WO2023221663A1 - Spectral sensor, spectral sensor module, sensor apparatus and electronic device - Google Patents

Abstract

Provided in the present application are a spectral sensor, a spectral sensor module, a sensor apparatus and an electronic device. The spectral sensor comprises a spectral chip and an optical assembly, wherein the spectral chip comprises a light modulation layer and a photoelectric detection layer; the light modulation layer is arranged, in a sensing path of the photoelectric detection layer, on one side of a light incident face of the photoelectric detection layer, and comprises a modulation unit used for modulating incident light; the optical assembly is arranged in a sensing path of the spectral chip; and the optical assembly at least comprises a diaphragm; the incident light passes through the diaphragm to form a light spot which irradiates the light modulation layer, and the light spot covers at least one modulation unit of the light modulation layer; or, the optical assembly comprises a light homogenizing member and a diaphragm, and the incident light passes through the light homogenizing member and the diaphragm to guide an optical signal to the upper surface of the light modulation layer; or, the optical assembly comprises a light homogenizing device and a lens, and the incident light passes through the light homogenizing device and the lens so as to be guided to the surface of the spectral chip at a set incident angle and in a uniform light intensity manner. In addition, the spectral sensor module at least comprises a spectral sensor and a circuit board. The spectral sensor provided in the present application can improve the photoelectric performance, for example, improve the accuracy and stability of spectrum recovery, etc.

Description

Spectral sensors, spectral sensor modules, sensor devices and electronic equipment Technical field

This application relates to the field of spectrum technology, and in particular to spectrum sensors, spectrum sensor modules, sensor devices and electronic equipment.

Background technique

Current micro/miniature spectral sensing/spectral imaging technology usually adopts the following working method: using sensors to acquire optical signals, and then performing data processing to varying degrees to finally obtain spectral information. The sensor used in this process can obtain information in the frequency domain of the light to be measured. The implementation method includes: a photodetector array with a light modulation structure, or an array of optical filters (or modulation structure or filter structure 10) and light A combination of detector arrays; wherein the optical filter (or modulation structure or filter structure 10) can be a narrowband, broadband, periodic or other filtering method in the frequency domain or wavelength domain. Using this computational reconstruction technology, it is possible to avoid the spectroscopic spatial optical path in traditional spectroscopy technology and realize a smaller spectrometer or spectrum camera.

Since computationally reconstructed spectrometers or computationally reconstructed spectral imaging devices are emerging technologies, computationally reconstructed light sources or computationally reconstructed spectral imaging devices encounter many technical problems in practical applications. Since the computational spectrum chip is relatively sensitive to the dominant light angle of the incident optical signal, changes in the dominant optical angle of the incident optical signal will greatly affect the accuracy of spectral recovery in actual use. That is to say, the unstable angle and light intensity of the incident light of the existing technology spectrum sensor will cause the restored spectral information to be inaccurate or the results of multiple restorations to fluctuate greatly.

Since spectrometers or spectral cameras need to solve various optical problems during the miniaturization process, designing a new miniature spectral sensor module is an urgent problem that needs to be solved.

Contents of the invention

According to the first design solution of this application, in order to achieve the above goals, this application proposes a spectrum sensor, a spectrum sensor module and an electronic device including such a spectrum sensor module, which can not only improve the current spectrum sensor, spectrum sensor module The set of optoelectronic properties, for example, significantly improves the accuracy and stability of the spectral recovery of the spectrum sensor module, and can achieve many advantages in manufacturing and assembly processes with optimized optoelectronic and mechanical structures, such as ease of assembly and maintenance and Stable and reliable work, etc.

According to a first aspect of this application, a spectral sensor is proposed, including:

Spectrum chip, the spectrum chip includes a light modulation layer and a photoelectric detection layer, wherein the light modulation layer is disposed on the light incident surface side of the photoelectric detection layer on the sensing path of the photoelectric detection layer and includes: at least one modulation unit for modulating incident light, wherein the photodetection layer is configured to obtain an optical signal modulated by the at least one modulation unit, and

Optical component, the optical component is disposed on the sensing path of the spectrum chip, used to receive the optical signal of the incident light from the photographed target and guide the optical signal to the light modulation layer of the spectrum chip,

wherein the optical component includes at least one aperture, and the aperture is configured to form a light spot irradiated to the light modulation layer of the spectrum chip through the aperture, such that the light spot covers at least one of the light modulation layers the modulation unit.

According to some embodiments of the first aspect of the present application, the aperture is configured such that the light spot formed by the aperture and irradiated to the light modulation layer of the spectrum chip covers the modulation units at different positions on the spectrum chip.

According to some embodiments of the first aspect of the present application, the aperture is configured such that the light spot formed by the aperture and irradiated to the light modulation layer of the spectrum chip covers all modulation units on the spectrum chip.

According to some embodiments of the first aspect of the present application, the spectrum chip further includes an image sensor configured to acquire a response signal to the incident light modulated by the light modulation layer, and is obtained from the above response signal Spectral image information.

According to some embodiments of the first aspect of the present application, the aperture is further configured to pass one or more modulation units corresponding to the light spot behind the aperture, and obtain the incident light corresponding to the image sensor through the image sensor. Spectral response.

According to some embodiments of the first aspect of the present application, the optical component of the spectrum sensor further includes a light attenuation sheet and/or a light enhancement sheet disposed at the aperture position.

According to some embodiments of the first aspect of the present application, the optical component of the spectrum sensor further includes a uniform light component, the uniform light component is disposed on the optical path where the incident light irradiates the spectrum chip, and the uniform light component The component is configured such that light incident on the uniform light component is uniformly reflected in all directions.

According to some embodiments of the first aspect of the present application, the luminous intensity of the uniform light component configured to pass through the uniform light component is D∝cosθ, that is, its brightness B has nothing to do with the direction, where D is each piece of the light emitting surface. The luminous intensity of the surface element S along any direction r, θ is the angle between r and the normal n.

According to some embodiments of the first aspect of the present application, the light uniformity component is any one of a light uniformity sheet, a light uniformity film, or a light uniformity coating.

According to some embodiments of the first aspect of the present application, the optical component further includes a filter component, and the filter component is disposed on a light path where the incident light irradiates the spectrum chip.

According to some embodiments of the first aspect of the present application, the aperture is configured as a through hole formed by injection molding of a plastic part.

According to some embodiments of the first aspect of the present application, the aperture is configured as a light-transmitting aperture hole in an opaque coating formed on the upper surface and/or the lower surface of the light-diffusing component.

According to some embodiments of the first aspect of the present application, the aperture is configured as a light-transmissive aperture hole in an opaque coating formed on an upper surface and/or a lower surface of the filter component.

According to some embodiments of the first aspect of the present application, the aperture hole is configured as a circular hole, and the center of the circle of the aperture circular hole is on the optical axis of the imaging light path of the spectrum chip.

According to some embodiments of the first aspect of the present application, the opaque coating is a coating, and the coating includes one or more coatings.

According to some embodiments of the first aspect of the application, the opaque coating is a metal coating.

According to some embodiments of the first aspect of the application, the longitudinal section of the through hole is cylindrical or trapezoidal.

According to some embodiments of the first aspect of the present application, the uniform component is configured so that the light spot reaching the spectrum chip through the optical component is uniform and angle-insensitive.

According to the second aspect of this application, a spectrum sensor module is proposed, including:

the aforementioned spectral sensor, and

A circuit board, on which a spectrum chip of the spectrum sensor is placed and electrically connected to the circuit board.

According to some embodiments of the second aspect of the present application, the housing of the spectral sensor module includes a first support member in which the aperture of the optical assembly is constructed.

According to some embodiments of the second aspect of the present application, the uniform light component of the optical component is disposed on a surface of the first support facing the incident light.

According to some embodiments of the second aspect of the present application, the filter component of the optical component is disposed on a surface of the first support member opposite to the uniform light component.

According to some embodiments of the second aspect of the present application, a groove for accommodating the filter assembly is provided in the first support member, and the groove corresponds to a position in the first support member where the aperture is provided.

According to some embodiments of the second aspect of the present application, the filter component is embedded in the groove of the first support member, and the outer surface of the filter component is flush with the edge of the groove.

According to some embodiments of the second aspect of the present application, the filter component of the optical component is disposed between the uniform light component of the optical component and the first support member.

According to some embodiments of the second aspect of the present application, the housing of the spectrum sensor module further includes a second support member for supporting the first support member, wherein the first support member and the second support member are configured to protect And support the formation of light path.

According to some embodiments of the second aspect of the present application, the first support member and the second support member are constructed in one piece, and thus form an integrated base, in an area of the base opposite to the light-diffusion component. Construct the aperture.

According to some embodiments of the second aspect of the present application, the housing of the spectrum sensor module further includes a bottom plate, the circuit board is disposed on the bottom plate, wherein the second support member is supported on the first support member and Between the base plates, the first support, the second support member and the base plate group jointly form a housing of the spectrum sensor module.

According to some embodiments of the second aspect of the present application, the thickness of the first support member is determined according to the aperture of the aperture and the thickness of the second support member.

According to some embodiments of the second aspect of the present application, a light spot irradiated onto the spectrum chip is formed through the aperture, wherein the effective area of the light spot follows the following empirical formula:

Among them, d represents the aperture or diameter of the aperture, h1 represents the distance from the incident surface/light exit surface of the uniform light component to the spectrum chip in the direction of the optical path of the incident light irradiating the spectrum chip, and h2 represents the distance between the incident light irradiation and the spectrum chip. The distance from the light entrance surface/light exit surface of the aperture to the spectrum chip in the direction of the optical path to the spectrum chip.

According to some embodiments of the second aspect of the present application, the spectrum sensor module further includes a cover plate, which is supported and fixed on the surface of the first support member facing the incident light.

According to some embodiments of the second aspect of the present application, a wedge-shaped groove is provided in the cover plate, and the wedge-shaped groove is used to embed and fix the uniform light component of the optical component.

According to some embodiments of the second aspect of the present application, the wedge-shaped groove is provided completely around the outer edge of the light-diffusing component.

According to some embodiments of the second aspect of the present application, a wedge-shaped groove is respectively provided at a plurality of opposite positions around the light-diffusing component.

According to some embodiments of the second aspect of the application, the wedge-shaped groove is configured as a tapered hole in the cover plate.

According to some embodiments of the second aspect of the present application, the narrow end of the tapered hole of the wedge-shaped groove is located on the outer surface of the cover plate, and the wide end of the tapered hole is located on the inner surface of the cover plate.

According to some embodiments of the second aspect of the present application, the inner and outer surfaces of the light diffusion component disposed in the wedge-shaped groove of the cover plate are flush with the corresponding surfaces of the cover plate.

According to some embodiments of the second aspect of the present application, a step hole is provided in the cover plate, and the steps of the step hole match the shape of the light-diffusion component, wherein the light-diffusion component embedded in the step hole of the cover plate The circumferential edge of the outer surface of the component is covered by the edge of the step hole of the cover plate, whereby the cover plate forms an edge-wrapping structure for the light-diffusion component embedded therein.

According to some embodiments of the second aspect of the present application, a protective cover is provided on the cover plate.

According to some embodiments of the second aspect of the present application, the first support member, the second support member and the cover plate of the spectrum sensor module are integrally injection molded.

According to some embodiments of the second aspect of the present application, the housing of the spectrum sensor module is an integrated cylindrical structure, and has a receiving portion for receiving and fixing the optical component at one end facing the incident light.

According to some embodiments of the second aspect of the present application, the receiving portion for receiving and fixing the optical component is configured as a stepped hole in the housing of the spectrum sensor module, and the stepped hole of the housing includes a step hole for passing through openings for incident light and steps for positioning and fixing the optical components.

According to some embodiments of the second aspect of the present application, the uniform light component, diaphragm and filter component of the optical component are stacked sequentially along the imaging optical path of the incident light to form a sandwich-type overall structural unit, wherein the The integral structural unit is embedded in the stepped hole of the housing through form locking, material locking or force locking.

According to some embodiments of the second aspect of the present application, a glue overflow groove is configured in the housing along the periphery of the accommodating portion for accommodating and fixing optical components.

According to some embodiments of the second aspect of the present application, the glue overflow groove is configured in the housing as a chamfer on a peripheral edge of the receiving portion for receiving and fixing optical components.

According to some embodiments of the second aspect of the present application, the housing of the spectrum sensor module is further provided with an exhaust hole that communicates the internal space of the housing with the external environment.

According to some embodiments of the second aspect of the present application, a light-transmitting protective layer is further provided on the light modulation layer of the spectrum chip, and a media component is provided on the light-transmitting protective layer for supporting the optical component. A uniform light component, wherein the dielectric component is a dielectric material with high light transmittance.

According to some embodiments of the second aspect of the present application, the media component is disposed between the light modulation layer of the spectrum chip and the optical component, and supports the optical component.

According to some embodiments of the second aspect of the present application, a filter layer is provided on the light incident surface of the dielectric material, and the aperture of the optical component is constructed in the filter layer.

According to some embodiments of the second aspect of the present application, the filter layer is bonded on the light incident surface of the media component, and the adhesive material is light-transmissive.

According to some embodiments of the second aspect of the present application, the spectrum sensor module further includes a data processing unit.

According to a third aspect of the present application, an electronic device is proposed, including the spectrum sensor module.

According to the second design solution of the present application, another spectral sensor and sensor device are proposed.

A major advantage of the present application is to provide a spectrum sensor and a sensor device, wherein the spectrum sensor includes a spectrum chip and an optical component located in the photosensitive path of the spectrum chip, wherein the incident light signal is incident at a specific angle through the optical component to the spectrum chip, which is beneficial to improving the stability of the spectrum recovered by the spectrum sensor.

Another advantage of the present application is to provide a spectrum sensor and a sensor device, in which the optical component remains stable to the light-collecting light cone angle of the incident light signal arriving at various positions on the upper surface of the light modulation layer on the spectrum chip, and has It is beneficial to improve the stability of spectral recovery.

Another advantage of the application is to provide a spectral sensor and sensor device, in which the optical component can realize the collection of solid angles with radiation angles within 150°, thereby realizing the collection of incident light with a large field of view FOV, that is, This solves the problem of stability and consistency of the angle at which the spectrum sensor acquires incident light.

Another advantage of the application is to provide a spectral sensor and sensor device, wherein the sensor device only changes in intensity when the incident angle is in the range of 0-50°, and the uniformity remains consistent, indicating that the angle of the chip surface The distribution is unchanged, thus improving the optical component eliminating angular sensitivity.

Another advantage of the application is to provide a spectrum sensor and a sensor device, wherein the spectrum sensor can modulate the incident light signal through the light modulation layer of the spectrum chip, and restore the obtained incident light signal through the recovery algorithm as described. Spectral information, the color temperature value is calculated according to the obtained spectral information of the incident light, and the illumination information is calculated according to the response of the incident light, thereby improving the applicability of the spectrum sensor.

Another advantage of the application is to provide a spectral sensor and sensor device, in which the spectral information of the incident light can be more accurately obtained through the spectral sensor and uniform light at a large FOV angle, so that the chromaticity can be calculated more accurately value.

According to one aspect of the present application, a spectral sensor of the present application that can achieve the aforementioned objects and other objects and advantages includes:

Spectral chip; and

Optical component, the optical component is located in the photosensitive path of the spectrum chip, whereby the optical component guides the target light signal to the upper surface of the light modulation layer of the spectrum chip at a fixed incident angle, and the light modulation layer is used to The incident light is modulated, and the upper surface of the light modulation layer is located on the side away from the image sensor;

The optical component includes a uniform light component and an aperture. The incident light guides the optical signal to the upper surface of the light modulation layer on the spectrum chip through the uniform light component and the diaphragm on the optical path.

According to an embodiment of the present application, the optical component further includes a light through hole located in the light exit path of the aperture and a lens located in the light exit path of the light through hole component.

According to an embodiment of the present application, the optical component includes a light uniformity member, wherein the light uniformity member is located on the light incident side of the diaphragm.

According to an embodiment of the present application, the light uniformity member is selected from a combination of a light uniformity film, a light uniformity sheet and a scattering sheet.

According to an embodiment of the present application, the light through-hole member has a light hole that passes from front to back and a light entrance port and a light exit port that communicate with the light hole, wherein the aperture size of the light entrance port is smaller than that of the light through hole. The aperture size of the light outlet of the aperture piece.

According to an embodiment of the present application, the light through-hole member includes a plurality of through-hole member units, wherein the through-hole member unit is a metal sheet with holes, and the plurality of through-hole members of the light through-hole member The units are superimposed and connected from front to back.

According to an embodiment of the present application, the optical component further includes an optical filter, wherein the optical filter is located at the exit end of the lens.

According to an embodiment of the present application, the light through-hole member has a light hole that passes from front to back, and the light inlet hole and the light outlet hole of the light hole have the same size.

According to one embodiment of the present application, the light through-hole member has a light hole that passes from front to back, and the light hole is formed from an integrally molded component.

According to an embodiment of the present application, the optical component further includes a filter, wherein the filter is located on the incident light side of the lens.

According to one embodiment of the present application, the spectrum chip includes a photodetection layer and a light modulation layer located in a photosensitive path of the photodetection layer.

According to another aspect of the application, the application further provides a sensor device, including:

Spectral chip;

A circuit board, wherein the spectrum chip is disposed on the circuit board and electrically connected to the circuit board; and

Optical component, wherein the optical component is located in the photosensitive path of the spectrum chip.

According to an embodiment of the present application, it further includes a base, wherein the base is fixed to the circuit board, and the optical component is disposed on the base, and the optical component is fixed to the spectrum through the base. The photosensitive path of the chip.

According to an embodiment of the present application, the optical component includes a light-diffusing member, a light-through hole member and a lens, wherein the light-through-hole member is disposed on the base, and the light-diffusion member is located on the light through-hole member. The lens is disposed on the light-emitting side of the light through-hole member.

According to an embodiment of the present application, it further includes a fixing component, wherein the light-diffusing component is fixed to the base by the fixing component.

According to an embodiment of the present application, the light through-hole member has a light hole that passes from front to back and a light entrance port and a light exit port that communicate with the light hole, wherein the aperture size of the light entrance port is smaller than that of the light through hole. The aperture size of the light outlet of the aperture piece.

According to an embodiment of the present application, the light through-hole member includes a plurality of through-hole member units, wherein the through-hole member unit is a metal sheet with holes, and the plurality of through-hole members of the light through-hole member The units are superimposed and connected from front to back.

According to the third design solution of this application, another spectrum sensor module is proposed.

A major advantage of the present application is to provide a spectrum sensor module, wherein the spectrum sensor includes a spectrum chip and an optical component located in the photosensitive path of the spectrum chip, wherein the incident light signal is incident at a specific angle through the optical component. The spectrum chip is beneficial to improving the stability of the spectrum restored by the spectrum sensor module.

Another advantage of the present application is to provide a spectrum sensor module, in which the optical component maintains stability in the light cone angle of the incident light signal arriving at various positions on the upper surface of the light modulation layer on the spectrum chip, which is beneficial to Improve the stability of spectral recovery.

Another advantage of the application is to provide a spectrum sensor module, in which the optical component can realize the collection of solid angles with radiation angles within 180°, thereby realizing the collection of incident light with a large field of view FOV, which solves the problem of This improves the stability and consistency of the spectrum sensor module in acquiring incident light angles.

Another advantage of the application is to provide a spectrum sensor module, in which the spectrum chip of the spectrum sensor only changes in intensity, and the uniformity remains consistent, indicating that the angular distribution of the chip surface has not changed, thereby improving the optical component. Angular sensitivity is eliminated.

Another advantage of the application is to provide a spectrum sensor module, wherein the spectrum sensor module can modulate the incident light signal through the light modulation layer of the spectrum chip, and restore the obtained incident light through the recovery algorithm as described The spectral information is obtained, the color temperature value is calculated based on the obtained spectral information of the incident light, and the illumination information is calculated based on the response of the incident light, thereby improving the applicability of the spectrum sensor module.

Another advantage of the application is to provide a spectral sensor module, in which the spectral information of the incident light can be more accurately obtained through the spectral sensor module and uniform light at a large FOV angle, so that the color can be calculated more accurately. degree value.

According to one aspect of the present application, a spectral sensor module of the present application can achieve the aforementioned objects and other objects and advantages. The spectral sensor module includes:

Optical components and spectrum chips, wherein the optical components are located in the photosensitive path of the spectrum chip, and a light filter structure is provided on the light incident surface of the spectrum chip, and the filter structure is used to modulate incident light, The optical component includes a uniform light device and a lens arranged in sequence from the light incident side along the optical axis direction, so that the incident light is guided to the desired location through the uniform light device and the lens with a set incident angle and uniform light intensity. The surface of the spectroscopic chip.

According to an embodiment of the present application, the optical component further includes an aperture, wherein the aperture is located between the light uniformity device and the lens.

According to an embodiment of the present application, the uniform light device is used to collect incident light within a solid angle of 180° and eliminate optical coupling caused by the incident light.

According to an embodiment of the present application, the light uniformity device is a light uniformity film or a light uniformity sheet.

According to an embodiment of the present application, the light uniformity device is attached to the aperture.

According to an embodiment of the present application, the optical component further includes a filter element, wherein the filter element is located on the light exit side of the lens.

According to an embodiment of the present application, the lens has a light incident surface and a light exit surface. The light incident surface of the lens faces the diaphragm and is a plane. The light exit surface of the lens faces the spectrum chip and is a plane. Hemispherical surface.

According to an embodiment of the present application, the filter element is disposed between the light exit surface of the lens and the spectrum chip.

According to an embodiment of the present application, the filter element is attached to the light exit surface side of the lens.

According to an embodiment of the present application, the filter element is attached to the photosensitive surface of the spectrum chip.

According to an embodiment of the present application, the spectrum sensor module further includes a lens assembly, a circuit board and a base, the optical assembly is provided on the lens assembly, the spectrum chip is provided on the circuit board, and The circuit board is electrically connected, and the lens assembly is fixed to the base.

According to an embodiment of the present application, the lens assembly includes a lens barrel and a spacer, the optical assembly is disposed in the accommodation space of the lens barrel, and the spacer is disposed between the diaphragm and the lens. between.

According to an embodiment of the present application, the lens barrel of the lens assembly is fixed on the upper end surface of the base.

According to an embodiment of the present application, the lens assembly further includes a fixing mechanism for fixing the lens assembly to the base.

According to an embodiment of the present application, the fixing mechanism includes a support frame and a fixing unit. One end of the support frame is fixed to the base, and the other end of the support frame is connected to the lens barrel of the lens assembly. The light uniforming device is fixed at the end of the lens barrel by the fixing unit.

According to an embodiment of the present application, the base has a mounting hole, and the spectrum chip is installed in the mounting hole of the base.

According to an embodiment of the present application, the lens barrel further includes an upper end and a lower end integrally extending downward from the upper end, and the light uniformity device is disposed on the upper end of the lens barrel, and The filter element is arranged at the lower end of the lens barrel.

According to an embodiment of the present application, the upper end of the lens barrel is further provided with a mounting groove, the lower end of the lens barrel is further provided with a mounting groove, and the light uniformity device is fixed on all parts of the upper end. In the mounting groove, the filter element is fixed in the mounting groove at the lower end.

According to an embodiment of the present application, the lens barrel is further provided with an aperture opening, wherein the aperture opening is formed on the upper end of the lens barrel.

According to an embodiment of the present application, a lens cover is also provided on the upper part of the lens barrel. The lens cover is provided on the light uniformity device, and a light hole is provided on the lens cover.

According to an embodiment of the present application, threads are provided on the outer wall of the lens barrel, the lens barrel is connected to the base through the threads on the outer wall, and the lens cover and the lens are connected through the threads.

These and other objects, features and advantages of the present application are fully demonstrated by the following detailed description and accompanying drawings.

Description of the drawings

The technical solution of the present application will be described in further detail below with reference to the accompanying drawings and examples. In the drawings, unless otherwise stated, the same reference numbers are used to refer to the same parts. Among them, Figures 1 to 26 are the drawings corresponding to the first design scheme in this application, Figures 27 to 36 are the drawings corresponding to the second design scheme in this application, and Figures 37 to 46 are the drawings corresponding to the second design scheme in this application. The corresponding drawings of the three design schemes are as follows:

Figure 1 shows a schematic structural diagram of a spectrum chip according to some embodiments of the first design solution of the present application.

Figure 2 shows a schematic structural diagram of a light modulation layer according to some embodiments of the first design solution of the present application.

Figure 3 shows a schematic structural diagram of a spectrum sensor module according to some embodiments of the first design solution of the present application.

Figure 4 shows a schematic diagram of the positional relationship of the optical components relative to the spectrum chip according to some embodiments of the first design solution of the present application.

FIG. 5 shows an optical path diagram of the embodiment shown in FIG. 4 .

FIG. 6 exemplarily shows different light uniformity effects of ambient light in different areas on the light uniformity component.

7 and 8 show schematic diagrams of the light spots formed by the diaphragm of the optical component irradiating on the light modulation layer according to some embodiments of the first design solution of the present application. Here, five light spots are taken as an example.

FIG. 9 shows a schematic diagram of the light spots formed by the diaphragm of the optical component irradiating the light modulation layer according to other embodiments of the first design solution of the present application. Here, four light spots are taken as an example.

FIG. 10 shows a schematic diagram of the light spot formed by the diaphragm of the optical component irradiating on the light modulation layer according to some other embodiments of the first design solution of the present application.

11 and 12 show schematic diagrams of the light spot formed by the diaphragm of the optical assembly irradiating the light modulation layer according to other embodiments of the first design solution of the present application.

Figure 13 shows a schematic diagram of the intensity and size of the light spot formed on the light modulation layer by the diaphragm of the optical assembly according to some embodiments of the first design solution of the present application.

Figure 14 shows a schematic diagram of an optical diaphragm of an optical assembly equipped with a light attenuating sheet and/or a light enhancing sheet according to some embodiments of the first design solution of the present application.

Figure 15 shows a distribution pattern of apertures according to some embodiments of the first design solution of the present application.

Figure 16 shows a schematic structural diagram of a spectrum sensor module according to some embodiments of the first design solution of the present application.

FIG. 17 shows an optical path diagram of the spectrum sensor module of FIG. 16 .

Figure 18 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application, in which multiple apertures are provided.

FIG. 19 shows an optical path diagram of the spectrum sensor module of FIG. 18 .

FIG. 20 shows a perspective cross-sectional view of the spectrum sensor module of FIG. 18 .

Figure 21 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application.

Figure 22 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application.

Figure 23 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application.

Figure 24 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application, in which multiple apertures are provided.

Figure 25 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application, in which the housing is provided with a receiving portion in the form of a boss.

Figure 26 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application, in which a media component is provided.

Figure 27 is a schematic diagram of a spectrum chip of the spectrum sensor according to the first preferred embodiment of the second design solution of the present application.

Figure 28 is a schematic structural frame diagram of the spectral sensor according to the above-mentioned first preferred embodiment of the second design solution of the present application.

Figure 29 is a partial structural schematic diagram of the spectrum sensor according to the first preferred embodiment of the second design solution of the present application. It shows that the light cone angle of the optical signal channel of the spectrum chip is a preset angle. .

30A and 30B are schematic structural diagrams of the spectrum sensor according to the above-mentioned first preferred embodiment of the second design solution of the present application.

Figure 31 is a schematic structural diagram of the optical component of the spectrum sensor according to the first preferred embodiment of the second design solution of the present application.

Figure 32 is a schematic structural diagram of the light through-hole member of the optical component of the spectrum sensor according to the first preferred embodiment of the second design solution of the present application.

33A and 33B are schematic structural diagrams of the spectrum sensor according to the above-mentioned second preferred embodiment of the second design solution of the present application.

Figure 34 is a schematic diagram of the installation structure of the uniform light component of the spectrum sensor according to the second preferred embodiment of the second design solution of the present application.

Figure 35 is the response curve of the chip surface at different incident angles of the spectral sensor according to the above-mentioned preferred embodiment of the second design solution of the present application.

Figure 36 is a schematic diagram of the spectral sensor acquiring color temperature sensing information with spatial information according to the above-mentioned preferred embodiment of the second design solution of the present application.

Figure 37 is a schematic diagram of a spectrum chip of the spectrum sensor module according to the first preferred embodiment of the third design solution of the present application.

Figure 38 is the light output of the spectrum sensor module according to the above-mentioned first preferred embodiment of the third design solution of the present application. Schematic diagram of the structural framework of the spectrum sensor.

Figure 39 is a schematic diagram of the unfolded state of the spectrum sensor module according to the above-mentioned first preferred embodiment of the third design solution of the present application.

Figure 40 is a schematic structural diagram of the spectrum sensor module according to the above-mentioned first preferred embodiment of the third design solution of the present application.

Figure 41 is a schematic structural diagram of the spectrum sensor according to the above-mentioned first preferred embodiment of the third design solution of the present application.

Figure 42 is a schematic optical path diagram of the optical component of the spectrum sensor according to the above-mentioned first preferred embodiment of the third design solution of the present application.

Figure 43 is an enlarged schematic structural view of the lens of the spectrum sensor according to the first preferred embodiment of the third design solution of the present application.

Figure 44 is a schematic diagram of the light spot effect obtained by the spectrum sensor on the spectrum chip according to the above-mentioned first preferred embodiment of the third design solution of the present application.

Figure 45 is a schematic structural diagram of a spectrum sensor module according to the second preferred embodiment of the third design solution of the present application.

Figure 46 is a schematic structural diagram of a spectrum sensor module according to the third preferred embodiment of the third design solution of the present application.

Detailed ways

The following description is provided to disclose the present application to enable those skilled in the art to practice the present application. The preferred embodiments in the following description are only examples, and other obvious modifications may occur to those skilled in the art. The basic principles of the present application defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the present application.

Those skilled in the art will understand that in the disclosure of this application, the terms "vertical", "lateral", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings or the optical axis direction of the incident light imaging, which It is only for the convenience of describing the present application and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the above terms cannot be construed as limitations of the present application.

In this application, the term "a" in the claims and description should be understood as "one or more", that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element may be Can be multiple. Unless the disclosure of this application clearly indicates that the number of the element is only one, the term "a" or "an" shall not be understood as being unique or single, and the term "a" or "one" shall not be understood as limiting the quantity.

In the description of this application, it should be understood that terms such as "first", "second", etc. are only used for description purposes and cannot be understood as indicating or implying relative importance. In the description of this application, it should be noted that, unless otherwise clearly stated and limited, "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection. ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through a medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "an example," "specific examples," or "some examples" or the like means that specific features are described in connection with the embodiment or example. , structures, materials or features are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described in this specification unless they are inconsistent with each other.

It should be pointed out that the embodiments shown in the drawings are only used as examples to specifically and vividly explain and illustrate the concept of the present application. They are neither necessarily drawn to scale in terms of size and structure, nor do they constitute a limitation on the concept of the present invention.

The first design solution of the present application provides a spectrum sensor, especially a miniaturized spectrum sensor, including a spectrum chip 20 and an optical component 10 disposed on the sensing path of the spectrum chip 20 .

The spectrum chip 20 includes a photodetection layer 230 and a light modulation layer 220 disposed on the light incident surface side of the photodetection layer 230 on the sensing path of the photodetection layer 230 . The light modulation layer 220 includes at least one modulation unit 221 for modulating incident light. The photodetection layer 230 is configured to obtain the optical signal modulated by the at least one modulation unit 221 . For convenience of description, the incident light is also referred to as the photographed light in the following text.

The optical component 10 is configured to receive the optical signal of the incident light from the photographed object or the optical signal of the photographed light, and guide the optical signal to the spectrum chip 20 . The optical assembly 10 is configured such that the incident light guided onto the spectrum chip 20 achieves uniform light intensity.

Specifically, the function of the uniform light component 110 is to achieve a fixed value of the light cone angle when the incident light reaches the light modulation unit 221 on the surface of the modulation layer after uniform light, and to achieve better consistency and stability. , which can better restore the spectral information.

The optical component 10 may also be provided with one or more diaphragms 120, whereby the areas with relatively good angular distribution in the center of the light spot 140 can be utilized for spectral recovery. In particular, the central areas of multiple light spots 140 can also be combined and used together to recover the spectrum. Alternatively, different modulation units 221 can be selected at different positions of the light modulation layer 220 to select light response data that is beneficial to spectral recovery.

Some embodiments of the first design solution of the present application will be described in detail below with reference to the accompanying drawings.

Figure 1 shows a schematic structural diagram of a spectrum chip 20 according to some embodiments of the first design solution of the present application. The spectrum chip 20 includes a modulation structure 210 and an image sensor 240 . The modulation structure 210 is located on the photosensitive path of the image sensor 240 . The modulation structure 210 is a broadband modulation structure 210 in the frequency domain or wavelength domain. The pass spectra of different wavelengths of each modulation structure 210 are not exactly the same. The modulation structure 210 can be a metasurface, photonic crystal, nanopillar, multilayer film, dye, quantum dot, MEMS (microelectromechanical system), FP etalon (FP etalon), cavity layer (resonant cavity layer), waveguide layer (waveguide layer) layer), diffractive elements and other structures or materials with filtering properties.

The modulation structure 210 may include a photodetection layer 230 and a light modulation layer 220 located on a sensing path of the photodetection layer 230 . For this purpose, see, for example, Chinese patent application number CN201921223201.2. The modulation structures provided on the light modulation layer of the modulation structure may be the same or have different shapes. The modulation units formed by the modulation structure may be periodically arranged, or may be different, that is, non-periodically arranged.

According to the present application, the photodetection layer 230 includes a plurality of sensing units. Each modulation unit 221 of the light modulation layer 220 corresponds to at least one sensing unit of the photodetection layer 230 along the optical path direction of the incident light. The spectrum chip 20 uses the modulation unit 221 of the light modulation layer 220 to modulate the optical signal of the incident light from the measured target to obtain a modulated optical frequency signal, and uses the photoelectric detection layer 230 to receive the measured optical signal. The modulated optical frequency signal is provided with a differential response, and then the signal circuit processing layer of the spectrum chip 20 is used to reconstruct the differential response to obtain the original spectral information of the measured target.

According to this application, when manufacturing the light modulation micro-nano structure, silicon-based materials are selected as materials for both the light modulation layer 220 and the photodetection layer 230 so as to have good compatibility in the manufacturing process. When preparing the light modulation layer 220, the light modulation layer 220 can be directly formed on the photodetection layer 230, or the prepared light modulation layer 220 can be transferred to the photodetection layer 230 first.

The light modulation layer 220, the photodetection layer 230 and the image sensor 240 are vertically connected from top to bottom and parallel to each other. The light modulation layer 220 is used to perform light modulation on the incident light to obtain a modulated spectrum. The photodetection layer 230 is used to receive the modulated spectrum and provide a differential response to the modulated spectrum. The image sensor 240 is used to process the differential response based on an algorithm to reconstruct the original spectrum.

FIG. 2 shows a schematic structural diagram of the light modulation layer 220 according to some embodiments of the first design solution of the present application. As shown in FIG. 2 , the light modulation layer 220 includes at least one modulation unit 221 . Each modulation unit 221 may be a micro-nano structural unit used to modulate incident light. A single modulation unit 221 may include multiple modulation structures 222 of the same or different sizes and shapes, arranged in the same or different arrays, such as nanopores or nanopillars. The modulation units 221 may be regularly arranged on the light modulation layer 220 in a periodic manner, or may be irregularly arranged on the light modulation layer 220 in a non-periodic manner. Different modulation units 221 have different modulation effects on incident light, that is, different modulation units 221 can correspond to basically different transmission spectra. The transmission spectrum mentioned in this application can be understood as a broad-spectrum transmission spectrum. According to the parameter characteristics of the modulation structure 222 in each modulation unit 221, the modulation effect and effect of the modulation unit 221 on incident light of different wavelengths can be determined.

It should be noted that the modulation effects or modulation methods on light of different wavelengths described in this application may include but are not limited to scattering, absorption, transmission, reflection, interference, surface plasmon polaritons, resonance and other effects. By changing the modulation structures 222 in different modulation units 221, the difference in spectral response between different modulation units 221 can be improved. By increasing the number of modulation units 221, the sensitivity to the difference between different spectra can be improved.

Different modulation units 221 may have the same or different modulation effects on light of different wavelengths. This can be set as needed, and is not specifically limited in this embodiment. According to the spectral information of the pixel points corresponding to each modulation unit 221 after the target beam is irradiated, the spectral information of the object to be imaged can be determined.

The modulation structures 222 provided in the modulation unit 221 may each have their own specific cross-sectional shape. For example, each modulation structure 222 may be freely combined and arranged according to the specific cross-sectional shape. Specifically, the specific cross-sectional shapes of some of the modulation structures 222 may be the same. Each modulation structure 222 with the same specific cross-sectional shape constitutes a plurality of modulation structure groups. The specific cross-sectional shapes of each modulation structure group are different from each other, and all the modulation structures 222 All freely combined.

It can be understood that the modulation unit 221 as a whole can be regarded as modulating the spectrum of a specific wavelength, or it can be freely divided into one or more modulation units 221 of the modulation structure 222, so as to be able to modulate the spectrum of a variety of different wavelengths. The spectrum is modulated to increase the flexibility and diversity of light modulation.

As shown in Figure 3, the optical component 10 is located on the photosensitive path of the image sensor 240. After the light is adjusted by the optical component 10 and then modulated through the modulation structure 210, it is received by the image sensor 240 to obtain a spectral response. . The optical component 10 may include, but is not limited to, optical components such as a uniform light component 110 and a filter component 130 .

Specifically, the incident light passes through the optical component 10 and is vertically incident from above the light modulation layer 220 through the light modulation micro-nano structure, and then is modulated by the modulation unit 221 of the light modulation layer 220, and different response spectra are obtained in different modulation units 221. . Each modulated response spectrum is illuminated on the corresponding sensing unit of the photodetection layer 230, and the response spectrum received by the corresponding sensing unit is different, thereby obtaining a differential response. The differential response refers to the response of each modulation unit. Calculate the difference between the response spectrum signals obtained after 221 modulation. Finally, the image sensor 240 uses an algorithm processing system to process the differential response, thereby obtaining the original spectrum through reconstruction.

As an example, in some embodiments of the present application, the image sensor 240 of the spectrum chip 20 may be a CMOS image sensor (CIS), CCD, array light detector, etc.

In practical applications, the spectrum chip 20 is relatively sensitive to the main light angle of the optical signal incident on the modulation layer. Therefore, if it is too sensitive, it will affect the accuracy and stability of the spectrum recovery. It should be noted that the chief light angle at any specific position of the spectrum chip 20 represents the angle between the chief ray of the optical signal guided to the spectrum chip 20 and the normal line, where the chief ray represents the angle from The normal line between the point where the light signal is emitted from the object and the point arriving on the surface of the modulation layer of the spectrum chip 20 represents a straight line perpendicular to the plane where the modulation layer of the spectrum chip 20 is located.

Therefore, the optical component 10 is located on the photosensitive path of the spectrum chip 20 , wherein the light is guided to the surface of the spectrum chip 20 through the optical component 10 with a set incident angle and uniform light intensity, so that remain incident on The optical angle of the same sensing unit is fixed. It can be understood that the light-collecting light cone angle of the spectrum chip 20 when the incident light signal reaches each position on the upper surface of the light modulation layer 220 on the spectrum chip 20 also needs to be stable and cannot have a large change.

Therefore, the light spot 140 obtained at the corresponding position of the modulation layer needs to be uniform, so that the light intensity on the corresponding photosensitive unit is uniform and the angular sensitivity is small.

The optical component 10 includes at least one aperture 120 . The captured light passes through the at least one aperture 120 to form a light spot 140 that irradiates the light modulation layer 220 of the spectrum chip 20 . The light spot 140 covers the spectrum chip 20 at least one modulation unit 221. The modulation unit 221 is, for example, the smallest unit used to restore the spectrum corresponding to the incident light. The at least one diaphragm 120 is located on the optical path and is used to control the size, angle and amount of light passing through the light spot 140 .

The optical component 10 further includes a uniform light component 110 , wherein the uniform light component 110 is disposed on the optical path of the captured light guided to the spectrum chip 20 .

As shown in FIG. 4 , in some embodiments, the light uniformity component 110 is disposed on the light incident side of the aperture 120 , that is, relative to the incident light propagation direction, the light uniformity component 110 is disposed in front of the aperture 120 . Alternatively, the uniform light component 110 may also be disposed on the light exit side of the aperture 120, that is, relative to the propagation direction of the incident light, the uniform light component 110 is disposed behind the aperture 120.

As shown in the optical path diagram of FIG. 5 , on the optical path from the captured light to the spectrum chip 20 , the captured light passes through the uniform light component 110 and the aperture 120 in sequence, and then reaches the spectrum chip 20 . Alternatively, the uniform light component 110 can also be disposed on the light exit side of the aperture 120 , that is, the captured light can first pass through the aperture 120 , then pass through the uniform light component 110 , and finally reach the spectrum chip 20 .

The uniform light component 110 can be a uniform light sheet, a uniform light film, etc. so that the incident light can obtain light with uniform intensity and the light intensity of the incident light of different wavelength bands in the spectrum recovery space region is basically the same. In some embodiments, the uniform light component 110 is configured so that the light spot 140 reaching the spectrum chip 20 through the optical component 10 is uniform and angle-insensitive.

A beam of light coming from different incident angles can illuminate each modulation unit 221 of the spectrum chip 20 with the same distributed intensity through the uniform light component 110 . At the same time, in order to obtain relatively stable light intensity and obtain corresponding spectral information for incident light in different wavelength bands, the uniform light component 110 needs to meet a certain light transmittance.

Table 1 below shows the corresponding relationship between the thickness of the uniform light component 110, the prescribed transmittance and the formula-fitted transmittance. For light uniforming components 110 with different thicknesses, their light transmittance and light uniforming effects are also different.

PTFE (ROCH) uniform light sheet thickness vs. transmittance

Table 1

Here, the light-diffusing component 110 is a light-diffusing sheet, and its thickness can be selected as the value in the third column of Table 1, and its unit is μm. The uniform light component 110 may also be a coating, for example, a composite coating with 2 to 20 layers. The coating is generally 30μm. The diffuser may be, for example, approximately from 5 μm to 1000 μm, or from 5 μm to 500 μm, especially 300 μm.

FIG. 6 exemplarily shows different light uniformity effects of ambient light in different areas on the light uniformity component. Since different materials have different light uniformity effects, different light uniformity components can be selected according to the size of the obtained light spot and the position of the modulation structure. Different thicknesses of uniform light components can produce different regional uniform light effects. Since the thinner the light uniforming component is, the lower the light uniformity ability is. However, different light uniforming effects of ambient light in different areas on the light uniformity component can be obtained, as shown in Figure 6 .

For example, when the thickness of the uniform light component is less than the set value, for example, refer to Table 1 and the thickness is less than or equal to 400, 300, 250, 200 or 100 μm, set a space to include red ( R), green (G), and blue (B) light sources, when light sources of different colors at different positions illuminate the uniform light component, different areas of uniform light will be formed at different positions corresponding to the uniform light component. Therefore, when it is necessary to obtain spectral information of ambient light in different areas, a thinner uniform light component needs to be used.

As shown in Figure 6, assuming that two different light sources, red and green, illuminate the uniform light component, when the thickness of the uniform light component used reaches the set value, the corresponding red (R) and green (G) can be obtained. The mixed light of the light source corresponds to the position and spectral information of the incident light obtained by the image sensor, which can perform regional spectral recovery for different ambient lights.

In some embodiments of the present application, the optical component 10 may further include a filter component 130 . The filter component 130 may be a filter or a filter film. The filter component 130 is disposed in the optical path of the incident light. For example, it may be disposed above the uniform light component 110 or below the uniform light component 110 , that is, It is located on the light entrance surface or the light exit surface of the light uniformity component 110 . To this end, the following connection methods of the optical component 10 can be designed according to the formation of the light path: the subject light is irradiated to the upper surface of the uniform light component 110, and after uniform light, is arranged under the uniform light component 110 The aperture 120 on the surface reaches the filter component 130 after passing through the aperture 120. After filtering the light, the light corresponding to the set waveband is obtained, and finally Finally, it is irradiated onto the modulation unit 221 of the light modulation layer 220 of the spectrum chip 20 .

Through the filter component 130 of the optical component 10, spectral information corresponding to incident light in different wavelength bands can be obtained, and at the same time, the adverse impact of light in other unnecessary wavelength bands on conventional requirements can be reduced. For example, the filter component 130 can selectively filter visible light, infrared light, etc.

The diaphragm 120 of the optical component 10 may be configured as a through hole formed by injection molding of a plastic part, or may be configured as an opaque coating formed on the upper surface and/or lower surface of the uniform light component 110. Aperture aperture of certain size. For these solutions, only the through hole or aperture hole is reserved for light transmission, and other areas block the light propagation path. The opaque coating here may be a coating, such as a metal coating. For details, please refer to the description of coatings later.

In addition to the above situation, that is, the aperture 120 of the optical component 10 is configured as a light-transmitting aperture hole in the opaque coating formed on the upper surface and/or the lower surface of the light-diffusing component 110 , it can also be configured as a light-transmitting aperture hole. When a filter component 130 is provided, such as a filter, the diaphragm 120 is constructed with an opaque coating formed on the upper surface and/or lower surface of the filter, and forms a set size. Diaphragm hole to pass light. In this case, the aperture 120 is configured as a light-transmitting aperture hole in an opaque coating formed on the upper surface and/or the lower surface of the filter.

According to the present application, the diaphragm 120 of the optical component 10 can be formed into a specific shape and aperture. For example, the cross section of the diaphragm hole can be circular or polygonal, and the longitudinal section can be cylindrical, square or trapezoidal. The longitudinal section refers to the section along the optical path direction of the incident light, and the cross section refers to the section perpendicular to the optical path direction of the incident light. In particular, the geometric characteristic parameters such as the aperture, cross-section and longitudinal section shape of the aperture can be set according to the size of the light spot 140 to be formed.

In some embodiments of the present application, the optical component 10 may be provided with only one aperture 120. When only one aperture 120 is set, a corresponding light spot 140 is formed on the spectrum chip 20. Further, the diaphragm 120 is configured as a circular hole, and the center of the circular hole is located on the optical axis of the imaging light path of the spectrum chip 20 . In addition, a light spot 140 irradiating the light modulation layer 220 of the spectrum chip 20 is formed through the aperture 120 . In particular, this light spot 140 covers all the modulation units 221 on the light modulation layer 220 of the spectrum chip 20 . Therefore, through the above measures, it is possible to perform optical imaging and/or spectral imaging of the environment or incident light at a single point or even multiple angles, and obtain relevant imaging information and spectral information.

Through the features described above in combination with a single aperture 120, especially in combination with the uniform light component 110, the optical component 10 can even achieve collection of solid angles with a radiation angle within 180°, thereby achieving a large field of view FOV. Incident light collection, which also helps solve the problem of angular stability and consistency of the spectral sensor module when acquiring incident light. The spectral information of the incident light can be obtained more accurately through uniform light with a large field of view FOV, so that the chromaticity value can be calculated more accurately.

Alternatively, the optical assembly 10 may also be provided with multiple apertures 120. When multiple apertures 120 are set, the multiple apertures 120 are configured to form multiple apertures through the multiple apertures 120. 140 light spots. In particular, in the optical In the case where the component 10 includes multiple apertures 120 , the multiple apertures 120 are configured to respectively form a light spot 140 irradiating the light modulation layer 220 of the spectrum chip 20 through the multiple apertures 120 .

7 and 8 show schematic diagrams of light spots 140 formed by the diaphragm 120 of the optical assembly 10 irradiating on the light modulation layer according to some embodiments of the first design solution of the present application. Here, five light spots 140 are used respectively. For example. Referring to FIG. 7 and FIG. 8 , the optical component includes five diaphragms as an example for description, each of which forms a light spot 140 and illuminates the corresponding modulation unit 221 on the light modulation layer 220 . However, it is obvious that the number, position and arrangement of the apertures can be changed as desired and are not limited to the parameters adopted here for the purpose of illustration.

According to the present application, the captured light passes through the aperture 120 of the optical component 10 to form a light spot 140, and is illuminated on the corresponding modulation unit 221 of the light modulation layer 220 of the spectrum chip 20. The light modulation layer 220 may be formed of one or more modulation units 221, and the modulation unit 221 may be a single layer or multiple layers, and modulate the subject light. The modulation unit 221 is, for example, the smallest unit for acquiring spectral information that restores the optical signal of the incident light of the subject. It should be noted that a plurality of different modulation structures 222 can be provided in the modulation unit 221. The modulation structures 222 can be periodically arranged to form different modulation units 221. The modulation unit 221 can be configured to restore the intensity of the incident light. The smallest unit of spectral information. Since the modulation unit 221 in this application can be composed of multiple different modulation structures 222, each modulation unit 221 can be configured to obtain different responses and recover the spectrum according to the algorithm of Y=TX (detailed introduction below) One modulation structure 222 cannot calculate accurate spectral information of the incident light, so at least two different modulation structures 222 are required to form a modulation unit 221 for calculating and obtaining the spectral information of the incident light.

Further, when the optical component 10 includes multiple apertures 120, each aperture 120 is configured to form a light spot 140, and each light spot 140 formed does not affect each other. The light spots 140 formed by each aperture 120 can be irradiated at different positions on the spectrum chip 20 , and each light spot 140 covers the modulation units 221 at different positions on the light modulation layer 220 of the spectrum chip 20 .

Optionally, each light spot 140 covers one modulation unit 221 on the light modulation layer 220 of the spectrum chip 20 on a one-to-one basis.

Furthermore, the plurality of apertures 120 are configured such that the overall combination of the light spots 140 formed by the plurality of apertures 120 and irradiated to the light modulation layer 220 of the spectrum chip 20 covers all the light spots on the spectrum chip 20 . Modulation unit 221. That is to say, all modulation units 221 on the spectrum chip 20 are covered by at least one light spot 140 or at least a part of the light spot 140 .

As shown in the figure, the spectrum chip 20 of the spectrum sensor is provided with five apertures 120, and the diameters of the five apertures 120 may be different (Fig. 7), or of course may be the same (Fig. 8). Specifically, the diameter of the aperture 120 can be set according to the number of structures of the light modulation layer 220 of the spectrum chip 20 . For example, the diameter of the aperture 120 is approximately 10 mm < aperture aperture - design target < 0.001 mm.

According to the present application, the light modulation layer 220 of the spectrum chip 20 may further include at least one The non-modulation unit 221 may be arranged on the light modulation layer 220 spaced apart from the at least one modulation unit 221 . Each modulation unit 221 and non-modulation unit 221 of the light modulation layer 220 may respectively correspond to at least one sensing unit of the photodetection layer 230 along the photosensitive path. Therefore, the modulation unit 221 of the light modulation layer 220 can be configured to modulate the imaging light entering the corresponding sensing unit, and the corresponding sensing unit is adapted to obtain the spectrum of the imaging light. information, and the non-modulation unit 221 of the light modulation layer 220 can be configured not to modulate the imaging light entering the corresponding sensing unit, and the corresponding sensing unit is adapted to obtain the imaging light. Light intensity information. For this situation, according to the present application, an aperture 120 can also be provided in the optical component 10, and the light spot 140 formed by it is irradiated on the corresponding non-modulation unit 221 on the light modulation layer 220, and passes through the photodetection layer 230. The corresponding sensing unit on the device obtains accurate light intensity information of the imaging light, thereby obtaining higher quality image information.

In addition, other light sensing functions, such as flick, can also be provided at positions of the light modulation layer 220 that are not illuminated by the light spot 140 , such as the modulation unit 221 or the non-modulation unit 221 that is not illuminated by the light spot 140 .

FIG. 9 shows a schematic diagram of the light spots 140 formed by the aperture 120 of the optical component 10 irradiating the light modulation layer 220 according to other embodiments of the present application. Here, four light spots 140 are taken as an example. As shown in FIG. 9 , the optical component 10 of the spectral sensor is provided with four apertures 120 . Of course, it can also be set to 1, 2, 3, 5... and other numbers. The light modulation layer 220 of the spectrum chip 20 may include a plurality of modulation units 221 arranged periodically, and each modulation unit 221 includes a plurality of spectral modulation structures 222, such as modulation holes or modulation columns.

In this application, the photodetection layer 230 is located below the light modulation layer 220 and is used to receive the modulated spectrum and provide a differential response to the modulated spectrum. The image sensor of the spectrum chip 20 240 is located below the photodetection layer 230 and is used to reconstruct the differential response to obtain the original spectrum.

It should be noted here that according to the present application, the sensing unit of the photodetection layer may be one physical pixel or multiple physical pixels of the image sensor. Different from physical pixels, in the spectral sensor according to the present application, one or more physical pixels corresponding to one or more modulation units may be called "spectral pixels". In this application, the spectral restored pixel unit refers to a "spectral pixel", and the modulation unit is a set of structural units corresponding to the spectral pixels. In this regard, "spectral pixel" is a pixel definition from the perspective of spectral imaging. This spectral pixel can also be understood as the smallest unit that can be used to recover the spectral information of the captured light.

Through aperture structures with different structural forms and arrangements, especially in combination with correspondingly arranged modulation units of the light modulation layer of the spectrum chip, different photoelectric effects can be obtained. For example, different forms of light can be matched and used according to different application scenarios. Laminate structure to achieve optical imaging and/or spectral imaging of single point, multi-point, or even multi-angle environment or incident light, and obtain relevant imaging information and spectral information.

In this application, the specific algorithm principles for recovering spectra include:

The intensity signal of ambient light at different wavelengths λ is recorded as f(λ), and the transmission spectrum curve of the modulation structure is recorded as T(λ). There are m groups of modulation structures on the filter, and each group of transmission spectra is different from each other. , that is, the "structural unit" as mentioned above, the whole can Denote it as T _i (λ) (i=1,2,3,…,m). There are corresponding physical pixels below each set of filter structures to detect the light intensity I _i modulated by the modulation structure. In a specific embodiment of the present application, one physical pixel corresponds to a group of structural units as an example for explanation, but it is not limited to this. In other embodiments, a group of multiple physical pixels may also correspond to a group of structures. unit.

The relationship between the spectral distribution of ambient light and the measured values of the light detector array can be expressed by the following formula:

I _i =Σ(f(λ)·T _i (λ)·R(λ))

Among them, R(λ) is the response of the detector, recorded as:

S _i (λ)=T _i (λ)·R(λ)

Then the above formula can be expanded into matrix form:

Here, I _i (i=1,2,3,…,m) is the response of the photodetector after the light to be measured passes through the modulation structure, which corresponds to the measured light intensity of m photodetector units, also known as m "Physical pixel", which is a vector of length m. S is the light response of the system to different wavelengths, which is determined by two factors: the transmittance of the modulation structure and the quantum efficiency of the photodetector response. S is a matrix. Each row vector corresponds to the response of a broadband filter unit (i.e., photodetector unit and its corresponding modulation structure) to ambient light of different wavelengths. Here, the ambient light is discretely and uniformly sampled, with a total of n sampling points. The number of columns of S is the same as the number of sampling points of the ambient light. Here, f(λ) is the spectrum of ambient light at different wavelengths λ, which is the ambient light spectrum to be measured.

In practical applications, the response parameter S of the system is known. Through the light intensity reading I of the detector, the spectrum f of the input light can be obtained through algorithm inversion. The process can use different data processing methods depending on the specific situation, including but not Limited to: least squares, pseudo-inverse, equilibrium, least square norm, artificial neural network, etc.

The above takes a physical pixel corresponding to a group of structural units as an example to illustrate how to use m groups of physical pixels (that is, pixels on the image sensor) and their corresponding m groups of structural units (the same structures on the modulation layer are defined as structural units). Or the modulation unit 221) recovers a spectral information, also called a "spectral pixel". It is worth noting that in some embodiments of the present application, multiple physical pixels may also correspond to a group of structural units. It can be further defined that a group of structural units and corresponding at least one physical pixel constitute a unit pixel. In principle, at least one unit pixel constitutes one of the spectral pixels, which can generate one color temperature channel, and multiple spectral pixels can generate multiple color temperature channels.

In this application, the spectral information of the incident light is recovered based on the spectral pixel corresponding to each modulation unit 221. Each modulation unit 221 can be set to be composed of n*n spectral modulation structures 222 (n is any integer). Of course, other array forms of spectral modulation structures 222 can also be considered to form the modulation unit 221, for example, m*n. It is composed of spectral modulation structures 222 (m and n are arbitrary integers).

Taking four apertures 120 as an example, four modulation units 221 are provided on the light modulation layer 220 of the spectrum chip 20 in the spectrum sensor, and each aperture 120 corresponds to one modulation unit 221 respectively. Here, taking 2*2 spectral pixels 224 as an example, each modulation unit 221 is provided with 3*3 spectral modulation structures 222. As shown in Figure 9, a spectral chip 20 is composed of four spectral pixels 224. In other words, one spectral pixel 224 can be covered by four light spots 140. Here, the corresponding four light spots 140 are respectively composed of four apertures. 120 formed.

In some embodiments, the modulation unit 221 corresponds to one or more physical pixels of the photodetection layer 230, where at least two modulation units 221 form one spectral pixel.

In other embodiments, the plurality of apertures 120 are configured to form multiple pairs of light spots 140 formed on the spectrum chip 20 by the light signal of the photographed target through the plurality of apertures 120 . Many or many to one. For example, multiple apertures 120 correspond to one light spot 140, or multiple apertures 120 correspond to multiple light spots 140, especially one-to-one correspondence.

FIG. 10 shows a schematic diagram of the light spot 140 formed by the diaphragm 120 of the optical assembly 10 irradiating on the light modulation layer 220 according to other embodiments of the present application. As shown in FIG. 10 , if each light spot 140 is close to each other, there will be problems such as unevenness or angle sensitivity that affect spectral recovery. Therefore, the modulation units 221 at different positions on the same spectrum chip 20 are periodically arranged. In this case, a corresponding light spot 140 can be illuminated at a set position corresponding to each period, and a corresponding aperture 120 is provided in the optical component 10 to form the light spot 140 at this position. When incident light irradiates through each aperture 120, a light spot 140 is formed at a corresponding position on the light modulation layer 220 of the spectrum chip 20. The diaphragm 120 is further configured to pass through one or more modulation units 221 corresponding to the light spot 140 behind the diaphragm 120 and obtain the spectral response corresponding to the incident light through the image sensor 240 . The spectral response of the incident light is obtained through one or more modulation units 221 corresponding to each light spot 140 . Through the above measures, it helps to ensure that the incident light only changes in intensity on the spectrum chip of the spectrum sensor, and the uniformity remains consistent, especially the angular distribution on the chip surface does not change, thereby improving the performance of the optical component. and helps eliminate angle sensitivity.

In some embodiments, for the case where the light modulation layer 220 of the same spectrum chip 20 is composed of periodically arranged modulation units 221, the modulation unit 221 corresponding to the set position in each cycle is composed of the aperture. 120 is covered by the light spot 140 formed by the light signal of the photographed object that passes through.

As shown in FIGS. 11 and 12 , in addition to the light spots 140 formed by the plurality of apertures 120 and irradiating the light modulation layer 220 of the spectrum chip 20 , the light spots 140 respectively cover different positions on the spectrum chip 20 . The modulation unit 221 may alternatively configure the aperture 120 so that the multiple light spots 140 formed by the aperture 120 cover different positions of the same modulation unit 221. For example, in the case where the modulation unit 221 includes multiple identical or different modulation sub-units, the aperture 120 is configured such that the multiple light spots 140 formed by the aperture 120 can cover different modulation sub-units of the same modulation unit 221 respectively. unit.

Optionally, the aperture 120 is configured such that the light spot 140 formed by the aperture 120 can also illuminate multiple modulation sub-units at the same position in different periods of the modulation unit 221 . For example, in the case where the modulation units 221 respectively include multiple identical or different modulation sub-units, the multiple light spots 140 formed by the aperture 120 may cover the modulation sub-units at the same position in different modulation units 221 respectively.

Therefore, the recovery algorithm can be performed by using the spectral response matrices of different spectral modulation structures 222 of different spectral pixels 224 when incident light reaches them. Since the parameters of the modulation response that can be obtained increase or the modulation intensity increases, the accuracy and stability of the spectral recovery are improved. Increased sex. In addition, through different paired combinations of apertures, modulation units and modulation sub-units, personalized optoelectronic characteristics can be customized to meet the needs of different applications and sensing performance.

In some embodiments, the light modulation layer 220 of the spectrum chip 20 is composed of a plurality of different sets of modulation units 221 as spectrum units. The spectrum units are periodically arranged on the spectrum chip 20. The aperture 120 is also configured such that the light spot 140 formed by the plurality of diaphragms 120 and irradiated onto the light modulation layer 220 of the spectrum chip 20 covers the different modulation units 221 of the spectrum unit.

In other embodiments, the light modulation layer 220 of the spectrum chip 20 is composed of a plurality of different sets of modulation units 221 as spectrum units, and the spectrum units are periodically arranged on the spectrum chip 20 .

In order to obtain more accurate and stable spectral recovery, a spectral unit can be composed of multiple different spectral modulation structures 222, or a spectral unit can be composed of multiple layers of the same modulation unit 221. The spectral unit can be composed of a plurality of different modulation units 221 arranged periodically. At this time, a set of responses to incident light can be obtained in each spectrum unit. Smoothing can be performed based on the responses of multiple sets of incident light to obtain a more accurate response. The accurate response of incident light, that is, T(λ), can more accurately obtain the response of incident light at different locations on the spectrum chip. Through the spectral recovery algorithm, more stable and accurate spectral information of the incident light can be obtained.

In other embodiments, the aperture 120 is further configured such that the light spot 140 formed by the plurality of apertures 120 and irradiated to the light modulation layer 220 of the spectrum chip 20 covers the same light spot of different spectral units. position on the modulation unit 221.

In other embodiments, the aperture 120 is further configured such that the light spot 140 formed by the plurality of apertures 120 and irradiated to the light modulation layer 220 of the spectrum chip 20 covers the corresponding corresponding parts of different spectral units. The modulation units 221 at different positions, and a plurality of the modulation units at different positions constitute a spectrum unit within one cycle. That is to say, the light spots illuminate the modulation units 221 at different positions, and then if these different positions in different periods are combined with each other, they can actually form a spectral unit within one period. For example, a modulation unit in the form of a nine-square grid is set, and then nine light spots illuminate each position of the nine-square grid in different cycles, that is, the first position in the first cycle, then the second position in the second cycle, and so on, until the ninth The ninth position of the cycle, these positions combined with each other can form the nine positions of a cycle.

13 illustrates the diaphragm 120 of the optical assembly 10 formed on the light modulation layer 220 according to some embodiments of the present application. A schematic diagram of the intensity and size of the light spot 140 is obtained. As shown in Figure 13, it is a schematic diagram of the light spot 140 formed by different apertures 120 irradiating the spectrum chip 20. The uniformity and stability of the light spot 140 obtained for this purpose can be obtained under the same or different apertures 120. The intensities of the light spots 140 may be the same or different, and the sizes of the light spots 140 may also be the same or different.

In addition, through the features described above in conjunction with the aperture, especially the combination of features, it can be ensured that the light-collecting light cone angle of the incident light signal arriving at various positions on the upper surface of the light modulation layer on the spectrum chip remains stable by the optical component. It is helpful to improve the stability of spectral recovery.

FIG. 14 shows a schematic diagram in which the diaphragm 120 of the optical assembly 10 is provided with a light attenuating sheet 225 and/or a light enhancing sheet 223 according to some embodiments of the present application. In some embodiments of the present application, the optical component 10 of the spectral sensor further includes a light attenuation sheet 225 and/or a light enhancement sheet 223 disposed at one or more aperture 120 positions. The light attenuation sheet 225 provided at the position of the diaphragm 120 is used to attenuate the incident light signal of the photographed object, and/or the light enhancement sheet 223 is used to enhance the incident light signal of the photographed object.

In some embodiments, the light attenuating sheet 225 and/or the light enhancing sheet 223 are disposed at a plurality of aperture positions, and the plurality of apertures 120 are configured to be formed by corresponding to the aperture 120 The light spot covers different modulation sub-unit positions of the modulation unit 221 in the same period.

In other embodiments, the light attenuating sheet 225 and/or the light enhancing sheet 223 are disposed at a plurality of aperture positions, and the plurality of apertures 120 are configured to be formed by corresponding to the aperture 120 The light spots cover the same modulation sub-unit position of the modulation unit 221 in different periods.

As shown in Figure 14, the light attenuation sheet 225 can be set at one or more aperture 120 positions, or the light enhancement sheet can be set at a certain aperture 120 position, or a light attenuation sheet 225 can be set at the set aperture 120 position. Attenuation sheet 225 and light enhancement sheet 223. When the incident light intensity exceeds the set threshold, spectral information corresponding to the position where the light attenuation sheet 225 is disposed can be obtained; when the incident light is lower than the set threshold, spectral information corresponding to the position where the light enhancement sheet is disposed is obtained. There are many ways to set up the light attenuating sheet 225 , which can be achieved by coating (coating a layer of translucent material) on the filter below the aperture 120 , or by reducing the aperture of the aperture 120 . On the contrary, a large aperture diaphragm 120 can be provided to achieve light enhancement.

Figure 15 shows a distribution pattern of aperture 120 according to some embodiments of the present application. In some embodiments of the present application, multiple apertures 120 may also be provided on the light exit surface of the light uniformity component 110 . For example, when plating a metal layer, by setting different layouts, as shown in FIG. 15 , multiple apertures 120 are formed through integrated plating. The number, distance and arrangement of the apertures 120 can be set according to requirements. Here, as an example, each circular light spot 140 is generated by a corresponding diaphragm 120 .

The same solution is applicable to other embodiments of the present application, and will not be described again here.

In addition, in some embodiments of the present application, filter components 130 with different filter bands can be provided corresponding to different positions of the diaphragm 120 to meet the spectral response and recovery of different ambient light in different wave bands.

This application also proposes a spectrum sensor module, which includes the spectrum sensor and a circuit board 5 (PCB). The spectrum chip 20 of the spectrum sensor is placed and electrically connected to the circuit board 5 . The spectral information obtained through the spectral sensor module can be used to recover ambient light parameters such as color temperature, illumination, and brightness.

The spectrum chip 20 of the spectrum sensor is placed and electrically connected to the circuit board 5 . In particular, a base plate 6 is provided on the circuit board 5 , on which base plate 6 the spectral chip 20 of the spectral sensor can be mounted. Wherein, the spectrum chip 20 is configured to receive incident light, modulate the incident light to obtain a response signal, and obtain spectral information of the incident light based on the response signal and a calculated spectrum recovery algorithm.

Since the main light angle needs to be fixed and insensitive to the light irradiating the upper surface of the light modulation layer 220 of the spectrum chip 20 , a uniform light component is also provided on the optical path of the incident light irradiating the spectrum chip 20 110. The uniform light component 110 is configured so that the light incident on the uniform light component 110 is uniformly reflected in all directions.

In some embodiments, the uniform light component 110 is configured such that incident light passing through the uniform light component 110 forms a cosine illuminant.

For example, the luminous intensity of the uniform light component 110 configured to pass through the uniform light component 110 is D∝cosθ, that is, its brightness B has nothing to do with the direction, where D is a certain direction of each unit S of the light emitting surface, or Speaking of the luminous intensity in any direction r, θ is the angle between r and the normal n.

The light uniformity component 110 is any one of a light uniformity film, a light uniformity sheet, or a light uniformity coating. In this embodiment, taking the light-diffusing sheet as an example, an opaque layer is provided on the light-emitting surface of the light-diffusing sheet. The opaque layer can be formed by plating an opaque metal material and retains a set aperture. The aperture is 120. The thickness of the opaque layer is determined by the diaphragm aperture, the number of diaphragms, and the distance between the diaphragms.

The spectrum sensor module may further include a data processing unit 3. The data processing unit 3 may be a processing unit such as MCU, CPU, GPU, FPGA, NPU, ASIC, etc., which may further perform operations on the data generated by the image sensor 240. and processing, in particular the generated data can be exported externally for processing. The image sensor 240 is configured to obtain a response signal to the incident light modulated by the light modulation layer 220 , and obtain spectral image information from the response signal, wherein a plurality of modulation units 221 are provided on the light modulation layer. Multiple modulation units 221 may be provided on the light modulation layer 220 .

The optical component 10 of the spectrum sensor sequentially includes a uniform light component 110, an aperture 120 and a possible filter component 130 along the optical path direction of the incident light.

The optical component 10 of the spectral sensor module shown here has an aperture 120 . However, since different modulation units 221 can be covered by different light spots 140 , multiple different apertures 120 can also be provided. Of course, the aperture 120 is only used as an example for explanation here, and the relevant features can also be applied to spectrum sensor modules with multiple different apertures 120 . The description made in conjunction with the aperture 120 in the specification is also applicable to the case of multiple apertures 120 and vice versa, and will not be described again.

The spectrum sensor module also includes a housing 4, which serves as the frame structure of the entire module and is used to form an accommodation space for the optoelectronic components of the spectrum sensor module, and to provide mechanical support and electrical load-bearing for the relevant optoelectronic components. Function, so that the spectrum sensor module can realize the corresponding photoelectric function.

The housing 4 of the spectral sensor module includes a first support 411 in which the at least one aperture 120 of the optical assembly 10 is constructed. Specifically, one or more apertures 120 of the optical assembly 10 are provided in the first support 411 , for example in the form of through holes. As shown in FIG. 16 , an aperture 120 is provided in the first support member 411 . Alternatively, a plurality of apertures 120 in the form of a plurality of through holes may be provided.

In some embodiments of the present application, for example, see FIG. 16 , the first support member 411 is configured as a plate-shaped or disc-shaped element, and its plate plane or disc plane is arranged substantially perpendicular to the optical path of the incident light irradiating the spectrum chip 20 . In this case, the thickness of the first supporting member 411 is also the structural size or structural height of the first supporting member 411 in the optical path direction of the incident light irradiating the spectrum chip 20 . In this embodiment, an aperture 120 is provided in the first support 411 .

The uniform light component 110 of the optical component 10 of the spectrum sensor is disposed along the optical path along which the incident light irradiates the spectrum chip 20. The uniform light component 110 is disposed on the upper surface of the first support member 411, that is, the first support member 411 on the surface facing the incident light and opposite to the diaphragm 120. The incident light passes through the uniform light component 110 and the aperture 120 and then irradiates the spectrum chip 20 with a main light angle in the range of 0-20°. The incident light is irradiated to the modulation layer of the spectrum chip 20 through the uniform light component 110 and the diaphragm 120 for light modulation. The spectrum chip 20 obtains the response information of the incident light, and obtains the spectrum corresponding to the incident light through an algorithm. information.

The housing 4 of the spectrum sensor module also includes a second support member 412. The second support member 412 is configured to support the first support member 411. For example, it can be supported between the first support member 411 and the circuit board or the spectrum sensor module. between the bottom plates 42 of the housing 4. Therefore, the first support member, the second support member 412 and the base plate 42 set together form the housing 4 of the spectrum sensor module. In this case, the thickness of the second supporting member 412 is also the structural size or structural height of the second supporting member 412 in the optical path direction of the incident light irradiating the spectrum chip 20 . The above structural form of the spectrum sensor module is beneficial to improving the photoelectric stability and mechanical reliability of the recovered spectrum of the spectrum sensor module.

As shown in the optical path diagram in Figure 17, the light emitted by the light source 8, or the reflected light of the object, or the ambient light is homogenized by the light uniformity component 110, and then passes through the aperture 120 and the filter component 130, with a fixed incident angle and The light intensity is guided to the surface of the spectrum chip 20 in a uniform manner.

In this embodiment, the spectrum sensor module further includes a cover plate 43, which is supported and fixed on the first support member 411, for example, on the surface of the first support member 411 facing the incident light. The cover plate 43 can be processed separately or provided separately, and is connected to the first supporting member 411 and the second supporting member 412 by, for example, gluing. Alternatively, the cover plate 43, the first support member 411 and the second support member 412 may also be integrally injection molded.

The spectrum sensor module further includes a base plate 42 , which is opposite to the cover plate 43 or the first support member 411 on one side of the second support member 412 and is on the other side of the second support member 412 . In this regard, structurally, The second support member 412 supports and connects the first support member 411 at one end and is connected to the bottom plate 42 at the other end, so the second support member 412 functions as a support. For example, the circuit board 5 can be fixed on the base plate 42 .

Therefore, the first support member 411, the second support member 412 and the bottom plate 42 of the spectrum sensor module form the housing 4 of the spectrum sensor module, which is used to protect and fix related optical and electronic components, especially Supporting the formation of a light path for incident light to illuminate the spectrum chip 20 .

The thickness of the first support member 411 is determined according to parameters such as the aperture (diameter) of the aperture, the distance between the center points of the apertures, the number of apertures, and the thickness of the second support member 412 .

The incident light passes through the uniform light component 110, and the angle of the incident light obtained after the uniform light is insensitive, and the incident light passing through the uniform light plate forms a Lambertian body, or a Lambertian-like body, and then passes through The uniform light is then irradiated onto the spectrum chip 20 through the aperture 120 to form a light spot 140. The effective area of the light spot 140 follows the following empirical formula:

Among them, d represents the aperture or diaphragm diameter, h1 represents the distance from the light exit surface of the uniform light component 110 to the spectrum chip 20 in the direction of the optical path of the incident light irradiating the spectrum chip 20, and h ₂ represents the distance between the incident light irradiation and the spectrum chip 20. The distance from the light exit surface of the diaphragm 120 to the spectrum chip 20 in the direction of the optical path to the spectrum chip 20 .

Similarly, h1 can also be defined as the distance from the light incident surface of the uniform light component 110 to the spectrum chip 20 in the direction of the optical path in which the incident light irradiates the spectrum chip 20 , and h ₂ can be defined as the distance in the direction in which the incident light irradiates the spectrum chip 20 The distance from the light incident surface of the aperture 120 to the spectrum chip 20 in the direction of the light path. There is no essential difference between the two definitions of the parameters h1 and _h2 . They are only defined based on the light incident surface or light exit surface of the uniform light component 110 and the light exit surface or light incident surface of the diaphragm 120, respectively. In Figure 16, h1 and _h2 are shown based on the light exit surface as an example.

If the optical component 10 further includes a filter component 130 , the filter component 130 may be disposed on a surface of the first support member 411 opposite to the uniform light component 110 . Alternatively, a filter component 130, such as a filter, is provided on the lower surface of the diaphragm 120.

Alternatively, the filter component 130 may also be disposed on the incident surface of the incident light, that is, the filter component 130 is disposed on the upper surface of the diaphragm 120 , that is, the surface facing the incident light. In other words, the filter component 130 of the optical component 10 is disposed between the uniform light component 110 of the optical component 10 and the first support member 411 . The filter component 130 may be a filter material coating or a filter. Therefore, the incident light is first irradiated on the filter component 130, and the incident light of the set wavelength band is obtained through the filter component 130, and then the light is homogenized. To this end, a uniform light component 110 is provided below the filter component 130 . The filter component 130 , the uniform light component 110 and the aperture 120 are sequentially provided on the optical path where incident light irradiates the spectrum chip 20 .

Alternatively, as shown in FIG. 16 , a uniform light component 110 , an aperture 120 and a filter component 130 are arranged in sequence on the optical path where incident light irradiates the spectrum chip 20 . The light uniformity component 110 may be a light uniformity sheet, a light uniformity film, etc., and the specific material may be polytetrafluoroethylene PET, PTFE, glass, etc.

According to some embodiments, the light-diffusion component is constructed as a Lambertian body. Lambertian body refers to the phenomenon when the incident energy is uniformly reflected in all directions, that is, the incident energy is centered on the incident point and reflects energy isotropically around the entire hemispheric space, which is called diffuse reflection, also known as isotropic reflection. A complete diffuser is called a Lambertian body. In the embodiments of the present application, it may not be limited to Lambertian, but may also be Lambertian-like. Compared with Lambertian, it can be within a certain error range.

The spectrum chip 20 is connected to the circuit board 5 through electrical connections, and the optical device is packaged in a protective shell, where the first support member 411 and the second support member 412 are used to protect and support the formation of the optical path.

In some embodiments of the present application, a wedge-shaped groove 431 is provided in the cover plate 43, and the wedge-shaped groove 431 matches the shape of the light-diffusing component 110. The above-mentioned light-diffusing component 110 can be disposed in the above-mentioned wedge-shaped groove 431, The uniform light component 110 is thereby embedded and fixed.

The wedge-shaped groove 431 can be provided completely around the outer edge of the light-diffusing component 110 , for example, the light-diffusing plate. That is, the wedge-shaped groove 431 is configured in a circular shape. For example, the wedge-shaped groove 431 can be configured as a through hole in the cover plate 43 , and the through hole can especially be a tapered hole, which is particularly beneficial to the installation, positioning and fixing of the light diffusion assembly 110 .

In the embodiment shown in FIG. 16 , the narrow end of the tapered hole as the wedge-shaped groove 431 is located on the outer surface of the cover plate 43 , that is, the surface facing the incident light, while the wide end of the tapered hole is located on the outer surface of the cover plate 43 . The inner surface is the surface facing the first support member 411 . Through such a structural form, all free ends of the light distribution component 110 are limited by the first support member 411 and the wedge-shaped groove 431, and can be accurately fixed and positioned. At the same time, the surface of the first support member 411 and the inner peripheral surface of the wedge-shaped groove 431 can be connected. The tight fit facilitates water and dust protection and uninterrupted transmission of light.

Advantageously, the inner and outer surfaces of the diffuser disposed in the tapered hole of the cover plate 43 are flush with the corresponding surfaces of the cover plate 43 . Further, the surface of the light-diffusion sheet is attached to the corresponding surface of the first support member 411 .

Alternatively, the wedge-shaped groove 431 can be provided on part of the circumference of the light-diffusing sheet for snapping and fixing the light-diffusing assembly 110 on the cover plate 43 . Alternatively, a wedge-shaped groove 431 may be provided around the light-diffusing component 110, such as a light-diffusing sheet, at multiple relative positions, such as at the three corners of an equilateral triangle, the four corners of a square, etc., for engaging. Fix the light distribution component 110.

In addition to the snap-on fixation method, the light-diffusion sheet can also be connected to the cover plate 43 through other fixation methods, such as bonding.

The thickness of the cover plate 43 is not less than the thickness of the light uniformity component 110 . In this embodiment, the thickness of the cover plate 43 is the same as the thickness of the uniform light component 110 .

In some embodiments of the present application, a substrate 6 is provided on the circuit board 5, and the spectrum chip 20 can be provided with placed on the substrate 6.

In some embodiments of the present application, a protective cover may also be provided on the cover plate 43 to protect the cover plate 43 and the light uniformity component 110 provided in the cover plate 43 . The protective cover can be a housing covering the cover plate 43 , or can be configured as a flat protective plate, which is, for example, fitted to the cover plate 43 . The protective cover may be a Fresnel lens or cover glass.

Compared with the embodiment shown in FIG. 16 , the embodiment shown in FIG. 18 is provided with nine apertures 120 in the form of a 3×3 array in the first support 411 . Therefore, as shown in the optical path diagram of FIG. 19 , the incident After the light is uniformed through the uniform light plate, it directly enters the nine apertures 120, thereby passing through the corresponding apertures 120 in nine split light paths and continuing to introduce subsequent optical filters, and finally illuminates the light modulation of the spectrum chip 20 on layer 220.

Different from the situation where the aperture 120 is provided, the spectrum sensor module here uses multiple apertures 120 to guide the incident light that has been homogenized by the uniform light component 110. Each aperture 120 forms its own separate light splitting path to detect the incident light. Obtain the best light angle and light amount before reaching the corresponding sensing unit respectively. These diaphragms 120 are provided in the first support member 411 , and are particularly configured as through holes penetrating the first support member 411 along the optical path direction of incident light. The filter component 130 is disposed on the light exit side of the diaphragms 120 . In particular, the surface of the filter component 130 is in contact with the surface of the first support member 411 on the light exit side of the diaphragm 120 . By setting multiple apertures 120 in different numbers and arrangements, the incident light path, frequency, wavelength, angle, etc. can be personalized according to different spectral sensor application scenarios, light environment characteristics to be measured, and sensor photoelectric characteristics requirements. Thus, desired, accurate and stable image imaging and/or spectral imaging information is obtained.

To express clearly here, Figure 20 is a cross-sectional view of the spectrum sensor module cut along the center line of the middle row of aperture holes. In this embodiment, the first support member 411 and the second support member 412 are integrally constructed and thus form an integrated base. The diaphragm 120 may be configured in an area of the base opposite to the light-diffusing component 110 , for example, configured as a light-transmitting diaphragm hole. See Figure 20. The first support member 411 and the second support member 412 are made of the same material, and may be integrally processed in the same process, for example. Therefore, the first support 411 and the second support integrally form a housing 41, which supports the cover 43 and the diffuser embedded in the cover 43 at one end, and is connected to the circuit board 5 or the bottom plate at the other end. A circuit board 5 for mounting the spectroscopic chip 20 can be arranged on this base plate. Alternatively, the first support member 411 , the second support member 412 and the base plate may also be made in one piece, thereby forming the housing 4 of the spectrum sensor module.

By using the integral housing 41, on the one hand, the manufacturing and assembly process of the spectrum sensor module can be simplified, on the other hand, it is helpful to ensure the precise size and shape of the housing of the spectrum sensor module, and is conducive to the accuracy of the optoelectronic components. Positioning to avoid adversely affecting the quality of spectral imaging and image imaging.

Furthermore, the bottom plate 42 can also be made integrally with the housing 41 composed of the first support member 411 and the second support member 412 . The first support member 411 , the second support member 412 and the bottom plate 42 thus form the can-shaped housing 4 of the spectrum sensor module, or form an integral part of the housing 4 .

In this embodiment, the diaphragm 120 and the filter assembly 130 are provided in the first support 411 . For example, in the A support member 411 is provided with a groove for accommodating the filter assembly 130, especially the filter. The optical filter can be embedded into the groove of the first support member 411, especially the outer surface of the filter is flush with the edge of the groove, so that the optical filter and the first support member 411 form a neat appearance, which is beneficial to Install other optoelectronic components in the housing 4 to avoid adverse effects on the optical path and imaging process.

In the embodiment shown in FIG. 21 , the light uniformity component 110 is also embedded in the cover plate 43 . However, what is different from the previous embodiment is that the narrow end of the tapered hole as the wedge-shaped groove 431 is located on the inner surface of the cover plate 43, that is, the surface facing away from the incident light, or in other words, the surface facing the first support member 411; The wide end of the tapered hole is located on the outer surface of the cover plate 43, that is, the surface facing the incident light.

Similarly, along the optical path direction of the incident light, the two side surfaces of the light diffuser embedded in the tapered hole of the cover plate 43 are flush with the surface of the cover plate 43 respectively. Further, the surface of the light-diffusion sheet is attached to the corresponding surface of the first support member 411 .

Through such a structural form, on the one hand, all free ends of the light distribution component 110 are limited by the first support member 411 and the wedge-shaped groove 431, so that it can be accurately fixed and positioned; on the other hand, it can achieve contact with the surface of the first support member 411 and the wedge-shaped groove 431. The inner circumferential surface of the casing is tightly fitted, which is conducive to waterproofing and dustproofing and the uninterrupted transmission of light; on the other hand, this structure can embed the light-diffusion component 110 into the wedge-shaped groove 431 of the first support member 411 from the outside of the casing. , which helps simplify the installation and maintenance process.

Furthermore, the diaphragm 120 and the filter assembly 130 are provided in the first support 411 . In this embodiment, an aperture 120 is provided in the first support 411 , for example configured as a through hole in the first support 411 . For example, a groove for accommodating the filter assembly 130, especially a filter, is provided in the first support member 411, and the groove corresponds to the position where the aperture 120 is provided in the first support member 411. The optical filter can be embedded into the groove of the first support member 411, especially the outer surface of the filter is flush with the edge of the groove, so that the optical filter and the first support member 411 form a neat appearance, which is beneficial to Install other optoelectronic components in the housing and avoid adverse effects on the optical path and imaging process.

In the embodiment shown in FIG. 21 , the first support member 411 and the second support member 412 may be integrally constructed. The first support member 411 and the second support member 412 may be made of the same material, and may be made of the same material, for example. Processed as a whole in the process. Therefore, the first support 411 and the second support integrally form a housing 41, which supports the cover 43 and the diffuser embedded in the cover 43 at one end, and is connected to the circuit board 5 or the bottom plate 42 at the other end. , the circuit board 5 for placing the spectrum chip 20 can be disposed on the base plate 42 .

In the embodiment shown in FIG. 22 , the uniform light component 110 is also embedded in the cover plate 43 . However, what is different from the previous embodiment is that the cover plate 43 is provided with a stepped hole 433. The steps of the stepped hole 433 match the shape of the light uniforming component 110. The light uniforming component 110 can be embedded in the stepped hole 433. , thereby positioning and fixing the uniform light component 110, while allowing the subject light to pass through the uniform light component 110, such as a uniform light plate. Optionally, the inner surface of the light diffusion sheet embedded in the step hole 433 of the cover plate 43 is flush with the inner surface of the cover plate 43 . Further, the circumferential edge of the outer surface of the light diffusion plate embedded in the step hole 433 of the cover plate 43, that is, the circumferential edge of the surface facing the incident light, is The edge of the step hole 433 of the cover plate 43 is covered, so that the cover plate 43 forms a wrapping structure 432 for the diffuser embedded therein. The advantage of this structural form is that the connection part between the uniform light component 110 and the cover 43 can be sealed higher through the wrapping structure 432 to prevent fog, water vapor, rainwater, etc. from intruding into the interior of the spectrum sensor module.

In this embodiment, an aperture 120 is also provided in the first support 411 , for example, configured as a through hole in the first support 411 . Optionally, the central axis of this through hole coincides with the optical axis of the imaging optical path of the spectrum chip 20 , which is beneficial to optimizing the incident angle and uniform light intensity.

Advantageously, the surface of the light diffusion sheet can be bonded with the corresponding surface of the first support member 411 . Furthermore, in this embodiment, the diaphragm 120 and the filter assembly 130 are provided in the first support 411 . For example, a groove for accommodating the filter assembly 130 , especially the filter, is provided in the first support 411 . The optical filter can be embedded into the groove of the first support member 411, especially the outer surface of the filter is flush with the edge of the groove, so that the optical filter and the first support member 411 form a neat appearance, which is beneficial to Install other optoelectronic components in the housing and avoid adverse effects on the optical path and imaging process.

This application also proposes a spectrum sensor module, which includes the spectrum sensor and a housing 4. The spectrum chip 20 and the optical component 10 of the spectrum sensor are placed in the housing 4.

As shown in FIG. 23 , the optical component 10 is directly fixed in the housing 4 of the spectrum sensor module and is arranged on the optical imaging path of the spectrum chip 20 . Specifically, the housing 4 of the spectrum sensor module is an integral structure, which is processed in the same process using the same material, for example. Overall, the housing 4 of the spectrum sensor module is an integrated columnar or cylindrical structure, and its geometric symmetry axis is coaxial with the incident light imaging optical path. In this embodiment, an aperture 120 is also provided in the first support member 411, which can also achieve the beneficial effects described above in conjunction with the aperture. Here, the diaphragm can be a light-transmitting hole in a light-shielding coating (for example, a metal coating). The light-shielding coating is, for example, attached to the surface of the light-diffusing component 110 and/or the filter component 130 , especially the light-diffusing component. 110 and filter assembly 130 are sandwiched in between.

The housing 4 of the spectrum sensor module has an accommodating portion for accommodating and fixing the optical component 10 at one end facing the incident light. In some embodiments, the receiving portion for receiving and fixing the optical component 10 may be configured as a stepped hole 441 in the housing 4 of the spectrum sensor module. The stepped hole 441 of the housing 4 has on the one hand an opening 442 for the passage of incident light and on the other hand a step 443 for positioning and fixing the optical component 10 , wherein the step 443 is formed around the opening 442 . The entire optical component 10 can be embedded in the stepped hole 441 , and its edge can be pressed against the step 443 of the receiving portion of the housing 4 . Advantageously, the outer surface of the optical component 10 embedded in the stepped hole 441 is flush with the inner surface of the housing 4 , that is, the combination of the two forms a flat and smooth surface.

Further, the optical component 10 is embedded in the receiving portion of the housing 4 of the spectrum sensor module, and the circumferential edge of the outer surface of the optical component 10, that is, the circumferential edge of the surface facing the incident light, It can be covered by the side wall of the opening 442 of the receiving portion, whereby the receiving portion of the housing 4 forms a wrapping structure for the optical component 10 embedded therein. This wrapping structure can be achieved, for example, by a chamfering structure on the side wall of the opening 442 of the receiving portion of the housing 4 or This is achieved by expanding the hole structure. The advantage of this structural form is that the connection between the uniform light component 110 and the cover plate 43 can be sealed more highly through this wrapping structure, thereby preventing fog, water vapor, rainwater, etc. from intruding into the interior of the spectrum sensor module.

The optical component 10 includes a uniform light component 110, an aperture 120 and an optional filter component 130, which are sequentially stacked along the imaging optical path of the incident light to form a sandwich-type overall structural unit. The diaphragm 120 may be a light-transmitting diaphragm hole in a separately provided light-shielding layer 150 . This integral structural unit can be embedded into the receiving portion (for example, the stepped hole 441 ) of the housing 4 through form locking, material locking or force locking. Advantageously, the inner surface of the light-diffusion component 110 , that is, the surface facing the inside of the housing 4 , is flush with the inner surface of the housing 4 itself.

Optionally, the receiving portion of the housing 4 is configured as a boss 444 on the housing 4 . That is to say, the receiving portion of the housing 4 protrudes from the overall outline of the housing 4 on the imaging optical path, for example, refer to the perspective view of the housing 4 shown in FIG. 25 . Such a structure is conducive to increasing the internal space of the housing and facilitating the arrangement and installation of other optoelectronic components.

Similarly, as shown in FIG. 24 , the optical component 10 may also be provided with multiple apertures 120 . The diaphragm 120 may be a light-transmitting diaphragm hole in a separately provided light-shielding layer 150 . Alternatively, the aperture 120 of the optical assembly 10 may also be configured as an aperture in an opaque coating (such as a coating, especially a metal coating), which may be coated on the The upper surface and/or the lower surface of the light uniformity component 110, or the upper surface and/or the lower surface of the optional filter component 130.

In some embodiments, the housing 4 is also provided with a glue overflow groove 446, see Figure 24. The glue overflow groove 446 is used to guide and accommodate craft glue. The glue overflow groove 446 may be configured in the housing 4 , especially near the receiving portion for receiving and fixing the optical component 10 , for guiding and receiving glue that may flow out when bonding the optical component 10 , for example. Adhesive or glue. In some embodiments, the glue overflow groove 446 is configured in the housing 4 along the periphery of the accommodating portion for accommodating and fixing the optical component 10 , and is particularly configured as an annular groove structure. Optionally, the glue overflow groove 446 in the housing 4 can also be configured as a chamfer of the peripheral edge of the receiving portion for accommodating and fixing the optical component 10, formed by this chamfering structure. Gap or notch to accommodate glue spillage.

In addition, as shown in Figure 25, in the housing 4, for example, in the upper end surface of the housing 4, an exhaust hole 445 can also be provided, which can connect the internal space of the housing and the external environment to each other, thereby achieving The balance of pressure inside and outside the casing ensures the public welfare of the spectrum sensor module during the manufacturing process and the stability during the working process. Optionally, the exhaust hole 445 can also be provided with a plug, which can close and seal the exhaust hole 445 when necessary to avoid unnecessary contamination and impact on the interior of the housing.

Referring to Figure 26, in other embodiments of the spectrum sensor module of the present application, a light-transmitting protective layer is also provided on the light modulation layer 220 of the spectrum chip 20, and a light-transmitting protective layer is provided on the light-transmitting protective layer. Media component 7. The dielectric component 7 is a dielectric material with high light transmittance.

Here, the media component 7 can provide both mechanical and optical functions. Structurally, the medium component 7 is disposed between the light modulation layer 220 of the spectrum chip 20 and the optical component 10, and supports the optical component 10, especially the uniform light component 110. The refractive index of the highly transparent dielectric material is related to the thickness of the dielectric material.

As the filter component 130 , a filter layer may be disposed on the light incident surface of the dielectric material, and the filter layer may be bonded to the light incident surface of the media component 7 .

The specific structural measures such as the uniform light component 110, the diaphragm 120, the filter component 130 and the housing 4 of the optical component 10 described in connection with the previous embodiment are also applicable to this embodiment and will not be described again.

The adhesive material used to bond the filter layer and the media component 7 is light-transmissive. In this embodiment, the incident light passes through the uniform light component 110 and the diaphragm 120 disposed behind the uniform light component 110 , continues through the medium component 7 , and reaches the light modulation layer 220 of the spectrum chip 20 .

Furthermore, the incident light can also pass through the uniform light component 110 and the diaphragm 120 provided below the uniform light component 110, continue to pass through the filter component 130 on the medium component 7, filter the light, and then enter the medium component 7, and then reaches the light modulation layer 220 of the spectrum chip 20 .

In some embodiments, the diaphragm 120 may be configured as an aperture in a coating, and the coating may be coated on the light entrance side surface and/or the light exit side surface of the uniform light component 110 . The coating is made of a light-shielding material, such as a metal coating, especially a chromium plating layer, thereby forming an opaque coating. Light can pass through the light-transmitting apertures in the coating, and these light-transmitting apertures also become light-transmitting apertures, the shape, number, and arrangement of which are described in detail later. In addition, the coating may also be deposited on the light-incident side surface and/or the light-exit side surface of the filter component 130 . In this embodiment, metal plating is taken as an example for description.

The coating may be a composite structure, for example, including one or more coatings. The one or more coatings are stacked on each other, and are correspondingly processed with light-transmitting aperture holes, thereby forming an integral coating with an aperture. Different coatings of the coating can be made of different materials, so that through combinations of coatings and materials, different physical and optical properties of the coating and the aperture can be achieved. The description of the characteristics of the coating here is particularly applicable to all the above exemplary embodiments described in conjunction with the spectral sensor module.

Some embodiments of the first design approach of the present application also provide an electronic device, including a spectrum sensor module. The spectral information obtained through the spectral sensor module of the electronic device can be used to recover ambient light parameters such as color temperature, illumination, and brightness.

The electronic device may include one or more processors and memory. The processor may be a central processing unit

(CPU) or other forms of processing units with data processing capabilities and/or instruction execution capabilities, and can control other components in the electronic device to perform the functions of the spectrum sensor or the spectrum sensor module. The memory may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and/or non-volatile memory. Relevant control instructions or programs for realizing spectral imaging and/or image imaging may be stored in the memory.

Referring to Figures 27 to 31 of the accompanying drawings of this application, a spectrum sensor according to the first preferred embodiment of the second design solution of this application is clarified in the following description. The spectrum sensor includes a spectrum chip 100' and a light The optical component 200' is located in the photosensitive path of the spectrum chip 100'. The spectrum chip 100' includes a photodetection layer 110' and a light modulation layer 120' located on the photosensitive path of the photodetection layer 110', wherein the photodetection layer 110' is configured to obtain information passing through the light modulation layer. 120' modulated optical signal. The optical component 200' is configured to receive light signals from the photographed object and guide the light signals to the spectrum chip 100'. The optical component enables each pixel unit guided to the spectrum chip 100' to have a fixed incident angle and uniform light intensity, thereby improving the accuracy of spectrum recovery of the spectrum sensor.

In the spectrum sensor of the second design embodiment of the present application, the spectrum chip 100' includes a filter structure 10' and an image sensor 20'. The filter structure 10' is located on the photosensitive side of the image sensor 20'. On the path, the filter structure 10' is a broadband filter structure 10' in the frequency domain or wavelength domain. The pass spectra of different wavelengths of each filter structure 10' are not exactly the same. The filter structure 10' can be a metasurface, photonic crystal, nano-column, multi-layer film, dye, quantum dot, MEMS (micro-electromechanical system), FP etalon (FP etalon), cavity layer (resonant cavity layer), waveguide layer (Waveguide layer), diffractive elements and other structures or materials with filtering properties. For example, in the embodiment of the present application, the light filter structure 10' may be the light modulation layer in Chinese patent CN201921223201.2.

Figure 27 shows a schematic diagram of a spectrum chip of the spectrum sensor according to the second design embodiment of the present application, wherein the spectrum chip is one disclosed by the applicant of the present application in Chinese patent CN201921223201.2 Spectral chip. Based on the contents of the Chinese patent CN201921223201.2, it can be known that the spectrum chip 100' includes a photodetection layer 110' and a light modulation layer 120' maintained on the sensing path of the photodetection layer 110'. In particular, the light modulation layer 120' includes at least one modulation unit 121', and each modulation unit 121' corresponds to at least one sensing unit 111' of the photoelectric detection layer 110', wherein the spectrum chip 100' utilizes The modulation unit 121' of the light modulation layer 120' modulates the optical signal from the measured target to obtain a modulated optical frequency signal, and uses the photoelectric detection layer 110' to receive the modulated optical frequency signal and A differential response is provided to it, and then the signal circuit processing layer of the spectrum chip 100' is used to reconstruct the differential response to obtain the original spectral information of the measured target. In some specific examples, the light modulation layer 120' includes at least one modulation unit 121' and at least one non-modulation unit, and each modulation unit 121' and each non-modulation unit respectively correspond to the photodetection layer. At least one sensing unit 111' of 110', that is, the modulation unit 121' and the sensing unit 111' can be arranged in a one-to-one correspondence, a one-to-many arrangement, or even a many-to-one arrangement, so The non-modulation unit and the sensing unit 111' may be arranged in a one-to-one correspondence, a one-to-many arrangement, or even a many-to-one arrangement.

As shown in FIG. 28 , the optical component 200 ′ is located on the photosensitive path of the image sensor 20 ′. After the light is adjusted by the optical component 200 ′ and then modulated through the filter structure 10 ′, the light is passed by the image sensor 20 'Receive and obtain spectral response; the optical component 200' can be but is not limited to optical components such as lens components and uniform light components. As an example, in this preferred embodiment of the present application, the image sensor 20' of the spectrum chip 100' may be a CMOS image sensor 20' (CIS), CCD, array light detector, etc. The spectrum sensor further includes a data processing unit, which may be an MCU, CPU, GPU, FPGA, NPU, ASIC or other processing unit, which may export the data generated by the image sensor 20' to the outside for processing.

As an example, after the image sensor 20' measures the spectral response, the data is transmitted to the data processing unit to calculate the recovered spectral information of the incident light. The process is described in detail as follows:

The intensity signals of the incident light at different wavelengths λ are marked as unit, the transmission spectra of each group of structural units are different from each other. Overall, the filter structure 10' can be recorded as Ti(λ) (i=1,2,3,...,m). There are corresponding physical pixels below each group of structural units to detect the light intensity bi modulated by the filtered light structure 10'. In the embodiment of the present application, one physical pixel is used, that is, one physical pixel corresponds to a group of structural units. However, it is not limited to this. In other embodiments, a group of multiple physical pixels may also be a group corresponding to a group of structural units. . Therefore, in the computational spectrum sensor according to the embodiment of the present application, at least two groups of structural units constitute a "spectral pixel". It can be understood that multiple sets of structural units and corresponding image sensors constitute spectral pixels. It should be noted that the effective transmission spectrum (the transmission spectrum used for spectrum recovery, called the effective transmission spectrum) of the filter structure 10' may be inconsistent with the number of structural units. 'The transmission spectrum is manually set, tested, or calculated according to certain rules according to the needs of identification or recovery (for example, the transmission spectrum of each structural unit mentioned above is the effective transmission spectrum). Therefore, the number of effective transmission spectra of the filter structure 10' may be less than the number of structural units, or may even be greater than the number of structural units; in this variant embodiment, a certain transmission spectrum curve is not necessarily a group of structures. determined by the unit. Furthermore, this application can use at least one spectral pixel to restore the image. That is to say, the spectral sensor in this application can recover the incident light spectral curve according to the spectral response and can also perform spectral imaging.

The relationship between the spectral distribution of the incident light and the measured value of the image sensor 20' can be expressed by the following formula:
bi＝∫x(λ)*Ti(λ)*R(λ)dλ

Then discretize, we get
bi＝Σ(x(λ)*Ti(λ)*R(λ))

where R(λ) is the response of the image sensor, recorded as:
Ai(λ)=Ti(λ)*R(λ),

Then the above formula can be expanded into matrix form:

Among them, bi(i=1,2,3,…,m) is the response of the image sensor after the light to be measured passes through the filter structure, which corresponds to the measured light intensity of the image sensor corresponding to m structural units. When a physical pixel When corresponding to a structural unit, it can be understood as The measured light intensity corresponding to m physical pixels is a vector with length m. A is the light response of the system to different wavelengths, which is determined by two factors: the transmittance of the filter structure and the quantum efficiency of the image sensor. A is a matrix, and each row vector corresponds to the response of a group of structural units to incident light of different wavelengths. Here, the incident light is sampled discretely and uniformly, with a total of n sampling points. The number of columns of A is the same as the number of sampling points of the incident light. Here x(λ) is the intensity of the incident light at different wavelengths λ, which is the spectrum of the incident light to be measured.

In some embodiments, the difference from the above embodiments is that the filter structure can be directly formed on the upper surface of the image sensor, such as quantum dots, nanowires, etc., which directly form the filter structure in the photosensitive area of the sensor. Or materials (nanowires, quantum dots, etc.), taking the filter structure as an example. At this time, it can be understood that when the raw material of the image sensor is processed to form the image sensor, the filter structure is formed on the upper surface of the raw material, so The transmission spectrum and the response of the image sensor are integrated, that is, it can be understood that the response of the detector and the transmission spectrum are the same curve. At this time, there is a gap between the spectral distribution of the incident light and the light intensity measurement value of the image sensor. The relationship can be expressed by the following formula:
bi＝Σ(x(λ)*Ri(λ))

That is, in this embodiment, the transmission spectrum Ai(λ)=Ri(λ)

Furthermore, a combination of the above two embodiments may also be used, that is, at least one filter structure for modulating incident light is provided on the image sensor with a filter structure. It can be understood that the image sensor (ie, photodetector array) in the first embodiment, which can be a CMOS image sensor (CIS), CCD, array photodetector, etc., is replaced with an integrated light filter structure in the second embodiment. image sensor.

At this time, the relationship between the spectral distribution of the incident light and the light intensity measurement value of the image sensor can be expressed by the following formula:
bi＝∫x(λ)*Ti(λ)*Ri(λ)dλ

Then discretize, we get
bi＝Σ(x(λ)*Ti(λ)*Ri(λ))

In this embodiment, Ai(λ)=Ti(λ)*Ri(λ)

There are some problems in practical applications of computational spectrum chips that work based on this principle, and these problems will affect the spectrum detection performance of the spectrum chip.

In practical applications, the spectrum chip is relatively sensitive to the main light angle of the incident light signal. In actual use, changes in the main light angle of the incident light signal will greatly affect the accuracy of spectral recovery. It should be noted that the chief light angle at any specific position of the spectrum chip 100' represents the angle between the chief ray of the optical signal guided to the spectrum chip 100' and the normal line, where the chief ray represents The normal line represents a line perpendicular to the light-sensitive surface of the spectrum chip 100'. For the spectrum chip 100', the main light angles of different sensing units are allowed to be greatly different, but they are incident on the same The light rays of the sensing unit need to maintain a small angle difference, that is, the angle between the optics incident on the same sensing unit needs to be maintained at a fixed size, so that the spectral sensor can perform spectral recovery with accuracy and stability.

Therefore, in this preferred embodiment of the present application, the optical component 200' is located in the photosensitive path of the spectrum chip 100', wherein the light is transmitted through the optical component 200' in a fixed incident angle and uniform light intensity. Guided to the surface of the spectrum chip 100', so as to keep the included angle of the light incident on the same sensing unit fixed.

As shown in Figure 29, in this preferred embodiment of the present application, the spectrum chip 100' has a light-collecting light cone for the incident light signal arriving at each position on the upper surface of the light modulation layer 120' on the spectrum chip 100'. The angle also needs to remain stable and cannot have major changes. The light-collecting light cone angle is a preset angle, which can be 0° to 50°. The light-collecting light cone angles at three different positions a', b', and c' reaching the upper surface of the light modulation layer of the spectrum chip 100' remain fixed, that is, the angle θ ₁ reaching point a' each time measured is within the set range. Change or be as unchanged as possible. When reaching point b', θ ₂ changes within the setting range or remains as little as possible. When reaching point c, θ ₃ changes within the setting range or remains as unchanged as possible. At the same time, it reaches each point a' and b' as quickly as possible. , the light intensity of c' also remains uniform, or changes within a set range, and the set range is a smaller variation interval. In this way, the incident angle distribution is uniform, and the illumination distribution on the chip surface is uniform through the lens, while the angle distribution remains constant.

In this preferred embodiment of the present application, the optical component can be implemented as a uniform light component composed of an aperture and a filter, that is, the optical component 200' includes an aperture and a filter; or the optical component 200' is a uniform light component composed of an aperture, a filter, and a heat sink; or the optical component 200' is a uniform light component composed of a light diaphragm, an aperture, a filter, and a scattering sheet. It is worth mentioning that the light uniformity components include but are not limited to light uniformity sheets, light uniformity films, lens modules, etc.

As shown in Figures 30A to 31, an optical component 200' of the spectrum sensor according to the first preferred embodiment of the second design mode of the present application is clarified in the following description. The optical component 200' includes an aperture 30', a light uniformity member 40', a light through hole member 50' located in the light output path of the aperture 30', and a light through hole member 50' located in the light output path of the light through hole member 50'. Lens 60', wherein the light uniformity member 40' is located on the light incident side of the diaphragm 30', and the light uniformity member 40' uniformizes the incident light. The light-diffusing member 40' may be, but is not limited to, a light-diffusing film or a light-diffusing sheet. As an example, in this preferred embodiment of the present application, the light-diffusing member 40' is a light-diffusing film. The light uniformity member 40' is made of a diffuse scattering material, such as a polytetrafluoroethylene light uniformity film. When ambient light (incident light) is incident on the light uniformity film, a small hole is formed through the light through hole member 50' to reach the desired location. The lens 60' is then focused on the image plane through the lens 60', and the image plane is also the upper surface of the filter structural unit.

It can be understood that, between the lower surface of the filter structure 10' and the side of the image sensor 20', the incident light reaches the lower surface through the upper surface of the filter structure 10' and modulates the incident light, and then reaches The image sensor 20'.

It is worth mentioning that in this preferred embodiment of the present application, the aperture 30' can be circular, rectangular or square, depending on its use. As an example, in this embodiment, the aperture 30' is circular, and in some systems (such as camera objective lenses), a diaphragm with a variable diameter is provided. The center of the aperture generally coincides with the optical axis of the optical system, and the plane where the aperture is located is perpendicular to the optical axis.

The light uniformity member 40' of the optical assembly 200' can be a square or circular structure, which can be adjusted according to the usage scenario. Preferably, in this embodiment, a circular uniform light film with a diameter is used as an example, and the uniform light film is a polytetrafluoroethylene sheet with a thickness of 0.1-0.8 mm.

As shown in Figures 31 and 32, the light through-hole component 50' of the optical assembly 200' is located on the light exit side of the diaphragm 30', wherein the light uniformity component 40' is a scattering material made of polytetrafluoroethylene. The chip can collect radiated light within a 180° solid angle, thereby eliminating optical coupling problems caused by limitations in the light collection sampling geometry. After the light passes through the light uniformity member 40', it is further guided to the lens 60' by the light through hole member 50'. The light through-hole member 50' has a light hole 501' that passes from front to back, wherein the light through-hole member 50' further has a light entrance 502' and a light outlet 503', wherein the light through hole member The light entrance 502' and the light exit 503' of 50' are connected with the light hole 501' of the light through hole member 50', and the light entrance 502' is located on the light hole 501'. The light entrance end of the hole 501', the light exit port 503' is located at the light exit end of the light hole 501'.

The ambient light is guided to the lens 60' through the light hole 501' of the light hole member 50', and then converges to the image plane through the lens 60'. In this preferred embodiment of the present application, the light hole 501' of the light hole member 50' is a hole that is small at the front and large at the back. In detail, the aperture size of the light entrance port 502' of the light through hole component 50' is smaller than the aperture size of the light outlet port 503' of the light through hole component 50', and the light through hole component is The aperture of the 50' light hole 501' gradually increases from the light entrance 502' to the light outlet 503', guiding ambient light from the light hole member 50' to the light outlet 503' at a specific angle. Lens 60'. It is worth mentioning that in this preferred embodiment of the present application, the light through-hole member 50' has the function of limiting light beams. Assume that the aperture of the light entrance 502' of the light through hole member 50' is a1', the aperture of the light outlet 503' is b1', and the height of the light through hole member 50' is c1', where Preferably, a1' is 3mm-5mm, b1' is 5mm-10mm, and c1' is 2-4mm. The angle θ' between the aperture edge of the light inlet 502' of the light through hole member 50' and the center line of the light outlet 503' and the axis is 10°-30°. Preferably, in this preferred embodiment of the present application, the diameter size of the diaphragm 30' is 1mm to 10mm, and the focal length of the lens 60' is f=2.5mm-2.8mm.

As an example, in one embodiment of the second design solution of the present application, the light through hole component 50' is composed of several metal sheets with holes, where each aperture of the metal sheets is different in size, and the light through hole component 50' is composed of a plurality of metal sheets with holes. The aperture cross-section of the hole is trapezoidal. In other words, in this preferred embodiment of the present application, the light through-hole member 50' includes a plurality of through-hole member units 51', wherein the through-hole member units 51' are metal sheets with holes, and the light through-hole member 50' includes a plurality of through-hole member units 51'. The plurality of through-hole unit units 51' of the hole member 50' are superimposed and penetrate front and back. It is worth mentioning that each aperture of the plurality of through-hole units 51' is different in size, and the aperture of the through-hole unit gradually becomes larger from the light incident direction to the light exit direction, so as to form a cross-section of Trapezoidal light hole 501'.

Optionally, in another optional implementation of the second design solution of the present application, the light through hole member 50' is an integrally formed image structural member with a set aperture.

It is worth mentioning that in this preferred embodiment of the present application, the uniform light component 40' is made of Teflon (polytetrafluoroethylene). ene) diffusing material, optimized for the 200-800nm spectrum band. The optical components used in this application can realize the collection of solid angles with radiation angles within 150°, thereby realizing the collection of incident light with a large field of view FOV, which also solves the problem of stabilizing the angle at which the spectrum sensor acquires incident light. sex and consistency.

As shown in Figure 30A, the optical component 200' of the spectrum sensor further includes a filter 70', wherein the filter 70' is located at the light exit end of the lens 60' along the direction of light propagation, The optical filter 70' can filter light of a specific wavelength band and selectively transmit light of part of the wavelength band to reduce the impact of stray light on the spectral recovery results. Optionally, as shown in Figure 30B, in another optional embodiment of the present application, the optical filter is located at the light incident end of the lens 60', that is, after the incident light passes through the optical filter 70' Reach the lens 60'.

A sensor device according to another aspect of the present application is illustrated in the following description with reference to FIGS. 33A to 34 of the accompanying drawings of the present application. The sensor device is a specific structural embodiment of the above-mentioned spectral sensor. The sensor device includes a spectrum chip 100', an optical component 200' and a circuit board 300', wherein the spectrum chip 100' is disposed on the circuit board 300' and is electrically connected to the circuit board. The component 200' is disposed on the photosensitive path of the spectrum chip 100'. It is worth mentioning that the specific structures of the spectrum chip 100' and the optical component 200' are the same as the above-mentioned first preferred embodiment, and will not be described again here.

The circuit board 300' may be, but is not limited to, a PCB board, wherein the spectrum chip 100' is fixed on the surface of the circuit board 300', and the angle forming the FOV is within 150°, that is, the spectrum chip 100' collects 150 ° range of ambient light. Preferably, in this preferred embodiment of the present application, the spectrum chip 100' is an image sensor CIS with the filter structure.

The uniform light component 40' of the optical component 200' is a strong uniform light dispersion sheet made of polytetrafluoroethylene material, wherein the lens of the optical component 200' is located in the light through hole component 50' The light hole 501'. The sensor device further includes a base 400', wherein the base 400' is disposed above the circuit board 300', and the light through-hole member 50' is disposed on the base 400' and passes through the base. 400' is fixed above the circuit board 300'. That is to say, in this preferred embodiment of the present application, the optical assembly 200' is fixedly arranged above the circuit board 300' by the base 300', and the optical assembly 200' is connected to the circuit board 300' through the base 300'. The light through-hole component 50', the light uniformity component 40' and the lens 60' of the assembly 200' are maintained in the photosensitive path of the spectrum chip 100'. That is to say, the light through-hole member 40', the light-diffusing member 40' and the lens 60' of the optical assembly 200' are fixed through the base 300', so that the light-diffusing member 40', The light hole 501' of the light hole member 50' and the lens 60' are located in the same optical path.

The light diffusion plate 40' of the optical assembly 200' is fixed on the light incident side of the light through hole member 50'. As an example, the sensor device further includes a fixing part 500', wherein the light uniformity sheet 40' of the optical assembly 200' is fixed to the base 400' by the fixation part 500'; or the light uniformity The piece 40' is fixed to the light through hole member 50' by the fixing member 500'.

It can be understood that in this preferred embodiment of the present application, the fixing member 500' can be implemented as a clamping element, The light-diffusion sheet 40' is clamped by the fixing member 500', and one end of the fixing member 500' is fixedly connected to the base 400'. 40' is maintained on the light incident side of the light through hole member 50'. Optionally, in other optional embodiments of the present application, the fixing member 500' may be implemented as other forms of elements, such as screws, adhesive members, etc. Therefore, in this preferred embodiment of the present application, the specific implementation of the fixing member 500' is only used as an example and not a limitation.

The light through-hole component 50' of the optical assembly 200' is fixed to the base 400', wherein the base 400' is provided with a threaded slot corresponding to the light through-hole component 50' for The metal sheet of the light through hole member 50' is fixed, and the plurality of metal sheets are stacked together to form the light through hole 501'.

The lens 60' is disposed at the lower end of the light through-hole member 50'. It is worth mentioning that the lens 60' is disposed at a position consisting of the light-diffusing member 40' and the light through-hole member 50'. And the light modulation layer that needs to be achieved is determined. As an example, in this embodiment, when the focal length of the lens 60' is 2.54 mm, the thickness of the sensor device is 7.15 mm. The parameters in this embodiment are examples and are not specifically limited in practical applications. The thickness of the uniform light sheet and the focal length of the lens can be adjusted according to sensor devices with different thicknesses, and the uniform light can also be fixed on the base. Adjust the thickness of the supporting piece of the piece.

As shown in Figure 33A and Figure 33B, in this preferred embodiment of the present application, the optical filter 70' is disposed on the light entrance side or the light exit side of the lens 60', wherein when the optical filter 70 When 'is disposed on the light incident side of the lens 60', the filter 70' is fixedly disposed on the light through hole member 50'. As an example, in this preferred embodiment of the present application, the optical filter 70' is fixed to the light hole 501' by the light through hole member 50', and the light through hole member 50' will The filter 70' is held at the front end of the lens 60'. As shown in Figure 33B, optionally, in another optional embodiment of the present application, the optical filter 70' is disposed at the exit end of the lens 60', wherein the optical filter 70' is It is fixed at the end of the light through hole member 50', and the light through hole member 50' holds the optical filter 70' at the light exit end of the lens 60'. Preferably, in another optional embodiment of the present application, the optical filter 70' can be fixed at the end of the light through hole member 50' through a fixing member 70', or the optical filter 70' The optical filter 70' can be fixed on the upper surface of the base 300' through a fixing member, and the optical filter 70' can be supported on the light exit end of the lens 60' through the base 300'.

It is worth mentioning that in some scenes with a large field of view FOV, the preset angle can be 35°-40°. In this preferred embodiment of the present application, the light-receiving light cone angle of the sensor device has a certain degree of tolerance, and its light-receiving light cone angle is within ±5°. That is to say, in this preferred embodiment of the present application, the main light angle and the light receiving light cone angle of each sensing unit of the spectrum chip are controlled through the optical assembly 200' with a specific structural configuration. The main light angle of the spectrum chip should take a fixed value, wherein the light-collecting light cone angle is a predetermined angle, and the predetermined angle is less than or equal to 45°, so as to reduce the spectrum recovery error of the spectrum chip.

As shown in Figure 35, it is the transmission spectrum of the response curve of the surface of the spectrum chip 100' under different incident angles. Through the corner test, the incident angle is in the range of 0-50°, the spectrum chip 100' only changes in intensity, and the uniformity can still be Being consistent indicates that the angular distribution on the surface of the spectrum chip 100' has not changed, thereby improving the optical component 200' and eliminating the angular sensitivity.

Furthermore, the spectrum sensor provided by this application can modulate the incident light signal through the light modulation layer 120' of the spectrum chip, and restore the obtained spectral information of the incident light through the recovery algorithm as described below. According to the obtained incident light spectrum The information is used to calculate color temperature values and illumination information based on the response to incident light.

As shown in Figure 36, the spectral imaging sensor acquires color temperature sensing information with spatial information, where the spatial information can be two-dimensional spatial information or three-dimensional spatial information. The spectral information is consistent with the image information acquired by the image sensor. form a spectral cube. The spectrum chip 100' of the spectrum sensor can obtain color temperature information with spatial information. By using a structure (sensor) to collect spectral information, the color temperature is calculated based on the spatial information of each pixel and the corresponding spectral information.

The color coordinates and illumination information can be calculated based on the obtained spectral information curve, specifically as follows:

where k is the planning coefficient, used to limit the maximum value of Y to 100, φ(λ) is the expression of the spectral curve, Color standard for the XYZ color space specified by CIE.

The CIE RGB space can be used to define chromaticity in a conventional way: the chromaticity coordinates are r and g:

In this embodiment, the chromaticity coordinates x, y, and CCT can be calculated through the obtained spectral information X and Y. Through the spectral sensor and homogenizing the light at a large FOV angle, the spectral information of the incident light can be obtained more accurately, so as to more accurately obtain the spectral information of the incident light. Add accurate calculations to get the chromaticity value.

Referring to Figures 37 to 44 of the accompanying drawings of this application, the spectrum sensor module according to the first preferred embodiment of the third design solution of this application will be elucidated in the following description. The spectrum sensor module includes a spectrum sensor 10", a lens assembly 20", a circuit board 3" and a base 4", wherein the circuit board 3" is electrically connected to the spectrum sensor 10", and the lens assembly 20" Located on the photosensitive side of the spectrum sensor 10", the spectrum sensor 10", the lens assembly 20" and the circuit board 3" are fixed to the base 4", and are supported and fixed by the base 4" The spectrum sensor 10" and the lens assembly 20".

The spectrum sensor 10" includes a spectrum chip 11" and an optical component 12", wherein the optical component 12" is located at the front end of the photosensitive path of the spectrum chip 11". The spectrum chip 11" includes a photoelectric detection layer 110" and A light modulation layer 120" located on the photosensitive path of the photodetection layer 110", wherein the photodetection layer 110" is configured to obtain an optical signal modulated by the light modulation layer 120". The optical component 12" Configured to receive the light signal from the photographed target and guide the light signal to the spectrum chip 11". The optical component causes each pixel unit guided to the spectrum chip 11" to have a set The incident angle and uniform light intensity thereby improve the accuracy of spectral recovery of the spectrum sensor module.

In the spectrum sensor module of the third design embodiment of the present application, the spectrum chip 11″ includes a filter structure 101″ and an image sensor 102″, and the filter structure 101″ is located on the image sensor 102″. On the photosensitive path, the filter structure 101″ is a broadband filter structure in the frequency domain or wavelength domain. The pass spectra of different wavelengths of each filter structure 101" are not exactly the same. The filter structure 101" can be a metasurface, photonic crystal, nano-column, multi-layer film, dye, quantum dot, MEMS (micro-electromechanical system), FP etalon ( FP etalon), cavity layer (resonant cavity layer), waveguide layer (waveguide layer), diffractive elements and other structures or materials with light filtering properties. For example, in the embodiment of the present application, the filter structure 101″ may be the light modulation layer in Chinese patent CN201921223201.2.

Figure 37 shows the structure of a spectrum chip of the spectrum sensor module according to the third design embodiment of the present application. The spectrum chip 100" includes a photoelectric detection layer 110" and is held on the photoelectric detection layer 110". The light modulation layer 120" on the sensing path of the detection layer 110". In particular, the light modulation layer 120″ includes at least one modulation unit 121″, and each modulation unit 121″ corresponds to at least one sensing unit 111″ of the photoelectric detection layer 110″, wherein the spectrum chip 100″ utilizes The modulation unit 121" of the optical modulation layer 120" modulates the optical signal from the measured target to obtain a modulated optical frequency signal, and uses the photoelectric detection layer 110" to receive the modulated optical frequency signal and A differential response is provided to it, and then the signal circuit processing layer of the spectrum chip 100″ is used to reconstruct the differential response to obtain the original spectral information of the measured target. In some specific examples, the light modulation layer 120″ includes at least one modulation unit 121″ and at least one non-modulation unit, and each modulation unit 121″ and each non-modulation unit respectively correspond to the photodetection layer. At least one sensing unit 111" of 110", that is, the modulation unit 121" and the sensing unit 111" can be arranged in a one-to-one correspondence, or in a one-to-many arrangement, or even in a many-to-one arrangement. The non-modulation unit and the sensing unit 111″ may be set up in one-to-one correspondence, or may be set up in one-to-many set-up, or even may be set up in many-to-one set-up. Set.

The optical component 12" is located on the photosensitive path of the image sensor 102". After the light is adjusted by the optical component 12" and then modulated through the filter structure 101", it is received by the image sensor 102" to obtain a spectral response. ; The optical component 12" may be, but is not limited to, a lens component, a uniform light component, and other optical components. As an example, in this preferred embodiment of the present application, the image sensor 102" of the spectrum chip 11" can be a CMOS image sensor 102" (CIS), CCD, array light detector, etc. The spectrum sensor The spectrum chip 11" further includes a data processing unit 103". The data processing unit 103" can be a processing unit such as MCU, CPU, GPU, FPGA, NPU, ASIC, etc., which can export the data generated by the image sensor 102" Process it externally.

In practical applications, the spectrum chip 11" is relatively sensitive to the main light angle of the incident light signal. In actual use, changes in the main light angle of the incident light signal will greatly affect the accuracy of spectral recovery. What needs to be explained Yes, the chief light angle at any specific position of the spectrum chip 11" represents the angle between the chief ray of the light signal directed to the spectrum chip 11" and the normal line, where the chief ray represents the angle from the subject The normal line represents the line perpendicular to the photosensitive surface of the spectrum chip 11 ″. "In terms of the angle, the main light angle of different sensing units is allowed to be greatly different, but the light incident on the same sensing unit needs to maintain a small angle difference, that is, the optical angle incident on the same sensing unit is kept fixed. The size can ensure the accuracy and stability of spectral recovery by the spectral sensor module.

Therefore, in this preferred embodiment of the present application, the optical component 12" is located in the photosensitive path of the spectrum chip 11", wherein the light is transmitted through the optical component 12" with a set incident angle and uniform light intensity. guide to the surface of the spectrum chip 11″ in order to keep the included angle of the light incident on the same sensing unit fixed. It can be understood that the light-collecting light cone angle of the spectrum chip 11" when the incident light signal reaches each position on the upper surface of the light modulation layer 120" on the spectrum chip 11" also needs to be stable and cannot have a larger angle. change.

As shown in Figure 41, the optical component 12" includes a uniform light device 122", an aperture 123", a lens 124" and a filter element 125" arranged sequentially along the optical axis direction from the light entrance side to the light exit side. The light reaches the spectrum chip 11" after passing through the uniform light device 122", the diaphragm 123", the lens 124" and the filter element 125" of the optical component 12" in sequence. The light uniforming device 122" of the assembly 12" is used to uniformize the incident light. In this preferred embodiment of the present application, the light uniforming device 122" can be, but is not limited to, a light uniformizing sheet or a light uniforming film. The diaphragm 123" is located on the light exit side of the light uniformity device 122", wherein the diaphragm 123" has an aperture, and the diaphragm hole of the diaphragm 123" is in contact with the light uniformity device 122" Opposite in the axial direction. The aperture 123" may be circular, rectangular or square, depending on its purpose. In this embodiment, the aperture is circular. In some systems (such as camera objective lenses), a diaphragm with a variable diameter is provided. The center of the aperture generally coincides with the optical axis of the optical system, and the aperture plane is perpendicular to the optical axis.

As shown in Figure 41, in this preferred embodiment of the present application, let the thickness of the uniform light device 122" be a, the thickness of the diaphragm 123" be b, and the lower surface of the diaphragm 123" and the The distance between the light incident surface of the lens 124" is c, the distance between the light exit surface of the lens 124" and the upper surface of the spectrum chip 11" is d, the diameter of the aperture 123" is e, And the divergence angle is θ", where the radius length of the imaging surface of the spectrum sensor module is Y ₂ and satisfies the following relationship:

Y ₂ =(1-d/c)Y ₁ +(b+c-bd/c)Y _2, where Y ₁ is e, and θ” is the divergence angle of the light-emitting surface of Y ₁ .

Optionally, in another optional embodiment of the present application, the optical component 12" includes a uniform light device 122", an aperture 123" and a light filter arranged in sequence from the light entrance side to the light exit side along the optical axis direction. Element 124". Optionally, in another optional embodiment of the present application, the optical component 12" includes a uniform light device 122", an aperture 123", a light filter, and a light uniformity device 122" arranged in sequence from the light entrance side to the light exit side along the optical axis direction. element 125" and a scattering sheet (not shown in the figure).

Preferably, in this preferred embodiment of the present application, the diaphragm 123″ and the light uniformity device 122″ are attached to each other, that is, the diaphragm 123″ is attached to the light uniformity device 122″. the light-emitting side. Optionally, in another optional embodiment of the present application, there is a gap between the aperture 123" and the light uniformity device 122", that is, there is a gap between the aperture 123" and the light uniformity device 122 "Doesn't fit. It should be noted that the distance between the aperture 123" and the light uniformity device 122" affects the distance between the lens 124" and the spectrum chip 11", that is, when the aperture 123" and the light uniformity device 122" When the device 122″ is not attached, the distance between the lens 124″ and the spectrum chip 11″ becomes smaller.

As shown in Figure 42, in this preferred embodiment of the present application, the light uniforming device 122" is a light uniforming film, wherein the light uniforming film is a light uniforming film made of a diffuse scattering material such as polytetrafluoroethylene. When ambient light (incident light) is incident on the uniform light device 122", it reaches the lens 124" through the aperture hole of the aperture 123", and then is refracted to the filter through the lens 124" The elements 125" finally converge on the image plane, which is also the photosensitive surface of the filter structure 101" of the spectrum chip 11". The backlight surface of the filter structure 101" is on one side of the image sensor 102". The incident light reaches the backlight surface through the photosensitive surface of the filter structure 101" and modulates the incident light, and then reaches the image sensor 102". .

It should be noted that in this preferred implementation of the present application, the optical component 12″ can collect light within a radiation angle of 0 to 170° solid angle to achieve incident light collection of a large field of view FOV, that is, This solves the problem of stability and consistency of the angle at which the spectrum sensor 10" acquires incident light.

It is worth mentioning that the filter element 125″ is located between the spectrum chip 11″ and the lens 124″, which is beneficial to improving the performance of the long wavelength band. As an example, in this preferred embodiment of the present application , the filter element 125" is disposed close to the light incident side of the spectrum chip 11". Optionally, in another optional embodiment of the present application, the filter element 125" is disposed close to The light-emitting side of the lens 124″. Optionally, in another optional embodiment of the present application, the filter element 125″ is disposed between the lens 124″ and the spectrum chip 11″.

It is worth mentioning that in this preferred embodiment of the present application, the filter element 125″ is disposed between the lens 124″ and the spectrum chip 11″. Compared with the filter element 125 " is disposed between the lens 124" and the diaphragm 123", which is more conducive to the recovery of the spectrum. As shown in Figure 44, when the filter element 125" is disposed between the lens 124" and the spectrum chip 11", the long-wavelength incident light reaches the light spot of the spectrum chip 11" (circle A in the figure) Greater than the light spot obtained by placing the filter element 125" between the diaphragm 123" and the lens 124" (in the figure Circle B) should be larger. The more effective spectral recovery data collected, the more conducive to spectral recovery. In particular, in this preferred embodiment of the present application, based on the above-mentioned structural design, the spectrum sensor module is designed to restore the spectrum more accurately for artificial sunlight such as D65. As shown in Figure 44, the dotted box C in the figure is the data area actually selected by the spectrum chip 11" of the spectrum sensor 10", and the circle A is when the filter element 125" is located between the lens 124" and the spectrum The light spot range obtained on the surface of the spectrum chip 11" is between the chips 11". Circle B is the surface of the spectrum chip 11" when the filter element 125" is located between the lens 124" and the diaphragm 123". The acquired spot range.

As shown in Figure 43, in this preferred embodiment of the present application, the lens 124" has a light incident surface 1241" and a light exit surface 1242", wherein ambient light is incident through the light incident surface 1241" of the lens 124" to the lens 124", and then exit through the light exit surface 1242" of the lens 124". Therefore, in this preferred embodiment of the present application, the light incident surface 1241" of the lens 124" faces toward the ambient light side (aperture 123"), and the light exit surface 1242" of the lens 124" faces toward on the spectrum chip 11".

Preferably, in this preferred embodiment of the present application, the light incident surface 1241" of the lens 124" is a flat surface, and the light exit surface 1242" of the lens 124" is a spherical surface (hemispheric surface), so as to pass through The lens 124" gathers the ambient light to the sensing light surface of the spectrum chip 11", thereby realizing the collection of incident light with a large field of view FOV, which solves the problem of the stability and stability of the angle at which the spectrum sensor acquires incident light. consistency.

As shown in Figures 39 and 40, the optical component 12" of the spectrum sensor 10" is fixed to the lens component 20", and then the optical component 12" is fixed to the lens component 20" through the lens component 20". The front end of the photosensitive path of the spectrum chip 11″. The lens assembly 20″ includes a lens barrel 21″ and a spacer 22″, wherein the lens barrel 21″ has a receiving space for accommodating the optical assembly 12″, the spacer 22″ and the optical assembly 12" is fixed in the accommodation space by the lens barrel 21". As an example, in this preferred embodiment of the present application, the lens barrel 21 ″ is in a cylindrical shape, the light diffusion plate 122 ″, the diaphragm 123 ″, the lens 124 of the optical assembly 12 ″ are ” and the filter element 125 ″ are sequentially fixed in the accommodation space of the lens barrel 21 ″.

The spacer 22" of the lens assembly 20" is disposed between the aperture 123" and the lens 124", wherein the spacer 22" has a preset thickness. "Adjust the distance from the diaphragm 123" to the lens 124" to adjust the path of the light. It is worth mentioning that the gasket 22" has a cylindrical hollow structure, and the size of the gasket 22" is adapted to the inner wall of the lens barrel 21", that is, the outer diameter of the gasket 22" is equal to The inner diameter of the lens barrel 21″ is adapted.

As shown in Figure 40, in this preferred embodiment of the present application, the optical assembly 12" is provided on the lens assembly 20", and is fixed on the lens barrel 21" of the lens assembly 20". The front end of the photosensitive path of the spectrum chip 11". As an example, in this preferred embodiment of the present application, the optical component 12" is fixed inside the lens barrel 12", and the optical component 12" Forming an integrated structure with the lens assembly 20", the lens barrel 21" of the lens assembly 20" is fixed on the base 4". Optionally, in another optional embodiment of the present application, the spectrum sensor module further includes a fixing mechanism 50", and the optical component 12" is fixed by the fixing mechanism 50". The base 4". The fixing mechanism 50" is implemented as a fixing frame, wherein one end of the fixing mechanism 50" is connected to the base 4", and the optical assembly 12" passes through the lens assembly 20". The lens barrel 21" is fixed on the other end of the fixing mechanism 50". The fixing mechanism 50" has a mounting hole for mounting and fixing the lens barrel 21" of the lens assembly 20".

As an example, in this preferred embodiment of the present application, the lens barrel 21 ″ of the lens assembly 20 ″ is fixed to the front end of the fixing mechanism 50 ″ by the fixing mechanism 50 ″ in a clamping and fixing manner. The fixing mechanism 50" includes a support bracket 51" and a fixing unit 52", wherein the support bracket 51" is used to fix the lens barrel 21" of the lens assembly 20" on one side of the base 4" , the fixing unit 52″ is used to fix the uniform light device 122″ of the optical component 12″ to the lens barrel 21″.

As an example, in this preferred embodiment of the present application, the fixing unit 52″ is implemented as an annular fixing piece, wherein the fixing unit 52″ is disposed at the end of the lens barrel 21″. The fixing unit 52″ fixes and installs the light uniforming device 122″ at the end of the lens barrel 21″. Optionally, in another optional embodiment of the present application, the fixing unit 52″ is implemented as a clamping device for clamping the uniform light device 122″ on the lens barrel 21″. Ends.

The spectrum chip 11″ is connected to the circuit board 3″, that is, the spectrum chip 11″ is electrically connected to the circuit board 3″. As an example, in this preferred embodiment of the present application, the spectrum chip 11″ is electrically connected to the circuit board 3″. The angle of the FOV formed by the optical component 12" is within 180°. The uniform light device 122" of the optical component 12" can be, but is not limited to, a uniform light dispersion plate (polytetrafluoroethylene), in which the incident light passes through the lens 124 " and the filter element 125" behind the lens 124" reaches the filter structure (micro-nano structure unit) matrix of the spectrum chip 11".

The spectrum chip 11" is disposed on the circuit board 3", wherein the circuit board 3" is fixed on the base 4", and the base 4" supports and fixes the spectrum chip 11". It can be understood that the spectrum chip 11″ is electrically connected to the circuit board 3″ and processes the acquired spectral information of the incident light. The base 4" is further provided with a mounting hole 40", wherein the optical path of the optical component corresponds to the mounting hole 40" of the base 4", and the spectrum chip 11" is located at the base 4" The mounting hole 40". As an example, in this preferred embodiment of the present application, the circuit board 3" is fixed on the lower end surface of the base 4".

Optionally, in this preferred embodiment of the present application, the lens barrel 21" of the lens assembly 20" is fixed on the upper end surface of the base 4", or the lens barrel 21" of the lens assembly 20" The barrel 21" is fixed on the upper end of the base 4" by the fixing mechanism 50", and the lens assembly 20" is held in the photosensitive path of the spectrum chip 11" by the fixing mechanism 50".

In one embodiment of the present application, a lens cover 23" is also provided on the upper part of the lens barrel 21". The lens cover 23" is provided on the light uniformity device, and a light hole 231 is provided on the lens cover 23". ".

In one embodiment of the present application, threads are provided on the outer wall of the lens barrel 21", and the lens barrel 21" passes through the outer wall. The threads on the wall are connected to the base 4", and the lens cover 23" and the lens 21" are connected through the threads.

It should be noted that in this preferred embodiment of the present application, the incident light signal can be modulated through the light modulation layer of the spectrum chip 11", and the obtained incident light can be restored through the recovery algorithm as described Spectral information, the color temperature value is calculated according to the obtained spectral information of the incident light, and the illumination information is calculated according to the response of the incident light. As shown in Figure 38, the composition of the spectrum chip 11" of this preferred embodiment of the present application is used. Spectral imaging sensor 1" to obtain color temperature sensing information with spatial information, where the spatial information can be two-dimensional spatial information or three-dimensional spatial information. The spectral information and the image information obtained by the image sensor form a spectral cube. .

It can be understood that in this preferred embodiment of the present application, since different light uniforming devices 122″ can have different effects on different filter structure arrays, different light uniforming devices 122″ can obtain different filter structures. light effects. When the uniform light is strong, the entire incident light can be detected uniformly, and a single spectral information in the entire ambient light can be obtained. If the uniform light is weak, the spectral information of different positions in the ambient light can be obtained. Therefore, the uniform light of different capabilities can be adjusted according to different application scenarios to achieve single-point, multi-point or even multi-angle environments or incident light. Spectral information.

Referring to Figure 45 of the accompanying drawings of this application, the specific implementation of a spectrum sensor module according to the second preferred embodiment of the third design solution of this application will be clarified in the following description. The spectrum sensor module includes a spectrum sensor 10", a lens assembly 20", a circuit board 3" and a base 4", wherein the circuit board 3" is electrically connected to the spectrum sensor 10", and the lens assembly 20" Located on the photosensitive side of the spectrum sensor 10", the spectrum sensor 10", the lens assembly 20" and the circuit board 3" are fixed to the base 4", and are supported and fixed by the base 4" The spectrum sensor 10" and the lens assembly 20".

What is different from the above-mentioned first preferred embodiment is the structure of the spectrum sensor 10" and the lens assembly 20". Specifically, the spectrum sensor 10" includes a spectrum chip 11" and an optical component 12" disposed in the photosensitive path of the spectrum chip 11". The lens assembly 20" includes a lens barrel 21", wherein the optical component 12″ is disposed on the lens barrel 21″ of the lens assembly 20″, and the optical assembly 12″ is held in the photosensitive path of the spectrum chip 11″ through the lens barrel 21″.

It is worth mentioning that in this preferred embodiment of the present application, the optical component 12" includes a uniform light device 122", a lens 124" and a filter element 125" arranged in sequence from the light incident side along the optical axis direction. The lens barrel 21" has an accommodating space 210" that passes front and back along the optical axis direction, and the lens 124" is fixed in the accommodating space 210" by the lens barrel 21". The lens barrel 21" It further includes an upper end 211" and a lower end 212" integrally extending downward from the upper end 211", and the light uniformity device 122" is provided on the upper end 211" of the lens barrel 21". The filter element 125″ is disposed at the lower end 212″ of the lens barrel 21″. It can be understood that in this preferred embodiment of the present application, the opening of the upper end 211″ of the lens barrel 21″ Toward the light incident side, the opening of the lower end portion 212" of the lens barrel 21" faces toward the light emitting side (the position of the spectrum chip 11").

As shown in Figure 46, a lens cover 23" is also provided on the upper part of the lens barrel 21". The lens cover 23" is provided on the light uniforming device, and the lens cover 23" is provided with a light hole 231".

Threads are provided on the outer wall of the lens barrel 21". The lens barrel 21" is connected to the base 4" through the threads on the outer wall. The lens cover 23" and the lens 21" are connected through the threads. The distance between the lens and the spectrum chip can also be adjusted by thread rotation of the lens barrel 21".

Preferably, in this preferred embodiment of the present application, the light uniformity device 122" is attached to the upper end 211" of the lens barrel 21", and the filter element 125" is attached to the The lower end portion 212″ of the lens barrel 21″. The upper end 211" of the lens barrel 21" is further provided with a mounting groove 2110", the lower end 212" of the lens barrel 21" is further provided with a mounting groove 2120", and the light uniformity device 122" is fixed on In the mounting groove 2110" of the upper end 211", the filter element 125" is fixed in the mounting groove 2120" of the lower end 212".

Preferably, in this preferred embodiment of the present application, the light uniformity device 122" and the filter element 125" are fixed to the lens barrel 21" by gluing. Correspondingly, the lens The barrel 21" is further provided with a glue overflow hole 2100", wherein the glue overflow hole 2100" is formed in the mounting groove 2110" and the mounting groove 2120" of the lens barrel 21", and excess glue will flow into it. In the glue overflow hole, that is, through the glue overflow hole 2100", glue is prevented from overflowing.

The lens barrel 21" is further provided with an aperture opening 213", wherein the aperture opening 213" is formed at the upper end 211" of the lens barrel 21", and the aperture opening 213" is connected to The accommodating space 210". Therefore, it can be understood that in this preferred embodiment of the present application, the aperture opening 213" of the lens barrel 21" limits the amount of light entering the external light. That is That is, in this preferred embodiment of the present application, the function of the aperture in the first preferred embodiment is replaced by the aperture opening 213" integrally formed in the lens barrel 21".

The lens 124" has a light incident surface 1241" and a light exit surface 1242", wherein ambient light is incident on the lens 124" through the light incident surface 1241" of the lens 124", and then passes through the light incident surface 124" of the lens 124". The light emitting surface 1242″ emits light. Different from the above-mentioned first preferred embodiment, in this preferred embodiment of the present application, the light incident surface 1241" of the lens 124" is a convex surface to collect more incident light into the lens. The spectrum chip 11" is disposed on the upper surface of the base 4" or the spectrum chip 11" is embedded in the base 4", and the spectrum chip 11" is supported and protected by the base 4".

Finally, it should be pointed out that the embodiments of the present application shown in the above description and drawings are only examples and do not limit the present application. The functional and structural principles of the present application have been shown and described in the embodiments. Without departing from the principles, the technical features and implementation modes of the present application can be arbitrarily combined or replaced, and the resulting deformations or modifications are also included in the present application. Within the scope of recording and disclosure of the application.

Claims (90)

Spectral sensor, characterized by including Spectrum chip, the spectrum chip includes a light modulation layer and a photoelectric detection layer, wherein the light modulation layer is disposed on the light incident surface side of the photoelectric detection layer on the sensing path of the photoelectric detection layer and includes: at least one modulation unit for modulating incident light, wherein the photodetection layer is configured to obtain an optical signal modulated by the at least one modulation unit, and Optical component, the optical component is disposed on the sensing path of the spectrum chip, used to receive the optical signal of the incident light from the photographed target and guide the optical signal to the light modulation layer of the spectrum chip, wherein the optical component includes at least one aperture, and the aperture is configured to form a light spot irradiated to the light modulation layer of the spectrum chip through the aperture, such that the light spot covers at least one of the light modulation layers the modulation unit. The spectrum sensor of claim 1, wherein the aperture is configured such that the light spot formed by the aperture and irradiated to the light modulation layer of the spectrum chip covers the modulation units at different positions on the spectrum chip. The spectrum sensor of claim 2, wherein the aperture is configured such that the light spot formed by the aperture and irradiated to the light modulation layer of the spectrum chip covers all modulation units on the spectrum chip. The spectrum sensor of claim 1, wherein the spectrum chip further includes an image sensor configured to acquire a response signal to the incident light modulated by the light modulation layer, and obtain a spectrum from the response signal. Image information. The spectrum sensor of claim 1, wherein the aperture is further configured to pass through one or more modulation units corresponding to the light spot behind the aperture, and obtain the spectrum corresponding to the incident light through the image sensor. response. The spectrum sensor of claim 1, wherein the optical component of the spectrum sensor further includes a light attenuation sheet and/or a light enhancement sheet disposed at the diaphragm position. The spectrum sensor according to any one of claims 1 to 6, wherein the optical component of the spectrum sensor further includes a uniform light component, the uniform light component is disposed on the optical path of the incident light irradiating the spectrum chip. , the uniform light component is configured such that the light incident on the uniform light component is uniformly reflected in all directions. The spectrum sensor of claim 7, wherein the luminous intensity of the uniform light component configured to pass through the uniform light component is D∝cosθ, that is, its brightness B is independent of direction, where D is each surface of the light emitting surface. The luminous intensity of element S along any direction r, θ is the angle between r and the normal n. The spectrum sensor according to claim 7, wherein the uniform light component is any one of a uniform light sheet, a uniform light film or a uniform light coating. The spectrum sensor according to claim 7, wherein the optical component further includes a filter component, the filter component is disposed on a light path where the incident light irradiates the spectrum chip. The spectrum sensor of claim 7, wherein the aperture is configured as a through hole formed by injection molding of a plastic part. The spectrum sensor of claim 7, wherein the aperture is configured as a light-transmissive aperture hole in an opaque coating formed on the upper surface and/or the lower surface of the light-diffusion component (110). The spectral sensor of claim 10, wherein the aperture is configured as a light-transmitting aperture hole in an opaque coating formed on an upper surface and/or a lower surface of the filter assembly (130). The spectrum sensor according to claim 12 or 13, wherein the aperture hole is configured as a circular hole, and the center of the circle of the aperture circular hole is on the optical axis of the imaging light path of the spectrum chip. The spectrum sensor of claim 12 or 13, wherein the opaque coating is a coating, and the coating includes one or more coatings. The spectrum sensor of claim 12 or 13, wherein the opaque coating is a metal coating. The spectrum sensor according to claim 11, wherein the longitudinal section of the through hole is cylindrical or trapezoidal. The spectrum sensor according to any one of claims 12 to 13, wherein the uniform component is configured so that the light spot reaching the spectrum chip through the optical component is uniform and angle-insensitive. Spectral sensor modules, including The spectral sensor according to any one of claims 1 to 18, and A circuit board, on which a spectrum chip of the spectrum sensor is placed and electrically connected to the circuit board. The spectrum sensor module of claim 19, wherein the housing of the spectrum sensor module includes a first support member in which the aperture of the optical assembly is constructed. The spectrum sensor module of claim 20, wherein the uniform light component of the optical component is disposed on a surface of the first support member facing the incident light. The spectrum sensor module of claim 21, wherein the filter component of the optical component is disposed on a surface of the first support member opposite to the uniform light component. The spectrum sensor module of claim 22, wherein a groove for accommodating the filter component is provided in the first support member, and the groove corresponds to the position of the aperture in the first support member. . The spectrum sensor module of claim 23, wherein the filter component is embedded in the groove of the first support member, and the outer surface of the filter component is flush with the edge of the groove. The spectrum sensor module of claim 21, wherein the filter component of the optical component is disposed on the between the uniform light component of the optical component and the first support member. The spectrum sensor module of claim 20, wherein the housing of the spectrum sensor module further includes a second support member for supporting the first support member, wherein the first support member and the second support member are configured to Protect and support the formation of light paths. The spectrum sensor module of claim 26, wherein the first support member and the second support member are integrally constructed and thereby form an integrated base, with a portion of the base opposite to the uniform light component. The aperture is constructed in the region. The spectrum sensor module of claim 26, wherein the housing of the spectrum sensor module further includes a bottom plate, the circuit board is disposed on the bottom plate, and the second support member is supported on the first support member and the bottom plate, so that the first support, the second support member and the bottom plate group jointly form a housing of the spectrum sensor module. The spectrum sensor module of claim 26, wherein the thickness of the first support member is determined according to the aperture of the aperture and the thickness of the second support member. The spectrum sensor module according to claim 29, wherein the light spot irradiated onto the spectrum chip is formed by the aperture, and the effective area of the light spot follows the following empirical formula:
Among them, d represents the aperture of the aperture or the diameter of the aperture, h1 represents the distance from the light incident surface/light exit surface of the uniform light component to the spectrum chip in the direction of the optical path of the incident light irradiating the spectrum chip, and h ₂ represents the distance between the incident light and the spectrum chip. The distance from the light incident surface/light exit surface of the aperture to the spectrum chip in the direction of the light path that illuminates the spectrum chip. The spectrum sensor module according to any one of claims 26 to 30, wherein the spectrum sensor module further includes a cover plate supported and fixed on a surface of the first support member facing incident light. The spectrum sensor module according to claim 31, wherein a wedge-shaped groove is provided in the cover plate, and the wedge-shaped groove is used to embed and fix the uniform light component of the optical component. The spectrum sensor module as claimed in claim 32, wherein the wedge-shaped groove is arranged completely around the outer edge of the light-diffusion component. The spectrum sensor module of claim 32, wherein a wedge-shaped groove is provided at a plurality of opposite positions around the light-diffusing component. The spectral sensor module of claim 33, wherein the wedge-shaped groove is configured as a tapered hole in the cover plate. The spectrum sensor module of claim 35, wherein the narrow end of the tapered hole of the wedge-shaped groove is located on the outer surface of the cover plate, and the wide end of the tapered hole is located on the inner surface of the cover plate. The spectrum sensor module as claimed in claim 32, wherein the inner and outer surfaces of the uniform light component disposed in the wedge-shaped groove of the cover plate are flush with the corresponding surfaces of the cover plate. The spectrum sensor module according to claim 31, wherein a step hole is provided in the cover plate, the steps of the step hole match the shape of the uniform light component, and the uniform light embedded in the step hole of the cover plate matches the shape of the uniform light component. The circumferential edge of the outer surface of the light component is covered by the edge of the step hole of the cover plate, whereby the cover plate forms an edge-wrapping structure for the light-diffusion component embedded therein. The spectrum sensor module according to claim 31, wherein a protective cover is provided on the cover plate. The spectrum sensor module according to claim 31, wherein the first support member, the second support member and the cover plate of the spectrum sensor module are integrally injection molded. The spectrum sensor module as claimed in claim 19, wherein the housing of the spectrum sensor module is an integrated cylindrical structure, and has a receiving portion for receiving and fixing the optical component at one end facing the incident light. The spectrum sensor module according to claim 41, wherein the receiving portion for receiving and fixing the optical component is configured as a stepped hole in the housing of the spectrum sensor module, and the stepped hole of the housing includes a step hole for receiving and fixing the optical component. Openings for incident light and steps for positioning and fixing the optical components. The spectrum sensor module according to claim 42, wherein the uniform light component, aperture and filter component of the optical component are stacked in sequence along the imaging light path of the incident light to form a sandwich-type overall structural unit, wherein The integral structural unit is embedded in the stepped hole of the housing through form locking, material locking or force locking. The spectrum sensor module according to claim 42 or 43, wherein a glue overflow groove is configured in the housing along the periphery of the receiving portion for receiving and fixing the optical component. Spectral sensor module according to claim 44, wherein the glue overflow groove is configured in the housing (4) as a chamfer on the peripheral edge of the housing for housing and fixing the optical component. . The spectrum sensor module according to any one of claims 19 to 30, wherein the housing of the spectrum sensor module is further provided with an exhaust hole that communicates the internal space of the housing with the external environment. The spectrum sensor module of claim 19, wherein a light-transmitting protective layer is provided on the light modulation layer of the spectrum chip, and a media component is provided on the light-transmitting protective layer for supporting the optical A uniform light component of the component, wherein the dielectric component is a dielectric material with high light transmittance. The spectrum sensor module of claim 47, wherein the media component is disposed between the light modulation layer of the spectrum chip and the optical component and supports the optical component. The spectrum sensor module as claimed in claim 47 or 48, wherein a filter layer is provided on the light incident surface of the dielectric material, and the aperture of the optical component is constructed in the filter layer. The spectrum sensor module of claim 49, wherein the filter layer is bonded on the light incident surface of the media component, and the adhesive material is light-transmissive. The spectrum sensor module according to any one of claims 19 to 30, wherein the spectrum sensor module further includes a data processing unit. Electronic equipment, including the spectrum sensor module according to any one of claims 19 to 51. A spectrum sensor, characterized by including: Spectral chip; and Optical component, the optical component is located in the photosensitive path of the spectrum chip, whereby the optical component guides the target light signal to the upper surface of the light modulation layer of the spectrum chip at a fixed incident angle, and the light modulation layer is used to The incident light is modulated, and the upper surface of the light modulation layer is located on the side away from the image sensor; The optical component includes a uniform light component and an aperture. The incident light guides the optical signal to the upper surface of the light modulation layer on the spectrum chip through the uniform light component and the diaphragm on the optical path. The spectrum sensor according to claim 53, wherein the optical component further includes a light through-hole component located in the light exit path of the aperture and a lens located in the light exit path of the light through-hole component. The spectrum sensor according to claim 54, wherein the optical component includes a light uniformity member, wherein the light uniformity member is located on the light incident side of the diaphragm. The spectrum sensor according to claim 55, wherein the light uniformity member is selected from one or a combination of a light uniformity film, a light uniformity sheet and a scattering sheet. The spectrum sensor according to claim 55, wherein the light through-hole member has a light hole that passes from front to back and a light entrance port and a light exit port that communicate with the light hole, wherein the aperture size of the light entrance port is smaller than the light hole. The aperture size of the light outlet of the light through hole component. The spectrum sensor according to claim 55, wherein the light through-hole member has a light hole that penetrates from front to back, and the light inlet hole and the light outlet hole of the light hole have the same size. The spectrum sensor according to claim 55, wherein the light through-hole member has a light hole that passes from front to back, and the light hole is formed from an integrally molded component. The spectrum sensor according to claim 55, wherein the light through-hole member includes a plurality of through-hole member units, wherein the through-hole member unit is a metal sheet with holes, and the plurality of light through-hole members Through-hole units are superimposed and front and back Through. The spectral sensor of claim 55, wherein the optical component further includes a filter, wherein the filter is located on an exit light side of the lens. The spectral sensor of claim 55, wherein the optical component further includes a filter, wherein the filter is located on the incident light side of the lens. The spectrum sensor according to claim 55, wherein the spectrum chip includes a photodetection layer and a light modulation layer located in a photosensitive path of the photodetection layer. A sensor device, characterized in that it includes: Spectral chip; A circuit board, wherein the spectrum chip is disposed on the circuit board and electrically connected to the circuit board; and Optical component, wherein the optical component is located in the photosensitive path of the spectrum chip. The sensor device according to claim 64, further comprising a base, wherein the base is fixed to the circuit board, and the optical component is disposed on the base, and the optical component is fixed to the base through the base. Describe the photosensitive path of the spectrum chip. The sensor device according to claim 65, wherein the optical component includes a light uniformity member, a light through hole member and a lens, wherein the light through hole member is provided on the base, and the light uniformity member is located on the light The lens is disposed on the light-emitting side of the through-hole component. The sensor device according to claim 66, further comprising a fixing member, wherein the light-diffusion member is fixed to the base by the fixing member. The sensor device according to claim 66, wherein the light through-hole member has a light hole that passes from front to back and a light entrance port and a light exit port that communicate with the light hole, wherein the aperture size of the light entrance port is smaller than the light hole. The aperture size of the light outlet of the light through hole component. The sensor device according to claim 66, wherein the light through-hole member includes a plurality of through-hole member units, wherein the through-hole member unit is a metal sheet with holes, and the plurality of light through-hole members The through-hole units are stacked and connected front to back. Spectral sensor module, characterized in that the spectrum sensor module includes: Optical components and spectrum chips, wherein the optical components are located in the photosensitive path of the spectrum chip, and a light filter structure is provided on the light incident surface of the spectrum chip, and the filter structure is used to modulate incident light, The optical component includes a uniform light device and a lens arranged in sequence from the light incident side along the optical axis direction, so that the incident light is guided to the desired location through the uniform light device and the lens with a set incident angle and uniform light intensity. The surface of the spectroscopic chip. The spectrum sensor module according to claim 70, wherein the optical component further includes an aperture, wherein the aperture is located between the light uniformity device and the lens. The spectrum sensor module according to claim 71, wherein the uniform light device is used to collect incident light within a solid angle of no more than 180° and eliminate optical coupling caused by the incident light. The spectrum sensor module according to claim 72, wherein the light uniformity device is a light uniformity film or a light uniformity sheet. The spectrum sensor module according to claim 73, wherein the light uniformity device is attached to the aperture. The spectrum sensor module according to claim 74, wherein the optical component further includes a filter element, wherein the filter element is located on the light exit side of the lens. The spectrum sensor module according to claim 75, wherein the lens has a light entrance surface and a light exit surface, the light entrance surface of the lens faces the diaphragm and is a plane, and the light exit surface of the lens faces the diaphragm. The spectrum chip is a hemisphere. The spectrum sensor module according to claim 76, wherein the filter element is disposed between the light exit surface of the lens and the spectrum chip. The spectrum sensor module according to claim 76, wherein the filter element is attached to the light exit surface side of the lens. The spectrum sensor module according to claim 76, wherein the filter element is attached to the photosensitive surface of the spectrum chip. The spectrum sensor module according to any one of claims 76 to 79, wherein the spectrum sensor module further includes a lens assembly, a circuit board and a base, the optical assembly is disposed on the lens assembly, and the spectrum chip is Disposed on the circuit board and electrically connected to the circuit board, wherein the lens assembly is fixed on the base. The spectrum sensor module according to claim 80, wherein the lens assembly includes a lens barrel and a gasket, the optical component is disposed in the accommodation space of the lens barrel, and the gasket is disposed in the aperture. and between the lenses. The spectrum sensor module according to claim 81, wherein the lens barrel of the lens assembly is fixed on the upper end surface of the base. The spectrum sensor module according to claim 81, further comprising a fixing mechanism for fixing the lens assembly to the base. The spectrum sensor module according to claim 83, wherein the fixing mechanism includes a support frame and a fixing unit, one end of the support frame is fixed on the base, and the other end of the support frame is connected to the mirror of the lens assembly. The lens barrel is connected, and the light uniformity device is fixed at the end of the lens barrel by the fixing unit. The spectrum sensor module according to claim 83, wherein the base has a mounting hole, and the spectrum chip is installed in the mounting hole of the base. The spectrum sensor module according to claim 82, wherein the lens barrel further includes an upper end portion and a lower end portion integrally extending downward from the upper end portion, and the light uniformity device is disposed on the lens barrel. The upper end portion, the filter element is disposed at the lower end portion of the lens barrel. The spectrum sensor module according to claim 86, wherein the upper end of the lens barrel is further provided with a mounting groove, the lower end of the lens barrel is further provided with a mounting groove, and the light uniformity device is fixed on the In the mounting groove at the upper end, the filter element is fixed in the mounting groove at the lower end. The spectrum sensor module according to claim 86, wherein the lens barrel is further provided with an aperture opening, wherein the aperture opening is formed on the upper end of the lens barrel. The spectrum sensor module according to claim 81, wherein the upper part of the lens barrel is further provided with a lens cover, the lens cover is provided on the light uniformity device, and the lens cover is provided with a light hole. The spectrum sensor module according to claim 89, wherein threads are provided on the outer wall of the lens barrel, the lens barrel is connected to the base through the threads on the outer wall, and the lens cover and the lens pass through The threaded connection.