WO2023231432A1 - 储物空调控制装置、控制方法及储物空调 - Google Patents

储物空调控制装置、控制方法及储物空调 Download PDF

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Publication number
WO2023231432A1
WO2023231432A1 PCT/CN2023/073770 CN2023073770W WO2023231432A1 WO 2023231432 A1 WO2023231432 A1 WO 2023231432A1 CN 2023073770 W CN2023073770 W CN 2023073770W WO 2023231432 A1 WO2023231432 A1 WO 2023231432A1
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WIPO (PCT)
Prior art keywords
temperature
operating power
semiconductor component
instruction
storage air
Prior art date
Application number
PCT/CN2023/073770
Other languages
English (en)
French (fr)
Inventor
刘超超
刘丙磊
王晓飞
杨聪慧
郭克涛
Original Assignee
青岛海尔空调器有限总公司
青岛海尔空调电子有限公司
海尔智家股份有限公司
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Application filed by 青岛海尔空调器有限总公司, 青岛海尔空调电子有限公司, 海尔智家股份有限公司 filed Critical 青岛海尔空调器有限总公司
Publication of WO2023231432A1 publication Critical patent/WO2023231432A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/89—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63—Electronic processing
    • F24F11/64—Electronic processing using pre-stored data
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/02—Doors; Covers
    • F25D23/028—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00—Arrangement or mounting of control or safety devices
    • F25D29/003—Arrangement or mounting of control or safety devices for movable devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2700/00—Means for sensing or measuring; Sensors therefor
    • F25D2700/12—Sensors measuring the inside temperature

Definitions

  • the present application relates to the technical field of air conditioners, and in particular to a storage air conditioner control device, a control method and a storage air conditioner.
  • Semiconductor refrigeration is an existing mature technology.
  • the semiconductor refrigerator will produce an obvious Peltier effect under the action of direct current.
  • One of the joints will separate holes and electron pairs under the action of the electric field, and absorb the heat of the crystal lattice to form a cold end. It must It absorbs the heat of the lattice to supplement the consumption of the lattice capacity, thus becoming the cold end.
  • the other joint generates holes and electron pairs to recombine under the action of the electric field, and releases heat to the crystal lattice, thus becoming the hot end.
  • Semiconductor refrigerators are often used for cooling storage due to their small size. However, current storage air conditioners that use semiconductor refrigeration cannot adjust the cooling temperature and cooling mode, resulting in poor cooling effects.
  • This application provides a storage air conditioner control device, a control method and a storage air conditioner to solve the problem in the prior art that storage air conditioners using semiconductor refrigeration cannot adjust the refrigeration temperature and refrigeration mode and have poor cooling effects.
  • Through the controller Adjust the operating power of semiconductor components and refrigeration components to adjust the cooling effect of the storage air conditioner.
  • the storage air conditioner has a storage cavity inside and includes:
  • the cold end of the semiconductor component is located inside the storage cavity
  • a refrigeration element the refrigeration element is located inside the storage cavity
  • Controller the controller is respectively connected with the semiconductor component and the refrigeration component in communication, and is used to control the operating power of the semiconductor component and the operating power of the refrigeration component to adjust the storage cavity. Internal temperature and/or humidity.
  • the refrigeration element includes a fan
  • the controller is electrically connected to the fan and used to control the rotation rate of the fan.
  • a storage air conditioning control device provided according to the present application further includes a first radiator and a second radiator;
  • the first radiator is connected to the cold end of the semiconductor component and is used to transfer the cold generated by the cold end of the semiconductor component to the inside of the storage cavity;
  • the second heat sink is connected to the hot end of the semiconductor component and is used to transfer the heat generated by the hot end of the semiconductor component to the environmental medium.
  • a storage air conditioning control device provided by this application, it also includes a first temperature sensor, a second temperature sensor and a third temperature sensor.
  • the first temperature sensor, the second temperature sensor and the third temperature sensor electrically connected to the controller respectively;
  • the first temperature sensor is provided on the first radiator and used to monitor the first temperature of the first radiator;
  • the second temperature sensor is provided on the second radiator and used to monitor the second temperature of the second radiator;
  • the third temperature sensor is disposed on the inner wall of the storage cavity and is used to monitor the third temperature of the storage cavity.
  • a storage air-conditioning control device provided according to the present application also includes an insulation layer component
  • the insulation layer component is provided with a through hole, the semiconductor component is provided in the through hole, and the insulation layer component is provided between the first radiator and the second radiator for blocking Heat transfer between the first heat sink and the second heat sink.
  • the controller includes:
  • the receiving unit is configured to receive the first temperature detected by the first temperature sensor. temperature, the second temperature monitored by the second temperature sensor and the third temperature monitored by the third temperature sensor;
  • control unit the control unit is used to obtain the first instruction by comparing the third temperature with the first preset temperature, obtain the second instruction by comparing the second temperature with the second preset temperature, and obtain the second instruction by comparing the first temperature with the dew point temperature.
  • the third instruction is to adjust the operating power of the semiconductor component and/or adjust the operating power of the refrigeration element according to the first instruction, the second instruction or the third instruction.
  • control unit is specifically used for:
  • the current dew point temperature is calculated according to the preset humidity and the third temperature.
  • the third temperature is higher than the first preset temperature, the operating power of the refrigeration element is increased and the semiconductor element is reduced. operating power so that the first temperature is always higher than the current dew point temperature.
  • This application also provides a storage air conditioning control method, which is applied to the storage air conditioning control device in the above embodiment.
  • the control method includes:
  • adjusting the operating power of semiconductor components and/or adjusting the operating power of the refrigeration element includes:
  • the first instruction is obtained by comparing the third temperature with the first preset temperature
  • the second instruction is obtained by comparing the second temperature with the second preset temperature
  • the third instruction is obtained by comparing the first temperature with the dew point temperature, and according to the first
  • the first instruction, the second instruction or the third instruction adjusts the operating power of the semiconductor component and/or adjusts the operating power of the refrigeration element.
  • the first instruction is obtained by comparing the third temperature with the first preset temperature
  • the second instruction is obtained by comparing the second temperature with the second preset temperature
  • the second instruction is obtained by comparing the second temperature with the first preset temperature.
  • temperature and dew point temperature to obtain the third instruction, and according to the first instruction and the The second instruction or the third instruction to adjust the operating power of the semiconductor component and/or to adjust the operating power of the refrigeration element specifically includes:
  • the current dew point temperature is calculated according to the preset humidity and the third temperature.
  • the third temperature is higher than the first preset temperature, the operating power of the refrigeration element is increased and the semiconductor element is reduced. operating power so that the first temperature is always higher than the current dew point temperature.
  • This application also provides a storage air conditioner, which includes: a storage cavity and the storage air conditioning control device in the above embodiment, and the storage air conditioning control device is disposed in the storage cavity.
  • the present application provides a storage air conditioner control device, a control method and a storage air conditioner.
  • the controller is used to adjust the operating power of semiconductor components and refrigeration components. By adjusting the operating power of semiconductor components and/or adjusting the operating power of refrigeration components, Run the power to adjust the temperature and/or humidity inside the storage cavity.
  • This application uses a controller to accurately adjust the operating power of semiconductor components and refrigeration components, thereby flexibly adjusting the temperature and/or humidity inside the storage cavity and improving the refrigeration effect.
  • Figure 1 is an exploded view of the storage air conditioning control device provided by this application.
  • FIG. 2 is a schematic flow chart of the storage air conditioning control method provided by this application.
  • Figure 3 is an overall view of the storage air conditioner provided by this application.
  • FIG. 4 is a top view of the storage air conditioner provided by this application.
  • Figure 5 is a cross-sectional view along A-A in Figure 4.
  • FIG. 6 is an internal diagram of the controller provided by this application.
  • 1 Storage cavity; 2: Controller; 3: Semiconductor components; 4: Fan; 5: First radiator; 6: Second radiator; 7: First temperature sensor; 8: Second temperature sensor; 9: Third Temperature sensor; 10: Insulation layer components;
  • the storage air conditioner has a storage cavity 1 inside.
  • the storage air conditioning control device includes: a controller 2, a semiconductor component 3 and a refrigeration component.
  • the cold end of the semiconductor component 3 is arranged inside the storage cavity 1; the refrigeration element is arranged inside the storage cavity 1; the controller 2 is connected to the semiconductor component 3 and the refrigeration element respectively for controlling the semiconductor.
  • the operating power of the component 3 and the operating power of the refrigeration element are used to adjust the temperature and/or humidity inside the storage cavity 1 .
  • the Peltier effect in a semiconductor component, if the current flows from the end A with a higher number of free electrons to the end B with a lower number of free electrons, the temperature of end B will increase; conversely, the temperature of end B will increase. will decrease; the heat absorbed/released at the joint is proportional to the current density passing through the joint.
  • the power of the semiconductor component 3 and the refrigeration component is adjustable, specifically by adjusting the current density passing through the semiconductor component 3 to adjust its heat absorption and dissipation capabilities, that is, adjusting the operating power of the semiconductor component 3; the refrigeration component can be
  • the speed of the fan 4 is adjusted through the controller 2, that is, the operating power of the refrigeration element is adjusted.
  • the adjustment of the operating power of the semiconductor component 3 and the refrigeration component by the controller 2 can be adjusted accordingly according to the mode of the storage air conditioner.
  • Different modes have different judgment criteria, mainly based on temperature and/or humidity, so that Simultaneously or individually increase or decrease the operating power of the semiconductor component 3 and the refrigeration element to ensure the cooling and heating capabilities of the storage air conditioner.
  • the cold end of the semiconductor component 3 is placed in the storage cavity 1 of the storage air conditioner to refrigerate the food in the storage cavity 1, while the hot end of the semiconductor component 3 faces the outside of the storage air conditioner. , heating the top of the storage air conditioner, food can be placed on the top to heat the food.
  • the refrigeration unit is arranged in the storage cavity 1 and cooperates with the semiconductor component 3 to refrigerate the food inside the storage cavity 1. Perform refrigeration.
  • the temperature control inside the storage cavity 1 can be adjusted directly by increasing or reducing the operating power of the semiconductor component 3 and the refrigeration element; the humidity control inside the storage cavity 1 needs to be adjusted according to the current temperature. Calculate the dew point temperature with the humidity set by the user, adjust the operating power of the semiconductor component 3 and the refrigeration component so that the temperature in the storage cavity 1 is always higher than the dew point temperature, and the circulating air brought by the fan 4 affects the storage cavity 1
  • the measures taken are to increase the air volume of the fan 4 and reduce the operating power of the semiconductor component 3.
  • the present application provides a storage air conditioning control device that uses the controller 2 to adjust the operating power of the semiconductor component 3 and the refrigeration element. By adjusting the operating power of the semiconductor component 3 and/or adjusting the operating power of the refrigeration element, thereby Adjust the temperature and/or humidity inside the storage cavity 1 .
  • This application uses the controller 2 to accurately adjust the operating power of the semiconductor component 3 and the refrigeration component, thereby flexibly adjusting the temperature and/or humidity inside the storage cavity 1 and improving the refrigeration effect.
  • the refrigeration element includes a fan 4; the controller 2 is electrically connected to the fan 4 and used to control the rotation rate of the fan 4.
  • the refrigeration element adopts an air-cooled refrigeration element, which can be in the form of a fan 4.
  • the refrigeration element can also be replaced by other air-cooled refrigeration elements.
  • a steplessly adjustable fan 4 can be used, and the rotation speed of the fan 4 is controlled by the controller 2 .
  • the storage air conditioning control device also includes a first radiator 5 and a second radiator 6; the first radiator 5 is connected to the cold end of the semiconductor component 3 for connecting the semiconductor component.
  • the cold generated by the cold end of the device 3 is transferred to the inside of the storage cavity 1;
  • the second radiator 6 is connected to the hot end of the semiconductor component 3 and is used to transfer the heat generated by the hot end of the semiconductor component 3 to the environment. medium.
  • the heat and cold generated by the semiconductor component 3 are conducted through the radiator.
  • the semiconductor component 3 is located on the top of the storage cavity 1 with its cold end facing downward.
  • a radiator 5 is located at the bottom of the semiconductor component 3 and is used to conduct the cold generated by the cold end of the semiconductor component into the storage cavity 1; the hot end of the semiconductor component 3 faces upward, and the second radiator 6 is located at the semiconductor component 3.
  • the top of component 3 is used to conduct the heat generated by the hot end of the semiconductor component to the external environment where the storage air conditioner is located (ie, the upper part of the storage air conditioner), and can be used to heat food.
  • the first radiator 5 in the above embodiment can be a column radiator or a fin. type radiator; the second radiator 6 can be a heat sink made of a good thermal conductive material, etc.
  • the storage air conditioning control device further includes a first temperature sensor 7, a second temperature sensor 8 and a third temperature sensor 9.
  • the first temperature sensor 7, the second temperature sensor 8 and the third temperature sensor 9 are The temperature sensors 9 are electrically connected to the controller 2 respectively; the first temperature sensor 7 is provided on the first radiator 5 for monitoring the first temperature of the first radiator 5; the second temperature sensor 8 is provided on the second radiator 6 on the inner wall of the storage cavity 1 for monitoring the second temperature of the second radiator 6 .
  • the third temperature sensor 9 is provided on the inner wall of the storage cavity 1 for monitoring the third temperature of the storage cavity 1 .
  • the temperature changes inside the first radiator 5, the second radiator 6 and the storage cavity 1 are monitored through temperature sensors, and the above-monitored temperature changes are sent to the controller 2, and the controller 2
  • the temperature change and comparison with the preset temperature are used to control the operating power of the semiconductor component 3 and the refrigeration component.
  • the storage air conditioning control device further includes an insulation layer component 10; the insulation layer component 10 is provided with a through hole, the semiconductor component 3 is provided in the through hole, and the insulation layer component 10 is provided on the third Between the first radiator 5 and the second radiator 6 is used to block the heat transfer between the first radiator 5 and the second radiator 6 .
  • the semiconductor component 3 is installed through the thermal insulation layer component 10 and used to isolate the heat transfer between the first radiator 5 and the second radiator 6 .
  • an insulation layer component 10 made of a material with a small thermal conductivity is used to block the first radiator.
  • the insulation layer component 10 is disposed between the first radiator 5 and the second radiator 6.
  • the cold generated by the cold end of the semiconductor component 3 is conducted to the first radiator 5 through the through hole, thereby affecting the storage cavity. 1 performs cooling inside, and on the other hand, the heat generated by the hot end of the semiconductor component 3 is conducted to the second radiator 6 through the through hole, thereby heating the external environment, and food can be heated on the second radiator 6.
  • the through holes provided in the insulation layer component 10 can also be in the form of grooves, and the thickness of the insulation layer at the bottom of the grooves is small enough to ensure the cooling effect.
  • the controller 2 includes: a receiving unit 21 and a regulating unit 22 .
  • the receiving unit 21 is used to receive the first temperature monitored by the first temperature sensor 7, the second temperature monitored by the second temperature sensor 8, and the third temperature monitored by the third temperature sensor 9;
  • the control unit 22 is used to obtain the first instruction by comparing the third temperature with the first preset temperature,
  • the second instruction is obtained by comparing the second temperature with the second preset temperature,
  • the third instruction is obtained by comparing the first temperature with the dew point temperature, and the operating power of the semiconductor component 3 is adjusted according to the first instruction, the second instruction or the third instruction. and/or adjust the operating power of the refrigeration element.
  • control unit 22 is specifically used to control different situations, mainly including three modes: heat preservation mode, storage mode and moisturizing storage mode:
  • the operating power of the semiconductor component 3 is increased, and the operating power of the refrigeration element is adjusted.
  • the semiconductor component 3 starts to operate, and its hot end heats the food through the second radiator 6, detects the temperature through the second temperature sensor 8, and continuously increases the power of the semiconductor component 3 until it reaches the second preset value. temperature.
  • the cold end of the semiconductor component 3 cools the interior of the storage cavity 1, and the rotation speed of the fan 4 is adjusted to ensure that the interior of the storage air conditioner is kept warm.
  • the third temperature when the third temperature is higher than the first preset temperature, the operating power of the semiconductor component 3 is increased, and the operating power of the refrigeration element is increased.
  • the temperature in the storage cavity 1 is detected through the third temperature sensor 9.
  • the third temperature is greater than the first preset temperature, the operating power of the semiconductor component 3 is increased to supply the storage space through the first radiator 5.
  • the interior of the object cavity 1 is cooled down and the operating power of the fan 4 is increased.
  • the third temperature is continuously monitored until the first preset temperature is reached, and then the operating power of the semiconductor component 3 and the fan 4 is reduced.
  • the hot end of the semiconductor component passes through the second heat sink 6 and uses air convection to release heat into the air.
  • the second temperature sensor 8 continuously monitors the surface temperature of the second heat sink 6 to keep it at within safe temperature.
  • the current dew point temperature is calculated based on the preset humidity and the third temperature.
  • the third temperature is higher than the first preset temperature, the operating power of the refrigeration element is increased and the operating power of the semiconductor component 3 is reduced. , so that the first temperature is always higher than the current dew point temperature.
  • the third temperature TQ in the storage cavity 1 is detected by the third temperature sensor 9 . If the third temperature TQ is greater than the first preset T1, the current dew point temperature is calculated based on the user-set humidity and the third temperature TQ.
  • the semiconductor component 3 starts to operate and is used to cool the storage cavity 1 through its cold end, and the fan 4 starts to operate.
  • the surface temperature of the first radiator 5 is detected by the first temperature sensor 7, that is, the First temperature TB4, by increasing the air volume of the fan 4 and reducing the operating power of the semiconductor device, the first temperature TB4 is continuously higher than the current dew point temperature. Continuously detect the third temperature TQ. If the third temperature TQ decreases by 1 degree and reaches the preset time t1, update the current dew point temperature until the third temperature TQ reaches the first preset temperature, then the semiconductor component 3 and the fan can be reduced. 4 operating power. During this process, the hot end of the semiconductor component passes through the second heat sink 6 and uses air convection to release heat into the air. The second temperature sensor 8 continuously monitors the surface temperature of the second heat sink 6 to keep it at within safe temperature.
  • This application also provides a storage air conditioning control method.
  • This control method is applied to the storage air conditioning control device of the above embodiment.
  • the control method includes: adjusting the operating power of the semiconductor component 3 and/or adjusting the operating power of the refrigeration element to adjust the temperature inside the storage cavity 1 and/ or humidity.
  • This application provides a storage air conditioning control method that adjusts the temperature and/or humidity inside the storage cavity 1 by adjusting the operating power of the semiconductor component 3 and/or the operating power of the refrigeration element to improve the cooling effect.
  • the step of adjusting the operating power of the semiconductor component 3 and/or adjusting the operating power of the refrigeration element includes the following steps.
  • the first temperature is the temperature monitored by the first temperature sensor 7
  • the second temperature is the temperature monitored by the second temperature sensor 8
  • the third temperature is the temperature monitored by the third temperature sensor 9 .
  • the first instruction is obtained by comparing the third temperature with the first preset temperature
  • the second instruction is obtained by comparing the second temperature with the second preset temperature
  • the third instruction is obtained by comparing the first temperature with the dew point temperature, and according to the first
  • the first instruction, the second instruction or the third instruction adjusts the operating power of the semiconductor component 3 and/or adjusts the operating power of the refrigeration element.
  • step S2 specifically includes:
  • the storage air conditioner includes: a storage cavity 1 and the storage air conditioning control device in the above embodiment.
  • the storage air conditioning control device is arranged in the storage cavity 1 and located at the top of the storage cavity 1 .
  • the storage air conditioner provided by this application has the same advantages as mentioned above because it includes the storage air conditioner control device of the above embodiment.
  • the device embodiments described above are only illustrative.
  • the units described as separate components may or may not be physically separated.
  • the components shown as units may or may not be physical units, that is, they may be located in One location, or it can be distributed across multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Persons of ordinary skill in the art can understand and implement the method without any creative effort.
  • each embodiment can be implemented by software plus a necessary general hardware platform, and of course, it can also be implemented by hardware.
  • the computer software product can be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., including a number of instructions to cause a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in various embodiments or certain parts of the embodiments.

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  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
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Abstract

本申请提供一种储物空调控制装置、控制方法及储物空调。该控制装置包括：半导体元器件，半导体元器件的冷端设于储物腔体的内部；制冷元件，制冷元件设于储物腔体的内部；控制器，控制器分别与半导体元器件、制冷元件通讯连接，用于控制半导体元器件的运转功率以及制冷元件的运转功率，以调整储物腔体内部的温度和/或湿度。本申请通过控制器精准调节半导体元器件和制冷元件的运转功率，从而灵活调节储物腔体内部的温度和/或湿度，提高制冷效果。

Description

储物空调控制装置、控制方法及储物空调
相关申请的交叉引用
本申请要求于2022年06月02日提交的申请号为202210625662.2，名称为“储物空调控制装置、控制方法及储物空调”的中国专利申请的优先权，其通过引用方式全部并入本文。
技术领域
本申请涉及空调器技术领域，尤其涉及一种储物空调控制装置、控制方法及储物空调。
背景技术
目前，一般的降温设备有风扇和空调等，功率较大。现有的单冷空调器或冷暖空调器功率较大，且结构复杂，一般由压缩机、蒸发器、毛细管、冷凝器、风机等部件组成。任何一个部件故障都会影响空调器的正常运行，维护成本较高。而且空调中所使用得制冷剂泄漏会造成环境污染。另外，现有普通空调体积大，需要占有较大的安装空间，不适于小环境使用。而风扇因仅有吹风使空气流动的功能，降温效果非常有限。
半导体制冷器是一种现有的成熟技术。半导体制冷器在直流电的作用下将会产生明显的珀尔帖效应(Peltier effect)，其中一个接头在电场的作用下产生空穴与电子对分离，并吸收晶格的热量形成冷端，它要吸收晶格的热量来补充晶格能力的消耗，因而成为冷端。另一个接头在电场的作用下产生空穴与电子对复合，并对晶格放热，因而成为热端。半导体制冷器因为其构造体积小巧，经常用于储物的制冷，但目前利用半导体制冷的储物空调无法调节制冷温度和制冷模式，存在制冷效果差的问题。
发明内容
本申请提供一种储物空调控制装置、控制方法及储物空调，用以解决现有技术中利用半导体制冷的储物空调无法调节制冷温度和制冷模式，存在制冷效果差的缺陷，通过控制器调节半导体元器件和制冷元件的运转功率，从而调节储物空调的制冷效果。
本申请提供一种储物空调控制装置，储物空调内部具有储物腔体且包括：
半导体元器件，所述半导体元器件的冷端设于储物腔体的内部；
制冷元件，所述制冷元件设于所述储物腔体的内部；
控制器，所述控制器分别与所述半导体元器件、所述制冷元件通讯连接，用于控制所述半导体元器件的运转功率以及所述制冷元件的运转功率，以调整所述储物腔体内部的温度和/或湿度。
根据本申请提供的一种储物空调控制装置，所述制冷元件包括风扇；
所述控制器与所述风扇电连接，用于控制所述风扇的转动速率。
根据本申请提供的一种储物空调控制装置，还包括第一散热器和第二散热器；
所述第一散热器与所述半导体元器件的冷端连接，用于将所述半导体元器件的冷端产生的冷量传递至所述储物腔体的内部；
所述第二散热器与所述半导体元器件的热端连接，用于将所述半导体元器件的热端产生的热量传递至环境介质。
根据本申请提供的一种储物空调控制装置，还包括第一温度传感器、第二温度传感器和第三温度传感器，所述第一温度传感器、所述第二温度传感器和所述第三温度传感器分别与所述控制器电连接；
所述第一温度传感器设于所述第一散热器上，用于监测所述第一散热器的第一温度；
所述第二温度传感器设于所述第二散热器上，用于监测所述第二散热器的第二温度；
所述第三温度传感器设于所述储物腔体的内壁上，用于监测所述储物腔体的第三温度。
根据本申请提供的一种储物空调控制装置，还包括保温层部件；
所述保温层部件设有通孔，所述半导体元器件设于所述通孔内，且所述保温层部件设于所述第一散热器和所述第二散热器之间，用于阻隔所述第一散热器和所述第二散热器之间的热量传递。
根据本申请提供的一种储物空调控制装置，所述控制器包括：
接收单元，所述接收单元用于接收所述第一温度传感器监测到的第一 温度、所述第二温度传感器监测到的第二温度和所述第三温度传感器监测到的第三温度；
调控单元，所述调控单元用于通过比较第三温度与第一预设温度得到第一指令，通过比较第二温度与第二预设温度得到第二指令，通过比较第一温度与露点温度得到第三指令，并根据第一指令、第二指令或第三指令调整所述半导体元器件的运转功率和/或调整所述制冷元件的运转功率。
根据本申请提供的一种储物空调控制装置，所述调控单元具体用于：
当所述第二温度低于所述第二预设温度时，提高所述半导体元器件的运转功率，并调整所述制冷元件的运转功率；
当所述第三温度高于所述第一预设温度时，提高所述半导体元器件的运转功率，并提高所述制冷元件的运转功率；
根据预设湿度和所述第三温度计算当前露点温度，当所述第三温度高于所述第一预设温度时，通过增大所述制冷元件的运转功率并减小所述半导体元器件的运转功率，以使所述第一温度始终高于当前露点温度。
本申请还提供一种储物空调控制方法，其应用于上述实施例中的储物空调控制装置，所述控制方法包括：
调节半导体元器件的的运转功率和/或调整所述制冷元件的运转功率，以调整所述储物腔体内部的温度和/或湿度。
根据本申请提供的一种储物空调控制方法，所述调节半导体元器件的的运转功率和/或调整所述制冷元件的运转功率包括：
S1、接收用于反映半导体元器件制冷效用的第一温度、用于反映半导体元器件制热效用的第二温度以及用于反映储物腔体内部温度变化的第三温度；
S2、通过比较第三温度与第一预设温度得到第一指令，通过比较第二温度与第二预设温度得到第二指令，通过比较第一温度与露点温度得到第三指令，并根据第一指令、第二指令或第三指令调整所述半导体元器件的运转功率和/或调整所述制冷元件的运转功率。
根据本申请提供的一种储物空调控制方法，所述通过比较第三温度与第一预设温度得到第一指令，通过比较第二温度与第二预设温度得到第二指令，通过比较第一温度与露点温度得到第三指令，并根据第一指令、第 二指令或第三指令调整所述半导体元器件的运转功率和/或调整所述制冷元件的运转功率具体包括：
当所述第二温度低于所述第二预设温度时，提高所述半导体元器件的运转功率，并调整所述制冷元件的运转功率；
当所述第三温度高于所述第一预设温度时，提高所述半导体元器件的运转功率，并提高所述制冷元件的运转功率；
根据预设湿度和所述第三温度计算当前露点温度，当所述第三温度高于所述第一预设温度时，通过增大所述制冷元件的运转功率并减小所述半导体元器件的运转功率，以使所述第一温度始终高于当前露点温度。
本申请还提供一种储物空调，包括：储物腔体和上述实施例中的储物空调控制装置，所述储物空调控制装置设置于所述储物腔体内。
本申请提供的一种储物空调控制装置、控制方法及储物空调，利用控制器对半导体元器件和制冷元件的运转功率进行调节，通过调整半导体元器件的运转功率和/或调整制冷元件的运转功率，从而调整所述储物腔体内部的温度和/或湿度。本申请通过控制器精准调节半导体元器件和制冷元件的运转功率，从而灵活调节储物腔体内部的温度和/或湿度，提高制冷效果。
附图说明
为了更清楚地说明本申请或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请提供的储物空调控制装置的爆炸图；
图2是本申请提供的储物空调控制方法的流程示意图；
图3是本申请提供的储物空调的整体图；
图4是本申请提供的储物空调的俯视图；
图5是图4中A-A的剖面图；
图6是本申请提供的控制器的内部图；
附图标记：
1：储物腔体；2：控制器；3：半导体元器件；4：风扇；5：第一散热器；6：第二散热器；7：第一温度传感器；8：第二温度传感器；9：第三 温度传感器；10：保温层部件；
21：接收单元；22：调控单元。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请中的附图，对本申请中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
下面结合图1、图3至图6描述本申请的一种储物空调控制装置。储物空调内部具有储物腔体1。该储物空调控制装置包括：控制器2、半导体元器件3和制冷元件。
其中，半导体元器件3的冷端设于储物腔体1的内部；制冷元件设于储物腔体1的内部；控制器2分别与半导体元器件3、制冷元件通讯连接，用于控制半导体元器件3的运转功率以及制冷元件的运转功率，以调整储物腔体1内部的温度和/或湿度。
具体来说，根据珀尔帖效应：半导体元器件中如果电流从自由电子数较高的一端A流向自由电子数较低的一端B，则B端的温度就会升高；反之，B端的温度就会降低；接头处吸收/放出的热量与通过接头处的电流密度成正比。半导体元器件3和制冷元件的功率可调，具体表现在于，通过调节通过半导体元器件3的电流密度从而调节其吸、放热能力，也即调节半导体元器件3的运转功率；制冷元件可采用风扇4，通过控制器2调节其转速，也即调节制冷元件的运转功率。
进一步地，控制器2对半导体元器件3和制冷元件的运转功率的调节，可以根据储物空调的模式进行相应调整，不同模式下具有不同的判断标准，主要根据温度和/或湿度判断，从而同时或单独提高或降低半导体元器件3和制冷元件的运转功率，以保证储物空调的制冷和制热能力。一般地，将半导体元器件3的冷端设置于储物空调的储物腔体1内，对储物腔体1内的食物进行制冷，而半导体元器件3的热端朝向储物空调的外侧，对储物空调顶部进行制热，可以将食物放置于其顶部，用于加热食物。制冷单元设置于储物腔体1内，与半导体元器件3协同对储物腔体1内部的食物进 行制冷。
更进一步地，对于储物腔体1内部的温度控制，可直接通过提高或降低半导体元器件3和制冷元件的运转功率进行调节；对于储物腔体1内部的湿度控制，则需要根据当前温度和用户设定的湿度计算露点温度，调节半导体元器件3和制冷元件的运转功率，使得储物腔体1内的温度始终高于露点温度，通过风扇4带来的循环风对储物腔体1内部进行保湿，一般来说，采取的措施是通过加大风扇4的风量以及降低半导体元器件3的运转功率。
本申请提供的一种储物空调控制装置，利用控制器2对半导体元器件3和制冷元件的运转功率进行调节，通过调整半导体元器件3的运转功率和/或调整制冷元件的运转功率，从而调整储物腔体1内部的温度和/或湿度。本申请通过控制器2精准调节半导体元器件3和制冷元件的运转功率，从而灵活调节储物腔体1内部的温度和/或湿度，提高制冷效果。
在本申请的其中一个实施例中，制冷元件包括风扇4；控制器2与风扇4电连接，用于控制风扇4的转动速率。具体来说，制冷元件采用风冷制冷元件，可采用风扇4形式，当然，根据实际应用情况，制冷元件也可以采用其他的风冷制冷元件代替。本实施例中可采用能够无级调节的风扇4，风扇4转速由控制器2进行控制。
在本申请的其中一个实施例中，该储物空调控制装置还包括第一散热器5和第二散热器6；第一散热器5与半导体元器件3的冷端连接，用于将半导体元器件3的冷端产生的冷量传递至储物腔体1的内部；第二散热器6与半导体元器件3的热端连接，用于将半导体元器件3的热端产生的热量传递至环境介质。进一步地，本实施例中的，通过散热器将半导体元器件3产生的热量和冷量进行传导，具体来说，半导体元器件3位于储物腔体1的顶部，其冷端朝下，第一散热器5位于半导体元器件3的底部，用于将半导体元器冷端产生的冷量传导至储物腔体1内；半导体元器件3的热端朝上，第二散热器6位于半导体元器件3的顶部，用于将半导体元器热端产生的热量传导至储物空调所处的外部环境(即储物空调的上部)，可用于加热食物。
进一步地，上述实施例中的第一散热器5可采用立柱式散热器或翅片 式散热器；第二散热器6可采用由良好导热材料制成的散热板等。
在本申请的其中一个实施例中，该储物空调控制装置还包括第一温度传感器7、第二温度传感器8和第三温度传感器9，第一温度传感器7、第二温度传感器8和第三温度传感器9分别与控制器2电连接；第一温度传感器7设于第一散热器5上，用于监测第一散热器5的第一温度；第二温度传感器8设于第二散热器6上，用于监测第二散热器6的第二温度，第三温度传感器9设于储物腔体1的内壁上，用于监测储物腔体1的第三温度。在本实施例中，通过温度传感器监测第一散热器5、第二散热器6以及储物腔体1内部的温度变化，并将上述监测到的温度变化发送给控制器2，控制器2根据温度变化以及与预设温度的比较，从而控制半导体元器件3和制冷元件的运转功率。
在本申请的其中一个实施例中，该储物空调控制装置还包括保温层部件10；保温层部件10设有通孔，半导体元器件3设于通孔内，且保温层部件10设于第一散热器5和第二散热器6之间，用于阻隔第一散热器5和第二散热器6之间的热量传递。本实施例通过保温层部件10安装半导体元器件3，并用于隔绝第一散热器5与第二散热器6之间的热量传递。具体来说，由于第一散热器5提供冷量，第二散热器6提供热量，因此为了避免热量/冷量损失，采用导热系数小的材料制成的保温层部件10来阻隔第一散热器5和第二散热器6，将半导体元器件3放置于保温层部件10的通孔中。保温层部件10设置于第一散热器5与第二散热器6之间，一方面半导体元器件3的冷端产生的冷量通过通孔传导至第一散热器5，进而对储物腔体1内部进行制冷，另一方面半导体元器件3的热端产生的热量通过通孔传导至第二散热器6，进而对外部环境进行制热，可在第二散热器6上加热食物。应当理解的是，保温层部件10设置的通孔也可以采用凹槽形式，凹槽底部保温层厚度较小，保证制冷效果即可。
在本申请的其中一个实施例中，如图6所示，控制器2包括：接收单元21和调控单元22。
接收单元21用于接收第一温度传感器7监测到的第一温度、第二温度传感器8监测到的第二温度和第三温度传感器9监测到的第三温度；
调控单元22用于通过比较第三温度与第一预设温度得到第一指令， 通过比较第二温度与第二预设温度得到第二指令，通过比较第一温度与露点温度得到第三指令，并根据第一指令、第二指令或第三指令调整半导体元器件3的运转功率和/或调整制冷元件的运转功率。
在本申请的其中一个实施例中，调控单元22具体用于针对不同情况进行调控，主要包括保温模式、储藏模式和保湿储藏模式三种模式：
在保温模式下，当第二温度低于第二预设温度时，提高半导体元器件3的运转功率，并调整制冷元件的运转功率。在该模式下，半导体元器件3开始运转，其热端通过第二散热器6对食物进行加热，通过第二温度传感器8检测温度，不断加大半导体元器件3的功率直到达到第二预设温度。在这一过程中，半导体元器件3的冷端对储物腔体1内部制冷，并通过调节风扇4的转速来保证储物空调内部进行保温。可以理解的是，若监测到第一温度持续降低，则降低风扇4转速；若监测到第一温度持续增高，则加大风扇4转速。该过程利用半导体制热同时另一端发冷的特性，保温的同时在不增加能耗的情况下实现了对储物的降温保鲜。
在储藏模式下，当第三温度高于第一预设温度时，提高半导体元器件3的运转功率，并提高制冷元件的运转功率。在该模式下，通过第三温度传感器9检测储物腔体1内温度，当第三温度大于第一预设温度，提高半导体元器件3的运转功率，用于通过第一散热器5给储物腔体1内部降温，提高风扇4的运转功率。持续监测第三温度，直到达到第一预设温度后，随之降低半导体元器件3和风扇4的运转功率。在这一过程中，半导体元器的热端通过第二散热器6、利用空气对流将热量释放于空气中，通过第二温度传感器8持续监测第二散热器6的表面温度，使其保持在安全温度内。
在保湿储藏模式下，根据预设湿度和第三温度计算当前露点温度，当第三温度高于第一预设温度时，通过增大制冷元件的运转功率并减小半导体元器件3的运转功率，以使第一温度始终高于当前露点温度。通过第三温度传感器9检测储物腔体1内的第三温度TQ。若第三温度TQ大于第一预设T1，根据用户设定的湿度以及第三温度TQ，计算当前露点温度。半导体元器件3开始运转，用于通过其冷端给储物腔体1进行降温，风扇4开始运转。通过第一温度传感器7检测第一散热器5的表面温度，即第 一温度TB4，通过加大风扇4风量及降低半导体器件的运转功率，使第一温度TB4持续高于当前露点温度。持续检测第三温度TQ，若第三温度TQ降低1度并达到预设时间t1后，更新当前露点温度，直到第三温度TQ达到第一预设温度，则可以减小半导体元器件3和风扇4的运转功率。在这一过程中，半导体元器的热端通过第二散热器6、利用空气对流将热量释放于空气中，通过第二温度传感器8持续监测第二散热器6的表面温度，使其保持在安全温度内。
本申请还提供一种储物空调控制方法。该控制方法应用于上述实施例的储物空调控制装置，控制方法包括：调节半导体元器件3的的运转功率和/或调整制冷元件的运转功率，以调整储物腔体1内部的温度和/或湿度。
本申请提供的一种储物空调控制方法，通过调整半导体元器件3的运转功率和/或调整制冷元件的运转功率，从而调整储物腔体1内部的温度和/或湿度，提高制冷效果。
在本申请的其中一个实施例中，如图2所示，调节半导体元器件3的的运转功率和/或调整制冷元件的运转功率的步骤包括下述步骤。
S1、接收用于反映半导体元器件3制冷效用的第一温度、用于反映半导体元器件3制热效用的第二温度以及用于反映储物腔体1内部温度变化的第三温度。具体来说，第一温度即第一温度传感器7监测到的温度，第二温度即第二温度传感器8监测到的温度，第三温度即第三温度传感器9监测到的温度。
S2、通过比较第三温度与第一预设温度得到第一指令，通过比较第二温度与第二预设温度得到第二指令，通过比较第一温度与露点温度得到第三指令，并根据第一指令、第二指令或第三指令调整半导体元器件3的运转功率和/或调整制冷元件的运转功率。
进一步地，上述步骤S2具体包括：
当第二温度低于第二预设温度时，提高半导体元器件3的运转功率，并调整制冷元件的运转功率；
当第三温度高于第一预设温度时，提高半导体元器件3的运转功率，并提高制冷元件的运转功率；
根据预设湿度和第三温度计算当前露点温度，当第三温度高于第一预 设温度时，通过增大制冷元件的运转功率并减小半导体元器件3的运转功率，以使第一温度始终高于当前露点温度。
本申请还提供一种储物空调。该储物空调包括：储物腔体1和上述实施例中的储物空调控制装置，储物空调控制装置设置于储物腔体1内，位于储物腔体1的顶部。
本申请提供的一种储物空调，由于包括上述实施例的储物空调控制装置，因此具有上述同样的优势。
以上所描述的装置实施例仅仅是示意性的，其中所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。本领域普通技术人员在不付出创造性的劳动的情况下，即可以理解并实施。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到各实施方式可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件。基于这样的理解，上述技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品可以存储在计算机可读存储介质中，如ROM/RAM、磁碟、光盘等，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行各个实施例或者实施例的某些部分所述的方法。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (11)

  1. 一种储物空调控制装置，其中，储物空调内部具有储物腔体且包括：
    半导体元器件，所述半导体元器件的冷端设于储物腔体的内部；
    制冷元件，所述制冷元件设于所述储物腔体的内部；
    控制器，所述控制器分别与所述半导体元器件、所述制冷元件通讯连接，用于控制所述半导体元器件的运转功率以及所述制冷元件的运转功率，以调整所述储物腔体内部的温度和/或湿度。
  2. 根据权利要求1所述的储物空调控制装置，其中，所述制冷元件包括风扇；
    所述控制器与所述风扇电连接，用于控制所述风扇的转动速率。
  3. 根据权利要求1所述的储物空调控制装置，还包括第一散热器和第二散热器；
    所述第一散热器与所述半导体元器件的冷端连接，用于将所述半导体元器件的冷端产生的冷量传递至所述储物腔体的内部；
    所述第二散热器与所述半导体元器件的热端连接，用于将所述半导体元器件的热端产生的热量传递至环境介质。
  4. 根据权利要求3所述的储物空调控制装置，还包括第一温度传感器、第二温度传感器和第三温度传感器，所述第一温度传感器、所述第二温度传感器和所述第三温度传感器分别与所述控制器电连接；
    所述第一温度传感器设于所述第一散热器上，用于监测所述第一散热器的第一温度；
    所述第二温度传感器设于所述第二散热器上，用于监测所述第二散热器的第二温度；
    所述第三温度传感器设于所述储物腔体的内壁上，用于监测所述储物腔体的第三温度。
  5. 根据权利要求4所述的储物空调控制装置，还包括保温层部件；
    所述保温层部件设有通孔，所述半导体元器件设于所述通孔内，且所述保温层部件设于所述第一散热器和所述第二散热器之间，用于阻隔所述第一散热器和所述第二散热器之间的热量传递。
  6. 根据权利要求4或5所述的储物空调控制装置，其中，所述控制器包括：
    接收单元，所述接收单元用于接收所述第一温度传感器监测到的第一温度、所述第二温度传感器监测到的第二温度和所述第三温度传感器监测到的第三温度；
    调控单元，所述调控单元用于通过比较第三温度与第一预设温度得到第一指令，通过比较第二温度与第二预设温度得到第二指令，通过比较第一温度与露点温度得到第三指令，并根据第一指令、第二指令或第三指令调整所述半导体元器件的运转功率和/或调整所述制冷元件的运转功率。
  7. 根据权利要求6所述的储物空调控制装置，其中，所述调控单元具体用于：
    当所述第二温度低于所述第二预设温度时，提高所述半导体元器件的运转功率，并调整所述制冷元件的运转功率；
    当所述第三温度高于所述第一预设温度时，提高所述半导体元器件的运转功率，并提高所述制冷元件的运转功率；
    根据预设湿度和所述第三温度计算当前露点温度，当所述第三温度高于所述第一预设温度时，通过增大所述制冷元件的运转功率并减小所述半导体元器件的运转功率，以使所述第一温度始终高于当前露点温度。
  8. 一种储物空调控制方法，应用于根据权利要求1至7中任意一项所述的储物空调控制装置，所述控制方法包括：
    调节半导体元器件的的运转功率和/或调整所述制冷元件的运转功率，以调整所述储物腔体内部的温度和/或湿度。
  9. 根据权利要求8所述的储物空调控制方法，其中，所述调节半导体元器件的的运转功率和/或调整所述制冷元件的运转功率包括：
    S1、接收用于反映半导体元器件制冷效用的第一温度、用于反映半导体元器件制热效用的第二温度以及用于反映储物腔体内部温度变化的第三温度；
    S2、通过比较第三温度与第一预设温度得到第一指令，通过比较第 二温度与第二预设温度得到第二指令，通过比较第一温度与露点温度得到第三指令，并根据第一指令、第二指令或第三指令调整所述半导体元器件的运转功率和/或调整所述制冷元件的运转功率。
  10. 根据权利要求9所述的储物空调控制方法，其中，所述通过比较第三温度与第一预设温度得到第一指令，通过比较第二温度与第二预设温度得到第二指令，通过比较第一温度与露点温度得到第三指令，并根据第一指令、第二指令或第三指令调整所述半导体元器件的运转功率和/或调整所述制冷元件的运转功率具体包括：
    当所述第二温度低于所述第二预设温度时，提高所述半导体元器件的运转功率，并调整所述制冷元件的运转功率；
    当所述第三温度高于所述第一预设温度时，提高所述半导体元器件的运转功率，并提高所述制冷元件的运转功率；
    根据预设湿度和所述第三温度计算当前露点温度，当所述第三温度高于所述第一预设温度时，通过增大所述制冷元件的运转功率并减小所述半导体元器件的运转功率，以使所述第一温度始终高于当前露点温度。
  11. 一种储物空调，包括：储物腔体和权利要求1至7中任意一项所述的储物空调控制装置，所述储物空调控制装置设置于所述储物腔体内。
PCT/CN2023/073770 2022-06-02 2023-01-30 储物空调控制装置、控制方法及储物空调 WO2023231432A1 (zh)

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