WO2023273314A1 - 终端设备 - Google Patents

终端设备 Download PDF

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Publication number
WO2023273314A1
WO2023273314A1 PCT/CN2022/072605 CN2022072605W WO2023273314A1 WO 2023273314 A1 WO2023273314 A1 WO 2023273314A1 CN 2022072605 W CN2022072605 W CN 2022072605W WO 2023273314 A1 WO2023273314 A1 WO 2023273314A1
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WO
WIPO (PCT)
Prior art keywords
opening
terminal device
circuit board
sub
circuit
Prior art date
Application number
PCT/CN2022/072605
Other languages
English (en)
French (fr)
Inventor
张翼鹤
高久亮
李占东
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to CN202410756313.3A priority Critical patent/CN118647130A/zh
Priority to EP22723007.5A priority patent/EP4138524A4/en
Priority to US17/756,606 priority patent/US20240172367A1/en
Priority to CN202280001151.1A priority patent/CN114731760B/zh
Publication of WO2023273314A1 publication Critical patent/WO2023273314A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present application relates to the technical field of terminals, and in particular to a terminal device.
  • a terminal device including components and a circuit board
  • the circuit board includes a circuit substrate and a solder resist layer, and the solder resist layer is located on the surface of the circuit substrate; wherein, the circuit board includes a first opening, and the first opening is located at a position where the solder resist layer is away from the circuit substrate The surface is recessed, and at least part of the element is received in the first opening.
  • the installation height between the component and the circuit board can be reduced without affecting the performance of the component and the circuit board.
  • the first opening does not penetrate the solder mask layer, and there is no need to consider whether the surface of the component in direct contact with the solder mask layer is conductive, and the circuit board is electrically connected to the circuit board, resulting in a circuit board short circuit or signal loss, which improves the applicability of the component type. scene; at the same time, the solder mask can still maintain its original function.
  • the part of the component accommodated in the first opening is in contact with the solder resist layer.
  • the installation height of the components and the circuit board can be minimized.
  • the part of the component accommodated in the first opening is spaced from the solder resist layer.
  • the terminal device further includes a connecting piece, and the connecting piece connects the component and the non-adjacent surface of the circuit board.
  • the component and the circuit board are arranged at intervals to prevent the rigid contact between the component and the circuit board when an external force acts, thereby affecting the performance of the component.
  • the component is one of a lens module, a SIM card holder, a screw washer, and a nut.
  • the above design can be used in various scenarios where the installation height needs to be reduced.
  • the element includes a body and a protrusion connected to the body, the protrusion is accommodated in the first opening, and the body is located outside the first opening.
  • the protrusion is accommodated in the first opening, which reduces the installation height of the component and the circuit board, and does not increase the installation height due to the existence of the protrusion.
  • the element includes a body and a protrusion connected to the body; the first opening includes a first sub-opening and a second sub-opening, and the first sub-opening communicates with the second sub-opening; the protrusion is accommodated in the second sub-opening. In one sub-opening, at least part of the main body is accommodated in the second sub-opening.
  • the structure of the first opening can be designed according to the shape of the component, so as to further reduce the installation height of the component and the circuit board.
  • the element is a lens module
  • the protrusion has a sub-element
  • the sub-element is at least one of a sensor, a lens module, a voice coil motor, and a Hall device.
  • a terminal device includes components and a circuit board; the circuit board includes a circuit substrate and a solder resist layer; the circuit substrate includes a dielectric layer and a circuit layer stacked with the dielectric layer, and the solder resist layer is located on the surface of the circuit substrate; wherein, the circuit The board includes a second opening, the second opening penetrates the solder resist layer but is not disposed on the circuit substrate, and at least part of the components are accommodated in the second opening.
  • the second opening penetrates the solder resist layer, which can further increase the depth of the components accommodated in the circuit board, thereby further reducing the installation height of the components and the circuit board.
  • the part of the component accommodated in the second opening is in contact with the circuit substrate.
  • the installation height of the components and the circuit board can be minimized.
  • the part of the component accommodated in the second opening is spaced from the circuit substrate.
  • the terminal device further includes a connecting piece, and the connecting piece connects the component and the non-adjacent surface of the circuit board.
  • the component and the circuit board are arranged at intervals to prevent the rigid contact between the component and the circuit board when an external force acts, thereby affecting the performance of the component.
  • the component is one of a lens module, a SIM card holder, a screw washer, and a nut.
  • the above design can be used in various scenarios where the installation height needs to be reduced.
  • the element includes a body and a protrusion connected to the body, the protrusion is accommodated in the second opening, and the body is located outside the second opening.
  • the protrusion is accommodated in the second opening, which reduces the installation height of the component and the circuit board, and does not increase the installation height due to the existence of the protrusion.
  • the element includes a body and a protrusion connected to the body, the second opening includes a first sub-opening and a second sub-opening, and the first sub-opening communicates with the second sub-opening; the protrusion is accommodated in the second sub-opening.
  • the protrusion is accommodated in the second sub-opening.
  • at least part of the main body is accommodated in the second sub-opening.
  • the structure of the second opening can be designed according to the shape of the component, so as to further reduce the installation height of the component and the circuit board.
  • the element is a lens module
  • the protrusion has a sub-element
  • the sub-element is at least one of a sensor, a lens module, a voice coil motor, and a Hall device.
  • a terminal device includes components and a circuit board, the circuit board includes a circuit substrate and a solder resist layer, the circuit substrate includes a dielectric layer and a circuit layer stacked with the dielectric layer, the number of layers of the circuit layer is greater than two layers, and the solder resist layer Located on the surface of the circuit substrate; wherein the circuit board includes a third opening, the third opening penetrates the solder resist layer and the circuit substrate, the circuit board has at least one circuit layer in the projected area of the third opening, and at least part of the components are accommodated in the first Three mouths.
  • the third opening penetrates the solder resist layer and part of the circuit layer, which can further increase the depth of the component accommodated in the circuit board, thereby further reducing the installation height of the component and the circuit board; in addition, the third opening does not penetrate all
  • the circuit layer of the circuit board will not affect the wiring of the circuit layer on the side of the circuit board away from the component, and will not affect the position of other components that need to be electrically connected on the circuit layer on the side of the circuit board away from the component.
  • the dielectric layer is exposed to the third opening, and the part of the element accommodated in the third opening is in contact with the dielectric layer.
  • the installation height of the components and the circuit board can be minimized.
  • the dielectric layer is exposed to the third opening, and the part of the element accommodated in the third opening is spaced apart from the dielectric layer.
  • the circuit layer is exposed to the third opening, and the part of the element accommodated in the third opening is in contact with the circuit layer.
  • the installation height of the components and the circuit board can be minimized.
  • the circuit layer is exposed to the third opening, and the part of the element accommodated in the third opening is spaced from the circuit layer.
  • the terminal device further includes a connecting piece, and the connecting piece connects the component and the non-adjacent surface of the circuit board.
  • the component and the circuit board are arranged at intervals to prevent the rigid contact between the component and the circuit board when an external force acts, thereby affecting the performance of the component.
  • the component is one of a lens module, a SIM card holder, a screw washer, and a nut.
  • the above design can be used in various scenarios where the installation height needs to be reduced.
  • the element includes a body and a protrusion connected to the body, the protrusion is accommodated in the third opening, and the body is located outside the third opening.
  • the protrusion is accommodated in the third opening, which reduces the installation height of the component and the circuit board, and does not increase the installation height due to the existence of the protrusion.
  • the element includes a body and a protrusion connected to the body, the third opening includes a first sub-opening and a second sub-opening, and the first sub-opening communicates with the second sub-opening; the protrusion is accommodated in the second sub-opening.
  • the protrusion is accommodated in the second sub-opening.
  • at least part of the main body is accommodated in the second sub-opening.
  • the structure of the third opening can be designed according to the shape of the component, so as to further reduce the installation height of the component and the circuit board.
  • the element is a lens module
  • the protrusion has a sub-element
  • the sub-element is at least one of a sensor, a lens module, a voice coil motor, and a Hall device.
  • a terminal device includes a component and a circuit board, wherein the circuit board includes a fourth opening, the fourth opening is recessed inward on the surface of the circuit board facing the component, and at least part of the component is arranged corresponding to the fourth opening.
  • the safety distance that needs to be reserved between the components and the circuit board is compensated, thereby reducing the installation height of the components and the circuit board.
  • the area of the element corresponding to the four openings is provided with a sub-element, and the sub-element is a Hall element.
  • the circuit board includes a circuit substrate and a solder resist layer on the surface of the circuit substrate; the fourth opening is recessed on the surface of the solder resist layer away from the circuit substrate.
  • the safety distance that needs to be reserved between the components and the circuit board is compensated, thereby reducing the installation height of the components and the circuit board.
  • the circuit board includes a circuit substrate and a solder resist layer located on the surface of the circuit substrate; the fourth opening penetrates the solder resist layer but is not disposed on the circuit substrate.
  • the safety distance that needs to be reserved between the components and the circuit board is further compensated, thereby reducing the installation height of the components and the circuit board.
  • the circuit board includes a circuit substrate and a solder resist layer located on the surface of the circuit substrate, the circuit substrate includes a dielectric layer and a circuit layer stacked with the dielectric layer, and the circuit layer The number of layers is greater than two; the fourth opening penetrates through the solder resist layer and part of the circuit substrate, and the circuit board has at least one layer of the circuit layer in the projected area of the fourth opening.
  • the safety distance that needs to be reserved between the components and the circuit board is further compensated, thereby reducing the installation height of the components and the circuit board.
  • FIG. 1 is a schematic diagram of a partial structure of a terminal device provided by an embodiment of the present application.
  • FIG. 2 is a partial structural schematic diagram of a terminal device having a first opening on a circuit board according to the first embodiment of the present application.
  • FIG. 3 is a partial structural schematic diagram of a terminal device with a component having protrusions provided in the first embodiment of the present application.
  • FIG. 4 is a partial structural schematic diagram of a terminal device with a first opening in the shape of a step provided in the first embodiment of the present application.
  • FIG. 5 is a partial structural schematic diagram of a terminal device having a second opening on a circuit board according to a second embodiment of the present application.
  • FIG. 6 is a partial structural schematic diagram of a terminal device having a third opening on a circuit board according to a third embodiment of the present application.
  • FIG. 7 is a schematic partial structural diagram of a terminal device with a third opening provided in a third embodiment of the present application.
  • FIG. 8 is a partial structural schematic diagram of a terminal device having a fourth opening on a circuit board according to a fourth embodiment of the present application.
  • connection used in the specification and claims of the present application is not limited to physical or mechanical connection, no matter it is direct or indirect. of. "Up”, “Down”, “Above”, “Bottom”, “Left”, “Right” and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship is also corresponding Change.
  • Some embodiments of the present application provide a terminal device, where the terminal device includes a component and a circuit board.
  • the circuit board includes a circuit substrate and a solder resist layer
  • the circuit substrate includes a dielectric layer and a circuit layer stacked with the dielectric layer. Openings with different depths are provided on the circuit board according to actual needs, and at least part of the components are accommodated in the openings or arranged correspondingly to the openings.
  • the installation height of the components and the circuit board is reduced without affecting the performance of the components and the circuit board.
  • the installation height in this application refers to the height of the components and the circuit board after they are mounted along the stacking direction of the components and the circuit board, and in some embodiments, includes the distance between the components and the circuit board.
  • an embodiment of the present application provides a terminal device 100', such as a mobile phone, a tablet computer, etc., and the terminal devices 100' such as a mobile phone and a tablet computer tend to be miniaturized.
  • the inventors of the present application have found that the circuit board 20' in terminal devices 100' such as mobile phones and tablet computers, the components 10' (such as lens modules) installed on the surface of the circuit board 20', and the decorative parts 30' that cover the components 10' are the most influential factors. It is one of the important factors influencing the installation height of terminal equipment 100 ′ such as mobile phones and tablet computers. Due to the large size of the lens module, a convex portion 31 ′ is designed on the decorative part 30 ′ of the actual terminal device 100 ′. In consideration of the aesthetics of the terminal device 100 ′, the size of the convex portion 31 ′ should be as small as possible. , which forms a contradiction with the performance requirements of the lens module.
  • the embodiment of the present application provides a terminal device 100 .
  • the terminal device 100 includes a component 10 and a circuit board 20 . At least part of the component 10 is embedded in the circuit board 20 .
  • the terminal device 100 is a product having at least a circuit board 20 and components 10 and the components 10 are disposed on the circuit board 20 .
  • the terminal device 100 includes but is not limited to a mobile phone, a tablet computer, a camera, a video camera, a monitor, and the like.
  • Component 10 can be the component 10 that is electrically connected with circuit board 20, such as lens module, SIM (Subscriber Identity Module, Subscriber Identity Module) deck etc.; It can also be the component 10 that is insulated and connected with circuit board 20, such as screw washer , nuts (such as surface mount nuts), etc. The component 10 is insulated from adjacent surfaces of the circuit board 20 . Wherein, it should be noted that when the element 10 is an element 10 electrically connected to the circuit board 20, the element 10 can be in contact with the circuit board 20, and the element 10 can be connected to the circuit board 20 through a wire (not shown) arranged in other areas of the circuit board 20. The element 10 is electrically connected.
  • the terminal device 100 is a mobile phone and the component 10 is a lens module.
  • the terminal device 100 includes the component 10 and the circuit board 20.
  • the terminal device 100 may also include a decoration 30. At least part of the component 10 is accommodated in the circuit board.
  • the decoration 30 is located on the side of the component 10 facing away from the circuit board 20 and covers the component 10 . Understandably, the following features may be applied to other terminal devices 100 and other components without conflict.
  • the circuit board 20 may be one of a flexible board, a rigid board or a combination of rigid and flexible boards.
  • the circuit board 20 includes a circuit substrate 21 and a solder resist layer 23 on the surface of the circuit substrate 21 .
  • the circuit substrate 21 includes a dielectric layer 212 and a circuit layer 214 laminated with the dielectric layer 212 , at least one surface of the circuit layer 214 is exposed to the dielectric layer 212 .
  • the solder resist layer 23 covers the dielectric layer 212, and also covers the circuit layer 214 exposed to the dielectric layer 212; the solder resist layer 23 has the functions of insulating and increasing the appearance, and also has the function of preventing the circuit layer 214 from short circuiting, being oxidized and corroded .
  • the circuit substrate 21 can be a single-layer circuit substrate (see FIG. 2 ), or a multi-layer circuit substrate (please refer to FIGS. 3 and 4 ).
  • the number of layers of the circuit layer 214 of the single-layer circuit substrate is a single layer; the number of layers of the circuit layer 214 of the multilayer circuit substrate is greater than or equal to two layers, and the multilayer circuit layers 214 are arranged at intervals through the dielectric layer 212 and electrically connected to each other. connect.
  • a first opening 40 is opened on the solder resist layer 23.
  • the first opening 40 is opened on the surface of the solder resist layer 23 away from the circuit substrate 21 and is recessed toward the circuit substrate 21.
  • the first opening 40 does not penetrate the solder resist layer. twenty three.
  • the way to form the first opening 40 can be through mechanical processing, so that the solder resist layer 23 is recessed to form the first opening 40; or the circuit layer 214 is not provided in the area where the first opening 40 is located.
  • the thickness of the solder resist layer 23 in the area where the circuit layer 214 is not provided is smaller than the thickness of the surrounding solder resist layer 23 or the total thickness of the solder resist layer 23 and the circuit layer 214 , so that the solder resist layer 23 in some areas is recessed to form the first opening 40 .
  • the first opening 40 may be opened in an area on the outer surface of the circuit board 20 where there is no pad (not shown) for electrical connection, so as to prevent the electrical connection between the circuit board 20 and other components from being affected.
  • At least part of the element 10 may be disposed in the first opening 40 . That is, in some embodiments, part of the component 10 is accommodated in the first opening 40 , and another part protrudes from the circuit board 20 ; in other embodiments, the entire component 10 is accommodated in the first opening 40 . Wherein, at least part of the component 10 is accommodated in the first opening 40, so that the mounting height of the component 10 and the circuit board 20 can be reduced, and the component 10 can be effectively reduced without affecting the respective performances of the component 10 and the circuit board 20.
  • the installation height of the circuit board 20 in addition, the convex part of the decorative part 30 of the actual terminal device 100 will also be reduced, and the overall aesthetics of the terminal device 100 will also be improved.
  • the size of the reduced installation height is related to the depth of the component 10 accommodated in the first opening 40 , and in some embodiments, the reduced installation height is 0.04mm-0.05mm.
  • the first opening 40 in this embodiment does not penetrate the solder resist layer 23, since the solder resist layer 23 itself has an insulating effect, the components 10 accommodated in the first opening 40 and the circuit substrate 21 are arranged at intervals through the solder resist layer 23, It will not be directly electrically connected to the circuit substrate 21 .
  • this embodiment it is not necessary to consider whether the surface of the component 10 in direct contact with the solder resist layer 23 is conductive or not, and the electrical connection to the circuit board 21 may result in short circuit or signal loss of the circuit board 20 . That is, this embodiment improves the application scenarios of the type of component 10; in addition, the first opening 40 does not penetrate the solder resist layer 23, and the solder resist layer 23 corresponding to the area with the first opening 40 can still maintain the original solder resist layer 23 role.
  • the part of the component 10 accommodated in the first opening 40 and the solder resist layer 23 may be in contact with each other (see FIG. 2 ), or may be arranged at intervals (see FIGS. 3 and 4 ), that is, between the component 10 and the solder resist layer 23 Leave a certain distance between them.
  • the external force such as impact
  • the component 10 and the circuit board 20 The surface contact of the solder resist layer 23 of the circuit board 20 can also include other surfaces, such as the component 10 side.
  • the component 10 and the solder resist layer 23 of the circuit board 20 are arranged at intervals, and a certain safety distance is reserved to avoid rigid contact between the component 10 and the circuit board 20.
  • a connector 25 can be connected to the non-adjacent surface of the component 10 and the circuit board 20 (that is, a surface other than the adjoining surface, such as the side of the component 10) to support the component 10, so as to avoid The component 10 is in direct contact with the circuit board 20 .
  • the component 10 when the external force will have a great impact on the performance of the component 10, when the surface adjacent to the component 10 and the circuit board 20 is made of a material with a cushioning effect (such as an elastic material, not shown in the figure), the component 10 will also It may be in direct contact with the solder resist layer 23 .
  • the part of the component 10 accommodated in the first opening 40 is spaced from the solder resist layer 23, and the component 10 is connected to the circuit board 20 through the connector 25 installed on the non-adjacent surface of the component 10 to support the component 10.
  • the connector 25 has the functions of reducing impact and improving positioning accuracy.
  • the connecting piece 25 does not increase the installation height between the component 10 and the circuit board 20 .
  • the connecting member 25 includes but is not limited to brackets, glue, etc., and the connecting member 25 is not limited to connecting the element 10 and the circuit board 20.
  • the element 10 can be adhered to the decoration 30 by glue. superior.
  • the component 10 includes a body 11 and a protrusion 13 , the protrusion 13 is connected to the body 11 and protrudes toward the first opening 40 , and the protrusion 13 is accommodated in the first opening 40 .
  • the protrusion 13 when the element 10 is a lens module, the protrusion 13 has a sub-element 131, the existence of the sub-element 131 causes the local area of the lens module to be thicker, such as sensors, Lens modules, voice coil motors, Hall devices, etc.
  • the protrusion 13 is accommodated in the first opening 40 , and the body 11 is located outside the first opening 40 , thereby reducing the installation height of the component 10 and the circuit board 20 , without additional installation height due to the existence of the protrusion 13 .
  • the shape of the first opening 40 can also be stepped.
  • the first opening 40 may include a first sub-opening 41 and a second sub-opening 43 , and the first sub-opening 41 communicates with the second sub-opening 43 .
  • the depth of the first sub-opening 41 is greater than the depth of the second sub-opening 43, that is, the first sub-opening 41 is located on the side close to the circuit substrate 21, and the second sub-opening 43 is located away from the circuit board.
  • the structure of the first opening 40 can be designed according to the shape of the component 10 , so as to further reduce the installation height of the component 10 and the circuit board 20 .
  • the second embodiment of the present application provides a terminal device 100 a, including a component 10 and a circuit board 20 .
  • the types of the components 10 and the circuit board 20 in the second embodiment are roughly the same as those in the first embodiment, the main difference is that: the circuit board 20 is provided with a second opening 50, and the second opening 50 penetrates the solder resist layer 23 but is not provided.
  • the second opening 50 only penetrates the solder resist layer 23 , and at least part of the component 10 is accommodated in the second opening 50 .
  • the second opening 50 penetrates the solder resist layer 23 , which can further increase the depth of the component 10 accommodated in the circuit board 20 , thereby further reducing the installation height of the component 10 and the circuit board 20 .
  • the surface of the circuit substrate 21 exposed to the second opening 50 can be a dielectric layer 212 or a circuit layer 214, but it is necessary to meet the insulation connection between the component 10 and the circuit layer 214 exposed to the second opening 50, and the surface of the component 10 can be used as Insulation material, component 10 and circuit layer 214 are arranged at intervals, etc., and the circuit layer 214 exposed to the second opening 50 can also be formed as an "island", that is, it is not electrically connected with other circuit layers 214 to realize the component 10 and circuit layer 214 exposed to the second opening 50.
  • the circuit layers 214 of the two openings 50 are insulated and connected. Wherein, the second opening 50 preferably does not expose the wiring layer 214 to prevent the wiring layer 214 exposed to the second opening 50 from being oxidized or corroded.
  • the method of forming the second opening 50 may be machining, or not provide the solder resist layer 23 in a local area. Specifically, in the process of processing the circuit board 20, before the solder resist layer 23 is formed on the surface of the circuit substrate 21, the silk screen used for forming the solder resist layer 23 may be partially coated with The ink used to form the solder resist layer 23 is applied, and the ink is applied to other areas, so as to form the second opening 50 in a specific area, without adding other processes and increasing the production cost due to the formation of the second opening 50 . That is, the installation height of the workpiece and the circuit board 20 can be reduced at a lower cost.
  • the element 10 may also include a body 11 and a protrusion 13 , and the installation method may be the same as that of the first embodiment; the second opening 50 may also be stepped, which will not be repeated here.
  • the third embodiment of the present application provides a terminal device 100 b, including a component 10 and a circuit board 20 .
  • the types of the components 10 and the circuit board 20 in the third embodiment are roughly the same as those in the first embodiment, the main difference is that: the circuit board 20 is provided with a third opening 60, and the third opening 60 penetrates the solder resist layer 23 and part of the circuit substrate 21 , the surface of the dielectric layer 212 or the circuit layer 214 is exposed to the third opening 60 , and at least part of the component 10 is accommodated in the third opening 60 .
  • the surface of the dielectric layer 212 is exposed to the third opening 60 .
  • the circuit substrate 21 of the circuit board 20 is a multilayer circuit substrate.
  • the third opening 60 penetrates through the solder resist layer 23 and the circuit layer 214 to expose the dielectric layer 212 .
  • the dielectric layer 212 of the same layer may only penetrate a part, and another part of the dielectric layer 212 does not penetrate, so that the dielectric layer 212 is exposed to the third opening 60 .
  • the components accommodated in the third opening 60 may be in contact with or spaced apart from the surface of the dielectric layer 212 exposed in the third opening 60 .
  • the component 10 accommodated in the third opening 60 is the same as that in the first embodiment, and it is not necessary to consider whether the surface of the component 10 and the solder resist layer 23 directly contacting is conductive or not.
  • the circuit board 21 is then electrically connected to cause a short circuit or signal loss on the circuit board 20 .
  • the third opening 60 preferably does not expose the wiring layer 214 to prevent the wiring layer 214 exposed to the third opening 60 from being oxidized or corroded.
  • the surface of the circuit layer 214 is exposed to the third opening 60 .
  • the third opening 60 penetrates through the solder resist layer 23 , part of the circuit layer 214 , and part of the dielectric layer 212 to expose the circuit layer 214 .
  • the opening 60 penetrates the solder resist layer, a circuit layer and a dielectric layer to expose the circuit lines.
  • the components accommodated in the third opening 60 may be in contact with or spaced apart from the surface of the circuit layer 214 exposed in the third opening 60 .
  • the component 10 received in the third opening 60 is insulated and connected to the circuit layer 214 exposed in the third opening 60 .
  • the surface of the component 10 is made of insulating material, and the component 10 and the circuit layer 214 are arranged at intervals, etc., and the circuit layer 214 exposed to the third opening 60 can also be formed as an "island", that is, it is not electrically connected with other circuit layers 214 to realize
  • the component 10 is insulated and connected to the circuit layer 214 exposed to the third opening 60 .
  • the third opening 60 preferably does not expose the wiring layer 214 to prevent the wiring layer 214 exposed to the third opening 60 from being oxidized or corroded.
  • the third opening 60 further penetrates the dielectric layer 212 .
  • the penetration depth of the third opening 60 at least needs to ensure that the circuit board 20 has at least one circuit layer 214 in the projection area corresponding to the third opening 60 , that is, at least one circuit layer 214 is not penetrated by the third opening 60 .
  • the inventors of the present application found that when the third opening 60 runs through all the circuit layers 214, it will affect the routing of the circuit layer 214 on the side of the circuit board 20 away from the component 10, reducing the area of the circuit layer 214; When the circuit layer 214 on the side of the board 20 away from the component 10 needs to be electrically connected to other components (such as capacitors, inductors, chips, sensors, etc.), these components 10 need to be moved to other positions, resulting in the need to reposition the components 10 in the terminal device 100b. layout, which increases the cost.
  • the element 10 may also include a body 11 and a protrusion 13 , and the installation method may be the same as that of the first embodiment, which will not be repeated here.
  • the third opening 60 can also be stepped.
  • the step of the third opening 60 can be consistent with the first embodiment or the second embodiment, and can be located on the solder resist layer 23 or on the circuit substrate 21 .
  • the second sub-opening 43 a penetrates the solder resist layer 23
  • the first sub-opening 41 a penetrates the solder resist layer 23 , part of the dielectric layer 212 and part of the circuit layer 214 .
  • the stepped shape can be set according to the shape of the element 10 .
  • the fourth embodiment of the present application provides a terminal device 100c, including a component 10 and a circuit board 20 .
  • the type of the component 10 and the circuit board 20 in the fourth embodiment is substantially the same as that of the first embodiment, the main difference is that: the circuit board 20 is provided with a fourth opening 70, and the fourth opening 70 is recessed inward on the surface facing the component 10 , at least part of the element 10 is disposed corresponding to the fourth opening 70 .
  • the part of the element 10 corresponding to the fourth opening 70 is provided with a sub-element 131a, and the sub-element 131a is an element that is relatively sensitive to external force, such as a Hall device.
  • the area with the sub-component 131a is arranged corresponding to the fourth opening 70 , which can make up for at least part of the safety distance between the component 10 and the circuit board 20 , thereby reducing the installation height of the component 10 and the circuit board 20 .
  • the depth of the fourth opening 70 can be set on part of the solder resist layer 23 as in the first embodiment; it can penetrate the solder resist layer 23 but not be arranged on the circuit substrate 21 as in the second embodiment; it can also be as in the third embodiment For example, it penetrates the solder resist layer 23 and part of the circuit substrate 21 . Refer to the first embodiment, the second embodiment, and the third embodiment for specific setting methods, which will not be repeated here.
  • openings (such as the first opening, second opening, third opening, fourth opening, etc.) It can reduce the installation height of the components and the circuit board; or when a sufficient safety distance needs to be reserved between part of the component area and the circuit board, the opening corresponds to this part of the area to make up for the above safety distance without affecting the components and the circuit board. Under the premise of improving performance, the installation height of components and circuit boards can also be reduced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

一种终端设备，终端设备包括元件以及电路板。电路板包括线路基板以及防焊层，线路基板包括介质层以及与介质层层叠设置的线路层。根据实际需要在电路板上开设不同深度的开口，将元件的至少部分容置于开口中或者与开口对应设置。在不影响元件以及电路板性能的前提下减小元件与电路板的安装高度。

Description

终端设备
相关申请的交叉引用
本申请要求在2021年6月30日提交中国专利局、申请号为202121471478.4、申请名称为“终端设备”的中国专利的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端技术领域，尤其涉及一种终端设备。
背景技术
体积小、性能高是目前用户对终端设备追求的重要指标。然而，一些元件的体积大小对其性能优劣具有较大影响，从而导致终端设备的体积小与性能高之间具有一定的矛盾。
发明内容
有鉴于此，有必要提供一种在不降低性能的前提下降低安装高度的终端设备。
一种终端设备，包括元件以及电路板，电路板包括线路基板以及防焊层，防焊层位于线路基板的表面；其中，电路板包括第一开口，第一开口在防焊层背离线路基板的表面凹陷，元件的至少部分容置于第一开口中。
上述设计中，元件的至少部分容置于第一开口中，在没有影响元件与电路板性能的前提下，即可减小元件与电路板之间的安装高度。另外，第一开口未贯穿防焊层，无需考虑元件与防焊层直接接触的表面是否具有导电性而与线路基板后因电连接导致电路板短路或者信号损失等结果，提高了元件类型的适用场景；同时，防焊层依然能够保持原有的作用。
在一种可能的设计中，元件容置于第一开口中的部分与防焊层接触。
上述设计中，可以最大限度减小元件与电路板的安装高度。
在一种可能的设计中，元件容置于第一开口中的部分与防焊层间隔设置。
上述设计中，在能够减小元件的电路板的安装高度的前提下，防止外力作用时，元件与电路板刚性接触而影响元件的性能。
在一种可能的设计中，终端设备还包括连接件，连接件连接元件与电路板的非邻接面。
上述设计中，将元件与电路板间隔设置，防止外力作用时，元件与电路板刚性接触而影响元件的性能。
在一种可能的设计中，元件为镜头模组、SIM卡座、螺丝垫片、螺母中的一种。
上述设计中，可以使用于多种对于需要减小安装高度的场景。
在一种可能的设计中，元件包括本体以及与本体连接的凸起，凸起容置于第一开口中，本体位于第一开口外。
上述设计中，将凸起容置于第一开口中，降低元件与电路板的安装高度，不会因为凸起的存在而额外增加安装高度。
在一种可能的设计中，元件包括本体以及与本体连接的凸起；第一开口包括第一子开口与第二子开口，第一子开口与第二子开口连通；凸起容置于第一子开口中，本体的至少部分容置于第二子开口中。
上述设计中，可以根据元件的外形设计第一开口的结构，从而更进一步地减小元件与电路板的安装高度。
在一种可能的设计中，元件为镜头模组，凸起中具有子元件，子元件为传感器、透镜模组、音圈马达、霍尔器件中的至少一种。
一种终端设备，终端设备包括元件以及电路板；电路板包括线路基板以及防焊层；线路基板包括介质层以及与介质层层叠设置的线路层，防焊层位于线路基板的表面；其中，电路板包括第二开口，第二开口贯穿防焊层但未设置于所述线路基板上，元件的至少部分容置于第二开口中。
上述设计中，第二开口贯穿防焊层，能够进一步增加元件容置于电路板中的深度，从而进一步减小元件与电路板的安装高度。
在一种可能的设计中，元件容置于第二开口中的部分与线路基板接触。
上述设计中，可以最大限度减小元件与电路板的安装高度。
在一种可能的设计中，元件容置于第二开口中的部分与线路基板间隔设置。
上述设计中，在能够减小元件的电路板的安装高度的前提下，防止外力作用时，元件与电路板刚性接触而影响元件的性能。
在一种可能的设计中，终端设备还包括连接件，连接件连接元件与电路板的非邻接面。
上述设计中，将元件与电路板间隔设置，防止外力作用时，元件与电路板刚性接触而影响元件的性能。
在一种可能的设计中，元件为镜头模组、SIM卡座、螺丝垫片、螺母中的一种。
上述设计中，可以使用于多种对于需要减小安装高度的场景。
在一种可能的设计中，元件包括本体以及与本体连接的凸起，凸起容置于第二开口中，本体位于第二开口外。
上述设计中，将凸起容置于第二开口中，降低元件与电路板的安装高度，不会因为凸起的存在而额外增加安装高度。
在一种可能的设计中，元件包括本体以及与本体连接的凸起，第二开口包括第一子开口与第二子开口，第一子开口与第二子开口连通；凸起容置于第一子开口中，本体的至少部分容置于第二子开口中。
上述设计中，可以根据元件的外形设计第二开口的结构，从而更进一步地减小元件与电路板的安装高度。
在一种可能的设计中，元件为镜头模组，凸起中具有子元件，子元件为传感器、透镜模组、音圈马达、霍尔器件中的至少一种。
一种终端设备，终端设备包括元件以及电路板，电路板包括线路基板以及防焊层，线路基板包括介质层以及与介质层层叠设置的线路层，线路层的层数大于两层，防焊层位于线路基板的表面；其中，电路板包括第三开口，第三开口贯穿防焊层以及线路基板，电路板在第三开口的投影区域内至少有一层线路层，元件的至少部分容置于第三开口中。
上述设计中，第三开口贯穿防焊层以及部分线路层，能够进一步增加元件容置于电路板中的深度，从而进一步减小元件与电路板的安装高度；另外，第三开口并未贯穿所有的线路层，不会影响电路板背离元件一侧的线路层的走线，也就不会对电路板背离元件一侧的线路层上需要电连接的其他元件的位置产生影响。
在一种可能的设计中，所述介质层暴露于所述第三开口，所述元件容置于所述第三开口中的部分与所述介质层接触。
上述设计中，可以最大限度减小元件与电路板的安装高度。
在一种可能的设计中，所述介质层暴露于所述第三开口，所述元件容置于所述第三开口中的部分与所述介质层间隔设置。
上述设计中，在能够减小元件的电路板的安装高度的前提下，防止外力作用时，元件与电路板刚性接触而影响元件的性能。
在一种可能的设计中，所述线路层暴露于所述第三开口，所述元件容置于所述第三开口中的部分与所述线路层接触。
上述设计中，可以最大限度减小元件与电路板的安装高度。
在一种可能的设计中，所述线路层暴露于所述第三开口，所述元件容置于所述第三开口中的部分与所述线路层间隔设置。
上述设计中，在能够减小元件的电路板的安装高度的前提下，防止外力作用时，元件与电路板刚性接触而影响元件的性能。
在一种可能的设计中，终端设备还包括连接件，连接件连接元件与电路板的非邻接面。
上述设计中，将元件与电路板间隔设置，防止外力作用时，元件与电路板刚性接触而影响元件的性能。
在一种可能的设计中，元件为镜头模组、SIM卡座、螺丝垫片、螺母中的一种。
上述设计中，可以使用于多种对于需要减小安装高度的场景。
在一种可能的设计中，元件包括本体以及与本体连接的凸起，凸起容置于第三开口中，本体位于第三开口外。
上述设计中，将凸起容置于第三开口中，降低元件与电路板的安装高度，不会因为凸起的存在而额外增加安装高度。
在一种可能的设计中，元件包括本体以及与本体连接的凸起，第三开口包括第一子开口与第二子开口，第一子开口与第二子开口连通；凸起容置于第一子开口中，本体的至少部分容置于第二子开口中。
上述设计中，可以根据元件的外形设计第三开口的结构，从而更进一步地减小元件与电路板的安装高度。
在一种可能的设计中，元件为镜头模组，凸起中具有子元件，子元件为传感器、透镜模组、音圈马达、霍尔器件中的至少一种。
一种终端设备，包括元件以及电路板，其中，电路板包括第四开口，第四开口在电路板朝向元件的表面向内凹陷，元件的至少部分与第四开口对应设置。
上述设计中，弥补元件与电路板需要预留的安全距离，从而减小元件与电路板的安装高度。
在一种可能的设计中，元件与四开口对应的区域设置有子元件，子元件为霍尔元件。
上述设计中，由于霍尔元件对外力作用较为敏感的元件，元件与电路板之间需要预留一定的安全距离，通过设置第四开口，可以弥补至少部分安全距离，从而减小元件与电路板的安装高度。
在一种可能的设计中，所述电路板包括线路基板以及位于所述线路基板表面的防焊层；所述第四开口在所述防焊层背离所述线路基板的表面凹陷。
上述设计中，弥补元件与电路板需要预留的安全距离，从而减小元件与电路板的安装高度。
在一种可能的设计中，所述电路板包括线路基板以及位于所述线路基板表面的防焊层；所述第四开口贯穿所述防焊层但未设置于所述线路基板上。
上述设计中，进一步弥补元件与电路板需要预留的安全距离，从而减小元件与电路板的安装高度。
在一种可能的设计中，所述电路板包括线路基板以及位于所述线路基板表面的防焊层，所述线路基板包括介质层以及与所述介质层层叠设置的线路层，所述线路层的层数大于两层；所述第四开口贯穿所述防焊层以及部分所述线路基板，所述电路板在所述第四开口的投影区域内至少有一层所述线路层。
上述设计中，更进一步弥补元件与电路板需要预留的安全距离，从而减小元件与电路板的安装高度。
附图说明
图1为本申请一实施例提供的终端设备的部分结构示意图。
图2为本申请第一实施例提供的电路板上具有第一开口的终端设备的部分结构示意图。
图3为本申请第一实施例提供的元件具有凸起的终端设备的部分结构示意图。
图4为本申请第一实施例提供的第一开口为台阶状的终端设备的部分结构示意图。
图5为本申请第二实施例提供的电路板上具有第二开口的终端设备的部分结构示意图。
图6为本申请第三实施例提供的电路板上具有第三开口的终端设备的部分结构示意图。
图7为本申请第三实施例提供的第三开口为台阶状的终端设备的部分结构示意图。
图8为本申请第四实施例提供的电路板上具有第四开口的终端设备的部分结构示意图。
主要元件符号说明
终端设备 100、100a、100b、100c、100’
元件 10、10’
本体 11
凸起 13
子元件 131、131a
电路板 20、20’
线路基板 21
介质层 212
线路层 214
防焊层 23
连接件 25
装饰件 30、30’
凸部 31’
第一开口 40
第一子开口 41、41a
第二子开口 43、43a
第二开口 50
第三开口 60
第四开口 70
宽度 W1、W2
如下具体实施方式将结合上述附图进一步说明本申请。
具体实施方式
为了能够更清楚地理解本申请的上述目的、特征和优点，下面结合附图和具体实施方式对本申请进行详细描述。需要说明的是，在不冲突的情况下，本申请的实施方式及实施方式中的特征可以相互组合。在下面的描述中阐述了很多具体细节以便于充分理解本申请，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本申请。本文所使用的术语“和/或”包括一个或多个相关的所列项目的所有的和任意的组合。
在本申请的各实施例中，为了便于描述而非限制本申请，本申请专利申请说明书以及权利要求书中使用的术语“连接”并非限定于物理的或者机械的连接，不管是直接的还是间接的。“上”、“下”、“上方”、“下方”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
本申请一些实施方式提供一种终端设备，终端设备包括元件以及电路板。电路板包括线路基板以及防焊层，线路基板包括介质层以及与介质层层叠设置的线路层。根据实际需要在电路板上开设不同深度的开口，将元件的至少部分容置于开口中或者与开口对应设置。
上述设计中，在不影响元件以及电路板性能的前提下减小元件与电路板的安装高度。
其中，本申请中的安装高度是指沿元件与电路板的叠加方向，元件与电路板安装后的高度，在一些实施例中，包括元件与电路板之间间隔的距离。
下面结合附图，对本申请的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1，本申请一实施例提供一种终端设备100’，例如移动电话、平板电脑等，移动电话、平板电脑等终端设备100’趋向于小型化发展。本申请发明人发现，手机、平板电脑等终端设备100’中电路板20’、安装于电路板20’表面的元件10’(如镜头模组)以及覆盖元件10’的装饰件30’是影响手机、平板电脑等终端设备100’的安装高度的重要影响因素之一。由于镜头模组的体积较大，实际的终端设备100’的装饰件30’上会设计一凸部31’，出于对终端设备100’美观性考虑，凸部31’的尺寸要尽量做小，这就与镜头模组的性能需求形成了矛盾。
第一实施例
请参阅图2至图4，本申请实施例提供一种终端设备100，终端设备100包括元件10以及电路板20，元件10的至少部分埋设于电路板20中。终端设备100为至少具有电路板20以及元件10且元件10设置于电路板20上的产品，终端设备100包括但不限于移动电话、平板电脑、照相机、摄像机、监控器等。
元件10可以是与电路板20电连接的元件10，例如镜头模组、SIM(Subscriber Identity Module，用户识别模块)卡座等；也可以是与电路板20绝缘连接的元件10，例如螺丝垫片、螺母(例如表贴螺母)等。元件10与电路板20的相邻接的表面之间绝缘。其中，需要说明的是，当元件10为与电路板20电连接的元件10，元件10可以与电路板20相接触，元件10可以通过设置于电路板20其他区域的导线(图未示)与元件10进行电连接。
以下以终端设备100为一手机、元件10为镜头模组为例进行说明，终端设备100包括元件10以及电路板20，终端设备100还可以包括装饰件30，元件10的至少部分容置于电路板20中，装饰件30位于元件10背离电路板20的一侧并覆盖元件10。可以理解地，在不冲突的情况下，以下特征可以适用于其他终端设备100以及其他元件。
电路板20可以是软板、硬板或者软硬结合板中的一种。
请再次参阅图2至图4，电路板20包括线路基板21以及位于线路基板21表面的防焊层23。线路基板21包括介质层212以及与介质层212层叠设置的线路层214，线路层214的至少一个表面暴露于介质层212。防焊层23覆盖介质层212，还一并覆盖暴露于介质层212的线路层214；防焊层23具有绝缘、增加美观的作用，还具有防止线路层214短路、被氧化以及被腐蚀的作用。
线路基板21可以是单层线路基板(请参阅图2)，也可以是多层线路基板(请参阅图3和图4)。单层线路基板的线路层214的层数为单层；多层线路基板的线路层214的层数大于或等于两层，多层线路层214之间通过介质层212间隔设置并相互之间电连接。
在本实施例中，防焊层23上开设有第一开口40，第一开口40开设于防焊层23背离线路基板21的表面并朝向线路基板21凹陷，第一开口40未贯穿防焊层23。形成第一开口40的方式可以通过机械加工，使得防焊层23凹陷形成第一开口40；或者是在第一开口40所在的区域未设置线路层214，在形成防焊层23的过程中，未设置线路层214的区域的防焊层23的厚度小于周围防焊层23的厚度或者防焊层23与线路层214的总厚度，使得部分区域的防焊层23凹陷形成第一开口40。其中，所述第一开口40可以开设在电路板20的外表面没有用于电连接的焊垫(图未示)的区域，以防止影响电路板20与其他元件的电连接。
元件10的至少部分可以设置于第一开口40中。即，在一些实施例中，元件10的部分容置于第一开口40中，另一部分凸伸于电路板20；在另一些 实施例中，元件10全部容置于第一开口40中。其中，元件10的至少部分容置于第一开口40中，即可减小元件10与电路板20的安装高度，在不影响元件10以及电路板20各自性能的前提下，有效减小元件10与电路板20的安装高度；另外，实际的终端设备100的装饰件30的凸部也会降低，终端设备100的整体美观性也得到提升。
减小的安装高度的大小与元件10容置于第一开口40的深度有关，在一些实施例中，减小的安装高度为0.04mm-0.05mm。
本实施例中的第一开口40未贯穿防焊层23时，由于防焊层23本身具有绝缘作用，容置于第一开口40中的元件10与线路基板21通过防焊层23间隔设置，不会与线路基板21直接电连接。则在本实施例中，可无需考虑元件10与防焊层23直接接触的表面是否具有导电性而与线路基板21后因电连接导致电路板20短路或者信号损失等结果。即，本实施例提高了元件10类型的适用场景；另外，第一开口40未贯穿防焊层23，相当于具有第一开口40的区域的防焊层23依然能够维持原有的防焊层23的作用。
元件10容置于第一开口40中的部分与防焊层23可以相互接触(请参阅图2)，也可以间隔设置(请参阅图3和图4)，即元件10与防焊层23之间预留一定的距离。其中，在一些实施例中，外力作用(例如撞击)对于元件10的性能不会产生影响或者影响较小可忽略不计时，沿元件10与电路板20叠放方向，元件10可以与电路板20的防焊层23的表面接触，以最大限度减小元件10与电路板20的安装高度，其中，元件10与电路板20的防焊层23的接触表面也还可以包括其他表面，例如元件10的侧面。在一些实施例中，外力作用对于元件10性能会产生较大影响时，元件10与电路板20的防焊层23间隔设置，预留一定的安全距离，避免元件10与电路板20刚性接触，可以在元件10与电路板20的非邻接面(即除相邻接之外的表面，例如元件10的侧面)连接一连接件25(请参阅图3和图4)支撑起元件10，以避免元件10与电路板20直接接触。在一些实施例中，外力作用对于元件10性能会产生较大影响时，元件10与电路板20相临近的表面采用具有缓冲作用的材料(例如弹性材料，图未示)时，则元件10也可以与防焊层23直接接触。
元件10容置于第一开口40中的部分与防焊层23间隔设置，元件10通过安装在元件10的非邻接面的连接件25与电路板20连接，以将元件10支撑起来，连接件25具有减小冲击、改善定位精度等作用。其中，连接件25不会增加元件10与电路板20之间的安装高度。可以理解地，连接件25包括但不限于支架、胶体等，连接件25也不仅限于连接元件10与电路板20，例如，在一些实施例中，可以通过胶体将元件10粘附于装饰件30上。
在一些实施例中，元件10包括本体11与凸起13，凸起13与本体11连接并朝向第一开口40凸伸，凸起13容置于第一开口40中。
请参阅图3和图4，在一些实施例中，元件10为镜头模组时，凸起13中具有的子元件131，子元件131的存在导致镜头模组的局部区域较厚，例 如传感器、透镜模组、音圈马达、霍尔器件等。将凸起13容置于第一开口40中，本体11位于第一开口40外，从而降低元件10与电路板20的安装高度，不会因为凸起13的存在而额外增加安装高度。
请参阅图4，在一些实施方式中，当元件10包括凸起13时，第一开口40的形状还可以呈台阶状。
具体地，第一开口40可以包括第一子开口41与第二子开口43，第一子开口41与第二子开口43连通。沿垂直于第一开口40的凹陷方向，第一子开口41的深度大于第二子开口43的深度，即第一子开口41位于靠近线路基板21的一侧，第二子开口43位于远离线路基板21的一侧；第一子开口41的宽度W 1小于第二子开口43的宽度W2，以便于凸起13容置于第一子开口41中，本体11的至少部分容置于第二子开口43中，可以根据元件10的外形设计第一开口40的结构，从而更进一步地减小元件10与电路板20的安装高度。
第二实施例
请参阅图5，本申请的第二实施例提供一种终端设备100a，包括元件10以及电路板20。第二实施例中的元件10与电路板20的类型与第一实施例大致相同，主要区别在于：电路板20上开设有第二开口50，第二开口50贯穿防焊层23但并未设置于线路基板21上，即第二开口50仅贯穿防焊层23，元件10的至少部分容置于第二开口50中。其中，第二开口50贯穿防焊层23，能够进一步增加元件10容置于电路板20中的深度，从而进一步减小元件10与电路板20的安装高度。
由于第二开口50贯穿防焊层23，则线路基板21暴露于第二开口50。暴露于第二开口50的线路基板21的表面可以为介质层212，也可以为线路层214，但需要满足元件10与暴露于第二开口50的线路层214绝缘连接，可以采用元件10表面为绝缘材料、元件10与线路层214间隔设置等方案实现，还可以将暴露于第二开口50的线路层214形成“孤岛”，即不与其他线路层214电连接以实现元件10与暴露于第二开口50的线路层214绝缘连接。其中，第二开口50优先以不暴露线路层214为宜，防止暴露于第二开口50的线路层214被氧化或腐蚀。
形成第二开口50的方式可以是机械加工，也可以是在局部区域不设置防焊层23。具体地，在加工电路板20的过程中，在线路基板21表面形成防焊层23之前，可以在需要形成第二开口50的区域局部，用于形成防焊层23所使用的丝网上不涂覆用于形成防焊层23的油墨，在其他区域涂覆油墨，从而在特定的区域形成第二开口50，不额外增加其他工序，不会因形成第二开口50而增加生产成本。即，在较低成本下即可实现减小工件与电路板20的安装高度。
可以理解地，在本实施例中，元件10也可以包括本体11与凸起13，安装方式可以同第一实施例；第二开口50也可以为台阶状，这里不再赘述。
第三实施例
请参阅图6和图7，本申请第三实施例提供一种终端设备100b，包括元件10以及电路板20。第三实施例中的元件10与电路板20的类型与第一实施例大致相同，主要区别在于：电路板20上开设有第三开口60，第三开口60贯穿防焊层23以及部分线路基板21，介质层212或者线路层214的表面暴露于第三开口60，元件10的至少部分容置于第三开口60中。
在本实施例中，介质层212的表面暴露于所述第三开口60。电路板20的线路基板21为多层线路基板。第三开口60贯穿防焊层23、线路层214以露出介质层212。在一些实施方式中还可以是同一层的介质层212仅贯穿部分，另一部分介质层212未贯穿，以使介质层212暴露于第三开口60。容置于所述第三开口60中的元件可以与暴露于第三开口60中的介质层212的表面接触或者间隔设置。由于介质层212的材质为绝缘材质，因此容置于第三开口60中的元件10同第一实施例中一致，可无需考虑元件10与防焊层23直接接触的表面是否具有导电性而与线路基板21后因电连接导致电路板20短路或者信号损失等结果。其中，第三开口60优先以不暴露线路层214为宜，防止暴露于第三开口60的线路层214被氧化或腐蚀。
在一些实施例中，线路层214的表面暴露于所述第三开口60。所述第三开口60贯穿防焊层23、部分线路层214、部分介质层212以露出线路层214。比如开口60贯穿了防焊层、一层线路层以及一层介质层以露出线路线。容置于所述第三开口60中的元件可以与暴露于第三开口60中的线路层214的表面接触或者间隔设置。容置于第三开口60中的元件10与暴露于第三开口60的线路层214绝缘连接。可以采用元件10表面为绝缘材料、元件10与线路层214间隔设置等方案实现，还可以将暴露于第三开口60的线路层214形成“孤岛”，即不与其他线路层214电连接以实现元件10与暴露于第三开口60的线路层214绝缘连接。其中，第三开口60优先以不暴露线路层214为宜，防止暴露于第三开口60的线路层214被氧化或腐蚀。
在一些实施例中，第三开口60还进一步贯穿介质层212。第三开口60的贯穿深度至少需要保证电路板20在第三开口60对应的投影区域内至少有一层线路层214，即至少有一层线路层214未被第三开口60贯穿。本申请发明人发现，当第三开口60贯穿所有的线路层214后，则影响电路板20背离元件10一侧的线路层214的走线，减小了线路层214的面积；另外，当电路板20背离元件10一侧的线路层214上需要电连接其他元件(例如电容、电感、芯片、传感器等)时，则这些元件10需要移动至其他位置，导致终端设备100b中元件10位置需要重新布局，增加了成本。
可以理解地，在本实施例中，元件10也可以包括本体11与凸起13，安装方式可以同第一实施例，这里不再赘述。
请参阅图7，第三开口60也可以为台阶状，第三开口60的台阶可以同第一实施例或第二实施例一致，位于防焊层23上，还可以是位于线路基板 21上。例如，第二子开口43a贯穿防焊层23，所述第一子开口41a贯穿防焊层23、部分介质层212以及部分线路层214。在其他实施例中，台阶状可以根据元件10的外形进行设置。
第四实施例
请参阅图8，本申请第四实施例提供一种终端设备100c，包括元件10以及电路板20。第四实施例中的元件10与电路板20的类型与第一实施例大致相同，主要区别在于：电路板20上开设有第四开口70，第四开口70在朝向元件10的表面向内凹陷，元件10的至少部分与第四开口70对应设置。
元件10与第四开口70对应的部分设置有子元件131a，子元件131a为对外力作用较为敏感的元件，例如霍尔器件。具有子元件131a的区域与第四开口70对应设置，可以弥补元件10与电路板20至少部分需要预留的安全距离，从而减小元件10与电路板20的安装高度。
第四开口70的深度可以如第一实施例中开设于部分防焊层23上；可以如第二实施例中贯穿防焊层23但并不设置于线路基板21上；还可以如第三实施例贯穿防焊层23以及部分线路基板21。具体设置方式可参第一实施例、第二实施例以及第三实施例，这里不再赘述。
上述设计中，在电路板上开设开口(例如第一开口、第二开口、第三开口、第四开口等)，将元件的部分置于开口中，既没有影响元件以及电路板的性能，又能减小元件与电路板的安装高度；或者元件部分区域需要与电路板之间预留足够的安全距离时，通过开口与该部分区域对应，弥补上述安全距离，在没有影响元件以及电路板的性能的前提下，也可以减小元件与电路板的安装高度。
以上实施方式仅用以说明本申请的技术方案而非限制，尽管参照以上较佳实施方式对本申请进行了详细说明，本领域的普通技术人员应当理解，可以对本申请的技术方案进行修改或等同替换都不应脱离本申请技术方案的精神和范围。

Claims (31)

  1. 一种终端设备，其特征在于，包括：
    元件；以及
    电路板，包括：
    线路基板；以及
    防焊层，位于所述线路基板的表面；
    其中，所述电路板包括第一开口，所述第一开口在所述防焊层背离所述线路基板的表面凹陷，所述元件的至少部分容置于所述第一开口中。
  2. 根据权利要求1所述的终端设备，其特征在于，所述元件容置于所述第一开口中的部分与所述防焊层接触。
  3. 根据权利要求1所述的终端设备，其特征在于，所述元件容置于所述第一开口中的部分与所述防焊层间隔设置。
  4. 根据权利要求3所述的终端设备，其特征在于，所述终端设备还包括连接件，所述连接件连接所述元件与所述电路板的非邻接面。
  5. 根据权利要求1所述的终端设备，其特征在于，所述元件为镜头模组、SIM卡座、螺丝垫片、螺母中的一种。
  6. 根据权利要求1所述的终端设备，其特征在于，所述元件包括本体以及与本体连接的凸起，所述凸起容置于所述第一开口中，所述本体位于所述第一开口外。
  7. 根据权利要求1所述的终端设备，其特征在于，所述元件包括本体以及与本体连接的凸起；所述第一开口包括第一子开口与第二子开口，所述第一子开口与所述第二子开口连通；所述凸起容置于所述第一子开口中，所述本体的至少部分容置于所述第二子开口中。
  8. 根据权利要求6或7所述的终端设备，其特征在于，所述元件为镜头模组，所述凸起中具有子元件，所述子元件为传感器、透镜模组、音圈马达、霍尔器件中的至少一种。
  9. 一种终端设备，其特征在于，所述终端设备包括：
    元件；以及
    电路板，包括：
    线路基板，包括介质层以及与所述介质层层叠设置的线路层；以及
    防焊层，位于所述线路基板的表面；
    其中，所述电路板包括第二开口，所述第二开口贯穿所述防焊层但未设置于所述线路基板上，所述元件的至少部分容置于所述第二开口中。
  10. 根据权利要求9所述的终端设备，其特征在于，所述元件容置于所述第二开口中的部分与所述线路基板接触。
  11. 根据权利要求9所述的终端设备，其特征在于，所述元件容置于所述第二开口中的部分与所述线路基板间隔设置。
  12. 根据权利要求11所述的终端设备，其特征在于，所述终端设备还包括连接件，所述连接件连接所述元件与所述电路板的非邻接面。
  13. 根据权利要求9所述的终端设备，其特征在于，所述元件为镜头模组、SIM卡座、螺丝垫片、螺母中的一种。
  14. 根据权利要求9所述的终端设备，其特征在于，所述元件包括本体以及与本体连接的凸起，所述凸起容置于所述第二开口中，所述本体位于所述第二开口外。
  15. 根据权利要求9所述的终端设备，其特征在于，所述元件包括本体以及与本体连接的凸起，所述第二开口包括第一子开口与第二子开口，所述第一子开口与所述第二子开口连通；所述凸起容置于所述第一子开口中，所述本体的至少部分容置于所述第二子开口中。
  16. 根据权利要求14或15所述的终端设备，其特征在于，所述元件为镜头模组，所述凸起中具有子元件，所述子元件为传感器、透镜模组、音圈马达、霍尔器件中的至少一种。
  17. 一种终端设备，其特征在于，所述终端设备包括：
    元件；以及
    电路板，包括：
    线路基板，包括介质层以及与所述介质层层叠设置的线路层，所述线路层的层数大于两层；以及
    防焊层，位于所述线路基板的表面；
    其中，所述电路板包括第三开口，所述第三开口贯穿所述防焊层以及部分所述线路基板，所述电路板在所述第三开口的投影区域内至少有一层所述线路层，所述元件的至少部分容置于所述第三开口中。
  18. 根据权利要求17所述的终端设备，其特征在于，所述介质层暴露于所述第三开口，所述元件容置于所述第三开口中的部分与所述介质层接触。
  19. 根据权利要求17所述的终端设备，其特征在于，所述介质层暴露于所述第三开口，所述元件容置于所述第三开口中的部分与所述介质层间隔设置。
  20. 根据权利要求17所述的终端设备，其特征在于，所述线路层暴露于所述第三开口，所述元件容置于所述第三开口中的部分与所述线路层接触。
  21. 根据权利要求17所述的终端设备，其特征在于，所述线路层暴露于所述第三开口，所述元件容置于所述第三开口中的部分与所述线路层间隔设置。
  22. 根据权利要求19或21所述的终端设备，其特征在于，所述终端设备还包括连接件，所述连接件连接所述元件与所述电路板的非邻接面。
  23. 根据权利要求17所述的终端设备，其特征在于，所述元件为镜头模组、SIM卡座、螺丝垫片、螺母中的一种。
  24. 根据权利要求17所述的终端设备，其特征在于，所述元件包括本体以及与本体连接的凸起，所述凸起容置于所述第三开口中，所述本体位于所述第三开口外。
  25. 根据权利要求17所述的终端设备，其特征在于，所述元件包括本体以及与本体连接的凸起，所述第三开口包括第一子开口与第二子开口，所述第一子开口与所述第二子开口连通；所述凸起容置于所述第一子开口中，所述本体的至少部分容置于所述第二子开口中。
  26. 根据权利要求24或25所述的终端设备，其特征在于，所述元件为镜头模组，所述凸起中具有子元件，所述子元件为传感器、透镜模组、音圈马达、霍尔器件中的至少一种。
  27. 一种终端设备，其特征在于，包括：
    元件；以及
    电路板：
    其中，所述电路板包括第四开口，所述第四开口在所述电路板朝向所述元件的表面向内凹陷，所述元件的至少部分与所述第四开口对应设置。
  28. 根据权利要求27所述的终端设备，其特征在于，所述元件与所述四开口对应的区域设置有子元件，所述子元件为霍尔元件。
  29. 根据权利要求27所述的终端设备，其特征在于，所述电路板包括线路基板以及位于所述线路基板表面的防焊层；所述第四开口在所述防焊层背离所述线路基板的表面凹陷。
  30. 根据权利要求27所述的终端设备，其特征在于，所述电路板包括线路基板以及位于所述线路基板表面的防焊层；所述第四开口贯穿所述防焊层但未设置于所述线路基板上。
  31. 根据权利要求27所述的终端设备，其特征在于，所述电路板包括线路基板以及位于所述线路基板表面的防焊层，所述线路基板包括介质层以及与所述介质层层叠设置的线路层，所述线路层的层数大于两层；所述第四开口贯穿所述防焊层以及部分所述线路基板，所述电路板在所述第四开口的投影区域内至少有一层所述线路层。
PCT/CN2022/072605 2021-06-30 2022-01-18 终端设备 WO2023273314A1 (zh)

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US17/756,606 US20240172367A1 (en) 2021-06-30 2022-01-18 Terminal Device
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