WO2023190923A1 - Tête d'éjection de liquide et dispositif d'impression - Google Patents

Tête d'éjection de liquide et dispositif d'impression Download PDF

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Publication number
WO2023190923A1
WO2023190923A1 PCT/JP2023/013287 JP2023013287W WO2023190923A1 WO 2023190923 A1 WO2023190923 A1 WO 2023190923A1 JP 2023013287 W JP2023013287 W JP 2023013287W WO 2023190923 A1 WO2023190923 A1 WO 2023190923A1
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WO
WIPO (PCT)
Prior art keywords
liquid ejection
ejection head
flow path
liquid
path member
Prior art date
Application number
PCT/JP2023/013287
Other languages
English (en)
Japanese (ja)
Inventor
英 岩渕
直人 宮越
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2023190923A1 publication Critical patent/WO2023190923A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles

Definitions

  • the disclosed embodiments relate to a liquid ejection head and a recording device.
  • Inkjet printers and inkjet plotters that use an inkjet recording method are known as printing devices.
  • Such an inkjet printing apparatus is equipped with a liquid ejection head for ejecting liquid.
  • a liquid ejection head includes a first flow path member, a second flow path member, a drive IC, and a heat sink.
  • the first channel member discharges liquid.
  • the second channel member supplies the liquid to the first channel member.
  • the drive IC controls ejection of the liquid.
  • the drive IC contacts the heat sink.
  • the second flow path member has a notch that accommodates the heat sink.
  • FIG. 1 is a front view schematically showing the front of a printer according to an embodiment.
  • FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment.
  • FIG. 3 is a perspective view showing an example of a schematic configuration of the liquid ejection head according to the first embodiment.
  • FIG. 4 is a perspective view showing an example of a schematic configuration of the second flow path member according to the first embodiment.
  • FIG. 5 is a partially enlarged perspective view of the liquid ejection head shown in FIG. 3.
  • FIG. FIG. 6 is a cross-sectional view showing an example of the liquid ejection head according to the first embodiment.
  • FIG. 7 is a cross-sectional view showing another example of the liquid ejection head according to the first embodiment.
  • FIG. 1 is a front view schematically showing the front of a printer according to an embodiment.
  • FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment.
  • FIG. 3 is a perspective view showing an
  • FIG. 8 is a plan view showing an example of a schematic configuration of a heat sink included in the liquid ejection head according to the second embodiment.
  • FIG. 9 is a perspective view showing an example of a partially enlarged schematic configuration of the liquid ejection head according to the second embodiment.
  • FIG. 10 is a plan view showing an example of a schematic configuration of a heat sink and a heat insulating member included in a liquid ejection head according to a third embodiment.
  • FIG. 11 is a perspective view showing an example of a partially enlarged schematic configuration of a liquid ejection head according to a third embodiment.
  • FIG. 12 is a perspective view showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment.
  • FIG. 13 is a perspective view showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment.
  • each embodiment can be combined as appropriate within the range that does not conflict with the processing contents. Further, in each of the embodiments below, the same parts are given the same reference numerals, and redundant explanations will be omitted.
  • FIG. 1 is a front view schematically showing the front of a printer according to an embodiment.
  • FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment.
  • the printer according to the embodiment is, for example, a color inkjet printer.
  • the printer 1 includes a paper feed roller 2, a guide roller 3, a coating machine 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads. 8, a conveyance roller 9, a dryer 10, a conveyance roller 11, a sensor section 12, and a collection roller 13.
  • the conveyance roller 6 is an example of a conveyance section.
  • the printer 1 has a control section 14 that controls each section of the printer 1.
  • the control unit 14 includes a paper feed roller 2, a guide roller 3, a coating machine 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, a plurality of liquid ejection heads 8, a transport roller 9, a dryer 10, and a transport roller. 11. Controls the operation of the sensor section 12 and collection roller 13.
  • the printer 1 records images and characters on the printing paper P by causing droplets to land on the printing paper P.
  • Print paper P is an example of a recording medium.
  • the printing paper P is wound around the paper feed roller 2 before use.
  • the printer 1 transports printing paper P from a paper feed roller 2 through a guide roller 3 and a coater 4 into a head case 5 .
  • the coating machine 4 uniformly applies the coating agent to the printing paper P. Thereby, since the printing paper P can be surface-treated, the printing quality of the printer 1 can be improved.
  • the head case 5 accommodates a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads 8. Inside the head case 5, a space is formed that is isolated from the outside except for a portion where the printing paper P enters and exits and is connected to the outside.
  • control unit 14 In the internal space of the head case 5, at least one of control factors such as temperature, humidity, and atmospheric pressure is controlled by the control unit 14 as necessary.
  • the conveyance roller 6 conveys the printing paper P to the vicinity of the liquid ejection head 8 inside the head case 5 .
  • the frame 7 is a rectangular flat plate, and is located close to above the printing paper P conveyed by the conveyance roller 6. Further, as shown in FIG. 2, the frame 7 is positioned such that its longitudinal direction is orthogonal to the conveyance direction of the printing paper P. Inside the head case 5, a plurality of (for example, four) frames 7 are positioned at predetermined intervals along the conveyance direction of the printing paper P.
  • a liquid for example, ink
  • the liquid ejection head 8 ejects liquid supplied from a liquid tank.
  • the control unit 14 controls the liquid ejection head 8 based on data such as images and characters, and causes the liquid to be ejected toward the printing paper P.
  • the distance between the liquid ejection head 8 and the printing paper P is, for example, about 0.5 to 20 mm.
  • the liquid ejection head 8 is fixed to the frame 7.
  • the liquid ejection head 8 is positioned such that its longitudinal direction is perpendicular to the conveyance direction of the printing paper P.
  • the printer 1 according to the present embodiment is a so-called line printer in which the liquid ejection head 8 is fixed inside the printer 1.
  • the printer 1 according to this embodiment is not limited to a line printer, and may be a so-called serial printer.
  • a serial printer is a printer that alternately records by moving the liquid ejection head 8 back and forth in a direction intersecting the conveying direction of the printing paper P, for example, in a direction substantially perpendicular to the conveyance direction, and transporting the printing paper P. This is a type of printer that uses
  • a plurality of (for example, five) liquid ejection heads 8 are fixed to one frame 7.
  • FIG. 2 an example is shown in which three liquid ejection heads 8 are located in the front and two liquid ejection heads 8 are located in the rear in the transport direction of the printing paper P.
  • the liquid ejection heads 8 are positioned so that their centers do not overlap.
  • a plurality of liquid ejection heads 8 located on one frame 7 constitute a head group 8A.
  • the four head groups 8A are located along the conveyance direction of the printing paper P. Inks of four colors are supplied to the liquid ejection heads 8 belonging to the same head group 8A. Thereby, the printer 1 can perform printing with four color inks using the four head groups 8A.
  • the colors of ink ejected from each liquid ejection head 8 are, for example, magenta (M), yellow (Y), cyan (C), and black (K).
  • the control unit 14 can print a color image on the printing paper P by controlling each liquid ejection head 8 to eject ink of a plurality of colors onto the printing paper P.
  • a coating agent may be ejected onto the printing paper P from the liquid ejection head 8.
  • the number of liquid ejection heads 8 included in one head group 8A and the number of head groups 8A mounted on the printer 1 can be changed as appropriate depending on the object to be printed and printing conditions. For example, if a printable range is to be printed with one liquid ejection head 8, the number of liquid ejection heads 8 mounted on the printer 1 may be one.
  • the printing paper P that has been printed inside the head case 5 is transported to the outside of the head case 5 by transport rollers 9 and passes through the inside of the dryer 10.
  • the dryer 10 dries the printed printing paper P.
  • the printing paper P dried in the dryer 10 is transported by a transport roller 11 and collected by a collection roller 13.
  • the printer 1 by drying the printing paper P in the dryer 10, it is possible to suppress adhesion of the printing paper P wound up overlappingly to each other and to prevent undried liquid from rubbing on the collection roller 13. can.
  • the sensor section 12 is composed of a position sensor, a speed sensor, a temperature sensor, etc.
  • the control section 14 can determine the status of each section of the printer 1 based on information from the sensor section 12 and control each section of the printer 1 .
  • the printing target in the printer 1 is not limited to the printing paper P, and rolls of cloth etc. You can also use it as the printing paper P, and rolls of cloth etc.
  • the printer 1 may place it on a conveyor belt and convey it. By using the conveyor belt, the printer 1 can print on sheets of paper, cut cloth, wood, tiles, and the like.
  • the printer 1 may print a wiring pattern of an electronic device or the like by discharging a liquid containing conductive particles from the liquid discharging head 8. Further, the printer 1 may produce a chemical agent by ejecting a predetermined amount of a liquid chemical agent or a liquid containing a chemical agent from the liquid ejecting head 8 toward a reaction container or the like.
  • the printer 1 may include a cleaning section that cleans the liquid ejection head 8.
  • the cleaning section cleans the liquid ejection head 8 by, for example, wiping processing or capping processing.
  • the wiping process is a process in which liquid adhering to the liquid ejection head 8 is removed by, for example, wiping the surface of the area where the liquid is ejected with a flexible wiper.
  • the capping process is performed as follows, for example. First, a cap is placed to cover the surface of the area from which liquid is to be discharged (this is called capping). As a result, a substantially sealed space is formed between the surface of the portion where the liquid is ejected and the cap. Next, the liquid is repeatedly discharged in such a sealed space. This makes it possible to remove liquids and foreign objects that are clogged in the nozzle 21A (see FIG. 3) and have a higher viscosity than in the standard state.
  • FIG. 3 is a perspective view showing an example of a schematic configuration of the liquid ejection head according to the first embodiment.
  • FIG. 3 shows a three-dimensional orthogonal coordinate system including a Z axis whose positive direction is vertically upward. Such an orthogonal coordinate system may also be shown in other drawings used in the description below.
  • the direction in which the nozzle 21A (see FIG. 3) is located in the liquid ejection head 8, that is, the Z-axis negative direction side will be referred to as "lower” or “downward", and the Z-axis positive
  • the direction side is sometimes referred to as "upper” or "upper”.
  • each member may be omitted or simplified in some cases.
  • the liquid ejection head 8 includes a first flow path member 21, a second flow path member 22, a pressurizing section 23, a connector section 26, a first flow path 27, and a second flow path member 22.
  • the head cover 29 includes a passage 28, a head cover 29, and heat sinks 31 and 32.
  • the first flow path member 21 is located on the bottom side of the liquid ejection head 8 facing the printing paper P (see FIG. 1).
  • the first flow path member 21 has a nozzle 21A.
  • the nozzle 21A is open on the bottom surface of the liquid ejection head 8, and ejects the liquid supplied inside the first channel member 21 to the outside.
  • the second flow path member 22 is located above the first flow path member 21.
  • the second channel member 22 supplies liquid to the first channel member 21 .
  • the second flow path member 22 has a flow path 22A connected to the nozzle 21A. Liquid is supplied from the first flow path 27 into the flow path 22A. Note that details of the second flow path member 22 will be described later.
  • the pressurizing unit 23 controls the discharge of liquid from the first flow path member 21 according to the drive signal.
  • the pressurizing section 23 includes a piezoelectric element that is displaced by energization, and a pressure chamber whose internal pressure changes according to the displacement of the piezoelectric element.
  • the pressurizing unit 23 controls the discharge of liquid from the nozzle 21A of the first channel member 21 to the outside by changing the internal pressure of the pressure chamber.
  • the connector section 26 has a connector 24.
  • Connector 24 is electrically connected to pressurizing section 23 .
  • the connector section 26 receives a drive signal from the outside, for example, for driving a piezoelectric element included in the pressure section 23, in accordance with a control signal output from the control section 14 (see FIG. 1). Further, the connector section 26 may include a connector cover 25 located between the connector 24 and the head cover 29.
  • the first flow path 27 supplies liquid to the inside of the second flow path member 22.
  • the second channel 28 collects liquid from inside the second channel member 22 .
  • the liquid recovered from the second flow path 28 is supplied to the first flow path 27 through, for example, a filter (not shown).
  • the head cover 29 has a plate shape and is arranged to cover a space located on the opposite side of the first flow path member 21 with the second flow path member 22 interposed therebetween.
  • the head cover 29 has a top plate 290, first side plates 291, 292, and second side plates 293, 294, 295.
  • the top plate 290 is located at the end on the positive Z-axis side along the XY plane.
  • the first side plates 291 and 292 are located at both ends in the Y-axis direction along the ZX plane.
  • the first side plate 291 is located at the end on the Y-axis negative direction side.
  • the first side plate 292 is located at the end on the Y-axis positive direction side.
  • One end of the first side plates 291 and 292 is connected to the top plate 290, and the other end is located above the second flow path member 22.
  • the second side plates 293, 294, and 295 are located at both ends in the X-axis direction along the YZ plane.
  • the second side plate 293 is connected to the top plate 290 at one end.
  • the second side plate 294 is connected to the first side plate 291 at one end.
  • the second side plate 295 is connected to the first side plate 292 at one end.
  • the head cover 29 can be made of a conductive metal material such as aluminum, for example. Further, the head cover 29 may be made of, for example, a conductive or insulating resin material. Thereby, heat is appropriately radiated from the liquid ejection head 8 via the head cover 29. Further, the head cover 29 may have higher thermal conductivity than the second flow path member 22. Thereby, heat conduction from the head cover 29 to the second flow path member 22 is less likely to occur. Therefore, for example, it is possible to reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance.
  • the head cover 29 may be in contact with the second flow path member 22 or may be apart from the second flow path member 22. By locating the head cover 29 away from the second flow path member 22, heat conduction from the head cover 29 to the second flow path member 22 is less likely to occur, and heat conduction to the heat sinks 31 and 32 is promoted. Therefore, for example, it is possible to reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance.
  • the heat sinks 31 and 32 are plate-shaped members located along the YZ plane.
  • the heat sinks 31 and 32 are located facing each other in the X-axis direction with the head cover 29 in between.
  • the heat sinks 31 and 32 are connected to the second side plates 293, 294, and 295 of the head cover 29 via the fixing member 42.
  • the heat sinks 31 and 32 receive the heat generated inside the liquid ejection head 8 from the head cover 29 and radiate it.
  • the head cover 29 receives the heat generated inside the liquid ejection head 8 from the heat sinks 31 and 32 and radiates it.
  • the fixing member 42 may be, for example, a metal screw member. Thereby, by screwing the heat sinks 31 and 32 to the head cover 29, the liquid ejection head 8 can secure a heat radiation route.
  • the fixing member 42 is an example of a second member that connects the heat sinks 31 and 32 and the head cover 29.
  • the heat sinks 31 and 32 can be made of the same material as the head cover 29, for example. Further, the heat sinks 31 and 32 may be made of a material having higher thermal conductivity than the head cover 29, for example.
  • FIG. 4 is a perspective view showing an example of a schematic configuration of the second flow path member according to the first embodiment.
  • FIG. 5 is a partially enlarged perspective view of the liquid ejection head shown in FIG. 3.
  • FIG. 6 is a cross-sectional view showing an example of the liquid ejection head according to the first embodiment.
  • the second flow path member 22 has a first notch 221, a second notch 222, and a flow path 224.
  • the first notch 221, the second notch 222, and the flow path portion 224 are provided on the upper surface of the second flow path member 22 (in the positive direction of the Z-axis).
  • the first notch 221 and the second notch 222 are located so as to cut out the side surface 220 of the second flow path member 22.
  • the side surfaces 220 are located at both ends of the second flow path member 22 in the width direction along the X-axis.
  • the first notch 221 accommodates heat sinks 31 and 32.
  • the length of the heat sinks 31 and 32 in the Z-axis direction can be increased compared to the head cover 29, so that, for example, the heat dissipation performance of the liquid ejection head 8 can be improved.
  • the heat sinks 31 and 32 in the first notch 221 it is possible to avoid increasing the size of the liquid ejection head 8 in the X-axis direction, for example.
  • the first notch 221 is located on the side surface 220, for example, the heat sinks 31 and 32 can be easily accommodated.
  • an adhesive 41 may be positioned between the heat sinks 31 and 32 and the first notch 221.
  • the heat sinks 31 and 32 and the first notch 221 may be fixed with the adhesive 41.
  • the adhesive 41 is an example of a first member that connects the heat sinks 31 and 32 and the second flow path member 22.
  • the adhesive 41 may be, for example, a resin-based adhesive containing a thermosetting resin or a photocurable resin.
  • the adhesive 41 may be made of a material having higher thermal conductivity than the fixing member 42, for example. Thereby, for example, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 via the adhesive 41 can be reduced.
  • the second notch 222 is located closer to the center of the second flow path member 22 than the first notch 221, and is arranged so as to cut out the first notch 221. Further, the second notch 222 has an opening 223. As shown in FIG. 6, the flexible substrates 51 and 52 are inserted into the opening 223. The flexible substrates 51 and 52 are electrically connected at one end to the pressurizing section 23 and at the other end to the connector 24, respectively.
  • a drive IC (Integrated Circuit) 61 is mounted on the flexible substrate 51, and a drive IC 62 is mounted on the flexible substrate 52.
  • the drive ICs 61 and 62 are so-called integrated circuits, and are heat sources that generate heat when energized.
  • the drive ICs 61 and 62 control the pressurizing section 23 according to the drive signal sent from the connector 24, and control the discharge of liquid.
  • the drive ICs 61 and 62 are pressed against the heat sinks 31 and 32 by a pressing member 70 and elastic members 71 and 72.
  • the pressing member 70 is made of, for example, a metal member or a resin member, and has a predetermined rigidity.
  • the pressing member 70 has a portion facing the drive ICs 61 and 62 with the flexible substrates 51 and 52 interposed therebetween.
  • the elastic members 71, 72 are located between the pressing member 70 and the drive ICs 61, 62 (flexible substrates 51, 52). In this way, the drive ICs 61 and 62 are pressed against the heat sinks 31 and 32 with an appropriate pressing force by the pressing member 70 and the elastic members 71 and 72.
  • the drive ICs 61 and 62 may be fixed to the heat sinks 31 and 32 by, for example, an adhesive (not shown).
  • the second flow path member 22 has the second notch 222, for example, the other end side of the flexible substrates 51, 52 whose one end is connected to the pressurizing part 23 can be easily pulled out. Therefore, for example, workability in assembling the liquid ejection head 8 is improved.
  • the second channel member 22 has the first notch 221 and the second notch 222, the contact area between the heat sinks 31 and 32 and the second channel member 22 is reduced, for example. Therefore, for example, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 can be reduced.
  • the flow path portion 224 is a recessed portion located at the center of the second flow path member 22 and extending in the length direction along the Y-axis direction. As shown in FIG. 6, the flow path portion 224 is sealed by a lid-like member 30 located above the second flow path member 22, and forms a flow path 22A. Note that the lid-like member 30 may be configured integrally with the second channel member 22.
  • FIG. 7 is a cross-sectional view showing another example of the liquid ejection head according to the first embodiment.
  • an intermediate member 43 located between the heat sinks 31 and 32 and the second flow path member 22 may be further provided.
  • the intermediate member 43 may be an elastic member having lower thermal conductivity than the heat sinks 31 and 32 and the second channel member 22, such as a resin sponge.
  • the intermediate member 43 can serve as a buffer material and a spacer between the heat sinks 31 and 32 and the second flow path member 22, for example. Thereby, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 becomes more difficult to occur. Therefore, for example, it is possible to further reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance.
  • heat sinks 31 and 32 are located apart from the second flow path member 22, it means that the heat sinks 31 and 32 are not in direct contact with the second flow path member 22. That is, as shown in FIG. 7, another member may be interposed between the heat dissipation plates 31, 32 and the second flow path member 22, or they may be separated without intervening.
  • FIG. 8 is a plan view showing an example of a schematic configuration of a heat sink included in the liquid ejection head according to the second embodiment.
  • the heat sink 31 may have a first portion 311 and a second portion 312.
  • the first portion 311 is located on the negative side of the Z-axis relative to the second portion 312 .
  • the first portion 311 has a longer length in the Y-axis direction than the second portion 312.
  • the first portion 311 of the heat sink 31 is a first wide portion that is wider in the longitudinal direction of the liquid ejection head 8 than the other portions.
  • the heat sink 31 having the first portion 311 for example, the heat capacity of the heat sink 31 can be improved, and the heat dissipation performance of the liquid ejection head 8 is improved.
  • FIG. 9 is a perspective view showing an example of a partially enlarged schematic configuration of the liquid ejection head according to the second embodiment.
  • the first portion 311, which is the first wide portion of the heat sink 31, may be accommodated in the first notch 221.
  • the heat dissipation plate 31 and/or the liquid ejection head 8 can be prevented from increasing in size in the height direction (Z-axis direction).
  • the heat capacity can be improved, and the heat dissipation of the liquid ejection head 8 is improved.
  • the adhesive can be fixed on the upper surface of the protruding first portion 311, improving workability.
  • the heat sink 32 can also have the same configuration as the heat sink 31.
  • FIG. 10 is a plan view showing an example of a schematic configuration of a heat sink and a heat insulating member included in the liquid ejection head according to the third embodiment.
  • FIG. 11 is a perspective view showing an example of a partially enlarged schematic configuration of a liquid ejection head according to a third embodiment.
  • the liquid ejection head 8 according to this embodiment is different from the liquid ejection head 8 according to each of the embodiments described above in that it further includes a heat insulating member 80 located between the heat sink 31 and the first flow path member 21. Therefore, heat transfer from the heat sink 31 to the first flow path member 21 can be further reduced.
  • the heat insulating member 80 is made of, for example, epoxy resin.
  • the thermal conductivity of the heat insulating member 80 may be lower than that of the heat sink 31.
  • the thermal conductivity of the heat insulating member 80 is, for example, 0.19 (W/m°C). Providing the heat insulating member 80 makes it difficult for the heat generated by the drive IC 61 to be transmitted to the first flow path member 21 via the heat sink 31.
  • the heat sink 31 may have a third portion 313 and a fourth portion 314.
  • the third portion 313 is located closer to the Z-axis negative direction than the fourth portion 314 .
  • the third portion 313 has a smaller length in the Y-axis direction than the fourth portion 314.
  • the heat insulating member 80 may include a first portion 801, a second portion 802, and a third portion 803.
  • the second portion 802 and the third portion 803 are located at both ends in the Y-axis direction.
  • a third portion 313 of the heat sink 31 is accommodated between the second portion 802 and the third portion 803.
  • the first portion 801 is located on the negative side of the Z-axis relative to the second portion 802 and the third portion 803.
  • the first portion 801 has a longer length along the Y-axis direction than the second portion 802 and the third portion 803.
  • the first portion 801 of the heat insulating member 80 is a second wide portion that is wider in the longitudinal direction of the liquid ejection head 8 than the other portions.
  • the bonding area between the heat sink 31 and the second flow path member 22 can be increased, and the bonding strength is improved.
  • the first portion 801 which is the second wide portion of the heat insulating member 80, may be accommodated in the first notch 221.
  • the first portion 801 of the heat insulating member 80 is accommodated in the first notch 221 and joined to the second flow path member 22, thereby making the liquid ejection head 8 compact in appearance, for example. Can be done. Further, for example, when fixing the heat insulating member 80 to the second channel member 22 with an adhesive, the adhesive can be fixed on the upper surface of the protruding first portion 801, improving workability.
  • FIGS. 12 and 13 are perspective views showing an example of a heat insulating member included in a liquid ejection head according to a third embodiment.
  • the heat insulating member 80 is a member that extends long in the longitudinal direction (Y-axis direction) of the liquid ejection head 8.
  • the heat insulating member 80 has a first section 81 , a second section 82 , and a third section 83 that connects the first section 81 and the second section 82 .
  • the heat insulating member 80 has a substantially S-shaped cross section.
  • the first portion 81 and the second portion 82 are located offset in the X-axis direction.
  • the first portion 81 has a surface 811 facing inside of the liquid ejection head 8 .
  • the second portion 82 has a surface 821 facing the outside of the liquid ejection head 8 .
  • the third portion 53 connects the lower portion of the first portion 81 and the upper portion of the second portion 82 and accommodates the third portion 313 of the heat sink 31 .
  • the heat insulating member 80 may include a protrusion 84 that protrudes from the first portion 81 toward the outside of the liquid ejection head 8.
  • the protrusion 84 can prevent relative displacement between the heat sink 31 and the heat insulating member 80.
  • the heat sink 31 may have a recess that can accommodate the protrusion 84.
  • FIGS. 10 to 13 the shape and arrangement of the heat sink 31 and the heat insulating member 80 located near the heat sink 31 have been described, but the heat sink 32 and the heat insulating member located near the heat sink 32 are also described.
  • the structure can be similar to that of the heat sink 31 and the heat insulating member 80.
  • the heat sinks 31 and 32 are connected to the second side plates 293, 294, and 295 of the head cover 29 via the fixing member 42, but the heat sinks 31 and 32 and the second side plates 293 , 294, 295, and the adhesive 41 and the fixing member 42 may be used for connection. Thereby, the heat sinks 31 and 32 and the head cover 29 can be more firmly fixed.
  • the second side plates 293, 294, and 295 of the head cover 29 are positioned independently, but two or more of the second side plates 293 to 295 are positioned consecutively. You can.
  • the liquid ejection head 8 has been described as having the heat sinks 31 and 32, but it may have only one of the heat sinks 31 and 32. Furthermore, in such a case, the second flow path member 22 only needs to have the first notch 221 corresponding to the heat sink that the liquid ejection head 8 has.
  • the liquid ejection head 8 includes the first flow path member 21, the second flow path member 22, the drive ICs 61 and 62, and the heat sinks 31 and 32.
  • the first channel member 21 discharges liquid.
  • the second channel member 22 supplies liquid to the first channel member 21 .
  • the drive ICs 61 and 62 control the ejection of liquid.
  • the drive ICs 61 and 62 are in contact with the heat sinks 31 and 32.
  • the second channel member 22 has a notch (first notch 221) that accommodates the heat sinks 31 and 32.

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  • Manufacturing & Machinery (AREA)
  • Ink Jet (AREA)

Abstract

Une tête d'éjection de liquide comprend un premier élément de passage d'écoulement, un second élément de passage d'écoulement, un circuit intégré d'attaque et une plaque de dissipation de chaleur. Le premier élément de passage d'écoulement éjecte un liquide. Le second élément de passage d'écoulement fournit le liquide au premier élément de passage d'écoulement. Le circuit intégré d'attaque commande l'éjection du liquide. Le circuit intégré d'attaque est en contact avec la plaque de dissipation de chaleur. Le second élément de passage d'écoulement présente une section d'encoche qui reçoit la plaque de dissipation de chaleur.
PCT/JP2023/013287 2022-03-30 2023-03-30 Tête d'éjection de liquide et dispositif d'impression WO2023190923A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268850A (ja) * 2006-03-31 2007-10-18 Brother Ind Ltd インクジェットヘッド
WO2016190413A1 (fr) * 2015-05-27 2016-12-01 京セラ株式会社 Tête d'éjection de liquide et dispositif d'enregistrement
WO2020158905A1 (fr) * 2019-01-31 2020-08-06 京セラ株式会社 Tête d'éjection de liquide et dispositif d'enregistrement
JP2020189404A (ja) * 2019-05-17 2020-11-26 東芝テック株式会社 液体吐出ヘッド及び液体吐出装置
WO2020250873A1 (fr) * 2019-06-14 2020-12-17 京セラ株式会社 Tête de distribution de liquide et dispositif d'enregistrement

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268850A (ja) * 2006-03-31 2007-10-18 Brother Ind Ltd インクジェットヘッド
WO2016190413A1 (fr) * 2015-05-27 2016-12-01 京セラ株式会社 Tête d'éjection de liquide et dispositif d'enregistrement
WO2020158905A1 (fr) * 2019-01-31 2020-08-06 京セラ株式会社 Tête d'éjection de liquide et dispositif d'enregistrement
JP2020189404A (ja) * 2019-05-17 2020-11-26 東芝テック株式会社 液体吐出ヘッド及び液体吐出装置
WO2020250873A1 (fr) * 2019-06-14 2020-12-17 京セラ株式会社 Tête de distribution de liquide et dispositif d'enregistrement

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