WO2023234125A1 - Ruban protecteur de liaison - Google Patents
Ruban protecteur de liaison Download PDFInfo
- Publication number
- WO2023234125A1 WO2023234125A1 PCT/JP2023/019199 JP2023019199W WO2023234125A1 WO 2023234125 A1 WO2023234125 A1 WO 2023234125A1 JP 2023019199 W JP2023019199 W JP 2023019199W WO 2023234125 A1 WO2023234125 A1 WO 2023234125A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- base material
- protective tape
- binding
- polyorganosiloxane
- parts
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 89
- 239000000463 material Substances 0.000 claims abstract description 127
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 229920000915 polyvinyl chloride Polymers 0.000 claims abstract description 34
- 239000004800 polyvinyl chloride Substances 0.000 claims abstract description 34
- 239000004014 plasticizer Substances 0.000 claims abstract description 24
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 239000000945 filler Substances 0.000 claims abstract description 19
- 239000011342 resin composition Substances 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 27
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 15
- -1 Phthalate ester Chemical class 0.000 description 11
- 244000043261 Hevea brasiliensis Species 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 229920003052 natural elastomer Polymers 0.000 description 9
- 229920001194 natural rubber Polymers 0.000 description 9
- 238000005299 abrasion Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 239000000839 emulsion Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229920000578 graft copolymer Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 102100035474 DNA polymerase kappa Human genes 0.000 description 4
- 101710108091 DNA polymerase kappa Proteins 0.000 description 4
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 4
- 229920003051 synthetic elastomer Polymers 0.000 description 4
- 239000005061 synthetic rubber Substances 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 229920000126 latex Polymers 0.000 description 3
- 239000004816 latex Substances 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000012417 linear regression Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- RWCHFQMCWQLPAS-UHFFFAOYSA-N (1-tert-butylcyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C(C)(C)C)CCCCC1 RWCHFQMCWQLPAS-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical compound COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 229920006310 Asahi-Kasei Polymers 0.000 description 1
- VSPBJCAGAJBGKS-UHFFFAOYSA-N Charine Chemical compound OC1=NC(N)=NC(N)=C1OC1C(O)C(O)C(O)CO1 VSPBJCAGAJBGKS-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 150000001278 adipic acid derivatives Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- CEDDGDWODCGBFQ-UHFFFAOYSA-N carbamimidoylazanium;hydron;phosphate Chemical compound NC(N)=N.OP(O)(O)=O CEDDGDWODCGBFQ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- WEXXMKKKIYDELC-UHFFFAOYSA-N charine Natural products Nc1nc(N)c(OC2OC(CO)C(O)C2O)c(O)n1 WEXXMKKKIYDELC-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 150000002531 isophthalic acids Chemical class 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 229920006173 natural rubber latex Polymers 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003503 terephthalic acid derivatives Chemical class 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PZRXQXJGIQEYOG-UHFFFAOYSA-N zinc;oxido(oxo)borane Chemical compound [Zn+2].[O-]B=O.[O-]B=O PZRXQXJGIQEYOG-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
Definitions
- the present invention relates to a binding protective tape.
- the binding protective tape can be suitably used for binding and protecting high-voltage cables for electric vehicles and hybrid vehicles, wire harnesses for automobiles, and the like.
- Patent Documents 1 and 2 Polyvinyl chloride-based binding and protective tapes are used that have a base material made of polyvinyl chloride resin coated with an adhesive on one side. It is also known that the cuttability and abrasion resistance of polyvinyl chloride binding and protective tape can be improved by arranging hard wire rods that are harder than polyvinyl chloride resin in a predetermined cutting direction and embedding them in the base material. (Patent Document 3).
- An object of the present invention is to provide a binding protective tape that has an excellent balance between flexibility and protective performance, and also has excellent film-forming properties on the base material.
- the base material contains a polyvinyl chloride resin, a plasticizer, a filler, and
- a polyvinyl chloride resin a polyvinyl chloride resin
- a plasticizer a plasticizer
- a filler a filler
- a binding protective tape comprising a base material and an adhesive layer formed on one side of the base material
- the base material is composed of a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a polyorganosiloxane, In the resin composition, the content of the polyorganosiloxane is 1 to 10 parts by mass based on 100 parts by mass of the polyvinyl chloride resin. Binding protection tape. [2] Install Nitto Denko Corporation No. 1 on the sample stage.
- the coefficient of kinetic friction on the surface of the base material is fixed using 5000NS double-sided tape and measured using an R contactor based on ASTM D1894 under the conditions of a load of 200 g and a test speed of 2.5 mm/sec. 0.06 to 0.26, The binding protective tape according to [1].
- the binding protection tape is fixed to the sample stage via the adhesive layer, and the measurement is performed using an R contactor based on ASTM D1894 under the conditions of a load of 200 g and a test speed of 2.5 mm/sec.
- the dynamic friction coefficient of the back surface of the base material of the binding protective tape is 0.13 to 0.60.
- a binding protective tape that has an excellent balance between flexibility and protective performance, and also has excellent film-forming properties on the base material.
- a binding protective tape according to an embodiment of the present invention includes a base material and an adhesive layer formed on one side of the base material. Each configuration will be described in detail below.
- the base material according to one embodiment of the present invention contains a polyvinyl chloride resin, a plasticizer, a filler, and a polyorganosiloxane, and the content of the polyorganosiloxane is 1 to 10 parts by mass based on 100 parts by mass of the polyvinyl chloride resin. It is composed of parts by mass of a resin composition.
- the polyvinyl chloride resin in one embodiment of the present invention preferably has an average degree of polymerization of 1000 to 1500, and two or more types of polyvinyl chloride resins having different average degrees of polymerization may be used. If the average degree of polymerization is less than 1000, sufficient strength (wear resistance) may not be obtained due to insufficient entanglement of polymer chains. If the average degree of polymerization is higher than 1500, gelation may be difficult and film forming properties may deteriorate.
- the plasticizer in one embodiment of the present invention is not particularly limited as long as it can impart flexibility to the base material.
- examples include trimellitic acid esters, adipic acid esters, phthalic acid esters, epoxy plasticizers, isophthalic acid esters, terephthalic acid esters, and phosphoric acid plasticizers. From the viewpoint of plasticizing effect on polyvinyl chloride resin and low bleed-out, phthalate esters are preferred. These plasticizers may be used alone or in combination of two or more.
- phthalate ester plasticizer examples include DINP (diisononyl phthalate), DHP (diheptyl phthalate), DOP (di-2-ethylhexyl phthalate), and n-DOP (diisononyl phthalate). -n-octyl) and diisodecyl phthalate (DIDP).
- phthalic acid and carbon atoms of 9 to 10 such as DINP (diisononyl phthalate) and diisodecyl phthalate (DIDP), are recommended. Diesters with alcohols are preferred. These plasticizers may be used alone or in combination of two or more.
- the content of the plasticizer is preferably 38 to 50 parts by weight, more preferably 40 to 48 parts by weight, based on 100 parts by weight of the polyvinyl chloride resin. Specifically, for example, it is preferably 38, 40, 42, 43, 44, 45, 46, 48, or 50 parts by mass, and even if it is within the range between any two of the numerical values exemplified here. good.
- the plasticizer in an amount of 38 parts by mass or more, the flexibility of the base material is improved and, for example, it is possible to reduce the occurrence of floating in the binding protection tape by improving the followability when it is wound around an electric wire or the like.
- the wear resistance of the base material can be improved and good protection performance can be obtained.
- the content of the plasticizer means the total amount of the plasticizer used in combination.
- the filler in one embodiment of the present invention is not particularly limited as long as it can increase the amount of the base material and improve the hardness.
- inorganic fillers are preferred from the viewpoint of achieving both a reinforcing effect and flexibility.
- Examples of the inorganic filler in an embodiment of the present invention include calcium carbonate, aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, calcium hydroxide, potassium hydroxide, barium hydroxide, triphenyl phosphite, and ammonium polyphosphate.
- polyphosphoric acid amide zirconium oxide, magnesium oxide, zinc oxide, titanium oxide, molybdenum oxide, guanidine phosphate, hydrotalcite, smectite, zinc borate, zinc borate anhydride, zinc metaborate, barium metaborate, antimony oxide, pentoxide
- examples include antimony, red phosphorus, talc, alumina, silica, boehmite, bentonite, sodium silicate, calcium silicate, calcium sulfate, magnesium carbonate, and carbon black. From the viewpoint of both reinforcing effect and flexibility, calcium carbonate, silica, and carbon black are preferred. These fillers may be used alone or in combination of two or more.
- the content of the filler is preferably 10 to 60 parts by weight, more preferably 20 to 40 parts by weight, based on 100 parts by weight of the polyvinyl chloride resin. Specifically, for example, it is 10, 15, 20, 25, 30, 35, 40, 45, 50, or 60 parts by mass, and may be within a range between any two of the numerical values exemplified here. .
- the filler in an amount of 10 parts by mass or more, the wear resistance of the base material can be improved and good protective performance can be obtained.
- the amount of the filler By controlling the amount of the filler to 60 parts by mass or less, the flexibility of the base material is improved and, for example, it is possible to reduce the occurrence of floating in the binding protective tape due to the improved followability when it is wound around electric wires or the like.
- the content of the filler means the total amount of the filler used together.
- the polyorganosiloxane in one embodiment of the present invention is not particularly limited as long as it has a polyorganosiloxane structure.
- the polyorganosiloxane structure is a polymer having -Si-O- repeating units in the main chain and organic groups in the side chains. Examples of the repeating unit include those represented by the following structural formula.
- R 1 and R 2 are each independently an organic group selected from an alkyl group, a polyoxyalkylene group, a fluorine-containing group, and a chlorophenyl group. From the viewpoint of slidability, an alkyl group is preferred. Examples of the alkyl group include a methyl group and an ethyl group from the viewpoint of slidability. These polyorganosiloxane structures may be used alone or in combination of two or more types.
- the polyorganosiloxane is an acrylic-modified polyorganosiloxane in which (meth)acrylate is copolymerized in the side chain of the polyorganosiloxane, from the viewpoint of dispersibility in polyvinyl chloride resin and durability of sliding properties. It may also be siloxane.
- the (meth)acrylate introduced into the side chain of polyorganosiloxane includes, for example, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, cyclohexyl methacrylate, and phenyl methacrylate. , 2-ethylhexyl methacrylate, t-butylcyclohexyl methacrylate, benzyl methacrylate, 2,2,2-trifluoroethyl methacrylate and the like. From the viewpoint of ease of handling and availability, methyl methacrylate is preferred.
- the polyorganosiloxane in one embodiment of the present invention is a methyl methacrylate-modified polyorganosiloxane in which methyl methacrylate is copolymerized on the side chain of polyorganosiloxane, from the viewpoint of dispersibility and long-lasting sliding properties in polyvinyl chloride resin. It is preferable that there be.
- the weight average molecular weight (Mw) of the acrylic modified polyorganosiloxane is preferably from 300,000 to 500,000, more preferably from 350,000 to 450,000. Specifically, for example, it is 30, 35, 38, 40, 42, 45, or 500,000, and may be within a range between any two of the numerical values exemplified here.
- the weight average molecular weight (Mw) of the acrylic-modified polyorganosiloxane By setting the weight average molecular weight (Mw) of the acrylic-modified polyorganosiloxane to 300,000 or more, it is possible to improve the film formability of the base material during production and the stability during storage. By setting the weight average molecular weight (Mw) to 500,000 or less, it can be uniformly dispersed in the polyvinyl chloride resin.
- the weight average molecular weight (Mw) of the acrylic modified polyorganosiloxane in one embodiment of the present invention can be measured using, for example, gel permeation chromatography (GPC).
- the weight average molecular weight (Mw) can be controlled, for example, by adjusting the weight average molecular weight (Mw) of the polyorganosiloxane.
- the weight average molecular weight (Mw) means the weight average molecular weight (Mw) when the acrylic modified polyorganosiloxane used together is combined.
- the polyorganosiloxane in one embodiment of the present invention may be a linear polyorganosiloxane in which siloxane bonds in the main chain are linearly bonded.
- Examples of the linear polyorganosiloxane include linear polydimethylsiloxane, linear polymethylphenylsiloxane, and linear polymethylhydrogensiloxane. From the viewpoint of sliding properties, linear polydimethylsiloxane is preferred. These other linear polyorganosiloxanes may be used alone or in combination of two or more types.
- the polyorganosiloxane in one embodiment of the present invention has a structure in which a linear polyorganosiloxane is crosslinked, and a siloxane bond. It may also have a three-dimensional network crosslinked structure. From the viewpoint of sliding properties, polyorganosiloxanes in which linear polyorganosiloxanes are crosslinked are preferred. These crosslinked polyorganosiloxanes may be used alone or in combination of two or more types.
- the content of polyorganosiloxane is 1 to 10 parts by weight, more preferably 3 to 7 parts by weight, based on 100 parts by weight of polyvinyl chloride resin. Specifically, it is, for example, 1, 2, 4, 6, 8, or 10 parts by mass, and may be within a range between any two of the numerical values exemplified here.
- the content of polyorganosiloxane By controlling the content of polyorganosiloxane to 10 parts by mass or less, the flexibility of the base material is improved, and for example, it is possible to reduce the occurrence of floating in the binding protective tape by improving the followability when wrapped around electric wires, etc. . In addition, plate-out (a phenomenon in which a part of the resin composition separates and adheres to the molding machine) can be prevented during film formation.
- the content of polyorganosiloxane means the total amount of polyorganosiloxane used together.
- the resin composition in this embodiment may contain other additives such as colorants, stabilizers, antioxidants, ultraviolet absorbers, lubricants, etc., as necessary, within the range that does not impede the effects of the present invention. can.
- the thickness of the base material of the binding protective tape in this embodiment varies depending on the intended use and application, but is preferably 190 to 330 ⁇ m, more preferably 190 to 250 ⁇ m. Specifically, it is, for example, 190, 195, 200, 205, 210, 220, 250, 280, 300, or 330 ⁇ m, and may be within a range between any two of the numerical values exemplified here.
- the base material thickness By setting the base material thickness to 190 ⁇ m or more, the wear resistance of the base material can be improved and good protection performance can be obtained.
- the thickness of the base material By setting the thickness of the base material to 330 ⁇ m or less, the flexibility of the base material is improved, and for example, it is possible to reduce the occurrence of floating in the binding protective tape due to the improved followability when it is wound around an electric wire or the like.
- the structure of the base material of the binding protective tape in this embodiment is preferably a single-layer structure from the viewpoint of simplifying the manufacturing process and manufacturing equipment.
- the resin composition for manufacturing the base material according to this embodiment includes a polyvinyl chloride resin, a plasticizer, a filler, a polyorganosiloxane, and, if necessary, a heat stabilizer, a light absorber, a pigment, and others. It can be obtained by melt-kneading additives and the like.
- the melt-kneading method is not particularly limited, but various mixers and kneaders equipped with heating devices such as twin-screw extruders, continuous and batch-type kneaders, rolls, and Banbury mixers can be used.
- the materials are mixed so as to be uniformly dispersed, and the resulting mixture is molded into a base material by a conventional molding method such as a calendar method, a T-die method, or an inflation method.
- a calendar molding machine is preferable from the viewpoint of productivity, color change, uniformity of shape, etc.
- the roll arrangement method in calender molding may be a known method such as an L-shape, an inverted L-shape, or a Z-shape, and the roll temperature is usually set at 150 to 200°C, preferably 155 to 190°C.
- the base material is manufactured by Nitto Denko Corporation.
- the dynamic friction coefficient of the base material surface is 0.0, measured using an R contactor based on ASTM D1894 at a load of 200 g and a test speed of 2.5 mm/sec. It is preferably from 0.06 to 0.26, more preferably from 0.10 to 0.25. Specifically, for example, 0.06, 0.08, 0.10, 0.12, 0.14, 0.16, 0.18, 0.20, 0.22, 0.24, or 0. It is preferably 26, and may be within a range between any two of the numerical values exemplified here.
- the dynamic friction coefficient of the base material surface By setting the dynamic friction coefficient of the base material surface to 0.06 or more, the flexibility of the binding protection tape is improved, and for example, when it is wrapped around electric wires, the following properties are improved and the occurrence of lifting of the binding protection tape is reduced. can.
- the dynamic friction coefficient of the base material surface By setting the dynamic friction coefficient of the base material surface to 0.26 or less, the abrasion resistance of the binding protective tape can be improved and good protective performance can be obtained.
- the coefficient of dynamic friction on the surface of the base material can be controlled by adjusting the type and content of polyorganosiloxane contained in the resin composition used to manufacture the base material.
- the dynamic friction coefficient of the base material surface of the base material according to the present embodiment can be measured by the following procedure using, for example, an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd.
- the base material sample is cut to a width of 50 mm and a length of 100 mm, and fixed to the sample stage using double-sided tape (No. 5000NS manufactured by Nitto Denko Corporation).
- An R contactor based on ASTM D1894 is placed on the back surface of the bonded base material sample, and the dynamic friction coefficient is measured under the conditions of a load of 200 g and a test speed of 2.5 mm/sec (room temperature: 23° C., humidity: 50% RH).
- the tensile modulus in terms of thickness of the base material is preferably 6 to 9 N/mm, more preferably 7 to 9 N/mm. Specifically, it is, for example, 6, 7, 8, or 9 N/mm, and may be within a range between any two of the numerical values exemplified here.
- the tensile modulus of elasticity converted to the thickness of the base material By setting the tensile modulus of elasticity converted to the thickness of the base material to 9 N/mm or less, the flexibility of the base material is improved, and for example, when wrapped around electric wires, etc., the binding protection tape will not float due to improved followability. can be reduced.
- the tensile modulus of elasticity converted to the thickness of the base material can be controlled by adjusting the type and content of the slidability imparting agent contained in the resin composition used for manufacturing the base material.
- the thickness-converted tensile modulus of the base material according to the present embodiment can be obtained from the value of the tensile modulus by the following procedure.
- a binding tape test piece with a width of 19 mm and a length of 200 mm is clamped and fixed between the chuck parts of a tensile tester so that the distance between the chucks is 100 mm.
- the test piece is pulled at a speed of 300 mm/min at a room temperature of 23° C. and a relative humidity of 50% RH to measure tensile stress and strain.
- the ratio of tensile stress to strain between 0.01 and 0.05% strain is calculated by linear regression, and the value is defined as the tensile modulus.
- the product of the tensile elastic modulus thus obtained and the tape total thickness (unit: mm) is defined as the tensile elastic modulus converted to thickness.
- the adhesive in the adhesive layer of the binding protective tape according to this embodiment is preferably a rubber adhesive, and may be either a solvent type or an emulsion type.
- the rubber-based adhesive preferably contains one or more rubbers selected from natural rubber or synthetic rubber and a tackifying resin, and more preferably a mixture of natural rubber, synthetic rubber, and tackifying resin. preferable.
- the mixing ratio of the tackifier resin is preferably 50 to 150 parts by mass per 100 parts by mass of the rubber component of the mixture containing natural rubber and synthetic rubber.
- Examples of the natural rubber and synthetic rubber include natural rubber-methyl methacrylate copolymer latex, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, methyl methacrylate-butadiene copolymer, and the like. These may be used alone or in combination of two or more.
- the tackifying resin can be selected in consideration of softening point, compatibility with each component, etc.
- emulsions such as aromatic hydrocarbon resins may be mentioned. These may be used alone or in combination of two or more.
- the rubber adhesive can be freely selected from a solvent type and an emulsion type, but an emulsion type that generates less VOC is preferable.
- the binding protective tape according to the present embodiment may be provided between the base material and the adhesive layer for the purpose of improving the adhesion between the base material and the adhesive layer within a range that does not impede the effects of the present invention.
- a primer layer may also be provided.
- the thickness of the undercoat layer is usually 0.1 to 1 ⁇ m, more preferably 0.3 to 0.5 ⁇ m, and the thickness of the undercoat layer is preferably smaller than the thickness of the base material.
- the undercoat forming the undercoat layer is preferably one consisting of 25 to 300 parts by mass of an acrylonitrile-butadiene copolymer based on 100 parts by mass of a graft polymer obtained by graft polymerizing methyl methacrylate to natural rubber.
- the graft polymer obtained by graft-polymerizing methyl methacrylate onto natural rubber used in the primer is preferably one in which 70-50 mass % of natural rubber is graft-polymerized with 30-50 mass % methyl methacrylate. If the ratio of methyl methacrylate in the graft polymer is less than 30% by mass, the adhesion between methyl methacrylate and the film base material may deteriorate, and delamination of the binding protective tape may occur. Moreover, if the ratio of methyl methacrylate is more than 50% by mass, the undercoat itself will harden and be unable to follow the deformation of the film base material, which may cause delamination of the binding protective tape.
- the acrylonitrile-butadiene copolymer used in the primer includes medium nitrile type (acrylonitrile 25-30% by mass, butadiene 75-70% by mass), medium-high nitrile type (acrylonitrile 31-35% by mass, butadiene 69-65% by mass). %) high nitrile type (acrylonitrile 36-43% by mass, butadiene 64-57% by mass). These may be used alone or in combination of two or more.
- the binding protection tape according to the present embodiment can be produced by, for example, applying an undercoat to one side of a base material, removing the solvent sufficiently in a drying oven, applying an adhesive, and then applying it in a drying oven in the same way as the undercoat. After sufficiently removing the solvent, an adhesive is applied to obtain a binding protective tape.
- Coating methods for the primer include the gravure method, spray method, kiss roll method, bar method, knife method, etc., and methods for applying the adhesive include the comma method, lip die method, gravure method, and roll method. , slot die method, etc.
- the thickness of the primer layer is usually 0.1 to 1 ⁇ m, more preferably 0.3 to 0.5 ⁇ m. Further, the thickness of the adhesive layer varies depending on the purpose and application, but is usually 5 to 50 ⁇ m, more preferably 10 to 30 ⁇ m.
- ⁇ Dynamic friction coefficient on the back side of the binding protective tape base material> an R contactor based on ASTM D1894 is used, a load of 200 g and a test speed of 2.5 mm/sec are used when the binding protection tape is fixed to the measurement stage via an adhesive layer.
- the dynamic friction coefficient of the back surface of the binding protective tape base material measured under the following conditions is preferably 0.13 to 0.60, more preferably 0.23 to 0.58. Specifically, for example, 0.13, 0.15, 0.20, 0.25, 0.30, 0.35, 0.40, 0.45, 0.50, 0.55, or 0. It is preferably 60, and may be within a range between any two of the numerical values exemplified here.
- the back surface of the binding protective tape base material means the surface of the binding protective tape base material that is opposite to the surface on which the adhesive layer is formed.
- the coefficient of dynamic friction on the surface of the base material increases, the coefficient of dynamic friction on the back surface of the base material of the binding protective tape tends to increase as well. Therefore, it can be controlled by adjusting the dynamic friction coefficient of the base material surface within the above-mentioned range.
- the coefficient of dynamic friction on the back side of the base material of the binding protective tape tends to be a larger value than the coefficient of dynamic friction on the surface of the base material, but due to the above relationship,
- the coefficient of dynamic friction on the back surface of the base material of the binding protective tape can be controlled within a desired range.
- the dynamic friction coefficient of the back surface of the binding protective tape base material can be controlled by adjusting the dynamic friction coefficient of the base material surface within the above-mentioned range.
- the back surface dynamic friction coefficient of the binding protective tape base material in the binding protective tape according to the present embodiment can be measured by the following procedure using, for example, an automatic friction and wear analysis device TS-501 manufactured by Kyowa Interface Science Co., Ltd.
- the binding protective tape sample is cut into 50 mm width x 100 mm length and fixed to the sample stage via the adhesive layer of the binding protective tape sample.
- An R contactor based on ASTM D1894 is placed on the back of the bonded protective tape sample, and the dynamic friction coefficient is measured under the conditions of a load of 200 g and a test speed of 2.5 mm/sec (room temperature: 23° C., humidity: 50% RH).
- the binding protective tape according to the present embodiment is suitably used as a binding protective tape for binding high-voltage cables and wire harnesses of electric vehicles and hybrid vehicles, for example.
- Acrylic modified polyorganosiloxane (weight average molecular weight 200,000) with methyl methacrylate copolymerized on the side chain:
- Linear polydimethylsiloxane Product name: "GENIOPLAST GUM”, manufactured by Asahi Kasei Wacker Silicone Co., Ltd.
- Polyorganosiloxane (crosslinked siloxane) Product name "KMP-597", manufactured by Shin-Etsu Chemical Co., Ltd.
- Plasticizer Phthalate ester plasticizer, diisononyl phthalate Product name "DINP”, manufactured by Shin-Etsu Chemical Co., Ltd.
- Manufactured by J-Plus (4) Filler Calcium carbonate Product name "Calseeds (registered trademark) P", manufactured by Kamishima Chemical Industry Co., Ltd.
- Polyvinyl chloride resin, polyorganosiloxane, plasticizer, and filler were melt-kneaded using a Banbury mixer to uniformly disperse the compositions shown in Tables 1 and 2, and then heated to a roll temperature of 165°C using a calendar molding machine. A base material of a predetermined thickness was prepared.
- ⁇ Preparation of binding protective tape> ⁇ Materials used> (1) Base material Base material created by the above process (2) Undercoat layer Mixture emulsion of graft polymer latex obtained by graft polymerizing methyl methacrylate to natural rubber and acrylonitrile butadiene copolymer emulsion: Product name KT4612A, E-Tech Co., Ltd. (3) Adhesive layer made by HA LATEX Co., Ltd.
- the thickness of the undercoat layer after drying was 0.3 ⁇ m, and the thickness of the adhesive layer after drying was 20 ⁇ m.
- ⁇ Dynamic friction coefficient of base material surface The measurement was performed using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd. according to the following procedure.
- the base material sample was cut to a width of 50 mm and a length of 100 mm, and was fixed to a sample stage using double-sided tape (No. 5000NS manufactured by Nitto Denko Corporation).
- An R contactor based on ASTM D1894 was placed on the back surface of the bonded base material sample, and the dynamic friction coefficient was measured under the conditions of a load of 200 g and a test speed of 2.5 mm/sec (room temperature: 23° C., humidity: 50% RH).
- the measurement was performed using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd. according to the following procedure.
- the binding protective tape sample was cut into 50 mm width x 100 mm length, and was affixed and fixed to a sample stage via an adhesive layer.
- An R contactor based on ASTM D1894 was placed on the back of the bonded protective tape sample, and the dynamic friction coefficient was measured under the conditions of a load of 200 g and a test speed of 2.5 mm/sec (room temperature: 23° C., humidity: 50% RH).
- ⁇ Tensile modulus/tensile modulus converted to thickness A binding tape test piece with a width of 19 mm and a length of 200 mm was clamped and fixed between the chuck parts of a tensile testing machine so that the distance between the chucks was 100 mm. The test piece was pulled at a speed of 300 mm/min at a room temperature of 23° C. and a relative humidity of 50% RH, and tensile stress and strain were measured. The ratio of tensile stress to strain between 0.01 and 0.05% strain was calculated by linear regression, and the value was defined as the tensile modulus. Further, the product of the tensile elastic modulus and the total tape thickness (unit: mm) was used as the tensile elastic modulus converted into thickness.
- the durometer A hardness of the base material samples stacked to a thickness of 6 mm or more was measured using an Asker rubber hardness meter A type (type A indenter based on ASTM D2240) manufactured by Kobunshi Keiki Co., Ltd. (room temperature: 23° C., humidity: 50% RH).
- Abrasion resistance was evaluated according to the following procedure. It was conducted in accordance with ISO6722-1 (2001). The base material sample was wrapped twice around a cylinder with a diameter of 10 mm and fixed with tape or the like. From above, the surface of the sample was abraded at a speed of 1500 mm/min using sandpaper whose hard material was fused alumina and had a particle size of 150 ⁇ m. The abrasion distance (mm) until a hole appeared in the sample was measured (room temperature: 23° C., humidity: 50% RH). The wear distance (mm) until a hole appeared in the sample was evaluated using the following criteria.
- a base material with an excellent evaluation of abrasion distance has high abrasion resistance, so it can be expected that excellent protection performance can be achieved in a binding protective tape manufactured using the base material.
- Wear distance is 1000 mm or more
- Wear distance is 800 mm or more and less than 1000 mm
- Wear distance is less than 800 mm
- the protective binding tape using the base material according to the example and the protective binding tape according to the example have an excellent balance between flexibility and protective performance. Furthermore, it can be seen that the base materials according to Examples have excellent film-forming properties. On the other hand, the binding protective tape using the base material according to the comparative example and the binding protective tape according to the comparative example are inferior in one or more aspects of the balance between flexibility and protection performance and the film formability of the base material. I understand.
- the binding protective tape according to the present invention has an excellent balance between flexibility and protective performance, and also has excellent film-forming properties on the base material.
- the binding protective tape according to the present invention can be suitably used for binding and protecting high-voltage cables for electric vehicles and hybrid vehicles, wire harnesses for automobiles, etc., and has industrial applicability.
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Abstract
La présente invention concerne un ruban protecteur de liaison qui présente un excellent équilibre de flexibilité et de performance de protection, et un matériau de base qui présente d'excellentes propriétés de formation de film. La présente invention concerne un ruban protecteur de liaison comprenant un matériau de base et une couche adhésive qui est formée sur une surface du matériau de base, le matériau de base étant constitué d'une composition de résine contenant une résine de polychlorure de vinyle, un plastifiant, une charge et un polyorganosiloxane ; et la teneur du polyorganosiloxane dans la composition de résine étant de 1 à 10 parties en masse pour 100 parties en masse de la résine de polychlorure de vinyle.
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WO2021029403A1 (fr) * | 2019-08-15 | 2021-02-18 | デンカ株式会社 | Ruban adhésif |
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- 2023-05-24 TW TW112119281A patent/TW202348442A/zh unknown
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JPH08291243A (ja) * | 1995-04-21 | 1996-11-05 | Zeon Kasei Co Ltd | 粉末成形用塩化ビニル樹脂組成物およびそれを用いた積層体 |
US6541558B1 (en) * | 1996-10-09 | 2003-04-01 | Res Development Corporation | Thermoplastic polymers with dispersed fluorocarbon additives |
JP3888431B2 (ja) * | 2001-11-28 | 2007-03-07 | 住友電装株式会社 | ワイヤハーネス保護材及びこれを用いたワイヤハーネス |
WO2021029403A1 (fr) * | 2019-08-15 | 2021-02-18 | デンカ株式会社 | Ruban adhésif |
CN111748162A (zh) * | 2020-06-30 | 2020-10-09 | 江门市支点光电科技有限公司 | 一种导热pvc组合物及其制备方法 |
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