WO2023276630A1 - 基板用コネクタ - Google Patents
基板用コネクタ Download PDFInfo
- Publication number
- WO2023276630A1 WO2023276630A1 PCT/JP2022/023597 JP2022023597W WO2023276630A1 WO 2023276630 A1 WO2023276630 A1 WO 2023276630A1 JP 2022023597 W JP2022023597 W JP 2022023597W WO 2023276630 A1 WO2023276630 A1 WO 2023276630A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- inner conductor
- circuit board
- connector
- board
- inner conductors
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 200
- 238000005192 partition Methods 0.000 claims abstract description 55
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 230000013011 mating Effects 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 238000004891 communication Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
Definitions
- the present disclosure relates to board connectors.
- This connector accommodates an inner conductor connected to a conductive path formed on a circuit board, an outer conductor surrounding the inner conductor while being electrically insulated from the inner conductor, the inner conductor, and the outer conductor. and a connector housing.
- the inner conductor connected to the conductive path of the circuit board is surrounded by the outer conductor.
- the noise leaking out of the board connector is also suppressed.
- the present disclosure has been completed based on the circumstances as described above, and an object thereof is to improve the communication performance of a board connector.
- the present disclosure is a board connector connected to a circuit board having a conductive path, comprising: a connector housing fitted with a mating connector; and a plurality of connector housings attached to the connector housing and connected to the conductive path of the circuit board. and a metal outer conductor that is attached to the connector housing and covers the plurality of inner conductors while being electrically insulated from the plurality of inner conductors, wherein the outer conductor includes two and a partition disposed between the two side walls and between the plurality of inner conductors, and the conductive path of the circuit board and the conductive path of the circuit board are provided at lower ends of the two side walls.
- a side wall connection portion to be connected protrudes
- a partition wall connection portion to be connected to the conductive path of the circuit board protrudes from the lower end portion of the partition wall.
- FIG. 1 is a perspective view showing a board connector and a circuit board according to Embodiment 1.
- FIG. 2 is an exploded perspective view showing the board connector.
- FIG. 3 is a perspective view showing a board connector.
- FIG. 4 is a sectional view taken along line IV-IV in FIG.
- FIG. 5 is a plan view showing the board connector.
- FIG. 6 is a perspective view showing an outer conductor.
- 7 is a perspective view showing the outer conductor viewed from a direction different from that of FIG. 6.
- FIG. FIG. 8 is a rear view showing the board connector.
- FIG. 9 is a perspective view of the board connector viewed obliquely from below.
- 10 is a cross-sectional view taken along the line XX in FIG. 5.
- FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 5.
- FIG. FIG. 12 is a bottom view showing the board connector.
- the present disclosure is a board connector connected to a circuit board having a conductive path, comprising: a connector housing fitted with a mating connector; and a connector housing attached to the connector housing and connected to the conductive path of the circuit board. and a metal outer conductor that is attached to the connector housing and covers the plurality of inner conductors while being electrically insulated from the plurality of inner conductors, wherein the outer conductor has two side walls and a partition disposed between the two side walls and between the plurality of inner conductors; A side wall connection portion connected to the conductive path protrudes, and a partition wall connection portion connected to the conductive path of the circuit board protrudes from the lower end of the partition wall.
- the inner conductor is covered with the side wall connected to the conductive path and the partition wall connected to the conductive path by the partition connecting portion connected to the conductive path of the circuit board. This improves the electromagnetic symmetry among the inner conductor, the side wall, and the partition, thereby suppressing signal leakage between the inner conductors separated by the partition. Thereby, the communication performance of the board connector can be improved.
- each of the plurality of inner conductors has a board connection portion connected to the conductive path of the circuit board, and the partition wall connection portion and the board connection portion are arranged side by side. .
- the partition wall connection part and the board connection part By arranging the partition wall connection part and the board connection part side by side, the symmetry between the partition wall connection part and the board connection part is improved. This further suppresses signal leakage between the substrate connecting portions.
- the plurality of inner conductors form a plurality of sets of inner conductor pairs composed of two adjacent inner conductors, and the partition wall is positioned between adjacent inner conductor pairs among the plurality of sets of inner conductor pairs. is preferably arranged.
- Embodiment 1 of the present disclosure will be described with reference to FIGS. 1 to 12.
- FIG. The board connector 10 according to this embodiment is attached to the circuit board 50 .
- the Z direction indicates upward
- the Y direction indicates forward
- the X direction indicates leftward.
- the circuit board 50 has a plurality of (eight in this embodiment) signal through holes 52 and a plurality of (six in this embodiment) ground through holes 51 . is formed by penetrating in the vertical direction.
- a signal land 53 (an example of a conductive path) through which a signal is transmitted is formed at the hole edge of the signal through hole 52 by printed wiring technology.
- An electrically grounded ground land 54 (an example of a conductive path) is formed at the hole edge of the ground through hole 51 by printed wiring technology.
- Electronic components (not shown) are mounted on the circuit board 50 by a known method such as soldering.
- the board connector 10 includes a connector housing 11, an outer conductor 20 attached to the connector housing 11, an upper dielectric 16 and a lower dielectric 17 accommodated inside the outer conductor 20. , an upper inner conductor 18 (an example of an inner conductor) accommodated inside the upper dielectric 16, and a lower inner conductor 19 (an example of an inner conductor) accommodated inside the lower dielectric 17. .
- the connector housing 11 is formed by injection molding an insulating synthetic resin. As shown in FIG. 3, the connector housing 11 has a hood portion 15 that opens forward and into which a mating connector (not shown) is fitted. As shown in FIG. 4 , a back wall 30 is provided on the side of the connector housing 11 opposite to the open end of the receptacle 15 . A lock portion 31 that protrudes downward is formed on the front edge of the upper wall of the receptacle portion 15 so as to protrude downward. Although not shown in detail, the lock portion 31 is engaged with the mating connector fitted inside the hood portion 15 so that the mating connector is held in the hood portion 15 .
- locking projections 33 projecting rearward are formed at four corners.
- the locking projection 33 is formed in a cylindrical shape.
- the diameter of the locking protrusion 33 formed near the upper end of the inner wall 30 is formed to be larger than the diameter of the locking protrusion 33 formed near the lower end of the inner wall 30 .
- the back wall 30 has a plurality of (four in this embodiment) cylindrical portion mounting holes 34 through which the cylindrical portion 21 of the outer conductor 20 (to be described later) is inserted. formed through.
- the cross-sectional shape of the tubular portion mounting hole 34 is a rectangular shape with rounded corners.
- the cylindrical portion attachment holes 34 are formed in two rows in the left-right direction and in two stages in the up-down direction.
- outer conductor 20 As shown in FIG. 5, the outer conductor 20 is attached to the rear portion of the connector housing 11 .
- the outer conductor 20 is made of a conductive metal.
- any metal such as zinc, copper, copper alloy, aluminum, and aluminum alloy can be appropriately selected.
- the outer conductor 20 is formed by known techniques such as casting, die casting, and cutting.
- the outer conductor 20 is adapted to make electrical contact with a mating outer conductor (not shown) accommodated in the mating connector.
- the outer conductor 20 includes a plurality of (four in this embodiment) tubular portions 21 extending in the front-rear direction and an inner conductor surrounding portion extending rearward from the rear end edge of the tubular portion 21 . and a flange 23 protruding in a direction crossing the front-rear direction at a boundary portion between the cylindrical portion 21 and the inner conductor enclosing portion 22 .
- the cylindrical section 21 has a rectangular cross section with rounded corners.
- the outer shape of the tubular portion 21 is set to be the same as or slightly smaller than the inner shape of the tubular portion mounting hole 34 of the back wall 30 . Thereby, the tubular portion 21 is press-fitted into the tubular portion mounting hole 34 of the connector housing 11 .
- a space extending in the front-rear direction is formed inside the tubular portion 21 .
- An upper dielectric 16 and a lower dielectric 17, which will be described later, are press-fitted into the space inside the cylindrical portion 21, and the upper dielectric 16 and the lower dielectric 17 are held in the cylindrical portion 21 in a retaining state. It has become so.
- the inner conductor enclosing part 22 has a shape that opens downward when viewed from the rear.
- the inner conductor enclosing portion 22 has a top wall 70, two side walls 71 extending downward from both left and right ends of the top wall 70, and a partition wall 72 extending downward from near the center of the top wall 70 in the left-right direction.
- a partition 72 is located between the two side walls 71 .
- an upper inner conductor 18 and a lower inner conductor 19, which will be described later, are surrounded by the inner conductor enclosing portion 22 on the upper, right, and left sides. It is designed to be contained in a state where
- the lower ends of the two side walls 71 are each provided with a plurality of (four in this embodiment) side wall connecting portions 73 in a cylindrical shape protruding downward.
- the side wall connection portion 73 is penetrated through the ground through hole 51 of the circuit board 50 and is formed on the inner surface of the ground through hole 51 by a known technique such as soldering. It is connected with land 54 .
- partition wall connecting portions 74 projecting downward are provided at the lower end of the partition wall 72 .
- the partition connecting portion 74 is passed through the ground through hole 51 of the circuit board 50 and is formed on the inner surface of the ground through hole 51 by a known technique such as soldering. It is connected with land 54 .
- the flange 23 comes into contact with the rear surface of the back wall 30 from behind while the tubular portion 21 is press-fitted into the tubular portion mounting hole 34 .
- a portion of the flange 23 corresponding to the punched hole 32 of the back wall 30 closes the punched hole 32 from behind.
- locking recesses 26 are formed in the flange 23 at positions corresponding to the locking projections 33 of the back wall 30, and penetrate the flange 23 in the front-rear direction.
- the cross-sectional shape of the locking recess 26 is circular.
- the inner shape of the engaging recess 26 is set substantially the same as the outer shape of the engaging protrusion 33 .
- the term “substantially the same” includes the case of being the same, and also includes the case of being substantially the same even if it is not the same.
- the lower dielectric 17 is mounted in the cylindrical portion mounting hole 34 provided in the lower stage, and the lower dielectric 17 is mounted in the cylindrical portion mounting hole 34 provided in the upper stage.
- the upper dielectric 16 is attached to the cylindrical portion attachment hole 34 .
- the upper dielectric 16 and the lower dielectric 17 are formed by injection-molding insulating synthetic resin.
- the upper dielectric 16 and the lower dielectric 17 each have an inner conductor through-hole 24 through which a straight portion 28 of an upper inner conductor 18 and a straight portion 28 of a lower inner conductor 19 pass in the front-rear direction.
- the vertical height dimension of the lower dielectric 17 is smaller than the vertical height dimension of the upper dielectric 16 .
- a lower inner conductor 19 is attached to the lower dielectric 17 and an upper inner conductor 18 is attached to the upper dielectric 16 .
- the lower inner conductor 19 and the upper inner conductor 18 are formed by bending a tab-shaped metal plate into a predetermined shape.
- the lower inner conductor 19 and the upper inner conductor 18 have a straight portion 28 extending in the front-rear direction (direction along the plate surface of the circuit board 50), and a straight portion 28 that is bent obliquely downward and rearward (circuit and a bent portion 29 extending along the direction intersecting the plate surface of the substrate 50 .
- the length dimension of the straight portion 28 of the lower inner conductor 19 is smaller than the length dimension of the straight portion 28 of the upper inner conductor 18 in the front-rear direction.
- the height dimension of the lower inner conductor 19 is smaller than the height dimension of the upper inner conductor 18 in the vertical direction.
- the front end of the straight portion 28 of the upper inner conductor 18 protrudes further forward than the front end of the upper dielectric 16 .
- the front end of the straight portion 28 of the lower inner conductor 19 protrudes further forward than the front end of the lower dielectric 17 .
- a mating inner conductor (not shown) housed in the mating connector can be brought into contact with the straight portion 28 .
- the bent portion 29 is bent obliquely downward with respect to the straight portion 28 and protrudes further downward from the lower surface of the connector housing 11 .
- a lower end portion of the bent portion 29 is further bent in a direction orthogonal to the circuit board 50 to form a board connecting portion 75 electrically connected to the signal land 53 formed on the circuit board 50 .
- the board connection portion 75 is inserted into the signal through hole 52 formed in the circuit board 50 and soldered to be electrically connected to the signal land 53 formed in the circuit board 50 . It has become.
- shield member 80 As shown in FIG. 11, a metallic shield member 80 is arranged between the lower dielectric 17 and the upper dielectric 16 .
- the shield member 80 is formed by pressing a conductive metal plate material into a predetermined shape. Any metal such as copper, a copper alloy, aluminum, an aluminum alloy, or the like can be appropriately selected as the metal forming the shield member 80 .
- the shield member 80 includes a substantially rectangular main body portion 81, rearwardly extending portions 82 extending rearward from both left and right side edges of the main body portion 81, and frontwardly extending from the upper end edge of the main body portion 81. and a forward extending portion 83 .
- the shield member 80 is press-fitted between the side wall 71 and the partition wall 72 from behind. By pressing the shield member 80 between the side wall 71 and the partition wall 72, the shield member 80 is held against the outer conductor 20 in a state of being prevented from coming off, and the shield member 80 and the outer conductor 20 are electrically connected. are connected to each other.
- the outer conductor 20 is formed with a groove 25 opening rearward between the cylindrical portion 21 provided on the upper side and the cylindrical portion 21 provided on the lower side.
- the span dimension of the groove portion 25 in the vertical direction is set to be the same as or slightly larger than the thickness dimension of the front extending portion 83 in the vertical direction.
- a front extending portion 83 of the shield member 80 is press-fitted into the groove portion 25 from behind. As a result, the shield member 80 is held behind the outer conductor 20 in a state of being prevented from coming off, and the shield member 80 and the outer conductor 20 are electrically connected.
- two lower inner conductors 19 are attached to one lower dielectric 17 adjacent to each other in the left-right direction.
- Two lower inner conductors 19 attached to one lower dielectric 17 form a set of lower inner conductor pairs 84 (an example of inner conductor pairs).
- two lower inner conductor pairs 84 are formed in one substrate connector 10 .
- two upper inner conductors 18 are attached to one upper dielectric 16 adjacent to each other in the left-right direction.
- Two upper inner conductors 18 attached to one upper dielectric 16 form a set of upper inner conductor pairs 85 (an example of inner conductor pairs).
- two upper inner conductor pairs 85 are formed in one substrate connector 10 .
- the front half of the straight portion 28 of the upper inner conductor 18 and the straight portion 28 of the lower inner conductor 19 are electromagnetically shielded by being covered with the cylindrical portion 21 of the outer conductor 20.
- noise from the outside is suppressed from entering the portion of the straight portion 28 covered by the cylindrical portion 21, and the portion of the straight portion 28 covered by the cylindrical portion 21 emits noise to the outside. Leakage of noise is suppressed.
- the rear half portion of the straight portion 28 of the upper inner conductor 18 , the bent portion 29 of the upper inner conductor 18 , and the bent portion 29 of the lower inner conductor 19 form the inner conductor enclosing portion 22 of the outer conductor 20 .
- leakage of noise to the outside from the portion covered by the inner conductor enclosing portion 22 of the upper inner conductor 18 and the lower inner conductor 19 is suppressed. It's becoming
- the side wall connecting portions 73 of the two side walls 71 are connected to the ground lands 54 of the circuit board 50, so that external noise is prevented from entering the upper inner conductor 18 and the lower inner conductor 19. is further suppressed, and leakage of noise from the upper inner conductor 18 and the lower inner conductor 19 to the outside is further suppressed.
- a lower inner conductor pair 84 and an upper inner conductor pair 85 are arranged on the left side of the board connector 10, and a lower inner conductor pair 84 and an upper inner conductor pair 85 are arranged on the right side. are separated by a partition wall 72 .
- the partition wall 72 is electrically connected to the ground land 54 of the circuit board 50 by the partition wall connecting portion 74, the lower inner conductor pair 84 and the upper inner conductor pair 85 arranged on the left side of the board connector 10 are connected to each other. , and the signal leakage between the lower inner conductor pair 84 and the upper inner conductor pair 85 arranged on the right side is further suppressed.
- the upper inner conductor pair 85 arranged on the upper side of the board connector 10 and the lower inner conductor pair 84 arranged on the lower side are separated by the shield member 80 . This suppresses signal leakage between the upper inner conductor pair 85 arranged on the upper side of the board connector 10 and the lower inner conductor pair 84 arranged on the lower side. .
- the shield member 80 is electrically connected to the side wall 71 of the outer conductor 20 and the partition wall 72, so that the upper inner conductor pair 85 arranged on the upper side of the board connector 10 and the lower side Signal leakage between the arranged lower inner conductor pair 84 is further suppressed.
- the four board connection portions 75 of the lower inner conductor 19 and the partition wall connection portion 74 provided on the front side of the partition wall 72 are arranged in a row in the left-right direction.
- the four board connection portions 75 of the upper inner conductor 18 and the partition wall connection portion 74 provided on the rear side of the partition wall 72 are arranged in a line in the left-right direction.
- the straight portion 28 of the lower inner conductor 19 is press-fitted into the inner conductor through-hole 24 of the lower dielectric 17 from behind.
- the straight portion 28 of the upper inner conductor 18 is press-fitted into the inner conductor through-hole 24 of the upper dielectric 16 from behind.
- the lower dielectric 17 is attached to the outer conductor 20 from behind. As a result, the front end portion of the lower dielectric 17 is press-fitted into the tubular portion 21 of the outer conductor 20 .
- the shield member 80 is attached to the outer conductor 20 from behind.
- the forward extending portion 83 of the shield member 80 is press-fitted into the groove portion 25 of the outer conductor 20 from the rear, and the rearward extending portion 82 of the shield member 80 is press-fitted between the side wall 71 and the partition wall 72 from the rear.
- the upper dielectric 16 is attached to the outer conductor 20 from behind. As a result, the front end portion of the upper dielectric 16 is press-fitted into the tubular portion 21 of the outer conductor 20 .
- the tubular portion 21 of the outer conductor 20 is press-fitted into the tubular portion mounting hole 34 of the connector housing 11 from behind. At this time, the locking protrusion 33 is inserted into the locking recess 26 of the flange 23 .
- the rear end portion of the locking projection 33 is heated and pressurized, thereby crushing the rear end portion of the locking projection 33 .
- the outer conductor 20 is retained in the connector housing 11 so as to be prevented from coming off.
- the board connector 10 is completed.
- the board connector 10 and the circuit board 50 are connected as follows. As indicated by the arrow A in FIG. 1, the board connector 10 is attached to the circuit board 50 from above.
- the side wall connection portion 73 and the partition wall connection portion 74 are inserted from above into the ground through hole 51 of the circuit board 50 , and the bent portion 29 is inserted into the signal through hole 52 of the circuit board 50 from above.
- a board connection portion 75 is inserted. After that, the side wall connection portion 73, the partition wall connection portion 74, and the board connection portion 75 are connected to the ground land 54 and the signal land 53 by soldering, respectively. As a result, the board connector 10 and the circuit board 50 are connected.
- the board connector 10 is a board connector 10 connected to a circuit board 50 having a signal land 53 and a ground land 54, and includes a connector housing 11 to be fitted with a mating connector, a connector An upper inner conductor 18 and a lower inner conductor 19 attached to the housing 11 and connected to the signal land 53 of the circuit board 50, and an upper inner conductor 18 and a lower inner conductor 19 attached to the connector housing 11.
- the upper inner conductor 18 and the lower inner conductor 19 are connected to the side wall 71 connected to the ground land 54 and the ground land 54 by the partition connecting portion 74 connected to the ground land 54 of the circuit board 50 . It is covered by a partition wall 72 that This improves the electromagnetic symmetry among the side walls 71 , the partition walls 72 , the upper inner conductor 18 and the lower inner conductor 19 . As a result, signal leakage between the upper inner conductors 18 and between the lower inner conductors 19 separated by the partition 72 can be suppressed. Thereby, the communication performance of the board connector 10 can be improved.
- each of the upper inner conductor 18 and the lower inner conductor 19 has the board connection portion 75 connected to the signal land 53 of the circuit board 50, and the partition wall connection portion 74 and the board It is arranged side by side with the connecting portion 75 .
- the partition connecting portion 74 and the substrate connecting portion 75 are arranged side by side, the symmetry between the partition connecting portion 74 and the substrate connecting portion 75 is improved. This further suppresses signal leakage between the substrate connecting portions 75 .
- the upper inner conductor 18 and the lower inner conductor 19 are formed by an upper inner conductor pair 85 and a lower inner conductor, each of which consists of two adjacent upper inner conductors 18 and lower inner conductors 19.
- the partition walls 72 are arranged between adjacent pairs of upper inner conductors 85 and between adjacent pairs of lower inner conductors 84 .
- the outer conductor 20 may be formed by bending a metal plate.
- the locking protrusion 33 of the connector housing 11 may be press-fitted into the locking recess 26 of the outer conductor 20 .
- the number of inner conductor pairs is four, but the number of inner conductor pairs is not limited to this, and may be two, three, or five or more. Three or more inner conductor pairs may be arranged in the horizontal direction, or three or more inner conductor pairs may be arranged in the vertical direction.
- the number of partition connecting portions 74 may be one, or three or more.
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
最初に本開示の実施態様を列挙して説明する。
以下に、本開示の実施形態について説明する。本開示はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内での全ての変更が含まれることが意図される。
本開示の実施形態1について、図1から図12を参照しつつ説明する。本実施形態に係る基板用コネクタ10は回路基板50に取り付けられる。以下の説明において、Z方向は上方を示し、Y方向は前方を示し、X方向は左方を示す。また、複数の同一部材については、一部の部材にのみ符号を付して、他の部材の符号を省略する場合がある。
図1に示すように、回路基板50には、複数(本実施形態では8つ)の信号用スルーホール52と、複数(本実施形態では6つ)のグランド用スルーホール51とが回路基板50を上下方向に貫通して形成されている。信号用スルーホール52の孔縁部には信号が伝送される信号用ランド53(導電路の一例)がプリント配線技術により形成されている。グランド用スルーホール51の孔縁部には電気的に接地されたグランド用ランド54(導電路の一例)がプリント配線技術により形成されている。回路基板50には、図示しない電子部品が半田付け等の公知の手法により実装されている。
図2に示すように、基板用コネクタ10は、コネクタハウジング11と、コネクタハウジング11に装着される外導体20と、外導体20の内部に収容される上側誘電体16、及び下側誘電体17と、上側誘電体16の内部に収容される上側内導体18(内導体の一例)と、下側誘電体17の内部に収容される下側内導体19(内導体の一例)と、を有する。
コネクタハウジング11は、絶縁性の合成樹脂を射出成型することにより形成される。図3に示すように、コネクタハウジング11は、前方に開口するとともに、相手方コネクタ(図示せず)が内嵌されるフード部15を備える。図4に示すように、コネクタハウジング11のうち、フード部15の開口端部と反対側には奥壁30が設けられている。フード部15の上壁の前端縁には、下方に突出するロック部31が下方に突出して形成されている。詳細には図示しないが、ロック部31が、フード部15内に内嵌された相手方コネクタと係合することにより、相手方コネクタがフード部15内に保持されるようになっている。
図5に示すように、外導体20は、コネクタハウジング11の後部に取り付けられる。外導体20は、導電性を有する金属製である。外導体20を構成する金属としては、亜鉛、銅、銅合金、アルミニウム、アルミニウム合金等、任意の金属を適宜に選択できる。外導体20は、鋳造、ダイキャスト、切削加工等、公知の手法により形成される。外導体20は、相手方コネクタに収容された相手方外導体(図示せず)と電気的に接触するようになっている。
図11に示すように、外導体20に形成された筒部取り付け孔34のうち、下段に設けられた筒部取り付け孔34には下側誘電体17が取り付けられており、上段に設けられた筒部取り付け孔34には上側誘電体16が取り付けられている。上側誘電体16及び下側誘電体17は、絶縁性を有する合成樹脂製を射出成型してなる。上側誘電体16及び下側誘電体17はそれぞれ、後述する上側内導体18のストレート部28、及び下側内導体19のストレート部28が前後方向に貫通する内導体貫通孔24を有する。下側誘電体17の上下方向の高さ寸法は、上側誘電体16の上下方向の高さ寸法よりも小さく形成されている。
図11に示すように、下側誘電体17には下側内導体19が取り付けられており、上側誘電体16には上側内導体18が取り付けられている。下側内導体19、及び上側内導体18は、タブ状の金属板材を所定の形状に曲げ加工することにより形成される。下側内導体19、及び上側内導体18は、前後方向(回路基板50の板面に沿う方向)に沿って延びるストレート部28と、ストレート部28に対して屈曲されて、斜め下後方(回路基板50の板面と交差する方向)に沿って延びる屈曲部29とを備える。前後方向について、下側内導体19のストレート部28の長さ寸法は、上側内導体18のストレート部28の長さ寸法よりも小さく形成されている。上下方向について、下側内導体19の高さ寸法は、上側内導体18の高さ寸法よりも小さく形成されている。
図11に示すように、下側誘電体17と、上側誘電体16との間には、金属製のシールド部材80が配されている。シールド部材80は導電性を有する金属板材を所定の形状にプレス加工してなる。シールド部材80を構成する金属としては、銅、銅合金、アルミニウム、アルミニウム合金等、任意の金属を適宜に選択できる。図2に示すように、シールド部材80は、略長方形状をなす本体部81と、本体部81の左右両側縁から後方に延びる後方延設部82と、本体部81の上端縁から前方に延びる前方延設部83と、を有する。
図2に示すように、1つの下側誘電体17には、2つの下側内導体19が、左右方向に隣り合って取り付けられている。1つの下側誘電体17に取り付けられた2つの下側内導体19は、1組の下側内導体対84(内導体対の一例)を形成している。本実施形態では、1つの基板用コネクタ10に、2組の下側内導体対84が形成されている。
図11に示すように、上側内導体18のストレート部28の前半部分、及び下側内導体19のストレート部28は、外導体20の筒部21によって覆われることにより、電磁的にシールドされている。この結果、ストレート部28のうち筒部21によって覆われた部分に外部からノイズが混入することが抑制されるようになっているとともに、ストレート部28うち筒部21によって覆われた部分から外部にノイズが漏洩することが抑制されるようになっている。
続いて、本実施形態に係る基板用コネクタ10の組み立て工程の一例について説明する。基板用コネクタ10の組み立て工程は、以下の記載に限定されない。
続いて、本実施形態の作用効果について説明する。本実施形態に係る基板用コネクタ10は、信号用ランド53、及びグランド用ランド54を有する回路基板50に接続される基板用コネクタ10であって、相手方コネクタと嵌合するコネクタハウジング11と、コネクタハウジング11に取り付けられるとともに回路基板50の信号用ランド53に接続される上側内導体18、及び下側内導体19と、コネクタハウジング11に取り付けられるとともに、上側内導体18、及び下側内導体19と電気的に絶縁された状態で、上側内導体18、及び下側内導体19を覆う金属製の外導体20と、を備え、外導体20は、2つの側壁71と、2つの側壁71の間に配されるとともに複数の上側内導体18の間、及び複数の下側内導体19の間に配される隔壁72と、を有し、2つの側壁71の下端部には、回路基板50のグランド用ランド54と接続される側壁接続部73が下方に突出しており、隔壁72の下端部には、回路基板50のグランド用ランド54と接続される隔壁接続部74が下方に突出している。
(1)外導体20は金属板材を曲げ加工することにより形成されてもよい。
11: コネクタハウジング
15: フード部
16: 上側誘電体
17: 下側誘電体
18: 上側内導体
19: 下側内導体
20: 外導体
21: 筒部
22: 内導体包囲部
23: フランジ
24: 内導体貫通孔
25: 溝部
26: 係止凹部
28: ストレート部
29: 屈曲部
30: 奥壁
31: ロック部
32: 型抜き孔
33: 係止凸部
34: 筒部取り付け孔
50: 回路基板
51: グランド用スルーホール
52: 信号用スルーホール
53: 信号用ランド
54: グランド用ランド
70: 上壁
71: 側壁
72: 隔壁
73: 側壁接続部
74: 隔壁接続部
75: 基板接続部
80: シールド部材
81: 本体部
82: 後方延設部
83: 前方延設部
84: 下側内導体対
85: 上側内導体対
Claims (3)
- 導電路を有する回路基板に接続される基板用コネクタであって、
相手方コネクタと嵌合するコネクタハウジングと、
前記コネクタハウジングに取り付けられるとともに前記回路基板の前記導電路に接続される複数の内導体と、
前記コネクタハウジングに取り付けられるとともに、前記複数の内導体と電気的に絶縁された状態で前記複数の内導体を覆う金属製の外導体と、を備え、
前記外導体は、2つの側壁と、2つの側壁の間に配されるとともに前記複数の内導体の間に配される隔壁と、を有し、
前記2つの側壁の下端部には、前記回路基板の前記導電路と接続される側壁接続部が突出しており、
前記隔壁の下端部には、前記回路基板の前記導電路と接続される隔壁接続部が突出している基板用コネクタ。 - 前記複数の内導体のそれぞれは、前記回路基板の前記導電路と接続される基板接続部を有し、
前記隔壁接続部と前記基板接続部とは並んで配されている請求項1に記載の基板用コネクタ。 - 複数の内導体は、隣り合う2つの内導体からなる複数組の内導体対を形成しており、
前記隔壁は、前記複数組の内導体対のうち隣り合う内導体対の間に配されている請求項1または請求項2に記載の基板用コネクタ。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07142123A (ja) * | 1993-06-04 | 1995-06-02 | Framatome Connectors Internatl | コネクタ装置 |
JP2002231391A (ja) * | 2001-01-31 | 2002-08-16 | Tyco Electronics Amp Kk | シールドコネクタ組立体 |
US9389368B1 (en) * | 2015-04-07 | 2016-07-12 | Tyco Electronics Corporation | Receptacle assembly and set of receptacle assemblies for a communication system |
JP2017022028A (ja) * | 2015-07-13 | 2017-01-26 | 日本航空電子工業株式会社 | コネクタ |
JP2017174515A (ja) * | 2016-03-18 | 2017-09-28 | ヒロセ電機株式会社 | コネクタ |
JP2020109738A (ja) * | 2018-12-28 | 2020-07-16 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ、及び機器 |
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2021
- 2021-07-02 JP JP2021110740A patent/JP2023007717A/ja active Pending
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2022
- 2022-06-13 WO PCT/JP2022/023597 patent/WO2023276630A1/ja active Application Filing
- 2022-06-13 CN CN202280044398.1A patent/CN117546373A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07142123A (ja) * | 1993-06-04 | 1995-06-02 | Framatome Connectors Internatl | コネクタ装置 |
JP2002231391A (ja) * | 2001-01-31 | 2002-08-16 | Tyco Electronics Amp Kk | シールドコネクタ組立体 |
US9389368B1 (en) * | 2015-04-07 | 2016-07-12 | Tyco Electronics Corporation | Receptacle assembly and set of receptacle assemblies for a communication system |
JP2017022028A (ja) * | 2015-07-13 | 2017-01-26 | 日本航空電子工業株式会社 | コネクタ |
JP2017174515A (ja) * | 2016-03-18 | 2017-09-28 | ヒロセ電機株式会社 | コネクタ |
JP2020109738A (ja) * | 2018-12-28 | 2020-07-16 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ、及び機器 |
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