CN219997547U

CN219997547U - Integrated computer heat radiation structure

Info

Publication number: CN219997547U
Application number: CN202321329192.1U
Authority: CN
Inventors: 季焕淑; 郭丽
Original assignee: Henan Light Industry Vocational College
Current assignee: Henan Light Industry Vocational College
Priority date: 2023-05-29
Filing date: 2023-05-29
Publication date: 2023-11-10
Anticipated expiration: 2033-05-29

Abstract

The utility model provides an integrated computer heat dissipation structure, comprising: the computer main body comprises a shell and an extension part, wherein the extension part is fixedly connected with the surface of the shell, the heat conducting plate is fixedly connected in the shell, the main heat radiation opening is correspondingly formed in the position of the shell relative to the heat conducting plate, the auxiliary heat radiation opening is symmetrically formed in two sides of the shell, the inner surface of the shell is fixedly connected with the heat radiation plate through a groove, the extension part is internally symmetrically formed with a converging groove, the bottom of the converging groove is communicated with the inside of the shell through a mounting groove, the fan is fixedly connected in the mounting groove, the surface of the extension part is fixedly connected with the positioning buckle, and the cooling pipe is fixedly connected with the surface of the extension part through the positioning buckle. According to the utility model, through the cooperation of the cooling pipe, the fan, the heat conducting plate, the heat radiating plate, the main heat radiating port and the auxiliary heat radiating port, the overall heat radiating effect of the computer can be effectively enhanced, so that the probability of accumulating a large amount of heat in the shell can be effectively reduced, and the smooth operation of the computer is ensured.

Description

Integrated computer heat radiation structure

Technical Field

The utility model relates to the technical field of integrated computers, in particular to an integrated computer heat dissipation structure.

Background

The integrated computer is a new computer integrating a host part, a display part and even a keyboard and a mouse; the innovation of this product is the high integration of the internal components; some manufacturers refer to All In One, AIO computers or screen computers; the first integrated computer is creatively put forward by apples in 1998 as an integrated computer is also called an integrated desktop computer: iMacG3; the manufacturers of Sony, shenzhou and the like have already put forward the products of the integrated machine; however, for many reasons such as technology and cost, the computer form of the foresight does not develop a new world belonging to the foresight in the market; along with the holding of CES exhibition in 2009, manufacturers such as association, hua Shuo, hewlett packard, square law and the like have all introduced new integrated computers, which means that the integrated computers have been deposited and incubated for many years, and thick and thin development will occur in 2009, and the desktop trend of the integrated machine age has come; in addition to the hot and integral computers sold in the market, such as delxps One, hewlett packard, square heart T300-5402, the integral computers have been designed into the house to make the concept realistic.

However, due to the highly integrated design, the space between the electronic components is smaller, when the computer works at high frequency, the temperature inside the computer is higher, and corresponding heat dissipation treatment is needed to ensure the smoothness of the computer, and the heat dissipation efficiency is lower by simply adopting the heat dissipation fan and the heat dissipation opening to dissipate heat, so that the heat is easily accumulated inside the computer to form higher temperature, thereby being unfavorable for the normal work of the computer and also improving the damage probability of the electronic components inside the computer.

Disclosure of Invention

In order to overcome the defects in the prior art, an integrated computer heat dissipation structure is provided to solve the problems in the prior art.

To achieve the above object, there is provided an integrated computer heat dissipation structure, comprising: the computer main part and extension, computer main part lower surface fixed connection support frame, the computer main part comprises casing and extension, casing surface fixed connection extension, and casing internal fixation connection heat-conducting plate, and the main thermovent is seted up to the position correspondence of the relative heat-conducting plate of casing, and vice thermovent is seted up to the casing bilateral symmetry simultaneously to the casing internal surface passes through recess fixed connection heating panel, the sink groove is seted up to the symmetry in the extension, and the sink groove bottom passes through inside the mounting groove intercommunication casing, and fixed connection fan in the mounting groove, and extension surface fixed connection location knot, the cooling tube passes through the surface of location knot fixed connection at the extension.

Preferably, the interior of the casing is divided into an element area and a heat dissipation area by a heat conducting plate, the whole heat conducting plate is of a square structure, a plurality of groups of heat dissipation grooves are formed in parallel and equidistant on one side of the heat conducting plate opposite to the heat dissipation area, and meanwhile, the cross sections of the heat dissipation grooves are of isosceles trapezoid structures.

Preferably, a plurality of groups of auxiliary heat dissipation openings are respectively arranged at equal intervals on two sides of the shell at equal intervals relative to the positions of the heat dissipation areas, the plurality of groups of auxiliary heat dissipation openings are of cylindrical structures, and the number and the positions of the heat dissipation openings are in one-to-one correspondence with the number and the positions of the heat dissipation grooves formed in the heat conduction plate.

Preferably, a plurality of groups of main heat dissipation openings are respectively arranged on two sides of the surface of the shell at equal intervals in parallel, the whole main heat dissipation opening is of a rectangular structure, the section of the main heat dissipation opening is of a parallelogram structure, and one end of the main heat dissipation opening far away from the discrete hot area is inclined upwards.

Preferably, a plurality of groups of grooves are respectively formed in parallel and equidistant on two sides of the surface of the shell, the cross sections of the grooves are of T-shaped structures, the grooves and the main heat dissipation openings are alternately distributed, and meanwhile, the cross sections of the heat dissipation plates fixedly connected in the grooves are of a Chinese character 'ji' -shaped structure.

Preferably, the horizontal section of extension is isosceles trapezoid structure, and two sets of converging grooves that extension surface symmetry was seted up all are prismatic table structure, and the both sides symmetry of extension in is seted up two sets of heavy grooves, and the horizontal section of heavy groove is right trapezoid structure.

Preferably, the surface of the extension part is close to the position of the converging groove and is fixedly connected with a plurality of groups of positioning buckles at equal intervals, the positioning buckles are of a C-shaped structure, two groups of cooling pipes fixedly connected with the extension part through the positioning buckles are of continuous U-shaped structures, and two ends of the two groups of cooling pipes are respectively connected with the infusion pipe through a group of three-way pipes.

Compared with the prior art, the utility model has the beneficial effects that: through the cooperation of extension, fan and cooling tube, can carry out corresponding cooling to the air current that flows into the casing inside, then can ensure that the temperature of inflow gas is lower, can strengthen the radiating effect of air current, moreover through the radiating groove of seting up on the heat conduction board surface, can increase the actual area of contact of heat conduction board and air current, then can further strengthen the radiating effect in the radiating area, simultaneously through the cooperation of main thermovent and vice thermovent, can ensure that the air current flows smoothly, and can reduce the probability that the air current is detained near the casing, and the setting of heating panel, then can assist the holistic radiating effect of reinforcing casing, and then ensure the smooth operation of computer main part, reduce the probability that computer main part damaged.

Drawings

Fig. 1 is a schematic rear view of an integrated computer heat dissipation structure according to the present utility model.

Fig. 2 is a schematic side view of an integrated computer heat dissipation structure according to the present utility model.

Fig. 3 is a schematic top view of an integrated computer heat dissipation structure according to the present utility model.

Fig. 4 is an enlarged schematic view of the structure of fig. 2 a of an integrated computer heat dissipation structure according to the present utility model.

In the figure: 1. a computer main body; 2. a housing; 3. an extension; 4. a main heat dissipation port; 5. a three-way pipe; 6. a cooling tube; 7. a sink groove; 8. a blower; 9. a positioning buckle; 10. a heat dissipation plate; 11. a heat conductive plate; 12. and the auxiliary heat dissipation port.

Detailed Description

Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model.

Referring to fig. 1-4, the present utility model provides an integrated computer heat dissipation structure, comprising: the computer main body 1 and extension 3, computer main body 1 lower surface fixed connection support frame, computer main body 1 comprises casing 2 and extension 3, and casing 2 fixed surface connection extension 3, and fixed connection heat-conducting plate 11 in the casing 2, and the main heat dissipation mouth 4 is offered to the position correspondence of casing 2 relative heat-conducting plate 11, and vice heat dissipation mouth 12 is offered to casing 2 bilateral symmetry simultaneously to casing 2 internal surface passes through recess fixed connection heating panel 10, the sink groove 7 is offered to the symmetry in extension 3, and the sink groove 7 bottom passes through inside the mounting groove intercommunication casing 2, and fixed connection fan 8 in the mounting groove, and extension 3 fixed surface connection location knot 9, and cooling tube 6 passes through location knot 9 fixed connection at the surface of extension 3. When the computer main body 1 needs to dissipate heat, the external liquid pump (not shown in the figure) is started to input liquid into the cooling pipe 6 through the infusion pipe and the three-way pipe 5, then the switch of the fan 8 is started, the fan 8 guides external air flow to circulate into the sink 7 and convey the external air flow into the heat dissipation area formed in the casing 2, wherein the air flow can perform corresponding heat exchange with the liquid when flowing through the cooling pipe 6, so that the temperature of the air flow can be reduced, the heat absorption effect of the air flow in the heat dissipation area is enhanced, the air flow can perform corresponding heat exchange while flowing along the surface of the heat conduction plate 11, and the air flow can flow out of the main heat dissipation opening 4 and the auxiliary heat dissipation opening 12 with the absorbed heat respectively, so that the heat dissipation effect of the heat dissipation area is realized, and then the whole heat dissipation effect of the computer main body 1 is ensured, the air flow flows obliquely upwards when flowing out of the main heat dissipation opening 4, and then the air flow on the surface of the heat dissipation plate 10 can be driven, and the heat dissipation effect in the heat dissipation area can be assisted. The interior of the machine shell 2 is divided into an element area and a heat dissipation area through the heat conduction plate 11, the whole heat conduction plate 11 is of a square structure, a plurality of groups of heat dissipation grooves are formed in parallel and equidistant on one side of the heat conduction plate 11 opposite to the heat dissipation area, and meanwhile, the cross sections of the heat dissipation grooves are of an isosceles trapezoid structure. As shown in fig. 2 and 3, the arrangement of the heat-conducting plate 11 can ensure the corresponding heat dissipation of the casing 2, prevent dust in the air flow from remaining on the surface of the electronic component in the component area, and the arrangement of the heat-dissipating grooves can increase the surface area of the heat-conducting plate 11 in the heat-dissipating area, so as to enhance the heat-dissipating effect of the heat-conducting plate 11. The positions of the two sides of the shell 2 opposite to the heat dissipation areas are respectively provided with a plurality of groups of auxiliary heat dissipation openings 12 at equal intervals in parallel, the plurality of groups of auxiliary heat dissipation openings 12 are of cylindrical structures, and the number and the positions of the heat dissipation openings are in one-to-one correspondence with the number and the positions of the heat dissipation grooves formed in the heat conducting plate 11. As shown in fig. 2 and 3, the auxiliary heat dissipation ports 12 are arranged to enable the air flow in the heat dissipation area to be discharged at two sides of the casing 2, so that the probability of excessive heat accumulation at the position near the casing 2 can be reduced, and meanwhile, the fluency of the air flow is improved. Multiple groups of main heat dissipation ports 4 are respectively arranged on two sides of the surface of the shell 2 at equal intervals in parallel, the whole main heat dissipation ports 4 are of rectangular structures, the section of each main heat dissipation port 4 is of a parallelogram structure, and one end of each main heat dissipation port 4 far away from a discrete hot zone is inclined upwards. As shown in fig. 1 and 2, the inclined surface structure of the main heat dissipation port 4 enables the hot air formed after the air flow absorbs heat to flow obliquely upwards of the casing 2, so that the time for the hot air to stay near the casing 2 can be reduced, excessive heat accumulated near the casing 2 is avoided, and the heat dissipation of the casing 2 is ensured to be normal. The two sides of the surface of the shell 2 are respectively provided with a plurality of groups of grooves at equal intervals in parallel, the cross sections of the grooves are of T-shaped structures, the grooves and the main heat dissipation openings 4 are alternately distributed, and meanwhile, the cross sections of the heat dissipation plates 10 fixedly connected in the grooves are of a Chinese character 'ji' -shaped structure. As shown in fig. 1 and 4, the heat dissipation plate 10 is configured such that the air flow in the heat dissipation area can transfer heat to the outside of the casing 2 through the heat dissipation plate 10, and when the air flow flows out from the main heat dissipation opening 4, the air flow near the heat dissipation plate 10 is driven, so that the stable heat dissipation effect of the heat dissipation plate 10 can be enhanced. The horizontal cross section of extension portion 3 is isosceles trapezoid structure, and two sets of converging grooves 7 that extension portion 3 surface symmetry was seted up all are prismatic table structure, and the both sides symmetry of extension portion 3 interior is seted up two sets of heavy grooves, and the horizontal cross section of heavy groove of subtracting is right trapezoid structure. As shown in fig. 3, the weight of the extension portion 3 can be effectively reduced by providing the weight-reducing groove, so that the overall weight of the computer main body 1 can be reduced, and the range of the draft fan 8 for drawing the airflow can be enlarged by providing the sink 7, and the flow direction of the airflow can be guided. The fixed connection multiunit location knot 9 of the equidistant position that is close to the confluence groove 7 in extension 3 surface, location knot 9 are C shape structure, and extension 3 all is continuous U-shaped structure through two sets of cooling tube 6 of location knot 9 fixed connection, and the transfer line is connected through a set of three-way pipe 5 respectively at the both ends of two sets of cooling tube 6 simultaneously. As shown in fig. 1 and fig. 4, the positioning buckle 9 is arranged, so that the cooling pipe 6 can be conveniently and fixedly connected to the surface of the extension portion 3, and the cooling pipe 6 can be arranged to effectively perform corresponding cooling treatment on the air flow flowing into the casing 2 and also perform corresponding heat absorption and cooling on the ambient temperature around the extension portion 3, thereby ensuring the overall heat dissipation effect of the computer main body 1.

The integrated computer heat radiation structure can effectively enhance the whole heat radiation effect of the computer by matching the cooling pipe 6, the fan 8, the heat conducting plate 11, the heat radiation plate 10, the main heat radiation opening 4 and the auxiliary heat radiation opening 12, thereby effectively reducing the probability of accumulating a large amount of heat in the shell 2, ensuring the smooth operation of the computer, and reducing the influence probability of the environment where the computer main body 1 is positioned on heat radiation by matching a plurality of cooling modes with a plurality of discharge directions of air flow.

Claims

1. An integrated computer heat dissipation structure comprising: computer main part (1) and extension (3), fixed connection support frame of computer main part (1) lower surface, its characterized in that: the computer main body (1) comprises casing (2) and extension (3), casing (2) fixed surface connects extension (3), and casing (2) internal fixation connects heat-conducting plate (11), and main thermovent (4) are offered to the position correspondence of casing (2) relative heat-conducting plate (11), vice thermovent (12) are offered to casing (2) bilateral symmetry simultaneously to casing (2) internal surface passes through recess fixed connection heating panel (10), sink (7) are offered to extension (3) internal symmetry, sink (7) bottom passes through mounting groove intercommunication casing (2) inside, and mounting groove internal fixation connects fan (8), and extension (3) fixed surface connects location knot (9), and cooling tube (6) are through location knot (9) fixed connection at the surface of extension (3).

2. The integrated computer heat dissipation structure according to claim 1, wherein the interior of the casing (2) is divided into an element area and a heat dissipation area by a heat conducting plate (11), the heat conducting plate (11) is of a square structure as a whole, a plurality of groups of heat dissipation grooves are formed in parallel and equidistant on one side of the heat conducting plate (11) opposite to the heat dissipation area, and meanwhile, the cross sections of the heat dissipation grooves are of an isosceles trapezoid structure.

3. The integrated computer heat radiation structure according to claim 1, wherein a plurality of groups of auxiliary heat radiation openings (12) are respectively arranged at equal intervals in parallel at positions opposite to the heat radiation areas on two sides of the casing (2), the plurality of groups of auxiliary heat radiation openings (12) are all in a cylindrical structure, and the number and positions of the heat radiation openings are in one-to-one correspondence with the number and positions of the heat radiation grooves formed in the heat conduction plate (11).

4. The integrated computer heat dissipation structure according to claim 1, wherein a plurality of groups of main heat dissipation openings (4) are respectively formed on two sides of the surface of the casing (2) at equal intervals in parallel, the main heat dissipation openings (4) are of rectangular structures as a whole, the cross section of each main heat dissipation opening (4) is of a parallelogram structure, and one end of each main heat dissipation opening (4) far away from the discrete hot area is inclined obliquely upwards.

5. The integrated computer heat radiation structure according to claim 1, wherein a plurality of groups of grooves are respectively formed on two sides of the surface of the casing (2) at equal intervals in parallel, the cross sections of the grooves are of a T-shaped structure, the grooves and the main heat radiation ports (4) are alternately distributed, and meanwhile, the cross sections of the heat radiation plates (10) fixedly connected in the grooves are of a Chinese character 'ji' -shaped structure.

6. The integrated computer heat dissipation structure according to claim 1, wherein the horizontal section of the extension part (3) is in an isosceles trapezoid structure, two groups of converging grooves (7) symmetrically formed on the surface of the extension part (3) are in a prismatic table structure, two groups of weight-reducing grooves are symmetrically formed on two sides in the extension part (3), and the horizontal section of the weight-reducing grooves is in a right trapezoid structure.

7. The integrated computer heat dissipation structure according to claim 1, wherein the surface of the extension part (3) is fixedly connected with a plurality of groups of positioning buckles (9) at equal intervals at positions close to the sink (7), the positioning buckles (9) are of a C-shaped structure, two groups of cooling pipes (6) fixedly connected with the extension part (3) through the positioning buckles (9) are of continuous U-shaped structures, and two ends of the two groups of cooling pipes (6) are respectively connected with a transfusion pipe through a group of three-way pipes (5).