CN219625929U

CN219625929U - Computer heat dissipation machine case

Info

Publication number: CN219625929U
Application number: CN202223506788.2U
Authority: CN
Inventors: 姜华
Original assignee: Yantai Vocational College
Current assignee: Yantai Vocational College
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-09-01
Anticipated expiration: 2032-12-28

Abstract

The utility model discloses a computer heat dissipation machine case, which comprises a machine case, wherein an air inlet cover is arranged at the top of the machine case, an air outlet cover is arranged at the bottom of the machine case, a pipeline is connected between the air inlet cover and the air outlet cover, and a circulating fan is arranged on the pipeline; a plurality of air holes are formed in the air inlet cover and the air outlet cover, a drying box is arranged at one end, close to a pipeline, in the air outlet cover, drying agents are placed in the drying box, heat dissipation fins are arranged in the air outlet cover in a linear arrangement mode, and a semiconductor refrigerator is arranged at the other end of the air outlet cover; the utility model can form circulating cold air in the case, which is beneficial to heat dissipation of the case.

Description

Computer heat dissipation machine case

Technical Field

The utility model relates to the technical field of computers, in particular to a computer heat dissipation case.

Background

The chassis of the computer is internally provided with a large number of components, the continuous high-speed operation of the components can cause a large amount of heat to be accumulated in the chassis of the computer, so that the computer can not work continuously due to heat generation, and even each component and connecting wires of the computer host can be burnt, and the progress of work and study is influenced; the existing heat dissipation machine case mostly adopts a heat dissipation fan or a cold air blowing mode, but when the air humidity is large, the cold air blowing can cause moisture in the air to form small liquid drops, so that damage is caused to components.

Disclosure of Invention

Aiming at the defects in the prior art, the utility model provides a computer heat dissipation case.

The utility model is realized by the following technical scheme:

the computer heat dissipation machine case comprises a machine case, wherein an air inlet cover is arranged at the top of the machine case, an air outlet cover is arranged at the bottom of the machine case, a pipeline is connected between the air inlet cover and the air outlet cover, and a circulating fan is arranged on the pipeline; the air inlet cover and the air outlet cover are provided with a plurality of air holes, one end, close to a pipeline, in the air outlet cover is provided with a drying box, drying agents are placed in the drying box, heat dissipation fins are arranged in the air outlet cover in a linear arrangement mode, and the other end of the air outlet cover is provided with a semiconductor refrigerator.

Preferably, a partition plate is arranged at the bottom of the case, the air outlet cover is fixedly arranged on the partition plate, and the semiconductor refrigerator is positioned below the partition plate.

Preferably, no air hole is arranged at the drying box of the air outlet cover.

Preferably, a radiating opening is arranged on the case at the semiconductor refrigerator, and a dust screen is arranged in the radiating opening.

The beneficial effects of the utility model are as follows: the utility model can form circulating cold air in the case to radiate the components in the case, and the drying box is also arranged in the air outlet cover to dry the air, so that the damage to the components in the case caused by small liquid drops formed when the air is cooled is prevented.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.

Fig. 1 is an isometric view of the present utility model.

Fig. 2 is an isometric view of the present utility model.

Fig. 3 is a front view of the present utility model.

Fig. 4 is a cross-sectional view in the direction a of fig. 3.

Fig. 5 is a B-direction cross-sectional view of fig. 3.

In the drawing, 1, a case, 2, an air inlet cover, 3, an air outlet cover, 4, a pipeline, 5, a circulating fan, 6, an air hole, 7, a partition plate, 8, a drying box, 9, a heat dissipation fin, 10, a semiconductor refrigerator, 11 and a dust screen.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Spatially relative terms, such as "upper," "lower," "left," "right," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature's illustrated in the figures. It will be understood that the spatial terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "under" other elements or features would then be oriented "over" the other elements or features. Thus, the exemplary term "lower" may encompass both an upper and lower orientation.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The utility model is described in detail below with reference to the accompanying drawings, and the computer heat dissipation case of the utility model comprises a case 1, and is characterized in that: an air inlet cover 2 is arranged at the top of the case 1, an air outlet cover 3 is arranged at the bottom of the case 1, a pipeline 4 is connected between the air inlet cover 2 and the air outlet cover 3, a circulating fan 5 is arranged on the pipeline 4, air in the case 1 can be circulated by driving of the circulating fan 5, and the air inlet cover 2 enters and is blown out by the air outlet cover 3; the air inlet cover 2 and the air outlet cover 3 are provided with a plurality of air holes 6, one end, close to a pipeline, in the air outlet cover 3 is provided with a drying box 8, drying agents are placed in the drying box 8, air blown into the air outlet cover 3 in the pipeline can be firstly dried through the drying box, condensation water is prevented from being generated by cooling through control of high humidity, heat dissipation fins 9 are arranged in the air outlet cover 3 in a linear manner, the other end of the air outlet cover 3 is provided with a semiconductor refrigerator 10, the semiconductor refrigerator 10 is matched with the heat dissipation fins to cool the air in the air outlet cover 3, and then the air is blown into a case.

The bottom of machine case 1 is provided with baffle 7, and air-out cover 3 fixed mounting is on baffle 7, and semiconductor refrigerator 10 is located the below of baffle 7, prevents that the heat that semiconductor refrigerator produced from entering into machine case 1, influences the radiating effect.

The drying box 8 of the air outlet cover 3 is not provided with an air hole 6, so that the controller is prevented from being blown into the case 1 without cooling after drying.

A heat radiation opening is arranged on the case 1 at the semiconductor refrigerator 10, a dust screen 11 is arranged in the heat radiation opening, and heat generated by the semiconductor refrigerator 10 can be radiated through the heat radiation opening.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model, and are intended to be included within the scope of the appended claims and description.

Claims

1. The utility model provides a computer heat dissipation machine case, includes quick-witted case (1), its characterized in that: an air inlet cover (2) is arranged at the top of the case (1), an air outlet cover (3) is arranged at the bottom of the case (1), a pipeline (4) is connected between the air inlet cover (2) and the air outlet cover (3), and a circulating fan (5) is arranged on the pipeline (4); the novel air conditioner is characterized in that a plurality of air holes (6) are formed in the air inlet cover (2) and the air outlet cover (3), a drying box (8) is arranged at one end, close to a pipeline, in the air outlet cover (3), drying agents are placed in the drying box (8), heat dissipation fins (9) are arranged in the air outlet cover (3) in a linear arrangement mode, and a semiconductor refrigerator (10) is arranged at the other end of the air outlet cover (3).

2. The computer heat sink chassis of claim 1, wherein: the bottom of the case (1) is provided with a partition plate (7), the air outlet cover (3) is fixedly arranged on the partition plate (7), and the semiconductor refrigerator (10) is positioned below the partition plate (7).

3. The computer heat sink chassis of claim 1, wherein: and no air hole (6) is arranged at the drying box (8) of the air outlet cover (3).

4. The computer heat sink chassis of claim 1, wherein: a radiating opening is formed in a case (1) at the position of the semiconductor refrigerator (10), and a dustproof net (11) is arranged in the radiating opening.