WO2023206779A1

WO2023206779A1 - Server and universal efficient air guide cover thereof

Info

Publication number: WO2023206779A1
Application number: PCT/CN2022/101953
Authority: WO
Inventors: 宗斌
Original assignee: 苏州元脑智能科技有限公司
Priority date: 2022-04-28
Filing date: 2022-06-28
Publication date: 2023-11-02
Also published as: CN114721484A

Abstract

A universal efficient air guide cover, comprising a cover body mounted in a case. The cover body comprises CPU cover frames covered on CPUs and used for forming an independent cold air flow channel for the CPUs, and memory cover frames connected to two sides of the CPU cover frames and respectively covered on memories located on two sides of the CPUs and used for forming an independent cold air flow channel for the memories; the end portion of each CPU cover frame facing away from a cold air inlet direction is provided with a flow guide tail wing plate, and the flow guide tail wing plate is used for guiding an airflow flowing through the CPU cover frame to a gap between rear components mounted at the rear end of the case; and flow guide inclined plates used for guiding cold air outside memory areas to the memory areas are provided on the memory cover frames.

Description

A server and its universal high-efficiency air guide cover

Cross-references to related applications

This application requests the priority of the Chinese patent application submitted to the China Patent Office on April 28, 2022, with the application number 202210461501.4 and the application title "A server and its universal high-efficiency air guide", the entire content of which is incorporated by reference. in this application.

Technical field

The present application relates to the field of server technology, and in particular to a universal high-efficiency air guide cover. This application also relates to a server.

Background technique

With the development of new infrastructure such as cloud computing and big data, the requirements for data calculation speed are getting higher and higher, and the computing speed and computational workload of the processor are also increasing. As a result, the power consumption of CPU components continues to soar, and the temperature spec also increases. Continuously reducing, especially the power consumption of CPUs, which has increased significantly by 80% every year, has made the heat dissipation of electronic devices in servers a thorny issue, and society now has increasing requirements for the power consumption of system cooling fans. The higher the PUE of the computer room, the lower the requirement is.

At present, in order to effectively solve the problem of excessive temperature of electronic components in servers, it is no longer simply to increase the fan air volume. Moreover, due to the limitations of current fan technology, the air volume of the server cooling system has basically reached its limit.

In the existing technology, some technical solutions achieve reasonable utilization of the existing air volume by installing an air guide cover in the server chassis, maximize the utilization rate, and more fully utilize the limited air volume to meet the Spec of each device. In order to give full play to the performance of the existing fans and make full use of the cold air flow, traditional air ducts generally open different holes or flow channels on the air duct according to the configuration and position distribution of different rear components, so that the cold air The airflow is divided into several streams and flows to each rear component for heat dissipation. However, the type, quantity, location and other parameters of the rear components configured on servers of different specifications are different. For example, the distribution form of rear components on 1U and 2U servers may be different, which leads to the need to configure the server according to different specifications. The actual situation of the rear components is to manufacture corresponding air guides, which usually require at least three shapes of air guides. This not only significantly increases the cost of heat dissipation, but also causes a lot of trouble in later installation and testing operations. Moreover, although the air guide hood divides the inlet airflow, the cold air will still transfer heat to the rear components after passing through the CPU, memory and other major heating components, causing the GPU and other major rear components to be affected by a large temperature rise. .

Therefore, how to minimize the impact of temperature rise on the rear components of the server and at the same time realize the versatility of the air guide cover for servers of different specifications is a technical problem faced by those skilled in the art.

Contents of the invention

According to the first aspect, the present application provides a universal high-efficiency air guide cover, which includes a cover body installed in a chassis. The cover body includes a CPU cover frame that covers the CPU and is used to form a separate cold air flow channel for the CPU, and Memory cover frames are connected to both sides of the CPU cover frame and respectively cover the memories located on both sides of the CPU. They are used to form separate cold air flow channels for each memory. The end of the CPU cover frame that is away from the cold air inlet direction is set There is a guide tail fin plate. The guide tail fin plate is used to guide the airflow flowing through the CPU cover frame into the gaps of the rear components installed at the rear end of the chassis. The memory cover frame is provided with a guide plate to guide the cold air outside the memory area. The flow guide ramp to the memory area.

In some embodiments, the front side of the air deflector tail panel is reversibly connected to the left side and/or the right side of the rear end of the CPU cover frame.

In some embodiments, the rear end of the air deflector tail plate abuts against the gap-side side wall of the corresponding rear component.

In some embodiments, a deflection ramp is disposed on the top of the memory cover frame to guide the cold air in the area above the memory downward to the memory area.

In some embodiments, the height of the top of the deflector ramp is the same as the height of the top surface of the CPU cover frame.

In some embodiments, the height of the bottom of the deflector ramp is the same as the height of the top of the memory.

In some embodiments, the height of the bottom end of the deflector ramp is the same as the lowest installation height of the corresponding rear component.

In some embodiments, the bottom end of the deflection ramp is in contact with the end of the top of the memory facing the cold air inlet direction, and the bottom end of the deflection ramp is connected with a flow guide for covering the memory to prevent cold wind from escaping. cover.

In some embodiments, mounting insert plates for detachable insertion into the chassis are provided on both sides of the cover.

According to a second aspect, the present application also provides a server, including a chassis and a universal high-efficiency air guide hood disposed in the chassis, wherein the universal high-efficiency air guide hood is specifically the universal high-efficiency air guide described in any one of the above. cover.

The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below. Other features and advantages of the application will be apparent from the description, drawings, and claims.

Description of the drawings

In order to explain the embodiments of the present application or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only This is an embodiment of the present application. For those of ordinary skill in the art, other drawings can be obtained based on the provided drawings without exerting creative efforts.

Figure 1 is a perspective view of the overall structure of a specific implementation provided by this application.

Figure 2 is a schematic diagram of the specific structure of the cover body.

FIG. 3 is a partial perspective view of FIG. 2 .

Among them, in Figures 1 to 3:

Chassis - 1, cover - 2, CPU cover - 3, memory cover - 4;

Install the insert plate - 21, the deflector tail plate - 31, the deflector inclined plate - 41, and the deflector cover - 42.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

Please refer to Figure 1, which is a perspective view of the overall structure of a specific embodiment provided by the present application (the arrow in the figure is the direction of the cold air inlet).

In a specific implementation provided by this application, the universal high-efficiency air guide mainly includes a cover body 2, a CPU cover frame 3, a memory cover frame 4, a flow guide tail plate 31 and a flow guide inclined plate 41.

Among them, the cover body 2 is the main structure of the air guide cover, generally in the shape of a frame, installed in the chassis 1 of the server, and is mainly used to realize the functions of guiding and shunting the inlet airflow (ie, cold air) in the chassis 1 .

The CPU cover frame 3 is one of the main components of the cover body 2. The specific cover is located on the CPU installed on the motherboard. It is mainly used to form a separate cold air flow channel for the CPU, so that the cold air entering from the front end of the chassis 1 can be diverted. Part of it is dedicated to cooling the CPU.

The memory cover frame 4 is also one of the main components of the cover body 2. It is specifically connected to both sides of the CPU cover frame 3 and is mainly used to cover the memory (bar) installed on the motherboard and located on both sides of the CPU. Separate cold air flow channels are formed for each memory, so that a part of the cold air flow entering from the front end of the chassis 1 is dedicated to dissipating and cooling the memory.

What is important is that the deflector tail plate 31 is set at the end position of the CPU cover frame 3 away from the cold air inlet direction, that is, the rear end position of the CPU cover frame 3 (based on the air inlet direction of the chassis 1), and is mainly used for The airflow flowing through the CPU cover frame 3 is directed to the gaps between the rear components installed at the rear end of the chassis 1, so that part of the cold airflow flows through the CPU cover frame 3 and absorbs the heat of the CPU. Flow through the gaps between the rear components, avoid passing directly through the rear components, and prevent the airflow that has absorbed the heat of the CPU from transferring the heat to the rear components.

The diversion ramp 41 is provided on the memory cover frame 4 and is mainly used to guide the cold air outside the memory area into the memory area, thereby increasing the cold air flow in the memory cover frame 4 .

In this way, the universal high-efficiency air guide provided in this embodiment provides separate cold air flow channels for the CPU and memory on the motherboard through the CPU cover frame 3 and the memory cover frame 4 respectively, and uses the air guide tail fin plate 31 to absorb the air. The airflow that absorbs the heat of the CPU flows through the gap between the rear components to avoid transferring the heat of the CPU to the corresponding rear components. At the same time, the deflector ramp 41 is used to increase the flow of cold air flowing through the memory, thereby reducing the distance between the memory and the memory. The temperature rise effect of the corresponding rear components.

Compared with the existing technology, since the positional relationship between the CPU and memory components on a server motherboard of any specification is fixed, the positional relationship between the CPU cover frame 3 and the memory cover frame 4 on the cover body 2 is also relatively fixed. , there is no need to adjust the position according to the rear components, so that the universal high-efficiency air guide provided in this embodiment can be applied to servers of different specifications to achieve versatility.

It should be noted that since one CPU usually corresponds to two sets of memory on both sides, one CPU cover frame 3 forms a group with the two memory cover frames 4 on both sides. On higher-spec servers, more than one CPU is usually installed. , such as 2 or more, etc., at this time, multiple sets of CPU cover frames 3 and memory cover frames 4 can be set on the cover body 2 at the same time. Moreover, since multiple CPUs are usually arranged side by side, each group of CPU cover frames 3 and memory cover frames 4 can also be connected into one body.

As shown in Figures 2 and 3, Figure 2 is a schematic diagram of the specific structure of the cover 2, and Figure 3 is a partial perspective view of Figure 2.

In an optional embodiment regarding the air guide tail fin plate 31 , the air guide fin plate 31 forms a rotational connection with the CPU cover frame 3 . Specifically, the air guide tail fin plate 31 is generally in a rectangular structure, and its front end side is rotationally connected with the rear end of the CPU cover frame 3 , so that the air guide tail fin plate 31 can move relative to the rear end of the CPU cover frame 3 The flipping movement, and then through the flipping of the air guide tail fin plate 31, adjusts the guiding direction of the airflow flowing out from the rear end of the CPU cover frame 3 - the inclination angle or flip angle of the air guide tail fin plate 31. With this arrangement, when the gap position between the rear components corresponding to the CPU cover frame 3 changes, the flip angle of the air guide tail fin plate 31 can be adjusted to ensure that the airflow flowing out from the rear end of the CPU cover frame 3 can pass through. flows through the gaps between rear components.

In some embodiments, the air deflector tail plate 31 can form a rotational connection with the left side of the rear end of the CPU cover frame 3, such as through a hinge, a rotating shaft or a pin, and can also be realized with a locking component such as a latch. The flip angle of the air deflector tail panel 31 is locked.

In the same way, the air deflector tail plate 31 can also form a rotational connection with the right side of the rear end of the CPU cover frame 3 .

Of course, if necessary, two air deflector tail fins 31 can be connected to one CPU cover frame 3 at the same time, and are respectively arranged on the left and right sides of the rear end of the CPU cover frame 3 .

In addition, in order to prevent the airflow from escaping after flowing out from the rear end of the CPU cover frame 3, in this embodiment, the rear end side of the air guide tail plate 31 is in contact with the gap side side wall of the corresponding rear component. With this arrangement, after the airflow is guided by the airflow guide tail plate 31, it will enter the gap along the airflow guide tail plate 31 into the gap between adjacent rear components, thereby preventing the airflow from escaping in the middle.

In an optional embodiment of the flow guide swash plate 41 , the flow guide swash plate 41 is specifically disposed at the top of the memory cover frame 4 and is mainly used to guide the cold air flowing in the area above the memory downward to the memory. in the area. Since the height of the memory cover frame 4 is usually greater than the height of the memory, a vertical distance is formed between the top surface of the memory cover frame 4 and the top end surface of the memory, and cold air flows through the space corresponding to this distance. With such an arrangement, part of the cold air flow located in the memory cover frame 4 but not flowing through the memory can be effectively utilized, ultimately achieving the effect that almost all the cold air flow passing through the memory cover frame 4 must pass through the memory.

In some embodiments, the height of the top of the deflection ramp 41 is the same as the height of the top surface of the CPU cover frame 3. With this arrangement, the deflection ramp 41 can be easily integrated with the CPU cover frame 3 to facilitate preliminary processing. manufacturing, cost savings.

In some embodiments, the height of the bottom end of the deflection ramp 41 is the same as the top height of the memory. With this arrangement, the bottom end face of the deflection ramp 41 can just abut against the top end face of the memory, and the deflection ramp is The cold air flow guided by the plate 41 will gradually move downward along the surface of the inclined guide plate 41 until it reaches the memory area. Generally, the inclination angle (or slope) of the deflection swash plate 41 is usually 30° to 60°.

In some embodiments, in order to accurately prevent the airflow flowing through the memory from flowing out from the memory cover frame 4 and reaching rear components, this embodiment considers that the installation position of rear components such as the GPU may be relatively upward at the rear end of the chassis 1. Therefore, the bottom height of the deflector swash plate 41 is designed to be the same as the lowest installation height of the corresponding rear component, or the same as the bottom surface height of the rear component. With this arrangement, when the airflow flowing through the memory cover frame 4 flows to the rear end of the chassis 1, it can avoid the installation area of the rear components such as the GPU and pass through the bottom gap of the rear components such as the GPU to prevent the heat carried to the rear. placed on the component.

Furthermore, the bottom end of the deflection swash plate 41 is specifically in contact with the end of the top of the memory facing the cold air inlet direction, that is, the bottom end surface of the deflection swash plate 41 is in contact with the front end of the top end surface of the memory. With this arrangement, when the cold air flow flows downward along the deflection ramp 41, it will enter the gap between adjacent memories from the front space of the memory, ensuring that the cold air flow passes through the entire memory.

Not only that, in order to prevent the cold air flow from escaping to other areas when passing through the memory, this embodiment also connects a flow guide cover 42 to the bottom end (or rear end) of the flow guide ramp 41 . Specifically, the flow guide cover 42 covers the top end surface of the memory, sealing the top of the memory, thereby preventing the cold air flow from escaping when flowing in the gap of the memory.

In addition, the deflection ramp 41 can not only tilt from top to bottom, but also tilt from left to right or from right to left, so that the cold airflow outside the areas on both sides of the memory can be guided to the memory area. Similarly, The purpose of increasing the cold air flow of the memory cover frame 4 can be achieved.

In order to facilitate the disassembly, assembly and position adjustment of the cover body 2 in the chassis 1, in this embodiment, installation insert plates 21 are provided on both sides of the cover body 2. The installation insert plates 21 are mainly used for insertion into the chassis 1 , and forms a detachable connection with the chassis 1, such as a plug-in connection, etc. Specifically, the installation plug-in plate 21 can be in the shape of a U-shaped clip, and can be inserted downwards into the side walls of the chassis 1 from the vertical direction, thereby clamping the side walls of the chassis 1. At the same time, the installation plug-in plate 21 can be used The elastic deformation increases the clamping force on the side wall of chassis 1 to achieve stable connection. When you need to adjust the installation position of the cover 2, you only need to twist the installation insert plate 21 to release it from the clamping of the side wall of the chassis 1, and then slide the cover 2 along the length direction of the chassis 1. When it is necessary to disassemble the cover body 2, you only need to twist the installation insert plate 21 to release it from the clamping of the side wall of the chassis 1, and then pull out the cover body 2 upwards.

This embodiment also provides a server, which mainly includes a chassis 1 and a universal high-efficiency air guide provided in the chassis 1. The specific content of the universal high-efficiency air guide is the same as the above-mentioned relevant content and will not be described again here. .

The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be practiced in other embodiments without departing from the spirit or scope of the application. Therefore, the present application is not to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

A universal high-efficiency air guide cover, characterized in that it includes a cover body (2) installed in a chassis (1). The cover body (2) includes a cover that is provided on the CPU and is used to form a separate cold air flow for the CPU. The CPU cover frame (3) of the CPU cover frame (3), and the memory cover connected to both sides of the CPU cover frame (3) and respectively covering the memories located on both sides of the CPU for forming separate cold air flow channels for each memory. Frame (4), the end of the CPU cover frame (3) facing away from the cold air inlet direction is provided with a deflector tail fin (31), and the deflector fin (31) is used to divert the flow through the CPU cover. The airflow of the frame (3) is directed to the gaps between the rear components installed at the rear end of the chassis (1). The memory cover frame (4) is provided with a device for guiding the cold air outside the memory area to the memory area. diversion ramp (41).
The universal high-efficiency air guide cover according to claim 1, characterized in that the front end side of the air guide tail panel (31) is reversibly connected to the rear end of the CPU cover frame (3). Left side and/or right side.
The universal high-efficiency air guide hood according to claim 1 or 2, characterized in that the rear end of the air guide tail plate (31) is in contact with the gap side side wall of the corresponding rear component.
The universal high-efficiency air guide cover according to claim 1, characterized in that the deflector ramp (41) is arranged on the top of the memory cover frame (4) to guide the cold air in the area above the memory downward. flow to the memory area.
The universal high-efficiency air guide hood according to claim 1 or 4, characterized in that the height of the top of the inclined air guide plate (41) is the same as the height of the top surface of the CPU cover frame (3).
The universal high-efficiency wind guide according to claim 1, 4 or 5, characterized in that the height of the bottom end of the deflection ramp (41) is the same as the top height of the memory.
The universal high-efficiency air guide hood according to claim 1, 4 or 5, characterized in that the height of the bottom end of the deflector sloping plate (41) is the same as the lowest installation height of the corresponding rear component.
The universal high-efficiency air guide hood according to claim 6, characterized in that the bottom end of the deflector sloping plate (41) is in contact with the end of the top of the memory facing the cold air inlet direction, and the guide plate (41) is The bottom end of the flow inclined plate (41) is connected with a flow guide cover (42) for covering the memory to prevent cold wind from escaping.
The universal high-efficiency air guide cover according to claim 1, characterized in that, both sides of the cover body (2) are provided with installation insert plates (21) for detachable insertion into the chassis (1). ).
A server, including a chassis (1) and a universal high-efficiency air guide hood arranged in the chassis (1), characterized in that the universal high-efficiency air guide hood is specifically as claimed in any one of claims 1-9. The above-mentioned universal high-efficiency air guide hood.