WO2023245565A1 - Led灯带 - Google Patents

Led灯带 Download PDF

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Publication number
WO2023245565A1
WO2023245565A1 PCT/CN2022/100852 CN2022100852W WO2023245565A1 WO 2023245565 A1 WO2023245565 A1 WO 2023245565A1 CN 2022100852 W CN2022100852 W CN 2022100852W WO 2023245565 A1 WO2023245565 A1 WO 2023245565A1
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WO
WIPO (PCT)
Prior art keywords
die
chip
bonding
pin
solid
Prior art date
Application number
PCT/CN2022/100852
Other languages
English (en)
French (fr)
Inventor
刘明剑
朱更生
吴振雷
周凯
Original Assignee
东莞市欧思科光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 东莞市欧思科光电科技有限公司 filed Critical 东莞市欧思科光电科技有限公司
Priority to CN202280002260.5A priority Critical patent/CN115428148A/zh
Priority to PCT/CN2022/100852 priority patent/WO2023245565A1/zh
Priority to US18/119,782 priority patent/US20230420421A1/en
Publication of WO2023245565A1 publication Critical patent/WO2023245565A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Definitions

  • the present application relates to the technical field of light-emitting diodes, and in particular, to an LED light strip.
  • LED Light-Emitting Diode
  • LED light strips can be made for ambient decoration.
  • the LED light strips can also be called LED light strings.
  • LED light strips on the market basically use plug-in LEDs or SMD LEDs to realize single-color or multi-color LED light strips in series. However, they cannot be controlled by a single LED and have a single lighting effect.
  • power carrier solutions can also be used at present, but fluctuations in the power supply voltage will cause data loss and limit the number of cascade points. As a result, LED light strips cannot be cascaded downwards with multiple points over long distances, thus limiting the length of the LED light strips. Therefore, it is necessary to provide a new LED light strip to solve the above problems.
  • the purpose of this application is to provide an LED light strip that is simple to make and easy to install, easy to adapt to the power supply, easy to control, and easy to adapt to the color tone of the surrounding scene, thereby improving the user experience and using it as an atmosphere light for decoration. Enhance the effect of festive atmosphere.
  • An embodiment of the present application provides an LED light strip, which includes:
  • the LED module includes at least two LED lamp beads, the at least two LED lamp beads are electrically connected to the four conductors, and the plurality of LED lamp beads are arranged in sequence along the four conductors. on and form a strip;
  • one of the four wires is a communication wire, and the other three wires are power supply wires; on the communication wire, the LED lamp beads on the strip are all connected in series; on the power supply wire, a plurality of The LED modules are connected in parallel with each other, and at least two LED lamp beads of each LED module are connected in series.
  • the LED light strips provided in the embodiments of the present application include at least four wires and multiple LED modules.
  • Each LED module includes at least two LED lamp beads.
  • the at least two LED lamp beads are electrically connected to the four wires.
  • the four One of the wires is a communication wire, and the other three wires are power supply wires.
  • Multiple LED lamp beads in each LED module are arranged on the four wires in sequence and form a strip, that is, all LED lamp beads are uniform in appearance. It is welded on four wires, but on the power supply wire, multiple LED modules are connected in parallel with each other and at least two LED lamp beads of each LED module are connected in series, but on the communication wire, the LED lights on the strip The beads are all connected in series.
  • the LED light strip adopts series-parallel power supply and series signal connection to achieve a variety of application solutions with different power supply voltages.
  • This uses a serial communication protocol to control each LED bead on the LED light strip, thereby achieving a luminous effect. It is diverse and can be adjusted at will, and is not limited by the number of cascading points and distance.
  • This LED light strip can effectively solve the difficulties and pain points of existing LED light strips, that is, it can achieve long-distance cascading, diverse lighting effects, easy control, and the power supply voltage can be adjusted arbitrarily according to needs.
  • the LED light strip can also be made using the same production process as the current leather cord lamps. It is simple to make and can improve the production efficiency of the LED light strip.
  • Figure 1 is a schematic structural diagram of an LED lamp bead provided by an embodiment of the present application.
  • Figure 2 is a schematic structural diagram of an LED lamp bead provided by an embodiment of the present application from another perspective;
  • Figure 3 is a schematic diagram of the exploded structure of an LED lamp bead provided by an embodiment of the present application.
  • 4a and 4b are schematic structural diagrams of a pin of an LED lamp bead provided by an embodiment of the present application from different perspectives;
  • FIG. 5 is a schematic structural diagram of an LED lamp bead provided by an embodiment of the present application.
  • Figure 6 is a schematic diagram of the circuit connection relationship of an LED lamp bead provided by an embodiment of the present application.
  • Figure 7 is a schematic structural diagram of a driver chip provided by an embodiment of the present application.
  • Figure 8 is a schematic structural diagram of another pin of an LED lamp bead provided by an embodiment of the present application.
  • Figure 9 is a schematic structural diagram of another pin of an LED lamp bead provided by an embodiment of the present application.
  • Figures 10a and 10b are structural schematic diagrams from different perspectives of the connection relationship between LED lamp beads and wires provided by embodiments of the present application;
  • FIG 11 is a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application.
  • Figure 12 is a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application from another perspective;
  • Figure 13 is a schematic diagram of the exploded structure of another LED lamp bead provided by the embodiment of the present application.
  • Figure 14 is a schematic structural diagram of a pin of an LED lamp bead provided by an embodiment of the present application.
  • Figures 15a and 15b are schematic diagrams of the circuit connection relationship of an LED lamp bead provided by an embodiment of the present application.
  • Figures 16a and 16b are schematic diagrams of the filling effect of the pins of the LED lamp beads provided by the embodiment of the present application.
  • Figures 16c and 16d are schematic structural diagrams of two die-bonding parts provided by embodiments of the present application.
  • Figures 17a and 17b are structural schematic diagrams from different perspectives of the connection relationship between LED lamp beads and wires provided by embodiments of the present application;
  • Figure 18 is a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application.
  • Figure 19 is a schematic diagram of the exploded structure of another LED lamp bead provided by an embodiment of the present application.
  • Figure 20 is a schematic structural diagram of a pin of an LED lamp bead provided by an embodiment of the present application.
  • Figure 21 is a schematic diagram of the circuit connection relationship of an LED lamp bead provided by an embodiment of the present application.
  • Figure 22 is a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application.
  • Figure 23 is a schematic diagram of the exploded structure of another LED lamp bead provided by the embodiment of the present application.
  • Figure 24 is a schematic structural diagram of a pin of an LED lamp bead provided by an embodiment of the present application.
  • Figure 25 is a schematic diagram of the filling effect of the pins of the LED lamp beads provided by the embodiment of the present application.
  • Figure 26 is a schematic diagram of the circuit connection relationship of an LED lamp bead provided by an embodiment of the present application.
  • Figure 27 is a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application.
  • Figure 28 is a schematic diagram of the exploded structure of another LED lamp bead provided by the embodiment of the present application.
  • Figure 29 is a schematic structural diagram of a pin of an LED lamp bead provided by an embodiment of the present application.
  • Figure 30 is a schematic diagram of the circuit connection relationship of an LED lamp bead provided by an embodiment of the present application.
  • Figure 31 is a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application.
  • Figure 32 is a schematic diagram of the exploded structure of another LED lamp bead provided by the embodiment of the present application.
  • Figure 33 is a schematic structural diagram of a pin of an LED lamp bead provided by an embodiment of the present application.
  • Figure 34 is a schematic diagram of the filling effect of the pins of the LED lamp beads provided by the embodiment of the present application.
  • Figure 35 is a schematic diagram of the circuit connection relationship of an LED lamp bead provided by an embodiment of the present application.
  • Figure 36 is a schematic structural diagram of an LED light strip provided by an embodiment of the present application.
  • Figure 37 is a schematic structural diagram of an LED light strip provided by an embodiment of the present application from another perspective;
  • Figure 38 is a schematic diagram of the circuit connection relationship of an LED light strip provided by an embodiment of the present application.
  • Figure 39 is a schematic structural diagram of another LED light strip provided by an embodiment of the present application.
  • Figure 40 is a schematic diagram of the circuit connection relationship of another LED light strip provided by an embodiment of the present application.
  • Figure 41 is a schematic structural diagram of another LED light strip provided by an embodiment of the present application.
  • Figure 42 is a schematic structural diagram of yet another LED light strip provided by an embodiment of the present application.
  • Figure 43 is a schematic structural diagram of another LED light strip from another perspective according to an embodiment of the present application.
  • Figure 44 is a schematic diagram of the circuit connection relationship of yet another LED light strip provided by an embodiment of the present application.
  • Figure 45 is a schematic structural diagram of yet another LED light strip provided by an embodiment of the present application.
  • Figure 46 is a schematic diagram of the circuit connection relationship of yet another LED light strip provided by an embodiment of the present application.
  • Figure 47 is a schematic structural diagram of yet another LED light strip provided by an embodiment of the present application.
  • Figure 48 is a schematic structural diagram of yet another LED light strip provided by an embodiment of the present application.
  • LED light strip 100.
  • LED lamp beads 10.
  • Bonding wire 11.
  • Insulating seat 110.
  • Filling resin 111. Cavity; 112.
  • Identification parts 12.
  • Light-emitting components 121.
  • Driver chip 122. Chip; 1221, green light chip; 1222, red light chip; 1223, blue light chip; 13, packaging glue; 14, pin; 1401, connection part; 1402, die solid part; 14021, chip placement part; 14022, bonding Line connection point placement part; 1403, chip mounting slot; 1404, conductive electrode; 141, first pin; 1411, first connection part; 1412, first solid die part; 142, second pin; 1421, second Connection part; 1422, second die-bonding part; 14221, first setting part; 14222, second setting part; 143, third pin; 1431, third connection part; 1432, third die-bonding part; 144.
  • LED Light-Emitting Diode
  • LED light strips can be made for ambient lighting decoration.
  • the LED light strips can also be called LED light strings or leather cord lights.
  • LED light strips on the market basically use plug-in LEDs or SMD LEDs to realize single-color or multi-color LED light strips in series. However, they cannot be controlled by a single LED and have a single lighting effect.
  • LED light strips can be used as Christmas lights.
  • Christmas lights are festive decorative lamps. Whenever the festival comes, some shopping malls, municipal streets, schools, parks, Christmas trees, shrubs, trees, etc. will be filled with LED light strings. Effectively enhance the festive atmosphere. Therefore, it is important to achieve an application solution for LED light strips that is easy to install, easy to adapt to the power supply, easy to control, consistent with the color tone of the surrounding scene, and able to achieve high-voltage transmission.
  • Plug-in LED light string There is no way to achieve miniaturization.
  • the product has a single color or a mixture of multiple luminous products. High-voltage applications are realized in series. The luminous effect is poor. It only achieves a single effect and cannot realize running lights and marquees (also known as revolving lantern) and other luminous effects.
  • the SMD LED light string can be miniaturized, it requires multiple groups of multi-color LEDs to be connected in series or parallel as necessary, attached to the leather cord light string, and then an external power controller is used, making it difficult to realize high-voltage leather cord lights.
  • the luminous effect of such LED light strips is also limited. It only achieves a single luminous effect and cannot achieve luminous effects such as running lights and marquees.
  • carrier communication can be used to achieve lighting effects such as running lights and marquees, making the lighting patterns changeable.
  • long-distance cascading cannot be achieved.
  • Each cascading point can correspond to an LED or Multiple LEDs, due to too many cascade points, are easily affected by line losses (such as long-distance resistance and power supply fluctuations) and interference (such as waveform interference from the power supply itself), so it is impossible to achieve long-distance, multi-point cascading.
  • embodiments of the present application provide a variety of LED lamp beads and an LED light strip composed of a variety of LED lamp beads.
  • the LED light strip is simple to manufacture and easy to install, easy to adapt to the power supply, easy to control, and easy to adapt to the surroundings. scene tones, while also enabling high-voltage transmission.
  • the LED light strip provided by the embodiment of the present application includes at least four wires and multiple LED modules.
  • the LED module includes at least two LED lamp beads. At least two LED lamp beads are electrically connected to four wires, and multiple LED lamp beads are arranged on the four wires in sequence to form a strip. Therefore, in appearance, multiple LED lamp beads Multiple LED lamp beads of the module form a long string.
  • one of the four wires is a communication wire, and the other three wires are power supply wires; on the communication wire, the LED lamp beads on the strip are all connected in series; on the power supply wire, multiple LED modules are connected in parallel with each other , at least two LED lamp beads of each LED module are connected in series.
  • the LED light strip provided in this application adopts the method of power supply series and parallel connection and signal series connection to realize a variety of application solutions with different power supply voltages. Therefore, a serial communication protocol is used to control each LED lamp bead on the LED light strip, so that it can The lighting effects are diverse and can be adjusted arbitrarily, and are not limited by the number of cascading points and distance.
  • This LED light strip can effectively solve the difficulties and pain points of existing LED light strips, that is, it can achieve long-distance cascading, diverse lighting effects, easy control, and the power supply voltage can be adjusted arbitrarily according to needs.
  • the LED light strip can also be made using the same production process as the current leather cord lamps. It is simple to make and can improve the production efficiency of the LED light strip.
  • the LED lamp beads may include one or more light-emitting chips and a driving chip for driving the light-emitting chips to emit light.
  • the light-emitting chips are LEDs, specifically PN structures.
  • the light-emitting chips are, for example, Red light chip, green light chip or blue light chip can also be called red light LED, green light LED and blue light LED.
  • the LED lamp beads may also be called LED lamps; the LED module may include one or more LED lamp beads provided in the embodiments of the present application.
  • the multiple LED lamp beads provided in the embodiment of the present application will be introduced first, and then the LED light strip made of multiple lamp beads will be introduced.
  • the multiple LED lamp beads provided in the embodiments of the present application can be divided into three major categories of LED lamp beads, which are respectively called Class A lamp beads, Class B lamp beads and Class C lamp beads.
  • Class A lamp beads and Class B lamp beads Class A lamp beads include Top-A lamp beads and Chip-A lamp beads
  • Class B lamp beads include Top-B lamp beads and Chip-A lamp beads.
  • Chip-B lamp beads, Class C includes Top-C lamp beads and Chip-C lamp beads, among which Top and Chip type lamp beads are made using different processing techniques.
  • Top-A lamp beads and Chip-A lamp beads Top-B lamp beads and Chip-B lamp beads, Top-C lamp beads and Chip-C lamp beads.
  • FIGS. 1 to 3 respectively show a schematic structural diagram of an LED lamp bead provided by an embodiment of the present application.
  • the LED lamp bead 10 includes an insulating base 11 , a light-emitting component 12 , an encapsulant 13 and at least four pairs of pins 14 .
  • the light-emitting component 12 includes a driver chip 121 and a chip 122.
  • the driver chip 121 and the chip 122 are connected through the bonding wire 101.
  • the driver chip 121 is used to drive the chip 122 to emit light.
  • the wafer 122 can be a multi-color light-emitting chip, specifically including a green light chip 1221, a red light chip 1222, and a blue light chip 1223.
  • the green light chip 1221, the red light chip 1222, and the blue light chip 1223 form a full-color light lamp. .
  • the wafer 122 may also include a single-color light-emitting chip or a combination of multiple single-color light-emitting chips, such as a blue light chip, a red light chip, or a green light chip, or a blue light chip, a red light chip, and a green light chip.
  • the combination forms a full-color light, or it can also be combined with a white light-emitting chip.
  • the white light-emitting chip can be combined with one or more light-emitting chips of blue light chip, red light chip and green light chip to form lights of multiple colors.
  • the encapsulating glue 13 covers the light-emitting component 12, specifically covering the driver chip 121 and the chip 122.
  • the encapsulating glue 13 is specifically a light-transmitting glue, such as a transparent glue or a translucent glue, so that the light emitted by the chip can be It spreads to the outside through the encapsulating glue 13.
  • the encapsulating glue 13 can also protect the light-emitting component 12 and the connecting wire between the light-emitting component 12.
  • the connecting wire can be a bonding wire, such as a gold wire, a silver wire, One of copper wire, aluminum wire and alloy wire.
  • a cavity 111 for accommodating the light-emitting component 12 is formed in the insulating base 11 .
  • the sealant 13 is filled in the cavity 111 , thereby increasing the firmness of the sealant 13 .
  • the cavity 111 can also be used as a reflective cup to reflect the light emitted by the wafer 122, so that the light emitted by the wafer 122 propagates toward the opening of the cavity 111.
  • the pin 14 includes a connecting part 1401 and a die-bonding part 1402.
  • the light-emitting component 12 is disposed on the die-bonding part 1402, and the connection part 1401 is used to electrically connect with the wire.
  • the connection part 1401 and the die-bonding part 1402 are electrically connected.
  • the connection part 1401 and the die-bonding part 1402 are integrally formed.
  • the wire is an external wire, which may specifically include a conductive wire core and an insulating layer wrapped around the conductive wire core. From the function of the wire, the wire can be divided into a power supply wire and a communication wire.
  • the connecting portions of the four pairs of pins 14 are located at the bottom of the insulating seat 11 and are arranged at intervals.
  • the connecting portions of each pair of pins 14 are respectively located on both sides of the bottom of the insulating seat 11 .
  • the die-bonding parts of the pins 14 are spaced on the top of the insulating seat 11 .
  • the die-fixing portion 1402 or the middle part of the die-fixing portion 1402 of some of the pins 14 is located at the bottom of the cavity 111 .
  • the four pairs of pins 14 are respectively the first pin 141, the second pin 142, the third pin 143, the fourth pin 144, the fifth pin 145, the sixth pin 146, the seventh pin 147 and the Eight pins 148.
  • the first pin 141 and the second pin 142 form a first pin pair
  • the third pin 143 and the fourth pin 144 form a second pin pair
  • the fifth pin 145 and the sixth pin 146 form The third pin pair
  • the seventh pin 147 and the eighth pin 148 form a fourth pin pair.
  • LED lamp beads provided in this application all include at least four pairs of pins 14. Of course, it is understandable that more pins 14 may be included, for example, five pairs of pins 14 or more may be included. Pin 14 is not limited here.
  • the first pin 141 includes a first connection part 1411 and a first die-bonding part 1412
  • the second pin 142 includes a second connection part 1421 and a second die-bonding part 1422, wherein the The first die-bonding part 1412 and the second die-bonding part 1422 can be integrally formed.
  • the integrated molding can reduce the number of solder joints between the first pin 141 and the second pin 142 and the wire.
  • the integrated die-solidating part is used for this. Electrical connection, because when the LED lamp beads are subsequently used to make LED lamp strips, the wires welded to the first pin 141 and the second pin 142 are the common positive electrode (anode) and can be connected together from beginning to end.
  • the third pin 143 includes a third connection part 1431 and a third die-bonding part 1432
  • the fourth pin 144 includes a fourth connection part 1441 and a fourth die-bonding part 1442
  • the fifth pin 145 includes a fifth connection part and a third die-bonding part 1442.
  • the sixth pin 146 includes a sixth die-bonding part.
  • the seventh pin 147 includes a seventh connection part 1471 and a seventh die-bonding part 1472.
  • the eighth pin includes an eighth connection part 1481 and an eighth die-bonding part. Crystal part 1482.
  • the die-bonding parts of each pin 14 are arranged at intervals on the insulating seat 11.
  • the main reason for the intervals is for electrical connection.
  • the first die-bonding part 1412 and the second die-bonding part 1422 they may also be integrally formed.
  • the fourth die-solid part 1442 is equipped with a driver chip 121 or a chip 122, etc.
  • the heat generated by the die-bonding part with electronic devices during operation is relatively small, so the heat generated by the die-bonding part without electronic devices is relatively small.
  • the spaced arrangement of the die-bonding parts can effectively prevent them from being bulged due to uneven heating, thereby improving the firmness of the pins 14 and the insulating seat 11 .
  • the driver chip 121 is disposed on the fourth solid chip portion 1442 of the fourth pin 144 , and the chip 122 includes a green light chip 1221 , a red light chip 1222 and Blue light chip 1223, wherein one terminal of the green light chip 1221, the red light chip 1222 and the blue light chip 1223 are all connected to the driver chip 121.
  • the driver chip 121 can also be arranged on the die-bonding portion of other pins, and the chip 122 can also include other color light-emitting chips, or less than three or more than three light-emitting chips.
  • the wafer 122 is electrically connected to the first die-bonding part 1412. Specifically, the wafer 122 can be electrically connected to the first die-bonding part 1412 through the bonding wire 101, or the wafer 122 can also be in contact with the first die-bonding part 1412 through adhesive contact. For example, the bottom of the chip 122 can be electrically connected to the first solid die portion 1412 using conductive silver glue in a thermosetting form. It should be noted that since the first die-bonding part 1412 and the second die-bonding part 1422 are integrally formed, it is also called that the chip 122 and the second die-bonding part 1422 are electrically connected.
  • the chip 122 may be electrically connected to the first die-bonding part 1412 or the second die-bonding part 1422, Electrical connection methods include bonding wires or conductive silver glue.
  • the structure of the PN junction of the wafer may be a vertical structure or a horizontal structure.
  • the bottom terminal of the wafer needs to be connected to the die-bonding part using conductive silver glue.
  • the bottom of the wafer refers to one end set on the die-bonding part, and the top terminal of the wafer needs to use bonding wires and The driver chip is electrically connected.
  • the LED lamp bead 10 provided in the above embodiment can be connected to other LED lamp beads through four wires, that is, and other lamp beads are arranged in an orderly manner on four wires. From the appearance, multiple LED lamp beads form an LED lamp string on the four wires. However, there are series and parallel connections in the circuit connection. In terms of communication connection relationship, each LED lamp bead is equal. It is easy to control in series, which makes the processing of LED light strips easier. At the same time, it can realize high-voltage power supply, long-distance cascading and luminous diversity of LED light strips. For example, it can realize lighting styles such as running lights and marquees.
  • the anode terminal VDD of the driver chip 121 is electrically connected to the first die-bonding part 1412 through the bonding wire 101 , which may also be called the second die-bond part 1422 .
  • the drive chip 121 The negative terminal GND is electrically connected to the fourth solid die part 1442 through the bonding wire 101.
  • the positive terminal VDD of the driver chip 121 can also be called the power supply terminal, and the negative terminal GND of the driver chip 121 can also be called the ground terminal.
  • the fifth die-bonding part 1452 is used to transmit control signals to the signal input terminal Din of the driver chip 121
  • the sixth die-bonded part 1462 is connected to the signal output terminal Dout of the driver chip 121 through the bonding wire 101 .
  • the first die-bonding part 1412 (or the second die-bonding part 1422 ) is provided with one or more wafers 122 ; the wafers 122 are connected to the driver chip 121 through the bonding wire 101 Electrically connected, the wafer 122 is also electrically connected to the first die-bonding part 1412 (or the second die-bonding part 1422) through the bonding wire 101, or the wafer 122 is also in adhesive contact with the first die-bonding part 1412 (or The second die-bonding part 1422) is electrically connected.
  • the driver chip 121 is used to control the light emission of the chip 122 . It should be noted that the chip 122 and the driver chip 121 can also be disposed on other die-bonding parts, and there is no limitation here.
  • the first die-bonding part 1412 is provided with a green light chip 1221 and a red light chip 1222
  • the second die-bonding part 1422 is provided with a green light chip 1221 and a red light chip 1222 .
  • the green light chip 1221 is electrically connected to the first die-bonding part 1412 and the driving chip 121 through the bonding wire 101 respectively.
  • the red light chip 1222 is connected to the driving chip 121 through the bonding wire 101, and is electrically connected to the first solid die part 1412 through adhesive contacts.
  • the first terminal of the green light chip 1221 is electrically connected to the first die solid part 1412 through the bonding wire
  • the second terminal of the green light chip 1221 is electrically connected to the G control terminal of the driver chip 121 through the bonding wire 101.
  • the first terminal and the second terminal of the green light chip 1221 correspond to the two ends of the PN junction.
  • the first terminal of the red light chip 1222 is electrically connected to the first solid die part 1412 through the conductive silver glue, and the second terminal of the red light chip 1222 is electrically connected to the R control terminal of the driver chip 121 through the bonding wire 101.
  • the first terminal and the second terminal of the red light chip 1222 correspond to the two ends of the PN junction.
  • the PN junction of the red light chip 1222 can be controlled to emit light. It should be noted that the red light chip 1222 has a PN junction with an up-and-down vertical structure.
  • the fourth die-bonding part 1442 is provided with a driver chip 121 and a wafer 122.
  • the wafer 122 is electrically connected to the first die-bonding part 1412 through a bonding wire, and may also be referred to as the second die-bonding part 1422.
  • the chip 122 is also electrically connected to the driver chip 121 through bonding wires.
  • the wafer provided in the fourth solid die part 1442 is a blue light chip 1223.
  • the first terminal of the blue light chip 1223 is connected to the blue light chip 1223 through a bonding wire.
  • the first solid die part 1412 is electrically connected, and the second terminal of the blue light chip 1223 is also electrically connected to the B control terminal of the driver chip 121 through a bonding wire.
  • the blue light chip 1223 is disposed in the fourth die-bonding part 1442 close to the first die-bonding part 1412, so that the blue-light chip 1223 is close to the wafer provided on the first die-bonding part 1412, such as green Light chip 1221 and red light chip 1222. Furthermore, under the control of the driver chip 121, three different color light-emitting chips can be used to generate different color combinations.
  • the integrated first die-bonding part 1412 and the second die-bonding part 1422 shown in FIGS. 4a and 6 can be cut off, for example, as As shown in Figures 8 and 9, due to the cross section, when the first die-bonding part 1412 and the second die-bonding part 1422 are thermally expanded after cutting, the release of internal stress can be slowed down, thereby improving the reliability of the LED lamp bead.
  • cutting the integrated first die-bonding part 1412 and the second die-bonding part 1422 specifically includes two methods as shown in FIG. 8 and FIG. 9 , and the first die-bonding part 1412 and the second die-bonding part 1422 after cutting are Two solid crystal parts 1422. Therefore, the positive terminal VDD of the driver chip 121 can be electrically connected to the cut first solid die portion 1412 through the bonding wire 101, or the positive terminal VDD of the driver chip 121 can also be electrically connected to the cut second solid die portion 1412 via the bonding wire 101.
  • the crystal part 1422 is electrically connected, as shown in FIG. 9 .
  • the LED lamp bead 10 further includes a first transition pin 14a.
  • the first transition pin 14a includes a die-fixing portion 14a1.
  • the die-fixing portion of the first transition pin 14a 14a1 is provided with a diode D1.
  • One end of the diode D1 is electrically connected to the solid die part 14a1 of the first transition pin 14a.
  • the other end of the diode D1 is electrically connected to the first die solid part 1412 through a bonding wire.
  • the die-solid part 14a1 of the pin 14a is also connected to the signal input Din terminal of the driver chip 121 through the bonding wire 101.
  • the die-solid part 14a1 of the first transition pin 14a is also electrically connected to the fifth die-solid part 1452.
  • the diode D1 may specifically be a Schottky diode. Since the signal input terminal Din of the driver chip 121 requires a reference voltage, a fast-response Schottky diode is required to pull the voltage in order to reference the signal at the signal input terminal Din, thus improving the communication quality of the LED lamp bead.
  • the die-bonding portion 14a1 of the first transition pin 14a is electrically connected to the fifth die-bonding portion 1452 through the capacitor C1. Since the LED lamp beads provided in the embodiments of the present application can be made into high-voltage powered LED lamp strips, and the control signals are correspondingly high-voltage high- and low-level signals, the capacitor C1 is used to couple the signal to improve signal transmission quality.
  • the cathode of the diode D1 is electrically connected to the die-bonding part 14a1 of the first transition pin 14a, and the anode of the diode D1 is electrically connected to the first die-bonding part 1412 through the bonding wire.
  • the diode D1 is connected to the die-solid part through adhesive connection, or through conductive silver glue.
  • the connection method between the capacitor C1 and the die-hardening part can also be adhesively connected using conductive silver glue.
  • the diode D1 and the capacitor C1 may not be disposed on the first transition pin 14a.
  • they may be disposed outside the LED lamp bead 10, that is, the same effect may be achieved by disposing an external circuit.
  • the LED lamp bead 10 may further include a second transition pin 14b, a first transition pin 14a and a second transition pin.
  • the pins 14b are provided on opposite sides of the insulating seat 11. It can be understood that the die-bonding portion of the second transition pin 14b is integrally formed with the fourth die-bonding portion 1442, or it can also be understood that the second transition pin 14b is formed from The fourth solid die portion 1442 extends out.
  • the LED lamp bead 10 after the LED lamp bead 10 is processed, it will generally be marked on the insulating seat of the LED lamp bead or in the product manual that the first transition pin 14a and the second transition pin 14b are empty pins. The pins are not electrically connected and serve as a transition or connection.
  • an identification piece 112 can also be provided on the insulating seat 11, as shown in Figures 1 and 3.
  • the identification piece is specifically In order to open a gap in the insulating seat 11, of course it can also be a logo, for example, it can be a character.
  • the first connection part 1411 of the first pin 141 and the second connection part 1421 of the second pin 142 are both used to communicate with each other.
  • the first wire 21 is electrically connected; the third connection portion 1431 of the third pin 143 and the fourth connection portion 1441 of the fourth pin 144 are both used to be electrically connected to the second wire 22; the third connection portion of the fifth pin 145
  • the fifth connection part 1451 and the sixth connection part 1461 of the sixth pin 146 are both used to electrically connect with the third wire 23
  • the seventh connection part 1471 of the seventh pin 147 and the eighth connection part of the eighth pin 148 1481 are used to electrically connect with the fourth wire 24 .
  • the first wire 21 is a positive wire
  • the second wire 22 is a positive wire
  • the third wire 23 is a communication wire
  • the fourth wire 24 is a negative wire.
  • the conductor 20 includes a conductive core 201 and an insulating layer 202 wrapping the conductive core 201.
  • the conductor 20 may also be an enameled wire or a rubber wire.
  • the portion of the conductive core 201 of the second wire 22 located between the third connection portion 1431 of the third pin 143 and the fourth connection portion 1441 of the fourth pin 144 is cut off; the third The portion of the conductive core 201 of the wire 23 located between the fifth connection portion 1451 of the fifth pin 145 and the sixth connection portion 1461 of the sixth pin 1461 is cut off.
  • the processing technology for connecting the LED lamp bead 10 and the wire 20 is specifically: removing the insulating layer 202 at the corresponding position in the wire 20 to expose the conductive wire core 201, coating the conductive wire core 201 with solder or coating the LED lamp bead 10 The connection part of the pin 14 is coated with solder, and then the pin 14 of the LED lamp bead 10 is soldered to the wire 20. It should be noted that when the LED lamp bead 10 and the wire 20 are subsequently used to make an LED lamp strip, this processing technology is also used.
  • the pin 14 of the LED lamp bead 10 is electrically connected to the wire 20, including a direct connection or an indirect connection.
  • the direct connection is, for example, a welding connection between the pin 14 of the LED lamp bead 10 and the wire 20, and the indirect connection is, for example, You can first weld a receiving board on the wire 20, and the receiving board includes a plurality of soldering feet, and then the pins 14 of the LED lamp beads 10 are welded to the soldering feet on the receiving board. The LED lamp beads 10 use the receiving board. It is electrically connected to the wire 20 .
  • a chip mounting slot 1403 may also be provided in the fourth die-bonding part 1442, and the driver chip 121 is disposed in the chip mounting slot 1403. Since the bottom of the chip installation groove 1403 is lower than other die-bonding parts, the driver chip 121 can sink into the bottom of the chip installation groove 1403. This not only ensures that the chip 122 is located above the driver chip 121, but also prevents the driver chip from blocking the chip. 122 rays of light, effectively improving the brightness of LED lamp beads.
  • the bonding wire can also reduce the position where the bonding wire is connected to the highest point of the driver chip 121, reduce the use length of the bonding wire 101, save the manufacturing cost of the LED lamp beads, and also reduce the stress release around the driver chip, thereby improving the product quality. reliability.
  • the distance between the bottom of the chip mounting groove 1403 and other die-bonding parts can be set to a preset distance.
  • the preset distance can be any size smaller than the thickness of the driver chip 121 .
  • the purpose is to allow the driver chip 121 to sink into the bottom of the cavity 111 . This not only ensures that the chip 122 is located above the driver chip 121 , but also avoids the driver chip 121 Blocking the light reaching the chip 122 effectively increases the brightness of the LED structure without increasing the manufacturing cost of the LED structure.
  • the LED packaging structure is composed of inorganic and organic materials. Since the thermal expansion coefficients of inorganic materials and organic materials are different, the stress generated by inorganic materials and organic materials is also different, which can easily cause bonding wires. 101 is overrun or broken, and this application reduces the use length of the bonding wire 101, thereby reducing the impact force on the bonding wire 101 during subsequent processes and avoiding undesirable phenomena such as overrun or breakage of the bonding wire 101.
  • Figures 11 to 13 respectively show a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application.
  • the LED lamp bead 10 includes an insulating base 11 , a light emitting component 12 , an encapsulant 13 and at least four pairs of pins 14 .
  • the insulating seat 11 can be made of plastic material.
  • the light-emitting component 12 includes a driver chip 121 and a chip 122.
  • the driver chip 121 and the chip 122 are connected through a bonding wire 101.
  • the driver chip 121 is used to drive the chip 122 to emit light.
  • the wafer 122 can be a multi-color light-emitting chip, specifically including a green light chip 1221, a red light chip 1222 and a blue light chip 1223.
  • the green light chip 1221, the red light chip 1222 and the blue light chip 1223 form a full-color light lamp. .
  • the wafer 122 may also include a single-color light-emitting chip or a combination of multiple single-color light-emitting chips, such as a blue light chip, a red light chip, or a green light chip, or a blue light chip, a red light chip, and a green light chip.
  • the combination forms a full-color light, or it can also be combined with a white light-emitting chip.
  • the white light-emitting chip can be combined with one or more light-emitting chips of blue light chip, red light chip and green light chip to form lights of multiple colors.
  • the packaging glue 13 covers the light-emitting component 12, specifically the driver chip 121 and the chip 122.
  • the packaging glue 13 is specifically a light-transmitting glue, such as a transparent glue, so that the light emitted by the chip can pass through the packaging glue. 13 propagates in other directions except the bottom.
  • the encapsulant 13 can also protect the light-emitting components 12 and the connecting lines between the light-emitting components 12.
  • the connecting lines can specifically be bonding wires.
  • bonding wire provided in the embodiment of the present application is, for example, one of gold wire, silver wire, copper wire, aluminum wire and alloy wire.
  • At least four pairs of pins 14 are fixed on the insulating base 11. Specifically, for example, a large piece of copper foil can be pressed onto the insulating base 11, and then the circuit corresponding to the pins 14 can be etched on the copper foil.
  • the circuit is specifically the connection part 1401 of the pin 14 and the die-bonding part 1402, where the connection part 1401 and the die-bonding part 1402 are electrically connected using via holes 1403.
  • the four pairs of pins 14 can be fixed to the insulating base 11 by bonding. Of course, other methods can also be used, such as molding technology.
  • the pins 14 all include the connection part 1401, but not all the pins 14 need to include the die-bonding part 1402, that is, some of the pins 14 may include the die-bonding part 1402, or all of the pins 14 may include the die-bonding part 1402.
  • the light emitting component 12 is provided on the die solid part 1402
  • the connecting part 1401 is used to electrically connect with the wire
  • the wire is an external wire, specifically it may include a conductive wire core and a conductive wire wrapped around the conductive wire core. Insulation layer, from the function of the wire, the wire can be divided into power supply wire and communication wire.
  • the four pairs of pins 14 are respectively a first pin 141, a second pin 142, a third pin 143, a fourth pin 144, a fifth pin 145, and a sixth pin.
  • 146, seventh pin 147 and eighth pin 148 are respectively a first pin 141, a second pin 142, a third pin 143, a fourth pin 144, a fifth pin 145, and a sixth pin.
  • the first pin 141 and the second pin 142 form a first pin pair
  • the third pin 143 and the fourth pin 144 form a second pin pair
  • the fifth pin 145 and the sixth pin 146 form The third pin pair
  • the seventh pin 147 and the eighth pin 148 form a fourth pin pair.
  • the connecting portions 1401 of the four pairs of pins 14 are all located at the bottom of the insulating seat 11 and are arranged at intervals.
  • the connecting portions 1401 of each pair of pins 14 are respectively located at the bottom of the insulating seat 11 .
  • the two sides are opposite to each other; accordingly, the die-bonding portions 1402 of the pins 14 are arranged at intervals on the top of the insulating seat 11 .
  • LED lamp beads provided in this application all include at least four pairs of pins 14. Of course, it is understandable that more pins 14 may be included, for example, five pairs of pins 14 or more may be included. Pin 14 is not limited here.
  • the four wires are respectively a first wire, a second wire, a third wire and a fourth wire.
  • the first wire is the positive wire and the second wire. is the positive wire
  • the third wire is the communication wire
  • the fourth wire is the negative wire.
  • the first pin pair is connected to the first conductor, that is, the connecting portions of the first pin 141 and the second pin 142 are both electrically connected to the first conductor; the second pin pair is electrically connected to the third conductor, that is, the third conductor is electrically connected to the first pin pair.
  • the connecting parts of the third pin 143 and the fourth pin 144 are both electrically connected to the third wire; the third pin pair is electrically connected to the second wire, that is, the connecting part of the fifth pin 145 and the sixth pin 146 Both are electrically connected to the second wire; the fourth pin pair is connected to the fourth wire, that is, the connecting portions of the seventh pin 147 and the eighth pin 148 are both electrically connected to the fourth wire.
  • the conductive core of the third wire is partially cut off between the connection portion of the third pin 143 and the fourth pin 144; the conductive core of the second wire is located between the fifth pin 145 and the sixth pin 146. Partially cut off between connections.
  • Figures 16a and 16b show the filling of the connection part and the die-hardening part of the pin 14.
  • the first pin 141 includes a first connection part 1411 and a first die-bonding part 1412.
  • the second pin 142 includes a second connection part 1421 and a second die-bonding part 1422.
  • the chip 122 is electrically connected to the second die-bonding part 1422.
  • the anode terminal VDD of the driver chip 121 is electrically connected to the second die-bonding part 1422 through the bonding wire 101 .
  • the third pin 143 includes a third connection part 1431 and a third die-bonding part 1432.
  • the fourth pin 144 includes a fourth connection part 1441 and a fourth die-bonding part 1442.
  • the third die-bonding part 1432 is used to provide power to the driver chip 121
  • the signal input terminal Din transmits the control signal
  • the fourth die-bonding part 1442 is connected to the signal output terminal Dout of the driver chip 121 through the bonding wire 101 .
  • the fifth pin 145 includes a fifth connection part 1451 and a fifth die-bonding part 1452.
  • the sixth pin 146 includes a sixth connection part 1461 and a sixth die-bonding part 1462.
  • the negative terminal GND of the driver chip 121 passes through the bonding wire 101 It is electrically connected to the sixth die-bonding part 1462 .
  • the seventh pin 147 includes a seventh connection portion 1471 and a seventh die-bonding portion 1472
  • the eighth pin 148 includes an eighth connection portion 1481 and an eighth die-bonding portion 1482 .
  • the first connection part 1411 and the second connection part 1421 are used for electrical connection with the first conductor
  • the third connection part 1431 and the fourth connection part 1441 are used for electrical connection with the third conductor
  • the fifth connection part 1451 and The sixth connection part 1461 is used for electrical connection with the second conductor
  • the seventh connection part 1471 and the eighth connection part 1481 are used for electrical connection with the fourth conductor.
  • the LED lamp bead 10 provided in the above embodiment can be connected to other LED lamp beads through four wires, that is, and other lamp beads are arranged in an orderly manner on four wires. From the appearance, multiple LED lamp beads form an LED lamp string on the four wires. However, there are series and parallel connections in the circuit connection. In terms of communication connection relationship, each LED lamp bead is equal. It is easy to control in series, which makes the processing of LED light strips easier. At the same time, it can realize high-voltage power supply, long-distance cascading and luminous diversity of LED light strips. For example, it can realize lighting styles such as running lights and marquees.
  • the first connecting part 1411 and the second connecting part 1421 are integrally formed, thereby facilitating electrical connection with the first conductor and increasing the reliability of the electrical connection with the first conductor.
  • the first connection part 1411 and the second connection part 1421 can also be cut off, that is, the first connection part 1411 and the second connection part 1421 are spaced apart. The spaced arrangement can effectively prevent the first connection part 1411 and the second connection part 1421 from being separated.
  • the connecting portion of the two connecting portions 1421 is arched from the insulating base 11, thereby extending the service life of the LED lamp bead.
  • the seventh pin 147 and the eighth pin 148 As shown in Figure 15a and Figure 16a, due to the die-bonding parts of the first pin 141, the seventh pin 147 and the eighth pin 148 It mainly functions to electrically connect with the connection portion located at the bottom of the insulating seat 11 using via holes, and its area at the top of the insulating seat 11 is also relatively small, so it can also be called the first pin 141 and the seventh pin. 147 and the eighth pin 148 do not include a die-bonding part.
  • driver chip 121 for the structure of the driver chip 121, reference can be made to FIG. 7. It should be noted that the driver chip 121 shown in FIG. 7 does not limit the structure of the driver chip of the present application, such as the positions of the positive terminal VDD and the negative terminal GND, and The positions of the input terminal Din and the signal output terminal Dout can vary with different driver chips. At the same time, the driver chip of the LED lamp bead provided in the following embodiments can also be understood with reference to FIG. 7 .
  • the second die-bonding part 1422 and the fifth die-bonding part 1452 are connected.
  • the second die-bonding part 1422 and the fifth die-bonding part 1452 may be integrally formed. It facilitates the subsequent use of the LED lamp bead 10 to make the electrical connection of the LED lamp strip, and at the same time improves the reliability of the power supply.
  • fewer devices can be installed. conductive electrodes for easy processing.
  • the second die-bonding portion 1422 and the fifth die-bonding portion 1452 can also be provided at intervals, that is, the integrally formed second die-bonding portion 1422 and the fifth die-bonding portion 1452 can be cut off.
  • the first die-fixing part 1412 and the second die-fixing part 1422 may also be integrally formed. Specifically, As shown in Figure 15b. Since the corresponding connecting portions of the first die-bonding part 1412 and the second die-bonding part 1422 are both connected to the first wire, it can be understood that the anode terminal VDD of the driver chip 121 can be electrically connected to the second die-bonding part 1422, Or the positive terminal VDD of the driver chip 121 may also be electrically connected to the first die-bonding part 1412 .
  • the LED lamp bead 10 includes a first transition pin 14a.
  • the first transition pin 14a includes a solid die portion 14a1.
  • the die solid portion 14a1 of the first transition pin 14a is provided with a diode D1.
  • the cathode of the diode D1 is connected to the first transition pin.
  • the die-bonding part 14a1 of 14a is electrically connected, and the anode of the diode D1 is electrically connected to the second die-bonding part 1422 through a bonding wire.
  • the signal input terminal Din of the driver chip 121 needs a reference voltage, so a fast-response Schottky diode is required to pull the voltage. In order to provide a reference for the signal at the signal input terminal Din, thereby improving the communication quality of the LED lamp beads.
  • the die-bonding portion 14a1 and the third die-bonding portion 1432 of the first transition pin 14a can also be provided through a capacitor.
  • C1 is connected, and the solid die portion 14a1 of the first transition pin 14a1 is connected to the signal input terminal Din of the driver chip 121 through a bonding wire.
  • the capacitor C1 is used to couple the signal to improve the signal transmission quality.
  • the die-bonding part 14a1 of the first transition pin 14a includes a fixed end part 14a11 and a connecting end part 14a12, and the fixed end part 14a11 and the connecting end part 14a12 are connected.
  • the fixed end 14a11 is used to set the diode D1 and the capacitor C1
  • the connection end 14a12 is used to set the bonding wire connection point, wherein the connection end 14a12 extends to be aligned with the sixth die-hardening part 1462, and the driver chip 121 is set on In the sixth solid chip part 1462, the signal input terminal Din of the driver chip 121 is electrically connected to the connection terminal 14a11 through a bonding wire.
  • the signal input terminal Din of the driver chip 121 is connected to the connection terminal 14a12 through a bonding wire.
  • Merge line connection point connection This design can save the length of the bonding wire and prevent the bonding wire from being too long and easy to break, thus improving the service life of the product.
  • the LED lamp bead 10 may further include a second transition pin (not shown), and the second transition pin and the first transition pin are disposed on opposite sides of the insulating base 11 .
  • the second transition pin may not be set.
  • each pin 14 A conductive electrode 1404 is also provided on the die-bonding part of The third die-bonding portion 1432, the die-bonding portion 14a1 of the first transition pin 14a, and the sixth die-bonding portion 1462 all include conductive electrodes 1404.
  • the second die-bonding part 1422 is provided with one or more wafers 122 , and the wafers 122 are electrically connected to the driver chip 121 through the bonding wires 101 .
  • the wafer 122 is also electrically connected to the second die-bonding part 1422 through the bonding wire 101, or the wafer 122 is also electrically connected to the second die-bonding part 1422 through adhesive contact, such as conductive silver glue.
  • one or more wafers 122 can also be disposed on other die-bonding parts, which is not limited here.
  • the second solid die part 1422 is provided with a green light chip 1221 and a red light chip 1222; wherein the green light chip 1221 is electrically connected to the second die solid part 1422 and the driver chip 121 respectively through the bonding wire 101. Specifically, It is connected to the G control terminal of the driving chip 121; the red light chip 1222 is connected to the driving chip 121 through the bonding wire 101, and is electrically connected to the second solid die part 1422 through the adhesive contact.
  • the second die-bonding part 1422 at least includes a first setting part 14221 and a second setting part 14222 arranged at intervals.
  • the first setting part 14221 is used to set the green
  • the second setting part of the optical chip 1221 and the red light chip 1222 is used to set bonding wire connection points. Since the bottom of the blue light chip and the green light chip are connected to the die-hardening part through the adhesive, the adhesive is an organic substance, and the internal stress is released differently when it is heated and expands, which can easily cause the surrounding secondary solder joints (bonds). delamination (also known as delamination) of the bonded wire connection point), which in turn causes electrical connection failure.
  • the spaced arrangement of the first setting portion 14221 and the second setting portion 14222 can effectively block the extension of delamination and peeling, effectively protect the firmness of the solder joints, and improve the reliability of the product.
  • the fifth die-bonding part 1452 and the second die-bonding part 1422 are integrally formed. Therefore, it can also be considered that the fifth die-bonding part 1452 includes at least a first setting part 14221 and a second setting part arranged at intervals. Department 14222.
  • the fourth die-bonding part 1442 is provided with a chip 122.
  • the chip 122 is electrically connected to the second die-bonding part 1422 through the bonding wire 101.
  • the wafer 122 is also electrically connected to the driver chip 121 through the bonding wire 101. sexual connection. Specifically, as shown in FIG.
  • the wafer 122 provided in the fourth die-bonding part 1442 is a blue-ray chip 1223
  • the blue-ray chip 1223 is provided in the fourth die-bonding part 1442 at a position close to the second die-bonding part 1422, so that the blue light chip 1223 1223 is close to the chip disposed on the second die-bonding part 1422, which not only saves bonding wires, but also facilitates the combination of different colors, which not only reduces product costs, improves product reliability, but also improves the LED lamp beads.
  • Composite luminous color mixing effect is not only saves bonding wires, but also facilitates the combination of different colors, which not only reduces product costs, improves product reliability, but also improves the LED lamp beads.
  • the driver chip 121 may be disposed on the sixth die-bonding part 1462 , and the area where the driver chip 121 is disposed in the sixth die-bonding part 1462 is located between the third die-bonding part 1432 and the fourth die-bonding part 1462 . between the crystal part 1442 and the fifth solid crystal part 1452.
  • the sixth die-bonding portion 1462 extends between the third die-bonding portion 1432, the fourth die-bonding portion 1442, and the fifth die-bonding portion 1452, thereby driving the chip 121 and other die-bonding portions. Or the distance between the wafers on other die-bonding parts, thereby facilitating connection through bonding wires, and also improving the reliability and life of the product.
  • the sixth die-bonding part 1462 may be configured to include first placing parts 14621 arranged at intervals. It is connected with the second placing part 14622, the first placing part 14621 and the second placing part 14622. Specifically, it can be understood that the first placing part 14621 and the second placing part 14622 are integrated designs.
  • the first placement part 14621 is used to set the driver chip 121
  • the second placement part 14622 is used to set the bonding wire connection point
  • the part between the first placement part 14621 and the second placement part 14622 is a spacing area, so it can also Preventing the heat generation of the driver chip 121 from causing peeling of the bonding wire connection points of the second placement portion 14622 can effectively block the extension of delamination peeling, effectively protect the firmness of the solder joints, and improve the reliability of the product.
  • the fourth die-bonding part 1442 includes a wafer placement part 14021 and a bonding wire connection point placement part 14022 extending from the wafer placement part 14021.
  • the bonding wire connection point placement part 14022 extends to the spacing area.
  • the LED lamp bead 10 may also include an isolation plate 15.
  • the isolation plate 15 may be a BT (Bismaleimide Triazine) plate, which may also be called a resin substrate.
  • the isolation plate 15 may be specifically a resin substrate. It is provided at the bottom of the insulating seat 11 and is used to isolate the connection parts of each pin 14 to avoid short circuits caused by tin beads when the LED lamp beads are welded to the wires. Since the surface of the insulating seat 11 is rough, if the isolation plate 15 is not used, a short circuit will easily occur when the connecting portion of the pin 14 is welded to the wire.
  • the connecting portion and the solid die portion of each pin 14 in the LED lamp bead 10 are electrically connected using via holes, and the middle of the via holes is filled with resin, which facilitates the molding process.
  • organic glue should not penetrate into the bottom pad pins, because the via-hole ring pins of the product are connected to the surroundings, and cutting is required to obtain a single product, so that the filling resin 110 of a single product is semi-cylindrical.
  • the first pin 141 and the second pin 142 form a first pin pair and are electrically connected to the first wire 21; the third pin 143 and the fourth pin 144 form a second pin pair.
  • the pin pair is electrically connected to the third wire 23; the fifth pin 145 and the sixth pin 146 form a third pin pair and is connected to the second wire 22; the seventh pin 147 and the eighth pin 148 form The fourth pin pair is connected to the fourth wire 24 .
  • the four conductors 20 are respectively a first conductor 21, a second conductor 22, a third conductor 23 and a fourth conductor 24.
  • the first conductor 21 is a positive wire
  • the second conductor 22 is a positive wire
  • the third conductor 23 is a communication wire.
  • the fourth wire 24 is a negative wire.
  • the first connecting portion 1411 of the first pin 141 and the second connecting portion 1421 of the second pin 142 are both electrically connected to the first wire 21; the third connecting portion 1431 and the fourth connecting portion of the third pin 143 are electrically connected to each other.
  • the fourth connection portion 1441 of the pin 144 is electrically connected to the third wire 23; the fifth connection portion 1451 of the fifth pin 145 and the sixth connection portion 1461 of the sixth pin 146 are both electrically connected to the second wire 22.
  • Connection; the seventh connection portion 1471 of the seventh pin 147 and the eighth connection portion 1481 of the eighth pin 148 are both electrically connected to the fourth wire 24 .
  • the conductive core 201 of the third conductor 23 between the third connection part 1431 and the fourth connection part 1441 is cut off; the conductive core 201 of the second conductor 22 between the fifth connection part 1451 and the sixth connection part 1461 cut off.
  • the LED lamp bead 10 may also include an identification piece to indicate different LED lamp beads.
  • an identification piece 112 can be provided on the insulating base 11 to represent different LED lamp beads, so as to facilitate the subsequent use of different LED lamp beads to make LED lamp strips.
  • the identification component 112 can represent different LED lamp beads in different shapes, such as rectangles, squares, and triangles. Of course, it can also be represented by different colors and characters.
  • FIGS. 18 and 19 respectively show a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application.
  • the LED lamp bead 10 includes an insulating base 11 , a light emitting component 12 , an encapsulant 13 and at least four pairs of pins 14 .
  • the difference of the LED lamp bead 10 lies in the structural design of the die-fixing portion of at least four pairs of pins 14 and the connection relationship between the light-emitting component and the die-fixing portion of the four pairs of pins 14 .
  • the following mainly introduces the difference in detail.
  • the structure and location of the connection parts of the insulating seat 11, the light-emitting component 12, the packaging glue 13 and at least four pairs of pins 14 can all be the same as the insulating seat of the Top-A lamp bead.
  • the structures and locations of the connection portions of the light-emitting component 12, the packaging glue 13, and at least four pairs of pins 14 are the same. Of course, they can also be different, and will not be described in detail here.
  • the four pairs of pins 14 are respectively the first pin 141, the second pin 142, the third pin 143, the fourth pin 144, the fifth pin 145, the sixth pin 146, and the Seventh pin 147 and eighth pin 148.
  • the first pin 141 and the second pin 142 form a first pin pair
  • the third pin 143 and the fourth pin 144 form a second pin pair
  • the fifth pin 145 and the sixth pin 146 form The third pin pair
  • the seventh pin 147 and the eighth pin 148 form a fourth pin pair.
  • the first pin 141 includes a first connection part 1411 and a first die-bonding part 1412
  • the second pin 142 includes a second connection part 1421 and a second die-bonding part 1422.
  • the first connection The portion 1411 and the second connecting portion 1421 are used to electrically connect with the first conductor, which is the positive electrode wire.
  • the first die-bonding portion 1412 and the second die-bonding portion 1422 are spaced apart.
  • the third pin 143 includes a third connection part 1431 and a third die-bonding part 1432.
  • the fourth pin 144 includes a fourth connection part 1441 and a fourth die-bonding part 1442.
  • the positive terminal VDD of the driver chip 121 passes through the bonding wire 101 It is electrically connected to the third die-bonding part 1432.
  • the negative terminal GND of the driver chip 121 is electrically connected to the fourth die-bonding part 1442 through the bonding wire 101.
  • the chip 122 is electrically connected to the third die-bonding part 1432.
  • the chip 122 is also electrically connected to the third die-bonding part 1432.
  • the bonding wire 101 is electrically connected to the driving chip 121.
  • the third connection part 1431 and the fourth connection part 1441 are used to electrically connect with the second wire, and the second wire is located in the third connection part 1431 and the fourth connection part 1441. The part between them is cut off, and the second wire is the positive wire.
  • the fifth pin 145 includes a fifth connection portion 1451 and a fifth die-bonding portion 1452
  • the sixth pin 146 includes a sixth connection portion 1461 and a sixth die-bonding portion 1462
  • the fifth die-bonding portion 1452 is connected to the die through the bonding wire 101
  • the signal input terminal Din of the driver chip 121 is connected
  • the sixth die-bonding part 1462 is connected to the signal output terminal Dout of the driver chip 121 through the bonding wire 101
  • the fifth connection part 1451 and the sixth connection part 1461 are used to connect with the third wire.
  • the part of the third conductor located between the fifth connection part 1451 and the sixth connection part 1461 is cut off, and the third conductor is a communication conductor.
  • the seventh pin 147 includes a seventh connection part 1471 and a seventh die-bonding part 1472.
  • the eighth pin 148 includes an eighth connection part 1481 and an eighth die-bonding part 1482.
  • the seventh connection part 1471 and the eighth connection part 1481 are used for
  • the fourth wire is connected to the negative electrode line, and the seventh die-bonding part 1472 and the eighth die-bonding part 1482 are arranged at intervals. Of course, they can also be designed in an integrated manner.
  • the at least four pairs of pins 14 of the LED lamp bead 10 and the connection relationship with the light-emitting component 12 enable the LED lamp bead 10 to easily form an LED light strip.
  • the LED lamp bead 10 provided in the above embodiment can be connected to other LED lamp beads through four wires, that is, and other lamp beads are arranged in an orderly manner on four wires. From the appearance, multiple LED lamp beads form an LED lamp string on the four wires. However, there are series and parallel connections in the circuit connection. In terms of communication connection relationship, each LED lamp bead is equal. It is easy to control in series, which makes the processing of LED light strips easier. At the same time, it can realize high-voltage power supply, long-distance cascading and luminous diversity of LED light strips. For example, it can realize lighting styles such as running lights and marquees.
  • the LED lamp bead 10 further includes: a first transition pin 14a and a second transition pin 14b, wherein the die-bonding part of the second transition pin 14b is connected to the fourth die-bonding part.
  • the crystal part 1442 is integrally formed. It can also be understood that the second transition pin 14b extends from the fourth solid die part 1442 to the outside of the insulating seat, thereby forming a symmetrical structure with the first transition pin 14a, which facilitates processing.
  • the design of the first transition pin 14a can facilitate the transition if it is inconvenient to connect the electronic components in the LED lamp bead, thereby improving the convenience of electrical connection of the electronic components.
  • the third die-bonding part 1432 or the fourth die-bonding part 1442 may be provided with one or more wafers 122; the wafer 122 is electrically connected to the driver chip 121 through the bonding wire 101; the wafer 122 It is also electrically connected to the third die-bonding part 1432 through the bonding wire 101, or the wafer 122 is electrically connected to the third die-bonding part 1432 through adhesive contact. Since the third die-bonding part 1432 and the fourth die-bonding part 1442 are provided with wafers, it not only enables subsequent production of LED light strips, but also saves the length of bonding wires and improves the reliability and service life of the product.
  • the third die-bonding part 1432 may be provided with a green light chip 1221 and a red light chip 1222, and the fourth die-bonding part 1442 may be provided with a blue light chip 1223; wherein, the green light chip 1221 is provided with a key
  • the bonding wire 101 is electrically connected to the third die-bonding part 1432 and the driver chip 121 respectively, specifically to the G control terminal of the driver chip 121;
  • the red light chip 1222 is connected to the driver chip 121 through the bonding wire 101, specifically to It is electrically connected to the R control terminal of the driver chip 121, and is electrically connected to the third die-bonding part 1432 through adhesive contact, such as through conductive silver glue;
  • the blue light chip 1223 is respectively connected to the driver chip through the bonding wire 101.
  • 121 is connected to the third die solid part 1432.
  • the blue light chip 1223 is connected to the B control terminal of the driver chip 121 through the bonding wire 101.
  • the blue light chip 1223 is disposed in the fourth die attaching part 1442 at a position close to the third die attaching part 1432, so that the blue light chip 1223 is close to the wafer disposed on the third die attaching part 1432, so that the blue light chip 1223 can be better It can combine a variety of colors to make the LED lamp beads have more diverse luminous colors and more uniform luminescence. It can also save bonding wires and increase the reliability and service life of the product. It can not only reduce product costs but also improve product reliability. It also improves the composite light-emitting color mixing effect of the LED lamp beads.
  • the driver chip 121 may be disposed on the fourth die-bonding part 1442 , and of course may also be disposed on other die-bonding parts.
  • the portion of the fourth die-bonding part 1442 where the driver chip 121 is disposed is located between the third die-bonding part 1432 , the fifth die-bonding part 1452 and the sixth die-bonding part 1462 . This saves bonding wires and increases product reliability and service life.
  • a chip mounting slot 1403 may also be provided in the fourth die-bonding part 1442 , and the driver chip 121 is disposed in the chip mounting slot 1403 . Since the bottom of the chip installation groove 1403 is lower than other die-bonding parts, the driver chip 121 can sink into the bottom of the chip installation groove 1403. This not only ensures that the chip 122 is located above the driver chip 121, but also prevents the driver chip from blocking the chip. 122 rays of light, effectively improving the brightness of LED lamp beads. At the same time, it can also reduce the position where the bonding wire is connected to the highest point of the driver chip 121, reduce the use length of the bonding wire 101, and save the manufacturing cost of the LED lamp beads.
  • the distance between the bottom of the chip mounting groove 1403 and other die-bonding parts can be set to a preset distance.
  • the preset distance can be any size smaller than the thickness of the driver chip 121 .
  • the purpose is to allow the driver chip 121 to sink into the bottom of the cavity 111 . This not only ensures that the chip 122 is located above the driver chip 121 , but also avoids the driver chip 121 Blocking the light reaching the chip 122 effectively increases the brightness of the LED structure without increasing the manufacturing cost of the LED structure.
  • the LED packaging structure is composed of inorganic and organic materials. Since the thermal expansion coefficients of inorganic materials and organic materials are different, the stress generated by inorganic materials and organic materials is also different, which can easily cause bonding wires. 101 is overrun or broken, and this application reduces the use length of the bonding wire 101, thereby reducing the impact force on the bonding wire 101 during subsequent processes and avoiding undesirable phenomena such as overrun or breakage of the bonding wire 101.
  • the LED lamp bead 10 includes an insulating base 11 , a light-emitting component 12 , an encapsulant 13 and at least four pairs of pins 14 .
  • the LED lamp bead 10 differs in the structural design of the die-bonding portion of at least four pairs of pins 14 and the connection relationship between the light-emitting component and the die-bonding portion of the four pairs of pins 14 .
  • the following mainly introduces the difference in detail.
  • the structure and position of the insulating seat 11, the light-emitting component 12, the packaging glue 13 and the connection portion of at least four pairs of pins 14 can all be the same as the insulating seat 11 of the Chip-A lamp bead.
  • the structure and position of the connection parts of the light-emitting component 12, the packaging glue 13 and at least four pairs of pins 14 are the same, and of course they can be different, so details will not be described here.
  • At least four pairs of pins 14 are respectively the first pin 141, the second pin 142, the third pin 143, the fourth pin 144, the fifth pin 145, and the sixth pin. pin 146, seventh pin 147 and eighth pin 148.
  • the first pin 141 and the second pin 142 form a first pin pair
  • the third pin 143 and the fourth pin 144 form a second pin pair
  • the fifth pin 145 and the sixth pin 146 form The third pin pair
  • the seventh pin 147 and the eighth pin 148 form a fourth pin pair.
  • the connecting portions of the first pin 141 and the second pin 142 are both used for electrical connection with the first wire; the connecting portions of the third pin 143 and the fourth pin 144 are used for electrical connection with the third wire. Connection; the connection portions of the fifth pin 145 and the sixth pin 146 are both used to electrically connect with the second conductor; the connection portions of the seventh pin 147 and the eighth pin 148 are both used to electrically connect with the fourth conductor. connect.
  • the first wire is a positive wire
  • the second wire is a positive wire
  • the third wire is a communication wire
  • the fourth wire is a negative wire
  • the conductive core of the third wire is at the connection portion of the third pin 143 and the fourth pin 144
  • the conductive core of the second wire is partially cut off between the connecting portion of the fifth pin 145 and the sixth pin 146 .
  • the first pin 141 includes a first connection part 1411 and a first die-bonding part 1412.
  • the second pin 142 includes a second connection part 1421 and a second die-bonding part 1422.
  • the first connection part 1411 and The second connection part 1421 is used to electrically connect with the first conductor.
  • the first connection part 1411 and the second connection part 1421 can be arranged at intervals. Of course, they can also be designed in an integrated manner. The integrated design can increase the number of electrical connections with the first conductor. reliability.
  • the third pin 143 includes a third connection portion 1431 and a third die-bonding portion 1432
  • the fourth pin 144 includes a fourth connection portion 1441 and a fourth die-bonding portion 1442
  • the third die-bonding portion 1432 is connected with the bonding wire 101 through the bonding wire 101
  • the signal input terminal Din of the driver chip 121 is connected
  • the fourth solid die part 1442 is connected to the signal output terminal of the driver chip 121 through the bonding wire 101
  • the third connection part 1431 and the fourth connection part 1441 are used to electrically connect with the third wire.
  • the portion of the conductive core of the third wire located between the third connection part 1431 and the fourth connection part 1441 is cut off.
  • the fifth pin 145 includes a fifth connection part 1451 and a fifth die-bonding part 1452.
  • the sixth pin 146 includes a sixth connection part 1461 and a sixth die-bonding part 1462.
  • the positive terminal VDD of the driver chip 121 passes through the bonding wire 101 It is electrically connected to the fifth die-bonding part 1452.
  • the negative terminal GND of the driver chip 121 is electrically connected to the sixth die-bonding part 1462 through the bonding wire 101.
  • the chip 122 is electrically connected to the fifth die-bonding part 1452 through the bonding wire 101.
  • connection part 1451 and the sixth connection part 1461 are used to electrically connect with the second conductor, and the conductive core of the second conductor is partially switched between the fifth connection part 1451 and the sixth connection part 1461.
  • the seventh pin 147 includes a seventh connection part 1471 and a seventh die-bonding part 1472.
  • the eighth pin 148 includes an eighth connection part 1481 and an eighth die-bonding part 1482.
  • the seventh connection part 1471 and the eighth connection part 1481 are used for is electrically connected to the fourth conductor.
  • the LED lamp bead 10 provided in the above embodiment can be connected to other LED lamp beads through four wires, that is, and other lamp beads are arranged in an orderly manner on four wires. From the appearance, multiple LED lamp beads are welded on four wires to form an LED lamp string. However, there are series and parallel connections in the circuit connection. In terms of communication connection relationship, each LED lamp bead They are all connected in series for easy control, which makes the processing of LED light strips easier. At the same time, high-voltage power supply, long-distance cascading and luminous diversity of LED light strips can be realized, such as running lights, marquees and other lighting styles.
  • the fifth solid chip part 1452 may be provided with one or more wafers 122; the wafer 122 is electrically connected to the driver chip 121 through the bonding wire 101; the wafer 122 is also connected to the fifth solid chip 122 through the bonding wire 101.
  • the crystal part 1452 is electrically connected, or the chip 122 is also electrically connected to the fifth solid die part 1452 through adhesive contact, such as conductive silver glue.
  • adhesive contact such as conductive silver glue.
  • the chip 122 can also be disposed on the die-bonding portion of other pins.
  • the fifth die-bonding part 1452 may be provided with a green light chip 1221 and a red light chip 1222; wherein the green light chip 1221 is connected to the fifth die-bonding part 1452 and the driver chip respectively through the bonding wire 101.
  • 121 is electrically connected, specifically to the G control terminal of the driver chip 121; the red light chip 1222 is connected to the driver chip 121 through the bonding wire 101, specifically to the R control terminal of the driver chip 121, and through adhesive contact.
  • the fifth die-bonding part 1452 is electrically connected.
  • the fifth die-bonding part 1452 at least includes a third setting part 14521 and a fourth setting part 14522 arranged at intervals, and the third setting part 14521 is used to set the green The optical chip 1221 and the red light chip 1222, the fourth setting part 14522 is used to set the bonding wire connection points. Since the bottom of the blue light chip and the green light chip are connected to the die-solid part through the adhesive, the adhesive is an organic matter. When it is heated and expands, the internal stress is released and extended, which can easily cause the surrounding secondary solder joints (bonding). delamination (also known as delamination) of wire connection points), causing electrical connection failure. Therefore, the spacing between the third setting portion 14521 and the fourth setting portion 14522 can effectively block the extension of delamination and peeling, effectively protect the firmness of the solder joints, and improve the reliability of the product.
  • the fourth die-bonding part 1442 may also be provided with a wafer 122; the wafer 122 is electrically connected to the fifth die-bonding part 1452 through the bonding wire 101, and the wafer 122 is also connected through the bonding wire 101.
  • the line 101 is electrically connected to the driver chip 121 .
  • the wafer 122 disposed in the fourth die-bonding part 1442 is a blue-ray chip 1223, and the blue-ray chip 1223 is disposed in the fourth die-bonding part 1442 at a position close to the fifth die-bonding part 1452, so that the blue light chip 1223 is disposed close to The wafer 122 on the fifth die-bonding part 1452. Therefore, different chips 122 can be combined to produce a variety of different colors, which not only reduces product costs and improves product reliability, but also improves the composite light-emitting color mixing effect of the LED lamp beads.
  • the sixth die-bonding part 1462 is provided with the driver chip 121 , and the area in the sixth die-bonding part 1462 in which the driver chip 121 is provided is located between the fourth die-bonding part and the fifth die-bonding part.
  • the driver chip 121 may be disposed on the sixth die-bonding part 1462 , and the area where the driver chip 121 is disposed in the sixth die-bonding part 1462 is located between the fourth die-bonding part 1442 and the fifth die-bonding part 1462 . between crystal parts 1452.
  • the sixth die-bonding portion 1462 extends between the fourth die-bonding portion 1442 and the fifth die-bonding portion 1452 , thereby driving the chip 121 with other die-bonding portions or wafers on other die-bonding portions. distance, thereby facilitating connection via bonding wires and providing product reliability and longevity.
  • the sixth die-bonding part 1462 may include first The placement part 14621 and the second placement part 14622 are connected, and the first placement part 14621 and the second placement part 14622 are connected. Specifically, it can be understood that the first placement part 14621 and the second placement part 14622 are integrated designs.
  • the first placement part 14621 is used to set the driver chip 121
  • the second placement part 14622 is used to set the bonding wire connection point
  • the part between the first placement part 14621 and the second placement part 14622 is a spacing area, so it can also Preventing the heat generation of the driver chip 121 from causing peeling of the bonding wire connection points of the second placement portion 14622 can effectively block the extension of delamination peeling, effectively protect the firmness of the solder joints, and improve the reliability of the product.
  • the fourth die-bonding part 1442 includes a wafer placement part 14021 and a bonding wire connection point placement part 14022 extending from the wafer placement part 14021.
  • the bonding wire connection point placement part 14022 extends to the spacing area.
  • connection part and the die-bonding part of the pin 14 also require electroplating process, or when using via holes to achieve electrical connection, the copper sinking process also requires electroplating.
  • a conductive electrode 1404 is also provided on the die-bonding portion of each pin 14, and the conductive electrode 1404 extends from the die-bonding portion of each pin to the edge of the insulating seat 11.
  • the third die-bonding The first portion 1432 and the sixth die-bonding portion 1462 both include conductive electrodes 1404 .
  • the LED lamp bead 10 can also include an isolation plate 15.
  • the isolation plate 15 can be a BT (Bismaleimide Triazine) plate, which can also be called a Resin substrate, the isolation plate 15 is specifically arranged at the bottom of the insulating seat 11 to isolate the connection parts of each pin 14 to avoid short circuits caused by tin beads when the LED lamp beads are welded to wires. Since the surface of the insulating seat 11 is rough, if the isolation plate 15 is not used, a short circuit will easily occur when the connecting portion of the pin 14 is welded to the wire.
  • BT Bismaleimide Triazine
  • FIGS. 27 and 28 respectively show a schematic structural diagram of another LED lamp bead provided by an embodiment of the present application.
  • the LED lamp bead 10 includes an insulating base 11 , a light emitting component 12 , an encapsulant 13 and at least four pairs of pins 14 .
  • the difference of the LED lamp bead 10 lies in the structural design of the die-fixing portion of at least four pairs of pins 14 and the connection relationship between the light-emitting component and the die-fixing portion of the four pairs of pins 14 .
  • the following mainly introduces the difference in detail.
  • the structure and location of the connection parts of the insulating seat 11, the light-emitting component 12, the packaging glue 13 and at least four pairs of pins 14 can all be the same as those of the Top-A lamp bead.
  • the structures and locations of the connection portions of the light-emitting component 12, the packaging glue 13, and at least four pairs of pins 14 are the same, and of course can be different, so details will not be described here.
  • At least four pairs of pins 14 are respectively the first pin 141, the second pin 142, the third pin 143, the fourth pin 144, the fifth pin 145, the sixth pin 146, The seventh pin 147 and the eighth pin 148.
  • the first pin 141 and the second pin 142 form a first pin pair
  • the third pin 143 and the fourth pin 144 form a second pin pair
  • the fifth pin 145 and the sixth pin 146 form The third pin pair
  • the seventh pin 147 and the eighth pin 148 form a fourth pin pair.
  • the first pin pair is electrically connected to the first wire, that is, the connecting portions of the first pin 141 and the second pin 142 are both used to be electrically connected to the first wire;
  • the second pin pair is connected to the second wire, That is, the connecting portions of the third pin 143 and the fourth pin 144 are both used to be electrically connected to the second wire;
  • the third pin pair is connected to the third wire, that is, the connecting portions of the fifth pin 145 and the sixth pin 146
  • the connecting parts are all used to be electrically connected to the third wire;
  • the fourth pin pair is connected to the fourth wire, that is, the connecting parts of the seventh pin 147 and the eighth pin 148 are both used to be electrically connected to the fourth wire.
  • the first wire is a positive wire
  • the second wire is a positive wire
  • the third wire is a communication wire
  • the fourth wire is a negative wire
  • the conductive core of the second wire is between the third pin 143 and the fourth pin 144
  • the portion between the connecting portions is cut off, and the conductive core of the third wire is partially cut off between the connecting portions of the fifth pin 145 and the sixth pin 146 .
  • the first pin 141 includes a first connection part 1411 and a first die-bonding part 1412
  • the second pin 142 includes a second connection part 1421 and a second die-bonding part 1422.
  • the first connection part 1411 and the second connection part 1421 are used to connect with the first wire.
  • the first die-bonding part 1412 and the second die-bonding part 1422 may be arranged at intervals or may be designed in an integrated manner.
  • the third pin 143 includes a third connection part 1431 and a third die-bonding part 1432.
  • the fourth pin 144 includes a fourth connection part 1441 and a fourth die-bonding part 1442.
  • the positive terminal VDD of the driver chip 121 passes through the bonding wire 101 It is electrically connected to the third die-bonding part 1432.
  • the chip 122 is electrically connected to the third die-bonding part 1432.
  • the third connection part 1431 and the fourth connection part 1441 are used to be electrically connected to the second wire.
  • the second wire is electrically conductive.
  • the wire core is partially cut between the third connection part 1431 and the fourth connection part 1441 .
  • the fifth pin 145 includes a fifth connection portion 1451 and a fifth die-bonding portion 1452
  • the sixth pin 146 includes a sixth connection portion 1461 and a sixth die-bonding portion 1462
  • the fifth die-bonding portion 1452 is connected to the die through the bonding wire 101
  • the signal input terminal Din of the driver chip 121 is connected.
  • the sixth die-bonding part 1462 is connected to the signal output terminal Dout of the driver chip 121 through the bonding wire 101.
  • the fifth connection part 1451 and the sixth connection part 1461 are used to electrically connect with the third wire.
  • the conductive core of the third wire is partially cut off between the fifth connection part 1451 and the sixth connection part 1461 .
  • the seventh pin 147 includes a seventh connection portion 1471 and a seventh die-bonding portion 1472
  • the eighth pin 148 includes an eighth connection portion 1481 and an eighth die-bonding portion 1482
  • the eighth die-bonding portion 1482 is connected with the bonding wire 101 through the bonding wire 101 .
  • the negative terminal GND of the driver chip 121 is electrically connected, and the seventh connection part 1471 and the eighth connection part 1481 are used to connect with the fourth communication line.
  • the LED lamp bead 10 provided in the above embodiment can be connected to other LED lamp beads through four wires, that is, and other lamp beads are arranged in an orderly manner on four wires. From the appearance, multiple LED lamp beads are welded on four wires to form an LED lamp string. However, there are series and parallel connections in the circuit connection. In terms of communication connection relationship, each LED lamp bead They are all connected in series for easy control, which makes the processing of LED light strips easier. At the same time, high-voltage power supply, long-distance cascading and luminous diversity of LED light strips can be realized, such as running lights, marquees and other lighting styles.
  • the LED lamp bead 10 also includes a first transition pin 14a and a second transition pin 14b.
  • the die-bonding part of the second transition pin is integrated with the eighth die-bonding part 1482. Molding can also be understood as the second transition pin 14b extends from the eighth die-bonding part 1482.
  • the first transition pin 14a and the second transition pin 14b are exposed from both sides of the insulating seat of the LED lamp bead and are symmetrical, but the first transition pin 14a and the second transition pin 14b are not electrically connected to external wires.
  • the sixth die-bonding portion 1462 of the sixth pin 146 is located between the die-bonding portion 1482 of the second transition pin 14b and the eighth die-bonding portion 1482.
  • This structural design can not only improve the firmness of the sixth pin 146, the eighth pin 148 and the insulating seat 11, but also save bonding wires, thereby relatively improving the reliability and service life of the product.
  • the third die-bonding part 1432 or the fourth die-bonding part 1442 is provided with one or more wafers 122.
  • the wafer 122 is electrically connected to the driver chip 121 through the bonding wire 101.
  • the wafer 122 is also connected through the bonding wire 101.
  • the bonding wire 101 is electrically connected to the third die-bonding part 1432, or the wafer 122 is also electrically connected to the third die-bonding part 1432 through adhesive contact.
  • the third die-bonding part 1432 is provided with a green light chip 1221 and a red light chip 1222, and the fourth die-bonding part 1442 is provided with a blue light chip 1223; wherein, the green light chip 1221 is provided with a bonding wire.
  • 101 is electrically connected to the third solid die part 1432 and the driver chip 121 respectively, specifically to the G control terminal of the driver chip 121; the red light chip 1222 is connected to the driver chip 121 through the bonding wire 101, specifically through the bonding wire.
  • the three solid crystal parts 1432 are electrically connected.
  • the blue light chip 1223 is disposed in the fourth die attaching part 1442 close to the third die attaching part 1432 , so that the blue light chip 1223 is close to the wafer disposed on the third die attaching part 1432 122. Therefore, the green light chip 1221, the red light chip 1222 and the blue light chip 1223 can combine more colors, which not only reduces product costs and improves product reliability, but also improves the composite light-emitting color mixing effect of the LED lamp beads.
  • the eighth die-bonding portion 1482 may be provided with a driver chip 121 .
  • the portion of the eighth die-bonding part where the driver chip 121 is disposed is located between the third die-bonding part 1432 , the fifth die-bonding part 1452 and the sixth die-bonding part 1462 . This saves bonding wires and increases product reliability and service life.
  • the eighth die-bonding part 1482 includes a chip mounting slot, and the driver chip 121 is disposed in the chip mounting slot. Since the bottom of the chip installation groove 1403 is lower than other die-bonding parts, the driver chip 121 can sink into the bottom of the chip installation groove 1403. This not only ensures that the chip 122 is located above the driver chip 121, but also prevents the driver chip from being blocked. The light from the chip 122 effectively improves the brightness of the LED lamp beads. Since the driver chip 121 has a high height, the position where the bonding wire is connected to the highest point of the driver chip 121 can be reduced, thereby reducing the length of the bonding wire 101 and saving the manufacturing cost of the LED lamp beads.
  • the LED lamp bead 10 includes an insulating base 11 , a light emitting component 12 , an encapsulant 13 and at least four pairs of pins 14 .
  • the difference of the LED lamp bead 10 lies in: the structural design of the die-solid part of at least four pairs of pins 14, and the connection relationship between the light-emitting component and the die-solid part of the four pairs of pins 14. The following is mainly about the This difference is explained in detail. It should be noted that the structure and position of the connection portion of the insulating seat 11, the light-emitting component 12, the packaging glue 13 and at least four pairs of pins 14 can all be consistent with the insulating seat 11, the light-emitting component 12, the packaging glue 13 and the Chip-A lamp bead. The structures and positions of the connection portions of at least the four pairs of pins 14 are the same, and of course may be different, so details will not be described here.
  • At least four pairs of pins 14 are respectively the first pin 141, the second pin 142, the third pin 143, the fourth pin 144, the fifth pin 145, and the sixth pin.
  • the first pin 141 and the second pin 142 form a first pin pair
  • the third pin 143 and the fourth pin 144 form a second pin pair
  • the fifth pin 145 and the sixth pin 146 form a third pin pair.
  • the seventh pin 147 and the eighth pin 148 form a fourth pin pair.
  • the first pin pair is used to be connected to the first wire, that is, the connecting portions of the first pin 141 and the second pin 142 are both used to be electrically connected to the first wire; the second pin pair is used to be connected to the first wire.
  • the third wire is connected, and the connecting portions of the third pin 143 and the fourth pin 144 are used to electrically connect with the third wire; the third pin pair is used to connect with the second wire, and the fifth pin 145 and the
  • the connecting portions of the six pins 146 are all used to be electrically connected to the second wire; the fourth pin pair is used to be connected to the fourth wire; the connecting portions of the seventh pin 147 and the eighth pin 148 are both used to be electrically connected to the second wire.
  • the first conductor is a positive conductor
  • the second conductor is a positive conductor
  • the third conductor is a communication conductor
  • the fourth conductor is a negative conductor.
  • the conductive core of the third lead is partially cut off between the connection portion of the third pin and the fourth pin; the conductive core of the second lead is cut off at the connection portion of the fifth pin and the sixth pin. Cut off the parts in between.
  • the first pin 141 includes a first connection part 1411 and a first die-bonding part 1412
  • the second pin 142 includes a second connection part 1421 and a second die-bonding part. 1422, the first connecting part 1411 and the second connecting part 1421 may be provided at intervals, or of course may be integrally formed for electrical connection with the first conductor.
  • the third pin 143 includes a third connection portion 1431 and a third die-bonding portion 1432
  • the fourth pin 144 includes a fourth connection portion 1441 and a fourth die-bonding portion 1442
  • the third die-bonding portion 1432 is connected with the bonding wire 101 through the bonding wire 101
  • the signal input terminal Din of the driver chip 121 is connected
  • the fourth solid die part 1442 is connected to the signal output terminal Dout of the driver chip 121 through the bonding wire 101
  • the third connection part 1431 and the fourth connection part 1441 are used for the electrical conductivity of the third wire.
  • the fifth pin 145 includes a fifth connection part 1451 and a fifth die-bonding part 1452
  • the sixth lead The pin 146 includes a sixth connection part 1461 and a sixth solid die part 1462.
  • the positive terminal VDD of the driver chip 121 is electrically connected to the fifth solid die part 1452 through the bonding wire 101.
  • the chip 121 is connected to the fifth solid die part 1452 through the bonding wire 101.
  • the crystal part 1452 is connected, the fifth connection part 1451 and the sixth connection part 1461 are used to electrically connect with the second wire, and the conductive core of the second wire is partially cut off between the fifth connection part 1451 and the sixth connection part 1461 .
  • the seventh pin 147 includes a seventh connection part 1471 and a seventh die-bonding part 1472.
  • the eighth pin 148 includes an eighth connection part 1481 and an eighth die-bonding part 1482.
  • the negative terminal GND of the driver chip 121 passes through the bonding wire 101 It is electrically connected to the eighth die-bonding part 1482.
  • the LED lamp bead 10 provided in the above embodiment can be connected to other LED lamp beads through four wires, that is, and other lamp beads are arranged in an orderly manner on four wires. From the appearance, multiple LED lamp beads are welded on four wires to form an LED lamp string. However, there are series and parallel connections in the circuit connection. In terms of communication connection relationship, each LED lamp bead They are all connected in series for easy control, which makes the processing of LED light strips easier. At the same time, high-voltage power supply, long-distance cascading and luminous diversity of LED light strips can be realized, such as running lights, marquees and other lighting styles.
  • the fifth solid chip part 1452 may be provided with one or more wafers 122; the wafer 122 is electrically connected to the driver chip 121 through the bonding wire 101; the wafer 122 is also connected to the fifth solid chip 122 through the bonding wire 101.
  • the crystal part 1452 is electrically connected, or the chip 122 is also electrically connected to the fifth solid die part 1452 through adhesive contact, such as conductive silver glue.
  • adhesive contact such as conductive silver glue.
  • the chip 122 can also be disposed on the die-bonding portion of other pins.
  • the fifth die-bonding part 1452 may be provided with a green light chip 1221 and a red light chip 1222 .
  • the green light chip 1221 is connected to the fifth die-bonding part 1452 and the driver chip through the bonding wire 101 respectively.
  • 121 is electrically connected, specifically to the G control terminal of the driver chip 121; the red light chip 1222 is connected to the driver chip 121 through the bonding wire 101, specifically to the R control terminal of the driver chip 121, and through adhesive contact.
  • the fifth die-bonding part 1452 is electrically connected.
  • the fifth die-bonding part 1452 at least includes a third setting part 14521 and a fourth setting part 14522 arranged at intervals, and the third setting part 14521 is used to set the green The optical chip 1221 and the red light chip 1222, the fourth setting part 14522 is used to set the bonding wire connection points. Since the bottom of the blue light chip and the green light chip are connected to the die-hardening part through the adhesive, the adhesive is an organic substance, and the internal stress is released differently when it is heated and expands, which can easily cause the surrounding secondary solder joints (bonds). delamination (also known as delamination) of the bonded wire connection point), which in turn causes electrical connection failure. Therefore, the spacing between the third setting portion 14521 and the fourth setting portion 14522 can effectively block the extension of delamination and peeling, effectively protect the firmness of the solder joints, and improve the reliability of the product.
  • the fourth die-bonding part 1442 may also be provided with a wafer 122; the wafer 122 is electrically connected to the fifth die-bonding part 1452 through the bonding wire 101, and the wafer 122 is also connected through the bonding wire 101.
  • the line 101 is electrically connected to the driver chip 121 .
  • the wafer 122 disposed in the fourth die-bonding part 1442 is a blue-ray chip 1223, and the blue-ray chip 1223 is disposed in the fourth die-bonding part 1442 at a position close to the fifth die-bonding part 1452, so that the blue light chip 1223 is disposed close to The wafer 122 on the fifth die-bonding part 1452. Therefore, different chips 122 can be combined to produce a variety of different colors, which not only reduces product costs and improves product reliability, but also improves the composite light-emitting color mixing effect of the LED lamp beads.
  • the eighth die-bonding part 1482 may be provided with the driver chip 121 , and the area where the driver chip 121 is provided in the eighth die-bonding part 1482 is located between the fourth die-bonding part 1442 and the fifth die-bonding part 1452 . Since the fourth die-bonding part 1442 and the fifth die-bonding part 1452 are used to set the connection points between the chip and the bonding wire, this design can shorten the bonding wire distance, save the cost of the bonding wire, and at the same time improve the LED lamp beads. service life.
  • an eighth die-bonding part 1482 may be provided including a third placement part 14821 and a fourth placement part 14822 that are spaced apart.
  • the third placement part 14821 and the fourth placement part 14822 are connected, the third placement part 14821 is used to set the driver chip 121, the fourth placement part 14822 is used to set the bonding wire connection point, the third placement part 14821 and the fourth placement part
  • the part between 14822 is a spacing area;
  • the fourth die-bonding part 1442 includes a wafer placing part 14021 and a bonding wire connection point placing part 14022 extending from the wafer placing part 14021, and the bonding wire connection point placing part 14022 extends to the spacing area . This can also prevent the heat-generating bonding wire connection points of the driver chip 121 from peeling off, thereby improving the service life of the product. At the same time, the distance between the bonding wire connecting the driver chip and the die-bonding part can be further shortened, thereby saving costs and improving product reliability.
  • connection part and the die-bonding part of the pin 14 also require electroplating process, or when using via holes to achieve electrical connection, the copper sinking process also requires electroplating.
  • a conductive electrode 1404 is also provided on the die-bonding portion of each pin 14.
  • the conductive electrode 1404 extends from the die-bonding portion of each pin to the edge of the insulating seat 11.
  • the third die-bonding The portion 1432, the fifth die-bonding portion 1452, and the eighth die-bonding portion 1482 all include conductive electrodes 1404.
  • the LED lamp bead 10 can also include an isolation plate 15.
  • the isolation plate 15 can be a BT (Bismaleimide Triazine) plate, which can also be called a resin substrate.
  • the isolation plate 15 is specifically arranged at the bottom of the insulating seat 11 to isolate the connection parts of each pin 14 to avoid short circuits caused by tin beads when the LED lamp beads are welded to the wires. Since the surface of the insulating seat 11 is rough, if the isolation plate 15 is not used, a short circuit will easily occur when the connecting portion of the pin 14 is welded to the wire.
  • Top-A lamp beads, Top-B lamp beads, Top-C lamp beads and Chip-A lamp beads, Chip-B lamp beads and Chip-C lamp beads provided in the above embodiments, in the following
  • Top-A lamp beads and Chip-A lamp beads may be called the first LED lamp beads
  • Top-C lamp beads and Chip-C lamp beads may be called the second LED lamp beads
  • Top-B lamp beads and Chip -B lamp bead is called the third LED lamp bead.
  • the following is an introduction to the LED light strip made by using the first LED lamp bead, the second LED lamp bead and the third LED lamp bead.
  • the LED light strips provided in the embodiments of the present application include at least four wires and multiple LED modules.
  • the LED modules include at least two LED lamp beads, and the at least two LED lamp beads are electrically connected to the four wires. , and a plurality of the LED lamp beads are arranged on the four conductors in sequence and form a strip; wherein, one of the four conductors is a communication conductor, and the other three conductors are power supply conductors; on the communication conductor,
  • the LED lamp beads on the strip are all connected in series; on the power supply wire, a plurality of the LED modules are connected in parallel with each other, and at least two LED lamp beads of each LED module are connected in series.
  • the LED module may include: a first LED lamp bead and a second LED lamp bead.
  • the first LED lamp bead and the second LED lamp bead have the same external structure.
  • the first LED lamp bead and the second LED lamp bead have the same external structure.
  • the internal structure is different; wherein, the external structure includes an insulating seat, a connection part of a pin and a packaging glue, and the internal structure includes a die-bonding part of a pin.
  • the LED module may further include: a third LED lamp bead, the third LED lamp bead is connected in series with the first LED lamp bead and the second LED lamp bead; wherein, the third LED lamp bead is located between the first LED lamp bead and the first LED lamp bead. Between the first LED lamp bead and the second LED lamp bead, the first LED lamp bead serves as the first lamp bead of the LED module, and the second LED lamp bead serves as the tail lamp bead of the LED module.
  • the third LED lamp bead has the same external structure as the first LED lamp bead and the second LED lamp bead; the third LED lamp bead has an internal structure different from the first LED lamp bead and the second LED lamp bead.
  • the number of third LED lamp beads in the LED module is one or more.
  • the plurality of third LED lamp beads are located in the first LED lamp.
  • the beads and the second LED lamp beads are connected in series with each other.
  • the working voltages of the first LED lamp bead, the second LED lamp bead, and the third LED lamp bead are the same.
  • the method of making an LED light strip may specifically include: extending at least four wires along a straight line track; arranging corresponding LED lamp beads on at least four wires at intervals along the straight line track; welding the LED lamp beads and the at least four wires; Cut out part of the wire cutout.
  • the conductor includes a conductive core and an insulating layer wrapping the conductive core.
  • the conductor includes an enameled wire, and the insulating layer may also be called an enameled wire layer.
  • the insulation layer of the wires needs to be stripped so that each wire exposes a conductive core that matches the pin of the LED lamp bead.
  • the insulation layer of the conductors is stripped.
  • the insulation layer of the wires can be stripped at equal intervals, so that the LED lamp beads of the multiple LED modules in the LED light strip can be arranged on four wires at equal intervals.
  • they can also be arranged on four wires at unequal intervals.
  • solder paste can also be applied to the connection portion of the LED lamp bead.
  • a hot air mechanism can be used to weld and fix the connection part of the LED lamp bead and the conductive core of the wire.
  • the conductor core of some of the conductors needs to be cut off.
  • the conductive parts of the second conductor and the third conductor need to be cut. Wire core cutting process. When punching, first flip the wire with the LED lamp bead welded on it so that the wire is facing up and the LED lamp bead is facing down. Use a cutter to punch from top to bottom, thus completing the production of the LED light strip.
  • the insulating layer of the wire can be removed to expose the conductive wire core, and then the second wire and the third wire can be punched, solder paste is applied on the wire core, and then the LED lamp bead is placed Weld the conductive core with solder paste on it, then drop UV glue on it and solidify it.
  • the LED light strip is reversed in the next process, and UV glue is dropped on the other side of the LED light strip for solidification to complete the production of the LED light strip.
  • each LED lamp strip corresponds to a different operating voltage.
  • the various LED lamp strips provided in the embodiments of the present application are introduced in detail below:
  • Figures 36 and 37 illustrate structures of different viewing angles of an LED light strip provided by embodiments of the present application.
  • the LED light strip 100 may specifically include at least four wires 20 and multiple LED modules.
  • each LED module includes three LED lamp beads, respectively.
  • LED lamp bead 10a, LED lamp bead 10b and LED lamp bead 10c are all electrically connected to four conductors 20.
  • the four conductors are respectively a first conductor 21, a second conductor 22, a third conductor 23 and a fourth conductor 24.
  • the first conductor 21 is a positive wire
  • the second wire 22 is a positive wire
  • the third wire 23 is a communication wire
  • the fourth wire is a negative wire.
  • the four pairs of pins of the three LED lamp beads of each LED module are electrically connected to four pairs of wires. Specifically, the first pin and the second pin are both connected to the first wire 21, and the third pin and the third pin are connected to the first wire 21. The four pins are all connected to the second wire 22 , the fifth pin and the sixth pin are both connected to the third wire 23 , and the seventh pin and the eighth pin are both connected to the fourth wire 24 .
  • the specific connection method please refer to the specific description of the LED lamp beads in the above embodiment.
  • Three LED lamp beads in multiple LED modules are arranged sequentially on four wires 20 to form a strip, that is, forming a long light string, which can be used as an ambient light to decorate other objects, such as a Christmas tree.
  • the LED lamp beads on the strip are all connected in series;
  • the modules are connected in parallel with each other, and the three LED lamp beads of each LED module are connected in series, that is, the LED lamp bead 10a, the LED lamp bead 10b, and the LED lamp bead 10c are connected in series.
  • the LED light strip 100 specifically includes one hundred LED modules, and each LED module includes three LED lamp beads, namely LED lamp beads 10a, LED lamp beads 10b and LED lamp beads 10c.
  • each of the one hundred LED modules is connected in parallel with each other, the three LED lamp beads in each LED module are connected in series, and the three hundred LED lamp beads on the LED strip 100 All communication wires are connected in series.
  • the LED light strip 100 is not limited to including one hundred LED modules, and may also include other numbers of LED modules, which may be more or less than one hundred.
  • one end of the three chips of the LED lamp bead 10a is electrically connected to the first solid die part of its first pin, and the other ends of the three chips of the LED lamp bead 10a are all electrically connected to the control end of the driver chip.
  • the control terminal of the driver chip specifically includes three control terminals: G control terminal, R control terminal and B control terminal.
  • the positive terminal VDD of the driver chip is electrically connected to the first solid crystal part of the LED lamp bead 10a, driving The negative terminal GND of the chip is connected to the fourth solid die portion of the fourth pin of the LED lamp bead 10a; and one end of the three chips of the LED lamp bead 10b is electrically connected to the third solid die portion of the third pin of the LED lamp bead 10b. The other ends of the three chips of the LED lamp bead 10b are electrically connected to the control terminals of its driver chip.
  • the positive terminal VDD of the driver chip is electrically connected to the third solid chip portion of the LED lamp bead 10b.
  • the negative terminal of the driver chip is electrically connected.
  • GND is electrically connected to the fourth solid die part of the LED lamp bead 10b; and one end of the three chips of the LED lamp bead 10c is electrically connected to the third solid die part of its third pin, and the three die solid parts of the LED lamp bead 10c are electrically connected.
  • the other end of the chip is electrically connected to the control terminal of its driver chip.
  • the positive terminal VDD of the driver chip is electrically connected to the third solid crystal part of the LED lamp bead 10c.
  • the negative terminal GND of the driver chip is electrically connected to the LED lamp bead 10c.
  • the eighth solid crystal part is electrically connected, thus realizing the series power supply of three LED lamp beads.
  • the power supply path is: for each LED lamp bead in the LED module, the current passes through the first wire 21, the first die-bonding part of the first pin of the LED lamp bead 10a, and the driver chip of the LED lamp bead 10a in sequence.
  • the fourth solid die part of the fourth pin of the LED lamp bead 10a, the second wire 22, the third solid die part of the third pin of the LED lamp bead 10b, the driver chip of the LED lamp bead 10b, the LED lamp bead 10b The fourth solid die portion of the fourth pin, the second wire 22, the third solid die portion of the third pin of the LED lamp bead 10c, the driver chip of the LED lamp bead 10c, and the eighth pin of the LED lamp bead 10c.
  • the eighth solid chip part and the fourth wire form a series power supply circuit; for different LED modules, since the first lamp bead of each LED module (such as the LED lamp bead 10a) is connected to the first wire, it is connected to the first lamp bead.
  • the series-connected tail lamp beads are connected to the fourth wire, so it can be determined that each LED module is connected in parallel to the first wire and the fourth wire.
  • the signal input terminal Din of the driver chip of the LED lamp bead 10a is connected to the fifth die-bonding part of the fifth pin of the LED lamp bead 10a (or through the third The solid die part of a transition pin is connected to the fifth solid die part), and the signal output terminal Dout of the driver chip of the LED lamp bead 10a is connected to the sixth die solid part of the sixth pin of the LED lamp bead 10a; the LED lamp bead
  • the signal input terminal Din of the driver chip 10b is connected to the fifth solid-crystal part of the fifth pin of the LED lamp bead 10b, and the signal output terminal Dout of the driver chip of the LED lamp bead 10b is connected to the sixth pin of the LED lamp bead 10b.
  • the sixth solid-crystal part is connected; the signal input terminal Din of the driver chip of the LED lamp bead 10c is connected to the fifth solid-crystal part of the fifth pin of the LED lamp bead 10c, and the signal output terminal Dout of the driver chip of the LED lamp bead 10c is connected with
  • the sixth pin of the LED lamp bead 10c is connected to the sixth die-bonding part; the connecting parts of the fifth pin and the sixth pin are both used to connect to the communication wire, thereby realizing each of the multiple LED modules LED lamp beads are connected in series on the communication wires.
  • the LED light strip adopts parallel connection between LED modules and the LED lamp beads in the LED modules are connected in series, the power supply loss of the LED light strip 100 is small, so the LED light strip 100 can achieve long-distance cascading, that is, The LED light strip can be made very long. More importantly, the LED light strip 100 is simple to manufacture, and only needs to weld the three types of LED lamp beads (LED lamp bead 10a, LED lamp bead 10b and LED lamp bead 10c) provided in the above embodiment to four wires in sequence. That is, the production can be completed.
  • the LED light strip adopts series-parallel power supply and signal series connection to realize a variety of application solutions with different power supply voltages.
  • a communication protocol is used to control each LED lamp bead on the LED light strip, so that various luminous effects can be achieved. It can be adjusted arbitrarily and is not limited by the number of cascading points and distance.
  • This LED light strip can effectively solve the difficulties and pain points of existing LED light strips, that is, it can achieve long-distance cascading, diverse lighting effects, easy control, and the power supply voltage can be adjusted arbitrarily according to needs.
  • the LED light strip can also be made using the same production process as the current leather cord lamps. It is simple to make and can improve the production efficiency of the LED light strip.
  • the LED light strip 100 may specifically include at least four wires 20 and multiple LED modules.
  • each LED module includes two LED lamp beads, respectively. 10a and LED lamp bead 10c, wherein, LED lamp bead 10a is a Top-A lamp bead, and LED lamp bead 10c is a Top-C lamp bead.
  • Both the LED lamp bead 10a and the LED lamp bead 10c are electrically connected to four wires 20, which are the first wire 21, the second wire 22, the third wire 23 and the fourth wire 24 respectively.
  • the first wire 21 is the positive wire.
  • the second wire 22 is a positive wire
  • the third wire 23 is a communication wire
  • the fourth wire is a negative wire.
  • Two LED lamp beads in multiple LED modules are arranged sequentially on four wires 20 to form a strip, that is, forming a long light string, which can be used as an ambient light to decorate other objects, such as a Christmas tree.
  • the LED lamp beads on the strip are all connected in series;
  • the modules are connected in parallel with each other, and the two LED lamp beads of each LED module are connected in series, that is, the LED lamp beads 10a and the LED lamp beads 10c are connected in series.
  • the LED light strip 100 specifically includes two hundred LED modules, and each LED module includes two LED lamp beads, namely an LED lamp bead 10a and an LED lamp bead 10c.
  • each of the two hundred LED modules is connected in parallel, and the two LED lamp beads in each LED module are connected in series, that is, there are four hundred LED lamp beads on the LED strip 100. All communication wires are connected in series.
  • one end of the three chips of the LED lamp bead 10a is electrically connected to the first solid die part of its first pin, and the other ends of the three chips of the LED lamp bead 10a are all electrically connected to the control end of the driver chip.
  • the number of control terminals of the driver chip specifically includes three, which are the G control terminal, the R control terminal and the B control terminal.
  • the positive terminal VDD of the driver chip is electrically connected to the first solid die part of the LED lamp bead 10a.
  • the negative terminal GND of the driver chip is connected to the fourth solid die part of the fourth pin of the LED lamp bead 10a; and one end of the three chips of the LED lamp bead 10c is electrically connected to the third solid die part of the third pin of the LED lamp bead 10c. The other ends of the three chips of the LED lamp bead 10c are electrically connected to the control terminal of its driver chip.
  • the positive terminal VDD of the driver chip is electrically connected to the third solid crystal part of the LED lamp bead 10c.
  • the driver chip The negative terminal GND is electrically connected to the eighth solid crystal part of the LED lamp bead 10c, thus realizing the series power supply of the two LED lamp beads.
  • the power supply path is: for each LED lamp bead in the LED module, the current passes through the first wire 21, the first die-bonding part of the first pin of the LED lamp bead 10a, and the driver chip of the LED lamp bead 10a in sequence.
  • the eighth solid-crystal part and the fourth wire of the eighth pin form a series power supply circuit; for different LED modules, since the LED lamp bead 10a of each LED module is connected to the first wire, it is connected to the LED lamp bead 10a The series-connected LED lamp beads 10c are connected to the fourth wire, so it can be determined that each LED module is connected in parallel to the first wire and the fourth wire.
  • the LED light strip adopts parallel connection between LED modules and the LED lamp beads in the LED modules are connected in series, the power supply loss of the LED light strip 100 is small, so the LED light strip 100 can achieve long-distance cascading, that is, The LED light strip can be made very long. More importantly, the LED lamp strip 100 is simple to manufacture. It only needs to weld the two types of LED lamp beads (LED lamp beads 10a and LED lamp beads 10c) provided in the above embodiment to four wires in sequence, and it can be produced. Finish.
  • the LED light strip adopts series-parallel power supply and series signal connection to achieve a variety of application solutions with different power supply voltages. This uses a serial communication protocol to control each LED bead on the LED light strip, thereby achieving a luminous effect.
  • This LED light strip can effectively solve the difficulties and pain points of existing LED light strips, that is, it can achieve long-distance cascading, diverse lighting effects, easy control, and the power supply voltage can be adjusted arbitrarily according to needs.
  • the LED light strip can also be made using the same production process as the current leather cord lamps. It is simple to make and can improve the production efficiency of the LED light strip.
  • the LED light strip 100 may specifically include at least four wires 20 and multiple LED modules.
  • each LED module includes six LED lamp beads, each of which is an LED lamp.
  • LED lamp bead 10a one LED lamp bead 10c and four LED lamp beads 10b
  • LED lamp bead 10a is the first lamp bead
  • LED lamp bead 10c is the tail lamp bead.
  • the LED lamp bead 10a is a Top-A lamp bead
  • the LED lamp bead 10b is a Chip-B lamp bead
  • the LED lamp bead 10c is a Top-C lamp bead.
  • LED lamp bead 10a, LED lamp bead 10b and LED lamp bead 10c are all electrically connected to four conductors 20.
  • the four conductors are respectively a first conductor 21, a second conductor 22, a third conductor 23 and a fourth conductor 24.
  • the first conductor 21 is a positive wire
  • the second wire 22 is a positive wire
  • the third wire 23 is a communication wire
  • the fourth wire is a negative wire.
  • Six LED lamp beads in multiple LED modules are arranged sequentially on four wires 20 to form a strip, that is, a long light string, which can be used as an ambient light to decorate other objects, such as a Christmas tree.
  • the LED lamp beads on the strip are all connected in series;
  • the modules are connected in parallel with each other, and the six LED lamp beads of each LED module are connected in series, that is, the LED lamp bead 10a, the four LED lamp beads 10b and the LED lamp bead 10c are connected in series.
  • the working voltages of the Top-A lamp beads, the Top-B lamp beads and the Top-C lamp beads may be the same, different, or approximately the same.
  • the working voltage of the Top-A lamp bead, Top-B lamp bead and Top-C lamp bead is the same, for example, the working voltage is 4v.
  • other voltages can also be used, such as 3.6V or 5V. Therefore, the power supply voltage of the LED light strip shown in Figure 36 is 12V, the power supply voltage of the LED light strip shown in Figure 39 is 8V, and the power supply voltage of the LED light strip shown in Figure 41 is 24V.
  • the high-voltage power supply can be understood as the current market generally uses less than 10V.
  • a power supply device supplies power to the LED light strip. If the LED light strip is long, the low-voltage power supply due to line loss will cause insufficient brightness of the LED lamp beads at the end of the LED light strip, which will affect the user experience. And with the LED light The longer the belt is used, the more obvious this phenomenon becomes.
  • the LED light strip provided by the embodiment of the present application can use high-voltage power supply such as 12V, 24V, 32V, and 40V. The high-voltage power supply can reduce the impact of voltage line loss, so that the LED light strip can be made very long.
  • the LED light strip provided by the embodiment of the present application can easily achieve a power supply voltage of more than 20V.
  • Top-type LED lamp beads to make LED light strips.
  • Chip-type LED lamp beads to make LED light strips.
  • the LED lamp strips provided in the embodiments of the present application are preferably made of only one type of LED lamp beads. This type refers to the different manufacturing processes of the LED lamp beads. For example, only Top-type LED lamp beads are used, or only Chip-type LED lamp beads are used. LED lamp beads. Of course, this LED light strip can also use both Chip type and Top type LED lamp beads.
  • the LED light strip 100 may specifically include at least four wires 20 and multiple LED modules.
  • each LED module includes three LED lamp beads, respectively.
  • LED lamp bead 10a, LED lamp bead 10b and LED lamp bead 10c are all electrically connected to four conductors 20.
  • the four conductors are respectively a first conductor 21, a second conductor 22, a third conductor 23 and a fourth conductor 24.
  • the first conductor 21 is a positive wire
  • the second wire 22 is a positive wire
  • the third wire 23 is a communication wire
  • the fourth wire is a negative wire.
  • the four pairs of pins of the three LED lamp beads of each LED module are electrically connected to four pairs of wires. Specifically, the first pin and the second pin are both connected to the first wire 21, and the third pin and the third pin are connected to the first wire 21. The four pins are all connected to the third wire 23 , the fifth pin and the sixth pin are both connected to the second wire 22 , and the seventh pin and the eighth pin are both connected to the fourth wire 24 .
  • the specific connection method please refer to the specific description of the LED lamp beads in the above embodiment.
  • Three LED lamp beads in multiple LED modules are arranged sequentially on four wires 20 to form a strip, that is, forming a long light string, which can be used as an ambient light to decorate other objects, such as a Christmas tree.
  • the LED lamp beads on the strip are all connected in series;
  • the modules are connected in parallel with each other, and the three LED lamp beads of each LED module are connected in series, that is, the LED lamp bead 10a, the LED lamp bead 10b, and the LED lamp bead 10c are connected in series.
  • the LED light strip 100 specifically includes two hundred LED modules, and each LED module includes three LED lamp beads, namely LED lamp beads 10a, LED lamp beads 10b and LED lamp beads 10c.
  • each of the one hundred LED modules is connected in parallel with each other, the three LED lamp beads in each LED module are connected in series, and the 600 LED lamp beads on the LED strip 100 All communication wires are connected in series.
  • one end of the three chips of the LED lamp bead 10a is electrically connected to the second die-bonding part of its second pin, and the other ends of the three chips of the LED lamp bead 10a are all electrically connected to the control end of the driver chip. Electrically connected, the positive terminal VDD of the driver chip is electrically connected to the second solid die of the LED lamp bead 10a, or the positive terminal VDD of the driver chip is electrically connected to the fifth solid die of the fifth pin of the LED lamp bead 10a.
  • the negative terminal GND of the driver chip is connected to the sixth solid chip portion of the sixth pin of the LED lamp bead 10a; and one end of the three chips of the LED lamp bead 10b is connected to the fifth pin of the fifth pin of the LED lamp bead 10b.
  • the solid crystal part is electrically connected.
  • the other ends of the three chips of the LED lamp bead 10b are electrically connected to the control terminals of its driver chip.
  • the positive terminal VDD of the driver chip is electrically connected to the fifth solid crystal part of the LED lamp bead 10b.
  • the negative terminal GND of the driver chip is electrically connected to the sixth solid die portion of the sixth pin of the LED lamp bead 10b; and one end of the three chips of the LED lamp bead 10c is connected to the fifth solid die of the fifth pin of the LED lamp bead 10c.
  • the other ends of the three chips of the LED lamp bead 10c are electrically connected to the control terminals of its driver chip.
  • the positive terminal VDD of the driver chip is electrically connected to the fifth solid chip portion of the LED lamp bead 10c.
  • the negative terminal GND of the driver chip is electrically connected to the eighth solid crystal part of the LED lamp bead 10c, thus realizing the series power supply of three LED lamp beads.
  • the power supply path is: for each LED lamp bead in the LED module, the current passes through the first wire 21, the second die-hardening part of the second pin of the LED lamp bead 10a, and the driver chip of the LED lamp bead 10a in sequence.
  • the eighth solid die part and the fourth wire form a series power supply circuit; for different LED modules, since the first lamp bead (such as the LED lamp bead 10a) of each LED module is connected to the first wire 21, it is connected to the first lamp bead 21.
  • each LED module is connected in parallel to the first wire 21 and the fourth wire 24 .
  • Each LED lamp bead is connected in series on the communication wire. Please refer to the above embodiment and will not be introduced in detail here.
  • the LED light strip adopts parallel connection between LED modules and the LED lamp beads in the LED modules are connected in series, the power supply loss of the LED light strip 100 is small, so the LED light strip 100 can achieve long-distance cascading, that is, The LED light strip can be made very long. More importantly, the LED light strip 100 is simple to manufacture, and only needs to weld the three types of LED lamp beads (LED lamp bead 10a, LED lamp bead 10b and LED lamp bead 10c) provided in the above embodiment to four wires in sequence. That is, the production can be completed.
  • the LED light strip adopts series-parallel power supply and series signal connection to achieve a variety of application solutions with different power supply voltages.
  • This LED light strip can effectively solve the difficulties and pain points of existing LED light strips, that is, it can achieve long-distance cascading, diverse lighting effects, easy control, and the power supply voltage can be adjusted arbitrarily according to needs.
  • the LED light strip can also be made using the same production process as the current leather cord lamps. It is simple to make and can improve the production efficiency of the LED light strip.
  • the LED light strip 100 may specifically include at least four wires 20 and multiple LED modules.
  • each LED module includes two LED lamp beads, respectively. 10a and LED lamp bead 10c, wherein, LED lamp bead 10a is a Chip-A lamp bead, and LED lamp bead 10c is a Chip-C lamp bead.
  • Both the LED lamp bead 10a and the LED lamp bead 10c are electrically connected to four wires 20.
  • the four pairs of pins of each LED lamp bead are electrically connected to four wires respectively.
  • the four wires are respectively the first wire 21, the second wire 22,
  • the third wire 23 and the fourth wire 24 the first wire 21 is a positive wire
  • the second wire 22 is a positive wire
  • the third wire 23 is a communication wire
  • the fourth wire is a negative wire.
  • Two LED lamp beads in multiple LED modules are arranged sequentially on four wires 20 to form a strip, that is, forming a long light string, which can be used as an ambient light to decorate other objects, such as a Christmas tree.
  • the LED lamp beads on the strip are all connected in series;
  • the modules are connected in parallel with each other, and the two LED lamp beads of each LED module are connected in series, that is, the LED lamp beads 10a and the LED lamp beads 10c are connected in series.
  • one end of the three chips of the LED lamp bead 10a is electrically connected to the second die-bonding part of its second pin, and the other ends of the three chips of the LED lamp bead 10a are all electrically connected to the control end of the driver chip.
  • the positive terminal VDD of the driver chip is electrically connected to the second solid die part of the LED lamp bead 10a, and the negative terminal GND of the driver chip is connected to the sixth solid die part of the sixth pin of the LED lamp bead 10a;
  • One end of the three chips of the LED lamp bead 10c is electrically connected to the fifth solid crystal part of the fifth pin, and the other ends of the three chips of the LED lamp bead 10c are electrically connected to the control end of the driver chip.
  • the positive terminal VDD of the driver chip is electrically connected to the fifth solid-crystal part of the LED lamp bead 10c, and the negative terminal GND of the driver chip is electrically connected to the eighth solid-crystal part of the LED lamp bead 10c, thereby realizing two LEDs.
  • Lamp beads are connected in series for power supply.
  • the power supply path is: for each LED lamp bead in the LED module, the current passes through the first wire 21, the second die-hardening part of the second pin of the LED lamp bead 10a, and the driver chip of the LED lamp bead 10a in sequence.
  • the eighth solid-crystal part and the fourth wire of the eighth pin form a series power supply circuit; for different LED modules, since the LED lamp bead 10a of each LED module is connected to the first wire 21, the LED lamp bead 10a is connected to the first wire 21.
  • the LED lamp beads 10c connected in series of 10a are connected to the fourth conductor 24, from which it can be determined that each LED module is connected in parallel to the first conductor and the fourth conductor.
  • the LED light strip 100 may specifically include at least four wires 20 and multiple LED modules.
  • each LED module includes six LED lamp beads, each of which is an LED lamp.
  • LED lamp bead 10a one LED lamp bead 10c and four LED lamp beads 10b
  • LED lamp bead 10a is the first lamp bead
  • LED lamp bead 10c is the tail lamp bead.
  • the LED lamp bead 10a is a Chip-A lamp bead
  • the LED lamp bead 10b is a Chip-B lamp bead
  • the LED lamp bead 10c is a Chip-C lamp bead.
  • LED lamp bead 10a, LED lamp bead 10b and LED lamp bead 10c are all electrically connected to four conductors 20.
  • the four conductors are respectively a first conductor 21, a second conductor 22, a third conductor 23 and a fourth conductor 24.
  • the first conductor 21 is a positive wire
  • the second wire 22 is a positive wire
  • the third wire 23 is a communication wire
  • the fourth wire is a negative wire.
  • Six LED lamp beads in multiple LED modules are arranged sequentially on four wires 20 to form a strip, that is, a long light string, which can be used as an ambient light to decorate other objects, such as a Christmas tree.
  • the LED lamp beads on the strip are all connected in series;
  • the modules are connected in parallel with each other, and the six LED lamp beads of each LED module are connected in series, that is, the LED lamp bead 10a, the four LED lamp beads 10b and the LED lamp bead 10c are connected in series.
  • Chip-A lamp beads Chip-B lamp beads and Chip-C lamp beads provided in the above embodiments.
  • LED lamps shown in Figures 42 to 43. Please refer to the corresponding embodiments for understanding, and will not introduce them in detail here.
  • the working voltages of Chip-A lamp beads, Chip-B lamp beads and Chip-C lamp beads may be the same, different, or approximately the same.
  • the working voltage of Chip-A lamp bead, Chip-B lamp bead and Chip-C lamp bead is the same, for example, the working voltage is 5v.
  • other voltages can also be used, such as 3.3V or 3.6V. Therefore, the power supply voltage of the LED light strip shown in Figure 42 is 15V, the power supply voltage of the LED light strip shown in Figure 42 is 10V, and the power supply voltage of the LED light strip shown in Figure 41 is 30V.
  • the high-voltage power supply can be understood as the current market generally uses less than 10V.
  • a power supply device supplies power to the LED light strip. If the LED light strip is long, the low-voltage power supply due to line loss will cause insufficient brightness of the LED lamp beads at the end of the LED light strip, which will affect the user experience. And with the LED light The longer the belt is used, the more obvious this phenomenon becomes.
  • the LED light strip provided by the embodiment of the present application can use high-voltage power supply such as 15V, 30V, and 40V. The high-voltage power supply can reduce the impact of voltage line loss, thereby improving the user experience.
  • each LED module of the LED light strip includes six LED lamp beads. Of course, it can also include other numbers of lamp beads. For example, each LED module Including four, five, seven, eight, nine, etc., it can be understood that each LED module can also include n LED lamp beads, where n is a positive integer greater than or equal to 2.
  • the first lamp bead and the tail lamp bead in each LED module are LED lamp bead 10a and LED lamp bead 10c respectively, and the middle lamp bead is LED lamp bead 10b.
  • multiple LED modules of an LED light strip can include the same number of LED lamp beads, and of course can also include different numbers of LED lamp beads, which is not limited here.
  • the LED light strips provided by the embodiments of the present application include at least four wires and multiple LED modules.
  • Each LED module includes at least two LED lamp beads, and the at least two LED lamp beads are electrically connected to the four wires. Connection, one of the four wires is a communication wire, and the other three wires are power supply wires.
  • Multiple LED lamp beads in each LED module are arranged on the four wires in sequence and form a strip, that is, all LEDs appear from the appearance
  • the lamp beads are all connected in series on four wires, but on the power supply wire, multiple LED modules are connected in parallel with each other and at least two LED lamp beads of each LED module are connected in series, but on the communication wire, the strip
  • the LED lamp beads are all connected in series.
  • the LED light strip adopts series-parallel power supply and series signal connection to achieve a variety of application solutions with different power supply voltages.
  • This uses a serial communication protocol to control each LED bead on the LED light strip, thereby achieving a luminous effect. It is diverse and can be adjusted at will, and is not limited by the number of cascading points and distance.
  • This LED light strip can effectively solve the difficulties and pain points of existing LED light strips, that is, it can achieve long-distance cascading, diverse lighting effects, easy control, and the power supply voltage can be adjusted arbitrarily according to needs.
  • the LED light strip can also be made using the same production process as the current leather cord lamps. It is simple to make and can improve the production efficiency of the LED light strip.
  • the LED light strip 100 may also include a power controller 30, which may also be called a power supply device or a control device.
  • the power controller 30 is used to provide power to the LED light strip through four wires.
  • the LED lamp beads provide working voltage and control signals.
  • the power controller 30 also includes a processor, such as a microcontroller, etc., for providing control signals to the LED lamp beads to control other lighting, such as adjusting color. and lighting duration, etc.
  • the power controller 30 can use a serial cascade communication protocol to control the LED lamp beads in the LED light strip.
  • Serial cascade communication protocols include return-to-zero code communication protocols and return-to-one code communication protocols.
  • the first end of the first wire 21 is used to connect to the positive terminal of the power controller 30, and the first end of the second wire 22 can be connected to the first end of the first wire 21, thereby saving power control.
  • the first end of the fourth wire 24 is connected to the negative terminal of the power controller; the first end of the third wire 23 is connected to the signal port of the power controller.
  • the first end of the wire refers to the end connected to the power controller 30 .
  • the LED light strip includes one type or multiple types of LED modules, and each type of LED module corresponds to a supply voltage.
  • different types of LED modules include different numbers of LED lamp beads. Since different numbers of LED lamp beads are connected in series, the corresponding power supply voltages are also different.
  • a cutting mark can be provided on the strip corresponding to the LED light strip.
  • the cutting mark at least includes a voltage mark.
  • the cutting mark can be a label that sets the wires of the LED light strip. , this voltage designation is used to instruct the user to tailor it to their needs.
  • an LED light strip includes multiple LED modules powered by 12V and multiple LED modules powered by 24V. The cutting mark can be set between the two to facilitate the user to cut two LED light strips.
  • a cutting mark can be provided on the strip corresponding to the LED light strip.
  • the cutting mark can be a cutting opening, which is provided on the wire of the LED light strip.
  • laser or cutting can be used.
  • the tool makes a scissor opening on the wire to prompt the user to cut at the scissor opening.
  • the cutting tool is such as scissors.
  • an LED light strip includes multiple LED modules powered by 12V and multiple LED modules powered by 24V, making it easier for users to cut two LED light strips.

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Abstract

一种LED灯带(100)，LED灯带(100)包括至少四条导线(20)和多个LED模组，LED模组包括至少两个LED灯珠(10)，至少两个LED灯珠(10)与四条导线(20)电性连接，且多个LED灯珠(10)依次排列四条导线上并形成一个条带；四条导线(20)中的一条导线为通信导线，其他三条导线(20)为供电导线；在通信导线上，条带上的LED灯珠(10)均串联；在供电导线上，多个LED模组之间彼此并联，且每个LED模组的至少两个LED灯珠(10)串联。该LED灯带采用电源串并联、信号串联的方式，以实现多种不同供电电压的应用方案，由此采用串行通讯协议控制LED灯带上的每个LED灯珠，实现发光效果多样，该LED灯带的生产工艺简单。

Description

LED灯带 技术领域
本申请涉及发光二极管技术领域，尤其涉及一种LED灯带。
背景技术
发光二极管(Light－EmittingDiode，LED)具有节能、省电、高效率、反应时间快、寿命周期长、且不含汞和环保等优点，被广泛用于照明行业。具体比如可以制成LED灯带以用于氛围装饰，该LED灯带也可以称为LED灯串。目前市场上的LED灯带，基本上使用插件LED或贴片LED通过串联方式实现单色或多色LED灯带，但是无法进行单个LED进行控制，发光效果单一。当然目前也可以采用电力载波的方案，但也受到供电电压波动会引起丢失数据及级联点数限制，导致LED灯带无法长距离多点数向下级联，由此限制了LED灯带的长度。因此，有必要提供一种新的LED灯带以解决上述问题。
发明内容
本申请旨在提供了一种制作简单且易安装、电源适配简便、易于控制便于适配于周围场景色调的LED灯带，进而可以提高用户的使用体验，将其作为气氛灯进行装饰，可以提高节日气氛的效果。
本申请实施例提供的一种LED灯带，该LED灯带包括：
至少四条导线；
多个LED模组，所述LED模组包括至少两个LED灯珠，所述至少两个LED灯珠与所述四条导线电性连接，且多个所述LED灯珠依次排列所述四条导线上并形成一个条带；
其中，所述四条导线中的一条导线为通信导线，其他三条导线为供电导线；在所述通信导线上，所述条带上的LED灯珠均串联；在所述供电导线上，多个所述LED模组之间彼此并联，且每个所述LED模组的至少两个LED灯珠串联。
本申请实施例提供的LED灯带，其均包括至少四条导线和多个LED模组，每个LED模组包括至少两个LED灯珠，至少两个LED灯珠与四条导线电性连接，四条导线中的一条导线为通信导线，其他三条导线为供电导线，每个LED模组中的多个LED灯珠依次排列在四条导线上并形成一个条带，即从外观上看所有LED灯珠均是焊接在四条导线上，但是在供电导线上，多个LED模组之间彼此并联且每个LED模组的至少两个LED灯珠串联，但是在通信导线上，该条带上的LED灯珠均串联。该LED灯带采用电源串并联、信号串联的方式，以实现多种不同供电电压的应用方案，由此采用串行通讯协议控制LED灯带上的每个LED灯珠，由此可以实现发光效果多样且可任意调节，且不受级联点数以及距离限制。该LED灯带可以有效地解决了现有LED灯带的难点和痛点，即可以实现长距离级联、发光效果多样、控制简便且供电电压可以根据需求任意调节。此外，该LED灯带还可以采用目前皮线灯相同的生产工艺制作，制作简单，可以提高LED灯带的生产效率。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本申请。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种LED灯珠的结构示意图；
图2是本申请实施例提供的一种LED灯珠的另一视角结构示意图；
图3是本申请实施例提供的一种LED灯珠的爆炸结构示意图；
图4a和图4b是本申请实施例提供的LED灯珠的一种引脚的不同视角的结构示意图；
图5是本申请实施例提供的一种LED灯珠的结构示意图；
图6是本申请实施例提供的一种LED灯珠的电路连接关系的示意图；
图7是本申请实施例提供的驱动芯片的结构示意图；
图8是本申请实施例提供的LED灯珠的另一种引脚的结构示意图；
图9是本申请实施例提供的LED灯珠的又一种引脚的结构示意图；
图10a和图10b是本申请实施例提供的LED灯珠与导线连接关系的不同视角的结构示意图；
图11是本申请实施例提供的另一种LED灯珠的结构示意图；
图12是本申请实施例提供的另一种LED灯珠的另一视角结构示意图；
图13是本申请实施例提供的另一种LED灯珠的爆炸结构示意图；
图14是本申请实施例提供的LED灯珠的一种引脚的结构示意图；
图15a和图15b是本申请实施例提供的一种LED灯珠的电路连接关系的示意图；
图16a和图16b是本申请实施例提供的LED灯珠的引脚的填充效果示意图；
图16c和图16d是本申请实施例提供的两个固晶部的结构示意图；
图17a和图17b是本申请实施例提供的LED灯珠与导线连接关系的不同视角的结构示意图；
图18是本申请实施例提供的另一种LED灯珠的结构示意图；
图19是本申请实施例提供的另一种LED灯珠的爆炸结构示意图；
图20是本申请实施例提供的LED灯珠的一种引脚的结构示意图；
图21是本申请实施例提供的一种LED灯珠的电路连接关系的示意图；
图22是本申请实施例提供的另一种LED灯珠的结构示意图；
图23是本申请实施例提供的另一种LED灯珠的爆炸结构示意图；
图24是本申请实施例提供的LED灯珠的一种引脚的结构示意图；
图25是本申请实施例提供的LED灯珠的引脚的填充效果示意图；
图26是本申请实施例提供的一种LED灯珠的电路连接关系的示意图；
图27是本申请实施例提供的另一种LED灯珠的结构示意图；
图28是本申请实施例提供的另一种LED灯珠的爆炸结构示意图；
图29是本申请实施例提供的LED灯珠的一种引脚的结构示意图；
图30是本申请实施例提供的一种LED灯珠的电路连接关系的示意图；
图31是本申请实施例提供的另一种LED灯珠的结构示意图；
图32是本申请实施例提供的另一种LED灯珠的爆炸结构示意图；
图33是本申请实施例提供的LED灯珠的一种引脚的结构示意图；
图34是本申请实施例提供的LED灯珠的引脚的填充效果示意图；
图35是本申请实施例提供的一种LED灯珠的电路连接关系的示意图；
图36是本申请实施例提供的一种LED灯带的结构示意图；
图37是本申请实施例提供的一种LED灯带的另一视角的结构示意图；
图38是本申请实施例提供的一种LED灯带的电路连接关系的示意图；
图39是本申请实施例提供的另一种LED灯带的结构示意图；
图40是本申请实施例提供的另一种LED灯带的电路连接关系的示意图；
图41是本申请实施例提供的另一种LED灯带的结构示意图；
图42是本申请实施例提供的又一种LED灯带的结构示意图；
图43是本申请实施例提供的又一种LED灯带的另一视角的结构示意图；
图44是本申请实施例提供的又一种LED灯带的电路连接关系的示意图；
图45是本申请实施例提供的又一种LED灯带的结构示意图；
图46是本申请实施例提供的又一种LED灯带的电路连接关系的示意图；
图47是本申请实施例提供的又一种LED灯带的结构示意图；
图48是本申请实施例提供的又一种LED灯带的结构示意图。
主要元件及符号说明：
100、LED灯带；10、LED灯珠；101、键合线；11、绝缘座；110、填充树脂；111、凹腔；112、标识件；12、发光组件；121、驱动芯片；122、晶片；1221、绿光芯片；1222、红光芯片；1223、蓝光芯片；13、封装胶；14、引脚；1401、连接部；1402、固晶部；14021、晶片放置部；14022、键合线连接点放置部；1403、芯片安装槽；1404、导电电极；141、第一引脚；1411、第一连接部；1412、第一固晶部；142、第二引脚；1421、第二连接部；1422、第二固晶部；14221、第一设置部；14222、第二设置部；143、第三引脚；1431、第三连接部；1432、第三固晶部；144、第四引脚；1441、第四连接部；1442、第四固晶部；145、第五引脚；1451、第五连接部；1452、第五固晶部；14521、第三设置部；14522、第四设置部；146、第六引脚；1461、第六连接部；1462、第六固晶部；14621、第一放置部；14622、第二放置部；147、第七引脚；1471、第七连接部；1472、第七固晶部；148、第八引脚；1481、第八连接部；1482、第八固晶部；14821、第三放置部；14822、第四放置部；14a、第一过渡引脚；14a1、第一过渡引脚的固晶部；14a11、固定端部；14a12、连接端部；14b、第二过渡引脚；15、隔离板；
20、导线；201、导电线芯；202、绝缘层；21、第一导线；22、第二导线；23、第三导线；24、第四导线；30、电源控制器。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
还应当理解，在此本申请说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本申请。如在本申请说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
还应当进一步理解，在本申请说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。
发光二极管(Light－EmittingDiode，LED)具有节能、省电、高效率、反应时间快、寿命周期长且环保等优点，被广泛用于照明行业。具体比如可以制成LED灯带以用于氛围灯装饰，该LED灯带也可以称为LED灯串或者皮线灯。目前市场上的LED灯带，基本上使用插件LED或贴片LED通过串联方式实现单色或多色LED灯带，但是无法进行单个LED进行控制，发光效果单一。
当然目前也可以采用电力载波对LED进行控制的方案，但也受到供电电压波动会引起丢失数据及级联点数限制，导致LED灯带无法长距离多点数向下级联，由此限制了LED灯带的长度。同时目前LED灯串的连接方式也会导致长距离的LED灯串出现电压损耗，会降低位于LED灯串尾部的LED的发光亮度，使得整条LED灯带上LED发光不均匀，进而降低了氛围灯的效果。
比如，LED灯带可以作为圣诞灯，圣诞灯是节日的氛围装饰灯具，每当节日到来的时候，一些商场、市政街道、学校、公园、圣诞树、灌木、树木等会挂满LED灯串，可以有 效的提升了节日的气氛。因此，需要实现LED灯带的应用方案易安装、电源适配简便、易于控制、与周围场景色调一致及实现高电压传输优为重要。
目前市场存在的LED灯带产品大致包括两类，分别为插件类LED灯串和贴片类LED灯串，但是均存在以下缺点：
插件类LED灯串：没有办法实现小型化，产品颜色单一或多种发光产品混合，用串联方式实现高压应用，发光效果较差，仅实现单一效果，不能实现流水灯、跑马灯(也称为走马灯)等发光效果。
贴片类LED灯串，虽然可以实现小型化，但是需要采用多组多色的LED进行必要的串联或并联，贴在皮线灯串上，再外置电源控制器，难以实现高压皮线灯串，但这样的LED灯带发光效果也同样受限，仅实现单一发光效果，不能实现流水灯、跑马灯类等发光效果。当然可以采用载波通信的方式，实现流水灯、跑马灯等发光效果，使得发光样式多变，但受载波通信技术的本身问题，不能实现长距离级联，每个级联点可以对应一个LED或多个LED，由于级联点数过多，容易受线损(比如长距离电阻及电源波动)及干扰(比如电源本身的波形干扰)影响，因此也无法实现长距离，多点数级联。
为此，本申请的实施例提供了多种LED灯珠以及由多种LED灯珠组成LED灯带，该LED灯带的制作简单且易安装、电源适配简便、易于控制便于适配于周围场景色调、同时还可以实现高电压传输。
本申请实施例提供的LED灯带包括至少四条导线和多个LED模组。其中，LED模组包括至少两个LED灯珠，至少两个LED灯珠与四条导线电性连接，且多个LED灯珠依次排列四条导线上并形成一个条带，因此从外观上多个LED模组的多个LED灯珠形成一个长串。其中，四条导线中的一条导线为通信导线，其他三条导线为供电导线；在通信导线上，所述条带上的LED灯珠均串联；在供电导线上，多个LED模组之间彼此并联，每个LED模组的至少两个LED灯珠串联。
本申请提供的LED灯带采用电源串并联、信号串联的方式，以实现多种不同供电电压的应用方案，由此采用串行通讯协议控制LED灯带上的每个LED灯珠，由此可以实现发光效果多样且可任意调节，且不受级联点数以及距离限制。该LED灯带可以有效地解决了现有LED灯带的难点和痛点，即可以实现长距离级联、发光效果多样、控制简便且供电电压可以根据需求任意调节。此外，该LED灯带还可以采用目前皮线灯相同的生产工艺制作，制作简单，可以提高LED灯带的生产效率。
需要说明的是，本申请的实施例中，LED灯珠可以包括一个或多个发光芯片和用于驱动该发光芯片发光的驱动芯片，该发光芯片为LED，具体为PN结构，发光芯片比如为红光芯片、绿光芯片或蓝光芯片，也可以称为红光LED、绿光LED、蓝光LED。其中，LED灯珠也可以称为LED灯；LED模组可以包括本申请实施例提供的一个或多个LED灯珠。
为了便于理解，先介绍本申请实施例提供的多个LED灯珠，再介绍由多个灯珠制成LED灯带。其中，本申请实施例提供的多个LED灯珠可以分为三大类LED灯珠，分别称为A类灯珠、B类灯珠和C类灯珠，A类灯珠、B类灯珠和C类灯珠又分别包括两种类型，分别为Top型和Chip型，具体地A类灯珠包括Top-A灯珠和Chip-A灯珠，B类灯珠包括Top-B灯珠和Chip-B灯珠，C类包括Top-C灯珠和Chip-C灯珠，其中Top和Chip类型灯珠为采用不同的加工工艺制成。
需要说明的是，对于Top-A灯珠和Chip-A灯珠、Top-B灯珠和Chip-B灯珠、Top-C灯珠和Chip-C灯珠，均包括多个实施例。
对于Top-A灯珠，请参阅图1至图3，图1至图3分别示出了本申请实施例提供的一种LED灯珠的结构示意图。如图1至图3所示，该LED灯珠10包括绝缘座11、发光组件12、封装胶13和至少四对引脚14。
其中，发光组件12包括驱动芯片121和晶片122，驱动芯片121与晶片122通过键合 线101连接，驱动芯片121用于驱动晶片122发光。在本实施例中，晶片122可以为多彩发光芯片，具体可以包括绿光芯片1221、红光芯片1222和蓝光芯片1223，通过绿光芯片1221、红光芯片1222和蓝光芯片1223形成全彩色光灯。
在一些实施例中，晶片122还可以包括单色发光芯片或者多个单色发光芯片的组合，比如蓝光芯片、红光芯片或绿光芯片，或者通过蓝光芯片、红光芯片和绿光芯片中组合形成全彩色光灯，或者还可以与白色发光芯片组合，白色发光芯片可以配合蓝光芯片、红光芯片和绿光芯片中一个发光芯片或多个发光芯片以形成多种色彩的灯光。
封装胶13覆盖发光组件12，具体覆盖在驱动芯片121和晶片122上，其中，该封装胶13具体为透光胶，具体比如可以是透明胶或半透明胶等，使得晶片发出来的光可以透过封装胶13向外部传播，同时该封装胶13还可以保护发光组件12以及发光组件12之间连接线，该连接线具体可以为键合线，键合线比如为金线、银线、铜线、铝线和合金线中的一种。
在一些实施例中，如图3所示，绝缘座11下凹形成有用于容置发光组件12的凹腔111，封装胶13填充于凹腔111内，由此可以增加封装胶13的牢固性，此外该凹腔111还可以作为反光杯，用于对晶片122发出的光进行反射，使得晶片122发出光向凹腔111的开口方向传播。
至少四对引脚14固定于绝缘座11上，比如四对引脚14与绝缘座11一体成型，具体可以通过注塑工艺形成。其中，引脚14包括连接部1401和固晶部1402，发光组件12设于固晶部1402上，连接部1401用于与导线电性连接。具体地，连接部1401和固晶部1402电性连接，具体比如连接部1401和固晶部1402一体成型。导线为外部导线，具体可以包括导电线芯和包裹在该导电线芯上的绝缘层，从导线的功能上，导线又可以分为供电导线和通信导线。
具体地，示例性的，如图2所示，四对引脚14的连接部均位于绝缘座11的底部且间隔排列，每对引脚14的连接部分别位于绝缘座11的底部的两侧且相对；相应地，引脚14的固晶部间隔设置在绝缘座11的顶部。
对于绝缘座11下凹形成有用于容置发光组件12的凹腔111时，部分引脚14的固晶部1402或者固晶部1402中部分位于凹腔111的底部。
四对引脚14分别为第一引脚141、第二引脚142、第三引脚143、第四引脚144、第五引脚145、第六引脚146、第七引脚147和第八引脚148。其中，第一引脚141和第二引脚142组成第一引脚对，第三引脚143和第四引脚144组成第二引脚对，第五引脚145和第六引脚146组成第三引脚对，第七引脚147和第八引脚148组成第四引脚对。
需要说明的是，本申请实施提供的LED灯珠均是包括至少四对引脚14，当然可以理解的是，还可以包括更多引脚14，比如可以包括五对引脚14或者更多对引脚14，在此不做限定。
如图4a和图4b所示，第一引脚141包括第一连接部1411和第一固晶部1412，第二引脚142包括第二连接部1421和第二固晶部1422，其中，第一固晶部1412和第二固晶部1422可以一体成型，一体成型可以使得第一引脚141和第二引脚142与导线的焊线可以少焊一些焊点，利用固晶部一体成型进行电气连接，由于后续该LED灯珠用于制成LED灯带时，焊接在该第一引脚141和第二引脚142的导线是公共正极(阳极)，可以是一直从头到尾并在一起的，即从首灯珠至尾灯珠，可以相对提高灯带的可靠性。第三引脚143包括第三连接部1431和第三固晶部1432，第四引脚144包括第四连接部1441和第四固晶部1442，第五引脚145包括第五连接部和第五固晶部，第六引脚146包括第六固晶部，第七引脚147包括第七连接部1471和第七固晶部1472，第八引脚包括第八连接部1481和第八固晶部1482。
需要说明的是，在无特殊说明情况下，各个引脚14的固晶部在绝缘座11均为间隔设置，间隔设置的主要原因是为了电气连接需要。特殊情况比如第一固晶部1412和第二固晶部1422也可以一体成型。对于一体成型的两个或多个固晶部，由于部分固晶部设有电子器件， 部分固晶部没有设有电子器件，比如第四固晶部1442设有驱动芯片121或晶片122等，设有电子器件的固晶部在工作时产生的热量，而没有设有电子器件的固晶部的产生的热量则相对较小，故如果不间隔设置则容易因受热不同而易拱起，所以固晶部间隔设置可以有效防止其受热不均匀而拱起，进而可以提高引脚14与绝缘座11的牢固性。
在本申请的实施例中，具体如图5和图6所示，驱动芯片121设置在第四引脚144的第四固晶部1442上，晶片122包括绿光芯片1221、红光芯片1222和蓝光芯片1223，其中，绿光芯片1221、红光芯片1222和蓝光芯片1223的一端子均与驱动芯片121连接。当然可以理解的是，驱动芯片121也可以设置在其他引脚的固晶部上，晶片122也可以包括其他颜色发光芯片，或者少于三个或多于三个发光芯片。
晶片122与第一固晶部1412电性连接，具体地晶片122可以通过键合线101与第一固晶部1412电性连接，或者晶片122还可以通过粘合接触与第一固晶部1412电性连接，示例性的，比如晶片122的底部可以用导电银胶以热固的形式完成与第一固晶部1412电性连接。需知由于第一固晶部1412和第二固晶部1422一体成型，故也称为晶片122与第二固晶部1422电性连接。即使第一固晶部1412和第二固晶部1422不是一体成型而是间隔设置的，晶片122可以与第一固晶部1412电性连接，也可以与第二固晶部1422电性连接，电性连接的方式包括键合线或导电银胶等方式。
需要说明的是，具体需要使用键合线或导电银胶实现晶片与固晶部的电性连接，需要根据晶片的类型确定，晶片的PN结的结构有可能是垂直结构也有可能是水平结构。对于是垂直结构的，那么该晶片的底部端子则需要使用导电银胶与固晶部连接，晶片的底部是指设置在固晶部上的一端部，晶片的顶部端子则需要使用键合线与驱动芯片电性连接。
上述实施例提供的LED灯珠10，由于四对引脚14的设计以及四对引脚14与发光组件12的连接关系，可以使得该LED灯珠10通过四条导线与其他LED灯珠连接，即和其他灯珠有序排列在四条导线上，从外观上看多个LED灯珠在四条导线上组成一个LED灯串，但是在电路连接存在串联和并联，在通信连接关系上各个LED灯珠均是串联便于控制，由此可以使得LED灯带的加工更加容易，同时实现LED灯带的高压供电、长距离级联以及发光多样性，比如可以实现流水灯和跑马灯等发光样式。
如图6和图7所示，驱动芯片121的正极端VDD通过键合线101与第一固晶部1412电性连接，也可以称为与第二固晶部1422电性连接，驱动芯片121的负极端GND通过键合线101与第四固晶部1442电性连接，驱动芯片121的正极端VDD也可以称为供电端，驱动芯片121的负极端GND也可以称为接地端。第五固晶部1452用于给驱动芯片121的信号输入端Din传输控制信号，第六固晶部1462通过键合线101与驱动芯片121的信号输出端Dout连接。
具体地，在一些实施例中，如图5所示，第一固晶部1412(或者第二固晶部1422)设置有一个或多个晶片122；晶片122通过键合线101与驱动芯片121电性连接，晶片122还通过键合线101与第一固晶部1412(或者第二固晶部1422)电性连接，或者，晶片122还通过粘合接触与第一固晶部1412(或者第二固晶部1422)电性连接。驱动芯片121用于控制晶片122的发光。需要说明的是，晶片122和驱动芯片121也可以设置在其他固晶部上，在此不做限定。
具体地，如图6和图7所示，第一固晶部1412设置有绿光芯片1221和红光芯片1222，或者称为第二固晶部1422设有绿光芯片1221和红光芯片1222。其中，绿光芯片1221通过键合线101分别与第一固晶部1412和驱动芯片121电性连接。红光芯片1222通过键合线101与驱动芯片121连接，以及通过粘合接触与第一固晶部1412电性连接。
具体地，绿光芯片1221的第一端子通过键合线与第一固晶部1412电性连接，绿光芯片1221的第二端子通过键合线101与驱动芯片121的G控制端电性连接，绿光芯片1221的第一端子和第二端子对应PN结的两端，可以通过控制绿光芯片1221的第一端子和第二端子 之间的电压，控制绿光芯片1221的PN结发光。
具体地，红光芯片1222的第一端子导电银胶与第一固晶部1412电性连接，红光芯片1222的第二端子通过键合线101与驱动芯片121的R控制端电性连接，红光芯片1222的第一端子和第二端子对应PN结的两端，可以通过控制红光芯片1222的第一端子和第二端子之间的电压，控制红光芯片1222的PN结发光。需要说明的是，红光芯片1222的为上下垂直结构的PN结。
在一些实施例中，第四固晶部1442设置有驱动芯片121和晶片122，该晶片122通过键合线与第一固晶部1412电性连接，也可以称为与第二固晶部1422电性连接，该晶片122还通过键合线与驱动芯片121电性连接。
示例性的，如图6和图7所示，设置在第四固晶部1442的晶片为蓝光芯片1223，当然也可以是其他颜色的晶片，该蓝光芯片1223的第一端子通过键合线与第一固晶部1412电性连接，该蓝光芯片1223的第二端子还通过键合线与驱动芯片121的B控制端电性连接。为了提高LED灯珠的发光效果，将蓝光芯片1223设置第四固晶部1442中靠近第一固晶部1412的位置，使得蓝光芯片1223靠近设置在第一固晶部1412上的晶片，比如绿光芯片1221和红光芯片1222。进而可以在驱动芯片121的控制下，利用三种不同颜色的发光芯片产生不同的颜色组合。
在一些实施例中，为了提高LED灯珠实际应用中的可靠性，可以将图4a和图6示出的一体成型的第一固晶部1412和第二固晶部1422切断，示例性的如图8和图9所示，因为有断面，切断后第一固晶部1412和第二固晶部1422在受热膨胀时，可以减缓内部应力释放，进而可以提高LED灯珠的可靠性。
需要说明的是，将一体成型的第一固晶部1412和第二固晶部1422切断，具体包括如图8和图9示出的两种方式，切断后的第一固晶部1412和第二固晶部1422。因此驱动芯片121的正极端VDD可以通过键合线101与切断后的第一固晶部1412电性连接，或者驱动芯片121的正极端VDD还可以通过键合线101与切断后的第二固晶部1422电性连接，具体如图9所示。
在一些实施例中，如图4a和图6所示，LED灯珠10还包括第一过渡引脚14a，第一过渡引脚14a包括固晶部14a1，第一过渡引脚14a的固晶部14a1设有二极管D1，二极管D1的一端与第一过渡引脚14a的固晶部电性14a1连接，二极管D1的另一端通过键合线与第一固晶部1412电性连接，第一过渡引脚14a的固晶部14a1还通过键合线101与驱动芯片121的信号输入Din端连接，第一过渡引脚14a的固晶部14a1还与第五固晶部1452电性连接。该二极管D1具体可以为肖特基二极管。由于驱动芯片121的信号输入端Din需要参考电压，因此需要快速反应的肖特基二极管拉电压，以便给信号输入端Din的信号做参考，由此提高LED灯珠的通信质量。
在一些实施例中，如图6所示，第一过渡引脚14a的固晶部14a1通过电容C1与第五固晶部1452电性连接。由于本申请实施例提供的LED灯珠可以制成高压供电的LED灯带，同时控制信号也相应的为高压高低电平信号，因此利用该电容C1耦合信号，可以提高信号的传输质量。
需要说明的是，当该二极管为PN型结构，二极管D1的阴极与第一过渡引脚14a的固晶部电性14a1连接，二极管D1的阳极通过键合线与第一固晶部1412电性连接；当该二极管为NP型结构，二极管D1的阳极与第一过渡引脚14a的固晶部电性14a1连接，二极管D1的阴极通过键合线与第一固晶部1412电性连接。二极管D1与固晶部通过粘合连接，也可以通过导电银胶粘合连接。电容C1与固晶部的连接方式也可以使用导电银胶进行粘合连接。
还需要说明的是，二极管D1和电容C1也可以不设置在第一过渡引脚14a上，比如可以设置该LED灯珠10的外部，即可以通过设置外部电路到达同样的效果。
在一些实施例中，为了便于LED灯珠的加工，如图5和图6所示，还可以设置LED灯珠10还包括第二过渡引脚14b，第一过渡引脚14a和第二过渡引脚14b设置绝缘座11的相对两侧，可以理解为，第二过渡引脚14b的固晶部与第四固晶部1442一体成型，或者还可以理解为，该第二过渡引脚14b为从第四固晶部1442中延伸出。
需要说明的是，在该LED灯珠10加工完成后，一般会在LED灯珠的绝缘座或产品说明书中标明该第一过渡引脚14a和第二过渡引脚14b为空引脚，该空引脚不进行电气连接，起到过渡或承接的作用。
在一些实施例中，为了后续分辨LED灯珠的方向，比如LED灯珠的引脚的方向，还可以在绝缘座11开设标识件112，具体如图1和图3所示，该标识件具体为在绝缘座11开设一个缺口，当然也可以是标识，比如可以是字符等。
如图10a和图10b所示，在上述实施例提供的多个LED灯珠10中，第一引脚141的第一连接部1411和第二引脚142的第二连接部1421均用于与第一导线21电性连接；第三引脚143的第三连接部1431和第四引脚144的第四连接部1441均用于与第二导线22电性连接；第五引脚145的第五连接部1451和第六引脚146的第六连接部1461均用于与第三导线23电性连接，第七引脚147的第七连接部1471和第八引脚148的第八连接部1481均用于与第四导线24电性连接。其中，第一导线21为正极线、第二导线22为正极线，第三导线23为通信导线、第四导线24为负极线。导线20包括导电线芯201和包裹导电线芯201的绝缘层202，导线20也可以为漆包线和橡胶线。
如图10a和图10b所示，第二导线22的导电线芯201位于第三引脚143的第三连接部1431和第四引脚144的第四连接部1441之间的部分切断；第三导线23的导电线芯201位于第五引脚145的第五连接部1451和第六引脚1461的第六连接部1461之间的部分切断。
其中，LED灯珠10与导线20连接的加工工艺具体为：将导线20中相应的位置的绝缘层202刨除露出导电线芯201，在该导电线芯201上涂覆焊锡或者在LED灯珠10的引脚14的连接部涂覆焊锡，再将LED灯珠10的引脚14焊接在导线20上。需要说明的是，在后续使用该LED灯珠10与导线20制成LED灯带时，也采用该加工工艺制作。
还需要说明的是，LED灯珠10的引脚14与导线20电性连接，包括直接连接或间接连接，其中直接连接比如为LED灯珠10的引脚14与导线20焊接连接，间接连接比如可以先在导线20上焊接一个承接板，该承接板上包括多个焊脚，再将LED灯珠10的引脚14对应焊接在该承接板上的焊脚上，LED灯珠10利用承接板与导线20电性连接。
在一些实施例中，如图4a所示，还可以在第四固晶部1442设置芯片安装槽1403，该驱动芯片121设置在芯片安装槽1403内。由于芯片安装槽1403的槽底低于其他固晶部，从而可以让驱动芯片121沉入芯片安装槽1403的底部，这样不仅可以确保晶片122位于驱动芯片121的上方，避免了驱动芯片遮挡到晶片122的光线，有效提高了LED灯珠的亮度。同时也可以降低键合线连接在驱动芯片121最高点的位置，减少键合线101的使用长度，节约LED灯珠的制造成本，同时还可以降低驱动芯片的周围应力释放，进而提高了产品的可靠性。
在一些实施例中，可以设置芯片安装槽1403的槽底距离其他固晶部之间距离为预设距离。其中，预设距离可以为小于驱动芯片121厚度的任何一个尺寸，其目的为了让驱动芯片121沉入凹腔111的底部，这样不仅可以确保晶片122位于驱动芯片121的上方，避免了驱动芯片121遮挡到晶片122的光线，在不增加LED结构的制造成本下，有效提高了LED结构的亮度。此外，LED的封装结构由无机及有机材料复合而成，由于无机材料与有机材料的受热膨胀系数是不一样，因此，无机材料与有机材料所产生的应力也不一样，从而容易造成键合线101的冲线或断裂，而本申请减少了键合线101的使用长度，从而可以降低后续工艺时键合线101所受到的冲击力，避免键合线101出现冲线或断裂等不良现象。
对于Chip-A灯珠，请参阅图11至图13，图11至图13分别示出了本申请实施例提供 的另一种LED灯珠的结构示意图。如图11至图13所示，该LED灯珠10包括绝缘座11、发光组件12、封装胶13和至少四对引脚14。
绝缘座11可以采用塑胶材料制成。发光组件12包括驱动芯片121和晶片122，驱动芯片121与晶片122通过键合线101连接，驱动芯片121用于驱动晶片122发光。在本实施例中，晶片122可以为多彩发光芯片，具体可以包括绿光芯片1221、红光芯片1222和蓝光芯片1223，通过绿光芯片1221、红光芯片1222和蓝光芯片1223形成全彩色光灯。
在一些实施例中，晶片122还可以包括单色发光芯片或者多个单色发光芯片的组合，比如蓝光芯片、红光芯片或绿光芯片，或者通过蓝光芯片、红光芯片和绿光芯片中组合形成全彩色光灯，或者还可以与白色发光芯片组合，白色发光芯片可以配合蓝光芯片、红光芯片和绿光芯片中一个发光芯片或多个发光芯片以形成多种色彩的灯光。
封装胶13覆盖发光组件12，具体覆盖在驱动芯片121和晶片122上，其中，该封装胶13具体为透光胶，具体比如可以是透明胶等，使得晶片发出来的光可以透过封装胶13向除底部外其他方向传播，同时该封装胶13还可以保护发光组件12以及发光组件12之间连接线，该连接线具体可以为键合线。
需要说明的是，本申请实施例提供的键合线比如为金线、银线、铜线、铝线和合金线中的一种。
如图13所示，至少四对引脚14固定于绝缘座11上，具体地比如可以将大张铜箔压合在绝缘座11上，然后在铜箔上蚀刻出引脚14对应的电路，该电路具体为引脚14的连接部1401和固晶部1402，其中，连接部1401和固晶部1402利用过孔1403实现电性连接。四对引脚14可以通过粘合固定于绝缘座11，当然也可以采用其他方式，比如采用模压工艺等。
在本申请的实施例中，引脚14均包括连接部1401，但并不是所有的引脚14均需包括固晶部1402，即可以是部分引脚14包括固晶部1402，或者全部引脚14均包括固晶部1402，发光组件12设于固晶部1402上，连接部1401用于与导线电性连接，导线为外部导线，具体可以包括导电线芯和包裹在该导电线芯上的绝缘层，从导线的功能上，导线又可以分为供电导线和通信导线。
具体地，如图14所示，四对引脚14分别为第一引脚141、第二引脚142、第三引脚143、第四引脚144、第五引脚145、第六引脚146、第七引脚147和第八引脚148。其中，第一引脚141和第二引脚142组成第一引脚对，第三引脚143和第四引脚144组成第二引脚对，第五引脚145和第六引脚146组成第三引脚对，第七引脚147和第八引脚148组成第四引脚对。
具体地，示例性的，如图12所示，四对引脚14的连接部1401均位于绝缘座11的底部且间隔排列，每对引脚14的连接部1401分别位于绝缘座11的底部的两侧且相对；相应地，引脚14的固晶部1402间隔设置在绝缘座11的顶部。
需要说明的是，本申请实施提供的LED灯珠均是包括至少四对引脚14，当然可以理解的是，还可以包括更多引脚14，比如可以包括五对引脚14或者更多对引脚14，在此不做限定。
在使用该LED灯珠10制作LED灯带时，则需要四条导线，四条导线分别为第一导线、第二导线、第三导线和第四导线，其中，第一导线为正极线、第二导线为正极线，第三导线为通信导线、第四导线为负极线。第一引脚对与第一导线连接，即第一引脚141和第二引脚142的连接部均与第一导线电性连接；第二引脚对与第三导线电性连接，即第三引脚143和第四引脚144的连接部均与第三导线电性连接；第三引脚对与第二导线电性连接，即第五引脚145和第六引脚146的连接部均与第二导线电性连接；第四引脚对与第四导线连接，即第七引脚147和第八引脚148的连接部均与第四导线电性连接。其中，第三导线的导电线芯位于第三引脚143和第四引脚144的连接部之间的部分切断；第二导线的导电线芯位于第五引脚145和第六引脚146的连接部之间的部分切断。
在本申请的实施例中，如图15a所示，同时可以参阅图14、图16a和图16b，为了便于 理解，图16a和图16b为对引脚14的连接部和固晶部进行填充。第一引脚141包括第一连接部1411和第一固晶部1412，第二引脚142包括第二连接部1421和第二固晶部1422，晶片122与第二固晶部1422电性连接，驱动芯片121的正极端VDD通过键合线101与第二固晶部1422电性连接。第三引脚143包括第三连接部1431和第三固晶部1432，第四引脚144包括第四连接部1441和第四固晶部1442，第三固晶部1432用于给驱动芯片121的信号输入端Din传输控制信号，第四固晶部1442通过键合线101与驱动芯片121的信号输出端Dout连接。第五引脚145包括第五连接部1451和第五固晶部1452，第六引脚146包括第六连接部1461和第六固晶部1462，驱动芯片121的负极端GND通过键合线101与第六固晶部1462电性连接。第七引脚147包括第七连接部1471和第七固晶部1472，第八引脚148包括第八连接部1481和第八固晶部1482。
其中，第一连接部1411和第二连接部1421用于与第一导线电性连接，第三连接部1431和第四连接部1441用于与第三导线电性连接，第五连接部1451和第六连接部1461用于与第二导线电性连接，第七连接部1471和第八连接部1481用于与第四导线电性连接。
上述实施例提供的LED灯珠10，由于四对引脚14的设计以及四对引脚14与发光组件12的连接关系，可以使得该LED灯珠10通过四条导线与其他LED灯珠连接，即和其他灯珠有序排列在四条导线上，从外观上看多个LED灯珠在四条导线上组成一个LED灯串，但是在电路连接存在串联和并联，在通信连接关系上各个LED灯珠均是串联便于控制，由此可以使得LED灯带的加工更加容易，同时实现LED灯带的高压供电、长距离级联以及发光多样性，比如可以实现流水灯和跑马灯等发光样式。
在本申请的实施例中，第一连接部1411和第二连接部1421一体成型，进而便于与第一导线电性连接，同时又可以增加与第一导线电性连接的可靠性，此外在利用过孔电性连接固晶部和连接部工艺时，可以设置更少的导电电极，便于加工。当然，在一些实施例中，第一连接部1411和第二连接部1421也可以切断，即第一连接部1411和第二连接部1421间隔设置，间隔设置可以有效防止第一连接部1411和第二连接部1421的连接部从绝缘座11上拱起，由此可以提供了LED灯珠的使用寿命。
对于第一引脚141、第七引脚147和第八引脚148，如图15a和图16a所示，由于第一引脚141、第七引脚147和第八引脚148的固晶部主要起到与位于绝缘座11底部的连接部利用过孔电性连接的作用，且其在绝缘座11的顶部的面积也比较小，因此也可以称为第一引脚141、第七引脚147和第八引脚148未包括固晶部。
需要说明的是，关于驱动芯片121的结构可以参考图7，需知图7示出的驱动芯片121不构成对本申请的驱动芯片的结构的限定，比如正极端VDD和负极端GND的位置、信号输入端Din和信号输出端Dout的位置等均是可以不同的驱动芯片而不同的。同时以下实施例提供的LED灯珠的驱动芯片也可以参考图7理解。
在一些实施例中，如图15a和图16a所示，第二固晶部1422和第五固晶部1452连接，具体地第二固晶部1422和第五固晶部1452可以是一体成型。便于后续利用该LED灯珠10制作成LED灯带的电气连接，以及同时又可以提高供电的可靠性，此外还可以在利用过孔电性连接固晶部和连接部工艺时，可以设置更少的导电电极，便于加工。当然可以理解的是，第二固晶部1422和第五固晶部1452也可以间隔设置，即可以将一体成型的第二固晶部1422和第五固晶部1452切断。
在一些实施例中，相对于图15a示出的第一固晶部1412和第二固晶部1422间隔设置，第一固晶部1412和第二固晶部1422也可以是一体成型，具体地如图15b所示。由于第一固晶部1412和第二固晶部1422对应的连接部均与第一导线连接，故可以理解的是，驱动芯片121的正极端VDD可以与第二固晶部1422电性连接，或驱动芯片121的正极端VDD还可以与第一固晶部1412电性连接。
在一些实施例中，为了提供该LED灯珠10的通信质量，便于后续针对LED灯带中每 个LED灯珠的准确控制，在设计该LED灯珠10，如图15a所示，还可以设计LED灯珠10包括第一过渡引脚14a，第一过渡引脚14a包括固晶部14a1，第一过渡引脚14a的固晶部14a1设有二极管D1，二极管D1的阴极与第一过渡引脚14a的固晶部14a1电性连接，二极管D1的阳极通过键合线与第二固晶部1422电性连接。由于该LED灯珠10在制成LED灯带时，可能需要高压驱动每个LED灯珠工作，故驱动芯片121的信号输入端Din需要参考电压，因此需要快速反应的肖特基二极管拉电压，以便给信号输入端Din的信号做参考，由此提高LED灯珠的通信质量。
在一些实施例中，为了进一步地提高通信质量，在设计LED灯珠10时，如图15a所示，还可以设置第一过渡引脚14a的固晶部14a1与第三固晶部1432通过电容C1连接，第一过渡引脚14a1的固晶部14a1通过键合线与驱动芯片121的信号输入端Din连接。该电容C1用于耦合信号，以提高信号的传输质量。
在一些实施例中，如图16a所示，请同时参阅图15a，第一过渡引脚14a的固晶部14a1包括固定端部14a11和连接端部14a12，固定端部14a11和连接端部14a12连接，固定端部14a11用于设置二极管D1和电容C1，连接端部14a12用于设置键合线连接点，其中，该连接端部14a12延伸至与第六固晶部1462对齐，驱动芯片121设置在第六固晶部1462，驱动芯片121的信号输入端Din通过键合线与连接端部14a11电性连接，具体是驱动芯片121的信号输入端Din通过键合线与连接端部14a12设置的键合线连接点连接。此设计可以节省键合线长度，避免了键合线过长而易断裂，由此可以提高产品的使用寿命。
在一些实施例中，该LED灯珠10还可以包括第二过渡引脚(图未示)，该第二过渡引脚和第一过渡引脚设置在绝缘座11的相对两侧。当然也可以不设置第二过渡引脚。
在一些实施例中，由于引脚14的连接部和固晶部还需要电镀工艺进行电镀，或者利用过孔实现电性连接时沉铜工艺也需要电镀，为了便于电镀工艺，在各个引脚14的固晶部上还设置有导电电极1404，该导电电极1404从各个引脚的固晶部延伸至绝缘座11的边缘，示例性的，如图16a所示，第二固晶部1422、第三固晶部1432、第一过渡引脚14a的固晶部14a1和第六固晶部1462均包括导电电极1404。
在一些实施例中，如图15a所示，第二固晶部1422设置有一个或多个晶片122，晶片122通过键合线101与驱动芯片121电性连接。另外该晶片122还通过键合线101与第二固晶部1422电性连接，或者，该晶片122还通过粘合接触与第二固晶部1422电性连接，比如通过导电银胶。需要说明的是，一个或多个晶片122也可以设置在其他固晶部上，在此不做限定。
示例性的，第二固晶部1422设置有绿光芯片1221和红光芯片1222；其中，绿光芯片1221通过键合线101分别与第二固晶部1422和驱动芯片121电性连接，具体是与驱动芯片121的G控制端连接；红光芯片1222通过键合线101与驱动芯片121连接，以及通过粘合接触与第二固晶部1422电性连接。
在本申请的实施例中，示例性的，如图16d所示，第二固晶部1422至少包括间隔设置的第一设置部14221和第二设置部14222，第一设置部14221用于设置绿光芯片1221和红光芯片1222，第二设置部用于设置键合线连接点。由于蓝光芯片和绿光芯片的底部是通过沾结胶与固晶部连接的，沾结胶是有机物，在受热膨胀时内应力释放不一样，极容易引起周边的二焊邦结焊点(键合线连接点)的分层(也可以称为剥离)，进而引起电气连接失效。因此第一设置部14221和第二设置部14222间隔设置可以有效阻隔分层剥离的延伸，有效保护焊点的牢固性，提升产品的可靠性。需要说明的是，在图16d中，第五固晶部1452与第二固晶部1422一体成型，因此也可以认为第五固晶部1452至少包括间隔设置的第一设置部14221和第二设置部14222。
在一些实施例中，第四固晶部1442设置有晶片122，该晶片122通过键合线101与第二固晶部1422电性连接，该晶片122还通过键合线101与驱动芯片121电性连接。具体地， 如图15a所示，设置在第四固晶部1442的晶片122为蓝光芯片1223，并且蓝光芯片1223设置第四固晶部1442中靠近第二固晶部1422的位置，使得蓝光芯片1223靠近设置在第二固晶部1422上的晶片，进而不仅可以节省键合线，还有利于组合出不同的颜色，不仅可以降低产品成本，提升了产品可靠性，还提升了该LED灯珠的复合发光混色效果。
在一些实施例中，如图15a所示，驱动芯片121可以设置在第六固晶部1462上，第六固晶部1462中设置驱动芯片121的区域位于第三固晶部1432、第四固晶部1442、第五固晶部1452之间。具体地，可以理解为第六固晶部1462至少存在一部分延伸至第三固晶部1432、第四固晶部1442、第五固晶部1452之间，由此驱动芯片121与其他固晶部或其他固晶部上晶片的距离，进而便于通过键合线连接，还能提供产品的可靠性和寿命。
在一些实施例中，为了进一步地提高产品的可靠性和使用寿命，如图16c所示，在设计第六固晶部1462时可以设置第六固晶部1462包括间隔设置的第一放置部14621和第二放置部14622，第一放置部14621和第二放置部14622连接，具体可以理解为第一放置部14621和第二放置部14622为一体化设计。其中，第一放置部14621用于设置驱动芯片121，第二放置部14622用于设置键合线连接点，第一放置部14621和第二放置部14622之间部分为间隔区域，由此也可以防止驱动芯片121的发热导致第二放置部14622的键合线连接点剥离，由此可以有效阻隔分层剥离的延伸，有效保护焊点的牢固性，提升产品的可靠性。相应地，第四固晶部1442包括晶片放置部14021和从晶片放置部14021延伸出的键合线连接点放置部14022，键合线连接点放置部14022延伸至所述间隔区域。由此可以进一步地缩短驱动芯片与固晶部连接的键合线的距离，由此可以节省成本以及提高产品的可靠性。
在一些实施例中，如图16b所示，该LED灯珠10还可以包括隔离板15，该隔离板15具体可以为BT(Bismaleimide Triazine)板，也可以称为树脂基板，该隔离板15具体设置在绝缘座11的底部，用于将各个引脚14的连接部进行隔离，避免后续将LED灯珠与导线进行焊接连接时，出现锡珠造成的短接。由于绝缘座11的表面是粗糙的，如果不用隔离板15，在引脚14的连接部与导线焊接时，极易出现短接。
在一些实施例中，如图14所示，在该LED灯珠10中的各个引脚14的连接部和固晶部利用过孔实现电性连接，过孔中间用树脂填充，利于Molding成型工艺，有机胶水不宜渗透至底部焊盘引脚，因产品的过孔圆环引脚与周边相连接，获得单颗产品需要进行切割，使得单颗产品的填充树脂110呈半圆柱型。
如图17a和图17b所示，第一引脚141和第二引脚142组成第一引脚对，与第一导线21电性连接；第三引脚143和第四引脚144组成第二引脚对，与第三导线23电性连接；第五引脚145和第六引脚146组成第三引脚对，与第二导线22连接；第七引脚147和第八引脚148组成第四引脚对，与第四导线24连接。四条导线20分别为第一导线21、第二导线22、第三导线23和第四导线24，其中，第一导线21为正极线、第二导线22为正极线，第三导线23为通信导线、第四导线24为负极线。具体地，第一引脚141的第一连接部1411和第二引脚142的第二连接部1421均与第一导线21电性连接；第三引脚143的第三连接部1431和第四引脚144的第四连接部1441均与第三导线23电性连接；第五引脚145的第五连接部1451和第六引脚146的第六连接部1461均与第二导线22电性连接；第七引脚147的第七连接部1471和第八引脚148的第八连接部1481均与第四导线24电性连接。其中，第三连接部1431和第四连接部1441之间的第三导线23的导电线芯201切断；第五连接部1451和第六连接部1461之间的第二导线22的导电线芯201切断。
在本申请的实施例中，由于采用同一种工艺生产的LED灯珠的外形基本完全相同，因此不便于LED灯带加工，因此该LED灯珠10还可以包括一个标识件，用于表示不同的LED灯珠。示例性的，如图11所示，可以在绝缘座11上设置标识件112，来表示不同的LED灯珠，便于后续用不同的LED灯珠制成LED灯带。标识件112可以用不同的形状表示不同LED灯珠，比如为长方形、正方形和三角形，当然也可以不同的颜色和字符来表示。
对于Top-B灯珠，请参阅图18和图19，图18至图19分别示出了本申请实施例提供的另一种LED灯珠的结构示意图。如图18至图19所示，该LED灯珠10包括绝缘座11、发光组件12、封装胶13和至少四对引脚14。
相对于Top-A灯珠，该LED灯珠10区别在于：至少四对引脚14的固晶部的结构设计，以及发光组件与四对引脚14的固晶部的连接关系。以下主要对该区别进行详细介绍，需知对于绝缘座11、发光组件12、封装胶13以及至少四对引脚14的连接部的结构和设置位置，均可以与Top-A灯珠的绝缘座11、发光组件12、封装胶13以及至少四对引脚14的连接部的结构和设置位置相同，当然也可以不同，在此不做详细介绍。
请同时参阅图20，四对引脚14分别为第一引脚141、第二引脚142、第三引脚143、第四引脚144、第五引脚145、第六引脚146、第七引脚147和第八引脚148。其中，第一引脚141和第二引脚142组成第一引脚对，第三引脚143和第四引脚144组成第二引脚对，第五引脚145和第六引脚146组成第三引脚对，第七引脚147和第八引脚148组成第四引脚对。
如图20和图21所示，第一引脚141包括第一连接部1411和第一固晶部1412，第二引脚142包括第二连接部1421和第二固晶部1422，第一连接部1411和第二连接部1421用于与第一导线电性连，第一导线为正极线，第一固晶部1412和第二固晶部1422间隔设置。第三引脚143包括第三连接部1431和第三固晶部1432，第四引脚144包括第四连接部1441和第四固晶部1442，驱动芯片121的正极端VDD通过键合线101与第三固晶部1432电性连接，驱动芯片121的负极端GND通过键合线101与第四固晶部1442电性连接，晶片122与第三固晶部1432电性连接，晶片122还通过键合线101与驱动芯片121电性连接，第三连接部1431和第四连接部1441用于与第二导线电性连接，且第二导线位于第三连接部1431和第四连接部1441之间的部分切断，第二导线为正极线。第五引脚145包括第五连接部1451和第五固晶部1452，第六引脚146包括第六连接部1461和第六固晶部1462，第五固晶部1452通过键合线101与驱动芯片121的信号输入端Din连接，第六固晶部1462通过键合线101与驱动芯片121的信号输出端Dout连接，第五连接部1451和第六连接部1461用于与第三导线连接，且第三导线位于第五连接部1451和第六连接部1461之间的部分切断，第三导线为通信导线。第七引脚147包括第七连接部1471和第七固晶部1472，第八引脚148包括第八连接部1481和第八固晶部1482，第七连接部1471和第八连接部1481用于第四导线连接，第四导线为负极线，第七固晶部1472和第八固晶部1482间隔设置，当然也可以是一体化设计。LED灯珠10的至少四对引脚14及与发光组件12的连接关系，使得该LED灯珠10可以便于组成LED灯带。
上述实施例提供的LED灯珠10，由于四对引脚14的设计以及四对引脚14与发光组件12的连接关系，可以使得该LED灯珠10通过四条导线与其他LED灯珠连接，即和其他灯珠有序排列在四条导线上，从外观上看多个LED灯珠在四条导线上组成一个LED灯串，但是在电路连接存在串联和并联，在通信连接关系上各个LED灯珠均是串联便于控制，由此可以使得LED灯带的加工更加容易，同时实现LED灯带的高压供电、长距离级联以及发光多样性，比如可以实现流水灯和跑马灯等发光样式。
在一些实施例中，如图20所示，该LED灯珠10还包括：第一过渡引脚14a和第二过渡引脚14b，其中，第二过渡引脚14b的固晶部与第四固晶部1442一体成型，也可以理解为，第二过渡引脚14b从第四固晶部1442中向绝缘座外侧延伸出，进而形成与第一过渡引脚14a对称结构，便于加工。第一过渡引脚14a设计可以LED灯珠中电子元件连接不方便进行过渡，提高了电子元件电气连接的便利性。
在本申请的实施例中，第三固晶部1432或第四固晶部1442可以设置有一个或多个晶片122；该晶片122通过键合线101与驱动芯片121电性连接；该晶片122还通过键合线101与第三固晶部1432电性连接，或者，该晶片122通过粘合接触与第三固晶部1432电性连接。由于第三固晶部1432和第四固晶部1442设置晶片不仅实现后续LED灯带制作，同时还可 以节省键合线长度，又提高产品的可靠性和使用寿命。
示例性的，如图21所示，第三固晶部1432可以设置有绿光芯片1221和红光芯片1222，第四固晶部1442可以设置有蓝光芯片1223；其中，绿光芯片1221通过键合线101分别与第三固晶部1432和驱动芯片121电性连接，具体是与驱动芯片121的G控制端电性连接；红光芯片1222通过键合线101与驱动芯片121连接，具体是与驱动芯片121的R控制端电性连接，以及通过粘合接触与第三固晶部1432电性连接，比如通过导电银胶粘合接触连接；蓝光芯片1223通过键合线101分别与驱动芯片121和第三固晶部1432连接，具体地蓝光芯片1223通过键合线101与驱动芯片121的B控制端连接。
在一些实施例中，蓝光芯片1223设置在第四固晶部1442中靠近第三固晶部1432的位置，使得蓝光芯片1223靠近设置在第三固晶部1432上的晶片，由此可以更好地组合出多种色彩，使得LED灯珠的发光色彩更加多样性以及发光更加均匀，同时还可以节省键合线，增加了产品的可靠性和使用寿命，不仅可以降低产品成本，提升了产品可靠性，还提升了该LED灯珠的复合发光混色效果。
示例性的，如图21所示，驱动芯片121可以设置在第四固晶部1442，当然也可以设置在其他固晶部上。其中，第四固晶部1442中设置驱动芯片121的部分位于第三固晶部1432、第五固晶部1452和第六固晶部1462之间。由此可以节省键合线，增加了产品的可靠性和使用寿命。
在一些实施例中，如图20所示，还可以在第四固晶部1442设置芯片安装槽1403，该驱动芯片121设置在芯片安装槽1403内。由于芯片安装槽1403的槽底低于其他固晶部，从而可以让驱动芯片121沉入芯片安装槽1403的底部，这样不仅可以确保晶片122位于驱动芯片121的上方，避免了驱动芯片遮挡到晶片122的光线，有效提高了LED灯珠的亮度。同时也可以降低键合线连接在驱动芯片121最高点的位置，减少键合线101的使用长度，节约LED灯珠的制造成本。
在一些实施例中，可以设置芯片安装槽1403的槽底距离其他固晶部之间距离为预设距离。其中，预设距离可以为小于驱动芯片121厚度的任何一个尺寸，其目的为了让驱动芯片121沉入凹腔111的底部，这样不仅可以确保晶片122位于驱动芯片121的上方，避免了驱动芯片121遮挡到晶片122的光线，在不增加LED结构的制造成本下，有效提高了LED结构的亮度。
此外，LED的封装结构由无机及有机材料复合而成，由于无机材料与有机材料的受热膨胀系数是不一样，因此，无机材料与有机材料所产生的应力也不一样，从而容易造成键合线101的冲线或断裂，而本申请减少了键合线101的使用长度，从而可以降低后续工艺时键合线101所受到的冲击力，避免键合线101出现冲线或断裂等不良现象。
对于Chip-B灯珠，请参阅图22和图23，图22至图23分别示出了本申请实施例提供的又一种LED灯珠的结构示意图。如图22至图23所示，该LED灯珠10包括绝缘座11、发光组件12、封装胶13和至少四对引脚14。
相对于Chip-A灯珠，该LED灯珠10区别在于：至少四对引脚14的固晶部的结构设计、以及发光组件与四对引脚14的固晶部的连接关系。以下主要对该区别进行详细介绍，需知对于绝缘座11、发光组件12、封装胶13以及至少四对引脚14的连接部的结构和位置，均可以与Chip-A灯珠的绝缘座11、发光组件12、封装胶13以及至少四对引脚14的连接部的结构和位置相同，当然也可以不同，在此不做详细介绍。
请同时参阅图24和图25，至少四对引脚14分别为第一引脚141、第二引脚142、第三引脚143、第四引脚144、第五引脚145、第六引脚146、第七引脚147和第八引脚148。其中，第一引脚141和第二引脚142组成第一引脚对，第三引脚143和第四引脚144组成第二引脚对，第五引脚145和第六引脚146组成第三引脚对，第七引脚147和第八引脚148组成第四引脚对。
其中，第一引脚141和第二引脚142的连接部均用于与第一导线电性连接；第三引脚143和第四引脚144的连接部均用于与第三导线电性连接；第五引脚145和第六引脚146的连接部均用于与第二导线电性连接；第七引脚147和第八引脚148的连接部均用于与第四导线电性连接。第一导线为正极线、第二导线为正极线、第三导线为通信导线、第四导线为负极导线；第三导线的导电线芯在第三引脚143和第四引脚144的连接部之间的部分切断，第二导线的导电线芯在第五引脚145和第六引脚146的连接部之间的部分切断。
请同时参阅图26，第一引脚141包括第一连接部1411和第一固晶部1412，第二引脚142包括第二连接部1421和第二固晶部1422，第一连接部1411和第二连接部1421用于与第一导线电性连接，第一连接部1411和第二连接部1421可以是间隔设置，当然也可以一体化设计，一体化设计可以增加与第一导线电性连接的可靠性。第三引脚143包括第三连接部1431和第三固晶部1432，第四引脚144包括第四连接部1441和第四固晶部1442，第三固晶部1432通过键合线101与驱动芯片121的信号输入端Din连接，第四固晶部1442通过键合线101与驱动芯片121的信号输出端连接，第三连接部1431和第四连接部1441用于与第三导线电性连接，第三导线的导电线芯位于第三连接部1431和第四连接部1441之间的部分切断。第五引脚145包括第五连接部1451和第五固晶部1452，第六引脚146包括第六连接部1461和第六固晶部1462，驱动芯片121的正极端VDD通过键合线101与第五固晶部1452电性连接，驱动芯片121的负极端GND通过键合线101与第六固晶部1462电性连接，晶片122通过键合线101与第五固晶部1452电性连接，第五连接部1451和第六连接部1461用于与第二导线电性连接，第二导线的导电线芯在第五连接部1451和第六连接部1461之间部分切换。第七引脚147包括第七连接部1471和第七固晶部1472，第八引脚148包括第八连接部1481和第八固晶部1482，第七连接部1471和第八连接部1481用于与第四导线电性连接。
上述实施例提供的LED灯珠10，由于四对引脚14的设计以及四对引脚14与发光组件12的连接关系，可以使得该LED灯珠10通过四条导线与其他LED灯珠连接，即和其他灯珠有序排列在四条导线上，从外观上看多个LED灯珠焊接在四条导线上组成一个LED灯串，但是在电路连接存在串联和并联，在通信连接关系上各个LED灯珠均是串联便于控制，由此可以使得LED灯带的加工更加容易，同时实现LED灯带的高压供电、长距离级联以及发光多样性，比如可以实现流水灯和跑马灯等发光样式。
在一些实施例中，第五固晶部1452可以设置有一个或多个晶片122；该晶片122通过键合线101与驱动芯片121电性连接；晶片122还通过键合线101与第五固晶部1452电性连接，或者，晶片122还通过粘合接触与第五固晶部1452电性连接，比如通过导电银胶。当然可以理解的是，晶片122也可以设置其他引脚的固晶部上。
示例性，如图26所示，第五固晶部1452可以设置有绿光芯片1221和红光芯片1222；其中，绿光芯片1221通过键合线101分别与第五固晶部1452和驱动芯片121电性连接，具体是与驱动芯片121的G控制端连接；红光芯片1222通过键合线101与驱动芯片121连接，具体是与驱动芯片121的R控制端连接，以及通过粘合接触与第五固晶部1452电性连接。
在一些实施例中，如图25所示，请同时参阅图26，第五固晶部1452至少包括间隔设置的第三设置部14521和第四设置部14522，第三设置部14521用于设置绿光芯片1221和红光芯片1222，第四设置部14522用于设置键合线连接点。由于蓝光芯片和绿光芯片的底部是通过沾结胶与固晶部连接的，沾结胶是有机物，在受热膨胀时内应力释放外延，极容易引起周边的二焊邦结焊点(键合线连接点)的分层(也可以称为剥离)，进而引起电气连接失效。因此第三设置部14521和第四设置部14522间隔设置可以有效阻隔分层剥离的延伸，有效保护焊点的牢固性，提升产品的可靠性。
在一些实施例中，如图26所示，第四固晶部1442也可以设置有晶片122；该晶片122通过键合线101与第五固晶部1452电性连接，晶片122还通过键合线101与驱动芯片121 电性连接。具体地，比如，设置在第四固晶部1442的晶片122为蓝光芯片1223，并且蓝光芯片1223设置第四固晶部1442中靠近第五固晶部1452的位置，使得蓝光芯片1223靠近设置在第五固晶部1452上的晶片122。由此可以各个不同晶片122可以组合出多种不同色彩，不仅可以降低产品成本，提升了产品可靠性，还提升了该LED灯珠的复合发光混色效果。
在一些实施例中，第六固晶部1462设置有驱动芯片121，第六固晶部1462中设置驱动芯片121的区域位于第四固晶部和第五固晶部之间。
在一些实施例中，如图26所示，驱动芯片121可以设置在第六固晶部1462上，第六固晶部1462中设置驱动芯片121的区域位于第四固晶部1442和第五固晶部1452之间。具体地，可以理解为第六固晶部1462至少存在一部分延伸至第四固晶部1442、第五固晶部1452之间，由此驱动芯片121与其他固晶部或其他固晶部上晶片的距离，进而便于通过键合线连接，还能提供产品的可靠性和寿命。
在一些实施例中，为了进一步地提高产品的可靠性和使用寿命，如图25和图26所示，在设计第六固晶部1462时可以设置第六固晶部1462包括间隔设置的第一放置部14621和第二放置部14622，第一放置部14621和第二放置部14622连接，具体可以理解为第一放置部14621和第二放置部14622为一体化设计。其中，第一放置部14621用于设置驱动芯片121，第二放置部14622用于设置键合线连接点，第一放置部14621和第二放置部14622之间部分为间隔区域，由此也可以防止驱动芯片121的发热导致第二放置部14622的键合线连接点剥离，由此可以有效阻隔分层剥离的延伸，有效保护焊点的牢固性，提升产品的可靠性。相应地，第四固晶部1442包括晶片放置部14021和从晶片放置部14021延伸出的键合线连接点放置部14022，键合线连接点放置部14022延伸至所述间隔区域。由此可以进一步地缩短驱动芯片与固晶部连接的键合线的距离，由此可以节省成本以及提高产品的可靠性。
在一些实施例中，由于引脚14的连接部和固晶部还需要电镀工艺进行电镀，或者利用过孔实现电性连接时沉铜工艺也需要电镀，为了便于电镀工艺，在其中一个或多个引脚14的固晶部上还设置有导电电极1404，该导电电极1404从各个引脚的固晶部延伸至绝缘座11的边缘，示例性的，如图25所示，第三固晶部1432和第六固晶部1462均包括导电电极1404。
在本申请实施例提供的Chip-B灯珠中，如图23所示，该LED灯珠10还可以包括隔离板15，该隔离板15具体可以为BT(Bismaleimide Triazine)板，也可以称为树脂基板，该隔离板15具体设置在绝缘座11的底部，用于将各个引脚14的连接部进行隔离，避免后续将LED灯珠与导线进行焊接连接时，出现锡珠造成的短接。由于绝缘座11的表面是粗糙的，如果不用隔离板15，在引脚14的连接部与导线焊接时，极易出现短接。
对于Top-C灯珠，请参阅图27和图28，图27至图28分别示出了本申请实施例提供的另一种LED灯珠的结构示意图。如图27至图28所示，该LED灯珠10包括绝缘座11、发光组件12、封装胶13和至少四对引脚14。
相对于Top-A灯珠，该LED灯珠10区别在于：至少四对引脚14的固晶部的结构设计，以及发光组件与四对引脚14的固晶部的连接关系。以下主要对该区别进行详细介绍，需知对于绝缘座11、发光组件12、封装胶13以及至少四对引脚14的连接部的结构和设置位置，均可以与Top-A灯珠的绝缘座11、发光组件12、封装胶13以及至少四对引脚14的连接部的结构和设置位置相同，当然也可以不同，在此不做详细介绍。
请同时参阅图29，至少四对引脚14分别为第一引脚141、第二引脚142、第三引脚143、第四引脚144、第五引脚145、第六引脚146、第七引脚147和第八引脚148。其中，第一引脚141和第二引脚142组成第一引脚对，第三引脚143和第四引脚144组成第二引脚对，第五引脚145和第六引脚146组成第三引脚对，第七引脚147和第八引脚148组成第四引脚对。
第一引脚对与第一导线电性连接，即第一引脚141和第二引脚142的连接部均用于与第一导线电性连接；第二引脚对与第二导线连接，即第三引脚143和第四引脚144的连接部均用于与第二导线电性连接；第三引脚对与第三导线连接，即第五引脚145和第六引脚146的 连接部均用于与第三导线电性连接；第四引脚对与第四导线连接，即第七引脚147和第八引脚148的连接部均用于与第四导线电性连接。其中，第一导线为正极线、第二导线为正极线、第三导线为通信导线、第四导线为负极线；第二导线的导电线芯在第三引脚143和第四引脚144的连接部之间的部分切断，第三导线的导电线芯在第五引脚145和第六引脚146的连接部之间的部分切断。
如图30所示，请同时参阅图29，第一引脚141包括第一连接部1411和第一固晶部1412，第二引脚142包括第二连接部1421和第二固晶部1422，第一连接部1411和第二连接部1421用于与第一导线连接，第一固晶部1412和第二固晶部1422可以是间隔设置，也可以一体化设计。第三引脚143包括第三连接部1431和第三固晶部1432，第四引脚144包括第四连接部1441和第四固晶部1442，驱动芯片121的正极端VDD通过键合线101与第三固晶部1432电性连接，晶片122与第三固晶部1432电性连接，第三连接部1431和第四连接部1441用于与第二导线电性连接，第二导线的导电线芯在第三连接部1431和第四连接部1441之间部分切断。第五引脚145包括第五连接部1451和第五固晶部1452，第六引脚146包括第六连接部1461和第六固晶部1462，第五固晶部1452通过键合线101与驱动芯片121的信号输入端Din连接，第六固晶部1462通过键合线101与驱动芯片121的信号输出端Dout连接，第五连接部1451和第六连接部1461用于与第三导线电性连接，第三导线的导电线芯在第五连接部1451和第六连接部1461之间的部分切断。第七引脚147包括第七连接部1471和第七固晶部1472，第八引脚148包括第八连接部1481和第八固晶部1482，第八固晶部1482通过键合线101与驱动芯片121的负极端GND电性连接，第七连接部1471和第八连接部1481用于与第四通信线连接。
上述实施例提供的LED灯珠10，由于四对引脚14的设计以及四对引脚14与发光组件12的连接关系，可以使得该LED灯珠10通过四条导线与其他LED灯珠连接，即和其他灯珠有序排列在四条导线上，从外观上看多个LED灯珠焊接在四条导线上组成一个LED灯串，但是在电路连接存在串联和并联，在通信连接关系上各个LED灯珠均是串联便于控制，由此可以使得LED灯带的加工更加容易，同时实现LED灯带的高压供电、长距离级联以及发光多样性，比如可以实现流水灯和跑马灯等发光样式。
在一些实施例中，如图29所示，该LED灯珠10还包括第一过渡引脚14a和第二过渡引脚14b，第二过渡引脚的固晶部与第八固晶部1482一体成型，也可以理解为，第二过渡引脚14b从第八固晶部1482上延伸出来。第一过渡引脚14a和第二过渡引脚14b从该LED灯珠的绝缘座的两侧露出且对称，但是第一过渡引脚14a和第二过渡引脚14b并与外部导线进行电气连接。
在一些实施例中，第六引脚146的第六固晶部1462位于第二过渡引脚14b的固晶部与第八固晶部1482之间。该结构设计不仅可以提高第六引脚146、第八引脚148与绝缘座11的牢固性，还可以节省键合线，进而相对提高产品的可靠性和使用寿命。
在一些实施例中，第三固晶部1432或第四固晶部1442设置有一个或多个晶片122，该晶片122通过键合线101与驱动芯片121电性连接，该晶片122还通过键合线101与第三固晶部1432电性连接，或者，该晶片122还通过粘合接触与第三固晶部1432电性连接。
示例性的，如图30所示，第三固晶部1432设置有绿光芯片1221和红光芯片1222，第四固晶部1442设置有蓝光芯片1223；其中，绿光芯片1221通过键合线101分别与第三固晶部1432和驱动芯片121电性连接，具体是与驱动芯片121的G控制端连接；红光芯片1222通过键合线101与驱动芯片121连接，具体是通过键合线101与驱动芯片121的R控制端连接，以及通过红光芯片1222粘合接触与第三固晶部1432电性连接；蓝光芯片1223通过键合线101分别与驱动芯片121的B控制端和第三固晶部1432电性连接。
在一些实施例中，如图30所示，蓝光芯片1223设置在第四固晶部1442中靠近第三固晶部1432的位置，使得蓝光芯片1223靠近设置在第三固晶部1432上的晶片122。由此绿 光芯片1221、红光芯片1222和蓝光芯片1223可以组合更多颜色，不仅可以降低产品成本，提升了产品可靠性，还提升了该LED灯珠的复合发光混色效果。
在一些实施例中，第八固晶部1482可以设置有驱动芯片121。其中，第八固晶部中设置驱动芯片121的部分位于第三固晶部1432、第五固晶部1452和第六固晶部1462之间。由此可以节省键合线，增加了产品的可靠性和使用寿命。
在一些实施例中，第八固晶部1482包括芯片安装槽，驱动芯片121设置在芯片安装槽内。由于芯片安装槽1403的槽底低于其他固晶部，从而可以让驱动芯片121沉入芯片安装槽1403的槽低，这样不仅可以确保晶片122位于驱动芯片121的上方，避免了驱动芯片遮挡到晶片122的光线，有效提高了LED灯珠的亮度。由于驱动芯片121的高度较高，因此又可以降低键合线连接在驱动芯片121最高点的位置，减少键合线101的使用长度，节约LED灯珠的制造成本。
对于Chip-C灯珠，请参阅图31和图32，图31至图32分别示出了本申请实施例提供的又一种LED灯珠的结构示意图。如图31至图32所示，该LED灯珠10包括绝缘座11、发光组件12、封装胶13和至少四对引脚14。
相对于Chip-A灯珠，该LED灯珠10区别在于：至少四对引脚14的固晶部的结构设计、以及发光组件与四对引脚14的固晶部的连接关系，以下主要对该区别进行详细介绍。需知对于绝缘座11、发光组件12、封装胶13以及至少四对引脚14的连接部的结构和位置，均可以与Chip-A灯珠的绝缘座11、发光组件12、封装胶13以及至少四对引脚14的连接部的结构和位置相同，当然也可以不同，在此不做详细介绍。
请同时参阅图33和图34，至少四对引脚14分别为第一引脚141、第二引脚142、第三引脚143、第四引脚144、第五引脚145、第六引脚146、第七引脚147和第八引脚148。第一引脚141和第二引脚142组成第一引脚对，第三引脚143和第四引脚144组成第二引脚对，第五引脚145和第六引脚146组成第三引脚对，第七引脚147和第八引脚148组成第四引脚对。
具体地，第一引脚对用于与第一导线连接，即第一引脚141和第二引脚142的连接部均用于与第一导线电性连接；第二引脚对用于与第三导线连接，第三引脚143和第四引脚144的连接部均用于与第三导线电性连接；第三引脚对用于与第二导线连接，第五引脚145和第六引脚146的连接部均用于与第二导线电性连接；第四引脚对用于与第四导线连接，第七引脚147和第八引脚148的连接部均用于与第四导线电性连接；其中，第一导线为正极线、第二导线为正极线、第三导线为通信导线、第四导线为负极导线。第三导线的导电线芯在第三引脚和第四引脚的连接部之间的部分切断；所述第二导线的导电线芯在所述第五引脚和第六引脚的连接部之间的部分切断。
如图35所示，请同时参阅图33和图34，第一引脚141包括第一连接部1411和第一固晶部1412，第二引脚142包括第二连接部1421和第二固晶部1422，第一连接部1411与第二连接部1421可以间隔设置，当然也可以一体成型，用于与第一导线电性连接。第三引脚143包括第三连接部1431和第三固晶部1432，第四引脚144包括第四连接部1441和第四固晶部1442，第三固晶部1432通过键合线101与驱动芯片121的信号输入端Din连接，第四固晶部1442通过键合线101与驱动芯片121的信号输出端Dout连接，第三连接部1431和第四连接部1441用于第三导线电性连接，且第三导线的导电线芯在第三连接部1431和第四连接部1441之间的部分切断；第五引脚145包括第五连接部1451和第五固晶部1452，第六引脚146包括第六连接部1461和第六固晶部1462，驱动芯片121的正极端VDD通过键合线101与第五固晶部1452电性连接，晶片121通过键合线101与第五固晶部1452连接，第五连接部1451和第六连接部1461用于与第二导线电性连接，且第二导线的导电线芯位于第五连接部1451和第六连接部1461之间部分切断。第七引脚147包括第七连接部1471和第七固晶部1472，第八引脚148包括第八连接部1481和第八固晶部1482，驱动芯片121的 负极端GND通过键合线101与第八固晶部1482电性连接。
上述实施例提供的LED灯珠10，由于四对引脚14的设计以及四对引脚14与发光组件12的连接关系，可以使得该LED灯珠10通过四条导线与其他LED灯珠连接，即和其他灯珠有序排列在四条导线上，从外观上看多个LED灯珠焊接在四条导线上组成一个LED灯串，但是在电路连接存在串联和并联，在通信连接关系上各个LED灯珠均是串联便于控制，由此可以使得LED灯带的加工更加容易，同时实现LED灯带的高压供电、长距离级联以及发光多样性，比如可以实现流水灯和跑马灯等发光样式。
在一些实施例中，第五固晶部1452可以设置有一个或多个晶片122；该晶片122通过键合线101与驱动芯片121电性连接；晶片122还通过键合线101与第五固晶部1452电性连接，或者，晶片122还通过粘合接触与第五固晶部1452电性连接，比如通过导电银胶。当然可以理解的是，晶片122也可以设置其他引脚的固晶部上。
示例性，如图35所示，第五固晶部1452可以设置有绿光芯片1221和红光芯片1222；其中，绿光芯片1221通过键合线101分别与第五固晶部1452和驱动芯片121电性连接，具体是与驱动芯片121的G控制端连接；红光芯片1222通过键合线101与驱动芯片121连接，具体是与驱动芯片121的R控制端连接，以及通过粘合接触与第五固晶部1452电性连接。
在一些实施例中，如图34所示，请同时参阅图35，第五固晶部1452至少包括间隔设置的第三设置部14521和第四设置部14522，第三设置部14521用于设置绿光芯片1221和红光芯片1222，第四设置部14522用于设置键合线连接点。由于蓝光芯片和绿光芯片的底部是通过沾结胶与固晶部连接的，沾结胶是有机物，在受热膨胀时内应力释放不一样，极容易引起周边的二焊邦结焊点(键合线连接点)的分层(也可以称为剥离)，进而引起电气连接失效。因此第三设置部14521和第四设置部14522间隔设置可以有效阻隔分层剥离的延伸，有效保护焊点的牢固性，提升产品的可靠性。
在一些实施例中，如图35所示，第四固晶部1442也可以设置有晶片122；该晶片122通过键合线101与第五固晶部1452电性连接，晶片122还通过键合线101与驱动芯片121电性连接。具体地，比如，设置在第四固晶部1442的晶片122为蓝光芯片1223，并且蓝光芯片1223设置第四固晶部1442中靠近第五固晶部1452的位置，使得蓝光芯片1223靠近设置在第五固晶部1452上的晶片122。由此可以各个不同晶片122可以组合出多种不同色彩，不仅可以降低产品成本，提升了产品可靠性，还提升了该LED灯珠的复合发光混色效果。
在一些实施例中，第八固晶部1482可以设置有驱动芯片121，第八固晶部1482中设置驱动芯片121的区域位于第四固晶部1442和第五固晶部1452之间。由于第四固晶部1442和第五固晶部1452是用于设置晶片和键合线连接点，故该设计可以缩短键合线距离，节省键合线缩减成本，同时又可以提高LED灯珠的使用寿命。
在一些实施例中，为了进一步地提高产品的可靠性和使用寿命，如图34和图35所示，可以设置第八固晶部1482包括间隔设置的第三放置部14821和第四放置部14822，第三放置部14821和第四放置部14822连接，第三放置部14821用于设置驱动芯片121，第四放置部14822用于设置键合线连接点，第三放置部14821和第四放置部14822之间部分为间隔区域；第四固晶部1442包括晶片放置部14021和从晶片放置部14021延伸出的键合线连接点放置部14022，键合线连接点放置部14022延伸至该间隔区域。由此也可以防止驱动芯片121的发热导键合线连接点剥离，由此可以提高产品的使用寿命。同时还可以进一步地缩短驱动芯片与固晶部连接的键合线的距离，由此可以节省成本以及提高产品的可靠性。
在一些实施例中，由于引脚14的连接部和固晶部还需要电镀工艺进行电镀，或者利用过孔实现电性连接时沉铜工艺也需要电镀，为了便于电镀工艺，在其中一个或多个引脚14的固晶部上还设置有导电电极1404，该导电电极1404从各个引脚的固晶部延伸至绝缘座11的边缘，示例性的，如图34所示，第三固晶部1432、第五固晶部1452和第八固晶部1482均包括导电电极1404。
在本申请实施例提供的Chip-B灯珠中，该LED灯珠10还可以包括隔离板15，该隔离板15具体可以为BT(Bismaleimide Triazine)板，也可以称为树脂基板，该隔离板15具体设置在绝缘座11的底部，用于将各个引脚14的连接部进行隔离，避免后续将LED灯珠与导线进行焊接连接时，出现锡珠造成的短接。由于绝缘座11的表面是粗糙的，如果不用隔离板15，在引脚14的连接部与导线焊接时，极易出现短接。
需要说明的是，上述实施例提供的Top-A灯珠、Top-B灯珠、Top-C灯珠和Chip-A灯珠、Chip-B灯珠、Chip-C灯珠，其中，在以下实施例中，Top-A灯珠和Chip-A灯珠可以称为第一LED灯珠，Top-C灯珠和Chip-C灯珠称为第二LED灯珠，Top-B灯珠和Chip-B灯珠称为第三LED灯珠。以下对使用第一LED灯珠、第二LED灯珠和第三LED灯珠制成LED灯带进行介绍。
本申请实施例提供的LED灯带均包括至少四条导线和多个LED模组，所述LED模组包括至少两个LED灯珠，所述至少两个LED灯珠与所述四条导线电性连接，且多个所述LED灯珠依次排列所述四条导线上并形成一个条带；其中，所述四条导线中的一条导线为通信导线，其他三条导线为供电导线；在所述通信导线上，所述条带上的LED灯珠均串联；在所述供电导线上，多个所述LED模组之间彼此并联，且每个所述LED模组的至少两个LED灯珠串联。
示例性的，LED模组可以包括：第一LED灯珠和第二LED灯珠，第一LED灯珠和第二LED灯珠的外部结构相同，第一LED灯珠和第二LED灯珠的内部结构不同；其中，所述外部结构包括绝缘座、引脚的连接部和封装胶，所述内部结构包括引脚的固晶部。
示例性的，LED模组还可以包括：第三LED灯珠，该第三LED灯珠与第一LED灯珠、第二LED灯珠串联；其中，第三LED灯珠位于第一LED灯珠和第二LED灯珠之间，第一LED灯珠作为LED模组的首灯珠，第二LED灯珠作为LED模组的尾灯珠。
其中，第三LED灯珠与第一LED灯珠、第二LED灯珠的外部结构相同；第三LED灯珠与所述第一LED灯珠、第二LED灯珠的内部结构不同。
在一些实施例中，LED模组中的第三LED灯珠的数量为一个或多个，其中，当第三LED灯珠的数量多个，多个第三LED灯珠均位于第一LED灯珠和第二LED灯珠之间且彼此串联。
本申请实施例中，第一LED灯珠、第二LED灯珠、第三LED灯珠的工作电压相同。
其中，制作LED灯带方法具体可以包括：将至少四条导线沿直线轨迹延伸设置；将相应的LED灯珠沿直线轨迹间隔布设于至少四条导线上；将LED灯珠和至少四条导线进行焊接处理；对部分导线的切除部进行冲切处理。
其中，导线包括导电线芯和包裹导电线芯的绝缘层，其中，导线包括漆包线，绝缘层也可以称为漆包线层。在将至少四条导线沿直线轨迹延伸设置之前，还需要对导线进行绝缘层的剥除，使每条导线露出有与LED灯珠的引脚相配适的导电线芯。当然可以理解的是，也在将至少四条导线沿直线轨迹延伸设置之后，对导线进行绝缘层的剥除。
在一些实施例中，为了外观的美观，可以等间距地对导线进行绝缘层的剥除，由此可以使得LED灯带中多个LED模组的LED灯珠等间距地排列在四条导线上。当然，也可以不等间距排列在四条导线上。
通过向导线的导电线芯上涂布锡膏，将LED灯珠和至少四条导线进行焊接处理，由此可以以提高LED灯珠和导线的导电线芯的焊接可靠性。在一些实施方式中，当然也可以在LED灯珠的连接部上涂布锡膏。具体可以使用热风机构将LED灯珠的连接部和导线的导电线芯进行焊接固定，在焊接结束，还需要对部分导线的导线线芯进行切断，具体需要对第二导线和第三导线的导电线芯切断处理。在冲切时，先将焊接有LED灯珠的导线进行翻转，使得导线朝上而LED灯珠向下，利用切刀自上而下冲切，由此完成LED灯带的制作。
在一些实施例中，还可以先将导线的绝缘层拨开露出导电线芯，然后将第二导线和第三 导线进行冲切，在导线线芯上涂覆锡膏，再将LED灯珠放在粘有锡膏的导电线芯上，再进行焊接，然后上面滴UV胶后进行固化。在将LED灯带在下一个工序中反转，在LED灯带的另一面再滴UV胶固化，完成LED灯带的制作。
以下，基于上述实施例提供的多种LED灯珠可以组合多种LED灯带，每种LED灯带对应不同的工作电压，下面对本申请实施例提供的多种LED灯带进行详细介绍：
请参阅图36和图37，图36和图37示出了本申请实施例提供的一种LED灯带不同视角的结构。如图36和图37所示，该LED灯带100具体可以包括至少四条导线20和多个LED模组，在该LED灯带100中每个LED模组均包括三个LED灯珠，分别为LED灯珠10a、LED灯珠10b和LED灯珠10c，其中，LED灯珠10a为Top-A灯珠，LED灯珠10b为Top-B灯珠，LED灯珠10c为Top-C灯珠。LED灯珠10a、LED灯珠10b和LED灯珠10c均与四条导线20电性连接，四条导线分别为第一导线21、第二导线22、第三导线23和第四导线24，第一导线21为正极线，第二导线22为正极线，第三导线23为通信导线，第四导线为负极线。
每个LED模组的三个LED灯珠的四对引脚与四对导线电性连接，具体地，第一引脚和第二引脚均与第一导线21连接，第三引脚和第四引脚均与第二导线22连接，第五引脚和第六引脚均与第三导线23连接，第七引脚和第八引脚均与第四导线24连接。具体的连接方式请参照上述实施例关于LED灯珠的具体描述。
多个LED模组中三个LED灯珠在四条导线20上依次排列组成一个条带，即组成一条长长的灯串，便于作为氛围灯装饰在其他物件上，比如装饰在圣诞树上。在第三导线23上，即在通信导线上，该条带上的LED灯珠均串联；在第一导线21、第二导线22和第四导线24上，即在供电导线上，多个LED模组之间彼此并联，且每个LED模组的三个LED灯珠串联，即LED灯珠10a、LED灯珠10b和LED灯珠10c串联。
示例性的，比如该LED灯带100具体包括一百个LED模组，每个LED模组包括三个LED灯珠，分别为LED灯珠10a、LED灯珠10b和LED灯珠10c。在三条供电导线上，一百个LED模组中每个模组之间彼此并联，每个LED模组中的三个LED灯珠则是串联，以及LED灯带100上三百个LED灯珠在通信导线上均是串联。该LED灯带100并不限定包括一百个LED模组，还可以是包括其他数量的LED模组，可以是多于或少于一百个。
其中，如何实现多个LED模组之间彼此并联，且每个LED模组的三个LED灯珠串联以及在通信导线上每个LED灯珠串联，可以参考上述对每个LED灯珠具体结构介绍。为了更便于理解该LED灯带100的电路连接，还可以参照图38。
如图38所示，LED灯珠10a的三个晶片的一端均与其第一引脚的第一固晶部电性连接，LED灯珠10a的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的控制端具体包括三个分别为G控制端、R控制端和B控制端，驱动芯片的正极端VDD与LED灯珠10a的第一固晶部电性连接，驱动芯片的负极端GND与LED灯珠10a的第四引脚的第四固晶部连接；而LED灯珠10b的三个晶片的一端均与其第三引脚的第三固晶部电性连接，LED灯珠10b的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的正极端VDD与LED灯珠10b的第三固晶部电性连接，该驱动芯片的负极端GND与LED灯珠10b的第四固晶部电性连接；而LED灯珠10c的三个晶片的一端均与其第三引脚的第三固晶部电性连接，LED灯珠10c的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的正极端VDD与LED灯珠10c的第三固晶部电性连接，该驱动芯片的负极端GND与LED灯珠10c的第八固晶部电性连接，由此实现了三个LED灯珠串联供电。
具体地，供电通路为：对于每个LED模组中的LED灯珠，电流依次经过第一导线21、LED灯珠10a的第一引脚的第一固晶部、LED灯珠10a的驱动芯片、LED灯珠10a的第四引脚的第四固晶部、第二导线22、LED灯珠10b的第三引脚的第三固晶部、LED灯珠10b的驱动芯片、LED灯珠10b的第四引脚的第四固晶部、第二导线22、LED灯珠10c的第三 引脚的第三固晶部、LED灯珠10c的驱动芯片、LED灯珠10c的第八引脚的第八固晶部和第四导线，构成串联供电回路；对于不同LED模组，由于每个LED模组的首灯珠(如LED灯珠10a)与第一导线连接，与该首灯珠串联的尾灯珠与第四导线连接，由此可以确定每个LED模组均是并联在第一导线和第四导线上。
如图38所示，对于每个LED模组中的LED灯珠，LED灯珠10a的驱动芯片的信号输入端Din与LED灯珠10a的第五引脚的第五固晶部(或者通过第一过渡引脚的固晶部与第五固晶部)连接，LED灯珠10a的驱动芯片的信号输出端Dout与LED灯珠10a的第六引脚的第六固晶部连接；LED灯珠10b的驱动芯片的信号输入端Din与LED灯珠10b的第五引脚的第五固晶部连接，LED灯珠10b的驱动芯片的信号输出端Dout与LED灯珠10b的第六引脚的第六固晶部连接；LED灯珠10c的驱动芯片的信号输入端Din与LED灯珠10c的第五引脚的第五固晶部连接，LED灯珠10c的驱动芯片的信号输出端Dout与LED灯珠10c的第六引脚的第六固晶部连接；其中第五引脚和第六引脚的连接部均用于与通信导线连接，由此实现了多个LED模组中每个LED灯珠在通信导线上均是串联。
由于该LED灯带采用了LED模组之间并联，LED模组中LED灯珠串联，使得该LED灯带100的供电损耗较小，由此该LED灯带100可以实现长距离级联，即该LED灯带可以制作的很长。更重要的是，该LED灯带100制作简单，只需要将上述实施例提供的三种类型LED灯珠(LED灯珠10a、LED灯珠10b和LED灯珠10c)依次焊接在四条导线上，即可以制作完成。该LED灯带采用电源串并联、信号串联的方式，以实现多种不同供电电压的应用方案，由此采用通讯协议控制LED灯带上的每个LED灯珠，由此可以实现发光效果多样且可任意调节，且不受级联点数以及距离限制。该LED灯带可以有效地解决了现有LED灯带的难点和痛点，即可以实现长距离级联、发光效果多样、控制简便且供电电压可以根据需求任意调节。此外，该LED灯带还可以采用目前皮线灯相同的生产工艺制作，制作简单，可以提高LED灯带的生产效率。
请参阅图39，图39示出了本申请实施例提供的另一种LED灯带的结构。如图39所示，该LED灯带100具体可以包括至少四条导线20和多个LED模组，在该LED灯带100中每个LED模组均包括两个LED灯珠，分别为LED灯珠10a和LED灯珠10c，其中，LED灯珠10a为Top-A灯珠，LED灯珠10c为Top-C灯珠。LED灯珠10a和LED灯珠10c均与四条导线20电性连接，四条导线分别为第一导线21、第二导线22、第三导线23和第四导线24，第一导线21为正极线，第二导线22为正极线，第三导线23为通信导线，第四导线为负极线。
多个LED模组中两个LED灯珠在四条导线20上依次排列组成一个条带，即组成一条长长的灯串，便于作为氛围灯装饰在其他物件上，比如装饰在圣诞树上。在第三导线23上，即在通信导线上，该条带上的LED灯珠均串联；在第一导线21、第二导线22和第四导线24上，即在供电导线上，多个LED模组之间彼此并联，且每个LED模组的两个LED灯珠串联，即LED灯珠10a和LED灯珠10c串联。
示例性的，比如该LED灯带100具体包括两百个LED模组，每个LED模组包括两个LED灯珠，分别为LED灯珠10a和LED灯珠10c。在三条供电导线上，两百个LED模组中每个模组之间彼此并联，每个LED模组中的两个LED灯珠则是串联，即LED灯带100上四百个LED灯珠在通信导线上均是串联。
其中，如何实现多个LED模组之间彼此并联，且每个LED模组的两个LED灯珠串联以及在通信导线上每个LED灯珠串联，可以参考上述对每个LED灯珠具体结构介绍。为了更便于理解该LED灯带100的电路连接，还可以参照图40。
如图40所示，LED灯珠10a的三个晶片的一端均与其第一引脚的第一固晶部电性连接，LED灯珠10a的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的控制端的数量具体包括三个，分别为G控制端、R控制端和B控制端，该驱动芯片的正极端VDD 与LED灯珠10a的第一固晶部电性连接，驱动芯片的负极端GND与LED灯珠10a的第四引脚的第四固晶部连接；而LED灯珠10c的三个晶片的一端均与其第三引脚的第三固晶部电性连接，LED灯珠10c的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的正极端VDD与LED灯珠10c的第三固晶部电性连接，该驱动芯片的负极端GND与LED灯珠10c的第八固晶部电性连接，由此实现了两个LED灯珠串联供电。
具体地，供电通路为：对于每个LED模组中的LED灯珠，电流依次经过第一导线21、LED灯珠10a的第一引脚的第一固晶部、LED灯珠10a的驱动芯片、LED灯珠10a的第四引脚的第四固晶部、第二导线22、LED灯珠10c的第三引脚的第三固晶部、LED灯珠10c的驱动芯片、LED灯珠10c的第八引脚的第八固晶部和第四导线，构成串联供电回路；对于不同LED模组，由于每个LED模组的LED灯珠10a与第一导线连接，与该LED灯珠10a串联的LED灯珠10c与第四导线连接，由此可以确定每个LED模组均是并联在第一导线和第四导线上。对于该LED灯带每个LED灯珠在通信导线，可以参照上述实施例，在此不做详细介绍。
由于该LED灯带采用了LED模组之间并联，LED模组中LED灯珠串联，使得该LED灯带100的供电损耗较小，由此该LED灯带100可以实现长距离级联，即该LED灯带可以制作的很长。更重要的是，该LED灯带100制作简单，只需要将上述实施例提供的两种类型LED灯珠(LED灯珠10a和LED灯珠10c)按照顺序依次焊接在四条导线上，即可以制作完成。该LED灯带采用电源串并联、信号串联的方式，以实现多种不同供电电压的应用方案，由此采用串行通讯协议控制LED灯带上的每个LED灯珠，由此可以实现发光效果多样且可任意调节，且不受级联点数以及距离限制。该LED灯带可以有效地解决了现有LED灯带的难点和痛点，即可以实现长距离级联、发光效果多样、控制简便且供电电压可以根据需求任意调节。此外，该LED灯带还可以采用目前皮线灯相同的生产工艺制作，制作简单，可以提高LED灯带的生产效率。
请参阅图41，图41示出了本申请实施例提供的又一种LED灯带的结构。如图41所示，该LED灯带100具体可以包括至少四条导线20和多个LED模组，在该LED灯带100中每个LED模组均包括六个LED灯珠，分别为一个LED灯珠10a、一个LED灯珠10c和四个LED灯珠10b，LED灯珠10a为首灯珠，LED灯珠10c为尾灯珠。其中，LED灯珠10a为Top-A灯珠，LED灯珠10b为Chip-B灯珠，LED灯珠10c为Top-C灯珠。LED灯珠10a、LED灯珠10b和LED灯珠10c均与四条导线20电性连接，四条导线分别为第一导线21、第二导线22、第三导线23和第四导线24，第一导线21为正极线，第二导线22为正极线，第三导线23为通信导线，第四导线为负极线。
多个LED模组中六个LED灯珠在四条导线20上依次排列组成一个条带，即组成一条长长的灯串，便于作为氛围灯装饰在其他物件上，比如装饰在圣诞树上。在第三导线23上，即在通信导线上，该条带上的LED灯珠均串联；在第一导线21、第二导线22和第四导线24上，即在供电导线上，多个LED模组之间彼此并联，且每个LED模组的六个LED灯珠串联，即LED灯珠10a、四个LED灯珠10b和LED灯珠10c串联。
其中，具体的串联和并联的对应电路，可以参照上述实施例提供的Top-A灯珠、Top-B灯珠和Top-C灯珠，当然也可以参照图36和图37示出的LED灯带对应的实施例进行理解，在此不做详细介绍。
需要说明的是，在本申请的实施例中，Top-A灯珠、Top-B灯珠和Top-C灯珠的工作电压可以相同，也可以不同，或者是大致相同。优选地，Top-A灯珠、Top-B灯珠和Top-C灯珠的工作电压相同，比如工作电压均为4v，当然也可以其他电压，比如3.6V或5V等。由此图36示出的LED灯带的供电电压为12V，图39示出的LED灯带的供电电压为8V，图41示出的LED灯带的供电电压为24V。由此可以可理解的是，通过在每个LED模组串联不同数量的LED灯珠，可是实现不同的供电电压，同时还实现高压供电，该高压供电可以理 解为目前市场上一般是使用10V以下的供电装置对LED灯带进行供电，如果LED灯带较长，由于存在线损低压供电将会导致LED灯带尾部的LED灯珠亮度不足，进而影响了用户的体验度，并且随着LED灯带使用越久，这种现象越明显。而本申请的实施例提供的LED灯带可以是使用12V、24V、32V和40V等等高压供电，高压供电可以减少电压线损的影响，由此可以使得该LED灯带可以做的很长。
还需要说明的是，目前市场上所谓低压供电，其实也没有一个明显的界限进行定义，即上述10V一下仅是举例说明，也有称为8V以下，或者12V以下，或者其他电压值以下，称为低压供电。但是本申请实施例提供的LED灯带很容易实现20V以上的供电电压。
以上是利用Top型的LED灯珠制成LED灯带，下面将介绍用Chip型的LED灯珠制成LED灯带。需知本申请实施例提供的LED灯带优先单独利用一种类型LED灯珠制成，该类型是指LED灯珠的制造工艺不同，比如仅用Top型的LED灯珠，或者仅用Chip型的LED灯珠。当然，该LED灯带也可以同时利用Chip类型和Top类型的LED灯珠。
请参阅图42和图43，图42和图43示出了本申请实施例提供的又一种LED灯带不同视角的结构。如图42和图43所示，该LED灯带100具体可以包括至少四条导线20和多个LED模组，在该LED灯带100中每个LED模组均包括三个LED灯珠，分别为LED灯珠10a、LED灯珠10b和LED灯珠10c，其中，LED灯珠10a为Chip-A灯珠，LED灯珠10b为Chip-B灯珠，LED灯珠10c为Chip-C灯珠。LED灯珠10a、LED灯珠10b和LED灯珠10c均与四条导线20电性连接，四条导线分别为第一导线21、第二导线22、第三导线23和第四导线24，第一导线21为正极线，第二导线22为正极线，第三导线23为通信导线，第四导线为负极线。
每个LED模组的三个LED灯珠的四对引脚与四对导线电性连接，具体地，第一引脚和第二引脚均与第一导线21连接，第三引脚和第四引脚均与第三导线23连接，第五引脚和第六引脚均与第二导线22连接，第七引脚和第八引脚均与第四导线24连接。具体的连接方式请参照上述实施例关于LED灯珠的具体描述。
多个LED模组中三个LED灯珠在四条导线20上依次排列组成一个条带，即组成一条长长的灯串，便于作为氛围灯装饰在其他物件上，比如装饰在圣诞树上。在第三导线23上，即在通信导线上，该条带上的LED灯珠均串联；在第一导线21、第二导线22和第四导线24上，即在供电导线上，多个LED模组之间彼此并联，且每个LED模组的三个LED灯珠串联，即LED灯珠10a、LED灯珠10b和LED灯珠10c串联。
示例性的，比如该LED灯带100具体包括两百个LED模组，每个LED模组包括三个LED灯珠，分别为LED灯珠10a、LED灯珠10b和LED灯珠10c。在三条供电导线上，一百个LED模组中每个模组之间彼此并联，每个LED模组中的三个LED灯珠则是串联，以及LED灯带100上六百个LED灯珠在通信导线上均是串联。
如图44所示，LED灯珠10a的三个晶片的一端均与其第二引脚的第二固晶部电性连接，LED灯珠10a的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的正极端VDD与LED灯珠10a的第二固晶部电性连接，或该驱动芯片的正极端VDD与LED灯珠10a的第五引脚的第第五固晶部电性连接，该驱动芯片的负极端GND与LED灯珠10a的第六引脚的第六固晶部连接；而LED灯珠10b的三个晶片的一端均与其第五引脚的第五固晶部电性连接，LED灯珠10b的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的正极端VDD与LED灯珠10b的第五固晶部电性连接，该驱动芯片的负极端GND与LED灯珠10b的第六引脚的第六固晶部电性连接；而LED灯珠10c的三个晶片的一端均与其第五引脚的第五固晶部电性连接，LED灯珠10c的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的正极端VDD与LED灯珠10c的第五固晶部电性连接，该驱动芯片的负极端GND与LED灯珠10c的第八固晶部电性连接，由此实现了三个LED灯珠串联供电。
具体地，供电通路为：对于每个LED模组中的LED灯珠，电流依次经过第一导线21、LED灯珠10a的第二引脚的第二固晶部、LED灯珠10a的驱动芯片、LED灯珠10a的第六引脚的第六固晶部、第二导线22、LED灯珠10b的第五引脚的第五固晶部、LED灯珠10b的驱动芯片、LED灯珠10b的第六引脚的第六固晶部、第二导线22、LED灯珠10c的第五引脚的第五固晶部、LED灯珠10c的驱动芯片、LED灯珠10c的第八引脚的第八固晶部和第四导线，构成串联供电回路；对于不同LED模组，由于每个LED模组的首灯珠(如LED灯珠10a)与第一导线21连接，与该首灯珠串联的尾灯珠与第四导线24连接，由此可以确定每个LED模组均是并联在第一导线21和第四导线24上。在通信导线上各个LED灯珠串联，请参照上述实施例，在此不做详细介绍。
由于该LED灯带采用了LED模组之间并联，LED模组中LED灯珠串联，使得该LED灯带100的供电损耗较小，由此该LED灯带100可以实现长距离级联，即该LED灯带可以制作的很长。更重要的是，该LED灯带100制作简单，只需要将上述实施例提供的三种类型LED灯珠(LED灯珠10a、LED灯珠10b和LED灯珠10c)依次焊接在四条导线上，即可以制作完成。该LED灯带采用电源串并联、信号串联的方式，以实现多种不同供电电压的应用方案，由此采用串行通讯协议控制LED灯带上的每个LED灯珠，由此可以实现发光效果多样且可任意调节，且不受级联点数以及距离限制。该LED灯带可以有效地解决了现有LED灯带的难点和痛点，即可以实现长距离级联、发光效果多样、控制简便且供电电压可以根据需求任意调节。此外，该LED灯带还可以采用目前皮线灯相同的生产工艺制作，制作简单，可以提高LED灯带的生产效率。
请参阅图45，图45示出了本申请实施例提供的又一种LED灯带的结构。如图45所示，该LED灯带100具体可以包括至少四条导线20和多个LED模组，在该LED灯带100中每个LED模组均包括两个LED灯珠，分别为LED灯珠10a和LED灯珠10c，其中，LED灯珠10a为Chip-A灯珠，LED灯珠10c为Chip-C灯珠。LED灯珠10a和LED灯珠10c均与四条导线20电性连接，每个LED灯珠的四对引脚分别与四条导线电性连接，四条导线分别为第一导线21、第二导线22、第三导线23和第四导线24，第一导线21为正极线，第二导线22为正极线，第三导线23为通信导线，第四导线为负极线。
多个LED模组中两个LED灯珠在四条导线20上依次排列组成一个条带，即组成一条长长的灯串，便于作为氛围灯装饰在其他物件上，比如装饰在圣诞树上。在第三导线23上，即在通信导线上，该条带上的LED灯珠均串联；在第一导线21、第二导线22和第四导线24上，即在供电导线上，多个LED模组之间彼此并联，且每个LED模组的两个LED灯珠串联，即LED灯珠10a和LED灯珠10c串联。
如图46所示，LED灯珠10a的三个晶片的一端均与其第二引脚的第二固晶部电性连接，LED灯珠10a的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的正极端VDD与LED灯珠10a的第二固晶部电性连接，驱动芯片的负极端GND与LED灯珠10a的第六引脚的第六固晶部连接；而LED灯珠10c的三个晶片的一端均与其第五引脚的第五固晶部电性连接，LED灯珠10c的三个晶片的另一端均与其驱动芯片的控制端电性连接，该驱动芯片的正极端VDD与LED灯珠10c的第五固晶部电性连接，该驱动芯片的负极端GND与LED灯珠10c的第八固晶部电性连接，由此实现了两个LED灯珠串联供电。
具体地，供电通路为：对于每个LED模组中的LED灯珠，电流依次经过第一导线21、LED灯珠10a的第二引脚的第二固晶部、LED灯珠10a的驱动芯片、LED灯珠10a的第六引脚的第六固晶部、第二导线22、LED灯珠10c的第五引脚的第五固晶部、LED灯珠10c的驱动芯片、LED灯珠10c的第八引脚的第八固晶部和第四导线，构成串联供电回路；对于不同LED模组，由于每个LED模组的LED灯珠10a与第一导线21连接，与该LED灯珠10a串联的LED灯珠10c与第四导线24连接，由此可以确定每个LED模组均是并联在第一导线和第四导线上。对于该LED灯带每个LED灯珠在通信导线，可以参照上述实施例，在 此不做详细介绍。
请参阅图47，图47示出了本申请实施例提供的又一种LED灯带的结构。如图47所示，该LED灯带100具体可以包括至少四条导线20和多个LED模组，在该LED灯带100中每个LED模组均包括六个LED灯珠，分别为一个LED灯珠10a、一个LED灯珠10c和四个LED灯珠10b，LED灯珠10a为首灯珠，LED灯珠10c为尾灯珠。其中，LED灯珠10a为Chip-A灯珠，LED灯珠10b为Chip-B灯珠，LED灯珠10c为Chip-C灯珠。LED灯珠10a、LED灯珠10b和LED灯珠10c均与四条导线20电性连接，四条导线分别为第一导线21、第二导线22、第三导线23和第四导线24，第一导线21为正极线，第二导线22为正极线，第三导线23为通信导线，第四导线为负极线。
多个LED模组中六个LED灯珠在四条导线20上依次排列组成一个条带，即组成一条长长的灯串，便于作为氛围灯装饰在其他物件上，比如装饰在圣诞树上。在第三导线23上，即在通信导线上，该条带上的LED灯珠均串联；在第一导线21、第二导线22和第四导线24上，即在供电导线上，多个LED模组之间彼此并联，且每个LED模组的六个LED灯珠串联，即LED灯珠10a、四个LED灯珠10b和LED灯珠10c串联。
其中，具体的串联和并联的对应电路，可以参照上述实施例提供的Chip-A灯珠、Chip-B灯珠和Chip-C灯珠，当然也可以参照图42至图43示出的LED灯带对应的实施例进行理解，在此不做详细介绍。
需要说明的是，在本申请的实施例中，Chip-A灯珠、Chip-B灯珠和Chip-C灯珠的工作电压可以相同，也可以不同，或者是大致相同。优选地，Chip-A灯珠、Chip-B灯珠和Chip-C灯珠的工作电压相同，比如工作电压均为5v，当然也可以其他电压，比如3.3V或3.6V等。由此图42示出的LED灯带的供电电压为15V，图42示出的LED灯带的供电电压为10V，图41示出的LED灯带的供电电压为30V。由此可以可理解的是，通过在每个LED模组串联不同数量的LED灯珠，可是实现不同的供电电压，同时还是实现高压供电，该高压供电可以理解为目前市场上一般是使用10V以下的供电装置对LED灯带进行供电，如果LED灯带较长，由于存在线损低压供电将会导致LED灯带尾部的LED灯珠亮度不足，进而影响了用户的体验度，并且随着LED灯带使用越久，这种现象越明显。而本申请的实施例提供的LED灯带可以是使用15V、30V和40V等等高压供电，高压供电可以减少电压线损的影响，由此可以提高用户的体验。
以图41和图47示出的LED灯带为例，该LED灯带的每个LED模组均包括六个LED灯珠，当然还可以包括其他数量的灯珠，比如每个LED模组均包括四个、五个、七个、八个、九个等等，即可以理解为每个LED模组还可以包括n个LED灯珠，n为大于等于2正整数。其中，每个LED模组中首灯珠和尾灯珠分别为LED灯珠10a和LED灯珠10c，中间灯珠为LED灯珠10b。
还需要说明的是，一条LED灯带的多个LED模组可以包括相同数量的LED灯珠，当然也可以包括不同数量LED灯珠，在此不做限定。
综上，本申请实施例提供的LED灯带，其均包括至少四条导线和多个LED模组，每个LED模组包括至少两个LED灯珠，至少两个LED灯珠与四条导线电性连接，四条导线中的一条导线为通信导线，其他三条导线为供电导线，每个LED模组中的多个LED灯珠依次排列在四条导线上并形成一个条带，即从外观上看所有LED灯珠均是串联在四条导线上，但是在供电导线上，多个LED模组之间彼此并联且每个LED模组的至少两个LED灯珠串联，但是在通信导线上，该条带上的LED灯珠均串联。该LED灯带采用电源串并联、信号串联的方式，以实现多种不同供电电压的应用方案，由此采用串行通讯协议控制LED灯带上的每个LED灯珠，由此可以实现发光效果多样且可任意调节，且不受级联点数以及距离限制。该LED灯带可以有效地解决了现有LED灯带的难点和痛点，即可以实现长距离级联、发光效果多样、控制简便且供电电压可以根据需求任意调节。此外，该LED灯带还可以采用目 前皮线灯相同的生产工艺制作，制作简单，可以提高LED灯带的生产效率。
在一些实施例中，如图48所示，该LED灯带100还可以包括电源控制器30，也可以称为供电装置或控制装置，该电源控制器30用于通过四条导线给LED灯带中的LED灯珠提供工作电压和控制信号。该电源控制器30除了可以提供工作电压外，即除了包括电源电路外，其还包括处理器，比如包括单片机等，用于给LED灯珠提供控制信号，以对其他发光进行控制，比如调整色彩和发光时长等。具体地，电源控制器30可以采用串行级联通信协议控制LED灯带中的LED灯珠，当然也可以采用其他通信协议。串行级联通信协议包括归零码通信协议和归一码通信协议等。
其中，第一导线21的第一端用于与电源控制器30的正极端口连接，而第二导线22的第一端可以与第一导线21的第一端连接，由此还可以节省电源控制器供电端口，第四导线24的第一端与电源控制器的负极端口连接；第三导线23的第一端与电源控制器的信号端口连接。导线的第一端是指与电源控制器30连接的一端。
在一些实施例中，LED灯带包括一种类型或多种类型的LED模组，每种类型的LED模组对应一种供电电压，具体是不同类型LED模组包括不同数量的LED灯珠，由于不同数量的LED灯珠均是串联，故对应的供电电压也不同。
在一些实施例中，示例性的，LED灯带对应的条带上可以设有裁剪标识，所述裁剪标识至少包括电压标识，该裁剪标识具体可以是一个标签，该标签设置LED灯带的导线上，该电压标识用于指示用户根据其需要进行裁剪。比如一条LED灯带包括12V供电的多个LED模组和另外24V供电的多个LED模组，可以在两者之间设置该裁剪标识，便于用户裁剪两条LED灯带。
在一些实施例中，示例性的，LED灯带对应的条带上可以设有裁剪标识，该裁剪标识可以是一个剪切口，设置在LED灯带的导线上，具体可以利用激光或者剪切工具在导线上打个剪刀口，用于提示用户需要在剪刀口处裁剪，剪切工具比如剪刀等。比如一条LED灯带包括12V供电的多个LED模组和另外24V供电的多个LED模组，进而便于用户裁剪两条LED灯带。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (54)

  1. 一种LED灯带，其特征在于，所述LED灯带包括：
    至少四条导线；
    多个LED模组，所述LED模组包括至少两个LED灯珠，所述LED灯珠包括至少四对引脚，所述LED灯珠与所述四条导线电性连接，且多个所述LED灯珠依次排列所述四条导线上并形成一个条带；
    其中，所述四条导线中的一条导线为通信导线，其他三条导线为供电导线；在所述通信导线上，所述条带上的LED灯珠均串联；在所述供电导线上，多个所述LED模组之间彼此并联，且每个所述LED模组的至少两个LED灯珠串联。
  2. 根据权利要求1所述的LED灯带，其特征在于，所述LED灯带还包括：
    电源控制器，所述电源控制器用于通过所述四条导线给所述LED灯带中的LED灯珠提供工作电压和控制信号，所述电源控制器采用串行通信协议控制所述LED灯带中的LED灯珠。
  3. 根据权利要求1所述的LED灯带，其特征在于，所述LED灯带包括一种类型或多种类型的所述LED模组，每种类型的所述LED模组对应一种供电电压。
  4. 根据权利要求1所述的LED灯带，其特征在于，所述条带上设有裁剪标识，所述裁剪标识至少包括电压标识。
  5. 根据权利要求1所述的LED灯带，其特征在于，所述LED模组包括第一LED灯珠和第二LED灯珠；或者，所述LED模组包括第一LED灯珠、第二LED灯珠和第三LED灯珠，其中，所述第三LED灯珠位于所述第一LED灯珠和第二LED灯珠之间，所述第一LED灯珠作为所述LED模组的首灯珠，所述第二LED灯珠作为所述LED模组的尾灯珠。
  6. 根据权利要求5所述的LED灯带，其特征在于，所述第一LED灯珠、第二LED灯珠和第三LED灯珠的外部结构相同，所述第一LED灯珠、第二LED灯珠和第三LED灯珠的内部结构不同；
    其中，所述外部结构包括绝缘座、引脚的连接部和封装胶，所述内部结构包括引脚的固晶部。
  7. 根据权利要求5所述的LED灯带，其特征在于，所述引脚包括连接部和固晶部，所述连接部用于导线电性连接，所述固晶部用于设置晶片和用于驱动所述晶片发光的驱动芯片；所述四对引脚分别为第一引脚、第二引脚、第三引脚、第四引脚、第五引脚、第六引脚、第七引脚和第八引脚；所述第一引脚和第二引脚组成第一引脚对，所述第三引脚和第四引脚组成第二引脚对，所述第五引脚和第六引脚组成第三引脚对，所述第七引脚和第八引脚组成第四引脚对；所述四条导线包括第一导线、第二导线、第三导线和第四导线，所述第一导线为正极线、所述第二导线为正极线、所述第三导线为通信导线、所述第四导线为负极线；
    其中，所述第一引脚对与所述第一导线电性连接，所述第二引脚对与所述第二导线电性连接，所述第三引脚对与所述第三导线电性连接，所述第四引脚对与所述第四导线电性连接；或者，所述第一引脚对与所述第一导线电性连接，所述第二引脚对与所述第三导线电性连接，所述第三引脚对与所述第二导线电性连接，所述第四引脚对与所述第四导线电性连接；
    其中，所述第二导线和第三导线的导电线芯在所述第三引脚和第四引脚的连接部之间的部分切断；所述第二导线和第三导线的导电线芯在所述第五引脚和第六引脚的连接部之间的部分切断。
  8. 根据权利要求7所述的LED灯带，其特征在于，所述LED模组包括第一LED灯珠，对于所述第一LED灯珠：
    所述第一引脚包括第一固晶部，所述第二引脚包括第二固晶部，所述晶片与所述第一固 晶部电性连接，所述驱动芯片的正极端与所述第一固晶部电性连接；
    所述第三引脚包括第三固晶部，所述第四引脚包括第四固晶部，所述驱动芯片的负极端与所述第四固晶部电性连接；所述第三引脚和第四引脚的连接部均与所述第二导线电性连接；
    所述第五引脚包括第五固晶部，所述第六引脚包括第六固晶部，所述第五固晶部用于给所述驱动芯片的信号输入端传输控制信号，所述第六固晶部与所述驱动芯片的信号输出端连接；
    所述第七引脚包括第七固晶部，所述第八引脚包括第八固晶部。
  9. 根据权利要求8所述的LED灯带，其特征在于，所述第一固晶部和所述第二固晶部一体成型；或者，所述第一固晶部和所述第二固晶部间隔设置，所述驱动芯片的正极端能够与所述第二固晶部电性连接。
  10. 根据权利要求8所述的LED灯带，其特征在于，所述第一LED灯珠还包括：
    第一过渡引脚，所述第一过渡引脚包括固晶部，所述第一过渡引脚的固晶部设有二极管，所述二极管的一端与所述第一过渡引脚的固晶部电性连接，所述二极管的另一端通过键合线与所述第一固晶部电性连接，所述第一过渡引脚的固晶部还通过键合线与所述驱动芯片的信号输入端连接，所述第一过渡引脚的固晶部还与所述第五固晶部电性连接。
  11. 根据权利要求10所述的LED灯带，其特征在于，所述第一LED灯珠还包括：
    第二过渡引脚，所述第一过渡引脚和第二过渡引脚设置所述绝缘座的相对两侧，所述第二过渡引脚的固晶部与所述第四固晶部一体成型。
  12. 根据权利要求10所述的LED灯带，其特征在于，所述第一过渡引脚的固晶部通过电容与所述第五固晶部电性连接。
  13. 根据权利要求8所述的LED灯带，其特征在于，所述第一固晶部设置有一个或多个所述晶片；所述晶片通过键合线与所述驱动芯片电性连接；所述晶片通过键合线与所述第一固晶部电性连接，或者，所述晶片通过粘合接触与所述第一固晶部电性连接。
  14. 根据权利要求13所述的LED灯带，其特征在于，所述第一固晶部设置有绿光芯片和红光芯片；其中，所述绿光芯片通过键合线分别与所述第一固晶部和所述驱动芯片电性连接；所述红光芯片通过键合线与所述驱动芯片连接，以及通过导电银胶与所述第一固晶部电性连接。
  15. 根据权利要求8所述的LED灯带，其特征在于，所述第四固晶部设置有所述驱动芯片和所述晶片；所述晶片通过键合线与所述第一固晶部电性连接，所述晶片还通过键合线与所述驱动芯片电性连接。
  16. 根据权利要求15所述的LED灯带，其特征在于，设置在所述第四固晶部的晶片为蓝光芯片，并且所述蓝光芯片设置所述第四固晶部中靠近所述第一固晶部的位置，使得所述蓝光芯片靠近设置在所述第一固晶部上的晶片。
  17. 根据权利要求7所述的LED灯带，其特征在于，所述LED模组包括第一LED灯珠，对于所述第一LED灯珠：
    所述第一引脚包括第一固晶部，所述第二引脚包括第二固晶部，所述晶片与所述第二固晶部电性连接，所述驱动芯片的正极端与所述第二固晶部电性连接；
    所述第三引脚包括第三固晶部，所述第四引脚包括第四固晶部，所述第三固晶部用于给所述驱动芯片的信号输入端传输控制信号，所述第四固晶部与所述驱动芯片的信号输出端连接；
    所述第五引脚包括第五固晶部，所述第六引脚包括第六固晶部，所述驱动芯片的负极端与所述第六固晶部电性连接。
  18. 根据权利要求17所述的LED灯带，其特征在于，所述第一固晶部和所述第二固晶部一体成型或间隔设置，所述驱动芯片的正极端能够与所述第一固晶部电性连接；或者，
    所述第二固晶部和所述第五固晶部一体成型或间隔设置。
  19. 根据权利要求17所述的LED灯带，其特征在于，所述第一LED灯珠还包括：
    第一过渡引脚，所述第一过渡引脚包括固晶部，所述第一过渡引脚的固晶部设有二极管，所述二极管的一端与所述第一过渡引脚的固晶部电性连接，所述二极管的另一端通过键合线与所述第二固晶部电性连接。
  20. 根据权利要求19所述的LED灯带，其特征在于，所述第一过渡引脚的固晶部与所述第三固晶部通过电容连接，所述第一过渡引脚的固晶部通过键合线与所述驱动芯片的信号输入端连接。
  21. 根据权利要求20所述的LED灯带，其特征在于，所述第一过渡引脚的固晶部包括延伸至与所述第六固晶部对齐的一连接端部，所述驱动芯片的信号输入端通过键合线与所述连接端部电性连接。
  22. 根据权利要求17所述的LED灯带，其特征在于，所述第二固晶部设置有一个或多个所述晶片；所述晶片通过键合线与所述驱动芯片电性连接；所述晶片通过键合线与所述第二固晶部电性连接，或者，所述晶片通过粘合接触与所述第二固晶部电性连接。
  23. 根据权利要求22所述的LED灯带，其特征在于，所述第二固晶部设置有绿光芯片和红光芯片；其中，所述绿光芯片通过键合线分别与所述第二固晶部和所述驱动芯片电性连接；所述红光芯片通过键合线与所述驱动芯片连接，以及通过导电银胶与所述第二固晶部电性连接。
  24. 根据权利要求22所述的LED灯带，其特征在于，所述第二固晶部至少包括间隔设置的第一设置部和第二设置部，所述第一设置部用于设置所述绿光芯片和红光芯片，所述第二设置部用于设置键合线连接点。
  25. 根据权利要求17所述的LED灯带，其特征在于，所述第四固晶部设置有所述晶片；所述晶片通过键合线与所述第二固晶部电性连接，所述晶片还通过键合线与所述驱动芯片电性连接。
  26. 根据权利要求25所述的LED灯带，其特征在于，设置在所述第四固晶部的晶片为蓝光芯片，并且所述蓝光芯片设置所述第四固晶部中靠近所述第二固晶部的位置，使得所述蓝光芯片靠近设置在所述第二固晶部上的晶片。
  27. 根据权利要求17所述的LED灯带，其特征在于，所述第六固晶部设置有所述驱动芯片，所述第六固晶部中设置所述驱动芯片的区域位于所述第三固晶部、第四固晶部、第五固晶部之间。
  28. 根据权利要求27所述的LED灯带，其特征在于，所述第六固晶部包括间隔设置的第一放置部和第二放置部，所述第一放置部和所述第二放置部连接，所述第一放置部用于设置所述驱动芯片，所述第二放置部用于设置键合线连接点，所述第一放置部和所述第二放置部之间部分为间隔区域；
    所述第四固晶部包括晶片放置部和从所述晶片放置部延伸出的键合线连接点放置部，所述键合线连接点放置部延伸至所述间隔区域。
  29. 根据权利要求7所述的LED灯带，其特征在于，所述LED模组包括第二LED灯珠，对于所述第二LED灯珠：
    所述第三引脚包括第三固晶部，所述第四引脚包括第四固晶部，所述驱动芯片的正极端与所述第三固晶部电性连接，所述晶片与所述第三固晶部电性连接；
    所述第五引脚包括第五固晶部，所述第六引脚包括第六固晶部，所述第五固晶部与所述驱动芯片的信号输入端连接，所述第六固晶部与所述驱动芯片的信号输出端连接；
    所述第七引脚包括第七固晶部，所述第八引脚包括第八固晶部，所述第八固晶部与所述驱动芯片的负极端电性连接。
  30. 根据权利要求29所述的LED灯带，其特征在于，所述第二LED灯珠还包括：第一过渡引脚和第二过渡引脚，所述第二过渡引脚的固晶部与所述第八固晶部一体成型。
  31. 根据权利要求29所述的LED灯带，其特征在于，所述第三固晶部或第四固晶部设置有一个或多个所述晶片；所述晶片通过键合线与所述驱动芯片电性连接；所述晶片还通过键合线与所述第三固晶部电性连接，或者，所述晶片通过粘合接触与所述第三固晶部电性连接。
  32. 根据权利要求31所述的LED灯带，其特征在于，所述第三固晶部设置有绿光芯片和红光芯片，所述第四固晶部设置有蓝光芯片；
    其中，所述绿光芯片通过键合线分别与所述第三固晶部和所述驱动芯片电性连接；所述红光芯片通过键合线与所述驱动芯片连接，以及通过粘合接触与所述第三固晶部电性连接；所述蓝光芯片通过键合线分别与所述驱动芯片和所述第三固晶部连接。
  33. 根据权利要求31所述的LED灯带，其特征在于，所述蓝光芯片设置在所述第四固晶部中靠近所述第三固晶部的位置，使得所述蓝光芯片靠近设置在所述第三固晶部上的晶片。
  34. 根据权利要求29所述的LED灯带，其特征在于，所述第八固晶部设置有所述驱动芯片，所述第八固晶部中设置所述驱动芯片的区域延伸在所述第三固晶部、第四固晶部、第五固晶部和第六固晶部之间。
  35. 根据权利要求7所述的LED灯带，其特征在于，所述LED模组包括第二LED灯珠，对于所述第二LED灯珠：
    所述第三引脚包括第三固晶部，所述第四引脚包括第四固晶部，所述第三固晶部与所述驱动芯片的信号输入端连接，所述第四固晶部与所述驱动芯片的信号输出端连接；
    所述第五引脚包括第五固晶部，所述第六引脚包括第六固晶部，所述驱动芯片的正极端与所述第五固晶部电性连接，所述晶片与所述第五固晶部连接；
    所述第八引脚包括第八固晶部，所述驱动芯片的负极端与所述第八固晶部电性连接。
  36. 根据权利要求35所述的LED灯带，其特征在于，所述第五固晶部设置有一个或多个所述晶片；所述晶片通过键合线与所述驱动芯片电性连接；所述晶片通过键合线与所述第五固晶部电性连接，或者，所述晶片通过粘合接触与所述第五固晶部电性连接。
  37. 根据权利要求36所述的LED灯带，其特征在于，所述第五固晶部设置有绿光芯片和红光芯片；其中，所述绿光芯片通过键合线分别与所述第五固晶部和所述驱动芯片电性连接；所述红光芯片通过键合线与所述驱动芯片连接，以及通过粘合接触与所述第五固晶部电性连接。
  38. 根据权利要求36所述的LED灯带，其特征在于，所述第五固晶部至少包括间隔设置的第三设置部和第四设置部，所述第三设置部用于设置所述绿光芯片和红光芯片，所述第四设置部用于设置键合线连接点。
  39. 根据权利要求38所述的LED灯带，其特征在于，设置在所述第四固晶部的晶片为蓝光芯片，并且所述蓝光芯片设置所述第四固晶部中靠近所述第五固晶部的位置，使得所述蓝光芯片靠近设置在所述第五固晶部上的晶片。
  40. 根据权利要求35所述的LED灯带，其特征在于，所述第八固晶部设置有所述驱动芯片，所述第八固晶部中设置所述驱动芯片的区域位于第四固晶部和第五固晶部之间。
  41. 根据权利要求40所述的LED灯带，其特征在于，所述第八固晶部包括间隔设置的第三放置部和第四放置部，所述第三放置部和所述第四放置部连接，所述第三放置部用于设置所述驱动芯片，所述第四放置部用于设置键合线连接点，所述第三放置部和所述第四放置部之间部分为间隔区域；
    所述第四固晶部包括晶片放置部和从所述晶片放置部延伸出的键合线连接点放置部，所述键合线连接点放置部延伸至所述间隔区域。
  42. 根据权利要求7所述的LED灯带，其特征在于，所述LED模组还包括第三LED灯珠，对于所述第三LED灯珠：
    所述第三引脚包括第三固晶部，所述第四引脚包括第四固晶部，所述驱动芯片的正极端 与所述第三固晶部电性连接，所述驱动芯片的负极端与所述第四固晶部电性连接，所述晶片与所述第三固晶部电性连接；
    所述第五引脚包括第五固晶部，所述第六引脚包括第六固晶部，所述第五固晶部与所述驱动芯片的信号输入端连接，所述第六固晶部与所述驱动芯片的信号输出端连接。
  43. 根据权利要求42所述的LED灯带，其特征在于，所述第三LED灯珠还包括：第一过渡引脚和第二过渡引脚，所述第二过渡引脚的固晶部与所述第四固晶部一体成型。
  44. 根据权利要求42所述的LED灯带，其特征在于，所述第三固晶部或第四固晶部设置有一个或多个所述晶片；所述晶片通过键合线与所述驱动芯片电性连接；所述晶片还通过键合线与所述第三固晶部电性连接，或者，所述晶片通过粘合接触与所述第三固晶部电性连接。
  45. 根据权利要求44所述的LED灯带，其特征在于，所述第三固晶部设置有绿光芯片和红光芯片，所述第四固晶部设置有蓝光芯片；
    其中，所述绿光芯片通过键合线分别与所述第三固晶部和所述驱动芯片电性连接；所述红光芯片通过键合线与所述驱动芯片连接，以及通过粘合接触与所述第三固晶部电性连接；所述蓝光芯片通过键合线分别与所述驱动芯片和所述第三固晶部连接。
  46. 根据权利要求45所述的LED灯带，其特征在于，所述蓝光芯片设置在所述第四固晶部中靠近所述第三固晶部的位置，使得所述蓝光芯片靠近设置在所述第三固晶部上的晶片。
  47. 根据权利要求42所述的LED灯带，其特征在于，所述驱动芯片设置在所述第四固晶部，其中，所述第四固晶部中设置所述驱动芯片的部分位于所述第三固晶部、第五固晶部和第六固晶部之间。
  48. 根据权利要求7所述的LED灯带，其特征在于，所述LED模组包括第二LED灯珠，对于所述第二LED灯珠：
    所述第三引脚包括第三固晶部，所述第四引脚包括第四固晶部，所述第三固晶部与所述驱动芯片的信号输入端连接，所述第四固晶部与所述驱动芯片的信号输出端连接；
    所述第五引脚包括第五固晶部，所述第六引脚包括第六固晶部，所述驱动芯片的正极端与所述第五固晶部电性连接，所述驱动芯片的负极端与所述第六固晶部电性连接，所述晶片与所述第五固晶部电性连接；所述第五引脚和所述第六引脚的连接部均与所述第二导线电性连接。
  49. 根据权利要求48所述的LED灯带，其特征在于，所述第五固晶部设置有一个或多个所述晶片；所述晶片通过键合线与所述驱动芯片电性连接；所述晶片通过键合线与所述第五固晶部电性连接，或者，所述晶片通过粘合接触与所述第五固晶部电性连接。
  50. 根据权利要求49所述的LED灯带，其特征在于，所述第五固晶部设置有绿光芯片和红光芯片；其中，所述绿光芯片通过键合线分别与所述第五固晶部和所述驱动芯片电性连接；所述红光芯片通过键合线与所述驱动芯片连接，以及通过粘合接触与所述第五固晶部电性连接。
  51. 根据权利要求50所述的LED灯带，其特征在于，所述第五固晶部至少包括间隔设置的第三设置部和第四设置部，所述第三设置部用于设置所述绿光芯片和红光芯片，所述第四设置部用于设置键合线连接点。
  52. 根据权利要求51所述的LED灯带，其特征在于，设置在所述第四固晶部的晶片为蓝光芯片，并且所述蓝光芯片设置所述第四固晶部中靠近所述第五固晶部的位置，使得所述蓝光芯片靠近设置在所述第五固晶部上的晶片。
  53. 根据权利要求48所述的LED灯带，其特征在于，所述第六固晶部设置有所述驱动芯片，所述第六固晶部中设置所述驱动芯片的区域位于第四固晶部和第五固晶部之间。
  54. 根据权利要求53所述的LED灯带，其特征在于，所述第六固晶部包括间隔设置的第一放置部和第二放置部，所述第一放置部和所述第二放置部连接，所述第一放置部用于设 置所述驱动芯片，所述第二放置部用于设置键合线连接点，所述第一放置部和所述第二放置部之间部分为间隔区域；
    所述第四固晶部包括晶片放置部和从所述晶片放置部延伸出的键合线连接点放置部，所述键合线连接点放置部延伸至所述间隔区域。
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CN116498937B (zh) * 2023-06-29 2023-09-08 南昌英诺泰克科技有限公司 一种轨道灯具及工作方法

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