WO2023279498A1 - 一种工控机cpu散热装置及使用方法 - Google Patents

一种工控机cpu散热装置及使用方法 Download PDF

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Publication number
WO2023279498A1
WO2023279498A1 PCT/CN2021/114541 CN2021114541W WO2023279498A1 WO 2023279498 A1 WO2023279498 A1 WO 2023279498A1 CN 2021114541 W CN2021114541 W CN 2021114541W WO 2023279498 A1 WO2023279498 A1 WO 2023279498A1
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WIPO (PCT)
Prior art keywords
industrial computer
storage tank
liquid storage
cooling fan
cpu
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PCT/CN2021/114541
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English (en)
French (fr)
Inventor
黄永正
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研华科技(中国)有限公司
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Priority to CA3142411A priority Critical patent/CA3142411C/en
Publication of WO2023279498A1 publication Critical patent/WO2023279498A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present disclosure relates to the technical field of heat dissipation devices, in particular to a CPU heat dissipation device of an industrial computer and a method of use thereof.
  • the central processing unit is one of the main equipment of electronic computers and the core accessories in computers. Its function is mainly to interpret computer instructions and process data in computer software.
  • the CPU is the core component in a computer responsible for reading instructions, decoding them, and executing them.
  • the CPU of the industrial computer will generate a lot of heat when it is working. If the heat is not dissipated in time, it will lead to a crash, or it may burn the CPU.
  • the cooling fan of the industrial computer is mostly installed inside the industrial computer. Then remove the cooling fan, causing the problem of inconvenient cleaning of the cooling fan, which seriously affects the heat dissipation efficiency of the cooling fan to the CPU.
  • an industrial computer CPU cooling device and its usage method are used to solve the problem that most of the cooling fans of the current industrial computer are installed inside the industrial computer.
  • cleaning the cooling fan it is necessary to use a special tool to remove the industrial computer shell, and then Remove the cooling fan again, causing the problem of inconvenient cleaning of the cooling fan, and seriously affecting the technical problem of the heat dissipation efficiency of the cooling fan to the CPU.
  • the present disclosure discloses a CPU cooling device for an industrial computer and a method for using it.
  • the first aspect of the present disclosure provides a CPU cooling device for an industrial computer, including: a body of the industrial computer, a heat conduction plate is arranged inside the body of the industrial computer, and a heat conduction column is arranged on the lower surface of the heat conduction plate, and the heat conduction column is far away from the One end of the heat conduction plate is fixedly connected to the bottom inner wall of the industrial computer body, the CPU body is installed on the upper surface of the heat conduction plate, and a first through hole is opened on the upper surface of the industrial computer body, and the first through hole is facing the CPU body.
  • a cooling fan is provided in the first through hole, and a clamping plate is provided at the upper end of the cooling fan, and the lower surfaces of both ends of the clamping plate are attached to the upper surface of the industrial computer body, and the upper surface of the industrial computer body is also provided with a clamping plate.
  • the engaging device is used to fix the card board, and the heat dissipation holes are arranged in the card board.
  • the engaging device includes:
  • a first groove, the first groove is arranged on the upper surface of the industrial computer body, and the first groove is located on the left side of the cooling fan;
  • the slider is slidably arranged in the first groove, one end of the slider extends upward to the outside of the first groove and a first baffle is provided, and the first baffle is perpendicular to the a slider, the lower surface of the first baffle is attached to the upper surface of the card plate;
  • the first spring the first spring is arranged in the first groove, one end of the first spring is fixedly connected with the side wall of the slider, and the other end of the first spring is connected with the inner side of the first groove Wall fixed connection;
  • a slide plate the slide plate is arranged on the left side wall of the slider, the lower surface of the slide plate is attached to the upper surface of the industrial computer body, and slides left and right along the upper surface of the industrial computer body.
  • cooling fins are provided on the right outer wall of the industrial computer body.
  • a cooling channel is arranged inside the heat conducting plate, and the cooling channel is arranged in an S shape, a first water pipe is arranged at an inlet end of the cooling channel, and a second water pipe is arranged at an outlet end of the cooling channel.
  • the CPU cooling device of the industrial computer also includes:
  • the first liquid storage tank the first liquid storage tank is arranged inside the body of the industrial computer, the first liquid storage tank is located on the left side of the heat conduction column, and the cooling liquid and the water pump are arranged in the first liquid storage tank , the outlet end of the water pump is provided with a third water pipe, the third water pipe runs through the right side wall of the first liquid storage tank and is connected to the first water pipe through a pipe connector;
  • the fourth water pipe, the fourth water pipe is located between the cooling fan and the heat conduction plate, the fourth water pipe is set in an S shape, the inlet end of the fourth water pipe is connected to the outlet end of the second water pipe, and the The outlet end of the fourth water pipe passes through the upper surface of the first liquid storage tank and communicates with the interior of the first liquid storage tank.
  • a second liquid storage tank is provided on the left outer wall of the main body of the industrial computer, and cooling liquid is stored in the second liquid storage tank, and a liquid filling port is provided at the upper end of the second liquid storage tank.
  • An observation window is arranged on the front side wall of the liquid storage tank.
  • the CPU cooling device of the industrial computer also includes an automatic water adding device, and the automatic water adding device includes:
  • a connecting pipe the connecting pipe is arranged near the lower side of the second liquid storage tank, one end of the connecting pipe communicates with the inside of the second liquid storage tank, and the other end of the connecting pipe extends to the body of the industrial computer inside and communicating with the inside of the first liquid storage tank;
  • the suspended ball floats on the liquid surface of the cooling liquid in the first liquid storage tank, the upper end of the suspended ball is provided with a first sliding rod, and one end of the first sliding rod is fixed to the upper surface of the suspended ball connected, the other end of the first sliding rod passes through the outer wall of the upper end of the first liquid storage tank and extends to the outside of the first liquid storage tank, and the first sliding rod slides with the upper side wall of the first liquid storage tank connect;
  • the second spring the second spring is sleeved on the first sliding rod, one end of the second spring is fixedly connected to the upper surface of the suspension ball, and the other end of the second spring is connected to the first liquid storage
  • the inner wall on the upper side of the box is fixedly connected, and the elastic force of the second spring is smaller than the buoyancy force on the floating ball;
  • a second sliding rod one end of the second sliding rod is arranged in the second liquid storage tank, and the other end of the second sliding rod passes through the upper side wall of the second liquid storage tank and extends to the second storage tank. Outside the liquid tank, the second sliding rod is slidingly connected to the upper side wall of the second liquid storage tank;
  • a sliding sleeve the sliding sleeve is arranged on the side of the second sliding rod facing the connecting pipe, a third spring is arranged in the sliding sleeve, one end of the third spring is fixedly connected with the inner wall of the sliding sleeve, the The other end of the third spring is provided with a sliding column, and the sliding column is slidably connected with the inner wall of the sliding sleeve.
  • a blocking block is arranged at one end of the sliding column away from the third spring. The blocking block is set to a spherical shape, and the diameter of the blocking block is greater than the diameter of the connecting pipe;
  • the second baffle, the second baffle is arranged on the upper end of the second sliding rod, the second baffle is located on the side of the second sliding rod facing the body of the industrial computer, and the second baffle is away from One end of the second sliding rod can slide up and down along the left side wall of the industrial computer body;
  • the third baffle, the third baffle is arranged under the second baffle, one end of the third baffle is fixedly connected to the side wall of the second sliding rod, and the third baffle is far away from the first baffle.
  • One end of the sliding rod can slide up and down along the left side wall of the industrial computer body;
  • a second through hole, the second through hole is arranged on the left side wall of the industrial computer body, the second through hole is located above the second liquid storage tank, a rotating shaft is arranged in the second through hole, the The front and rear ends of the rotating shaft are rotatably connected with the inner walls of the front and rear sides of the second through hole respectively.
  • a rotating plate is arranged on the rotating shaft. One end of the rotating plate extends to the outside of the industrial computer body and a roller is arranged.
  • a blind hole is arranged at the other end of the rotating plate, and a fourth spring is arranged in the blind hole, and one end of the fourth spring is fixedly connected with the inner wall of the blind hole, so that The other end of the fourth spring is provided with a connecting rod, the connecting rod is slidably connected to the inner wall of the blind hole, and the end of the connecting rod far away from the fourth spring is hingedly connected to the end of the first sliding rod far away from the suspension ball.
  • the actual air volume of the cooling fan should be greater than the target air volume, and the target air volume of the cooling fan should satisfy the following formula:
  • Q 1 is the target air volume of the cooling fan
  • P 1 is the rated power of the CPU body
  • t 1 is the working hours of the CPU body
  • C 1 is the specific heat capacity of the air blown by the cooling fan
  • ⁇ 1 is the standard state air density
  • t2 is the working time of the cooling fan
  • T2 is the maximum temperature allowed to work by the CPU body
  • T1 is the preset maximum temperature outside the industrial computer body.
  • the second aspect of the present disclosure provides a method for using a CPU cooling device for an industrial computer, which is used to use the above-mentioned CPU cooling device for an industrial computer, and the method includes the following steps:
  • Step 1 start the cooling fan, and the cooling fan transports the cooling air outside the industrial computer body to the upper surface of the CPU body, thereby cooling the CPU body, and at the same time, conducts the heat of the CPU body through the heat conduction plate, And transfer the heat to the shell of the industrial computer body through the heat conduction column, and further dissipate the heat of the CPU body;
  • Step 2 After the cooling fan has been working for a preset time, open the engaging device, and then grasp the clamping plate to move upwards, and the clamping plate drives the cooling fan to slide out from the first through hole. At this time, take out the cooling fan and clean it Dust on the cooling fan surface;
  • Step 3 After the dust is cleaned, open the locking device again, put the cooling fan into the body of the industrial computer along the first through hole, until the lower surface of the card plate fits with the upper surface of the body of the industrial computer, and then release the locking device , the clamping device clamps the card board on the upper surface of the industrial computer body, the cooling fan is installed, and the cooling fan is turned on again to dissipate heat from the CPU body, and then repeat steps 2 and 3.
  • a CPU cooling device for an industrial computer and a method for using it include a body of the industrial computer, a heat conduction plate is arranged inside the body of the industrial computer, and a heat conduction column is arranged on the lower surface of the heat conduction plate, and the heat conduction column is far away from the One end of the heat conduction plate is fixedly connected to the bottom inner wall of the industrial computer body, the CPU body is installed on the upper surface of the heat conduction plate, and a first through hole is opened on the upper surface of the industrial computer body, and the first through hole is facing the CPU body.
  • a cooling fan is provided in the first through hole, and a clamping plate is provided at the upper end of the cooling fan, and the lower surfaces of both ends of the clamping plate are attached to the upper surface of the industrial computer body, and the upper surface of the industrial computer body is also provided with a clamping plate.
  • the engaging device is used to fix the card board, and the heat dissipation holes are arranged in the card board.
  • the cooling fan is installed outside the main body of the industrial computer through an engaging device, which is convenient for quick disassembly and assembly of the cooling fan, and improves work efficiency. After cleaning the cooling fan, it helps to improve the heat dissipation efficiency of the cooling fan.
  • FIG. 1 is a schematic diagram of the internal structure of a CPU cooling device for an industrial computer according to one or more embodiments of the present disclosure
  • FIG. 2 is a schematic diagram of the external structure of a CPU cooling device for an industrial computer according to one or more embodiments of the present disclosure
  • FIG. 3 is a schematic diagram of the internal structure of the heat conduction module in one or more embodiments of the present disclosure
  • Fig. 4 is a top view of a fourth water pipe in one or more embodiments of the present disclosure.
  • FIG. 5 is an enlarged view of A in FIG. 1 of the present disclosure
  • FIG. 6 is an enlarged view of B in FIG. 1 of the present disclosure.
  • FIG. 7 is an enlarged view at C in FIG. 1 of the present disclosure.
  • FIG. 8 is an enlarged view at D in FIG. 1 of the present disclosure.
  • a CPU cooling device for an industrial computer as shown in FIG.
  • a heat conduction column 3 is provided, and one end of the heat conduction column 3 away from the heat conduction plate 2 is fixedly connected to the bottom inner wall of the industrial computer body 1, and a CPU body 4 is installed on the upper surface of the heat conduction plate 2, and the industrial computer
  • the upper surface of the main body 1 is provided with a first through hole, the first through hole is facing the CPU body 4, a cooling fan 5 is arranged in the first through hole, and a clamping plate is arranged at the upper end of the cooling fan 5 6.
  • the lower surfaces of both ends of the clamping plate 6 are attached to the upper surface of the industrial computer body 1, and the upper surface of the industrial computer body 1 is also provided with an engaging device, and the engaging device is used to fix the
  • the card board 6 is provided with cooling holes in the card board 6 .
  • a heat conduction plate 2 is arranged inside the industrial computer body 1, a heat conduction column 3 is arranged on the lower surface of the heat conduction plate 2, and there are multiple heat conduction columns 3.
  • a plurality of heat conduction columns 3 can act as To support the function of the heat conduction plate 2, on the other hand, the heat of the heat conduction plate 2 can also be exported to the bottom wall of the industrial computer body 1.
  • the CPU body 4 is installed on the heat conduction plate 2. When the industrial computer body 1 is working, the CPU body 4 A part of the heat generated is exported through the heat conduction plate 2, which enhances the heat dissipation effect.
  • a cooling fan 5 is arranged above the CPU body 4.
  • the cooling fan 5 is stuck in the first through hole through the clamp plate 6.
  • the upper end of the cooling fan 5 is connected to the clamp plate. 6.
  • the lower end is fixedly connected, and the cross-sectional area of the clamping plate 6 is larger than that of the first through hole.
  • the cooling fan 5 can be driven to slide up and down in the first through hole, thereby facilitating the cooling fan 5 from the industrial control Take it out of the machine body 1.
  • the clamping plate 6 can be clamped and fixed by the clamping device to prevent the cooling fan 5 from shaking violently when it is working.
  • the cooling fan 5 can be quickly disassembled and assembled without the need for special tools.
  • the labor intensity of the staff is reduced, and at the same time, the staff regularly cleans the cooling fan 5 according to the scheduled working hours, avoiding more dust attached to the surface of the cooling fan 5, and improving the overall heat dissipation effect of the device.
  • the engaging device may include:
  • the first groove 7, the first groove 7 is arranged on the upper surface of the industrial computer body 1, and the first groove 7 is located on the left side of the cooling fan 5;
  • the first spring 10, the first spring 10 is arranged in the first groove 7, one end of the first spring 10 is fixedly connected to the side wall of the slider 8, and the other end of the first spring 10 is connected to the side wall of the slider 8.
  • the inner wall of the first groove 7 is fixedly connected;
  • the sliding plate 11 is arranged on the left side wall of the slider 8, the lower surface of the sliding plate 11 is attached to the upper surface of the industrial computer body 1, and slides left and right along the upper surface of the industrial computer body 1.
  • the working principle and beneficial effects of the above technical solution are: when the cooling fan 5 needs to be removed and cleaned, push the first baffle 9 with one hand, the first baffle 9 can drive the slider 8 to slide in the first groove 7, and the second A spring 10 is compressed, and the slide plate 11 can slide from right to left on the upper surface of the industrial computer body 1 until the first baffle plate 9 is separated from the upper surface of the clamp plate 6. At this time, grasp the clamp plate 6 with one hand to turn the cooling fan 5 Take it out from the inside of the industrial computer body 1. After cleaning, push the first baffle 9 again. After installing the cooling fan 5 in place, release the first baffle 9. The first baffle 9 can Slide to the upper surface of the clamping plate 6 again, and clamp the clamping plate 6, so that the cooling fan 5 is fixed. When the slider 8 slides, the sliding plate 11 can slide with the slider 8, which can block the dust for the first groove 7 The effect of avoiding dust entering into the first groove 7 to cause the jamming problem of the sliding block 8 to slide.
  • cooling fins 12 are provided on the outer wall of the right side of the industrial computer body 1 .
  • a number of heat dissipation fins 12 are provided on the right outer wall of the industrial computer body 1 to increase the heat dissipation area, thereby enhancing the heat dissipation effect of the CPU body 4 .
  • a cooling channel 13 can be provided inside the heat conducting plate 2, and the cooling channel 13 can be arranged in an S shape, and the inlet end of the cooling channel 13 A first water pipe 14 is provided, and a second water pipe 15 is provided at the outlet end of the cooling channel 13 .
  • the industrial computer CPU cooling device may also include:
  • the first liquid storage tank 16 the first liquid storage tank 16 is arranged inside the industrial computer body 1, the first liquid storage tank 16 is located on the left side of the heat conduction column 3, the first liquid storage tank 16 A coolant and a water pump 17 are arranged inside, and a third water pipe 18 is arranged at the outlet end of the water pump 17, and the third water pipe 18 runs through the right side wall of the first liquid storage tank 16 and connects with the first water pipe 14 through a pipe connector connect;
  • the fourth water pipe 19, the fourth water pipe 19 is located between the cooling fan 5 and the heat conduction plate 2, the fourth water pipe 19 is arranged in an S shape, the inlet end of the fourth water pipe 19 is connected to the second The outlet ends of the water pipes 15 are connected, and the outlet ends of the fourth water pipe 19 pass through the upper surface of the first liquid storage tank 16 and communicate with the interior of the first liquid storage tank 16 .
  • a first liquid storage tank 16 is provided inside the industrial computer body 1 , a coolant is stored in the first liquid storage tank 16 , and a water pump 17 is provided in the first liquid storage tank 16 , start the water pump 17, and the water pump 17 drives the cooling liquid to flow into the first water pipe 14 from the third water pipe 18, then flow through the cooling passage 13, flow into the fourth water pipe 19 through the second water pipe 15, and finally flow into the fourth water pipe 19 from the fourth water pipe 19.
  • a circulating flow of cooling liquid is formed.
  • the fourth water pipe 19 and the cooling channel 13 are both arranged in an S shape, which increases the circulation volume of cooling water.
  • Passage 13 utilizes cooling water to flow in cooling passage 13 then, can take away the heat that heat conduction plate 2 derives from CPU body 4, has improved heat radiation efficiency further, and, the 4th water pipe 19 is arranged on cooling fan 5 and CPU body 4 Between, the air brought in by the cooling fan 5 can be cooled by the fourth water pipe 19 when it flows through the fourth water pipe 19, thereby reducing the temperature of the air blown to the CPU body 4, which is conducive to the rapid cooling and heat dissipation of the CPU body 4, and ensures the cooling of the CPU body 4.
  • the working efficiency of the main body 4 prolongs the service life of the CPU main body 4 .
  • the upper end of the second liquid storage tank 20 is provided with a liquid filling port, and the front side wall of the second liquid storage tank 20 is provided with an observation window 21 .
  • the CPU cooling device of the industrial computer can also include an automatic water adding device, and the automatic water adding device includes:
  • a connecting pipe 22, the connecting pipe 22 is arranged near the lower side of the second liquid storage tank 20, one end of the connecting pipe 22 communicates with the inside of the second liquid storage tank 20, and the other end of the connecting pipe 22 extends To the interior of the industrial computer body 1 and communicate with the interior of the first liquid storage tank 16;
  • the suspended ball 23 floats on the coolant liquid surface in the first liquid storage tank 16, the upper end of the suspended ball 23 is provided with a first sliding rod 24, and one end of the first sliding rod 24 is connected to the The upper surface of the suspension ball 23 is fixedly connected, the other end of the first sliding rod 24 passes through the outer wall of the upper end of the first liquid storage tank 16 and extends to the outside of the first liquid storage tank 16, the first sliding rod 24 and The upper side wall of the first liquid storage tank 16 is slidably connected;
  • the second spring 25, the second spring 25 is sleeved on the first sliding rod 24, one end of the second spring 25 is fixedly connected with the upper surface of the suspension ball 23, and the other end of the second spring 25 is connected with the upper surface of the suspension ball 23.
  • the inner wall on the upper side of the first liquid storage tank 16 is fixedly connected, and the elastic force of the second spring 25 is smaller than the buoyancy force received by the floating ball 23;
  • the second sliding rod 26, one end of the second sliding rod 26 is arranged in the second liquid storage tank 20, and the other end of the second sliding rod 26 passes through the upper side wall of the second liquid storage tank 20 and extends to Outside the second liquid storage tank 20, the second sliding rod 26 is slidingly connected to the upper side wall of the second liquid storage tank 20;
  • the inner wall of the sleeve 27 is fixedly connected, the other end of the third spring 28 is provided with a sliding post 29, the sliding post 29 is slidingly connected with the inner wall of the sliding sleeve 27, and the end of the sliding post 29 away from the third spring 28 is provided with a blocking block 30, the blocking block 30 is set in a spherical shape, and the diameter of the blocking block 30 is larger than the diameter of the connecting pipe 22;
  • the second baffle 31, the second baffle 31 is arranged on the upper end of the second sliding rod 26, the second baffle 31 is located on the side of the second sliding rod 26 facing the body 1 of the industrial computer, so The end of the second baffle plate 31 away from the second sliding rod 26 can slide up and down along the left side wall of the industrial computer body 1;
  • the third baffle 32, the third baffle 32 is arranged below the second baffle 31, one end of the third baffle 32 is fixedly connected to the side wall of the second sliding rod 26, the third baffle The end of the plate 32 away from the second sliding rod 26 can slide up and down along the left side wall of the industrial computer body 1;
  • the second through hole 33, the second through hole 33 is arranged on the left side wall of the industrial computer body 1, the second through hole 33 is located above the second liquid storage tank 20, the second through hole 33
  • a rotating shaft 34 is arranged inside, and the front and rear ends of the rotating shaft 34 are respectively connected to the inner walls of the front and rear sides of the second through hole 33.
  • a rotating plate 35 is arranged on the rotating shaft 34, and one end of the rotating plate 35 extends to the industrial computer.
  • a roller 36 is arranged outside the body 1, and the roller 36 is located between the second baffle 31 and the third baffle 32.
  • the other end of the rotating plate 35 is provided with a blind hole 37, and the blind hole 37 is provided with a A fourth spring 38, one end of the fourth spring 38 is fixedly connected to the inner wall of the blind hole 37, the other end of the fourth spring 38 is provided with a connecting rod 39, and the connecting rod 39 is slidably connected to the inner wall of the blind hole 37, The end of the connecting rod 39 away from the fourth spring 38 is hingedly connected to the end of the first sliding rod 24 away from the suspension ball 23 .
  • a second liquid storage tank 20 is arranged outside the industrial computer body 1, and the cooling liquid capacity in the second liquid storage tank 20 is greater than that in the first liquid storage tank 16, During the cooling liquid circulation process, the cooling liquid in the first liquid storage tank 16 will be gradually lost and reduced, and the liquid level of the cooling liquid in the first liquid storage tank 16 will gradually decrease, and the suspension ball 23 will drive the first sliding rod 24 to slide downward,
  • the first sliding rod 24 drives the connecting rod 39 to move downward
  • the fourth spring 38 stretches
  • the connecting rod 39 drives the rotating plate 35 to rotate clockwise
  • one end of the rotating plate 35 with a roller 36 gradually contacts the second baffle plate 31, and Drive the second baffle plate 31 to move upward
  • the second baffle plate 31 drives the second sliding rod 26 to slide upward
  • the second sliding rod 26 drives the sliding sleeve 27 to move upward
  • the sliding sleeve 27 drives the blocking block 30 to move upward.
  • the spherical The blocking block 30 will slide out from the left end of the connecting pipe 22 to stop blocking the connecting pipe 22.
  • the coolant in the second liquid storage tank 20 will flow into the first liquid storage tank 16 through the connecting pipe 22.
  • the suspension ball 23 moves upward under the action of buoyancy, and drives the first sliding rod 24 to move upward, and the first sliding rod 24 drives the rotating plate 35 to rotate counterclockwise through the connecting rod 39 , the roller 36 at the other end of the rotating plate 35 gradually approaches the third baffle 32, when the roller 36 contacts the third baffle 32, the roller 36 drives the third baffle 32 to move downward, and the third baffle 32 drives the second sliding
  • the rod 26 moves downward, the second sliding rod 26 drives the sliding sleeve 27 downward, and the sliding sleeve 27 drives the blocking block 30 to slide downward through the sliding column 29 until the blocking block 30 slides to the left end of the connecting pipe 22.
  • the blocking block 30 is tightly blocked at the left end of the connecting pipe 22, preventing the coolant in the second liquid storage tank 20 from flowing into the first liquid storage tank 16, and the second liquid storage tank can be confirmed through the provided observation window 21
  • the liquid level of the cooling liquid in 20, thereby fills cooling liquid in the second liquid storage tank 20 in time through liquid filling port, by setting automatic water adding device, can realize the automatic addition of cooling liquid in the first liquid storage tank 16, without Need to rely on other electrical appliances, will not generate excess heat for the interior of the industrial computer body 1, and the second liquid storage tank 20 is arranged outside the industrial computer body 1, on the one hand, it is convenient to observe the remaining coolant in the second liquid storage tank 20,
  • the cooling liquid is added in time, and on the other hand, it is convenient to add the cooling liquid into the second liquid storage tank 20 without dismantling the industrial computer body 1, which reduces the labor intensity of the staff and improves the convenience of cooling liquid filling. This ensures that the liquid level of the cooling liquid in the first liquid storage tank 16 is always maintained at a liquid level
  • the actual air volume of the cooling fan 5 should be greater than the target air volume, and the target air volume of the cooling fan 5 should satisfy the following formula :
  • Q 1 is the target air volume of the cooling fan 5
  • P 1 is the rated power of the CPU body 4
  • t 1 is the working hours of the CPU body 4
  • C 1 is the air blown by the cooling fan 5 specific heat capacity
  • ⁇ 1 is the standard state air density
  • t2 is the working time of the cooling fan 5
  • T2 is the maximum temperature allowed to work by the CPU body 4
  • T1 is the preset value outside the industrial computer body 1 maximum temperature.
  • the CPU body 4 will generate a large amount of heat when it is working, which will cause the temperature of the CPU body 4 to be high, and if the temperature of the CPU body 4 is too high, the working efficiency and service life of the CPU body 4 will be reduced.
  • the actual air volume of the cooling fan 5 should be greater than the target air volume, and the cooling fan 5 can be calculated by the above formula.
  • the working hours of the CPU body 4 are the same as the working hours of the cooling fan 5, and the preset maximum temperature outside the industrial computer body 1 is 36 degrees Celsius, which is the outdoor temperature in summer, and the CPU body 4 is allowed to work
  • the maximum temperature of the cooling fan is generally 60 degrees Celsius. According to the target air volume calculated by the above formula, the cooling fan 5 is selected so that the actual air volume of the cooling fan 5 can be greater than the target air volume.
  • the actual air volume produced by the cooling fan 5 can be quickly
  • the heat generated by the CPU body 4 is taken away, and the heat dissipation efficiency is accelerated, so that the operating temperature of the CPU body 4 does not exceed the maximum allowable temperature, thereby ensuring the working efficiency of the CPU body 4 and prolonging the service life of the CPU body 4 .
  • a method for using a CPU cooling device for an industrial computer is used to use the above-mentioned CPU cooling device for an industrial computer, and the method includes the following steps:
  • step 1 start the cooling fan 5, the cooling fan 5 transports the cooling air outside the industrial computer body 1 to the upper surface of the CPU body 4, thereby cooling the CPU body 4, and at the same time, through the heat conducting plate 2. Export the heat of the CPU body 4, and transfer the heat to the shell of the industrial computer body 1 through the heat conduction column 3, and further dissipate the heat of the CPU body 4;
  • step 2 after the cooling fan 5 has been working for a preset period of time, open the engaging device, and then grasp the clamping plate 6 to move upwards, and the clamping plate 6 drives the cooling fan 5 to slide out from the first through hole. At this time, Take out the cooling fan 5, and clean up the dust on the surface of the cooling fan 5;
  • step 3 After the dust is cleaned, open the engaging device again, put the cooling fan 5 into the industrial computer body 1 along the first through hole, until the lower surface of the clamp plate 6 is attached to the upper surface of the industrial computer body 1, Then loosen the engaging device, the engaging device clamps the clamping plate 6 on the upper surface of the industrial computer body 1, the cooling fan 5 is installed, and the cooling fan 5 is turned on again to dissipate heat from the CPU body 4, and then steps 2 and 3 are repeated.
  • the heat of the CPU body 4 can be exported through the heat conduction plate 2, and the heat is transferred to the shell of the industrial computer body 1 through the heat conduction column 3, and the heat dissipation of the CPU body 4 is further carried out;
  • the cooling fan 5 works for a preset time
  • Open the engaging device then grasp the clamping plate 6 to move upwards, the clamping plate 6 drives the cooling fan 5 to slide out from the first through hole, at this time, take out the cooling fan 5, and clean the dust on the surface of the cooling fan 5;
  • open the engaging device again, put the cooling fan 5 into the main body 1 of the industrial computer along the first through hole until the lower surface of the clamping plate 6 is attached to the upper surface of the main body 1 of the industrial computer, and then loosen the engaging device.
  • the clamping device clamps the card board 6 on the upper surface of the industrial computer body 1, the cooling fan 5 is installed, and the cooling fan 5 is turned on again to dissipate heat from the CPU body 4, and then steps 2 and 3 are repeated to realize quick disassembly and assembly of the cooling fan 5 , solve the problem that the current cooling fan 5 is not easy to disassemble.
  • This solution can quickly clean the dust on the surface of the cooling fan 5, avoid excessive dust on the surface of the cooling fan 5 and affect the heat dissipation efficiency, and quickly remove the cooling fan 5 for dust cleaning, which greatly improves work efficiency and reduces labor intensity. heat radiation.

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Abstract

一种工控机CPU散热装置及使用方法，包括工控机本体(1)，工控机本体(1)内部设置导热板(2)，导热板(2)的下表面设置导热柱(3)，导热柱(3)远离导热板(2)的一端与工控机本体(1)的底部内壁固定连接，导热板(2)的上表面安装CPU本体(4)，工控机本体(1)的上表面开设第一通孔，第一通孔正对所述CPU本体(4)，第一通孔内设置冷却扇(5)，冷却扇(5)的上端设置卡板(6)，卡板(6)的两端下表面与工控机本体(1)的上表面贴合，工控机本体(1)的上表面还设置卡合装置，卡合装置用于固定卡板(6)，卡板(6)内设置散热孔。冷却扇通过卡合装置安装在工控机本体外部，便于冷却扇的快速拆装，提高了工作效率，清理冷却扇后有助于提升冷却扇的散热效率。

Description

一种工控机CPU散热装置及使用方法
相关申请的交叉引用
本公开要求于2021年7月6日提交、申请号为202110765618.7且名称为“一种工控机CPU散热装置及使用方法”的中国专利申请的优先权，其全部内容通过引用合并于此。
技术领域
本公开涉及散热装置技术领域，特别涉及一种工控机CPU散热装置及使用方法。
背景技术
中央处理器简称CPU，是电子计算机的主要设备之一，电脑中的核心配件。其功能主要是解释计算机指令以及处理计算机软件中的数据。CPU是计算机中负责读取指令，对指令译码并执行指令的核心部件。
工控机CPU在工作的时候会产生大量的热，如果不将这些热量及时散发出去，轻则导致死机，重则可能将CPU烧毁，目前工控机内都安装有冷却扇，通过冷却扇为为CPU散热，冷却扇对CPU的稳定运行起着决定性的作用，但在冷却扇的使用过程中，冷却扇的扇叶表面容易吸附灰尘，当灰尘吸附较多时，冷却扇的扇叶转速也会变慢，甚至造成冷却扇的转动卡滞，严重影响冷却扇对CPU的散热效率，目前，工控机的冷却扇大多安装在工控机内部，对冷却扇清灰时需要使用专用工具拆除工控机外壳，然后再拆除冷却扇，造成冷却扇清理不便的问题，严重影响冷却扇对CPU的散热效率。
发明内容
根据本公开的实施例的一种工控机CPU散热装置及使用方法，用以解决目前工控机的冷却扇大多安装在工控机内部，对冷却扇清灰时需要使用专用工具拆除工控机外壳，然后再拆除冷却扇，造成冷却扇清理不便的问题，严重影响冷却扇对CPU的散热效率的技术问题。
为解决上述技术问题，本公开内容公开了一种工控机CPU散热装置及 使用方法。
本公开的第一方面，提供了一种工控机CPU散热装置，包括：工控机本体，所述工控机本体内部设置导热板，所述导热板下表面设置导热柱，所述导热柱远离所述导热板一端与所述工控机本体底部内壁固定连接，所述导热板上表面安装CPU本体，所述工控机本体上表面开设第一通孔，所述第一通孔正对所述CPU本体，所述第一通孔内设置冷却扇，所述冷却扇上端设置卡板，所述卡板两端下表面与所述工控机本体上表面贴合，所述工控机本体上表面还设置卡合装置，所述卡合装置用于固定所述卡板，所述卡板内设置散热孔。
在一些实施方式中，所述卡合装置包括：
第一凹槽，所述第一凹槽设置在所述工控机本体上表面，且所述第一凹槽位于所述冷却扇左侧；
滑块，所述滑块滑动设置在所述第一凹槽内，所述滑块一端向上延伸至所述第一凹槽外部并设置第一挡板，所述第一挡板垂直于所述滑块，所述第一挡板下表面与所述卡板上表面贴合；
第一弹簧，所述第一弹簧设置在所述第一凹槽内，所述第一弹簧一端与所述滑块侧壁固定连接，所述第一弹簧另一端与所述第一凹槽内侧壁固定连接；
滑板，所述滑板设置在所述滑块左侧壁，所述滑板下表面与所述工控机本体上表面贴合，并沿所述工控机本体上表面左右滑动。
在一些实施方式中，所述工控机本体右侧外壁设置若干散热翅片。
在一些实施方式中，所述导热板内部设置冷却通道，所述冷却通道设置为S型，所述冷却通道入口端设置第一水管，所述冷却通道出口端设置第二水管。
在一些实施方式中，所述工控机CPU散热装置还包括：
第一储液箱，所述第一储液箱设置在所述工控机本体内部，所述第一储液箱位于所述导热柱左侧，所述第一储液箱内设置冷却液与水泵，所述水泵出口端设置第三水管，所述第三水管贯穿所述第一储液箱右侧壁并与所述第一水管通过管道连接器连接；
第四水管，所述第四水管位于所述冷却扇与所述导热板之间，所述第四水管设置为S型，所述第四水管入口端与所述第二水管出口端相连，所述第四水管出口端贯穿所述第一储液箱上表面并与所述第一储液箱内部连通。
在一些实施方式中，所述工控机本体左侧外壁设置第二储液箱，所述第二储液箱内存放冷却液，所述第二储液箱上端设置加液口，所述第二储液箱前侧壁设置观察窗。
在一些实施方式中，所述工控机CPU散热装置还包括自动加水装置，所述自动加水装置包括：
连接管，所述连接管设置在所述第二储液箱靠近下侧位置，所述连接管一端与所述第二储液箱内部连通，所述连接管另一端延伸至所述工控机本体内部并与所述第一储液箱内部连通；
悬浮球，所述悬浮球漂浮在所述第一储液箱内的冷却液液面上，所述悬浮球上端设置第一滑动杆，所述第一滑动杆一端与所述悬浮球上表面固定连接，所述第一滑动杆另一端贯穿所述第一储液箱上端外壁并延伸至所述第一储液箱外部，所述第一滑动杆与所述第一储液箱上侧壁滑动连接；
第二弹簧，所述第二弹簧套设在所述第一滑动杆上，所述第二弹簧一端与所述悬浮球上表面固定连接，所述第二弹簧另一端与所述第一储液箱上侧内壁固定连接，所述第二弹簧弹力小于所述悬浮球受到的浮力；
第二滑动杆，所述第二滑动杆一端设置在所述第二储液箱内，所述第二滑动杆另一端贯穿所述第二储液箱上侧壁并延伸至所述第二储液箱外部，所述第二滑动杆与所述第二储液箱上侧壁滑动连接；
滑套，所述滑套设置在所述第二滑动杆朝向所述连接管一侧，所述滑套内设置第三弹簧，所述第三弹簧一端与所述滑套内壁固定连接，所述第三弹簧另一端设置滑柱，所述滑柱与所述滑套内壁滑动连接，所述滑柱远离所述第三弹簧一端设置堵块，所述堵块设置为球形，所述堵块直径大于所述连接管直径；
第二挡板，所述第二挡板设置在所述第二滑动杆上端，所述第二挡板位于所述第二滑动杆朝向所述工控机本体一侧，所述第二挡板远离所述第二滑动杆一端能沿所述工控机本体左侧壁上下滑动；
第三挡板，所述第三挡板设置在所述第二挡板下方，所述第三挡板一端与所述第二滑动杆侧壁固定连接，所述第三挡板远离所述第二滑动杆一端能沿所述工控机本体左侧壁上下滑动；
第二通孔，所述第二通孔设置在所述工控机本体左侧壁，所述第二通孔位于所述第二储液箱上方，所述第二通孔内设置转轴，所述转轴前后两端分别与所述第二通孔前后两侧内壁转动连接，所述转轴上设置转动板，所述转动板一端延伸至所述工控机本体外部并设置滚轮，所述滚轮位于所述第二挡板与所述第三挡板之间，所述转动板另一端设置盲孔，所述盲孔内设置第四弹簧，所述第四弹簧一端与所述盲孔内壁固定连接，所述第四弹簧另一端设置连接杆，所述连接杆与所述盲孔内壁滑动连接，所述连接杆远离所述第四弹簧一端与所述第一滑动杆远离所述悬浮球一端铰接连接。
在一些实施方式中，为了使所述CPU本体的工作温度不超过允许工作的最大温度，所述冷却扇的实际风量应大于目标风量，所述冷却扇的目标风量应满足以下公式：
Figure PCTCN2021114541-appb-000001
其中，Q 1为所述冷却扇的目标风量，P 1为所述CPU本体的额定功率，t 1为所述CPU本体的工作时长，C 1为所述冷却扇吹动的空气的比热容，ρ 1为标准状态空气密度，t 2为所述冷却扇的工作时长，T 2为所述CPU本体允许工作的最大温度，T 1为所述工控机本体外部的预设最高温度。
本公开的第二方面，提供了一种工控机CPU散热装置的使用方法，用于使用上述一种工控机CPU散热装置，所述使用方法包括以下步骤：
步骤1：启动冷却扇，所述冷却扇将所述工控机本体外部的冷却风输送至所述CPU本体上表面，从而为所述CPU本体降温，同时，通过导热板将CPU本体的热量导出，并通过导热柱将热量传递至工控机本体外壳，进一步进行CPU本体的散热；
步骤2：当所述冷却扇工作预设时长后，打开卡合装置，然后抓住卡板向上运动，卡板带动冷却扇从第一通孔内滑出，此时，取出冷却扇，并清理冷却扇表面的灰尘；
步骤3：灰尘清理完毕后，再起打开卡合装置，将冷却扇沿着第一通孔放入工控机本体内，直至卡板下表面与工控机本体上表面贴合，接着松开卡合装置，卡合装置将卡板卡在工控机本体上表面，冷却扇完成安装，重新开启冷却扇对CPU本体散热，然后重复步骤2与步骤3。
根据本公开一些实施方式的一种工控机CPU散热装置及使用方法，包括工控机本体，所述工控机本体内部设置导热板，所述导热板下表面设置导热柱，所述导热柱远离所述导热板一端与所述工控机本体底部内壁固定连接，所述导热板上表面安装CPU本体，所述工控机本体上表面开设第一通孔，所述第一通孔正对所述CPU本体，所述第一通孔内设置冷却扇，所述冷却扇上端设置卡板，所述卡板两端下表面与所述工控机本体上表面贴合，所述工控机本体上表面还设置卡合装置，所述卡合装置用于固定所述卡板，所述卡板内设置散热孔。在本公开中，冷却扇通过卡合装置安装在工控机本体外部，便于冷却扇的快速拆装，提高了工作效率，清理冷却扇后有助于提升冷却扇的散热效率。
本公开的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本公开而了解。本公开的目的和其他优点可通过在所写的说明书以及说明书附图中所特别指出的装置来实现和获得。
下面通过附图和实施例，对本公开的技术方案做进一步的详细描述。
附图说明
附图用来提供对本公开的进一步理解，并且构成说明书的一部分，与本公开的实施例一起用于解释本公开，并不构成对本公开的限制。在附图中：
图1为根据本公开的一个或多个实施方式的一种工控机CPU散热装置内部结构示意图；
图2为根据本公开的一个或多个实施方式的一种工控机CPU散热装置外部结构示意图；
图3为本公开的一个或多个实施方式中导热本内部结构示意图；
图4为本公开的一个或多个实施方式中第四水管俯视图；
图5为本公开图1中A处放大图；
图6为本公开图1中B处放大图；
图7为本公开图1中C处放大图；
图8为本公开图1中D处放大图。
图中：1、工控机本体；2、导热板；3、导热柱；4、CPU本体；5、冷却扇；6、卡板；7、第一凹槽；8、滑块；9、第一挡板；10、第一弹簧；11、滑板；12、散热翅片；13、冷却通道；14、第一水管；15、第二水管；16、第一储液箱；17、水泵；18、第三水管；19、第四水管；20、第二储液箱；21、观察窗；22、连接管；23、悬浮球；24、第一滑动杆；25、第二弹簧；26、第二滑动杆；27、滑套；28、第三弹簧；29、滑柱；30、堵块；31、第二挡板；32、第三挡板；33、第二通孔；34、转轴；35、转动板；36、滚轮；37、盲孔；38、第四弹簧；39、连接杆。
具体实施方式
以下结合附图对本公开的优选实施例进行说明，应当理解，此处所描述的优选实施例仅用于说明和解释本公开，并不用于限定本公开。
另外，在本公开中如涉及“第一”、“第二”等的描述仅用于描述目的，并非特别指称次序或顺位的意思，亦非用以限定本公开，其仅仅是为了区别以相同技术用语描述的组件或操作而已，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案以及技术特征可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本公开要求的保护范围之内。
实施例1
根据本公开实施例的一种工控机CPU散热装置，如图1-8所示，包括：工控机本体1，所述工控机本体1内部设置有导热板2，所述导热板2的下表面设置有导热柱3，所述导热柱3远离所述导热板2的一端与所述工控机本体 1的底部内壁固定连接，所述导热板2的上表面安装有CPU本体4，所述工控机本体1的上表面开设有第一通孔，所述第一通孔正对所述CPU本体4，所述第一通孔内设置有冷却扇5，所述冷却扇5的上端设置有卡板6，所述卡板6的两端下表面与所述工控机本体1的上表面贴合，所述工控机本体1的上表面还设置有卡合装置，所述卡合装置用于固定所述卡板6，所述卡板6内设置有散热孔。
上述技术方案的工作原理及有益效果为：在工控机本体1内部设置有导热板2，导热板2下表面设置导热柱3，导热柱3设置为多个，多个导热柱3一方面可以起到支撑导热板2的作用，另一方面还可以将导热板2的热量导出至工控机本体1底壁上，在导热板2上安装有CPU本体4，工控机本体1工作时，CPU本体4产生的一部分热量通过导热板2导出，增强了散热效果，同时，在CPU本体4上方设置有冷却扇5，冷却扇5通过卡板6卡在第一通孔内，冷却扇5上端与卡板6下端固定连接，卡板6的横截面面积大于第一通孔的横截面面积，通过抓取卡板6可以带动冷却扇5在第一通孔内上下滑动，从而便于将冷却扇5从工控机本体1内取出，另外，卡板6能够通过卡合装置卡紧固定，防止冷却扇5工作时发生剧烈晃动，通过上述方案，实现了冷却扇5的快速拆装，不需要借助专用工具，减小了工作人员的劳动强度，同时工作人员根据预定工作时长定期清理冷却扇5，避免冷却扇5表面附着较多的灰尘，提高了装置整体的散热效果。
实施例2
在上述实施例1的基础上，如图1、图5所示，所述卡合装置可包括：
第一凹槽7，所述第一凹槽7设置在所述工控机本体1上表面，且所述第一凹槽7位于所述冷却扇5左侧；
滑块8，所述滑块8滑动设置在所述第一凹槽7内，所述滑块8一端向上延伸至所述第一凹槽7外部并设置第一挡板9，所述第一挡板9垂直于所述滑块8，所述第一挡板9下表面与所述卡板6上表面贴合；
第一弹簧10，所述第一弹簧10设置在所述第一凹槽7内，所述第一弹簧10一端与所述滑块8侧壁固定连接，所述第一弹簧10另一端与所述第一凹槽 7内侧壁固定连接；
滑板11，所述滑板11设置在所述滑块8左侧壁，所述滑板11下表面与所述工控机本体1上表面贴合，并沿所述工控机本体1上表面左右滑动。
上述技术方案的工作原理及有益效果为：当冷却扇5需要取下清理时，单手推动第一挡板9，第一挡板9可带动滑块8在第一凹槽7内滑动，第一弹簧10压缩，滑板11可在工控机本体1上表面从右向左滑动，直至第一挡板9与卡板6上表面分离，此时，再单手抓住卡板6将冷却扇5从工控机本体1内部取出，清理完毕后，再次推动第一挡板9，将冷却扇5安装到位后，松开第一挡板9，第一挡板9可在第一弹簧10的作用下重新滑动至卡板6上表面，并将卡板6卡住，使得冷却扇5固定，在滑块8滑动时，滑板11能够随滑块8滑动，可以起到为第一凹槽7遮挡灰尘的作用，避免灰尘进入第一凹槽7内造成滑块8滑动的卡滞问题。
实施例3
在实施例1或2的基础上，如图7所示，所述工控机本体1右侧外壁设置若干散热翅片12。
上述技术方案的工作原理及有益效果为：在工控机本体1右侧外壁设置若干散热翅片12，能够增大散热面积，从而增强CPU本体4的散热效果。
实施例4
在实施例1的基础上，如图1、图3、图4所示，所述导热板2内部可设置冷却通道13，所述冷却通道13可设置为S型，所述冷却通道13入口端设置第一水管14，所述冷却通道13出口端设置第二水管15。
在本实施例中，工控机CPU散热装置还可包括：
第一储液箱16，所述第一储液箱16设置在所述工控机本体1内部，所述第一储液箱16位于所述导热柱3左侧，所述第一储液箱16内设置冷却液与水泵17，所述水泵17出口端设置第三水管18，所述第三水管18贯穿所述第一储液箱16右侧壁并与所述第一水管14通过管道连接器连接；
第四水管19，所述第四水管19位于所述冷却扇5与所述导热板2之间， 所述第四水管19设置为S型，所述第四水管19入口端与所述第二水管15出口端相连，所述第四水管19出口端贯穿所述第一储液箱16上表面并与所述第一储液箱16内部连通。
上述技术方案的工作原理及有益效果为：在工控机本体1内部设置有第一储液箱16，第一储液箱16内存放有冷却液，并且第一储液箱16内设置有水泵17，启动水泵17，水泵17带动冷却液从第三水管18流入第一水管14内，然后流经冷却通道13后，通过第二水管15流入第四水管19内，最后从第四水管19流入第一储液箱16中，形成冷却液的循环流动，在一些实施方式中，第四水管19与冷却通道13均设置为S型，增加了冷却水的流通体积，通过在导热板2内设置冷却通道13，然后利用冷却水在冷却通道13内流动，能够带走导热板2从CPU本体4内导出的热量，进一步提高了散热效率，并且，第四水管19设置在冷却扇5与CPU本体4之间，冷却扇5带入的空气流过第四水管19时能够被第四水管19降温，从而使得吹向CPU本体4的空气温度降低，有利于CPU本体4的快速降温散热，保证了CPU本体4的工作效率，延长了CPU本体4的使用寿命。
实施例5
在实施例4的基础上，如图1-图8所示，所述工控机本体1左侧外壁设置第二储液箱20，所述第二储液箱20内存放冷却液，所述第二储液箱20上端设置加液口，所述第二储液箱20前侧壁设置观察窗21。
在本实施例中，工控机CPU散热装置还可包括自动加水装置，所述自动加水装置包括：
连接管22，所述连接管22设置在所述第二储液箱20靠近下侧位置，所述连接管22一端与所述第二储液箱20内部连通，所述连接管22另一端延伸至所述工控机本体1内部并与所述第一储液箱16内部连通；
悬浮球23，所述悬浮球23漂浮在所述第一储液箱16内的冷却液液面上，所述悬浮球23上端设置第一滑动杆24，所述第一滑动杆24一端与所述悬浮球23上表面固定连接，所述第一滑动杆24另一端贯穿所述第一储液箱16上端外壁并延伸至所述第一储液箱16外部，所述第一滑动杆24与所述第 一储液箱16上侧壁滑动连接；
第二弹簧25，所述第二弹簧25套设在所述第一滑动杆24上，所述第二弹簧25一端与所述悬浮球23上表面固定连接，所述第二弹簧25另一端与所述第一储液箱16上侧内壁固定连接，所述第二弹簧25弹力小于所述悬浮球23受到的浮力；
第二滑动杆26，所述第二滑动杆26一端设置在所述第二储液箱20内，所述第二滑动杆26另一端贯穿所述第二储液箱20上侧壁并延伸至所述第二储液箱20外部，所述第二滑动杆26与所述第二储液箱20上侧壁滑动连接；
滑套27，所述滑套27设置在所述第二滑动杆26朝向所述连接管22一侧，所述滑套27内设置第三弹簧28，所述第三弹簧28一端与所述滑套27内壁固定连接，所述第三弹簧28另一端设置滑柱29，所述滑柱29与所述滑套27内壁滑动连接，所述滑柱29远离所述第三弹簧28一端设置堵块30，所述堵块30设置为球形，所述堵块30直径大于所述连接管22直径；
第二挡板31，所述第二挡板31设置在所述第二滑动杆26上端，所述第二挡板31位于所述第二滑动杆26朝向所述工控机本体1一侧，所述第二挡板31远离所述第二滑动杆26一端能沿所述工控机本体1左侧壁上下滑动；
第三挡板32，所述第三挡板32设置在所述第二挡板31下方，所述第三挡板32一端与所述第二滑动杆26侧壁固定连接，所述第三挡板32远离所述第二滑动杆26一端能沿所述工控机本体1左侧壁上下滑动；
第二通孔33，所述第二通孔33设置在所述工控机本体1左侧壁，所述第二通孔33位于所述第二储液箱20上方，所述第二通孔33内设置转轴34，所述转轴34前后两端分别与所述第二通孔33前后两侧内壁转动连接，所述转轴34上设置转动板35，所述转动板35一端延伸至所述工控机本体1外部并设置滚轮36，所述滚轮36位于所述第二挡板31与所述第三挡板32之间，所述转动板35另一端设置盲孔37，所述盲孔37内设置第四弹簧38，所述第四弹簧38一端与所述盲孔37内壁固定连接，所述第四弹簧38另一端设置连接杆39，所述连接杆39与所述盲孔37内壁滑动连接，所述连接杆39远离所述第四弹簧38一端与所述第一滑动杆24远离所述悬浮球23一端铰接连接。
上述技术方案的工作原理及有益效果为：在工控机本体1外部设置有 第二储液箱20，第二储液箱20内的冷却液容量大于第一储液箱16内的冷却液容量，在冷却液循环过程中，第一储液箱16内的冷却液会逐渐损耗减少，第一储液箱16内的冷却液液面逐渐降低，悬浮球23带动第一滑动杆24向下滑动，第一滑动杆24带动连接杆39向下运动，第四弹簧38拉伸，并且连接杆39带动转动板35进行顺时针转动，转动板35带滚轮36一端逐渐与第二挡板31接触，并且带动第二挡板31向上运动，第二挡板31带动第二滑动杆26向上滑动，第二滑动杆26带动滑套27向上运动，滑套27带动堵块30向上运动，此时圆球形的堵块30会从连接管22的左端滑出，停止对连接管22的阻挡，此时，第二储液箱20内的冷却液会通过连接管22流入第一储液箱16中，随着第一储液箱16内冷却液面的升高，悬浮球23在浮力作用下向上运动，并带动第一滑动杆24向上运动，第一滑动杆24通过连接杆39带动转动板35逆时针转动，转动板35另一端的滚轮36逐渐靠近第三挡板32，当滚轮36与第三挡板32接触后，滚轮36带动第三挡板32向下运动，第三挡板32带动第二滑动杆26向下运动，第二滑动杆26带动滑套27向下，滑套27通过滑柱29带动堵块30向下滑动，直至堵块30滑动至连接管22左端，在第三弹簧28的作用下，堵块30紧紧的封堵在连接管22左端，避免第二储液箱20内的冷却液流入第一储液箱16中，通过设置的观察窗21能够确认第二储液箱20内的冷却液的液面，从而通过加液口及时向第二储液箱20内加注冷却液，通过设置自动加水装置，能够实现第一储液箱16内冷却液的自动添加，不需要借助其它电器，不会为工控机本体1内部产生多余的热量，并且，第二储液箱20设置在工控机本体1外部，一方面便于观察第二储液箱20内剩余的冷却液，及时进行冷却液的添加，另一方面便于向第二储液箱20内加入冷却液，不需要拆除工控机本体1，减小了工作人员的劳动强度，提高了冷却液加注的便利性，保证了第一储液箱16内的冷却液液面始终保持在能够维持冷却液循环的液面，确保了装置整体的散热效率，提高了装置整体的便捷性。
实施例6
在实施例1的基础上，为了使所述CPU本体的工作温度不超过允许工 作的最大温度，所述冷却扇5的实际风量应大于目标风量，所述冷却扇5的目标风量应满足以下公式：
Figure PCTCN2021114541-appb-000002
其中，Q 1为所述冷却扇5的目标风量，P 1为所述CPU本体4的额定功率，t 1为所述CPU本体4的工作时长，C 1为所述冷却扇5吹动的空气的比热容，ρ 1为标准状态空气密度，t 2为所述冷却扇5的工作时长，T 2为所述CPU本体4允许工作的最大温度，T 1为所述工控机本体1外部的预设最高温度。
上述技术方案的工作原理及有益效果为：CPU本体4工作时会产生大量的热量，从而导致CPU本体4的温度较高，CPU本体4温度过高会降低CPU本体4的工作效率和使用寿命，为了延长CPU本体4的使用寿命与工作效率，需保证CPU本体4的工作温度不超过允许工作的最大温度，因此，冷却扇5的实际风量应当大于目标风量，通过上述公式可以计算出冷却扇5的目标风量，在一些实施方式中，CPU本体4的工作时长与冷却扇5的工作时长相同，工控机本体1外部的预设最高温度取值为36摄氏度为夏季室外温度，CPU本体4允许工作的最大温度一般为60摄氏度，根据上述公式计算的目标风量，选取冷却扇5，使得冷却扇5的实际风量能够大于目标风量，在选取的冷却扇5后，冷却扇5产生的实际风量能够快速带走CPU本体4产生的热量，加快了散热效率，使得CPU本体4的工作温度不超过允许工作的最大温度，从而确保了CPU本体4的工作效率，延长了CPU本体4的使用寿命。
根据本公开另外一些实施例的一种工控机CPU散热装置的使用方法，用于使用上述一种工控机CPU散热装置，所述使用方法包括以下步骤：
在步骤1中：启动冷却扇5，所述冷却扇5将所述工控机本体1外部的冷却风输送至所述CPU本体4上表面，从而为所述CPU本体4降温，同时，通过导热板2将CPU本体4的热量导出，并通过导热柱3将热量传递至工控机本体1外壳，进一步进行CPU本体4的散热；
在步骤2中：当所述冷却扇5工作预设时长后，打开卡合装置，然后抓住卡板6向上运动，卡板6带动冷却扇5从第一通孔内滑出，此时，取出冷却扇5，并清理冷却扇5表面的灰尘；
在步骤3中：灰尘清理完毕后，再起打开卡合装置，将冷却扇5沿着第一通孔放入工控机本体1内，直至卡板6下表面与工控机本体1上表面贴合，接着松开卡合装置，卡合装置将卡板6卡在工控机本体1上表面，冷却扇5完成安装，重新开启冷却扇5对CPU本体4散热，然后重复步骤2与步骤3。
上述技术方案的工作原理及有益效果为：工控机本体1开始工作时，启动冷却扇5，冷却扇5可将工控机本体1外部的冷却风输送至CPU本体4上表面，从而为CPU本体4降温，同时，通过导热板2可将CPU本体4的热量导出，并通过导热柱3将热量传递至工控机本体1外壳，进一步进行CPU本体4的散热；当冷却扇5工作预设时长后，打开卡合装置，然后抓住卡板6向上运动，卡板6带动冷却扇5从第一通孔内滑出，此时，取出冷却扇5，并清理冷却扇5表面的灰尘；待灰尘清理完毕后，再起打开卡合装置，将冷却扇5沿着第一通孔放入工控机本体1内，直至卡板6下表面与工控机本体1上表面贴合，接着松开卡合装置，卡合装置将卡板6卡在工控机本体1上表面，冷却扇5完成安装，重新开启冷却扇5对CPU本体4散热，然后重复步骤2与步骤3，可以实现冷却扇5的快速拆装，解决了目前冷却扇5不易拆装的问题。本方案能够快速清理冷却扇5表面的灰尘，避免冷却扇5表面灰尘过多而影响散热效率，快速拆下冷却扇5进行灰尘清理，大大提高了工作效率，减小了劳动强度，从而保证了散热效果。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

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  1. 一种工控机CPU散热装置，包括：工控机本体(1)，所述工控机本体(1)内部设置导热板(2)，所述导热板(2)下表面设置导热柱(3)，所述导热柱(3)远离所述导热板(2)一端与所述工控机本体(1)底部内壁固定连接，所述导热板(2)上表面安装CPU本体(4)，所述工控机本体(1)上表面开设第一通孔，所述第一通孔正对所述CPU本体(4)，所述第一通孔内设置冷却扇(5)，所述冷却扇(5)上端设置卡板(6)，所述卡板(6)两端下表面与所述工控机本体(1)上表面贴合，所述工控机本体(1)上表面还设置卡合装置，所述卡合装置用于固定所述卡板(6)，所述卡板(6)内设置散热孔。
  2. 根据权利要求1所述的一种工控机CPU散热装置，其中，所述卡合装置包括：
    第一凹槽(7)，所述第一凹槽(7)设置在所述工控机本体(1)上表面，且所述第一凹槽(7)位于所述冷却扇(5)左侧；
    滑块(8)，所述滑块(8)滑动设置在所述第一凹槽(7)内，所述滑块(8)一端向上延伸至所述第一凹槽(7)外部并设置第一挡板(9)，所述第一挡板(9)垂直于所述滑块(8)，所述第一挡板(9)下表面与所述卡板(6)上表面贴合；
    第一弹簧(10)，所述第一弹簧(10)设置在所述第一凹槽(7)内，所述第一弹簧(10)一端与所述滑块(8)侧壁固定连接，所述第一弹簧(10)另一端与所述第一凹槽(7)内侧壁固定连接；
    滑板(11)，所述滑板(11)设置在所述滑块(8)左侧壁，所述滑板(11)下表面与所述工控机本体(1)上表面贴合，并沿所述工控机本体(1)上表面左右滑动。
  3. 根据权利要求1所述的一种工控机CPU散热装置，其中，所述工控机本体(1)右侧外壁设置若干散热翅片(12)。
  4. 根据权利要求1所述的一种工控机CPU散热装置，其中，所述导热板(2)内部设置冷却通道(13)，所述冷却通道(13)设置为S型，所述冷 却通道(13)入口端设置第一水管(14)，所述冷却通道(13)出口端设置第二水管(15)。
  5. 根据权利要求4所述的一种工控机CPU散热装置，还包括：
    第一储液箱(16)，所述第一储液箱(16)设置在所述工控机本体(1)内部，所述第一储液箱(16)位于所述导热柱(3)左侧，所述第一储液箱(16)内设置冷却液与水泵(17)，所述水泵(17)出口端设置第三水管(18)，所述第三水管(18)贯穿所述第一储液箱(16)右侧壁并与所述第一水管(14)通过管道连接器连接；
    第四水管(19)，所述第四水管(19)位于所述冷却扇(5)与所述导热板(2)之间，所述第四水管(19)设置为S型，所述第四水管(19)入口端与所述第二水管(15)出口端相连，所述第四水管(19)出口端贯穿所述第一储液箱(16)上表面并与所述第一储液箱(16)内部连通。
  6. 根据权利要求5所述的一种工控机CPU散热装置，其中，所述工控机本体(1)左侧外壁设置第二储液箱(20)，所述第二储液箱(20)内存放冷却液，所述第二储液箱(20)上端设置加液口，所述第二储液箱(20)前侧壁设置观察窗(21)。
  7. 根据权利要求6所述的一种工控机CPU散热装置，还包括自动加水装置，所述自动加水装置包括：
    连接管(22)，所述连接管(22)设置在所述第二储液箱(20)靠近下侧位置，所述连接管(22)一端与所述第二储液箱(20)内部连通，所述连接管(22)另一端延伸至所述工控机本体(1)内部并与所述第一储液箱(16)内部连通；
    悬浮球(23)，所述悬浮球(23)漂浮在所述第一储液箱(16)内的冷却液液面上，所述悬浮球(23)上端设置第一滑动杆(24)，所述第一滑动杆(24)一端与所述悬浮球(23)上表面固定连接，所述第一滑动杆(24)另一端贯穿所述第一储液箱(16)上端外壁并延伸至所述第一储液箱(16)外部，所述第一滑动杆(24)与所述第一储液箱(16)上侧壁滑动连接；
    第二弹簧(25)，所述第二弹簧(25)套设在所述第一滑动杆(24)上，所述第二弹簧(25)一端与所述悬浮球(23)上表面固定连接，所述第二弹 簧(25)另一端与所述第一储液箱(16)上侧内壁固定连接，所述第二弹簧(25)弹力小于所述悬浮球(23)受到的浮力；
    第二滑动杆(26)，所述第二滑动杆(26)一端设置在所述第二储液箱(20)内，所述第二滑动杆(26)另一端贯穿所述第二储液箱(20)上侧壁并延伸至所述第二储液箱(20)外部，所述第二滑动杆(26)与所述第二储液箱(20)上侧壁滑动连接；
    滑套(27)，所述滑套(27)设置在所述第二滑动杆(26)朝向所述连接管(22)一侧，所述滑套(27)内设置第三弹簧(28)，所述第三弹簧(28)一端与所述滑套(27)内壁固定连接，所述第三弹簧(28)另一端设置滑柱(29)，所述滑柱(29)与所述滑套(27)内壁滑动连接，所述滑柱(29)远离所述第三弹簧(28)一端设置堵块(30)，所述堵块(30)设置为球形，所述堵块(30)直径大于所述连接管(22)直径；
    第二挡板(31)，所述第二挡板(31)设置在所述第二滑动杆(26)上端，所述第二挡板(31)位于所述第二滑动杆(26)朝向所述工控机本体(1)一侧，所述第二挡板(31)远离所述第二滑动杆(26)一端能沿所述工控机本体(1)左侧壁上下滑动；
    第三挡板(32)，所述第三挡板(32)设置在所述第二挡板(31)下方，所述第三挡板(32)一端与所述第二滑动杆(26)侧壁固定连接，所述第三挡板(32)远离所述第二滑动杆(26)一端能沿所述工控机本体(1)左侧壁上下滑动；
    第二通孔(33)，所述第二通孔(33)设置在所述工控机本体(1)左侧壁，所述第二通孔(33)位于所述第二储液箱(20)上方，所述第二通孔(33)内设置转轴(34)，所述转轴(34)前后两端分别与所述第二通孔(33)前后两侧内壁转动连接，所述转轴(34)上设置转动板(35)，所述转动板(35)一端延伸至所述工控机本体(1)外部并设置滚轮(36)，所述滚轮(36)位于所述第二挡板(31)与所述第三挡板(32)之间，所述转动板(35)另一端设置盲孔(37)，所述盲孔(37)内设置第四弹簧(38)，所述第四弹簧(38)一端与所述盲孔(37)内壁固定连接，所述第四弹簧(38)另一端设置连接杆(39)，所述连接杆(39)与所述盲孔(37)内壁滑动连接，所述 连接杆(39)远离所述第四弹簧(38)一端与所述第一滑动杆(24)远离所述悬浮球(23)一端铰接连接。
  8. 根据权利要求1所述的一种工控机CPU散热装置，其中，为了使所述CPU本体的工作温度不超过允许工作的最大温度，所述冷却扇(5)的实际风量应大于目标风量，所述冷却扇(5)的目标风量应满足以下公式：
    Figure PCTCN2021114541-appb-100001
    其中，Q 1为所述冷却扇(5)的目标风量，P 1为所述CPU本体(4)的额定功率，t 1为所述CPU本体(4)的工作时长，C 1为所述冷却扇(5)吹动的空气的比热容，ρ 1为标准状态空气密度，t 2为所述冷却扇(5)的工作时长，T 2为所述CPU本体(4)允许工作的最大温度，T 1为所述工控机本体(1)外部的预设最高温度。
  9. 一种工控机CPU散热装置的使用方法，用于使用上述权利要求1-8中任意一种工控机CPU散热装置，所述使用方法包括以下步骤：
    步骤1：启动冷却扇(5)，所述冷却扇(5)将所述工控机本体(1)外部的冷却风输送至所述CPU本体(4)上表面，从而为所述CPU本体(4)降温，同时，通过导热板(2)将CPU本体(4)的热量导出，并通过导热柱(3)将热量传递至工控机本体(1)外壳，进一步进行CPU本体(4)的散热；
    步骤2：当所述冷却扇(5)工作预设时长后，打开卡合装置，然后抓住卡板(6)向上运动，卡板(6)带动冷却扇(5)从第一通孔内滑出，此时，取出冷却扇(5)，并清理冷却扇(5)表面的灰尘；
    步骤3：灰尘清理完毕后，再起打开卡合装置，将冷却扇(5)沿着第一通孔放入工控机本体(1)内，直至卡板(6)下表面与工控机本体(1)上表面贴合，接着松开卡合装置，卡合装置将卡板(6)卡在工控机本体(1)上表面，冷却扇(5)完成安装，重新开启冷却扇(5)对CPU本体(4)散热，然后重复步骤2与步骤3。
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