WO2022231137A1 - Dispositif électronique comportant une structure étanche à l'eau - Google Patents

Dispositif électronique comportant une structure étanche à l'eau Download PDF

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Publication number
WO2022231137A1
WO2022231137A1 PCT/KR2022/004105 KR2022004105W WO2022231137A1 WO 2022231137 A1 WO2022231137 A1 WO 2022231137A1 KR 2022004105 W KR2022004105 W KR 2022004105W WO 2022231137 A1 WO2022231137 A1 WO 2022231137A1
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WIPO (PCT)
Prior art keywords
sealing member
electronic device
disposed
printed circuit
display panel
Prior art date
Application number
PCT/KR2022/004105
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English (en)
Korean (ko)
Inventor
탕 응오반
찌 부이닥
천 르쑤안
호앙 응웬반
둑 르반
픅 트란바
Original Assignee
삼성전자주식회사
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Publication of WO2022231137A1 publication Critical patent/WO2022231137A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a waterproof structure of the electronic device.
  • Various electronic components are densely packed in the electronic device, and the exterior may be designed to be robustly designed to protect various electronic components inside, and a waterproof and dustproof structure may be provided to block moisture and foreign substances flowing into the electronic device.
  • the waterproof structure of the electronic device may include a sealing member for sealing a gap between the cover window and the sidewall of the housing in order to prevent the electronic component of the display module from being contaminated with external moisture and foreign substances. At this time, due to the material of the housing, there is a fear that the sealing member may fall off.
  • Various embodiments of the present invention do not use a sealing member for sealing the gap between the cover window and the side wall of the housing, and thus have excellent adhesion and include a waterproof structure capable of securing waterproof performance by sealing the periphery of the electronic component of the display module. device can be provided.
  • An electronic device includes a housing forming an inner space, a cover window covering the inner space, and a display panel coupled to the cover window and accommodated in the inner space.
  • a substrate assembly disposed on one edge of the display panel and connected to the display panel, a first sealing member coupling the substrate assembly to the cover window, and disposed on one surface of the display panel opposite to the display panel a second sealing member, a third sealing member disposed along the other edge of the display panel, and a fourth sealing member connecting any one of the first sealing member and the second sealing member to the third sealing member; may include
  • a substrate cover provided to seal an electronic component and a plurality of sealing members connected to each other are disposed on the rear surface of the window cover, a sealing member sealing a gap between the cover window and a side wall of the housing It is possible to secure waterproof performance by sealing around the electronic components of the display module without using
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • FIG. 2 is a diagram illustrating a front side of an electronic device according to various embodiments of the present disclosure
  • FIG. 3 is a view illustrating a rear surface of an electronic device according to various embodiments of the present disclosure
  • FIG. 4 is an exploded view of an electronic device according to one of various embodiments of the present invention.
  • FIG. 5 is a rear view of a cover window with a display module coupled thereto in an electronic device according to one of various embodiments of the present disclosure
  • FIG. 6 is a cross-sectional view taken along line I-I' of FIG. 5 .
  • FIG. 7 is a cross-sectional view taken along line II-II' of FIG. 5 .
  • FIG. 8 is an enlarged view of part III of FIG. 5 .
  • FIG. 9 is a view illustrating a fourth sealing member of another embodiment in an electronic device according to one of various embodiments of the present invention.
  • FIG. 10 is a perspective view illustrating a substrate cover of an electronic device according to one of various embodiments of the present disclosure
  • FIG. 11 is an enlarged view of a part of the substrate cover illustrated in FIG. 10 .
  • FIG. 13 is a view illustrating a cut-away filling hole of an electronic device according to one of various embodiments of the present disclosure
  • FIG. 14 is a diagram illustrating a substrate cover according to another embodiment in which a partition plate is omitted in an electronic device according to one of various embodiments of the present disclosure.
  • 15 is a diagram illustrating a substrate cover in an electronic device according to another one of various embodiments of the present disclosure.
  • 16 is a cross-sectional view illustrating a waterproof structure in an electronic device according to still another one of various embodiments of the present disclosure.
  • 17 is a cross-sectional view illustrating a waterproof structure in an electronic device according to still another one of various embodiments of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • at least one of these components eg, the connection terminal 178
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190 ). have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the electronic device 102 may output a sound.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module #92 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • each of the phrases such as 'at least one of , B, or C' may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof.
  • Terms such as 'first', 'second', or 'first' or 'second' may simply be used to distinguish the component from other such components, and refer to the components in other aspects (e.g., importance or order) is not limited.
  • one (eg first) component is 'coupled' or 'connected' to another (eg second) component, with or without the terms 'functionally' or 'communicatively'.
  • one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a storage medium eg, internal memory 136 or external memory 138
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product).
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones).
  • a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.
  • FIG. 2 is a diagram illustrating a front side of an electronic device according to various embodiments of the present disclosure
  • 3 is a view illustrating a rear surface of an electronic device according to various embodiments of the present disclosure
  • the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) according to various embodiments has a first surface (or front surface) 210A, a second surface (or rear surface). ) 210B, and a housing 210 including a side surface 210C surrounding a space between the first surface 210A and the second surface 210B.
  • the housing 210 may refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 2 .
  • the first side 210A is provided by a front plate (or 'cover window') 202 (eg, a glass plate comprising various coating layers, or a polymer plate) that is at least in part substantially transparent. can be formed.
  • the second surface 210B may be formed by a substantially opaque back plate 211 .
  • the back plate 211 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or 'side member') 218 including a metal and/or a polymer.
  • the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 202 includes two first regions 210D that extend seamlessly from the first surface 210A toward the rear plate 211 by a long edge of the front plate 202 . (long edge) can be included at both ends.
  • the rear plate 211 has two second regions 210E that extend seamlessly from the second surface 210B toward the front plate 202 with long edges. It can be included at both ends.
  • the front plate 202 (or the rear plate 211 ) may include only one of the first regions 210D (or the second regions 210E). According to another embodiment, some of the first areas 210D or the second areas 210E may not be included.
  • the side bezel structure 218 when viewed from the side of the electronic device 200 , is the first side bezel structure 218 on the side that does not include the first regions 210D or the second regions 210E. It may have a thickness (or width) of 1, and a second thickness that is thinner than the first thickness on the side surface including the first regions 210D or the second regions 210E.
  • the electronic device 200 includes a display module 201 , an audio module 203 , 207 , 214 , a sensor module 204 , 216 , 219 , a camera module 205 , 212 , 213 , It may include at least one of a key input device 217 , a light emitting element 206 , and connector holes 208 and 209 . According to some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or the light emitting device 206 ) or additionally include other components.
  • the display module 201 may be exposed through a substantial portion of the front plate 202 , for example. According to some embodiments, at least a portion of the display module 201 may be exposed through the front plate 202 forming the first areas 210D of the first surface 210A and the side surface 210C. have. According to some embodiments, the edge of the display module 201 may be formed to be substantially the same as an adjacent outer shape of the front plate 202 . According to another exemplary embodiment (not shown), in order to expand an area to which the display module 201 is exposed, the distance between the outside of the display module 201 and the outside of the front plate 202 may be substantially the same.
  • the display module 201 may include an audio module 214 , a sensor module 204 , a camera module 205 , a fingerprint sensor 216 , and a light emitting device 206 on the rear surface of the screen display area. It may include at least one or more. According to another embodiment (not shown), the display module 201 forms a recess or an opening in a portion of the screen display area, and the audio module 214 is aligned with the recess or the opening. ), a sensor module 204 , a camera module 205 , and at least one of a light emitting device 206 .
  • the display module 201 is combined with a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen, or They may be disposed adjacent to each other. According to some embodiments, at least a portion of the sensor module 204 , 219 , and/or at least a portion of the key input device 217 , the first area 210D and/or the second area 210E ) can be placed in
  • the audio modules 203 , 207 , and 214 may include a microphone hole 203 and speaker holes 207 and 214 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for a call.
  • the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker (eg, a piezo speaker) may be included without the speaker holes 207 and 114 .
  • the sensor modules 204 , 216 , and 219 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 200 or an external environmental state.
  • the sensor modules 204 , 216 , 219 include, for example, a first sensor module 204 (eg, a proximity sensor) and/or a second sensor module ( (not shown) (eg, a fingerprint sensor), and/or a third sensor module 219 (eg, HRM sensor) and/or a fourth sensor module 216 disposed on the second side 210B of the housing 210 . ) (eg fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 210A (eg, the display module 201 as well as the second surface 210B) of the housing 210.
  • the electronic device 200 includes a sensor module (not shown); For example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 204 . may include more.
  • a gesture sensor For example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 204 . may include more.
  • the camera modules 205 , 212 , and 213 include a first camera device 205 disposed on the first surface 210A of the electronic device 200 , and a second camera device 212 disposed on the second surface 210B of the electronic device 200 . ), and/or a flash 213 .
  • the camera devices 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp. According to some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device 200 .
  • the key input device 217 may be disposed on the side surface 210C of the housing 210 . According to another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217 , and the not included key input devices 217 are displayed on the display module 201 . It may be implemented in other forms, such as soft keys. According to some embodiments, the key input device 217 may include a sensor module 216 disposed on the second surface 210B of the housing 210 .
  • the light emitting element 206 may be disposed, for example, on the first surface 210A of the housing 210 .
  • the light emitting device 206 may provide, for example, state information of the electronic device 200 in the form of light.
  • the light emitting device 206 may provide, for example, a light source that is interlocked with the operation of the camera module 205 .
  • Light emitting element 206 may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector holes 208 and 209 include a first connector hole 208 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 209 capable of accommodating a connector for transmitting and receiving audio signals.
  • a connector eg, a USB connector
  • a second connector hole eg, earphone jack
  • FIG. 4 is an exploded view of an electronic device according to one of various embodiments of the present invention.
  • the electronic device 300 includes a side bezel structure 318 , a first support member 311 (eg, a bracket), a front plate (or “cover window *?**?*) 320 .” , a display module 330 , a printed circuit board 340 , a battery 350 , a second support member 360 (eg, a rear case), an antenna 370 , and a rear plate 380 .
  • the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360 ) or additionally include other components. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2 or 3, and overlapping descriptions will be omitted below. do.
  • the housing 310 may form an internal space that can accommodate the components of the electronic device 300 including the display module 330 .
  • the inner space of the housing 310 may be covered by the cover window 320 and the rear plate 380 .
  • the housing 310 may include a first support member 311 and a side bezel structure 318 .
  • the first support member 311 may be disposed inside the electronic device 300 and connected to the side bezel structure 318 , or may be integrally formed with the side bezel structure 318 .
  • the first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 311 may have a display module 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.
  • the printed circuit board 340 may be equipped with a processor, memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the display module 330 may be coupled to correspond to the first surface (eg, the front surface) of the printed circuit board 340 .
  • the printed circuit board 340 may be positioned such that the display module 330 corresponds to the first surface (eg, the front surface).
  • a sensor module eg, an image sensor, a proximity sensor, an illuminance sensor, and a biometric sensor
  • a first surface eg, a front surface
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 , or may be disposed detachably from the electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna structure may be formed by a part of the side bezel structure 310 and/or the first support member 311 or a combination thereof.
  • 5 is a rear view of a cover window with a display module coupled thereto in an electronic device according to one of various embodiments of the present disclosure
  • 6 is a cross-sectional view taken along line I-I' of FIG. 5
  • 7 is a cross-sectional view taken along line II-II' of FIG. 5 .
  • the display module 330 of the electronic device 300 includes a first edge 330A, a second edge 330B, a third edge 330C, A fourth edge 330D may be included.
  • the display module 330 is a display panel 3301 disposed on the rear surface of the cover window 320 and a substrate assembly in which electronic components for controlling components of the electronic device 300 including the display panel 3301 are provided. (3302).
  • the display panel 3301 includes a touch sensor that detects a touch signal input through the cover window 320 , a plurality of optical layers that emit light under the control of the display driver IC by receiving power, or control the wavelength of the light, and the display panel It may be a concept including all components such as a polarizing plate and a cover panel that prevent light generated from being diffused or diffused in an unintended direction.
  • the display panel 3301 may be coupled to the rear surface of the cover window 320 by an adhesive.
  • the cover window 320 in which the display panel 3301 is coupled covers the inner space of the housing 310
  • the display panel 3301 may be accommodated in the inner space of the housing 310 .
  • the substrate assembly 3302 may be disposed on an edge side of the display panel 3301 . Specifically, the substrate assembly 3302 may be disposed on an edge side of the display panel 3301 corresponding to the first edge 330A. A part of the substrate assembly 3302 (eg, the first printed circuit board 3303 ) is disposed on one surface of the display panel 3301 to overlap the display panel 3301 when viewed from the front of the electronic device 300 . A substrate assembly 3302 may be coupled on the back surface of the display panel 3301 .
  • the substrate assembly 3302 includes first and second printed circuit boards 3303 and 3304 on which electronic components controlling components of the electronic device 300 including the display panel 3301 are disposed, and a second printed circuit board ( A substrate cover 3306 that covers and protects a portion of the 3304 (eg, the bending portion 3304b) may be included.
  • the first printed circuit board 3303 may be disposed on one surface of the display panel 3301 to overlap the display panel 3301 when viewed from the front of the electronic device 300 .
  • the second printed circuit board 3304 may connect the first printed circuit board 3303 and the display panel 3301 .
  • the second printed circuit board 3304 includes a flat portion 3304a disposed on one surface of the first printed circuit board 3303 so as to overlap the first printed circuit board 3303, a flat portion 3304a and a display panel ( It may include a bending portion 3304b that connects 3301 and extends bent from the flat portion 3304a.
  • the substrate assembly 3302 is disposed behind the first and second printed circuit boards 3303 and 3304 to protect the first and second printed circuit boards 3303 and 3304 protective plate 3307.
  • the protection plate 3307 may be omitted.
  • the substrate assembly 3302 may include an adhesive member 3308 for attaching and fixing the substrate cover 3306 to the second printed circuit board 3304 or the protection plate 3307 .
  • the electronic device 300 couples the display module 300 to the housing 310 (eg, the first support member 311 ), and removes foreign substances such as moisture and/or dust from the outside of the electronic device 300 to the substrate assembly. and waterproof structures 3305a - d to protect the electronic components of 3302 .
  • the waterproof structure may include sealing members 3305a-d. At least a portion of the sealing members 3305a - d may be a flexible adhesive member (eg, a waterproof tape member). At least some of the sealing members 3305a - d may be waterproof and adhesive filling members. However, the present invention is not limited thereto, and the sealing members 3305a-d may be formed of various materials and members capable of being waterproof.
  • the sealing member 3305a-d may include a plurality of sealing members 3305a-d.
  • the plurality of sealing members 3305a - d couple one end (eg, the substrate cover 3306 ) of the substrate assembly 3302 to the rear surface of the cover window 320 , and at the same time, the substrate assembly 3302 and the cover window 320 . It may include a first sealing member 3305a for sealing the gap therebetween.
  • the first sealing member 3305a may be disposed at a position corresponding to the first edge 330A and may extend along the first edge 330A.
  • the plurality of sealing members 3305a - d are disposed on the other surface (eg, one surface of the substrate cover 3306 ) of the substrate assembly 3302 opposite to the one surface of the substrate assembly 3302 to which the display panel 3301 is coupled.
  • a second sealing member 3305b may be included. As the second sealing member 3305b is attached to the housing 310 (eg, the first support member 311 ), the substrate assembly 3302 and/or the display panel 3301 may be coupled to the housing 310 . .
  • the second sealing member 3305b may be disposed at a position corresponding to the first edge 330A and may extend along the first edge 330A.
  • the second sealing member 3305b has the display panel 3301 facing the first edge 330A so that an impact generated when the second sealing member 3305b is attached to the substrate assembly 3302 can be reduced. It may be disposed to be farther away from the first edge 330A than a portion farthest from the first edge 330A among the outer surfaces of the .
  • the plurality of sealing members 3305a-d may include a third sealing member 3305c disposed on the other surface of the display panel 3301 opposite to one surface of the display panel 3301 coupled to the cover window 320 . have. As the third sealing member 3305c is attached to the housing 310 (eg, the first support member 311 ), the substrate assembly 3302 and/or the display panel 3301 may be coupled to the housing 310 . .
  • the third sealing member 3305c may be disposed at a position corresponding to the second to fourth edges 330B-D, and may extend along the second to fourth edges 330B-D.
  • the third sealing member 3305c may be formed in an approximately U-shape opened in a direction toward the first edge 330A.
  • the third sealing member 3305c may be disposed to be spaced apart from the second sealing member 3305b. Both ends of the third sealing member 3305c adjacent to the first edge 330A may be spaced apart from the second sealing member 3305b, and may be disposed on both sides of the second sealing member 3305b, respectively.
  • FIG. 8 is an enlarged view of a part “III*?**?* of FIG. 5 .
  • the plurality of sealing members (3305a-d) is a fourth sealing member connecting at least one of the first sealing member (3305a) and the second sealing member (3305b) to the third sealing member (3305c) ( 3305d).
  • the fourth sealing member 3305d may be formed by filling the space formed in the substrate assembly 3302 with the waterproof filling member.
  • FIG. 8 shows a fourth sealing member 3305d connecting the second sealing member 3305b and the third sealing member 3305c so that the second sealing member 3305b and the third sealing member 3305c form a closed loop.
  • this is illustrative and not limited thereto.
  • the fourth sealing member 3305d may connect the first sealing member 3305a and the third sealing member 3305c so that the first sealing member 3305a and the third sealing member 3305c form a closed loop.
  • the waterproof filling member forming the fourth sealing member 3305d is disposed between the sidewall 3306d (refer to FIG. 10 ) of the substrate cover 3306 and the display panel 3301 and/or the cutout 3310a ( FIG. 10 ). see) and may be connected to the first sealing member 3305a.
  • the present invention is not limited thereto.
  • FIG. 9 is a view illustrating a fourth sealing member of another embodiment in an electronic device according to one of various embodiments of the present invention.
  • Each of the first to third sealing members 4305a-c of FIG. 9 may be the same as and/or similar to each of the first to third sealing members 3305a-c of FIG. 8 , and overlapping descriptions will be omitted below.
  • the waterproof structure of the electronic device 300 may include a fourth sealing member 4305d connected to all of the first to third sealing members 4305a-c.
  • the waterproof filling member forming the fourth sealing member 4305d flows out through the space between the sidewall 3306d of the substrate cover 3306 and the display panel 3301 and/or the cutout 3310a and flows through the first It may be connected to the sealing member 4305a and the second sealing member 4305b.
  • the following description relates to the fourth sealing member 3305d of FIG. 8 , but all of these descriptions may be applied to the fourth sealing member 4305d of FIG. 9 .
  • the fourth sealing member 3305d may include a plurality of fourth sealing members 3305d. According to an embodiment, the fourth sealing member 3305d may include a pair of fourth sealing members 3305d, and may be disposed on both ends of the second sealing member 3305b, respectively. As the fourth sealing member 3305d is attached to the housing 310 (eg, the first support member 311 ), the substrate assembly 3302 and/or the display panel 3301 may be coupled to the housing 310 . .
  • the plurality of sealing members 3305a-d extend along the first to fourth edges 330A-D.
  • a closed loop may be formed, and moisture and/or foreign substances from the outside of the housing 310 may be prevented from flowing into the interior of the display module 330 through a gap located inside the closed loop.
  • moisture and/or foreign substances from the outside of the housing 310 can be removed from the inside of the housing 310 without using a separate sealing member coupling the cover window 320 and the housing 310 . Since it is possible to prevent inflow into the space, it is possible to prevent the waterproof structure from falling off due to the material of the housing 310 .
  • the risk that the waterproof structure is detached from the display module 330 due to external impact and/or contamination can be reduced.
  • FIG. 10 is a perspective view illustrating a substrate cover of an electronic device according to one of various embodiments of the present disclosure
  • FIG. 11 is an enlarged view of a part of the substrate cover illustrated in FIG. 10
  • FIG. 12 is an enlarged view of a part III*?**?* of FIG. 5 before the fourth sealing member is filled in the electronic device according to one of various embodiments of the present invention.
  • FIG. It is a view showing a filling hole of an electronic device according to one of various embodiments of the present invention by cutting it.
  • the substrate cover 3306 forms an accommodating space 3309 and is formed at both ends of the cover body 3306a extending along the first edge 330A, and the cover body 3306a in the extending direction of the cover body 3306a. and a sidewall 3306d.
  • the cover body 3306a may have a semi-cylindrical shape extending approximately along the first edge 330A.
  • the accommodation space 3309 may be formed inside the cover body 3306a.
  • a first sealing member 3305a may be attached to the outer surface of the cover body 3306a and the outer surface of the side wall 3306d. A portion of the first sealing member 3305a may be disposed between the outer surface of the cover body 3306a and the rear surface of the cover window 320 .
  • the substrate cover 3306 includes the first printed circuit board 3303 and the first printed circuit board 3303 from the other end of the cover body 3306a opposite to one end of the cover body 3306a coupled to the cover window 320 toward the third edge 330C. 2 may include a support portion 3306b extending in parallel with the flat portion 3304a of the printed circuit board 3304 .
  • the support part 3306b may be disposed behind the first and second printed circuit boards 3303 and 3304 . On one surface of the support portion 3306b facing the first and second printed circuit boards 3303 and 3304, the support portion 3306b is coupled to the flat portion 3304a or the protective plate 3307 of the second printed circuit board 3304. An adhesive member 3308 may be disposed, and a second sealing member 3305b may be disposed on the other surface of the support part 3306b on the opposite side.
  • the substrate cover 3306 may form a filling space 3310 in which a waterproof filling member forming the fourth sealing member 3305d is filled.
  • the filling space 3310 may be formed inside the cover body 3306a.
  • the filling space 3310 is surrounded by the substrate cover 3306 , the window cover 320 , and the display panel 3301 on the first edge 330A side and is in a space open toward the rear of the electronic device 300 . may be applicable.
  • the substrate cover 3306 includes an accommodation space 3309 to prevent a portion of the fourth sealing member 3305d from passing into the accommodation space 3309 when the fourth sealing member 3305d is filled in the filling space 3310.
  • a partition plate 3306c partitioning the filling space 3310 may be included.
  • the partition plate 3306c may be disposed between the sidewalls 3306d formed at both ends of the cover body 3306a and may be disposed on the inner surface of the cover body 3306d.
  • the partition plate 3306c may be provided as a pair to correspond to the pair of fourth sealing members 3305d.
  • the partition plate 3306c may be disposed between the second sealing member 3305b and the third sealing member 3305c in the extending direction of the first edge 330A.
  • the partition plate 3306c may be provided separately from the cover body 3306a or may be formed integrally with the cover body 3306a.
  • One surface of the partition plate 3306c covering the display panel 3301 at the first edge 330A may be formed to correspond to the shape of one surface of the display panel 3301 corresponding to the first edge 330A.
  • the substrate cover 3306 may include a cutout 3310a formed by cutting a portion of the cover body 3306a so that the waterproof filling member is smoothly introduced into the cover body 3306a.
  • the cutout 3310a may be opened toward the rear surface of the electronic device.
  • the cutout 3310a may be formed at a position corresponding to the filling space 3310 and may communicate with the filling space 3310 .
  • the electronic device 300 may include a guide groove 3310b formed at a position corresponding to the first cutout 3310a and the filling space 3310 to guide the introduction of the waterproof filling member.
  • the guide groove 3310b may communicate with the first cutout 3310a and/or the filling space 3310 .
  • the guide groove 3310b may be formed by removing a portion of the third sealing member 3305c adjacent to the filling space 3310 .
  • One side of the guide groove 3310b may be opened toward the rear and the other side may be covered by the display panel 3301 .
  • the guide groove 3310b may be disposed adjacent to one side of the second sealing member 3305b.
  • the electronic device 300 communicates with the filling space 3310 and may include a filling hole 311a formed in the housing 310 (eg, the first support member 311 ).
  • the filling hole 311a may be formed at a position corresponding to the filling space 3310 .
  • the fourth sealing member 3305d introduced into the filling hole 311a may be guided by the guide groove 3310b to flow into the filling space 3310 . Meanwhile, when the filling hole 311a is viewed from the rear of the electronic device 300 , one end of the second sealing member 3305b facing the guide groove 3310b through the filling hole 311a may be seen. When looking at the filling hole 311a from the rear of the electronic device 300 , one end of the third sealing member 3305c in which the guide groove 3310b is formed may be seen through the filling hole 311a.
  • the fourth sealing member 3305d partially or completely filling the filling space 311a may be introduced into at least one of the cutout 3310a, the guide groove 3310b, and the space between the sidewall 3306d and the display panel 3301. Meanwhile, a space in which the filling space 3310 , the cutout 3310a , the guide groove 3310b , and the space between the sidewall 3306d and the display panel 3310 are integrally connected may be referred to as a guide space.
  • FIG. 14 is a diagram illustrating a substrate cover in an electronic device according to another one of various embodiments of the present disclosure.
  • Each of the cover body 4306a, the support 4306b, and the sidewall 4306d of the substrate cover 4306 of FIG. 14 is the cover body 3306a, the support portion 3306b, and the sidewall 4306d of the substrate cover 3306 of FIG. 3306d) may be the same and/or similar to each.
  • At least one of the components of the electronic device of FIG. 14 may be the same as or similar to at least one of the components of the electronic device 300 of FIGS. 4 or 5 , and overlapping descriptions will be omitted below.
  • the substrate cover 4306 may further include a rib 4306c to which the partition plate 3306c is attached.
  • the rib 4306c may be connected to the inner surface of the cover body 4306a , and the rib 4306c may be integrally formed with the cover body 4306a.
  • the partition plate 3306c may be attached to one surface of the rib 4306c.
  • FIG. 15 is a diagram illustrating a substrate cover in an electronic device according to still another one of various embodiments of the present disclosure.
  • Each of the cover body 5306a and the support 5306b of the substrate cover 5306 of FIG. 15 may be the same as and/or similar to each of the cover body 3306a and the support 3306b of the substrate cover 3306 of FIG. 10 .
  • At least one of the components of the electronic device of FIG. 15 may be the same as or similar to at least one of the components of the electronic device 300 of FIGS. 4 or 5 , and overlapping descriptions will be omitted below.
  • the substrate cover 5306 may further include a stand unit 5306e provided so that the substrate cover 5306 can be stably disposed on the rear surface of the cover window 320 .
  • the stand unit 5306e may be formed at one end of the cover body 5306a in contact with the cover window 320 to increase a contact area between the substrate cover 5306 and the cover window 320 .
  • the stand portion 5306e may be disposed at a position corresponding to the first sealing member 3305a and may extend along the first edge 330A.
  • the first sealing member 3305a may be disposed on the stand unit 5306e.
  • the stand unit 5306e may be integrally formed with the cover body 5306a.
  • FIG. 16 is a cross-sectional view illustrating a waterproof structure in an electronic device according to still another one of various embodiments of the present disclosure.
  • the third sealing member 5305c of FIG. 16 may be the same as or similar to the third sealing member 3305c of FIG. 5 .
  • At least one of the components of the electronic device of FIG. 16 may be the same as or similar to at least one of the components of the electronic device 300 of FIGS. 4 or 5 , and overlapping descriptions will be omitted below.
  • the substrate cover 3306 in the substrate assembly 3302 may be omitted. As the substrate cover 3306 is omitted, the thickness in the front-rear direction of the substrate assembly 3302 may be reduced compared to the case in which the substrate cover 3306 is provided.
  • the first sealing member 5305a may be disposed between the second printed circuit board 3304 and the cover window 320 to couple the second printed circuit board 3304 to the cover window 320 .
  • the first sealing member 5305a may be disposed at one end of the bending part 3304b of the second printed circuit board 3304 connected to the display panel 3301 .
  • the first sealing member 5305a may extend along the first edge 330A.
  • the second sealing member 5305b may be disposed on the flat portion 3304a or the protective plate 3307 of the second printed circuit board 3304 , and overlaps the flat portion 3304a when viewed from the front of the electronic device. can be The second sealing member 5305b may extend along the first edge 330A.
  • the third sealing member 5305c may be disposed at a position corresponding to the second to fourth edges 330B-D, and may extend along the second to fourth edges 330B-D.
  • the third sealing member 5305c may be formed in a U-shape that is opened in a direction toward the first edge 330A.
  • the third sealing member 5305c may be disposed to be spaced apart from the second sealing member 5305b. Both ends of the third sealing member 5305c adjacent to the first edge 330A may be spaced apart from the second sealing member 5305b, and may be disposed on both sides of the second sealing member 5305b, respectively.
  • the fourth sealing member 5305d may connect the first to third sealing members 5305a-c.
  • the fourth sealing member 5305d may include a pair of fourth sealing members 5305d.
  • the first sealing member 5305a may be disposed on one end side of the first sealing member 5305a in the extending direction. That is, the second sealing member 5305b may be disposed on one end side of the second sealing member 5305b in the extending direction.
  • the fourth sealing member 5305d may connect one end of the first sealing member 5305a and one end of the second sealing member 5305b to the adjacent third sealing member 5305c.
  • the fourth sealing member 5305d may be formed by filling a waterproof filling member at a position adjacent to the first to third sealing members 5305a-c.
  • FIG. 17 is a cross-sectional view illustrating a waterproof structure in an electronic device according to still another one of various embodiments of the present disclosure.
  • the third sealing member 6305c of FIG. 17 may be the same as or similar to the third sealing member 3305c of FIG. 5 .
  • At least one of the components of the electronic device of FIG. 17 may be the same as or similar to at least one of the components of the electronic device 300 of FIGS. 4 or 5 , and overlapping descriptions will be omitted below.
  • the substrate cover 3306 in the substrate assembly 3302 may be omitted. As the substrate cover 3306 is omitted, the thickness in the front-back direction of the substrate assembly 3302 may be further reduced than when the substrate cover 3306 is provided.
  • the first sealing member 6305a may be disposed between the second printed circuit board 3304 and the cover window 320 to couple the second printed circuit board 3304 to the cover window 320 .
  • the first sealing member 6305a may be disposed at one end of the bending part 3304b of the second printed circuit board 3304 connected to the display panel 3301 .
  • the first sealing member 6305a may extend along the first edge 330A.
  • the second sealing member 6305b may be disposed on the first printed circuit board 3303 or the protection plate 3307 . When viewed from the front of the electronic device, it may overlap the first printed circuit board 3303 without overlapping the flat portion 3304a of the second printed circuit board 3304 . In other words, the second sealing member 6305b is directly attached to the rear surface of the first printed circuit board 3303, or between the second sealing member 6305b and the first printed circuit board 3303 in the front-rear direction, a protective plate ( 3307) can be placed. Therefore, the thickness in the front-back direction of the substrate assembly 3302 is greater than when the flat portion 3304a of the second printed circuit board 3304 is disposed between the second sealing member 6305b and the first printed circuit board 3303 . can be reduced

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  • Casings For Electric Apparatus (AREA)

Abstract

La présente invention concerne un dispositif électronique qui comporte une structure étanche à l'eau. Le dispositif électronique peut comprendre : un boîtier formant un espace intérieur ; une fenêtre de couverture couvrant l'espace intérieur ; un panneau d'affichage couplé à la fenêtre de couverture et logé dans l'espace intérieur ; un ensemble substrat disposé au bord d'un côté du panneau d'affichage et connecté au panneau d'affichage ; un premier élément d'étanchéité couplant l'ensemble substrat à la fenêtre de couverture ; un deuxième élément d'étanchéité disposé sur une surface du panneau d'affichage sur le côté opposé du panneau d'affichage ; un troisième élément d'étanchéité disposé le long du bord de l'autre côté du panneau d'affichage ; et un quatrième élément d'étanchéité reliant le premier élément d'étanchéité ou le deuxième élément d'étanchéité au troisième élément d'étanchéité.
PCT/KR2022/004105 2021-04-29 2022-03-24 Dispositif électronique comportant une structure étanche à l'eau WO2022231137A1 (fr)

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KR10-2021-0055975 2021-04-29
KR1020210055975A KR20220148638A (ko) 2021-04-29 2021-04-29 방수 구조를 포함하는 전자 장치

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WO2022231137A1 true WO2022231137A1 (fr) 2022-11-03

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180026191A (ko) * 2016-09-02 2018-03-12 삼성전자주식회사 디스플레이 장치 및 그를 포함하는 전자 장치
KR20180029190A (ko) * 2016-09-09 2018-03-20 삼성디스플레이 주식회사 표시장치 및 이를 이용한 전자장치 제조방법
KR20190085199A (ko) * 2018-01-08 2019-07-18 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
KR20190142118A (ko) * 2018-06-15 2019-12-26 삼성전자주식회사 디스플레이 장치 및 그를 포함하는 전자 장치
KR20210001050A (ko) * 2019-06-26 2021-01-06 삼성전자주식회사 디스플레이를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180026191A (ko) * 2016-09-02 2018-03-12 삼성전자주식회사 디스플레이 장치 및 그를 포함하는 전자 장치
KR20180029190A (ko) * 2016-09-09 2018-03-20 삼성디스플레이 주식회사 표시장치 및 이를 이용한 전자장치 제조방법
KR20190085199A (ko) * 2018-01-08 2019-07-18 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
KR20190142118A (ko) * 2018-06-15 2019-12-26 삼성전자주식회사 디스플레이 장치 및 그를 포함하는 전자 장치
KR20210001050A (ko) * 2019-06-26 2021-01-06 삼성전자주식회사 디스플레이를 포함하는 전자 장치

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