WO2023224238A1 - Dispositif électronique comprenant une couche gravée ayant une couleur indépendante de la couleur d'une couche imprimée - Google Patents

Dispositif électronique comprenant une couche gravée ayant une couleur indépendante de la couleur d'une couche imprimée Download PDF

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Publication number
WO2023224238A1
WO2023224238A1 PCT/KR2023/003613 KR2023003613W WO2023224238A1 WO 2023224238 A1 WO2023224238 A1 WO 2023224238A1 KR 2023003613 W KR2023003613 W KR 2023003613W WO 2023224238 A1 WO2023224238 A1 WO 2023224238A1
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Prior art keywords
layer
color
electronic device
imprinting
independent
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PCT/KR2023/003613
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English (en)
Korean (ko)
Inventor
임준엽
박중영
이진욱
김명곤
김서현
송태현
Original Assignee
삼성전자주식회사
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Priority claimed from KR1020220073650A external-priority patent/KR20230160668A/ko
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of WO2023224238A1 publication Critical patent/WO2023224238A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties

Definitions

  • an electronic device for example, an electronic device including an imprinting layer having a color independent of the color of the printing layer.
  • Laser engraving may be performed on the printed layer.
  • the portion on which laser engraving is performed on the printing layer may be referred to as an engraved layer.
  • the printing layer generally functions as a background color, and the imprinting layer is used to represent figures or text.
  • the color of the imprint layer may be dependent on the color of the print layer.
  • the color of the imprinting layer may be expressed dependently on the color of the printing layer.
  • Various embodiments may provide an electronic device including an imprinting layer having a color independent of the color of the printing layer.
  • the electronic device 300 includes a cover 310 made of a transparent material, an imprinting layer 320 connected to one surface of the cover and having a first color, and a protective layer 330 surrounding the imprinting layer. ), a film base 340 connected to one side of the protective layer, and a print layer 350 connected to the film base and having a second color.
  • an electronic device includes a cover 510 made of a transparent material, a first imprinted layer 520 connected to one surface of the cover and having a first color, and a first protection layer surrounding the first imprinted layer.
  • a layer 530, a first film base 540 connected to one side of the first protective layer, a second imprinted layer 570 connected to the first film base and having a second color, the second imprinted layer a second protective layer 580 surrounding the second protective layer 580, a second film base 590 connected to one side of the second protective layer, and a print layer 595 connected to one side of the second film base and having a third color. may include.
  • an electronic device may include a printing layer and an imprinting layer.
  • the color of the imprinting layer may be independent of the color of the printing layer.
  • FIG. 1 is a block diagram of an electronic device according to an embodiment.
  • FIG. 2A is a perspective view of the front of a mobile electronic device according to one embodiment.
  • FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A.
  • FIG. 3A is a cross-sectional view of an electronic device according to an embodiment, cut away from portion A1 of FIG. 2B.
  • FIG. 3B is an enlarged cross-sectional view of portion A2 of FIG. 3A.
  • Figure 4 is a cross-sectional view showing a state in which a temporary printing layer is connected to a cover according to an embodiment.
  • Figure 5 is a cross-sectional view showing a state in which a temporary film is connected to a temporary printing layer according to an embodiment.
  • Figure 6 is a cross-sectional view schematically showing a state in which laser engraving is performed on a temporary printing layer according to an embodiment.
  • Figure 7 is a cross-sectional view showing a state in which an imprinting layer is created on a temporary printing layer according to an embodiment.
  • Figure 8 is a cross-sectional view schematically showing the temporary film being separated according to one embodiment.
  • Figure 9 is a cross-sectional view showing a state in which an imprinting layer is connected to a cover according to an embodiment.
  • Figure 10 is a cross-sectional view schematically showing a state in which a protective layer approaches a cover according to an embodiment.
  • FIG. 11 is a cross-sectional view of an electronic device according to an embodiment.
  • FIG. 12 is an exploded cross-sectional view of an electronic device according to an embodiment.
  • FIG. 13 is a cross-sectional view of an electronic device according to an embodiment.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment, according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199 (e.g., a short-range wireless communication network). It is possible to communicate with at least one of the electronic device 104 or the server 108 through a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g., a central processing unit or an application processor
  • an auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • coprocessor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit signals or power to or receive signals or power from the outside (e.g., an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a first side e.g., bottom side
  • a designated high frequency band e.g., mmWave band
  • a plurality of antennas e.g., array antennas
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-mentioned devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a machine-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • two user devices e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.
  • FIG. 2A is a perspective view of the front of a mobile electronic device according to one embodiment.
  • FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A.
  • the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to an embodiment has a first side (or front) 210A, a second side (or back), and ) (210B), and a housing (210) including a side (210C) surrounding the space between the first surface (210A) and the second surface (210B).
  • the housing may refer to a structure that forms some of the first side 210A, second side 210B, and side surface 210C of FIG. 1 .
  • the first surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate).
  • the second surface 210B may be formed by a substantially opaque rear plate 211.
  • the back plate 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be.
  • the side 210C is coupled to the front plate 202 and the back plate 211 and may be formed by a side bezel structure (or “side member”) 218 including metal and/or polymer.
  • the back plate 211 and the side bezel structure 218 may be integrally formed and include the same material (eg, a metallic material such as aluminum).
  • text and/or shapes may be engraved on the second side 210B.
  • text and/or shapes may be formed in the portion marked A1.
  • Text and/or shapes may have color.
  • Text and/or shapes may have a color independent of the color of the rear plate 211. The structure in which the text and/or figure and each color of the back plate 211 are expressed externally will be described in detail with reference to FIG. 3A and the like.
  • the electronic device 200 includes a display 201, an audio module 203, 207, and 214, a sensor module 204, 216, and 219, a camera module 205, 212, and 213, and a key input. It may include at least one of the device 217, the light emitting element 206, the pen input device 220, and the connector holes 208 and 209. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or the light emitting device 206) or may additionally include another component.
  • Display 201 may be exposed, for example, through a significant portion of front plate 202 .
  • at least a portion of the display 201 may be exposed through the front plate 202 that forms the first area 210D of the first surface 210A and the side surface 210C.
  • the edges of the display 201 may be formed to be substantially the same as the adjacent outer shape of the front plate 202.
  • the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.
  • a recess or opening is formed in a portion of the screen display area of the display 201, and an audio module 214 and a sensor are aligned with the recess or opening. It may include at least one of a module 204, a camera module 205, and a light emitting device 206. In another embodiment (not shown), an audio module 214, a sensor module 204, a camera module 205, a fingerprint sensor 216, and a light emitting element 206 are located on the back of the screen display area of the display 201. ) may include at least one of the following.
  • the display 201 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • a touch detection circuit capable of measuring the intensity (pressure) of touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor modules 204, 219, and/or at least a portion of the key input device 217 are located in the first areas 210D and/or the second areas 210E. can be placed in the field.
  • the audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214.
  • a microphone for acquiring external sound may be placed inside the microphone hole 203, and in some embodiments, a plurality of microphones may be placed to detect the direction of the sound.
  • the speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for calls.
  • the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker may be included without the speaker holes 207 and 214 (e.g., piezo speaker).
  • the sensor modules 204, 216, and 219 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 200 or the external environmental state.
  • Sensor modules 204, 216, 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (e.g., a proximity sensor) disposed on the first side 210A of the housing 210. (not shown) (e.g., fingerprint sensor), and/or a third sensor module 219 (e.g., HRM sensor) and/or fourth sensor module 216 disposed on the second side 210B of the housing 210. ) (e.g., fingerprint sensor) may be included.
  • a first sensor module 204 e.g., a proximity sensor
  • a second sensor module e.g., a proximity sensor
  • a third sensor module 219 e.g., HRM sensor
  • the fingerprint sensor may be disposed on the first side 210A (e.g., the display 201) as well as the second side 210B of the housing 210.
  • the electronic device 200 includes a sensor module, not shown, e.g. For example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 204. It can be included.
  • the camera modules 205, 212, and 213 include a first camera device 205 disposed on the first side 210A of the electronic device 200, and a second camera device 212 disposed on the second side 210B. ), and/or a flash 213.
  • the camera devices 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 200.
  • the key input device 217 may be disposed on the side 210C of the housing 210.
  • the electronic device 200 may not include some or all of the key input devices 217 mentioned above, and the key input devices 217 not included may be other than soft keys on the display 201. It can be implemented in the form
  • the key input device may include a sensor module 216 disposed on the second side 210B of the housing 210.
  • the light emitting device 206 may be disposed, for example, on the first side 210A of the housing 210.
  • the light emitting device 206 may provide status information of the electronic device 200 in the form of light.
  • the light emitting device 206 may provide a light source that is linked to the operation of the camera module 205, for example.
  • the light emitting device 206 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 208 and 209 are a first connector hole 208 that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 209 that can accommodate a connector for transmitting and receiving audio signals.
  • a connector for example, a USB connector
  • a second connector hole eg, earphone jack
  • the pen input device 220 (e.g., stylus pen) can be inserted or detached by being guided into the interior of the housing 210 through the hole 221 formed on the side of the housing 210, and is easily detached. It can include a button to do this.
  • the pen input device 220 may have a separate resonance circuit built into it and be linked to an electromagnetic induction panel (eg, digitizer) included in the electronic device 200.
  • the pen input device 220 may include an electro-magnetic resonance (EMR) method, an active electrical stylus (AES) method, and an electric coupled resonance (ECR) method.
  • FIG. 3A is a cross-sectional view of an electronic device according to an embodiment, cut away from portion A1 of FIG. 2B.
  • FIG. 3B is an enlarged cross-sectional view of portion A2 of FIG. 3A.
  • an electronic device 300 (e.g., the electronic device 101 of FIG. 1 or the electronic device 200 of FIG. 2) includes an imprinting layer having a color independent of the color of the printing layer. , hereinafter referred to as “electronic device”) may display at least one color to the outside.
  • the electronic device 300 may externally display two colors.
  • the electronic device 300 may include an imprinting layer 320 and a printing layer 350 that each externally express independent colors.
  • the imprinting layer 320 may have a color independent of the color of the printing layer 350.
  • the color of the imprinting layer 320 may not be dependent on the color of the printing layer 350.
  • the electronic device 300 may include a cover 310, an imprinting layer 320, a protective layer 330, a film base 340, and a printing layer 350.
  • the cover 310, protective layer 330, film base 340, and printing layer 350 may be stacked in the z-axis direction.
  • the imprinting layer 320 may be provided between the cover 310 and the protective layer 330.
  • the cover 310 may be a part of the exterior of an electronic device (eg, the electronic device 200 of FIG. 2A).
  • the cover 310 can assist the colors of the parts provided inside the cover 310 to be expressed to the outside.
  • Cover 310 may include a transparent material.
  • the cover 310 may include a material having transparency.
  • the cover 310 may include at least one of tempered glass or reinforced plastic.
  • the shape of the cover 310 may be planar or three-dimensional.
  • the imprinting layer 320 may be formed by laser engraving.
  • the imprinting layer 320 may have a plurality of irregularities 321 .
  • the irregularities 321 may form at least one of irregular lines, grids, dots, or burrs.
  • the irregularities 321 may form a linear pattern, and the irregularities may be dot-like puddles or burs caused by damage from a laser.
  • the surface of the imprint layer 320 facing the cover 310 may be rough due to the plurality of irregularities 321 .
  • the imprinting layer 320 is a separate component from the printing layer 350, which will be described later, and may have an independent color that is not dependent on the color of the printing layer 350.
  • the imprinting layer 320 may have a first color.
  • the first color may be red, green, or blue. It should be noted that the first color is not limited thereto.
  • the imprinting layer 320 may have a first thickness d1. The first thickness may be 5 ⁇ m or more and less than 10 ⁇ m.
  • the imprinting layer 320 is not formed on the printing layer 350 but is provided separately, it can have a color independent of the color of the printing layer 350.
  • the color of the imprinting layer 320 may be expressed externally through the cover 310 independently of the color of the printing layer 350.
  • the imprinting layer 320 may be provided in plural pieces.
  • a plurality of imprinting layers may be provided to be spaced apart from each other in the x-axis or y-axis direction.
  • the imprinting layer 320 may have three imprinting layers 320A, 320B, and 320C. In the drawing, it is shown that there are three imprinted layers, but the number is not limited thereto.
  • Each of the plurality of imprinting layers may have a different color. It should be noted that a plurality of imprinted layers may have the same color.
  • the imprinting layer 320 may be provided between the cover 310 and the protective layer 330.
  • the cover 310 may cover one side of the imprinting layer 320
  • the protective layer 330 may cover the other side of the imprinting layer 320.
  • the protective layer 330 may protect the imprinting layer 320.
  • the protective layer 330 may be an adhesive layer connecting the cover 310 and the film base 340.
  • the adhesive layer may include optically clear adhesive (OCA).
  • OCA optically clear adhesive
  • the adhesive layer may include at least one of acrylic, silicone, or urethane.
  • the protective layer 330 may have elasticity.
  • the thickness d2 of the protective layer 330 may be 20 ⁇ m or more and less than 40 ⁇ m.
  • the film base 340 may be attached to the protective layer 330.
  • the film base 340 is made of poly ethylene terephthalate (PET), poly methyl methacrylate (PDMA), poly carbonate (PC), or thermoplastic polyurethane (TPU). It may contain at least one or more.
  • the printing layer 350 may be connected to the film base 340.
  • the printing layer 350 may include an ink material that can be cured by ultraviolet curing or heat curing.
  • the color of the printing layer 350 may be the same overall or may be partially different.
  • the printing layer 350 may have a second color.
  • the second color may be red, green, or blue. It should be noted that the second color is not limited thereto.
  • the imprinting layer 320 may be provided at a location spaced apart from the printing layer 350.
  • the imprinting layer 320 and the printing layer 350 may be located on opposite sides of the film base 340.
  • the printing layer 350 may not have irregularities.
  • the surface of the print layer 350 facing the film base 340 may be smooth.
  • Figure 4 is a cross-sectional view showing a state in which a temporary printing layer is connected to a cover according to an embodiment.
  • Figure 5 is a cross-sectional view showing a state in which a temporary film is connected to a temporary printing layer according to an embodiment.
  • Figure 6 is a cross-sectional view schematically showing a state in which laser engraving is performed on a temporary printing layer according to an embodiment.
  • Figure 7 is a cross-sectional view showing a state in which an imprinting layer is created on a temporary printing layer according to an embodiment.
  • Figure 8 is a cross-sectional view schematically showing the temporary film being separated according to one embodiment.
  • Figure 9 is a cross-sectional view showing a state in which an imprinting layer is connected to a cover according to an embodiment.
  • Figure 10 is a cross-sectional view schematically showing a state in which a protective layer approaches a cover according to an embodiment.
  • 4 to 10 are diagrams for explaining the process of manufacturing the electronic device 300.
  • a temporary printing layer 380 may be connected to the cover 310 .
  • the temporary printing layer 380 may be attached to the cover 310.
  • the temporary print layer 380 may be an uncured layer.
  • the temporary print layer 380 may be prepared in a dried state at 150-170 degrees for about 1 minute.
  • the temporary film 390 may be connected to the temporary print layer 380, as shown in the example of FIG. 5 .
  • the temporary film 390 may include an adhesive layer 391 and a film body 392.
  • the adhesive layer 391 may be adhered to the temporary print layer 380.
  • laser engraving may be performed, as shown in the example of FIG. 6.
  • an infrared laser may pass through the cover 310 and be irradiated onto the temporary printing layer 380.
  • some of the temporary printing layer 380 may change into the engraving layer 320, as shown in the example of FIG. 7.
  • an imprinting layer 320 may be created.
  • the portion where the imprint layer 320 is created may be hardened.
  • the uncured portion of the temporary print layer 380 may be separated from the cover 310.
  • the cover 310, the imprinting layer 320, the temporary printing layer 380, and the temporary film 390 may be exposed to a high temperature and high humidity environment.
  • the cover 310, the imprinting layer 320, the temporary printing layer 380, and the temporary film 390 may be exposed to an environment where the temperature is about 80 degrees and the relative humidity is 90% or more.
  • the temporary printing layer 380 can be separated from the cover 310.
  • the temporary printing layer 380 is separated from the cover 310, only the imprinting layer 320 may remain on the cover 310, as shown in the example of FIG. 9.
  • the protective layer 330, film base 340, and printing layer 350 may be connected to the cover 310.
  • the protective layer 330, film base 340, and printing layer 350 may be sequentially stacked.
  • the protective layer 330, the film base 340, and the printing layer 350 are prepared in a pre-connected state and can be connected to the cover 310 at once.
  • 11 is a cross-sectional view of an electronic device according to an embodiment.
  • 12 is an exploded cross-sectional view of an electronic device according to an embodiment.
  • the electronic device 400 may include a cover 410, an imprinting layer 420, a protective layer 430, a film base 440, and a printing layer 450.
  • cover 410 may be at least partially identical to the cover 310 of FIGS. 3A and 3B, detailed description thereof will be omitted.
  • imprinting layer 420 may be at least partially the same as the imprinting layer 320 of FIGS. 3A and 3B, detailed description thereof will be omitted.
  • film base 440 may be at least partially identical to the film base 340 of FIGS. 3A and 3B, detailed description thereof will be omitted.
  • the printed layer 450 may be at least partially the same as the printed layer 350 of FIGS. 3A and 3B, detailed description will be omitted.
  • the protective layer 430 may be made of a strong material.
  • the protective layer 430 may include a groove 431 to accommodate the imprinting layer 420 .
  • the protective layer 430 may be a direct glass printing layer.
  • the number of grooves 431 may be formed to correspond to the number of imprinting layers 420 .
  • the protective layer 430 may have the same material as the printing layer 450.
  • FIG. 13 is a cross-sectional view of an electronic device according to an embodiment.
  • the electronic device 500 includes a cover 510, a first imprinting layer 520, a first protective layer 530, a first film base 540, a second imprinting layer 570, It may include a second protective layer 580, a second film base 590, and a printing layer 595.
  • cover 510 may be at least partially identical to the cover 310 of FIGS. 3A and 3B, detailed description thereof will be omitted.
  • first imprinting layer 520 may be at least partially the same as the imprinting layer 320 of FIGS. 3A and 3B, detailed description thereof will be omitted.
  • protection layer 530 may be at least partially identical to the protection layer 330 of FIGS. 3A and 3B, detailed description thereof will be omitted.
  • first film base 540 may be at least partially identical to the film base 340 of FIGS. 3A and 3B, detailed description thereof will be omitted.
  • the printed layer 450 may be at least partially the same as the printed layer 350 of FIGS. 3A and 3B, detailed description will be omitted.
  • the first imprinting layer 520 may have a first color
  • the second imprinting layer 570 may have a second color
  • the printing layer 595 may have a third color.
  • the colors of the first imprinting layer 520, the second imprinting layer 570, and the printing layer 595 may be independent from each other.
  • the colors of the first imprinting layer 520, the second imprinting layer 570, and the printing layer 595 may be the same or different.
  • the electronic device 300 includes a cover 310 made of a transparent material, an imprinting layer 320 connected to one surface of the cover and having a first color, and a protective layer 330 surrounding the imprinting layer. ), a film base 340 connected to one side of the protective layer, and a print layer 350 connected to the film base and having a second color.
  • the first color may be an independent color that is not influenced by the second color.
  • a plurality of imprinting layers may be provided on one surface of the cover.
  • the color of each of the plurality of imprinting layers may be different from each other.
  • the imprinting layer may be provided at a location spaced apart from the printing layer.
  • the imprinting layer and the printing layer may be located on opposite sides of the film base.
  • the protective layer may be an elastic adhesive layer.
  • the cover may cover one side of the imprinting layer, and the protective layer may cover the other side of the imprinting layer.
  • the imprinting layer may include a plurality of irregularities provided on a surface facing the cover.
  • a plurality of irregularities may be provided at positions spaced apart from the printing layer.
  • the print layer may have a smooth surface facing the film base.
  • the protective layer may include a groove to receive the imprinting layer.
  • the film base may have a transparent material.
  • the thickness of the imprinted layer may be 5 ⁇ m or more and less than 10 ⁇ m.
  • the thickness of the protective layer may be 20 ⁇ m or more and less than 40 ⁇ m.
  • an electronic device includes a cover 510 made of a transparent material, a first imprinted layer 520 connected to one surface of the cover and having a first color, and a first protection layer surrounding the first imprinted layer.
  • a layer 530, a first film base 540 connected to one side of the first protective layer, a second imprinted layer 570 connected to the first film base and having a second color, the second imprinted layer a second protective layer 580 surrounding the second protective layer 580, a second film base 590 connected to one side of the second protective layer, and a print layer 595 connected to one side of the second film base and having a third color. may include.
  • the first color and the second color may be independent colors that are not influenced by the third color.
  • each of the first imprinting layer and the second imprinting layer may be provided in plural numbers.
  • the first imprinting layer, the second imprinting layer, and the printing layer may be spaced apart from each other.
  • the second imprinting layer may be provided between the first imprinting layer and the printing layer.

Landscapes

  • Telephone Set Structure (AREA)

Abstract

Selon divers modes de réalisation, un dispositif électronique (300) peut comprendre : un couvercle (310) ayant un matériau transparent ; une couche gravée (320) reliée à une surface du couvercle et ayant une première couleur ; une couche de protection (330) entourant la couche gravée ; une base de film (340) reliée à une surface de la couche de protection ; et une couche imprimée (350) reliée à la base de film et ayant une seconde couleur. Divers autres modes de réalisation sont possibles.
PCT/KR2023/003613 2022-05-16 2023-03-17 Dispositif électronique comprenant une couche gravée ayant une couleur indépendante de la couleur d'une couche imprimée WO2023224238A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2022-0059492 2022-05-16
KR20220059492 2022-05-16
KR10-2022-0073650 2022-06-16
KR1020220073650A KR20230160668A (ko) 2022-05-16 2022-06-16 인쇄층의 컬러와 독립적인 컬러를 갖는 각인층을 포함하는 전자 장치

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WO2023224238A1 true WO2023224238A1 (fr) 2023-11-23

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Citations (5)

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Publication number Priority date Publication date Assignee Title
KR20110101350A (ko) * 2010-03-08 2011-09-16 주식회사 신양엔지니어링 휴대폰케이스용 메탈코팅구조와 그 제조방법
KR20190112516A (ko) * 2018-03-26 2019-10-07 김성철 스마트폰용 박막 필름 및 이의 제조 방법
CN110815983A (zh) * 2019-11-28 2020-02-21 Oppo广东移动通信有限公司 电子设备的壳体及其制作方法、电子设备
KR20200076802A (ko) * 2018-12-19 2020-06-30 삼성전자주식회사 데코레이션 필름 및 이를 포함하는 전자장치
KR20200112228A (ko) * 2019-03-21 2020-10-05 삼성전자주식회사 후면 플레이트를 포함하는 전자 장치 및 이의 제조하는 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110101350A (ko) * 2010-03-08 2011-09-16 주식회사 신양엔지니어링 휴대폰케이스용 메탈코팅구조와 그 제조방법
KR20190112516A (ko) * 2018-03-26 2019-10-07 김성철 스마트폰용 박막 필름 및 이의 제조 방법
KR20200076802A (ko) * 2018-12-19 2020-06-30 삼성전자주식회사 데코레이션 필름 및 이를 포함하는 전자장치
KR20200112228A (ko) * 2019-03-21 2020-10-05 삼성전자주식회사 후면 플레이트를 포함하는 전자 장치 및 이의 제조하는 방법
CN110815983A (zh) * 2019-11-28 2020-02-21 Oppo广东移动通信有限公司 电子设备的壳体及其制作方法、电子设备

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