WO2023190923A1 - Liquid ejection head and recording device - Google Patents

Liquid ejection head and recording device Download PDF

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Publication number
WO2023190923A1
WO2023190923A1 PCT/JP2023/013287 JP2023013287W WO2023190923A1 WO 2023190923 A1 WO2023190923 A1 WO 2023190923A1 JP 2023013287 W JP2023013287 W JP 2023013287W WO 2023190923 A1 WO2023190923 A1 WO 2023190923A1
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WO
WIPO (PCT)
Prior art keywords
liquid ejection
ejection head
flow path
liquid
path member
Prior art date
Application number
PCT/JP2023/013287
Other languages
French (fr)
Japanese (ja)
Inventor
英 岩渕
直人 宮越
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2023190923A1 publication Critical patent/WO2023190923A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles

Definitions

  • the disclosed embodiments relate to a liquid ejection head and a recording device.
  • Inkjet printers and inkjet plotters that use an inkjet recording method are known as printing devices.
  • Such an inkjet printing apparatus is equipped with a liquid ejection head for ejecting liquid.
  • a liquid ejection head includes a first flow path member, a second flow path member, a drive IC, and a heat sink.
  • the first channel member discharges liquid.
  • the second channel member supplies the liquid to the first channel member.
  • the drive IC controls ejection of the liquid.
  • the drive IC contacts the heat sink.
  • the second flow path member has a notch that accommodates the heat sink.
  • FIG. 1 is a front view schematically showing the front of a printer according to an embodiment.
  • FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment.
  • FIG. 3 is a perspective view showing an example of a schematic configuration of the liquid ejection head according to the first embodiment.
  • FIG. 4 is a perspective view showing an example of a schematic configuration of the second flow path member according to the first embodiment.
  • FIG. 5 is a partially enlarged perspective view of the liquid ejection head shown in FIG. 3.
  • FIG. FIG. 6 is a cross-sectional view showing an example of the liquid ejection head according to the first embodiment.
  • FIG. 7 is a cross-sectional view showing another example of the liquid ejection head according to the first embodiment.
  • FIG. 1 is a front view schematically showing the front of a printer according to an embodiment.
  • FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment.
  • FIG. 3 is a perspective view showing an
  • FIG. 8 is a plan view showing an example of a schematic configuration of a heat sink included in the liquid ejection head according to the second embodiment.
  • FIG. 9 is a perspective view showing an example of a partially enlarged schematic configuration of the liquid ejection head according to the second embodiment.
  • FIG. 10 is a plan view showing an example of a schematic configuration of a heat sink and a heat insulating member included in a liquid ejection head according to a third embodiment.
  • FIG. 11 is a perspective view showing an example of a partially enlarged schematic configuration of a liquid ejection head according to a third embodiment.
  • FIG. 12 is a perspective view showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment.
  • FIG. 13 is a perspective view showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment.
  • each embodiment can be combined as appropriate within the range that does not conflict with the processing contents. Further, in each of the embodiments below, the same parts are given the same reference numerals, and redundant explanations will be omitted.
  • FIG. 1 is a front view schematically showing the front of a printer according to an embodiment.
  • FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment.
  • the printer according to the embodiment is, for example, a color inkjet printer.
  • the printer 1 includes a paper feed roller 2, a guide roller 3, a coating machine 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads. 8, a conveyance roller 9, a dryer 10, a conveyance roller 11, a sensor section 12, and a collection roller 13.
  • the conveyance roller 6 is an example of a conveyance section.
  • the printer 1 has a control section 14 that controls each section of the printer 1.
  • the control unit 14 includes a paper feed roller 2, a guide roller 3, a coating machine 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, a plurality of liquid ejection heads 8, a transport roller 9, a dryer 10, and a transport roller. 11. Controls the operation of the sensor section 12 and collection roller 13.
  • the printer 1 records images and characters on the printing paper P by causing droplets to land on the printing paper P.
  • Print paper P is an example of a recording medium.
  • the printing paper P is wound around the paper feed roller 2 before use.
  • the printer 1 transports printing paper P from a paper feed roller 2 through a guide roller 3 and a coater 4 into a head case 5 .
  • the coating machine 4 uniformly applies the coating agent to the printing paper P. Thereby, since the printing paper P can be surface-treated, the printing quality of the printer 1 can be improved.
  • the head case 5 accommodates a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads 8. Inside the head case 5, a space is formed that is isolated from the outside except for a portion where the printing paper P enters and exits and is connected to the outside.
  • control unit 14 In the internal space of the head case 5, at least one of control factors such as temperature, humidity, and atmospheric pressure is controlled by the control unit 14 as necessary.
  • the conveyance roller 6 conveys the printing paper P to the vicinity of the liquid ejection head 8 inside the head case 5 .
  • the frame 7 is a rectangular flat plate, and is located close to above the printing paper P conveyed by the conveyance roller 6. Further, as shown in FIG. 2, the frame 7 is positioned such that its longitudinal direction is orthogonal to the conveyance direction of the printing paper P. Inside the head case 5, a plurality of (for example, four) frames 7 are positioned at predetermined intervals along the conveyance direction of the printing paper P.
  • a liquid for example, ink
  • the liquid ejection head 8 ejects liquid supplied from a liquid tank.
  • the control unit 14 controls the liquid ejection head 8 based on data such as images and characters, and causes the liquid to be ejected toward the printing paper P.
  • the distance between the liquid ejection head 8 and the printing paper P is, for example, about 0.5 to 20 mm.
  • the liquid ejection head 8 is fixed to the frame 7.
  • the liquid ejection head 8 is positioned such that its longitudinal direction is perpendicular to the conveyance direction of the printing paper P.
  • the printer 1 according to the present embodiment is a so-called line printer in which the liquid ejection head 8 is fixed inside the printer 1.
  • the printer 1 according to this embodiment is not limited to a line printer, and may be a so-called serial printer.
  • a serial printer is a printer that alternately records by moving the liquid ejection head 8 back and forth in a direction intersecting the conveying direction of the printing paper P, for example, in a direction substantially perpendicular to the conveyance direction, and transporting the printing paper P. This is a type of printer that uses
  • a plurality of (for example, five) liquid ejection heads 8 are fixed to one frame 7.
  • FIG. 2 an example is shown in which three liquid ejection heads 8 are located in the front and two liquid ejection heads 8 are located in the rear in the transport direction of the printing paper P.
  • the liquid ejection heads 8 are positioned so that their centers do not overlap.
  • a plurality of liquid ejection heads 8 located on one frame 7 constitute a head group 8A.
  • the four head groups 8A are located along the conveyance direction of the printing paper P. Inks of four colors are supplied to the liquid ejection heads 8 belonging to the same head group 8A. Thereby, the printer 1 can perform printing with four color inks using the four head groups 8A.
  • the colors of ink ejected from each liquid ejection head 8 are, for example, magenta (M), yellow (Y), cyan (C), and black (K).
  • the control unit 14 can print a color image on the printing paper P by controlling each liquid ejection head 8 to eject ink of a plurality of colors onto the printing paper P.
  • a coating agent may be ejected onto the printing paper P from the liquid ejection head 8.
  • the number of liquid ejection heads 8 included in one head group 8A and the number of head groups 8A mounted on the printer 1 can be changed as appropriate depending on the object to be printed and printing conditions. For example, if a printable range is to be printed with one liquid ejection head 8, the number of liquid ejection heads 8 mounted on the printer 1 may be one.
  • the printing paper P that has been printed inside the head case 5 is transported to the outside of the head case 5 by transport rollers 9 and passes through the inside of the dryer 10.
  • the dryer 10 dries the printed printing paper P.
  • the printing paper P dried in the dryer 10 is transported by a transport roller 11 and collected by a collection roller 13.
  • the printer 1 by drying the printing paper P in the dryer 10, it is possible to suppress adhesion of the printing paper P wound up overlappingly to each other and to prevent undried liquid from rubbing on the collection roller 13. can.
  • the sensor section 12 is composed of a position sensor, a speed sensor, a temperature sensor, etc.
  • the control section 14 can determine the status of each section of the printer 1 based on information from the sensor section 12 and control each section of the printer 1 .
  • the printing target in the printer 1 is not limited to the printing paper P, and rolls of cloth etc. You can also use it as the printing paper P, and rolls of cloth etc.
  • the printer 1 may place it on a conveyor belt and convey it. By using the conveyor belt, the printer 1 can print on sheets of paper, cut cloth, wood, tiles, and the like.
  • the printer 1 may print a wiring pattern of an electronic device or the like by discharging a liquid containing conductive particles from the liquid discharging head 8. Further, the printer 1 may produce a chemical agent by ejecting a predetermined amount of a liquid chemical agent or a liquid containing a chemical agent from the liquid ejecting head 8 toward a reaction container or the like.
  • the printer 1 may include a cleaning section that cleans the liquid ejection head 8.
  • the cleaning section cleans the liquid ejection head 8 by, for example, wiping processing or capping processing.
  • the wiping process is a process in which liquid adhering to the liquid ejection head 8 is removed by, for example, wiping the surface of the area where the liquid is ejected with a flexible wiper.
  • the capping process is performed as follows, for example. First, a cap is placed to cover the surface of the area from which liquid is to be discharged (this is called capping). As a result, a substantially sealed space is formed between the surface of the portion where the liquid is ejected and the cap. Next, the liquid is repeatedly discharged in such a sealed space. This makes it possible to remove liquids and foreign objects that are clogged in the nozzle 21A (see FIG. 3) and have a higher viscosity than in the standard state.
  • FIG. 3 is a perspective view showing an example of a schematic configuration of the liquid ejection head according to the first embodiment.
  • FIG. 3 shows a three-dimensional orthogonal coordinate system including a Z axis whose positive direction is vertically upward. Such an orthogonal coordinate system may also be shown in other drawings used in the description below.
  • the direction in which the nozzle 21A (see FIG. 3) is located in the liquid ejection head 8, that is, the Z-axis negative direction side will be referred to as "lower” or “downward", and the Z-axis positive
  • the direction side is sometimes referred to as "upper” or "upper”.
  • each member may be omitted or simplified in some cases.
  • the liquid ejection head 8 includes a first flow path member 21, a second flow path member 22, a pressurizing section 23, a connector section 26, a first flow path 27, and a second flow path member 22.
  • the head cover 29 includes a passage 28, a head cover 29, and heat sinks 31 and 32.
  • the first flow path member 21 is located on the bottom side of the liquid ejection head 8 facing the printing paper P (see FIG. 1).
  • the first flow path member 21 has a nozzle 21A.
  • the nozzle 21A is open on the bottom surface of the liquid ejection head 8, and ejects the liquid supplied inside the first channel member 21 to the outside.
  • the second flow path member 22 is located above the first flow path member 21.
  • the second channel member 22 supplies liquid to the first channel member 21 .
  • the second flow path member 22 has a flow path 22A connected to the nozzle 21A. Liquid is supplied from the first flow path 27 into the flow path 22A. Note that details of the second flow path member 22 will be described later.
  • the pressurizing unit 23 controls the discharge of liquid from the first flow path member 21 according to the drive signal.
  • the pressurizing section 23 includes a piezoelectric element that is displaced by energization, and a pressure chamber whose internal pressure changes according to the displacement of the piezoelectric element.
  • the pressurizing unit 23 controls the discharge of liquid from the nozzle 21A of the first channel member 21 to the outside by changing the internal pressure of the pressure chamber.
  • the connector section 26 has a connector 24.
  • Connector 24 is electrically connected to pressurizing section 23 .
  • the connector section 26 receives a drive signal from the outside, for example, for driving a piezoelectric element included in the pressure section 23, in accordance with a control signal output from the control section 14 (see FIG. 1). Further, the connector section 26 may include a connector cover 25 located between the connector 24 and the head cover 29.
  • the first flow path 27 supplies liquid to the inside of the second flow path member 22.
  • the second channel 28 collects liquid from inside the second channel member 22 .
  • the liquid recovered from the second flow path 28 is supplied to the first flow path 27 through, for example, a filter (not shown).
  • the head cover 29 has a plate shape and is arranged to cover a space located on the opposite side of the first flow path member 21 with the second flow path member 22 interposed therebetween.
  • the head cover 29 has a top plate 290, first side plates 291, 292, and second side plates 293, 294, 295.
  • the top plate 290 is located at the end on the positive Z-axis side along the XY plane.
  • the first side plates 291 and 292 are located at both ends in the Y-axis direction along the ZX plane.
  • the first side plate 291 is located at the end on the Y-axis negative direction side.
  • the first side plate 292 is located at the end on the Y-axis positive direction side.
  • One end of the first side plates 291 and 292 is connected to the top plate 290, and the other end is located above the second flow path member 22.
  • the second side plates 293, 294, and 295 are located at both ends in the X-axis direction along the YZ plane.
  • the second side plate 293 is connected to the top plate 290 at one end.
  • the second side plate 294 is connected to the first side plate 291 at one end.
  • the second side plate 295 is connected to the first side plate 292 at one end.
  • the head cover 29 can be made of a conductive metal material such as aluminum, for example. Further, the head cover 29 may be made of, for example, a conductive or insulating resin material. Thereby, heat is appropriately radiated from the liquid ejection head 8 via the head cover 29. Further, the head cover 29 may have higher thermal conductivity than the second flow path member 22. Thereby, heat conduction from the head cover 29 to the second flow path member 22 is less likely to occur. Therefore, for example, it is possible to reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance.
  • the head cover 29 may be in contact with the second flow path member 22 or may be apart from the second flow path member 22. By locating the head cover 29 away from the second flow path member 22, heat conduction from the head cover 29 to the second flow path member 22 is less likely to occur, and heat conduction to the heat sinks 31 and 32 is promoted. Therefore, for example, it is possible to reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance.
  • the heat sinks 31 and 32 are plate-shaped members located along the YZ plane.
  • the heat sinks 31 and 32 are located facing each other in the X-axis direction with the head cover 29 in between.
  • the heat sinks 31 and 32 are connected to the second side plates 293, 294, and 295 of the head cover 29 via the fixing member 42.
  • the heat sinks 31 and 32 receive the heat generated inside the liquid ejection head 8 from the head cover 29 and radiate it.
  • the head cover 29 receives the heat generated inside the liquid ejection head 8 from the heat sinks 31 and 32 and radiates it.
  • the fixing member 42 may be, for example, a metal screw member. Thereby, by screwing the heat sinks 31 and 32 to the head cover 29, the liquid ejection head 8 can secure a heat radiation route.
  • the fixing member 42 is an example of a second member that connects the heat sinks 31 and 32 and the head cover 29.
  • the heat sinks 31 and 32 can be made of the same material as the head cover 29, for example. Further, the heat sinks 31 and 32 may be made of a material having higher thermal conductivity than the head cover 29, for example.
  • FIG. 4 is a perspective view showing an example of a schematic configuration of the second flow path member according to the first embodiment.
  • FIG. 5 is a partially enlarged perspective view of the liquid ejection head shown in FIG. 3.
  • FIG. 6 is a cross-sectional view showing an example of the liquid ejection head according to the first embodiment.
  • the second flow path member 22 has a first notch 221, a second notch 222, and a flow path 224.
  • the first notch 221, the second notch 222, and the flow path portion 224 are provided on the upper surface of the second flow path member 22 (in the positive direction of the Z-axis).
  • the first notch 221 and the second notch 222 are located so as to cut out the side surface 220 of the second flow path member 22.
  • the side surfaces 220 are located at both ends of the second flow path member 22 in the width direction along the X-axis.
  • the first notch 221 accommodates heat sinks 31 and 32.
  • the length of the heat sinks 31 and 32 in the Z-axis direction can be increased compared to the head cover 29, so that, for example, the heat dissipation performance of the liquid ejection head 8 can be improved.
  • the heat sinks 31 and 32 in the first notch 221 it is possible to avoid increasing the size of the liquid ejection head 8 in the X-axis direction, for example.
  • the first notch 221 is located on the side surface 220, for example, the heat sinks 31 and 32 can be easily accommodated.
  • an adhesive 41 may be positioned between the heat sinks 31 and 32 and the first notch 221.
  • the heat sinks 31 and 32 and the first notch 221 may be fixed with the adhesive 41.
  • the adhesive 41 is an example of a first member that connects the heat sinks 31 and 32 and the second flow path member 22.
  • the adhesive 41 may be, for example, a resin-based adhesive containing a thermosetting resin or a photocurable resin.
  • the adhesive 41 may be made of a material having higher thermal conductivity than the fixing member 42, for example. Thereby, for example, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 via the adhesive 41 can be reduced.
  • the second notch 222 is located closer to the center of the second flow path member 22 than the first notch 221, and is arranged so as to cut out the first notch 221. Further, the second notch 222 has an opening 223. As shown in FIG. 6, the flexible substrates 51 and 52 are inserted into the opening 223. The flexible substrates 51 and 52 are electrically connected at one end to the pressurizing section 23 and at the other end to the connector 24, respectively.
  • a drive IC (Integrated Circuit) 61 is mounted on the flexible substrate 51, and a drive IC 62 is mounted on the flexible substrate 52.
  • the drive ICs 61 and 62 are so-called integrated circuits, and are heat sources that generate heat when energized.
  • the drive ICs 61 and 62 control the pressurizing section 23 according to the drive signal sent from the connector 24, and control the discharge of liquid.
  • the drive ICs 61 and 62 are pressed against the heat sinks 31 and 32 by a pressing member 70 and elastic members 71 and 72.
  • the pressing member 70 is made of, for example, a metal member or a resin member, and has a predetermined rigidity.
  • the pressing member 70 has a portion facing the drive ICs 61 and 62 with the flexible substrates 51 and 52 interposed therebetween.
  • the elastic members 71, 72 are located between the pressing member 70 and the drive ICs 61, 62 (flexible substrates 51, 52). In this way, the drive ICs 61 and 62 are pressed against the heat sinks 31 and 32 with an appropriate pressing force by the pressing member 70 and the elastic members 71 and 72.
  • the drive ICs 61 and 62 may be fixed to the heat sinks 31 and 32 by, for example, an adhesive (not shown).
  • the second flow path member 22 has the second notch 222, for example, the other end side of the flexible substrates 51, 52 whose one end is connected to the pressurizing part 23 can be easily pulled out. Therefore, for example, workability in assembling the liquid ejection head 8 is improved.
  • the second channel member 22 has the first notch 221 and the second notch 222, the contact area between the heat sinks 31 and 32 and the second channel member 22 is reduced, for example. Therefore, for example, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 can be reduced.
  • the flow path portion 224 is a recessed portion located at the center of the second flow path member 22 and extending in the length direction along the Y-axis direction. As shown in FIG. 6, the flow path portion 224 is sealed by a lid-like member 30 located above the second flow path member 22, and forms a flow path 22A. Note that the lid-like member 30 may be configured integrally with the second channel member 22.
  • FIG. 7 is a cross-sectional view showing another example of the liquid ejection head according to the first embodiment.
  • an intermediate member 43 located between the heat sinks 31 and 32 and the second flow path member 22 may be further provided.
  • the intermediate member 43 may be an elastic member having lower thermal conductivity than the heat sinks 31 and 32 and the second channel member 22, such as a resin sponge.
  • the intermediate member 43 can serve as a buffer material and a spacer between the heat sinks 31 and 32 and the second flow path member 22, for example. Thereby, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 becomes more difficult to occur. Therefore, for example, it is possible to further reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance.
  • heat sinks 31 and 32 are located apart from the second flow path member 22, it means that the heat sinks 31 and 32 are not in direct contact with the second flow path member 22. That is, as shown in FIG. 7, another member may be interposed between the heat dissipation plates 31, 32 and the second flow path member 22, or they may be separated without intervening.
  • FIG. 8 is a plan view showing an example of a schematic configuration of a heat sink included in the liquid ejection head according to the second embodiment.
  • the heat sink 31 may have a first portion 311 and a second portion 312.
  • the first portion 311 is located on the negative side of the Z-axis relative to the second portion 312 .
  • the first portion 311 has a longer length in the Y-axis direction than the second portion 312.
  • the first portion 311 of the heat sink 31 is a first wide portion that is wider in the longitudinal direction of the liquid ejection head 8 than the other portions.
  • the heat sink 31 having the first portion 311 for example, the heat capacity of the heat sink 31 can be improved, and the heat dissipation performance of the liquid ejection head 8 is improved.
  • FIG. 9 is a perspective view showing an example of a partially enlarged schematic configuration of the liquid ejection head according to the second embodiment.
  • the first portion 311, which is the first wide portion of the heat sink 31, may be accommodated in the first notch 221.
  • the heat dissipation plate 31 and/or the liquid ejection head 8 can be prevented from increasing in size in the height direction (Z-axis direction).
  • the heat capacity can be improved, and the heat dissipation of the liquid ejection head 8 is improved.
  • the adhesive can be fixed on the upper surface of the protruding first portion 311, improving workability.
  • the heat sink 32 can also have the same configuration as the heat sink 31.
  • FIG. 10 is a plan view showing an example of a schematic configuration of a heat sink and a heat insulating member included in the liquid ejection head according to the third embodiment.
  • FIG. 11 is a perspective view showing an example of a partially enlarged schematic configuration of a liquid ejection head according to a third embodiment.
  • the liquid ejection head 8 according to this embodiment is different from the liquid ejection head 8 according to each of the embodiments described above in that it further includes a heat insulating member 80 located between the heat sink 31 and the first flow path member 21. Therefore, heat transfer from the heat sink 31 to the first flow path member 21 can be further reduced.
  • the heat insulating member 80 is made of, for example, epoxy resin.
  • the thermal conductivity of the heat insulating member 80 may be lower than that of the heat sink 31.
  • the thermal conductivity of the heat insulating member 80 is, for example, 0.19 (W/m°C). Providing the heat insulating member 80 makes it difficult for the heat generated by the drive IC 61 to be transmitted to the first flow path member 21 via the heat sink 31.
  • the heat sink 31 may have a third portion 313 and a fourth portion 314.
  • the third portion 313 is located closer to the Z-axis negative direction than the fourth portion 314 .
  • the third portion 313 has a smaller length in the Y-axis direction than the fourth portion 314.
  • the heat insulating member 80 may include a first portion 801, a second portion 802, and a third portion 803.
  • the second portion 802 and the third portion 803 are located at both ends in the Y-axis direction.
  • a third portion 313 of the heat sink 31 is accommodated between the second portion 802 and the third portion 803.
  • the first portion 801 is located on the negative side of the Z-axis relative to the second portion 802 and the third portion 803.
  • the first portion 801 has a longer length along the Y-axis direction than the second portion 802 and the third portion 803.
  • the first portion 801 of the heat insulating member 80 is a second wide portion that is wider in the longitudinal direction of the liquid ejection head 8 than the other portions.
  • the bonding area between the heat sink 31 and the second flow path member 22 can be increased, and the bonding strength is improved.
  • the first portion 801 which is the second wide portion of the heat insulating member 80, may be accommodated in the first notch 221.
  • the first portion 801 of the heat insulating member 80 is accommodated in the first notch 221 and joined to the second flow path member 22, thereby making the liquid ejection head 8 compact in appearance, for example. Can be done. Further, for example, when fixing the heat insulating member 80 to the second channel member 22 with an adhesive, the adhesive can be fixed on the upper surface of the protruding first portion 801, improving workability.
  • FIGS. 12 and 13 are perspective views showing an example of a heat insulating member included in a liquid ejection head according to a third embodiment.
  • the heat insulating member 80 is a member that extends long in the longitudinal direction (Y-axis direction) of the liquid ejection head 8.
  • the heat insulating member 80 has a first section 81 , a second section 82 , and a third section 83 that connects the first section 81 and the second section 82 .
  • the heat insulating member 80 has a substantially S-shaped cross section.
  • the first portion 81 and the second portion 82 are located offset in the X-axis direction.
  • the first portion 81 has a surface 811 facing inside of the liquid ejection head 8 .
  • the second portion 82 has a surface 821 facing the outside of the liquid ejection head 8 .
  • the third portion 53 connects the lower portion of the first portion 81 and the upper portion of the second portion 82 and accommodates the third portion 313 of the heat sink 31 .
  • the heat insulating member 80 may include a protrusion 84 that protrudes from the first portion 81 toward the outside of the liquid ejection head 8.
  • the protrusion 84 can prevent relative displacement between the heat sink 31 and the heat insulating member 80.
  • the heat sink 31 may have a recess that can accommodate the protrusion 84.
  • FIGS. 10 to 13 the shape and arrangement of the heat sink 31 and the heat insulating member 80 located near the heat sink 31 have been described, but the heat sink 32 and the heat insulating member located near the heat sink 32 are also described.
  • the structure can be similar to that of the heat sink 31 and the heat insulating member 80.
  • the heat sinks 31 and 32 are connected to the second side plates 293, 294, and 295 of the head cover 29 via the fixing member 42, but the heat sinks 31 and 32 and the second side plates 293 , 294, 295, and the adhesive 41 and the fixing member 42 may be used for connection. Thereby, the heat sinks 31 and 32 and the head cover 29 can be more firmly fixed.
  • the second side plates 293, 294, and 295 of the head cover 29 are positioned independently, but two or more of the second side plates 293 to 295 are positioned consecutively. You can.
  • the liquid ejection head 8 has been described as having the heat sinks 31 and 32, but it may have only one of the heat sinks 31 and 32. Furthermore, in such a case, the second flow path member 22 only needs to have the first notch 221 corresponding to the heat sink that the liquid ejection head 8 has.
  • the liquid ejection head 8 includes the first flow path member 21, the second flow path member 22, the drive ICs 61 and 62, and the heat sinks 31 and 32.
  • the first channel member 21 discharges liquid.
  • the second channel member 22 supplies liquid to the first channel member 21 .
  • the drive ICs 61 and 62 control the ejection of liquid.
  • the drive ICs 61 and 62 are in contact with the heat sinks 31 and 32.
  • the second channel member 22 has a notch (first notch 221) that accommodates the heat sinks 31 and 32.

Abstract

This liquid ejection head comprises a first flow passage member, a second flow passage member, a drive IC, and a heat dissipation plate. The first flow passage member ejects a liquid. The second flow passage member supplies the liquid to the first flow passage member. The drive IC controls the ejection of the liquid. The drive IC is in contact with the heat dissipation plate. The second flow passage member has a notch section which accommodates the heat dissipation plate.

Description

液体吐出ヘッドおよび記録装置Liquid ejection head and recording device
　開示の実施形態は、液体吐出ヘッドおよび記録装置に関する。 The disclosed embodiments relate to a liquid ejection head and a recording device.
　印刷装置として、インクジェット記録方式を利用したインクジェットプリンタやインクジェットプロッタが知られている。このようなインクジェット方式の印刷装置には、液体を吐出させるための液体吐出ヘッドが搭載されている。 Inkjet printers and inkjet plotters that use an inkjet recording method are known as printing devices. Such an inkjet printing apparatus is equipped with a liquid ejection head for ejecting liquid.
　かかる液体吐出ヘッドには、発熱源である駆動ＩＣに放熱板を接触させ、駆動ＩＣから伝達された熱を、放熱板を介して放熱させるものが知られている。 Among such liquid ejection heads, there is known one in which a heat sink is brought into contact with a drive IC, which is a heat source, and the heat transferred from the drive IC is radiated through the heat sink.
特開２０１４－９７６６１号公報JP2014-97661A 特開２００８－８７２３１号公報JP2008-87231A
　実施形態の一態様による液体吐出ヘッドは、第１流路部材と、第２流路部材と、駆動ＩＣと、放熱板とを備える。第１流路部材は、液体を吐出する。第２流路部材は、前記第１流路部材に前記液体を供給する。駆動ＩＣは、前記液体の吐出を制御する。放熱板は、前記駆動ＩＣが接触する。前記第２流路部材は、前記放熱板を収容する切欠部を有する。 A liquid ejection head according to one aspect of the embodiment includes a first flow path member, a second flow path member, a drive IC, and a heat sink. The first channel member discharges liquid. The second channel member supplies the liquid to the first channel member. The drive IC controls ejection of the liquid. The drive IC contacts the heat sink. The second flow path member has a notch that accommodates the heat sink.
図１は、実施形態に係るプリンタの概略的な正面を模式的に示す正面図である。FIG. 1 is a front view schematically showing the front of a printer according to an embodiment. 図２は、実施形態に係るプリンタの概略的な平面を模式的に示す平面図である。FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment. 図３は、第１の実施形態に係る液体吐出ヘッドの概略的な構成の一例を示す斜視図である。FIG. 3 is a perspective view showing an example of a schematic configuration of the liquid ejection head according to the first embodiment. 図４は、第１の実施形態に係る第２流路部材の概略的な構成の一例を示す斜視図である。FIG. 4 is a perspective view showing an example of a schematic configuration of the second flow path member according to the first embodiment. 図５は、図３に示す液体吐出ヘッドを部分的に拡大した斜視図である。FIG. 5 is a partially enlarged perspective view of the liquid ejection head shown in FIG. 3. FIG. 図６は、第１の実施形態に係る液体吐出ヘッドの一例を示す断面図である。FIG. 6 is a cross-sectional view showing an example of the liquid ejection head according to the first embodiment. 図７は、第１の実施形態に係る液体吐出ヘッドの他の一例を示す断面図である。FIG. 7 is a cross-sectional view showing another example of the liquid ejection head according to the first embodiment. 図８は、第２の実施形態に係る液体吐出ヘッドが有する放熱板の概略的な構成の一例を示す平面図である。FIG. 8 is a plan view showing an example of a schematic configuration of a heat sink included in the liquid ejection head according to the second embodiment. 図９は、第２の実施形態に係る液体吐出ヘッドを部分的に拡大した概略的な構成の一例を示す斜視図である。FIG. 9 is a perspective view showing an example of a partially enlarged schematic configuration of the liquid ejection head according to the second embodiment. 図１０は、第３の実施形態に係る液体吐出ヘッドが有する放熱板および断熱部材の概略的な構成の一例を示す平面図である。FIG. 10 is a plan view showing an example of a schematic configuration of a heat sink and a heat insulating member included in a liquid ejection head according to a third embodiment. 図１１は、第３の実施形態に係る液体吐出ヘッドを部分的に拡大した概略的な構成の一例を示す斜視図である。FIG. 11 is a perspective view showing an example of a partially enlarged schematic configuration of a liquid ejection head according to a third embodiment. 図１２は、第３の実施形態に係る液体吐出ヘッドが有する断熱部材の一例を示す斜視図である。FIG. 12 is a perspective view showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment. 図１３は、第３の実施形態に係る液体吐出ヘッドが有する断熱部材の一例を示す斜視図である。FIG. 13 is a perspective view showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment.
　上述の液体吐出ヘッドでは、たとえば、放熱性を向上するという点でさらなる改善の余地がある。 There is room for further improvement in the above-mentioned liquid ejection head, for example, in terms of improving heat dissipation.
　そこで、放熱性の高い液体吐出ヘッドおよび記録装置の提供が期待されている。 Therefore, it is expected to provide a liquid ejection head and a recording device that have high heat dissipation properties.
　以下、添付図面を参照して、本願の開示する液体吐出ヘッドおよび記録装置の実施形態について説明する。なお、以下に示す各実施形態により本開示が限定されるものではない。また、図面は模式的なものであり、各要素の寸法の関係、各要素の比率などは、現実と異なる場合があることに留意する必要がある。さらに、図面の相互間においても、互いの寸法の関係や比率が異なる部分が含まれている場合がある。 Hereinafter, embodiments of a liquid ejection head and a recording apparatus disclosed in the present application will be described with reference to the accompanying drawings. Note that the present disclosure is not limited to the embodiments described below. Furthermore, it should be noted that the drawings are schematic, and the dimensional relationship of each element, the ratio of each element, etc. may differ from reality. Furthermore, drawings may include portions with different dimensional relationships and ratios.
　また、以下に示す各実施形態では、「一定」、「直交」、「垂直」あるいは「平行」といった表現が用いられる場合があるが、これらの表現は、厳密に「一定」、「直交」、「垂直」あるいは「平行」であることを要しない。すなわち、上記した各表現は、たとえば製造精度、設置精度などのずれを許容するものとする。 Furthermore, in each of the embodiments described below, expressions such as "constant", "orthogonal", "perpendicular", or "parallel" may be used, but these expressions strictly do not mean "constant", "orthogonal", It does not need to be "perpendicular" or "parallel". That is, each of the above expressions allows deviations in manufacturing accuracy, installation accuracy, etc., for example.
　また、各実施形態は、処理内容を矛盾させない範囲で適宜組み合わせることが可能である。また、以下の各実施形態において同一の部位には同一の符号を付し、重複する説明は省略される。 Furthermore, each embodiment can be combined as appropriate within the range that does not conflict with the processing contents. Further, in each of the embodiments below, the same parts are given the same reference numerals, and redundant explanations will be omitted.
［実施形態］
＜プリンタの構成＞
　まず、図１および図２を参照して実施形態に係る記録装置の一例であるプリンタの概要について説明する。図１は、実施形態に係るプリンタの概略的な正面を模式的に示す正面図である。図２は、実施形態に係るプリンタの概略的な平面を模式的に示す平面図である。実施形態に係るプリンタは、たとえば、カラーインクジェットプリンタである。 [Embodiment]
<Printer configuration>
First, an overview of a printer, which is an example of a recording device according to an embodiment, will be described with reference to FIGS. 1 and 2. FIG. 1 is a front view schematically showing the front of a printer according to an embodiment. FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment. The printer according to the embodiment is, for example, a color inkjet printer.
　図１に示すように、プリンタ１は、給紙ローラ２と、ガイドローラ３と、塗布機４と、ヘッドケース５と、複数の搬送ローラ６と、複数のフレーム７と、複数の液体吐出ヘッド８と、搬送ローラ９と、乾燥機１０と、搬送ローラ１１と、センサ部１２と、回収ローラ１３とを備える。搬送ローラ６は、搬送部の一例である。 As shown in FIG. 1, the printer 1 includes a paper feed roller 2, a guide roller 3, a coating machine 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads. 8, a conveyance roller 9, a dryer 10, a conveyance roller 11, a sensor section 12, and a collection roller 13. The conveyance roller 6 is an example of a conveyance section.
　さらに、プリンタ１は、プリンタ１の各部を制御する制御部１４を有している。制御部１４は、給紙ローラ２、ガイドローラ３、塗布機４、ヘッドケース５、複数の搬送ローラ６、複数のフレーム７、複数の液体吐出ヘッド８、搬送ローラ９、乾燥機１０、搬送ローラ１１、センサ部１２および回収ローラ１３の動作を制御する。 Further, the printer 1 has a control section 14 that controls each section of the printer 1. The control unit 14 includes a paper feed roller 2, a guide roller 3, a coating machine 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, a plurality of liquid ejection heads 8, a transport roller 9, a dryer 10, and a transport roller. 11. Controls the operation of the sensor section 12 and collection roller 13.
　プリンタ１は、印刷用紙Ｐに液滴を着弾させることにより、印刷用紙Ｐに画像や文字の記録を行う。印刷用紙Ｐは、記録媒体の一例である。印刷用紙Ｐは、使用前において給紙ローラ２に巻かれた状態になっている。プリンタ１は、印刷用紙Ｐを、給紙ローラ２からガイドローラ３および塗布機４を介してヘッドケース５の内部に搬送する。 The printer 1 records images and characters on the printing paper P by causing droplets to land on the printing paper P. Print paper P is an example of a recording medium. The printing paper P is wound around the paper feed roller 2 before use. The printer 1 transports printing paper P from a paper feed roller 2 through a guide roller 3 and a coater 4 into a head case 5 .
　塗布機４は、コーティング剤を印刷用紙Ｐに一様に塗布する。これにより、印刷用紙Ｐに表面処理を施すことができることから、プリンタ１の印刷品質を向上させることができる。 The coating machine 4 uniformly applies the coating agent to the printing paper P. Thereby, since the printing paper P can be surface-treated, the printing quality of the printer 1 can be improved.
　ヘッドケース５は、複数の搬送ローラ６と、複数のフレーム７と、複数の液体吐出ヘッド８とを収容する。ヘッドケース５の内部には、印刷用紙Ｐが出入りする部分などの一部において外部と繋がっている他は、外部と隔離された空間が形成されている。 The head case 5 accommodates a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads 8. Inside the head case 5, a space is formed that is isolated from the outside except for a portion where the printing paper P enters and exits and is connected to the outside.
　ヘッドケース５の内部空間は、必要に応じて、温度、湿度、および気圧などの制御因子のうち、少なくとも１つが制御部１４によって制御される。搬送ローラ６は、ヘッドケース５の内部で印刷用紙Ｐを液体吐出ヘッド８の近傍に搬送する。 In the internal space of the head case 5, at least one of control factors such as temperature, humidity, and atmospheric pressure is controlled by the control unit 14 as necessary. The conveyance roller 6 conveys the printing paper P to the vicinity of the liquid ejection head 8 inside the head case 5 .
　フレーム７は、矩形状の平板であり、搬送ローラ６で搬送される印刷用紙Ｐの上方に近接して位置している。また、図２に示すように、フレーム７は、長手方向が印刷用紙Ｐの搬送方向に直交するように位置している。そして、ヘッドケース５の内部には、複数（たとえば、４つ）のフレーム７が、印刷用紙Ｐの搬送方向に沿って所定の間隔で位置している。 The frame 7 is a rectangular flat plate, and is located close to above the printing paper P conveyed by the conveyance roller 6. Further, as shown in FIG. 2, the frame 7 is positioned such that its longitudinal direction is orthogonal to the conveyance direction of the printing paper P. Inside the head case 5, a plurality of (for example, four) frames 7 are positioned at predetermined intervals along the conveyance direction of the printing paper P.
　液体吐出ヘッド８には、図示しない液体タンクから液体、たとえば、インクが供給される。液体吐出ヘッド８は、液体タンクから供給される液体を吐出する。 A liquid, for example, ink, is supplied to the liquid ejection head 8 from a liquid tank (not shown). The liquid ejection head 8 ejects liquid supplied from a liquid tank.
　制御部１４は、画像や文字などのデータに基づいて液体吐出ヘッド８を制御し、印刷用紙Ｐに向けて液体を吐出させる。液体吐出ヘッド８と印刷用紙Ｐとの間の距離は、たとえば、０．５～２０ｍｍ程度である。 The control unit 14 controls the liquid ejection head 8 based on data such as images and characters, and causes the liquid to be ejected toward the printing paper P. The distance between the liquid ejection head 8 and the printing paper P is, for example, about 0.5 to 20 mm.
　液体吐出ヘッド８は、フレーム７に固定されている。液体吐出ヘッド８は、長手方向が印刷用紙Ｐの搬送方向に直交するように位置している。 The liquid ejection head 8 is fixed to the frame 7. The liquid ejection head 8 is positioned such that its longitudinal direction is perpendicular to the conveyance direction of the printing paper P.
　すなわち、本実施形態に係るプリンタ１は、プリンタ１の内部に液体吐出ヘッド８が固定されている、いわゆるラインプリンタである。なお、本実施形態に係るプリンタ１は、ラインプリンタに限られず、いわゆるシリアルプリンタであってもよい。 That is, the printer 1 according to the present embodiment is a so-called line printer in which the liquid ejection head 8 is fixed inside the printer 1. Note that the printer 1 according to this embodiment is not limited to a line printer, and may be a so-called serial printer.
　シリアルプリンタとは、液体吐出ヘッド８を、印刷用紙Ｐの搬送方向に交差する方向、たとえば、略直交する方向に往復させるなどして移動させながら記録する動作と、印刷用紙Ｐの搬送とを交互に行う方式のプリンタである。 A serial printer is a printer that alternately records by moving the liquid ejection head 8 back and forth in a direction intersecting the conveying direction of the printing paper P, for example, in a direction substantially perpendicular to the conveyance direction, and transporting the printing paper P. This is a type of printer that uses
　図２に示すように、１つのフレーム７に複数（たとえば、５つ）の液体吐出ヘッド８が固定されている。図２では、印刷用紙Ｐの搬送方向の前方に３つ、後方に２つの液体吐出ヘッド８が位置している例を示しており、印刷用紙Ｐの搬送方向において、それぞれの液体吐出ヘッド８の中心が重ならないように液体吐出ヘッド８が位置している。 As shown in FIG. 2, a plurality of (for example, five) liquid ejection heads 8 are fixed to one frame 7. In FIG. 2, an example is shown in which three liquid ejection heads 8 are located in the front and two liquid ejection heads 8 are located in the rear in the transport direction of the printing paper P. The liquid ejection heads 8 are positioned so that their centers do not overlap.
　そして、１つのフレーム７に位置する複数の液体吐出ヘッド８によって、ヘッド群８Ａが構成されている。４つのヘッド群８Ａは、印刷用紙Ｐの搬送方向に沿って位置している。同じヘッド群８Ａに属する液体吐出ヘッド８には、４色のインクが供給される。これにより、プリンタ１は、４つのヘッド群８Ａを用いて４色のインクによる印刷を行うことができる。 A plurality of liquid ejection heads 8 located on one frame 7 constitute a head group 8A. The four head groups 8A are located along the conveyance direction of the printing paper P. Inks of four colors are supplied to the liquid ejection heads 8 belonging to the same head group 8A. Thereby, the printer 1 can perform printing with four color inks using the four head groups 8A.
　各液体吐出ヘッド８から吐出されるインクの色は、たとえば、マゼンタ（Ｍ）、イエロー（Ｙ）、シアン（Ｃ）およびブラック（Ｋ）である。制御部１４は、各液体吐出ヘッド８を制御して複数色のインクを印刷用紙Ｐに吐出することにより、印刷用紙Ｐにカラー画像を印刷することができる。 The colors of ink ejected from each liquid ejection head 8 are, for example, magenta (M), yellow (Y), cyan (C), and black (K). The control unit 14 can print a color image on the printing paper P by controlling each liquid ejection head 8 to eject ink of a plurality of colors onto the printing paper P.
　なお、印刷用紙Ｐの表面処理をするために、液体吐出ヘッド８からコーティング剤を印刷用紙Ｐに吐出してもよい。 Incidentally, in order to perform surface treatment on the printing paper P, a coating agent may be ejected onto the printing paper P from the liquid ejection head 8.
　また、１つのヘッド群８Ａに含まれる液体吐出ヘッド８の個数や、プリンタ１に搭載されているヘッド群８Ａの個数は、印刷する対象や印刷条件に応じて適宜変更可能である。たとえば、１つの液体吐出ヘッド８で印刷可能な範囲を印刷するのであれば、プリンタ１に搭載されている液体吐出ヘッド８の個数は１つでもよい。 Further, the number of liquid ejection heads 8 included in one head group 8A and the number of head groups 8A mounted on the printer 1 can be changed as appropriate depending on the object to be printed and printing conditions. For example, if a printable range is to be printed with one liquid ejection head 8, the number of liquid ejection heads 8 mounted on the printer 1 may be one.
　ヘッドケース５の内部で印刷処理された印刷用紙Ｐは、搬送ローラ９によってヘッドケース５の外部に搬送され、乾燥機１０の内部を通る。乾燥機１０は、印刷処理された印刷用紙Ｐを乾燥する。乾燥機１０で乾燥された印刷用紙Ｐは、搬送ローラ１１で搬送されて、回収ローラ１３で回収される。 The printing paper P that has been printed inside the head case 5 is transported to the outside of the head case 5 by transport rollers 9 and passes through the inside of the dryer 10. The dryer 10 dries the printed printing paper P. The printing paper P dried in the dryer 10 is transported by a transport roller 11 and collected by a collection roller 13.
　プリンタ１では、乾燥機１０で印刷用紙Ｐを乾燥することにより、回収ローラ１３において、重なって巻き取られる印刷用紙Ｐ同士が接着したり、未乾燥の液体が擦れたりすることを抑制することができる。 In the printer 1, by drying the printing paper P in the dryer 10, it is possible to suppress adhesion of the printing paper P wound up overlappingly to each other and to prevent undried liquid from rubbing on the collection roller 13. can.
　センサ部１２は、位置センサや速度センサ、温度センサなどにより構成されている。制御部１４は、センサ部１２からの情報に基づいて、プリンタ１の各部における状態を判断し、プリンタ１の各部を制御することができる。 The sensor section 12 is composed of a position sensor, a speed sensor, a temperature sensor, etc. The control section 14 can determine the status of each section of the printer 1 based on information from the sensor section 12 and control each section of the printer 1 .
　ここまで説明したプリンタ１では、印刷対象（すなわち、記録媒体）として印刷用紙Ｐを用いた場合について示したが、プリンタ１における印刷対象は印刷用紙Ｐに限られず、ロール状の布などを印刷対象としてもよい。 In the printer 1 described so far, the case is shown in which printing paper P is used as the printing target (that is, the recording medium), but the printing target in the printer 1 is not limited to the printing paper P, and rolls of cloth etc. You can also use it as
　また、プリンタ１は、印刷用紙Ｐを直接搬送する代わりに、搬送ベルト上に載せて搬送するものであってもよい。搬送ベルトを用いることで、プリンタ１は、枚葉紙や裁断された布、木材、タイルなどを印刷対象とすることができる。 Furthermore, instead of directly conveying the printing paper P, the printer 1 may place it on a conveyor belt and convey it. By using the conveyor belt, the printer 1 can print on sheets of paper, cut cloth, wood, tiles, and the like.
　また、プリンタ１は、液体吐出ヘッド８から導電性の粒子を含む液体を吐出するようにして、電子機器の配線パターンなどを印刷してもよい。また、プリンタ１は、液体吐出ヘッド８から反応容器などに向けて所定量の液体の化学薬剤や化学薬剤を含んだ液体を吐出させて、化学薬品を作製してもよい。 Further, the printer 1 may print a wiring pattern of an electronic device or the like by discharging a liquid containing conductive particles from the liquid discharging head 8. Further, the printer 1 may produce a chemical agent by ejecting a predetermined amount of a liquid chemical agent or a liquid containing a chemical agent from the liquid ejecting head 8 toward a reaction container or the like.
　また、プリンタ１は、液体吐出ヘッド８をクリーニングするクリーニング部を備えていてもよい。クリーニング部は、たとえば、ワイピング処理やキャッピング処理によって液体吐出ヘッド８の洗浄を行う。 Additionally, the printer 1 may include a cleaning section that cleans the liquid ejection head 8. The cleaning section cleans the liquid ejection head 8 by, for example, wiping processing or capping processing.
　ワイピング処理とは、たとえば、柔軟性のあるワイパーで、液体が吐出される部位の面を払拭することで、液体吐出ヘッド８に付着していた液体を取り除く処理である。 The wiping process is a process in which liquid adhering to the liquid ejection head 8 is removed by, for example, wiping the surface of the area where the liquid is ejected with a flexible wiper.
　また、キャッピング処理は、たとえば、次のように実施する。まず、液体を吐出される部位の面を覆うようにキャップを被せる（これをキャッピングという）。これにより、液体を吐出される部位の面とキャップとの間に、略密閉された空間が形成される。次に、このような密閉された空間で液体の吐出を繰り返す。これにより、ノズル２１Ａ（図３参照）に詰まっていた、標準状態よりも粘度が高い液体や異物などを取り除くことができる。 Additionally, the capping process is performed as follows, for example. First, a cap is placed to cover the surface of the area from which liquid is to be discharged (this is called capping). As a result, a substantially sealed space is formed between the surface of the portion where the liquid is ejected and the cap. Next, the liquid is repeatedly discharged in such a sealed space. This makes it possible to remove liquids and foreign objects that are clogged in the nozzle 21A (see FIG. 3) and have a higher viscosity than in the standard state.
＜液体吐出ヘッドの構成＞
（第１の実施形態）
　次に、図３～図６を参照して第１の実施形態に係る液体吐出ヘッド８の構成について説明する。図３は、第１の実施形態に係る液体吐出ヘッドの概略的な構成の一例を示す斜視図である。 <Configuration of liquid ejection head>
(First embodiment)
Next, the configuration of the liquid ejection head 8 according to the first embodiment will be described with reference to FIGS. 3 to 6. FIG. 3 is a perspective view showing an example of a schematic configuration of the liquid ejection head according to the first embodiment.
　なお、説明を分かりやすくするために、図３には、鉛直上向きを正方向とするＺ軸を含む３次元の直交座標系を図示している。かかる直交座標系は、後述の説明に用いる他の図面でも示す場合がある。また、以下の説明では、便宜的に、液体吐出ヘッド８においてノズル２１Ａ（図３参照）が位置する方向、すなわち、Ｚ軸負方向側を「下」または「下方」と呼称し、Ｚ軸正方向側を「上」または「上方」と呼称する場合がある。また、図３～図６では、各部材を省略または簡略化して示している場合がある。 In order to make the explanation easier to understand, FIG. 3 shows a three-dimensional orthogonal coordinate system including a Z axis whose positive direction is vertically upward. Such an orthogonal coordinate system may also be shown in other drawings used in the description below. In addition, in the following description, for convenience, the direction in which the nozzle 21A (see FIG. 3) is located in the liquid ejection head 8, that is, the Z-axis negative direction side will be referred to as "lower" or "downward", and the Z-axis positive The direction side is sometimes referred to as "upper" or "upper". Further, in FIGS. 3 to 6, each member may be omitted or simplified in some cases.
　図３に示すように、液体吐出ヘッド８は、第１流路部材２１と、第２流路部材２２と、加圧部２３と、コネクタ部２６と、第１流路２７と、第２流路２８と、ヘッドカバー２９と、放熱板３１，３２とを備える。 As shown in FIG. 3, the liquid ejection head 8 includes a first flow path member 21, a second flow path member 22, a pressurizing section 23, a connector section 26, a first flow path 27, and a second flow path member 22. The head cover 29 includes a passage 28, a head cover 29, and heat sinks 31 and 32.
　第１流路部材２１は、印刷用紙Ｐ（図１参照）と対向する液体吐出ヘッド８の底面側に位置している。第１流路部材２１は、ノズル２１Ａを有している。ノズル２１Ａは、液体吐出ヘッド８の底面に開口しており、第１流路部材２１の内部に供給された液体を外部へ吐出する。 The first flow path member 21 is located on the bottom side of the liquid ejection head 8 facing the printing paper P (see FIG. 1). The first flow path member 21 has a nozzle 21A. The nozzle 21A is open on the bottom surface of the liquid ejection head 8, and ejects the liquid supplied inside the first channel member 21 to the outside.
　第２流路部材２２は、第１流路部材２１の上に位置している。第２流路部材２２は、第１流路部材２１に液体を供給する。第２流路部材２２は、ノズル２１Ａに繋がる流路２２Ａを有している。流路２２Ａの内部には、第１流路２７から液体が供給される。なお、第２流路部材２２の詳細については後述する。 The second flow path member 22 is located above the first flow path member 21. The second channel member 22 supplies liquid to the first channel member 21 . The second flow path member 22 has a flow path 22A connected to the nozzle 21A. Liquid is supplied from the first flow path 27 into the flow path 22A. Note that details of the second flow path member 22 will be described later.
　加圧部２３は、駆動信号に応じて第１流路部材２１からの液体の吐出を制御する。加圧部２３は、通電により変位する圧電素子と、圧電素子の変位に応じて内部圧力が変化する圧力室とを有している。加圧部２３は、圧力室の内部圧力を変化させることにより、第１流路部材２１が有するノズル２１Ａから外部への液体の吐出を制御する。 The pressurizing unit 23 controls the discharge of liquid from the first flow path member 21 according to the drive signal. The pressurizing section 23 includes a piezoelectric element that is displaced by energization, and a pressure chamber whose internal pressure changes according to the displacement of the piezoelectric element. The pressurizing unit 23 controls the discharge of liquid from the nozzle 21A of the first channel member 21 to the outside by changing the internal pressure of the pressure chamber.
　コネクタ部２６は、コネクタ２４を有する。コネクタ２４は、加圧部２３に電気的に接続されている。コネクタ部２６は、制御部１４（図１参照）から出力された制御信号に応じて、たとえば加圧部２３が有する圧電素子を駆動させるための駆動信号を外部から受け取る。また、コネクタ部２６は、コネクタ２４とヘッドカバー２９との間に位置するコネクタカバー２５を有してもよい。 The connector section 26 has a connector 24. Connector 24 is electrically connected to pressurizing section 23 . The connector section 26 receives a drive signal from the outside, for example, for driving a piezoelectric element included in the pressure section 23, in accordance with a control signal output from the control section 14 (see FIG. 1). Further, the connector section 26 may include a connector cover 25 located between the connector 24 and the head cover 29.
　第１流路２７は、第２流路部材２２の内部に液体を供給する。第２流路２８は、第２流路部材２２の内部から液体を回収する。第２流路２８から回収された液体は、たとえば、図示しないフィルタを通じて第１流路２７に供給される。 The first flow path 27 supplies liquid to the inside of the second flow path member 22. The second channel 28 collects liquid from inside the second channel member 22 . The liquid recovered from the second flow path 28 is supplied to the first flow path 27 through, for example, a filter (not shown).
　ヘッドカバー２９は、板状であり、第２流路部材２２を挟んで第１流路部材２１の反対側に位置する空間を覆うように配置されている。ヘッドカバー２９は、天板２９０と、第１側板２９１，２９２と、第２側板２９３，２９４，２９５を有する。 The head cover 29 has a plate shape and is arranged to cover a space located on the opposite side of the first flow path member 21 with the second flow path member 22 interposed therebetween. The head cover 29 has a top plate 290, first side plates 291, 292, and second side plates 293, 294, 295.
　天板２９０は、ＸＹ平面に沿うようにＺ軸正方向側の端部に位置している。第１側板２９１，２９２は、ＺＸ平面に沿うようにＹ軸方向の両端部に位置している。第１側板２９１は、Ｙ軸負方向側の端部に位置している。第１側板２９２は、Ｙ軸正方向側の端部に位置している。第１側板２９１，２９２は、一端が天板２９０に繋がっており、他端が第２流路部材２２の上に位置している。 The top plate 290 is located at the end on the positive Z-axis side along the XY plane. The first side plates 291 and 292 are located at both ends in the Y-axis direction along the ZX plane. The first side plate 291 is located at the end on the Y-axis negative direction side. The first side plate 292 is located at the end on the Y-axis positive direction side. One end of the first side plates 291 and 292 is connected to the top plate 290, and the other end is located above the second flow path member 22.
　第２側板２９３，２９４，２９５は、ＹＺ平面に沿うようにＸ軸方向の両端部に位置している。第２側板２９３は、一端が天板２９０に繋がっている。第２側板２９４は、一端が第１側板２９１に繋がっている。第２側板２９５は、一端が第１側板２９２に繋がっている。 The second side plates 293, 294, and 295 are located at both ends in the X-axis direction along the YZ plane. The second side plate 293 is connected to the top plate 290 at one end. The second side plate 294 is connected to the first side plate 291 at one end. The second side plate 295 is connected to the first side plate 292 at one end.
　ヘッドカバー２９は、たとえば、アルミニウムなど、導電性を有する金属材料により構成できる。また、ヘッドカバー２９は、たとえば、導電性または絶縁性を有する樹脂材料により構成されてもよい。これにより、液体吐出ヘッド８は、ヘッドカバー２９を介して適切に放熱される。また、ヘッドカバー２９は、第２流路部材２２よりも熱伝導率が高くてもよい。これにより、ヘッドカバー２９から第２流路部材２２への熱伝導が生じにくくなる。このため、たとえば、第２流路部材２２の内部を流れる液体の性状が変化し、吐出性能に不具合が生じる可能性を低減することができる。 The head cover 29 can be made of a conductive metal material such as aluminum, for example. Further, the head cover 29 may be made of, for example, a conductive or insulating resin material. Thereby, heat is appropriately radiated from the liquid ejection head 8 via the head cover 29. Further, the head cover 29 may have higher thermal conductivity than the second flow path member 22. Thereby, heat conduction from the head cover 29 to the second flow path member 22 is less likely to occur. Therefore, for example, it is possible to reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance.
　ヘッドカバー２９は、第２流路部材２２と接していてもよく、第２流路部材２２から離れていてもよい。ヘッドカバー２９が第２流路部材２２から離れて位置することにより、ヘッドカバー２９から第２流路部材２２への熱伝導が生じにくくなり、放熱板３１，３２への熱伝導が促進される。このため、たとえば、第２流路部材２２の内部を流れる液体の性状が変化し、吐出性能に不具合が生じる可能性を低減することができる。 The head cover 29 may be in contact with the second flow path member 22 or may be apart from the second flow path member 22. By locating the head cover 29 away from the second flow path member 22, heat conduction from the head cover 29 to the second flow path member 22 is less likely to occur, and heat conduction to the heat sinks 31 and 32 is promoted. Therefore, for example, it is possible to reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance.
　放熱板３１，３２は、ＹＺ平面に沿うように位置している板状の部材である。放熱板３１，３２は、ヘッドカバー２９を挟んでＸ軸方向に向かい合って位置している。放熱板３１，３２は、固定部材４２を介してヘッドカバー２９の第２側板２９３，２９４，２９５に接続されている。たとえば、駆動ＩＣ６１，６２の発熱が小さい場合は、放熱板３１，３２は、液体吐出ヘッド８の内部で発生した熱をヘッドカバー２９から受け取り、放散させる。また、たとえば、駆動ＩＣ６１，６２の発熱が大きい場合は、ヘッドカバー２９は、液体吐出ヘッド８の内部で発生した熱を放熱板３１，３２から受け取り、放散させる。固定部材４２は、たとえば、金属製のねじ部材であってもよい。これにより、放熱板３１，３２をヘッドカバー２９にねじ止めすることで、液体吐出ヘッド８は放熱ルートを確保できる。固定部材４２は、放熱板３１，３２とヘッドカバー２９とを接続する第２部材の一例である。 The heat sinks 31 and 32 are plate-shaped members located along the YZ plane. The heat sinks 31 and 32 are located facing each other in the X-axis direction with the head cover 29 in between. The heat sinks 31 and 32 are connected to the second side plates 293, 294, and 295 of the head cover 29 via the fixing member 42. For example, when the heat generated by the drive ICs 61 and 62 is small, the heat sinks 31 and 32 receive the heat generated inside the liquid ejection head 8 from the head cover 29 and radiate it. Further, for example, when the drive ICs 61 and 62 generate a large amount of heat, the head cover 29 receives the heat generated inside the liquid ejection head 8 from the heat sinks 31 and 32 and radiates it. The fixing member 42 may be, for example, a metal screw member. Thereby, by screwing the heat sinks 31 and 32 to the head cover 29, the liquid ejection head 8 can secure a heat radiation route. The fixing member 42 is an example of a second member that connects the heat sinks 31 and 32 and the head cover 29.
　放熱板３１，３２は、たとえば、ヘッドカバー２９と同じ材料で構成することができる。また、放熱板３１，３２は、たとえば、ヘッドカバー２９よりも熱伝導率の高い材料により構成されてもよい。 The heat sinks 31 and 32 can be made of the same material as the head cover 29, for example. Further, the heat sinks 31 and 32 may be made of a material having higher thermal conductivity than the head cover 29, for example.
　図４は、第１の実施形態に係る第２流路部材の概略的な構成の一例を示す斜視図である。図５は、図３に示す液体吐出ヘッドを部分的に拡大した斜視図である。図６は、第１の実施形態に係る液体吐出ヘッドの一例を示す断面図である。 FIG. 4 is a perspective view showing an example of a schematic configuration of the second flow path member according to the first embodiment. FIG. 5 is a partially enlarged perspective view of the liquid ejection head shown in FIG. 3. FIG. FIG. 6 is a cross-sectional view showing an example of the liquid ejection head according to the first embodiment.
　図４に示すように、第２流路部材２２は、第１切欠部２２１と、第２切欠部２２２と、流路部２２４とを有している。第１切欠部２２１と、第２切欠部２２２と、流路部２２４とは、第２流路部材２２の上面（Ｚ軸正方向）に設けられている。 As shown in FIG. 4, the second flow path member 22 has a first notch 221, a second notch 222, and a flow path 224. The first notch 221, the second notch 222, and the flow path portion 224 are provided on the upper surface of the second flow path member 22 (in the positive direction of the Z-axis).
　第１切欠部２２１および第２切欠部２２２は、第２流路部材２２の側面２２０を切り欠くように位置している。側面２２０は、Ｘ軸に沿う第２流路部材２２の幅方向の両端部に位置している。 The first notch 221 and the second notch 222 are located so as to cut out the side surface 220 of the second flow path member 22. The side surfaces 220 are located at both ends of the second flow path member 22 in the width direction along the X-axis.
　また、図５、図６に示すように、第１切欠部２２１には、放熱板３１，３２が収容される。これにより、ヘッドカバー２９と比較して放熱板３１，３２のＺ軸方向の長さを大きくすることができることから、たとえば、液体吐出ヘッド８の放熱性を高めることができる。また、放熱板３１，３２が第１切欠部２２１に収容されることにより、たとえば、液体吐出ヘッド８のＸ軸方向の大型化を回避することができる。また、第１切欠部２２１が側面２２０に位置することにより、たとえば、放熱板３１，３２を容易に収容することができる。 Furthermore, as shown in FIGS. 5 and 6, the first notch 221 accommodates heat sinks 31 and 32. As a result, the length of the heat sinks 31 and 32 in the Z-axis direction can be increased compared to the head cover 29, so that, for example, the heat dissipation performance of the liquid ejection head 8 can be improved. Furthermore, by housing the heat sinks 31 and 32 in the first notch 221, it is possible to avoid increasing the size of the liquid ejection head 8 in the X-axis direction, for example. Further, since the first notch 221 is located on the side surface 220, for example, the heat sinks 31 and 32 can be easily accommodated.
　また、図６に示すように、放熱板３１，３２と第１切欠部２２１との間に接着材４１を位置させてもよい。言い換えると、放熱板３１，３２と、第１切欠部２２１とを接着材４１により固定してもよい。接着材４１は、放熱板３１，３２と第２流路部材２２とを接続する第１部材の一例である。接着材４１は、たとえば、熱硬化性樹脂または光硬化性樹脂などを有する樹脂系の接着材であってもよい。かかる接着材４１は、たとえば、固定部材４２よりも熱伝導率の高い材料により構成されてもよい。これにより、たとえば、接着材４１を介して放熱板３１，３２から第２流路部材２２への熱伝導を低減することができる。 Furthermore, as shown in FIG. 6, an adhesive 41 may be positioned between the heat sinks 31 and 32 and the first notch 221. In other words, the heat sinks 31 and 32 and the first notch 221 may be fixed with the adhesive 41. The adhesive 41 is an example of a first member that connects the heat sinks 31 and 32 and the second flow path member 22. The adhesive 41 may be, for example, a resin-based adhesive containing a thermosetting resin or a photocurable resin. The adhesive 41 may be made of a material having higher thermal conductivity than the fixing member 42, for example. Thereby, for example, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 via the adhesive 41 can be reduced.
　第２切欠部２２２は、第１切欠部２２１よりも第２流路部材２２の中央寄りに位置しており、第１切欠部２２１を切り欠くように配置されている。また、第２切欠部２２２は、開口２２３を有している。図６に示すように、開口２２３には、フレキシブル基板５１，５２が挿通される。フレキシブル基板５１，５２は、一端が加圧部２３に、他端がコネクタ２４に、それぞれ電気的に接続されている。フレキシブル基板５１には、駆動ＩＣ（Integrated　Circuit）６１が実装されており、フレキシブル基板５２には、駆動ＩＣ６２が実装されている。駆動ＩＣ６１，６２は、いわゆる集積回路であり、通電により発熱する発熱源である。駆動ＩＣ６１，６２は、コネクタ２４から送られた駆動信号に応じて加圧部２３を制御し、液体の吐出を制御する。 The second notch 222 is located closer to the center of the second flow path member 22 than the first notch 221, and is arranged so as to cut out the first notch 221. Further, the second notch 222 has an opening 223. As shown in FIG. 6, the flexible substrates 51 and 52 are inserted into the opening 223. The flexible substrates 51 and 52 are electrically connected at one end to the pressurizing section 23 and at the other end to the connector 24, respectively. A drive IC (Integrated Circuit) 61 is mounted on the flexible substrate 51, and a drive IC 62 is mounted on the flexible substrate 52. The drive ICs 61 and 62 are so-called integrated circuits, and are heat sources that generate heat when energized. The drive ICs 61 and 62 control the pressurizing section 23 according to the drive signal sent from the connector 24, and control the discharge of liquid.
　図６に示すように、駆動ＩＣ６１，６２は、押圧部材７０および弾性部材７１，７２によって放熱板３１，３２に押し当てられている。押圧部材７０は、たとえば金属部材または樹脂部材からなり、所定の剛性を有している。押圧部材７０は、フレキシブル基板５１，５２を挟んで駆動ＩＣ６１，６２と向かい合う部分を有している。弾性部材７１，７２は、押圧部材７０と駆動ＩＣ６１，６２（フレキシブル基板５１，５２）との間に位置している。このように、駆動ＩＣ６１，６２は、押圧部材７０および弾性部材７１，７２によって放熱板３１，３２に適度な押圧力で押し当てられている。なお、駆動ＩＣ６１，６２は、たとえば、不図示の接着材により放熱板３１，３２に固定されていてもよい。 As shown in FIG. 6, the drive ICs 61 and 62 are pressed against the heat sinks 31 and 32 by a pressing member 70 and elastic members 71 and 72. The pressing member 70 is made of, for example, a metal member or a resin member, and has a predetermined rigidity. The pressing member 70 has a portion facing the drive ICs 61 and 62 with the flexible substrates 51 and 52 interposed therebetween. The elastic members 71, 72 are located between the pressing member 70 and the drive ICs 61, 62 (flexible substrates 51, 52). In this way, the drive ICs 61 and 62 are pressed against the heat sinks 31 and 32 with an appropriate pressing force by the pressing member 70 and the elastic members 71 and 72. Note that the drive ICs 61 and 62 may be fixed to the heat sinks 31 and 32 by, for example, an adhesive (not shown).
　このように、第２流路部材２２が第２切欠部２２２を有することにより、たとえば一端が加圧部２３に接続されたフレキシブル基板５１，５２の他端側が引き出しやすくなる。このため、たとえば液体吐出ヘッド８の組み立て作業における作業性が向上する。 As described above, since the second flow path member 22 has the second notch 222, for example, the other end side of the flexible substrates 51, 52 whose one end is connected to the pressurizing part 23 can be easily pulled out. Therefore, for example, workability in assembling the liquid ejection head 8 is improved.
　また、第２流路部材２２が第１切欠部２２１および第２切欠部２２２を有することにより、たとえば放熱板３１，３２と第２流路部材２２との接触面積が低減する。このため、たとえば、放熱板３１，３２から第２流路部材２２への熱伝導を低減することができる。 Furthermore, since the second channel member 22 has the first notch 221 and the second notch 222, the contact area between the heat sinks 31 and 32 and the second channel member 22 is reduced, for example. Therefore, for example, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 can be reduced.
　流路部２２４は、第２流路部材２２の中央部分に位置し、Ｙ軸方向に沿う長さ方向に延びる凹部である。図６に示すように、流路部２２４は、第２流路部材２２の上に位置する蓋状部材３０により封止され、流路２２Ａを構成する。なお、蓋状部材３０は、第２流路部材２２と一体に構成されてもよい。 The flow path portion 224 is a recessed portion located at the center of the second flow path member 22 and extending in the length direction along the Y-axis direction. As shown in FIG. 6, the flow path portion 224 is sealed by a lid-like member 30 located above the second flow path member 22, and forms a flow path 22A. Note that the lid-like member 30 may be configured integrally with the second channel member 22.
　上述の実施形態では、放熱板３１，３２は、第２流路部材２２に接していると説明したが、第２流路部材２２から離れて位置してもよい。図７は、第１の実施形態に係る液体吐出ヘッドの他の一例を示す断面図である。 In the above-described embodiment, the heat sinks 31 and 32 were described as being in contact with the second flow path member 22, but they may be located apart from the second flow path member 22. FIG. 7 is a cross-sectional view showing another example of the liquid ejection head according to the first embodiment.
　図７に示すように、放熱板３１，３２と第２流路部材２２との間に位置する中間部材４３をさらに備えてもよい。中間部材４３は、たとえば樹脂製のスポンジなど、放熱板３１，３２および第２流路部材２２よりも熱伝導性の低い弾性部材であってもよい。かかる中間部材４３は、たとえば放熱板３１，３２と第２流路部材２２との間の緩衝材およびスペーサとなり得る。これにより、放熱板３１，３２から第２流路部材２２への熱伝導がさらに生じにくくなる。このため、たとえば、第２流路部材２２の内部を流れる液体の性状が変化し、吐出性能に不具合が生じる可能性をさらに低減することができる。なお、放熱板３１，３２が第２流路部材２２から離れて位置するとは、放熱板３１，３２が、第２流路部材２２と直接接触しないことをいう。すなわち、図７に示すように放熱板３１，３２と第２流路部材２２との間に別の部材が介在してもよく、介在せずに離間していてもよい。 As shown in FIG. 7, an intermediate member 43 located between the heat sinks 31 and 32 and the second flow path member 22 may be further provided. The intermediate member 43 may be an elastic member having lower thermal conductivity than the heat sinks 31 and 32 and the second channel member 22, such as a resin sponge. The intermediate member 43 can serve as a buffer material and a spacer between the heat sinks 31 and 32 and the second flow path member 22, for example. Thereby, heat conduction from the heat sinks 31 and 32 to the second flow path member 22 becomes more difficult to occur. Therefore, for example, it is possible to further reduce the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and a problem will occur in the ejection performance. Note that when the heat sinks 31 and 32 are located apart from the second flow path member 22, it means that the heat sinks 31 and 32 are not in direct contact with the second flow path member 22. That is, as shown in FIG. 7, another member may be interposed between the heat dissipation plates 31, 32 and the second flow path member 22, or they may be separated without intervening.
（第２の実施形態）
　次に、図８、図９を参照して第２の実施形態に係る液体吐出ヘッド８の構成について説明する。図８は、第２の実施形態に係る液体吐出ヘッドが有する放熱板の概略的な構成の一例を示す平面図である。 (Second embodiment)
Next, the configuration of the liquid ejection head 8 according to the second embodiment will be described with reference to FIGS. 8 and 9. FIG. 8 is a plan view showing an example of a schematic configuration of a heat sink included in the liquid ejection head according to the second embodiment.
　図８に示すように、放熱板３１は、第１部位３１１と第２部位３１２とを有してもよい。第１部位３１１は、第２部位３１２よりもＺ軸負方向側に位置している。第１部位３１１は、第２部位３１２よりもＹ軸方向に沿う長さが大きい。言い換えると、放熱板３１の第１部位３１１は、液体吐出ヘッド８の長手方向の幅が他の部分より広い第１幅広部である。 As shown in FIG. 8, the heat sink 31 may have a first portion 311 and a second portion 312. The first portion 311 is located on the negative side of the Z-axis relative to the second portion 312 . The first portion 311 has a longer length in the Y-axis direction than the second portion 312. In other words, the first portion 311 of the heat sink 31 is a first wide portion that is wider in the longitudinal direction of the liquid ejection head 8 than the other portions.
　このように、放熱板３１が第１部位３１１を有することにより、たとえば、放熱板３１の熱容量を向上させることができ、液体吐出ヘッド８の放熱性が向上する。 As described above, by having the heat sink 31 having the first portion 311, for example, the heat capacity of the heat sink 31 can be improved, and the heat dissipation performance of the liquid ejection head 8 is improved.
　図９は、第２の実施形態に係る液体吐出ヘッドを部分的に拡大した概略的な構成の一例を示す斜視図である。図９に示すように、放熱板３１の第１幅広部である第１部位３１１が、第１切欠部２２１に収容されていてもよい。 FIG. 9 is a perspective view showing an example of a partially enlarged schematic configuration of the liquid ejection head according to the second embodiment. As shown in FIG. 9, the first portion 311, which is the first wide portion of the heat sink 31, may be accommodated in the first notch 221.
　このように、第１部位３１１が、第１切欠部２２１に収容されることにより、たとえば、放熱板３１および／または液体吐出ヘッド８を高さ方向（Ｚ軸方向）に大型化することなく、熱容量を向上させることができ、液体吐出ヘッド８の放熱性が向上する。また、たとえば、放熱板３１を接着材にて第２流路部材２２に固定する場合、突出した第１部位３１１の上面に接着材を留めることができ、作業性が向上する。 In this way, by housing the first portion 311 in the first notch 221, for example, the heat dissipation plate 31 and/or the liquid ejection head 8 can be prevented from increasing in size in the height direction (Z-axis direction). The heat capacity can be improved, and the heat dissipation of the liquid ejection head 8 is improved. Further, for example, when fixing the heat dissipation plate 31 to the second flow path member 22 with an adhesive, the adhesive can be fixed on the upper surface of the protruding first portion 311, improving workability.
　なお、図８、図９では、放熱板３１の形状および配置について説明したが、放熱板３２についても、放熱板３１と同様の構成とすることができる。 Although the shape and arrangement of the heat sink 31 have been described in FIGS. 8 and 9, the heat sink 32 can also have the same configuration as the heat sink 31.
（第３の実施形態）
　次に、図１０～図１３を参照して第３の実施形態に係る液体吐出ヘッド８の構成について説明する。図１０は、第３の実施形態に係る液体吐出ヘッドが有する放熱板および断熱部材の概略的な構成の一例を示す平面図である。図１１は、第３の実施形態に係る液体吐出ヘッドを部分的に拡大した概略的な構成の一例を示す斜視図である。 (Third embodiment)
Next, the configuration of the liquid ejection head 8 according to the third embodiment will be described with reference to FIGS. 10 to 13. FIG. 10 is a plan view showing an example of a schematic configuration of a heat sink and a heat insulating member included in the liquid ejection head according to the third embodiment. FIG. 11 is a perspective view showing an example of a partially enlarged schematic configuration of a liquid ejection head according to a third embodiment.
　本実施形態に係る液体吐出ヘッド８は、放熱板３１と第１流路部材２１との間に位置する断熱部材８０をさらに備える点で上記した各実施形態に係る液体吐出ヘッド８と相違する。このため、放熱板３１から第１流路部材２１への熱伝達をさらに低減することができる。 The liquid ejection head 8 according to this embodiment is different from the liquid ejection head 8 according to each of the embodiments described above in that it further includes a heat insulating member 80 located between the heat sink 31 and the first flow path member 21. Therefore, heat transfer from the heat sink 31 to the first flow path member 21 can be further reduced.
　断熱部材８０は、たとえば、エポキシ系の樹脂などで構成されている。断熱部材８０の熱伝導率は、放熱板３１の熱伝導率よりも低くてもよい。断熱部材８０の熱伝導率は、たとえば、０．１９（Ｗ／ｍ℃）である。断熱部材８０を設けることにより、駆動ＩＣ６１で発生した熱が放熱板３１を介して第１流路部材２１に伝わりにくくなる。 The heat insulating member 80 is made of, for example, epoxy resin. The thermal conductivity of the heat insulating member 80 may be lower than that of the heat sink 31. The thermal conductivity of the heat insulating member 80 is, for example, 0.19 (W/m°C). Providing the heat insulating member 80 makes it difficult for the heat generated by the drive IC 61 to be transmitted to the first flow path member 21 via the heat sink 31.
　図１０に示すように、放熱板３１は、第３部位３１３と第４部位３１４とを有してもよい。第３部位３１３は、第４部位３１４よりもＺ軸負方向側に位置している。第３部位３１３は、第４部位３１４よりもＹ軸方向に沿う長さが小さい。 As shown in FIG. 10, the heat sink 31 may have a third portion 313 and a fourth portion 314. The third portion 313 is located closer to the Z-axis negative direction than the fourth portion 314 . The third portion 313 has a smaller length in the Y-axis direction than the fourth portion 314.
　断熱部材８０は、第１部分８０１と、第２部分８０２と、第３部分８０３とを有してもよい。第２部分８０２および第３部分８０３は、Ｙ軸方向の両端に位置している。第２部分８０２と第３部分８０３の間には、放熱板３１の第３部位３１３が収容される。 The heat insulating member 80 may include a first portion 801, a second portion 802, and a third portion 803. The second portion 802 and the third portion 803 are located at both ends in the Y-axis direction. A third portion 313 of the heat sink 31 is accommodated between the second portion 802 and the third portion 803.
　第１部分８０１は、第２部分８０２および第３部分８０３よりもＺ軸負方向側に位置している。第１部分８０１は、第２部分８０２および第３部分８０３よりもＹ軸方向に沿う長さが大きい。言い換えると、断熱部材８０の第１部分８０１は、液体吐出ヘッド８の長手方向の幅が他の部分より広い第２幅広部である。 The first portion 801 is located on the negative side of the Z-axis relative to the second portion 802 and the third portion 803. The first portion 801 has a longer length along the Y-axis direction than the second portion 802 and the third portion 803. In other words, the first portion 801 of the heat insulating member 80 is a second wide portion that is wider in the longitudinal direction of the liquid ejection head 8 than the other portions.
　このように、放熱板３１が第１部分８０１を有することにより、たとえば、放熱板３１と第２流路部材２２との接合面積を大きくすることができ、接合強度が向上する。 As described above, since the heat sink 31 has the first portion 801, for example, the bonding area between the heat sink 31 and the second flow path member 22 can be increased, and the bonding strength is improved.
　また、図１１に示すように、断熱部材８０の第２幅広部である第１部分８０１が、第１切欠部２２１に収容されていてもよい。 Furthermore, as shown in FIG. 11, the first portion 801, which is the second wide portion of the heat insulating member 80, may be accommodated in the first notch 221.
　このように、断熱部材８０の第１部分８０１が、第１切欠部２２１に収容され、第２流路部材２２と接合されることにより、たとえば、外観的にコンパクトな液体吐出ヘッド８とすることができる。また、たとえば、断熱部材８０を接着材にて第２流路部材２２に固定する場合、突出した第１部分８０１の上面に接着材を留めることができ、作業性が向上する。 In this way, the first portion 801 of the heat insulating member 80 is accommodated in the first notch 221 and joined to the second flow path member 22, thereby making the liquid ejection head 8 compact in appearance, for example. Can be done. Further, for example, when fixing the heat insulating member 80 to the second channel member 22 with an adhesive, the adhesive can be fixed on the upper surface of the protruding first portion 801, improving workability.
　次に、本実施形態に係る液体吐出ヘッドが有する断熱部材の構成の一例について、図１２、図１３を参照しながら説明する。図１２、図１３は、第３の実施形態に係る液体吐出ヘッドが有する断熱部材の一例を示す斜視図である。 Next, an example of the configuration of the heat insulating member included in the liquid ejection head according to the present embodiment will be described with reference to FIGS. 12 and 13. 12 and 13 are perspective views showing an example of a heat insulating member included in a liquid ejection head according to a third embodiment.
　図１２、図１３に示すように、断熱部材８０は、液体吐出ヘッド８の長手方向（Ｙ軸方向）へ長く延びる部材である。断熱部材８０は、第１部位８１と、第２部位８２と、第１部位８１および第２部位８２を接続する第３部位８３とを有する。断熱部材８０は、断面視略Ｓ字形状を有している。第１部位８１と第２部位８２とは、Ｘ軸方向にずれて位置している。第１部位８１は、液体吐出ヘッド８の内側に面する面８１１を有する。第２部位８２は、液体吐出ヘッド８の外側に面する面８２１を有する。第３部位５３は、第１部位８１の下部と第２部位８２の上部とを接続するとともに、放熱板３１の第３部位３１３を収容する。 As shown in FIGS. 12 and 13, the heat insulating member 80 is a member that extends long in the longitudinal direction (Y-axis direction) of the liquid ejection head 8. The heat insulating member 80 has a first section 81 , a second section 82 , and a third section 83 that connects the first section 81 and the second section 82 . The heat insulating member 80 has a substantially S-shaped cross section. The first portion 81 and the second portion 82 are located offset in the X-axis direction. The first portion 81 has a surface 811 facing inside of the liquid ejection head 8 . The second portion 82 has a surface 821 facing the outside of the liquid ejection head 8 . The third portion 53 connects the lower portion of the first portion 81 and the upper portion of the second portion 82 and accommodates the third portion 313 of the heat sink 31 .
　また、断熱部材８０は、第１部位８１から液体吐出ヘッド８の外側に向かって突出する突起部８４を有してもよい。突起部８４は、放熱板３１が有する貫通孔３１５（図１１参照）に収容されることにより、放熱板３１と断熱部材８０との相対的な位置ずれを生じにくくすることができる。なお、放熱板３１は、貫通孔３１５に代えて、突起部８４を収容可能な凹部を有してもよい。 Furthermore, the heat insulating member 80 may include a protrusion 84 that protrudes from the first portion 81 toward the outside of the liquid ejection head 8. By being accommodated in the through hole 315 (see FIG. 11) that the heat sink 31 has, the protrusion 84 can prevent relative displacement between the heat sink 31 and the heat insulating member 80. Note that, instead of the through hole 315, the heat sink 31 may have a recess that can accommodate the protrusion 84.
　なお、図１０～図１３では、放熱板３１および放熱板３１の近傍に位置する断熱部材８０の形状および配置について説明したが、放熱板３２および放熱板３２の近傍に位置する断熱部材についても、放熱板３１および断熱部材８０と同様の構成とすることができる。 In FIGS. 10 to 13, the shape and arrangement of the heat sink 31 and the heat insulating member 80 located near the heat sink 31 have been described, but the heat sink 32 and the heat insulating member located near the heat sink 32 are also described. The structure can be similar to that of the heat sink 31 and the heat insulating member 80.
（その他の実施形態）
　上述の各実施形態では、放熱板３１，３２は固定部材４２を介してヘッドカバー２９の第２側板２９３，２９４，２９５と接続されているとして説明したが、放熱板３１，３２と第２側板２９３，２９４，２９５との間に接着材４１を位置させて、接着材４１および固定部材４２を用いて接続してもよい。これにより、放熱板３１，３２とヘッドカバー２９とをより強固に固定することができる。 (Other embodiments)
In each of the embodiments described above, the heat sinks 31 and 32 are connected to the second side plates 293, 294, and 295 of the head cover 29 via the fixing member 42, but the heat sinks 31 and 32 and the second side plates 293 , 294, 295, and the adhesive 41 and the fixing member 42 may be used for connection. Thereby, the heat sinks 31 and 32 and the head cover 29 can be more firmly fixed.
　また、上述の実施形態では、ヘッドカバー２９の第２側板２９３，２９４，２９５はそれぞれ独立して位置しているとして説明したが、第２側板２９３～２９５のうち、２以上が連続して位置してもよい。 Furthermore, in the above-described embodiment, the second side plates 293, 294, and 295 of the head cover 29 are positioned independently, but two or more of the second side plates 293 to 295 are positioned consecutively. You can.
　また、上述の実施形態では、液体吐出ヘッド８が放熱板３１，３２を有するとして説明したが、放熱板３１および３２のうち、一方のみを有していてもよい。また、かかる場合、第２流路部材２２は、液体吐出ヘッド８が有する放熱板に対応する第１切欠部２２１のみを有すればよい。 Furthermore, in the above embodiment, the liquid ejection head 8 has been described as having the heat sinks 31 and 32, but it may have only one of the heat sinks 31 and 32. Furthermore, in such a case, the second flow path member 22 only needs to have the first notch 221 corresponding to the heat sink that the liquid ejection head 8 has.
　以上のように、実施形態に係る液体吐出ヘッド８は、第１流路部材２１と、第２流路部材２２と、駆動ＩＣ６１，６２と、放熱板３１，３２とを備える。第１流路部材２１は、液体を吐出する。第２流路部材２２は、第１流路部材２１に液体を供給する。駆動ＩＣ６１，６２は、液体の吐出を制御する。放熱板３１，３２は、駆動ＩＣ６１，６２が接触する。第２流路部材２２は、放熱板３１，３２を収容する切欠部（第１切欠部２２１）を有する。これにより、実施形態に係る液体吐出ヘッド８によれば、高い放熱性を有することができる。 As described above, the liquid ejection head 8 according to the embodiment includes the first flow path member 21, the second flow path member 22, the drive ICs 61 and 62, and the heat sinks 31 and 32. The first channel member 21 discharges liquid. The second channel member 22 supplies liquid to the first channel member 21 . The drive ICs 61 and 62 control the ejection of liquid. The drive ICs 61 and 62 are in contact with the heat sinks 31 and 32. The second channel member 22 has a notch (first notch 221) that accommodates the heat sinks 31 and 32. Thereby, the liquid ejection head 8 according to the embodiment can have high heat dissipation.
　さらなる効果や変形例は、当業者によって容易に導き出すことができる。このため、本発明のより広範な態様は、以上のように表しかつ記述した特定の詳細及び代表的な実施形態に限定されるものではない。したがって、添付の請求の範囲及びその均等物によって定義される総括的な発明の概念の精神又は範囲から逸脱することなく、様々な変更が可能である。 Further effects and modifications can be easily deduced by those skilled in the art. Therefore, the broader aspects of the invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various changes may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.
１　プリンタ
８　液体吐出ヘッド
１４　制御部
２１　第１流路部材
２１Ａ　ノズル
２２　第２流路部材
２３　加圧部
２９　ヘッドカバー
３１，３２　放熱板
４１　接着材
４２　固定部材
５１，５２　フレキシブル基板
６１，６２　駆動ＩＣ
８０　断熱部材
２２０　側面
２２１　第１切欠部
２２２　第２切欠部
２２３　開口 1 Printer 8 Liquid ejection head 14 Control section 21 First flow path member 21A Nozzle 22 Second flow path member 23 Pressure section 29 Head covers 31, 32 Heat sink 41 Adhesive 42 Fixing members 51, 52 Flexible substrate 61, 62 Drive IC
80 Heat insulating member 220 Side surface 221 First notch 222 Second notch 223 Opening

Claims (15)

  1. 　液体を吐出する第１流路部材と、
    　前記第１流路部材に前記液体を供給する第２流路部材と、
    　前記液体の吐出を制御する駆動ＩＣと、
    　前記駆動ＩＣが接触する放熱板と
    　を備え、
    　前記第２流路部材は、前記放熱板を収容する切欠部を有する
    　液体吐出ヘッド。     a first channel member that discharges liquid;
    a second channel member that supplies the liquid to the first channel member;
    a drive IC that controls ejection of the liquid;
    a heat sink with which the drive IC comes into contact;
    The second flow path member has a notch that accommodates the heat sink. The liquid ejection head.
  2. 　前記切欠部は、前記第２流路部材の側面に位置している、請求項１に記載の液体吐出ヘッド。 The liquid ejection head according to claim 1, wherein the notch is located on a side surface of the second flow path member.
  3. 　前記放熱板は、前記第２流路部材から離れて位置している、請求項１または２に記載の液体吐出ヘッド。 The liquid ejection head according to claim 1 or 2, wherein the heat sink is located apart from the second flow path member.
  4. 　前記放熱板と前記第２流路部材との間に位置する接着材を有する、請求項１～３のいずれか１つに記載の液体吐出ヘッド。 The liquid ejection head according to any one of claims 1 to 3, further comprising an adhesive located between the heat sink and the second flow path member.
  5. 　前記放熱板は、第１部材を介して前記第２流路部材に接続され、前記第１部材および該第１部材よりも熱伝導率の高い第２部材を介してヘッドカバーに接続される、請求項１～４のいずれか１つに記載の液体吐出ヘッド。 The heat sink is connected to the second flow path member via a first member, and connected to the head cover via the first member and a second member having higher thermal conductivity than the first member. The liquid ejection head according to any one of items 1 to 4.
  6. 　前記ヘッドカバーは、前記第２流路部材から離れて位置している、請求項５に記載の液体吐出ヘッド。 The liquid ejection head according to claim 5, wherein the head cover is located apart from the second flow path member.
  7. 　前記ヘッドカバーは、前記第２流路部材よりも熱伝導率が高い、請求項５または６に記載の液体吐出ヘッド。 The liquid ejection head according to claim 5 or 6, wherein the head cover has higher thermal conductivity than the second flow path member.
  8. 　前記第２流路部材は、前記放熱板を収容する第１切欠部と、前記第１切欠部よりも前記第２流路部材の中央寄りに位置する第２切欠部とを有する、請求項１～７のいずれか１つに記載の液体吐出ヘッド。 1 . The second flow path member has a first cutout portion that accommodates the heat sink, and a second cutout portion that is located closer to the center of the second flow path member than the first cutout portion. 7. The liquid ejection head according to any one of items 7 to 7.
  9. 　前記駆動ＩＣが実装されているフレキシブル基板を有し、
    　前記第２切欠部は、前記フレキシブル基板を挿通させる開口を有している、請求項８に記載の液体吐出ヘッド。     It has a flexible substrate on which the driving IC is mounted,
    The liquid ejection head according to claim 8, wherein the second notch has an opening through which the flexible substrate is inserted.
  10. 　前記放熱板は、前記液体吐出ヘッドの長手方向の幅が他の部分より広い第１幅広部を有する、請求項１～９のいずれか１つに記載の液体吐出ヘッド。 The liquid ejection head according to any one of claims 1 to 9, wherein the heat sink has a first wide portion that is wider in the longitudinal direction of the liquid ejection head than other parts.
  11. 　前記第１幅広部が、前記切欠部に収容されている、請求項１０に記載の液体吐出ヘッド。 The liquid ejection head according to claim 10, wherein the first wide portion is accommodated in the notch.
  12. 　液体を吐出する第１流路部材と、
    　前記第１流路部材に前記液体を供給する第２流路部材と、
    　前記液体の吐出を制御する駆動ＩＣと、
    　前記駆動ＩＣが接触する放熱板と、
    　前記放熱板と前記第１流路部材との間に位置する断熱部材と
    　を備え、
    　前記第２流路部材は、前記断熱部材を収容する切欠部を有する
    　液体吐出ヘッド。     a first channel member that discharges liquid;
    a second channel member that supplies the liquid to the first channel member;
    a drive IC that controls ejection of the liquid;
    a heat sink with which the drive IC contacts;
    a heat insulating member located between the heat sink and the first flow path member;
    The second flow path member has a notch that accommodates the heat insulating member. Liquid ejection head.
  13. 　前記断熱部材は、前記液体吐出ヘッドの長手方向の幅が他の部分より広い第２幅広部を有する、請求項１２に記載の液体吐出ヘッド。 The liquid ejection head according to claim 12, wherein the heat insulating member has a second wide portion that is wider in the longitudinal direction of the liquid ejection head than other parts.
  14. 　前記第２幅広部が、前記切欠部に収容されている、請求項１３に記載の液体吐出ヘッド。 The liquid ejection head according to claim 13, wherein the second wide portion is accommodated in the notch.
  15. 　請求項１～１４のいずれか１つに記載の液体吐出ヘッドを備える記録装置。 A recording device comprising the liquid ejection head according to any one of claims 1 to 14.
PCT/JP2023/013287 2022-03-30 2023-03-30 Liquid ejection head and recording device WO2023190923A1 (en)

Applications Claiming Priority (2)

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JP2022-057162 2022-03-30
JP2022057162 2022-03-30

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268850A (en) * 2006-03-31 2007-10-18 Brother Ind Ltd Inkjet head
WO2016190413A1 (en) * 2015-05-27 2016-12-01 京セラ株式会社 Liquid ejection head and recording device
WO2020158905A1 (en) * 2019-01-31 2020-08-06 京セラ株式会社 Liquid ejecting head and recording device
JP2020189404A (en) * 2019-05-17 2020-11-26 東芝テック株式会社 Liquid ejection head and liquid ejection device
WO2020250873A1 (en) * 2019-06-14 2020-12-17 京セラ株式会社 Liquid dispensing head and recording device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268850A (en) * 2006-03-31 2007-10-18 Brother Ind Ltd Inkjet head
WO2016190413A1 (en) * 2015-05-27 2016-12-01 京セラ株式会社 Liquid ejection head and recording device
WO2020158905A1 (en) * 2019-01-31 2020-08-06 京セラ株式会社 Liquid ejecting head and recording device
JP2020189404A (en) * 2019-05-17 2020-11-26 東芝テック株式会社 Liquid ejection head and liquid ejection device
WO2020250873A1 (en) * 2019-06-14 2020-12-17 京セラ株式会社 Liquid dispensing head and recording device

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