WO2023233458A1 - 接続構造及び接続構造の製造方法 - Google Patents

接続構造及び接続構造の製造方法 Download PDF

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Publication number
WO2023233458A1
WO2023233458A1 PCT/JP2022/021908 JP2022021908W WO2023233458A1 WO 2023233458 A1 WO2023233458 A1 WO 2023233458A1 JP 2022021908 W JP2022021908 W JP 2022021908W WO 2023233458 A1 WO2023233458 A1 WO 2023233458A1
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WO
WIPO (PCT)
Prior art keywords
insulated wires
connection structure
tip
adhesive
center conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/021908
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
正道 山本
恭一郎 中次
孝佳 鯉沼
雅弘 松本
詩穂 服部
生未 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to US18/868,695 priority Critical patent/US20250357688A1/en
Priority to PCT/JP2022/021908 priority patent/WO2023233458A1/ja
Priority to JP2024524522A priority patent/JPWO2023233458A1/ja
Publication of WO2023233458A1 publication Critical patent/WO2023233458A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections

Definitions

  • the present disclosure relates to a connection structure and a method for manufacturing the connection structure.
  • connection structure is described in Japanese Unexamined Patent Publication No. 2015-201280 (Patent Document 1).
  • the connection structure described in Patent Document 1 includes a plurality of insulated wires, a printed wiring board, and a positioning sheet.
  • each of the plurality of insulated wires the conductor is exposed from the insulating layer at the tip in the axial direction.
  • the printed wiring board has a plurality of connected parts arranged in a row. The tip end of each of the plurality of insulated wires is soldered to each of the plurality of connected parts.
  • the positioning sheet has an adhesive layer and a base film. The adhesive layer is bonded to the tips of the plurality of insulated wires. The base film is placed on the adhesive layer. The longitudinal direction of the positioning sheet is along the direction in which the plurality of connected parts are lined up and the direction in which the plurality of conductors of the insulated wires are lined up.
  • connection structure described in Patent Document 1 is manufactured by the following method. First, a positioning step is performed. A jig is used in the positioning process. A plurality of positioning grooves are formed on the surface of the jig. The pitch between two adjacent ones of the plurality of positioning grooves is equal to the pitch between two adjacent ones of the plurality of connected parts. The tip end portion of each of the plurality of insulated wires is arranged in each of the plurality of positioning grooves.
  • a positioning sheet is attached to the conductor.
  • the adhesive layer is bonded to the tips of the plurality of insulated wires.
  • the tips of each of the plurality of insulated wires are placed on each of the plurality of connected parts, and the adhesive layers at both longitudinal ends of the positioning sheet are bonded to the printed wiring board. .
  • the tips of each of the plurality of insulated wires are soldered to each of the plurality of connected parts.
  • the connection structure of the present disclosure includes a plurality of insulated wires, a plurality of connected parts, and an adhesive.
  • Each of the plurality of insulated wires has a center conductor and an insulating layer covering the circumferential surface of the center conductor.
  • a central conductor is exposed from the insulating layer at the axial end of each of the plurality of insulated wires.
  • the plurality of connected parts are arranged in a row.
  • the tip end of each of the plurality of insulated wires is soldered to each of the plurality of connected parts.
  • the adhesive is bonded to the side surface of the tip of at least one of the plurality of insulated wires.
  • FIG. 1 is a plan view of the connection structure 100.
  • FIG. 2 is a sectional view taken along line II-II in FIG.
  • FIG. 3 is a sectional view taken along line III-III in FIG.
  • FIG. 4 is a sectional view taken along IV-IV in FIG.
  • FIG. 5 is a manufacturing process diagram of the connection structure 100.
  • FIG. 6 is a cross-sectional view illustrating the positioning step S2.
  • FIG. 7 is a cross-sectional view illustrating the bonding step S3.
  • FIG. 8A is a first cross-sectional view illustrating the soldering process S4.
  • FIG. 8B is a second sectional view illustrating the soldering step S4.
  • FIG. 9 is a side view of the insulated wire 20 used in the connection structure 100 according to the first modification.
  • FIG. 10 is a cross-sectional view taken along line XX in FIG.
  • FIG. 11 is a sectional view taken along line XI-XI in FIG.
  • FIG. 12 is a cross-sectional view of an insulated wire 20 used in a connection structure 100 according to a second modification.
  • FIG. 13 is a cross-sectional view of a connection structure 100 according to a second modification.
  • FIG. 14 is a plan view of a connection structure 100 according to modification 3.
  • FIG. 15 is a plan view of the connection structure 200.
  • FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. 15.
  • FIG. 17 is a manufacturing process diagram of the connection structure 200.
  • FIG. 18 is a plan view of the connection structure 300.
  • FIG. 19 is a sectional view taken along line XIX-XIX in FIG.
  • FIG. 20 is a manufacturing process diagram of the connection structure 300.
  • connection structure described in Patent Document 1 the adhesive layer is bonded only to the upper ends of the tip portions of the plurality of insulated wires. Therefore, in the connection structure described in Patent Document 1, the position of the tip of each of the plurality of insulated wires is insufficiently fixed, and when soldering is performed, the position of the tip of each of the plurality of insulated wires is There is a risk that the positions of the connected parts may become inconsistent with each other.
  • the present disclosure has been made in view of the problems of the prior art as described above. More specifically, the present disclosure provides a connection that can suppress mismatch between the position of the tip of each of a plurality of insulated wires and the position of each of a plurality of connected parts during soldering. Provide structure.
  • connection structure of the present disclosure it is possible to prevent the positions of the tips of each of the plurality of insulated wires and the positions of each of the plurality of connected parts from becoming inconsistent with each other during soldering.
  • a connection structure includes a plurality of insulated wires, a plurality of connected parts, and an adhesive.
  • Each of the plurality of insulated wires has a center conductor and an insulating layer covering the circumferential surface of the center conductor.
  • a central conductor is exposed from the insulating layer at the axial end of each of the plurality of insulated wires.
  • the plurality of connected parts are arranged in a row.
  • the tip end of each of the plurality of insulated wires is soldered to each of the plurality of connected parts.
  • the adhesive is bonded to the side surface of the tip of at least one of the plurality of insulated wires.
  • connection structure (1) it is possible to prevent the positions of the tips of each of the plurality of insulated wires and the positions of each of the plurality of connected parts from becoming inconsistent with each other during soldering. be.
  • the pitch between two adjacent parts of the plurality of connected parts may be 200 ⁇ m or less.
  • connection structure (2) even if the pitch between two adjacent parts of the plurality of connected parts is small, the position of the tip of each of the plurality of insulated wires and the plurality of It is possible to prevent the positions of the connected parts from becoming inconsistent with each other.
  • the tips of each of the plurality of insulated wires may be fixed to each other with an adhesive.
  • connection structure of (1) or (2) above may further include a base material and a sealing member.
  • the plurality of connected parts may be arranged on the base material.
  • the sealing member may be arranged on the base material so as to cover the tips of the plurality of insulated wires and the plurality of connected parts.
  • connection structure (4) above it is possible to reduce the height of the connection portion between the tip end portion of each of the plurality of insulated wires and each of the plurality of connected portions, and increase the reliability of the connection portion.
  • the thickness of the sealing member on the tip portion may be 100 ⁇ m or less.
  • the tip of at least one of the plurality of insulated wires has a distance from the upper end of the tip of 1/10 of the average diameter of the tip and 3 ⁇ m.
  • the adhesive may be bonded to a portion of the circumferential surface of the tip portion which is larger than the smaller one.
  • the tip of at least one of the plurality of insulated wires has a distance from the upper end of the tip of 1/3 of the average diameter of the tip and 10 ⁇ m.
  • the adhesive may be bonded to a portion of the circumferential surface of the tip portion which is larger than the smaller one.
  • a method for manufacturing a connection structure includes a step of preparing a plurality of insulated wires.
  • Each of the plurality of insulated wires has a center conductor and an insulating layer covering the circumferential surface of the center conductor.
  • a central conductor is exposed from the insulating layer at the axial end of each of the plurality of insulated wires.
  • a method for manufacturing a connection structure according to an embodiment includes a step of positioning the tips of a plurality of insulated wires, a step of bonding the tips of the plurality of insulated wires with an adhesive after the positioning is performed, and a step of bonding the tips of the plurality of insulated wires with an adhesive.
  • the method further includes the step of soldering the tips of the plurality of insulated wires to each of the plurality of connected parts arranged in a row after the tips of the plurality of insulated wires are bonded.
  • the adhesive is bonded to the side surfaces of the tips of the plurality of insulated wires so that the tips of the plurality of insulated wires are fixed to each other.
  • connection structure in (8) above it is possible to prevent the position of the tip of each of the plurality of insulated wires from becoming inconsistent with the position of each of the plurality of connected parts during soldering. Can be suppressed.
  • the method for manufacturing a connection structure according to (8) above includes the step of peeling off the adhesive from the plurality of tips after the tips of each of the plurality of insulated wires are soldered to each of the plurality of connected parts. You may also have more.
  • connection structure of (9) it is possible to reduce the height of the connection portion between the tip end portion of each of the plurality of insulated wires and each of the plurality of connected portions.
  • connection structure in the method for manufacturing a connection structure according to (9) above, a plurality of connected parts may be arranged on the base material.
  • the method for manufacturing a connection structure in (9) above further includes a step of covering the tips of the plurality of insulated wires and the plurality of connected parts with a sealing member after the adhesive is peeled off from the tips of the plurality of insulated wires. You may be prepared.
  • connection structure described in (10) above, it is possible to reduce the height of the connection portion between the tip end portion of each of the plurality of insulated wires and each of the plurality of connected portions, and to increase the reliability of the connection portion. It is possible.
  • the tips of the plurality of insulated wires are heated and pressurized. It may also be bonded to an adhesive by being glued.
  • connection structure 100 A connection structure according to the first embodiment will be explained.
  • the connection structure according to the first embodiment is referred to as a connection structure 100.
  • FIG. 1 is a plan view of the connection structure 100.
  • the connection structure 100 includes a printed wiring board 10, a plurality of insulated wires 20, and a pitch fixing film 30.
  • the plurality of insulated wires 20 are obtained by dividing one wire assembly.
  • FIG. 2 is a sectional view taken along II-II in FIG. 1.
  • the printed wiring board 10 includes a base material 11 and a plurality of wirings 12.
  • the base material 11 has a first main surface 11a and a second main surface 11b.
  • the first main surface 11a and the second main surface 11b are end faces of the base material 11 in the thickness direction.
  • the base material 11 has a plate shape or a film shape, and is made of an electrically insulating material.
  • the base material 11 is made of, for example, a resin material.
  • the base material 11 is formed of, for example, glass epoxy.
  • the base material 11 is formed of, for example, polyimide, polyethylene terephthalate, or the like.
  • the constituent material of the base material 11 may contain fillers, additives, and the like.
  • the wiring 12 is arranged on the first main surface 11a.
  • the wiring 12 extends along the first direction DR1 in a plan view.
  • Plane view refers to a view from a direction perpendicular to the first principal surface 11a.
  • the plurality of wirings 12 are lined up at intervals in the second direction DR2. It is preferable that the plurality of wirings 12 are arranged at equal intervals in the second direction DR2.
  • the second direction DR2 is a direction orthogonal to the first direction DR1.
  • connection pad 12a The end of the wiring 12 in the first direction DR1 is a connection pad 12a.
  • the connection pad 12a becomes a connected portion to which the tip portion 20a is connected.
  • the connection pads 12a of the plurality of wirings 12 are arranged at intervals in the second direction DR2. It is preferable that the connection pads 12a of the plurality of wirings 12 are arranged at equal intervals.
  • the pitch between two adjacent connection pads 12a of the plurality of wirings 12 is defined as a pitch P.
  • the pitch P is the distance between the center of one connection pad 12a in the second direction DR2 and the center of another connection pad 12a adjacent to the one connection pad 12a in the second direction DR2. It is preferable that the pitch P is 200 ⁇ m or less.
  • the surface of the connection pad 12a may be subjected to a plating process such as tin (Sn) plating process or gold (Au) plating process.
  • the wiring 12 is made of a conductive material.
  • the wiring 12 is made of copper (Cu) or a copper alloy, for example.
  • the wiring 12 is formed, for example, by etching a conductive material placed on the base material 11 using a resist pattern as a mask.
  • the method of forming the wiring 12 is not limited to this.
  • the lower limit of the average thickness of the wiring 12 is preferably 3 ⁇ m, more preferably 5 ⁇ m, from the viewpoint of reducing the resistance of the wiring 12.
  • the upper limit of the average thickness of the wiring 12 is preferably 100 ⁇ m, and more preferably 50 ⁇ m.
  • the lower limit of the average width of the connection pads 12a is preferably 0.8 times the average diameter of the center conductor 21 from the viewpoint of ensuring connectivity with the center conductor 21, and is 1.0 times the average diameter of the center conductor 21. More preferably, it is twice as large.
  • the upper limit of the average width of the connection pads 12a is preferably 5.0 times the average diameter of the center conductor 21, and 3.0 times the average diameter of the center conductor 21. It is more preferable that the diameter be 2.0 times the average diameter of the center conductor 21.
  • FIG. 3 is a cross-sectional view taken along III-III in FIG. 1.
  • the insulated wire 20 has a center conductor 21 and an insulating layer 22.
  • the center conductor 21 is made of a conductive material.
  • the center conductor 21 is a metal wire made of, for example, copper, copper alloy, aluminum (Al), aluminum alloy, or the like.
  • the center conductor 21 is, for example, circular in cross-sectional view perpendicular to the axial direction.
  • the “axial direction” is the direction in which the insulated wire 20 extends.
  • the cross-sectional shape of the center conductor 21 is not limited to this.
  • the center conductor 21 may be square or rectangular, for example.
  • the lower limit of the average diameter of the center conductor 21 is preferably 10 ⁇ m, and more preferably 15 ⁇ m.
  • the upper limit of the average diameter of the center conductor 21 is preferably 500 ⁇ m, more preferably 200 ⁇ m.
  • the insulating layer 22 covers the peripheral surface of the center conductor 21.
  • the insulating layer 22 is made of a flexible electrically insulating material.
  • the insulating layer 22 is made of, for example, ethylene resin, a resin obtained by mixing ethylene resin with polyolefin, polyimide, polyamideimide, polyurethane, a silane crosslinked resin composition, a fluororesin, or the like.
  • ethylene resin include polyethylene, ethylene vinyl acetate copolymer, ethylene ethyl acrylate copolymer, and the like.
  • polyolefins include polypropylene, ethylene propylene rubber, styrene elastomer, and the like.
  • Specific examples of the fluororesin include PTFE (polytetrafluoroethylene), PFA (perfluoroalkoxyalkane), FEP (perfluoroethylene propene copolymer), and the like.
  • the insulating layer 22 can be formed, for example, by extruding the constituent material of the insulating layer 22 in a molten state onto the circumferential surface of the central conductor 21 and curing it, or by applying a paint in which the constituent material of the insulating layer 22 is dissolved in an organic solvent to the central conductor 21. It is arranged on the circumferential surface of the center conductor 21 by applying it onto the circumferential surface and then baking it.
  • the average thickness of the insulating layer 22 is, for example, 3 ⁇ m or more and 1 mm or less.
  • the insulated wire 20 has a tip 20a in the axial direction.
  • the insulating layer 22 is removed from the circumferential surface of the center conductor 21. That is, the tip portion 20a is composed of the center conductor 21.
  • the average length of the tip portion 20a in the axial direction is, for example, 0.2 mm or more and 3.0 mm or less.
  • a primer layer may be interposed between the circumferential surface of the center conductor 21 and the insulating layer 22 in order to improve the adhesion between the circumferential surface of the center conductor 21 and the insulating layer 22. good.
  • the primer layer is formed of, for example, a cured crosslinkable resin such as ethylene that does not contain metal hydroxide.
  • FIG. 4 is a cross-sectional view taken along IV-IV in FIG. 1.
  • the tip portion 20a of each of the plurality of insulated wires 20 is connected to each of the plurality of connection pads 12a by a connection portion 40.
  • the connecting portion 40 is formed of a solder alloy such as a tin-silver-copper alloy, a tin-zinc (Zn)-bismuth (Bi) alloy, a tin-copper alloy, a tin-silver-indium (In)-bismuth alloy, etc.
  • a solder alloy such as a tin-silver-copper alloy, a tin-zinc (Zn)-bismuth (Bi) alloy, a tin-copper alloy, a tin-silver-indium (In)-bismuth alloy, etc.
  • the pitch fixing film 30 has a base material 31 and an adhesive 32.
  • the base material 31 is, for example, a film-like member.
  • the base material 31 has a first main surface 31a and a second main surface 31b.
  • the first main surface 31a and the second main surface 31b are end faces of the base material 31 in the thickness direction.
  • the first main surface 31a faces the base material 11 (printed wiring board 10) side.
  • the lower limit of the average thickness of the base material 31 is preferably 5 ⁇ m, and more preferably 10 ⁇ m.
  • the upper limit of the average thickness of the base material 31 is preferably 100 ⁇ m, and more preferably 50 ⁇ m.
  • the base material 31 is made of, for example, super engineering plastic.
  • super engineering plastics include polyimide, polyamideimide, polyetherimide, polyetheretherketone, polyphenylene sulfide, polyarylate, liquid crystal polymer, polysulfone, polyethersulfone, and fluororesins other than polytetrafluoroethylene. Can be mentioned.
  • the adhesive 32 is arranged in a layered manner on the first main surface 31a.
  • the adhesive 32 has a first surface 32a and a second surface 32b.
  • the first surface 32a is a surface in contact with the base material 31 (first main surface 31a).
  • the second surface 32b is the opposite surface to the first surface 32a.
  • the average thickness of the adhesive 32 is smaller than the average thickness of the base material 31, for example. From the viewpoint of ensuring the strength of the adhesive 32, the lower limit of the average thickness of the adhesive 32 is preferably 5 ⁇ m, and more preferably 10 ⁇ m. From the viewpoint of reducing the height of the connection structure 100, the average thickness of the adhesive 32 is preferably 100 ⁇ m, and more preferably 50 ⁇ m.
  • the adhesive 32 is, for example, a thermosetting adhesive whose main component is a thermosetting resin.
  • the thermosetting resin is, for example, an epoxy resin containing a curing agent.
  • epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, copolymerization type epoxy resin of bisphenol A type and bisphenol F type, and naphthalene type epoxy resin. Examples include epoxy resin, novolac type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, and the like.
  • the adhesive 32 may contain at least one of these epoxy resins.
  • the epoxy resin used for the adhesive 32 is preferably a combination of an epoxy resin with a molecular weight of 15,000 or more and an epoxy resin with a molecular weight of 2,000 or less.
  • the molecular weight of the epoxy resin is the molecular weight in terms of polystyrene determined from gel permeation chromatography (GPC) developed with tetrahydrofuran (THF).
  • a latent curing agent is a curing agent that has excellent storage stability at low temperatures and hardly causes a curing reaction at room temperature, but quickly performs a curing reaction when exposed to heat, light, or the like.
  • Specific examples of latent curing agents include imidazole type, hydrazide type, boron trifluoride-amine complex, amine imide, polyamine type, tertiary amine, amine type such as alkyl urea type, dicyandiamide type, acid anhydride type, and Examples include phenolic compounds and modified products thereof.
  • a curing agent for the epoxy resin one type or a mixture of two or more of these can be used.
  • the curing agent contained in the epoxy resin is preferably an imidazole-based latent curing agent from the viewpoint of storage stability and rapid curing at low temperatures.
  • imidazole-based latent curing agents include adducts of imidazole compounds with epoxy resins.
  • Specific examples of imidazole compounds include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-propylimidazole, 2-dodecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 4-methylimidazole, etc. Can be mentioned.
  • the imidazole-based latent curing agent is preferably microencapsulated from the viewpoint of long-term storage stability and fast curing.
  • Microcapsules are made of polymer materials, metal materials, and inorganic materials.
  • polymeric materials include polymeric materials containing polyurethane, polyester, etc. as a main component.
  • metal material include nickel, copper, and the like.
  • inorganic materials include calcium silicate and the like.
  • the adhesive 32 may be a thermoplastic adhesive whose main component is a thermoplastic resin.
  • thermoplastic resins include polyvinyl acetal such as polyvinyl butyral, phenoxy resin, acrylic resin, methacrylic resin, polyamide, polyacetal, polyphenylene sulfide, polyimide, polytetrafluoroethylene, polyether ether ketone, polyether sulfone, urethane, Examples include polyester, polyethylene, polypropylene, polystyrene, and the like.
  • the thermoplastic resin is preferably phenoxy resin, polyamide, polyimide, or the like.
  • the base material 31 and adhesive 32 have transparency. Thereby, the tip portion 20a can be visually recognized through the base material 31 and the adhesive 32, so that the manufacturability of the connection structure 100 is improved.
  • the tip portion 20a has an upper end 20b.
  • the distance between the tip portion 20a and the first main surface 31a (first surface 32a) in the third direction DR3 is smallest at the upper end 20b.
  • the third direction DR3 is a direction orthogonal to the first direction DR1 and the second direction DR2.
  • the third direction DR3 corresponds to the normal direction of the first main surface 11a.
  • the adhesive 32 is bonded to the side surface of the tip 20a.
  • the adhesive 32 is bonded to the side surface of the tip 20a means that the distance from the upper end 20b in the third direction DR3 is either 1/10 of the average diameter of the tip 20a (center conductor 21) or 3 ⁇ m. This means that the adhesive 32 is bonded to the portion of the circumferential surface of the tip portion 20a that is larger than the smaller portion. To put this from another perspective, the distance between the upper end 20b and the second surface 32b in the third direction DR3 is the smaller of 1/10 of the average diameter of the tip portion 20a (center conductor 21) or 3 ⁇ m. It is larger than the other.
  • the adhesive 32 extends to a portion of the circumferential surface of the tip 20a where the distance from the upper end 20b in the third direction DR3 is greater than either 1/3 of the average diameter of the tip 20a (center conductor 21) or 10 ⁇ m, whichever is smaller. It may be glued.
  • the lower limit of the thickness of the adhesive 32 between the upper end 20b and the base material 31 is preferably 1/10 of the average diameter of the center conductor 21. Preferably, it is more preferably 1/5 of the average diameter of the center conductor 21.
  • the upper limit of the thickness of the adhesive 32 between the upper end 20b and the base material 31 is preferably 2/3 of the average diameter of the center conductor 21 from the viewpoint of reducing the height of the connection structure 100. It is more preferable that the average diameter is 1/2 of the average diameter of 21.
  • the upper end 20b may be in contact with the base material 31. That is, the lower limit of the thickness of the adhesive 32 between the upper end 20b and the base material 31 may be 0.
  • the adhesive strength between the tip 20a and the adhesive 32 is preferably lower than the bonding strength between the tip 20a and the connection pad 12a.
  • the tip portion 20a protrudes from the pitch fixing film 30 in plan view.
  • the lower limit of the length of the tip portion 20a protruding from the pitch fixing film 30 is preferably 10 ⁇ m, more preferably 20 ⁇ m.
  • the upper limit of the length of the tip portion 20a protruding from the pitch fixing film 30 is preferably 200 ⁇ m, more preferably 150 ⁇ m.
  • the insulating layer 22 adjacent to the tip portion 20a overlaps the pitch fixing film 30 in plan view. That is, the insulating layer 22 adjacent to the tip portion 20a is bonded with the adhesive 32. Thereby, the boundary between the insulating layer 22 adjacent to the tip 20a and the tip 20a is protected by the adhesive 32.
  • the lower limit of the width of the overlap between the insulating layer 22 and the pitch fixing film 30 adjacent to the tip portion 20a is preferably 10 ⁇ m, and preferably 20 ⁇ m.
  • the upper limit of the width of the overlap between the insulating layer 22 and the pitch fixing film 30 adjacent to the tip portion 20a is preferably 500 ⁇ m, and preferably 300 ⁇ m.
  • the pitch fixing film 30 at least partially overlaps the plurality of connection pads 12a in plan view. Both ends of the pitch fixing film 30 in the second direction DR2 are located at positions that protrude further outward than the outermost connection pad 12a in the second direction DR2.
  • the lower limit of the amount of protrusion of both ends of the pitch fixing film 30 in the second direction DR2 is preferably twice the average diameter of the center conductor 21, and preferably 2.5 times the average diameter of the center conductor 21. More preferred.
  • the upper limit of the amount of protrusion of both ends of the pitch fixing film 30 in the second direction DR2 is preferably 100 times the average diameter of the center conductor 21, and more preferably 50 times the average diameter of the center conductor 21. .
  • Both ends of the pitch fixing film 30 in the second direction DR2 may be bonded to the first main surface 11a, or may not be bonded to the first main surface 11a.
  • FIG. 5 is a manufacturing process diagram of the connection structure 100.
  • the method for manufacturing the connection structure 100 includes a preparation step S1, a positioning step S2, an adhesion step S3, and a soldering step S4.
  • the positioning step S2 is performed after the preparation step S1.
  • the bonding step S3 is performed after the positioning step S2.
  • the soldering process S4 is performed after the bonding process S3.
  • a plurality of insulated wires 20 are prepared.
  • a plurality of insulated wires 20 are divided from the assembled wire.
  • the insulating layer 22 is removed at the tip 20a. Removal of the insulating layer 22 is performed by cutting the insulating layer 22 by irradiating a laser and peeling off the cut insulating layer 22.
  • FIG. 6 is a cross-sectional view illustrating the positioning step S2. As shown in FIG. 6, the positioning step S2 is performed using a jig 50.
  • the jig 50 is placed on a pedestal 51.
  • the jig 50 has a first surface 50a and a second surface 50b.
  • the first surface 50a is a surface facing the pedestal 51 side.
  • the second surface 50b is the opposite surface to the first surface 50a.
  • a plurality of positioning grooves 50c are formed on the second surface 50b.
  • the positioning groove 50c extends linearly.
  • the positioning groove 50c has a V-shape, for example, in a cross-sectional view orthogonal to the extending direction of the positioning groove 50c.
  • the positioning groove 50c may be U-shaped in a cross-sectional view orthogonal to the extending direction of the positioning groove 50c.
  • the plurality of positioning grooves 50c are arranged at intervals in a direction perpendicular to the direction in which the positioning grooves 50c extend.
  • the pitch between two adjacent positioning grooves 50c is set to match the pitch P.
  • the tips 20a of each of the plurality of insulated wires 20 are arranged in each of the plurality of positioning grooves 50c. Thereby, the pitch between two adjacent tips 20a of the plurality of insulated wires 20 is adjusted to match the pitch P.
  • FIG. 7 is a cross-sectional view illustrating the bonding step S3.
  • the pitch fixing film 30 is bonded to the tip portions 20a of the plurality of insulated wires 20 using the adhesive 32.
  • the pitch fixing film 30 is placed on the tip portions 20a of the plurality of insulated wires 20.
  • the tips 20a of the plurality of insulated wires 20 are in contact with the adhesive 32.
  • the adhesive 32 has not been cured.
  • the heating body 60 is brought into contact with the first principal surface 31a, and the heating body 60 presses the pitch fixing film 30 toward the tips 20a of the plurality of insulated wires 20.
  • the side surfaces of the tip portions 20a of the plurality of insulated wires 20 are adhered to the adhesive 32, and the tip portions 20a of the plurality of insulated wires 20 are fixed to each other.
  • the adhesive 32 is a thermosetting adhesive
  • the adhesive 32 is turned into a B stage by heating with the heating element 60. After the bonding step S3 is performed, the jig 50 is removed.
  • the pitch between two adjacent ones of the plurality of insulated wires 20 does not change even after the jig 50 is removed. It's tough.
  • the heating temperature in the bonding step S3 may be a temperature at which the viscosity of the adhesive 32 is reduced so that a portion of the tip portion 20a is buried in the adhesive 32.
  • the heating temperature in the bonding step S3 is, for example, 170°C or more and 350°C or less, and preferably 200°C or more and 320°C or less.
  • the pressure applied in the bonding step S3 may be such that a portion of the tip portion 20a is buried in the softened adhesive 32.
  • the pressure applied in the bonding step S3 is, for example, 0.1 MPa or more and 15 MPa or less, and preferably 0.5 MPa or more and 10 MPa or less.
  • the tip 20a will be too buried in the adhesive 32 (that is, the tip 20a will be covered with the adhesive 32), and the tip will be damaged. It becomes impossible to connect the portion 20a and the connection pad 12a.
  • the heating temperature in the bonding step S3 and the pressure applied in the bonding step S3 are too small, the tip 20a will not be buried in the adhesive 32 (that is, the adhesive 32 will not adhere to the side surface of the tip 20a), The force for maintaining the pitch between the tips 20a of two adjacent insulated wires 20 becomes weaker.
  • FIG. 8A is a first cross-sectional view illustrating the soldering step S4.
  • FIG. 8B is a second sectional view illustrating the soldering step S4.
  • a connection portion 40 is formed, and the tip portion 20a of each of the plurality of insulated wires 20 is soldered to each of the plurality of connection pads 12a.
  • the tip portions 20a of each of the plurality of insulated wires 20 are placed on each of the plurality of connection pads 12a with the plate-shaped solder 41 interposed therebetween.
  • the heating body 61 is brought into contact with the first main surface 31a, and the heating body 61 presses the pitch fixing film 30 toward the tip portions 20a of the plurality of insulated wires 20.
  • the plate-shaped solder 41 is melted, and the tips 20a of each of the plurality of insulated wires 20 are soldered to each of the plurality of connection pads 12a.
  • bar-shaped solder may be used instead of the plate-shaped solder 41.
  • flux may be supplied to at least one of the surface of the plate-shaped solder 41 (rod-shaped solder), the surface of the tip portion 20a, and the surface of the connection pad 12a. This flux is, for example, an organic acid-based or rosin-based flux.
  • soldering may be performed by bringing the heating body 61 into contact with the second main surface 11b to melt the plate-shaped solder 41 (rod-shaped solder).
  • connection structure 100 The effects of the connection structure 100 will be explained below.
  • the position of the tip portions 20a of each of the plurality of insulated wires 20 is fixed. may be insufficient.
  • the position of the tip end 20a of each of the plurality of insulated wires 20 may be shifted from the position of each of the plurality of connection pads 12a, which may result in defective soldering. be. This becomes particularly noticeable when the pitch P is small (for example, when the pitch P is 200 ⁇ m or less).
  • connection structure 100 the adhesive 32 is bonded to the side surfaces of the tip portions 20a of the plurality of insulated wires 20. Therefore, in the connection structure 100, the positions of the tips 20a of each of the plurality of insulated wires 20 are more firmly fixed with the adhesive 32. As a result, according to the connection structure 100, when soldering is performed, the position of the tip end 20a of each of the plurality of insulated wires 20 is difficult to shift from the position of each of the plurality of connection pads 12a, resulting in defective soldering. It is possible to prevent this from happening.
  • Samples 1 to 3 were prepared as samples of connection structures.
  • the average diameter of the tip portion 20a (center conductor 21) was 32 ⁇ m, and the thickness of the insulating layer 22 was 5 ⁇ m.
  • the thickness of the base material 31 was 12 ⁇ m, and the base material 31 was made of polyimide.
  • the thickness of the adhesive 32 was 12 ⁇ m, and the adhesive 32 was an epoxy thermosetting adhesive.
  • the printed wiring board 10 was a flexible printed wiring board, and the pitch P was 120 ⁇ m (including the width of the wiring 12 of 80 ⁇ m and the interval between adjacent wirings 12 of 40 ⁇ m).
  • the adhesive 32 is applied to the circumference of the tip 20a where the distance from the upper end 20b in the third direction DR3 is 1 ⁇ m (1/32 of the average diameter of the tip 20a). It was glued to the surface. That is, in sample 3, the adhesive 32 was not adhered to the side surface of the tip portion 20a.
  • the adhesive 32 is applied to the tip portion 20a such that the distance from the upper end 20b in the third direction DR3 is 16 ⁇ m (1/2 of the average diameter of the tip portion 20a). It was glued all the way to the periphery.
  • the adhesive 32 is applied to the tip portion 20a at a distance of 4 ⁇ m (1/8 of the average diameter of the tip portion 20a) from the upper end 20b in the third direction DR3 after the soldering step S4 is performed. It was glued all the way to the periphery.
  • FIG. 9 is a side view of the insulated wire 20 used in the connection structure 100 according to the first modification.
  • FIG. 10 is a cross-sectional view taken along line XX in FIG.
  • the center conductor 21 may be a twisted wire obtained by twisting a plurality of wires 21a.
  • the average diameter of the tip portion 20a is determined based on a virtual circumscribed circle (indicated by a dotted line in FIG. 10) that circumscribes the plurality of wires 21a, and also determined based on the circumscribed circle. Based on the average diameter of the tip 20a, it is determined whether the adhesive 32 is adhered to the side surface of the tip 20a.
  • the number of strands 21a constituting the center conductor 21 is not particularly limited, but is, for example, 2 or more and 20 or less.
  • FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 9.
  • the insulated wire 20 may further include a plurality of outer conductors 23 and a jacket 24. That is, the insulated wire 20 may be a coaxial wire.
  • the outer conductor 23 is, for example, a metal wire made of copper or a copper alloy.
  • the outer conductor 23 may be formed by performing silver plating, tin plating, etc. on the surface of this metal wire.
  • the outer conductor 23 extends along the axial direction on the circumferential surface of the insulating layer 22.
  • the outer conductor 23 may be spirally wound.
  • the plurality of external conductors 23 cover the insulating layer 22 by being lined up along the circumferential surface of the insulating layer 22 .
  • the cross-sectional shape of the external conductor 23 is, for example, circular, square, or rectangular.
  • the lower limit of the average diameter of the outer conductor 23 is preferably 10 ⁇ m, more preferably 15 ⁇ m, from the viewpoint of suppressing breakage of the outer conductor 23.
  • the upper limit of the average diameter of the outer conductor 23 is preferably 500 ⁇ m, more preferably 200 ⁇ m, from the viewpoint of preventing the outer diameter of the insulated wire 20 from becoming excessively large.
  • the outer sheath 24 covers the plurality of external conductors 23.
  • the outer cover 24 is made of a flexible electrically insulating material.
  • the outer cover 24 is made of, for example, polyester resin such as polyethylene terephthalate.
  • the outer cover 24 may be formed of the same material as the insulating layer 22.
  • the insulated wire 20 has an adjacent portion 20c adjacent to the tip portion 20a in the axial direction. At the tip portion 20a, the center conductor 21 is exposed by removing the insulating layer 22, the plurality of outer conductors 23, and the outer sheath 24. In the adjacent portion 20c, the plurality of external conductors 23 are exposed by removing the outer cover 24. Note that the plurality of external conductors 23 are also removed from the tip end 20a side of the adjacent portion 20c.
  • the plurality of external conductors 23 exposed in the adjacent portion 20c are electrically connected, for example, to a ground wire (not shown) arranged on the first main surface 11a by soldering or the like, and set to a ground potential. This functions as a shield to suppress electrical interference from other circuits.
  • the average length of the adjacent portions 20c in the axial direction is, for example, 0.1 mm or more and 5 mm or less.
  • the insulating layer 22 at the tip 20a is removed, the insulating layer 22 at the tip 20a and the adjacent portion 20c is removed.
  • the outer sheath 24 as well as the plurality of outer conductors 23 at the tip 20a are removed.
  • FIG. 12 is a cross-sectional view of an insulated wire 20 used in a connection structure 100 according to a second modification.
  • the tip portion 20a may include a center conductor 21 and a solder layer 42 covering the center conductor 21.
  • the average diameter of the solder layer 42 and the upper end of the solder layer 42 become the average diameter and the upper end 20b of the tip 20a, respectively, and it is determined based on these whether the adhesive 32 is bonded to the side surface of the tip 20a.
  • the solder layer 42 is formed by supplying a molten solder alloy onto the circumferential surface of the center conductor 21 at the tip portion 20a after the insulating layer 22 is removed in the preparatory step S1.
  • FIG. 13 is a cross-sectional view of a connection structure 100 according to Modification 2.
  • FIG. 13 shows a cross section of the connection structure 100 according to Modification 2 at a position corresponding to FIG. 4 .
  • the surface of the connection pad 12a may be covered with a solder layer 43.
  • the solder layer 43 is formed, for example, by plating the surface of the connection pad 12a.
  • the solder layer 42 and the solder layer 43 are bonded to each other to form the connection portion 40 by heating in the soldering step S4. Note that when the tip portion 20a has the solder layer 42 and the surface of the connection pad 12a is covered with the solder layer 43, the plate-shaped solder 41 (rod-shaped solder) is not used in the soldering process S4. , the flux is supplied to at least one of the surfaces of the solder layer 42 and the solder layer 43.
  • FIG. 14 is a plan view of a connection structure 100 according to modification 3. As shown in FIG. 14, the pitch fixing film 30 does not need to overlap the plurality of connection pads 12a in plan view.
  • the adhesive 32 does not need to be placed on the base material 31 in advance. That is, in the bonding step S3, the base material 31 may be bonded onto the adhesive 32 after the adhesive 32 is bonded to the tip portions 20a of the plurality of insulated wires 20.
  • the connected part to which the tip end 20a is connected is a connection pad of a printed wiring board, but the connected part may be provided on an electronic component other than the printed wiring board (for example, a connector). Good too.
  • connection structure 200 A connection structure according to a second embodiment will be explained.
  • the connection structure according to the second embodiment is referred to as a connection structure 200.
  • points different from the connection structure 100 will be mainly explained, and duplicate explanations will not be repeated.
  • connection structure 200 includes a printed wiring board 10 and a plurality of insulated wires 20. As shown in FIG. In this regard, the configuration of connection structure 200 is common to the configuration of connection structure 100.
  • connection structure 200 does not have the pitch fixing film 30.
  • FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. 15.
  • an adhesive 32 is bonded to the side surface of the tip end 20a of at least one of the plurality of insulated wires 20.
  • the adhesive 32 is bonded to the side surface of at least one tip 20a of the plurality of insulated wires 20 other than both ends in the second direction DR2.
  • the configuration of connection structure 200 differs from the configuration of connection structure 100 in these respects.
  • FIG. 17 is a manufacturing process diagram of the connection structure 200.
  • the method for manufacturing the connection structure 200 includes a preparation step S1, a positioning step S2, an adhesion step S3, and a soldering step S4.
  • the method for manufacturing connection structure 200 is common to the method for manufacturing connection structure 100.
  • the method for manufacturing the connection structure 200 further includes a peeling step S5.
  • the peeling process S5 is performed after the soldering process S4.
  • the pitch fixing film 30 is peeled together with the adhesive 32 from the tip portions 20a of the plurality of insulated wires 20.
  • the adhesive 32 is not completely peeled off, so that the adhesive 32 partially remains on the side surface of the tip end 20a of at least one of the plurality of insulated wires 20.
  • the method for manufacturing connection structure 200 is different from the method for manufacturing connection structure 100.
  • connection structure 200 the pitch fixing film 30 is removed. Therefore, the connection structure 100 can be made lower in height than the connection structure 100 because it does not include the pitch fixing film 30.
  • the soldering step S4 it is not necessary to fix the tips 20a of the plurality of insulated wires 20 to each other using the adhesive 32. Therefore, even in the connection structure 200 without the pitch fixing film 30, the position of the tip end 20a of each of the plurality of insulated wires 20 does not shift from the position of each of the plurality of connection pads 12a when soldering is performed. , is suppressed.
  • connection structure described in Patent Document 1 the adhesive layer at both ends of the positioning sheet in the longitudinal direction is attached to the printed wiring board for more reliable connection between the tip of the insulated wire and the connected part. It is glued. Therefore, in the connection structure described in Patent Document 1, it is not assumed that the positioning sheet is peeled off from the tip of the insulated wire.
  • connection structure 300 A connection structure according to a third embodiment will be explained.
  • the connection structure according to the third embodiment is referred to as a connection structure 300.
  • points different from the connection structure 200 will be mainly explained, and duplicate explanations will not be repeated.
  • connection structure 300 The configuration of the connection structure 300 will be explained below.
  • FIG. 18 is a plan view of the connection structure 300. As shown in FIG. 18, the connection structure 300 includes a printed wiring board 10 and a plurality of insulated wires 20, but does not include a pitch fixing film 30. In this regard, the configuration of connection structure 300 is common to the configuration of connection structure 200.
  • FIG. 19 is a cross-sectional view taken along line XIX-XIX in FIG. 18.
  • the connection structure 300 further includes a sealing member 70.
  • the sealing member 70 is arranged on the first main surface 11a so as to cover the tip portions 20a of the plurality of insulated wires 20 and the plurality of connection pads 12a.
  • the sealing member 70 is made of, for example, an ultraviolet curable resin material. Let the thickness of the sealing member 70 on the tip portion 20a be the thickness T.
  • the thickness T is preferably 100 ⁇ m or less.
  • the configuration of connection structure 300 differs from the configuration of connection structure 200 in these respects.
  • FIG. 20 is a manufacturing process diagram of the connection structure 300.
  • the method for manufacturing the connection structure 200 includes a preparation step S1, a positioning step S2, an adhesion step S3, a soldering step S4, and a peeling step S5.
  • the method for manufacturing connection structure 300 is common to the method for manufacturing connection structure 200.
  • the method for manufacturing the connection structure 300 further includes a sealing step S6.
  • the sealing step S6 is performed after the peeling step S5.
  • the tip portions 20a of the plurality of insulated wires 20 and the plurality of connection pads 12a are covered with the sealing member 70.
  • the sealing member 70 is supplied onto the first main surface 11a so as to cover the tip portions 20a of the plurality of insulated wires 20 and the plurality of connection pads 12a. At this stage, the sealing member 70 is uncured.
  • the uncured sealing member 70 is irradiated with ultraviolet light.
  • the sealing member 70 is cured, and the tip portions 20a of the plurality of insulated wires 20 and the plurality of connection pads 12a are sealed with the sealing member 70.
  • the method for manufacturing connection structure 200 is different from the method for manufacturing connection structure 100.
  • connection structure 300 The effects of the connection structure 300 will be explained below.
  • the connection structure 300 includes the sealing member 70, the height of the portion where the tip portion 20a and the connection pad 12a are connected becomes large; however, if the thickness T is 100 ⁇ m or less, the height is low. Dorsal transformation is not inhibited.
  • connection structure 200 no particular protection is applied to the connection portion between the tip portion 20a and the connection pad 12a.
  • the connection structure 100 although the tips 20a of the plurality of insulated wires 20 are each fixed to each other by the adhesive 32, there is a space between two adjacent tips 20a of the plurality of insulated wires 20. There is.
  • the connection structure 300 since the sealing member 70 is arranged on the first main surface 11a so as to cover the tip portions 20a of the plurality of insulated wires 20 and the plurality of connection pads 12a, the plurality of insulated wires 20 A sealing member 70 is also filled between two adjacent tips 20a. Therefore, according to the connection structure 300, the reliability of the connection between the tip portion 20a and the connection pad 12a can be improved compared to the connection structure 100 and the connection structure 200.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
PCT/JP2022/021908 2022-05-30 2022-05-30 接続構造及び接続構造の製造方法 Ceased WO2023233458A1 (ja)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007026846A (ja) * 2005-07-15 2007-02-01 Mitsubishi Electric Corp フレキシブル回路基板及びこれを用いた表示装置
JP2010118318A (ja) * 2008-11-14 2010-05-27 Hitachi Cable Ltd 同軸ケーブルの接続部及びその接続方法
JP2011054442A (ja) * 2009-09-02 2011-03-17 Hitachi Cable Ltd 多芯ケーブルの接続部及びその接続方法
JP2011258460A (ja) * 2010-06-10 2011-12-22 Hitachi Cable Ltd ケーブル接続構造、及びケーブル接続方法
JP2013206617A (ja) * 2012-03-27 2013-10-07 Olympus Corp ケーブル接続構造、超音波探触子および超音波内視鏡システム
JP2015201280A (ja) * 2014-04-04 2015-11-12 住友電気工業株式会社 電気的接続方法、電気的接続構造、並びに絶縁電線及びプリント配線板の接続体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007026846A (ja) * 2005-07-15 2007-02-01 Mitsubishi Electric Corp フレキシブル回路基板及びこれを用いた表示装置
JP2010118318A (ja) * 2008-11-14 2010-05-27 Hitachi Cable Ltd 同軸ケーブルの接続部及びその接続方法
JP2011054442A (ja) * 2009-09-02 2011-03-17 Hitachi Cable Ltd 多芯ケーブルの接続部及びその接続方法
JP2011258460A (ja) * 2010-06-10 2011-12-22 Hitachi Cable Ltd ケーブル接続構造、及びケーブル接続方法
JP2013206617A (ja) * 2012-03-27 2013-10-07 Olympus Corp ケーブル接続構造、超音波探触子および超音波内視鏡システム
JP2015201280A (ja) * 2014-04-04 2015-11-12 住友電気工業株式会社 電気的接続方法、電気的接続構造、並びに絶縁電線及びプリント配線板の接続体

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