CN208689535U - Computer memory bank dustproof heat radiator - Google Patents
Computer memory bank dustproof heat radiator Download PDFInfo
- Publication number
- CN208689535U CN208689535U CN201821623684.0U CN201821623684U CN208689535U CN 208689535 U CN208689535 U CN 208689535U CN 201821623684 U CN201821623684 U CN 201821623684U CN 208689535 U CN208689535 U CN 208689535U
- Authority
- CN
- China
- Prior art keywords
- dust cover
- slot
- air inlet
- memory bar
- gas vent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses computer memory bank dustproof heat radiators, relate generally to radiator field.Including dust cover, the dust cover top is provided with through-hole, the both ends of the through-hole are respectively equipped with buckle, the dust cover inner bottom surface is equipped with slot, and memory bar passes through the through-hole and is inserted into slot, is equipped with multiple partitions along its length on the medial surface of the dust cover, the divider upright is in dust cover medial surface, the side of the dust cover is equipped with air inlet fan and gas vent, and the air inlet is fanned and the setting of gas vent opposite side, and the opening of the air inlet fan and gas vent is equipped with strainer.The utility model has the beneficial effects that: preventing dust from entering memory bar slot, and radiate in computer work to memory bar.
Description
Technical field
The utility model relates to radiator fields, specifically computer memory bank dustproof heat radiator.
Background technique
Memory bar is that CPU can be by bus addressing, and the computer part being written and read.Memory bar is gone through in PC
It was once the extension of main memory in history.With the requirement that computer soft and hardware technology is constantly updated, memory bar has become read/write memory
Entirety.The size of our usually said computer memories (RAM), that is, refer to the total capacity of memory bar.Memory bar is that computer must not
Can component part less, have main memory on historical computer main board, memory bar is the extension of main memory.Later computer main board
Upper no main memory, CPU are completely dependent on memory bar.Content on all external memory must be acted on by memory competence exertion.
Positional distance CPU of the memory bank on mainboard is closer, can be discharged by cpu fan in the CPU course of work more
Heat will affect memory bar then these heats can be such that the memory bar close to CPU is in the higher working environment of temperature
It works normally, leads to computer Caton, crash or blue screen, and memory bar is in open working environment, extraneous dust
Cabinet inside can be entered by cabinet gap to fall into memory bar slot, can interfere to radiate, lead to the golden finger failure of memory bar,
Also the failures such as Caton, crash, blue screen can occur, influence the normal use of computer.
Utility model content
The purpose of this utility model is to provide computer memory bank dustproof heat radiators, it prevents dust from entering memory bar
Slot, and radiate in computer work to memory bar.
The utility model to achieve the above object, is achieved through the following technical solutions:
Computer memory bank dustproof heat radiator, including dust cover, the dust cover top is provided with through-hole, described logical
The both ends in hole are respectively equipped with buckle, and the dust cover inner bottom surface is equipped with slot, and memory bar passes through the through-hole and is inserted into slot,
Multiple partitions are equipped on the medial surface of the dust cover along its length, the divider upright is in dust cover medial surface, institute
The side for stating dust cover is equipped with air inlet fan and gas vent, the air inlet fan and the setting of gas vent opposite side, the air inlet fan and row
The opening of stomata is equipped with strainer.
Further, the outside of the dust cover and the outside of slot are equipped with cooling piece.
Further, the outside of the dust cover is equipped with multiple heat-conducting plates.
Further, the section of the dust cover is convex shape.
The prior art is compared, the utility model has the beneficial effects that:
The memory bar of general desktop computer is mounted on position of the mainboard close to CPU, and it is dry to reduce electromagnetism of the CPU in addressing
It disturbs, so the heat of cpu fan discharge can be such that the memory bar closed on is in the working environment of a high temperature, and memory
Item is open working environment, and the time, which has been grown, will accumulate dust in slot, be will lead between memory bar golden finger and slot
Poor contact, in addition the working environment of high temperature, will lead to computer and the failures such as Caton, blue screen, crash occur, influence the normal of computer
It uses, therefore a dust cover, dust cover two sides setting air inlet fan and exhaust is arranged in the outside of slot in the utility model
Hole makes the air circulation in dust cover, reduces the temperature of memory bar working environment, while the medial surface of dust cover extends
It spends direction and is equipped with multiple partitions, the wind increases of slot two sides are made using funnelling, can preferably be reduced in dust cover
Temperature, and enter the wind and be additionally provided with strainer at fan and gas vent, strainer and dust cover can be effectively prevented dust and fall into slot
It is interior, guarantee the normal work of memory bar, prevents computer from the failures such as Caton, crash, blue screen occurring because of memory bar.
Detailed description of the invention
Attached drawing 1 is the structural schematic diagram of the utility model.
Attached drawing 2 is another angled arrangement schematic diagram of the utility model.
Attached drawing 3 is the sectional view of the main view of the utility model.
Attached drawing 4 is the internal structure chart for looking up direction of the utility model.
Label shown in attached drawing:
1, dust cover；2, through-hole；3, it buckles；4, slot；5, partition；6, air inlet fan；7, gas vent；8, strainer；9, it makes
Cold；10, heat-conducting plate.
Specific embodiment
The present invention will be further illustrated below in conjunction with specific embodiments.It should be understood that these embodiments are merely to illustrate this
Utility model rather than limitation the scope of the utility model.In addition, it should also be understood that, in the content for having read the utility model instruction
Later, those skilled in the art can make various changes or modifications the utility model, and such equivalent forms equally fall within this Shen
It please limited range.
Described in the utility model is computer memory bank dustproof heat radiator, and main structure includes dust cover 1, described anti-
1 top of dirt shell is provided with through-hole 2, and the both ends of the through-hole 2 have been respectively articulated with buckle 3, and buckle 3 is after being inserted into memory bar to memory
Item is fixed, and 1 inner bottom surface of dust cover is equipped with slot 4, and memory bar passes through the through-hole 2 and is inserted into slot 4, slot 4
Be arranged on mainboard and with the connection on mainboard, it is multiple right to be equipped on the medial surface of the dust cover 1 along its length
The partition 5 for claiming slot 4 to be arranged, the partition 5 is " when air-flow is by open using funnelling perpendicular to 1 medial surface of dust cover
When area flows into the valley that landform is constituted, since air quality is unable to bulk deposition, then accelerate to flow through valley, wind speed increases.
When flowing out valley, air velocity can slow down again ", by the air-flow that air inlet fan 6 is formed with gas vent 7, make the gas of 4 two sides of slot
Body is in the flow regime of fair speed always, reaches preferably heat dissipation effect, and the side of the dust cover 1 is equipped with air inlet fan
6 and gas vent 7, air inlet fan 6 connect by conducting wire with motherboard power supply, and the laggard fan 6 that is switched on follows starting, guarantees good heat dissipation
Effect, the air inlet fan 6 and the setting of 7 opposite side of gas vent, the gas flow direction that air inlet fan 6 is formed by with gas vent 7 is anti-
The length direction of dirt shell 1, cooperation partition 5 form " funnelling " to reach preferably heat dissipation effect, the air inlet fan 6 and row
The opening of stomata 7 is equipped with strainer 8, prevents dust under off-mode from being entered in slot 4 by the opening and gas vent 7 of air inlet fan 6
The case where.
Since the installation site of memory bar is close to CPU, it itself has been in the higher environment of temperature, it is dust-proof outer in this way
High temperature outside shell 1 can be diffused into inside, and additional burden is carried out to the heat dissipation work belt inside dust cover 1, can also if serious
Lead to computer glitch, the outside of the dust cover 1 and the outside of slot 4 are equipped with cooling piece 9, and cooling piece 9 refers to that one kind is divided into
Two sides is absorbed heat on one side, is radiated on one side, and thermally conductive patch is played, and the high temperature outside such dust cover 1 cannot be introduced into inside, and
High temperature inside dust cover 1 can also pass to outside by cooling piece 9, and the high temperature generated in slot 4 can also pass to outside dust-proof
It is finally passed to outside dust cover 1 in shell 1, the device is made to reach preferably heat dissipation effect.
In order to reach preferably heat dissipation effect, the outside of the dust cover 1 is equipped with multiple heat-conducting plates 10, dust cover 1
Internal heat can be transmitted to outside faster by heat-conducting plate 10, guarantee that memory bar is in the good working environment of temperature
In, guarantee the normal work of computer.
Since memory bar will first transfer heat in dust cover 1 in heat dissipation, then pass through the outer wall of dust cover 1
It is transmitted to outside with air inlet fan 6, radiating efficiency can be reduced if the hypertelorism of the shell wall of dust cover 1 and memory bar,
The section of the dust cover 1 is convex shape, and 1 top of dust cover is bonded memory bar two sides, only there are the heat-dissipating space of lower part,
The region to be radiated is set to become smaller, while the heat that memory bar generates can be quickly transmitted to by the shell wall of dust cover 1
Outside accelerates radiating efficiency, keeps heat dissipation effect more preferable.
Embodiment 1: computer memory bank dustproof heat radiator is the dust cover 1 of convex shape including section, described dust-proof
The outside of shell 1 is equipped with semiconductor chilling plate 9, and the outside of the dust cover 1 is symmetrically arranged with 16 heat-conducting plates 10, described dust-proof
1 top of shell is provided with through-hole 2, and the both ends of the through-hole 2 have been respectively articulated with buckle 3, and 1 inner bottom surface of dust cover, which is equipped with, inserts
Slot 4,4 bottom surface of slot are connected on mainboard, and the outside of the slot 4 is equipped with semiconductor chilling plate 9, and memory bar passes through the through-hole
2 insertion slots 4, symmetrical slot 4 is equipped with 18 partitions 5, the partition 5 along its length on the medial surface of the dust cover 1
Perpendicular to 1 medial surface of dust cover, the side of the dust cover 1 is equipped with air inlet fan 6 and gas vent 7, and air inlet fan 6 passes through conducting wire
It connect with motherboard power supply, starts with launch computer, the air inlet fan 6 and the setting of 7 opposite side of gas vent, the air inlet fan 6 and row
The opening of stomata 7 is equipped with strainer 8.
Exhaust fan 6 starts with booting computer, and forming air-flow with gas vent 7 by air inlet fan 6 will be inside dust cover 1
Heat transfer utilizes " funnelling " to outside, improves the gas flow rates of 4 two sides of slot, reaches and preferably radiate
Effect, the heat that semiconductor chilling plate 9 can prevent CPU from issuing passes in dust cover 1, and heat-conducting plate 10 can play auxiliary
The effect of heat dissipation improves radiating efficiency, and the heat that the structure of convex shape can be such that memory bar distributes is transmitted to outside faster, this
Utility model can carry out effective radiating dustproof to the working environment of memory bar, reduce the rate of breakdown of computer.
Claims (4)
1. computer memory bank dustproof heat radiator, it is characterised in that: including dust cover (1), dust cover (1) top
It is provided with through-hole (2), the both ends of the through-hole (2) are respectively equipped with buckle (3), and dust cover (1) inner bottom surface is equipped with slot
(4), memory bar passes through the through-hole (2) insertion slot (4), is equipped with along its length on the medial surface of the dust cover (1)
Multiple partitions (5), the partition (5) are equipped with air inlet perpendicular to dust cover (1) medial surface, the side of the dust cover (1)
Fan (6) and gas vent (7), the air inlet fan (6) and the setting of gas vent (7) opposite side, the air inlet fan (6) and gas vent (7)
Opening is equipped with strainer (8).
2. computer memory bank dustproof heat radiator according to claim 1, it is characterised in that: the dust cover (1)
Outside and the outside of slot (4) are equipped with cooling piece (9).
3. computer memory bank dustproof heat radiator according to claim 1, it is characterised in that: the dust cover (1)
Outside is equipped with multiple heat-conducting plates (10).
4. computer memory bank dustproof heat radiator according to claim 1, it is characterised in that: the dust cover (1)
Section is convex shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821623684.0U CN208689535U (en) | 2018-09-28 | 2018-09-28 | Computer memory bank dustproof heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821623684.0U CN208689535U (en) | 2018-09-28 | 2018-09-28 | Computer memory bank dustproof heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208689535U true CN208689535U (en) | 2019-04-02 |
Family
ID=65889491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821623684.0U Expired - Fee Related CN208689535U (en) | 2018-09-28 | 2018-09-28 | Computer memory bank dustproof heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208689535U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113253816A (en) * | 2021-07-15 | 2021-08-13 | 深圳市嘉合劲威电子科技有限公司 | Memory bank for internet server |
-
2018
- 2018-09-28 CN CN201821623684.0U patent/CN208689535U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113253816A (en) * | 2021-07-15 | 2021-08-13 | 深圳市嘉合劲威电子科技有限公司 | Memory bank for internet server |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190402 Termination date: 20200928 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |