CN114721484A - Server and general efficient wind scooper thereof - Google Patents

Abstract

The invention discloses a general efficient wind scooper which comprises a hood body arranged in a case, wherein the hood body comprises a CPU hood frame which is covered on a CPU and used for forming an independent cold wind channel for the CPU, and memory hood frames which are connected with two sides of the CPU hood frame, respectively covered on memories positioned on two sides of the CPU and used for respectively forming an independent cold wind channel for each memory, a flow guide tail wing plate is arranged at the end part of the CPU hood frame deviating from the cold wind inlet direction and used for guiding airflow flowing through the CPU hood frame to gaps of rear parts arranged at the rear end of the case, and a flow guide inclined plate used for guiding cold wind outside the memory area to the memory area is arranged on the memory hood frame. The universal efficient wind scooper disclosed by the invention can reduce the influence of temperature rise on the rear parts in the server as much as possible, and meanwhile, the universality of the wind scooper on servers with different specifications is realized. The invention also discloses a server, which has the beneficial effects as described above.

Description

A server and its universal high-efficiency air guide

technical field

The invention relates to the technical field of servers, in particular to a universal high-efficiency air guide. The invention also relates to a server.

Background technique

With the development of new infrastructure such as cloud computing and big data, the requirements for data computing speed are getting higher and higher, and the computing speed and computing volume of the processor are also increasing. Continuous reduction, especially the power consumption of the CPU is increasing by 80% every year, which makes the heat dissipation of the electronic devices in the server a difficult problem at present, and now the society has more and more requirements for the power consumption of the cooling fan of the system. The higher it is, the lower the PUE of the computer room is.

At present, in order to effectively solve the problem of overheating of the electronic components of the server, it is no longer simply to increase the air volume of the fan, and due to the limitation of the current fan technology, the air volume of the server cooling system has basically reached its limit.

In the prior art, some technical solutions utilize the current air volume reasonably, maximize the utilization rate, and more fully utilize the limited air volume to meet the Spec of each device by installing an air guide cover in the server chassis. In order to give full play to the existing fan performance and make full use of the cold air flow, the traditional air guide hood generally opens different holes or flow channels on the air guide hood according to the configuration and position distribution of different rear components, so as to make the cold air flow. The airflow is divided into several strands and flows to each rear component for heat dissipation. However, the types, quantities, locations and other parameters of the rear components configured on servers of different specifications are different. For example, the distribution of rear components on 1U and 2U servers may be different, which leads to According to the actual situation of the rear components, the corresponding air ducts usually need to be configured with at least 3 shapes of air ducts, which not only significantly increases the heat dissipation cost, but also causes a lot of troubles for post-installation and testing operations. In addition, although the air duct divides the intake air flow, after the cold air passes through the main heat-generating components such as the CPU and memory, the heat will still be transferred to the rear components, causing the main rear components such as the GPU to be affected by a large temperature rise. .

Therefore, how to minimize the influence of the temperature rise on the rear components in the server and at the same time realize the versatility of the air guide cover for servers of different specifications is a technical problem faced by those skilled in the art.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a universal high-efficiency air guide, which can minimize the influence of temperature rise on the rear components in the server, and at the same time realize the versatility of the air guide for servers of different specifications. Another object of the present invention is to provide a server.

In order to solve the above technical problems, the present invention provides a general-purpose high-efficiency air guide cover, including a cover body installed in a chassis, the cover body including a CPU cover installed on the CPU and used to form a separate cold air flow channel for the CPU. frame, and a memory cover frame that is connected to both sides of the CPU cover frame and covers the memory located on both sides of the CPU and is used to form separate cold air flow channels for each memory, the CPU cover frame is away from the cold air. The end of the air inlet direction is provided with a deflector spoiler, which is used to guide the airflow flowing through the CPU cover frame to the gaps of the rear components installed at the rear end of the chassis. The memory cover frame is provided with a deflector inclined plate for guiding the cold air outside the memory area to the memory area.

Preferably, the front end side of the spoiler is rotatably connected to the left side and/or the right side of the rear end of the CPU cover frame.

Preferably, the rear end of the spoiler plate is in abutment with the corresponding sidewall of the gap of the rear component.

Preferably, the deflector inclined plate is arranged on the top of the memory cover frame, so as to guide the cold air from the area above the memory to the memory area.

Preferably, the height of the top of the slanted air guide plate is the same as the height of the top surface of the CPU cover frame.

Preferably, the height of the bottom end of the deflector inclined plate is the same as the height of the top end of the memory.

Preferably, the height of the bottom end of the deflector inclined plate is the same as the minimum installation height of the corresponding rear component.

Preferably, the bottom end of the deflector inclined plate abuts against the end of the top of the memory which is facing the direction of cold air intake, and the bottom end of the deflector inclined plate is connected with a guide for covering the memory to prevent cold air from escaping. flow cover.

Preferably, two sides of the cover body are provided with mounting boards for detachably being inserted into the chassis.

The present invention also provides a server, comprising a chassis and a universal high-efficiency air guide cover disposed in the chassis, wherein the universal high-efficiency air guide cover is specifically the universal high-efficiency air guide described in any of the above .

The universal high-efficiency wind deflector provided by the present invention mainly includes a cover body, a CPU cover frame, a memory cover frame, a deflector tail plate and a deflector inclined plate. Among them, the cover is the main structure of the air guide cover, generally in the shape of a frame, installed in the chassis of the server, and mainly used to realize the functions of diversion and diversion of the intake air flow (ie cold air) in the chassis. The CPU cover frame is one of the main components of the cover body. It is specifically covered on the CPU installed on the motherboard. It is mainly used to form a separate cold air flow channel for the CPU, so that the cold air entering from the front of the chassis is divided and a part is dedicated to the CPU. Cool down the CPU. The memory cover frame is also one of the main components of the cover body. It is specifically connected to the two sides of the CPU cover frame. It is mainly used to cover the memory (strips) installed on the motherboard and located on both sides of the CPU. Separate cold air ducts are formed, so that a part of the cold air entering from the front of the chassis is dedicated to cooling the memory. It is important that the spoiler plate is set at the end of the CPU cover frame away from the cold air intake direction, that is, the rear end of the CPU cover frame (subject to the air intake direction of the chassis), which is mainly used for the airflow through the CPU. The airflow of the cover frame is diverted to the gaps between the rear components installed at the rear of the chassis, so that part of the cold air flow passes through the CPU cover frame and absorbs the heat of the CPU, and most of it can be removed from the gaps between the rear components. Flow through the gap, avoid directly passing through the rear components, and prevent the airflow that absorbs the heat of the CPU from transferring heat to the rear components. The air guide inclined plate is arranged on the memory cover frame, and is mainly used to guide the cold air outside the memory area into the memory area, thereby increasing the flow of cold air in the memory cover frame. In this way, the general-purpose high-efficiency air guide provided by the present invention provides separate cold air flow channels for the CPU and memory on the main board through the CPU cover frame and the memory cover frame, and uses the guide tail plate to absorb the heat of the CPU. The airflow flows through the gaps between the rear components to avoid transferring the heat of the CPU to the corresponding rear components, and at the same time, the swash plate is used to increase the flow of cold air flowing through the memory, thereby reducing the number of rear components corresponding to the memory. temperature rise effect. Compared with the prior art, since the positional relationship between the CPU and memory components on a server motherboard of any specification is fixed, the positional relationship between the CPU cover frame and the memory cover frame on the cover body is also relatively fixed, and there is no need to The position of the rear component is adjusted, so that the universal high-efficiency air guide provided by the present invention can be applied to servers of different specifications, thereby achieving versatility.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.

FIG. 1 is a perspective view of the overall structure of a specific embodiment provided by the present invention.

FIG. 2 is a schematic diagram of the specific structure of the cover body.

FIG. 3 is a partial perspective view of FIG. 2 .

Among them, in Figure 1-Figure 3:

Chassis-1, cover-2, CPU cover-3, memory cover-4;

Install the plug board-21, the deflector tail plate-31, the deflector swash plate-41, and the deflector cover-42.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Please refer to FIG. 1 . FIG. 1 is a perspective view of the overall structure of a specific embodiment provided by the present invention (the arrow in the figure is the direction of cold air intake).

In a specific embodiment provided by the present invention, the universal high-efficiency wind deflector mainly includes a cover body 2 , a CPU cover frame 3 , a memory cover frame 4 , a deflector tail plate 31 and a deflector swash plate 41 .

Among them, the cover body 2 is the main structure of the air guide cover, generally in the shape of a frame, installed in the chassis 1 of the server, and is mainly used to realize the functions of diversion and diversion of the intake air flow (ie cold air) in the chassis 1 .

The CPU cover frame 3 is one of the main components of the cover body 2, and is specifically covered on the CPU installed on the motherboard, and is mainly used to form a separate cold air flow channel for the CPU, so that the cold air entering from the front end of the chassis 1 can be divided Part of it is dedicated to cooling the CPU.

The memory cover frame 4 is also one of the main components of the cover body 2, and is specifically connected to the two sides of the CPU cover frame 3. It is mainly used to cover the memory (strips) installed on the motherboard and located on both sides of the CPU, to A separate cold air flow channel is formed for each memory, so that a part of the cold air flow entering from the front end of the chassis 1 is dedicated to cooling the memory.

It is important that the spoiler 31 is arranged at the end position of the CPU cover frame 3 away from the cold air intake direction, that is, the rear end position of the CPU cover frame 3 (subject to the air intake direction of the chassis 1), and is mainly used for The airflow passing through the CPU cover frame 3 is diverted to the gaps between the rear components installed at the rear end of the chassis 1, so that part of the cold air flows through the CPU cover frame 3 and absorbs the heat of the CPU, so that most of the cooling air can be absorbed. Flow through the gap between the rear components, avoid directly passing through the rear components, and prevent the airflow that absorbs the heat of the CPU from transferring heat to the rear components.

The slanted air guide plate 41 is disposed on the memory cover frame 4 , and is mainly used to guide the cold air outside the memory area into the memory area, thereby increasing the flow of cold air in the memory cover frame 4 .

In this way, the universal high-efficiency air guide provided in this embodiment provides separate cold air flow channels for the CPU and memory on the main board through the CPU cover frame 3 and the memory cover frame 4, and uses the guide tail plate 31 to absorb the air. The airflow that removes the heat of the CPU flows through the gaps between the rear components to avoid transferring the heat of the CPU to the corresponding rear components. At the same time, the air deflector 41 is used to increase the flow of cold air flowing through the memory, thereby reducing the connection between the memory and the memory. The influence of the temperature rise of the corresponding rear components.

Compared with the prior art, since the positional relationship between the CPU and memory components on any specification of the server motherboard is fixed, the positional relationship between the CPU cover frame 3 and the memory cover frame 4 on the cover body 2 is also relatively fixed. , there is no need to adjust the position according to the rear components, so that the universal high-efficiency air guide provided in this embodiment can be applied to servers of different specifications, thereby achieving versatility.

It should be noted that, since a CPU usually corresponds to two sets of memory on both sides, a CPU cover frame 3 and the two memory cover frames 4 on both sides form a group, and higher specification servers usually install more than one CPU. , such as two or more, in this case, multiple sets of CPU cover frames 3 and memory cover frames 4 can be simultaneously set on the cover body 2 . In addition, since a plurality of CPUs are usually arranged in parallel, each set of the CPU cover frame 3 and the memory cover frame 4 may be connected to be integrated.

As shown in FIG. 2 and FIG. 3 , FIG. 2 is a schematic diagram of a specific structure of the cover body 2 , and FIG. 3 is a partial perspective view of FIG. 2 .

In an optional embodiment of the spoiler plate 31 , the spoiler plate 31 is rotatably connected with the CPU cover frame 3 . Specifically, the spoiler plate 31 generally has a rectangular structure, and its front end side and the rear end of the CPU cover frame 3 are rotatably connected, so that the spoiler plate 31 can be rotated relative to the rear end of the CPU cover frame 3 . The flipping motion, and then through the flipping of the spoiler 31 , adjusts the direction of the airflow flowing out from the rear end of the CPU cover frame 3 - the inclination angle or the flip angle of the spoiler 31 . In this way, when the position of the gap between the respective rear components corresponding to the CPU cover frame 3 changes, the air flow from the rear end of the CPU cover frame 3 can be ensured by adjusting the turning angle of the spoiler plate 31 to ensure that the air flow from the rear end of the CPU cover frame 3 can be flow through the gap between the rear parts.

In some embodiments, the spoiler plate 31 can be rotationally connected with the left side of the rear end of the CPU cover frame 3 , for example, through hinges, rotating shafts or pins, etc., and can also be combined with locking components such as latches. The flip angle of the spoiler 31 is locked.

Similarly, the spoiler plate 31 can also form a rotational connection with the right side of the rear end of the CPU cover frame 3 .

Of course, if necessary, two air deflectors 31 can be connected to one CPU cover frame 3 at the same time, and are respectively disposed on the left side and the right side of the rear end of the CPU cover frame 3 .

In addition, in order to prevent the airflow from flowing out from the rear end of the CPU cover frame 3 and escaping, in this embodiment, the rear end side of the spoiler plate 31 is in contact with the gap side wall of the corresponding rear component. In this way, after the air flow is guided by the deflector fin plate 31, it will enter the gap between the adjacent rear components along the deflector fin plate 31, so as to prevent the air flow from escaping in the middle.

In an optional embodiment of the inclined air guide plate 41, the inclined air guide plate 41 is specifically arranged at the top position of the memory cover frame 4, and is mainly used to guide the cold air flowing in the area above the memory to the memory. in the area. Since the height of the memory cover frame 4 is generally greater than the height of the memory, a vertical distance is formed between the top surface of the memory cover frame 4 and the top end face of the memory, and the space corresponding to the distance has cold air flowing through. In this way, part of the cold air flow located in the memory cover frame 4 but not flowing through the memory can be effectively utilized, and finally almost all the cold air flow passing through the memory cover frame 4 must pass through the memory.

In some embodiments, the height of the top of the slanted deflector 41 is the same as the height of the top surface of the CPU cover frame 3. In this way, the slanted deflector 41 can be easily integrally connected with the CPU cover frame 3, which is convenient for pre-processing. Manufacturing, cost saving.

In some embodiments, the height of the bottom end of the oblique deflector 41 is the same as the height of the top of the memory. In this way, the bottom end face of the oblique deflector 41 can just abut on the top end surface of the memory, and the oblique deflector The cold air flow guided by the plate 41 will gradually move downward along the surface of the guide inclined plate 41 until it reaches the storage area. Generally, the inclination angle (or slope) of the sloping guide plate 41 is usually 30°˜60°.

In some implementation manners, in order to precisely prevent the airflow flowing through the memory from flowing out of the memory cover frame 4 and then reaching the rear components, this embodiment considers that the rear components such as the GPU may be installed at the rear end of the chassis 1 on the upper side. Therefore, the height of the bottom end of the swash plate 41 is designed to be the same as the minimum installation height of the corresponding rear component, or the same as the height of the bottom surface of the rear component. In this way, when the airflow flowing through the memory cover frame 4 flows to the rear end of the chassis 1, it can avoid the installation area of the rear components such as the GPU, and pass through the bottom gap of the rear components such as the GPU, so as to prevent the carried heat from being transferred to the rear. on the component.

Further, the bottom end of the deflector inclined plate 41 abuts against the end of the top of the memory toward the cold air inlet direction, that is, the bottom end face of the deflector inclined plate 41 abuts against the front end of the top end face of the memory. In this way, when the cold air flows downward along the deflector inclined plate 41, it will enter the gap between the adjacent memories from the front end space of the memory to ensure that the cold air flows through the entire memory.

Not only that, in order to prevent the cold air from escaping to other areas when passing through the memory, in this embodiment, a guide cover 42 is also connected to the bottom end (or rear end) of the guide inclined plate 41 . Specifically, the air guide cover plate 42 covers the top end face of the internal memory to seal the top of the internal memory, thereby preventing the cold air from escaping when flowing in the gap of the internal memory.

In addition, the deflecting inclined plate 41 can not only be inclined from top to bottom, but also can be inclined from left to right or from right to left, so that the cold air flow outside the areas on both sides of the memory can be diverted into the memory area. The purpose of increasing the cold air flow of the memory cover frame 4 can be achieved.

In order to facilitate the disassembly and position adjustment of the cover body 2 in the chassis 1, in this embodiment, installation boards 21 are provided on both sides of the cover body 2, and the installation boards 21 are mainly used to be inserted into the chassis 1. , and form a detachable connection with the chassis 1, such as a plug-in connection. Specifically, the installation board 21 can be in the shape of a U-shaped clip, and can be inserted into the sidewalls on both sides of the chassis 1 from the vertical direction, so as to clamp the sidewalls of the chassis 1, and at the same time, the installation board 21 can be used. The elastic deformation improves the clamping force on the side wall of the chassis 1 to achieve stable connection. When it is necessary to adjust the installation position of the cover body 2 , it is only necessary to move the installation plug board 21 to release the clamping of the side wall of the case 1 , and then slide the cover body 2 along the length direction of the case 1 . When the cover body 2 needs to be dismantled, it is only necessary to move the installation plug board 21 so that it is released from the clamping on the side wall of the case 1, and then the cover body 2 can be pulled up.

This embodiment also provides a server, which mainly includes a chassis 1 and a universal high-efficiency air guide cover disposed in the chassis 1, wherein the specific content of the universal high-efficiency air guide cover is the same as the above-mentioned related content, and will not be repeated here. .

The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A universal high-efficiency air guide hood, characterized in that it comprises a cover body (2) installed in a chassis (1), and the cover body (2) comprises a cover that is arranged on the CPU and is used to form a separate structure for the CPU. A CPU cover frame (3) for the cold air flow channel, and a CPU cover frame (3) connected to both sides of the CPU cover frame (3) and respectively covering the memories located on both sides of the CPU and used for forming separate cold air flow channels for each memory respectively. The memory cover frame (4), the end of the CPU cover frame (3) that is away from the cold air inlet direction is provided with a deflector fin plate (31), and the deflector fin plate (31) is used to The air flow of the CPU cover frame (3) is guided into the gaps of the rear components installed at the rear end of the chassis (1). The baffle plate (41) of the memory area. 2. The universal high-efficiency air guide according to claim 1, characterized in that the front end side of the wind deflector (31) is reversibly connected to the rear end of the CPU cover frame (3) the left side and/or the right side of the part. 3 . The universal high-efficiency wind deflector according to claim 2 , wherein the rear end of the spoiler plate ( 31 ) abuts against the gap side wall of the corresponding rear component. 4 . 4. The universal high-efficiency air guide according to claim 1, characterized in that, the inclined air guide plate (41) is arranged on the top of the memory cover frame (4), so as to direct the cold air from the area above the memory to the top of the memory cover frame (4). down to the memory area. 5 . The universal high-efficiency air guide according to claim 4 , wherein the height of the top of the inclined air guide plate ( 41 ) is the same as the height of the top surface of the CPU cover frame ( 3 ). 6 . 6 . The universal high-efficiency air guide hood according to claim 5 , wherein the height of the bottom end of the inclined air guide plate ( 41 ) is the same as the height of the top end of the memory. 7 . 7 . The universal high-efficiency air guide hood according to claim 5 , wherein the height of the bottom end of the inclined air guide plate ( 41 ) is the same as the minimum installation height of the corresponding rear component. 8 . 8 . The universal high-efficiency air guide hood according to claim 6 , wherein the bottom end of the guide slant plate ( 41 ) abuts against the end position of the top of the memory that faces the cold air intake direction, and the The bottom end of the deflecting inclined plate (41) is connected with a deflecting cover plate (42) for covering the memory to prevent cold air from escaping. 9. The universal high-efficiency air guide cover according to claim 1, characterized in that, two sides of the cover body (2) are provided with mounting boards for detachably inserting into the chassis (1) (twenty one). 10. A server, comprising a chassis (1) and a universal high-efficiency air guide hood arranged in the chassis (1), characterized in that the universal high-efficiency air guide hood is specifically any one of claims 1-9 The general-purpose high-efficiency air guide described in the item.

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