WO2023221663A1 - Capteur spectral, module de capteur spectral, appareil de capteur et dispositif électronique - Google Patents

Capteur spectral, module de capteur spectral, appareil de capteur et dispositif électronique Download PDF

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Publication number
WO2023221663A1
WO2023221663A1 PCT/CN2023/085130 CN2023085130W WO2023221663A1 WO 2023221663 A1 WO2023221663 A1 WO 2023221663A1 CN 2023085130 W CN2023085130 W CN 2023085130W WO 2023221663 A1 WO2023221663 A1 WO 2023221663A1
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WO
WIPO (PCT)
Prior art keywords
light
spectrum
component
sensor module
hole
Prior art date
Application number
PCT/CN2023/085130
Other languages
English (en)
Chinese (zh)
Inventor
黄志雷
熊健
李情情
李丽
李小青
冯东宝
王莉
姚壮
盖永萍
Original Assignee
北京与光科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202221206359.0U external-priority patent/CN217504984U/zh
Priority claimed from CN202222448366.8U external-priority patent/CN218885141U/zh
Priority claimed from CN202223266805.XU external-priority patent/CN219553634U/zh
Application filed by 北京与光科技有限公司 filed Critical 北京与光科技有限公司
Publication of WO2023221663A1 publication Critical patent/WO2023221663A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum

Definitions

  • This application relates to the field of spectrum technology, and in particular to spectrum sensors, spectrum sensor modules, sensor devices and electronic equipment.
  • spectral sensing/spectral imaging technology usually adopts the following working method: using sensors to acquire optical signals, and then performing data processing to varying degrees to finally obtain spectral information.
  • the sensor used in this process can obtain information in the frequency domain of the light to be measured.
  • the implementation method includes: a photodetector array with a light modulation structure, or an array of optical filters (or modulation structure or filter structure 10) and light A combination of detector arrays; wherein the optical filter (or modulation structure or filter structure 10) can be a narrowband, broadband, periodic or other filtering method in the frequency domain or wavelength domain.
  • computationally reconstructed spectrometers or computationally reconstructed spectral imaging devices are emerging technologies, computationally reconstructed light sources or computationally reconstructed spectral imaging devices encounter many technical problems in practical applications. Since the computational spectrum chip is relatively sensitive to the dominant light angle of the incident optical signal, changes in the dominant optical angle of the incident optical signal will greatly affect the accuracy of spectral recovery in actual use. That is to say, the unstable angle and light intensity of the incident light of the existing technology spectrum sensor will cause the restored spectral information to be inaccurate or the results of multiple restorations to fluctuate greatly.
  • this application proposes a spectrum sensor, a spectrum sensor module and an electronic device including such a spectrum sensor module, which can not only improve the current spectrum sensor, spectrum sensor module
  • the set of optoelectronic properties for example, significantly improves the accuracy and stability of the spectral recovery of the spectrum sensor module, and can achieve many advantages in manufacturing and assembly processes with optimized optoelectronic and mechanical structures, such as ease of assembly and maintenance and Stable and reliable work, etc.
  • a spectral sensor including:
  • the spectrum chip includes a light modulation layer and a photoelectric detection layer, wherein the light modulation layer is disposed on the light incident surface side of the photoelectric detection layer on the sensing path of the photoelectric detection layer and includes: at least one modulation unit for modulating incident light, wherein the photodetection layer is configured to obtain an optical signal modulated by the at least one modulation unit, and
  • the optical component is disposed on the sensing path of the spectrum chip, used to receive the optical signal of the incident light from the photographed target and guide the optical signal to the light modulation layer of the spectrum chip,
  • the optical component includes at least one aperture
  • the aperture is configured to form a light spot irradiated to the light modulation layer of the spectrum chip through the aperture, such that the light spot covers at least one of the light modulation layers the modulation unit.
  • the aperture is configured such that the light spot formed by the aperture and irradiated to the light modulation layer of the spectrum chip covers the modulation units at different positions on the spectrum chip.
  • the aperture is configured such that the light spot formed by the aperture and irradiated to the light modulation layer of the spectrum chip covers all modulation units on the spectrum chip.
  • the spectrum chip further includes an image sensor configured to acquire a response signal to the incident light modulated by the light modulation layer, and is obtained from the above response signal Spectral image information.
  • the aperture is further configured to pass one or more modulation units corresponding to the light spot behind the aperture, and obtain the incident light corresponding to the image sensor through the image sensor. Spectral response.
  • the optical component of the spectrum sensor further includes a light attenuation sheet and/or a light enhancement sheet disposed at the aperture position.
  • the optical component of the spectrum sensor further includes a uniform light component
  • the uniform light component is disposed on the optical path where the incident light irradiates the spectrum chip
  • the uniform light component The component is configured such that light incident on the uniform light component is uniformly reflected in all directions.
  • the luminous intensity of the uniform light component configured to pass through the uniform light component is D ⁇ cos ⁇ , that is, its brightness B has nothing to do with the direction, where D is each piece of the light emitting surface.
  • the luminous intensity of the surface element S along any direction r, ⁇ is the angle between r and the normal n.
  • the light uniformity component is any one of a light uniformity sheet, a light uniformity film, or a light uniformity coating.
  • the optical component further includes a filter component, and the filter component is disposed on a light path where the incident light irradiates the spectrum chip.
  • the aperture is configured as a through hole formed by injection molding of a plastic part.
  • the aperture is configured as a light-transmitting aperture hole in an opaque coating formed on the upper surface and/or the lower surface of the light-diffusing component.
  • the aperture is configured as a light-transmissive aperture hole in an opaque coating formed on an upper surface and/or a lower surface of the filter component.
  • the aperture hole is configured as a circular hole, and the center of the circle of the aperture circular hole is on the optical axis of the imaging light path of the spectrum chip.
  • the opaque coating is a coating
  • the coating includes one or more coatings.
  • the opaque coating is a metal coating.
  • the longitudinal section of the through hole is cylindrical or trapezoidal.
  • the uniform component is configured so that the light spot reaching the spectrum chip through the optical component is uniform and angle-insensitive.
  • a spectrum sensor module including:
  • a circuit board on which a spectrum chip of the spectrum sensor is placed and electrically connected to the circuit board.
  • the housing of the spectral sensor module includes a first support member in which the aperture of the optical assembly is constructed.
  • the uniform light component of the optical component is disposed on a surface of the first support facing the incident light.
  • the filter component of the optical component is disposed on a surface of the first support member opposite to the uniform light component.
  • a groove for accommodating the filter assembly is provided in the first support member, and the groove corresponds to a position in the first support member where the aperture is provided.
  • the filter component is embedded in the groove of the first support member, and the outer surface of the filter component is flush with the edge of the groove.
  • the filter component of the optical component is disposed between the uniform light component of the optical component and the first support member.
  • the housing of the spectrum sensor module further includes a second support member for supporting the first support member, wherein the first support member and the second support member are configured to protect And support the formation of light path.
  • the first support member and the second support member are constructed in one piece, and thus form an integrated base, in an area of the base opposite to the light-diffusion component. Construct the aperture.
  • the housing of the spectrum sensor module further includes a bottom plate, the circuit board is disposed on the bottom plate, wherein the second support member is supported on the first support member and Between the base plates, the first support, the second support member and the base plate group jointly form a housing of the spectrum sensor module.
  • the thickness of the first support member is determined according to the aperture of the aperture and the thickness of the second support member.
  • a light spot irradiated onto the spectrum chip is formed through the aperture, wherein the effective area of the light spot follows the following empirical formula:
  • d represents the aperture or diameter of the aperture
  • h1 represents the distance from the incident surface/light exit surface of the uniform light component to the spectrum chip in the direction of the optical path of the incident light irradiating the spectrum chip
  • h2 represents the distance between the incident light irradiation and the spectrum chip. The distance from the light entrance surface/light exit surface of the aperture to the spectrum chip in the direction of the optical path to the spectrum chip.
  • the spectrum sensor module further includes a cover plate, which is supported and fixed on the surface of the first support member facing the incident light.
  • a wedge-shaped groove is provided in the cover plate, and the wedge-shaped groove is used to embed and fix the uniform light component of the optical component.
  • the wedge-shaped groove is provided completely around the outer edge of the light-diffusing component.
  • a wedge-shaped groove is respectively provided at a plurality of opposite positions around the light-diffusing component.
  • the wedge-shaped groove is configured as a tapered hole in the cover plate.
  • the narrow end of the tapered hole of the wedge-shaped groove is located on the outer surface of the cover plate, and the wide end of the tapered hole is located on the inner surface of the cover plate.
  • the inner and outer surfaces of the light diffusion component disposed in the wedge-shaped groove of the cover plate are flush with the corresponding surfaces of the cover plate.
  • a step hole is provided in the cover plate, and the steps of the step hole match the shape of the light-diffusion component, wherein the light-diffusion component embedded in the step hole of the cover plate
  • the circumferential edge of the outer surface of the component is covered by the edge of the step hole of the cover plate, whereby the cover plate forms an edge-wrapping structure for the light-diffusion component embedded therein.
  • a protective cover is provided on the cover plate.
  • the first support member, the second support member and the cover plate of the spectrum sensor module are integrally injection molded.
  • the housing of the spectrum sensor module is an integrated cylindrical structure, and has a receiving portion for receiving and fixing the optical component at one end facing the incident light.
  • the receiving portion for receiving and fixing the optical component is configured as a stepped hole in the housing of the spectrum sensor module, and the stepped hole of the housing includes a step hole for passing through openings for incident light and steps for positioning and fixing the optical components.
  • the uniform light component, diaphragm and filter component of the optical component are stacked sequentially along the imaging optical path of the incident light to form a sandwich-type overall structural unit, wherein the The integral structural unit is embedded in the stepped hole of the housing through form locking, material locking or force locking.
  • a glue overflow groove is configured in the housing along the periphery of the accommodating portion for accommodating and fixing optical components.
  • the glue overflow groove is configured in the housing as a chamfer on a peripheral edge of the receiving portion for receiving and fixing optical components.
  • the housing of the spectrum sensor module is further provided with an exhaust hole that communicates the internal space of the housing with the external environment.
  • a light-transmitting protective layer is further provided on the light modulation layer of the spectrum chip, and a media component is provided on the light-transmitting protective layer for supporting the optical component.
  • the media component is disposed between the light modulation layer of the spectrum chip and the optical component, and supports the optical component.
  • a filter layer is provided on the light incident surface of the dielectric material, and the aperture of the optical component is constructed in the filter layer.
  • the filter layer is bonded on the light incident surface of the media component, and the adhesive material is light-transmissive.
  • the spectrum sensor module further includes a data processing unit.
  • an electronic device including the spectrum sensor module.
  • a major advantage of the present application is to provide a spectrum sensor and a sensor device, wherein the spectrum sensor includes a spectrum chip and an optical component located in the photosensitive path of the spectrum chip, wherein the incident light signal is incident at a specific angle through the optical component to the spectrum chip, which is beneficial to improving the stability of the spectrum recovered by the spectrum sensor.
  • Another advantage of the present application is to provide a spectrum sensor and a sensor device, in which the optical component remains stable to the light-collecting light cone angle of the incident light signal arriving at various positions on the upper surface of the light modulation layer on the spectrum chip, and has It is beneficial to improve the stability of spectral recovery.
  • Another advantage of the application is to provide a spectral sensor and sensor device, in which the optical component can realize the collection of solid angles with radiation angles within 150°, thereby realizing the collection of incident light with a large field of view FOV, that is, This solves the problem of stability and consistency of the angle at which the spectrum sensor acquires incident light.
  • Another advantage of the application is to provide a spectral sensor and sensor device, wherein the sensor device only changes in intensity when the incident angle is in the range of 0-50°, and the uniformity remains consistent, indicating that the angle of the chip surface The distribution is unchanged, thus improving the optical component eliminating angular sensitivity.
  • Another advantage of the application is to provide a spectrum sensor and a sensor device, wherein the spectrum sensor can modulate the incident light signal through the light modulation layer of the spectrum chip, and restore the obtained incident light signal through the recovery algorithm as described.
  • Spectral information, the color temperature value is calculated according to the obtained spectral information of the incident light, and the illumination information is calculated according to the response of the incident light, thereby improving the applicability of the spectrum sensor.
  • Another advantage of the application is to provide a spectral sensor and sensor device, in which the spectral information of the incident light can be more accurately obtained through the spectral sensor and uniform light at a large FOV angle, so that the chromaticity can be calculated more accurately value.
  • a spectral sensor of the present application that can achieve the aforementioned objects and other objects and advantages includes:
  • the optical component is located in the photosensitive path of the spectrum chip, whereby the optical component guides the target light signal to the upper surface of the light modulation layer of the spectrum chip at a fixed incident angle, and the light modulation layer is used to The incident light is modulated, and the upper surface of the light modulation layer is located on the side away from the image sensor;
  • the optical component includes a uniform light component and an aperture.
  • the incident light guides the optical signal to the upper surface of the light modulation layer on the spectrum chip through the uniform light component and the diaphragm on the optical path.
  • the optical component further includes a light through hole located in the light exit path of the aperture and a lens located in the light exit path of the light through hole component.
  • the optical component includes a light uniformity member, wherein the light uniformity member is located on the light incident side of the diaphragm.
  • the light uniformity member is selected from a combination of a light uniformity film, a light uniformity sheet and a scattering sheet.
  • the light through-hole member has a light hole that passes from front to back and a light entrance port and a light exit port that communicate with the light hole, wherein the aperture size of the light entrance port is smaller than that of the light through hole.
  • the aperture size of the light outlet of the aperture piece is smaller than that of the light through hole.
  • the light through-hole member includes a plurality of through-hole member units, wherein the through-hole member unit is a metal sheet with holes, and the plurality of through-hole members of the light through-hole member The units are superimposed and connected from front to back.
  • the optical component further includes an optical filter, wherein the optical filter is located at the exit end of the lens.
  • the light through-hole member has a light hole that passes from front to back, and the light inlet hole and the light outlet hole of the light hole have the same size.
  • the light through-hole member has a light hole that passes from front to back, and the light hole is formed from an integrally molded component.
  • the optical component further includes a filter, wherein the filter is located on the incident light side of the lens.
  • the spectrum chip includes a photodetection layer and a light modulation layer located in a photosensitive path of the photodetection layer.
  • the application further provides a sensor device, including:
  • a circuit board wherein the spectrum chip is disposed on the circuit board and electrically connected to the circuit board;
  • optical component wherein the optical component is located in the photosensitive path of the spectrum chip.
  • it further includes a base, wherein the base is fixed to the circuit board, and the optical component is disposed on the base, and the optical component is fixed to the spectrum through the base.
  • the photosensitive path of the chip is fixed to the circuit board.
  • the optical component includes a light-diffusing member, a light-through hole member and a lens, wherein the light-through-hole member is disposed on the base, and the light-diffusion member is located on the light through-hole member.
  • the lens is disposed on the light-emitting side of the light through-hole member.
  • it further includes a fixing component, wherein the light-diffusing component is fixed to the base by the fixing component.
  • the light through-hole member has a light hole that passes from front to back and a light entrance port and a light exit port that communicate with the light hole, wherein the aperture size of the light entrance port is smaller than that of the light through hole.
  • the aperture size of the light outlet of the aperture piece is smaller than that of the light through hole.
  • the light through-hole member includes a plurality of through-hole member units, wherein the through-hole member unit is a metal sheet with holes, and the plurality of through-hole members of the light through-hole member The units are superimposed and connected from front to back.
  • a major advantage of the present application is to provide a spectrum sensor module, wherein the spectrum sensor includes a spectrum chip and an optical component located in the photosensitive path of the spectrum chip, wherein the incident light signal is incident at a specific angle through the optical component.
  • the spectrum chip is beneficial to improving the stability of the spectrum restored by the spectrum sensor module.
  • Another advantage of the present application is to provide a spectrum sensor module, in which the optical component maintains stability in the light cone angle of the incident light signal arriving at various positions on the upper surface of the light modulation layer on the spectrum chip, which is beneficial to Improve the stability of spectral recovery.
  • Another advantage of the application is to provide a spectrum sensor module, in which the optical component can realize the collection of solid angles with radiation angles within 180°, thereby realizing the collection of incident light with a large field of view FOV, which solves the problem of This improves the stability and consistency of the spectrum sensor module in acquiring incident light angles.
  • Another advantage of the application is to provide a spectrum sensor module, in which the spectrum chip of the spectrum sensor only changes in intensity, and the uniformity remains consistent, indicating that the angular distribution of the chip surface has not changed, thereby improving the optical component. Angular sensitivity is eliminated.
  • Another advantage of the application is to provide a spectrum sensor module, wherein the spectrum sensor module can modulate the incident light signal through the light modulation layer of the spectrum chip, and restore the obtained incident light through the recovery algorithm as described
  • the spectral information is obtained, the color temperature value is calculated based on the obtained spectral information of the incident light, and the illumination information is calculated based on the response of the incident light, thereby improving the applicability of the spectrum sensor module.
  • Another advantage of the application is to provide a spectral sensor module, in which the spectral information of the incident light can be more accurately obtained through the spectral sensor module and uniform light at a large FOV angle, so that the color can be calculated more accurately. degree value.
  • a spectral sensor module of the present application can achieve the aforementioned objects and other objects and advantages.
  • the spectral sensor module includes:
  • optical components and spectrum chips wherein the optical components are located in the photosensitive path of the spectrum chip, and a light filter structure is provided on the light incident surface of the spectrum chip, and the filter structure is used to modulate incident light
  • the optical component includes a uniform light device and a lens arranged in sequence from the light incident side along the optical axis direction, so that the incident light is guided to the desired location through the uniform light device and the lens with a set incident angle and uniform light intensity.
  • the surface of the spectroscopic chip is arranged in sequence from the light incident side along the optical axis direction, so that the incident light is guided to the desired location through the uniform light device and the lens with a set incident angle and uniform light intensity.
  • the optical component further includes an aperture, wherein the aperture is located between the light uniformity device and the lens.
  • the uniform light device is used to collect incident light within a solid angle of 180° and eliminate optical coupling caused by the incident light.
  • the light uniformity device is a light uniformity film or a light uniformity sheet.
  • the light uniformity device is attached to the aperture.
  • the optical component further includes a filter element, wherein the filter element is located on the light exit side of the lens.
  • the lens has a light incident surface and a light exit surface.
  • the light incident surface of the lens faces the diaphragm and is a plane.
  • the light exit surface of the lens faces the spectrum chip and is a plane. Hemispherical surface.
  • the filter element is disposed between the light exit surface of the lens and the spectrum chip.
  • the filter element is attached to the light exit surface side of the lens.
  • the filter element is attached to the photosensitive surface of the spectrum chip.
  • the spectrum sensor module further includes a lens assembly, a circuit board and a base, the optical assembly is provided on the lens assembly, the spectrum chip is provided on the circuit board, and The circuit board is electrically connected, and the lens assembly is fixed to the base.
  • the lens assembly includes a lens barrel and a spacer, the optical assembly is disposed in the accommodation space of the lens barrel, and the spacer is disposed between the diaphragm and the lens. between.
  • the lens barrel of the lens assembly is fixed on the upper end surface of the base.
  • the lens assembly further includes a fixing mechanism for fixing the lens assembly to the base.
  • the fixing mechanism includes a support frame and a fixing unit. One end of the support frame is fixed to the base, and the other end of the support frame is connected to the lens barrel of the lens assembly.
  • the light uniforming device is fixed at the end of the lens barrel by the fixing unit.
  • the base has a mounting hole, and the spectrum chip is installed in the mounting hole of the base.
  • the lens barrel further includes an upper end and a lower end integrally extending downward from the upper end, and the light uniformity device is disposed on the upper end of the lens barrel, and The filter element is arranged at the lower end of the lens barrel.
  • the upper end of the lens barrel is further provided with a mounting groove
  • the lower end of the lens barrel is further provided with a mounting groove
  • the light uniformity device is fixed on all parts of the upper end.
  • the filter element is fixed in the mounting groove at the lower end.
  • the lens barrel is further provided with an aperture opening, wherein the aperture opening is formed on the upper end of the lens barrel.
  • a lens cover is also provided on the upper part of the lens barrel.
  • the lens cover is provided on the light uniformity device, and a light hole is provided on the lens cover.
  • threads are provided on the outer wall of the lens barrel, the lens barrel is connected to the base through the threads on the outer wall, and the lens cover and the lens are connected through the threads.
  • Figure 1 shows a schematic structural diagram of a spectrum chip according to some embodiments of the first design solution of the present application.
  • Figure 2 shows a schematic structural diagram of a light modulation layer according to some embodiments of the first design solution of the present application.
  • Figure 3 shows a schematic structural diagram of a spectrum sensor module according to some embodiments of the first design solution of the present application.
  • Figure 4 shows a schematic diagram of the positional relationship of the optical components relative to the spectrum chip according to some embodiments of the first design solution of the present application.
  • FIG. 5 shows an optical path diagram of the embodiment shown in FIG. 4 .
  • FIG. 6 exemplarily shows different light uniformity effects of ambient light in different areas on the light uniformity component.
  • FIG. 7 and 8 show schematic diagrams of the light spots formed by the diaphragm of the optical component irradiating on the light modulation layer according to some embodiments of the first design solution of the present application.
  • five light spots are taken as an example.
  • FIG. 9 shows a schematic diagram of the light spots formed by the diaphragm of the optical component irradiating the light modulation layer according to other embodiments of the first design solution of the present application.
  • four light spots are taken as an example.
  • FIG. 10 shows a schematic diagram of the light spot formed by the diaphragm of the optical component irradiating on the light modulation layer according to some other embodiments of the first design solution of the present application.
  • 11 and 12 show schematic diagrams of the light spot formed by the diaphragm of the optical assembly irradiating the light modulation layer according to other embodiments of the first design solution of the present application.
  • Figure 13 shows a schematic diagram of the intensity and size of the light spot formed on the light modulation layer by the diaphragm of the optical assembly according to some embodiments of the first design solution of the present application.
  • Figure 14 shows a schematic diagram of an optical diaphragm of an optical assembly equipped with a light attenuating sheet and/or a light enhancing sheet according to some embodiments of the first design solution of the present application.
  • Figure 15 shows a distribution pattern of apertures according to some embodiments of the first design solution of the present application.
  • Figure 16 shows a schematic structural diagram of a spectrum sensor module according to some embodiments of the first design solution of the present application.
  • FIG. 17 shows an optical path diagram of the spectrum sensor module of FIG. 16 .
  • Figure 18 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application, in which multiple apertures are provided.
  • FIG. 19 shows an optical path diagram of the spectrum sensor module of FIG. 18 .
  • FIG. 20 shows a perspective cross-sectional view of the spectrum sensor module of FIG. 18 .
  • Figure 21 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application.
  • Figure 22 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application.
  • Figure 23 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application.
  • Figure 24 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application, in which multiple apertures are provided.
  • Figure 25 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application, in which the housing is provided with a receiving portion in the form of a boss.
  • Figure 26 shows a schematic structural diagram of a spectrum sensor module according to other embodiments of the first design solution of the present application, in which a media component is provided.
  • Figure 27 is a schematic diagram of a spectrum chip of the spectrum sensor according to the first preferred embodiment of the second design solution of the present application.
  • Figure 28 is a schematic structural frame diagram of the spectral sensor according to the above-mentioned first preferred embodiment of the second design solution of the present application.
  • Figure 29 is a partial structural schematic diagram of the spectrum sensor according to the first preferred embodiment of the second design solution of the present application. It shows that the light cone angle of the optical signal channel of the spectrum chip is a preset angle. .
  • 30A and 30B are schematic structural diagrams of the spectrum sensor according to the above-mentioned first preferred embodiment of the second design solution of the present application.
  • Figure 31 is a schematic structural diagram of the optical component of the spectrum sensor according to the first preferred embodiment of the second design solution of the present application.
  • Figure 32 is a schematic structural diagram of the light through-hole member of the optical component of the spectrum sensor according to the first preferred embodiment of the second design solution of the present application.
  • 33A and 33B are schematic structural diagrams of the spectrum sensor according to the above-mentioned second preferred embodiment of the second design solution of the present application.
  • Figure 34 is a schematic diagram of the installation structure of the uniform light component of the spectrum sensor according to the second preferred embodiment of the second design solution of the present application.
  • Figure 35 is the response curve of the chip surface at different incident angles of the spectral sensor according to the above-mentioned preferred embodiment of the second design solution of the present application.
  • Figure 36 is a schematic diagram of the spectral sensor acquiring color temperature sensing information with spatial information according to the above-mentioned preferred embodiment of the second design solution of the present application.
  • Figure 37 is a schematic diagram of a spectrum chip of the spectrum sensor module according to the first preferred embodiment of the third design solution of the present application.
  • Figure 38 is the light output of the spectrum sensor module according to the above-mentioned first preferred embodiment of the third design solution of the present application. Schematic diagram of the structural framework of the spectrum sensor.
  • Figure 39 is a schematic diagram of the unfolded state of the spectrum sensor module according to the above-mentioned first preferred embodiment of the third design solution of the present application.
  • Figure 40 is a schematic structural diagram of the spectrum sensor module according to the above-mentioned first preferred embodiment of the third design solution of the present application.
  • Figure 41 is a schematic structural diagram of the spectrum sensor according to the above-mentioned first preferred embodiment of the third design solution of the present application.
  • Figure 42 is a schematic optical path diagram of the optical component of the spectrum sensor according to the above-mentioned first preferred embodiment of the third design solution of the present application.
  • Figure 43 is an enlarged schematic structural view of the lens of the spectrum sensor according to the first preferred embodiment of the third design solution of the present application.
  • Figure 44 is a schematic diagram of the light spot effect obtained by the spectrum sensor on the spectrum chip according to the above-mentioned first preferred embodiment of the third design solution of the present application.
  • Figure 45 is a schematic structural diagram of a spectrum sensor module according to the second preferred embodiment of the third design solution of the present application.
  • Figure 46 is a schematic structural diagram of a spectrum sensor module according to the third preferred embodiment of the third design solution of the present application.
  • the term "a” in the claims and description should be understood as “one or more”, that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element may be Can be multiple. Unless the disclosure of this application clearly indicates that the number of the element is only one, the term “a” or “an” shall not be understood as being unique or single, and the term “a” or “one” shall not be understood as limiting the quantity.
  • references to the terms “one embodiment,” “some embodiments,” “an example,” “specific examples,” or “some examples” or the like means that specific features are described in connection with the embodiment or example. , structures, materials or features are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described in this specification unless they are inconsistent with each other.
  • the first design solution of the present application provides a spectrum sensor, especially a miniaturized spectrum sensor, including a spectrum chip 20 and an optical component 10 disposed on the sensing path of the spectrum chip 20 .
  • the spectrum chip 20 includes a photodetection layer 230 and a light modulation layer 220 disposed on the light incident surface side of the photodetection layer 230 on the sensing path of the photodetection layer 230 .
  • the light modulation layer 220 includes at least one modulation unit 221 for modulating incident light.
  • the photodetection layer 230 is configured to obtain the optical signal modulated by the at least one modulation unit 221 .
  • the incident light is also referred to as the photographed light in the following text.
  • the optical component 10 is configured to receive the optical signal of the incident light from the photographed object or the optical signal of the photographed light, and guide the optical signal to the spectrum chip 20 .
  • the optical assembly 10 is configured such that the incident light guided onto the spectrum chip 20 achieves uniform light intensity.
  • the function of the uniform light component 110 is to achieve a fixed value of the light cone angle when the incident light reaches the light modulation unit 221 on the surface of the modulation layer after uniform light, and to achieve better consistency and stability. , which can better restore the spectral information.
  • the optical component 10 may also be provided with one or more diaphragms 120, whereby the areas with relatively good angular distribution in the center of the light spot 140 can be utilized for spectral recovery.
  • the central areas of multiple light spots 140 can also be combined and used together to recover the spectrum.
  • different modulation units 221 can be selected at different positions of the light modulation layer 220 to select light response data that is beneficial to spectral recovery.
  • FIG. 1 shows a schematic structural diagram of a spectrum chip 20 according to some embodiments of the first design solution of the present application.
  • the spectrum chip 20 includes a modulation structure 210 and an image sensor 240 .
  • the modulation structure 210 is located on the photosensitive path of the image sensor 240 .
  • the modulation structure 210 is a broadband modulation structure 210 in the frequency domain or wavelength domain. The pass spectra of different wavelengths of each modulation structure 210 are not exactly the same.
  • the modulation structure 210 can be a metasurface, photonic crystal, nanopillar, multilayer film, dye, quantum dot, MEMS (microelectromechanical system), FP etalon (FP etalon), cavity layer (resonant cavity layer), waveguide layer (waveguide layer) layer), diffractive elements and other structures or materials with filtering properties.
  • MEMS microelectromechanical system
  • FP etalon FP etalon
  • cavity layer resonant cavity layer
  • waveguide layer waveguide layer
  • diffractive elements other structures or materials with filtering properties.
  • the modulation structure 210 may include a photodetection layer 230 and a light modulation layer 220 located on a sensing path of the photodetection layer 230 .
  • the modulation structures provided on the light modulation layer of the modulation structure may be the same or have different shapes.
  • the modulation units formed by the modulation structure may be periodically arranged, or may be different, that is, non-periodically arranged.
  • the photodetection layer 230 includes a plurality of sensing units.
  • Each modulation unit 221 of the light modulation layer 220 corresponds to at least one sensing unit of the photodetection layer 230 along the optical path direction of the incident light.
  • the spectrum chip 20 uses the modulation unit 221 of the light modulation layer 220 to modulate the optical signal of the incident light from the measured target to obtain a modulated optical frequency signal, and uses the photoelectric detection layer 230 to receive the measured optical signal.
  • the modulated optical frequency signal is provided with a differential response, and then the signal circuit processing layer of the spectrum chip 20 is used to reconstruct the differential response to obtain the original spectral information of the measured target.
  • silicon-based materials are selected as materials for both the light modulation layer 220 and the photodetection layer 230 so as to have good compatibility in the manufacturing process.
  • the light modulation layer 220 can be directly formed on the photodetection layer 230, or the prepared light modulation layer 220 can be transferred to the photodetection layer 230 first.
  • the light modulation layer 220, the photodetection layer 230 and the image sensor 240 are vertically connected from top to bottom and parallel to each other.
  • the light modulation layer 220 is used to perform light modulation on the incident light to obtain a modulated spectrum.
  • the photodetection layer 230 is used to receive the modulated spectrum and provide a differential response to the modulated spectrum.
  • the image sensor 240 is used to process the differential response based on an algorithm to reconstruct the original spectrum.
  • FIG. 2 shows a schematic structural diagram of the light modulation layer 220 according to some embodiments of the first design solution of the present application.
  • the light modulation layer 220 includes at least one modulation unit 221 .
  • Each modulation unit 221 may be a micro-nano structural unit used to modulate incident light.
  • a single modulation unit 221 may include multiple modulation structures 222 of the same or different sizes and shapes, arranged in the same or different arrays, such as nanopores or nanopillars.
  • the modulation units 221 may be regularly arranged on the light modulation layer 220 in a periodic manner, or may be irregularly arranged on the light modulation layer 220 in a non-periodic manner.
  • Different modulation units 221 have different modulation effects on incident light, that is, different modulation units 221 can correspond to basically different transmission spectra.
  • the transmission spectrum mentioned in this application can be understood as a broad-spectrum transmission spectrum. According to the parameter characteristics of the modulation structure 222 in each modulation unit 221, the modulation effect and effect of the modulation unit 221 on incident light of different wavelengths can be determined.
  • the modulation effects or modulation methods on light of different wavelengths described in this application may include but are not limited to scattering, absorption, transmission, reflection, interference, surface plasmon polaritons, resonance and other effects.
  • the modulation structures 222 in different modulation units 221 By changing the modulation structures 222 in different modulation units 221, the difference in spectral response between different modulation units 221 can be improved.
  • the sensitivity to the difference between different spectra can be improved.
  • Different modulation units 221 may have the same or different modulation effects on light of different wavelengths. This can be set as needed, and is not specifically limited in this embodiment. According to the spectral information of the pixel points corresponding to each modulation unit 221 after the target beam is irradiated, the spectral information of the object to be imaged can be determined.
  • the modulation structures 222 provided in the modulation unit 221 may each have their own specific cross-sectional shape.
  • each modulation structure 222 may be freely combined and arranged according to the specific cross-sectional shape.
  • the specific cross-sectional shapes of some of the modulation structures 222 may be the same.
  • Each modulation structure 222 with the same specific cross-sectional shape constitutes a plurality of modulation structure groups.
  • the specific cross-sectional shapes of each modulation structure group are different from each other, and all the modulation structures 222 All freely combined.
  • the modulation unit 221 as a whole can be regarded as modulating the spectrum of a specific wavelength, or it can be freely divided into one or more modulation units 221 of the modulation structure 222, so as to be able to modulate the spectrum of a variety of different wavelengths.
  • the spectrum is modulated to increase the flexibility and diversity of light modulation.
  • the optical component 10 is located on the photosensitive path of the image sensor 240. After the light is adjusted by the optical component 10 and then modulated through the modulation structure 210, it is received by the image sensor 240 to obtain a spectral response. .
  • the optical component 10 may include, but is not limited to, optical components such as a uniform light component 110 and a filter component 130 .
  • the incident light passes through the optical component 10 and is vertically incident from above the light modulation layer 220 through the light modulation micro-nano structure, and then is modulated by the modulation unit 221 of the light modulation layer 220, and different response spectra are obtained in different modulation units 221. .
  • Each modulated response spectrum is illuminated on the corresponding sensing unit of the photodetection layer 230, and the response spectrum received by the corresponding sensing unit is different, thereby obtaining a differential response.
  • the differential response refers to the response of each modulation unit. Calculate the difference between the response spectrum signals obtained after 221 modulation.
  • the image sensor 240 uses an algorithm processing system to process the differential response, thereby obtaining the original spectrum through reconstruction.
  • the image sensor 240 of the spectrum chip 20 may be a CMOS image sensor (CIS), CCD, array light detector, etc.
  • the spectrum chip 20 is relatively sensitive to the main light angle of the optical signal incident on the modulation layer. Therefore, if it is too sensitive, it will affect the accuracy and stability of the spectrum recovery.
  • the chief light angle at any specific position of the spectrum chip 20 represents the angle between the chief ray of the optical signal guided to the spectrum chip 20 and the normal line, where the chief ray represents the angle from The normal line between the point where the light signal is emitted from the object and the point arriving on the surface of the modulation layer of the spectrum chip 20 represents a straight line perpendicular to the plane where the modulation layer of the spectrum chip 20 is located.
  • the optical component 10 is located on the photosensitive path of the spectrum chip 20 , wherein the light is guided to the surface of the spectrum chip 20 through the optical component 10 with a set incident angle and uniform light intensity, so that remain incident on The optical angle of the same sensing unit is fixed. It can be understood that the light-collecting light cone angle of the spectrum chip 20 when the incident light signal reaches each position on the upper surface of the light modulation layer 220 on the spectrum chip 20 also needs to be stable and cannot have a large change.
  • the light spot 140 obtained at the corresponding position of the modulation layer needs to be uniform, so that the light intensity on the corresponding photosensitive unit is uniform and the angular sensitivity is small.
  • the optical component 10 includes at least one aperture 120 .
  • the captured light passes through the at least one aperture 120 to form a light spot 140 that irradiates the light modulation layer 220 of the spectrum chip 20 .
  • the light spot 140 covers the spectrum chip 20 at least one modulation unit 221.
  • the modulation unit 221 is, for example, the smallest unit used to restore the spectrum corresponding to the incident light.
  • the at least one diaphragm 120 is located on the optical path and is used to control the size, angle and amount of light passing through the light spot 140 .
  • the optical component 10 further includes a uniform light component 110 , wherein the uniform light component 110 is disposed on the optical path of the captured light guided to the spectrum chip 20 .
  • the light uniformity component 110 is disposed on the light incident side of the aperture 120 , that is, relative to the incident light propagation direction, the light uniformity component 110 is disposed in front of the aperture 120 .
  • the uniform light component 110 may also be disposed on the light exit side of the aperture 120, that is, relative to the propagation direction of the incident light, the uniform light component 110 is disposed behind the aperture 120.
  • the captured light passes through the uniform light component 110 and the aperture 120 in sequence, and then reaches the spectrum chip 20 .
  • the uniform light component 110 can also be disposed on the light exit side of the aperture 120 , that is, the captured light can first pass through the aperture 120 , then pass through the uniform light component 110 , and finally reach the spectrum chip 20 .
  • the uniform light component 110 can be a uniform light sheet, a uniform light film, etc. so that the incident light can obtain light with uniform intensity and the light intensity of the incident light of different wavelength bands in the spectrum recovery space region is basically the same.
  • the uniform light component 110 is configured so that the light spot 140 reaching the spectrum chip 20 through the optical component 10 is uniform and angle-insensitive.
  • a beam of light coming from different incident angles can illuminate each modulation unit 221 of the spectrum chip 20 with the same distributed intensity through the uniform light component 110 .
  • the uniform light component 110 needs to meet a certain light transmittance.
  • Table 1 below shows the corresponding relationship between the thickness of the uniform light component 110, the prescribed transmittance and the formula-fitted transmittance. For light uniforming components 110 with different thicknesses, their light transmittance and light uniforming effects are also different.
  • the light-diffusing component 110 is a light-diffusing sheet, and its thickness can be selected as the value in the third column of Table 1, and its unit is ⁇ m.
  • the uniform light component 110 may also be a coating, for example, a composite coating with 2 to 20 layers.
  • the coating is generally 30 ⁇ m.
  • the diffuser may be, for example, approximately from 5 ⁇ m to 1000 ⁇ m, or from 5 ⁇ m to 500 ⁇ m, especially 300 ⁇ m.
  • FIG. 6 exemplarily shows different light uniformity effects of ambient light in different areas on the light uniformity component. Since different materials have different light uniformity effects, different light uniformity components can be selected according to the size of the obtained light spot and the position of the modulation structure. Different thicknesses of uniform light components can produce different regional uniform light effects. Since the thinner the light uniforming component is, the lower the light uniformity ability is. However, different light uniforming effects of ambient light in different areas on the light uniformity component can be obtained, as shown in Figure 6 .
  • the thickness of the uniform light component is less than the set value, for example, refer to Table 1 and the thickness is less than or equal to 400, 300, 250, 200 or 100 ⁇ m, set a space to include red ( R), green (G), and blue (B) light sources, when light sources of different colors at different positions illuminate the uniform light component, different areas of uniform light will be formed at different positions corresponding to the uniform light component. Therefore, when it is necessary to obtain spectral information of ambient light in different areas, a thinner uniform light component needs to be used.
  • R red
  • G green
  • B blue
  • the corresponding red (R) and green (G) can be obtained.
  • the mixed light of the light source corresponds to the position and spectral information of the incident light obtained by the image sensor, which can perform regional spectral recovery for different ambient lights.
  • the optical component 10 may further include a filter component 130 .
  • the filter component 130 may be a filter or a filter film.
  • the filter component 130 is disposed in the optical path of the incident light. For example, it may be disposed above the uniform light component 110 or below the uniform light component 110 , that is, It is located on the light entrance surface or the light exit surface of the light uniformity component 110 .
  • the following connection methods of the optical component 10 can be designed according to the formation of the light path: the subject light is irradiated to the upper surface of the uniform light component 110, and after uniform light, is arranged under the uniform light component 110
  • the aperture 120 on the surface reaches the filter component 130 after passing through the aperture 120. After filtering the light, the light corresponding to the set waveband is obtained, and finally Finally, it is irradiated onto the modulation unit 221 of the light modulation layer 220 of the spectrum chip 20 .
  • the filter component 130 of the optical component Through the filter component 130 of the optical component 10, spectral information corresponding to incident light in different wavelength bands can be obtained, and at the same time, the adverse impact of light in other unnecessary wavelength bands on conventional requirements can be reduced.
  • the filter component 130 can selectively filter visible light, infrared light, etc.
  • the diaphragm 120 of the optical component 10 may be configured as a through hole formed by injection molding of a plastic part, or may be configured as an opaque coating formed on the upper surface and/or lower surface of the uniform light component 110. Aperture aperture of certain size. For these solutions, only the through hole or aperture hole is reserved for light transmission, and other areas block the light propagation path.
  • the opaque coating here may be a coating, such as a metal coating. For details, please refer to the description of coatings later.
  • the aperture 120 of the optical component 10 is configured as a light-transmitting aperture hole in the opaque coating formed on the upper surface and/or the lower surface of the light-diffusing component 110 , it can also be configured as a light-transmitting aperture hole.
  • a filter component 130 such as a filter
  • the diaphragm 120 is constructed with an opaque coating formed on the upper surface and/or lower surface of the filter, and forms a set size. Diaphragm hole to pass light.
  • the aperture 120 is configured as a light-transmitting aperture hole in an opaque coating formed on the upper surface and/or the lower surface of the filter.
  • the diaphragm 120 of the optical component 10 can be formed into a specific shape and aperture.
  • the cross section of the diaphragm hole can be circular or polygonal, and the longitudinal section can be cylindrical, square or trapezoidal.
  • the longitudinal section refers to the section along the optical path direction of the incident light, and the cross section refers to the section perpendicular to the optical path direction of the incident light.
  • the geometric characteristic parameters such as the aperture, cross-section and longitudinal section shape of the aperture can be set according to the size of the light spot 140 to be formed.
  • the optical component 10 may be provided with only one aperture 120.
  • a corresponding light spot 140 is formed on the spectrum chip 20.
  • the diaphragm 120 is configured as a circular hole, and the center of the circular hole is located on the optical axis of the imaging light path of the spectrum chip 20 .
  • a light spot 140 irradiating the light modulation layer 220 of the spectrum chip 20 is formed through the aperture 120 .
  • this light spot 140 covers all the modulation units 221 on the light modulation layer 220 of the spectrum chip 20 . Therefore, through the above measures, it is possible to perform optical imaging and/or spectral imaging of the environment or incident light at a single point or even multiple angles, and obtain relevant imaging information and spectral information.
  • the optical component 10 can even achieve collection of solid angles with a radiation angle within 180°, thereby achieving a large field of view FOV.
  • Incident light collection which also helps solve the problem of angular stability and consistency of the spectral sensor module when acquiring incident light.
  • the spectral information of the incident light can be obtained more accurately through uniform light with a large field of view FOV, so that the chromaticity value can be calculated more accurately.
  • the optical assembly 10 may also be provided with multiple apertures 120.
  • the multiple apertures 120 are configured to form multiple apertures through the multiple apertures 120. 140 light spots.
  • the multiple apertures 120 are configured to respectively form a light spot 140 irradiating the light modulation layer 220 of the spectrum chip 20 through the multiple apertures 120 .
  • FIG. 7 and 8 show schematic diagrams of light spots 140 formed by the diaphragm 120 of the optical assembly 10 irradiating on the light modulation layer according to some embodiments of the first design solution of the present application.
  • five light spots 140 are used respectively.
  • the optical component includes five diaphragms as an example for description, each of which forms a light spot 140 and illuminates the corresponding modulation unit 221 on the light modulation layer 220 .
  • the number, position and arrangement of the apertures can be changed as desired and are not limited to the parameters adopted here for the purpose of illustration.
  • the captured light passes through the aperture 120 of the optical component 10 to form a light spot 140, and is illuminated on the corresponding modulation unit 221 of the light modulation layer 220 of the spectrum chip 20.
  • the light modulation layer 220 may be formed of one or more modulation units 221, and the modulation unit 221 may be a single layer or multiple layers, and modulate the subject light.
  • the modulation unit 221 is, for example, the smallest unit for acquiring spectral information that restores the optical signal of the incident light of the subject. It should be noted that a plurality of different modulation structures 222 can be provided in the modulation unit 221.
  • the modulation structures 222 can be periodically arranged to form different modulation units 221.
  • the modulation unit 221 can be configured to restore the intensity of the incident light.
  • the smallest unit of spectral information. Since the modulation unit 221 in this application can be composed of multiple different modulation structures 222, each modulation unit 221 can be configured to obtain different responses and recover the spectrum according to the algorithm of Y TX (detailed introduction below)
  • One modulation structure 222 cannot calculate accurate spectral information of the incident light, so at least two different modulation structures 222 are required to form a modulation unit 221 for calculating and obtaining the spectral information of the incident light.
  • each aperture 120 is configured to form a light spot 140, and each light spot 140 formed does not affect each other.
  • the light spots 140 formed by each aperture 120 can be irradiated at different positions on the spectrum chip 20 , and each light spot 140 covers the modulation units 221 at different positions on the light modulation layer 220 of the spectrum chip 20 .
  • each light spot 140 covers one modulation unit 221 on the light modulation layer 220 of the spectrum chip 20 on a one-to-one basis.
  • the plurality of apertures 120 are configured such that the overall combination of the light spots 140 formed by the plurality of apertures 120 and irradiated to the light modulation layer 220 of the spectrum chip 20 covers all the light spots on the spectrum chip 20 .
  • the spectrum chip 20 of the spectrum sensor is provided with five apertures 120, and the diameters of the five apertures 120 may be different (Fig. 7), or of course may be the same (Fig. 8).
  • the diameter of the aperture 120 can be set according to the number of structures of the light modulation layer 220 of the spectrum chip 20 .
  • the diameter of the aperture 120 is approximately 10 mm ⁇ aperture aperture - design target ⁇ 0.001 mm.
  • the light modulation layer 220 of the spectrum chip 20 may further include at least one The non-modulation unit 221 may be arranged on the light modulation layer 220 spaced apart from the at least one modulation unit 221 .
  • Each modulation unit 221 and non-modulation unit 221 of the light modulation layer 220 may respectively correspond to at least one sensing unit of the photodetection layer 230 along the photosensitive path. Therefore, the modulation unit 221 of the light modulation layer 220 can be configured to modulate the imaging light entering the corresponding sensing unit, and the corresponding sensing unit is adapted to obtain the spectrum of the imaging light.
  • the non-modulation unit 221 of the light modulation layer 220 can be configured not to modulate the imaging light entering the corresponding sensing unit, and the corresponding sensing unit is adapted to obtain the imaging light.
  • Light intensity information For this situation, according to the present application, an aperture 120 can also be provided in the optical component 10, and the light spot 140 formed by it is irradiated on the corresponding non-modulation unit 221 on the light modulation layer 220, and passes through the photodetection layer 230.
  • the corresponding sensing unit on the device obtains accurate light intensity information of the imaging light, thereby obtaining higher quality image information.
  • other light sensing functions such as flick
  • FIG. 9 shows a schematic diagram of the light spots 140 formed by the aperture 120 of the optical component 10 irradiating the light modulation layer 220 according to other embodiments of the present application.
  • four light spots 140 are taken as an example.
  • the optical component 10 of the spectral sensor is provided with four apertures 120 .
  • the light modulation layer 220 of the spectrum chip 20 may include a plurality of modulation units 221 arranged periodically, and each modulation unit 221 includes a plurality of spectral modulation structures 222, such as modulation holes or modulation columns.
  • the photodetection layer 230 is located below the light modulation layer 220 and is used to receive the modulated spectrum and provide a differential response to the modulated spectrum.
  • the image sensor of the spectrum chip 20 240 is located below the photodetection layer 230 and is used to reconstruct the differential response to obtain the original spectrum.
  • the sensing unit of the photodetection layer may be one physical pixel or multiple physical pixels of the image sensor.
  • one or more physical pixels corresponding to one or more modulation units may be called “spectral pixels”.
  • the spectral restored pixel unit refers to a "spectral pixel”
  • the modulation unit is a set of structural units corresponding to the spectral pixels.
  • “spectral pixel” is a pixel definition from the perspective of spectral imaging. This spectral pixel can also be understood as the smallest unit that can be used to recover the spectral information of the captured light.
  • the intensity signal of ambient light at different wavelengths ⁇ is recorded as f( ⁇ ), and the transmission spectrum curve of the modulation structure is recorded as T( ⁇ ).
  • I i ⁇ (f( ⁇ ) ⁇ T i ( ⁇ ) ⁇ R( ⁇ ))
  • R( ⁇ ) is the response of the detector, recorded as:
  • S is the light response of the system to different wavelengths, which is determined by two factors: the transmittance of the modulation structure and the quantum efficiency of the photodetector response.
  • S is a matrix. Each row vector corresponds to the response of a broadband filter unit (i.e., photodetector unit and its corresponding modulation structure) to ambient light of different wavelengths.
  • the ambient light is discretely and uniformly sampled, with a total of n sampling points.
  • the number of columns of S is the same as the number of sampling points of the ambient light.
  • f( ⁇ ) is the spectrum of ambient light at different wavelengths ⁇ , which is the ambient light spectrum to be measured.
  • the response parameter S of the system is known.
  • the spectrum f of the input light can be obtained through algorithm inversion.
  • the process can use different data processing methods depending on the specific situation, including but not Limited to: least squares, pseudo-inverse, equilibrium, least square norm, artificial neural network, etc.
  • a physical pixel corresponding to a group of structural units as an example to illustrate how to use m groups of physical pixels (that is, pixels on the image sensor) and their corresponding m groups of structural units (the same structures on the modulation layer are defined as structural units).
  • the modulation unit 221) recovers a spectral information, also called a "spectral pixel".
  • multiple physical pixels may also correspond to a group of structural units.
  • a group of structural units and corresponding at least one physical pixel constitute a unit pixel.
  • at least one unit pixel constitutes one of the spectral pixels, which can generate one color temperature channel, and multiple spectral pixels can generate multiple color temperature channels.
  • each modulation unit 221 can be set to be composed of n*n spectral modulation structures 222 (n is any integer).
  • n is any integer
  • other array forms of spectral modulation structures 222 can also be considered to form the modulation unit 221, for example, m*n. It is composed of spectral modulation structures 222 (m and n are arbitrary integers).
  • each modulation unit 221 is provided on the light modulation layer 220 of the spectrum chip 20 in the spectrum sensor, and each aperture 120 corresponds to one modulation unit 221 respectively.
  • each modulation unit 221 is provided with 3*3 spectral modulation structures 222.
  • a spectral chip 20 is composed of four spectral pixels 224.
  • one spectral pixel 224 can be covered by four light spots 140.
  • the corresponding four light spots 140 are respectively composed of four apertures. 120 formed.
  • the modulation unit 221 corresponds to one or more physical pixels of the photodetection layer 230, where at least two modulation units 221 form one spectral pixel.
  • the plurality of apertures 120 are configured to form multiple pairs of light spots 140 formed on the spectrum chip 20 by the light signal of the photographed target through the plurality of apertures 120 .
  • Many or many to one For example, multiple apertures 120 correspond to one light spot 140, or multiple apertures 120 correspond to multiple light spots 140, especially one-to-one correspondence.
  • FIG. 10 shows a schematic diagram of the light spot 140 formed by the diaphragm 120 of the optical assembly 10 irradiating on the light modulation layer 220 according to other embodiments of the present application.
  • the modulation units 221 at different positions on the same spectrum chip 20 are periodically arranged.
  • a corresponding light spot 140 can be illuminated at a set position corresponding to each period, and a corresponding aperture 120 is provided in the optical component 10 to form the light spot 140 at this position.
  • a light spot 140 is formed at a corresponding position on the light modulation layer 220 of the spectrum chip 20.
  • the diaphragm 120 is further configured to pass through one or more modulation units 221 corresponding to the light spot 140 behind the diaphragm 120 and obtain the spectral response corresponding to the incident light through the image sensor 240 .
  • the spectral response of the incident light is obtained through one or more modulation units 221 corresponding to each light spot 140 .
  • the modulation unit 221 corresponding to the set position in each cycle is composed of the aperture. 120 is covered by the light spot 140 formed by the light signal of the photographed object that passes through.
  • the light spots 140 respectively cover different positions on the spectrum chip 20 .
  • the modulation unit 221 may alternatively configure the aperture 120 so that the multiple light spots 140 formed by the aperture 120 cover different positions of the same modulation unit 221.
  • the aperture 120 is configured such that the multiple light spots 140 formed by the aperture 120 can cover different modulation sub-units of the same modulation unit 221 respectively. unit.
  • the aperture 120 is configured such that the light spot 140 formed by the aperture 120 can also illuminate multiple modulation sub-units at the same position in different periods of the modulation unit 221 .
  • the multiple light spots 140 formed by the aperture 120 may cover the modulation sub-units at the same position in different modulation units 221 respectively.
  • the recovery algorithm can be performed by using the spectral response matrices of different spectral modulation structures 222 of different spectral pixels 224 when incident light reaches them. Since the parameters of the modulation response that can be obtained increase or the modulation intensity increases, the accuracy and stability of the spectral recovery are improved. Increased sex. In addition, through different paired combinations of apertures, modulation units and modulation sub-units, personalized optoelectronic characteristics can be customized to meet the needs of different applications and sensing performance.
  • the light modulation layer 220 of the spectrum chip 20 is composed of a plurality of different sets of modulation units 221 as spectrum units.
  • the spectrum units are periodically arranged on the spectrum chip 20.
  • the aperture 120 is also configured such that the light spot 140 formed by the plurality of diaphragms 120 and irradiated onto the light modulation layer 220 of the spectrum chip 20 covers the different modulation units 221 of the spectrum unit.
  • the light modulation layer 220 of the spectrum chip 20 is composed of a plurality of different sets of modulation units 221 as spectrum units, and the spectrum units are periodically arranged on the spectrum chip 20 .
  • a spectral unit can be composed of multiple different spectral modulation structures 222, or a spectral unit can be composed of multiple layers of the same modulation unit 221.
  • the spectral unit can be composed of a plurality of different modulation units 221 arranged periodically.
  • a set of responses to incident light can be obtained in each spectrum unit. Smoothing can be performed based on the responses of multiple sets of incident light to obtain a more accurate response.
  • the accurate response of incident light that is, T( ⁇ )
  • T( ⁇ ) can more accurately obtain the response of incident light at different locations on the spectrum chip.
  • the aperture 120 is further configured such that the light spot 140 formed by the plurality of apertures 120 and irradiated to the light modulation layer 220 of the spectrum chip 20 covers the same light spot of different spectral units. position on the modulation unit 221.
  • the aperture 120 is further configured such that the light spot 140 formed by the plurality of apertures 120 and irradiated to the light modulation layer 220 of the spectrum chip 20 covers the corresponding corresponding parts of different spectral units.
  • the modulation units 221 at different positions, and a plurality of the modulation units at different positions constitute a spectrum unit within one cycle. That is to say, the light spots illuminate the modulation units 221 at different positions, and then if these different positions in different periods are combined with each other, they can actually form a spectral unit within one period.
  • a modulation unit in the form of a nine-square grid is set, and then nine light spots illuminate each position of the nine-square grid in different cycles, that is, the first position in the first cycle, then the second position in the second cycle, and so on, until the ninth The ninth position of the cycle, these positions combined with each other can form the nine positions of a cycle.
  • FIG. 13 illustrates the diaphragm 120 of the optical assembly 10 formed on the light modulation layer 220 according to some embodiments of the present application.
  • a schematic diagram of the intensity and size of the light spot 140 is obtained. As shown in Figure 13, it is a schematic diagram of the light spot 140 formed by different apertures 120 irradiating the spectrum chip 20. The uniformity and stability of the light spot 140 obtained for this purpose can be obtained under the same or different apertures 120.
  • the intensities of the light spots 140 may be the same or different, and the sizes of the light spots 140 may also be the same or different.
  • FIG. 14 shows a schematic diagram in which the diaphragm 120 of the optical assembly 10 is provided with a light attenuating sheet 225 and/or a light enhancing sheet 223 according to some embodiments of the present application.
  • the optical component 10 of the spectral sensor further includes a light attenuation sheet 225 and/or a light enhancement sheet 223 disposed at one or more aperture 120 positions.
  • the light attenuation sheet 225 provided at the position of the diaphragm 120 is used to attenuate the incident light signal of the photographed object, and/or the light enhancement sheet 223 is used to enhance the incident light signal of the photographed object.
  • the light attenuating sheet 225 and/or the light enhancing sheet 223 are disposed at a plurality of aperture positions, and the plurality of apertures 120 are configured to be formed by corresponding to the aperture 120
  • the light spot covers different modulation sub-unit positions of the modulation unit 221 in the same period.
  • the light attenuating sheet 225 and/or the light enhancing sheet 223 are disposed at a plurality of aperture positions, and the plurality of apertures 120 are configured to be formed by corresponding to the aperture 120
  • the light spots cover the same modulation sub-unit position of the modulation unit 221 in different periods.
  • the light attenuation sheet 225 can be set at one or more aperture 120 positions, or the light enhancement sheet can be set at a certain aperture 120 position, or a light attenuation sheet 225 can be set at the set aperture 120 position. Attenuation sheet 225 and light enhancement sheet 223. When the incident light intensity exceeds the set threshold, spectral information corresponding to the position where the light attenuation sheet 225 is disposed can be obtained; when the incident light is lower than the set threshold, spectral information corresponding to the position where the light enhancement sheet is disposed is obtained.
  • the light attenuating sheet 225 There are many ways to set up the light attenuating sheet 225 , which can be achieved by coating (coating a layer of translucent material) on the filter below the aperture 120 , or by reducing the aperture of the aperture 120 . On the contrary, a large aperture diaphragm 120 can be provided to achieve light enhancement.
  • Figure 15 shows a distribution pattern of aperture 120 according to some embodiments of the present application.
  • multiple apertures 120 may also be provided on the light exit surface of the light uniformity component 110 .
  • multiple apertures 120 are formed through integrated plating.
  • the number, distance and arrangement of the apertures 120 can be set according to requirements.
  • each circular light spot 140 is generated by a corresponding diaphragm 120 .
  • filter components 130 with different filter bands can be provided corresponding to different positions of the diaphragm 120 to meet the spectral response and recovery of different ambient light in different wave bands.
  • This application also proposes a spectrum sensor module, which includes the spectrum sensor and a circuit board 5 (PCB).
  • the spectrum chip 20 of the spectrum sensor is placed and electrically connected to the circuit board 5 .
  • the spectral information obtained through the spectral sensor module can be used to recover ambient light parameters such as color temperature, illumination, and brightness.
  • the spectrum chip 20 of the spectrum sensor is placed and electrically connected to the circuit board 5 .
  • a base plate 6 is provided on the circuit board 5 , on which base plate 6 the spectral chip 20 of the spectral sensor can be mounted.
  • the spectrum chip 20 is configured to receive incident light, modulate the incident light to obtain a response signal, and obtain spectral information of the incident light based on the response signal and a calculated spectrum recovery algorithm.
  • a uniform light component is also provided on the optical path of the incident light irradiating the spectrum chip 20 110.
  • the uniform light component 110 is configured so that the light incident on the uniform light component 110 is uniformly reflected in all directions.
  • the uniform light component 110 is configured such that incident light passing through the uniform light component 110 forms a cosine illuminant.
  • the luminous intensity of the uniform light component 110 configured to pass through the uniform light component 110 is D ⁇ cos ⁇ , that is, its brightness B has nothing to do with the direction, where D is a certain direction of each unit S of the light emitting surface, or Speaking of the luminous intensity in any direction r, ⁇ is the angle between r and the normal n.
  • the light uniformity component 110 is any one of a light uniformity film, a light uniformity sheet, or a light uniformity coating.
  • an opaque layer is provided on the light-emitting surface of the light-diffusing sheet.
  • the opaque layer can be formed by plating an opaque metal material and retains a set aperture.
  • the aperture is 120.
  • the thickness of the opaque layer is determined by the diaphragm aperture, the number of diaphragms, and the distance between the diaphragms.
  • the spectrum sensor module may further include a data processing unit 3.
  • the data processing unit 3 may be a processing unit such as MCU, CPU, GPU, FPGA, NPU, ASIC, etc., which may further perform operations on the data generated by the image sensor 240. and processing, in particular the generated data can be exported externally for processing.
  • the image sensor 240 is configured to obtain a response signal to the incident light modulated by the light modulation layer 220 , and obtain spectral image information from the response signal, wherein a plurality of modulation units 221 are provided on the light modulation layer. Multiple modulation units 221 may be provided on the light modulation layer 220 .
  • the optical component 10 of the spectrum sensor sequentially includes a uniform light component 110, an aperture 120 and a possible filter component 130 along the optical path direction of the incident light.
  • the optical component 10 of the spectral sensor module shown here has an aperture 120 .
  • multiple different apertures 120 can also be provided.
  • the aperture 120 is only used as an example for explanation here, and the relevant features can also be applied to spectrum sensor modules with multiple different apertures 120 .
  • the description made in conjunction with the aperture 120 in the specification is also applicable to the case of multiple apertures 120 and vice versa, and will not be described again.
  • the spectrum sensor module also includes a housing 4, which serves as the frame structure of the entire module and is used to form an accommodation space for the optoelectronic components of the spectrum sensor module, and to provide mechanical support and electrical load-bearing for the relevant optoelectronic components. Function, so that the spectrum sensor module can realize the corresponding photoelectric function.
  • the housing 4 of the spectral sensor module includes a first support 411 in which the at least one aperture 120 of the optical assembly 10 is constructed.
  • one or more apertures 120 of the optical assembly 10 are provided in the first support 411 , for example in the form of through holes.
  • an aperture 120 is provided in the first support member 411 .
  • a plurality of apertures 120 in the form of a plurality of through holes may be provided.
  • the first support member 411 is configured as a plate-shaped or disc-shaped element, and its plate plane or disc plane is arranged substantially perpendicular to the optical path of the incident light irradiating the spectrum chip 20 .
  • the thickness of the first supporting member 411 is also the structural size or structural height of the first supporting member 411 in the optical path direction of the incident light irradiating the spectrum chip 20 .
  • an aperture 120 is provided in the first support 411 .
  • the uniform light component 110 of the optical component 10 of the spectrum sensor is disposed along the optical path along which the incident light irradiates the spectrum chip 20.
  • the uniform light component 110 is disposed on the upper surface of the first support member 411, that is, the first support member 411 on the surface facing the incident light and opposite to the diaphragm 120.
  • the incident light passes through the uniform light component 110 and the aperture 120 and then irradiates the spectrum chip 20 with a main light angle in the range of 0-20°.
  • the incident light is irradiated to the modulation layer of the spectrum chip 20 through the uniform light component 110 and the diaphragm 120 for light modulation.
  • the spectrum chip 20 obtains the response information of the incident light, and obtains the spectrum corresponding to the incident light through an algorithm. information.
  • the housing 4 of the spectrum sensor module also includes a second support member 412.
  • the second support member 412 is configured to support the first support member 411. For example, it can be supported between the first support member 411 and the circuit board or the spectrum sensor module. between the bottom plates 42 of the housing 4. Therefore, the first support member, the second support member 412 and the base plate 42 set together form the housing 4 of the spectrum sensor module.
  • the thickness of the second supporting member 412 is also the structural size or structural height of the second supporting member 412 in the optical path direction of the incident light irradiating the spectrum chip 20 .
  • the above structural form of the spectrum sensor module is beneficial to improving the photoelectric stability and mechanical reliability of the recovered spectrum of the spectrum sensor module.
  • the light emitted by the light source 8, or the reflected light of the object, or the ambient light is homogenized by the light uniformity component 110, and then passes through the aperture 120 and the filter component 130, with a fixed incident angle and The light intensity is guided to the surface of the spectrum chip 20 in a uniform manner.
  • the spectrum sensor module further includes a cover plate 43, which is supported and fixed on the first support member 411, for example, on the surface of the first support member 411 facing the incident light.
  • the cover plate 43 can be processed separately or provided separately, and is connected to the first supporting member 411 and the second supporting member 412 by, for example, gluing.
  • the cover plate 43, the first support member 411 and the second support member 412 may also be integrally injection molded.
  • the spectrum sensor module further includes a base plate 42 , which is opposite to the cover plate 43 or the first support member 411 on one side of the second support member 412 and is on the other side of the second support member 412 .
  • the second support member 412 supports and connects the first support member 411 at one end and is connected to the bottom plate 42 at the other end, so the second support member 412 functions as a support.
  • the circuit board 5 can be fixed on the base plate 42 .
  • the first support member 411, the second support member 412 and the bottom plate 42 of the spectrum sensor module form the housing 4 of the spectrum sensor module, which is used to protect and fix related optical and electronic components, especially Supporting the formation of a light path for incident light to illuminate the spectrum chip 20 .
  • the thickness of the first support member 411 is determined according to parameters such as the aperture (diameter) of the aperture, the distance between the center points of the apertures, the number of apertures, and the thickness of the second support member 412 .
  • the incident light passes through the uniform light component 110, and the angle of the incident light obtained after the uniform light is insensitive, and the incident light passing through the uniform light plate forms a Lambertian body, or a Lambertian-like body, and then passes through The uniform light is then irradiated onto the spectrum chip 20 through the aperture 120 to form a light spot 140.
  • the effective area of the light spot 140 follows the following empirical formula:
  • d represents the aperture or diaphragm diameter
  • h1 represents the distance from the light exit surface of the uniform light component 110 to the spectrum chip 20 in the direction of the optical path of the incident light irradiating the spectrum chip 20
  • h 2 represents the distance between the incident light irradiation and the spectrum chip 20. The distance from the light exit surface of the diaphragm 120 to the spectrum chip 20 in the direction of the optical path to the spectrum chip 20 .
  • h1 can also be defined as the distance from the light incident surface of the uniform light component 110 to the spectrum chip 20 in the direction of the optical path in which the incident light irradiates the spectrum chip 20
  • h 2 can be defined as the distance in the direction in which the incident light irradiates the spectrum chip 20 The distance from the light incident surface of the aperture 120 to the spectrum chip 20 in the direction of the light path.
  • the filter component 130 may be disposed on a surface of the first support member 411 opposite to the uniform light component 110 .
  • a filter component 130 such as a filter, is provided on the lower surface of the diaphragm 120.
  • the filter component 130 may also be disposed on the incident surface of the incident light, that is, the filter component 130 is disposed on the upper surface of the diaphragm 120 , that is, the surface facing the incident light.
  • the filter component 130 of the optical component 10 is disposed between the uniform light component 110 of the optical component 10 and the first support member 411 .
  • the filter component 130 may be a filter material coating or a filter. Therefore, the incident light is first irradiated on the filter component 130, and the incident light of the set wavelength band is obtained through the filter component 130, and then the light is homogenized. To this end, a uniform light component 110 is provided below the filter component 130 .
  • the filter component 130 , the uniform light component 110 and the aperture 120 are sequentially provided on the optical path where incident light irradiates the spectrum chip 20 .
  • a uniform light component 110 is arranged in sequence on the optical path where incident light irradiates the spectrum chip 20 .
  • the light uniformity component 110 may be a light uniformity sheet, a light uniformity film, etc., and the specific material may be polytetrafluoroethylene PET, PTFE, glass, etc.
  • the light-diffusion component is constructed as a Lambertian body.
  • Lambertian body refers to the phenomenon when the incident energy is uniformly reflected in all directions, that is, the incident energy is centered on the incident point and reflects energy isotropically around the entire hemispheric space, which is called diffuse reflection, also known as isotropic reflection.
  • a complete diffuser is called a Lambertian body. In the embodiments of the present application, it may not be limited to Lambertian, but may also be Lambertian-like. Compared with Lambertian, it can be within a certain error range.
  • the spectrum chip 20 is connected to the circuit board 5 through electrical connections, and the optical device is packaged in a protective shell, where the first support member 411 and the second support member 412 are used to protect and support the formation of the optical path.
  • a wedge-shaped groove 431 is provided in the cover plate 43, and the wedge-shaped groove 431 matches the shape of the light-diffusing component 110.
  • the above-mentioned light-diffusing component 110 can be disposed in the above-mentioned wedge-shaped groove 431, The uniform light component 110 is thereby embedded and fixed.
  • the wedge-shaped groove 431 can be provided completely around the outer edge of the light-diffusing component 110 , for example, the light-diffusing plate. That is, the wedge-shaped groove 431 is configured in a circular shape.
  • the wedge-shaped groove 431 can be configured as a through hole in the cover plate 43 , and the through hole can especially be a tapered hole, which is particularly beneficial to the installation, positioning and fixing of the light diffusion assembly 110 .
  • the narrow end of the tapered hole as the wedge-shaped groove 431 is located on the outer surface of the cover plate 43 , that is, the surface facing the incident light, while the wide end of the tapered hole is located on the outer surface of the cover plate 43 .
  • the inner surface is the surface facing the first support member 411 .
  • the inner and outer surfaces of the diffuser disposed in the tapered hole of the cover plate 43 are flush with the corresponding surfaces of the cover plate 43 . Further, the surface of the light-diffusion sheet is attached to the corresponding surface of the first support member 411 .
  • the wedge-shaped groove 431 can be provided on part of the circumference of the light-diffusing sheet for snapping and fixing the light-diffusing assembly 110 on the cover plate 43 .
  • a wedge-shaped groove 431 may be provided around the light-diffusing component 110, such as a light-diffusing sheet, at multiple relative positions, such as at the three corners of an equilateral triangle, the four corners of a square, etc., for engaging. Fix the light distribution component 110.
  • the light-diffusion sheet can also be connected to the cover plate 43 through other fixation methods, such as bonding.
  • the thickness of the cover plate 43 is not less than the thickness of the light uniformity component 110 . In this embodiment, the thickness of the cover plate 43 is the same as the thickness of the uniform light component 110 .
  • a substrate 6 is provided on the circuit board 5, and the spectrum chip 20 can be provided with placed on the substrate 6.
  • a protective cover may also be provided on the cover plate 43 to protect the cover plate 43 and the light uniformity component 110 provided in the cover plate 43 .
  • the protective cover can be a housing covering the cover plate 43 , or can be configured as a flat protective plate, which is, for example, fitted to the cover plate 43 .
  • the protective cover may be a Fresnel lens or cover glass.
  • the embodiment shown in FIG. 18 is provided with nine apertures 120 in the form of a 3 ⁇ 3 array in the first support 411 . Therefore, as shown in the optical path diagram of FIG. 19 , the incident After the light is uniformed through the uniform light plate, it directly enters the nine apertures 120, thereby passing through the corresponding apertures 120 in nine split light paths and continuing to introduce subsequent optical filters, and finally illuminates the light modulation of the spectrum chip 20 on layer 220.
  • the spectrum sensor module uses multiple apertures 120 to guide the incident light that has been homogenized by the uniform light component 110.
  • Each aperture 120 forms its own separate light splitting path to detect the incident light. Obtain the best light angle and light amount before reaching the corresponding sensing unit respectively.
  • These diaphragms 120 are provided in the first support member 411 , and are particularly configured as through holes penetrating the first support member 411 along the optical path direction of incident light.
  • the filter component 130 is disposed on the light exit side of the diaphragms 120 . In particular, the surface of the filter component 130 is in contact with the surface of the first support member 411 on the light exit side of the diaphragm 120 .
  • the incident light path, frequency, wavelength, angle, etc. can be personalized according to different spectral sensor application scenarios, light environment characteristics to be measured, and sensor photoelectric characteristics requirements.
  • desired, accurate and stable image imaging and/or spectral imaging information is obtained.
  • Figure 20 is a cross-sectional view of the spectrum sensor module cut along the center line of the middle row of aperture holes.
  • the first support member 411 and the second support member 412 are integrally constructed and thus form an integrated base.
  • the diaphragm 120 may be configured in an area of the base opposite to the light-diffusing component 110 , for example, configured as a light-transmitting diaphragm hole. See Figure 20.
  • the first support member 411 and the second support member 412 are made of the same material, and may be integrally processed in the same process, for example.
  • the first support 411 and the second support integrally form a housing 41, which supports the cover 43 and the diffuser embedded in the cover 43 at one end, and is connected to the circuit board 5 or the bottom plate at the other end.
  • a circuit board 5 for mounting the spectroscopic chip 20 can be arranged on this base plate.
  • the first support member 411 , the second support member 412 and the base plate may also be made in one piece, thereby forming the housing 4 of the spectrum sensor module.
  • the manufacturing and assembly process of the spectrum sensor module can be simplified, on the other hand, it is helpful to ensure the precise size and shape of the housing of the spectrum sensor module, and is conducive to the accuracy of the optoelectronic components. Positioning to avoid adversely affecting the quality of spectral imaging and image imaging.
  • the bottom plate 42 can also be made integrally with the housing 41 composed of the first support member 411 and the second support member 412 .
  • the first support member 411 , the second support member 412 and the bottom plate 42 thus form the can-shaped housing 4 of the spectrum sensor module, or form an integral part of the housing 4 .
  • the diaphragm 120 and the filter assembly 130 are provided in the first support 411 .
  • the A support member 411 is provided with a groove for accommodating the filter assembly 130, especially the filter.
  • the optical filter can be embedded into the groove of the first support member 411, especially the outer surface of the filter is flush with the edge of the groove, so that the optical filter and the first support member 411 form a neat appearance, which is beneficial to Install other optoelectronic components in the housing 4 to avoid adverse effects on the optical path and imaging process.
  • the light uniformity component 110 is also embedded in the cover plate 43 .
  • the narrow end of the tapered hole as the wedge-shaped groove 431 is located on the inner surface of the cover plate 43, that is, the surface facing away from the incident light, or in other words, the surface facing the first support member 411;
  • the wide end of the tapered hole is located on the outer surface of the cover plate 43, that is, the surface facing the incident light.
  • the two side surfaces of the light diffuser embedded in the tapered hole of the cover plate 43 are flush with the surface of the cover plate 43 respectively. Further, the surface of the light-diffusion sheet is attached to the corresponding surface of the first support member 411 .
  • the diaphragm 120 and the filter assembly 130 are provided in the first support 411 .
  • an aperture 120 is provided in the first support 411 , for example configured as a through hole in the first support 411 .
  • a groove for accommodating the filter assembly 130, especially a filter is provided in the first support member 411, and the groove corresponds to the position where the aperture 120 is provided in the first support member 411.
  • the optical filter can be embedded into the groove of the first support member 411, especially the outer surface of the filter is flush with the edge of the groove, so that the optical filter and the first support member 411 form a neat appearance, which is beneficial to Install other optoelectronic components in the housing and avoid adverse effects on the optical path and imaging process.
  • the first support member 411 and the second support member 412 may be integrally constructed.
  • the first support member 411 and the second support member 412 may be made of the same material, and may be made of the same material, for example. Processed as a whole in the process. Therefore, the first support 411 and the second support integrally form a housing 41, which supports the cover 43 and the diffuser embedded in the cover 43 at one end, and is connected to the circuit board 5 or the bottom plate 42 at the other end.
  • the circuit board 5 for placing the spectrum chip 20 can be disposed on the base plate 42 .
  • the uniform light component 110 is also embedded in the cover plate 43 .
  • the cover plate 43 is provided with a stepped hole 433.
  • the steps of the stepped hole 433 match the shape of the light uniforming component 110.
  • the light uniforming component 110 can be embedded in the stepped hole 433. , thereby positioning and fixing the uniform light component 110, while allowing the subject light to pass through the uniform light component 110, such as a uniform light plate.
  • the inner surface of the light diffusion sheet embedded in the step hole 433 of the cover plate 43 is flush with the inner surface of the cover plate 43 .
  • the circumferential edge of the outer surface of the light diffusion plate embedded in the step hole 433 of the cover plate 43 is The edge of the step hole 433 of the cover plate 43 is covered, so that the cover plate 43 forms a wrapping structure 432 for the diffuser embedded therein.
  • the advantage of this structural form is that the connection part between the uniform light component 110 and the cover 43 can be sealed higher through the wrapping structure 432 to prevent fog, water vapor, rainwater, etc. from intruding into the interior of the spectrum sensor module.
  • an aperture 120 is also provided in the first support 411 , for example, configured as a through hole in the first support 411 .
  • the central axis of this through hole coincides with the optical axis of the imaging optical path of the spectrum chip 20 , which is beneficial to optimizing the incident angle and uniform light intensity.
  • the surface of the light diffusion sheet can be bonded with the corresponding surface of the first support member 411 .
  • the diaphragm 120 and the filter assembly 130 are provided in the first support 411 .
  • a groove for accommodating the filter assembly 130 , especially the filter, is provided in the first support 411 .
  • the optical filter can be embedded into the groove of the first support member 411, especially the outer surface of the filter is flush with the edge of the groove, so that the optical filter and the first support member 411 form a neat appearance, which is beneficial to Install other optoelectronic components in the housing and avoid adverse effects on the optical path and imaging process.
  • This application also proposes a spectrum sensor module, which includes the spectrum sensor and a housing 4.
  • the spectrum chip 20 and the optical component 10 of the spectrum sensor are placed in the housing 4.
  • the optical component 10 is directly fixed in the housing 4 of the spectrum sensor module and is arranged on the optical imaging path of the spectrum chip 20 .
  • the housing 4 of the spectrum sensor module is an integral structure, which is processed in the same process using the same material, for example.
  • the housing 4 of the spectrum sensor module is an integrated columnar or cylindrical structure, and its geometric symmetry axis is coaxial with the incident light imaging optical path.
  • an aperture 120 is also provided in the first support member 411, which can also achieve the beneficial effects described above in conjunction with the aperture.
  • the diaphragm can be a light-transmitting hole in a light-shielding coating (for example, a metal coating).
  • the light-shielding coating is, for example, attached to the surface of the light-diffusing component 110 and/or the filter component 130 , especially the light-diffusing component. 110 and filter assembly 130 are sandwiched in between.
  • the housing 4 of the spectrum sensor module has an accommodating portion for accommodating and fixing the optical component 10 at one end facing the incident light.
  • the receiving portion for receiving and fixing the optical component 10 may be configured as a stepped hole 441 in the housing 4 of the spectrum sensor module.
  • the stepped hole 441 of the housing 4 has on the one hand an opening 442 for the passage of incident light and on the other hand a step 443 for positioning and fixing the optical component 10 , wherein the step 443 is formed around the opening 442 .
  • the entire optical component 10 can be embedded in the stepped hole 441 , and its edge can be pressed against the step 443 of the receiving portion of the housing 4 .
  • the outer surface of the optical component 10 embedded in the stepped hole 441 is flush with the inner surface of the housing 4 , that is, the combination of the two forms a flat and smooth surface.
  • the optical component 10 is embedded in the receiving portion of the housing 4 of the spectrum sensor module, and the circumferential edge of the outer surface of the optical component 10, that is, the circumferential edge of the surface facing the incident light, It can be covered by the side wall of the opening 442 of the receiving portion, whereby the receiving portion of the housing 4 forms a wrapping structure for the optical component 10 embedded therein.
  • This wrapping structure can be achieved, for example, by a chamfering structure on the side wall of the opening 442 of the receiving portion of the housing 4 or This is achieved by expanding the hole structure.
  • the advantage of this structural form is that the connection between the uniform light component 110 and the cover plate 43 can be sealed more highly through this wrapping structure, thereby preventing fog, water vapor, rainwater, etc. from intruding into the interior of the spectrum sensor module.
  • the optical component 10 includes a uniform light component 110, an aperture 120 and an optional filter component 130, which are sequentially stacked along the imaging optical path of the incident light to form a sandwich-type overall structural unit.
  • the diaphragm 120 may be a light-transmitting diaphragm hole in a separately provided light-shielding layer 150 .
  • This integral structural unit can be embedded into the receiving portion (for example, the stepped hole 441 ) of the housing 4 through form locking, material locking or force locking.
  • the inner surface of the light-diffusion component 110 that is, the surface facing the inside of the housing 4 , is flush with the inner surface of the housing 4 itself.
  • the receiving portion of the housing 4 is configured as a boss 444 on the housing 4 . That is to say, the receiving portion of the housing 4 protrudes from the overall outline of the housing 4 on the imaging optical path, for example, refer to the perspective view of the housing 4 shown in FIG. 25 .
  • Such a structure is conducive to increasing the internal space of the housing and facilitating the arrangement and installation of other optoelectronic components.
  • the optical component 10 may also be provided with multiple apertures 120 .
  • the diaphragm 120 may be a light-transmitting diaphragm hole in a separately provided light-shielding layer 150 .
  • the aperture 120 of the optical assembly 10 may also be configured as an aperture in an opaque coating (such as a coating, especially a metal coating), which may be coated on the The upper surface and/or the lower surface of the light uniformity component 110, or the upper surface and/or the lower surface of the optional filter component 130.
  • the housing 4 is also provided with a glue overflow groove 446, see Figure 24.
  • the glue overflow groove 446 is used to guide and accommodate craft glue.
  • the glue overflow groove 446 may be configured in the housing 4 , especially near the receiving portion for receiving and fixing the optical component 10 , for guiding and receiving glue that may flow out when bonding the optical component 10 , for example. Adhesive or glue.
  • the glue overflow groove 446 is configured in the housing 4 along the periphery of the accommodating portion for accommodating and fixing the optical component 10 , and is particularly configured as an annular groove structure.
  • the glue overflow groove 446 in the housing 4 can also be configured as a chamfer of the peripheral edge of the receiving portion for accommodating and fixing the optical component 10, formed by this chamfering structure. Gap or notch to accommodate glue spillage.
  • an exhaust hole 445 can also be provided, which can connect the internal space of the housing and the external environment to each other, thereby achieving The balance of pressure inside and outside the casing ensures the public welfare of the spectrum sensor module during the manufacturing process and the stability during the working process.
  • the exhaust hole 445 can also be provided with a plug, which can close and seal the exhaust hole 445 when necessary to avoid unnecessary contamination and impact on the interior of the housing.
  • a light-transmitting protective layer is also provided on the light modulation layer 220 of the spectrum chip 20, and a light-transmitting protective layer is provided on the light-transmitting protective layer.
  • Media component 7. The dielectric component 7 is a dielectric material with high light transmittance.
  • the media component 7 can provide both mechanical and optical functions. Structurally, the medium component 7 is disposed between the light modulation layer 220 of the spectrum chip 20 and the optical component 10, and supports the optical component 10, especially the uniform light component 110.
  • the refractive index of the highly transparent dielectric material is related to the thickness of the dielectric material.
  • a filter layer may be disposed on the light incident surface of the dielectric material, and the filter layer may be bonded to the light incident surface of the media component 7 .
  • the adhesive material used to bond the filter layer and the media component 7 is light-transmissive.
  • the incident light passes through the uniform light component 110 and the diaphragm 120 disposed behind the uniform light component 110 , continues through the medium component 7 , and reaches the light modulation layer 220 of the spectrum chip 20 .
  • the incident light can also pass through the uniform light component 110 and the diaphragm 120 provided below the uniform light component 110, continue to pass through the filter component 130 on the medium component 7, filter the light, and then enter the medium component 7, and then reaches the light modulation layer 220 of the spectrum chip 20 .
  • the diaphragm 120 may be configured as an aperture in a coating, and the coating may be coated on the light entrance side surface and/or the light exit side surface of the uniform light component 110 .
  • the coating is made of a light-shielding material, such as a metal coating, especially a chromium plating layer, thereby forming an opaque coating. Light can pass through the light-transmitting apertures in the coating, and these light-transmitting apertures also become light-transmitting apertures, the shape, number, and arrangement of which are described in detail later.
  • the coating may also be deposited on the light-incident side surface and/or the light-exit side surface of the filter component 130 .
  • metal plating is taken as an example for description.
  • the coating may be a composite structure, for example, including one or more coatings.
  • the one or more coatings are stacked on each other, and are correspondingly processed with light-transmitting aperture holes, thereby forming an integral coating with an aperture.
  • Different coatings of the coating can be made of different materials, so that through combinations of coatings and materials, different physical and optical properties of the coating and the aperture can be achieved.
  • the description of the characteristics of the coating here is particularly applicable to all the above exemplary embodiments described in conjunction with the spectral sensor module.
  • Some embodiments of the first design approach of the present application also provide an electronic device, including a spectrum sensor module.
  • the spectral information obtained through the spectral sensor module of the electronic device can be used to recover ambient light parameters such as color temperature, illumination, and brightness.
  • the electronic device may include one or more processors and memory.
  • the processor may be a central processing unit
  • the memory may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and/or non-volatile memory. Relevant control instructions or programs for realizing spectral imaging and/or image imaging may be stored in the memory.
  • the spectrum sensor includes a spectrum chip 100' and a light
  • the optical component 200' is located in the photosensitive path of the spectrum chip 100'.
  • the spectrum chip 100' includes a photodetection layer 110' and a light modulation layer 120' located on the photosensitive path of the photodetection layer 110', wherein the photodetection layer 110' is configured to obtain information passing through the light modulation layer. 120' modulated optical signal.
  • the optical component 200' is configured to receive light signals from the photographed object and guide the light signals to the spectrum chip 100'. The optical component enables each pixel unit guided to the spectrum chip 100' to have a fixed incident angle and uniform light intensity, thereby improving the accuracy of spectrum recovery of the spectrum sensor.
  • the spectrum chip 100' includes a filter structure 10' and an image sensor 20'.
  • the filter structure 10' is located on the photosensitive side of the image sensor 20'.
  • the filter structure 10' is a broadband filter structure 10' in the frequency domain or wavelength domain.
  • the pass spectra of different wavelengths of each filter structure 10' are not exactly the same.
  • the filter structure 10' can be a metasurface, photonic crystal, nano-column, multi-layer film, dye, quantum dot, MEMS (micro-electromechanical system), FP etalon (FP etalon), cavity layer (resonant cavity layer), waveguide layer (Waveguide layer), diffractive elements and other structures or materials with filtering properties.
  • the light filter structure 10' may be the light modulation layer in Chinese patent CN201921223201.2.
  • Figure 27 shows a schematic diagram of a spectrum chip of the spectrum sensor according to the second design embodiment of the present application, wherein the spectrum chip is one disclosed by the applicant of the present application in Chinese patent CN201921223201.2 Spectral chip. Based on the contents of the Chinese patent CN201921223201.2, it can be known that the spectrum chip 100' includes a photodetection layer 110' and a light modulation layer 120' maintained on the sensing path of the photodetection layer 110'.
  • the light modulation layer 120' includes at least one modulation unit 121', and each modulation unit 121' corresponds to at least one sensing unit 111' of the photoelectric detection layer 110', wherein the spectrum chip 100' utilizes
  • the modulation unit 121' of the light modulation layer 120' modulates the optical signal from the measured target to obtain a modulated optical frequency signal, and uses the photoelectric detection layer 110' to receive the modulated optical frequency signal and A differential response is provided to it, and then the signal circuit processing layer of the spectrum chip 100' is used to reconstruct the differential response to obtain the original spectral information of the measured target.
  • the light modulation layer 120' includes at least one modulation unit 121' and at least one non-modulation unit, and each modulation unit 121' and each non-modulation unit respectively correspond to the photodetection layer.
  • At least one sensing unit 111' of 110' that is, the modulation unit 121' and the sensing unit 111' can be arranged in a one-to-one correspondence, a one-to-many arrangement, or even a many-to-one arrangement, so The non-modulation unit and the sensing unit 111' may be arranged in a one-to-one correspondence, a one-to-many arrangement, or even a many-to-one arrangement.
  • the optical component 200 ′ is located on the photosensitive path of the image sensor 20 ′. After the light is adjusted by the optical component 200 ′ and then modulated through the filter structure 10 ′, the light is passed by the image sensor 20 'Receive and obtain spectral response; the optical component 200' can be but is not limited to optical components such as lens components and uniform light components.
  • the image sensor 20' of the spectrum chip 100' may be a CMOS image sensor 20' (CIS), CCD, array light detector, etc.
  • the spectrum sensor further includes a data processing unit, which may be an MCU, CPU, GPU, FPGA, NPU, ASIC or other processing unit, which may export the data generated by the image sensor 20' to the outside for processing.
  • the data is transmitted to the data processing unit to calculate the recovered spectral information of the incident light.
  • the process is described in detail as follows:
  • the intensity signals of the incident light at different wavelengths ⁇ are marked as unit, the transmission spectra of each group of structural units are different from each other.
  • one physical pixel is used, that is, one physical pixel corresponds to a group of structural units.
  • a group of multiple physical pixels may also be a group corresponding to a group of structural units. . Therefore, in the computational spectrum sensor according to the embodiment of the present application, at least two groups of structural units constitute a "spectral pixel".
  • the effective transmission spectrum (the transmission spectrum used for spectrum recovery, called the effective transmission spectrum) of the filter structure 10' may be inconsistent with the number of structural units. 'The transmission spectrum is manually set, tested, or calculated according to certain rules according to the needs of identification or recovery (for example, the transmission spectrum of each structural unit mentioned above is the effective transmission spectrum). Therefore, the number of effective transmission spectra of the filter structure 10' may be less than the number of structural units, or may even be greater than the number of structural units; in this variant embodiment, a certain transmission spectrum curve is not necessarily a group of structures. determined by the unit. Furthermore, this application can use at least one spectral pixel to restore the image. That is to say, the spectral sensor in this application can recover the incident light spectral curve according to the spectral response and can also perform spectral imaging.
  • A is the light response of the system to different wavelengths, which is determined by two factors: the transmittance of the filter structure and the quantum efficiency of the image sensor.
  • A is a matrix, and each row vector corresponds to the response of a group of structural units to incident light of different wavelengths.
  • the incident light is sampled discretely and uniformly, with a total of n sampling points.
  • the number of columns of A is the same as the number of sampling points of the incident light.
  • x( ⁇ ) is the intensity of the incident light at different wavelengths ⁇ , which is the spectrum of the incident light to be measured.
  • the filter structure can be directly formed on the upper surface of the image sensor, such as quantum dots, nanowires, etc., which directly form the filter structure in the photosensitive area of the sensor. Or materials (nanowires, quantum dots, etc.), taking the filter structure as an example.
  • the filter structure is formed on the upper surface of the raw material, so The transmission spectrum and the response of the image sensor are integrated, that is, it can be understood that the response of the detector and the transmission spectrum are the same curve.
  • a combination of the above two embodiments may also be used, that is, at least one filter structure for modulating incident light is provided on the image sensor with a filter structure.
  • the image sensor ie, photodetector array
  • the image sensor in the first embodiment which can be a CMOS image sensor (CIS), CCD, array photodetector, etc., is replaced with an integrated light filter structure in the second embodiment. image sensor.
  • the spectrum chip is relatively sensitive to the main light angle of the incident light signal. In actual use, changes in the main light angle of the incident light signal will greatly affect the accuracy of spectral recovery.
  • the chief light angle at any specific position of the spectrum chip 100' represents the angle between the chief ray of the optical signal guided to the spectrum chip 100' and the normal line, where the chief ray represents The normal line represents a line perpendicular to the light-sensitive surface of the spectrum chip 100'.
  • the main light angles of different sensing units are allowed to be greatly different, but they are incident on the same
  • the light rays of the sensing unit need to maintain a small angle difference, that is, the angle between the optics incident on the same sensing unit needs to be maintained at a fixed size, so that the spectral sensor can perform spectral recovery with accuracy and stability.
  • the optical component 200' is located in the photosensitive path of the spectrum chip 100', wherein the light is transmitted through the optical component 200' in a fixed incident angle and uniform light intensity. Guided to the surface of the spectrum chip 100', so as to keep the included angle of the light incident on the same sensing unit fixed.
  • the spectrum chip 100' has a light-collecting light cone for the incident light signal arriving at each position on the upper surface of the light modulation layer 120' on the spectrum chip 100'.
  • the angle also needs to remain stable and cannot have major changes.
  • the light-collecting light cone angle is a preset angle, which can be 0° to 50°.
  • the light-collecting light cone angles at three different positions a', b', and c' reaching the upper surface of the light modulation layer of the spectrum chip 100' remain fixed, that is, the angle ⁇ 1 reaching point a' each time measured is within the set range. Change or be as unchanged as possible. When reaching point b', ⁇ 2 changes within the setting range or remains as little as possible.
  • ⁇ 3 changes within the setting range or remains as unchanged as possible.
  • it reaches each point a' and b' as quickly as possible.
  • the light intensity of c' also remains uniform, or changes within a set range, and the set range is a smaller variation interval. In this way, the incident angle distribution is uniform, and the illumination distribution on the chip surface is uniform through the lens, while the angle distribution remains constant.
  • the optical component can be implemented as a uniform light component composed of an aperture and a filter, that is, the optical component 200' includes an aperture and a filter; or the optical component 200' is a uniform light component composed of an aperture, a filter, and a heat sink; or the optical component 200' is a uniform light component composed of a light diaphragm, an aperture, a filter, and a scattering sheet.
  • the light uniformity components include but are not limited to light uniformity sheets, light uniformity films, lens modules, etc.
  • the optical component 200' includes an aperture 30', a light uniformity member 40', a light through hole member 50' located in the light output path of the aperture 30', and a light through hole member 50' located in the light output path of the light through hole member 50'.
  • Lens 60' wherein the light uniformity member 40' is located on the light incident side of the diaphragm 30', and the light uniformity member 40' uniformizes the incident light.
  • the light-diffusing member 40' may be, but is not limited to, a light-diffusing film or a light-diffusing sheet.
  • the light-diffusing member 40' is a light-diffusing film.
  • the light uniformity member 40' is made of a diffuse scattering material, such as a polytetrafluoroethylene light uniformity film.
  • ambient light incident light
  • a small hole is formed through the light through hole member 50' to reach the desired location.
  • the lens 60' is then focused on the image plane through the lens 60', and the image plane is also the upper surface of the filter structural unit.
  • the incident light reaches the lower surface through the upper surface of the filter structure 10' and modulates the incident light, and then reaches The image sensor 20'.
  • the aperture 30' can be circular, rectangular or square, depending on its use.
  • the aperture 30' is circular, and in some systems (such as camera objective lenses), a diaphragm with a variable diameter is provided.
  • the center of the aperture generally coincides with the optical axis of the optical system, and the plane where the aperture is located is perpendicular to the optical axis.
  • the light uniformity member 40' of the optical assembly 200' can be a square or circular structure, which can be adjusted according to the usage scenario.
  • a circular uniform light film with a diameter is used as an example, and the uniform light film is a polytetrafluoroethylene sheet with a thickness of 0.1-0.8 mm.
  • the light through-hole component 50' of the optical assembly 200' is located on the light exit side of the diaphragm 30', wherein the light uniformity component 40' is a scattering material made of polytetrafluoroethylene.
  • the chip can collect radiated light within a 180° solid angle, thereby eliminating optical coupling problems caused by limitations in the light collection sampling geometry. After the light passes through the light uniformity member 40', it is further guided to the lens 60' by the light through hole member 50'.
  • the light through-hole member 50' has a light hole 501' that passes from front to back, wherein the light through-hole member 50' further has a light entrance 502' and a light outlet 503', wherein the light through hole member
  • the light entrance 502' and the light exit 503' of 50' are connected with the light hole 501' of the light through hole member 50', and the light entrance 502' is located on the light hole 501'.
  • the light entrance end of the hole 501', the light exit port 503' is located at the light exit end of the light hole 501'.
  • the ambient light is guided to the lens 60' through the light hole 501' of the light hole member 50', and then converges to the image plane through the lens 60'.
  • the light hole 501' of the light hole member 50' is a hole that is small at the front and large at the back.
  • the aperture size of the light entrance port 502' of the light through hole component 50' is smaller than the aperture size of the light outlet port 503' of the light through hole component 50', and the light through hole component is The aperture of the 50' light hole 501' gradually increases from the light entrance 502' to the light outlet 503', guiding ambient light from the light hole member 50' to the light outlet 503' at a specific angle.
  • Lens 60' is a specific angle.
  • the light through-hole member 50' has the function of limiting light beams.
  • the aperture of the light entrance 502' of the light through hole member 50' is a1'
  • the aperture of the light outlet 503' is b1'
  • the height of the light through hole member 50' is c1'
  • a1' is 3mm-5mm
  • b1' is 5mm-10mm
  • c1' is 2-4mm.
  • the angle ⁇ ' between the aperture edge of the light inlet 502' of the light through hole member 50' and the center line of the light outlet 503' and the axis is 10°-30°.
  • the diameter size of the diaphragm 30' is 1mm to 10mm
  • the light through hole component 50' is composed of several metal sheets with holes, where each aperture of the metal sheets is different in size, and the light through hole component 50' is composed of a plurality of metal sheets with holes.
  • the aperture cross-section of the hole is trapezoidal.
  • the light through-hole member 50' includes a plurality of through-hole member units 51', wherein the through-hole member units 51' are metal sheets with holes, and the light through-hole member 50' includes a plurality of through-hole member units 51'.
  • the plurality of through-hole unit units 51' of the hole member 50' are superimposed and penetrate front and back.
  • each aperture of the plurality of through-hole units 51' is different in size, and the aperture of the through-hole unit gradually becomes larger from the light incident direction to the light exit direction, so as to form a cross-section of Trapezoidal light hole 501'.
  • the light through hole member 50' is an integrally formed image structural member with a set aperture.
  • the uniform light component 40' is made of Teflon (polytetrafluoroethylene). ene) diffusing material, optimized for the 200-800nm spectrum band.
  • the optical components used in this application can realize the collection of solid angles with radiation angles within 150°, thereby realizing the collection of incident light with a large field of view FOV, which also solves the problem of stabilizing the angle at which the spectrum sensor acquires incident light. sex and consistency.
  • the optical component 200' of the spectrum sensor further includes a filter 70', wherein the filter 70' is located at the light exit end of the lens 60' along the direction of light propagation,
  • the optical filter 70' can filter light of a specific wavelength band and selectively transmit light of part of the wavelength band to reduce the impact of stray light on the spectral recovery results.
  • the optical filter is located at the light incident end of the lens 60', that is, after the incident light passes through the optical filter 70' Reach the lens 60'.
  • the sensor device is a specific structural embodiment of the above-mentioned spectral sensor.
  • the sensor device includes a spectrum chip 100', an optical component 200' and a circuit board 300', wherein the spectrum chip 100' is disposed on the circuit board 300' and is electrically connected to the circuit board.
  • the component 200' is disposed on the photosensitive path of the spectrum chip 100'. It is worth mentioning that the specific structures of the spectrum chip 100' and the optical component 200' are the same as the above-mentioned first preferred embodiment, and will not be described again here.
  • the circuit board 300' may be, but is not limited to, a PCB board, wherein the spectrum chip 100' is fixed on the surface of the circuit board 300', and the angle forming the FOV is within 150°, that is, the spectrum chip 100' collects 150 ° range of ambient light.
  • the spectrum chip 100' is an image sensor CIS with the filter structure.
  • the uniform light component 40' of the optical component 200' is a strong uniform light dispersion sheet made of polytetrafluoroethylene material, wherein the lens of the optical component 200' is located in the light through hole component 50' The light hole 501'.
  • the sensor device further includes a base 400', wherein the base 400' is disposed above the circuit board 300', and the light through-hole member 50' is disposed on the base 400' and passes through the base. 400' is fixed above the circuit board 300'. That is to say, in this preferred embodiment of the present application, the optical assembly 200' is fixedly arranged above the circuit board 300' by the base 300', and the optical assembly 200' is connected to the circuit board 300' through the base 300'.
  • the light through-hole component 50', the light uniformity component 40' and the lens 60' of the assembly 200' are maintained in the photosensitive path of the spectrum chip 100'. That is to say, the light through-hole member 40', the light-diffusing member 40' and the lens 60' of the optical assembly 200' are fixed through the base 300', so that the light-diffusing member 40', The light hole 501' of the light hole member 50' and the lens 60' are located in the same optical path.
  • the light diffusion plate 40' of the optical assembly 200' is fixed on the light incident side of the light through hole member 50'.
  • the sensor device further includes a fixing part 500', wherein the light uniformity sheet 40' of the optical assembly 200' is fixed to the base 400' by the fixation part 500'; or the light uniformity The piece 40' is fixed to the light through hole member 50' by the fixing member 500'.
  • the fixing member 500' can be implemented as a clamping element, The light-diffusion sheet 40' is clamped by the fixing member 500', and one end of the fixing member 500' is fixedly connected to the base 400'. 40' is maintained on the light incident side of the light through hole member 50'.
  • the fixing member 500' may be implemented as other forms of elements, such as screws, adhesive members, etc. Therefore, in this preferred embodiment of the present application, the specific implementation of the fixing member 500' is only used as an example and not a limitation.
  • the light through-hole component 50' of the optical assembly 200' is fixed to the base 400', wherein the base 400' is provided with a threaded slot corresponding to the light through-hole component 50' for
  • the metal sheet of the light through hole member 50' is fixed, and the plurality of metal sheets are stacked together to form the light through hole 501'.
  • the lens 60' is disposed at the lower end of the light through-hole member 50'. It is worth mentioning that the lens 60' is disposed at a position consisting of the light-diffusing member 40' and the light through-hole member 50'. And the light modulation layer that needs to be achieved is determined.
  • the thickness of the sensor device is 7.15 mm.
  • the parameters in this embodiment are examples and are not specifically limited in practical applications. The thickness of the uniform light sheet and the focal length of the lens can be adjusted according to sensor devices with different thicknesses, and the uniform light can also be fixed on the base. Adjust the thickness of the supporting piece of the piece.
  • the optical filter 70' is disposed on the light entrance side or the light exit side of the lens 60', wherein when the optical filter 70 When 'is disposed on the light incident side of the lens 60', the filter 70' is fixedly disposed on the light through hole member 50'.
  • the optical filter 70' is fixed to the light hole 501' by the light through hole member 50', and the light through hole member 50' will The filter 70' is held at the front end of the lens 60'.
  • the optical filter 70' is disposed at the exit end of the lens 60', wherein the optical filter 70' is It is fixed at the end of the light through hole member 50', and the light through hole member 50' holds the optical filter 70' at the light exit end of the lens 60'.
  • the optical filter 70' can be fixed at the end of the light through hole member 50' through a fixing member 70', or the optical filter 70'
  • the optical filter 70' can be fixed on the upper surface of the base 300' through a fixing member, and the optical filter 70' can be supported on the light exit end of the lens 60' through the base 300'.
  • the preset angle can be 35°-40°.
  • the light-receiving light cone angle of the sensor device has a certain degree of tolerance, and its light-receiving light cone angle is within ⁇ 5°. That is to say, in this preferred embodiment of the present application, the main light angle and the light receiving light cone angle of each sensing unit of the spectrum chip are controlled through the optical assembly 200' with a specific structural configuration.
  • the main light angle of the spectrum chip should take a fixed value, wherein the light-collecting light cone angle is a predetermined angle, and the predetermined angle is less than or equal to 45°, so as to reduce the spectrum recovery error of the spectrum chip.
  • the spectrum sensor provided by this application can modulate the incident light signal through the light modulation layer 120' of the spectrum chip, and restore the obtained spectral information of the incident light through the recovery algorithm as described below. According to the obtained incident light spectrum The information is used to calculate color temperature values and illumination information based on the response to incident light.
  • the spectral imaging sensor acquires color temperature sensing information with spatial information, where the spatial information can be two-dimensional spatial information or three-dimensional spatial information.
  • the spectral information is consistent with the image information acquired by the image sensor. form a spectral cube.
  • the spectrum chip 100' of the spectrum sensor can obtain color temperature information with spatial information.
  • the color temperature is calculated based on the spatial information of each pixel and the corresponding spectral information.
  • the color coordinates and illumination information can be calculated based on the obtained spectral information curve, specifically as follows:
  • ⁇ ( ⁇ ) is the expression of the spectral curve, Color standard for the XYZ color space specified by CIE.
  • the CIE RGB space can be used to define chromaticity in a conventional way: the chromaticity coordinates are r and g:
  • the chromaticity coordinates x, y, and CCT can be calculated through the obtained spectral information X and Y.
  • the spectral information of the incident light can be obtained more accurately, so as to more accurately obtain the spectral information of the incident light. Add accurate calculations to get the chromaticity value.
  • the spectrum sensor module includes a spectrum sensor 10", a lens assembly 20", a circuit board 3" and a base 4", wherein the circuit board 3" is electrically connected to the spectrum sensor 10", and the lens assembly 20" Located on the photosensitive side of the spectrum sensor 10", the spectrum sensor 10", the lens assembly 20" and the circuit board 3" are fixed to the base 4", and are supported and fixed by the base 4" The spectrum sensor 10" and the lens assembly 20".
  • the spectrum sensor 10 includes a spectrum chip 11" and an optical component 12", wherein the optical component 12" is located at the front end of the photosensitive path of the spectrum chip 11".
  • the spectrum chip 11 includes a photoelectric detection layer 110" and A light modulation layer 120" located on the photosensitive path of the photodetection layer 110", wherein the photodetection layer 110" is configured to obtain an optical signal modulated by the light modulation layer 120".
  • the optical component 12" Configured to receive the light signal from the photographed target and guide the light signal to the spectrum chip 11".
  • the optical component causes each pixel unit guided to the spectrum chip 11" to have a set The incident angle and uniform light intensity thereby improve the accuracy of spectral recovery of the spectrum sensor module.
  • the spectrum chip 11′′ includes a filter structure 101′′ and an image sensor 102′′, and the filter structure 101′′ is located on the image sensor 102′′.
  • the filter structure 101′′ is a broadband filter structure in the frequency domain or wavelength domain.
  • the pass spectra of different wavelengths of each filter structure 101" are not exactly the same.
  • the filter structure 101" can be a metasurface, photonic crystal, nano-column, multi-layer film, dye, quantum dot, MEMS (micro-electromechanical system), FP etalon ( FP etalon), cavity layer (resonant cavity layer), waveguide layer (waveguide layer), diffractive elements and other structures or materials with light filtering properties.
  • the filter structure 101′′ may be the light modulation layer in Chinese patent CN201921223201.2.
  • Figure 37 shows the structure of a spectrum chip of the spectrum sensor module according to the third design embodiment of the present application.
  • the spectrum chip 100" includes a photoelectric detection layer 110" and is held on the photoelectric detection layer 110".
  • the light modulation layer 120" on the sensing path of the detection layer 110".
  • the light modulation layer 120′′ includes at least one modulation unit 121′′, and each modulation unit 121′′ corresponds to at least one sensing unit 111′′ of the photoelectric detection layer 110′′, wherein the spectrum chip 100′′ utilizes The modulation unit 121" of the optical modulation layer 120" modulates the optical signal from the measured target to obtain a modulated optical frequency signal, and uses the photoelectric detection layer 110" to receive the modulated optical frequency signal and A differential response is provided to it, and then the signal circuit processing layer of the spectrum chip 100′′ is used to reconstruct the differential response to obtain the original spectral information of the measured target.
  • the light modulation layer 120′′ includes at least one modulation unit 121′′ and at least one non-modulation unit, and each modulation unit 121′′ and each non-modulation unit respectively correspond to the photodetection layer.
  • At least one sensing unit 111" of 110" that is, the modulation unit 121" and the sensing unit 111" can be arranged in a one-to-one correspondence, or in a one-to-many arrangement, or even in a many-to-one arrangement.
  • the non-modulation unit and the sensing unit 111′′ may be set up in one-to-one correspondence, or may be set up in one-to-many set-up, or even may be set up in many-to-one set-up. Set.
  • the optical component 12" is located on the photosensitive path of the image sensor 102". After the light is adjusted by the optical component 12" and then modulated through the filter structure 101", it is received by the image sensor 102" to obtain a spectral response. ;
  • the optical component 12" may be, but is not limited to, a lens component, a uniform light component, and other optical components.
  • the image sensor 102" of the spectrum chip 11" can be a CMOS image sensor 102" (CIS), CCD, array light detector, etc.
  • the spectrum sensor The spectrum chip 11" further includes a data processing unit 103".
  • the data processing unit 103" can be a processing unit such as MCU, CPU, GPU, FPGA, NPU, ASIC, etc., which can export the data generated by the image sensor 102" Process it externally.
  • the spectrum chip 11" is relatively sensitive to the main light angle of the incident light signal. In actual use, changes in the main light angle of the incident light signal will greatly affect the accuracy of spectral recovery. What needs to be explained Yes, the chief light angle at any specific position of the spectrum chip 11" represents the angle between the chief ray of the light signal directed to the spectrum chip 11" and the normal line, where the chief ray represents the angle from the subject The normal line represents the line perpendicular to the photosensitive surface of the spectrum chip 11 ′′. "In terms of the angle, the main light angle of different sensing units is allowed to be greatly different, but the light incident on the same sensing unit needs to maintain a small angle difference, that is, the optical angle incident on the same sensing unit is kept fixed. The size can ensure the accuracy and stability of spectral recovery by the spectral sensor module.
  • the optical component 12" is located in the photosensitive path of the spectrum chip 11", wherein the light is transmitted through the optical component 12" with a set incident angle and uniform light intensity. guide to the surface of the spectrum chip 11′′ in order to keep the included angle of the light incident on the same sensing unit fixed. It can be understood that the light-collecting light cone angle of the spectrum chip 11" when the incident light signal reaches each position on the upper surface of the light modulation layer 120" on the spectrum chip 11" also needs to be stable and cannot have a larger angle. change.
  • the optical component 12" includes a uniform light device 122", an aperture 123", a lens 124" and a filter element 125” arranged sequentially along the optical axis direction from the light entrance side to the light exit side.
  • the light reaches the spectrum chip 11" after passing through the uniform light device 122", the diaphragm 123", the lens 124" and the filter element 125" of the optical component 12" in sequence.
  • the light uniforming device 122" of the assembly 12" is used to uniformize the incident light.
  • the light uniforming device 122" can be, but is not limited to, a light uniformizing sheet or a light uniforming film.
  • the diaphragm 123" is located on the light exit side of the light uniformity device 122", wherein the diaphragm 123" has an aperture, and the diaphragm hole of the diaphragm 123" is in contact with the light uniformity device 122" Opposite in the axial direction.
  • the aperture 123" may be circular, rectangular or square, depending on its purpose. In this embodiment, the aperture is circular. In some systems (such as camera objective lenses), a diaphragm with a variable diameter is provided.
  • the center of the aperture generally coincides with the optical axis of the optical system, and the aperture plane is perpendicular to the optical axis.
  • the thickness of the uniform light device 122" be a
  • the thickness of the diaphragm 123" be b
  • the lower surface of the diaphragm 123" and the The distance between the light incident surface of the lens 124" is c
  • the distance between the light exit surface of the lens 124" and the upper surface of the spectrum chip 11" is d
  • the diameter of the aperture 123" is e
  • the divergence angle is ⁇ " where the radius length of the imaging surface of the spectrum sensor module is Y 2 and satisfies the following relationship:
  • Y 2 (1-d/c)Y 1 +(b+c-bd/c)Y 2, where Y 1 is e, and ⁇ ” is the divergence angle of the light-emitting surface of Y 1 .
  • the optical component 12" includes a uniform light device 122", an aperture 123" and a light filter arranged in sequence from the light entrance side to the light exit side along the optical axis direction.
  • the optical component 12" includes a uniform light device 122", an aperture 123", a light filter, and a light uniformity device 122" arranged in sequence from the light entrance side to the light exit side along the optical axis direction.
  • element 125" and a scattering sheet (not shown in the figure).
  • the diaphragm 123′′ and the light uniformity device 122′′ are attached to each other, that is, the diaphragm 123′′ is attached to the light uniformity device 122′′. the light-emitting side.
  • there is a gap between the aperture 123" and the light uniformity device 122 that is, there is a gap between the aperture 123" and the light uniformity device 122 "Doesn't fit.
  • the distance between the aperture 123" and the light uniformity device 122" affects the distance between the lens 124" and the spectrum chip 11", that is, when the aperture 123" and the light uniformity device 122" When the device 122′′ is not attached, the distance between the lens 124′′ and the spectrum chip 11′′ becomes smaller.
  • the light uniforming device 122" is a light uniforming film, wherein the light uniforming film is a light uniforming film made of a diffuse scattering material such as polytetrafluoroethylene.
  • the uniform light device 122 When ambient light (incident light) is incident on the uniform light device 122", it reaches the lens 124" through the aperture hole of the aperture 123", and then is refracted to the filter through the lens 124"
  • the elements 125" finally converge on the image plane, which is also the photosensitive surface of the filter structure 101" of the spectrum chip 11".
  • the backlight surface of the filter structure 101" is on one side of the image sensor 102".
  • the incident light reaches the backlight surface through the photosensitive surface of the filter structure 101" and modulates the incident light, and then reaches the image sensor 102". .
  • the optical component 12′′ can collect light within a radiation angle of 0 to 170° solid angle to achieve incident light collection of a large field of view FOV, that is, This solves the problem of stability and consistency of the angle at which the spectrum sensor 10" acquires incident light.
  • the filter element 125′′ is located between the spectrum chip 11′′ and the lens 124′′, which is beneficial to improving the performance of the long wavelength band.
  • the filter element 125" is disposed close to the light incident side of the spectrum chip 11".
  • the filter element 125′′ is disposed close to The light-emitting side of the lens 124′′.
  • the filter element 125′′ is disposed between the lens 124′′ and the spectrum chip 11′′.
  • the filter element 125′′ is disposed between the lens 124′′ and the spectrum chip 11′′.
  • the filter element 125 " is disposed between the lens 124" and the diaphragm 123", which is more conducive to the recovery of the spectrum.
  • the long-wavelength incident light reaches the light spot of the spectrum chip 11" (circle A in the figure) Greater than the light spot obtained by placing the filter element 125" between the diaphragm 123" and the lens 124" (in the figure Circle B) should be larger.
  • the spectrum sensor module is designed to restore the spectrum more accurately for artificial sunlight such as D65.
  • the dotted box C in the figure is the data area actually selected by the spectrum chip 11" of the spectrum sensor 10
  • the circle A is when the filter element 125" is located between the lens 124" and the spectrum
  • the light spot range obtained on the surface of the spectrum chip 11" is between the chips 11.
  • Circle B is the surface of the spectrum chip 11" when the filter element 125" is located between the lens 124" and the diaphragm 123". The acquired spot range.
  • the lens 124" has a light incident surface 1241" and a light exit surface 1242", wherein ambient light is incident through the light incident surface 1241" of the lens 124" to the lens 124", and then exit through the light exit surface 1242" of the lens 124". Therefore, in this preferred embodiment of the present application, the light incident surface 1241" of the lens 124" faces toward the ambient light side (aperture 123"), and the light exit surface 1242" of the lens 124" faces toward on the spectrum chip 11".
  • the light incident surface 1241" of the lens 124" is a flat surface
  • the light exit surface 1242" of the lens 124" is a spherical surface (hemispheric surface), so as to pass through
  • the lens 124" gathers the ambient light to the sensing light surface of the spectrum chip 11", thereby realizing the collection of incident light with a large field of view FOV, which solves the problem of the stability and stability of the angle at which the spectrum sensor acquires incident light. consistency.
  • the optical component 12" of the spectrum sensor 10" is fixed to the lens component 20", and then the optical component 12" is fixed to the lens component 20" through the lens component 20".
  • the lens assembly 20′′ includes a lens barrel 21′′ and a spacer 22′′, wherein the lens barrel 21′′ has a receiving space for accommodating the optical assembly 12′′, the spacer 22′′ and the optical assembly 12" is fixed in the accommodation space by the lens barrel 21".
  • the lens barrel 21 ′′ is in a cylindrical shape, the light diffusion plate 122 ′′, the diaphragm 123 ′′, the lens 124 of the optical assembly 12 ′′ are ” and the filter element 125 ′′ are sequentially fixed in the accommodation space of the lens barrel 21 ′′.
  • the spacer 22" of the lens assembly 20" is disposed between the aperture 123" and the lens 124", wherein the spacer 22" has a preset thickness. "Adjust the distance from the diaphragm 123" to the lens 124" to adjust the path of the light. It is worth mentioning that the gasket 22" has a cylindrical hollow structure, and the size of the gasket 22" is adapted to the inner wall of the lens barrel 21", that is, the outer diameter of the gasket 22" is equal to The inner diameter of the lens barrel 21′′ is adapted.
  • the optical assembly 12" is provided on the lens assembly 20", and is fixed on the lens barrel 21" of the lens assembly 20".
  • the optical component 12" is fixed inside the lens barrel 12", and the optical component 12" Forming an integrated structure with the lens assembly 20", the lens barrel 21" of the lens assembly 20" is fixed on the base 4".
  • the spectrum sensor module further includes a fixing mechanism 50", and the optical component 12" is fixed by the fixing mechanism 50". The base 4".
  • the fixing mechanism 50" is implemented as a fixing frame, wherein one end of the fixing mechanism 50" is connected to the base 4", and the optical assembly 12" passes through the lens assembly 20".
  • the lens barrel 21" is fixed on the other end of the fixing mechanism 50".
  • the fixing mechanism 50" has a mounting hole for mounting and fixing the lens barrel 21" of the lens assembly 20".
  • the lens barrel 21 ′′ of the lens assembly 20 ′′ is fixed to the front end of the fixing mechanism 50 ′′ by the fixing mechanism 50 ′′ in a clamping and fixing manner.
  • the fixing mechanism 50" includes a support bracket 51" and a fixing unit 52", wherein the support bracket 51" is used to fix the lens barrel 21" of the lens assembly 20" on one side of the base 4" , the fixing unit 52′′ is used to fix the uniform light device 122′′ of the optical component 12′′ to the lens barrel 21′′.
  • the fixing unit 52′′ is implemented as an annular fixing piece, wherein the fixing unit 52′′ is disposed at the end of the lens barrel 21′′.
  • the fixing unit 52′′ fixes and installs the light uniforming device 122′′ at the end of the lens barrel 21′′.
  • the fixing unit 52′′ is implemented as a clamping device for clamping the uniform light device 122′′ on the lens barrel 21′′. Ends.
  • the spectrum chip 11′′ is connected to the circuit board 3′′, that is, the spectrum chip 11′′ is electrically connected to the circuit board 3′′.
  • the spectrum chip 11′′ is electrically connected to the circuit board 3′′.
  • the angle of the FOV formed by the optical component 12" is within 180°.
  • the uniform light device 122" of the optical component 12" can be, but is not limited to, a uniform light dispersion plate (polytetrafluoroethylene), in which the incident light passes through the lens 124 " and the filter element 125" behind the lens 124" reaches the filter structure (micro-nano structure unit) matrix of the spectrum chip 11".
  • the spectrum chip 11" is disposed on the circuit board 3", wherein the circuit board 3" is fixed on the base 4", and the base 4" supports and fixes the spectrum chip 11". It can be understood that the spectrum chip 11′′ is electrically connected to the circuit board 3′′ and processes the acquired spectral information of the incident light.
  • the base 4" is further provided with a mounting hole 40", wherein the optical path of the optical component corresponds to the mounting hole 40" of the base 4", and the spectrum chip 11" is located at the base 4"
  • the mounting hole 40" As an example, in this preferred embodiment of the present application, the circuit board 3" is fixed on the lower end surface of the base 4".
  • the lens barrel 21" of the lens assembly 20" is fixed on the upper end surface of the base 4", or the lens barrel 21" of the lens assembly 20"
  • the barrel 21" is fixed on the upper end of the base 4" by the fixing mechanism 50", and the lens assembly 20" is held in the photosensitive path of the spectrum chip 11" by the fixing mechanism 50".
  • a lens cover 23" is also provided on the upper part of the lens barrel 21".
  • the lens cover 23" is provided on the light uniformity device, and a light hole 231 is provided on the lens cover 23". ".
  • threads are provided on the outer wall of the lens barrel 21", and the lens barrel 21" passes through the outer wall.
  • the threads on the wall are connected to the base 4", and the lens cover 23" and the lens 21" are connected through the threads.
  • the incident light signal can be modulated through the light modulation layer of the spectrum chip 11", and the obtained incident light can be restored through the recovery algorithm as described Spectral information, the color temperature value is calculated according to the obtained spectral information of the incident light, and the illumination information is calculated according to the response of the incident light.
  • the composition of the spectrum chip 11" of this preferred embodiment of the present application is used.
  • Spectral imaging sensor 1" to obtain color temperature sensing information with spatial information, where the spatial information can be two-dimensional spatial information or three-dimensional spatial information.
  • the spectral information and the image information obtained by the image sensor form a spectral cube. .
  • different light uniforming devices 122′′ can have different effects on different filter structure arrays, different light uniforming devices 122′′ can obtain different filter structures. light effects. When the uniform light is strong, the entire incident light can be detected uniformly, and a single spectral information in the entire ambient light can be obtained. If the uniform light is weak, the spectral information of different positions in the ambient light can be obtained. Therefore, the uniform light of different capabilities can be adjusted according to different application scenarios to achieve single-point, multi-point or even multi-angle environments or incident light. Spectral information.
  • the spectrum sensor module includes a spectrum sensor 10", a lens assembly 20", a circuit board 3" and a base 4", wherein the circuit board 3" is electrically connected to the spectrum sensor 10", and the lens assembly 20" Located on the photosensitive side of the spectrum sensor 10", the spectrum sensor 10", the lens assembly 20" and the circuit board 3" are fixed to the base 4", and are supported and fixed by the base 4" The spectrum sensor 10" and the lens assembly 20".
  • the spectrum sensor 10 includes a spectrum chip 11" and an optical component 12" disposed in the photosensitive path of the spectrum chip 11".
  • the lens assembly 20 includes a lens barrel 21", wherein the optical component 12′′ is disposed on the lens barrel 21′′ of the lens assembly 20′′, and the optical assembly 12′′ is held in the photosensitive path of the spectrum chip 11′′ through the lens barrel 21′′.
  • the optical component 12" includes a uniform light device 122", a lens 124" and a filter element 125" arranged in sequence from the light incident side along the optical axis direction.
  • the lens barrel 21" has an accommodating space 210" that passes front and back along the optical axis direction, and the lens 124" is fixed in the accommodating space 210" by the lens barrel 21".
  • the lens barrel 21" It further includes an upper end 211" and a lower end 212" integrally extending downward from the upper end 211", and the light uniformity device 122" is provided on the upper end 211" of the lens barrel 21".
  • the filter element 125′′ is disposed at the lower end 212′′ of the lens barrel 21′′.
  • a lens cover 23" is also provided on the upper part of the lens barrel 21".
  • the lens cover 23" is provided on the light uniforming device, and the lens cover 23" is provided with a light hole 231".
  • Threads are provided on the outer wall of the lens barrel 21".
  • the lens barrel 21" is connected to the base 4" through the threads on the outer wall.
  • the lens cover 23" and the lens 21" are connected through the threads.
  • the distance between the lens and the spectrum chip can also be adjusted by thread rotation of the lens barrel 21".
  • the light uniformity device 122" is attached to the upper end 211" of the lens barrel 21"
  • the filter element 125" is attached to the The lower end portion 212′′ of the lens barrel 21′′.
  • the upper end 211" of the lens barrel 21” is further provided with a mounting groove 2110
  • the lower end 212" of the lens barrel 21” is further provided with a mounting groove 2120”
  • the light uniformity device 122" is fixed on In the mounting groove 2110" of the upper end 211
  • the filter element 125" is fixed in the mounting groove 2120" of the lower end 212".
  • the light uniformity device 122" and the filter element 125" are fixed to the lens barrel 21" by gluing.
  • the lens The barrel 21" is further provided with a glue overflow hole 2100", wherein the glue overflow hole 2100" is formed in the mounting groove 2110" and the mounting groove 2120" of the lens barrel 21", and excess glue will flow into it.
  • glue overflow hole that is, through the glue overflow hole 2100
  • glue is prevented from overflowing.
  • the lens barrel 21" is further provided with an aperture opening 213", wherein the aperture opening 213" is formed at the upper end 211" of the lens barrel 21", and the aperture opening 213" is connected to The accommodating space 210". Therefore, it can be understood that in this preferred embodiment of the present application, the aperture opening 213" of the lens barrel 21" limits the amount of light entering the external light. That is, in this preferred embodiment of the present application, the function of the aperture in the first preferred embodiment is replaced by the aperture opening 213" integrally formed in the lens barrel 21".
  • the lens 124" has a light incident surface 1241" and a light exit surface 1242", wherein ambient light is incident on the lens 124" through the light incident surface 1241" of the lens 124", and then passes through the light incident surface 124" of the lens 124".
  • the light emitting surface 1242′′ emits light.
  • the light incident surface 1241" of the lens 124" is a convex surface to collect more incident light into the lens.
  • the spectrum chip 11" is disposed on the upper surface of the base 4" or the spectrum chip 11" is embedded in the base 4", and the spectrum chip 11" is supported and protected by the base 4".

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectrometry And Color Measurement (AREA)

Abstract

La présente demande concerne un capteur spectral, un module de capteur spectral, un appareil de capteur et un dispositif électronique. Le capteur spectral comprend une puce spectrale et un ensemble optique, la puce spectrale comportant une couche de modulation de lumière et une couche de détection photoélectrique ; la couche de modulation de lumière est disposée, dans un trajet de détection de la couche de détection photoélectrique, sur un côté d'une face d'incidence de lumière de la couche de détection photoélectrique, et comprend une unité de modulation utilisée pour moduler la lumière incidente ; l'ensemble optique est disposé dans un trajet de détection de la puce spectrale ; et l'ensemble optique comprend au moins un diaphragme ; la lumière incidente traverse le diaphragme pour former un point lumineux qui irradie la couche de modulation de lumière, et le point lumineux recouvre au moins une unité de modulation de la couche de modulation de lumière ; ou l'ensemble optique comprend un élément d'homogénéisation de lumière et un diaphragme, et la lumière incidente traverse l'élément d'homogénéisation de lumière et le diaphragme pour guider un signal optique vers la surface supérieure de la couche de modulation de lumière ; ou l'ensemble optique comprend un dispositif d'homogénéisation de lumière et une lentille, et la lumière incidente traverse le dispositif d'homogénéisation de lumière et la lentille de façon à être guidée vers la surface de la puce spectrale à un angle d'incidence défini et d'une manière d'intensité de lumière uniforme. De plus, le module de capteur spectral comprend au moins un capteur spectral et une carte de circuit imprimé. Le capteur spectral selon la présente demande permet d'améliorer les performances photoélectriques, par exemple, d'améliorer la précision et la stabilité de la récupération du spectre, etc.
PCT/CN2023/085130 2022-05-16 2023-03-30 Capteur spectral, module de capteur spectral, appareil de capteur et dispositif électronique WO2023221663A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
CN202221206359.0U CN217504984U (zh) 2022-05-16 2022-05-16 光谱传感器模组和传感器装置
CN202221206359.0 2022-05-16
CN202222448366.8U CN218885141U (zh) 2022-09-15 2022-09-15 光谱传感器模组
CN202222448366.8 2022-09-15
CN202211558210 2022-12-06
CN202211558210.3 2022-12-06
CN202223266805.X 2022-12-06
CN202223266805.XU CN219553634U (zh) 2022-12-06 2022-12-06 光谱传感器、光谱传感器模组和电子设备

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US4448529A (en) * 1980-04-16 1984-05-15 Erwin Sick Gmbh - Optik-Elektronik Spectral analysis of a beam of radiation
US20110063614A1 (en) * 2008-01-17 2011-03-17 Vrije Universiteit Brussel Photospectrometer
US20130083312A1 (en) * 2011-09-30 2013-04-04 Inview Technology Corporation Adaptive Search for Atypical Regions in Incident Light Field and Spectral Classification of Light in the Atypical Regions
CN210376122U (zh) * 2019-07-31 2020-04-21 清华大学 一种光调制微纳结构及微集成光谱仪
CN111490060A (zh) * 2020-05-06 2020-08-04 清华大学 光谱成像芯片及光谱识别设备
CN111505820A (zh) * 2020-03-17 2020-08-07 清华大学 单片集成的图像传感芯片及光谱识别设备
CN112730267A (zh) * 2019-10-28 2021-04-30 清华大学 光谱仪结构及电子设备
CN113588085A (zh) * 2021-09-03 2021-11-02 杭州纳境科技有限公司 微型快照式光谱仪
CN113596308A (zh) * 2021-07-30 2021-11-02 苏州多感科技有限公司 图像传感器以及优化成像效果的方法
CN214951801U (zh) * 2021-06-16 2021-11-30 北京与光科技有限公司 光谱分析装置
CN215953344U (zh) * 2021-09-10 2022-03-04 北京与光科技有限公司 光谱检测装置
CN217504984U (zh) * 2022-05-16 2022-09-27 北京与光科技有限公司 光谱传感器模组和传感器装置
CN218885141U (zh) * 2022-09-15 2023-04-18 北京与光科技有限公司 光谱传感器模组

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4448529A (en) * 1980-04-16 1984-05-15 Erwin Sick Gmbh - Optik-Elektronik Spectral analysis of a beam of radiation
US20110063614A1 (en) * 2008-01-17 2011-03-17 Vrije Universiteit Brussel Photospectrometer
US20130083312A1 (en) * 2011-09-30 2013-04-04 Inview Technology Corporation Adaptive Search for Atypical Regions in Incident Light Field and Spectral Classification of Light in the Atypical Regions
CN210376122U (zh) * 2019-07-31 2020-04-21 清华大学 一种光调制微纳结构及微集成光谱仪
CN112730267A (zh) * 2019-10-28 2021-04-30 清华大学 光谱仪结构及电子设备
CN111505820A (zh) * 2020-03-17 2020-08-07 清华大学 单片集成的图像传感芯片及光谱识别设备
CN111490060A (zh) * 2020-05-06 2020-08-04 清华大学 光谱成像芯片及光谱识别设备
CN214951801U (zh) * 2021-06-16 2021-11-30 北京与光科技有限公司 光谱分析装置
CN113596308A (zh) * 2021-07-30 2021-11-02 苏州多感科技有限公司 图像传感器以及优化成像效果的方法
CN113588085A (zh) * 2021-09-03 2021-11-02 杭州纳境科技有限公司 微型快照式光谱仪
CN215953344U (zh) * 2021-09-10 2022-03-04 北京与光科技有限公司 光谱检测装置
CN217504984U (zh) * 2022-05-16 2022-09-27 北京与光科技有限公司 光谱传感器模组和传感器装置
CN218885141U (zh) * 2022-09-15 2023-04-18 北京与光科技有限公司 光谱传感器模组

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