WO2023199658A1 - Multilayer substrate - Google Patents

Multilayer substrate Download PDF

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Publication number
WO2023199658A1
WO2023199658A1 PCT/JP2023/008998 JP2023008998W WO2023199658A1 WO 2023199658 A1 WO2023199658 A1 WO 2023199658A1 JP 2023008998 W JP2023008998 W JP 2023008998W WO 2023199658 A1 WO2023199658 A1 WO 2023199658A1
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WO
WIPO (PCT)
Prior art keywords
axis
columnar
conductor layer
distance
columnar conductors
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PCT/JP2023/008998
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French (fr)
Japanese (ja)
Inventor
恒亮 西尾
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株式会社村田製作所
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Publication of WO2023199658A1 publication Critical patent/WO2023199658A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Definitions

  • the present invention relates to a multilayer substrate including a signal conductor layer.
  • a transmission line described in Patent Document 1 As an invention related to a conventional multilayer board, for example, a transmission line described in Patent Document 1 is known.
  • This transmission line includes a signal line, two ground conductors, and a plurality of GND vias.
  • the signal line extends in the front-rear direction.
  • the signal line is located between two ground conductors in the vertical direction.
  • a plurality of GND vias electrically connects two ground conductors. Some of the GND vias among the plurality of GND vias are lined up in the front-rear direction on the left of the signal line. Further, the remaining GND vias among the plurality of GND vias are arranged in the front-rear direction on the right side of the signal line.
  • an object of the present invention is to provide a multilayer board that can improve shielding performance.
  • a multilayer substrate includes: A laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction; a first signal conductor layer provided on the laminate and having a linear shape when viewed in the Z-axis direction; a first ground conductor layer located in the negative direction of the Z-axis from the first signal conductor layer and overlapping with the first signal conductor layer when viewed in the Z-axis direction; Penetrating in the Z-axis direction the insulator layer located in the negative direction of the Z-axis from the first signal conductor layer, and located in the positive direction of the Z-axis from the first ground conductor layer.
  • a plurality of first columnar conductors, a plurality of second columnar conductors, a plurality of third columnar conductors, and a plurality of fourth columnar conductors It is equipped with
  • the direction in which the first signal conductor layer extends is defined as the X-axis direction
  • a direction perpendicular to the X-axis direction and the Z-axis direction is defined as the Y-axis direction
  • the plurality of first columnar conductors, the plurality of second columnar conductors, the plurality of third columnar conductors, and the plurality of fourth columnar conductors are electrically connected to the first ground conductor layer,
  • the centers of the plurality of first columnar conductors are located in the positive direction of the Y-axis from the first signal conductor layer, and are arranged at a predetermined pitch in a first row extending in the X-axis direction.
  • the centers of the plurality of second columnar conductors are located in the positive direction of the Y-axis relative to the first signal conductor layer, and are located in the predetermined second row extending in the X-axis direction. lined up on the pitch, When viewed in the Z-axis direction, the centers of the plurality of third columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are arranged in the predetermined third row extending in the X-axis direction.
  • the centers of the plurality of fourth columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are located in the fourth row extending in the X-axis direction.
  • the second column is located in the negative direction of the Y axis from the first column
  • the fourth column is located in the negative direction of the Y axis from the third column,
  • a plurality of first X-axis positions indicating the positions of the centers of the plurality of first columnar conductors on the X-axis
  • a plurality of first X-axis positions indicating the positions of the centers of the plurality of second columnar conductors on the X-axis.
  • the second X-axis positions are arranged alternately in the X-axis direction, A plurality of third X-axis positions indicating the positions of the centers of the plurality of third columnar conductors on the X-axis and a third X-axis position indicating the positions of the centers of the plurality of fourth columnar conductors on the X-axis when viewed in the Z-axis direction.
  • the 4X-axis positions are arranged alternately in the X-axis direction,
  • the distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is the distance from the third X-axis position to the first X-axis position among the plurality of second X-axis positions.
  • the distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is the distance from the fourth X-axis position to the second X-axis position among the plurality of first X-axis positions. It is shorter than the distance to the first X-axis position closest to the fourth X-axis position.
  • the multilayer substrate according to the present invention it is possible to improve shielding performance.
  • FIG. 1 is an exploded perspective view of the multilayer substrate 10.
  • FIG. 2 is a top view of the insulator layer 16c of the multilayer substrate 10.
  • FIG. 3 is a cross-sectional view of the multilayer substrate 10.
  • FIG. 4 is a front view of the multilayer substrate 10 in use.
  • FIG. 5 is a top view of the insulator layer 16c of the multilayer substrate 10a.
  • FIG. 6 is a top view of the insulator layer 16c of the multilayer substrate 10b.
  • FIG. 7 is a top view of the insulator layer 16c of the multilayer substrate 10c.
  • FIG. 8 is a top view of the insulator layer 16c of the multilayer substrate 10d.
  • FIG. 9 is a top view of the insulator layer 16c of the multilayer substrate 10e.
  • FIG. 10 is a top view of the insulator layer 16c of the multilayer substrate 10f.
  • FIG. 11 is a top view of the insulator layer 16c of the multilayer substrate 10g.
  • FIG. 12 is an exploded view of the multilayer substrate 10h.
  • FIG. 13 is a cross-sectional view of the multilayer substrate 10h.
  • FIG. 14 is an exploded perspective view of the multilayer substrate 10i.
  • FIG. 1 is an exploded perspective view of the multilayer substrate 10.
  • FIG. 2 is a top view of the insulator layer 16c of the multilayer substrate 10.
  • FIG. 3 is a cross-sectional view of the multilayer substrate 10. In FIG. 3, a cross section perpendicular to the left-right direction is shown.
  • FIG. 4 is a front view of the multilayer substrate 10 in use. Note that in FIGS. 1 and 2, only representative columnar conductors v11 to v14 among the plurality of columnar conductors v11 to v14 are given reference numerals.
  • direction is defined as follows.
  • the stacking direction of the stacked body 12 of the multilayer substrate 10 is defined as the vertical direction.
  • the up-down direction coincides with the Z-axis direction.
  • the upward direction is the positive direction of the Z axis.
  • the downward direction is the negative direction of the Z axis.
  • the direction in which the signal conductor layer 20 of the multilayer substrate 10 extends is defined as the left-right direction.
  • the left-right direction coincides with the X-axis direction.
  • the left-right direction is perpendicular to the up-down direction.
  • a direction perpendicular to the up-down direction and the left-right direction is defined as the front-back direction.
  • the front-back direction coincides with the Y-axis direction.
  • the upper and lower directions in the vertical direction may be interchanged
  • the left and right directions in the horizontal direction may be interchanged
  • the front and rear directions in the longitudinal direction may be interchanged.
  • Multilayer substrate 10 transmits high frequency signals.
  • the multilayer substrate 10 is used to electrically connect two circuits in electronic devices such as smartphones.
  • the multilayer board 10 includes a laminate 12, protective layers 18a, 18b, a signal conductor layer 20, ground conductor layers 22, 24, 28, 30, 32, 34, signal terminals 26a, 26b, and columnar conductors. It includes v1, v2 and a plurality of columnar conductors v11 to v14.
  • the laminate 12 has a plate shape. Therefore, the laminate 12 has an upper main surface and a lower main surface.
  • the upper main surface and the lower main surface of the laminate 12 have a rectangular shape with long sides extending in the left-right direction. Therefore, the length of the laminate 12 in the left-right direction is longer than the length of the laminate 12 in the front-rear direction.
  • the laminate 12 has flexibility.
  • the laminate 12 has a structure in which insulator layers 16a to 16d are stacked in the vertical direction (Z-axis direction).
  • the insulator layers 16a to 16d are arranged in this order from top to bottom.
  • Each of the insulator layers 16a to 16d has an upper main surface and a lower main surface.
  • the material of the insulator layers 16a to 16d is thermoplastic resin.
  • the thermoplastic resin is, for example, a liquid crystal polymer.
  • a high frequency signal is transmitted to the signal conductor layer 20.
  • the signal conductor layer 20 (first signal conductor layer) is provided in the laminate 12.
  • the signal conductor layer 20 is located on the upper main surface of the insulator layer 16c.
  • the signal conductor layer 20 has a linear shape extending in the left-right direction when viewed in the up-down direction (Z-axis direction). In this embodiment, the signal conductor layer 20 has a linear shape.
  • the ground conductor layer 22 is provided on the laminate 12, as shown in FIG.
  • the ground conductor layer 22 (fifth ground conductor layer) is located above the signal conductor layer 20 (first signal conductor layer) (in the positive direction of the Z-axis), and when viewed in the vertical direction (Z-axis direction), It overlaps with the conductor layer 20 (first signal conductor layer).
  • the ground conductor layer 22 is located on the upper main surface of the insulator layer 16a. Furthermore, the ground conductor layer 22 covers substantially the entire upper main surface of the insulator layer 16a. A ground potential is connected to the ground conductor layer 22 .
  • the ground conductor layer 24 is provided on the laminate 12, as shown in FIG.
  • the ground conductor layer 24 (first ground conductor layer) is located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis), and when viewed in the vertical direction (Z-axis direction), It overlaps with the conductor layer 20 (first signal conductor layer).
  • the ground conductor layer 24 is located on the lower main surface of the insulator layer 16d. Further, the ground conductor layer 24 covers substantially the entire lower main surface of the insulator layer 16d.
  • a ground potential is connected to the ground conductor layer 24.
  • the signal conductor layer 20, ground conductor layer 22, and ground conductor layer 24 as described above have a strip line structure.
  • the ground conductor layers 28 and 30 are provided on the laminate 12, as shown in FIG.
  • the ground conductor layers 28 and 30 are located on the upper main surface of the insulator layer 16b.
  • the ground conductor layer 28 is located before the signal conductor layer 20.
  • the ground conductor layer 30 is located after the signal conductor layer 20.
  • the ground conductor layers 28 and 30 have a linear shape extending in the left-right direction.
  • the ground conductor layers 32 and 34 are provided on the laminate 12, as shown in FIG.
  • the ground conductor layers 32 and 34 are located on the upper main surface of the insulator layer 16c. Therefore, the vertical positions of the ground conductor layers 32 and 34 are the same as the vertical positions of the signal conductor layer 20.
  • the ground conductor layer 32 is located before the signal conductor layer 20.
  • the ground conductor layer 34 is located after the signal conductor layer 20.
  • the ground conductor layers 32 and 34 have a linear shape extending in the left-right direction.
  • the signal terminal 26a is provided at the left end of the laminate 12. More specifically, the signal terminal 26a is located on the upper main surface of the insulator layer 16a. The signal terminal 26a overlaps the left end portion of the signal conductor layer 20 when viewed in the vertical direction. The signal terminal 26a has a rectangular shape when viewed in the vertical direction. The signal terminal 26a is an external terminal to which a high frequency signal is input/output. The signal terminal 26a is not in contact with the ground conductor layer 22.
  • the columnar conductor v1 electrically connects the signal terminal 26a and the left end portion of the signal conductor layer 20. More specifically, the columnar conductor v1 vertically penetrates the insulator layers 16a and 16b. The upper end of the columnar conductor v1 is in contact with the signal terminal 26a. The lower end of the columnar conductor v1 is in contact with the left end of the signal conductor layer 20.
  • the structures of the signal terminal 26b and the columnar conductor v2 are bilaterally symmetrical to the structures of the signal terminal 26a and the columnar conductor v1, so a description thereof will be omitted.
  • the centers of the plurality of columnar conductors v11 When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v11 are located in front of the signal conductor layer 20 (in the positive direction of the Y-axis), as shown in FIG.
  • the centers of the plurality of columnar conductors v11 are arranged at a predetermined pitch P0 in a first row L1 extending in the left-right direction (X-axis direction).
  • the plurality of columnar conductors v11 have a structure in which four columnar conductors that vertically penetrate the insulator layers 16a to 16d are connected in the vertical direction. Thereby, the plurality of columnar conductors v11 electrically connect the ground conductor layer 22, the ground conductor layer 24, the ground conductor layer 28, and the ground conductor layer 32.
  • each of the plurality of columnar conductors v11 includes a columnar conductor v11c.
  • the plurality of columnar conductors v11c (first columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v11c (first columnar conductors) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis).
  • the centers of the plurality of columnar conductors v11c are located in front of the signal conductor layer 20 (first signal conductor layer) (in the positive direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a first row L1 extending in the left-right direction (X-axis direction).
  • the plurality of columnar conductors v11c are a part of the plurality of columnar conductors v11, so the ground conductor layer 22 (first ground conductor layer) and the ground conductor layer 24 (fifth ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v11c (first columnar conductors) are in contact with the ground conductor layer 32 (second ground conductor layer). Therefore, the plurality of columnar conductors v11c are electrically connected to the ground conductor layer 32.
  • the centers of the plurality of columnar conductors v12 are located in front of the signal conductor layer 20 (in the positive direction of the Y-axis), as shown in FIG.
  • the centers of the plurality of columnar conductors v12 are arranged at a predetermined pitch P0 in a second row L2 extending in the left-right direction (X-axis direction).
  • the second row L2 is located after the first row L1 (in the negative direction of the Y-axis).
  • the plurality of columnar conductors v12 have a structure in which four columnar conductors vertically vertically penetrate through the insulating layers 16a to 16d. Thereby, the plurality of columnar conductors v12 electrically connect the ground conductor layer 22 and the ground conductor layer 24.
  • each of the plurality of columnar conductors v12 includes a columnar conductor v12c.
  • the plurality of columnar conductors v12c (second columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v12c (first columnar conductors) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis).
  • the centers of the plurality of columnar conductors v12c are located before the signal conductor layer 20 (first signal conductor layer) (in the positive direction of the Y-axis), Moreover, they are arranged at a predetermined pitch P0 in a second row L2 extending in the left-right direction (X-axis direction).
  • the plurality of columnar conductors v12c (second columnar conductors) are a part of the plurality of columnar conductors v12, so the ground conductor layer 22 (fifth ground conductor layer) and the ground conductor layer 24 (first ground conductor layer) ) is electrically connected to. Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v12c (second columnar conductors) are in contact with the ground conductor layer 32 (second ground conductor layer). Therefore, the plurality of columnar conductors v12c are electrically connected to the ground conductor layer 32.
  • a plurality of first X-axis positions indicate the positions of the centers of the plurality of columnar conductors v11c (first columnar conductors) in the left-right direction (X-axis) when viewed in the vertical direction (Z-axis direction).
  • p1 and a plurality of second X-axis positions p2 indicating the positions of the centers of the plurality of columnar conductors v12c (second columnar conductors) in the left-right direction (X-axis direction) are arranged alternately in the left-right direction (X-axis direction).
  • the plurality of first X-axis positions p1 and the plurality of second X-axis positions p2 are arranged alternately in the left-right direction (X-axis direction) at a pitch that is half the predetermined pitch P0.
  • the columnar conductor v12c (second columnar conductor) closest to the columnar conductor v11c (first columnar conductor) among the plurality of columnar conductors v12c (second columnar conductors) from the center of the columnar conductor v11c (first columnar conductor) The distance l1 to the center is longer than the distance d11 in the left-right direction (Y-axis direction) between the first row L1 and the second row L2.
  • the distance l1 is longer than the diameter r1 of the columnar conductor v11c (first columnar conductor) and the diameter r2 of the columnar conductor v12c (second columnar conductor). In this embodiment, the diameter r2 is equal to the diameter r1.
  • the centers of the plurality of columnar conductors v13 are located behind the signal conductor layer 20 (in the negative direction of the Y-axis), as shown in FIG.
  • the centers of the plurality of columnar conductors v13 are arranged at a predetermined pitch P0 in a third row L3 extending in the left-right direction (X-axis direction).
  • the plurality of columnar conductors v13 have a structure in which four columnar conductors that vertically penetrate the insulator layers 16a to 16d are connected in the vertical direction. Thereby, the plurality of columnar conductors v13 electrically connect the ground conductor layer 22, the ground conductor layer 24, the ground conductor layer 30, and the ground conductor layer 34.
  • each of the plurality of columnar conductors v13 includes a columnar conductor v13c.
  • the plurality of columnar conductors v13c (third columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v13c (third columnar conductors) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis).
  • the centers of the plurality of columnar conductors v13c are located after the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a third row L3 extending in the left-right direction (X-axis direction).
  • the plurality of columnar conductors v13c are a part of the plurality of columnar conductors v13, so the ground conductor layer 22 (first ground conductor layer) and the ground conductor layer 24 (fifth ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v13c (third columnar conductors) are in contact with the ground conductor layer 34. Therefore, the plurality of columnar conductors v13c are electrically connected to the ground conductor layer 34.
  • the centers of the plurality of columnar conductors v14 are located behind the signal conductor layer 20 (in the negative direction of the Y-axis), as shown in FIG.
  • the centers of the plurality of columnar conductors v14 are arranged at a predetermined pitch P0 in a fourth row L4 extending in the left-right direction (X-axis direction).
  • the fourth row L4 is located after the third row L3 (in the negative direction of the Y-axis).
  • the distance d2 in the left-right direction (Y-axis direction) between the second row L2 and the fourth row L4 is equal to the distance d1 in the left-right direction (Y-axis direction) between the first row L1 and the third row L3.
  • the distance L13 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the third row L3 is equal to the distance L13 between the signal conductor layer 20 (first signal conductor layer) and the second row L2. It is equal to the distance L12 in the left-right direction (Y-axis direction).
  • the distance L14 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the fourth row L4 is the distance L14 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the first row L1. It is equal to the distance L11 (in the Y-axis direction). As shown in FIG.
  • the plurality of columnar conductors v14 have a structure in which four columnar conductors vertically vertically penetrate through the insulator layers 16a to 16d. Thereby, the plurality of columnar conductors v14 electrically connect the ground conductor layer 22 and the ground conductor layer 24.
  • each of the plurality of columnar conductors v14 includes a columnar conductor v14c.
  • the plurality of columnar conductors v14c (fourth columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v14c (fourth columnar conductor) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis).
  • the centers of the plurality of columnar conductors v14c are located after the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a fourth row L4 extending in the left-right direction (X-axis direction).
  • the plurality of columnar conductors v14c (fourth columnar conductor) are a part of the plurality of columnar conductors v14, so the ground conductor layer 22 (fifth ground conductor layer) and the ground conductor layer 24 (first ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v14c (fourth columnar conductors) are in contact with the ground conductor layer 34. Therefore, the plurality of columnar conductors v14c are electrically connected to the ground conductor layer 34.
  • a plurality of third X-axis positions indicate the positions of the centers of the plurality of columnar conductors v13c (third columnar conductors) in the left-right direction (X-axis) when viewed in the vertical direction (Z-axis direction).
  • p3 and a plurality of fourth X-axis positions p4 indicating the positions of the centers of the plurality of columnar conductors v14c (fourth columnar conductors) in the left-right direction (X-axis) are arranged alternately in the X-axis direction.
  • the plurality of third X-axis positions p3 and the plurality of fourth X-axis positions p4 are alternately arranged in the X-axis direction at a pitch that is half the predetermined pitch P0.
  • the plurality of columnar conductors v13c overlap with the plurality of columnar conductors v11c (first columnar conductors) when viewed in the front-back direction (Y-axis direction). That is, the third X-axis position p3 matches the first X-axis position p1.
  • the columnar conductor v14c (fourth columnar conductor) overlaps with the columnar conductor v12c (second columnar conductor) when viewed in the front-rear direction (Y-axis direction). That is, the fourth X-axis position p4 coincides with the second X-axis position p2.
  • the distance l2 to the center is longer than the distance d12 in the left-right direction (Y-axis direction) between the third row L3 and the fourth row L4.
  • the distance l2 is longer than the diameter r3 of the columnar conductor v13c (third columnar conductor) and the diameter r4 of the columnar conductor v14c (fourth columnar conductor). In this embodiment, the diameter r4 is equal to the diameter r3.
  • ground conductor layers 22, 24, 28, 30, 32, 34 and signal terminals 26a, 26b as described above are formed by etching metal foil provided on the upper or lower main surface of the insulator layers 16a to 16d, for example. It is formed by applying The metal foil is, for example, copper foil.
  • the columnar conductors v1, v2, v11 to v14 are, for example, via hole conductors.
  • the via hole conductor is manufactured by forming through holes in the insulator layers 16a to 16d, filling the through holes with conductive paste, and sintering the conductive paste.
  • the material of the columnar conductors v1, v2, v11 to v14 is a mixture of resin and metal.
  • the protective layer 18a covers the upper main surface of the laminate 12. Thereby, the protective layer 18a protects the ground conductor layer 22.
  • the protective layer 18a is provided with openings h1 to h6.
  • the opening h1 overlaps the signal terminal 26a when viewed in the vertical direction. Thereby, the signal terminal 26a is exposed to the outside from the multilayer substrate 10.
  • the opening h2 is located in front of the opening h1.
  • a portion of the ground conductor layer 22 is exposed to the outside from the multilayer substrate 10 through the opening h2.
  • the opening h3 is located after the opening h1.
  • a portion of the ground conductor layer 22 is exposed to the outside from the multilayer substrate 10 via the opening h3.
  • a portion of the ground conductor layer 22 functions as a ground terminal.
  • the structure of the openings h4 to h6 is symmetrical to the structure of the openings h1 to h3, so a description thereof will be omitted.
  • the protective layer 18b covers the lower main surface of the laminate 12. Thereby, the protective layer 18b protects the ground conductor layer 24.
  • the protective layers 18a and 18b are, for example, resist layers.
  • the multilayer substrate 10 as described above has flexibility. Therefore, as shown in FIG. 4, the multilayer substrate 10 can be bent. Specifically, the multilayer substrate 10 has a first section A1, a second section A2, and a third section A3. The first section A1, the second section A2, and the third section A3 are arranged in this order from left to right when the multilayer substrate 10 is not bent. The second section A2 is bent downward with respect to the first section A1. On the other hand, the first section A1 and the third section A3 are not bent. However, the first section A1 and the third section A3 may be slightly bent. In this case, the radius of curvature of the first section A1 and the radius of curvature of the third section A3 are larger than the radius of curvature of the second section A2. Note that the multilayer substrate 10 may be bent due to elastic deformation, may be bent due to plastic deformation, or may be bent due to elastic deformation and plastic deformation.
  • the plurality of columnar conductors v11c and the plurality of columnar conductors v12c are arranged in a zigzag pattern. Specifically, when viewed in the vertical direction, the centers of the plurality of columnar conductors v11c are lined up in the first row L1 at a predetermined pitch P0. When viewed in the vertical direction, the centers of the plurality of columnar conductors v12c are lined up in the second row L2 at a predetermined pitch P0. The second row L2 is located after the first row L1.
  • a plurality of first X-axis positions p1 indicating the positions in the left-right direction of the centers of the plurality of columnar conductors v11c
  • a plurality of second X-axis positions indicating the positions in the left-right direction of the centers of the plurality of columnar conductors v12c.
  • p2 are arranged alternately in the left and right direction.
  • the columnar conductors v11c and the plurality of columnar conductors v12c in the left-right direction can be arranged without shortening the distance l1 from the center of the columnar conductor v11c to the center of the columnar conductor v12c. You can shorten the distance between As a result, it becomes difficult for noise to pass between the columnar conductor v11c and the columnar conductor v12c. Therefore, according to the multilayer substrate 10, it is possible to improve shielding performance.
  • the plurality of columnar conductors v13c and the plurality of columnar conductors v14c are arranged in a zigzag pattern, similar to the plurality of columnar conductors v11c and the plurality of columnar conductors v12c.
  • the multilayer substrate 10 it is possible to improve shielding performance. Furthermore, it is possible to suppress the occurrence of peeling in the insulating layers 16a to 16d, and the difficulty in manufacturing the multilayer substrate 10 is less likely to increase.
  • the columnar conductor v11c is located in front of the columnar conductor v12c.
  • the columnar conductor v13c is located in front of the columnar conductor v14c.
  • the columnar conductor v13c overlaps the columnar conductor v11c when viewed in the left-right direction.
  • the columnar conductor v14c overlaps with the columnar conductor v12c when viewed in the left-right direction.
  • the distance between the columnar conductor v11c and the columnar conductor v13c and the distance between the columnar conductor v12c and the columnar conductor v14c become close values.
  • the sum of the capacitance that occurs between the signal conductor layer 20 and the columnar conductor v11c, the capacitance that occurs between the signal conductor layer 20 and the columnar conductor v13c, and the capacitance that occurs between the signal conductor layer 20 and the columnar conductor v12c The sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v14c becomes close to the total value.
  • the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided is close to the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided. It will take a value. Therefore, in the multilayer substrate 10, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance (for example, 50 ⁇ ) is suppressed.
  • a predetermined characteristic impedance for example, 50 ⁇
  • the distance d2 in the left-right direction between the second row L2 and the fourth row L4 is equal to the distance d1 in the left-right direction between the first row L1 and the third row L3.
  • the sum of the capacitance and the capacitance generated between the signal conductor layer 20 and the columnar conductor v14c becomes closer to each other.
  • the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided and the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided are further increased.
  • the values will be close to each other. Therefore, in the multilayer substrate 10, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance is effectively suppressed.
  • the distance L13 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the third row L3 is the distance L13 between the signal conductor layer 20 (first signal conductor layer) and the second row L3. It is equal to the distance L12 in the left-right direction (Y-axis direction) from L2.
  • the distance L14 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the fourth row L4 is the distance L14 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the first row L1. It is equal to the distance L11 (in the Y-axis direction).
  • the sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v14c becomes equal.
  • the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided is equal to the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided.
  • the signal conductor layer 20 has a linear shape. As a result, the length of the signal conductor layer 20 is shortened, so that the DC resistance value of the signal conductor layer 20 is reduced.
  • FIG. 5 is a top view of the insulator layer 16c of the multilayer substrate 10a.
  • the multilayer substrate 10a differs from the multilayer substrate 10 in that the signal conductor layer 20 is meandering.
  • the meandering period is a predetermined pitch P0.
  • the sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v14c becomes equal.
  • the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided is equal to the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided. Become.
  • the multilayer substrate 10a deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance is suppressed. Note that the other structure of the multilayer substrate 10a is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • FIG. 6 is a top view of the insulator layer 16c of the multilayer substrate 10b.
  • the plurality of columnar conductors v13c do not overlap with the plurality of columnar conductors v11c when seen in the front-rear direction, and the columnar conductors v14c do not overlap with the columnar conductors v11c when seen in the left-right direction. It differs from the multilayer substrate 10 in that it does not overlap with v12c. That is, the third X-axis position p3 does not match the first X-axis position p1. The fourth X-axis position p4 does not match the second X-axis position p2.
  • the third X-axis position p3 must not deviate significantly from the first X-axis position p1 in the left-right direction. Therefore, the distance D1 from the third X-axis position p3 to the first X-axis position p1 closest to the third X-axis position p3 among the plurality of first X-axis positions p1 is the distance D1 from the third X-axis position p3 to the plurality of second X-axis positions p2. It is shorter than the distance D2 from the third X-axis position p3 to the second X-axis position p2 which is closest to the third X-axis position p3.
  • the distance D1 from the third X-axis position p3 to the first X-axis position p1 closest to the third X-axis position p3 among the plurality of first X-axis positions p1 is 1/4 or less of the predetermined pitch P0. .
  • the distance D1 from the third X-axis position p3 to the first X-axis position p1 closest to the third X-axis position p3 among the plurality of first X-axis positions p1 is the distance D1 from the columnar conductor v13c (third columnar conductor) to the plurality of columnar conductors It is less than half of the distance D11 in the X-axis direction to the columnar conductor v14c (fourth columnar conductor) closest to the columnar conductor v13c (third columnar conductor) among the conductors v14c (fourth columnar conductor).
  • the fourth X-axis position p4 must not deviate significantly from the second X-axis position p2 in the left-right direction. Therefore, the distance D3 from the fourth X-axis position p4 to the second X-axis position p2 closest to the fourth X-axis position p4 among the plurality of second X-axis positions p2 is the distance D3 from the fourth X-axis position p4 to the plurality of first X-axis positions p1. It is shorter than the distance D4 to the first X-axis position p1 which is closest to the fourth X-axis position p4.
  • the distance D3 from the fourth X-axis position p4 to the second X-axis position p2 closest to the fourth X-axis position p4 among the plurality of second X-axis positions p2 is 1/4 or less of the predetermined pitch P0. .
  • the distance D3 from the fourth X-axis position p4 to the second X-axis position p2 closest to the fourth X-axis position p4 among the plurality of second X-axis positions p2 is the distance D3 from the columnar conductor v13c (third columnar conductor) to the second It is less than half of the distance D11 in the left-right direction (X-axis direction) to the columnar conductor v14c (fourth columnar conductor) closest to the columnar conductor v13c (third columnar conductor) among the conductors v14c (fourth columnar conductor).
  • the amount of deviation of the third X-axis position p3 from the first X-axis position p1 is limited.
  • the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided is close to the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided. It will take a value. Therefore, in the multilayer substrate 10b, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance is suppressed.
  • the other structure of the multilayer substrate 10b is the same as that of the multilayer substrate 10.
  • FIG. 7 is a top view of the insulator layer 16c of the multilayer substrate 10c.
  • the multilayer board 10c has a diameter r1 of the columnar conductor v11c (first columnar conductor) larger than a diameter r2 of the columnar conductor v12c (second columnar conductor), and a diameter r4 of the columnar conductor v14c (fourth columnar conductor). , is different from the multilayer substrate 10 in that the diameter r3 of the columnar conductor v13c (third columnar conductor) is larger than that of the columnar conductor v13c (third columnar conductor). That is, among the columnar conductors v11c and v12c, the columnar conductor v11c located far from the signal conductor layer 20 has a larger diameter.
  • the columnar conductor v14c located far from the signal conductor layer 20 has a larger diameter. Thereby, shielding performance can be improved while suppressing an increase in capacitance generated between the signal conductor layer 20 and the columnar conductors v11c to v14c.
  • the other structure of the multilayer substrate 10c is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • FIG. 8 is a top view of the insulator layer 16c of the multilayer substrate 10d.
  • the multilayer board 10d has the following points: when viewed in the front-rear direction (Y-axis direction), a portion of the columnar conductor v12c (second columnar conductor) overlaps a portion of the columnar conductor v11c (first columnar conductor); This differs from the multilayer substrate 10 in that a portion of the columnar conductor v14c (fourth columnar conductor) overlaps a portion of the columnar conductor v13c (third columnar conductor) when viewed in the Y-axis direction. Thereby, in the multilayer substrate 10d, shielding performance can be improved. Note that the other structure of the multilayer substrate 10d is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • FIG. 9 is a top view of the insulator layer 16c of the multilayer substrate 10e.
  • the multilayer substrate 10e differs from the multilayer substrate 10 in the shapes of the ground conductor layers 32 and 34. More specifically, the distance D111 in the front-rear direction (Y-axis direction) between the ground conductor layer 32 (second ground conductor layer) and the signal conductor layer 20 (first signal conductor layer) at the first X-axis position p1 is It is longer than the distance D112 in the front-rear direction (Y-axis direction) between the ground conductor layer 32 (second ground conductor layer) and the signal conductor layer 20 (first signal conductor layer) at the axial position p2.
  • the distance D114 in the front-rear direction between the ground conductor layer 34 and the signal conductor layer 20 at the fourth X-axis position p4 is longer than the distance D113 in the front-rear direction between the ground conductor layer 34 and the signal conductor layer 20 at the third X-axis position p3. .
  • the capacitance generated between the signal conductor layer 20 and the ground conductor layers 32 and 34 can be reduced.
  • the other structure of the multilayer substrate 10e is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • the ground conductor layers 28 and 30 may also have the same shape as the ground conductor layers 32 and 34.
  • FIG. 10 is a top view of the insulator layer 16c of the multilayer substrate 10f.
  • the multilayer board 10f is a multilayer board in that it includes a plurality of ground conductor layers 32a, a plurality of ground conductor layers 32b, a plurality of ground conductor layers 34a, and a plurality of ground conductor layers 34b instead of the ground conductor layers 32 and 34. It is different from 10.
  • the plurality of ground conductor layers 32a (third ground conductor layer) are in contact with each of the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v11c (first columnar conductors).
  • the plurality of ground conductor layers 32a are not in contact with each other.
  • the plurality of ground conductor layers 32b (fourth ground conductor layer) are in contact with each of the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v12c (second columnar conductors).
  • the plurality of ground conductor layers 32b are not in contact with each other.
  • the plurality of ground conductor layers 34a are in contact with each of the upper ends of the plurality of columnar conductors v13c.
  • the plurality of ground conductor layers 34a are not in contact with each other.
  • the plurality of ground conductor layers 34b are in contact with each of the upper ends of the plurality of columnar conductors v14c.
  • the plurality of ground conductor layers 34b are not in contact with each other.
  • the areas of the ground conductor layers 32a, 32b, 34a, and 34b are smaller than the areas of the ground conductor layers 32 and 24. Therefore, according to the multilayer substrate 10f, the capacitance generated between the signal conductor layer 20 and the ground conductor layers 32a, 32b, 34a, and 34b can be reduced.
  • the other structure of the multilayer substrate 10f is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
  • the multilayer substrate 10f may include ground conductor layers 28a, 28b, 30a, 30b having the same shape as the ground conductor layers 32a, 32b, 34a, 34b.
  • FIG. 11 is a top view of the insulator layer 16c of the multilayer substrate 10g.
  • the multilayer board 10g differs from the multilayer board 10 in that it further includes a signal conductor layer 21, columnar conductors v15, v16, and a ground conductor layer 36.
  • the signal conductor layer 21 (second signal conductor layer) is provided in the laminate 12.
  • the signal conductor layer 21 (second signal conductor layer) is located after the third row L3 and the fourth row L4 (in the negative direction of the Y-axis), and when viewed from the vertical direction (Z-axis direction), It has a linear shape parallel to the signal conductor layer 20 (first signal conductor layer).
  • the ground conductor layer 24 (first ground conductor layer, not shown in FIG. 11) overlaps the signal conductor layer 21 (second signal conductor layer) when viewed in the vertical direction (Z-axis direction).
  • the centers of the plurality of columnar conductors v15 are located behind the signal conductor layer 21.
  • the centers of the plurality of columnar conductors v15 are arranged at a predetermined pitch P0 in a fifth row L5 extending in the left-right direction.
  • the plurality of columnar conductors v15 have a structure in which four columnar conductors that vertically penetrate the insulating layers 15a to 15d are connected in the vertical direction. Thereby, the plurality of columnar conductors v15 electrically connect the ground conductor layer 22, the ground conductor layer 24, and the ground conductor layer 36.
  • the ground conductor layer 36 is provided on the laminate 12.
  • the ground conductor layer 36 is located on the upper main surface of the insulator layer 16c.
  • the ground conductor layer 36 is located after the signal conductor layer 21.
  • the ground conductor layer 36 has a linear shape extending in the left-right direction.
  • each of the plurality of columnar conductors v15 includes a columnar conductor v15c.
  • the plurality of columnar conductors v15c (fifth columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 21 (second signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v15c (fifth columnar conductor) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis).
  • the center of the plurality of columnar conductors v15c is located after the signal conductor layer 21 (second signal conductor layer) (in the negative direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a fifth row L5 extending in the left-right direction (X-axis direction).
  • the plurality of columnar conductors v15c are a part of the plurality of columnar conductors v15, so the ground conductor layer 22 (first ground conductor layer) and the ground conductor layer 24 (fifth ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v15c (fifth columnar conductors) are in contact with the ground conductor layer 36. Therefore, the plurality of columnar conductors v15c are electrically connected to the ground conductor layer 36.
  • the centers of the plurality of columnar conductors v16 are located behind the signal conductor layer 21 (in the negative direction of the Y-axis).
  • the centers of the plurality of columnar conductors v16 are arranged at a predetermined pitch P0 in a sixth row L6 extending in the left-right direction (X-axis direction).
  • the sixth row L6 is located after the fifth row L5 (in the negative direction of the Y-axis).
  • the plurality of columnar conductors v16 have a structure in which four columnar conductors vertically vertically penetrate through the insulator layers 16a to 16d. Thereby, the plurality of columnar conductors v16 electrically connect the ground conductor layer 22 and the ground conductor layer 24.
  • each of the plurality of columnar conductors v16 includes a columnar conductor v16c.
  • the plurality of columnar conductors v16c (sixth columnar conductor) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 21 (second signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v16c (sixth columnar conductor) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis).
  • the centers of the plurality of columnar conductors v16c are located after the signal conductor layer 21 (second signal conductor layer) (in the negative direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a sixth row L6 extending in the left-right direction (X-axis direction).
  • the plurality of columnar conductors v16c are a part of the plurality of columnar conductors v16, so the ground conductor layer 22 (fifth ground conductor layer) and the ground conductor layer 24 (first ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v16c (sixth columnar conductors) are in contact with the ground conductor layer 36. Therefore, the plurality of columnar conductors v16c are electrically connected to the ground conductor layer 36.
  • a plurality of fifth X-axis positions p5 indicating the positions of the centers of the plurality of columnar conductors v15c (fifth columnar conductors) in the left-right direction (X-axis) and a plurality of columnar conductors v16c.
  • a plurality of sixth X-axis positions p6 indicating the position of the center of the (sixth columnar conductor) in the left-right direction (X-axis) are arranged alternately in the X-axis direction.
  • the plurality of fifth X-axis positions p5 and the plurality of sixth X-axis positions p6 are alternately arranged in the X-axis direction at a pitch that is half the predetermined pitch P0.
  • the plurality of columnar conductors v15c overlap with the plurality of columnar conductors v13c (third columnar conductor) when viewed in the front-back direction (Y-axis direction). That is, the fifth X-axis position p5 coincides with the third X-axis position p3.
  • the columnar conductor v16c overlaps with the columnar conductor v14c (fourth columnar conductor) when viewed in the left-right direction (Y-axis direction). That is, the sixth X-axis position p6 coincides with the fourth X-axis position p4.
  • the fifth X-axis position p5 does not have to match the third X-axis position p3. However, the fifth X-axis position p5 must not deviate significantly from the third X-axis position p3 in the left-right direction. Therefore, the distance from the fifth X-axis position p5 to the third X-axis position p3 closest to the fifth X-axis position p5 among the plurality of third X-axis positions p3 is the distance from the fifth X-axis position p5 to the plurality of fourth X-axis positions p4. It is shorter than the distance from the fifth X-axis position p5 to the fourth X-axis position p4 closest to the fifth X-axis position p5.
  • the sixth X-axis position p6 does not have to match the fourth X-axis position p4.
  • the sixth X-axis position p6 must not deviate significantly from the fourth X-axis position p4 in the left-right direction. Therefore, the distance from the sixth X-axis position p6 to the fourth X-axis position p4 closest to the sixth X-axis position p6 among the plurality of fourth X-axis positions p4 is the distance from the sixth X-axis position p6 to the plurality of third X-axis positions p3.
  • the other structure of the multilayer substrate 10g is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • FIG. 12 is an exploded view of the multilayer substrate 10h. However, in FIG. 12, the protective layers 18a and 18b are omitted.
  • FIG. 13 is a cross-sectional view of the multilayer substrate 10h.
  • the multilayer substrate 10h differs from the multilayer substrate 10 in the structure of the columnar conductors v11 to v14.
  • the columnar conductors v11 to v14 have a zigzag shape when viewed in the left-right direction.
  • Each of the plurality of columnar conductors v11 includes columnar conductors v11a to v11d. Each of the columnar conductors v11a to v11d vertically penetrates the insulator layers 16a to 16d.
  • the plurality of columnar conductors v11a, the plurality of columnar conductors v11c, and the plurality of columnar conductors v11d are arranged in the first row L1 at a predetermined pitch P0.
  • the plurality of columnar conductors v11b are arranged in the second row L2 at a predetermined pitch P0.
  • Each of the plurality of columnar conductors v11a, the plurality of columnar conductors v11b, the plurality of columnar conductors v11c, and the plurality of columnar conductors v11d are located at the first X-axis position p1.
  • Each of the plurality of columnar conductors v12 includes columnar conductors v12a to v12d. Each of the columnar conductors v12a to v12d vertically penetrates the insulator layers 16a to 16d.
  • the plurality of columnar conductors v12a, the plurality of columnar conductors v12c, and the plurality of columnar conductors v12d are arranged in the second row L2 at a predetermined pitch P0.
  • the plurality of columnar conductors v12b are arranged in the first row L1 at a predetermined pitch P0.
  • Each of the plurality of columnar conductors v12a, the plurality of columnar conductors v12b, the plurality of columnar conductors v12c, and the plurality of columnar conductors v12d are located at the second X-axis position p2.
  • Each of the plurality of columnar conductors v13 includes columnar conductors v13a to v13d. Each of the columnar conductors v13a to v13d vertically penetrates the insulator layers 16a to 16d.
  • the plurality of columnar conductors v13a, the plurality of columnar conductors v13c, and the plurality of columnar conductors v13d are arranged in the third row L3 at a predetermined pitch P0.
  • the plurality of columnar conductors v13b are arranged in a fourth row L4 at a predetermined pitch P0.
  • Each of the plurality of columnar conductors v13a, the plurality of columnar conductors v13b, the plurality of columnar conductors v13c, and the plurality of columnar conductors v13d are located at the third X-axis position p3.
  • Each of the plurality of columnar conductors v14 includes columnar conductors v14a to v14d. Each of the columnar conductors v14a to v14d vertically penetrates the insulator layers 16a to 16d.
  • the plurality of columnar conductors v14a, the plurality of columnar conductors v14c, and the plurality of columnar conductors v14d are arranged in the fourth row L4 at a predetermined pitch P0.
  • the plurality of columnar conductors v14b are arranged in the third row L3 at a predetermined pitch P0.
  • Each of the plurality of columnar conductors v14a, the plurality of columnar conductors v14b, the plurality of columnar conductors v14c, and the plurality of columnar conductors v14d are located at the fourth X-axis position p4.
  • the other structure of the multilayer substrate 10h is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
  • FIG. 14 is an exploded perspective view of the multilayer substrate 10i.
  • the multilayer board 10i differs from the multilayer board 10 in that it does not include a ground conductor layer 22.
  • the signal conductor layer 20 and the ground conductor layer 24 have a microstrip line structure.
  • the other structure of the multilayer substrate 10i is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
  • the multilayer substrate according to the present invention is not limited to the multilayer substrates 10, 10a to 10i, and can be modified within the scope of the gist thereof. Note that the structures of the multilayer substrates 10, 10a to 10i may be arbitrarily combined.
  • protective layers 18a and 18b are not essential components. Further, either the protective layer 18a or the protective layer 18b may be provided.
  • ground conductor layers 28, 30, 32, and 34 are not essential components.
  • the distance d12 in the front-rear direction between the second row L2 and the fourth row L4 does not have to be equal to the distance d11 in the front-rear direction between the first row L1 and the third row L3.
  • the diameter r1 of the columnar conductor v11c may be smaller than the diameter r2 of the columnar conductor v12c.
  • the diameter r4 of the columnar conductor v14c may be smaller than the diameter r3 of the columnar conductor v13c.
  • the present invention has the following structure.
  • a laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction; a first signal conductor layer provided on the laminate and having a linear shape when viewed in the Z-axis direction; a first ground conductor layer located in the negative direction of the Z-axis from the first signal conductor layer and overlapping with the first signal conductor layer when viewed in the Z-axis direction; Penetrating in the Z-axis direction the insulator layer located in the negative direction of the Z-axis from the first signal conductor layer, and located in the positive direction of the Z-axis from the first ground conductor layer.
  • a plurality of first columnar conductors, a plurality of second columnar conductors, a plurality of third columnar conductors, and a plurality of fourth columnar conductors It is equipped with
  • the direction in which the first signal conductor layer extends is defined as the X-axis direction
  • a direction perpendicular to the X-axis direction and the Z-axis direction is defined as the Y-axis direction
  • the plurality of first columnar conductors, the plurality of second columnar conductors, the plurality of third columnar conductors, and the plurality of fourth columnar conductors are electrically connected to the first ground conductor layer,
  • the centers of the plurality of first columnar conductors are located in the positive direction of the Y-axis from the first signal conductor layer, and are arranged at a predetermined pitch in a first row extending in the X-axis direction.
  • the centers of the plurality of second columnar conductors are located in the positive direction of the Y-axis relative to the first signal conductor layer, and are located in the predetermined second row extending in the X-axis direction. lined up on the pitch, When viewed in the Z-axis direction, the centers of the plurality of third columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are arranged in the predetermined third row extending in the X-axis direction.
  • the centers of the plurality of fourth columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are located in the fourth row extending in the X-axis direction.
  • the second column is located in the negative direction of the Y axis from the first column
  • the fourth column is located in the negative direction of the Y axis from the third column,
  • a plurality of first X-axis positions indicating the positions of the centers of the plurality of first columnar conductors on the X-axis
  • a plurality of first X-axis positions indicating the positions of the centers of the plurality of second columnar conductors on the X-axis.
  • the second X-axis positions are arranged alternately in the X-axis direction, A plurality of third X-axis positions indicating the positions of the centers of the plurality of third columnar conductors on the X-axis and a third X-axis position indicating the positions of the centers of the plurality of fourth columnar conductors on the X-axis when viewed in the Z-axis direction.
  • the 4X-axis positions are arranged alternately in the X-axis direction,
  • the distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is the distance from the third X-axis position to the first X-axis position among the plurality of second X-axis positions.
  • the distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is the distance from the fourth X-axis position to the second X-axis position among the plurality of first X-axis positions. shorter than the distance to the first X-axis position closest to the fourth X-axis position; Multilayer board.
  • the distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is 1/4 or less of the predetermined pitch
  • the distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is 1/4 or less of the predetermined pitch
  • the distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is the distance from the third columnar conductor to the first X-axis position among the plurality of fourth columnar conductors. less than half the distance in the X-axis direction to the fourth columnar conductor closest to the third columnar conductor,
  • the distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is the distance from the third columnar conductor to the second X-axis position among the plurality of fourth columnar conductors. less than half the distance in the X-axis direction from the third columnar conductor to the fourth columnar conductor closest to the third columnar conductor;
  • the third columnar conductor overlaps the first columnar conductor when viewed in the Y-axis direction
  • the fourth columnar conductor overlaps the second columnar conductor when viewed in the Y-axis direction.
  • the distance between the second row and the fourth row in the Y-axis direction is equal to the distance between the first row and the third row in the Y-axis direction.
  • the distance from the center of the first columnar conductor to the center of the second columnar conductor closest to the first columnar conductor among the plurality of second columnar conductors is the distance between the first column and the second column. longer than the distance in the Y-axis direction
  • the distance from the center of the third columnar conductor to the center of the fourth columnar conductor closest to the third columnar conductor among the plurality of fourth columnar conductors is the distance between the third column and the fourth column. longer than the distance in the Y-axis direction
  • the multilayer substrate according to any one of (1) to (5).
  • the distance from the center of the first columnar conductor to the center of the second columnar conductor closest to the first columnar conductor among the plurality of second columnar conductors is determined by the diameter of the first columnar conductor and the second columnar conductor. longer than the diameter of the conductor,
  • the distance from the center of the third columnar conductor to the center of the fourth columnar conductor closest to the third columnar conductor among the plurality of fourth columnar conductors is determined by the diameter of the third columnar conductor and the fourth columnar conductor. longer than the diameter of the conductor,
  • the multilayer substrate according to any one of (1) to (6).
  • the diameter of the first columnar conductor is larger than the diameter of the second columnar conductor
  • the diameter of the fourth columnar conductor is larger than the diameter of the third columnar conductor.
  • the multilayer substrate includes: The second ground conductor layer, Furthermore, we are equipped with The ends of the plurality of first columnar conductors in the positive direction of the Z axis and the ends of the plurality of second columnar conductors in the positive direction of the Z axis are in contact with the second ground conductor layer, The multilayer substrate according to any one of (1) to (9).
  • the distance in the Y-axis direction between the second ground conductor layer and the first signal conductor layer at the first X-axis position is the distance between the second ground conductor layer and the first signal conductor layer at the second X-axis position. longer than the distance in the Y-axis direction,
  • the multilayer substrate includes: a plurality of third ground conductor layers in contact with each of the ends of the plurality of first columnar conductors in the positive direction of the Z axis; a plurality of fourth ground conductor layers in contact with each of the ends of the plurality of second columnar conductors in the positive direction of the Z axis; Furthermore, we have The multilayer substrate according to any one of (1) to (11).
  • the multilayer substrate includes: a fifth ground conductor layer that is located in the positive direction of the Z-axis from the first signal conductor layer and overlaps with the first signal conductor layer when viewed in the Z-axis direction; Furthermore, we are equipped with The plurality of first columnar conductors, the plurality of second columnar conductors, the plurality of third columnar conductors, and the plurality of fourth columnar conductors are electrically connected to the fifth ground conductor layer, The multilayer substrate according to any one of (1) to (12).
  • the distance between the first signal conductor layer and the third column in the Y-axis direction is equal to the distance between the first signal conductor layer and the second column in the Y-axis direction
  • the distance between the first signal conductor layer and the fourth row in the Y-axis direction is equal to the distance between the first signal conductor layer and the first row in the Y-axis direction.
  • the first signal conductor layer has a linear shape;
  • the multilayer substrate includes: The first signal conductor layer is provided in the laminate, is located in the negative direction of the Y-axis from the third row and the fourth row, and is similar to the first signal conductor layer when viewed from the Z-axis direction. a second signal conductor layer having a parallel linear shape; Penetrating in the Z-axis direction the insulator layer located in the negative direction of the Z-axis from the second signal conductor layer, and located in the positive direction of the Z-axis from the first ground conductor layer.
  • the first ground conductor layer overlaps the second signal conductor layer when viewed in the Z-axis direction
  • the plurality of fifth columnar conductors and the plurality of sixth columnar conductors are electrically connected to the first ground conductor layer,
  • the centers of the plurality of fifth columnar conductors are located in the negative direction of the Y-axis from the second signal conductor layer, and are located in the predetermined fifth column extending in the X-axis direction.
  • the centers of the plurality of sixth columnar conductors are located in the negative direction of the Y-axis from the second signal conductor layer, and are located in the predetermined sixth column extending in the X-axis direction. lined up on the pitch, The sixth column is located in the negative direction of the Y axis from the fifth column, When viewed in the Z-axis direction, a plurality of fifth X-axis positions indicating the positions of the centers of the plurality of fifth columnar conductors on the X-axis and a plurality of positions indicating the positions of the centers of the plurality of sixth columnar conductors on the X-axis.
  • the sixth X-axis positions are arranged alternately in the X-axis direction,
  • the distance from the fifth X-axis position to the third X-axis position closest to the fifth X-axis position among the plurality of third X-axis positions is the distance from the fifth X-axis position to the third X-axis position among the plurality of fourth X-axis positions.
  • the distance from the sixth X-axis position to the fourth X-axis position closest to the sixth X-axis position among the plurality of fourth X-axis positions is the distance from the sixth X-axis position to the fourth X-axis position among the plurality of third X-axis positions. shorter than the distance to the third X-axis position closest to the sixth X-axis position;
  • the plurality of first X-axis positions and the plurality of second X-axis positions are alternately arranged in the X-axis direction at a pitch that is half the predetermined pitch.
  • the multilayer substrate according to any one of (1) to (16).
  • Multilayer substrate 12 Laminated bodies 16a to 16d: Insulator layers 18a, 18b: Protective layers 20, 21: Signal conductor layers 22, 24, 28, 28a, 28b, 30, 30a, 30b, 32, 32a, 32b, 34, 34a, 34b, 36: Ground conductor layer 26a, 26b: Signal terminal A1: First section A2: Second section A3: Third section L1: First column L2: Second column L3: Third Row L4: Fourth row L5: Fifth row L6: Sixth row p1: First X-axis position p2: Second X-axis position p3: Third X-axis position p4: Fourth X-axis position p5: Fifth X-axis position p6: Sixth X Axis positions v1, v2, v11 to v16, v11a to v11d, v12a to v12d, v13a to v13d, v14a to v14d,

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Abstract

According to the present invention, the centers of a plurality of first columnar conductors, the centers of a plurality of second columnar conductors, the centers of a plurality of third columnar conductors, and the centers of a plurality of fourth columnar conductors are arranged side by side at a prescribed pitch in first to fourth rows extending in the X-axis direction. The second row is positioned more in the Y-axis negative direction than the first row. The fourth row is positioned more in the Y-axis negative direction than the third row. When viewed in the Z-axis direction, a plurality of first X-axis positions indicating positions, on the X-axis, of the centers of the plurality of first columnar conductors, and a plurality of second X-axis positions indicating positions, on the X-axis, of the centers of the plurality of second columnar conductors, are alternately arranged side by side in the X-axis direction. When viewed in the Z-axis direction, a plurality of third X-axis positions indicating positions, on the X-axis, of the centers of the plurality of second columnar conductors, and a plurality of fourth X-axis positions indicating positions, on the X-axis, of the centers of the plurality of fourth columnar conductors, are alternately arranged side by side in the X-axis direction.

Description

多層基板multilayer board
 本発明は、信号導体層を備える多層基板に関する。 The present invention relates to a multilayer substrate including a signal conductor layer.
 従来の多層基板に関する発明としては、例えば、特許文献1に記載の伝送線路が知られている。この伝送線路は、信号線、2つの接地導体及び複数のGNDビアを備えている。信号線は、前後方向に延びている。信号線は、上下方向において、2つの接地導体の間に位置している。複数のGNDビアは、2つの接地導体を電気的に接続している。複数のGNDビアの内の一部のGNDビアは、信号線より左において前後方向に並んでいる。また、複数のGNDビアの内の残部のGNDビアは、信号線より右において前後方向に並んでいる。 As an invention related to a conventional multilayer board, for example, a transmission line described in Patent Document 1 is known. This transmission line includes a signal line, two ground conductors, and a plurality of GND vias. The signal line extends in the front-rear direction. The signal line is located between two ground conductors in the vertical direction. A plurality of GND vias electrically connects two ground conductors. Some of the GND vias among the plurality of GND vias are lined up in the front-rear direction on the left of the signal line. Further, the remaining GND vias among the plurality of GND vias are arranged in the front-rear direction on the right side of the signal line.
特開2010-28306号公報Japanese Patent Application Publication No. 2010-28306
 ところで、特許文献1に記載の伝送線路において、ノイズが伝送線路の外部に放射されること、及び、ノイズが伝送線路の内部に侵入することを抑制したい(以下、シールド性の向上と呼ぶ)という要望がある。 By the way, in the transmission line described in Patent Document 1, it is desired to suppress noise from being radiated to the outside of the transmission line and from entering the inside of the transmission line (hereinafter referred to as improving shielding performance). I have a request.
 そこで、本発明の目的は、シールド性の向上を図ることができる多層基板を提供することである。 Therefore, an object of the present invention is to provide a multilayer board that can improve shielding performance.
 本発明の一形態に係る多層基板は、
 複数の絶縁体層がZ軸方向に積層された構造を有している積層体と、
 前記積層体に設けられており、かつ、前記Z軸方向に見て、線形状を有している第1信号導体層と、
 前記第1信号導体層よりZ軸の負方向に位置すると共に、前記Z軸方向に見て、前記第1信号導体層と重なっている第1グランド導体層と、
 前記第1信号導体層より前記Z軸の負方向に位置する前記絶縁体層を前記Z軸方向に貫通しており、かつ、前記第1グランド導体層より前記Z軸の正方向に位置している複数の第1柱状導体、複数の第2柱状導体、複数の第3柱状導体及び複数の第4柱状導体と、
 を備えており、
 前記第1信号導体層が延びる方向をX軸方向と定義し、
 前記X軸方向及び前記Z軸方向に直交する方向をY軸方向と定義し、
 前記複数の第1柱状導体、前記複数の第2柱状導体、前記複数の第3柱状導体及び前記複数の第4柱状導体は、前記第1グランド導体層に電気的に接続されており、
 前記Z軸方向に見て、前記複数の第1柱状導体の中心は、前記第1信号導体層よりY軸の正方向に位置し、かつ、前記X軸方向に延びる第1列に所定ピッチで並んでおり、
 前記Z軸方向に見て、前記複数の第2柱状導体の中心は、前記第1信号導体層より前記Y軸の正方向に位置し、かつ、前記X軸方向に延びる第2列に前記所定ピッチで並んでおり、
 前記Z軸方向に見て、前記複数の第3柱状導体の中心は、前記第1信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第3列に前記所定ピッチで並んでおり、
 前記Z軸方向に見て、前記複数の第4柱状導体の中心は、前記第1信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第4列に前記所定ピッチで並んでおり、
 前記第2列は、前記第1列より前記Y軸の負方向に位置しており、
 前記第4列は、前記第3列より前記Y軸の負方向に位置しており、
 前記Z軸方向に見て、前記複数の第1柱状導体の中心のX軸における位置を示す複数の第1X軸位置と前記複数の第2柱状導体の中心の前記X軸における位置を示す複数の第2X軸位置とは、前記X軸方向に交互に並んでおり、
 前記Z軸方向に見て、前記複数の第3柱状導体の中心の前記X軸における位置を示す複数の第3X軸位置と前記複数の第4柱状導体の中心の前記X軸における位置を示す第4X軸位置とは、前記X軸方向に交互に並んでおり、
 前記第3X軸位置から前記複数の第1X軸位置の内の前記第3X軸位置に最も近い前記第1X軸位置までの距離は、前記第3X軸位置から前記複数の第2X軸位置の内の前記第3X軸位置に最も近い前記第2X軸位置までの距離より短く、
 前記第4X軸位置から前記複数の第2X軸位置の内の前記第4X軸位置に最も近い前記第2X軸位置までの距離は、前記第4X軸位置から前記複数の第1X軸位置の内の前記第4X軸位置に最も近い前記第1X軸位置までの距離より短い。
A multilayer substrate according to one embodiment of the present invention includes:
A laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a first signal conductor layer provided on the laminate and having a linear shape when viewed in the Z-axis direction;
a first ground conductor layer located in the negative direction of the Z-axis from the first signal conductor layer and overlapping with the first signal conductor layer when viewed in the Z-axis direction;
Penetrating in the Z-axis direction the insulator layer located in the negative direction of the Z-axis from the first signal conductor layer, and located in the positive direction of the Z-axis from the first ground conductor layer. A plurality of first columnar conductors, a plurality of second columnar conductors, a plurality of third columnar conductors, and a plurality of fourth columnar conductors,
It is equipped with
The direction in which the first signal conductor layer extends is defined as the X-axis direction,
A direction perpendicular to the X-axis direction and the Z-axis direction is defined as the Y-axis direction,
The plurality of first columnar conductors, the plurality of second columnar conductors, the plurality of third columnar conductors, and the plurality of fourth columnar conductors are electrically connected to the first ground conductor layer,
When viewed in the Z-axis direction, the centers of the plurality of first columnar conductors are located in the positive direction of the Y-axis from the first signal conductor layer, and are arranged at a predetermined pitch in a first row extending in the X-axis direction. They are lined up,
When viewed in the Z-axis direction, the centers of the plurality of second columnar conductors are located in the positive direction of the Y-axis relative to the first signal conductor layer, and are located in the predetermined second row extending in the X-axis direction. lined up on the pitch,
When viewed in the Z-axis direction, the centers of the plurality of third columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are arranged in the predetermined third row extending in the X-axis direction. lined up on the pitch,
When viewed in the Z-axis direction, the centers of the plurality of fourth columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are located in the fourth row extending in the X-axis direction. lined up on the pitch,
The second column is located in the negative direction of the Y axis from the first column,
The fourth column is located in the negative direction of the Y axis from the third column,
When viewed in the Z-axis direction, a plurality of first X-axis positions indicating the positions of the centers of the plurality of first columnar conductors on the X-axis, and a plurality of first X-axis positions indicating the positions of the centers of the plurality of second columnar conductors on the X-axis. The second X-axis positions are arranged alternately in the X-axis direction,
A plurality of third X-axis positions indicating the positions of the centers of the plurality of third columnar conductors on the X-axis and a third X-axis position indicating the positions of the centers of the plurality of fourth columnar conductors on the X-axis when viewed in the Z-axis direction. The 4X-axis positions are arranged alternately in the X-axis direction,
The distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is the distance from the third X-axis position to the first X-axis position among the plurality of second X-axis positions. shorter than the distance to the second X-axis position closest to the third X-axis position,
The distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is the distance from the fourth X-axis position to the second X-axis position among the plurality of first X-axis positions. It is shorter than the distance to the first X-axis position closest to the fourth X-axis position.
 本発明に係る多層基板によれば、シールド性の向上を図ることができる。 According to the multilayer substrate according to the present invention, it is possible to improve shielding performance.
図1は、多層基板10の分解斜視図である。FIG. 1 is an exploded perspective view of the multilayer substrate 10. 図2は、多層基板10の絶縁体層16cの上面図である。FIG. 2 is a top view of the insulator layer 16c of the multilayer substrate 10. 図3は、多層基板10の断面図である。FIG. 3 is a cross-sectional view of the multilayer substrate 10. 図4は、多層基板10の使用時における正面図である。FIG. 4 is a front view of the multilayer substrate 10 in use. 図5は、多層基板10aの絶縁体層16cの上面図である。FIG. 5 is a top view of the insulator layer 16c of the multilayer substrate 10a. 図6は、多層基板10bの絶縁体層16cの上面図である。FIG. 6 is a top view of the insulator layer 16c of the multilayer substrate 10b. 図7は、多層基板10cの絶縁体層16cの上面図である。FIG. 7 is a top view of the insulator layer 16c of the multilayer substrate 10c. 図8は、多層基板10dの絶縁体層16cの上面図である。FIG. 8 is a top view of the insulator layer 16c of the multilayer substrate 10d. 図9は、多層基板10eの絶縁体層16cの上面図である。FIG. 9 is a top view of the insulator layer 16c of the multilayer substrate 10e. 図10は、多層基板10fの絶縁体層16cの上面図である。FIG. 10 is a top view of the insulator layer 16c of the multilayer substrate 10f. 図11は、多層基板10gの絶縁体層16cの上面図である。FIG. 11 is a top view of the insulator layer 16c of the multilayer substrate 10g. 図12は、多層基板10hの分解図である。FIG. 12 is an exploded view of the multilayer substrate 10h. 図13は、多層基板10hの断面図である。FIG. 13 is a cross-sectional view of the multilayer substrate 10h. 図14は、多層基板10iの分解斜視図である。FIG. 14 is an exploded perspective view of the multilayer substrate 10i.
(実施形態)
[多層基板の構造]
 以下に、本発明の実施形態に係る多層基板10の構造について図面を参照しながら説明する。図1は、多層基板10の分解斜視図である。図2は、多層基板10の絶縁体層16cの上面図である。図3は、多層基板10の断面図である。図3では、左右方向に直交する断面を示した。図4は、多層基板10の使用時における正面図である。なお、図1及び図2では、複数の柱状導体v11~v14の内の代表的な柱状導体v11~v14にのみ参照符号を付した。
(Embodiment)
[Structure of multilayer board]
The structure of a multilayer substrate 10 according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of the multilayer substrate 10. FIG. 2 is a top view of the insulator layer 16c of the multilayer substrate 10. FIG. 3 is a cross-sectional view of the multilayer substrate 10. In FIG. 3, a cross section perpendicular to the left-right direction is shown. FIG. 4 is a front view of the multilayer substrate 10 in use. Note that in FIGS. 1 and 2, only representative columnar conductors v11 to v14 among the plurality of columnar conductors v11 to v14 are given reference numerals.
 本明細書において、方向を以下のように定義する。多層基板10の積層体12の積層方向を上下方向と定義する。また、上下方向は、Z軸方向と一致する。上方向は、Z軸の正方向である。下方向は、Z軸の負方向である。また、多層基板10の信号導体層20が延びる方向を左右方向と定義する。左右方向は、X軸方向と一致する。左右方向は、上下方向に直交する。また、上下方向及び左右方向に直交する方向を前後方向と定義する。前後方向は、Y軸方向と一致する。なお、上下方向の上方向と下方向とが入れ替わってもよいし、左右方向の左方向と右方向とが入れ替わってもよいし、前後方向の前方向と後方向とが入れ替わってもよい。 In this specification, direction is defined as follows. The stacking direction of the stacked body 12 of the multilayer substrate 10 is defined as the vertical direction. Further, the up-down direction coincides with the Z-axis direction. The upward direction is the positive direction of the Z axis. The downward direction is the negative direction of the Z axis. Further, the direction in which the signal conductor layer 20 of the multilayer substrate 10 extends is defined as the left-right direction. The left-right direction coincides with the X-axis direction. The left-right direction is perpendicular to the up-down direction. Further, a direction perpendicular to the up-down direction and the left-right direction is defined as the front-back direction. The front-back direction coincides with the Y-axis direction. Note that the upper and lower directions in the vertical direction may be interchanged, the left and right directions in the horizontal direction may be interchanged, and the front and rear directions in the longitudinal direction may be interchanged.
 まず、図1を参照しながら、多層基板10の構造について説明する。多層基板10は、高周波信号を伝送する。多層基板10は、スマートフォン等の電子機器において、2つの回路を電気的に接続するために用いられる。多層基板10は、図1に示すように、積層体12、保護層18a,18b、信号導体層20、グランド導体層22,24,28,30,32,34、信号端子26a,26b、柱状導体v1,v2及び複数の柱状導体v11~v14を備えている。 First, the structure of the multilayer substrate 10 will be described with reference to FIG. 1. Multilayer substrate 10 transmits high frequency signals. The multilayer substrate 10 is used to electrically connect two circuits in electronic devices such as smartphones. As shown in FIG. 1, the multilayer board 10 includes a laminate 12, protective layers 18a, 18b, a signal conductor layer 20, ground conductor layers 22, 24, 28, 30, 32, 34, signal terminals 26a, 26b, and columnar conductors. It includes v1, v2 and a plurality of columnar conductors v11 to v14.
 積層体12は、板形状を有している。従って、積層体12は、上主面及び下主面を有している。積層体12の上主面及び下主面は、左右方向に延びる長辺を有する長方形状を有している。そのため、積層体12の左右方向の長さは、積層体12の前後方向の長さより長い。積層体12は、可撓性を有している。 The laminate 12 has a plate shape. Therefore, the laminate 12 has an upper main surface and a lower main surface. The upper main surface and the lower main surface of the laminate 12 have a rectangular shape with long sides extending in the left-right direction. Therefore, the length of the laminate 12 in the left-right direction is longer than the length of the laminate 12 in the front-rear direction. The laminate 12 has flexibility.
 積層体12は、図1に示すように、絶縁体層16a~16dが上下方向(Z軸方向)に積層された構造を有している。絶縁体層16a~16dは、上から下へとこの順に並んでいる。絶縁体層16a~16dのそれぞれは、上主面及び下主面を有している。絶縁体層16a~16dの材料は、熱可塑性樹脂である。熱可塑性樹脂は、例えば、液晶ポリマである。 As shown in FIG. 1, the laminate 12 has a structure in which insulator layers 16a to 16d are stacked in the vertical direction (Z-axis direction). The insulator layers 16a to 16d are arranged in this order from top to bottom. Each of the insulator layers 16a to 16d has an upper main surface and a lower main surface. The material of the insulator layers 16a to 16d is thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer.
 信号導体層20には、高周波信号が伝送される。信号導体層20(第1信号導体層)は、積層体12に設けられている。本実施形態では、信号導体層20は、絶縁体層16cの上主面に位置している。信号導体層20は、上下方向(Z軸方向)に見て、左右方向に延びる線形状を有している。本実施形態では、信号導体層20は、直線形状を有している。 A high frequency signal is transmitted to the signal conductor layer 20. The signal conductor layer 20 (first signal conductor layer) is provided in the laminate 12. In this embodiment, the signal conductor layer 20 is located on the upper main surface of the insulator layer 16c. The signal conductor layer 20 has a linear shape extending in the left-right direction when viewed in the up-down direction (Z-axis direction). In this embodiment, the signal conductor layer 20 has a linear shape.
 グランド導体層22は、図1に示すように、積層体12に設けられている。グランド導体層22(第5グランド導体層)は、信号導体層20(第1信号導体層)より上(Z軸の正方向)に位置すると共に、上下方向(Z軸方向)に見て、信号導体層20(第1信号導体層)と重なっている。本実施形態では、グランド導体層22は、絶縁体層16aの上主面に位置している。また、グランド導体層22は、絶縁体層16aの上主面の略全面を覆っている。グランド導体層22には、グランド電位が接続される。 The ground conductor layer 22 is provided on the laminate 12, as shown in FIG. The ground conductor layer 22 (fifth ground conductor layer) is located above the signal conductor layer 20 (first signal conductor layer) (in the positive direction of the Z-axis), and when viewed in the vertical direction (Z-axis direction), It overlaps with the conductor layer 20 (first signal conductor layer). In this embodiment, the ground conductor layer 22 is located on the upper main surface of the insulator layer 16a. Furthermore, the ground conductor layer 22 covers substantially the entire upper main surface of the insulator layer 16a. A ground potential is connected to the ground conductor layer 22 .
 グランド導体層24は、図1に示すように、積層体12に設けられている。グランド導体層24(第1グランド導体層)は、信号導体層20(第1信号導体層)より下(Z軸の負方向)に位置すると共に、上下方向(Z軸方向)に見て、信号導体層20(第1信号導体層)と重なっている。本実施形態では、グランド導体層24は、絶縁体層16dの下主面に位置している。また、グランド導体層24は、絶縁体層16dの下主面の略全面を覆っている。グランド導体層24には、グランド電位が接続される。以上のような信号導体層20、グランド導体層22及びグランド導体層24は、ストリップライン構造を有している。 The ground conductor layer 24 is provided on the laminate 12, as shown in FIG. The ground conductor layer 24 (first ground conductor layer) is located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis), and when viewed in the vertical direction (Z-axis direction), It overlaps with the conductor layer 20 (first signal conductor layer). In this embodiment, the ground conductor layer 24 is located on the lower main surface of the insulator layer 16d. Further, the ground conductor layer 24 covers substantially the entire lower main surface of the insulator layer 16d. A ground potential is connected to the ground conductor layer 24. The signal conductor layer 20, ground conductor layer 22, and ground conductor layer 24 as described above have a strip line structure.
 グランド導体層28,30は、図1に示すように、積層体12に設けられている。グランド導体層28,30は、絶縁体層16bの上主面に位置している。グランド導体層28は、信号導体層20より前に位置している。グランド導体層30は、信号導体層20より後に位置している。グランド導体層28,30は、左右方向に延びる線形状を有している。 The ground conductor layers 28 and 30 are provided on the laminate 12, as shown in FIG. The ground conductor layers 28 and 30 are located on the upper main surface of the insulator layer 16b. The ground conductor layer 28 is located before the signal conductor layer 20. The ground conductor layer 30 is located after the signal conductor layer 20. The ground conductor layers 28 and 30 have a linear shape extending in the left-right direction.
 グランド導体層32,34は、図1に示すように、積層体12に設けられている。グランド導体層32,34は、絶縁体層16cの上主面に位置している。従って、グランド導体層32,34の上下方向の位置は、信号導体層20の上下方向の位置と同じである。グランド導体層32は、信号導体層20より前に位置している。グランド導体層34は、信号導体層20より後に位置している。グランド導体層32,34は、左右方向に延びる線形状を有している。 The ground conductor layers 32 and 34 are provided on the laminate 12, as shown in FIG. The ground conductor layers 32 and 34 are located on the upper main surface of the insulator layer 16c. Therefore, the vertical positions of the ground conductor layers 32 and 34 are the same as the vertical positions of the signal conductor layer 20. The ground conductor layer 32 is located before the signal conductor layer 20. The ground conductor layer 34 is located after the signal conductor layer 20. The ground conductor layers 32 and 34 have a linear shape extending in the left-right direction.
 信号端子26aは、積層体12の左端部に設けられている。より詳細には、信号端子26aは、絶縁体層16aの上主面に位置している。信号端子26aは、上下方向に見て、信号導体層20の左端部と重なっている。信号端子26aは、上下方向に見て、長方形状を有している。信号端子26aは、高周波信号が入出力する外部端子である。信号端子26aは、グランド導体層22に接触していない。 The signal terminal 26a is provided at the left end of the laminate 12. More specifically, the signal terminal 26a is located on the upper main surface of the insulator layer 16a. The signal terminal 26a overlaps the left end portion of the signal conductor layer 20 when viewed in the vertical direction. The signal terminal 26a has a rectangular shape when viewed in the vertical direction. The signal terminal 26a is an external terminal to which a high frequency signal is input/output. The signal terminal 26a is not in contact with the ground conductor layer 22.
 柱状導体v1は、信号端子26aと信号導体層20の左端部とを電気的に接続している。より詳細には、柱状導体v1は、絶縁体層16a,16bを上下方向に貫通している。柱状導体v1の上端は、信号端子26aに接している。柱状導体v1の下端は、信号導体層20の左端部に接している。信号端子26b及び柱状導体v2の構造は、信号端子26a及び柱状導体v1の構造と左右対称であるので、説明を省略する。 The columnar conductor v1 electrically connects the signal terminal 26a and the left end portion of the signal conductor layer 20. More specifically, the columnar conductor v1 vertically penetrates the insulator layers 16a and 16b. The upper end of the columnar conductor v1 is in contact with the signal terminal 26a. The lower end of the columnar conductor v1 is in contact with the left end of the signal conductor layer 20. The structures of the signal terminal 26b and the columnar conductor v2 are bilaterally symmetrical to the structures of the signal terminal 26a and the columnar conductor v1, so a description thereof will be omitted.
 上下方向(Z軸方向)に見て、複数の柱状導体v11の中心は、図2に示すように、信号導体層20より前(Y軸の正方向)に位置している。複数の柱状導体v11の中心は、左右方向(X軸方向)に延びる第1列L1に所定ピッチP0で並んでいる。複数の柱状導体v11は、絶縁体層16a~16dを上下方向に貫通する4つの柱状導体が上下方向に連なった構造を有している。これにより、複数の柱状導体v11は、グランド導体層22とグランド導体層24とグランド導体層28とグランド導体層32とを電気的に接続している。 When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v11 are located in front of the signal conductor layer 20 (in the positive direction of the Y-axis), as shown in FIG. The centers of the plurality of columnar conductors v11 are arranged at a predetermined pitch P0 in a first row L1 extending in the left-right direction (X-axis direction). The plurality of columnar conductors v11 have a structure in which four columnar conductors that vertically penetrate the insulator layers 16a to 16d are connected in the vertical direction. Thereby, the plurality of columnar conductors v11 electrically connect the ground conductor layer 22, the ground conductor layer 24, the ground conductor layer 28, and the ground conductor layer 32.
 ここで、複数の柱状導体v11のそれぞれは、柱状導体v11cを含んでいる。複数の柱状導体v11c(第1柱状導体)は、信号導体層20(第1信号導体層)より下(Z軸の負方向)に位置する絶縁体層16cを上下方向(Z軸方向)に貫通している。これにより、複数の柱状導体v11c(第1柱状導体)は、グランド導体層24(第1グランド導体層)より上(Z軸の正方向)に位置している。上下方向(Z軸方向)に見て、複数の柱状導体v11c(第1柱状導体)の中心は、信号導体層20(第1信号導体層)より前(Y軸の正方向)に位置し、かつ、左右方向(X軸方向)に延びる第1列L1に所定ピッチP0で並んでいる。 Here, each of the plurality of columnar conductors v11 includes a columnar conductor v11c. The plurality of columnar conductors v11c (first columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v11c (first columnar conductors) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis). When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v11c (first columnar conductors) are located in front of the signal conductor layer 20 (first signal conductor layer) (in the positive direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a first row L1 extending in the left-right direction (X-axis direction).
 前記の通り、複数の柱状導体v11c(第1柱状導体)は、複数の柱状導体v11の一部分であるので、グランド導体層22(第1グランド導体層)及びグランド導体層24(第5グランド導体層)に電気的に接続されている。また、複数の柱状導体v11c(第1柱状導体)の上端(Z軸の正方向の端)は、グランド導体層32(第2グランド導体層)に接している。従って、複数の柱状導体v11cは、グランド導体層32に電気的に接続されている。 As mentioned above, the plurality of columnar conductors v11c (first columnar conductors) are a part of the plurality of columnar conductors v11, so the ground conductor layer 22 (first ground conductor layer) and the ground conductor layer 24 (fifth ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v11c (first columnar conductors) are in contact with the ground conductor layer 32 (second ground conductor layer). Therefore, the plurality of columnar conductors v11c are electrically connected to the ground conductor layer 32.
 上下方向(Z軸方向)に見て、複数の柱状導体v12の中心は、図2に示すように、信号導体層20より前(Y軸の正方向)に位置している。複数の柱状導体v12の中心は、左右方向(X軸方向)に延びる第2列L2に所定ピッチP0で並んでいる。第2列L2は、第1列L1より後(Y軸の負方向)に位置している。複数の柱状導体v12は、図3に示すように、絶縁体層16a~16dを上下方向に貫通する4つの柱状導体が上下方向に連なった構造を有している。これにより、複数の柱状導体v12は、グランド導体層22とグランド導体層24とを電気的に接続している。 As seen in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v12 are located in front of the signal conductor layer 20 (in the positive direction of the Y-axis), as shown in FIG. The centers of the plurality of columnar conductors v12 are arranged at a predetermined pitch P0 in a second row L2 extending in the left-right direction (X-axis direction). The second row L2 is located after the first row L1 (in the negative direction of the Y-axis). As shown in FIG. 3, the plurality of columnar conductors v12 have a structure in which four columnar conductors vertically vertically penetrate through the insulating layers 16a to 16d. Thereby, the plurality of columnar conductors v12 electrically connect the ground conductor layer 22 and the ground conductor layer 24.
 ここで、複数の柱状導体v12のそれぞれは、柱状導体v12cを含んでいる。複数の柱状導体v12c(第2柱状導体)は、信号導体層20(第1信号導体層)より下(Z軸の負方向)に位置する絶縁体層16cを上下方向(Z軸方向)に貫通している。これにより、複数の柱状導体v12c(第1柱状導体)は、グランド導体層24(第1グランド導体層)より上(Z軸の正方向)に位置している。上下方向(Z軸方向)に見て、複数の柱状導体v12c(第2柱状導体)の中心は、信号導体層20(第1信号導体層)より前(Y軸の正方向)に位置し、かつ、左右方向(X軸方向)に延びる第2列L2に所定ピッチP0で並んでいる。 Here, each of the plurality of columnar conductors v12 includes a columnar conductor v12c. The plurality of columnar conductors v12c (second columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v12c (first columnar conductors) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis). When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v12c (second columnar conductors) are located before the signal conductor layer 20 (first signal conductor layer) (in the positive direction of the Y-axis), Moreover, they are arranged at a predetermined pitch P0 in a second row L2 extending in the left-right direction (X-axis direction).
 前記の通り、複数の柱状導体v12c(第2柱状導体)は、複数の柱状導体v12の一部分であるので、グランド導体層22(第5グランド導体層)及びグランド導体層24(第1グランド導体層)に電気的に接続されている。また、複数の柱状導体v12c(第2柱状導体)の上端(Z軸の正方向の端)は、グランド導体層32(第2グランド導体層)に接している。従って、複数の柱状導体v12cは、グランド導体層32に電気的に接続されている。 As mentioned above, the plurality of columnar conductors v12c (second columnar conductors) are a part of the plurality of columnar conductors v12, so the ground conductor layer 22 (fifth ground conductor layer) and the ground conductor layer 24 (first ground conductor layer) ) is electrically connected to. Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v12c (second columnar conductors) are in contact with the ground conductor layer 32 (second ground conductor layer). Therefore, the plurality of columnar conductors v12c are electrically connected to the ground conductor layer 32.
 また、図2に示すように、上下方向(Z軸方向)に見て、複数の柱状導体v11c(第1柱状導体)の中心の左右方向(X軸)における位置を示す複数の第1X軸位置p1と複数の柱状導体v12c(第2柱状導体)の中心の左右方向(X軸)における位置を示す複数の第2X軸位置p2とは、左右方向(X軸方向)に交互に並んでいる。本実施形態では、複数の第1X軸位置p1と複数の第2X軸位置p2とは、左右方向(X軸方向)に所定ピッチP0の半分のピッチで交互に並んでいる。 In addition, as shown in FIG. 2, a plurality of first X-axis positions indicate the positions of the centers of the plurality of columnar conductors v11c (first columnar conductors) in the left-right direction (X-axis) when viewed in the vertical direction (Z-axis direction). p1 and a plurality of second X-axis positions p2 indicating the positions of the centers of the plurality of columnar conductors v12c (second columnar conductors) in the left-right direction (X-axis direction) are arranged alternately in the left-right direction (X-axis direction). In this embodiment, the plurality of first X-axis positions p1 and the plurality of second X-axis positions p2 are arranged alternately in the left-right direction (X-axis direction) at a pitch that is half the predetermined pitch P0.
 また、柱状導体v11c(第1柱状導体)の中心から複数の柱状導体v12c(第2柱状導体)の内の柱状導体v11c(第1柱状導体)に最も近い柱状導体v12c(第2柱状導体)の中心までの距離l1は、第1列L1と第2列L2との左右方向(Y軸方向)の距離d11より長い。柱状導体v11c(第1柱状導体)の中心から複数の柱状導体v12c(第2柱状導体)の内の柱状導体v11c(第1柱状導体)に最も近い柱状導体v12c(第2柱状導体)の中心までの距離l1は、柱状導体v11c(第1柱状導体)の直径r1及び柱状導体v12c(第2柱状導体)の直径r2より長い。本実施形態では、直径r2は、直径r1と等しい。 Also, the columnar conductor v12c (second columnar conductor) closest to the columnar conductor v11c (first columnar conductor) among the plurality of columnar conductors v12c (second columnar conductors) from the center of the columnar conductor v11c (first columnar conductor) The distance l1 to the center is longer than the distance d11 in the left-right direction (Y-axis direction) between the first row L1 and the second row L2. From the center of the columnar conductor v11c (first columnar conductor) to the center of the columnar conductor v12c (second columnar conductor) closest to the columnar conductor v11c (first columnar conductor) among the plurality of columnar conductors v12c (second columnar conductors) The distance l1 is longer than the diameter r1 of the columnar conductor v11c (first columnar conductor) and the diameter r2 of the columnar conductor v12c (second columnar conductor). In this embodiment, the diameter r2 is equal to the diameter r1.
 上下方向(Z軸方向)に見て、複数の柱状導体v13の中心は、図2に示すように、信号導体層20より後(Y軸の負方向)に位置している。複数の柱状導体v13の中心は、左右方向(X軸方向)に延びる第3列L3に所定ピッチP0で並んでいる。複数の柱状導体v13は、図3に示すように、絶縁体層16a~16dを上下方向に貫通する4つの柱状導体が上下方向に連なった構造を有している。これにより、複数の柱状導体v13は、グランド導体層22とグランド導体層24とグランド導体層30とグランド導体層34とを電気的に接続している。 As seen in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v13 are located behind the signal conductor layer 20 (in the negative direction of the Y-axis), as shown in FIG. The centers of the plurality of columnar conductors v13 are arranged at a predetermined pitch P0 in a third row L3 extending in the left-right direction (X-axis direction). As shown in FIG. 3, the plurality of columnar conductors v13 have a structure in which four columnar conductors that vertically penetrate the insulator layers 16a to 16d are connected in the vertical direction. Thereby, the plurality of columnar conductors v13 electrically connect the ground conductor layer 22, the ground conductor layer 24, the ground conductor layer 30, and the ground conductor layer 34.
 ここで、複数の柱状導体v13のそれぞれは、柱状導体v13cを含んでいる。複数の柱状導体v13c(第3柱状導体)は、信号導体層20(第1信号導体層)より下(Z軸の負方向)に位置する絶縁体層16cを上下方向(Z軸方向)に貫通している。これにより、複数の柱状導体v13c(第3柱状導体)は、グランド導体層24(第1グランド導体層)より上(Z軸の正方向)に位置している。上下方向(Z軸方向)に見て、複数の柱状導体v13c(第3柱状導体)の中心は、信号導体層20(第1信号導体層)より後(Y軸の負方向)に位置し、かつ、左右方向(X軸方向)に延びる第3列L3に所定ピッチP0で並んでいる。 Here, each of the plurality of columnar conductors v13 includes a columnar conductor v13c. The plurality of columnar conductors v13c (third columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v13c (third columnar conductors) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis). When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v13c (third columnar conductors) are located after the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a third row L3 extending in the left-right direction (X-axis direction).
 前記の通り、複数の柱状導体v13c(第3柱状導体)は、複数の柱状導体v13の一部分であるので、グランド導体層22(第1グランド導体層)及びグランド導体層24(第5グランド導体層)に電気的に接続されている。また、複数の柱状導体v13c(第3柱状導体)の上端(Z軸の正方向の端)は、グランド導体層34に接している。従って、複数の柱状導体v13cは、グランド導体層34に電気的に接続されている。 As mentioned above, the plurality of columnar conductors v13c (third columnar conductor) are a part of the plurality of columnar conductors v13, so the ground conductor layer 22 (first ground conductor layer) and the ground conductor layer 24 (fifth ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v13c (third columnar conductors) are in contact with the ground conductor layer 34. Therefore, the plurality of columnar conductors v13c are electrically connected to the ground conductor layer 34.
 上下方向(Z軸方向)に見て、複数の柱状導体v14の中心は、図2に示すように、信号導体層20より後(Y軸の負方向)に位置している。複数の柱状導体v14の中心は、左右方向(X軸方向)に延びる第4列L4に所定ピッチP0で並んでいる。第4列L4は、第3列L3より後(Y軸の負方向)に位置している。第2列L2と第4列L4との左右方向(Y軸方向)の距離d2は、第1列L1と第3列L3との左右方向(Y軸方向)の距離d1と等しい。更に、信号導体層20(第1信号導体層)と第3列L3との左右方向(Y軸方向)の距離L13は、信号導体層20(第1信号導体層)と第2列L2との左右方向(Y軸方向)の距離L12と等しい。信号導体層20(第1信号導体層)と第4列L4との左右方向(Y軸方向)の距離L14は、信号導体層20(第1信号導体層)と第1列L1との左右方向(Y軸方向)の距離L11と等しい。複数の柱状導体v14は、図3に示すように、絶縁体層16a~16dを上下方向に貫通する4つの柱状導体が上下方向に連なった構造を有している。これにより、複数の柱状導体v14は、グランド導体層22とグランド導体層24とを電気的に接続している。 As seen in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v14 are located behind the signal conductor layer 20 (in the negative direction of the Y-axis), as shown in FIG. The centers of the plurality of columnar conductors v14 are arranged at a predetermined pitch P0 in a fourth row L4 extending in the left-right direction (X-axis direction). The fourth row L4 is located after the third row L3 (in the negative direction of the Y-axis). The distance d2 in the left-right direction (Y-axis direction) between the second row L2 and the fourth row L4 is equal to the distance d1 in the left-right direction (Y-axis direction) between the first row L1 and the third row L3. Furthermore, the distance L13 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the third row L3 is equal to the distance L13 between the signal conductor layer 20 (first signal conductor layer) and the second row L2. It is equal to the distance L12 in the left-right direction (Y-axis direction). The distance L14 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the fourth row L4 is the distance L14 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the first row L1. It is equal to the distance L11 (in the Y-axis direction). As shown in FIG. 3, the plurality of columnar conductors v14 have a structure in which four columnar conductors vertically vertically penetrate through the insulator layers 16a to 16d. Thereby, the plurality of columnar conductors v14 electrically connect the ground conductor layer 22 and the ground conductor layer 24.
 ここで、複数の柱状導体v14のそれぞれは、柱状導体v14cを含んでいる。複数の柱状導体v14c(第4柱状導体)は、信号導体層20(第1信号導体層)より下(Z軸の負方向)に位置する絶縁体層16cを上下方向(Z軸方向)に貫通している。これにより、複数の柱状導体v14c(第4柱状導体)は、グランド導体層24(第1グランド導体層)より上(Z軸の正方向)に位置している。上下方向(Z軸方向)に見て、複数の柱状導体v14c(第4柱状導体)の中心は、信号導体層20(第1信号導体層)より後(Y軸の負方向)に位置し、かつ、左右方向(X軸方向)に延びる第4列L4に所定ピッチP0で並んでいる。 Here, each of the plurality of columnar conductors v14 includes a columnar conductor v14c. The plurality of columnar conductors v14c (fourth columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v14c (fourth columnar conductor) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis). When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v14c (fourth columnar conductor) are located after the signal conductor layer 20 (first signal conductor layer) (in the negative direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a fourth row L4 extending in the left-right direction (X-axis direction).
 前記の通り、複数の柱状導体v14c(第4柱状導体)は、複数の柱状導体v14の一部分であるので、グランド導体層22(第5グランド導体層)及びグランド導体層24(第1グランド導体層)に電気的に接続されている。また、複数の柱状導体v14c(第4柱状導体)の上端(Z軸の正方向の端)は、グランド導体層34に接している。従って、複数の柱状導体v14cは、グランド導体層34に電気的に接続されている。 As mentioned above, the plurality of columnar conductors v14c (fourth columnar conductor) are a part of the plurality of columnar conductors v14, so the ground conductor layer 22 (fifth ground conductor layer) and the ground conductor layer 24 (first ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v14c (fourth columnar conductors) are in contact with the ground conductor layer 34. Therefore, the plurality of columnar conductors v14c are electrically connected to the ground conductor layer 34.
 また、図2に示すように、上下方向(Z軸方向)に見て、複数の柱状導体v13c(第3柱状導体)の中心の左右方向(X軸)における位置を示す複数の第3X軸位置p3と複数の柱状導体v14c(第4柱状導体)の中心の左右方向(X軸)における位置を示す複数の第4X軸位置p4とは、X軸方向に交互に並んでいる。本実施形態では、複数の第3X軸位置p3と複数の第4X軸位置p4とは、X軸方向に所定ピッチP0の半分のピッチで交互に並んでいる。 In addition, as shown in FIG. 2, a plurality of third X-axis positions indicate the positions of the centers of the plurality of columnar conductors v13c (third columnar conductors) in the left-right direction (X-axis) when viewed in the vertical direction (Z-axis direction). p3 and a plurality of fourth X-axis positions p4 indicating the positions of the centers of the plurality of columnar conductors v14c (fourth columnar conductors) in the left-right direction (X-axis) are arranged alternately in the X-axis direction. In this embodiment, the plurality of third X-axis positions p3 and the plurality of fourth X-axis positions p4 are alternately arranged in the X-axis direction at a pitch that is half the predetermined pitch P0.
 また、複数の柱状導体v13c(第3柱状導体)は、前後方向(Y軸方向)に見て、複数の柱状導体v11c(第1柱状導体)と重なっている。すなわち、第3X軸位置p3は、第1X軸位置p1と一致している。柱状導体v14c(第4柱状導体)は、前後方向(Y軸方向)に見て、柱状導体v12c(第2柱状導体)と重なっている。すなわち、第4X軸位置p4は、第2X軸位置p2と一致している。 Furthermore, the plurality of columnar conductors v13c (third columnar conductors) overlap with the plurality of columnar conductors v11c (first columnar conductors) when viewed in the front-back direction (Y-axis direction). That is, the third X-axis position p3 matches the first X-axis position p1. The columnar conductor v14c (fourth columnar conductor) overlaps with the columnar conductor v12c (second columnar conductor) when viewed in the front-rear direction (Y-axis direction). That is, the fourth X-axis position p4 coincides with the second X-axis position p2.
 また、柱状導体v13c(第3柱状導体)の中心から複数の柱状導体v14c(第4柱状導体)の内の柱状導体v13c(第3柱状導体)に最も近い柱状導体v14c(第4柱状導体)の中心までの距離l2は、第3列L3と第4列L4との左右方向(Y軸方向)の距離d12より長い。柱状導体v13c(第3柱状導体)の中心から複数の柱状導体v14c(第4柱状導体)の内の柱状導体v13c(第3柱状導体)に最も近い柱状導体v14c(第4柱状導体)の中心までの距離l2は、柱状導体v13c(第3柱状導体)の直径r3及び柱状導体v14c(第4柱状導体)の直径r4より長い。本実施形態では、直径r4は、直径r3と等しい。 Also, the columnar conductor v14c (fourth columnar conductor) closest to the columnar conductor v13c (third columnar conductor) among the plurality of columnar conductors v14c (fourth columnar conductor) from the center of the columnar conductor v13c (third columnar conductor). The distance l2 to the center is longer than the distance d12 in the left-right direction (Y-axis direction) between the third row L3 and the fourth row L4. From the center of columnar conductor v13c (third columnar conductor) to the center of columnar conductor v14c (fourth columnar conductor) closest to columnar conductor v13c (third columnar conductor) among the plurality of columnar conductors v14c (fourth columnar conductor) The distance l2 is longer than the diameter r3 of the columnar conductor v13c (third columnar conductor) and the diameter r4 of the columnar conductor v14c (fourth columnar conductor). In this embodiment, the diameter r4 is equal to the diameter r3.
 以上のようなグランド導体層22,24,28,30,32,34及び信号端子26a,26bは、例えば、絶縁体層16a~16dの上主面又は下主面に設けられた金属箔にエッチングが施されることにより形成されている。金属箔は、例えば、銅箔である。 The ground conductor layers 22, 24, 28, 30, 32, 34 and signal terminals 26a, 26b as described above are formed by etching metal foil provided on the upper or lower main surface of the insulator layers 16a to 16d, for example. It is formed by applying The metal foil is, for example, copper foil.
 また、柱状導体v1,v2,v11~v14は、例えば、ビアホール導体である。ビアホール導体は、絶縁体層16a~16dに貫通孔を形成し、貫通孔に導電性ペーストを充填し、導電性ペーストを焼結させることにより作製される。柱状導体v1,v2,v11~v14の材料は、樹脂と金属との混合物である。 Further, the columnar conductors v1, v2, v11 to v14 are, for example, via hole conductors. The via hole conductor is manufactured by forming through holes in the insulator layers 16a to 16d, filling the through holes with conductive paste, and sintering the conductive paste. The material of the columnar conductors v1, v2, v11 to v14 is a mixture of resin and metal.
 保護層18aは、積層体12の上主面を覆っている。これにより、保護層18aは、グランド導体層22を保護している。ただし、保護層18aには、開口h1~h6が設けられている。開口h1は、上下方向に見て、信号端子26aと重なっている。これにより、信号端子26aは、多層基板10から外部に露出している。開口h2は、開口h1の前に位置している。グランド導体層22の一部分は、開口h2を介して多層基板10から外部に露出している。開口h3は、開口h1の後に位置している。グランド導体層22の一部分は、開口h3を介して多層基板10から外部に露出している。これにより、グランド導体層22の一部分は、グランド端子として機能する。なお、開口h4~h6の構造は、開口h1~h3の構造と左右対称であるので説明を省略する。 The protective layer 18a covers the upper main surface of the laminate 12. Thereby, the protective layer 18a protects the ground conductor layer 22. However, the protective layer 18a is provided with openings h1 to h6. The opening h1 overlaps the signal terminal 26a when viewed in the vertical direction. Thereby, the signal terminal 26a is exposed to the outside from the multilayer substrate 10. The opening h2 is located in front of the opening h1. A portion of the ground conductor layer 22 is exposed to the outside from the multilayer substrate 10 through the opening h2. The opening h3 is located after the opening h1. A portion of the ground conductor layer 22 is exposed to the outside from the multilayer substrate 10 via the opening h3. Thereby, a portion of the ground conductor layer 22 functions as a ground terminal. Note that the structure of the openings h4 to h6 is symmetrical to the structure of the openings h1 to h3, so a description thereof will be omitted.
 保護層18bは、積層体12の下主面を覆っている。これにより、保護層18bは、グランド導体層24を保護している。保護層18a,18bは、例えば、レジスト層である。 The protective layer 18b covers the lower main surface of the laminate 12. Thereby, the protective layer 18b protects the ground conductor layer 24. The protective layers 18a and 18b are, for example, resist layers.
 以上のような多層基板10は、可撓性を有している。従って、図4に示すように、多層基板10は、屈曲できる。具体的には、多層基板10は、第1区間A1、第2区間A2及び第3区間A3を有している。第1区間A1、第2区間A2及び第3区間A3は、多層基板10が屈曲していない状態では、左から右へとこの順に並んでいる。そして、第2区間A2は、第1区間A1に対して下方向に屈曲している。一方、第1区間A1及び第3区間A3は、屈曲していない。ただし、第1区間A1及び第3区間A3は、僅かに屈曲していてもよい。この場合、第1区間A1の曲率半径及び第3区間A3の曲率半径は、第2区間A2の曲率半径より大きい。なお、多層基板10は、弾性変形により屈曲していてもよいし、塑性変形により屈曲していてもよいし、弾性変形及び塑性変形により屈曲していてもよい。 The multilayer substrate 10 as described above has flexibility. Therefore, as shown in FIG. 4, the multilayer substrate 10 can be bent. Specifically, the multilayer substrate 10 has a first section A1, a second section A2, and a third section A3. The first section A1, the second section A2, and the third section A3 are arranged in this order from left to right when the multilayer substrate 10 is not bent. The second section A2 is bent downward with respect to the first section A1. On the other hand, the first section A1 and the third section A3 are not bent. However, the first section A1 and the third section A3 may be slightly bent. In this case, the radius of curvature of the first section A1 and the radius of curvature of the third section A3 are larger than the radius of curvature of the second section A2. Note that the multilayer substrate 10 may be bent due to elastic deformation, may be bent due to plastic deformation, or may be bent due to elastic deformation and plastic deformation.
[効果]
 多層基板10によれば、シールド性の向上を図ることができる。より詳細には、特許文献1に記載の伝送線路のシールド性を向上させる方法としては、例えば、複数のGNDビアの前後方向のピッチを短くすることが挙げられる。この場合、絶縁体層に剥離が生じるという問題、及び、伝送線路の製造の困難性が高くなるという問題が発生する。
[effect]
According to the multilayer substrate 10, it is possible to improve shielding performance. More specifically, as a method for improving the shielding performance of the transmission line described in Patent Document 1, for example, shortening the pitch of the plurality of GND vias in the front-rear direction can be mentioned. In this case, problems arise in that the insulator layer peels off and that it becomes more difficult to manufacture the transmission line.
 そこで、多層基板10では、複数の柱状導体v11cと複数の柱状導体v12cとは、ジグザグに並んでいる。具体的には、上下方向に見て、複数の柱状導体v11cの中心は、第1列L1に所定ピッチP0で並んでいる。上下方向に見て、複数の柱状導体v12cの中心は、第2列L2に所定ピッチP0で並んでいる。そして、第2列L2は、第1列L1より後に位置している。更に、上下方向に見て、複数の柱状導体v11cの中心の左右方向における位置を示す複数の第1X軸位置p1と複数の柱状導体v12cの中心の左右方向における位置を示す複数の第2X軸位置p2とは、左右方向に交互に並んでいる。複数の柱状導体v11cと複数の柱状導体v12cとがジグザグに並ぶことにより、柱状導体v11cの中心から柱状導体v12cの中心までの距離l1を短くすることなく、左右方向における柱状導体v11cと柱状導体v12cとの距離を短くできる。その結果、柱状導体v11cと柱状導体v12cとの間をノイズが通過しにくくなる。よって、多層基板10によれば、シールド性の向上を図ることができる。更に、柱状導体v11cの中心から柱状導体v12cの中心までの距離l1を短くしなくてもよいので、絶縁体層16a~16dに剥離が発生することを抑制できると共に、多層基板10の製造の困難性が高くなりにくい。 Therefore, in the multilayer substrate 10, the plurality of columnar conductors v11c and the plurality of columnar conductors v12c are arranged in a zigzag pattern. Specifically, when viewed in the vertical direction, the centers of the plurality of columnar conductors v11c are lined up in the first row L1 at a predetermined pitch P0. When viewed in the vertical direction, the centers of the plurality of columnar conductors v12c are lined up in the second row L2 at a predetermined pitch P0. The second row L2 is located after the first row L1. Furthermore, when viewed in the vertical direction, a plurality of first X-axis positions p1 indicating the positions in the left-right direction of the centers of the plurality of columnar conductors v11c, and a plurality of second X-axis positions indicating the positions in the left-right direction of the centers of the plurality of columnar conductors v12c. p2 are arranged alternately in the left and right direction. By arranging the plurality of columnar conductors v11c and the plurality of columnar conductors v12c in a zigzag pattern, the columnar conductors v11c and columnar conductors v12c in the left-right direction can be arranged without shortening the distance l1 from the center of the columnar conductor v11c to the center of the columnar conductor v12c. You can shorten the distance between As a result, it becomes difficult for noise to pass between the columnar conductor v11c and the columnar conductor v12c. Therefore, according to the multilayer substrate 10, it is possible to improve shielding performance. Furthermore, since it is not necessary to shorten the distance l1 from the center of the columnar conductor v11c to the center of the columnar conductor v12c, it is possible to suppress the occurrence of peeling in the insulator layers 16a to 16d, and also to reduce the difficulty in manufacturing the multilayer substrate 10. It is difficult to become sexually active.
 多層基板10では、複数の柱状導体v13cと複数の柱状導体v14cとは、複数の柱状導体v11cと複数の柱状導体v12cと同様に、ジグザグに並んでいる。これにより、多層基板10によれば、シールド性の向上を図ることができる。更に、絶縁体層16a~16dに剥離が発生することを抑制できると共に、多層基板10の製造の困難性が高くなりにくい。 In the multilayer substrate 10, the plurality of columnar conductors v13c and the plurality of columnar conductors v14c are arranged in a zigzag pattern, similar to the plurality of columnar conductors v11c and the plurality of columnar conductors v12c. Thereby, according to the multilayer substrate 10, it is possible to improve shielding performance. Furthermore, it is possible to suppress the occurrence of peeling in the insulating layers 16a to 16d, and the difficulty in manufacturing the multilayer substrate 10 is less likely to increase.
 多層基板10では、信号導体層20に発生する特性インピーダンスが所定の特性インピーダンスからずれることが抑制される。より詳細には、柱状導体v11cは、柱状導体v12cより前に位置している。柱状導体v13cは、柱状導体v14cより前に位置している。そして、柱状導体v13cは、左右方向に見て、柱状導体v11cと重なっている。柱状導体v14cは、左右方向に見て、柱状導体v12cと重なっている。従って、柱状導体v11cと柱状導体v13cとの距離と、柱状導体v12cと柱状導体v14cとの距離とが近い値を取るようになる。その結果、信号導体層20と柱状導体v11cとの間に発生する容量と信号導体層20と柱状導体v13cとの間に発生する容量との合計と、信号導体層20と柱状導体v12cとの間に発生する容量と信号導体層20と柱状導体v14cとの間に発生する容量との合計とが近い値を取るようになる。その結果、柱状導体v11c,v13cが設けられている区間において信号導体層20に発生する特性インピーダンスと、柱状導体v12c,v14cが設けられている区間において信号導体層20に発生する特性インピーダンスとが近い値を取るようになる。よって、多層基板10では、信号導体層20に発生する特性インピーダンスが所定の特性インピーダンス(例えば、50Ω)からずれることが抑制される。 In the multilayer substrate 10, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance is suppressed. More specifically, the columnar conductor v11c is located in front of the columnar conductor v12c. The columnar conductor v13c is located in front of the columnar conductor v14c. The columnar conductor v13c overlaps the columnar conductor v11c when viewed in the left-right direction. The columnar conductor v14c overlaps with the columnar conductor v12c when viewed in the left-right direction. Therefore, the distance between the columnar conductor v11c and the columnar conductor v13c and the distance between the columnar conductor v12c and the columnar conductor v14c become close values. As a result, the sum of the capacitance that occurs between the signal conductor layer 20 and the columnar conductor v11c, the capacitance that occurs between the signal conductor layer 20 and the columnar conductor v13c, and the capacitance that occurs between the signal conductor layer 20 and the columnar conductor v12c. The sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v14c becomes close to the total value. As a result, the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided is close to the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided. It will take a value. Therefore, in the multilayer substrate 10, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance (for example, 50Ω) is suppressed.
 特に、多層基板10では、第2列L2と第4列L4との左右方向の距離d2は、第1列L1と第3列L3との左右方向の距離d1と等しい。信号導体層20と柱状導体v11cとの間に発生する容量と信号導体層20と柱状導体v13cとの間に発生する容量との合計と、信号導体層20と柱状導体v12cとの間に発生する容量と信号導体層20と柱状導体v14cとの間に発生する容量との合計とが更に近い値を取るようになる。その結果、柱状導体v11c,v13cが設けられている区間において信号導体層20に発生する特性インピーダンスと、柱状導体v12c,v14cが設けられている区間において信号導体層20に発生する特性インピーダンスとが更に近い値を取るようになる。よって、多層基板10では、信号導体層20に発生する特性インピーダンスが所定の特性インピーダンスからずれることが効果的に抑制される。 In particular, in the multilayer substrate 10, the distance d2 in the left-right direction between the second row L2 and the fourth row L4 is equal to the distance d1 in the left-right direction between the first row L1 and the third row L3. The sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v11c, the capacitance generated between the signal conductor layer 20 and the columnar conductor v13c, and the capacitance generated between the signal conductor layer 20 and the columnar conductor v12c. The sum of the capacitance and the capacitance generated between the signal conductor layer 20 and the columnar conductor v14c becomes closer to each other. As a result, the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided and the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided are further increased. The values will be close to each other. Therefore, in the multilayer substrate 10, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance is effectively suppressed.
 多層基板10では、信号導体層20(第1信号導体層)と第3列L3との左右方向(Y軸方向)の距離L13は、信号導体層20(第1信号導体層)と第2列L2との左右方向(Y軸方向)の距離L12と等しい。信号導体層20(第1信号導体層)と第4列L4との左右方向(Y軸方向)の距離L14は、信号導体層20(第1信号導体層)と第1列L1との左右方向(Y軸方向)の距離L11と等しい。これにより、信号導体層20と柱状導体v11cとの間に発生する容量と信号導体層20と柱状導体v13cとの間に発生する容量との合計と、信号導体層20と柱状導体v12cとの間に発生する容量と信号導体層20と柱状導体v14cとの間に発生する容量との合計とが等しくなる。その結果、柱状導体v11c,v13cが設けられている区間において信号導体層20に発生する特性インピーダンスと、柱状導体v12c,v14cが設けられている区間において信号導体層20に発生する特性インピーダンスとが等しくなる。よって、多層基板10では、信号導体層20に発生する特性インピーダンスが所定の特性インピーダンスからずれることが抑制される。 In the multilayer substrate 10, the distance L13 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the third row L3 is the distance L13 between the signal conductor layer 20 (first signal conductor layer) and the second row L3. It is equal to the distance L12 in the left-right direction (Y-axis direction) from L2. The distance L14 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the fourth row L4 is the distance L14 in the left-right direction (Y-axis direction) between the signal conductor layer 20 (first signal conductor layer) and the first row L1. It is equal to the distance L11 (in the Y-axis direction). As a result, the sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v11c, the capacitance generated between the signal conductor layer 20 and the columnar conductor v13c, and the capacitance generated between the signal conductor layer 20 and the columnar conductor v12c. The sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v14c becomes equal. As a result, the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided is equal to the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided. Become. Therefore, in the multilayer substrate 10, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance is suppressed.
 多層基板10では、信号導体層20が直線形状を有している。これにより、信号導体層20の長さが短くなるので、信号導体層20の直流抵抗値が低減される。 In the multilayer substrate 10, the signal conductor layer 20 has a linear shape. As a result, the length of the signal conductor layer 20 is shortened, so that the DC resistance value of the signal conductor layer 20 is reduced.
(第1変形例)
 以下に、第1変形例に係る多層基板10aについて図面を参照しながら説明する。図5は、多層基板10aの絶縁体層16cの上面図である。
(First modification)
A multilayer substrate 10a according to a first modification will be described below with reference to the drawings. FIG. 5 is a top view of the insulator layer 16c of the multilayer substrate 10a.
 多層基板10aは、信号導体層20が蛇行している点において多層基板10と相違する。蛇行の周期は、所定ピッチP0である。これにより、信号導体層20から柱状導体v11cまでの距離L111と信号導体層20から柱状導体v13cまでの距離L113とが等しくなる。信号導体層20から柱状導体v12cまでの距離L112と信号導体層20から柱状導体v14cまでの距離L114とが等しくなる。これにより、信号導体層20と柱状導体v11cとの間に発生する容量と信号導体層20と柱状導体v13cとの間に発生する容量との合計と、信号導体層20と柱状導体v12cとの間に発生する容量と信号導体層20と柱状導体v14cとの間に発生する容量との合計とが等しくなる。その結果、柱状導体v11c,v13cが設けられている区間において信号導体層20に発生する特性インピーダンスと、柱状導体v12c,v14cが設けられている区間において信号導体層20に発生する特性インピーダンスとが等しくなる。よって、多層基板10aでは、信号導体層20に発生する特性インピーダンスが所定の特性インピーダンスからずれることが抑制される。なお、多層基板10aのその他の構造は、多層基板10と同じであるので説明を省略する。 The multilayer substrate 10a differs from the multilayer substrate 10 in that the signal conductor layer 20 is meandering. The meandering period is a predetermined pitch P0. Thereby, the distance L111 from the signal conductor layer 20 to the columnar conductor v11c becomes equal to the distance L113 from the signal conductor layer 20 to the columnar conductor v13c. The distance L112 from the signal conductor layer 20 to the columnar conductor v12c is equal to the distance L114 from the signal conductor layer 20 to the columnar conductor v14c. As a result, the sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v11c, the capacitance generated between the signal conductor layer 20 and the columnar conductor v13c, and the capacitance generated between the signal conductor layer 20 and the columnar conductor v12c. The sum of the capacitance generated between the signal conductor layer 20 and the columnar conductor v14c becomes equal. As a result, the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided is equal to the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided. Become. Therefore, in the multilayer substrate 10a, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance is suppressed. Note that the other structure of the multilayer substrate 10a is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
(第2変形例)
 以下に、第2変形例に係る多層基板10bについて図面を参照しながら説明する。図6は、多層基板10bの絶縁体層16cの上面図である。
(Second modification)
A multilayer substrate 10b according to a second modification will be described below with reference to the drawings. FIG. 6 is a top view of the insulator layer 16c of the multilayer substrate 10b.
 多層基板10bは、前後方向に見て、複数の柱状導体v13cが、前後方向に見て、複数の柱状導体v11cと重なっていない点、及び、柱状導体v14cが、左右方向に見て、柱状導体v12cと重なっていない点において多層基板10と相違する。すなわち、第3X軸位置p3は、第1X軸位置p1と一致していない。第4X軸位置p4は、第2X軸位置p2と一致していない。 In the multilayer board 10b, the plurality of columnar conductors v13c do not overlap with the plurality of columnar conductors v11c when seen in the front-rear direction, and the columnar conductors v14c do not overlap with the columnar conductors v11c when seen in the left-right direction. It differs from the multilayer substrate 10 in that it does not overlap with v12c. That is, the third X-axis position p3 does not match the first X-axis position p1. The fourth X-axis position p4 does not match the second X-axis position p2.
 ただし、第3X軸位置p3は、第1X軸位置p1に対して左右方向に大きくずれていてはいけない。従って、第3X軸位置p3から複数の第1X軸位置p1の内の第3X軸位置p3に最も近い第1X軸位置p1までの距離D1は、第3X軸位置p3から複数の第2X軸位置p2の内の第3X軸位置p3に最も近い第2X軸位置p2までの距離D2より短い。本実施形態では、第3X軸位置p3から複数の第1X軸位置p1の内の第3X軸位置p3に最も近い第1X軸位置p1までの距離D1は、所定ピッチP0の1/4以下である。更に、第3X軸位置p3から複数の第1X軸位置p1の内の第3X軸位置p3に最も近い第1X軸位置p1までの距離D1は、柱状導体v13c(第3柱状導体)から複数の柱状導体v14c(第4柱状導体)の内の柱状導体v13c(第3柱状導体)に最も近い柱状導体v14c(第4柱状導体)までのX軸方向の距離D11の半分以下である。 However, the third X-axis position p3 must not deviate significantly from the first X-axis position p1 in the left-right direction. Therefore, the distance D1 from the third X-axis position p3 to the first X-axis position p1 closest to the third X-axis position p3 among the plurality of first X-axis positions p1 is the distance D1 from the third X-axis position p3 to the plurality of second X-axis positions p2. It is shorter than the distance D2 from the third X-axis position p3 to the second X-axis position p2 which is closest to the third X-axis position p3. In this embodiment, the distance D1 from the third X-axis position p3 to the first X-axis position p1 closest to the third X-axis position p3 among the plurality of first X-axis positions p1 is 1/4 or less of the predetermined pitch P0. . Furthermore, the distance D1 from the third X-axis position p3 to the first X-axis position p1 closest to the third X-axis position p3 among the plurality of first X-axis positions p1 is the distance D1 from the columnar conductor v13c (third columnar conductor) to the plurality of columnar conductors It is less than half of the distance D11 in the X-axis direction to the columnar conductor v14c (fourth columnar conductor) closest to the columnar conductor v13c (third columnar conductor) among the conductors v14c (fourth columnar conductor).
 同様に、第4X軸位置p4は、第2X軸位置p2に対して左右方向に大きくずれていてはいけない。従って、第4X軸位置p4から複数の第2X軸位置p2の内の第4X軸位置p4に最も近い第2X軸位置p2までの距離D3は、第4X軸位置p4から複数の第1X軸位置p1の内の第4X軸位置p4に最も近い第1X軸位置p1までの距離D4より短い。本実施形態では、第4X軸位置p4から複数の第2X軸位置p2の内の第4X軸位置p4に最も近い第2X軸位置p2までの距離D3は、所定ピッチP0の1/4以下である。更に、第4X軸位置p4から複数の第2X軸位置p2の内の第4X軸位置p4に最も近い第2X軸位置p2までの距離D3は、柱状導体v13c(第3柱状導体)から複数の柱状導体v14c(第4柱状導体)の内の柱状導体v13c(第3柱状導体)に最も近い柱状導体v14c(第4柱状導体)までの左右方向(X軸方向)の距離D11の半分以下である。 Similarly, the fourth X-axis position p4 must not deviate significantly from the second X-axis position p2 in the left-right direction. Therefore, the distance D3 from the fourth X-axis position p4 to the second X-axis position p2 closest to the fourth X-axis position p4 among the plurality of second X-axis positions p2 is the distance D3 from the fourth X-axis position p4 to the plurality of first X-axis positions p1. It is shorter than the distance D4 to the first X-axis position p1 which is closest to the fourth X-axis position p4. In this embodiment, the distance D3 from the fourth X-axis position p4 to the second X-axis position p2 closest to the fourth X-axis position p4 among the plurality of second X-axis positions p2 is 1/4 or less of the predetermined pitch P0. . Furthermore, the distance D3 from the fourth X-axis position p4 to the second X-axis position p2 closest to the fourth X-axis position p4 among the plurality of second X-axis positions p2 is the distance D3 from the columnar conductor v13c (third columnar conductor) to the second It is less than half of the distance D11 in the left-right direction (X-axis direction) to the columnar conductor v14c (fourth columnar conductor) closest to the columnar conductor v13c (third columnar conductor) among the conductors v14c (fourth columnar conductor).
 多層基板10bによれば、第3X軸位置p3の第1X軸位置p1に対するずれ量が制限されている。これにより、柱状導体v11c,v13cが設けられている区間において信号導体層20に発生する特性インピーダンスと、柱状導体v12c,v14cが設けられている区間において信号導体層20に発生する特性インピーダンスとが近い値を取るようになる。よって、多層基板10bでは、信号導体層20に発生する特性インピーダンスが所定の特性インピーダンスからずれることが抑制される。多層基板10bのその他の構造は、多層基板10と同じである。 According to the multilayer substrate 10b, the amount of deviation of the third X-axis position p3 from the first X-axis position p1 is limited. As a result, the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v11c and v13c are provided is close to the characteristic impedance generated in the signal conductor layer 20 in the section where the columnar conductors v12c and v14c are provided. It will take a value. Therefore, in the multilayer substrate 10b, deviation of the characteristic impedance generated in the signal conductor layer 20 from a predetermined characteristic impedance is suppressed. The other structure of the multilayer substrate 10b is the same as that of the multilayer substrate 10.
(第3変形例)
 以下に、第3変形例に係る多層基板10cについて図面を参照しながら説明する。図7は、多層基板10cの絶縁体層16cの上面図である。
(Third modification)
A multilayer substrate 10c according to a third modification will be described below with reference to the drawings. FIG. 7 is a top view of the insulator layer 16c of the multilayer substrate 10c.
 多層基板10cは、柱状導体v11c(第1柱状導体)の直径r1が、柱状導体v12c(第2柱状導体)の直径r2より大きい点、及び、柱状導体v14c(第4柱状導体)の直径r4が、柱状導体v13c(第3柱状導体)の直径r3より大きい点において多層基板10と相違する。すなわち、柱状導体v11c,v12cの内の信号導体層20から遠くに位置する柱状導体v11cの直径が大きい。柱状導体v13c,v14cの内の信号導体層20から遠くに位置する柱状導体v14cの直径が大きい。これにより、信号導体層20と柱状導体v11c~v14cとの間に発生する容量の増大を抑制しつつ、シールド性の向上を図ることができる。多層基板10cのその他の構造は、多層基板10と同じであるので説明を省略する。 The multilayer board 10c has a diameter r1 of the columnar conductor v11c (first columnar conductor) larger than a diameter r2 of the columnar conductor v12c (second columnar conductor), and a diameter r4 of the columnar conductor v14c (fourth columnar conductor). , is different from the multilayer substrate 10 in that the diameter r3 of the columnar conductor v13c (third columnar conductor) is larger than that of the columnar conductor v13c (third columnar conductor). That is, among the columnar conductors v11c and v12c, the columnar conductor v11c located far from the signal conductor layer 20 has a larger diameter. Among the columnar conductors v13c and v14c, the columnar conductor v14c located far from the signal conductor layer 20 has a larger diameter. Thereby, shielding performance can be improved while suppressing an increase in capacitance generated between the signal conductor layer 20 and the columnar conductors v11c to v14c. The other structure of the multilayer substrate 10c is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
(第4変形例)
 以下に、第4変形例に係る多層基板10dについて図面を参照しながら説明する。図8は、多層基板10dの絶縁体層16cの上面図である。
(Fourth modification)
A multilayer substrate 10d according to a fourth modification will be described below with reference to the drawings. FIG. 8 is a top view of the insulator layer 16c of the multilayer substrate 10d.
 多層基板10dは、前後方向(Y軸方向)に見て、柱状導体v12c(第2柱状導体)の一部分は、柱状導体v11c(第1柱状導体)の一部分と重なっている点、及び、前後方向(Y軸方向)に見て、柱状導体v14c(第4柱状導体)の一部分は、柱状導体v13c(第3柱状導体)の一部分と重なっている点において多層基板10と相違する。これにより、多層基板10dでは、シールド性の向上を図ることができる。なお、多層基板10dのその他の構造は、多層基板10と同じであるので説明を省略する。 The multilayer board 10d has the following points: when viewed in the front-rear direction (Y-axis direction), a portion of the columnar conductor v12c (second columnar conductor) overlaps a portion of the columnar conductor v11c (first columnar conductor); This differs from the multilayer substrate 10 in that a portion of the columnar conductor v14c (fourth columnar conductor) overlaps a portion of the columnar conductor v13c (third columnar conductor) when viewed in the Y-axis direction. Thereby, in the multilayer substrate 10d, shielding performance can be improved. Note that the other structure of the multilayer substrate 10d is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
(第5変形例)
 以下に、第5変形例に係る多層基板10eについて図面を参照しながら説明する。図9は、多層基板10eの絶縁体層16cの上面図である。
(Fifth modification)
A multilayer substrate 10e according to a fifth modification will be described below with reference to the drawings. FIG. 9 is a top view of the insulator layer 16c of the multilayer substrate 10e.
 多層基板10eは、グランド導体層32,34の形状において多層基板10と相違する。より詳細には、第1X軸位置p1におけるグランド導体層32(第2グランド導体層)と信号導体層20(第1信号導体層)との前後方向(Y軸方向)の距離D111は、第2X軸位置p2におけるグランド導体層32(第2グランド導体層)と信号導体層20(第1信号導体層)との前後方向(Y軸方向)の距離D112より長い。また、第4X軸位置p4におけるグランド導体層34と信号導体層20との前後方向の距離D114は、第3X軸位置p3におけるグランド導体層34と信号導体層20との前後方向の距離D113より長い。これにより、信号導体層20とグランド導体層32,34との間に発生する容量を低減することができる。なお、多層基板10eのその他の構造は、多層基板10と同じであるので説明を省略する。また、グランド導体層28,30も、グランド導体層32,34と同じ形状を有していてもよい。 The multilayer substrate 10e differs from the multilayer substrate 10 in the shapes of the ground conductor layers 32 and 34. More specifically, the distance D111 in the front-rear direction (Y-axis direction) between the ground conductor layer 32 (second ground conductor layer) and the signal conductor layer 20 (first signal conductor layer) at the first X-axis position p1 is It is longer than the distance D112 in the front-rear direction (Y-axis direction) between the ground conductor layer 32 (second ground conductor layer) and the signal conductor layer 20 (first signal conductor layer) at the axial position p2. Further, the distance D114 in the front-rear direction between the ground conductor layer 34 and the signal conductor layer 20 at the fourth X-axis position p4 is longer than the distance D113 in the front-rear direction between the ground conductor layer 34 and the signal conductor layer 20 at the third X-axis position p3. . Thereby, the capacitance generated between the signal conductor layer 20 and the ground conductor layers 32 and 34 can be reduced. Note that the other structure of the multilayer substrate 10e is the same as that of the multilayer substrate 10, so a description thereof will be omitted. Further, the ground conductor layers 28 and 30 may also have the same shape as the ground conductor layers 32 and 34.
(第6変形例)
 以下に、第6変形例に係る多層基板10fについて図面を参照しながら説明する。図10は、多層基板10fの絶縁体層16cの上面図である。
(Sixth variation)
A multilayer substrate 10f according to a sixth modification will be described below with reference to the drawings. FIG. 10 is a top view of the insulator layer 16c of the multilayer substrate 10f.
 多層基板10fは、グランド導体層32,34の代わりに、複数のグランド導体層32a、複数のグランド導体層32b、複数のグランド導体層34a及び複数のグランド導体層34bを備えている点において多層基板10と相違する。複数のグランド導体層32a(第3グランド導体層)は、複数の柱状導体v11c(第1柱状導体)の上端(Z軸の正方向の端)のそれぞれと接している。複数のグランド導体層32aは、互いに接していない。複数のグランド導体層32b(第4グランド導体層)は、複数の柱状導体v12c(第2柱状導体)の上端(Z軸の正方向の端)のそれぞれと接している。複数のグランド導体層32bは、互いに接していない。 The multilayer board 10f is a multilayer board in that it includes a plurality of ground conductor layers 32a, a plurality of ground conductor layers 32b, a plurality of ground conductor layers 34a, and a plurality of ground conductor layers 34b instead of the ground conductor layers 32 and 34. It is different from 10. The plurality of ground conductor layers 32a (third ground conductor layer) are in contact with each of the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v11c (first columnar conductors). The plurality of ground conductor layers 32a are not in contact with each other. The plurality of ground conductor layers 32b (fourth ground conductor layer) are in contact with each of the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v12c (second columnar conductors). The plurality of ground conductor layers 32b are not in contact with each other.
 また、複数のグランド導体層34aは、複数の柱状導体v13cの上端のそれぞれと接している。複数のグランド導体層34aは、互いに接していない。複数のグランド導体層34bは、複数の柱状導体v14cの上端のそれぞれと接している。複数のグランド導体層34bは、互いに接していない。グランド導体層32a,32b,34a,34bの面積は、グランド導体層32,24の面積より小さい。従って、多層基板10fによれば、信号導体層20とグランド導体層32a,32b,34a,34bとの間に発生する容量を低減することができる。なお、多層基板10fのその他の構造は、多層基板10と同じであるので説明を省略する。また、多層基板10fは、グランド導体層32a,32b,34a,34bと同じ形状を有するグランド導体層28a,28b,30a,30bを備えていてもよい。 Further, the plurality of ground conductor layers 34a are in contact with each of the upper ends of the plurality of columnar conductors v13c. The plurality of ground conductor layers 34a are not in contact with each other. The plurality of ground conductor layers 34b are in contact with each of the upper ends of the plurality of columnar conductors v14c. The plurality of ground conductor layers 34b are not in contact with each other. The areas of the ground conductor layers 32a, 32b, 34a, and 34b are smaller than the areas of the ground conductor layers 32 and 24. Therefore, according to the multilayer substrate 10f, the capacitance generated between the signal conductor layer 20 and the ground conductor layers 32a, 32b, 34a, and 34b can be reduced. Note that the other structure of the multilayer substrate 10f is the same as that of the multilayer substrate 10, so the description thereof will be omitted. Further, the multilayer substrate 10f may include ground conductor layers 28a, 28b, 30a, 30b having the same shape as the ground conductor layers 32a, 32b, 34a, 34b.
(第7変形例)
 以下に、第7変形例に係る多層基板10gについて図面を参照しながら説明する。図11は、多層基板10gの絶縁体層16cの上面図である。
(Seventh modification)
A multilayer substrate 10g according to a seventh modification will be described below with reference to the drawings. FIG. 11 is a top view of the insulator layer 16c of the multilayer substrate 10g.
 多層基板10gは、信号導体層21、柱状導体v15,v16及びグランド導体層36を更に備えている点において多層基板10と相違する。信号導体層21(第2信号導体層)は、積層体12に設けられている。信号導体層21(第2信号導体層)は、第3列L3及び第4列L4より後(Y軸の負方向)に位置しており、かつ、上下方向(Z軸方向)から見て、信号導体層20(第1信号導体層)と平行な線形状を有している。グランド導体層24(第1グランド導体層 図11では図示せず)は、上下方向(Z軸方向)に見て、信号導体層21(第2信号導体層)と重なっている。 The multilayer board 10g differs from the multilayer board 10 in that it further includes a signal conductor layer 21, columnar conductors v15, v16, and a ground conductor layer 36. The signal conductor layer 21 (second signal conductor layer) is provided in the laminate 12. The signal conductor layer 21 (second signal conductor layer) is located after the third row L3 and the fourth row L4 (in the negative direction of the Y-axis), and when viewed from the vertical direction (Z-axis direction), It has a linear shape parallel to the signal conductor layer 20 (first signal conductor layer). The ground conductor layer 24 (first ground conductor layer, not shown in FIG. 11) overlaps the signal conductor layer 21 (second signal conductor layer) when viewed in the vertical direction (Z-axis direction).
 上下方向(Z軸方向)に見て、複数の柱状導体v15の中心は、信号導体層21より後に位置している。複数の柱状導体v15の中心は、左右方向に延びる第5列L5に所定ピッチP0で並んでいる。複数の柱状導体v15は、絶縁体層15a~15dを上下方向に貫通する4つの柱状導体が上下方向に連なった構造を有している。これにより、複数の柱状導体v15は、グランド導体層22とグランド導体層24とグランド導体層36とを電気的に接続している。 When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v15 are located behind the signal conductor layer 21. The centers of the plurality of columnar conductors v15 are arranged at a predetermined pitch P0 in a fifth row L5 extending in the left-right direction. The plurality of columnar conductors v15 have a structure in which four columnar conductors that vertically penetrate the insulating layers 15a to 15d are connected in the vertical direction. Thereby, the plurality of columnar conductors v15 electrically connect the ground conductor layer 22, the ground conductor layer 24, and the ground conductor layer 36.
 グランド導体層36は、積層体12に設けられている。グランド導体層36は、絶縁体層16cの上主面に位置している。グランド導体層36は、信号導体層21より後に位置している。グランド導体層36は、左右方向に延びる線形状を有している。 The ground conductor layer 36 is provided on the laminate 12. The ground conductor layer 36 is located on the upper main surface of the insulator layer 16c. The ground conductor layer 36 is located after the signal conductor layer 21. The ground conductor layer 36 has a linear shape extending in the left-right direction.
 ここで、複数の柱状導体v15のそれぞれは、柱状導体v15cを含んでいる。複数の柱状導体v15c(第5柱状導体)は、信号導体層21(第2信号導体層)より下(Z軸の負方向)に位置する絶縁体層16cを上下方向(Z軸方向)に貫通している。これにより、複数の柱状導体v15c(第5柱状導体)は、グランド導体層24(第1グランド導体層)より上(Z軸の正方向)に位置している。上下方向(Z軸方向)に見て、複数の柱状導体v15c(第5柱状導体)の中心は、信号導体層21(第2信号導体層)より後(Y軸の負方向)に位置し、かつ、左右方向(X軸方向)に延びる第5列L5に所定ピッチP0で並んでいる。 Here, each of the plurality of columnar conductors v15 includes a columnar conductor v15c. The plurality of columnar conductors v15c (fifth columnar conductors) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 21 (second signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v15c (fifth columnar conductor) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis). When viewed in the vertical direction (Z-axis direction), the center of the plurality of columnar conductors v15c (fifth columnar conductor) is located after the signal conductor layer 21 (second signal conductor layer) (in the negative direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a fifth row L5 extending in the left-right direction (X-axis direction).
 前記の通り、複数の柱状導体v15c(第5柱状導体)は、複数の柱状導体v15の一部分であるので、グランド導体層22(第1グランド導体層)及びグランド導体層24(第5グランド導体層)に電気的に接続されている。また、複数の柱状導体v15c(第5柱状導体)の上端(Z軸の正方向の端)は、グランド導体層36に接している。従って、複数の柱状導体v15cは、グランド導体層36に電気的に接続されている。 As mentioned above, the plurality of columnar conductors v15c (fifth columnar conductors) are a part of the plurality of columnar conductors v15, so the ground conductor layer 22 (first ground conductor layer) and the ground conductor layer 24 (fifth ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v15c (fifth columnar conductors) are in contact with the ground conductor layer 36. Therefore, the plurality of columnar conductors v15c are electrically connected to the ground conductor layer 36.
 上下方向(Z軸方向)に見て、複数の柱状導体v16の中心は、信号導体層21より後(Y軸の負方向)に位置している。複数の柱状導体v16の中心は、左右方向(X軸方向)に延びる第6列L6に所定ピッチP0で並んでいる。第6列L6は、第5列L5より後(Y軸の負方向)に位置している。複数の柱状導体v16は、絶縁体層16a~16dを上下方向に貫通する4つの柱状導体が上下方向に連なった構造を有している。これにより、複数の柱状導体v16は、グランド導体層22とグランド導体層24とを電気的に接続している。 When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v16 are located behind the signal conductor layer 21 (in the negative direction of the Y-axis). The centers of the plurality of columnar conductors v16 are arranged at a predetermined pitch P0 in a sixth row L6 extending in the left-right direction (X-axis direction). The sixth row L6 is located after the fifth row L5 (in the negative direction of the Y-axis). The plurality of columnar conductors v16 have a structure in which four columnar conductors vertically vertically penetrate through the insulator layers 16a to 16d. Thereby, the plurality of columnar conductors v16 electrically connect the ground conductor layer 22 and the ground conductor layer 24.
 ここで、複数の柱状導体v16のそれぞれは、柱状導体v16cを含んでいる。複数の柱状導体v16c(第6柱状導体)は、信号導体層21(第2信号導体層)より下(Z軸の負方向)に位置する絶縁体層16cを上下方向(Z軸方向)に貫通している。これにより、複数の柱状導体v16c(第6柱状導体)は、グランド導体層24(第1グランド導体層)より上(Z軸の正方向)に位置している。上下方向(Z軸方向)に見て、複数の柱状導体v16c(第6柱状導体)の中心は、信号導体層21(第2信号導体層)より後(Y軸の負方向)に位置し、かつ、左右方向(X軸方向)に延びる第6列L6に所定ピッチP0で並んでいる。 Here, each of the plurality of columnar conductors v16 includes a columnar conductor v16c. The plurality of columnar conductors v16c (sixth columnar conductor) penetrate in the vertical direction (Z-axis direction) through the insulator layer 16c located below the signal conductor layer 21 (second signal conductor layer) (in the negative direction of the Z-axis). are doing. Thereby, the plurality of columnar conductors v16c (sixth columnar conductor) are located above the ground conductor layer 24 (first ground conductor layer) (in the positive direction of the Z-axis). When viewed in the vertical direction (Z-axis direction), the centers of the plurality of columnar conductors v16c (sixth columnar conductor) are located after the signal conductor layer 21 (second signal conductor layer) (in the negative direction of the Y-axis), Further, they are arranged at a predetermined pitch P0 in a sixth row L6 extending in the left-right direction (X-axis direction).
 前記の通り、複数の柱状導体v16c(第6柱状導体)は、複数の柱状導体v16の一部分であるので、グランド導体層22(第5グランド導体層)及びグランド導体層24(第1グランド導体層)に電気的に接続されている。また、複数の柱状導体v16c(第6柱状導体)の上端(Z軸の正方向の端)は、グランド導体層36に接している。従って、複数の柱状導体v16cは、グランド導体層36に電気的に接続されている。 As mentioned above, the plurality of columnar conductors v16c (sixth columnar conductor) are a part of the plurality of columnar conductors v16, so the ground conductor layer 22 (fifth ground conductor layer) and the ground conductor layer 24 (first ground conductor layer) ) is electrically connected to the Further, the upper ends (ends in the positive direction of the Z axis) of the plurality of columnar conductors v16c (sixth columnar conductors) are in contact with the ground conductor layer 36. Therefore, the plurality of columnar conductors v16c are electrically connected to the ground conductor layer 36.
 また、上下方向(Z軸方向)に見て、複数の柱状導体v15c(第5柱状導体)の中心の左右方向(X軸)における位置を示す複数の第5X軸位置p5と複数の柱状導体v16c(第6柱状導体)の中心の左右方向(X軸)における位置を示す複数の第6X軸位置p6とは、X軸方向に交互に並んでいる。本実施形態では、複数の第5X軸位置p5と複数の第6X軸位置p6とは、X軸方向に所定ピッチP0の半分のピッチで交互に並んでいる。 Further, when viewed in the vertical direction (Z-axis direction), there are a plurality of fifth X-axis positions p5 indicating the positions of the centers of the plurality of columnar conductors v15c (fifth columnar conductors) in the left-right direction (X-axis) and a plurality of columnar conductors v16c. A plurality of sixth X-axis positions p6 indicating the position of the center of the (sixth columnar conductor) in the left-right direction (X-axis) are arranged alternately in the X-axis direction. In this embodiment, the plurality of fifth X-axis positions p5 and the plurality of sixth X-axis positions p6 are alternately arranged in the X-axis direction at a pitch that is half the predetermined pitch P0.
 また、複数の柱状導体v15c(第5柱状導体)は、前後方向(Y軸方向)に見て、複数の柱状導体v13c(第3柱状導体)と重なっている。すなわち、第5X軸位置p5は、第3X軸位置p3と一致している。柱状導体v16c(第6柱状導体)は、左右方向(Y軸方向)に見て、柱状導体v14c(第4柱状導体)と重なっている。すなわち、第6X軸位置p6は、第4X軸位置p4と一致している。 Furthermore, the plurality of columnar conductors v15c (fifth columnar conductor) overlap with the plurality of columnar conductors v13c (third columnar conductor) when viewed in the front-back direction (Y-axis direction). That is, the fifth X-axis position p5 coincides with the third X-axis position p3. The columnar conductor v16c (sixth columnar conductor) overlaps with the columnar conductor v14c (fourth columnar conductor) when viewed in the left-right direction (Y-axis direction). That is, the sixth X-axis position p6 coincides with the fourth X-axis position p4.
 なお、第5X軸位置p5は、第3X軸位置p3と一致していなくてもよい。ただし、第5X軸位置p5は、第3X軸位置p3に対して左右方向に大きくずれていてはいけない。従って、第5X軸位置p5から複数の第3X軸位置p3の内の第5X軸位置p5に最も近い第3X軸位置p3までの距離は、第5X軸位置p5から複数の第4X軸位置p4の内の第5X軸位置p5に最も近い第4X軸位置p4までの距離より短い。 Note that the fifth X-axis position p5 does not have to match the third X-axis position p3. However, the fifth X-axis position p5 must not deviate significantly from the third X-axis position p3 in the left-right direction. Therefore, the distance from the fifth X-axis position p5 to the third X-axis position p3 closest to the fifth X-axis position p5 among the plurality of third X-axis positions p3 is the distance from the fifth X-axis position p5 to the plurality of fourth X-axis positions p4. It is shorter than the distance from the fifth X-axis position p5 to the fourth X-axis position p4 closest to the fifth X-axis position p5.
 また、第6X軸位置p6は、第4X軸位置p4と一致していなくてもよい。ただし、第6X軸位置p6は、第4X軸位置p4に対して左右方向に大きくずれていてはいけない。従って、第6X軸位置p6から複数の第4X軸位置p4の内の第6X軸位置p6に最も近い第4X軸位置p4までの距離は、第6X軸位置p6から複数の第3X軸位置p3の内の第6X軸位置p6に最も近い第3X軸位置p3までの距離より短い。多層基板10gのその他の構造は、多層基板10と同じであるので説明を省略する。 Furthermore, the sixth X-axis position p6 does not have to match the fourth X-axis position p4. However, the sixth X-axis position p6 must not deviate significantly from the fourth X-axis position p4 in the left-right direction. Therefore, the distance from the sixth X-axis position p6 to the fourth X-axis position p4 closest to the sixth X-axis position p6 among the plurality of fourth X-axis positions p4 is the distance from the sixth X-axis position p6 to the plurality of third X-axis positions p3. It is shorter than the distance from the sixth X-axis position p6 to the third X-axis position p3 closest to the sixth X-axis position p6. The other structure of the multilayer substrate 10g is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
(第8変形例)
 以下に、第8変形例に係る多層基板10hについて図面を参照しながら説明する。図12は、多層基板10hの分解図である。ただし、図12では、保護層18a,18bを省略した。図13は、多層基板10hの断面図である。
(Eighth modification)
A multilayer substrate 10h according to an eighth modification will be described below with reference to the drawings. FIG. 12 is an exploded view of the multilayer substrate 10h. However, in FIG. 12, the protective layers 18a and 18b are omitted. FIG. 13 is a cross-sectional view of the multilayer substrate 10h.
 多層基板10hは、柱状導体v11~v14の構造において多層基板10と相違する。柱状導体v11~v14は、左右方向に見て、ジグザグ形状を有している。 The multilayer substrate 10h differs from the multilayer substrate 10 in the structure of the columnar conductors v11 to v14. The columnar conductors v11 to v14 have a zigzag shape when viewed in the left-right direction.
 複数の柱状導体v11のそれぞれは、柱状導体v11a~v11dを含んでいる。柱状導体v11a~v11dのそれぞれは、絶縁体層16a~16dを上下方向に貫通している。複数の柱状導体v11a、複数の柱状導体v11c及び複数の柱状導体v11dは、第1列L1に所定ピッチP0で並んでいる。複数の柱状導体v11bは、第2列L2に所定ピッチP0で並んでいる。複数の柱状導体v11a、複数の柱状導体v11b、複数の柱状導体v11c及び複数の柱状導体v11dのそれぞれは、第1X軸位置p1に位置している。 Each of the plurality of columnar conductors v11 includes columnar conductors v11a to v11d. Each of the columnar conductors v11a to v11d vertically penetrates the insulator layers 16a to 16d. The plurality of columnar conductors v11a, the plurality of columnar conductors v11c, and the plurality of columnar conductors v11d are arranged in the first row L1 at a predetermined pitch P0. The plurality of columnar conductors v11b are arranged in the second row L2 at a predetermined pitch P0. Each of the plurality of columnar conductors v11a, the plurality of columnar conductors v11b, the plurality of columnar conductors v11c, and the plurality of columnar conductors v11d are located at the first X-axis position p1.
 複数の柱状導体v12のそれぞれは、柱状導体v12a~v12dを含んでいる。柱状導体v12a~v12dのそれぞれは、絶縁体層16a~16dを上下方向に貫通している。複数の柱状導体v12a、複数の柱状導体v12c及び複数の柱状導体v12dは、第2列L2に所定ピッチP0で並んでいる。複数の柱状導体v12bは、第1列L1に所定ピッチP0で並んでいる。複数の柱状導体v12a、複数の柱状導体v12b、複数の柱状導体v12c及び複数の柱状導体v12dのそれぞれは、第2X軸位置p2に位置している。 Each of the plurality of columnar conductors v12 includes columnar conductors v12a to v12d. Each of the columnar conductors v12a to v12d vertically penetrates the insulator layers 16a to 16d. The plurality of columnar conductors v12a, the plurality of columnar conductors v12c, and the plurality of columnar conductors v12d are arranged in the second row L2 at a predetermined pitch P0. The plurality of columnar conductors v12b are arranged in the first row L1 at a predetermined pitch P0. Each of the plurality of columnar conductors v12a, the plurality of columnar conductors v12b, the plurality of columnar conductors v12c, and the plurality of columnar conductors v12d are located at the second X-axis position p2.
 複数の柱状導体v13のそれぞれは、柱状導体v13a~v13dを含んでいる。柱状導体v13a~v13dのそれぞれは、絶縁体層16a~16dを上下方向に貫通している。複数の柱状導体v13a、複数の柱状導体v13c及び複数の柱状導体v13dは、第3列L3に所定ピッチP0で並んでいる。複数の柱状導体v13bは、第4列L4に所定ピッチP0で並んでいる。複数の柱状導体v13a、複数の柱状導体v13b、複数の柱状導体v13c及び複数の柱状導体v13dのそれぞれは、第3X軸位置p3に位置している。 Each of the plurality of columnar conductors v13 includes columnar conductors v13a to v13d. Each of the columnar conductors v13a to v13d vertically penetrates the insulator layers 16a to 16d. The plurality of columnar conductors v13a, the plurality of columnar conductors v13c, and the plurality of columnar conductors v13d are arranged in the third row L3 at a predetermined pitch P0. The plurality of columnar conductors v13b are arranged in a fourth row L4 at a predetermined pitch P0. Each of the plurality of columnar conductors v13a, the plurality of columnar conductors v13b, the plurality of columnar conductors v13c, and the plurality of columnar conductors v13d are located at the third X-axis position p3.
 複数の柱状導体v14のそれぞれは、柱状導体v14a~v14dを含んでいる。柱状導体v14a~v14dのそれぞれは、絶縁体層16a~16dを上下方向に貫通している。複数の柱状導体v14a、複数の柱状導体v14c及び複数の柱状導体v14dは、第4列L4に所定ピッチP0で並んでいる。複数の柱状導体v14bは、第3列L3に所定ピッチP0で並んでいる。複数の柱状導体v14a、複数の柱状導体v14b、複数の柱状導体v14c及び複数の柱状導体v14dのそれぞれは、第4X軸位置p4に位置している。多層基板10hのその他の構造は、多層基板10と同じであるので説明を省略する。 Each of the plurality of columnar conductors v14 includes columnar conductors v14a to v14d. Each of the columnar conductors v14a to v14d vertically penetrates the insulator layers 16a to 16d. The plurality of columnar conductors v14a, the plurality of columnar conductors v14c, and the plurality of columnar conductors v14d are arranged in the fourth row L4 at a predetermined pitch P0. The plurality of columnar conductors v14b are arranged in the third row L3 at a predetermined pitch P0. Each of the plurality of columnar conductors v14a, the plurality of columnar conductors v14b, the plurality of columnar conductors v14c, and the plurality of columnar conductors v14d are located at the fourth X-axis position p4. The other structure of the multilayer substrate 10h is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
(第9変形例)
 以下に、第9変形例に係る多層基板10iについて図面を参照しながら説明する。図14は、多層基板10iの分解斜視図である。
(9th modification)
A multilayer substrate 10i according to a ninth modification will be described below with reference to the drawings. FIG. 14 is an exploded perspective view of the multilayer substrate 10i.
 多層基板10iは、グランド導体層22を備えていない点において多層基板10と相違する。多層基板10iでは、信号導体層20及びグランド導体層24は、マイクロストリップライン構造を有している。多層基板10iのその他の構造は、多層基板10と同じであるので説明を省略する。 The multilayer board 10i differs from the multilayer board 10 in that it does not include a ground conductor layer 22. In the multilayer substrate 10i, the signal conductor layer 20 and the ground conductor layer 24 have a microstrip line structure. The other structure of the multilayer substrate 10i is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
(その他の実施形態)
 本発明に係る多層基板は、多層基板10,10a~10iに限らずその要旨の範囲内において変更可能である。なお、多層基板10,10a~10iの構造を任意に組み合わせてもよい。
(Other embodiments)
The multilayer substrate according to the present invention is not limited to the multilayer substrates 10, 10a to 10i, and can be modified within the scope of the gist thereof. Note that the structures of the multilayer substrates 10, 10a to 10i may be arbitrarily combined.
 なお、保護層18a,18bは、必須の構成要件ではない。また、保護層18a又は保護層18bのいずれか一方が設けられていてもよい。 Note that the protective layers 18a and 18b are not essential components. Further, either the protective layer 18a or the protective layer 18b may be provided.
 なお、グランド導体層28,30,32,34は、必須の構成要件ではない。 Note that the ground conductor layers 28, 30, 32, and 34 are not essential components.
 なお、第2列L2と第4列L4との前後方向の距離d12は、第1列L1と第3列L3との前後方向の距離d11と等しくなくてもよい。 Note that the distance d12 in the front-rear direction between the second row L2 and the fourth row L4 does not have to be equal to the distance d11 in the front-rear direction between the first row L1 and the third row L3.
 なお、柱状導体v11cの直径r1は、柱状導体v12cの直径r2より小さくてもよい。柱状導体v14cの直径r4は、柱状導体v13cの直径r3より小さくてもよい。 Note that the diameter r1 of the columnar conductor v11c may be smaller than the diameter r2 of the columnar conductor v12c. The diameter r4 of the columnar conductor v14c may be smaller than the diameter r3 of the columnar conductor v13c.
 本願発明は、以下の構造を有する。 The present invention has the following structure.
(1)
 複数の絶縁体層がZ軸方向に積層された構造を有している積層体と、
 前記積層体に設けられており、かつ、前記Z軸方向に見て、線形状を有している第1信号導体層と、
 前記第1信号導体層よりZ軸の負方向に位置すると共に、前記Z軸方向に見て、前記第1信号導体層と重なっている第1グランド導体層と、
 前記第1信号導体層より前記Z軸の負方向に位置する前記絶縁体層を前記Z軸方向に貫通しており、かつ、前記第1グランド導体層より前記Z軸の正方向に位置している複数の第1柱状導体、複数の第2柱状導体、複数の第3柱状導体及び複数の第4柱状導体と、
 を備えており、
 前記第1信号導体層が延びる方向をX軸方向と定義し、
 前記X軸方向及び前記Z軸方向に直交する方向をY軸方向と定義し、
 前記複数の第1柱状導体、前記複数の第2柱状導体、前記複数の第3柱状導体及び前記複数の第4柱状導体は、前記第1グランド導体層に電気的に接続されており、
 前記Z軸方向に見て、前記複数の第1柱状導体の中心は、前記第1信号導体層よりY軸の正方向に位置し、かつ、前記X軸方向に延びる第1列に所定ピッチで並んでおり、
 前記Z軸方向に見て、前記複数の第2柱状導体の中心は、前記第1信号導体層より前記Y軸の正方向に位置し、かつ、前記X軸方向に延びる第2列に前記所定ピッチで並んでおり、
 前記Z軸方向に見て、前記複数の第3柱状導体の中心は、前記第1信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第3列に前記所定ピッチで並んでおり、
 前記Z軸方向に見て、前記複数の第4柱状導体の中心は、前記第1信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第4列に前記所定ピッチで並んでおり、
 前記第2列は、前記第1列より前記Y軸の負方向に位置しており、
 前記第4列は、前記第3列より前記Y軸の負方向に位置しており、
 前記Z軸方向に見て、前記複数の第1柱状導体の中心のX軸における位置を示す複数の第1X軸位置と前記複数の第2柱状導体の中心の前記X軸における位置を示す複数の第2X軸位置とは、前記X軸方向に交互に並んでおり、
 前記Z軸方向に見て、前記複数の第3柱状導体の中心の前記X軸における位置を示す複数の第3X軸位置と前記複数の第4柱状導体の中心の前記X軸における位置を示す第4X軸位置とは、前記X軸方向に交互に並んでおり、
 前記第3X軸位置から前記複数の第1X軸位置の内の前記第3X軸位置に最も近い前記第1X軸位置までの距離は、前記第3X軸位置から前記複数の第2X軸位置の内の前記第3X軸位置に最も近い前記第2X軸位置までの距離より短く、
 前記第4X軸位置から前記複数の第2X軸位置の内の前記第4X軸位置に最も近い前記第2X軸位置までの距離は、前記第4X軸位置から前記複数の第1X軸位置の内の前記第4X軸位置に最も近い前記第1X軸位置までの距離より短い、
 多層基板。
(1)
A laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a first signal conductor layer provided on the laminate and having a linear shape when viewed in the Z-axis direction;
a first ground conductor layer located in the negative direction of the Z-axis from the first signal conductor layer and overlapping with the first signal conductor layer when viewed in the Z-axis direction;
Penetrating in the Z-axis direction the insulator layer located in the negative direction of the Z-axis from the first signal conductor layer, and located in the positive direction of the Z-axis from the first ground conductor layer. A plurality of first columnar conductors, a plurality of second columnar conductors, a plurality of third columnar conductors, and a plurality of fourth columnar conductors,
It is equipped with
The direction in which the first signal conductor layer extends is defined as the X-axis direction,
A direction perpendicular to the X-axis direction and the Z-axis direction is defined as the Y-axis direction,
The plurality of first columnar conductors, the plurality of second columnar conductors, the plurality of third columnar conductors, and the plurality of fourth columnar conductors are electrically connected to the first ground conductor layer,
When viewed in the Z-axis direction, the centers of the plurality of first columnar conductors are located in the positive direction of the Y-axis from the first signal conductor layer, and are arranged at a predetermined pitch in a first row extending in the X-axis direction. They are lined up,
When viewed in the Z-axis direction, the centers of the plurality of second columnar conductors are located in the positive direction of the Y-axis relative to the first signal conductor layer, and are located in the predetermined second row extending in the X-axis direction. lined up on the pitch,
When viewed in the Z-axis direction, the centers of the plurality of third columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are arranged in the predetermined third row extending in the X-axis direction. lined up on the pitch,
When viewed in the Z-axis direction, the centers of the plurality of fourth columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are located in the fourth row extending in the X-axis direction. lined up on the pitch,
The second column is located in the negative direction of the Y axis from the first column,
The fourth column is located in the negative direction of the Y axis from the third column,
When viewed in the Z-axis direction, a plurality of first X-axis positions indicating the positions of the centers of the plurality of first columnar conductors on the X-axis, and a plurality of first X-axis positions indicating the positions of the centers of the plurality of second columnar conductors on the X-axis. The second X-axis positions are arranged alternately in the X-axis direction,
A plurality of third X-axis positions indicating the positions of the centers of the plurality of third columnar conductors on the X-axis and a third X-axis position indicating the positions of the centers of the plurality of fourth columnar conductors on the X-axis when viewed in the Z-axis direction. The 4X-axis positions are arranged alternately in the X-axis direction,
The distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is the distance from the third X-axis position to the first X-axis position among the plurality of second X-axis positions. shorter than the distance to the second X-axis position closest to the third X-axis position,
The distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is the distance from the fourth X-axis position to the second X-axis position among the plurality of first X-axis positions. shorter than the distance to the first X-axis position closest to the fourth X-axis position;
Multilayer board.
(2)
 前記第3X軸位置から前記複数の第1X軸位置の内の前記第3X軸位置に最も近い前記第1X軸位置までの距離は、前記所定ピッチの1/4以下であり、
 前記第4X軸位置から前記複数の第2X軸位置の内の前記第4X軸位置に最も近い前記第2X軸位置までの距離は、前記所定ピッチの1/4以下である、
 (1)に記載の多層基板。
(2)
The distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is 1/4 or less of the predetermined pitch,
The distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is 1/4 or less of the predetermined pitch,
The multilayer substrate according to (1).
(3)
 前記第3X軸位置から前記複数の第1X軸位置の内の前記第3X軸位置に最も近い前記第1X軸位置までの距離は、前記第3柱状導体から前記複数の第4柱状導体の内の前記第3柱状導体に最も近い前記第4柱状導体までのX軸方向の距離の半分以下であり、
 前記第4X軸位置から前記複数の第2X軸位置の内の前記第4X軸位置に最も近い前記第2X軸位置までの距離は、前記第3柱状導体から前記複数の第4柱状導体の内の前記第3柱状導体に最も近い前記第4柱状導体までのX軸方向の距離の半分以下である、
 (1)に記載の多層基板。
(3)
The distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is the distance from the third columnar conductor to the first X-axis position among the plurality of fourth columnar conductors. less than half the distance in the X-axis direction to the fourth columnar conductor closest to the third columnar conductor,
The distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is the distance from the third columnar conductor to the second X-axis position among the plurality of fourth columnar conductors. less than half the distance in the X-axis direction from the third columnar conductor to the fourth columnar conductor closest to the third columnar conductor;
The multilayer substrate according to (1).
(4)
 前記第3柱状導体は、前記Y軸方向に見て、前記第1柱状導体と重なっており、
 前記第4柱状導体は、前記Y軸方向に見て、前記第2柱状導体と重なっている、
 (1)に記載の多層基板。
(4)
The third columnar conductor overlaps the first columnar conductor when viewed in the Y-axis direction,
The fourth columnar conductor overlaps the second columnar conductor when viewed in the Y-axis direction.
The multilayer substrate according to (1).
(5)
 前記第2列と前記第4列との前記Y軸方向の距離は、前記第1列と前記第3列との前記Y軸方向の距離と等しい、
 (1)ないし(4)のいずれかに記載の多層基板。
(5)
The distance between the second row and the fourth row in the Y-axis direction is equal to the distance between the first row and the third row in the Y-axis direction.
The multilayer substrate according to any one of (1) to (4).
(6)
 前記第1柱状導体の中心から前記複数の第2柱状導体の内の前記第1柱状導体に最も近い前記第2柱状導体の中心までの距離は、前記第1列と前記第2列との前記Y軸方向の距離より長く、
 前記第3柱状導体の中心から前記複数の第4柱状導体の内の前記第3柱状導体に最も近い前記第4柱状導体の中心までの距離は、前記第3列と前記第4列との前記Y軸方向の距離より長い、
 (1)ないし(5)のいずれかに記載の多層基板。
(6)
The distance from the center of the first columnar conductor to the center of the second columnar conductor closest to the first columnar conductor among the plurality of second columnar conductors is the distance between the first column and the second column. longer than the distance in the Y-axis direction,
The distance from the center of the third columnar conductor to the center of the fourth columnar conductor closest to the third columnar conductor among the plurality of fourth columnar conductors is the distance between the third column and the fourth column. longer than the distance in the Y-axis direction,
The multilayer substrate according to any one of (1) to (5).
(7)
 前記第1柱状導体の中心から前記複数の第2柱状導体の内の前記第1柱状導体に最も近い前記第2柱状導体の中心までの距離は、前記第1柱状導体の直径及び前記第2柱状導体の直径より長く、
 前記第3柱状導体の中心から前記複数の第4柱状導体の内の前記第3柱状導体に最も近い前記第4柱状導体の中心までの距離は、前記第3柱状導体の直径及び前記第4柱状導体の直径より長い、
 (1)ないし(6)のいずれかに記載の多層基板。
(7)
The distance from the center of the first columnar conductor to the center of the second columnar conductor closest to the first columnar conductor among the plurality of second columnar conductors is determined by the diameter of the first columnar conductor and the second columnar conductor. longer than the diameter of the conductor,
The distance from the center of the third columnar conductor to the center of the fourth columnar conductor closest to the third columnar conductor among the plurality of fourth columnar conductors is determined by the diameter of the third columnar conductor and the fourth columnar conductor. longer than the diameter of the conductor,
The multilayer substrate according to any one of (1) to (6).
(8)
 前記第1柱状導体の直径は、前記第2柱状導体の直径より大きく、
 前記第4柱状導体の直径は、前記第3柱状導体の直径より大きい、
 (1)ないし(7)のいずれかに記載の多層基板。
(8)
The diameter of the first columnar conductor is larger than the diameter of the second columnar conductor,
The diameter of the fourth columnar conductor is larger than the diameter of the third columnar conductor.
The multilayer substrate according to any one of (1) to (7).
(9)
 前記Y軸方向に見て、前記第2柱状導体の一部分は、前記第1柱状導体の一部分と重なっており、
 前記Y軸方向に見て、前記第4柱状導体の一部分は、前記第3柱状導体の一部分と重なっている、
 (1)ないし(8)のいずれかに記載の多層基板。
(9)
When viewed in the Y-axis direction, a portion of the second columnar conductor overlaps a portion of the first columnar conductor,
When viewed in the Y-axis direction, a portion of the fourth columnar conductor overlaps a portion of the third columnar conductor,
The multilayer substrate according to any one of (1) to (8).
(10)
 前記多層基板は、
 第2グランド導体層を、
 更に備えており、
 前記複数の第1柱状導体の前記Z軸の正方向の端及び前記複数の第2柱状導体の前記Z軸の正方向の端は、前記第2グランド導体層に接している、
 (1)ないし(9)のいずれかに記載の多層基板。
(10)
The multilayer substrate includes:
The second ground conductor layer,
Furthermore, we are equipped with
The ends of the plurality of first columnar conductors in the positive direction of the Z axis and the ends of the plurality of second columnar conductors in the positive direction of the Z axis are in contact with the second ground conductor layer,
The multilayer substrate according to any one of (1) to (9).
(11)
 前記第1X軸位置における前記第2グランド導体層と前記第1信号導体層との前記Y軸方向の距離は、前記第2X軸位置における前記第2グランド導体層と前記第1信号導体層との前記Y軸方向の距離より長い、
 (10)に記載の多層基板。
(11)
The distance in the Y-axis direction between the second ground conductor layer and the first signal conductor layer at the first X-axis position is the distance between the second ground conductor layer and the first signal conductor layer at the second X-axis position. longer than the distance in the Y-axis direction,
The multilayer substrate according to (10).
(12)
 前記多層基板は、
 前記複数の第1柱状導体の前記Z軸の正方向の端のそれぞれと接する複数の第3グランド導体層と、
 前記複数の第2柱状導体の前記Z軸の正方向の端のそれぞれと接する複数の第4グランド導体層と、
 更に備えている、
 (1)ないし(11)のいずれかに記載の多層基板。
(12)
The multilayer substrate includes:
a plurality of third ground conductor layers in contact with each of the ends of the plurality of first columnar conductors in the positive direction of the Z axis;
a plurality of fourth ground conductor layers in contact with each of the ends of the plurality of second columnar conductors in the positive direction of the Z axis;
Furthermore, we have
The multilayer substrate according to any one of (1) to (11).
(13)
 前記多層基板は、
 前記第1信号導体層より前記Z軸の正方向に位置すると共に、前記Z軸方向に見て、前記第1信号導体層と重なっている第5グランド導体層を、
 更に備えており、
 前記複数の第1柱状導体、前記複数の第2柱状導体、前記複数の第3柱状導体及び前記複数の第4柱状導体は、前記第5グランド導体層に電気的に接続されている、
 (1)ないし(12)のいずれかに記載の多層基板。
(13)
The multilayer substrate includes:
a fifth ground conductor layer that is located in the positive direction of the Z-axis from the first signal conductor layer and overlaps with the first signal conductor layer when viewed in the Z-axis direction;
Furthermore, we are equipped with
The plurality of first columnar conductors, the plurality of second columnar conductors, the plurality of third columnar conductors, and the plurality of fourth columnar conductors are electrically connected to the fifth ground conductor layer,
The multilayer substrate according to any one of (1) to (12).
(14)
 前記第1信号導体層と前記第3列との前記Y軸方向の距離は、前記第1信号導体層と前記第2列との前記Y軸方向の距離と等しく、
 前記第1信号導体層と前記第4列との前記Y軸方向の距離は、前記第1信号導体層と前記第1列との前記Y軸方向の距離と等しい、
 (1)ないし(13)のいずれかに記載の多層基板。
(14)
The distance between the first signal conductor layer and the third column in the Y-axis direction is equal to the distance between the first signal conductor layer and the second column in the Y-axis direction,
The distance between the first signal conductor layer and the fourth row in the Y-axis direction is equal to the distance between the first signal conductor layer and the first row in the Y-axis direction.
The multilayer substrate according to any one of (1) to (13).
(15)
 前記第1信号導体層は、直線形状を有している、
 (14)に記載の多層基板。
(15)
the first signal conductor layer has a linear shape;
The multilayer substrate according to (14).
(16)
 前記多層基板は、
 前記積層体に設けられており、かつ、前記第3列及び前記第4列より前記Y軸の負方向に位置しており、かつ、前記Z軸方向から見て、前記第1信号導体層と平行な線形状を有している第2信号導体層と、
 前記第2信号導体層より前記Z軸の負方向に位置する前記絶縁体層を前記Z軸方向に貫通しており、かつ、前記第1グランド導体層より前記Z軸の正方向に位置している複数の第5柱状導体及び複数の第6柱状導体と、
 を更に備えており、
 前記第1グランド導体層は、前記Z軸方向に見て、前記第2信号導体層と重なっており、
 前記複数の第5柱状導体及び前記複数の第6柱状導体は、前記第1グランド導体層に電気的に接続されており、
 前記Z軸方向に見て、前記複数の第5柱状導体の中心は、前記第2信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第5列に前記所定ピッチで並んでおり、
 前記Z軸方向に見て、前記複数の第6柱状導体の中心は、前記第2信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第6列に前記所定ピッチで並んでおり、
 前記第6列は、前記第5列より前記Y軸の負方向に位置しており、
 前記Z軸方向に見て、前記複数の第5柱状導体の中心の前記X軸における位置を示す複数の第5X軸位置と前記複数の第6柱状導体の中心の前記X軸における位置を示す複数の第6X軸位置とは、前記X軸方向に交互に並んでおり、
 前記第5X軸位置から前記複数の第3X軸位置の内の前記第5X軸位置に最も近い前記第3X軸位置までの距離は、前記第5X軸位置から前記複数の第4X軸位置の内の前記第5X軸位置に最も近い前記第4X軸位置までの距離より短く、
 前記第6X軸位置から前記複数の第4X軸位置の内の前記第6X軸位置に最も近い前記第4X軸位置までの距離は、前記第6X軸位置から前記複数の第3X軸位置の内の前記第6X軸位置に最も近い前記第3X軸位置までの距離より短い、
 (1)ないし(15)のいずれかに記載の多層基板。
(16)
The multilayer substrate includes:
The first signal conductor layer is provided in the laminate, is located in the negative direction of the Y-axis from the third row and the fourth row, and is similar to the first signal conductor layer when viewed from the Z-axis direction. a second signal conductor layer having a parallel linear shape;
Penetrating in the Z-axis direction the insulator layer located in the negative direction of the Z-axis from the second signal conductor layer, and located in the positive direction of the Z-axis from the first ground conductor layer. a plurality of fifth columnar conductors and a plurality of sixth columnar conductors,
Furthermore, it is equipped with
The first ground conductor layer overlaps the second signal conductor layer when viewed in the Z-axis direction,
The plurality of fifth columnar conductors and the plurality of sixth columnar conductors are electrically connected to the first ground conductor layer,
When viewed in the Z-axis direction, the centers of the plurality of fifth columnar conductors are located in the negative direction of the Y-axis from the second signal conductor layer, and are located in the predetermined fifth column extending in the X-axis direction. lined up on the pitch,
When viewed in the Z-axis direction, the centers of the plurality of sixth columnar conductors are located in the negative direction of the Y-axis from the second signal conductor layer, and are located in the predetermined sixth column extending in the X-axis direction. lined up on the pitch,
The sixth column is located in the negative direction of the Y axis from the fifth column,
When viewed in the Z-axis direction, a plurality of fifth X-axis positions indicating the positions of the centers of the plurality of fifth columnar conductors on the X-axis and a plurality of positions indicating the positions of the centers of the plurality of sixth columnar conductors on the X-axis. The sixth X-axis positions are arranged alternately in the X-axis direction,
The distance from the fifth X-axis position to the third X-axis position closest to the fifth X-axis position among the plurality of third X-axis positions is the distance from the fifth X-axis position to the third X-axis position among the plurality of fourth X-axis positions. shorter than the distance to the fourth X-axis position closest to the fifth X-axis position,
The distance from the sixth X-axis position to the fourth X-axis position closest to the sixth X-axis position among the plurality of fourth X-axis positions is the distance from the sixth X-axis position to the fourth X-axis position among the plurality of third X-axis positions. shorter than the distance to the third X-axis position closest to the sixth X-axis position;
The multilayer substrate according to any one of (1) to (15).
(17)
 前記複数の第1X軸位置と前記複数の第2X軸位置とは、X軸方向に前記所定ピッチの半分のピッチで交互に並んでいる、
 (1)ないし(16)のいずれかに記載の多層基板。
(17)
The plurality of first X-axis positions and the plurality of second X-axis positions are alternately arranged in the X-axis direction at a pitch that is half the predetermined pitch.
The multilayer substrate according to any one of (1) to (16).
10,10a~10i:多層基板
12:積層体
16a~16d:絶縁体層
18a,18b:保護層
20,21:信号導体層
22,24,28,28a,28b,30,30a,30b,32,32a,32b,34,34a,34b,36:グランド導体層
26a,26b:信号端子
A1:第1区間
A2:第2区間
A3:第3区間
L1:第1列
L2:第2列
L3:第3列
L4:第4列
L5:第5列
L6:第6列
p1:第1X軸位置
p2:第2X軸位置
p3:第3X軸位置
p4:第4X軸位置
p5:第5X軸位置
p6:第6X軸位置
v1,v2,v11~v16,v11a~v11d,v12a~v12d,v13a~v13d,v14a~v14d,v15c,v16c:柱状導体
10, 10a to 10i: Multilayer substrate 12: Laminated bodies 16a to 16d: Insulator layers 18a, 18b: Protective layers 20, 21: Signal conductor layers 22, 24, 28, 28a, 28b, 30, 30a, 30b, 32, 32a, 32b, 34, 34a, 34b, 36: Ground conductor layer 26a, 26b: Signal terminal A1: First section A2: Second section A3: Third section L1: First column L2: Second column L3: Third Row L4: Fourth row L5: Fifth row L6: Sixth row p1: First X-axis position p2: Second X-axis position p3: Third X-axis position p4: Fourth X-axis position p5: Fifth X-axis position p6: Sixth X Axis positions v1, v2, v11 to v16, v11a to v11d, v12a to v12d, v13a to v13d, v14a to v14d, v15c, v16c: columnar conductor

Claims (17)

  1.  複数の絶縁体層がZ軸方向に積層された構造を有している積層体と、
     前記積層体に設けられており、かつ、前記Z軸方向に見て、線形状を有している第1信号導体層と、
     前記第1信号導体層よりZ軸の負方向に位置すると共に、前記Z軸方向に見て、前記第1信号導体層と重なっている第1グランド導体層と、
     前記第1信号導体層より前記Z軸の負方向に位置する前記絶縁体層を前記Z軸方向に貫通しており、かつ、前記第1グランド導体層より前記Z軸の正方向に位置している複数の第1柱状導体、複数の第2柱状導体、複数の第3柱状導体及び複数の第4柱状導体と、
     を備えており、
     前記第1信号導体層が延びる方向をX軸方向と定義し、
     前記X軸方向及び前記Z軸方向に直交する方向をY軸方向と定義し、
     前記複数の第1柱状導体、前記複数の第2柱状導体、前記複数の第3柱状導体及び前記複数の第4柱状導体は、前記第1グランド導体層に電気的に接続されており、
     前記Z軸方向に見て、前記複数の第1柱状導体の中心は、前記第1信号導体層よりY軸の正方向に位置し、かつ、前記X軸方向に延びる第1列に所定ピッチで並んでおり、
     前記Z軸方向に見て、前記複数の第2柱状導体の中心は、前記第1信号導体層より前記Y軸の正方向に位置し、かつ、前記X軸方向に延びる第2列に前記所定ピッチで並んでおり、
     前記Z軸方向に見て、前記複数の第3柱状導体の中心は、前記第1信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第3列に前記所定ピッチで並んでおり、
     前記Z軸方向に見て、前記複数の第4柱状導体の中心は、前記第1信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第4列に前記所定ピッチで並んでおり、
     前記第2列は、前記第1列より前記Y軸の負方向に位置しており、
     前記第4列は、前記第3列より前記Y軸の負方向に位置しており、
     前記Z軸方向に見て、前記複数の第1柱状導体の中心のX軸における位置を示す複数の第1X軸位置と前記複数の第2柱状導体の中心の前記X軸における位置を示す複数の第2X軸位置とは、前記X軸方向に交互に並んでおり、
     前記Z軸方向に見て、前記複数の第3柱状導体の中心の前記X軸における位置を示す複数の第3X軸位置と前記複数の第4柱状導体の中心の前記X軸における位置を示す第4X軸位置とは、前記X軸方向に交互に並んでおり、
     前記第3X軸位置から前記複数の第1X軸位置の内の前記第3X軸位置に最も近い前記第1X軸位置までの距離は、前記第3X軸位置から前記複数の第2X軸位置の内の前記第3X軸位置に最も近い前記第2X軸位置までの距離より短く、
     前記第4X軸位置から前記複数の第2X軸位置の内の前記第4X軸位置に最も近い前記第2X軸位置までの距離は、前記第4X軸位置から前記複数の第1X軸位置の内の前記第4X軸位置に最も近い前記第1X軸位置までの距離より短い、
     多層基板。
    A laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
    a first signal conductor layer provided on the laminate and having a linear shape when viewed in the Z-axis direction;
    a first ground conductor layer located in the negative direction of the Z-axis from the first signal conductor layer and overlapping with the first signal conductor layer when viewed in the Z-axis direction;
    Penetrating in the Z-axis direction the insulator layer located in the negative direction of the Z-axis from the first signal conductor layer, and located in the positive direction of the Z-axis from the first ground conductor layer. A plurality of first columnar conductors, a plurality of second columnar conductors, a plurality of third columnar conductors, and a plurality of fourth columnar conductors,
    It is equipped with
    The direction in which the first signal conductor layer extends is defined as the X-axis direction,
    A direction perpendicular to the X-axis direction and the Z-axis direction is defined as the Y-axis direction,
    The plurality of first columnar conductors, the plurality of second columnar conductors, the plurality of third columnar conductors, and the plurality of fourth columnar conductors are electrically connected to the first ground conductor layer,
    When viewed in the Z-axis direction, the centers of the plurality of first columnar conductors are located in the positive direction of the Y-axis from the first signal conductor layer, and are arranged at a predetermined pitch in a first row extending in the X-axis direction. They are lined up,
    When viewed in the Z-axis direction, the centers of the plurality of second columnar conductors are located in the positive direction of the Y-axis relative to the first signal conductor layer, and are located in the predetermined second row extending in the X-axis direction. lined up on the pitch,
    When viewed in the Z-axis direction, the centers of the plurality of third columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are arranged in the predetermined third row extending in the X-axis direction. lined up on the pitch,
    When viewed in the Z-axis direction, the centers of the plurality of fourth columnar conductors are located in the negative direction of the Y-axis from the first signal conductor layer, and are located in the fourth row extending in the X-axis direction. lined up on the pitch,
    The second column is located in the negative direction of the Y axis from the first column,
    The fourth column is located in the negative direction of the Y axis from the third column,
    When viewed in the Z-axis direction, a plurality of first X-axis positions indicating the positions of the centers of the plurality of first columnar conductors on the X-axis, and a plurality of first X-axis positions indicating the positions of the centers of the plurality of second columnar conductors on the X-axis. The second X-axis positions are arranged alternately in the X-axis direction,
    A plurality of third X-axis positions indicating the positions of the centers of the plurality of third columnar conductors on the X-axis and a third X-axis position indicating the positions of the centers of the plurality of fourth columnar conductors on the X-axis when viewed in the Z-axis direction. The 4X-axis positions are arranged alternately in the X-axis direction,
    The distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is the distance from the third X-axis position to the first X-axis position among the plurality of second X-axis positions. shorter than the distance to the second X-axis position closest to the third X-axis position,
    The distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is the distance from the fourth X-axis position to the second X-axis position among the plurality of first X-axis positions. shorter than the distance to the first X-axis position closest to the fourth X-axis position;
    Multilayer board.
  2.  前記第3X軸位置から前記複数の第1X軸位置の内の前記第3X軸位置に最も近い前記第1X軸位置までの距離は、前記所定ピッチの1/4以下であり、
     前記第4X軸位置から前記複数の第2X軸位置の内の前記第4X軸位置に最も近い前記第2X軸位置までの距離は、前記所定ピッチの1/4以下である、
     請求項1に記載の多層基板。
    The distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is 1/4 or less of the predetermined pitch,
    The distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is 1/4 or less of the predetermined pitch,
    The multilayer substrate according to claim 1.
  3.  前記第3X軸位置から前記複数の第1X軸位置の内の前記第3X軸位置に最も近い前記第1X軸位置までの距離は、前記第3柱状導体から前記複数の第4柱状導体の内の前記第3柱状導体に最も近い前記第4柱状導体までのX軸方向の距離の半分以下であり、
     前記第4X軸位置から前記複数の第2X軸位置の内の前記第4X軸位置に最も近い前記第2X軸位置までの距離は、前記第3柱状導体から前記複数の第4柱状導体の内の前記第3柱状導体に最も近い前記第4柱状導体までのX軸方向の距離の半分以下である、
     請求項1に記載の多層基板。
    The distance from the third X-axis position to the first X-axis position closest to the third X-axis position among the plurality of first X-axis positions is the distance from the third columnar conductor to the first X-axis position among the plurality of fourth columnar conductors. less than half the distance in the X-axis direction to the fourth columnar conductor closest to the third columnar conductor,
    The distance from the fourth X-axis position to the second X-axis position closest to the fourth X-axis position among the plurality of second X-axis positions is the distance from the third columnar conductor to the second X-axis position among the plurality of fourth columnar conductors. less than half the distance in the X-axis direction from the third columnar conductor to the fourth columnar conductor closest to the third columnar conductor;
    The multilayer substrate according to claim 1.
  4.  前記第3柱状導体は、前記Y軸方向に見て、前記第1柱状導体と重なっており、
     前記第4柱状導体は、前記Y軸方向に見て、前記第2柱状導体と重なっている、
     請求項1に記載の多層基板。
    The third columnar conductor overlaps the first columnar conductor when viewed in the Y-axis direction,
    The fourth columnar conductor overlaps the second columnar conductor when viewed in the Y-axis direction.
    The multilayer substrate according to claim 1.
  5.  前記第2列と前記第4列との前記Y軸方向の距離は、前記第1列と前記第3列との前記Y軸方向の距離と等しい、
     請求項1ないし請求項4のいずれかに記載の多層基板。
    The distance between the second row and the fourth row in the Y-axis direction is equal to the distance between the first row and the third row in the Y-axis direction.
    The multilayer substrate according to any one of claims 1 to 4.
  6.  前記第1柱状導体の中心から前記複数の第2柱状導体の内の前記第1柱状導体に最も近い前記第2柱状導体の中心までの距離は、前記第1列と前記第2列との前記Y軸方向の距離より長く、
     前記第3柱状導体の中心から前記複数の第4柱状導体の内の前記第3柱状導体に最も近い前記第4柱状導体の中心までの距離は、前記第3列と前記第4列との前記Y軸方向の距離より長い、
     請求項1ないし請求項5のいずれかに記載の多層基板。
    The distance from the center of the first columnar conductor to the center of the second columnar conductor closest to the first columnar conductor among the plurality of second columnar conductors is the distance between the first column and the second column. longer than the distance in the Y-axis direction,
    The distance from the center of the third columnar conductor to the center of the fourth columnar conductor closest to the third columnar conductor among the plurality of fourth columnar conductors is the distance between the third column and the fourth column. longer than the distance in the Y-axis direction,
    The multilayer substrate according to any one of claims 1 to 5.
  7.  前記第1柱状導体の中心から前記複数の第2柱状導体の内の前記第1柱状導体に最も近い前記第2柱状導体の中心までの距離は、前記第1柱状導体の直径及び前記第2柱状導体の直径より長く、
     前記第3柱状導体の中心から前記複数の第4柱状導体の内の前記第3柱状導体に最も近い前記第4柱状導体の中心までの距離は、前記第3柱状導体の直径及び前記第4柱状導体の直径より長い、
     請求項1ないし請求項6のいずれかに記載の多層基板。
    The distance from the center of the first columnar conductor to the center of the second columnar conductor closest to the first columnar conductor among the plurality of second columnar conductors is determined by the diameter of the first columnar conductor and the second columnar conductor. longer than the diameter of the conductor,
    The distance from the center of the third columnar conductor to the center of the fourth columnar conductor closest to the third columnar conductor among the plurality of fourth columnar conductors is determined by the diameter of the third columnar conductor and the fourth columnar conductor. longer than the diameter of the conductor,
    The multilayer substrate according to any one of claims 1 to 6.
  8.  前記第1柱状導体の直径は、前記第2柱状導体の直径より大きく、
     前記第4柱状導体の直径は、前記第3柱状導体の直径より大きい、
     請求項1ないし請求項7のいずれかに記載の多層基板。
    The diameter of the first columnar conductor is larger than the diameter of the second columnar conductor,
    The diameter of the fourth columnar conductor is larger than the diameter of the third columnar conductor.
    The multilayer substrate according to any one of claims 1 to 7.
  9.  前記Y軸方向に見て、前記第2柱状導体の一部分は、前記第1柱状導体の一部分と重なっており、
     前記Y軸方向に見て、前記第4柱状導体の一部分は、前記第3柱状導体の一部分と重なっている、
     請求項1ないし請求項8のいずれかに記載の多層基板。
    When viewed in the Y-axis direction, a portion of the second columnar conductor overlaps a portion of the first columnar conductor,
    When viewed in the Y-axis direction, a portion of the fourth columnar conductor overlaps a portion of the third columnar conductor,
    The multilayer substrate according to any one of claims 1 to 8.
  10.  前記多層基板は、
     第2グランド導体層を、
     更に備えており、
     前記複数の第1柱状導体の前記Z軸の正方向の端及び前記複数の第2柱状導体の前記Z軸の正方向の端は、前記第2グランド導体層に接している、
     請求項1ないし請求項9のいずれかに記載の多層基板。
    The multilayer substrate includes:
    The second ground conductor layer,
    Furthermore, we are equipped with
    The ends of the plurality of first columnar conductors in the positive direction of the Z axis and the ends of the plurality of second columnar conductors in the positive direction of the Z axis are in contact with the second ground conductor layer,
    The multilayer substrate according to any one of claims 1 to 9.
  11.  前記第1X軸位置における前記第2グランド導体層と前記第1信号導体層との前記Y軸方向の距離は、前記第2X軸位置における前記第2グランド導体層と前記第1信号導体層との前記Y軸方向の距離より長い、
     請求項10に記載の多層基板。
    The distance in the Y-axis direction between the second ground conductor layer and the first signal conductor layer at the first X-axis position is the distance between the second ground conductor layer and the first signal conductor layer at the second X-axis position. longer than the distance in the Y-axis direction,
    The multilayer substrate according to claim 10.
  12.  前記多層基板は、
     前記複数の第1柱状導体の前記Z軸の正方向の端のそれぞれと接する複数の第3グランド導体層と、
     前記複数の第2柱状導体の前記Z軸の正方向の端のそれぞれと接する複数の第4グランド導体層と、
     更に備えている、
     請求項1ないし請求項11のいずれかに記載の多層基板。
    The multilayer substrate includes:
    a plurality of third ground conductor layers in contact with each of the ends of the plurality of first columnar conductors in the positive direction of the Z axis;
    a plurality of fourth ground conductor layers in contact with each of the ends of the plurality of second columnar conductors in the positive direction of the Z axis;
    Furthermore, we have
    The multilayer substrate according to any one of claims 1 to 11.
  13.  前記多層基板は、
     前記第1信号導体層より前記Z軸の正方向に位置すると共に、前記Z軸方向に見て、前記第1信号導体層と重なっている第5グランド導体層を、
     更に備えており、
     前記複数の第1柱状導体、前記複数の第2柱状導体、前記複数の第3柱状導体及び前記複数の第4柱状導体は、前記第5グランド導体層に電気的に接続されている、
     請求項1ないし請求項12のいずれかに記載の多層基板。
    The multilayer substrate includes:
    a fifth ground conductor layer that is located in the positive direction of the Z-axis from the first signal conductor layer and overlaps with the first signal conductor layer when viewed in the Z-axis direction;
    Furthermore, we are equipped with
    The plurality of first columnar conductors, the plurality of second columnar conductors, the plurality of third columnar conductors, and the plurality of fourth columnar conductors are electrically connected to the fifth ground conductor layer,
    The multilayer substrate according to any one of claims 1 to 12.
  14.  前記第1信号導体層と前記第3列との前記Y軸方向の距離は、前記第1信号導体層と前記第2列との前記Y軸方向の距離と等しく、
     前記第1信号導体層と前記第4列との前記Y軸方向の距離は、前記第1信号導体層と前記第1列との前記Y軸方向の距離と等しい、
     請求項1ないし請求項13のいずれかに記載の多層基板。
    The distance between the first signal conductor layer and the third column in the Y-axis direction is equal to the distance between the first signal conductor layer and the second column in the Y-axis direction,
    The distance between the first signal conductor layer and the fourth row in the Y-axis direction is equal to the distance between the first signal conductor layer and the first row in the Y-axis direction.
    The multilayer substrate according to any one of claims 1 to 13.
  15.  前記第1信号導体層は、直線形状を有している、
     請求項14に記載の多層基板。
    the first signal conductor layer has a linear shape;
    The multilayer substrate according to claim 14.
  16.  前記多層基板は、
     前記積層体に設けられており、かつ、前記第3列及び前記第4列より前記Y軸の負方向に位置しており、かつ、前記Z軸方向から見て、前記第1信号導体層と平行な線形状を有している第2信号導体層と、
     前記第2信号導体層より前記Z軸の負方向に位置する前記絶縁体層を前記Z軸方向に貫通しており、かつ、前記第1グランド導体層より前記Z軸の正方向に位置している複数の第5柱状導体及び複数の第6柱状導体と、
     を更に備えており、
     前記第1グランド導体層は、前記Z軸方向に見て、前記第2信号導体層と重なっており、
     前記複数の第5柱状導体及び前記複数の第6柱状導体は、前記第1グランド導体層に電気的に接続されており、
     前記Z軸方向に見て、前記複数の第5柱状導体の中心は、前記第2信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第5列に前記所定ピッチで並んでおり、
     前記Z軸方向に見て、前記複数の第6柱状導体の中心は、前記第2信号導体層より前記Y軸の負方向に位置し、かつ、前記X軸方向に延びる第6列に前記所定ピッチで並んでおり、
     前記第6列は、前記第5列より前記Y軸の負方向に位置しており、
     前記Z軸方向に見て、前記複数の第5柱状導体の中心の前記X軸における位置を示す複数の第5X軸位置と前記複数の第6柱状導体の中心の前記X軸における位置を示す複数の第6X軸位置とは、前記X軸方向に交互に並んでおり、
     前記第5X軸位置から前記複数の第3X軸位置の内の前記第5X軸位置に最も近い前記第3X軸位置までの距離は、前記第5X軸位置から前記複数の第4X軸位置の内の前記第5X軸位置に最も近い前記第4X軸位置までの距離より短く、
     前記第6X軸位置から前記複数の第4X軸位置の内の前記第6X軸位置に最も近い前記第4X軸位置までの距離は、前記第6X軸位置から前記複数の第3X軸位置の内の前記第6X軸位置に最も近い前記第3X軸位置までの距離より短い、
     請求項1ないし請求項15のいずれかに記載の多層基板。
    The multilayer substrate includes:
    The first signal conductor layer is provided in the laminate, is located in the negative direction of the Y-axis from the third row and the fourth row, and is similar to the first signal conductor layer when viewed from the Z-axis direction. a second signal conductor layer having a parallel linear shape;
    Penetrating in the Z-axis direction the insulator layer located in the negative direction of the Z-axis from the second signal conductor layer, and located in the positive direction of the Z-axis from the first ground conductor layer. a plurality of fifth columnar conductors and a plurality of sixth columnar conductors,
    Furthermore, it is equipped with
    The first ground conductor layer overlaps the second signal conductor layer when viewed in the Z-axis direction,
    The plurality of fifth columnar conductors and the plurality of sixth columnar conductors are electrically connected to the first ground conductor layer,
    When viewed in the Z-axis direction, the centers of the plurality of fifth columnar conductors are located in the negative direction of the Y-axis from the second signal conductor layer, and are located in the predetermined fifth column extending in the X-axis direction. lined up on the pitch,
    When viewed in the Z-axis direction, the centers of the plurality of sixth columnar conductors are located in the negative direction of the Y-axis from the second signal conductor layer, and are located in the predetermined sixth column extending in the X-axis direction. lined up on the pitch,
    The sixth column is located in the negative direction of the Y axis from the fifth column,
    When viewed in the Z-axis direction, a plurality of fifth X-axis positions indicating the positions of the centers of the plurality of fifth columnar conductors on the X-axis and a plurality of positions indicating the positions of the centers of the plurality of sixth columnar conductors on the X-axis. The sixth X-axis positions are arranged alternately in the X-axis direction,
    The distance from the fifth X-axis position to the third X-axis position closest to the fifth X-axis position among the plurality of third X-axis positions is the distance from the fifth X-axis position to the third X-axis position among the plurality of fourth X-axis positions. shorter than the distance to the fourth X-axis position closest to the fifth X-axis position,
    The distance from the sixth X-axis position to the fourth X-axis position closest to the sixth X-axis position among the plurality of fourth X-axis positions is the distance from the sixth X-axis position to the fourth X-axis position among the plurality of third X-axis positions. shorter than the distance to the third X-axis position closest to the sixth X-axis position;
    The multilayer substrate according to any one of claims 1 to 15.
  17.  前記複数の第1X軸位置と前記複数の第2X軸位置とは、X軸方向に前記所定ピッチの半分のピッチで交互に並んでいる、
     請求項1ないし請求項16のいずれかに記載の多層基板。
    The plurality of first X-axis positions and the plurality of second X-axis positions are alternately arranged in the X-axis direction at a pitch that is half the predetermined pitch.
    The multilayer substrate according to any one of claims 1 to 16.
PCT/JP2023/008998 2022-04-11 2023-03-09 Multilayer substrate WO2023199658A1 (en)

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JPH08335754A (en) * 1995-06-05 1996-12-17 Hewlett Packard Japan Ltd Guard structure employing via hole/through hole
US6518864B1 (en) * 1999-03-15 2003-02-11 Nec Corporation Coplanar transmission line
JP2005183271A (en) * 2003-12-22 2005-07-07 Honda Tsushin Kogyo Co Ltd Flexible cable
JP2006186386A (en) * 2006-02-08 2006-07-13 Kyocera Corp Wiring board for mounting electronic parts and electronic equipment
US7626476B2 (en) * 2006-04-13 2009-12-01 Electronics And Telecommunications Research Institute Multi-metal coplanar waveguide
JP2011071403A (en) * 2009-09-28 2011-04-07 Murata Mfg Co Ltd Signal line
WO2020189699A1 (en) * 2019-03-20 2020-09-24 株式会社村田製作所 Transmission path substrate, and mounting structure for transmission path substrate

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS506364U (en) * 1973-05-16 1975-01-23
JPH08335754A (en) * 1995-06-05 1996-12-17 Hewlett Packard Japan Ltd Guard structure employing via hole/through hole
US6518864B1 (en) * 1999-03-15 2003-02-11 Nec Corporation Coplanar transmission line
JP2005183271A (en) * 2003-12-22 2005-07-07 Honda Tsushin Kogyo Co Ltd Flexible cable
JP2006186386A (en) * 2006-02-08 2006-07-13 Kyocera Corp Wiring board for mounting electronic parts and electronic equipment
US7626476B2 (en) * 2006-04-13 2009-12-01 Electronics And Telecommunications Research Institute Multi-metal coplanar waveguide
JP2011071403A (en) * 2009-09-28 2011-04-07 Murata Mfg Co Ltd Signal line
WO2020189699A1 (en) * 2019-03-20 2020-09-24 株式会社村田製作所 Transmission path substrate, and mounting structure for transmission path substrate

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