, and only a small amount of liquid working medium is needed to realize the liquid seal, avoiding the evaporation inside the evaporator 100 The gaseous working medium enters the return pipeline 400 .

In addition, it is worth noting that the position height of the end of the steam line 200 connected to the condenser 300 is higher than the position height of the end of the return line 400 connected with the condenser 300, that is, the steam inlet of the condenser 300 in the embodiment of the present application is at The upper position can prevent the condensed liquid working fluid from flowing back into the steam pipeline 200 .

It should be noted that the evaporator 100, the condenser 300, the steam pipeline 200 and the return pipeline 400 in the embodiment of the present application can all be metal parts, that is, they can all be made of metal materials and connected together by brazing . Wherein, the metal parts mentioned above may be, but not limited to, copper, aluminum, stainless steel or other products, that is, metal materials may be, but not limited to, copper, aluminum or stainless steel.

In addition, it should be noted that in the embodiment of the present application, a heat insulation layer can be set on the outer layer of the steam pipeline 200, or a heat insulation layer can be set on the outer layer of the return pipeline 400, or at the same time, the steam The outer layer of the pipeline 200 and the return pipeline 400 is sheathed with a heat insulating layer. In the embodiment of the present application, the heat insulation layer is provided to prevent the phase change of the working fluid in the steam pipeline 200 or the return pipeline 400 in advance, and to improve the circulation efficiency of the working fluid. Wherein, the material of the heat insulation layer mentioned above may be, but not limited to, plastic, foam or other materials with low thermal conductivity.

It should be noted that the inside of the cooling device of the embodiment of the present application is evacuated and filled with working fluid, wherein the filled working fluid can be, but not limited to, water, ammonia, refrigerant, etc., depending on the working temperature and component materials.

In addition, it is worth noting that when the evaporator 100 is provided with a capillary structure, the capillary structure can provide capillary force to suck the working fluid to the heat source area, which can not only improve the performance of the heat sink, but also appropriately reduce the charging of the working fluid. Injection. Wherein, the capillary structure mentioned above may be but not limited to be a metal product, that is, the material of the capillary structure may be but not limited to be a metal material. Specifically, the capillary structure may be, but not limited to, a porous capillary structure formed by processing metal materials such as copper or aluminum through powder sintering, fiber sintering or foaming processes.

Or, when there is no capillary structure inside the evaporator 100, under normal working conditions, it is required that the working fluid must not pass through the heat source area to ensure that the evaporator 100 can absorb the heat from the heat source so that the heat sink can work normally.

Based on Fig. 1 and Fig. 2, the working schematic diagram of the heat dissipation device in the horizontal arrangement scenario of the embodiment of the present application can be shown in Fig. 3, and the specific working process is as follows:

The evaporator 100 is in contact with the heat source to absorb the heat of the heat source, so that the liquid working medium in the inner cavity of the evaporator 100 is heated and evaporated. Since the connection between the return line 400 and the evaporator 100 is a liquid-sealed structure 410, the excess liquid working medium It will accumulate at the liquid seal structure 410 to form a liquid seal, so that the gaseous working medium obtained by evaporation in the inner cavity of the evaporator 100 can only flow through the steam pipeline 200; then, the gaseous working medium will flow from the condenser 300 after passing through the steam pipeline The inlet at the upper position enters the condenser 300, and since the condenser 300 is usually in contact with the cold source, the condenser 300 will transfer heat to the cold source so that the gaseous working medium is condensed into a liquid working medium; then, the condenser 300 The condensed liquid working fluid will flow back through the return line 400 and accumulate in the liquid seal structure 410 , and at the same time, due to gravity, the liquid working fluid will enter the interior of the evaporator 100 , so that the working fluid forms a directional circulation.

According to the above working process, it can be seen that in the embodiment of the present application, a liquid seal structure 410 is added to the return line 400 , and the connection between the condenser 300 and the steam line 200 is designed at the upper position of the condenser 300 . Specifically, the liquid seal structure 410 at the connection between the evaporator 100 and the return pipeline 400 can force the gaseous working medium to flow from the steam pipeline 200, and at the same time, the connection between the condenser 300 and the steam pipeline 200 is located above the condenser 300. Prevent the condensed liquid working fluid from flowing back from the steam pipeline 200 . Therefore, the embodiments of the present application can force the working fluid to undergo directional circulation through the above two structural designs, avoid gas-liquid mixing, and thereby improve the heat transfer efficiency of the heat sink.

It can be understood that the above-mentioned heat source in contact with the evaporator 100 can be but not limited to a chip; in addition, the above-mentioned cold source in contact with the condenser 300 can be but not limited to a water-cooled plate , Air-cooled fins, semiconductor refrigerators.

In addition, in addition to the horizontal layout scenarios shown in Figures 1 to 3, that is, the height of the position of the evaporator 100 is consistent with the height of the position of the condenser 300, the layout of the heat sink in the embodiment of the present application can also be arranged as shown in Figures 4 to 3 In the vertical arrangement scenario shown in FIG. 5 , the position height of the evaporator 100 is lower than that of the condenser 300 . Among them, FIG. 4 is a cross-sectional view of a heat dissipation device in a vertical arrangement scenario provided by an embodiment of the present application; FIG. 5 is a working schematic diagram of a heat dissipation device in a vertical arrangement scenario provided by an embodiment of the present application.

It is worth noting that, for the specific implementation and technical effects of the heat sink in the vertical arrangement scenario provided by the embodiments of the present application, reference may be made to the above-mentioned specific implementation and technical effects of the heat sink in the horizontal arrangement scenario.

In addition, based on the above-mentioned heat dissipation devices shown in Figures 1 to 5, the embodiment of the present application also provides an electronic device. Specifically, the electronic device in the embodiment of the present application includes but is not limited to the device to be dissipated and any of the above-mentioned embodiments In the heat dissipation device, the evaporator 100 in the heat dissipation device is set to absorb the heat of the device to be dissipated.

It can be understood that, in order to improve the heat absorption efficiency of the evaporator 100, in the embodiment of the present application, the evaporator 100 may be directly in contact with the device to be dissipated.

In addition, it can be understood that the above-mentioned device to be dissipated is the heat source mentioned above. Wherein, the device to be dissipated in the embodiment of the present application may be, but not limited to, a chip.

In addition, the electronic device in the embodiment of the present application also includes but is not limited to a cold source, and the condenser 300 in the heat dissipation device is configured to transfer heat to the cold source.

It can be understood that, in order to improve the heat dissipation efficiency of the condenser 300, the embodiment of the present application may directly contact the condenser 300 with the cooling source.

In addition, it can be understood that the above-mentioned cooling source may be, but not limited to, a water-cooled plate, an air-cooled fin, or a semiconductor refrigerator.

In addition, it can be understood that the electronic device in this embodiment of the present application may be, but not limited to, a product device such as a router or a server.

The embodiment of the present application includes: the heat dissipation device of the embodiment of the present application includes an evaporator, a condenser, a steam pipeline and a return pipeline, wherein the steam pipeline is connected to the evaporator and the condenser, and the steam pipeline is set In order to transport the gaseous working medium obtained by evaporating the evaporator to the condenser; the return line is connected to the condenser and the evaporator, and the return line is set as the liquid working medium obtained by condensing the condenser The substance is transported to the evaporator, wherein, one end of the return pipeline connected to the evaporator is provided with a liquid seal structure, and the liquid seal structure is set to be filled with liquid working fluid to avoid the evaporator inside the evaporator. The gaseous working medium enters the return pipeline through the liquid seal structure. According to the technical solution of the embodiment of the present application, the heat dissipation device of the embodiment of the present application designs the return line at the inlet of the evaporator as a liquid-sealed structure, which prevents the gaseous working medium inside the evaporator from entering the return line through the liquid-sealed structure. The gaseous working medium evaporated by the evaporator can only flow away through the steam pipeline, so that the liquid working medium and the gaseous working medium are completely separated and flow in the return pipeline and the steam pipeline respectively. Therefore, the embodiment of the present application can make The efficient circulation of the working medium inside the cooling device improves the heat transfer performance of the cooling device.

The above is a specific description of several implementations of the present application, but the application is not limited to the above-mentioned implementations, and those skilled in the art can also make various equivalent deformations or replacements without violating the spirit of the application. These equivalent modifications or replacements are all within the scope defined by the claims of the present application.

Claims

A cooling device, comprising:

Evaporator;

condenser;

a steam pipeline, which communicates with the evaporator and the condenser, and the steam pipeline is configured to transport the gaseous working medium evaporated by the evaporator to the condenser;

A return pipeline, which communicates with the condenser and the evaporator, the return pipeline is configured to transport the liquid working substance condensed by the condenser to the evaporator, and the return pipeline communicates with the evaporator One end of the evaporator is provided with a liquid seal structure, and the liquid seal structure is configured to be filled with the liquid working medium to prevent the gaseous working medium inside the evaporator from entering the return pipeline through the liquid seal structure.
The heat dissipation device according to claim 1, wherein the liquid seal structure comprises a first end, a second end and a liquid storage cavity, the liquid storage cavity communicates with the evaporator through the first end, the The liquid storage chamber communicates with the condenser through the second end, and the height of the liquid storage chamber is lower than that of the first end and the second end.
The heat dissipation device according to claim 2, wherein the liquid seal structure is arranged in a U-shape or an S-shape.
The heat dissipation device according to claim 1, wherein the evaporator, the condenser, the steam pipeline and the return pipeline are all made of metal.
The heat dissipation device according to claim 4, wherein the metal parts are copper parts, aluminum parts or stainless steel parts.
The heat dissipation device according to claim 1, further comprising a heat insulating layer, and the heat insulating layer is sleeved on the steam pipeline and/or the return pipeline.
The heat dissipation device according to claim 6, wherein the material of the heat insulation layer is plastic or foam.
The heat dissipation device according to claim 1, further comprising a capillary structure disposed inside the evaporator.
The heat dissipation device according to claim 8, wherein the capillary structure is a metal member.
The heat dissipation device according to any one of claims 1 to 9, wherein the height of the evaporator is the same as that of the condenser, or the height of the evaporator is lower than that of the condenser position height.
The heat dissipation device according to any one of claims 1 to 9, wherein the height of the end of the steam pipeline connected to the condenser is higher than the height of the end of the return pipeline connected with the condenser .
An electronic device comprising a device to be dissipated and the heat dissipation device according to any one of claims 1 to 11, wherein the evaporator in the heat dissipation device is configured to absorb the heat of the device to be dissipated.
The electronic device according to claim 12, wherein the device to be dissipated includes a chip.
The electronic device according to claim 12, further comprising a heat sink, and the condenser in the heat dissipation device is configured to transfer heat to the heat sink.
The electronic device according to claim 14, wherein the cooling source comprises at least one of the following: a water-cooled plate, or an air-cooled fin, or a semiconductor refrigerator.