CN114721485A - Server wind scooper and server - Google Patents
Server wind scooper and server Download PDFInfo
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- CN114721485A CN114721485A CN202210467893.5A CN202210467893A CN114721485A CN 114721485 A CN114721485 A CN 114721485A CN 202210467893 A CN202210467893 A CN 202210467893A CN 114721485 A CN114721485 A CN 114721485A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 230000008859 change Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 5
- 238000009499 grossing Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 210000000697 sensory organ Anatomy 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a server wind scooper and a server, and belongs to the technical field of heat dissipation. The server comprises a CPU, a memory and fans which are arranged in a front-back manner, wherein the number of the fans is equal to the total number of the CPU and the memory, and the server wind scooper comprises: the air conditioner comprises a CPU (Central processing Unit) air guide cover (1) and a memory air guide cover (2) which are arranged side by side, wherein a CPU air guide channel (11) is formed in the CPU air guide cover (1), and the CPU air guide channel (11) is used for guiding cold air of a corresponding fan to the CPU to cool the CPU; the internal storage air guide cover (2) is provided with an internal storage air guide channel (23), and the internal storage air guide channel (23) is used for guiding cold air of a corresponding fan to the internal storage to cool the internal storage. The server wind scooper can independently dissipate heat of the CPU and the memory, optimize heat dissipation of the memory part and realize fixed-point directional heat dissipation.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a server wind scooper and a server.
Background
With the development of new infrastructure such as cloud computing, big data and the like, the requirement on data computing speed is higher and higher, the computing speed and the computation amount of a processor are also higher and higher, so that the power consumption of CPU components is increased and soared, the temperature spec is also reduced, especially, the power consumption of the CPU is increased by 80% each year, the heat dissipation of electronic devices becomes a very troublesome problem at present, the requirement on the power consumption of a system cooling fan in the current society is higher and higher, the requirement on PUE of a machine room is reduced continuously, and energy conservation is a mainstream trend at present. How to effectively solve the problem of overhigh temperature of each electronic component should not simply increase air volume at least, and the air volume of the system is basically limited by the limitation of the current fan technology. What can be done is to reasonably utilize the existing air quantity at present to achieve the maximization of the utilization rate, and more fully utilize the limited air quantity to meet the Spec of each device, which is a technical problem to be solved urgently. The most effective way to achieve this is to reasonably plan the air flow, and reduce the temperature of the device and the power consumption of the fan as much as possible.
Disclosure of Invention
This application summarizes aspects of the embodiments and should not be used to limit the claims. Other embodiments are contemplated in accordance with the techniques described herein, as will be apparent to those skilled in the art upon studying the following drawings and detailed description, and are intended to be included within the scope of the application.
The invention aims to provide a server wind scooper. The server wind scooper can independently dissipate heat of the CPU and the memory, optimize heat dissipation of the memory part and realize fixed-point directional heat dissipation.
The invention also aims to provide a server.
According to an aspect of the present invention, there is provided a server wind scooper, the server includes a CPU, a memory and fans arranged in front and behind, and the number of the fans is equal to the total number of the CPU and the memory, the server wind scooper includes: the CPU air guide cover and the memory air guide cover are arranged side by side, wherein a CPU air guide channel is formed on the CPU air guide cover and is used for guiding cold air of a corresponding fan to the CPU to cool the CPU; the internal air guide cover is provided with an internal air guide channel, and the internal air guide channel is used for guiding cold air of a corresponding fan to the internal storage to cool the internal storage.
According to an embodiment of the present invention, the internal air guiding cover includes a smooth section and a flow rate adjusting section, one side of the smooth section has an air inlet, the other side of the smooth section is connected to the flow rate adjusting section, an air outlet is formed at a free end of the flow rate adjusting section, and the flow rate adjusting section can rotate along a connection position with the smooth section to change an air outlet amount of the air outlet.
According to an embodiment of the invention, the flow velocity adjusting section is a flat plate and is arranged at an angle to the top wall of the smooth section.
According to an embodiment of the present invention, an included angle between the flow velocity adjusting section and the top wall of the smoothing section can be adjusted according to a rotation speed of the fan, so as to change the size of the opening of the air outlet and balance the amount of cold air flowing between the memory and the memory rear-side component.
According to an embodiment of the present invention, when the fan corresponding to the internal storage air guiding cover is fully operated, the flow rate of the cold air is large, so that the opening angle is increased, the internal storage is fully cooled, and the cold air flows through the internal storage to cool the components at the rear side of the internal storage; when the fan corresponding to the internal storage wind scooper runs insufficiently, the flow of cold wind is small, so that the opening angle is reduced, and the cold wind blows towards the internal storage to increase the heat dissipation capacity of the internal storage.
According to an embodiment of the present invention, the flow velocity adjusting section is located at a rear end of the internal storage to reduce noise by being away from the fan corresponding to the internal storage wind scooper.
According to an embodiment of the invention, the angle between the flow velocity adjusting section and the top wall of the smooth section varies from 20 ° to 90 °.
According to an embodiment of the invention, the angle between the flow velocity adjusting section and the top wall of the smooth section varies from 30 ° to 75 °.
According to an embodiment of the present invention, the flow velocity adjusting section is an S-shaped plate, and the cold air is blown to the S-shaped plate through the internal air guiding channel to form scattering, so as to improve a heat dissipation effect.
According to another aspect of the present invention, a server is provided. The server comprises the fixed point directional server wind scooper.
One embodiment of the present invention has the following advantages or benefits:
the invention provides a server wind scooper. The server wind scooper concentrates wind flow to perform fixed-point efficient heat dissipation, improves the utilization rate of the wind flow, comprehensively considers, plans and optimizes other parts synchronously, particularly the parts of the tail end of the system which are greatly influenced by the temperature of the air outlet of the CPU radiator, further reduces the influence of the CPU on other parts, improves the temperature uniformity of the wind flow at the rear part of the case, and reduces the heat dissipation risk caused by local overheating. This wind-guiding scheme has effectively avoided local hot spot, has just also effectively avoided because avoid local overheated to the rearmounted various wind scoopers that carry out the heat flow direction and add, greatly reduced system cost, reduced the material number again, reduced the installation problem, promoted the installation effectiveness. This directional heat dissipation scheme of section has promoted the radiating efficiency greatly, promotes customer's sense organ quality. The server wind scooper independently dissipates heat for the CPU, dissipates heat for the memory part and is optimized, the angle of the wind scooper is automatically adjusted according to different system flows, the utilization rate of wind current is improved, the temperature of all devices, especially the CPU is greatly reduced, on the basis that an existing fan and a radiator are unchanged, the optimized wind scooper reduces the system cost, the mounting recognition problem is reduced, and the professional quality and the customer recognition are improved.
These and other aspects, objects, and features of the disclosure will be understood and appreciated by those skilled in the art upon studying the following specification, claims, and appended drawings.
Drawings
For a more complete understanding of embodiments of the present application, reference should be made to the embodiments illustrated in greater detail in the accompanying drawings and described below by way of example, wherein:
FIG. 1 is a schematic illustration of a server wind scooper according to an exemplary embodiment;
FIG. 2 is a schematic top view of a server wind scooper according to an exemplary embodiment.
Wherein the reference numerals are as follows:
1. a CPU wind scooper; 11. a CPU air guide channel; 2. the wind scooper is stored; 21. a smoothing section; 22. a flow velocity adjusting section; 23. and storing an air guide channel.
Detailed Description
Embodiments of the present disclosure are described below. However, it is to be understood that the disclosed embodiments are merely examples and that other embodiments may take various and alternative forms. The figures are not necessarily to scale; certain features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present application. As will be appreciated by one of skill in the art, various features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to produce embodiments that are not explicitly illustrated or described. The combination of features shown provides a representative embodiment for a typical application. However, various combinations and modifications of the features consistent with the teachings of the present disclosure may be desirable for certain specific applications or implementations.
Moreover, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
One or more embodiments of the present application will be described below with reference to the accompanying drawings. Flow diagrams illustrate processes performed by systems according to the present application, it being understood that the flow diagrams need not be performed in an order, one or more steps may be omitted, one or more steps may be added, and one or more steps may be performed in an order or reversed, or even simultaneously in some embodiments.
Referring to fig. 1-2, a server of the server wind scooper according to an embodiment of the present invention includes a CPU, a memory, and fans arranged in front and behind, where the number of the fans is equal to the total number of the CPU and the memory, and the server wind scooper includes: the CPU air guide cover comprises a CPU air guide cover 1 and an internal storage air guide cover 2 which are arranged side by side, wherein a CPU air guide channel 11 is formed on the CPU air guide cover 1, and the CPU air guide channel 11 is used for guiding cold air of a corresponding fan to a CPU to cool the CPU; the memory wind scooper 2 is formed with a memory wind channel 23, and the memory wind channel 23 is used for guiding cold air of a corresponding fan to the memory to cool the memory.
Wherein, the number of the system fans is set according to the number of the CPUs and the memory. In particular, the number of fans may be greater than the number of CPUs and memory. Each fan corresponds to one air guide channel, and the one-to-one cooling effect is better. In order to improve the utilization rate of the air flow, the air flows of the two fans are respectively guided to the corresponding CPU radiators, and the sufficient air flow of the CPU radiators is ensured. The ineffective flow away of the wind flow is reduced. The second part is a wind scooper of the internal storage part.
In a preferred embodiment of the present invention, the internal air guiding hood 2 includes a smooth section 21 and a flow velocity adjusting section 22, one side of the smooth section 21 has an air inlet, the other side is connected to the flow velocity adjusting section 22, a free end of the flow velocity adjusting section 22 forms an air outlet, and the flow velocity adjusting section 22 can rotate along a connection point with the smooth section 21 to change an air outlet amount of the air outlet.
As shown in fig. 1, the smooth section 21 is preferably a rectangular parallelepiped shaped channel. The front side of the channel is an air inlet which is opposite to the corresponding air outlet of the fan. A fan may also be provided in the channel. One end of the flow velocity adjusting section 22 is connected to the rear side of the smoothing section 21, and the other end of the flow velocity adjusting section 22, that is, the free end, is movable to form an air outlet and change the air output.
In a preferred embodiment of the present invention, the flow velocity adjusting section 22 is a flat plate and is disposed at an angle to the top wall of the smooth section 21. The angle between the flow velocity regulating section 22 and the top wall of the smoothing section 21 varies from 20 ° to 90 °. The angle between the flow velocity regulating section 22 and the top wall of the smoothing section 21 varies from 30 to 75.
As shown in fig. 1, the flow velocity adjusting section 22 is rotatably connected to the top wall of the smooth section 21 and forms an angle with the top wall of the smooth section 21. Two cases may be made, the first case is that when the flow rate is large, the flow rate adjusting section 22 blows more toward the top wall of the smooth section 21, and the air volume flowing through is large, whereas when the flow rate is small, the air volume flowing through is naturally small. In the second case, the flow rate adjusting section 22 is turned over to the top wall of the smooth section 21 by an external force, and the air volume flowing through the flow rate adjusting section 22 is increased, whereas the air volume flowing through the flow rate adjusting section is decreased when the external force turns over the flow rate adjusting section 22 to be close to the bottom wall of the smooth section 21.
In a preferred embodiment of the present invention, an included angle between the flow velocity adjusting section 22 and the top wall of the smoothing section 21 can be adjusted according to the rotation speed of the fan, so as to change the size of the opening of the air outlet and balance the cold air volume of the memory and the memory rear-side component. When the fan corresponding to the internal storage wind scooper 2 runs fully, the flow of cold wind is large, so that the opening angle is increased, the internal storage radiates heat fully, and the cold wind flows through the internal storage to cool the components at the rear side of the internal storage; when the fan corresponding to the internal storage wind scooper 2 runs insufficiently, the flow of the cold wind is small, so that the opening angle is reduced, and the cold wind blows towards the internal storage to increase the heat dissipation capacity of the internal storage.
As shown in fig. 1 and fig. 2, when the rotation speed of the fan is changed, the flow rate of the air blown into the air guiding channel is changed, so as to change the included angle between the flow rate adjusting section 22 and the top wall of the smooth section 21, and thus change the size of the opening of the air outlet. In order to improve the utilization rate of wind flow at different rotating speeds, the tail end wind scooper is designed into a hinge mode, namely a mode capable of being adjusted up and down. The angle can be adjusted automatically according to different wind currents, and then the heat dissipation of the memory and the rear device is optimized. When the system fan is in a high-rotating-speed state, the system flow and pressure are sufficient, the risk of heat dissipation of the memory does not exist, the opening of the part of the wind scooper is large, more wind flow can enter the rear end, particularly GPU configuration is realized, more low-temperature wind flow can enter the rear GPU, when the rotating speed of the system is low, the wind power is small, the tail wing wind scooper cannot be blown up, the wind flow is pressed downwards, more wind flow flows through the memory part, the wind flow of the memory part is increased, the memory temperature is reduced, and the wind flow utilization rate is improved.
In a preferred embodiment of the present invention, the flow rate adjusting section 22 is located at the rear end of the internal storage to reduce noise by being away from the corresponding fan of the internal storage wind scooper 2.
As shown in fig. 1, the flow rate adjusting section 22 is disposed at the rear end of the internal storage, so that the air outlet is located far away from the fan, and the noise of the fan is significantly reduced.
In a preferred embodiment of the present invention, the flow velocity adjusting section 22 is an S-shaped plate, and the cold air is blown to the S-shaped plate through the internal air guiding channel 23 to form scattering, so as to improve the heat dissipation effect.
As shown in fig. 1, the flow-rate regulation section 22 has an S-shape from the junction with the smooth section 21 to the free end. The S-shaped plate can well scatter wind flow blowing to the S-shaped plate, so that a turbulent flow effect is formed, and heat dissipation is performed on the memory and parts on the rear side in a surrounding mode.
The server of the embodiment of the invention comprises the fixed-point oriented server wind scooper.
The server wind scooper concentrates the wind flow to perform fixed-point efficient heat dissipation, improves the utilization rate of the wind flow, comprehensively considers, plans and optimizes other parts synchronously, particularly the parts of the tail end of the system which are greatly influenced by the temperature of the air outlet of the CPU radiator, further reduces the influence of the CPU on other parts, improves the temperature uniformity of the wind flow at the rear part of the case, and reduces the heat dissipation risk caused by local overheating. According to the air guide scheme, local hot spots are effectively avoided, various air guide covers added for rear heat flow guide are avoided due to the fact that local overheating is avoided, system cost is greatly reduced, material numbers are reduced, installation problems are reduced, and installation efficiency is improved. This directional heat dissipation scheme of section has promoted the radiating efficiency greatly, promotes customer's sense organ quality. The server wind scooper carries out directional wind-guiding heat dissipation on the CPU and the memory, so that the temperature of the CPU and the memory is reduced, the temperature of a rear device is obviously reduced, the wind scooper is saved, the heat dissipation cost is saved, the assembly complexity is reduced, the labor and the error rate are saved, the angle of the wind scooper is automatically adjusted according to different wind currents by the hinge tail wing scheme of the memory part, different boundary conditions are adapted, the wind current utilization rate is improved, and the heat dissipation risk of the memory is reduced.
In embodiments of the present invention, the term "plurality" means two or more unless explicitly defined otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly and include, for example, "connected" that may be fixedly connected, detachably connected, or integrally connected. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.
In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or units must have a specific direction, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the embodiments of the present invention.
In the description herein, the appearances of the phrase "one embodiment," "a preferred embodiment," or the like, are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
This document is intended to explain how to fashion the disclosed technology and various embodiments in a manner that is not intended to limit the true, intended, and fair scope and spirit thereof. Moreover, the foregoing description is not intended to be exhaustive or to limit the scope to the precise form disclosed. Modifications and variations are possible in light of the above teachings. The embodiments were chosen and described to provide the best illustration of the principles of the described technology and its practical application, and to enable one of ordinary skill in the art to utilize the disclosed technology in various modifications as are suited to the particular use contemplated. Accordingly, variations and modifications of the above-described embodiments may be made without departing substantially from the spirit and principles of the technology described herein, which are intended to be included within the scope of the disclosure.
Claims (10)
1. A server wind scooper, the server includes CPU, memory and fan that the tandem is arranged, its characterized in that, the quantity of fan equals the total quantity of CPU and memory, the server wind scooper includes: a CPU wind scooper (1) and an internal memory wind scooper (2) which are arranged side by side, wherein,
the CPU air guide cover (1) is provided with a CPU air guide channel (11), and the CPU air guide channel (11) is used for guiding cold air of a corresponding fan to the CPU to cool the CPU;
the internal storage air guide cover (2) is provided with an internal storage air guide channel (23), and the internal storage air guide channel (23) is used for guiding cold air of a corresponding fan to the internal storage to cool the internal storage.
2. The server wind scooper according to claim 1, wherein the internal storage wind scooper (2) comprises a smooth section (21) and a flow rate adjusting section (22), one side of the smooth section (21) is provided with a wind inlet, the other side of the smooth section is connected with the flow rate adjusting section (22), a free end of the flow rate adjusting section (22) is provided with a wind outlet, and the flow rate adjusting section (22) can rotate along a connection part with the smooth section (21) to change the wind outlet amount of the wind outlet.
3. The server wind scooper according to claim 2, wherein the flow velocity adjusting section (22) is a flat plate and is disposed at an angle to a top wall of the smooth section (21).
4. The server wind scooper according to claim 3, wherein an included angle between the flow velocity adjusting section (22) and the top wall of the smooth section (21) can be adjusted according to the rotating speed of the fan, so that the size of the opening of the wind outlet is changed, and the cold wind volume of the internal memory and the internal memory rear-side component is balanced.
5. The server wind scooper according to claim 4, wherein when the fan corresponding to the memory wind scooper (2) is fully operated, the flow rate of cold wind is large, so that the opening angle is increased, the heat dissipation of the memory is sufficient, and the cold wind flows through the memory to cool the components at the rear side of the memory; when the fan corresponding to the memory wind scooper (2) runs insufficiently, the flow of cold wind is small, so that the opening angle is reduced, and the cold wind blows towards the memory to increase the heat dissipation capacity of the memory.
6. The server wind scooper according to claim 2, wherein the flow rate adjusting section (22) is located at a rear end of the internal storage to reduce noise by being away from a corresponding fan of the internal storage wind scooper (2).
7. The server wind scooper according to claim 3, wherein the angle between the flow velocity adjusting section (22) and the top wall of the smooth section (21) varies within a range of 20 ° to 90 °.
8. The server wind scooper according to claim 7, wherein the angle between the flow velocity adjusting section (22) and the top wall of the smooth section (21) varies within a range of 30 ° to 75 °.
9. The server wind scooper according to claim 2, wherein the flow velocity adjusting section (22) is an S-shaped plate, and cold wind blows to the S-shaped plate through the internal wind guiding channel (23) to form scattering, so that the heat dissipation effect is improved.
10. A server, comprising: the server wind scooper of any one of claims 1 to 9.
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CN202210467893.5A CN114721485A (en) | 2022-04-29 | 2022-04-29 | Server wind scooper and server |
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CN202210467893.5A CN114721485A (en) | 2022-04-29 | 2022-04-29 | Server wind scooper and server |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2023206779A1 (en) * | 2022-04-28 | 2023-11-02 | 苏州元脑智能科技有限公司 | Server and universal efficient air guide cover thereof |
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CN104460880A (en) * | 2014-11-12 | 2015-03-25 | 杭州华为数字技术有限公司 | Cabinet server and control method thereof |
US20190274236A1 (en) * | 2016-11-28 | 2019-09-05 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Power conversion device |
CN112328017A (en) * | 2020-10-16 | 2021-02-05 | 苏州浪潮智能科技有限公司 | Wind scooper and server |
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2022
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WO2002074032A1 (en) * | 2001-03-02 | 2002-09-19 | Sanyo Electric Co., Ltd. | Electronic device |
CN101059713A (en) * | 2006-04-20 | 2007-10-24 | 华信精密股份有限公司 | Heat-irradiation device capable of adjusting direction |
CN104460880A (en) * | 2014-11-12 | 2015-03-25 | 杭州华为数字技术有限公司 | Cabinet server and control method thereof |
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