WO2023210198A1 - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
WO2023210198A1
WO2023210198A1 PCT/JP2023/010031 JP2023010031W WO2023210198A1 WO 2023210198 A1 WO2023210198 A1 WO 2023210198A1 JP 2023010031 W JP2023010031 W JP 2023010031W WO 2023210198 A1 WO2023210198 A1 WO 2023210198A1
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WO
WIPO (PCT)
Prior art keywords
conductor layer
radiation conductor
layer
axis
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/010031
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English (en)
French (fr)
Japanese (ja)
Inventor
健太朗 川辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202390000317.8U priority Critical patent/CN223156273U/zh
Priority to JP2024517899A priority patent/JP7736179B2/ja
Publication of WO2023210198A1 publication Critical patent/WO2023210198A1/ja
Priority to US18/918,370 priority patent/US20250038413A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas

Definitions

  • the present invention relates to a multilayer substrate including a plurality of radiation conductor layers.
  • a patch antenna described in Patent Document 1 As an invention related to a conventional antenna element, a patch antenna described in Patent Document 1 is known.
  • This patch antenna includes a dielectric block, a ground electrode, a parasitic electrode, a radiation electrode, and a connection electrode.
  • the dielectric block has a disk shape having an upper main surface and a lower main surface.
  • the ground electrode is provided on the lower main surface of the dielectric block.
  • the radiation electrode is provided near the center of the upper main surface of the dielectric block.
  • the parasitic electrode is provided on the upper main surface of the dielectric block.
  • the parasitic electrode has an annular shape surrounding the radiation electrode when viewed in the vertical direction.
  • the connection electrode is provided on the side surface of the dielectric block. The connection electrode electrically connects the ground electrode and the parasitic electrode.
  • the radiation electrode transmits and receives high-frequency signals.
  • an object of the present invention is to reduce the size of a multilayer board including a plurality of radiation conductor layers, and to improve the radiation characteristics of the plurality of radiation conductor layers.
  • a multilayer substrate includes: A laminate having a structure in which one or more first insulator layers and one or more second insulator layers are stacked in the Z-axis direction, the dielectric constant of the one or more second insulator layers is , a laminate having a dielectric constant lower than that of the one or more first insulating layers; a first radiation conductor layer provided on the laminate so as to be in contact with the first insulator layer; is provided in the laminate so as to be in contact with the second insulator layer, is located in the positive direction of the Z-axis from the first radiation conductor layer, and is located in the positive direction of the Z-axis when viewed in the Z-axis direction.
  • a second radiation conductor layer overlapping with the radiation conductor layer, the frequency of the electromagnetic waves radiated or received by the second radiation conductor layer is higher than the frequency of the electromagnetic waves radiated or received by the first radiation conductor layer, or , the area of the second radiation conductor layer is smaller than the area of the first radiation conductor layer; a first planar ground conductor that is located in the negative direction of the Z-axis from the first radiation conductor layer and overlaps with the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction; layer and A first ground that does not overlap the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction and is located in the positive direction of the Z-axis from the first radiation conductor layer.
  • the multilayer substrate according to the present invention it is possible to reduce the size of the multilayer substrate including a plurality of radiation conductor layers, and it is also possible to improve the radiation characteristics of the plurality of radiation conductor layers.
  • FIG. 1 is an exploded perspective view of the multilayer substrate 10.
  • FIG. 2 is a cross-sectional view of the multilayer substrate 10 taken along line AA in FIG.
  • FIG. 3 is a diagram of the multilayer substrate 10 seen from above.
  • FIG. 4 is a cross-sectional view of the multilayer substrate 10a.
  • FIG. 5 is a cross-sectional view of the multilayer substrate 10b.
  • FIG. 6 is an exploded perspective view of the multilayer substrate 10c.
  • FIG. 7 is an exploded perspective view of the multilayer substrate 10d.
  • FIG. 8 is a diagram of the multilayer substrate 10e seen from above.
  • FIG. 1 is an exploded perspective view of the multilayer substrate 10.
  • FIG. 2 is a cross-sectional view of the multilayer substrate 10 taken along line AA in FIG.
  • FIG. 3 is a diagram of the multilayer substrate 10 seen from above.
  • the stacking direction of the stacked body 12 of the multilayer substrate 10 will be defined as the vertical direction.
  • the up-down direction coincides with the Z-axis direction.
  • the upward direction is the positive direction of the Z axis.
  • the downward direction is the negative direction of the Z axis.
  • the two directions in which the sides of the multilayer substrate 10 extend are defined as the left-right direction and the front-back direction, respectively.
  • the left-right direction coincides with the X-axis direction.
  • the front-back direction coincides with the Y-axis direction.
  • the left-right direction is perpendicular to the up-down direction.
  • the front-rear direction is orthogonal to the up-down direction and the left-right direction.
  • direction in this specification is an example. Therefore, the direction in which the multilayer substrate 10 is actually used does not need to match the direction in this specification. Further, the vertical direction may be reversed in each drawing. Similarly, the left and right directions may be reversed in each drawing. The front and rear directions may be reversed in each drawing.
  • X is a component or member of the multilayer substrate 10.
  • each part of X is defined as follows.
  • the front part of the X means the front half of the X.
  • the rear part of the X means the rear half of the X.
  • the left part of X means the left half of X.
  • the right side of X means the right half of X.
  • the upper part of X means the upper half of X.
  • the lower part of X means the lower half of X.
  • the front end of X means the front end of X.
  • the rear end of X means the end of X in the rear direction.
  • the left end of X means the left end of X.
  • the right end of X means the right end of X.
  • the upper end of X means the upper end of X.
  • the lower end of X means the lower end of X.
  • the front end of X means the front end of X and its vicinity.
  • the rear end of X means the rear end of X and its vicinity.
  • the left end of X means the left end of X and its vicinity.
  • the right end of X means the right end of X and its vicinity.
  • the upper end of X means the upper end of X and its vicinity.
  • the lower end of X means the lower end of X and its vicinity.
  • the multilayer substrate 10 is used, for example, in electronic devices such as mobile phones. As shown in FIG. 1, the multilayer substrate 10 includes a laminate 12, a first ground conductor layer 16, a planar ground conductor layer 18, a first radiation conductor layer 20, a second radiation conductor layer 21, external electrodes 24a, 24b, 26a, 26b and interlayer connection conductors v1 to v8.
  • the laminate 12 has a plate shape. As shown in FIGS. 1 and 2, the laminate 12 has a rectangular shape when viewed in the vertical direction.
  • insulator layers 14b to 14d first insulator layer
  • insulator layer 14a second insulator layer
  • insulator layers 14e to 14g third insulator layer
  • the insulator layers 14a to 14g are arranged in this order from top to bottom.
  • the dielectric constant of the insulator layer 14a (second insulator layer) is lower than the dielectric constant of the insulator layers 14b to 14d (first insulator layer).
  • the dielectric constants of the insulator layers 14e to 14g are lower than the dielectric constants of the insulator layers 14b to 14d (first insulator layers).
  • the dielectric constant of the insulator layer 14a is equal to the dielectric constant of the insulator layers 14e to 14g.
  • the material of the insulator layers 14a to 14g is a thermoplastic resin such as polyimide or liquid crystal polymer. Therefore, the laminate 12 has flexibility.
  • the first radiation conductor layer 20 emits and/or receives a first high frequency signal.
  • the first radiation conductor layer 20 is provided on the laminate 12 so as to be in contact with the insulator layers 14b and 14c (first insulator layers).
  • the first radiation conductor layer 20 is located on the upper main surface of the insulator layer 14c.
  • the first radiation conductor layer 20 has a diamond shape with diagonal lines extending in the left-right direction (X-axis direction) and the front-back direction (Y-axis direction) when viewed in the up-down direction (Z-axis direction). are doing.
  • the second radiation conductor layer 21 radiates and/or receives the second high frequency signal.
  • the second radiation conductor layer 21 is provided on the stacked body 12 so as to be in contact with the insulator layer 14a (second insulator layer).
  • the second radiation conductor layer 21 is located on the upper main surface of the insulator layer 14a. Thereby, the second radiation conductor layer 21 is located above the first radiation conductor layer 20 (in the positive direction of the Z axis).
  • the vertical distance between the second radiation conductor layer 21 and the first radiation conductor layer 20 is 1/4 of the wavelength of the second high frequency signal.
  • the second radiation conductor layer 21 overlaps with the first radiation conductor layer 20 when viewed in the vertical direction (Z-axis direction).
  • the second radiation conductor layer 21 has a diamond shape with diagonal lines extending in the left-right direction (X-axis direction) and the front-back direction (Y-axis direction) when viewed in the up-down direction (Z-axis direction). are doing.
  • the area of the second radiation conductor layer 21 is smaller than the area of the first radiation conductor layer 20. Therefore, the four sides of the first radiation conductor layer 20 do not overlap with the second radiation conductor layer 21 when viewed in the vertical direction.
  • the frequency of the second high frequency signal (electromagnetic wave) radiated or received by the second radiation conductor layer 21 is higher than the frequency of the first high frequency signal (electromagnetic wave) radiated or received by the first radiation conductor layer 20.
  • the planar ground conductor layer 18 is provided on the laminate 12, as shown in FIGS. 1 and 2. More specifically, the planar ground conductor layer 18 (first planar ground conductor layer) is located below the first radiation conductor layer 20 (in the negative direction of the Z-axis). The planar ground conductor layer 18 is provided on the lower main surface of the insulator layer 14g. As shown in FIG. 1, the planar ground conductor layer 18 has a rectangular shape when viewed in the vertical direction. The long sides of the planar ground conductor layer 18 extend in the left-right direction. The short sides of the planar ground conductor layer 18 extend in the front-rear direction.
  • planar ground conductor layer 18 When viewed in the vertical direction (Z-axis direction), the planar ground conductor layer 18 (first planar ground conductor layer) overlaps with the first radiation conductor layer 20 and the second radiation conductor layer 21 . Planar ground conductor layer 18 is connected to ground potential.
  • the first ground conductor layer 16 is provided on the laminate 12. More specifically, the first ground conductor layer 16 is located above the first radiation conductor layer 20 (in the positive direction of the Z-axis). In this embodiment, the first ground conductor layer 16 is provided at the same position as the second radiation conductor layer 21 in the vertical direction (Z-axis direction). Therefore, the first ground conductor layer 16 is located on the upper main surface of the insulator layer 14a.
  • the first ground conductor layer 16 does not overlap the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the vertical direction (Z-axis direction).
  • the first ground conductor layer 16 when viewed in the vertical direction (Z-axis direction), is located on the left (positive direction of the X-axis) and right (X-axis (negative direction of the Y-axis), front (positive direction of the Y-axis), and rear (negative direction of the Y-axis). Therefore, the first ground conductor layer 16 has an annular shape surrounding the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the vertical direction (Z-axis direction).
  • the first ground conductor layer 16 has a rectangular outer edge and an inner edge having two sides extending in the front-rear direction and two sides extending in the left-right direction.
  • the external electrodes 24a, 24b, 26a, and 26b are provided on the lower main surface of the insulator layer 14g.
  • the external electrodes 24a, 24b, 26a, and 26b are not in contact with the planar ground conductor layer 18. Therefore, the external electrodes 24a, 24b, 26a, and 26b are located within the openings provided in the planar ground conductor layer 18.
  • the external electrodes 24a and 24b overlap the first radiation conductor layer 20 when viewed in the vertical direction.
  • the external electrodes 26a and 26b overlap the second radiation conductor layer 21 when viewed in the vertical direction.
  • a first high frequency signal is input to and output from the external electrodes 24a and 24b.
  • a second high-frequency signal is input to and output from the external electrodes 26a and 26b.
  • the interlayer connection conductor v1 electrically connects the first radiation conductor layer 20 and the external electrode 24a.
  • the interlayer connection conductor v1 vertically penetrates the insulator layers 14c to 14g. Further, the interlayer connection conductor v1 is located near the midpoint of the front left side of the first radiation conductor layer 20 when viewed in the vertical direction. The point in the first radiation conductor layer 20 where the interlayer connection conductor v1 is in contact is the first feeding point P1.
  • the interlayer connection conductor v2 electrically connects the first radiation conductor layer 20 and the external electrode 24b.
  • the interlayer connection conductor v2 vertically penetrates the insulator layers 14c to 14g. Further, the interlayer connection conductor v2 is located near the midpoint of the left rear side of the first radiation conductor layer 20 when viewed in the vertical direction. The point in the first radiation conductor layer 20 where the interlayer connection conductor v2 is in contact is the second feeding point P2.
  • the interlayer connection conductor v3 electrically connects the second radiation conductor layer 21 and the external electrode 26a.
  • the interlayer connection conductor v3 vertically penetrates the insulator layers 14a to 14g. Further, the interlayer connection conductor v3 is located near the midpoint of the front right side of the second radiation conductor layer 21 when viewed in the vertical direction. The point in the second radiation conductor layer 21 where the interlayer connection conductor v3 is in contact is the third feeding point P3.
  • the interlayer connection conductor v4 electrically connects the second radiation conductor layer 21 and the external electrode 26b.
  • the interlayer connection conductor v4 vertically penetrates the insulator layers 14a to 14g. Further, the interlayer connection conductor v4 is located near the midpoint of the right rear side of the second radiation conductor layer 21 when viewed in the vertical direction. The point in the second radiation conductor layer 21 where the interlayer connection conductor v4 is in contact is the fourth feeding point P4.
  • the interlayer connection conductors v5 to v8 electrically connect the first ground conductor layer 16 and the planar ground conductor layer 18. Each of the interlayer connection conductors v5 to v8 penetrates the insulator layers 14a to 14g.
  • the first ground conductor layer 16, the planar ground conductor layer 18, the first radiation conductor layer 20, the second radiation conductor layer 21, and the external electrodes 24a, 24b, 26a, 26b are, for example, It is formed by patterning copper foil attached to the surface or lower main surface.
  • the interlayer connection conductors v1 to v8 are, for example, via hole conductors.
  • the via hole conductor is formed by forming through holes in the insulator layers 14a to 14g, filling the through holes with conductive paste, and sintering the conductive paste.
  • the first ground conductor layer 16, the planar ground conductor layer 18, and the first radiation conductor layer 20 function as a patch antenna that radiates or receives the first high frequency signal. Further, the first ground conductor layer 16, the planar ground conductor layer 18, and the second radiation conductor layer 21 function as a patch antenna that radiates or receives the second high-frequency signal.
  • the multilayer substrate 10 including the first radiation conductor layer 20 and the second radiation conductor layer 21 can be downsized. More specifically, when viewed in the vertical direction, the second radiation conductor layer 21 overlaps with the first radiation conductor layer 20. As a result, when viewed in the vertical direction, the area of the multilayer substrate 10 becomes smaller than the area of a multilayer substrate in which two radiation conductors are lined up in the front-rear direction or the left-right direction. Therefore, according to the multilayer substrate 10, the multilayer substrate 10 including the first radiation conductor layer 20 and the second radiation conductor layer 21 can be made smaller.
  • the radiation characteristics of the first radiation conductor layer 20 can be improved. More specifically, the area of the first radiation conductor layer 20 is larger than the area of the second radiation conductor layer 21. Therefore, the first radiation conductor layer 20 is located near the first ground conductor layer 16 when viewed in the vertical direction. In this case, an opposite phase current flows through the planar ground conductor layer 18 . As a result, the radiation characteristics of the first radiation conductor layer 20 deteriorate.
  • the first radiation conductor layer 20 is provided on the laminate 12 so as to be in contact with the insulator layers 14b and 14c.
  • the dielectric constants of the insulator layers 14b and 14c are higher than the dielectric constant of the insulator layer 14a.
  • the first radiation conductor layer 20 can be made smaller due to the wavelength shortening effect without changing the frequency of the first high frequency signal that the first radiation conductor layer 20 emits or receives. Therefore, the first radiation conductor layer 20 is separated from the first ground conductor layer 16 when viewed in the vertical direction. Therefore, it becomes difficult for an opposite-phase current to flow through the planar ground conductor layer 18.
  • the radiation characteristics of the first radiation conductor layer 20 can be improved.
  • the radiation characteristics of the second radiation conductor layer 21 can be improved. More specifically, the frequency of the second high frequency signal radiated or received by the second radiating conductor layer 21 is higher than the frequency of the first high frequency signal radiating or received by the first radiating conductor layer 20. Therefore, the area of the second radiation conductor layer 21 is smaller than the area of the first radiation conductor layer 20. In this case, it is difficult to improve the radiation characteristics of the second radiation conductor layer 21.
  • the second radiation conductor layer 21 is provided on the laminate 12 so as to be in contact with the insulator layer 14a.
  • the dielectric constant of the insulator layer 14a is lower than the dielectric constant of the insulator layers 14b to 14d. Therefore, the wavelength shortening effect is less likely to occur in the second radiation conductor layer 21. Therefore, the area of the second radiation conductor layer 21 can be increased without changing the frequency of the second high-frequency signal that the second radiation conductor layer 21 emits or receives. As a result, according to the multilayer substrate 10, the radiation characteristics of the second radiation conductor layer 21 can be improved.
  • the antenna gain of the first radiation conductor layer 20 in the first polarization can be brought close to the antenna gain of the first radiation conductor layer 20 in the second polarization. More specifically, the first radiation conductor layer 20 radiates and receives a first high frequency signal of a first polarization at the first feeding point P1. The first radiation conductor layer 20 radiates and receives the first high frequency signal of the second polarization at the second feeding point P2. In order to bring the antenna gain of the first radiation conductor layer 20 in the first polarization closer to the antenna gain of the first radiation conductor layer 20 in the second polarization, it is necessary to The distance and the distance from the second feeding point P2 to the first ground conductor layer 16 may be made closer.
  • the first radiation conductor layer 20 and the second radiation conductor layer 21 have a rhombic shape with diagonal lines extending in the left-right direction and the front-back direction when viewed in the vertical direction, as shown in FIG. ing. Furthermore, when viewed in the vertical direction, the first ground conductor layer 16 is located on the left, right, front, and rear of the first radiation conductor layer 20 and the second radiation conductor layer 21. Thereby, the distance from the first feed point P1 to the first ground conductor layer 16 and the distance from the second feed point P2 to the first ground conductor layer 16 become equal to each other.
  • the antenna gain of the first radiation conductor layer 20 in the first polarization can be brought closer to the antenna gain of the first radiation conductor layer 20 in the second polarization.
  • the antenna gain of the second radiation conductor layer 21 in the first polarization and the antenna gain of the second radiation conductor layer 21 in the second polarization can be made close to each other.
  • the antenna gain of the second radiation conductor layer 21 can be improved. More specifically, the second radiation conductor layer 21 radiates the second high frequency signal upward and downward. The second high frequency signal radiated downward is reflected by the first radiation conductor layer 20 and travels upward.
  • the vertical distance between the second radiation conductor layer 21 and the first radiation conductor layer 20 is 1/4 of the wavelength of the second high frequency signal.
  • the phase of the second high-frequency signal is shifted by 180°.
  • the phase of the second high frequency signal shifts by 180° upon reflection.
  • the phase of the second high frequency signal radiated downward matches the phase of the second high frequency signal radiated upward. Therefore, according to the multilayer substrate 10, the antenna gain of the second radiation conductor layer 21 can be improved.
  • FIG. 4 is a cross-sectional view of the multilayer substrate 10a.
  • the multilayer substrate 10a differs from the multilayer substrate 10 in that the laminate 12 further includes protective layers 15a and 15b. This difference will be explained below.
  • the insulator layer 14a (second insulator layer) is located above the insulator layers 14b to 14d (first insulator layer) (in the positive direction of the Z-axis).
  • the protective layer 15a is located above the insulator layer 14a (second insulator layer) (in the positive direction of the Z-axis).
  • the protective layer 15a covers the upper main surface of the insulator layer 14a.
  • the protective layer 15a covers the second radiation conductor layer 21.
  • the protective layer 15b covers the lower main surface of the insulator layer 14g.
  • the protective layer 15b covers the planar ground conductor layer 18. However, a portion of the external electrodes 24a, 24b, 26a, 26b and the planar ground conductor layer 18 are exposed from the protective layer 15b.
  • the dielectric constants of the protective layers 15a and 15b are lower than the dielectric constant of the insulator layer 14a (second insulator layer).
  • the second radiation conductor layer 21 is buried in the protective layer 15a.
  • the area where the second radiation conductor layer 21 is in contact with the protective layer 15a is larger than the area where the second radiation conductor layer 21 is in contact with the insulator layer 14a (second insulator layer).
  • the other structure of the multilayer substrate 10a is the same as that of the multilayer substrate 10.
  • the multilayer substrate 10a can have the same effects as the multilayer substrate 10.
  • the radiation characteristics of the second radiation conductor layer 21 can be improved. More specifically, the dielectric constant of the protective layer 15a is lower than the dielectric constant of the insulator layer 14a (second insulator layer). The area where the second radiation conductor layer 21 is in contact with the protective layer 15a is larger than the area where the second radiation conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). This makes it difficult for the wavelength shortening effect to occur in the second radiation conductor layer 21. Therefore, the area of the second radiation conductor layer 21 can be increased without changing the frequency of the second high-frequency signal that the second radiation conductor layer 21 emits or receives. As a result, according to the multilayer substrate 10a, the radiation characteristics of the second radiation conductor layer 21 can be improved.
  • FIG. 5 is a cross-sectional view of the multilayer substrate 10b.
  • the multilayer substrate 10b differs from the multilayer substrate 10a in that the dielectric constants of the protective layers 15a and 15b are higher than the dielectric constant of the insulator layer 14a (second insulator layer).
  • the second radiation conductor layer 21 is buried in the insulator layer 14a.
  • the area where the second radiation conductor layer 21 is in contact with the protective layer 15a is smaller than the area where the second radiation conductor layer 21 is in contact with the insulator layer 14a (second insulator layer).
  • the other structure of the multilayer substrate 10b is the same as that of the multilayer substrate 10a.
  • the multilayer substrate 10b can have the same effects as the multilayer substrate 10a.
  • the multilayer substrate 10b According to the multilayer substrate 10b, deterioration of the radiation characteristics of the second radiation conductor layer 21 can be suppressed. More specifically, the dielectric constants of the protective layers 15a and 15b are higher than the dielectric constant of the insulator layer 14a (second insulator layer). However, the area where the second radiation conductor layer 21 is in contact with the protective layer 15a is smaller than the area where the second radiation conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). This prevents the wavelength shortening effect from occurring too much in the second radiation conductor layer 21. Therefore, the area of the second radiation conductor layer 21 can be prevented from becoming smaller without changing the frequency of the second high-frequency signal that the second radiation conductor layer 21 emits or receives. As a result, according to the multilayer substrate 10b, deterioration of the radiation characteristics of the second radiation conductor layer 21 can be suppressed.
  • FIG. 6 is an exploded perspective view of the multilayer substrate 10c.
  • the multilayer substrate 10c differs from the multilayer substrate 10 in that it further includes a first matching circuit 50a and a second matching circuit 50b. More specifically, the laminate 12 includes an insulator layer 14a (second insulator layer), insulator layers 14b to 14d (first insulator layer), and insulator layers 14e, 14h, 14i, and 14g (third insulator layer). It has a structure in which the body layers) are arranged in this order downward (in the negative direction of the Z axis). The dielectric constants of the insulator layers 14e, 14h, 14i, and 14g (third insulator layers) are lower than the dielectric constants of the insulator layers 14b to 14d (first insulator layers).
  • the multilayer substrate 10c further includes a planar ground conductor layer 28, first signal conductor layers 30, 32, second signal conductor layers 34, 36, and interlayer connection conductors v11 to v14.
  • the planar ground conductor layer 28 is located on the upper main surface of the insulator layer 14h.
  • the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are located on the upper main surface of the insulator layer 14i. Therefore, the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 are located below the planar ground conductor layer 28 and above the planar ground conductor layer 18.
  • the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 overlap with the planar ground conductor layers 18, 28 when viewed in the vertical direction.
  • the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 extend in the left-right direction.
  • the interlayer connection conductor v1 electrically connects the first radiation conductor layer 20 and the right end portion of the first signal conductor layer 30.
  • the interlayer connection conductor v11 electrically connects the left end portion of the first signal conductor layer 30 and the external electrode 24a.
  • the interlayer connection conductor v2 electrically connects the first radiation conductor layer 20 and the right end portion of the first signal conductor layer 32.
  • the interlayer connection conductor v12 electrically connects the left end portion of the first signal conductor layer 32 and the external electrode 24b.
  • the interlayer connection conductor v3 electrically connects the second radiation conductor layer 21 and the left end portion of the second signal conductor layer 34.
  • the interlayer connection conductor v13 electrically connects the right end portion of the second signal conductor layer 34 and the external electrode 26a.
  • the interlayer connection conductor v4 electrically connects the second radiation conductor layer 21 and the left end portion of the second signal conductor layer 36.
  • the interlayer connection conductor v14 electrically connects the right end portion of the second signal conductor layer 36 and the external electrode 26b.
  • the first signal conductor layers 30, 32, the second signal conductor layers 34, 36, and the planar ground conductor layers 18, 28 have a stripline structure. Thereby, the first signal conductor layers 30, 32 and the planar ground conductor layers 18, 28 form a first matching circuit 50a. The second signal conductor layers 34, 36 and the planar ground conductor layers 18, 28 form a second matching circuit 50b.
  • the first matching circuit 50a is electrically connected to the first radiation conductor layer 20 via the interlayer connection conductors v1 and v2.
  • the second matching circuit 50b is electrically connected to the second radiation conductor layer 21 via interlayer connection conductors v3 and v4.
  • the first matching circuit 50a and the second matching circuit 50b are in contact with the insulating layers 14e to 14g (third insulating layer).
  • the other structure of the multilayer substrate 10c is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • the multilayer substrate 10c can have the same effects as the multilayer substrate 10.
  • the first matching circuit 50a and the second matching circuit 50b are in contact with the insulating layers 14e to 14g (third insulating layer).
  • the dielectric constants of the insulator layers 14e to 14g (third insulator layers) are lower than the dielectric constants of the insulator layers 14b to 14d (first insulator layers). This makes it difficult for capacitance to be formed between the first signal conductor layers 30, 32 and the planar ground conductor layers 18, 28. Capacitance is less likely to be formed between the second signal conductor layers 34, 36 and the planar ground conductor layers 18, 28.
  • the capacitance value does not become too large. Therefore, while maintaining the characteristic impedance of the first matching circuit 50a and the second matching circuit 50b at a desired characteristic impedance, the resistance values of the first signal conductor layers 30 and 32 and the resistance values of the second signal conductor layers 34 and 36 can be adjusted. Can be reduced.
  • FIG. 7 is an exploded perspective view of the multilayer substrate 10d.
  • the multilayer substrate 10d differs from the multilayer substrate 10c in the structure of the laminate 12.
  • the laminate 12 has a first area A1 and a second area A2.
  • the first region A1 includes an insulator layer 14a (first insulator layer), insulator layers 14b to 14d (second insulator layer), insulator layers 14e, 14h, This is a region where 14i and 14j (third insulating layer) are present.
  • the second region A2 has no insulator layer 14a (first insulator layer) and insulator layers 14b to 14d (second insulator layer) when viewed in the vertical direction (Z-axis direction), and is insulated. This is a region where body layers 14e, 14h, 14i, and 14j (third insulating layer) are present.
  • the first signal conductor layer 30 is electrically connected to the first radiation conductor layer 20 via the interlayer connection conductor v1.
  • the first signal conductor layer 32 is electrically connected to the first radiation conductor layer 20 via the interlayer connection conductor v2.
  • the second signal conductor layer 34 is electrically connected to the second radiation conductor layer 21 via an interlayer connection conductor v3.
  • the second signal conductor layer 36 is electrically connected to the second radiation conductor layer 21 via an interlayer connection conductor v4.
  • the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are in contact with the insulator layers 14h, 14i (third insulator layer), and extend from the first area A1 to the second area A2. It extends.
  • the other structure of the multilayer substrate 10d is the same as that of the multilayer substrate 10c, so a description thereof will be omitted.
  • the multilayer substrate 10d can have the same effects as the multilayer substrate 10c.
  • the resistance values of the first signal conductor layers 30 and 32 and the resistance values of the second signal conductor layers 34 and 36 can be reduced for the same reason as the multilayer substrate 10c. As a result, even if the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 become longer, insertion loss is less likely to occur in the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36. .
  • the vertical thickness of the second region A2 is smaller than the vertical thickness of the first region A1. Therefore, the second area A2 is more easily deformed than the first area A1. Therefore, in the multilayer substrate 10d, the second area A2 can be bent and used.
  • FIG. 8 is a diagram of the multilayer substrate 10e seen from above.
  • the multilayer substrate 10e differs from the multilayer substrate 10 in that it further includes a third radiation conductor layer 120 and a fourth radiation conductor layer 121.
  • the third radiation conductor layer 120 is provided in the stacked body 12 so as to be in contact with the insulator layers 14b and 14c (first insulator layer).
  • the fourth radiation conductor layer 121 is provided on the laminate 12 so as to be in contact with the insulator layer 14a (second insulator layer).
  • the fourth radiation conductor layer 121 is located above the third radiation conductor layer 120 (in the positive direction of the Z-axis), and overlaps with the third radiation conductor layer 120 when viewed in the vertical direction (Z-axis direction). .
  • the area of the fourth radiation conductor layer 121 is smaller than the area of the third radiation conductor layer 120. Thereby, the frequency of the fourth high frequency signal (electromagnetic wave) radiated or received by the fourth radiation conductor layer 121 is higher than the frequency of the third high frequency signal (electromagnetic wave) radiated or received by the third radiation conductor layer 120.
  • the first ground conductor layer 16 surrounds the first radiation conductor layer 20, the second radiation conductor layer 21, the third radiation conductor layer 120 to the fourth radiation conductor layer 121 when viewed in the vertical direction (Z-axis direction). It has a ring shape.
  • the other structure of the multilayer substrate 10e is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
  • the multilayer substrate 10e can have the same effects as the multilayer substrate 10.
  • the multilayer substrate according to the present invention is not limited to the multilayer substrates 10, 10a to 10e, and can be modified within the scope of the gist thereof. Furthermore, the structures of the multilayer substrates 10, 10a to 10e may be combined arbitrarily.
  • the number of first insulator layers is one. However, the number of first insulator layers may be one or more.
  • the number of second insulator layers is three. However, the number of second insulator layers may be one or more.
  • the number of third insulator layers is three. However, the number of third insulator layers may be one or more.
  • the frequency of the electromagnetic waves radiated or received by the second radiation conductor layer 21 is higher than the frequency of the electromagnetic waves radiated or received by the first radiation conductor layer 20, or the area of the second radiation conductor layer 21 is higher than the frequency of the electromagnetic waves radiated or received by the first radiation conductor layer 20. Either one of the following conditions may hold true: the area is smaller than the area of the radiation conductor layer 20.
  • the frequency of the electromagnetic waves radiated or received by the fourth radiation conductor layer 121 is higher than the frequency of the electromagnetic waves radiated or received by the third radiation conductor layer 120, or the area of the fourth radiation conductor layer 121 is higher than the frequency of the electromagnetic waves radiated or received by the third radiation conductor layer 120. Either one of the following conditions may hold true: the area is smaller than the area of the radiation conductor layer 120.
  • interlayer connection conductors v1 and v2 may be provided. Only one of the interlayer connection conductors v3 and v4 may be provided.
  • the interlayer connection conductor v1 may be provided.
  • the interlayer connection conductor v1 is connected to both the first radiation conductor layer 20 and the second radiation conductor layer 21, and is also connected to the external electrode 24a. Both the first high frequency signal and the second high frequency signal are input and output to the external electrode 24a.
  • a duplexer is connected to the external electrode 24a. Then, the duplexer separates the first high frequency signal and the second high frequency signal.
  • the dielectric constant of the insulating layer 14a may not be equal to the dielectric constant of the insulating layers 14c to 14g.
  • the first ground conductor layer 16 does not have to have a ring shape.
  • first radiation conductor layer 20 is sandwiched between the first insulating layers from above and below. However, the first radiation conductor layer 20 may be in contact only with the insulator layer 14b (first insulator layer), or may be in contact only with the insulator layer 14c (first insulator layer).
  • the second radiation conductor layer 21 may be sandwiched between the second insulating layers from above and below.
  • the first matching circuit 50a or the second matching circuit 50b is in contact with the insulating layers 14e to 14g (third insulating layer).
  • the first signal conductor layers 30, 32 or the second signal conductor layers 34, 36 only needs to be in contact with the insulator layers 14h, 14i (third insulator layer).
  • the present invention has the following structure.
  • a second radiation conductor layer overlapping with the radiation conductor layer, the frequency of the electromagnetic waves radiated or received by the second radiation conductor layer is higher than the frequency of the electromagnetic waves radiated or received by the first radiation conductor layer, or , the area of the second radiation conductor layer is smaller than the area of the first radiation conductor layer; a first planar ground conductor that is located in the negative direction of the Z-axis from the first radiation conductor layer and overlaps with the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction; layer and A first ground that does not overlap the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction and is located in the positive direction of the Z-axis from the first radiation conductor layer.
  • a conductor layer It is equipped with Multilayer board.
  • the direction perpendicular to the Z-axis direction is defined as the X-axis direction
  • a direction perpendicular to the X-axis direction and the Z-axis direction is defined as the Y-axis direction
  • the first ground conductor layer is located in the positive direction of the X-axis, the positive direction of the Y-axis, and the negative direction of the Y-axis of the first radiation conductor layer and the second radiation conductor layer.
  • the first radiation conductor layer and the second radiation conductor layer have a rhombus shape having diagonal lines extending in the X-axis direction and the Y-axis direction when viewed in the Z-axis direction.
  • the laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in this order toward the negative direction of the Z axis. and The dielectric constant of the one or more third insulator layers is lower than the dielectric constant of the one or more first insulator layers,
  • the multilayer substrate includes: a first matching circuit electrically connected to the first radiation conductor layer; a second matching circuit electrically connected to the second radiation conductor layer; It further includes At least one of the first matching circuit or the second matching circuit is in contact with the one or more third insulating layers, The multilayer substrate according to either (1) or (2).
  • the laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in this order toward the negative direction of the Z axis. and The dielectric constant of the one or more third insulator layers is lower than the dielectric constant of the one or more first insulator layers,
  • the laminate includes a first region where the one or more first insulator layers, the one or more second insulator layers, and the one or more third insulator layers are present when viewed in the Z-axis direction. When viewed in the Z-axis direction, the one or more first insulator layers and the one or more second insulator layers are not present, and the one or more third insulator layers are present.
  • the multilayer substrate includes: a first signal conductor layer electrically connected to the first radiation conductor layer; a second signal conductor layer electrically connected to the second radiation conductor layer; It further includes At least one of the first signal conductor layer or the second signal conductor layer is in contact with the one or more third insulator layers and extends from the first region to the second region,
  • the multilayer substrate according to either (1) or (2).
  • the multilayer substrate includes: a third radiation conductor layer provided on the laminate so as to be in contact with the first insulator layer; is provided in the laminate so as to be in contact with the second insulator layer, is located in the positive direction of the Z-axis from the third radiation conductor layer, and is located in the positive direction of the Z-axis when viewed in the Z-axis direction.
  • the first ground conductor layer has an annular shape surrounding the first radiation conductor layer, the second radiation conductor layer, the third radiation conductor layer, and the fourth radiation conductor layer when viewed in the Z-axis direction.
  • the one or more second insulator layers are located in the negative direction of the Z axis from the second radiation conductor layer
  • the laminate further includes a protective layer located in the positive direction of the Z-axis from the one or more second insulating layers and covering the second radiation conductor layer,
  • the dielectric constant of the protective layer is lower than the dielectric constant of the one or more second insulating layers
  • the area where the second radiation conductor layer is in contact with the protective layer is larger than the area where the second radiation conductor layer is in contact with the one or more second insulator layers.
  • the one or more second insulator layers are located in the negative direction of the Z axis from the second radiation conductor layer
  • the laminate further includes a protective layer located in the positive direction of the Z-axis from the one or more second insulating layers and covering the second radiation conductor layer,
  • the dielectric constant of the protective layer is higher than the dielectric constant of the one or more second insulating layers,
  • the area where the second radiation conductor layer is in contact with the protective layer is smaller than the area where the second radiation conductor layer is in contact with the one or more second insulator layers.
  • the first ground conductor layer has an annular shape surrounding the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction.
  • the multilayer substrate according to any one of (1) to (7).
  • Multilayer substrate 12 Laminated bodies 14a to 14j: Insulator layers 15a, 15b: Protective layer 16: First ground conductor layer 18, 28: Planar ground conductor layer 20: First radiation conductor layer 21: Second radiation conductor layers 24a, 24b, 26a, 26b: External electrodes 30, 32: First signal conductor layers 34, 36: Second signal conductor layer 50a: First matching circuit 50b: Second matching circuit 120: Third radiation Conductor layer 121: Fourth radiating conductor layer A1: First region A2: Second region P1: First feeding point P2: Second feeding point P3: Third feeding point P4: Fourth feeding point v1 to v8, v11 to v14 :Interlayer connection conductor

Landscapes

  • Waveguide Aerials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2023/010031 2022-04-25 2023-03-15 多層基板 Ceased WO2023210198A1 (ja)

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JP2024517899A JP7736179B2 (ja) 2022-04-25 2023-03-15 多層基板
US18/918,370 US20250038413A1 (en) 2022-04-25 2024-10-17 Multilayer substrate

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JP2022071274 2022-04-25

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WO2025225106A1 (ja) * 2024-04-23 2025-10-30 株式会社村田製作所 多層基板アンテナ及び電子機器

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JP2001060823A (ja) * 1999-08-24 2001-03-06 Matsushita Electric Ind Co Ltd 複共振型誘電体アンテナ及び車載無線装置
JP2007531436A (ja) * 2004-04-01 2007-11-01 カトライン−ベルケ・カーゲー 埋込み型平面アンテナ及びそれに関する調整方法
WO2019188471A1 (ja) * 2018-03-30 2019-10-03 株式会社村田製作所 アンテナモジュールおよびそれを搭載した通信装置
JP2021520743A (ja) * 2018-05-04 2021-08-19 テレフオンアクチーボラゲット エルエム エリクソン（パブル） キャビティバックアンテナエレメント及びアレイアンテナ装置

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JP4294670B2 (ja) 2006-09-15 2009-07-15 シャープ株式会社 無線通信装置
WO2018225537A1 (ja) 2017-06-06 2018-12-13 株式会社村田製作所 アンテナ
JP6883059B2 (ja) 2019-04-18 2021-06-09 株式会社フジクラ アンテナ

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Publication number Priority date Publication date Assignee Title
JP2001060823A (ja) * 1999-08-24 2001-03-06 Matsushita Electric Ind Co Ltd 複共振型誘電体アンテナ及び車載無線装置
JP2007531436A (ja) * 2004-04-01 2007-11-01 カトライン−ベルケ・カーゲー 埋込み型平面アンテナ及びそれに関する調整方法
WO2019188471A1 (ja) * 2018-03-30 2019-10-03 株式会社村田製作所 アンテナモジュールおよびそれを搭載した通信装置
JP2021520743A (ja) * 2018-05-04 2021-08-19 テレフオンアクチーボラゲット エルエム エリクソン（パブル） キャビティバックアンテナエレメント及びアレイアンテナ装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025225106A1 (ja) * 2024-04-23 2025-10-30 株式会社村田製作所 多層基板アンテナ及び電子機器

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CN223156273U (zh) 2025-07-25

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