WO2023241265A1 - 一种芯片封装体、感光模组、激光发射模组和激光雷达 - Google Patents

一种芯片封装体、感光模组、激光发射模组和激光雷达 Download PDF

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Publication number
WO2023241265A1
WO2023241265A1 PCT/CN2023/092863 CN2023092863W WO2023241265A1 WO 2023241265 A1 WO2023241265 A1 WO 2023241265A1 CN 2023092863 W CN2023092863 W CN 2023092863W WO 2023241265 A1 WO2023241265 A1 WO 2023241265A1
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WO
WIPO (PCT)
Prior art keywords
photonic
chip
bare chip
circuit board
transparent insulating
Prior art date
Application number
PCT/CN2023/092863
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English (en)
French (fr)
Inventor
张�浩
李勇
樊英民
刘兴胜
Original Assignee
西安炬光科技股份有限公司
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Application filed by 西安炬光科技股份有限公司 filed Critical 西安炬光科技股份有限公司
Publication of WO2023241265A1 publication Critical patent/WO2023241265A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
    • G01S17/931—Lidar systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/484—Transmitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/486—Receivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding

Definitions

  • This application relates to the field of optoelectronic packaging technology, specifically, to a chip package, a photosensitive module, a laser emitting module and a laser radar.
  • autonomous driving can not only minimize the danger of driving a car, but also relieve users of heavy driving tasks. Therefore, autonomous driving is the trend of future automobile development.
  • a variety of sensors need to be installed on the vehicle body, and lidar is one of them.
  • lidar mounted on cars is usually called vehicle-mounted lidar.
  • the laser chip is usually packaged separately at the automotive level and the laser chip electrodes inside the package structure are led out to form pins.
  • the individually packaged laser chip is integrally mounted on the circuit board and the pins are connected to the circuit board accordingly.
  • This packaging method will, on the one hand, introduce large parasitic inductance and thermal resistance, resulting in limited device performance; on the other hand, This aspect will make the packaging steps more complicated and the cost will remain high.
  • the parasitic inductance and thermal resistance can be reduced if the bare photonic chip is directly packaged on the circuit board, the bare photonic chip is easily affected by dust, water vapor, etc. in the external environment and fails in a short period of time, resulting in poor reliability.
  • the purpose of this application is to provide a chip package, a photosensitive module, a laser emitting module and a laser radar in view of the above-mentioned deficiencies in the prior art, which can simplify the packaging steps while also reducing the parasitic inductance introduced by the packaging. and thermal resistance, thereby improving device performance and ensuring high vehicle-standard reliability.
  • a chip package which includes a circuit board and a photonic bare chip.
  • the photonic bare chip is disposed on the circuit board, and the photonic bare chip is connected to a driving circuit of the circuit board through a bonding wire to be connected by the driving circuit.
  • Driving the photonic bare chip, the circuit board is also provided with a transparent insulating packaging colloid that at least covers the photonic bare chip, and the photonic bare chip has There are windows for the exit or entry of light beams.
  • the transparent insulating encapsulating colloid covers at least the photonic bare chip and the bonding wire.
  • the driving circuit includes a driving chip, and the photonic bare chip is connected to the driving chip through bonding wires.
  • the driving circuit includes a driving chip, and the anode of the photonic bare chip is connected to the driving chip through a bonding wire.
  • the photonic bare chip is directly mounted on the circuit board, or the photonic bare chip is mounted on the circuit board through the substrate.
  • the outer wall surface of the transparent insulating encapsulating colloid corresponding to the window is flat.
  • an optical shaping portion is provided on the outer wall surface of the transparent insulating encapsulant corresponding to the window to shape the light beam used to exit the window.
  • the optical shaping part is a convex part, and the convex part is used to collimate the light beam of the exit window along the fast axis and/or slow axis direction.
  • the light transmittance of the transparent insulating encapsulating colloid is greater than 95%.
  • the material of the transparent insulating encapsulating colloid is one of epoxy resin, silicone, and thermosetting plastic.
  • Another aspect of the embodiment of the present application provides a photosensitive module, including any one of the above chip packages, and the photonic bare chip of the chip package is a photosensitive chip.
  • a laser emitting module including any one of the above chip packages, and the photonic bare chip of the chip package is a laser bare chip.
  • Another aspect of the embodiments of the present application provides a laser radar, including any one of the above laser emission modules.
  • This application provides a chip package, a photosensitive module, a laser emitting module and a lidar, which can effectively simplify the packaging steps by covering at least the photonic bare chip with a transparent insulating packaging colloid to directly package it onto a circuit board. Reduce packaging costs.
  • the transparent insulating packaging colloid covers the photonic bare chip to provide good protection for the photonic bare chip, so that the photonic bare chip can be protected from external dust and water vapor, so that the chip package can meet high reliability requirements, such as Car grade.
  • the transparent insulating encapsulation colloid can firstly strengthen the connection between the photonic bare chip and the circuit board, and secondly, it can also strengthen the connection between the bonding wire and the photonic bare chip to prevent the bonding wire from falling off due to weak bonding force with the pad on the photonic bare chip. .
  • this application uses transparent insulating packaging colloid to directly package the photonic bare chip to the circuit board, which can avoid the additional parasitic inductance and thermal resistance introduced when the packaged chip is repackaged to the circuit board.
  • this application can effectively reduce the loop parasitic inductance, thereby reducing the rising edge and falling edge time, thereby reducing the pulse width, which facilitates increasing the pulse peak power, and also reduces the thermal resistance, allowing the device to have higher peak light output power and larger electro-optical conversion efficiency.
  • the chip package of the present application can be flexibly integrated into a temperature control system as a module to ensure smaller performance deviations in high and low temperature environments.
  • Figure 1 is a schematic structural diagram of a chip package provided by an embodiment of the present application.
  • Figure 2 is a partial enlarged view of a chip package provided by an embodiment of the present application.
  • Figure 3 is a schematic diagram of an unpackaged state of a photonic bare chip provided by an embodiment of the present application
  • Figure 4 is a second schematic diagram of an unpackaged state of a photonic bare chip provided by an embodiment of the present application
  • Figure 5 is one of the structural schematic diagrams of a chip package after encapsulation provided by the embodiment of the present application.
  • Figure 6 is a second structural schematic diagram of a chip package after encapsulation provided by an embodiment of the present application.
  • Figure 7 is a schematic diagram of a photonic bare chip provided by an embodiment of the present application, which is a light extraction chip;
  • Figure 8 is a schematic diagram of a photonic bare chip provided by an embodiment of the present application, which is a photosensitive chip;
  • Figure 9 is a top view of a chip package provided by an embodiment of the present application.
  • Figure 10 is a schematic diagram of a chip package collimating a light beam in the fast axis direction according to an embodiment of the present application
  • FIG. 11 is a schematic diagram of a chip package collimating a light beam in the slow axis direction according to an embodiment of the present application.
  • Icon 100-circuit board; 110-photonic bare chip; 111-substrate; 120-driver chip; 130-transparent insulating packaging colloid; 131-convex part; 140-electronic components; 150-bonding wire; 210-beam .
  • One aspect of the embodiments of the present application provides a chip package, which can avoid additional parasitic inductance and thermal resistance introduced when the packaged chip is packaged on the circuit board by directly packaging the photonic bare chip, thereby causing The performance of the device is limited, but it also ensures the high reliability of the photonic bare chip being directly packaged on the board. Since the step of separately packaging the bare chip is omitted, the overall packaging step can be effectively simplified, packaging costs can be reduced, and packaging yield can be improved.
  • the embodiments of the present application are described below with reference to the accompanying drawings.
  • FIG. 1 , FIG. 2 and FIG. 9 shows the structure of the chip package after completion of packaging.
  • the chip package includes a circuit board 100 and a photonic bare chip 110 .
  • the photonic bare chip 110 is directly packaged on the circuit board 100 .
  • the circuit board 100 at least has a driving function to drive the photonic bare chip 110 into a working state.
  • the photonic bare chip 110 in the working state may emit light or sense light.
  • the circuit board 100 may be a motherboard.
  • a variety of electronic components 140 may be provided on the circuit board 100 , for example, a processor may be provided on the circuit board 100 .
  • Each electronic component 140 can be connected as needed according to the lines on the circuit board 100 to implement corresponding functions.
  • the photonic bare chip 110 is disposed on the circuit board 100 and is not packaged.
  • the negative electrode of the photonic bare chip 110 can be located on the bottom surface of the photonic bare chip 110 and connected through a key.
  • the bonding process is connected to the circuit board 100, and the anode of the photonic bare chip 110 is located on the top surface of the photonic bare chip 110 and connected to the circuit board 100 through the bonding wire 150, so that the circuit board 100 can directly drive the photonic bare chip 110.
  • the positive electrode of the photonic bare chip 110 may be located on the bottom surface of the photonic bare chip 110 and connected to the circuit board 100 through a bonding process.
  • the negative electrode of the photonic bare chip 110 may be located on the top surface of the photonic bare chip 110 and connected to the circuit board 100 through a bonding process.
  • the alignment line 150 is connected to the circuit board 100 so that the circuit board 100 can directly drive the photonic bare chip 110 .
  • the circuit board 100 has a driving circuit, and the photonic bare chip 110 is connected to the driving circuit.
  • the driving circuit includes a driving chip 120 , and the photonic bare chip 110 is connected to the driving chip 120 through a bonding wire 150 .
  • the type of the circuit board 100 can be a ceramic circuit board 100, an alumina ceramic circuit board 100, an aluminum nitride ceramic circuit board 100, an FR4 circuit board 100, etc. This application does not limit the type, and the specific selection can be made according to actual needs. Reasonable settings.
  • the circuit board 100 is a ceramic circuit board 100.
  • the photonic bare chip 110 can be directly bonded to the ceramic circuit board 100, and then the photonic bare chip 110 can be bonded to the ceramic circuit board 100 through the bonding wire 150.
  • the bare chip 110 is connected to the ceramic circuit board 100 .
  • the circuit board 100 is an FR4 circuit board 100.
  • the photonic bare chip 110 can be first Set on the substrate 111, and then mount the substrate 111 with the photonic bare chip 110 on the FR4 circuit board 100, forming a structure in which the substrate 111 is located between the photonic bare chip 110 and the circuit board 100 in Figure 4. In this way, The thermal expansion mismatch between the photonic bare chip 110 and the FR4 circuit board 100 can be balanced through the substrate 111.
  • the photonic bare chip 110 After the photonic bare chip 110 is fixedly installed on the circuit board 100, please refer to Figures 1 and 2. You can also set a transparent insulating packaging colloid 130 on the circuit board 100, and cover the photonic bare chip 110 with the transparent insulating packaging colloid 130. This achieves the purpose of directly packaging the photonic bare chip 110 onto the circuit board 100 .
  • the photonic die 110 has a window for the light beam to exit or enter.
  • this application can effectively simplify the packaging steps and reduce the packaging cost by covering at least the photonic bare chip 110 with the transparent insulating packaging colloid 130 and directly packaging it to the circuit board 100 .
  • the transparent insulating packaging colloid 130 covers the photonic bare chip 110 to provide good protection for the photonic bare chip 110, so that the photonic bare chip 110 can be protected from external dust and water vapor, so that the chip package can meet the requirements of high reliability.
  • sexual requirements such as vehicle regulations.
  • the transparent insulating encapsulating colloid 130 can firstly strengthen the connection between the photonic bare chip 110 and the circuit board 100 , and secondly, can also strengthen the connection between the bonding wire 150 and the photonic bare chip 110 to avoid the connection between the bonding wire 150 and the photonic bare chip 110 .
  • the pad bonding force is weak and falls off.
  • the present application directly packages the photonic bare chip 110 to the circuit board 100 through the transparent insulating packaging colloid 130, which can avoid the additional parasitic inductance and thermal resistance introduced when the packaged chip is re-packaged to the circuit board.
  • the present application can Effectively reduce the parasitic inductance in the loop, thereby reducing the rising edge and falling edge time, thereby reducing the pulse width, which facilitates increasing the pulse peak power, and also reduces the thermal resistance, allowing the device to have higher peak light output power and larger electro-optical conversion efficiency.
  • the chip package of the present application can be flexibly integrated into a temperature control system as a module to ensure smaller performance deviations in high and low temperature environments.
  • the bonding wire 150 can be a gold wire, a copper wire, a silver wire, etc., and the corresponding connection can be achieved through a wire bonding process.
  • the positive and/or negative electrodes of the photonic bare chip 110 are bonded and driven through gold wires.
  • Chip 120 is connected to reduce the parasitic inductance of the loop.
  • the photonic bare chip 110 located on the circuit board 100 may be one or more chips, which is not particularly limited in this application.
  • the multiple photonic bare chips 110 can be placed on the circuit board 100 correspondingly and the electrical connection between the photonic bare chips 110 and the circuit board 100 is completed. , it can be packaged in the following two ways: First, for a separate photonic bare chip 110 corresponding Apply a separate transparent insulating encapsulating colloid 130 to cover them; secondly, apply the same transparent insulating encapsulating colloid 130 to cover multiple bare photonic chips 110 .
  • the transparent insulating packaging colloid 130 should be able to at least fully cover the photonic bare chip 110. On this basis , and can also be reasonably selected according to the coating range of the transparent insulating encapsulating colloid 130.
  • the transparent insulating encapsulating colloid 130 completely covers the photonic bare chip 110 and part of the bonding wires 150 .
  • the bonding wires 150 can be connected to the photonic bare chip through the transparent insulating encapsulating colloid 130 .
  • Parts of the chip 110 are reinforced to reduce the possibility of the bonding wire 150 falling off from the pad on the photonic bare chip 110, thereby improving the reliability and stability of the chip package.
  • the transparent insulating encapsulant 130 completely covers the photonic bare chip 110 and the bonding wire 150 , in other words, the bonding wire 150 is completely embedded in the transparent insulating encapsulant 130 , thereby enabling
  • the bonding wire 150 is reinforced by the transparent insulating encapsulating glue 130 to reduce the possibility of the bonding wire 150 falling off from the circuit board 100 or the pad on the photonic bare chip 110 , thereby further improving the reliability and stability of the chip package.
  • the packaged photonic bare chip 110 and the circuit board 100 serve as an integral module to avoid touching the bonding wire 150 and causing the photonic bare chip 110 to fail during the back-end optical assembly process.
  • the transparent insulating encapsulating colloid 130 completely covers the photonic bare chip 110 , the bonding wire 150 and the driver chip 120 , so that the photonic bare chip 110 , The bonding wire 150 and the driver chip 120 are well protected and sealed, thereby improving the reliability and stability of the chip package.
  • the transparent insulating encapsulant 130 can also cover the entire circuit board 100 to connect the photonic bare chip 110, the bonding wire 150, the driver chip 120 and various electronic components on the circuit board 100.
  • the devices 140 are all covered to improve the reliability and stability of the chip package.
  • the photonic bare chip 110 can be a laser bare chip or a photosensitive chip.
  • the photonic bare chip 110 when it is a laser bare chip, it can be applied to a laser emitting module. Refer to FIG. 7, through the circuit board 100.
  • the driving circuit can drive the photonic bare chip 110 to emit the light beam 210; when the photonic bare chip 110 is a photosensitive chip, it can be applied to the photosensitive module. Please refer to Figure 8.
  • the photon can also be driven by the driving circuit on the circuit board 100.
  • the bare chip 110 senses the incident light beam 210 .
  • the transparent insulating encapsulant 130 can be set as a plane on the outer wall surface corresponding to the window of the photonic bare chip 110 ( Figure 7 or Figure 8
  • the right side wall of the transparent insulating encapsulant 130 is flat), so that the light beam 210 is less affected when entering or exiting through the window, and can be transmitted smoothly and accurately.
  • the transparent insulating packaging glue 130 and the window can also be An optical shaping part is provided on the surface of the outer wall corresponding to the opening.
  • an optical shaping part is formed at the front end of the window of the photonic bare chip 110. In this way, when the light beam emerges from the window, the light beam can be shaped, thereby improving the light output quality of the laser bare chip. This further improves the optical performance of the chip package.
  • the optical shaping part can be made of a material that is consistent with the transparent insulating encapsulating colloid 130; in one embodiment, the optical shaping part can also be made of a material that is inconsistent with the transparent insulating encapsulating colloid 130. This application applies It does not impose restrictions.
  • the optical shaping part may be a convex part 131, which can pre-collimate the light beam emitted through the window, thereby reducing stray light and improving optical performance.
  • the photonic bare chip 110 is a laser bare chip. When the photonic bare chip 110 is driven to emit the light beam 210, the light beam 210 can be collimated under the action of the convex portion 131, so as to improve the light emitting quality of the photonic bare chip 110.
  • FIG. 10 shows that the convex portion 131 pre-collimates the light beam 210 in the fast axis direction, that is, when the photonic bare chip 110 is driven to emit the light beam 210 from the window, the light beam 210 passes through the convex portion. 131 can be collimated in the fast axis direction.
  • FIG. 11 shows that the convex portion 131 pre-collimates the light beam 210 in the slow axis direction, that is, when the photonic bare chip 110 is driven to emit the light beam 210 from the window, the light beam 210 passes through the convex portion. 131 can be collimated in the slow axis direction.
  • the convex portion 131 is capable of pre-collimating the light beam 210 in the fast axis direction and the slow axis direction at the same time, that is, when the photonic bare chip 110 is driven to emit the light beam 210 from the window, the light beam 210 passes through the convex portion 131 can be collimated in both fast and slow axis directions.
  • the transparent insulating encapsulating colloid 130 is a high-temperature thermosetting colloid, that is, the transparent insulating encapsulating colloid 130 is a fluid at normal temperature.
  • the transparent insulating encapsulating colloid 130 undergoes reflow soldering. Can be cured at high temperatures during other processes.
  • the material of the transparent insulating encapsulant 130 is one of epoxy resin, silicone gel, and thermosetting plastic.
  • the light transmittance of the transparent insulating encapsulant 130 is greater than 95%.
  • Another aspect of the embodiment of the present application provides a photosensitive module, including any one of the above chip packages, and the photonic bare chip of the chip package is a photosensitive chip.
  • a laser emitting module including any one of the above chip packages, and the photonic bare chip of the chip package is a laser bare chip.
  • a laser radar including a processor and any of the above chip packages.
  • the processor is disposed on the circuit board 100 of the chip package, and the processor is connected to the circuit through bonding wires.
  • the board 100 is connected, so that the information interaction between the processor and the photonic bare chip 110 can be realized. Therefore, when the lidar is mounted on a vehicle, it can also A receiver capable of information interaction with the processor can be provided on the circuit board 100.
  • the photonic bare chip 110 in the chip package can be used as a laser bare chip, and is stimulated by the circuit board 100 to emit a beam toward the target object. The beam reaches The target object is reflected and received by the receiver.
  • the processor determines the target object information based on various parameter information of the light emitting chip and the receiver. Among them, the target information can be information such as shape, distance, etc., and the detection signal can be information such as time of emission or reception, image, etc.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Semiconductor Lasers (AREA)

Abstract

一种芯片封装体、感光模组、激光发射模组和激光雷达，涉及光电封装技术领域，通过透明绝缘封装胶体(130)将光子裸芯片(110)直接封装至电路板(100)的方式，能够有效简化封装的步骤，降低封装成本，还可以通过透明绝缘封装胶体(130)加固邦定线(150)与光子裸芯片(110)的连接、光子裸芯片(110)与电路板(100)的连接。透明绝缘封装胶体(130)保护光子裸芯片(110)免受外界的灰尘、凝露接触芯片而导致光子裸芯片(110)失效。此外，通过透明绝缘封装胶体(130)将光子裸芯片(110)直接封装至电路板(100)的方式能够避免已封装芯片再封装至电路板(100)时所引入的额外寄生电感和热阻，使器件能够具有较高的峰值出光功率和较大的电光转换效率且可以满足车规级的可靠性。芯片封装体能够作为一个模块可以很灵活的集成于控温系统中保证在高低温环境中性能较小的偏差。

Description

一种芯片封装体、感光模组、激光发射模组和激光雷达
相关申请的交叉引用
本申请要求于2022年06月13日提交中国专利局的申请号为202210659146.1、名称为“一种芯片封装体、感光模组、激光发射模组和激光雷达”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光电封装技术领域，具体而言，涉及一种芯片封装体、感光模组、激光发射模组和激光雷达。
背景技术
随着信息和控制技术的快速发展，自动驾驶技术逐渐被汽车厂家和用户所接受。自动驾驶不仅能够将汽车行驶的危险性降到最低，而且能够减轻用户繁重的驾驶任务，因此，自动驾驶是未来汽车发展的趋势。为了具有级别更高的自动驾驶能力，需要在车身上安装多种传感器，激光雷达属于其中的一种。
现有搭载在汽车上的激光雷达通常称为车载激光雷达，在组装过程中，通常为先对激光芯片单独进行车规级封装并对封装结构内部的激光芯片电极进行引出形成引脚，然后再将单独封装完成后的激光芯片整体贴装于电路板并将引脚对应连接至电路板，此种封装方式，一方面会引入较大的寄生电感和热阻，导致器件性能受限，另一方面会使得封装步骤较为复杂，成本居高不下。如果直接将裸光子芯片封装在电路板上虽然也可以减小寄生电感和热阻，但是光子芯片裸漏在外面易受到外界环境中灰尘、水汽等的影响而短期内失效，可靠性差。
发明内容
本申请的目的在于，针对上述现有技术中的不足，提供一种芯片封装体、感光模组、激光发射模组和激光雷达，在简化封装步骤的同时，还能够降低因封装引入的寄生电感和热阻，从而提高器件性能且保证了较高的车规可靠性。
为实现上述目的，本申请实施例采用的技术方案如下：
本申请实施例的一方面，提供一种芯片封装体，包括电路板和光子裸芯片，光子裸芯片设置于电路板，且光子裸芯片与电路板的驱动电路通过邦定线连接以由驱动电路驱动光子裸芯片，在电路板上还设置有至少包覆光子裸芯片的透明绝缘封装胶体，光子裸芯片具 有用于光束出射或入射的窗口。
可选的，透明绝缘封装胶体至少包覆光子裸芯片和邦定线。
可选的，驱动电路包括驱动芯片，光子裸芯片通过邦定线与驱动芯片连接。
可选的，驱动电路包括驱动芯片，光子裸芯片的正极通过邦定线与驱动芯片连接。
可选的，光子裸芯片直接贴装于电路板，或，光子裸芯片通过衬底贴装于电路板。
可选的，透明绝缘封装胶体与窗口对应的外壁表面为平面。
可选的，在透明绝缘封装胶体与窗口对应的外壁表面设置有光学整形部，以对用于出射窗口的光束进行整形。
可选的，光学整形部为凸部，凸部用于沿快轴和/或慢轴方向对出射窗口的光束进行准直。
可选的，透明绝缘封装胶体的透光率大于95％。
可选的，透明绝缘封装胶体的材质为环氧树脂、硅胶和热固性塑料中的一种。
本申请实施例的另一方面，提供一种感光模组，包括上述任一种的芯片封装体，芯片封装体的光子裸芯片为感光芯片。
本申请实施例的再一方面，提供一种激光发射模组，包括上述任一种的芯片封装体，芯片封装体的光子裸芯片为激光器裸芯片。
本申请实施例的又一方面，提供一种激光雷达，包括上述任一种的激光发射模组。
本申请的有益效果包括：
本申请提供了一种芯片封装体、感光模组、激光发射模组和激光雷达，通过透明绝缘封装胶体至少包覆光子裸芯片以将其直接封装至电路板的方式能够有效简化封装的步骤，降低封装成本。同时，通过透明绝缘封装胶体对光子裸芯片的覆盖从而对光子裸芯片提供良好的保护，使得光子裸芯片可以免受外界的灰尘、水汽的影响，使芯片封装体能够满足高可靠性要求，例如车规级。通过透明绝缘封装胶体一来能够加固光子裸芯片与电路板的连接，二来还能够加固邦定线与光子裸芯片的连接，避免邦定线与光子裸芯片上的焊盘键合力弱而脱落。
然后，本申请通过透明绝缘封装胶体将光子裸芯片直接封装至电路板的方式，能够避免已封装芯片再封装至电路板时所引入的额外寄生电感和热阻，换言之，本申请能够有效降低回路中的寄生电感，从而减小上升沿、下降沿时间，进而减小脉宽，便于提高脉冲峰值功率，同时也能够降低热阻，使器件能够具有较高的峰值出光功率和较大的电光转换效率。此外，本申请的芯片封装体能够作为一个模块可以很灵活的集成于控温系统中保证在高低温环境中性能较小的偏差。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本申请的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
图1为本申请实施例提供的一种芯片封装体的结构示意图；
图2为本申请实施例提供的一种芯片封装体局部放大图；
图3为本申请实施例提供的一种光子裸芯片未封装的状态示意图之一；
图4为本申请实施例提供的一种光子裸芯片未封装的状态示意图之二；
图5为本申请实施例提供的一种芯片封装体封装后的结构示意图之一；
图6为本申请实施例提供的一种芯片封装体封装后的结构示意图之二；
图7为本申请实施例提供的一种光子裸芯片为出光芯片的示意图；
图8为本申请实施例提供的一种光子裸芯片为感光芯片的示意图；
图9为本申请实施例提供的一种芯片封装体的俯视图；
图10为本申请实施例提供的一种芯片封装体在快轴方向对光束进行准直的示意图；
图11为本申请实施例提供的一种芯片封装体在慢轴方向对光束进行准直的示意图。
图标：100-电路板；110-光子裸芯片；111-衬底；120-驱动芯片；130-透明绝缘封装胶体；131-凸部；140-电子元器件；150-邦定线；210-光束。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。
因此，以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围，而是仅仅表示本申请的选定实施例。需要说明的是，在不冲突的情况下，本申请的实施例中的各个特征可以相互结合，结合后的实施例依然在本申请的保护范围内。
在本申请的描述中，需要说明的是，术语“上”、“下”、“左”、“右”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，或者是该申请产品使用时惯常摆放的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“安 装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
本申请实施例的一方面，提供一种芯片封装体，通过将光子裸芯片直接封装至电路板的方式，能够避免已封装芯片封装至电路板时所引入的额外寄生电感和热阻，从而导致器件性能受限，同时也能保证光子裸芯片直接封装在板子上的高可靠性。由于省去了先对裸芯片进行单独封装的步骤，还能够有效简化整体封装的步骤，降低封装成本，有助于提高封装良率。下面结合附图，对本申请的实施例进行描述。
请参阅图1、图2和图9，示出了芯片封装体完成封装后的结构，芯片封装体包括电路板100和光子裸芯片110，光子裸芯片110被直接封装于电路板100。其中，电路板100至少具有驱动功能，以便于驱动光子裸芯片110处于工作状态，处于工作状态的光子裸芯片110可以是出光或感光。在一些实施方式中，电路板100可以是主板，换言之，如图1和图2所示，在电路板100上还可以设置有多种电子元器件140，例如在电路板100上还设置有处理器、存储器、电源管理模块以及通讯模块等，各电子元器件140之间可以根据电路板100上的线路按需进行连接以实现对应功能。
请参阅图3或图4，示出了光子裸芯片110设置于电路板100且未封装的状态，在一种实施方式中，光子裸芯片110的负极可以位于光子裸芯片110的底面且通过键合工艺与电路板100连接，光子裸芯片110的正极则位于光子裸芯片110的顶面且通过邦定线150连接至电路板100，以此，便于电路板100能够直接驱动光子裸芯片110。在一种实施方式中，光子裸芯片110的正极可以位于光子裸芯片110的底面且通过键合工艺与电路板100连接，光子裸芯片110的负极则位于光子裸芯片110的顶面且通过邦定线150连接至电路板100，以此，便于电路板100能够直接驱动光子裸芯片110。
为实现电路板100对光子裸芯片110的驱动，电路板100具有驱动电路，光子裸芯片110的与驱动电路连接。在一种实施方式中，参阅图1至图11，驱动电路包括驱动芯片120，光子裸芯片110通过邦定线150与驱动芯片120连接。
电路板100的类型可以是陶瓷电路板100、氧化铝陶瓷电路板100、氮化铝陶瓷电路板100以及FR4电路板100等，本申请对其类型不做限制，具体选择时可以根据实际需求进行合理设置。
例如，一种实施方式中：如图3所示，电路板100为陶瓷电路板100，此时，可以将光子裸芯片110直接键合于陶瓷电路板100，然后再通过邦定线150将光子裸芯片110连接至陶瓷电路板100。
另一种实施方式中：如图4所示，电路板100为FR4电路板100，鉴于光子裸芯片110和FR4电路板100之间可能存在热膨胀系数不匹配的问题，可以先将光子裸芯片110设置于衬底111，然后将具有光子裸芯片110的衬底111贴装于FR4电路板100，形成图4中，衬底111位于光子裸芯片110和电路板100之间的结构，以此，能够通过衬底111来平衡光子裸芯片110和FR4电路板100之间的热膨胀失配，同理，在光子裸芯片110和其它类型电路板100之间存在热膨胀失配问题时，可以参照该方式进行改善，此处不再赘述。需要说明的是，在光子裸芯片110具有衬底111时，可以将光子裸芯片110底面的负极由衬底111上的背孔引出，从而实现光子裸芯片110负极与电路板100的连接。
在电路板100上固定设置光子裸芯片110后，请参阅图1和图2，还可以在电路板100上设置透明绝缘封装胶体130，通过透明绝缘封装胶体130对光子裸芯片110进行包覆，以此达到将光子裸芯片110直接封装至电路板100的目的。此外，光子裸芯片110具有用于光束出射或入射的窗口。
综上，首先，本申请通过透明绝缘封装胶体130至少包覆光子裸芯片110以将其直接封装至电路板100的方式能够有效简化封装的步骤，降低封装成本。同时，通过透明绝缘封装胶体130对光子裸芯片110的覆盖从而对光子裸芯片110提供良好的保护，使得光子裸芯片110可以免受外界的灰尘、水汽的影响，使芯片封装体能够满足高可靠性要求，例如车规级。通过透明绝缘封装胶体130一来能够加固光子裸芯片110与电路板100的连接，二来还能够加固邦定线150与光子裸芯片110的连接，避免邦定线150与光子裸芯片110上的焊盘键合力弱而脱落。
然后，本申请通过透明绝缘封装胶体130将光子裸芯片110直接封装至电路板100的方式，能够避免已封装芯片再封装至电路板时所引入的额外寄生电感和热阻，换言之，本申请能够有效降低回路中的寄生电感，从而减小上升沿、下降沿时间，进而减小脉宽，便于提高脉冲峰值功率，同时也能够降低热阻，使器件能够具有较高的峰值出光功率和较大的电光转换效率。此外，本申请的芯片封装体能够作为一个模块可以很灵活的集成于控温系统中保证在高低温环境中性能较小的偏差。
在一些实施方式中，邦定线150可以是金线、铜线、银线等，可以通过引线键合工艺实现对应的连接，例如光子裸芯片110的正极和/负极通过金丝键合与驱动芯片120连接，以此降低回路的寄生电感。
在一些实施方式中，位于电路板100上的光子裸芯片110可以是一片或多片，本申请对其不做特别限制。例如在将多片光子裸芯片110直接封装至电路板100时，可以是先将多片光子裸芯片110对应的设置于电路板100并完成光子裸芯片110与电路板100的电连接，此时，可以通过以下两种方式对其进行封装：一是，针对单独的光子裸芯片110对应 涂覆单独的透明绝缘封装胶体130对其进行包覆；二是，针对多片光子裸芯片110涂覆同一个透明绝缘封装胶体130对多个片光子裸芯片110进行包覆。
在通过透明绝缘封装胶体130将光子裸芯片110封装至电路板100时，为了保证光子裸芯片110的可靠性，应当使得透明绝缘封装胶体130能够至少全包覆光子裸芯片110，在此基础上，还可以根据透明绝缘封装胶体130的包覆范围进行合理选择，以下将结合附图做进一步的说明：
在一种实施例中，请参阅图5，透明绝缘封装胶体130完全包覆光子裸芯片110和部分邦定线150，以此，能够通过透明绝缘封装胶体130对邦定线150连接至光子裸芯片110的部分进行加固，降低邦定线150从光子裸芯片110上的焊盘脱落的可能，从而提高芯片封装体的可靠性和稳定性。
在一种实施例中，请参阅图6，透明绝缘封装胶体130完全包覆光子裸芯片110和邦定线150，换言之，邦定线150完全嵌入于透明绝缘封装胶体130中，以此，能够通过透明绝缘封装胶体130对邦定线150进行加固，降低邦定线150从电路板100或光子裸芯片110上的焊盘脱落的可能，从而进一步的提高芯片封装体的可靠性和稳定性。此外，封装后的光子裸芯片110和电路板100作为一个整体模块在后端光学装调工艺中能够很好的避免触碰邦定线150使得光子裸芯片110失效。
在一种实施例中，请参阅图7，透明绝缘封装胶体130完全包覆光子裸芯片110、邦定线150和驱动芯片120，以此，借助透明绝缘封装胶体130能够对光子裸芯片110、邦定线150和驱动芯片120进行良好的保护和密封，提高芯片封装体的可靠性和稳定性。
在一种实施例中，透明绝缘封装胶体130还可以对整个电路板100均进行包覆，以此将光子裸芯片110、邦定线150、驱动芯片120和电路板100上的多种电子元器件140均进行包覆，提高芯片封装体的可靠性和稳定性。
可选的，光子裸芯片110可以是激光器裸芯片或感光芯片，例如当光子裸芯片110为激光器裸芯片时，可以将其应用于激光发射模组，请参阅图7，通过电路板100上的驱动电路能够驱动光子裸芯片110向外出射光束210；当光子裸芯片110为感光芯片时，可以将其应用于感光模组，请参阅图8，通过电路板100上的驱动电路同样能够驱动光子裸芯片110对入射的光束210进行感光。
请参阅图7和图8所示，为了降低透明绝缘封装胶体130对光束210的影响，可以使得透明绝缘封装胶体130在与光子裸芯片110窗口对应的外壁表面设置为平面(图7或图8中透明绝缘封装胶体130的右侧壁为平面)，以此使得光束210在由窗口入射或出射时所受到的影响较小，能够顺利且准确的传输。
为了使得芯片封装体能够具有较佳的光学性能，还可以在透明绝缘封装胶体130与窗 口对应的外壁表面设置有光学整形部，换言之，在光子裸芯片110窗口的前端形成光学整形部，如此，在光束从窗口出射时，能够对光束进行整形，从而提高激光器裸芯片的出光质量，进而提高芯片封装体的光学性能。
在一种实施例中，光学整形部可以与透明绝缘封装胶体130的材质一致；在一种实施例中，光学整形部还可以采用与透明绝缘封装胶体130材质不一致的材料进行制作，本申请对其不做限制。
光学整形部可以是凸部131，其能够对经窗口出射的光束进行预准直，从而降低杂散光，提高光学性能，请参照图10和图11所示，光子裸芯片110为激光器裸芯片，在光子裸芯片110受驱出射光束210时，能够使得光束210在凸部131的作用下进行准直，以提高光子裸芯片110的出光质量。
在一种实施例中，请参阅图10，示出了凸部131在快轴方向对光束210进行预准直，即在光子裸芯片110受驱由窗口出射光束210时，光束210经过凸部131时能够在快轴方向被准直。
在一种实施例中，请参阅图11，示出了凸部131在慢轴方向对光束210进行预准直，即在光子裸芯片110受驱由窗口出射光束210时，光束210经过凸部131时能够在慢轴方向被准直。
在一种实施例中，凸部131在够同时在快轴方向和慢轴方向对光束210进行预准直，即在光子裸芯片110受驱由窗口出射光束210时，光束210经过凸部131时能够在快轴和慢轴方向均被准直。
在一种实施例中，透明绝缘封装胶体130为高温热固胶体，即透明绝缘封装胶体130在常温下为流体，在光子裸芯片110贴装至电路板时，透明绝缘封装胶体130经过回流焊等工艺时可以在高温下进行固化。
在一种实施例中，透明绝缘封装胶体130的材质为环氧树脂、硅胶和热固性塑料中的一种。
在一种实施例中，透明绝缘封装胶体130的透光率大于95％。
本申请实施例的另一方面，提供一种感光模组，包括上述任一种的芯片封装体，芯片封装体的光子裸芯片为感光芯片。
本申请实施例的再一方面，提供一种激光发射模组，包括上述任一种的芯片封装体，芯片封装体的光子裸芯片为激光器裸芯片。
本申请实施例的又一方面，提供一种激光雷达，包括处理器以及上述任一种的芯片封装体，处理器设置于芯片封装体的电路板100上，且处理器通过邦定线与电路板100连接，以此可以实现处理器与光子裸芯片110的信息交互。从而在激光雷达搭载在载具上时，还 可以在电路板100上设置与处理器可信息交互的接收器，芯片封装体中的光子裸芯片110可以作为激光器裸芯片，并在电路板100的驱动下受激朝向目标物出射光束，光束到达目标物后反射并被接收器接收，处理器根据出光芯片和接收器的各项参数信息，确定目标物的信息。其中，目标物信息可以是形状、距离等信息，探测信号可以是出射或接收的时间、图像等信息。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (13)

  1. 一种芯片封装体，其特征在于，包括电路板和光子裸芯片，所述光子裸芯片设置于所述电路板，且所述光子裸芯片与所述电路板的驱动电路通过邦定线连接以由所述驱动电路驱动所述光子裸芯片，在所述电路板上还设置有至少包覆所述光子裸芯片的透明绝缘封装胶体，所述光子裸芯片具有用于光束出射或入射的窗口。
  2. 如权利要求1所述的芯片封装体，其特征在于，所述透明绝缘封装胶体至少包覆所述光子裸芯片和所述邦定线。
  3. 如权利要求1所述的芯片封装体，其特征在于，所述驱动电路包括驱动芯片，所述光子裸芯片通过所述邦定线与驱动芯片连接。
  4. 如权利要求3所述的芯片封装体，其特征在于，所述透明绝缘封装胶体至少包覆所述光子裸芯片、所述邦定线和所述驱动芯片。
  5. 如权利要求1所述的芯片封装体，其特征在于，所述光子裸芯片直接贴装于所述电路板，或，所述光子裸芯片通过衬底贴装于所述电路板。
  6. 如权利要求1所述的芯片封装体，其特征在于，所述透明绝缘封装胶体与所述窗口对应的外壁表面为平面。
  7. 如权利要求1所述的芯片封装体，其特征在于，在所述透明绝缘封装胶体与所述窗口对应的外壁表面设置有光学整形部，以对用于出射所述窗口的光束进行整形。
  8. 如权利要求7所述的芯片封装体，其特征在于，所述光学整形部为凸部，所述凸部用于沿快轴和/或慢轴方向对出射所述窗口的光束进行准直。
  9. 如权利要求1至8任一项所述的芯片封装体，其特征在于，所述透明绝缘封装胶体的透光率大于95％。
  10. 如权利要求1至8任一项所述的芯片封装体，其特征在于，所述透明绝缘封装胶体的材质为环氧树脂、硅胶和热固性塑料中的一种。
  11. 一种感光模组，其特征在于，包括如权利要求1至6任一项所述的芯片封装体，所述芯片封装体的光子裸芯片为感光芯片。
  12. 一种激光发射模组，其特征在于，包括如权利要求1至10任一项所述的芯片封装体，所述芯片封装体的光子裸芯片为激光器裸芯片。
  13. 一种激光雷达，其特征在于，包括如权利要求12所述的激光发射模组。
PCT/CN2023/092863 2022-06-13 2023-05-09 一种芯片封装体、感光模组、激光发射模组和激光雷达 WO2023241265A1 (zh)

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