WO2023241378A1 - 光模块 - Google Patents

光模块 Download PDF

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Publication number
WO2023241378A1
WO2023241378A1 PCT/CN2023/097958 CN2023097958W WO2023241378A1 WO 2023241378 A1 WO2023241378 A1 WO 2023241378A1 CN 2023097958 W CN2023097958 W CN 2023097958W WO 2023241378 A1 WO2023241378 A1 WO 2023241378A1
Authority
WO
WIPO (PCT)
Prior art keywords
filter
optical
side wall
light
light receiving
Prior art date
Application number
PCT/CN2023/097958
Other languages
English (en)
French (fr)
Inventor
曲一帆
张强
杨世海
赵其圣
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202221497568.5U external-priority patent/CN217689522U/zh
Priority claimed from CN202210673876.7A external-priority patent/CN117270114A/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2023241378A1 publication Critical patent/WO2023241378A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers

Definitions

  • the present disclosure relates to the technical field of optical fiber communication, and in particular, to an optical module.
  • optical communication technology As one of the key components in optical communication equipment, can realize photoelectric signal conversion. With the development of optical communication technology, the data transmission rate of optical modules is required to continue to increase.
  • An optical module provided according to some embodiments of the present disclosure includes: a circuit board and a transceiver cavity.
  • the light emitting component is located inside the transceiver cavity and includes a light emitting chip.
  • the light emitting direction of the light emitting chip is parallel to the bottom surface of the transceiver cavity.
  • the light receiving component is arranged on the side wall of the transceiver cavity, and a second filter is provided on the surface of the light receiving component.
  • the light receiving component includes a light receiving chip, and the height of the light receiving chip is the same as the height of the light emitting chip.
  • the transceiver device is located inside the transceiver cavity and includes a fiber adapter, a first lens, and a first filter.
  • the first surface of the first filter faces the light emitting surface of the light emitting chip, and the second surface of the first filter faces the light emitting chip.
  • the first filter is configured to reflect the receiving light signal from the optical fiber adapter and transmit the emitting light signal generated by the light emitting chip.
  • the first filter is tilted relative to the bottom surface of the transceiver cavity, so that the plane where the incident light and the emitted light of the first filter are located forms a preset angle with the bottom surface of the transceiver cavity, so that the emitted light of the first filter Inclined towards the light receiving chip.
  • the first filter is arranged perpendicular to the bottom surface of the transceiver cavity, and a displacement prism is provided between the first filter and the second filter.
  • the displacement prism is configured to change the transmission of the received optical signal entering the light receiving chip. direction and transmission height, so that the received optical signal is injected into the light receiving chip; the height of the light exit surface of the displacement prism is greater than the height of the light entrance surface of the displacement prism, the light entrance surface of the displacement prism faces the second surface of the first filter, and the displacement prism The light exit surface is connected to the second filter.
  • Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure.
  • Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure.
  • Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure.
  • Figure 5 is an internal structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • Figure 6 is an internal structural diagram of a transceiver cavity provided according to some embodiments of the present disclosure.
  • Figure 7 is an exploded structural view of a transceiver cavity provided according to some embodiments of the present disclosure.
  • Figure 8 is a structural diagram of a transceiver cavity provided according to some embodiments of the present disclosure.
  • Figure 9 is a structural diagram 2 of a transceiver cavity provided according to some embodiments of the present disclosure.
  • Figure 10 is an exploded view of a light emitting component provided according to some embodiments of the present disclosure.
  • Figure 11 is a structural diagram of a light receiving component provided according to some embodiments of the present disclosure.
  • Figure 12 is an exploded view of a light receiving component provided according to some embodiments of the present disclosure.
  • Figure 13 is a structural diagram of a circuit board provided according to some embodiments of the present disclosure.
  • Figure 14 is a structural diagram 2 of a circuit board provided according to some embodiments of the present disclosure.
  • Figure 15 is an exploded schematic diagram of the assembly of a circuit board and a transceiver cavity according to some embodiments of the present disclosure
  • Figure 16 is a schematic assembly diagram of a circuit board and a transceiver cavity according to some embodiments of the present disclosure
  • Figure 17 is a cross-sectional view of the assembly of a circuit board and a transceiver cavity according to some embodiments of the present disclosure
  • Figure 18 is an assembly cross-sectional view of a circuit board and a transceiver cavity provided according to some embodiments of the present disclosure
  • Figure 19 is an assembly cross-sectional view of a circuit board and a transceiver cavity provided according to some embodiments of the present disclosure
  • Figure 20 is a schematic assembly diagram of a flexible circuit board and a transceiver cavity according to some embodiments of the present disclosure
  • Figure 21 is an assembly diagram of a first filter and a filter support frame provided according to some embodiments of the present disclosure.
  • Figure 22 is an exploded assembly view of a first filter and a filter support frame provided according to some embodiments of the present disclosure
  • Figure 23 is a schematic diagram of the relationship between a first filter configuration and an optical path according to some embodiments of the present disclosure
  • Figure 24 is a schematic diagram of the relationship between another arrangement form and optical path of a first filter provided according to some embodiments of the present disclosure.
  • Figure 25 is a structural diagram of a filter support frame provided according to some embodiments of the present disclosure.
  • Figure 26 is an optical path diagram 1 of an optical module provided according to some embodiments of the present disclosure.
  • Figure 27 is a structural diagram of another transceiver cavity provided according to some embodiments of the present disclosure.
  • Figure 28 is an exploded view of another transceiver cavity provided according to some embodiments of the present disclosure.
  • Figure 29 is an exploded view of the internal structure of another transceiver cavity provided according to some embodiments of the present disclosure.
  • Figure 30 is a structural diagram of another light receiving component provided according to some embodiments of the present disclosure.
  • Figure 31 is a structural diagram of a displacement prism arrangement provided according to some embodiments of the present disclosure.
  • Figure 32 is Figure 2 of a displacement prism arrangement structure provided according to some embodiments of the present disclosure.
  • Figure 33 is Figure 3 of a displacement prism arrangement structure provided according to some embodiments of the present disclosure.
  • Figure 34 is a schematic diagram of a displacement prism changing an optical path according to some embodiments of the present disclosure.
  • Figure 35 is an optical path diagram 2 of an optical module provided according to some embodiments of the present disclosure.
  • optical communication technology in order to establish information transfer between information processing devices, information needs to be loaded onto light and the propagation of light is used to achieve information transfer.
  • light loaded with information is an optical signal.
  • Optical signals can reduce the loss of optical power when transmitted in information transmission equipment, so high-speed, long-distance, and low-cost information transmission can be achieved.
  • the signals that information processing equipment can identify and process are electrical signals.
  • Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, TVs, etc.
  • Information transmission equipment usually includes optical fibers and optical waveguides.
  • Optical modules can realize the mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment.
  • at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first light from the optical fiber The signal is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module Convert the second electrical signal into a second optical signal, and transmit the second optical signal to the optical fiber.
  • the information processing equipment directly connected to the optical module is called the host computer of the optical module.
  • the optical signal input end or the optical signal output end of the optical module may be called an optical port
  • the electrical signal input end or the electrical signal output end of the optical module may be called an electrical port.
  • Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure.
  • the optical communication system mainly includes remote information processing equipment 1000, local information processing equipment 2000, host computer 100, optical module 200, optical fiber 101 and network cable 103.
  • One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200.
  • the optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power.
  • the optical signal undergoes total reflection multiple times in the optical fiber 101 to transmit the information from the remote information processing device 1000.
  • the optical signal is transmitted to the optical module 200, or the optical signal from the optical module 200 is transmitted to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.
  • the optical communication system may include one or more optical fibers 101, and the optical fibers 101 and the optical module 200 may be detachably connected or fixedly connected.
  • the host computer 100 is configured to provide data signals to the optical module 200 , or to receive data signals from the optical module 200 , or to monitor or control the working status of the optical module 200 .
  • the host computer 100 includes a substantially rectangular parallelepiped housing, and an optical module interface 102 provided on the housing.
  • the optical module interface 102 is configured to access the optical module 200 so that the host computer 100 and the optical module 200 establish a one-way or two-way electrical signal connection.
  • the host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network.
  • the external electrical interface includes a universal serial bus interface (Universal Serial Bus, USB) or a network cable interface 104.
  • the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 can establish a one-way or two-way electrical connection. signal connection.
  • One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103.
  • the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103.
  • the host computer 100 generates a second electrical signal according to the third electrical signal, and the second electrical signal from the host computer 100 is transmitted to the optical system.
  • Module 200 The optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101.
  • the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.
  • the first optical signal from the remote information processing device 1000 is propagated through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200.
  • the optical module 200 converts the first optical signal into a first electrical signal.
  • the module 200 transmits the first electrical signal to the host computer 100 , the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000 .
  • the optical module is a tool to realize the mutual conversion of optical signals and electrical signals. During the above-mentioned conversion process of optical signals and electrical signals, the information does not change, and the encoding and decoding methods of the information can change.
  • the host computer 100 also includes optical line terminals (Optical Line Terminal, OLT), optical network equipment (Optical Network Terminal, ONT), or data center servers, etc.
  • OLT optical Line Terminal
  • ONT optical network equipment
  • data center servers etc.
  • FIG. 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure.
  • the host computer 100 also includes a PCB circuit board 105 provided in the housing, a cage 106 provided on the surface of the PCB circuit board 105, a radiator 107 provided on the cage 106, and a heat sink 107 provided inside the cage 106.
  • electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other protruding structures that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106.
  • the heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100.
  • the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.
  • FIG. 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure
  • FIG. 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure.
  • the optical module 200 includes a housing, a circuit board 300 disposed in the housing, a transceiver cavity 400a, a light emitting component, and a light receiving component.
  • the housing includes an upper housing 201 and a lower housing 202.
  • the upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205; the outer contour of the housing generally presents a square body.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and the cover plate 2011 covers the lower case. on the two lower side plates 2022 of 202 to form the above-mentioned housing.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021;
  • the upper case 201 includes a cover plate 2011, and two lower side plates 2022 located on both sides of the cover plate 2011.
  • the two upper side plates arranged perpendicularly to the cover plate 2011 are combined with the two lower side plates 2022 to realize that the upper housing 201 is covered on the lower housing 202 .
  • the direction of the connection between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 204 is located at an end of the optical module 200 and the opening 205 is located at a side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger of the circuit board 300 extends from the opening 204 and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, configured to access the external optical fiber 101, so that the optical fiber 101 connects to the optical fiber 101.
  • the light emitting component and the light receiving component in the module 200 are configured to access the external optical fiber 101, so that the optical fiber 101 connects to the optical fiber 101.
  • the assembly method of combining the upper shell 201 and the lower shell 202 is used to facilitate the installation of the circuit board 300, the transceiver cavity 400a, the light emitting component, the light receiving component, etc. into the above shell.
  • the upper shell 201 and the lower shell 202 can package and protect the above devices.
  • when assembling the circuit board 300 When the transceiver cavity 400a, light emitting components, light receiving components, etc. are installed, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, and is conducive to automated production.
  • the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
  • the light module 200 also includes an unlocking component 203 located outside its housing.
  • the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.
  • the unlocking component 203 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer 100 .
  • the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging parts of the unlocking part 203; when the unlocking part 203 is pulled, the engaging parts of the unlocking part 203 move accordingly, thereby changing the engaging parts.
  • the connection relationship with the host computer is to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be extracted from the cage 106 .
  • the circuit board 300 includes circuit wiring, electronic components, chips, etc.
  • the electronic components and chips are connected according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding.
  • Electronic components may include, for example, capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET).
  • the chip may include, for example, a microcontroller unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (Limiting Amplifier, LIA), and a clock data recovery chip (Clock and Data Recovery, CDR). ), power management chip, digital signal processing (Digital Signal Processing, DSP) chip.
  • MCU microcontroller Unit
  • TIA Transimpedance Amplifier
  • LIA limiting amplifier
  • CDR clock data recovery chip
  • power management chip digital signal processing (Digital Signal Processing, DSP)
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the cage of the host computer 100 106 in the electrical connector.
  • the circuit board 300 also includes gold fingers formed on its end surface, and the gold fingers are composed of a plurality of mutually independent pins.
  • the circuit board 300 is inserted into the cage 106, and the golden finger is connected to the electrical connector in the cage 106.
  • the gold fingers can be provided only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or can be provided on the surfaces of the upper and lower sides of the circuit board 300 to provide a larger number of pins to accommodate the pins. Occasions with large quantity requirements.
  • the golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc.
  • I2C Inter-Integrated Circuit
  • flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • FIG. 5 is an internal structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • a laser driver chip 300a is disposed on the surface of the circuit board 300.
  • the laser driver chip 300a is located outside the transceiver cavity 400a.
  • the laser driver chip 300a is used to provide drive signals for the laser chip.
  • the transceiver cavity 400a is electrically connected to the circuit board 300.
  • the upper surface of the transceiver cavity 400a is covered with a cover plate 408a.
  • the transceiver cavity 400a is connected with the cover plate 408a to form a sealed housing with a receiving cavity.
  • one side of the transceiver cavity 400a is plug-connected to the surface of the circuit board 300, and one side is connected to the circuit board 300 through the flexible circuit board 900a.
  • FIG. 6 is an internal structural diagram of a transceiver cavity provided according to some embodiments of the present disclosure
  • FIG. 7 is an exploded structural view of a transceiver cavity provided according to some embodiments of the present disclosure.
  • a transceiver device 500a, a light emitting component 600a and a light receiving component 700a are respectively provided inside the transceiver cavity 400a.
  • the transceiver device 500a, the light emitting component 600a and the light receiving component 700a are compactly arranged in the transceiver cavity 400a, fully and cleverly utilizing the space inside the transceiver cavity 400a.
  • the light emitting component 600a and the light receiving component 700a can be packaged in many forms, such as micro-optical packaging or TO packaging.
  • the micro-optical packaging method refers to: the light emitted by the optical chip enters the air, and during the installation of lenses, fiber optic adapters, etc. on the optical path, the light emitted by the optical chip is coupled to the fiber optic adapter through the lens, and the fiber optic adapter is connected to the optical fiber. Due to the limitation of the cavity space, the light receiving component 700a in the embodiment of the present disclosure adopts coaxial packaging based on the ease of process manufacturing and the difficulty of matching with the cavity.
  • the transceiver device 500a is disposed inside the transceiver cavity 400a; the light emitting component 600a is disposed inside the transceiver cavity 400a; the light receiving component 700a is disposed on the side wall of the transceiver cavity 400a, for example, on the side wall inside the through hole.
  • the transceiver cavity 400a includes a first side wall 400a1, a second side wall 400a2, a third side wall 400a3, and a fourth side wall 400a4.
  • the first side wall 400a1 and the second side wall 400a2 are arranged oppositely, and the third side wall 400a3 and the fourth side wall 400a4 are arranged oppositely.
  • the four side walls 400a4 are arranged oppositely; the first side wall 400a1 and the second side wall 400a2 are located in the length direction of the transceiver cavity 400a, and the third side wall 400a3 and the fourth side wall 400a4 are located in the width direction of the transceiver cavity 400a.
  • the light receiving component 700a is disposed in the through hole 404 of the first side wall 400a1 of the transceiver cavity 400a.
  • the light emitting component 600a is disposed at one end close to the third side wall 400a3 of the transceiver cavity 400a; the transceiver device 500a is disposed at one end close to the fourth side wall 400a4 of the transceiver cavity 400a.
  • the transceiver device 500a is used for the light transmitting end and the light receiving end.
  • the transceiver device 500a includes an optical fiber adapter 501a, a first lens, a first filter 503a, and a filter support frame 504a.
  • the first lens may be converging lens 502a.
  • the first filter 503a can reflect the received optical signal and transmit the emitted optical signal.
  • the received optical signal refers to the external optical signal that enters the light receiving component 700a through the optical fiber adapter 501a; the emitted optical signal refers to the optical signal generated by the light emitting component 600a and transmitted to the outside.
  • the first filter plate 503a is connected to the filter plate support frame 504a, and the filter plate support frame 504a is used to support the first filter plate 503a.
  • the filter support frame 504a is provided between the first filter 503a and the second side wall.
  • a first mesa 401 and a second mesa 402 are respectively formed inside the transceiver cavity 400a, and the second mesa 402 is formed by sinking.
  • the first mesa 401 and the second mesa 402 are arranged in a stepped manner, and the height of the first mesa 401 is higher than the height of the second mesa 402 .
  • the surface of the first mesa 401 is provided with an optical fiber adapter 501a, a condensing lens 502a, a first filter 503a, a filter support frame 504a, and an isolator 800a.
  • the surface of the second mesa 402 is provided with a light emitting component 600a.
  • the light emitting component 600a includes a TEC 601a, a laser chip 604a, and the like.
  • the first filter plate 503a is inclined relative to the bottom end of the transceiver cavity 400a, and the first filter plate 503a is inclined toward the direction of the filter support frame 504a.
  • the TEC 601a has a certain height and the laser chip 604a is disposed on the surface of the TEC 601a, in order to ensure that the wiring length between the laser chip 604a and the laser driver chip 300a is short, the upper surface of the metallized ceramic substrate on the bottom surface of the laser chip 604a is It is flush with the upper surface of the laser driver chip 300a, so the second mesa 402 carrying the light emitting component 600a needs to be sunk, and the TEC 601a is placed in the space formed by the sinking, so that the overall height of the light emitting component 600a is sunk.
  • the third side wall 400a3 of the transceiver cavity 400a is formed with a first opening 403, and the circuit board 300 extends into the transceiver cavity through the first opening 403.
  • the bonding wire between the laser chip 604a and the laser driver chip 300a passes through the first opening 403, and the first opening 403 allows the bonding wire between the laser chip 604a and the laser driver chip 300a to pass through.
  • Figure 8 is a structural diagram of a transceiver cavity provided according to some embodiments of the present disclosure. As shown in FIG. 8 , the first opening 403 includes side walls 4031 .
  • a through hole 404 is formed on the first side wall 400a1 of the transceiver cavity 400a, and the light receiving component 700a is disposed in the through hole 404.
  • the two ends of the side wall of the transceiver cavity 400a respectively form a first protrusion 405 and a second protrusion 406.
  • the first protrusion 405 and the second protrusion 406 are protrudingly disposed relative to the side wall of the transceiver cavity 400a. Due to the small internal space of the transceiver cavity 400a and ensuring a more stable connection with the circuit board, the transceiver cavity 400a
  • the first protrusion 405 and the second protrusion 406 are respectively provided at both ends of the first side wall 400a1 of the hair chamber 400a.
  • a threaded hole is provided in the middle of the first protrusion 405, and a stable connection with the circuit board is achieved through the threads.
  • the first protrusion 405 and the second protrusion 406 are respectively located at two ends of the same side of the transceiver cavity 400a. For example, both are located on the first side wall 400a1 side of the transceiver cavity 400a. Since the first filter 503a is inclined toward the second side wall 400a2, in order to ensure the balance and stability of the transceiver cavity 400a, the first protrusion 405 and the second protrusion 406 are provided on the transceiver cavity 400a. One side of the first side wall to ensure balance and stability.
  • Figure 9 is a second structural diagram of a transceiver cavity provided according to some embodiments of the present disclosure.
  • a second opening 407 is formed on the fourth side wall of the transceiver cavity 400a, and the optical fiber adapter 501a is disposed in the second opening 407.
  • the position of the laser chip 604a can be determined according to the length of the wiring with the surface of the circuit board 300, and the position of the fiber optic adapter 501a can be determined according to the position of the laser chip 604a.
  • the fiber adapter 501a and the laser chip 604a The optical axes are on the same straight line.
  • the second opening 407 is also set sunk. Since the height of the TEC 601a is greater than half of the height of the fiber adapter 501a, then The sinking height of the second opening 407 is smaller than the sinking height of the second mesa 402 so that the optical axes of the optical fiber adapter 501a and the laser chip 604a are on the same straight line.
  • the optical fiber adapter 501a When the optical fiber adapter 501a extends into the second opening 407, the optical fiber adapter 501a can move back and forth in the second opening 407 to adapt to the length of the optical fiber. For example, when the optical fiber length is short, the optical fiber adapter 501a moves toward the outside of the transceiver cavity 400a along the second opening 407 to meet the connection size requirements; when the optical fiber length is long, the optical fiber adapter 501a moves toward the transceiver cavity 400a along the second opening 407 The interior of the cavity 400a moves to straighten the fiber and avoid bending the fiber.
  • the second opening 407 is inclined relative to the bottom surface of the transceiver cavity 400a.
  • the inclination angle is 3°, so that when the optical fiber adapter 501a is inserted into the second opening 407, the optical fiber end surface of the optical fiber adapter 501a is in contact with the bottom surface of the transceiver cavity 400a.
  • the incident angle of the emitted light is not vertical, making it difficult for the emitted light to be reflected back and increasing the coupling efficiency.
  • Figure 10 is an exploded view of a light emitting component according to some embodiments of the present disclosure.
  • the light emitting component 600a includes a semiconductor refrigerator TEC 601a, a first base 602a, a second base 603a, a laser chip 604a, and a second lens.
  • the second lens may be collimating lens 605a.
  • light emitting component 600a also includes a thermistor 606a.
  • the laser chip 604a is arranged on the surface of the metalized ceramic substrate.
  • a circuit pattern is formed on the surface of the metalized ceramic substrate, which can power the laser chip 604a.
  • the metalized ceramic substrate has good thermal conductivity and can be used as a heat sink for the laser chip 604a. To dissipate heat.
  • the surface of the TEC 601a is respectively provided with a first base 602a and a second base 603a.
  • a light emitting chip is provided on the surface of the first base 602a, and the light emitting chip is in the form of a laser chip 604a.
  • a collimating lens 605a is provided on the surface of the second base 603a, and the divergent light emitted by the laser chip 604a is condensed into parallel light by the collimating lens 605a.
  • a thermistor 606a is also provided on the side close to the laser chip 604a.
  • TEC 601a is directly set on the surface of the transceiver cavity 400a, and then the metallized ceramic substrate is set on the surface of TEC 601. TEC 601 is used to balance heat to maintain the set operating temperature of laser chip 604a. For this reason, it is placed close to the laser chip 604a.
  • the thermistor 606a is also provided on the side. The thermistor 606a collects the operating temperature of the laser chip 604a. The TEC 601a adjusts the temperature of the laser chip 604a according to the operating temperature to maintain the laser chip 604a within the set operating temperature range.
  • the height of the laser chip 604a can be increased through the first base 602a, and the height of the collimating lens 605a can be increased through the second base 603a, so that the central axes of the laser chip 604a and the collimating lens 605a are at the same height as the central axis of the optical fiber adapter 501a. , thereby increasing the coupling efficiency of the optical signal emitted by the laser chip 604a.
  • the heights of the first base 602a and the second base 603a can be flexibly set.
  • the optical axes of the fiber adapter 501a, the converging lens 502a, the first filter 503a, and the laser chip 604a are on the same straight line.
  • FIG 11 is a structural diagram of a light receiving component provided according to some embodiments of the present disclosure
  • Figure 12 is an exploded view of a light receiving component provided according to some embodiments of the present disclosure.
  • a second filter 701a is provided on the surface of the light receiving component 700a.
  • the light receiving component 700a includes a tube cap 702a and a tube base 703a.
  • the second filter 701a is provided on the outer surface of the tube cap 702a; the inner surface of the tube base 703a faces the inside of the transceiver cavity 400a.
  • the tube cap 702a and the tube base 703a form a certain accommodation space.
  • the surface of the tube base 703a is provided with a light receiving chip 704a.
  • the light receiving chip 704a can convert the received optical signal into an electrical signal.
  • the surface of the tube base 703a is provided with various pins 705a, such as power supply pins, signal pins, grounding pins, etc.
  • the second filter 701a is fixed on the outer surface of the tube cap 702 by pasting, which can filter out light of other wavelengths except the received light signal, so that the received light signal enters the light receiving chip 704a, and the light receiving chip 704a will receive the light.
  • the signal is converted into an electrical signal, while other optical signals are not allowed to enter the light receiving chip 704a.
  • the optical signal emitted by the laser chip 604a is transmitted to the outside through the optical fiber adapter 501a; the external optical signal is transmitted to the light receiving chip 704a through the optical fiber adapter 501a.
  • the optical signal emitted by the laser chip 604a is called a first optical signal
  • the optical signal transmitted to the light receiving chip 704a is called a second optical signal.
  • part of the first optical signal may enter the transceiver cavity 400a together with the second optical signal, and then enter the optical receiving chip.
  • a second filter 701a is provided on the outer surface of the component 700a to filter out other signals except the second optical signal from the optical signal entering the light receiving component 700a, allowing only the second optical signal to enter the light receiving component 700a.
  • the second filter 701a is a 0° filter.
  • the 0° filter refers to a filter with an angle of 0° between the incident light and the normal line of the filter, that is, the incident light enters the 0° filter perpendicularly. .
  • part of the first optical signal when the first optical signal is transmitted to the outside through the fiber optic adapter 501a, part of the first optical signal may enter the transceiver cavity 400a together with the second optical signal.
  • an isolator 800a is provided between the first filter 503a and the laser chip 604a. The first optical signal is prevented from returning to the laser chip 604a by the isolator 800a.
  • the optical signal generated by the laser chip 604a is transmitted to the outside through the first filter 503a, the converging lens 502a, and the optical fiber adapter 501a.
  • the external optical signal passes through the optical fiber adapter 501a, the condensing lens 502a, the first filter 503a, and then is transmitted to the light receiving chip 704a.
  • FIG. 13 is a first structural diagram of a circuit board according to some embodiments of the present disclosure
  • FIG. 14 is a second structural diagram of a circuit board according to some embodiments of the present disclosure.
  • the sides of the circuit board 300 are inwardly recessed at two poles.
  • one end of the side of the circuit board 300 is recessed inward to form a first notch 301, and the other end is recessed inward to form a third notch 303.
  • the first notch 301 and the third notch 303 continue to be recessed inward to form a second notch 302. .
  • the end of the first notch 301 forms a groove 304 .
  • a connecting area 306 is provided at the connection between the first notch 301 and the second notch 302, and a connecting area 307 is provided at the connection between the second notch 302 and the third notch 303.
  • the sides after the sides of the circuit board 300 are recessed inward, the sides include a first connection side 3051, a second connection side 3052, a third connection side 3053, a fourth connection side 3054, and a fifth connection side connected in sequence. 3055, the sixth connecting edge 3056, and the seventh connecting edge 3057.
  • the first connecting edge 3051 and the second connecting edge 3052 form the connecting area 307
  • the fourth connecting edge 3054 and the fifth connecting edge 3055 form the connecting area 306
  • the fifth connecting edge 3055 and the sixth connecting edge 3056 form the first gap 301
  • a groove 304 is provided at the junction of the two connecting edges;
  • the second connecting edge 3052, the third connecting edge 3053, and the fourth connecting edge 3054 form a second notch 302;
  • the circuit board 300 passes through the first notch 301, the second notch 302, and the third notch 305.
  • the notch 303, the connection area 306, and the connection area 307 realize electrical connection with the transceiver cavity 400a.
  • the second connecting edge 3052, the third connecting edge 3053, and the fourth connecting edge 3054 form the second notch 302.
  • the second notch 302 is used to set the end of the light receiving component 700a; since the end of the light receiving component 700a is provided with pins , so a certain space is needed to set the pins. For example, the pins are set through the second notch 302 .
  • FIG. 15 is an exploded schematic diagram of the assembly of a circuit board and a transceiver cavity according to some embodiments of the present disclosure
  • FIG. 16 is a schematic assembly diagram of a circuit board and a transceiver cavity according to some embodiments of the present disclosure.
  • the first protrusion 405 and the second protrusion 406 are respectively connected to the connecting area 307 and the connecting area 306 of the circuit board.
  • the connecting area 307 is embedded into the area below the bottom surface of the first protrusion 405, and the connecting area 306 is embedded into the area below the bottom surface of the second protrusion 406, then the bottom surface of the first protrusion 405 and the connecting area
  • the top surface of 307 is connected, the first protrusion 405 is provided on the surface of the connection area 307, and then the first protrusion 405 is provided on the surface of the circuit board 300; the bottom surface of the second protrusion 406 is connected with the top surface of the connection area 306,
  • the second protrusion 406 is disposed on the surface of the connecting area 306 , and the second protrusion 406 is disposed on the surface of the circuit board 300 .
  • the curves of the first protrusion 405 and the second protrusion 406 are chamfered to increase the contact surface with the circuit board to achieve a firm connection with the circuit board 300 .
  • connection area 307 of the circuit board is connected to the bottom surface of the first protrusion 405 of the transceiver cavity 400a.
  • the connection area 307 is embedded in the bottom end of the first protrusion 405.
  • the first protrusion 405 is provided on the surface of the connection area 307; circuit
  • the connection area 306 of the board is connected to the bottom surface of the second protrusion 406 of the transceiver cavity 400a.
  • the connection area 306 is embedded in the bottom of the second protrusion 406, and the second protrusion 406 is provided on the surface of the connection area 306.
  • Figure 17 is a first assembly sectional view of a circuit board and a transceiver cavity according to some embodiments of the present disclosure
  • Figure 18 is a second assembly sectional view of a circuit board and a transceiver cavity provided according to some embodiments of the present disclosure.
  • the connection area 307 of the circuit board 300 is connected to the bottom end of the first protrusion 405 of the transceiver cavity 400a
  • the connection area 306 is connected to the bottom end of the second protrusion 406 of the transceiver cavity 400a.
  • a notch 301 extends into the first opening 403 to realize the connection between the circuit board 300 and the transceiver cavity 400a.
  • Figure 19 is a cross-sectional view of the assembly of a circuit board and a transceiver cavity according to some embodiments of the present disclosure.
  • the first notch 301 of the circuit board extends into the first opening 403 of the transceiver cavity 400a, and the first notch 301 is protrudingly disposed relative to the first opening 403; in the first notch 301 After extending into the first opening 403, it is blocked by the side wall 4031 of the first opening 403 during the process of connecting to the second protrusion 406. Therefore, the circuit board 300 is also provided with a groove 304 through which the groove 304 can be connected. By avoiding the side wall 4031, the connecting area 306 of the circuit board 300 is connected to the second protrusion 406 of the transceiver cavity 400a.
  • the groove 304 of the circuit board is connected to the side wall 4031, so that the circuit board avoids the side wall 4031. After the first notch 301 extends into the first opening 403, the groove 304 can avoid the side wall 4031, and then the connection area 306 and The second protrusion 406 is connected.
  • one end of the light receiving component 700a extends into the transceiver cavity 400a, and the other end is provided in the second notch 302, and each protruding pin of the light receiving component 700a is provided through the second notch 302.
  • Figure 20 is a schematic assembly diagram of a flexible circuit board and a transceiver cavity according to some embodiments of the present disclosure. As shown in Figure 20, in some embodiments, the connection between the light receiving component 700a and the circuit board 300 is achieved through the flexible circuit board 900a.
  • the light receiving component 700a includes various pins 705a, such as signal pins, ground pins, etc.
  • the flexible circuit board 900a includes a first connection end 910 and a second connection end 920.
  • the first connection end 910 is electrically connected to the light receiving component 700a
  • the second connection end 920 is electrically connected to the circuit board 300, thereby realizing the electrical connection between the light receiving component 700a and the circuit board 300.
  • a pin through hole 9101 is provided on the surface of the first connection end 910 to allow pins to pass through.
  • a metal layer is provided on the inner wall surface of the pin through hole 9101 to achieve electrical connection between the first connection end 910 and the light receiving component 700a.
  • a soldering pad 9201 is provided on the surface of the second connection end 920 to achieve electrical connection between the second connection end 920 and the circuit board 300 .
  • the first connection end 910 and the second connection end 920 are respectively provided with corresponding soldering pads
  • the inner surface of the pin through hole 9101 is provided with a metal layer
  • the outer surface is provided with a soldering pad
  • the tube on the surface of the tube base 703 The pin passes through the pin through hole 9101, and then passes through the solder pad to connect the pin and the flexible circuit board 900a.
  • the electrical signal from the light receiving chip 704a is transmitted to the first connection end 910 of the flexible circuit board 900a through the pin.
  • the electrical signal is transmitted from the first connection end 910 of the flexible circuit board 900a to the second connection end 920 of the flexible circuit board 900a; the second connection end 920 is provided with a pad 9201 on the surface, and the corresponding surface of the circuit board 300 If a soldering pad is also provided at the position, the second connection end 920 and the circuit board 300 are electrically connected through the soldering pad, and the electrical signal is then transmitted to the surface of the circuit board 300 .
  • the optical axis of the optical fiber adapter 501a and the laser chip 604a is at the same height. Since the size of the tube base of the light receiving component 700a is large and limited by the height of the side wall of the transceiver cavity 400a, the installation height of the light receiving component 700a is relatively high. , furthermore, the height of the light receiving chip 704a is higher than the height of the laser chip 604a. However, the optical axis of the optical fiber adapter 501a, the condensing lens 502a, and the first filter 503a is at the same height as the optical axis of the laser chip 604a.
  • the height of the light receiving chip 704a is relative to the optical fiber adapter 501a, the converging lens 502a, and the first filter 503a. If it is higher, all the received optical signals transmitted through the optical fiber adapter 501a cannot be injected into the light receiving chip 704a, thereby reducing the optical coupling rate of the received optical signals.
  • Figure 21 is an assembly diagram of a first filter and a filter support frame provided according to some embodiments of the present disclosure
  • Figure 22 is an assembly exploded view of a first filter and a filter support frame provided according to some embodiments of the present disclosure.
  • the first filter plate 503a is inclined relative to the bottom end of the transceiver cavity 400a, and the first filter plate 503a is inclined in the direction of the filter support frame 504a, then The inclined surface of the first filter 503a faces the lens on the surface of the tube cap 702, so that the inclined surface of the first filter 503a faces the light receiving chip 704a.
  • the first filter 503a is arranged obliquely relative to the bottom end of the transceiver cavity 400a, so that the emitted light from the first filter 503a is emitted obliquely relative to the bottom end of the transceiver cavity 400a, so as to be directed to the light receiving chip; by The filter 503a is arranged at an angle to change the transmission direction of the optical signal emitted by the first filter 503a, adjust the optical path of the optical signal, and thereby increase the optical coupling rate of the light receiving chip.
  • the light exit surface of the laser chip 604a faces the first surface of the first filter 503a
  • the light entrance surface of the light receiving chip 704a faces the second surface of the first filter 503a.
  • the first filter 503a is tilted toward the filter support frame 504a.
  • the filter support frame 504a is provided at one end close to the second side wall of the transceiver cavity 400a, and then the first filter plate 503a is inclined in a direction close to the filter support frame 504a.
  • the plane where the incident light and the outgoing light of the first filter 503a are located forms a preset angle with the bottom end of the transceiver cavity 400a, and is inclined from the first filter 503a toward the light receiving chip 704a.
  • the tilt direction of the first filter 503a when the height of the light receiving chip 704a is smaller than the height of the laser chip 604a is opposite to the tilt direction when the height of the light receiving chip 704a is larger than the height of the laser chip 604a.
  • the first filter 503a is inclined relative to the bottom end of the transceiver cavity 400a, and the first filter 503a is tilted toward the direction of the filter support frame 504a.
  • the inclined surface of the first filter 503a is in contact with the transceiver.
  • the vertical surface of the bottom end of the cavity 400a forms a certain angle.
  • the first filter 503a is arranged non-vertically relative to the bottom end of the transceiver cavity 400a.
  • the filter support frame 504a is provided between the first filter plate 503a and the second side wall of the transceiver cavity 400a, and the first filter plate 503a is inclined toward the direction of the filter support frame 504a.
  • the inclined surface of the first filter 503a faces the light receiving chip 704a. Since the height of the light receiving chip 704a is higher relative to the first filter 503a, the optical signal emitted from the first filter 503a to the light receiving chip 704a is directed towards the light receiving chip 704a.
  • the height of the receiving chip 704a is tilted, that is, the optical signal reflected from the first filter 503a will rise to the light receiving chip 704a, thereby compensating for the height difference on the optical path from the first filter 503a to the light receiving chip 704a, changing the emitted light
  • the emission height of the signal causes the received optical signal to be injected into the light receiving chip 704a to a greater extent, thereby increasing the optical coupling rate of the received optical signal.
  • the direction of the incident light signal does not change, but the direction of the first filter 503a
  • the normal line will rise toward the light receiving chip 704a, and the incident light signal
  • the plane with the normal line rises toward the light receiving chip 704a. Since the incident light signal, the normal line, and the outgoing light signal are on the same plane, the outgoing light signal emitted from the first filter 503a also moves toward the light receiving chip 704a.
  • the outgoing optical signal will be incident into the light receiving chip 704a to a greater extent, thereby increasing the optical coupling rate of the received optical signal.
  • the angle between the incident light signal incident on the 45° filter and the normal is 45°
  • the angle between the outgoing light signal emitted from the 45° filter and the normal is 45°
  • the "normal" refers to the normal line of the 45° filter; when the 45° filter is tilted relative to the bottom end of the transceiver cavity 400a, and the 45° filter faces the direction of the filter support frame 504a
  • the direction of the incident light signal remains unchanged, but the normal line of the 45° filter will rise toward the light receiving chip 704a, and the plane where the incident light signal and the normal line are located will rise toward the light receiving chip 704a.
  • the outgoing light signal emitted from the 45° filter will also rise toward the light receiving chip 704a, and the outgoing light signal will enter the light receiving chip 704a to a greater extent. to increase the optical coupling rate of received optical signals.
  • the inclined surface of the first filter 503a forms a certain angle with the vertical surface at the bottom of the transceiver cavity 400a. This angle range can ensure that the first filter 503a will not have a large impact on the optical power of the transmitter. , while ensuring the optical coupling efficiency at the receiving end.
  • the angle between the inclined surface of the first filter 503a and the vertical surface at the bottom of the transceiver cavity 400a ranges from 6° to 13°, with 8° being the best.
  • Figure 23 is a schematic diagram of the relationship between a first filter arrangement and an optical path according to some embodiments of the present disclosure.
  • the plane A where the incident light signal and the outgoing optical signal of the first filter 503a are located is a horizontal plane.
  • the transceiver cavity 400a is the same as the transceiver cavity 400a.
  • the bottom end of 400a is in a parallel relationship.
  • Figure 24 is a schematic diagram of the relationship between another arrangement form and optical path of a first filter according to some embodiments of the present disclosure.
  • the plane B where the incident light signal and the outgoing light signal of the first filter 503a are located It is an inclined surface.
  • the plane B is inclined toward the light receiving chip 704a, thereby raising the optical path from the first filter 503a to the light receiving chip 704a and increasing the light coupling rate of the light receiving chip 704a.
  • the light receiving component 700a is also tilted.
  • the end of the tube cap 702 in the light receiving component 700a is inclined close to the bottom end of the transceiver cavity 400a, and the height of the central axis of the end of the pin 705a is higher than the height of the central axis of the end of the tube cap 702, that is, the height of the pin One end is tilted upward, and the cap end is tilted downward.
  • the center of gravity of the light receiving chip 704a is closer to the bottom of the transceiver cavity 400a, and the height difference between the light receiving chip 704a and the laser chip 604a is reduced to increase the optical coupling rate of the received optical signal.
  • the light receiving component 700a When the light receiving component 700a is tilted, a certain angle is formed between the central axis of the light receiving component 700a and the bottom plane of the transceiver cavity 400a.
  • the angle range is 13° to 18°, with 16° being the best, to ensure The height difference between the light receiving chip 704a and the laser chip 604a is reduced to increase the optical coupling rate of the received optical signal.
  • the first filter plate 503a is connected to the filter plate support frame 504a to support the first filter plate 503a through the filter plate support frame 504a to increase the stability of the first filter plate 503a.
  • the overall structure of the filter support frame 504a is set perpendicular to the bottom end of the transceiver cavity 400a.
  • the tilt direction and angle of the inclined surface 5041 are consistent with the first filter 503a.
  • the tilt of the first filter 503a is achieved through the tilt of the inclined surface 5041. And the two are in close contact and connection.
  • the filter support frame 504a is a special-shaped support frame. There is a gap between the first filter 503a and the filter support frame 504a, so that the optical signal generated by the transmitting end laser chip 604a can pass through and reach the surface of the first filter 503a.
  • FIG 25 is a structural diagram of a filter support frame provided according to some embodiments of the present disclosure.
  • the filter support frame 504a includes an inclined surface 5041, a top surface 5042, a side surface 5043 and an arc surface 5044.
  • the top surface 5042 connects the inclined surface 5041 and the side surface 5043.
  • the first filter 503a is connected to the inclined surface 5041.
  • the first filter 503a and the inclined surface 5041 may be bonded together through UV glue.
  • the filter support frame 504a is recessed upward from the lower end to form a curved surface 5044.
  • the outline of the structure of the curved surface 5044 includes curved edges.
  • the arc surface 5044 includes a first curved edge 50441 and a second curved edge 50442. The first curved edge 50441 is connected to the side surface 5043, and the second curved edge 50442 is connected to the inclined surface 5041.
  • the inclined surface 5041 is connected to the second curved edge 50442.
  • the first filter 503a is in contact with the inclined surface 5041.
  • the bottom end of the inclined surface 5041 is the second curved edge 50442. Since the bottom end of the inclined surface 5041 is a curved edge, it curls inward. , it can better support the first filter 503a.
  • One end of the arc surface 5044 faces the laser chip 604a to avoid the optical signal generated by the laser chip 604a, so that the optical signal generated by the laser chip 604a passes through the arc surface 5044, enters the first filter 503a, and then passes through the first filter plate 504a.
  • the sheet 503a is transmitted through.
  • the first filter plate 503a can be tilted, and then the first filter plate 503a can be tilted toward the light receiving chip 704a, so as to raise the height of the first filter plate 503a.
  • the optical path from the first filter 503a to the light receiving chip 704a increases the receiving light coupling rate of the light receiving chip 704a; at the same time, it can avoid the optical signal generated by the laser chip 604a, so that the optical signal generated by the laser chip 604a passes through the arc surface 5044 , is injected into the first filter 503a, then transmitted out from the first filter 503a, and then transmitted into the optical fiber through the condensing lens 502a and the optical fiber adapter 501a.
  • Figure 26 is an optical path diagram 1 of an optical module provided according to some embodiments of the present disclosure.
  • the path of the emitted light signal the laser chip 604a emits the emitted light signal - the collimating lens 605a collimates the emitted light signal - the isolator 800a - the arc surface 5044 - the first filter 503a transmits the light signal - the condensing lens 502a Converging the transmitted optical signals in the fiber optic adapter 501a.
  • the optical fiber adapter 501a receives the received optical signal from the outside - the converging lens 502a - the first filter 503a reflects the received optical signal - the first filter 503a is tilted to increase the emission height of the optical signal - the second filter Chip 701a - light receiving chip 704a.
  • the first filter 503a is tilted to change the transmission direction and transmission height of the optical signal emitted by the first filter 503a, adjust the optical path of the optical signal, and thereby increase the efficiency of the light receiving chip.
  • An embodiment of the present disclosure also provides an optical module.
  • a displacement prism is provided between the first filter 503b and the second filter 701b, so that the optical signal is transmitted from the first filter 503b at a relatively lower position to the opposite position.
  • the higher light receiving chip 704b further increases the transmission height of the optical signal, so that the received optical signal is coupled to the surface of the light receiving chip 704b to a greater extent, thereby increasing the coupling efficiency of the received optical signal.
  • Figure 27 is a structural diagram of another transceiver cavity provided according to some embodiments of the present disclosure.
  • the optical module includes a transceiver cavity 400b, and the transceiver cavity 400b is connected to the cover plate 408b.
  • the side wall of the transceiver cavity 400b is provided with a light receiving component 700b; one end of the transceiver cavity 400b is provided with a transceiver device 500b, and the other end of the transceiver cavity 400b is provided with a light emitting component 600b.
  • connection relationship between the transceiver cavity 400b and the circuit board 300 is the same as the connection relationship between the transceiver cavity 400a and the circuit board 300, which will not be elaborated further.
  • connection relationship between the transceiver cavity 400b and the transceiver device 500b is the same as the connection relationship between the transceiver cavity 400a and the transceiver device 500a, which will not be elaborated further.
  • connection relationship between the transceiver cavity 400b and the light emitting component 600b is the same as the connection relationship between the transceiver cavity 400a and the light emitting component 600a, which will not be elaborated further.
  • connection relationship between the transceiver cavity 400b and the light receiving component 700b is the same as the connection relationship between the transceiver cavity 400a and the light receiving component 700a, which will not be elaborated further.
  • the structures of the interior and side walls of the transceiver cavity 400b which are used to respectively dispose the transceiver device 500b, the light emitting component 600b, and the light receiving component 700b, are the same as those of the transceiver cavity 400a.
  • the structures of the interior and side walls of the transceiver cavity 400b are the same as those of the transceiver cavity 400b.
  • the structure of the interior and side walls of 400a is the same. From the appearance and interior It can be seen that the transceiver cavity 400b and the transceiver cavity 400a are exactly the same transceiver cavity.
  • Figure 28 is an exploded view of another transceiver cavity provided according to some embodiments of the present disclosure
  • Figure 29 is an exploded view of the internal structure of another transceiver cavity provided according to some embodiments of the present disclosure.
  • the transceiver device 500b includes an optical fiber adapter 501b, a condensing lens 502b, a first filter 503b, and a support base 506.
  • the first filter 503b can be a 45° filter.
  • the first filter 503b can reflect the received light signal from the outside, and at the same time, can also transmit the emitted light signal generated by the laser chip.
  • the first filter plate 503b is arranged vertically relative to the bottom end of the transceiver cavity 400b, and the first filter plate 503b is arranged perpendicularly to the bottom end of the transceiver cavity 400b.
  • the first filter plate 503b is disposed on the surface of the support seat 506 so as to limit and fix the first filter plate 503b through the support seat 506. Disposing the first filter 503b through the support base 506 has higher reliability than directly pasting the first filter 503b on the surface of the circuit board 300.
  • the first filter 503b and the support base 506 may be connected through UV glue.
  • a displacement prism 507 is provided between the first filter 503b and the second filter 701b, and the optical path height of the reflected light signal of the first filter 503b is adjusted through the displacement prism 507, that is, through the displacement prism 507, The transmission direction and transmission height of the received light signal are changed so that the received light signal is emitted into the light receiving chip. For example, the optical path height of the reflected optical signal of the first filter 503b is increased by displacing the prism 507.
  • the displacement prism 507 transfers the optical signal at a relatively lower height to a higher height through two reflections, thereby transmitting the optical signal from the optical fiber adapter 501b at a relatively lower position to a relatively higher position.
  • the height of the light receiving chip 704b is about 0.5mm higher than the height of the laser chip 604b.
  • the vertical height of the displacement prism 507 can be 0.58mm, and there is no specific requirement for the thickness of the displacement prism 507.
  • one end of the displacement prism 507 is disposed on the surface of the support base 506, and the other end is connected to the second filter 701b; the provision of the support base 506 can further increase the height of the displacement prism 507 and further increase the optical path height of the optical signal, so as to Increase the coupling rate of received optical signals.
  • the structure of the light emitting component 600b is the same as that of the light emitting component 600a, including a laser chip 604b, a collimating lens 605b, etc.; after the optical signal generated by the laser chip 604b is collimated by the collimating lens 605b, it emits It enters the first filter 503b, passes through the transmission of the first filter 503b, and then enters the condensing lens 502b and the optical fiber adapter 501b in sequence.
  • the emitted optical signal generated by the laser chip 604b When the emitted optical signal generated by the laser chip 604b is transmitted to the outside through the optical fiber adapter 501b, part of the emitted optical signal may enter the transceiver cavity 400b along with the received optical signal.
  • the signal returns to the laser chip, and an isolator 800b is provided between the first filter 503b and the laser chip; the arrangement of the isolator 800b can prevent the emitted light signal from returning to the laser chip.
  • the light receiving component 700b includes a tube cap, the outer surface of the tube cap is provided with a second filter plate 701b, and the second filter plate 701b is adhered to the outer surface of the tube cap.
  • the second filter 701b is a 0° filter.
  • the 0° filter refers to a filter with an angle of 0° between the incident light and the normal line of the filter, that is, the incident light is vertically incident on the 0° filter.
  • the second filter 701b can filter out other wavelengths of light except the received optical signal; after being filtered by the 0° filter, it enters the light receiving chip 704b to improve the quality of the optical signal.
  • Figure 30 is a structural diagram of another light receiving component provided according to some embodiments of the present disclosure.
  • a light receiving chip 704b is provided inside the light receiving component 700b.
  • the position of the light receiving chip 704b is higher relative to the position of the laser chip 604b. It passes between the first filter 503b and the second filter 701b.
  • the displacement prism 507 is set up to transmit the optical signal from the first filter 503b at a relatively lower position to the light receiving chip 704b at a relatively higher position, so that the received optical signal is coupled to the light receiving chip 704b to a greater extent. surface to increase the coupling efficiency of received optical signals.
  • Figure 31 is a diagram 1 of a displacement prism arrangement structure provided according to some embodiments of the present disclosure.
  • the first filter 503b is disposed on the surface of the support base 506, one end of the displacement prism 507 is disposed on the surface of the support base 506, and the other end is connected to the second filter 701b.
  • one end of the displacement prism 507 is bonded to the surface of the support base 506 through UV glue, and the other end is also bonded to the surface of the second filter 701b through UV glue.
  • the displacement prism 507 is disposed on the surface of the support base 506, which can increase the height of the displacement prism 507, thereby increasing the transmission height of the optical path for receiving optical signals.
  • the displacement prism 507 is tilted upward from the direction of the support base 506 to the direction of the second filter 701b. It includes a light entrance surface and a light exit surface, and the height of the light exit surface is greater than the height of the light entrance surface.
  • the light entrance surface faces the first filter 503b to receive the optical signal reflected by the first filter 503b; the light exit surface is connected to the second filter 701b to transmit the received optical signal to the opposite side after raising the optical path.
  • the surface of the light receiving chip 704b is positioned higher to increase the transmission height of the optical signal.
  • Figure 32 is a diagram 2 of a displacement prism arrangement structure provided according to some embodiments of the present disclosure. As shown in FIG. 32 , both ends of the first filter 503 b protrude relative to the surface of the support base 506 respectively, and are arranged opposite to the light entrance surface of the displacement prism 507 .
  • Figure 33 is Figure 3 of a displacement prism arrangement structure provided according to some embodiments of the present disclosure.
  • the displacement prism 507 is staggered with the first filter 503b.
  • One end of the displacement prism 507 is close to the center of the support base 506, and the other end protrudes relative to the surface of the support base 506 to receive the first filter to a greater extent.
  • Figure 34 is a schematic diagram of a displacement prism changing an optical path according to some embodiments of the present disclosure. As shown in Figure 34, , is a schematic diagram of the optical path between the first filter 503b and the displacement prism 507; the optical signal reflected from the first filter 503b vertically enters the light entrance surface of the displacement prism 507, and then after the first reflection It reaches the top surface of the displacement prism 507, and after the second reflection, is vertically emitted from the light exit surface of the displacement prism 507, and reaches the surface of the second filter 701b.
  • the displacement prism 507 can transmit the optical signal from a relatively lower position to a relatively higher position to increase the transmission height of the optical signal, so that the received optical signal can be coupled to the surface of the light receiving chip 704b to a greater extent, thereby increasing the reception Coupling efficiency of optical signals.
  • Figure 35 is an optical path diagram 2 of an optical module provided according to some embodiments of the present disclosure.
  • the path of the emitted optical signal the laser chip 604b emits the emitted optical signal - the collimating lens 605b collimates the emitted optical signal - the isolator 800b - the first filter 503b transmits the emitted optical signal - the condensing lens 502b collects the emitted optical signal - Fiber optic adapter 501b.
  • the optical fiber adapter 501b receives the received optical signal from the outside - the converging lens 502b - the first filter 503b reflects the received optical signal - passes through the displacement prism 507 to increase the emission height of the optical signal - the second filter 701b - Light receiving chip 704b.
  • a displacement prism 507 is disposed between the first filter 503b and the second filter 701b, so that the optical signal is transmitted from the first filter 503b at a relatively lower position to a relatively higher position.
  • the transmission height of the optical signal is increased, so that the received optical signal is coupled to the surface of the light receiving chip 704b to a greater extent, thereby increasing the coupling efficiency of the received optical signal.

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Abstract

一种光模块（200），包括电路板（300）、收发腔体（400a）。光发射部件（600a）设于收发腔体（400a）内部，包括光发射芯片。光接收部件（700a）设于收发腔体（400a）的侧壁上，表面设有第二滤波片（701a），包括光接收芯片（704a），光接收芯片（704a）设置高度与光发射芯片设置高度不同。收发器件（500a）设于收发腔体内部（400a），包括第一滤波片（503a）。第一滤波片（503a）相对于收发腔体（400a）底表面倾斜设置，以使第一滤波片（503a）的出射光倾斜射向光接收芯片（704a）；和/或，第一滤波片（503a）相对于收发腔体（400a）底表面垂直设置，第一滤波片（503a）和第二滤波片（701a）之间设有位移棱镜（507），位移棱镜（507）可改变进入至光接收芯片704a）的光信号的传输方向和传输高度。通过将第一滤波片（503a）倾斜设置，和/或，在第一滤波片（503a）和第二滤波片（701a）之间设置位移棱镜（507），从而提高光耦合功率。

Description

光模块
本申请要求在2022年6月14日提交中国专利局、申请号为202210673876.7的优先权；在2022年6月14日提交中国专利局、申请号为202221497568.5的优先权其全部内容通过引用结合在本申请中。
技术领域
本公开涉及光纤通信技术领域，尤其涉及一种光模块。
背景技术
随着云计算、移动互联网、视频等新型业务和应用模式的发展，光通信技术的进步变的愈加重要。在光通信技术中，光模块作为光通信设备中的关键器件之一，可以实现光电信号转换。随着光通信技术的发展，要求光模块的数据传输速率不断提高。
发明内容
根据本公开一些实施例提供的光模块，包括：电路板和收发腔体。光发射部件设于收发腔体的内部，包括光发射芯片，光发射芯片出光方向平行于收发腔体底表面。光接收部件设于收发腔体的侧壁上，光接收部件表面设有第二滤波片，光接收部件包括光接收芯片，光接收芯片所在高度与所述光发射芯片所在高度。收发器件设于收发腔体内部，包括光纤适配器、第一透镜、第一滤波片，其中，第一滤波片的第一表面朝向光发射芯片的出光面，第一滤波片的第二表面朝向光接收芯片的进光面，第一滤波片被配置为反射来自光纤适配器的接收光信号，及透射光发射芯片产生的发射光信号。第一滤波片相对于收发腔体底表面倾斜设置，以使第一滤波片的入射光与出射光所在的平面与收发腔体底表面呈预设夹角，进而使第一滤波片的出射光倾斜射向光接收芯片。和/或，第一滤波片垂直于收发腔体底表面设置，第一滤波片和第二滤波片之间设有位移棱镜，位移棱镜被配置为改变进入至光接收芯片的接收光信号的传输方向和传输高度，以使接收光信号射入光接收芯片中；位移棱镜的出光面高度大于位移棱镜的进光面高度，位移棱镜的进光面朝向第一滤波片的第二表面，位移棱镜的出光面与第二滤波片连接。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非是对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据本公开一些实施例提供的一种光通信系统的部分结构图；
图2为根据本公开一些实施例提供的一种上位机的局部结构图；
图3为根据本公开一些实施例提供的一种光模块的结构图；
图4为根据本公开一些实施例提供的一种光模块的分解图；
图5为根据本公开一些实施例提供的一种光模块的内部结构图；
图6为根据本公开一些实施例提供的一种收发腔体的内部结构图；
图7为根据本公开一些实施例提供的一种收发腔体的分解结构图；
图8为根据本公开一些实施例提供的一种收发腔体结构图一；
图9为根据本公开一些实施例提供的一种收发腔体结构图二；
图10为根据本公开一些实施例提供的一种光发射部件的分解图；
图11为根据本公开一些实施例提供的一种光接收部件的结构图；
图12为根据本公开一些实施例提供的一种光接收组件的分解图；
图13为根据本公开一些实施例提供的一种电路板的结构图一；
图14为根据本公开一些实施例提供的一种电路板的结构图二；
图15为根据本公开一些实施例提供的一种电路板与收发腔体的装配分解示意图；
图16为根据本公开一些实施例提供的一种电路板与收发腔体的装配示意图；
图17为根据本公开一些实施例提供的一种电路板与收发腔体的装配剖面图一；
图18为根据本公开一些实施例提供的一种电路板与收发腔体的装配剖面图二；
图19为根据本公开一些实施例提供的一种电路板与收发腔体的装配剖面图三；
图20为根据本公开一些实施例提供的一种柔性电路板与收发腔体的装配示意图；
图21为根据本公开一些实施例提供的一种第一滤波片与滤波片支撑架装配图；
图22为根据本公开一些实施例提供的一种第一滤波片与滤波片支撑架装配分解图；
图23为根据本公开一些实施例提供的一种第一滤波片设置形态与光路关系示意图；
图24为根据本公开一些实施例提供的一种第一滤波片另一设置形态与光路关系示意图；
图25为根据本公开一些实施例提供的一种滤波片支撑架的结构图；
图26为根据本公开一些实施例提供的一种光模块的光路图一；
图27为根据本公开一些实施例提供的另一种收发腔体的结构图；
图28为根据本公开一些实施例提供的另一种收发腔体的分解图；
图29为根据本公开一些实施例提供的另一种收发腔体内部结构分解图；
图30为根据本公开一些实施例提供的另一种光接收部件的结构图；
图31为根据本公开一些实施例提供的一种位移棱镜设置结构图一；
图32为根据本公开一些实施例提供的一种位移棱镜设置结构图二；
图33为根据本公开一些实施例提供的一种位移棱镜设置结构图三；
图34为根据本公开一些实施例提供的一种位移棱镜改变光路示意图；
图35为根据本公开一些实施例提供的一种光模块的光路图二。
具体实施方式
在光通信技术中，为了在信息处理设备之间建立信息传递，需要将信息加载到光上，利用光的传播实现信息的传递。这里，加载有信息的光就是光信号。光信号在信息传输设备中传输时可以减少光功率的损耗，因此可以实现高速度、远距离、低成本的信息传递。信息处理设备能够识别和处理的信号是电信号。信息处理设备通常包括光网络终端(Optical Network Unit，ONU)、网关、路由器、交换机、手机、计算机、服务器、平板电脑、电视机等，信息传输设备通常包括光纤及光波导等。
光模块可以实现信息处理设备与信息传输设备之间的光信号与电信号的相互转换。例如，光模块的光信号输入端或光信号输出端中的至少一个连接有光纤，光模块的电信号输入端或电信号输出端中的至少一个连接有光网络终端；来自光纤的第一光信号传输至光模块，光模块将该第一光信号转换为第一电信号，并将该第一电信号传输至光网络终端；来自光网络终端的第二电信号传输至光模块，光模块将该第二电信号转换为第二光信号，并将该第二光信号传输至光纤。由于多个信息处理设备之间可以通过电信号进行信息传输，因此，需要多个信息处理设备中的至少一个信息处理设备直接与光模块连接，而无需所有的信息处理设备直接与光模块连接。这里，直接连接光模块的信息处理设备被称为光模块的上位机。另外，光模块的光信号输入端或光信号输出端可被称为光口，光模块的电信号输入端或电信号输出端可被称为电口。
图1为根据本公开一些实施例提供的一种光通信系统的部分结构图。如图1所示，光通信系统主要包括远端信息处理设备1000、本地信息处理设备2000、上位机100、光模块200、光纤101以及网线103。
光纤101的一端向远端信息处理设备1000的方向延伸，且光纤101的另一端通过光模块200的光口与光模块200连接。光信号可以在光纤101中全反射，且光信号在全反射方向上的传播几乎可以维持原有光功率，光信号在光纤101中发生多次的全反射，以将来自远端信息处理设备1000的光信号传输至光模块200中，或将来自光模块200的光信号传输至远端信息处理设备1000，从而实现远距离、低功率损耗的信息传递。
光通信系统可以包括一根或多根光纤101，且光纤101与光模块200可拆卸连接，或固定连接。上位机100被配置为向光模块200提供数据信号，或从光模块200接收数据信号，或对光模块200的工作状态进行监测或控制。
上位机100包括大致呈长方体的壳体，以及设置在该壳体上的光模块接口102。光模块接口102被配置为接入光模块200，以使上位机100与光模块200建立单向或双向的电信号连接。
上位机100还包括对外电接口，该对外电接口可以接入电信号网络。例如，该对外电接口包括通用串行总线接口(Universal Serial Bus，USB)或网线接口104，网线接口104被配置为接入网线103，以使上位机100与网线103建立单向或双向的电信号连接。网线103的一端连接本地信息处理设备2000，且网线103的另一端连接上位机100，以通过网线103在本地信息处理设备2000与上位机100之间建立电信号连接。例如，本地信息处理设备2000发出的第三电信号通过网线103传入上位机100，上位机100根据该第三电信号生成第二电信号，来自上位机100的该第二电信号传输至光模块200，光模块200将该第二电信号转换为第二光信号，并将该第二光信号传输至光纤101，该第二光信号在光纤101中传输至远端信息处理设备1000。例如，来自远端信息处理设备1000的第一光信号通过光纤101传播，来自光纤101的第一光信号传输至光模块200，光模块200将该第一光信号转换为第一电信号，光模块200将该第一电信号传输至上位机100，上位机100根据该第一电信号生成第四电信号，并将该第四电信号传入本地信息处理设备2000。需要说明的是，光模块是实现光信号与电信号相互转换的工具，在上述光信号与电信号的转换过程中，信息并未发生变化，信息的编码和解码方式可以发生变化。
上位机100除了包括光网络终端之外，还包括光线路终端(Optical Line Terminal，OLT)、光网络设备(Optical Network Terminal，ONT)、或数据中心服务器等。
图2为根据本公开一些实施例提供的一种上位机的局部结构图。为了清楚地显示光模块200与上位机100的连接关系，图2仅示出了上位机100的与光模块200相关的结构。如图2所示，上位机100还包括设置于壳体内的PCB电路板105、设置在PCB电路板105的表面的笼子106、设置于笼子106上的散热器107、以及设置于笼子106内部的电连接器。该电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起结构。
光模块200插入上位机100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而使光模块200与上位机100建立双向的电信号连接。此外，光模块200的光口与光纤101连接，从而使得光模块200与光纤101建立双向的光信号连接。
图3为根据本公开一些实施例提供的一种光模块的结构图，图4为根据本公开一些实施例提供的一种光模块的分解图。如图3和图4所示，光模块200包括壳体、设置于壳体内的电路板300、收发腔体400a、光发射部件、光接收部件。
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口204和205的上述壳体；壳体的外轮廓一般呈现方形体。
在一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011，盖板2011盖合在下壳体202的两个下侧板2022上，以形成上述壳体。
在一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011，以及位于盖板2011两侧、与盖板2011垂直设置的两个上侧板，由两个上侧板与两个下侧板2022结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。例如，开口204位于光模块200的端部(图3的右端)，开口205也位于光模块200的端部(图3的左端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。开口204为电口，电路板300的金手指从开口204伸出，插入上位机100的电连接器中；开口205为光口，被配置为接入外部的光纤101，以使光纤101连接光模块200中的光发射部件、光接收部件。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、收发腔体400a、光发射部件、光接收部件等安装到上述壳体中，由上壳体201、下壳体202可以对上述器件进行封装保护。此外，在装配电路板300、 收发腔体400a、光发射部件、光接收部件等时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化地实施生产。
在一些实施例中，上壳体201及下壳体202采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外部的解锁部件203。解锁部件203被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
例如，解锁部件203位于下壳体202的两个下侧板2022的外侧，包括与上位机100的笼子106匹配的卡合部件。当光模块200插入笼子106中时，由解锁部件203的卡合部件将光模块200固定在笼子106中；拉动解锁部件203时，解锁部件203的卡合部件随之移动，从而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的固定，从而可以将光模块200从笼子106中抽出。
电路板300包括电路走线、电子元件及芯片等，通过电路走线将电子元件和芯片按照电路设计连接，以实现供电、电信号传输及接地等功能。电子元件例如可以包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如可以包括微控制单元(Microcontroller Unit，MCU)、激光驱动芯片、跨阻放大器(Transimpedance Ampl ifier，TIA)、限幅放大器(Limiting Amplifier，LIA)、时钟数据恢复芯片(Clock and Data Recovery，CDR)、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载上述电子元件和芯片；硬性电路板还可以插入上位机100的笼子106中的电连接器中。
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300插入笼子106中，由金手指与笼子106内的电连接器导通。金手指可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以提供更多数量的引脚，从而适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、二线制同步串行(Inter-Integrated Circuit，I2C)信号传递、数据信号传递等。当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。
图5为根据本公开一些实施例提供的一种光模块的内部结构图。如图5所示,电路板300表面设有激光驱动芯片300a，激光驱动芯片300a设于收发腔体400a的外部，激光驱动芯片300a用于为激光芯片提供驱动信号。
收发腔体400a与电路板300电连接，收发腔体400a的上表面盖设有盖板408a，收发腔体400a与盖板408a盖合连接，形成具有容纳腔的密封壳体。
在一些实施例中，收发腔体400a一侧与电路板300表面插入连接，一侧通过柔性电路板900a与电路板300连接。
图6为根据本公开一些实施例提供的一种收发腔体的内部结构图；图7为根据本公开一些实施例提供的一种收发腔体的分解结构图。如图6和图7所示，收发腔体400a内部分别设有收发器件500a、光发射部件600a和光接收部件700a。
收发器件500a、光发射部件600a和光接收部件700a紧凑设置于收发腔体400a内，充分及巧妙利用收发腔体400a内部的空间。
在一些实施例中，光发射部件600a和光接收部件700a的封装形式有很多，可以为微光学封装，也可以为TO封装。示例性地，当光模块用于50G OLT时，要求较高的光发射功率，微光学封装方式可输出较高的光发射功率，因此光发射部件600a可采用微光学封装方式。微光学封装方式指的是：光芯片发出的光进入空气中，在光学路径上设置透镜、光纤适配器等期间，将光芯片发出的光经透镜后耦合至光纤适配器中，光纤适配器与光纤连接。受限于腔体空间，从工艺制作难易程度及与腔体配合难易程度出发，本公开实施例中的光接收部件700a采用同轴封装。
在一些实施例中，收发器件500a设于收发腔体400a内部；光发射部件600a设于收发腔体400a内部；光接收部件700a设于收发腔体400a侧壁，示例性地，设于侧壁的通孔内。
收发腔体400a包括第一侧壁400a1、第二侧壁400a2、第三侧壁400a3和第四侧壁400a4，第一侧壁400a1和第二侧壁400a2相对设置，第三侧壁400a3和第四侧壁400a4相对设置；第一侧壁400a1和第二侧壁400a2位于收发腔体400a的长度方向上，第三侧壁400a3和第四侧壁400a4位于收发腔体400a的宽度方向上。光接收部件700a设于收发腔体400a第一侧壁400a1的通孔404内。光发射部件600a设于靠近收发腔体400a第三侧壁400a3的一端；收发器件500a设于靠近收发腔体400a第四侧壁400a4的一端。
收发器件500a用于光发射端和光接收端。在一些实施例中，收发器件500a包括光纤适配器501a、第一透镜、第一滤波片503a、滤波片支撑架504a。示例性地，第一透镜可以为汇聚透镜502a。第一滤波片503a可反射接收光信号、透射发射光信号。接收光信号指的是经光纤适配器501a进入至光接收部件700a内的外部光信号；发射光信号指的是光发射部件600a产生并传输至外部的光信号。第一滤波片503a与滤波片支撑架504a连接，滤波片支撑架504a用于支撑第一滤波片503a。示例性地，滤波片支撑架504a设于第一滤波片503a和第二侧壁之间。
收发腔体400a内部分别形成有第一台面401和第二台面402，第二台面402下沉而形成。第一台面401和第二台面402呈阶梯设置，第一台面401的高度高于第二台面402的高度。
第一台面401表面设置有光纤适配器501a、汇聚透镜502a、第一滤波片503a、滤波片支撑架504a、隔离器800a，第二台面402的表面设置有光发射部件600a。光发射部件600a包括TEC 601a、激光芯片604a等。其中，第一滤波片503a相对于收发腔体400a的底端呈倾斜设置，且第一滤波片503a向滤波片支撑架504a所在方向倾斜。
由于TEC 601a具有一定高度，且激光芯片604a设置于TEC 601a的表面，为了保证激光芯片604a与激光驱动芯片300a之间的打线长度较短，将激光芯片604a底面的金属化陶瓷基板的上表面与激光驱动芯片300a的上表面平齐，因此需将承载光发射部件600a的第二台面402作下沉设置，下沉形成的空间内设置TEC 601a，以使光发射部件600a的整体高度下沉，进而实现激光芯片604a底面的金属化陶瓷基板的上表面与激光驱动芯片300a的上表面平齐，保证激光芯片604a与激光驱动芯片300a之间的打线长度较短。
收发腔体400a的第三侧壁400a3形成有第一开口403，电路板300通过第一开口403伸入收发腔体内。示例性地，激光芯片604a与激光驱动芯片300a之间的打线穿过第一开口403，第一开口403供激光芯片604a与激光驱动芯片300a之间的打线穿过。
图8为根据本公开一些实施例提供的一种收发腔体结构图一。如图8所示，第一开口403包括侧壁4031。
收发腔体400a的第一侧壁400a1形成有通孔404，光接收部件700a设于通孔404内。
收发腔体400a的侧壁的两个端部分别形成第一凸起405和第二凸起406，第一凸起405和第二凸起406相对于收发腔体400a的侧壁突出设置。受限于收发腔体400a内部空间较小，且保证与电路板更稳定连接，所以收 发腔体400a的第一侧壁400a1的两端分别设有第一凸起405和第二凸起406。第一凸起405的中间设有螺纹孔，通过螺纹实现与电路板的稳定连接。
第一凸起405和第二凸起406分别位于收发腔体400a同一侧的两端，示例性地，二者均位于收发腔体400a的第一侧壁400a1一侧。由于第一滤波片503a向第二侧壁400a2一侧倾斜，为了保证收发腔体400a的平衡性和稳定性，因此，将第一凸起405和第二凸起406设于收发腔体400a的第一侧壁一侧，以保证平衡性和稳定性。
图9为根据本公开一些实施例提供的一种收发腔体结构图二。如图9所示，收发腔体400a的第四侧壁形成有第二开口407，光纤适配器501a设于第二开口407内。在一些实施例中，根据与电路板300表面打线长短可确定激光芯片604a的位置，光纤适配器501a的设置位置可根据激光芯片604a的位置进行确定，示例性地，光纤适配器501a与激光芯片604a的光轴处于同一直线上。由于第二台面402作下沉设置，为了实现光纤适配器501a与激光芯片604a的光轴处于同一直线上，第二开口407同样做下沉设置，由于TEC 601a高度大于光纤适配器501a一半的高度，则第二开口407下沉的高度小于第二台面402下沉的高度，以实现光纤适配器501a与激光芯片604a的光轴处于同一直线上。
光纤适配器501a伸入第二开口407中时，光纤适配器501a可在第二开口407内前后移动，以适应光纤长度。示例性地，当光纤长度较短时，光纤适配器501a沿第二开口407朝向收发腔体400a外部移动，以满足连接尺寸要求；当光纤长度较长时，光纤适配器501a沿第二开口407朝向收发腔体400a内部移动，以拉直光纤，避免光纤弯曲。
在一些实施例中，第二开口407相对于收发腔体400a的底面倾斜，示例性地，倾斜角度为3°，从而使得光纤适配器501a插入到第二开口407时，光纤适配器501a的光纤端面与发射光的入射角不垂直，使得发射光不容易反射回去，增加耦合效率。
图10为根据本公开一些实施例提供的一种光发射部件的分解图。如图10所示，光发射部件600a包括半导体制冷器TEC 601a、第一底座602a、第二底座603a、激光芯片604a、第二透镜。示例性地，第二透镜可以为准直透镜605a。在一些实施例中，光发射部件600a还包括热敏电阻606a。其中，激光芯片604a设置在金属化陶瓷基板的表面，金属化陶瓷基板表面形成电路图案，可以为激光芯片604a供电，同时金属化陶瓷基板具有较好的导热性能，可以作为激光芯片604a的热沉进行散热。
在一些实施例中，TEC 601a的表面分别设有第一底座602a和第二底座603a。第一底座602a的表面设有光发射芯片，光发射芯片的形式为激光芯片604a。第二底座603a的表面设有准直透镜605a，激光芯片604a发出的发散光经准直透镜605a汇聚为平行光。在一些实施例中，在靠近激光芯片604a的一侧还设有热敏电阻606a。
TEC 601a直接设置在收发腔体400a的表面，然后金属化陶瓷基板设置在TEC 601的表面，TEC 601用于平衡热量以维持激光芯片604a的设定工作温度，为此在靠近激光芯片604a的一侧还设有热敏电阻606a，热敏电阻606a采集激光芯片604a的工作温度，TEC 601a根据该工作温度对激光芯片604a进行温度调节，以使激光芯片604a维持在设定的工作温度范围内。
通过第一底座602a可增加激光芯片604a所在的高度，通过第二底座603a可增加准直透镜605a的高度，以使激光芯片604a和准直透镜605a的中心轴与光纤适配器501a的中心轴高度相同，进而可以增加激光芯片604a发射的光信号耦合效率。示例性地，第一底座602a和第二底座603a的高度可灵活设置。
在一些实施例中，光纤适配器501a、汇聚透镜502a、第一滤波片503a、激光芯片604a的光轴在同一直线上。
图11为根据本公开一些实施例提供的一种光接收部件的结构图；图12为根据本公开一些实施例提供的一种光接收部件的分解图。如图11和图12所示，在一些实施例中，光接收部件700a的表面设有第二滤波片701a。光接收部件700a包括管帽702a、管座703a。第二滤波片701a设于管帽702a的外表面；管座703a的内表面朝向收发腔体400a的内部。管帽702a、管座703a构成一定容纳空间，管座703a表面设有光接收芯片704a，光接收芯片704a可将接收的光信号转换为电信号。同时管座703a表面贯穿设有各管脚705a，如供电管脚、信号管脚、接地管脚等。其中，第二滤波片701a通过粘贴固定在管帽702的外表面，其可滤掉除接收光信号以外的其他波长光，使得接收光信号进入光接收芯片704a，光接收芯片704a将接收的光信号转换为电信号，同时其他光信号不允许进入光接收芯片704a。
在一些实施例中，激光芯片604a发出的光信号经过光纤适配器501a向外部传输；外部的光信号经光纤适配器501a向光接收芯片704a传输。将激光芯片604a发出的光信号称为第一光信号，将传输至光接收芯片704a的光信号称为第二光信号。当第一光信号经过光纤适配器501a向外部传输时，第一光信号中的部分光信号可能会随着第二光信号一起进入收发腔体400a内部，进而进入光接收芯片内部，因此在光接收部件700a的外表面设有第二滤波片701a，以将进入光接收部件700a的光信号中除第二光信号外的其他信号滤除掉，仅允许第二光信号进入光接收部件700a。示例性地，第二滤波片701a为0°滤波片，0°滤波片指的是入射光与滤波片法线之间夹角为0°的滤波片，即入射光垂直射入0°滤波片。
在一些实施例中，当第一光信号经过光纤适配器501a向外部传输时，第一光信号中的部分光信号可能会随着第二光信号一起进入收发腔体400a内部，为了避免第一光信号中的部分光信号返回至激光芯片604a中，影响激光芯片604a的发光质量，为此在第一滤波片503a与激光芯片604a之间设置有隔离器800a。通过隔离器800a可防止第一光信号返回至激光芯片604a中。
在一些实施例中，激光芯片604a产生的光信号经第一滤波片503a、汇聚透镜502a、光纤适配器501a传输至外部。在一些实施例中，外部的光信号经光纤适配器501a、汇聚透镜502a、第一滤波片503a，然后传输至光接收芯片704a。
图13为根据本公开一些实施例提供的一种电路板的结构图一；图14为根据本公开一些实施例的一种电路板的结构图二。如图13和图14所示，为了实现电路板300与收发腔体400a的连接，电路板300的侧边呈两极向内凹陷。
在一些实施例中，电路板300侧边一端向内凹陷形成第一缺口301，另一端向内凹陷形成第三缺口303，第一缺口301和第三缺口303继续向内凹陷形成第二缺口302。
第一缺口301的端部形成凹槽304。第一缺口301和第二缺口302的连接处设有衔接区域306，第二缺口302和第三缺口303的连接处设有衔接区域307。
在一些实施例中，电路板300侧边向内凹陷后，侧边包括依次连接的第一连接边3051、第二连接边3052、第三连接边3053、第四连接边3054、第五连接边3055、第六连接边3056、第七连接边3057。第一连接边3051与第二连接边3052组成衔接区域307，第四连接边3054与第五连接边3055组成衔接区域306，第五连接边3055与第六连接边3056组成第一缺口301，且两连接边衔接处设有凹槽304；第二连接边3052、第三连接边3053、第四连接边3054组成第二缺口302；电路板300通过第一缺口301、第二缺口302、第三缺口303、衔接区域306、衔接区域307实现与收发腔体400a的电连接。
第二连接边3052、第三连接边3053、第四连接边3054组成第二缺口302，第二缺口302用于设置光接收部件700a的端部；由于光接收部件700a的端部设有管脚，因此需一定空间以设置管脚，示例性地，通过第二缺口302以设置管脚。
图15为根据本公开一些实施例提供的一种电路板与收发腔体的装配分解示意图；图16为根据本公开一些实施例提供的一种电路板与收发腔体的装配示意图。如图15和图16所示，在一些实施例中，第一凸起405和第二凸起406分别与电路板的衔接区域307和衔接区域306连接。示例性地，衔接区域307嵌入至第一凸起405的底表面以下的区域，衔接区域306嵌入至第二凸起406的底表面以下的区域，则第一凸起405的底表面与衔接区域307的顶表面连接，第一凸起405设于衔接区域307的表面，进而第一凸起405设于电路板300的表面；第二凸起406的底表面与衔接区域306的顶表面连接，第二凸起406设于衔接区域306的表面，进而第二凸起406设于电路板300的表面。第一凸起405和第二凸起406的曲线均作倒角处理，增加与电路板的接触面，以实现与电路板300的牢固连接。
电路板的衔接区域307与收发腔体400a的第一凸起405的底表面连接，衔接区域307嵌入至第一凸起405的底端，第一凸起405设于衔接区域307的表面；电路板的衔接区域306，与收发腔体400a的第二凸起406的底表面连接，衔接区域306嵌入至第二凸起406的底部，第二凸起406设于衔接区域306的表面。
图17为根据本公开一些实施例提供的一种电路板与收发腔体的装配剖面图一；图18为根据本公开一些实施例提供的一种电路板与收发腔体的装配剖面图二。如图17和图18所示，电路板300的衔接区域307与收发腔体400a的第一凸起405底端连接，衔接区域306与收发腔体400a的第二凸起406底端连接，第一缺口301伸入第一开口403内，进而实现电路板300与收发腔体400a的连接。
图19为根据本公开一些实施例提供的一种电路板与收发腔体的装配剖面图三。如图19所示，在一些实施例中，电路板的第一缺口301伸入收发腔体400a的第一开口403内部，第一缺口301相对于第一开口403突出设置；在第一缺口301伸入第一开口403内后，在向第二凸起406连接的过程中，受到第一开口403的侧壁4031的阻挡，因此，电路板300还设有凹槽304，通过凹槽304可避让侧壁4031，进而实现电路板300的衔接区域306与收发腔体400a的第二凸起406连接。
电路板的凹槽304与侧壁4031连接，使电路板避让侧壁4031，在第一缺口301伸入至第一开口403后，通过凹槽304，可避让侧壁4031，然后衔接区域306与第二凸起406连接。
在一些实施例中，光接收部件700a一端向收发腔体400a内部伸入，另一端设于第二缺口302内，通过第二缺口302设置光接收部件700a突出的各管脚。
图20为根据本公开一些实施例提供的一种柔性电路板与收发腔体的装配示意图。如图20所示，在一些实施例中，通过柔性电路板900a实现连接光接收部件700a与电路板300之间的连接。
在一些实施例中，光接收部件700a包括各管脚705a，如信号管脚、接地管脚等。
柔性电路板900a包括第一连接端910和第二连接端920。第一连接端910与光接收部件700a电连接，第二连接端920与电路板300电连接，进而实现光接收部件700a与电路板300的电连接。
第一连接端910表面设有管脚通孔9101，以使管脚通过。管脚通孔9101的内壁表面设有金属层，以实现第一连接端910与光接收部件700a的电连接。第二连接端920表面设有焊盘9201，以实现第二连接端920与电路板300实现电连接。
在一些实施例中，第一连接端910和第二连接端920分别设有相应焊盘，管脚通孔9101的内表面设有金属层，外表面设有焊盘，管座703表面的管脚穿过管脚通孔9101，然后通过焊盘以连接管脚与柔性电路板900a，光接收芯片704a发出的电信号经过管脚传输至柔性电路板900a的第一连接端910。
在一些实施例中，电信号从柔性电路板900a的第一连接端910，传输至柔性电路板900a的第二连接端920；第二连接端920表面设有焊盘9201，电路板300的相应位置同样设有焊盘，则第二连接端920与电路板300通过焊盘实现电连接，电信号进而传输至电路板300表面。
光纤适配器501a与激光芯片604a的光轴处于同一高度，由于光接收部件700a的管座尺寸较大，受限于收发腔体400a侧壁的高度尺寸，导致光接收部件700a的设置高度相对较高，进而光接收芯片704a所在高度相对于激光芯片604a所在高度较高。然而光纤适配器501a、汇聚透镜502a、第一滤波片503a的光轴与激光芯片604a的光轴处于同一高度，进而光接收芯片704a相对于光纤适配器501a、汇聚透镜502a、第一滤波片503a的高度较高，经光纤适配器501a传输的接收光信号无法全部射入光接收芯片704a中，进而降低接收光信号的光耦合率。
图21为根据本公开一些实施例提供的一种第一滤波片与滤波片支撑架装配图；图22为根据本公开一些实施例提供的一种第一滤波片与滤波片支撑架装配分解图。如图21和图22所示，在一些实施例中，第一滤波片503a相对于收发腔体400a的底端呈倾斜设置，且第一滤波片503a向滤波片支撑架504a所在方向倾斜，则第一滤波片503a的倾斜面朝向管帽702表面的透镜，以使第一滤波片503a的倾斜面朝向光接收芯片704a。
第一滤波片503a相对于收发腔体400a的底端倾斜设置，以使第一滤波片503a的出射光相对于收发腔体400a的底端倾斜射出，以射向光接收芯片；通过将第一滤波片503a倾斜设置，以改变第一滤波片503a射出的光信号的传输方向，调整光信号的光路，进而增大光接收芯片的光耦合率。
激光芯片604a的出光面朝向第一滤波片503a的第一表面，光接收芯片704a的进光面朝向第一滤波片503a的第二表面。当光接收芯片704a高度大于激光芯片604a高度时，将第一滤波片503a向滤波片支撑架504a方向倾斜设置。示例性地，滤波片支撑架504a设于靠近收发腔体400a第二侧壁的一端，然后第一滤波片503a向靠近滤波片支撑架504a的方向倾斜。其中，第一滤波片503a的入射光与出射光所在的平面与收发腔体400a底端呈预设夹角，从第一滤波片503a向光接收芯片704a倾斜。
在一些实施例中当光接收芯片704a高度小于激光芯片604a高度时第一滤波片503a的倾斜方向，与光接收芯片704a高度大于激光芯片604a高度时的倾斜方向相反。
在一些实施例中，第一滤波片503a相对于收发腔体400a的底端呈倾斜设置，且第一滤波片503a向滤波片支撑架504a所在方向倾斜，第一滤波片503a的倾斜面与收发腔体400a底端的垂直面呈一定夹角，示例性地，第一滤波片503a相对于收发腔体400a的底端非垂直设置。示例性地，滤波片支撑架504a设于第一滤波片503a和收发腔体400a的第二侧壁之间，第一滤波片503a向滤波片支撑架504a所在方向倾斜。
第一滤波片503a的倾斜面朝向光接收芯片704a，由于光接收芯片704a相对于第一滤波片503a的高度较高，则从第一滤波片503a中射向光接收芯片704a的光信号向光接收芯片704a所在高度倾斜，即从第一滤波片503a中反射出的光信号会上扬至光接收芯片704a，进而补偿从第一滤波片503a至光接收芯片704a光路上的高度差，改变出射光信号的射出高度，使接收光信号更大程度的射入光接收芯片704a中，进而增加接收光信号的光耦合率。
当第一滤波片503a相对于收发腔体400a的底端呈倾斜设置，且第一滤波片503a向滤波片支撑架504a所在方向倾斜时，入射光信号方向不变，然而第一滤波片503a的法线会朝向光接收芯片704a而上扬，则入射光信号 与法线所在的平面随之朝向光接收芯片704a而上扬，由于入射光信号、法线、出射光信号处于同一平面，则从第一滤波片503a中射出的出射光信号同样随之朝向光接收芯片704a而上扬，则出射光信号会更大程度的射入光接收芯片704a中，以增加接收光信号的光耦合率。以第一滤波片503a为45°滤波片为例，入射至45°滤波片上的入射光信号与法线的夹角为45°，从45°滤波片出射的出射光信号与法线的夹角为45°，“法线”指的是45°滤波片的法线；当45°滤波片相对于收发腔体400a的底端呈倾斜设置，且45°滤波片向滤波片支撑架504a所在方向倾斜时，入射光信号方向不变，然而45°滤波片的法线会朝向光接收芯片704a而上扬，则入射光信号与法线所在的平面随之朝向光接收芯片704a而上扬，由于入射光信号、法线、出射光信号处于同一平面，则从45°滤波片中射出的出射光信号同样随之朝向光接收芯片704a而上扬，则出射光信号会更大程度的射入光接收芯片704a中，以增加接收光信号的光耦合率。
在一定实施例中，第一滤波片503a的倾斜面与收发腔体400a底端的垂直面呈一定夹角，该夹角范围可保证第一滤波片503a对发射端光功率不会产生较大影响，同时保证接收端光耦合效率。示例性地，第一滤波片503a的倾斜面与收发腔体400a底端的垂直面之间的夹角范围为6°至13°，其中以8°为最佳。
图23为根据本公开一些实施例提供的一种第一滤波片设置形态与光路关系示意图。如图23所示，当第一滤波片503a垂直于收发腔体400a底端时，第一滤波片503a的入射光信号和出射光信号所在的平面A为水平面，示例性地，与收发腔体400a底端呈平行关系。
图24为根据本公开一些实施例提供的一种第一滤波片另一设置形态与光路关系示意图。如图24所示，当第一滤波片503a相对于收发腔体400a底端倾斜且向滤波片支撑架504a所在方向倾斜时，第一滤波片503a的入射光信号和出射光信号所在的平面B为倾斜面，示例性地，平面B朝向光接收芯片704a而倾斜，进而可以抬高从第一滤波片503a至光接收芯片704a的光路，增加光接收芯片704a的接收光耦合率。
在一些实施例中，光接收部件700a也倾斜设置。示例性地，光接收部件700a中的管帽702端靠近收发腔体400a底端而倾斜，管脚705a端的中心轴线的所在高度相对于管帽702端的中心轴线的所在高度较高，即管脚一端向上倾斜，管帽一端向下倾斜。光接收部件700a倾斜设置时，光接收芯片704a所在重心位置更靠近收发腔体400a底端，光接收芯片704a与激光芯片604a之间的高度差缩小，以增加接收光信号的光耦合率。
光接收部件700a倾斜设置时，光接收部件700a的中心轴线与收发腔体400a底端平面之间呈一定夹角，该夹角范围为13°至18°，以16°为最佳，以保证光接收芯片704a与激光芯片604a之间的高度差缩小，以增加接收光信号的光耦合率。
在一些实施例中，第一滤波片503a与滤波片支撑架504a连接，以通过滤波片支撑架504a支撑第一滤波片503a，增加第一滤波片503a的稳定性。
滤波片支撑架504a整体结构垂直于收发腔体400a底端设置，倾斜面5041的倾斜方向和倾斜角度与第一滤波片503a一致，通过倾斜面5041的倾斜以实现第一滤波片503a的倾斜，且二者密切接触连接。
在一些实施例中，滤波片支撑架504a为异形支撑架。第一滤波片503a与滤波片支撑架504a之间具有空隙，以使发射端激光芯片604a产生的光信号穿过，到达第一滤波片503a表面。
图25为根据本公开一些实施例提供的一种滤波片支撑架的结构图。如图25所示，滤波片支撑架504a包括倾斜面5041、顶面5042、侧面5043和弧面5044。顶面5042连接倾斜面5041和侧面5043。
第一滤波片503a与倾斜面5041连接。示例性地，第一滤波片503a与倾斜面5041二者之间可通过UV胶粘贴在一起。
为了不阻挡激光芯片604a产生的光信号射向第一滤波片503a，滤波片支撑架504a从低端向上凹陷形成弧面5044，弧面5044这一结构的轮廓包括各弯曲边。在一些实施例中，弧面5044包括第一曲边50441和第二曲边50442，第一曲边50441与侧面5043连接，第二曲边50442与倾斜面5041连接。
倾斜面5041与第二曲边50442连接，第一滤波片503a与倾斜面5041接触连接，倾斜面5041的底端为第二曲边50442，由于倾斜面5041的底端为曲边，向内卷曲、收拢，则对第一滤波片503a具有更好地支撑作用。
弧面5044一端朝向激光芯片604a，对激光芯片604a产生的光信号起到规避作用，以使激光芯片604a产生的光信号穿过弧面5044，射入第一滤波片503a，然后从第一滤波片503a透射而出。
在一些实施例中，通过将滤波片支撑架504a设置为异形支撑架，既可以实现第一滤波片503a的倾斜设置，进而使第一滤波片503a朝向光接收芯片704a而倾斜，以抬高从第一滤波片503a至光接收芯片704a的光路，增加光接收芯片704a的接收光耦合率；同时又可以规避激光芯片604a产生的光信号，以使激光芯片604a产生的光信号穿过弧面5044，射入第一滤波片503a，然后从第一滤波片503a透射而出，然后经汇聚透镜502a、光纤适配器501a进而传输至光纤内。
图26为根据本公开一些实施例提供的一种光模块的光路图一。如图26所示，发射光信号的路径：激光芯片604a发出发射光信号-准直透镜605a准直发射光信号-隔离器800a-弧面5044-第一滤波片503a透射光信号-汇聚透镜502a汇聚发射光信号-光纤适配器501a中。
接收光信号的路径：光纤适配器501a接收外部传来的接收光信号-汇聚透镜502a-第一滤波片503a反射接收光信号-经过第一滤波片503a倾斜以提高光信号的射出高度-第二滤波片701a-光接收芯片704a。
上述实施例提供的光模块中，通过将第一滤波片503a倾斜设置，以改变第一滤波片503a射出的光信号的传输方向和传输高度，调整光信号的光路，进而增大光接收芯片的光耦合率。本公开实施例还提供一种光模块，在第一滤波片503b和第二滤波片701b之间设置位移棱镜，使光信号从处于相对位置较低的第一滤波片503b处，传输至相对位置较高的光接收芯片704b处，进而提高光信号的传输高度，以使接收光信号更大程度地耦合至光接收芯片704b表面，进而增加接收光信号的耦合效率。
图27为根据本公开一些实施例提供的另一种收发腔体的结构图。如图27所示，在本公开的一些实施例中，光模块包括收发腔体400b，收发腔体400b与盖板408b盖合连接。收发腔体400b的侧壁设有光接收部件700b；收发腔体400b内部一端设有收发器件500b，内部另一端设有光发射部件600b。
在一些实施例中，收发腔体400b与电路板300的连接关系，与收发腔体400a与电路板300的连接关系相同，不再详细展开。
在一些实施例中，收发腔体400b与收发器件500b的连接关系，与收发腔体400a与收发器件500a的连接关系相同，不再详细展开。
在一些实施例中，收发腔体400b与光发射部件600b的连接关系，与收发腔体400a与光发射部件600a的连接关系相同，不再详细展开。
在一些实施例中，收发腔体400b与光接收部件700b的连接关系，与收发腔体400a与光接收部件700a的连接关系相同，不再详细展开。
收发腔体400b内部及侧壁用来分别设置收发器件500b、光发射部件600b、光接收部件700b的各结构均与收发腔体400a相同，收发腔体400b内部及侧壁的构造与收发腔体400a内部及侧壁的构造相同，从外观和内部 来看，收发腔体400b与收发腔体400a为完全相同的收发腔体。
图28为根据本公开一些实施例提供的另一种收发腔体的分解图；图29为根据本公开一些实施例提供的另一种收发腔体内部结构分解图。如图28和图29所示，在一些实施例中，收发器件500b包括光纤适配器501b、汇聚透镜502b、第一滤波片503b、支撑座506。其中，第一滤波片503b可以为45°滤波片，第一滤波片503b可以对来自于外部的接收光信号进行反射，同时，也可以对激光芯片产生的发射光信号进行透射。
第一滤波片503b相对于收发腔体400b的底端垂直设置，第一滤波片503b垂直于收发腔体400b的底端设置。
第一滤波片503b设置于支撑座506的表面，以通过支撑座506对第一滤波片503b进行限位和固定。通过支撑座506来设置第一滤波片503b，相比于将第一滤波片503b直接粘贴于电路板300表面，可靠性更高。示例性地，第一滤波片503b与支撑座506二者之间可通过UV胶连接。
在一些实施例中，在第一滤波片503b和第二滤波片701b之间设置位移棱镜507，通过位移棱镜507调整第一滤波片503b的反射光信号的光路高度，也就是通过位移棱镜507以改变所述接收光信号的传输方向和传输高度，以使所述接收光信号射入所述光接收芯片中。示例性地，通过位移棱镜507提高第一滤波片503b的反射光信号的光路高度。
在一些实施例中，位移棱镜507通过两次反射，将在相对较低高度的光信号转移至较高高度，进而使光信号从处于相对位置较低的光纤适配器501b处，传输至相对位置较高的光接收芯片704b处。
在一些实施例中，光接收芯片704b的高度相对激光芯片604b高度高0.5mm左右，为了通过位移棱镜507，使光信号从处于相对位置较低的光纤适配器501b处，传输至相对位置较高的光接收芯片704b处，位移棱镜507的垂直高度可以为0.58mm，对位移棱镜507的厚度不作具体要求。
在一些实施例中，位移棱镜507一端设置在支撑座506表面，另一端与第二滤波片701b连接；支撑座506的设置可进一步提高位移棱镜507的高度，进一步抬高光信号的光路高度，以增加接收光信号的耦合率。
在一些实施例中，光发射部件600b的结构与光发射部件600a的结构相同，包括激光芯片604b、准直透镜605b等；激光芯片604b产生的光信号经过准直透镜605b的准直后，射入第一滤波片503b，经过第一滤波片503b的透射，依次进入汇聚透镜502b、光纤适配器501b。
当激光芯片604b产生的发射光信号经过光纤适配器501b向外部传输时，发射光信号中的部分光信号可能会随着接收光信号一起进入收发腔体400b内部，为了避免发射光信号中的部分光信号返回至激光芯片中，在第一滤波片503b与激光芯片之间设有隔离器800b；隔离器800b的设置，可防止发射光信号返回至激光芯片中。
在一些实施例中，光接收部件700b包括管帽，管帽外表面设有第二滤波片701b，第二滤波片701b粘贴在管帽外表面。示例性地，第二滤波片701b为0°滤波片，0°滤波片指的是入射光与滤波片法线之间夹角为0°的滤波片，即入射光垂直射入0°滤波片，第二滤波片701b可滤掉除接收光信号以外的其他波长光；经过0°滤波片的滤光后，进入光接收芯片704b，以提高光信号质量。
图30为根据本公开一些实施例提供的另一种光接收部件的结构图。如图30所示，光接收部件700b的内部设有光接收芯片704b，光接收芯片704b的位置相对于激光芯片604b的位置较高，通过在第一滤波片503b和第二滤波片701b之间设置位移棱镜507，使光信号从处于相对位置较低的第一滤波片503b处，传输至相对位置较高的光接收芯片704b处，以使接收光信号更大程度地耦合至光接收芯片704b表面，增加接收光信号的耦合效率。
图31为根据本公开一些实施例提供的一种位移棱镜设置结构图一。如图31所示，在一些实施例中，第一滤波片503b设置于支撑座506的表面，位移棱镜507的一端设置于支撑座506的表面，另一端与第二滤波片701b连接。示例性地，位移棱镜507的一端通过UV胶粘贴在支撑座506的表面，另一端同样通过UV胶粘贴在第二滤波片701b表面。位移棱镜507设置于支撑座506的表面，可以提高位移棱镜507的所在高度，进而提高接收光信号的光路传输高度。
位移棱镜507从支撑座506方向向上倾斜至第二滤波片701b方向，其包括进光面和出光面，出光面高度大于进光面高度。示例性地，进光面朝向第一滤波片503b，以接收第一滤波片503b反射的光信号；出光面与第二滤波片701b连接，以在抬高光路后，将接收光信号传输至相对位置较高的光接收芯片704b表面，以提高光信号的传输高度。
图32为根据本公开一些实施例提供的一种位移棱镜设置结构图二。如图32所示，第一滤波片503b的两端分别相对于支撑座506表面突出，并且与位移棱镜507的进光面相对设置。
图33为根据本公开一些实施例提供的一种位移棱镜设置结构图三。如图33所示，位移棱镜507与第一滤波片503b错开设置，位移棱镜507的一端向支撑座506的中心靠近，另一端相对于支撑座506表面突出，以更大程度地接收第一滤波片503b反射的光信号。
图34为根据本公开一些实施例提供的一种位移棱镜改变光路示意图。如图34所示，，为第一滤波片503b与位移棱镜507之间的光路示意；从第一滤波片503b反射的光信号垂直进入位移棱镜507的进光面，然后经过第一次反射后到达位移棱镜507的顶面，经过第二次反射后，从位移棱镜507的出光面垂直射出，到达第二滤波片701b表面。位移棱镜507可将光信号从相对较低的位置传输至相对位置较高的位置，以提高光信号的传输高度，以使接收光信号更大程度地耦合至光接收芯片704b表面，进而增加接收光信号的耦合效率。
图35为根据本公开一些实施例提供的一种光模块的光路图二。如图35所示，发射光信号的路径：激光芯片604b发出发射光信号-准直透镜605b准直发射光信号-隔离器800b-第一滤波片503b透射光信号-汇聚透镜502b汇聚发射光信号-光纤适配器501b中。
接收光信号的路径：光纤适配器501b接收外部传来的接收光信号-汇聚透镜502b-第一滤波片503b反射接收光信号-经过位移棱镜507以提高光信号的射出高度-第二滤波片701b-光接收芯片704b。
本公开一些实施例中通过在第一滤波片503b和第二滤波片701b之间设置位移棱镜507，使光信号从处于相对位置较低的第一滤波片503b处，传输至相对位置较高的光接收芯片704b处，进而提高光信号的传输高度，以使接收光信号更大程度地耦合至光接收芯片704b表面，进而增加接收光信号的耦合效率。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (12)

  1. 一种光模块，包括：
    电路板；
    收发腔体，与所述电路板电连接；
    光发射部件，设于所述收发腔体的内部，包括光发射芯片，所述光发射芯片出光方向平行于所述收发腔体底表面；
    光接收部件，设于所述收发腔体的侧壁上，表面设有第二滤波片，所述光接收部件包括光接收芯片，所述光接收芯片所在高度与所述光发射芯片所在高度不同；
    收发器件，设于所述收发腔体的内部，包括光纤适配器、第一透镜、第一滤波片；其中，所述第一滤波片的第一表面朝向所述光发射芯片的出光面，所述第一滤波片的第二表面朝向所述光接收芯片的进光面，所述第一滤波片被配置为反射来自所述光纤适配器的接收光信号，及透射光发射芯片产生的发射光信号；
    所述第一滤波片相对于所述收发腔体底表面倾斜设置，以使所述第一滤波片的入射光与出射光所在的平面与所述收发腔体底端呈预设夹角，进而使所述第一滤波片的出射光倾斜射向所述光接收芯片；和/或，所述第一滤波片相对于所述收发腔体底表面垂直设置，所述第一滤波片和所述第二滤波片之间设有位移棱镜，所述位移棱镜被配置为改变进入至所述光接收芯片的接收光信号的传输方向和传输高度，以使所述接收光信号射入所述光接收芯片中，其中，所述位移棱镜的出光面所在高度大于所述位移棱镜的进光面所在高度，所述位移棱镜的进光面朝向所述第一滤波片的第二表面，所述位移棱镜的出光面与所述第二滤波片连接。
  2. 根据权利要求1所述的光模块，其中，所述收发腔体包括第一侧壁、第二侧壁、第三侧壁及第四侧壁；所述第一侧壁和所述第二侧壁相对设置；所述第三侧壁和所述第四侧壁相对设置；
    所述第一侧壁形成有通孔，所述通孔内设有所述光接收部件；
    所述第三侧壁形成有第一开口，所述第一开口包括侧壁；所述电路板通过所述第一开口伸入所述收发腔体内，以使所述光发射芯片与所述电路板表面的激光驱动芯片之间的打线穿过，所述激光驱动芯片位于所述收发腔体的外部；
    所述第四侧壁形成有第二开口，所述第二开口内设有所述光纤适配器；
    所述第一侧壁顶端的两侧分别形成有第一凸起和第二凸起，所述第一凸起和第二凸起由所述第一侧壁向外突出得到。
  3. 根据权利要求2所述的光模块，其中，所述第一滤波片与滤波片支撑架连接，且所述第一滤波片朝向所述滤波片支撑架倾斜设置；所述滤波片支撑架被配置为支撑所述第一滤波片；所述滤波片支撑架设于所述第一滤波片与所述第二侧壁之间；
    所述滤波片支撑架包括倾斜面和侧面；所述倾斜面被配置为支撑所述第一滤波片，所述倾斜面相对于所述收发腔体底端倾斜设置，且靠近所述第二侧壁倾斜；
    所述侧面形成有弧面，以使所述光发射芯片产生的光信号透射至所述第一滤波片表面；所述弧面包括第一曲边和第二曲边。
  4. 根据权利要求1所述的光模块，其中，所述第一滤波片的底端设有支撑座，以通过所述支撑座支撑所述第一滤波片和所述位移棱镜；
    所述第一滤波片设于所述支撑座表面；
    所述位移棱镜的一端与所述支撑座表面连接，另一端与所述第二滤波片连接。
  5. 根据权利要求4所述的光模块，其中，所述第一滤波片的两端均相对所述支撑座突出；
    所述位移棱镜一端相对于所述第一滤波片的相应端更靠近所述支撑座的中心，另一端相对于所述支撑座突出， 以使所述位移棱镜的进光面更靠近所述第一滤波片。
  6. 根据权利要求3所述的光模块，其中，所述电路板包括第一缺口、第二缺口和第三缺口；
    第一缺口和第二缺口的连接处形成有第一衔接区域，第二缺口和第三缺口的连接处形成有第二衔接区域；
    所述第一缺口的末端形成有凹槽，所述凹槽被配置为避让所述第一开口的侧壁，以使所述第一衔接区域嵌入至所述第二凸起的底端；
    所述第一衔接区域的顶表面与所述第二凸起的底表面连接，所述第二衔接区域的顶表面与所述第一凸起的底表面连接；
    所述第二缺口被配置为避让所述光接收部件的管脚，所述管脚相突出设置，所述管脚伸出并设于所述第三缺口内。
  7. 根据权利要求6所述的光模块，其中，所述第一缺口伸入所述第一开口内，以使所述电路板嵌入至所述第一开口内；
    所述第一衔接区域嵌入至所述第二凸起的底端，所述第二衔接区域嵌入至所述第一凸起的底端，以使所述第二凸起和所述第一凸起设置于所述电路板表面。
  8. 根据权利要求3所述的光模块，其中，所述光接收部件位于所述第一侧壁，所述滤波片支撑架靠近所述第二侧壁设置；
    所述光发射部件靠近所述第三侧壁设置；
    所述收发器件靠近所述第四侧壁设置；
    所述第一凸起和所述第二凸起分别设于所述第一侧壁的两端。
  9. 根据权利要求6所述的光模块，其中，所述收发腔体内部分别形成有第一台面和第二台面，所述第二台面所在高度小于所述第二台面所在高度，以使所述光发射芯片表面与所述激光驱动芯片表面平齐；
    所述第一台面表面设有所述光纤适配器、所述第一透镜、所述第一滤波片、所述滤波片支撑架；所述第二台面表面设有所述光发射部件。
  10. 根据权利要求9所述的光模块，其中，所述光发射部件包括TEC，所述TEC表面分别设有第一底座和第二底座，所述第一底座和所述第二底座表面分别设有所述光发射芯片和第二透镜；
    所述光接收部件包括管帽和管座，所述管帽朝向所述收发腔体内部的表面设有所述第二滤波片；
    所述管座表面所述光接收芯片；
    所述管座表面设有管脚，所述管脚相对于所述管座表面突出设置；
    所述光接收部件一端朝向所述收发腔体内部，另一端设于所述第二缺口内。
  11. 根据权利要求1所述的光模块，其中，所述光接收部件和所述电路板之间通过柔性电路板连接；
    所述柔性电路板一端与所述光接收部件电连接，另一端与所述电路板电连接。
  12. 根据权利要求10所述的光模块，其中，所述第一滤波片和所述第二透镜之间设有隔离器，且所述隔离器设于所述第一台面表面。
PCT/CN2023/097958 2022-06-14 2023-06-02 光模块 WO2023241378A1 (zh)

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