WO2023237571A1 - Composition comprenant deux tensioactifs différents - Google Patents
Composition comprenant deux tensioactifs différents Download PDFInfo
- Publication number
- WO2023237571A1 WO2023237571A1 PCT/EP2023/065159 EP2023065159W WO2023237571A1 WO 2023237571 A1 WO2023237571 A1 WO 2023237571A1 EP 2023065159 W EP2023065159 W EP 2023065159W WO 2023237571 A1 WO2023237571 A1 WO 2023237571A1
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- WO
- WIPO (PCT)
- Prior art keywords
- surfactant
- alkali
- mass
- group
- composition
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 162
- 239000004094 surface-active agent Substances 0.000 title claims description 142
- 239000002195 soluble material Substances 0.000 claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims description 75
- 239000003086 colorant Substances 0.000 claims description 61
- 239000011248 coating agent Substances 0.000 claims description 53
- 238000000576 coating method Methods 0.000 claims description 53
- 150000001875 compounds Chemical class 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 28
- 239000002904 solvent Substances 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 230000002940 repellent Effects 0.000 claims description 2
- 239000005871 repellent Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 137
- -1 acryloyloxy group Chemical group 0.000 description 103
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 42
- 239000002253 acid Substances 0.000 description 42
- 239000000976 ink Substances 0.000 description 39
- 239000000049 pigment Substances 0.000 description 30
- 239000003921 oil Substances 0.000 description 25
- 229920000058 polyacrylate Polymers 0.000 description 25
- 229920001296 polysiloxane Polymers 0.000 description 22
- 239000007864 aqueous solution Substances 0.000 description 20
- 238000004090 dissolution Methods 0.000 description 20
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 19
- 239000011737 fluorine Substances 0.000 description 18
- 229910052731 fluorine Inorganic materials 0.000 description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 17
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 238000011161 development Methods 0.000 description 16
- 239000000178 monomer Substances 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 15
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 15
- 230000018109 developmental process Effects 0.000 description 15
- 239000003505 polymerization initiator Substances 0.000 description 14
- 125000000217 alkyl group Chemical group 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- 239000002736 nonionic surfactant Substances 0.000 description 13
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 239000000654 additive Substances 0.000 description 11
- 230000000996 additive effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- 150000002148 esters Chemical class 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 9
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- 239000003513 alkali Substances 0.000 description 7
- 239000002280 amphoteric surfactant Substances 0.000 description 7
- 239000003945 anionic surfactant Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 125000001424 substituent group Chemical group 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000004971 Cross linker Substances 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical group [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 5
- 229910018828 PO3H2 Inorganic materials 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- 125000005370 alkoxysilyl group Chemical group 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 150000003983 crown ethers Chemical class 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 5
- 238000010494 dissociation reaction Methods 0.000 description 5
- 230000005593 dissociations Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 235000019239 indanthrene blue RS Nutrition 0.000 description 5
- 125000004430 oxygen atom Chemical group O* 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- 229910004727 OSO3H Inorganic materials 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000003623 enhancer Substances 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 125000005372 silanol group Chemical group 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 125000004018 acid anhydride group Chemical group 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 150000005215 alkyl ethers Chemical class 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 3
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 125000005375 organosiloxane group Chemical group 0.000 description 3
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 3
- 239000002096 quantum dot Substances 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229930195734 saturated hydrocarbon Natural products 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 150000003573 thiols Chemical class 0.000 description 3
- AICIYIDUYNFPRY-UHFFFAOYSA-N 1,3-dihydro-2H-imidazol-2-one Chemical compound O=C1NC=CN1 AICIYIDUYNFPRY-UHFFFAOYSA-N 0.000 description 2
- SILNNFMWIMZVEQ-UHFFFAOYSA-N 1,3-dihydrobenzimidazol-2-one Chemical compound C1=CC=C2NC(O)=NC2=C1 SILNNFMWIMZVEQ-UHFFFAOYSA-N 0.000 description 2
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 2
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 2
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 2
- RHNJVKIVSXGYBD-UHFFFAOYSA-N 10-prop-2-enoyloxydecyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCCOC(=O)C=C RHNJVKIVSXGYBD-UHFFFAOYSA-N 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- VFTFKUDGYRBSAL-UHFFFAOYSA-N 15-crown-5 Chemical compound C1COCCOCCOCCOCCO1 VFTFKUDGYRBSAL-UHFFFAOYSA-N 0.000 description 2
- XEZNGIUYQVAUSS-UHFFFAOYSA-N 18-crown-6 Chemical compound C1COCCOCCOCCOCCOCCO1 XEZNGIUYQVAUSS-UHFFFAOYSA-N 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 2
- DEPDDPLQZYCHOH-UHFFFAOYSA-N 1h-imidazol-2-amine Chemical compound NC1=NC=CN1 DEPDDPLQZYCHOH-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 2
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 2
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 2
- 150000001253 acrylic acids Chemical class 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 125000005577 anthracene group Chemical group 0.000 description 2
- MYONAGGJKCJOBT-UHFFFAOYSA-N benzimidazol-2-one Chemical compound C1=CC=CC2=NC(=O)N=C21 MYONAGGJKCJOBT-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- PPSZHCXTGRHULJ-UHFFFAOYSA-N dioxazine Chemical compound O1ON=CC=C1 PPSZHCXTGRHULJ-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- UHOKSCJSTAHBSO-UHFFFAOYSA-N indanthrone blue Chemical compound C1=CC=C2C(=O)C3=CC=C4NC5=C6C(=O)C7=CC=CC=C7C(=O)C6=CC=C5NC4=C3C(=O)C2=C1 UHOKSCJSTAHBSO-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 2
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 2
- 238000000424 optical density measurement Methods 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229950000688 phenothiazine Drugs 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- OKYDCMQQLGECPI-UHFFFAOYSA-N thiopyrylium Chemical class C1=CC=[S+]C=C1 OKYDCMQQLGECPI-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- OXFSTTJBVAAALW-UHFFFAOYSA-N 1,3-dihydroimidazole-2-thione Chemical compound SC1=NC=CN1 OXFSTTJBVAAALW-UHFFFAOYSA-N 0.000 description 1
- QKLPIYTUUFFRLV-YTEMWHBBSA-N 1,4-bis[(e)-2-(2-methylphenyl)ethenyl]benzene Chemical compound CC1=CC=CC=C1\C=C\C(C=C1)=CC=C1\C=C\C1=CC=CC=C1C QKLPIYTUUFFRLV-YTEMWHBBSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- TZMSYXZUNZXBOL-UHFFFAOYSA-N 10H-phenoxazine Chemical compound C1=CC=C2NC3=CC=CC=C3OC2=C1 TZMSYXZUNZXBOL-UHFFFAOYSA-N 0.000 description 1
- XQQZRZQVBFHBHL-UHFFFAOYSA-N 12-crown-4 Chemical compound C1COCCOCCOCCO1 XQQZRZQVBFHBHL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- KNWQKDWAKRSKIF-UHFFFAOYSA-N 2-(1h-benzimidazol-2-yl)ethanol Chemical compound C1=CC=C2NC(CCO)=NC2=C1 KNWQKDWAKRSKIF-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- LPYUENQFPVNPHY-UHFFFAOYSA-N 3-methoxycatechol Chemical compound COC1=CC=CC(O)=C1O LPYUENQFPVNPHY-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- ZSSJQYMNCUJSBR-UHFFFAOYSA-N 4,5-dimethoxy-1,3-bis(methoxymethyl)imidazolidin-2-one Chemical compound COCN1C(OC)C(OC)N(COC)C1=O ZSSJQYMNCUJSBR-UHFFFAOYSA-N 0.000 description 1
- REHISTNPTFCXKS-UHFFFAOYSA-N 4-[2-[3-(iodomethyl)pyridin-2-yl]ethenyl]-n,n-dimethylaniline Chemical compound C1=CC(N(C)C)=CC=C1C=CC1=NC=CC=C1CI REHISTNPTFCXKS-UHFFFAOYSA-N 0.000 description 1
- LJMMZIHDOKOJCM-UHFFFAOYSA-N 4-[2-[4-(2-iodoethyl)-1,3-benzothiazol-2-yl]ethenyl]-n,n-dimethylaniline Chemical compound C1=CC(N(C)C)=CC=C1C=CC1=NC2=C(CCI)C=CC=C2S1 LJMMZIHDOKOJCM-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 description 1
- CDSULTPOCMWJCM-UHFFFAOYSA-N 4h-chromene-2,3-dione Chemical compound C1=CC=C2OC(=O)C(=O)CC2=C1 CDSULTPOCMWJCM-UHFFFAOYSA-N 0.000 description 1
- QXAMGWKESXGGNV-UHFFFAOYSA-N 7-(diethylamino)-1-benzopyran-2-one Chemical compound C1=CC(=O)OC2=CC(N(CC)CC)=CC=C21 QXAMGWKESXGGNV-UHFFFAOYSA-N 0.000 description 1
- QZXAEJGHNXJTSE-UHFFFAOYSA-N 7-(ethylamino)-4,6-dimethylchromen-2-one Chemical compound O1C(=O)C=C(C)C2=C1C=C(NCC)C(C)=C2 QZXAEJGHNXJTSE-UHFFFAOYSA-N 0.000 description 1
- NRZJOTSUPLCYDJ-UHFFFAOYSA-N 7-(ethylamino)-6-methyl-4-(trifluoromethyl)chromen-2-one Chemical compound O1C(=O)C=C(C(F)(F)F)C2=C1C=C(NCC)C(C)=C2 NRZJOTSUPLCYDJ-UHFFFAOYSA-N 0.000 description 1
- JBNOVHJXQSHGRL-UHFFFAOYSA-N 7-amino-4-(trifluoromethyl)coumarin Chemical compound FC(F)(F)C1=CC(=O)OC2=CC(N)=CC=C21 JBNOVHJXQSHGRL-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 238000012648 alternating copolymerization Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- FLPKSBDJMLUTEX-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) 2-butyl-2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]propanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)(CCCC)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 FLPKSBDJMLUTEX-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- ZPEIMTDSQAKGNT-UHFFFAOYSA-N chlorpromazine Chemical compound C1=C(Cl)C=C2N(CCCN(C)C)C3=CC=CC=C3SC2=C1 ZPEIMTDSQAKGNT-UHFFFAOYSA-N 0.000 description 1
- 229960001076 chlorpromazine Drugs 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- GLNDAGDHSLMOKX-UHFFFAOYSA-N coumarin 120 Chemical compound C1=C(N)C=CC2=C1OC(=O)C=C2C GLNDAGDHSLMOKX-UHFFFAOYSA-N 0.000 description 1
- KDTAEYOYAZPLIC-UHFFFAOYSA-N coumarin 152 Chemical compound FC(F)(F)C1=CC(=O)OC2=CC(N(C)C)=CC=C21 KDTAEYOYAZPLIC-UHFFFAOYSA-N 0.000 description 1
- AFYCEAFSNDLKSX-UHFFFAOYSA-N coumarin 460 Chemical compound CC1=CC(=O)OC2=CC(N(CC)CC)=CC=C21 AFYCEAFSNDLKSX-UHFFFAOYSA-N 0.000 description 1
- UIMOXRDVWDLOHW-UHFFFAOYSA-N coumarin 481 Chemical compound FC(F)(F)C1=CC(=O)OC2=CC(N(CC)CC)=CC=C21 UIMOXRDVWDLOHW-UHFFFAOYSA-N 0.000 description 1
- GZTMNDOZYLMFQE-UHFFFAOYSA-N coumarin 500 Chemical compound FC(F)(F)C1=CC(=O)OC2=CC(NCC)=CC=C21 GZTMNDOZYLMFQE-UHFFFAOYSA-N 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- QSBFECWPKSRWNM-UHFFFAOYSA-N dibenzo-15-crown-5 Chemical compound O1CCOCCOC2=CC=CC=C2OCCOC2=CC=CC=C21 QSBFECWPKSRWNM-UHFFFAOYSA-N 0.000 description 1
- YSSSPARMOAYJTE-UHFFFAOYSA-N dibenzo-18-crown-6 Chemical compound O1CCOCCOC2=CC=CC=C2OCCOCCOC2=CC=CC=C21 YSSSPARMOAYJTE-UHFFFAOYSA-N 0.000 description 1
- JKCQOMAQPUYHPL-UHFFFAOYSA-N dibenzo-21-crown-7 Chemical compound O1CCOCCOCCOC2=CC=CC=C2OCCOCCOC2=CC=CC=C21 JKCQOMAQPUYHPL-UHFFFAOYSA-N 0.000 description 1
- BBGKDYHZQOSNMU-UHFFFAOYSA-N dicyclohexano-18-crown-6 Chemical compound O1CCOCCOC2CCCCC2OCCOCCOC2CCCCC21 BBGKDYHZQOSNMU-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- NZZFYRREKKOMAT-UHFFFAOYSA-N diiodomethane Chemical compound ICI NZZFYRREKKOMAT-UHFFFAOYSA-N 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- UWLPCYBIJSLGQO-UHFFFAOYSA-N dodecanoic acid;propane-1,2,3-triol Chemical compound OCC(O)CO.CCCCCCCCCCCC(O)=O UWLPCYBIJSLGQO-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 125000004407 fluoroaryl group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000004170 methylsulfonyl group Chemical group [H]C([H])([H])S(*)(=O)=O 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SQDFHQJTAWCFIB-UHFFFAOYSA-N n-methylidenehydroxylamine Chemical compound ON=C SQDFHQJTAWCFIB-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002991 phenoxazines Chemical class 0.000 description 1
- 230000001443 photoexcitation Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical class C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000000411 transmission spectrum Methods 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/41—Organic pigments; Organic dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/45—Anti-settling agents
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
Definitions
- the present invention relates to a composition containing an alkali-soluble material.
- the present invention also relates to a method for manufacturing a cured film using the same, a cured film formed therefrom, a light conversion device comprising the cured film, and a display device comprising the light conversion device.
- Black matrices for color filters used in color display devices are formed by mixing a light shielding black pigment such as carbon black with an alkali- soluble resin to form a resist composition, which is then coated, and the coated film is exposed, developed and patterned.
- Black matrices are used, for example, in a liquid crystal display device to prevent light leakage from non-switching pixels and maintain high contrast. Since amorphous silicon and oxide semiconductors generate leakage current due to photoexcitation when exposed to light, the black matrix layer suppresses the leakage current by blocking the light to the thin film transistor portion (Patent Document 1 ).
- compositions capable of forming a cured film that exhibits oil repellency at its upper part and lipophilicity at its lower part to provide a patternable composition for forming a bank that exhibits oil repellency at the top of the bank and lipophilicity at the bottom of the bank; to provide a patternable composition that preferably exhibits, after bank formation, oil repellency at the top of the bank and lipophilicity at the opening and the side of the bank; to provide a bank that exhibits lipophilicity to ink at the opening of the bank, preferably allows ink to be filled without any gap at the opening of the bank, and exhibits lipophilicity to ink at the top of the bank, preferably repels ink appropriately at the top of the bank, and/or to provide a patternable composition for forming the above bank, wherein preferably, the above ink is a quantum dot-containing ink, more preferably the above ink is an acrylic monomer-containing ink, further preferably the above ink is solvent-free; to provide a patternable
- composition comprising:
- the present invention relates to a method for manufacturing a cured film comprising: a step of applying the above composition above a substrate to form a coating film; and a step of heating the coating film.
- the present invention relates to a cured film produced or capable of being produced by the above method.
- the present invention relates to a cured film comprising: a polymer (A) derived from an alkali-soluble material; a first surfactant; and a second surfactant different from the first surfactant.
- the present invention relates to a light conversion device comprising the above cured film.
- the present invention relates to a display device comprising the above cured film or the above light conversion device.
- compositions capable of forming a cured film that exhibits oil repellency at its upper part and lipophilicity at its lower part to provide a patternable composition for forming a bank that exhibits oil repellency at the top of the bank and lipophilicity at the bottom of the bank; to provide a patternable composition that preferably exhibits, after bank formation, oil repellency at the top of the bank and lipophilicity at the opening and the side of the bank; to provide a bank that exhibits lipophilicity to ink at the opening of the bank, preferably allows ink to be filled without any gap at the opening of the bank, and exhibits lipophilicity to ink at the top of the bank, preferably repels ink appropriately at the top of the bank, and/or to provide a patternable composition for forming the above bank, wherein preferably, the above ink is a quantum dot-containing ink, more preferably the above ink is an acrylic monomer-containing ink, further preferably the above ink is solvent-free; to provide a patternable
- an element of a concept can be expressed by a plurality of species, and when the amount (for example, mass % or mol %) is described, it means sum of the plurality of species. “And/or” includes a combination of all elements and also includes single use of the element.
- the (meth)acrylate means acrylate, methacrylate, or a mixture of acrylate and methacrylate according to common general technical knowledge.
- the monomer means a monomeric substance, and refers to a substance that can form a polymer (including an oligomer) by reacting with another monomer.
- the polymer may be in the form of an oligomer, and the mass average molecular weight of the polymer is not particularly limited, but is preferably 1 ,000 to 100,000, more preferably 2,000 to 30,000.
- the mass average molecular weight is a mass average molecular weight in terms of styrene obtained by the gel permeation chromatography.
- the alkyl means a group obtained by removing any one hydrogen from a linear or branched, saturated hydrocarbon and includes a linear alkyl and branched alkyl
- the cycloalkyl means a group obtained by removing one hydrogen from a saturated hydrocarbon comprising a cyclic structure and optionally includes a linear or branched alkyl in the cyclic structure as a side chain.
- the aryl means a group obtained by removing any one hydrogen from an aromatic hydrocarbon.
- the alkylene means a group obtained by removing any two hydrogens from a linear or branched, saturated hydrocarbon.
- the arylene means a hydrocarbon group obtained by removing any two hydrogens from an aromatic hydrocarbon.
- Ci- 6 alkyl means alkyl having 1 or more and 6 or less carbons (methyl, ethyl, propyl, butyl, pentyl, hexyl etc.).
- the fluoroalkyl used in the present specification refers to alkyl in which one or more hydrogen atoms are replaced with fluorine
- the fluoroaryl refers to aryl in which one or more hydrogen atoms are replaced with fluorine.
- these repeating units copolymerize.
- These copolymerization may be any of alternating copolymerization, random copolymerization, block copolymerization, graft copolymerization, or a mixture thereof.
- % means mass %
- ratio means mass ratio
- Celsius is used as the temperature unit.
- 20 degrees means 20 degrees Celsius.
- the additive refers to a compound itself having a function thereof (for example, in the case of a base generator, a compound itself that generates a base).
- a compound itself having a function thereof (for example, in the case of a base generator, a compound itself that generates a base).
- An embodiment in which the compound is dissolved or dispersed in a solvent and added to a composition is also possible.
- it is preferable that such a solvent is contained in the composition according to the present invention as the solvent (VI) or another component.
- composition according to the present invention comprises:
- the present invention essentially consists of (I) an alkali-soluble material, (II) a first surfactant, and (III) a second surfactant different from the first surfactant, and in another embodiment of the present invention, the present invention consists of (I) an alkali-soluble material, (II) a first surfactant, and (III) a second surfactant different from the first surfactant.
- composition according to the present invention is preferably a film forming composition, more preferably a cured film forming composition.
- composition according to the present invention is preferably a photosensitive composition, more preferably a negative type photosensitive composition.
- composition according to the present invention further comprises:
- a coloring agent preferably organic coloring agent and/or inorganic coloring agent, more preferably organic and/or inorganic black coloring agent
- composition according to the present invention exhibits a better effect when forming a film of 100 pm or less, and is preferably a negative type photosensitive composition for thick film, which exhibits a greater effect when forming a thick film.
- composition according to the present invention comprises an alkali- soluble material.
- the alkali-soluble material is an alkali-soluble monomer, an alkali-soluble polymer, or a mixture thereof.
- the alkali-soluble material preferably has a partial structure with an acid group.
- the acid group is preferably an acid group having an acid dissociation index (pKa) of 7 or less, more preferably -OH, -COOH, -SOsH, -OSOsH, -PO3H2, -OPO3H2, -CONHSO2 and -SO2NHSO2-, and -COOH is particularly preferred.
- pKa acid dissociation index
- Having an acid group, preferably a carboxy group can effectively improve the solubility of the alkali-soluble material in a low- concentration developer.
- the alkali-soluble monomer is a compound containing, preferably one or more, more preferably two or more (meth)acryloyloxy groups.
- the alkali- soluble material is a compound containing two or more (meth)acryloyloxy groups and/or an alkali-soluble polymer.
- the alkali-soluble material comprises a compound containing two or more (meth)acryloyloxy groups, and further preferably further comprises an alkali-soluble polymer.
- a compound containing two or more (meth)acryloyloxy groups is hereinafter sometimes referred to as the (meth)acryloyloxy group-containing compound for the sake of simplicity.
- the (meth)acryloyloxy group is a general term for an acryloyloxy group and a methacryloyloxy group.
- This compound is a compound capable of forming a crosslinked structure by reacting with an acryloyl group-containing compound, an alkali-soluble polymer, or the like.
- a compound containing two or more acryloyloxy groups or methacryloyloxy groups that are reactive groups is required, and in order to form a higher-order crosslinked structure, three or more acryloyloxy groups or methacryloyloxy groups are preferably contained.
- esters obtained by reacting (a) a polyol compound having two or more hydroxyl groups and ([3) two or more (meth)acrylic acids are preferably used.
- a polyol compound (a) a compound that has a saturated or unsaturated aliphatic hydrocarbon, an aromatic hydrocarbon, a heterocyclic hydrocarbon, a primary, secondary or tertiary amine, an ether, or the like as a basic skeleton, and two or more hydroxyl groups as a substituent is included.
- This polyol compound may contain other substituents such as a carboxy group, a carbonyl group, an amino group, an ether bond, a thiol group, a thioether bond, etc., in such a range that is not detrimental to the effect of the present invention.
- Preferred polyol compounds include alkylpolyol, arylpolyol, polyalkanolamine, cyanuric acid, dipentaerythritol, or the like.
- the polyol compound (a) has 3 or more hydroxyl groups, not all the hydroxyl groups need to be reacted with (meth)acrylic acid and may be partially esterified. That is, these esters may have unreacted hydroxyl groups.
- esters include tris(2-acryloxyethyl) isocyanurate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, polytetramethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, ditrimethylolpropane tetraacrylate, tricyclodecane dimethanol diacrylate, 1 ,9-nonanediol diacrylate, 1 ,6-hexanediol diacrylate, 1 ,10-decanediol diacrylate, and the like.
- tris(2-acryloxyethyl) isocyanurate and dipentaerythritol hexaacrylate are preferred from the viewpoint of reactivity and the number of crosslinkable groups.
- Two or more types of these compounds can be combined in order to adjust the shape of the pattern to be formed.
- such a compound is preferably a molecule that is relatively smaller than the alkali-soluble polymer.
- the molecular weight thereof is preferably 2,000 or less, more preferably 1 ,500 or less.
- the content of the (meth)acryloyloxy group-containing compound is adjusted depending on the type of the polymer and acryloyloxy group- containing compound used, etc., but it is preferably 5 to 99.9 mass %, more preferably 30 to 70 mass %, based on the total mass of the composition excluding the solvent.
- it is preferably 5 to 1 ,000 mass %, more preferably 10 to 800 mass %, based on the total mass of the alkali-soluble polymer.
- a low-concentration developer it is preferably 30 to 800 mass %.
- the (meth)acryloyloxy group-containing compound may be used alone or in combination of two or more.
- PGMEA propylene glycol monomethyl ether acetate
- the alkali-soluble polymer has a structural portion having an acid group, and is more preferably a polymer obtained by copolymerizing the structural portion having an acid group and a structural portion having no acid group.
- the acid group is preferably an acid group having an acid dissociation index (pKa) of 7 or less, more preferably -OH, -COOH, -SOsH, -OSO3H, - PO3H2, -OPO3H2, -CONHSO2 and -SO2NHSO2-, and -COOH is particularly preferred.
- pKa acid dissociation index
- Having an acid group, preferably a carboxy group can effectively improve the solubility of the alkali-soluble material in a low- concentration developer.
- the alkali-soluble polymer (which may be in the form of an oligomer) used in the present invention preferably comprises an acryloyl group.
- the alkali-soluble polymer consists of (meth)acrylic polymer, siloxane polymer, siloxane (meth)acrylic polymer, or a mixture thereof, and the alkali-soluble polymer used in the present invention is not particularly limited, but is preferably selected from polysiloxane containing siloxane bonds in the main skeleton, and (meth)acrylic polymer.
- Acrylic polymer is more preferred.
- the alkali dissolution rate of an alkali-soluble polymer is measured and calculated as follows, using a 0.03 mass % KOH (potassium hydroxide) aqueous solution as the alkali solution.
- the alkali-soluble polymer is diluted with PGMEA to become 35 mass %, and dissolved at room temperature with stirring for 1 hour using a stirrer.
- 1cc of the prepared alkali-soluble polymer solution is dropped onto the center portion of a silicon wafer (4-inch and thickness: 525 pm) using a pipette and spin-coated to become a thickness of 2 ⁇ 0.1 pm, followed by heating on a hot plate at 100°C for 90 seconds to remove the solvent.
- the film thickness of the coating film is measured with a spectroscopic ellipsometer (J. A. Woollam).
- the silicon wafer having this film is gently immersed in a 6- inch diameter glass petri dish containing 100 ml of a 0.03 mass % KOH aqueous solution adjusted to 23.0 ⁇ 0.1 °C, it is left to stand, and the time until the coating film disappears is measured.
- the dissolution rate is obtained by dividing by the time required for the film at 10 mm inside from the edge of the wafer to disappear.
- the dissolution rate is remarkably slow, after the wafer is immersed in a KOH aqueous solution for a certain period of time, the film thickness is measured, and the dissolution rate is calculated by dividing the amount of change in film thickness before and after the immersion by the immersion time.
- the above measurement method is performed 5 times, and the average of the obtained values is taken as the dissolution rate of the alkali-soluble polymer.
- the alkali-soluble polymer is referred to one in which the coating film at 10 mm inside from the edge of the wafer dissolves and disappears in a 0.03 mass % KOH aqueous solution within 10 minutes in the above measurement and calculation of the alkali dissolution rate.
- the alkali-soluble polymer may contain a siloxane (Si-O-Si) bond as its main skeleton.
- a polymer containing siloxane bonds as a main skeleton is referred to as polysiloxane.
- the skeleton structure of a polysiloxane can be classified into a silicone skeleton (the number of oxygen atoms bonded to a silicon atom is 2), a silsesquioxane skeleton (the number of oxygen atoms bonded to a silicon atom is 3), and a silica skeleton (the number of oxygen atoms bonded to a silicon atom is 4).
- the polysiloxane molecule may contain a plurality of combinations of any of these skeleton structures.
- the polysiloxane used in the present invention contains a silsesquioxane skeleton.
- a polysiloxane generally has a silanol group or an alkoxysilyl group.
- a silanol group and alkoxysilyl group mean a hydroxyl group and alkoxy group directly bonded to a silicon forming the siloxane skeleton.
- the silanol group and the alkoxysilyl group can be thought that they have the effect of promoting the curing reaction when forming a cured film using the composition and also contribute to the reaction with the silicon-containing compound described later. For this reason, it is preferable that polysiloxane has these groups.
- the acrylic polymer suitably used in the present invention can be selected from generally used acrylic polymer, such as polyacrylic acid, polymethacrylic acid, polyalkyl acrylate and polyalkyl methacrylate.
- the acrylic polymer used in the present invention preferably contains a repeating unit containing an acryloyl group, and preferably the acrylic polymer has a structural portion having an acid group.
- the acid group is preferably an acid group having an acid dissociation index (pKa) of 7 or less, more preferably -OH, -COOH, -SOsH, -OSO3H, - PO3H2, -OPO3H2, -CONHSO2 and -SO2NHSO2-, and -COOH is particularly preferred.
- pKa acid dissociation index
- Having an acid group, preferably a carboxy group can effectively improve the solubility of the alkali-soluble material in a low- concentration developer.
- the polymerization unit containing an acid group (for example, carboxyl group, etc.) is not particularly limited as long as it is a polymerization unit containing an acid group in its side chain, but polymerization units, which are derived from an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride or a mixture thereof, are preferred.
- the polymerization unit containing an alkoxysilyl group may be a polymerization unit containing an alkoxysilyl group in its side chain, but polymerization units derived from a monomer represented by the following formula (B) is preferable:
- X B (CH2)a-Si(OR B )b(CH 3 )3-b (B)
- X B is a vinyl group, a styryl group or a (meth)acryloyloxy group
- R B is a methyl group or an ethyl group
- a is an integer of 0 to 3
- b is an integer of 1 to 3.
- the polymer preferably contains a polymerization unit containing a hydroxyl group derived from a hydroxyl group-containing unsaturated monomer.
- the mass average molecular weight of the alkali-soluble polymer according to the present invention which is preferably an acrylic polymer, is not particularly limited, but is preferably 1 ,000 to 40,000, more preferably 2,000 to 30,000.
- the mass average molecular weight is a mass average molecular weight in terms of styrene obtained by gel permeation chromatography.
- the solid content acid value is usually 40 to 190 mgKOH/g, more preferably 60 to 150 mgKOH/g.
- the composition according to the present invention is a photosensitive composition
- a cured film is formed on a substrate through coating, exposure and development.
- the coating film in the unexposed areas should have a certain level of solubility in the developer.
- the dissolution rate of the coating film in a 2.38 mass % KOH aqueous solution hereinafter sometimes referred to as alkali dissolution rate or ADR, and details is described later
- ADR alkali dissolution rate
- the alkali-soluble polymer should be appropriately selected according to the development conditions.
- the dissolution rate in a 2.38 mass % KOH aqueous solution is preferably 50 to 20,000 A/sec, more preferably 100 to 10,000 A/sec.
- polysiloxane and acrylic polymer used in the present invention are not particularly limited, and for example, the polysiloxane and acrylic polymer, etc. described in WO2021/018927A1 can be suitably used.
- the alkali-soluble polymer may be one or a mixture of two or more. Combinations of acrylic polymer and polysiloxane, two or more types of acrylic polymer, two or more types of polysiloxane, etc. can also be used.
- the alkali-soluble polymer used in the present invention is one or a mixture of two or more acrylic polymer, more preferably two acrylic polymer. More preferably, as the alkali-soluble polymer, it is desirable to select two types of acrylic polymer such that dissolves in an organic solvent such as PGMEA, exhibits water solubility, and dissolves in an alkaline developer before exposure. Further preferably, the two types of acrylic polymer each has a structural portion having an acid group and is more preferably a polymer obtained by copolymerizing a structural portion having an acid group and a structural portion having no acid group.
- the acid group is preferably an acid group having an acid dissociation index (pKa) of 7 or less, more preferably -OH, -COOH, -SOsH, -OSO3H, - PO3H2, -OPO3H2, -CONHSO2 and -SO2NHSO2-, and -COOH is particularly preferred.
- pKa acid dissociation index
- the total content of the alkali-soluble material (I) in the composition is preferably 5 to 99.9 mass %, more preferably 70 to 90 mass %, based on the total mass of the composition excluding the solvent.
- the composition according to the present invention comprises a first surfactant (II).
- the first surfactant (II) is not particularly limited as long as it achieves at least one or more of the effects of the present invention, but from the viewpoint of enabling to provide a composition that exhibits lipophilicity at least in the lower part of the film formed, preferably to provide a composition that exhibits lipophilicity at least at the bottom of the bank or the bottom of the bank and the bank side of the opening and is capable of being patterned
- the first surfactant (II) is preferably a surfactant that exhibits lipophilicity, further preferably a fluorine-free surfactant, more preferably a fluorine-free nonionic surfactant, anionic surfactant or amphoteric surfactant, or mixtures thereof.
- the first surfactant (II) is a fluorine-free nonionic surfactant, more preferably the first surfactant (II) is polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene oleyl ether and polyoxyethylene cetyl ether, polyoxyethylene fatty acid diesters, polyoxyethylene fatty acid monoesters, polyoxyethylene polyoxypyropyrene block polymer, acetylene alcohols, acetylene glycols, polyethoxylates of acetylene alcohol, acetylene glycol derivatives such as polyethoxylates of acetylene glycol, organosiloxane surfactants, silicon-based surfactants, or mixtures
- the surfactant that exhibits lipophilicity can be suitably selected from known and available materials.
- silicon-based surfactants manufactured by DIC Corporation, SOILNON AF-800 (Nicca Chemical), Glide ZG400 (Evonik Industries), AKS-10 (Shin-Etsu Chemical), and the like can be suitably used.
- bank means a partition wall or a black matrix that is arranged between display pixels of an optical display device and divides the display pixels and means, for example, banks and black matrices as described in JP-A 2021-075660, WO2017-138607A1 , and JP-A 2018-203599.
- the composition according to the present invention comprises a second surfactant (III).
- the second surfactant (III) is not particularly limited as long as it achieves at least one or more of the effects of the present invention, but from the viewpoint of providing a composition that exhibits oil repellency at the upper part of the formed film, and preferably a patternable composition that exhibits oil repellency at the top of the bank, the second surfactant (III) is preferably a surfactant that exhibits oil repellency, more preferably a fluorosurfactant or a fluorine-containing surfactant, and from the viewpoint of better oil repellency, a fluorine- containing surfactant is further preferable.
- a fluorine-containing nonionic surfactant is preferred, particularly, preferred is a fluorine-containing nonionic surfactant, anionic surfactant or amphoteric surfactant, or mixtures thereof.
- the surfactant that exhibits oil repellency can be suitably selected from known and available materials.
- fluorine-containing surfactants manufactured by Daikin Industries, Ltd. and Surfion (AGC Seimi Chemical Co., Ltd.) which is a surfactant having a perfluoroalkyl group, and the like can be suitably used.
- the second surfactant (III) is preferably a fluorine-containing nonionic surfactant.
- the molecular weight of the second surfactant (III) may be lower than that of the first surfactant (II) or the alkali-soluble polymer (I).
- the composition according to the present invention comprises a first surfactant (II) and a second surfactant (III), wherein the first surfactant (II) and the second surfactant (III) are not particularly limited as long as they achieve at least one or more of the effects of the present invention, but it is characterized in that from the viewpoint of providing a patternable composition that exhibits lipophilicity at least at the bottom of the bank or the bottom of the bank and bank side of the opening and exhibits oil repellency at the top portion of the bank, the first surfactant (II) is preferably a fluorine-free surfactant, preferably a fluorine-free nonionic surfactant, anionic surfactant or amphoteric surfactant, or mixtures thereof, the second surfactant (III) is a fluorine-containing surfactant, preferably a fluorine-containing nonionic surfactant, anionic surfactant, amphoteric surfactant or a mixture thereof.
- the first surfactant (II) is
- oil repellency reveals at the upper part (the top of the bank when the bank is formed) and lipophilicity reveals at the lower part (the bottom of the bank when the bank is formed).
- the first surfactant (II) is a fluorine-free nonionic surfactant, more preferably the first surfactant (II) is polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene oleyl ether and polyoxyethylene cetyl ether, polyoxyethylene fatty acid diesters, polyoxyethylene fatty acid monoesters, polyoxyethylene polyoxypyropyrene block polymer, acetylene alcohols, acetylene glycols, polyethoxylates of acetylene alcohol, acetylene glycol derivatives such as polyethoxylates of acetylene glycol,
- the second surfactant (III) is a fluorine-containing nonionic surfactant.
- the mass ratio of the first surfactant (II) to the second surfactant (III) is 1 : 1 ,000 to 99 : 10, more preferably 1 : 100 to 5 : 1 , further preferably 1 : 50 to 2 : 1 , most preferably 1 : 20 to 1 : 1 .
- composition capable of forming a bank that exhibits lipophilicity more effectively with respect to the QD ink at the bottom of the bank or the bottom of the bank and the bank side of the opening and exhibits oil repellency more effectively with respect to the QD ink at the top of the bank.
- the content of the first surfactant (II) is in the range of preferably 0.001 to 5 mass %, more preferably 0.01 to 1 mass %, further preferably 0.02 to 0.5 mass %, most preferably 0.03 to 0.3 mass %, based on the total mass of the alkali-soluble material.
- the content of the second surfactant (III) is in the range of preferably 0.05 to 10 mass %, more preferably 0.1 to 5 mass %, further preferably 0.2 to 1 mass %, most preferably 0.3 to 0.5 mass %, based on the total mass of the alkali-soluble material.
- the average film thickness is obtained by measuring a film thickness at 3 to 5 points with a stylus type surface profilometer manufactured by LILBAC, Inc. and taking the average value thereof.
- the viscosity of the composition according to the present invention is preferably 0.1 to 10,000 cP, more preferably 1 .0 to 8,000 cP. The viscosity is measured at 25°C with a rotational viscometer.
- the composition according to the present invention can comprise a coloring agent (IV).
- the coloring agent (IV) is an organic coloring agent and/or an inorganic coloring agent, more preferably an organic and/or inorganic black coloring agent, further preferably an organic black coloring agent, and further more preferably the coloring agent is a black coloring agent consisting of a mixture of two or more organic coloring agents, and further more preferably the coloring agent (IV) is a mixture of red and bluegreen organic coloring agents mixed to give a black color.
- black coloring agent used in the present invention is an organic coloring agent or pigment
- a black color material can be obtained by mixing each color of red, green, blue, etc.
- the organic coloring agent and pigment are selected from those having a structure of azo-based, phthalocyanine-based, quinacridone-based, benzimidazolone-based, isoindolinone-based, dioxazine-based, indanthrene-based, perylene-based, etc.
- Preferred pigment combination includes, for example, a combination of one or more selected from the group consisting of C.l. Pigment Orange 43, C.l. Pigment Orange 64 and C.l. Pigment Orange 72, with one or more selected from the group consisting of C.l. Pigment Blue 60, C.l. Pigment Green 7, C.l. Pigment Green 36 and C.l.
- Pigment Green 58 more preferably a combination of one selected from the group consisting of C.l. Pigment Orange 43, C.l. Pigment Orange 64 and C.l. Pigment Orange 72, with C.l. Pigment Blue 60. This combination may be further combined with other organic pigments.
- the content of the coloring agent (IV) is preferably 3 to 80 mass %, more preferably 5 to 50 mass %, based on the total mass of the alkali-soluble material.
- the content of the coloring agent is based on the mass of the pigment itself. In other words, there is also a case where the coloring agent is obtained in a dispersed state using a dispersant, but in this case, anything other than the pigment is not included in the mass of the coloring agent.
- the coloring agent used in the present invention can also be used in combination with a dispersant.
- a dispersant for example, an organic compound-based dispersant such as a polymer dispersant described in JP 2004-292672 A may be used.
- the composition according to the present invention can comprise a polymerization initiator.
- This polymerization initiator includes a polymerization initiator that generates an acid, base or radical by radiation and a polymerization initiator that generates an acid, base or radical by heat.
- the former is preferred in terms of process shortening and cost, and photoradical generators are more preferred.
- the photoradical generator can improve the resolution by strengthening the pattern shape and increasing the development contrast.
- the photoradical generator used in the present invention is a photoradical generator that releases radicals when irradiated with radiation. Examples of radiation include visible light, ultraviolet ray, infrared ray, X-ray, electron beam, a-ray, or y-ray.
- the optimum amount of the photoradical generator to be added varies depending on the type of the active substance generated by decomposition of the photoradical generator, the amount generated thereof, the required sensitivity, and the dissolution contrast between the exposed area and unexposed area, but it is preferably 0.001 to 50 mass %, more preferably 0.01 to 30 mass %, based on the total mass of the alkali-soluble polymer. If the amount added is less than 0.001 mass %, the dissolution contrast between the exposed area and the unexposed area is too low, the addition effect may not be obtained.
- the amount of the photoradical generator added is more than 50 mass %, cracks may occur in the formed film, and coloration due to decomposition of the photoradical generator may become remarkable, which may reduce the colorless transparency of the coating film. Further, if the amount added is too large, thermal decomposition of the photoradical generator may cause deterioration of the electrical insulation properties of the cured product and release of gas, which may cause problems in a subsequent process. Furthermore, the resistance of the coating film to a photoresist stripper containing monoethanolamine or the like as a main ingredient may be lowered.
- Examples of the photoradical generator include azo-based, peroxide- based, acylphosphine oxide-based, alkylphenone-based, oxime ester- based, and titanocene-based initiators.
- alkylphenone-based, acylphosphine oxide-based and oxime ester-based initiators are preferable, and examples thereof include 2,2-dimethoxy-1 ,2-diphenyl- ethan-1 -one, 1 - hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1 -phenylpropan-1 - one, 1 -[4-(2- hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1 -propan- 1-one, 2-hydroxy-1 - ⁇ 4-[4-(2-hydroxy-2-methyl- propionyl)benzyl]phenyl ⁇ -2- methylpropan-1 -one, 2-methyl-1 -(4-methylthiophenyl)-2-morpholinopropan
- the composition according to the present invention can comprise a solvent.
- the solvent is not particularly limited as long as it uniformly dissolves or disperses the alkali-soluble material, surfactant, and optionally added components.
- the solvent that can be used in the present invention include ethylene glycol monoalkyl ethers, such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monobutyl ether; diethylene glycol dialkyl ethers, such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl ether; ethylene glycol alkyl ether acetates, such as methyl cellosolve acetate and ethyl cellosolve acetate; propylene glycol monoalkyl ethers, such as propylene glycol monomethyl ether and propylene glycol monoethyl ether;
- propylene glycol alkyl ether acetates or esters, and alcohols having linear or branched alkyl groups with 4 or 5 carbon atoms are preferably used from the viewpoint of availability, ease of handling, solubility of alkali-soluble materials, etc.
- the solvent ratio of the alcohol is preferably 5 to 80%.
- the solvent content of the composition according to the present invention can be freely adjusted according to the method of applying the composition and the like.
- the proportion of the solvent in the composition may be 90 mass % or more.
- slit coating which is used for coating large substrates, it is usually 60 mass % or more, preferably 70 mass % or more.
- the properties of the compositions of the present invention do not vary greatly with the amount of solvent.
- the composition according to the present invention may, if necessary, comprise an additive (VII) other than the components described above.
- an additive is at least one of a developer dissolution accelerator, a scum remover, an adhesion enhancer, a polymerization inhibitor, an antifoaming agent, a third surfactant different from the first and second surfactants, a sensitizer, a crosslinker, a hardener, or a mixture thereof.
- a developer dissolution accelerator for example, 4-hydroxybutyl acrylate and the like can be suitably used.
- the content of the additive (VII) is preferably 5 mass % or less, more preferably 1 mass % or less. In a preferred embodiment, the additive (VII) is not contained in the composition, that is, the content thereof is 0 mass %.
- the scum remover is one that adjusts the solubility of the formed coating film in the developer, and also has a function to prevent scum from remaining on the substrate after development.
- a crown ether can be used as such an additive.
- One having the simplest structure as the crown ether is represented by the general formula (-CH2-CH2-O-)n. Among these, those in which n is 4 to 7 are preferred in the present invention.
- the crown ether is sometimes called x-crown-y-ether, where x is the total number of atoms composing the ring and y is the number of oxygen atoms contained therein.
- x is the total number of atoms composing the ring
- y is the number of oxygen atoms contained therein.
- Exemplified embodiments of more preferred crown ether are 21-crown-7-ether, 18- crown-6-ether, 15-crown-5-ether, 12-crown-4-ether, dibenzo-21-crown-7- ether, dibenzo-18-crown-6-ether, dibenzo-15-crown-5-ether, dibenzo-12- crown-4-ether, dicyclohexyl-21-crown-7-ether, dicyclohexyl-18-crown- 6- ether, dicyclohexyl-15-crown-5-ether, and dicyclo- hexyl-12-crown-4-ether.
- the present invention among these, those selected from 18-crown-6- ether and 15-crown-5-ether are most preferred. Its content is preferably 0.05 to 15 mass %, more preferably 0.1 to 10 mass %, based on the total mass of the alkali-soluble material.
- the adhesion enhancer has an effect of preventing peeling of the pattern due to stress applied after baking when a cured film is formed using the composition according to the present invention.
- imidazoles As the adhesion enhancer, imidazoles, silane coupling agents, and the like are preferable.
- imidazoles 2-hydroxy- benzimidazole, 2-hydroxyethylbenzimidazole, benzimidazole, 2-hydroxyimidazole, imidazole, 2-mercaptoimidazole, 2- aminoimidazole are preferred, and 2-hydroxybenzimidazole, benzimidazole, 2-hydroxyimidazole and imidazole are in particular preferably used.
- silane coupling agent ones known are suitably used, and examples thereof include epoxysilane coupling agents, aminosilane coupling agents, mercaptosilane coupling agents, and the like.
- 3- glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, N-2- (aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3- aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3- aminopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, 3- chloropropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3- isocyanatopropyltriethoxysilane, and the like are preferred. These can be used alone or in combination of a plurality of any of them, and
- a silane compound having an acid group, a siloxane compound, or the like can also be used as the silane coupling agent.
- the acid group include a carboxy group, an acid anhydride group, a phenolic hydroxyl group, and the like.
- a monobasic acid group such as a carboxyl group or a phenolic hydroxyl group
- silane coupling agent includes a compound represented by the formula (C):
- R 3 includes hydrocarbon groups such as alkyl groups, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n- butyl group, and the like.
- hydrocarbon groups such as alkyl groups, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n- butyl group, and the like.
- a plurality of R 3 is included, and each R 3 may be the same or different.
- Examples of X includes: those having an acid group such as phosphonium, borate, carboxy, phenol, peroxide, nitro, cyano, sulfo and alcohol group; as well as those in which these acid groups are protected by acetyl, aryl, amyl, benzyl, methoxym ethyl, mesyl, tolyl, trimethoxysilyl, triethoxysilyl, triisopropy Isily I , trityl group, or the like; and acid anhydride group.
- an acid group such as phosphonium, borate, carboxy, phenol, peroxide, nitro, cyano, sulfo and alcohol group
- acids groups are protected by acetyl, aryl, amyl, benzyl, methoxym ethyl, mesyl, tolyl, trimethoxysilyl, triethoxysilyl, triisopropy Isily I ,
- a methyl group as R 3 and a carboxylic acid anhydride group as X for example, acid anhydride group-containing silicone
- a compound represented by the following formula (X-12-967C (trade name, Shin-Etsu Chemical Co., Ltd.)) or polymer containing a structure corresponding thereto in the terminal or side chain of a silicon-containing polymer such as silicone is preferred.
- a compound obtained by imparting an acid group such as thiol, phosphonium, borate, carboxy, phenol, peroxide, nitro, cyano, and sulfo groups to the ends of dimethyl silicone is also preferred.
- Such a compound includes the compounds represented by the following formulae (X-22- 2290AS and X-22-1821 (both are trade names, Shin-Etsu Chemical Co., Ltd.)).
- the mass average molecular weight of the silane coupling agent is preferably 5,000 or less, more preferably 4,000 or less.
- the content of the silane coupling agent is preferably 0.01 to 15 mass % based on the total mass of the alkali-soluble polymer.
- nitrone, nitroxide radical, hydroquinone, catechol, phenothiazine, phenoxazines, hindered amine and their derivatives, as well as UV absorber can be added.
- methylhydroquinone, catechol, 4-t-butylcatechol, 3-m ethoxycatechol, phenothiazine, chlorpromazine, phenoxazine, TINUVIN 144, 292, 5100 (BASF) as the hindered amine, TINUVIN 326, 328, 384-2, 400, 477 (BASF) as the UV absorber are preferred.
- BASF hindered amine
- BASF BASF
- alcohols (C1 -is) higher fatty acids such as oleic acid and stearic acid, higher fatty acid esters such as glycerin monolaurate, polyethers such as polyethylene glycol (PEG) (Mn 200 to 10,000) and polypropylene glycol (PPG) (Mn 200 to 10,000), silicone compounds such as dimethyl silicone oil, alkyl-modified silicone oil and fluorosilicone oil, organic siloxane-based surfactants detailed below, and the like are included. These can be used alone or in combination of a plurality of any of them, and their content is preferably 0.1 to 3 mass % based on the total mass of the alkali-soluble material.
- a sensitizer can be added to the composition according to the present invention, if necessary.
- the sensitizer preferably used in the composition according to the present invention include coumarin, ketocoumarin and derivatives thereof, thiopyrylium salts, acetophenones, etc.
- p-bis(o-methyl- styryl)benzene 7-dimethylamino-4-methylquinolone- 2,7-amino-4- methylcoumarin, 4,6-dimethyl-7-ethyl- aminocoumarin, 2-(p- dimethylam inostyryl)-pyridyl- methyl iodide, 7-diethylaminocoumarin, 7- diethylamino- 4-methylcoumarin, 2, 3, 5, 6-1 H,4H-tetrahydro-8-methyl- quinolidino- ⁇ 9,9a,1-gh>coumarin, 7-diethylamino-4- trifluoromethylcoumarin, 7-dimethylamino-4-trifluoro- methylcoumarin, 7- amino-4-trifluoromethylcoumarin
- a compound containing an anthracene skeleton can also be used as a sensitizer.
- compounds represented by the following formula can be included.
- R 31 each independently represents a substituent selected from the group consisting of an alkyl group, an aralkyl group, an allyl group, a hydroxyalkyl group, an alkoxyalkyl group, a glycidyl group and a halogenated alkyl group;
- R 32 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group, an alkoxy group, a halogen atom, a nitro group, a sulfonic acid group, a hydroxyl group, an amino group and a carboalkoxy group; and k is each independently an integer selected from 0, and 1 to 4.
- its content is preferably 0.01 to 5 mass % based on the total mass of the alkali-soluble polymer.
- a crosslinker can be added to the composition according to the present invention, if necessary.
- the crosslinker include melamine compounds having a methylol group, alkoxymethyl group, etc., isocyanate compounds, and the like.
- a melamine compound is exemplified among the examples of the crosslinker, NIKALAC MW-390, NIKALAC MW-100LM, NIKALAC MX- 750LM, NIKALAC MX-270, NIKALAC MX-280, etc. having an imino group, a methylol group, a methoxymethyl group, and the like are mentioned.
- isocyanate compound X-12-9659 or KBM-9659, X-12-9659 or KBM-585 (Shin-Etsu Chemical Co., Ltd.) are mentioned.
- the content of the crosslinker is preferably 1 to 80 mass %, more preferably 5 to 50 mass %, further preferably 10 to 30 mass %, based on the total mass of the alkali-soluble material. It can be used alone or in combination of two or more.
- the method for forming a cured film according to the present invention comprises a step of applying the above-mentioned composition above a substrate to form a coating film, and a step of heating the coating film.
- the "above a substrate” includes the case where the composition is applied directly on a substrate and the case where the composition is applied on a substrate via one or more intermediate layer.
- the method for manufacturing a cured film further comprises a step of exposing the coating film to light and a step of developing the coating film.
- the method for manufacturing a cured film according to the present invention comprises a step of applying the above- mentioned composition above a substrate to form a coating film, a step of exposing the coating film to light, a step of developing the coating film, and a step of heating in this order, and further preferably comprises a step of prebaking after the step of applying and before the step of exposing.
- a coating film of the composition in the present invention can be performed by any method conventionally known as a method for applying a photosensitive composition. In particular, it can be freely selected from dip coating, roll coating, bar coating, brush coating, spray coating, doctor coating, flow coating, spin coating, slit coating, and the like.
- a substrate for applying the composition any suitable substrate such as silicon substrate, glass substrate and resin film can be used. Various semiconductor elements and the like may be formed on these substrates as required. When the substrate is a film, gravure coating is also available. If desired, a step of drying can be separately provided after applying. The step of applying can be repeated once or twice or more as necessary to obtain a desired film thickness of the formed coating film.
- prebaking preheating treatment
- the step of prebaking can be generally performed at a temperature of 40 to 150°C, preferably 50 to 100°C, and for 10 to 300 seconds, preferably 30 to 120 seconds when using a hot plate and for 1 to 30 minutes when using a clean oven.
- the surface of the coating film is irradiated with light as desired.
- Any light source conventionally used in the pattern forming method can be used for the light irradiation.
- Examples of such a light source include lamps such as high-pressure mercury lamp, low pressure mercury lamp, metal halide lamp and xenon lamp, laser diode, and LED.
- Ultraviolet rays such as g-line, h-line and i-line are usually used as irradiation light. Except for ultrafine processing such as semiconductors, light of 360 to 430 nm (high pressure mercury lamp) is generally used for patterning of several pm to several ten pm.
- the energy of the irradiation light is generally 5 to 2,000 mJ/cm 2 , preferably 10 to 1 ,000 mJ/cm 2 , although it depends on the light source and the film thickness of the coating film. If the irradiation light energy is lower than 10 mJ/cm 2 , sufficient resolution may not be obtained, and conversely, if it is higher than 2,000 mJ/cm 2 , the exposure is excessive and halation may occur.
- a general photomask can be used. Such a photomask can be freely selected from well-known ones.
- the environment for irradiation is not particularly limited, but generally the surrounding atmosphere (in the atmosphere) or nitrogen atmosphere may be accessible.
- patterned film also includes the case where such a film is formed on the entire surface of the substrate.
- post exposure baking can be performed, as necessary, in order to promote the reaction between polymer in the film by the reaction initiator generated at the exposed area. Unlike the step of heating (6) described later, this heat treatment is not performed to completely cure the coating film, but it is performed to make it possible to remain the desired pattern on the substrate after development and to remove the other portion by development. Therefore, this is not essential in the present invention.
- a hot plate, oven or furnace can be used.
- the heating temperature should not be excessively high, because it is undesirable for the acid in the exposed area, which is generated by the light irradiation, to diffuse into the unexposed area.
- the range of the heating temperature after exposure is preferably 40°C to 150°C, more preferably 60°C to 120°C.
- Stepwise heating can also be applied, if desired, to control the curing rate of the composition.
- the atmosphere during heating is not particularly limited, but for the purpose of controlling the curing speed of the composition, it can be selected from in an inert gas such as nitrogen, in a vacuum, under reduced pressure, in oxygen gas, and the like.
- the heating time is preferably at least a certain level in order to maintain the uniformity of the temperature history within the wafer surface, and is preferably not excessively long in order to suppress the diffusion of the generated acid. From this point of view, the heating time is preferably 20 seconds to 500 seconds, more preferably 40 seconds to 300 seconds.
- any developer that is conventionally used for developing photosensitive compositions can be used.
- Preferred developers include an alkaline developer that is an aqueous solution of an alkaline compound such as tetraalkylammonium hydroxide, choline, alkali metal hydroxide, alkali metal metasilicate (hydrate), alkali metal phosphate (hydrate), sodium carbonate aqueous solution, ammonia, alkylamine, alkanolamine and heterocyclic amine, and particularly preferable alkaline developer is tetramethylammonium hydroxide aqueous solution, potassium hydroxide aqueous solution, sodium hydroxide aqueous solution, and sodium carbonate aqueous solution.
- alkaline developers may further contain, if necessary, a water-soluble organic solvent such as methanol and ethanol, or a surfactant.
- a developer having a lower concentration than that of the 2.38 mass % TMAH developer that is usually used as a developer includes, for example, a 0.05 to 1 .5 mass % TMAH aqueous solution, a 0.1 to 2.5 mass % sodium carbonate aqueous solution, a 0.01 to 1.5 mass % potassium hydroxide aqueous solution, and the like.
- the development time is usually 10 to 300 seconds, preferably 30 to 180 seconds.
- the development method can also be freely selected from conventionally known methods. In particular, methods such as immersion (dip) in a developer, paddle, shower, slit, cap coat, and spray are mentioned. A pattern can be obtained by this development, and it is preferable to rinse with water after development with a developer.
- the coating film is cured by heating.
- the heating device to be used in the step of heating the same device as used in the above-mentioned post exposure baking can be used.
- the heating temperature in this step of heating is not particularly limited as long as it is a temperature at which the coating film can be cured, and can be freely determined.
- a relatively high temperature is generally selected as the heating temperature.
- the composition according to the invention is capable of curing at a relatively low temperature.
- the curing temperature is more preferably 300°C or lower, in particular preferably 250°C or lower.
- the curing temperature is preferably 70°C or higher, more preferably 80°C or higher.
- the heating time is not particularly limited, and is generally 10 minutes to 24 hours, preferably 20 minutes to 3 hours. This heating time is the time from when the temperature of the patterned film reaches the desired heating temperature. It usually takes several minutes to several hours for the patterned film to reach the desired temperature from the temperature before heating.
- the cured film thus formed exhibits the effects of the present application if the film has an average film thickness of 100 pm or less, and the film preferably has a thickness of 5 to 100 pm. It is more preferably 5 to 25 pm, further preferably 8 to 20 pm.
- the optical density (OD) of the cured film average thereof is preferably 1 .5 or more, more preferably 2 or more at a wavelength of 400 to 700 nm. The optical density is measured by Spectrophotometer CM-5 (Konica Minolta).
- the cured film according to the present invention has good light-shielding properties and can be used as a partition wall material for display devices. Since the cured film according to the present invention can be made thicker, it can be suitably used for quantum dots and organic electroluminescence devices that require a thicker partition wall material.
- the present invention relates to a cured film manufactured or capable of being manufactured by the above method.
- the present invention relates to a cured film comprising: a polymer (A) derived from an alkali-soluble material, a first surfactant; and a second surfactant different from the first surfactant.
- this cured film is preferably patterned, more preferably a patterned bank.
- the polymer (A) has a network crosslinked structure, and is more preferably a polymer derived from the alkali-soluble material (I) and the polymerization initiator (V) described above.
- the cured film further comprises a coloring agent.
- the coloring agent is an organic coloring agent and/or an inorganic coloring agent, further preferably the coloring agent is an organic and/or inorganic black coloring agent.
- the present invention relates to a light conversion device comprising the cured film.
- the present invention relates to a display device comprising the cured film or the light conversion device.
- composition comprising
- (III) a second surfactant different from the first surfactant, or consisting essentially of the above-mentioned alkali-soluble material (I), first surfactant (II), and second surfactant (III) different from the first surfactant, or consisting of the above-mentioned alkali-soluble material (I), first surfactant (II), and second surfactant (III) different from the first surfactant.
- the composition is a cured film-forming composition.
- the composition is a photosensitive composition. More preferably, the composition is a negative type photosensitive composition. Preferably, the composition further comprises
- a coloring agent which is preferably an organic coloring agent and/or an inorganic coloring agent, more preferably an organic and/or inorganic black coloring agent;
- the alkali-soluble material (I) has a structural portion having an acid group.
- the acid group is preferably one that has an acid dissociation index (pKa) of 7 or less, more preferably -OH, -COOH, -SOsH, -OSO3H, -PO3H2, -OPO3H2, -CONHSO2 and -SO2NHSO2-, further preferably -COOH.
- the first surfactant (II) is a surfactant that exhibits lipophilicity, preferably a fluorine-free surfactant, more preferably a fluorine-free nonionic surfactant, anionic surfactant or amphoteric surfactant, or a mixture thereof; and the second surfactant (III) is a surfactant that exhibits oil repellency, preferably a fluorosurfactant or fluorine-containing surfactant that exhibits oil repellency, more preferably a fluorine-containing surfactant, further preferably a fluorine-containing nonionic surfactant, fluorine-containing anionic surfactant, fluorine- containing amphoteric surfactant or a mixture thereof.
- the second surfactant (III) is a surfactant that exhibits oil repellency, preferably a fluorosurfactant or fluorine-containing surfactant that exhibits oil repellency, more preferably a fluorine-containing surfactant, further preferably a
- the first surfactant (II) is a fluorine-free nonionic surfactant, more preferably the first surfactant (II) is polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene oleyl ether and polyoxyethylene cetyl ether, polyoxyethylene fatty acid diesters, polyoxyethylene fatty acid monoesters, polyoxyethylene polyoxypyropyrene block polymer, acetylene alcohols, acetylene glycols, polyethoxylates of acetylene alcohol, acetylene glycol derivatives such as polyethoxylates of acetylene glycol, organosiloxane surfactants, silicon-based surfactants, or mixtures thereof.
- polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene oleyl ether and polyoxyethylene cetyl ether, polyoxyethylene fatty acid diesters, polyoxyethylene fatty acid monoesters, polyoxyethylene
- the second surfactant (III) is a fluorine-containing nonionic surfactant.
- composition according to Embodiment 1 or 2 wherein, the mass ratio of the first surfactant (II) to the second surfactant (III) (the first surfactant (II) : the second surfactant (III)) is 1 : 1 ,000 to 99 : 10, more preferably 1 : 100 to 5 : 1 , further preferably 1 : 50 to 2 : 1 , most preferably 1 : 20 to 1 : 1 .
- the content of the first surfactant (II) is preferably 0.001 to 5 mass %, more preferably 0.01 to 1 mass %, further preferably 0.02 to 0.5 mass %, most preferably 0.03 to 0.3 mass %, based on the total mass of the alkali-soluble material
- the content of the second surfactant (III) is preferably 0.05 to 10 mass %, more preferably 0.1 to 5 mass %, further preferably 0.2 to 1 mass %, most preferably 0.3 to 0.5 mass %, based on the total mass of the alkali-soluble material.
- the coloring agent (IV) is an organic and/or inorganic black coloring agent, more preferably an organic black coloring agent, and further preferably a black coloring agent consisting of a mixture of two or more organic coloring agents, and further more preferably a mixture of red and blue-green organic coloring agents mixed to give a black color.
- the coloring agent (IV) is a black coloring agent consisting of a mixture of organic coloring agents selected from the group consisting of azo-based, phthalocyanine-based, quinacridone-based, benzimidazolone-based, isoindolinone-based, dioxazine-based, indanthrene-based and perylene-based, and most preferably the organic black coloring agent is a combination of one or more selected from the group consisting of C.l. Pigment Orange 43, C.l. Pigment Orange 64 and C.l. Pigment Orange 72, with one or more selected from the group consisting of C.l. Pigment Blue 60, C.l. Pigment Green 7, C.l.
- the content of the coloring agent (IV) is 3 to 80 mass %, more preferably 5 to 50 mass %, based on the total mass of the alkali- soluble material.
- the compound containing two or more (meth)acryloyloxy groups is esters obtained by reacting (a) a polyol compound having two or more hydroxyl groups and ([3) two or more (meth)acrylic acids.
- the polyol compound (a) is a compound that has a saturated or unsaturated aliphatic hydrocarbon, an aromatic hydrocarbon, a heterocyclic hydrocarbon, a primary, secondary or tertiary amine, an ether, or the like as a basic skeleton, and two or more hydroxyl groups as a substituent.
- the polyol compound (a) further contains one, or two or more substituents selected from the group consisting of a carboxy group, a carbonyl group, an amino group, an ether bond, a thiol group and a thioether bond.
- the polyol compound (a) is selected from the group consisting of alkylpolyol, arylpolyol, polyalkanolamine, cyanuric acid and dipentaerythritol.
- esters When the polyol compound (a) has 3 or more hydroxyl groups, not all the hydroxyl groups need to be reacted with (meth)acrylic acid and may be partially esterified. That is, these esters may have unreacted hydroxyl groups.
- esters include a mixture consisting of one, or two or more selected from tris(2-acryloxyethyl) isocyanurate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, polytetramethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, ditrimethylolpropane tetraacrylate, tricyclodecane dimethanol diacrylate, 1 ,9-non
- it is tris(2-acryloxyethyl) isocyanurate and dipentaerythritol hexaacrylate or a combination thereof.
- it is a combination of a compound containing three (meth)acryloyloxy groups and a compound containing two (meth)acryloyloxy groups.
- the molecular weight of the compound containing two or more (meth)acryloyloxy groups is 2,000 or less, more preferably 1 ,500 or less.
- the content of the compound containing two or more (meth)acryloyloxy groups is 5 to 99.9 mass %, more preferably 30 to 70 mass %, based on the total mass of the composition excluding the solvent.
- the alkali-soluble polymer is selected from the group consisting of (meth)acrylic polymer, siloxane polymer, siloxane (meth)acrylic polymer, and mixtures thereof.
- the alkali dissolution rate of an alkali-soluble polymer is measured and calculated as follows, using a 0.03 mass % KOH aqueous solution as the alkali solution.
- the alkali-soluble polymer is diluted with PGMEA to become 35 mass %, and dissolved at room temperature with stirring for 1 hour using a stirrer.
- 1cc of the prepared alkali-soluble polymer solution is dropped onto the center portion of a silicon wafer (4-inch and thickness: 525 pm) using a pipette and spin-coated to become a thickness of 2 ⁇ 0.1 pm, followed by heating on a hot plate at 100°C for 90 seconds to remove the solvent.
- the film thickness of the coating film is measured with a spectroscopic ellipsometer (J. A. Woollam).
- the silicon wafer having this film is gently immersed in a 6- inch diameter glass petri dish containing 100 ml of a 0.03 mass % KOH aqueous solution adjusted to 23.0 ⁇ 0.1 °C, it is left to stand, and the time until the coating film disappears is measured.
- the dissolution rate is obtained by dividing by the time required for the film at 10 mm inside from the edge of the wafer to disappear.
- the dissolution rate is remarkably slow, after the wafer is immersed in a KOH aqueous solution for a certain period of time, the film thickness is measured, and the dissolution rate is calculated by dividing the amount of change in film thickness before and after the immersion by the immersion time.
- the above measurement method is performed 5 times, and the average of the obtained values is taken as the dissolution rate of the alkali-soluble polymer.
- the alkali-soluble polymer is referred to one in which the coating film at 10 mm inside from the edge of the wafer dissolves and disappears in a 0.03 mass % KOH aqueous solution within 10 minutes in the measurement and calculation of the alkali dissolution rate.
- the content of the compound containing two or more (meth)acryloyloxy groups is 5 to 1 ,000 mass %, more preferably 10 to 800 mass %, based on the total mass of the alkali-soluble polymer.
- the solvent (VI) is one or a combination of a plurality of any of ethylene glycol monoalkyl ethers, such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monobutyl ether; diethylene glycol dialkyl ethers, such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl ether; ethylene glycol alkyl ether acetates, such as methyl cellosolve acetate and ethyl cellosolve acetate; propylene glycol monoalkyl ethers, such as propylene glycol monomethyl ether and propylene glycol monoethyl ether; propylene glycol alkyl ether acetates, such as PGMEA, propylene glycol monoethyl ether acetate and propylene glycol
- the additive (VII) is a developer dissolution accelerator (preferably a compound having a hydroxyl group, more preferably a monomer or polymer having a hydroxyl group, or mixture thereof), a scum remover, an adhesion enhancer, a polymerization inhibitor, an antifoaming agent, a third surfactant different from the first and second surfactants, a sensitizer, a crosslinker, a hardener, or a mixture thereof.
- a method for manufacturing a cured film comprising a step of applying the composition according to any one of Embodiments 1 to 10 above a substrate to form a coating film, and a step of heating the coating film.
- the method for manufacturing a cured film further comprises a step of exposing the coating film to light and a step of developing the coating film. More preferably, the method for manufacturing a cured film comprises a step of applying the composition according to any one of Embodiments 1 to 10 above a substrate to form a coating film, a step of exposing the coating film to light, a step of developing the coating film, and a step of heating in this order, and further preferably, further comprises a step of prebaking after the coating step and before the exposing step. [0102]
- a cured film manufactured or capable of being manufactured by the method according to Embodiment 11 is a cured film manufactured or capable of being manufactured by the method according to Embodiment 11 .
- a cured film comprising: a polymer (A) derived from an alkali-soluble material, a first surfactant; and a second surfactant different from the first surfactant.
- the polymer (A) derived from an alkali-soluble material has a network crosslinked structure.
- the cured film is patterned. More preferably, the cured film is a patterned bank.
- the cured film further contains a coloring agent.
- the coloring agent is an organic coloring agent and/or an inorganic coloring agent, further preferably the coloring agent is an organic and/or inorganic black coloring agent.
- the polymer (A) is a polymer derived from an alkali- soluble material (I) and a polymerization initiator (V).
- the cured film is patterned, more preferably the cured film is a patterned bank.
- a light conversion device comprising the cured film according to any one of Embodiments 12 to 15.
- a display device comprising the cured film according to any one of Embodiments 12 to 15 or the light conversion device according to Embodiment 16.
- the composition is a photosensitive composition, more preferably a negative type photo-sensitive composition.
- the composition further comprises a coloring agent (IV), preferably an organic coloring agent and/or inorganic coloring agent, more preferably an organic and/or inorganic black coloring agent; a polymerization initiator (V); and/or a solvent (VI).
- a coloring agent preferably an organic coloring agent and/or inorganic coloring agent, more preferably an organic and/or inorganic black coloring agent
- V polymerization initiator
- VI solvent
- the first surfactant (II) is a fluorine-free surfactant, more preferably a fluorine-free nonionic surfactant, anionic surfactant or amphoteric surfactant, or a mixture thereof, and the second surfactant (III) is a fluorine-containing surfactant.
- A-DPH as a (meth)acryloyloxy group-containing compound
- 47 parts by mass of additive A thiol monomer "Karenz MT PE-1", Showa Denko K.K.
- coloring agent A black coloring agent, Toyocolor Co., Ltd.
- fluorine-containing surfactant A Daikin Industries, Ltd.
- compositions of Comparative Examples 2 to 5 are prepared in the same manner as in Comparative Example 1 , except that the composition is changed as shown in Table 1 .
- compositions of Examples 1 to 6 are prepared in the same manner as in Comparative Example 1 , except that the composition is changed as shown in Table 2.
- Acrylic polymer A acrylic random polymer made from carboxyl acid monomer and monomer containing at least one aromatic ring group (Shin- Nakamura Chemical Co., Ltd.).
- Acrylic polymer B 2-propenoic acid, 2-methyl-, polymer with 2- hydroxyethyl 2-methyl-2-propenoate, 2-isocyanatoethyl 2-propenoate and methyl 2-methyl-2-propenoate (Natoco Co., Ltd.)
- Surfactant A fluorine-containing surfactant (Daikin Industries, Ltd.)
- As the surfactant A for example, Surfion (AGC Seimi Chemical Co., Ltd.), which is a surfactant having a perfluoroalkyl group, can also be used.
- - Surfactant B silicon-based surfactant (DIC Corporation)
- silicon-based surfactant SOILNON AF-800 (Nicca Chemical Co., Ltd.) can also be used.
- Each of the resulting compositions is applied onto a glass substrate by a spin coater (MS-A100, MIKASA), and after applying, it is subjected to prebaking on a hot plate (HHP-411 V, AS ONE) at 60°C for 90 seconds to adjust the average thickness becomes 10 pm.
- Exposure is performed using an i-line exposure machine (NES2W-ghiO6, Nikon), and hole patterns of 54x160 and 200x200 pm are formed using a 0.03 mass % KOH aqueous solution as a developer.
- the patterned substrate is placed in an oven (DP- 200, Yamato) at 85°C and heated for 30 minutes to accelerate curing of the polymer.
- the pattern is checked with an optical microscope (MX61A, OLYMPUS) and SEM (JSM-7100, JEOL) to confirm that there is no residue.
- An unpatterned substrate is prepared for optical density measurement.
- the entire surface of the substrate is exposed without using any photomask.
- a film is formed by the same process procedure as the pattern forming.
- a transmission spectrum is measured with a spectra- photometer (CM-5, KONICA MINOLTA), and an average OD value in the wavelength range of 400 to 650 nm is calculated.
- An unpatterned substrate is prepared for surface free energy measurement.
- the entire surface of the substrate is exposed without using any photomask.
- a film is formed by the same process procedure as the pattern forming.
- the formed substrate is set in a contact angle meter (DropMaster700, Kyowa), and the contact angle between distilled water and 3 pL of diiodomethane is measured.
- the surface free energy is calculated from the Owens-Wendt theoretical formula and the value of the obtained contact angle.
- Ink A is formed by mixing the materials listed in Table 3 below. With respect to inks, they can also be formed using materials and methods described, for example, in WO2021/116139A1 .
- the method for forming the monomer mixture is as follows.
- HDDA 1 ,6-hexanediol diacrylate
- HDDA 1 ,6-hexanediol diacrylate
- a drop of ink A is put in a hole pattern with a size of 54x160 pm using an inkjet printer (Dimatix DMP-2831 , FujiFilm), and the spread of the ink is evaluated with an optical microscope and SEM.
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Abstract
Une composition contenant un matériau soluble dans les alcalis, un film durci et son procédé de fabrication.
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JP2018203599A (ja) | 2017-06-09 | 2018-12-27 | 三菱マテリアル電子化成株式会社 | 窒化ジルコニウム粉末及びその製造方法 |
WO2021018927A1 (fr) | 2019-07-31 | 2021-02-04 | Merck Patent Gmbh | Composition photosensible de type négatif comprenant un colorant noir |
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WO2021116139A1 (fr) | 2019-12-12 | 2021-06-17 | Merck Patent Gmbh | Composition |
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- 2023-06-09 TW TW112121622A patent/TW202413445A/zh unknown
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JP2004292672A (ja) | 2003-03-27 | 2004-10-21 | Mikuni Color Ltd | カーボンブラック分散液 |
WO2006064873A1 (fr) * | 2004-12-15 | 2006-06-22 | Mitsubishi Chemical Corporation | Composition de resine pour panneau a cristaux liquides, filtre de couleur et panneau a cristaux liquides utilisant celle-ci |
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EP2555054A1 (fr) * | 2010-03-31 | 2013-02-06 | FUJIFILM Corporation | Révélateur permettant de traiter un précurseur de plaque d'impression planographique, procédé de préparation d'une plaque d'impression planographique en utilisant le révélateur, et procédé d'impression |
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