WO2023226644A1 - 电子器件保护结构、电路板、显示模组和制作方法 - Google Patents

电子器件保护结构、电路板、显示模组和制作方法 Download PDF

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Publication number
WO2023226644A1
WO2023226644A1 PCT/CN2023/089684 CN2023089684W WO2023226644A1 WO 2023226644 A1 WO2023226644 A1 WO 2023226644A1 CN 2023089684 W CN2023089684 W CN 2023089684W WO 2023226644 A1 WO2023226644 A1 WO 2023226644A1
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WIPO (PCT)
Prior art keywords
protective tape
substrate
component group
layer
sub
Prior art date
Application number
PCT/CN2023/089684
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English (en)
French (fr)
Inventor
蔡洋洋
张英
谢志豪
梁恒镇
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Publication of WO2023226644A1 publication Critical patent/WO2023226644A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details

Definitions

  • the present disclosure relates to the field of semiconductor technology, and in particular, to an electronic device protection structure, a circuit board, a display module and a manufacturing method.
  • the present disclosure provides an electronic device protection structure, a circuit board, a display module and a manufacturing method to improve related technologies.
  • electronic devices are attached with protective tape, the attached tape has wrinkles and false attachments, resulting in insufficient electromagnetic and electrostatic protection effects. Good question.
  • Embodiments of the present disclosure provide an electronic device protection structure, including: a substrate, a component group located on one side of the substrate, and a first protective tape located on the side of the component group away from the substrate, and a second protective tape located on the side of the first protective tape facing away from the component group;
  • the first protective tape includes: a covering portion covering the component group, and an overlap portion extending from at least one side of the covering portion to contact the substrate;
  • the second protective tape is attached to the periphery of the component group and electrically overlaps with the overlapping portion.
  • the overlapping part includes: a first overlapping part, and a second overlapping part connecting the first overlapping part and the covering part;
  • the first overlapping portion is in contact with the substrate, and the overlapping portion electrically overlaps with the second protective tape at the first overlapping portion.
  • the first protective tape includes a first insulating layer, a first conductive layer, and a second insulating layer stacked in sequence away from the substrate;
  • the second protective tape includes a first insulating layer stacked away from the substrate in sequence;
  • the first protective tape has a side facing the second protective tape and exposes the first conductive layer in an area corresponding to the first overlapping portion.
  • the second protective tape has a side facing the first protective tape. , and the area corresponding to the first overlapping portion exposes the second conductive layer, so that the first conductive layer of the first protective tape and the second conductive layer of the second protective tape Electrical bonding.
  • the substrate includes a third conductive layer, the third conductive layer includes a wire, and the wire is grounded;
  • the second protective tape also electrically overlaps part of the conductors.
  • the side of the second protective tape facing the substrate has an opening in an area corresponding to the conductor at the overlap, exposing the second conductive layer so that the third The second conductive layers of the two protective tapes are electrically connected to the conductors.
  • the first insulating layer includes: a first sub-insulating layer, and a first insulating glue layer located on a side of the first sub-insulating layer away from the first conductive layer;
  • the first conductive layer includes: a first sub-conductive layer, and a first conductive adhesive layer located on the side of the first sub-conductive layer facing the first insulating layer;
  • the second insulating layer includes: a second sub-insulating layer, and a second insulating glue layer located on the side of the second sub-insulating layer facing the first conductive layer.
  • the third insulating layer includes: a third sub-insulating layer, and a third insulating glue layer located on a side of the third sub-insulating layer facing away from the second conductive layer;
  • the second conductive layer includes: a second sub-conductive layer, and a second conductive layer located facing the second sub-conductive layer. a second conductive adhesive layer on one side of the third insulating layer;
  • the fourth insulating layer includes: a fourth sub-insulating layer, and a fourth insulating glue layer located on the side of the fourth sub-insulating layer facing the second conductive layer.
  • the material of the first sub-insulating layer and the third sub-insulating layer are the same, and the material of the first insulating glue layer and the third insulating glue layer are the same;
  • the material of the first sub-conductive layer is the same as the material of the second sub-conductive layer, and the material of the first conductive adhesive layer is the same as the material of the second conductive adhesive layer;
  • the second sub-insulating layer is made of the same material as the fourth sub-insulating layer, and the second insulating glue layer is made of the same material as the fourth insulating glue layer.
  • the width of the projection of the first overlapping portion on the substrate is greater than the width of the projection of the covering portion on the substrate;
  • the width of the projection of the covering portion on the substrate is greater than the width of the projection of the second overlapping portion on the substrate.
  • the projected length of the first overlapping portion on the substrate is smaller than the projected length of the covering portion on the substrate
  • the projected length of the first overlapping portion on the substrate is the same as the projected length of the second overlapping portion on the substrate.
  • the projection of the component group on the substrate falls within the projection of the covering part on the substrate.
  • An embodiment of the present disclosure also provides a circuit board, including the first protective tape, the substrate, and the component group as described in the embodiment of the present disclosure.
  • An embodiment of the present disclosure also provides a display module, including a display panel, the circuit board and the second protective tape as described in the embodiment of the present disclosure.
  • An embodiment of the present disclosure also provides a method for manufacturing the display module provided by the embodiment of the present disclosure.
  • the manufacturing method includes:
  • a component group is provided on one side of the substrate
  • a first protective tape is attached to the side of the component group facing away from the substrate, wherein the A protective tape includes: a covering portion covering the component group, and an overlapping portion extending from at least one side of the covering portion to contact the substrate;
  • a second protective tape is attached to the side of the first protective tape away from the component group, wherein the second protective tape is attached to the periphery of the component group and is electrically connected to the overlapping portion.
  • Sexual hookup is attached to the side of the first protective tape away from the component group, wherein the second protective tape is attached to the periphery of the component group and is electrically connected to the overlapping portion.
  • attaching the first protective tape to one side of the substrate includes:
  • a circuit board is provided, wherein a component group is provided on one side of the circuit board;
  • the electronic device protection structure includes a first protective tape, and a second protective tape located on the side of the first protective tape away from the component group;
  • the first protective tape includes: covering The covering part of the component group, and extending from at least one side of the covering part to the overlapping part in contact with the substrate;
  • the second protective tape is attached to the periphery of the component group and electrically overlapped with the overlapping part, that is, this
  • the first protective tape on the surface of the component group and the second protective tape on the periphery of the component group are designed separately, and then the two pieces are put together in a "stacked" manner.
  • the protective tape in the area is connected, so that the first protective tape on the surface of the component group can be grounded through the second protective tape on the periphery of the component group. Since the covering part on the surface of the component group is integrated with the extended overlap part, and is connected with the component
  • the second protective tape on the periphery of the device group is designed to be separated, so there will be no wrinkles and false attachments like the one-piece design, which can also improve related technologies. When attaching protective tape to the circuit board, the attached tape will have wrinkles and False stickers may cause poor electromagnetic and electrostatic protection.
  • Figure 1A is a schematic top view of a protective tape attached in the related art
  • Figure 1B is a schematic cross-sectional view along the dotted line A1B1 in Figure 1A;
  • Figure 1C is a schematic cross-sectional view along the dotted line C1D1 in Figure 1A;
  • Figure 2A is a schematic top view of the circuit board when the first protective tape and the second protective tape are not attached;
  • Figure 2B is a schematic cross-sectional view along the dotted line A1B1 in Figure 2A;
  • Figure 3A is a top view of the circuit board when the first protective tape is attached
  • Figure 3B is a schematic cross-sectional view along the dotted line A1B1 in Figure 3A;
  • FIG. 3C is a schematic cross-sectional view of the transfer film attached along the dotted line A2B2 in Figure 3A;
  • FIG. 3C is a schematic cross-sectional view after the first protective tape is attached along the dotted line A2B2 in Figure 3A;
  • Figure 4A is a schematic top view of the transfer film corresponding to the second protective tape
  • Figure 4B is a top view of the second protective tape
  • Figure 4C is a schematic top view after the second protective tape is attached
  • Figure 5A is a top view of the circuit board after attaching the first protective tape and the second protective tape;
  • Figure 5B is a schematic cross-sectional view along the dotted line A1B1 in Figure 5A;
  • FIG. 6 is a schematic diagram of a manufacturing process of a display device according to an embodiment of the present disclosure.
  • the waterproof structure can only be designed from the inside out.
  • waterproof glue is placed around the component area. This requires that during the production process of the display screen, the components cannot be placed when applying protective tape (EMI Tape) for electrostatic and electromagnetic protection.
  • Group 02 is covered all around, and component group 02 is surrounded by reserved space for dispensing.
  • the protective tape 03 on the surface of the component and the circuit board is isolated from each other.
  • the protective tape 03 on the surface of component group 02 cannot be grounded.
  • Figures 1A to 1C are shown.
  • Figure 1B is a schematic cross-sectional view along the dotted line A1B1 in Figure 1A.
  • Figure 1C is a schematic cross-sectional view along the dotted line C1D1 in Figure 1A.
  • the protective tape 03 When the protective tape 03 is attached, it adopts an integrated design. That is, the surface of component group 02 and the surface of the circuit board are one piece of tape. After the circuit board is bound, a full surface of transfer film 05 is used to attach it. The surface protective tape 03 of component group 02 and the surface protective tape 03 of the circuit board pass through the sides. Small areas are connected into a whole to achieve grounding.
  • the problems with the integrated design are as shown in Figure 1C.
  • the right side of Figure 1C is a schematic diagram when attaching through the transfer film 05
  • the left side of Figure 1C is a schematic diagram of the final attachment of the protective tape 03 after removing the transfer film 05.
  • FIGS. 2A to 5B wherein FIG. 2A is a top view of the circuit board without the first protective tape and the second protective tape being attached, and FIG. 2B is a cross-section along the dotted line A1B1 in FIG. 2A
  • Figure 3A is a top view of the circuit board after the first protective tape is attached
  • Figure 3B is a cross-sectional schematic diagram along the dotted line A1B1 in Figure 3A
  • the right picture of Figure 3C shows the attachment through the transfer film along the dotted line A2B2 in Figure 3A
  • the left picture of Figure 3C is the cross-sectional schematic diagram when the first protective tape is attached along the dotted line A2B2 in Figure 3A.
  • Figure 4A is a top view of the transfer film corresponding to the second protective tape.
  • Figure 4B is the second protective tape.
  • Figure 4C is a top view of the circuit board after attaching the second protective tape.
  • Figure 5A is a top view of the circuit board after attaching the first protective tape and the second protective tape.
  • Figure 5B is the dotted line in Figure 5A A schematic cross-sectional view at A1B1, the embodiment of the present disclosure provides an electronic device protection structure, including: a substrate 1, a component group 2 located on one side of the substrate 1, and a third component group 2 located on the side away from the substrate 1 A protective tape 3, and a second protective tape 4 located on the side of the first protective tape 3 facing away from the component group 2;
  • the component group 2 may include one or more components, the components of which may include, for example, Control chip IC, capacitor C and/or resistor R, etc.;
  • the first protective tape 3 includes: a covering portion 31 covering the component group 2, and an overlapping portion 32 extending from at least one side of the covering portion 31 to contact the substrate 1;
  • the second protective tape 4 is attached to the periphery of the component group 2 and electrically overlaps with the overlapping portion 32 .
  • the periphery of the component group 2 can be understood as part or all of the area outside the area where the component group 2 is located.
  • the electronic device protection structure includes a first protective tape 3 and a second protective tape 4 located on the side of the first protective tape 3 away from the component group 2;
  • the first protective tape 3 includes: covering the component group 2 The covering portion 31 of 2, and extending from at least one side of the covering portion 31 to contact the substrate 1 The overlapping portion 32;
  • the second protective tape 4 is attached to the periphery of the component group 2 and is electrically overlapped with the overlapping portion 32.
  • the first protective tape 3 on the surface of the component group 2 and the second protective tape 4 on the periphery of the component group 2 are designed separately, and then the protective tapes in the two areas are connected by "stacking", so that the surface of the component group 2
  • the first protective tape 3 can be grounded through the second protective tape 4 on the periphery of the component group 2, because the covering portion 31 on the surface of the component group 2 is integrated with the extended overlapping portion 32, and is connected with the outer surface of the component group 2.
  • the second protective tape 4 is designed separately, so there will be no wrinkles or false sticking when attaching like the one-piece design, which can also improve the related technology. When attaching the protective tape, the attached tape will have wrinkles and false sticking, causing electromagnetic interference. And the problem of poor electrostatic protection effect.
  • the gap P can be used to set waterproof glue to waterproof the component group 2, that is, by dispensing glue on the component group 2 and the peripheral gap P to strengthen the waterproofing of the component group 2 and improve the waterproofing of the component group 2.
  • the circuit board is used in a foldable display device (such as a foldable mobile phone), due to its folding characteristics, there will be a gap between the screen and the middle frame of the whole device, making it impossible to waterproof the case, and there will be problems with poor waterproof performance.
  • the overlapping part 32 includes: a first overlapping part 321, and a second overlapping part connecting the first overlapping part 321 and the covering part 31.
  • the connecting portion 322; the first overlapping portion 321 is in contact with the substrate 1, and the overlapping portion 32 is electrically connected to the second protective tape 4 at the first overlapping portion 321.
  • the second overlapping portion 322 is used to connect the covering portion 31 and the first overlapping portion 321 , and may be partially in contact with the substrate 1 and partially inclined at a certain angle with the substrate 1 .
  • the lower image in FIG. 3B is an enlarged schematic view of the upper image in FIG. 3B corresponding to the dotted box
  • the lower image in FIG. 5B is the enlarged schematic view of FIG. 5B
  • the upper figure in corresponds to the enlarged schematic diagram of the dotted box.
  • the first protective tape 3 includes a first insulating layer 33, a first conductive layer 35, and a second insulating layer 34 stacked away from the substrate 1 in order;
  • the second protective tape 4 It includes a third insulating layer 41, a second conductive layer 43 and a fourth insulating layer 42 stacked on the side away from the substrate 1 in sequence;
  • the first protective tape 3 faces the side of the second protective tape 4 and overlaps with the first protective tape 3. Part 321 corresponding area
  • the first conductive layer 35 is exposed, and the second conductive layer 43 of the second protective tape 4 is exposed on the side facing the first protective tape 3 and corresponding to the first overlapping portion 321, so that the first conductive layer of the first protective tape 3 is exposed.
  • the layer 35 is electrically connected to the second conductive layer 43 of the second protective tape 4 .
  • the substrate 1 includes a third conductive layer, and the third conductive layer includes wires 5 ; the second protective tape 4 also electrically overlaps part of the wires 5 .
  • the circuit board can be deducted from external static electricity or electromagnetic interference signals.
  • the material of the conductor 5 may be copper, for example.
  • the overlapping portion 32 can extend toward the side of the circuit board where the wires 5 are disposed.
  • the side of the second protective tape 4 facing the substrate 1 has an opening 40 in the area corresponding to the conductor at the overlap, exposing the second conductive layer 43 so that the second conductive layer 43 of the second protective tape 4 is exposed.
  • the two conductive layers 43 are electrically connected to the conductor 5 .
  • the first insulating layer 33 includes: a first sub-insulating layer 331 and a first insulating glue located on the side of the first sub-insulating layer 331 away from the first conductive layer 35 layer 332;
  • the first conductive layer 35 includes: a first sub-conductive layer 351, and a first conductive adhesive layer 352 located on the side of the first sub-conductive layer 351 facing the first insulating layer 33;
  • the second insulating layer 34 includes: a second The sub-insulating layer 341 and the second insulating glue layer 342 located on the side of the second sub-insulating layer 341 facing the first conductive layer 35 .
  • the third insulating layer 41 includes: a third sub-insulating layer 411 and a third insulating glue located on the side of the third sub-insulating layer 411 away from the second conductive layer 43 layer 412;
  • the second conductive layer 43 includes: a second sub-conductive layer 431, and a second conductive adhesive layer 432 located on the side of the second sub-conductive layer 431 facing the third insulating layer 41;
  • the fourth insulating layer 42 includes: a fourth The sub-insulating layer 421, and the fourth insulating glue layer 422 located on the side of the fourth sub-insulating layer 421 facing the second conductive layer 43.
  • the material of the first sub-insulating layer 331 and the third sub-insulating layer 411 are the same, and the first insulating glue layer 332 and the third insulating glue layer 412 are made of the same material;
  • the material of the first sub-insulating layer 331 and the material of the third sub-insulating layer 411 are, for example, They can both be made of polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • the first insulating glue layer 332 and the third insulating glue layer 412 can both be made of insulating pressure-sensitive adhesive (Pressure Sensitive Adhesive, PSA);
  • the material of the first sub-conductive layer 351 is the same as the material of the second sub-conductive layer 431.
  • the material of the first conductive glue layer 352 is the same as the material of the second conductive glue layer 432.
  • the material of the first conductive glue layer 352 is the same as that of the second conductive sub-layer 431.
  • the material of the second conductive adhesive layer 432 can be conductive cloth, or it can be a copper layer, or it can be electrospinning.
  • the material of the first conductive adhesive layer 352 is different from the material of the second conductive adhesive.
  • the material of the layer 432 can be, for example, conductive pressure-sensitive adhesive (Pressure Sensitive Adhesive, PSA);
  • the material of the second sub-insulating layer 341 is the same as the material of the fourth sub-insulating layer 421.
  • the material of the second insulating glue layer 342 is the same as the material of the fourth insulating glue layer 422.
  • the material of the second sub-insulating layer 341 is the same as that of the fourth sub-insulating layer 421.
  • the material of the fourth sub-insulating layer 421, for example, can both be Mylar; the materials of the second insulating glue layer 342 and the fourth insulating glue layer 422, for example, can both be insulating pressure-sensitive adhesive (Mylar). Pressure Sensitive Adhesive (PSA).
  • the projected width d1 of the first overlapping portion 321 on the substrate 1 is greater than the projected width d1 of the covering portion 31 on the substrate 1 .
  • the projected width d2 of the substrate 1; in the direction perpendicular to the direction from the covering portion 31 to the overlapping portion 32, the projected width d2 of the covering portion 31 on the substrate 1 is greater than the projected width d3 of the second overlapping portion 322 on the substrate 1 .
  • the projected length a1 of the first overlapping portion 321 on the substrate 1 is smaller than the length a1 of the covering portion 31 on the substrate.
  • the projected length a2 of 1; in the direction from the covering part 31 to the overlapping part 32, the projected length a1 of the first overlapping part 321 on the substrate 1 is the same as the projected length a3 of the second overlapping part 322 on the substrate 1 .
  • the orthographic projection of the component group 2 on the substrate 1 falls within the orthographic projection of the covering part 31 on the substrate 1 .
  • the orthographic projection of the covering portion 31 on the substrate 1 and the orthographic projection of the component group 2 on the substrate 1 can overlap each other.
  • an embodiment of the present disclosure also provides a circuit board, including the first protective tape provided by the embodiment of the present disclosure, a substrate, and a component group.
  • the circuit board is a flexible circuit board (FPC).
  • FPC flexible circuit board
  • an embodiment of the present disclosure also provides a display module, including a display panel, a circuit board and a second protective tape as provided in the embodiment of the present disclosure.
  • the display module of the embodiment of the present disclosure can be a folding display device, for example, it can be a folding mobile phone, a folding tablet computer, a folding TV, a folding display, a folding laptop, a folding digital photo frame, a folding navigator, or any other device with a display.
  • Functional products or components are understood by those of ordinary skill in the art, and will not be described in detail here, nor should they be used to limit the present disclosure.
  • an embodiment of the present disclosure also provides a manufacturing method for manufacturing a display module as provided in an embodiment of the present disclosure. As shown in FIG. 6 , the manufacturing method includes:
  • Step S100 Provide a substrate, wherein a component group is provided on one side of the substrate;
  • Step S200 Attach a first protective tape on the side of the component group facing away from the substrate, where the first protective tape includes: a covering portion covering the component group, and at least one side of the covering portion extends out to contact the substrate.
  • Step S300 Attach a second protective tape on the side of the first protective tape away from the component group, where the second protective tape is attached to the periphery of the component group and electrically overlaps with the overlapping portion.
  • attaching the first protective tape on the side of the component group facing away from the substrate includes:
  • Step S201 Provide a circuit board, wherein a component group is provided on one side of the circuit board;
  • Step S202 Attach the first protective tape to one side of the circuit board
  • Step S203 Bind the circuit board with the first protective tape attached to the display panel.
  • the first protective tape can be attached after the circuit board supplier completes the production. This can play the role of protecting against static electricity when the circuit board is a single unit, and does not increase the process steps of the module factory. .
  • the electronic device protection structure includes a first protective tape 3 and a second protective tape 4 located on the side of the first protective tape 3 away from the component group 2;
  • the first protective tape 3 includes: a covering part 31 covering the component group 2, and the covering part 31 At least one side of 31 extends to the overlap portion 32 in contact with the substrate 1;
  • the second protective tape 4 is attached to the periphery of the component group 2 and electrically overlaps with the overlap portion 32, that is, in the embodiment of the present disclosure,
  • the first protective tape 3 on the surface of the component group 2 and the second protective tape 4 on the periphery of the component group 2 are designed separately, and then the two areas are separated by the "stacked" method.
  • the protective tape is connected, so that the first protective tape 3 on the surface of the component group 2 can be grounded through the second protective tape 4 on the periphery of the component group 2. Since the covering portion 31 on the surface of the component group 2 and the extended overlapping portion 32 It is integrated and designed separately from the second protective tape 4 on the periphery of the component group 2, so there will be no wrinkles and false attachments like the one-piece design, which can also improve the related technology when attaching protective tape to the circuit board. , the attached tape has wrinkles and false attachments, resulting in poor electromagnetic and electrostatic protection effects.

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  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本公开公开了一种电子器件保护结构、电路板、显示模组和制作方法，以改善相关技术在电子器件贴附防护胶带时，贴附的胶带存在褶皱以及虚贴，导致电磁以及静电防护效果不佳的问题。所述一种电路板，包括：衬底，位于所述衬底一侧的元器件组，以及位于所述元器件组远离所述衬底一侧的第一防护胶带，以及位于所述第一防护胶带背离所述元器件组一侧的第二防护胶带；所述第一防护胶带包括：覆盖于所述元器件组的覆盖部，以及由所述覆盖部至少一侧延伸出至所述衬底接触的搭接部；所述第二防护胶带贴附于所述元器件组外围，并与所述搭接部电性搭接。

Description

电子器件保护结构、电路板、显示模组和制作方法
相关申请的交叉引用
本公开要求在2022年05月24日提交中国专利局、申请号为202210569922.9、申请名称为“一种电子器件保护结构、电路板、显示模组和制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及半导体技术领域，尤其涉及一种电子器件保护结构、电路板、显示模组和制作方法。
背景技术
折叠手机由于其折叠特性，整机屏幕与中框之间会存在间隙，无法通过机壳防水，所以折叠产品的防水性能不佳。相关技术中，采用点涂防水胶方式通常会引起防护胶带静电屏蔽效果变差的问题。
发明内容
本公开提供一种电子器件保护结构、电路板、显示模组和制作方法，以改善相关技术在电子器件贴附防护胶带时，贴附的胶带存在褶皱以及虚贴，导致电磁以及静电防护效果不佳的问题。
本公开实施例提供一种电子器件保护结构，包括：衬底，位于所述衬底一侧的元器件组，以及位于所述元器件组远离所述衬底一侧的第一防护胶带，以及位于所述第一防护胶带背离所述元器件组一侧的第二防护胶带；
所述第一防护胶带包括：覆盖于所述元器件组的覆盖部，以及由所述覆盖部至少一侧延伸至与所述衬底接触的搭接部；
所述第二防护胶带贴附于所述元器件组外围，并与所述搭接部电性搭接。
在一种可能的实施方式中，所述第二防护胶带与所述元器件组之间具有 间隙。
在一种可能的实施方式中，所述搭接部包括：第一搭接部，以及连接所述第一搭接部与所述覆盖部的第二搭接部；
所述第一搭接部与所述衬底接触，所述搭接部在所述第一搭接部处与所述第二防护胶带电性搭接。
在一种可能的实施方式中，所述第一防护胶带包括依次远离所述衬底叠置的第一绝缘层、第一导电层、第二绝缘层；所述第二防护胶带包括依次远离所述衬底叠设置的第三绝缘层、第二导电层和第四绝缘层；
所述第一防护胶带朝向所述第二防护胶带的一面、且与所述第一搭接部对应区域暴露所述第一导电层，所述第二防护胶带在朝向所述第一防护胶带一面、且与所述第一搭接部对应的区域暴露所述第二导电层，以使所述第一防护胶带的所述第一导电层与所述第二防护胶带的所述第二导电层电性搭接。
在一种可能的实施方式中，所述衬底包括第三导电层，所述第三导电层包括导线，所述导线接地；
所述第二防护胶带还与部分所述导线电性搭接。
在一种可能的实施方式中，所述第二防护胶带面向所述衬底的一面在与搭接处的所述导线对应的区域具有开口，暴露所述第二导电层，以使所述第二防护胶带的所述第二导电层与所述导线电性搭接。
在一种可能的实施方式中，所述第一绝缘层包括：第一子绝缘层，以及位于所述第一子绝缘层背离所述第一导电层一侧的第一绝缘胶层；
所述第一导电层包括：第一子导电层，以及位于所述第一子导电层面向所述第一绝缘层一侧的第一导电胶层；
所述第二绝缘层包括：第二子绝缘层，以及位于所述第二子绝缘层面向所述第一导电层一侧的第二绝缘胶层。
在一种可能的实施方式中，所述第三绝缘层包括：第三子绝缘层，以及位于所述第三子绝缘层背离所述第二导电层一侧的第三绝缘胶层；
所述第二导电层包括：第二子导电层，以及位于所述第二子导电层面向 所述第三绝缘层一侧的第二导电胶层；
所述第四绝缘层包括：第四子绝缘层，以及位于所述第四子绝缘层面向所述第二导电层一侧的第四绝缘胶层。
在一种可能的实施方式中，所述第一子绝缘层的材质与所述第三子绝缘层的材质相同，所述第一绝缘胶层与所述第三绝缘胶层材质相同；
所述第一子导电层的材质与所述第二子导电层的材质相同，所述第一导电胶层的材质与所述第二导电胶层的材质相同；
所述第二子绝缘层的材质与所述第四子绝缘层的材质相同，所述第二绝缘胶层的材质与所述第四绝缘胶层的材质相同。
在一种可能的实施方式中，所述第一搭接部在所述衬底上的投影的宽度，大于所述覆盖部在所述衬底上的投影的宽度；
所述覆盖部在所述衬底上的投影的宽度，大于所述第二搭接部在所述衬底上的投影的宽度。
在一种可能的实施方式中，所述第一搭接部在所述衬底上的投影长度小于所述覆盖部在所述衬底上的投影长度；
所述第一搭接部在所述衬底上的投影长度与所述第二搭接部在所述衬底上的投影长度相同。
在一种可能的实施方式中，所述元器件组在所述衬底上的投影落在所述覆盖部在所述衬底的投影内。
本公开实施例还提供一种电路板，包括如本公开实施例提供所述的第一防护胶带，所述衬底，以及所述元器件组。
本公开实施例还提供一种显示模组，包括显示面板，以及如本公开实施例所述的电路板和所述第二防护胶带。
本公开实施例还提供一种制作如本公开实施例提供的所述显示模组的制作方法，所述制作方法包括：
提供一衬底，其中，所述衬底的一侧设置有元器件组；
在所述元器件组背离所述衬底的一侧贴附第一防护胶带，其中，所述第 一防护胶带包括:覆盖于所述元器件组的覆盖部，以及由所述覆盖部至少一侧延伸出与所述衬底接触的搭接部；
在所述第一防护胶带的背离所述元器件组的一侧贴附第二防护胶带，其中，所述第二防护胶带贴附于所述元器件组外围，并与所述搭接部电性搭接。
在一种可能的实施方式中，所述在衬底的一侧贴附第一防护胶带，包括：
提供一电路板，其中，所述电路板的一侧设置有元器件组；
在所述电路板的一侧贴附所述第一防护胶带；
将贴附有所述第一防护胶带的所述电路板与显示面板绑定。
本公开实施例有益效果如下：本公开实施例中，电子器件保护结构包括第一防护胶带，以及位于第一防护胶带背离元器件组一侧的第二防护胶带；第一防护胶带包括：覆盖于元器件组的覆盖部，以及由覆盖部至少一侧延伸至与衬底接触的搭接部；第二防护胶带贴附于元器件组外围，并与搭接部电性搭接，即，本公开实施例中，通过“叠拼”式的防护胶带结构设计，将元器件组表面的第一防护胶带与元器件组外围的第二防护胶带分离设计，然后通“叠拼”方式将两块区域的防护胶带连接，这样元器件组表面的第一防护胶带可以通过元器件组外围的第二防护胶带接地，由于元器件组表面的覆盖部与延伸出的搭接部为一体，且与元器件组外围的第二防护胶带分离设计，所以不会存在一体式设计那样贴附时的褶皱和虚贴，进而也可以改善相关技术在电路板贴附防护胶带时，贴附的胶带存在褶皱以及虚贴，导致电磁以及静电防护效果不佳的问题。
附图说明
图1A为相关技术的贴附有防护胶带的俯视示意图；
图1B为图1A中沿虚线A1B1处的截面示意图；
图1C为图1A中沿虚线C1D1处的截面示意图；
图2A为未贴附第一防护胶带以及第二防护胶带时的电路板的俯视示意图；
图2B为图2A中沿虚线A1B1处的截面示意图；
图3A为贴附第一防护胶带时的电路板的俯视示意图；
图3B为图3A中沿虚线A1B1处的截面示意图；
图3C右图为图3A中沿虚线A2B2处通过转移膜贴附时的截面示意图；
图3C左图为图3A中沿虚线A2B2处贴附完第一防护胶带时的截面示意图；
图4A与第二防护胶带对应的转移膜的俯视示意图；
图4B第二防护胶带的俯视示意图；
图4C为贴附完第二防护胶带时的俯视示意图；
图5A为贴附完第一防护胶带以及第二防护胶带后的电路板的俯视示意图；
图5B为图5A中沿虚线A1B1处的截面示意图；
图6为本公开实施例提供的显示装置的制作流程示意图。
具体实施方式
为了使得本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、 “左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
如本文中使用的“大约”或“大致相同”包括所陈述的值且意味着在如由本领域普通技术人员考虑到所讨论的测量和与具体量的测量有关的误差(即，测量系统的限制)而确定的对于具体值的可接受的偏差范围内。例如，“大致相同”可意味着相对于所陈述的值的差异在一种或多种标准偏差范围内，或者在±30％、20％、10％、5％范围内。
在附图中，为了清楚，放大了层、膜、面板、区域等的厚度。在本文中参照作为理想化实施方式的示意图的横截面图描述示例性实施方式。这样，将预计到作为例如制造技术和/或公差的结果的与图的形状的偏差。因而，本文中描述的实施方式不应解释为限于如本文中所示的区域的具体形状，而是包括由例如制造所导致的形状方面的偏差。例如，图示或描述为平坦的区域可典型地具有粗糙的和/或非线性的特征。此外，所图示的尖锐的角可为圆形的。因而，图中所示的区域在本质上是示意性的，并且它们的形状不意图图示区域的精确形状，且不意图限制本权利要求的范围。
为了保持本公开实施例的以下说明清楚且简明，本公开省略了已知功能和已知部件的详细说明。
为提高折叠产品整机防水性能，只能由内而外设计防水结构。一般在显示屏组装整机时会在元器件组域四周点防水胶，这就要求在显示屏生产过程中，贴合用于静电及电磁防护的防护胶带(EMI Tape)的时候不能将元器件组02四周覆盖，元器件组02四周是点胶预留空间，但是元器件和电路板表面的防护胶带03相互孤立，元器件组02表面的防护胶带03无法接地，为了实现接地，常规设计如图1A-图1C所示，其中，图1B为图1A中沿虚线A1B1处的截面示意图，图1C为图1A中沿虚线C1D1处的截面示意图，防护胶带03贴附时，采用一体式设计，即元器件组02表面与电路板表面为一整张胶带，在电路板绑定后采用一整面转移膜05贴附，元器件组02表面防护胶带03和电路板表面防护胶带03通过侧边的小块区域连接成一个整体，可以实现接地， 但是一体式设计存在的问题如图1C所示，其中，图1C右侧为通过转移膜05贴附时的示意图，图1C左图为去除转移膜05后防护胶带03的最终贴附示意图，由于元器件组02表面防护胶带03三边与电路板表面防护胶带03处于断裂状态，且在贴附时存在元器件组02侧边呈现斜坡式，而且斜坡区域的防护胶带03较为窄长(例如，宽度2～3mm，长度20mm左右)，贴附时必然存在褶皱以及虚贴问题，导致电磁以及静电防护效果不佳的问题。
有鉴于此，参见图2A-图5B所示，其中，图2A为未贴附第一防护胶带以及第二防护胶带时的电路板的俯视示意图，图2B为图2A中沿虚线A1B1处的截面示意图，图3A为贴附第一防护胶带后的电路板的俯视示意图，图3B为图3A中沿虚线A1B1处的截面示意图，图3C右图为图3A中沿虚线A2B2处通过转移膜贴附时的截面示意图，图3C左图为图3A中沿虚线A2B2处贴附完第一防护胶带时的截面示意图，图4A与第二防护胶带对应的转移膜的俯视示意图，图4B第二防护胶带的俯视示意图，图4C为贴附完第二防护胶带时的俯视示意图，图5A为贴附完第一防护胶带以及第二防护胶带后的电路板的俯视示意图，图5B为图5A中沿虚线A1B1处的截面示意图，本公开实施例提供一种电子器件保护结构，包括：衬底1，位于衬底1一侧的元器件组2，以及位于元器件组2远离衬底1一侧的第一防护胶带3，以及位于第一防护胶带3背离元器件组2一侧的第二防护胶带4；具体的，元器件组2可以包括一个或多个元器件，其中的元器件例如，可以包括控制芯片IC、电容C和/或电阻R等；
第一防护胶带3包括：覆盖于元器件组2的覆盖部31，以及由覆盖部31至少一侧延伸至与衬底1接触的搭接部32；
第二防护胶带4贴附于元器件组2外围，并与搭接部32电性搭接。具体的，元器件组2外围可以理解为元器件组2所在区域以外的部分或全部区域。
本公开实施例中，电子器件保护结构包括第一防护胶带3，以及位于第一防护胶带3背离元器件组2一侧的第二防护胶带4；第一防护胶带3包括：覆盖于元器件组2的覆盖部31，以及由覆盖部31至少一侧延伸至与衬底1接触 的搭接部32；第二防护胶带4贴附于元器件组2外围，并与搭接部32电性搭接，即，本公开实施例中，通过“叠拼”式的防护胶带结构设计，将元器件组2表面的第一防护胶带3与元器件组2外围的第二防护胶带4分离设计，然后通“叠拼”方式将两块区域的防护胶带连接，这样元器件组2表面的第一防护胶带3可以通过元器件组2外围的第二防护胶带4接地，由于元器件组2表面的覆盖部31与延伸出的搭接部32为一体，且与元器件组2外围的第二防护胶带4分离设计，所以不会存在一体式设计那样贴附时的褶皱和虚贴，进而也可以改善相关技术在贴附防护胶带时，贴附的胶带存在褶皱以及虚贴，导致电磁以及静电防护效果不佳的问题。
在一种可能的实施方式中，结合图5A所示，第二防护胶带4与元器件组2之间具有间隙P。具体的，该间隙P可以用于设置对元器件组2进行防水的防水胶，即通过对元器件组2以及外围的间隙P进行点胶，以强化对元器件组2的防水，改善将该电路板应用于折叠显示装置(例如折叠手机)时，由于其折叠特性，整机屏幕与中框之间会存在间隙，无法通过机壳防水，会存防水性能不佳的问题。
在一种可能的实施方式中，结合图3A、图3B和图5B所示，搭接部32包括：第一搭接部321，以及连接第一搭接部321与覆盖部31的第二搭接部322；第一搭接部321与衬底1接触，搭接部32具体在第一搭接部321处与第二防护胶带4电性搭接。具体的，第二搭接部322用于连接覆盖部31以及第一搭接部321，其可以是部分与衬底1接触，部分与衬底1呈一定角度的倾斜设置。
在一种可能的实施方式中，结合图3B和图5B所示，其中图3B中的下图为图3B中的上图对应虚线方框处的放大示意图，图5B中的下图为图5B中的上图对应虚线方框处的放大示意图，第一防护胶带3包括依次远离衬底1叠置的第一绝缘层33、第一导电层35、第二绝缘层34；第二防护胶带4包括依次远离衬底1一侧叠置的第三绝缘层41、第二导电层43和第四绝缘层42；第一防护胶3带面向第二防护胶带4的一面、且与第一搭接部321对应区域 暴露第一导电层35，第二防护胶带4在朝向第一防护胶带3一面、且与第一搭接部321对应的区域暴露第二导电层43，以使第一防护胶带3的第一导电层35与第二防护胶带4的第二导电层43电性搭接。
在一种可能的实施方式中，结合图5B所示，衬底1包括第三导电层，第三导电层包括导线5；第二防护胶带4还与部分导线5电性搭接。如此，以实现将电路板受到外界的静电或电磁等干扰信号导出。具体的，导线5的材质，例如，可以为铜。
在一种可能的实施方式中，结合图5B所示，搭接部32可以向电路板中设置有导线5的一侧进行延伸。
具体的，结合图5B所示，第二防护胶带4面向衬底1的一面在与搭接处的导线对应的区域具有开口40，暴露第二导电层43，以使第二防护胶带4的第二导电层43与导线5电性搭接。
在一种可能的实施方式中，结合图5B所示，第一绝缘层33包括：第一子绝缘层331，以及位于第一子绝缘层331背离第一导电层35一侧的第一绝缘胶层332；第一导电层35包括：第一子导电层351，以及位于第一子导电层351面向第一绝缘层33一侧的第一导电胶层352；第二绝缘层34包括：第二子绝缘层341，以及位于第二子绝缘层341面向第一导电层35一侧的第二绝缘胶层342。
在一种可能的实施方式中，结合图5B所示，第三绝缘层41包括：第三子绝缘层411，以及位于第三子绝缘层411背离第二导电层43一侧的第三绝缘胶层412；第二导电层43包括：第二子导电层431，以及位于第二子导电层431面向第三绝缘层41一侧的第二导电胶层432；第四绝缘层42包括：第四子绝缘层421，以及位于第四子绝缘层421面向第二导电层43一侧的第四绝缘胶层422。
在一种可能的实施方式中，结合图5B所示，第一子绝缘层331的材质与第三子绝缘层411的材质相同，第一绝缘胶层332与第三绝缘胶层412材质相同；具体的，第一子绝缘层331的材质与第三子绝缘层411的材质，例如， 可以均为聚对苯二甲酸乙二醇酯(Polyethylene terephthalate，PET)，具体的，例如，第一绝缘胶层332与第三绝缘胶层412材质可以均为绝缘压敏胶(Pressure Sensitive Adhesive，PSA)；
第一子导电层351的材质与第二子导电层431的材质相同，第一导电胶层352的材质与第二导电胶层432的材质相同；具体的，第一导电胶层352的材质与第二导电胶层432的材质例如，可以均为导电布，又例如，可以均为铜层，又例如，可以为静电纺丝；具体的，第一导电胶层352的材质与第二导电胶层432的材质，例如，可以均为导电压敏胶(Pressure Sensitive Adhesive，PSA)；
第二子绝缘层341的材质与第四子绝缘层421的材质相同，第二绝缘胶层342的材质与第四绝缘胶层422的材质相同，具体的，第二子绝缘层341的材质与第四子绝缘层421的材质，例如，可以均为迈拉胶层(Mylar)；第二绝缘胶层342的材质与第四绝缘胶层422的材质，例如，可以均为绝缘压敏胶(Pressure Sensitive Adhesive，PSA)。
在一种可能的实施方式中，结合图3A所示，在垂直于由覆盖部31指向搭接部32的方向上，第一搭接部321在衬底1的投影宽度d1大于覆盖部31在衬底1的投影宽度d2；在垂直于由覆盖部31指向搭接部32的方向上，覆盖部31在衬底1的投影宽度d2大于第二搭接部322在衬底1的投影宽度d3。
在一种可能的实施方式中，结合图3A所示，在由覆盖部31指向搭接部32的方向上，第一搭接部321在衬底1的投影长度a1小于覆盖部31在衬底1的投影长度a2；在由覆盖部31指向搭接部32的方向上，第一搭接部321在衬底1的投影长度a1与第二搭接部322在衬底1的投影长度a3相同。
在一种可能的实施方式中，结合图2A和图3A所示，元器件组2在衬底1的正投影落在覆盖部31在衬底1的正投影内。具体的，覆盖部31在衬底1的正投影与元器件组2在衬底1的正投影可以互相重合。
基于同一发明构思，本公开实施例还提供一种电路板，包括本公开实施例提供的第一防护胶带，衬底，以及元器件组。
在一种可能的实施方式中，电路板为柔性电路板FPC。
基于同一发明构思，本公开实施例还提供一种显示模组，包括显示面板，以及包括如本公开实施例提供的电路板和第二防护胶带。具体的，本公开实施例的显示模组可以为折叠显示装置，例如，可以为折叠手机，折叠平板电脑、折叠电视机、折叠显示器、折叠笔记本电脑、折叠数码相框、折叠导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本公开的限制。
基于同一发明构思，本公开实施例还提供一种制作如本公开实施例提供的显示模组的制作方法，参见图6所示，制作方法包括：
步骤S100、提供一衬底，其中，衬底的一侧设置有元器件组；
步骤S200、在元器件组背离衬底的一侧贴附第一防护胶带，其中，第一防护胶带包括：覆盖于元器件组的覆盖部，以及由覆盖部至少一侧延伸出与衬底接触的搭接部；
步骤S300、在第一防护胶带的背离元器件组的一侧贴附第二防护胶带，其中，第二防护胶带贴附于元器件组外围，并与搭接部电性搭接。
在一种可能的实施方式中，关于步骤S200、在元器件组背离衬底的一侧贴附第一防护胶带，包括：
步骤S201、提供一电路板，其中，电路板的一侧设置有元器件组；
步骤S202、在电路板的一侧贴附第一防护胶带；
步骤S203、将贴附有第一防护胶带的电路板与显示面板绑定。
本公开实施例中，第一防护胶带可以在电路板供应商制作完成后就进行贴附，这样可以在电路板单体时就起到防护静电的功能，且不会增加模组厂的工艺步骤。
本公开实施例有益效果如下：本公开实施例中，电子器件保护结构包括第一防护胶带3，以及位于第一防护胶带3背离元器件组2一侧的第二防护胶带4；第一防护胶带3包括：覆盖于元器件组2的覆盖部31，以及由覆盖部 31至少一侧延伸至与衬底1接触的搭接部32；第二防护胶带4贴附于元器件组2外围，并与搭接部32电性搭接，即，本公开实施例中，通过“叠拼”式的防护胶带结构设计，将元器件组2表面的第一防护胶带3与元器件组2外围的第二防护胶带4分离设计，然后通“叠拼”方式将两块区域的防护胶带连接，这样元器件组2表面的第一防护胶带3可以通过元器件组2外围的第二防护胶带4接地，由于元器件组2表面的覆盖部31与延伸出的搭接部32为一体，且与元器件组2外围的第二防护胶带4分离设计，所以不会存在一体式设计那样贴附时的褶皱和虚贴，进而也可以改善相关技术在电路板贴附防护胶带时，贴附的胶带存在褶皱以及虚贴，导致电磁以及静电防护效果不佳的问题。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (16)

  1. 一种电子器件保护结构，其中，包括：衬底，位于所述衬底一侧的元器件组，以及位于所述元器件组远离所述衬底一侧的第一防护胶带，以及位于所述第一防护胶带背离所述元器件组一侧的第二防护胶带；
    所述第一防护胶带包括：覆盖于所述元器件组的覆盖部，以及由所述覆盖部至少一侧延伸至与所述衬底接触的搭接部；
    所述第二防护胶带贴附于所述元器件组外围，并与所述搭接部电性搭接。
  2. 如权利要求1所述的电子器件保护结构，其中，所述第二防护胶带与所述元器件组之间具有间隙。
  3. 如权利要求1或2所述的电子器件保护结构，其中，所述搭接部包括：第一搭接部，以及连接所述第一搭接部与所述覆盖部的第二搭接部；
    所述第一搭接部与所述衬底接触，所述搭接部在所述第一搭接部处与所述第二防护胶带电性搭接。
  4. 如权利要求3所述的电子器件保护结构，其中，所述第一防护胶带包括依次远离所述衬底叠置的第一绝缘层、第一导电层、第二绝缘层；所述第二防护胶带包括依次远离所述衬底叠设置的第三绝缘层、第二导电层和第四绝缘层；
    所述第一防护胶带朝向所述第二防护胶带的一面、且与所述第一搭接部对应区域暴露所述第一导电层，所述第二防护胶带在朝向所述第一防护胶带一面、且与所述第一搭接部对应的区域暴露所述第二导电层，以使所述第一防护胶带的所述第一导电层与所述第二防护胶带的所述第二导电层电性搭接。
  5. 如权利要求4所述的电子器件保护结构，其中，所述衬底包括第三导电层，所述第三导电层包括导线，所述导线接地；
    所述第二防护胶带还与部分所述导线电性搭接。
  6. 如权利要求5所述的电子器件保护结构，其中，所述第二防护胶带面向所述衬底的一面在与搭接处的所述导线对应的区域具有开口，暴露所述第 二导电层，以使所述第二防护胶带的所述第二导电层与所述导线电性搭接。
  7. 如权利要求4-6任一项所述的电子器件保护结构，其中，所述第一绝缘层包括：第一子绝缘层，以及位于所述第一子绝缘层背离所述第一导电层一侧的第一绝缘胶层；
    所述第一导电层包括：第一子导电层，以及位于所述第一子导电层面向所述第一绝缘层一侧的第一导电胶层；
    所述第二绝缘层包括：第二子绝缘层，以及位于所述第二子绝缘层面向所述第一导电层一侧的第二绝缘胶层。
  8. 如权利要求7所述的电子器件保护结构，其中，所述第三绝缘层包括：第三子绝缘层，以及位于所述第三子绝缘层背离所述第二导电层一侧的第三绝缘胶层；
    所述第二导电层包括：第二子导电层，以及位于所述第二子导电层面向所述第三绝缘层一侧的第二导电胶层；
    所述第四绝缘层包括：第四子绝缘层，以及位于所述第四子绝缘层面向所述第二导电层一侧的第四绝缘胶层。
  9. 如权利要求8所述的电子器件保护结构，其中，所述第一子绝缘层的材质与所述第三子绝缘层的材质相同，所述第一绝缘胶层与所述第三绝缘胶层材质相同；
    所述第一子导电层的材质与所述第二子导电层的材质相同，所述第一导电胶层的材质与所述第二导电胶层的材质相同；
    所述第二子绝缘层的材质与所述第四子绝缘层的材质相同，所述第二绝缘胶层的材质与所述第四绝缘胶层的材质相同。
  10. 如权利要求3所述的电子器件保护结构，其中，所述第一搭接部在所述衬底上的投影的宽度，大于所述覆盖部在所述衬底上的投影的宽度；
    所述覆盖部在所述衬底上的投影的宽度，大于所述第二搭接部在所述衬底上的投影的宽度。
  11. 如权利要求3所述的电子器件保护结构，其中，所述第一搭接部在 所述衬底上的投影长度小于所述覆盖部在所述衬底上的投影长度；
    所述第一搭接部在所述衬底上的投影长度与所述第二搭接部在所述衬底上的投影长度相同。
  12. 如权利要求3所述的电子器件保护结构，其中，所述元器件组在所述衬底上的投影落在所述覆盖部在所述衬底的投影内。
  13. 一种电路板，其中，包括如权利要求1-12任一项所述的第一防护胶带，所述衬底，以及所述元器件组。
  14. 一种显示模组，其中，包括显示面板，以及如权利要求13所述的电路板和所述第二防护胶带。
  15. 一种制作如权利要求14所述的显示模组的制作方法，其中，所述制作方法包括：
    提供一衬底，其中，所述衬底的一侧设置有元器件组；
    在所述元器件组背离所述衬底的一侧贴附第一防护胶带，其中，所述第一防护胶带包括:覆盖于所述元器件组的覆盖部，以及由所述覆盖部至少一侧延伸出与所述衬底接触的搭接部；
    在所述第一防护胶带的背离所述元器件组的一侧贴附第二防护胶带，其中，所述第二防护胶带贴附于所述元器件组外围，并与所述搭接部电性搭接。
  16. 如权利要求15所述的制作方法，其中，所述在衬底的一侧贴附第一防护胶带，包括：
    提供一电路板，其中，所述电路板的一侧设置有元器件组；
    在所述电路板的一侧贴附所述第一防护胶带；
    将贴附有所述第一防护胶带的所述电路板与显示面板绑定。
PCT/CN2023/089684 2022-05-24 2023-04-21 电子器件保护结构、电路板、显示模组和制作方法 WO2023226644A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101765289A (zh) * 2009-12-30 2010-06-30 友达光电股份有限公司 静电放电防护结构及使用其的显示装置
US20170358642A1 (en) * 2016-06-10 2017-12-14 Samsung Display Co., Ltd. Display device
CN214122615U (zh) * 2020-10-23 2021-09-03 京东方科技集团股份有限公司 显示模组及显示装置
CN216487054U (zh) * 2021-07-21 2022-05-10 京东方科技集团股份有限公司 一种显示模组及显示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101765289A (zh) * 2009-12-30 2010-06-30 友达光电股份有限公司 静电放电防护结构及使用其的显示装置
US20170358642A1 (en) * 2016-06-10 2017-12-14 Samsung Display Co., Ltd. Display device
CN214122615U (zh) * 2020-10-23 2021-09-03 京东方科技集团股份有限公司 显示模组及显示装置
CN216487054U (zh) * 2021-07-21 2022-05-10 京东方科技集团股份有限公司 一种显示模组及显示装置

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