JP7328105B2 - Liquid ejection head and recording device - Google Patents

Description

The disclosed embodiments relate to a liquid ejection head and a printing apparatus.

2. Description of the Related Art Inkjet printers and inkjet plotters using an inkjet recording method are known as printing apparatuses. Such an inkjet printing apparatus is equipped with a liquid ejection head for ejecting liquid.

Further, in such a liquid ejection head, a part of the flexible substrate on which the driver IC is mounted (hereinafter also referred to as a connector insertion portion) is inserted into the connector of the wiring substrate, thereby electrically connecting the flexible substrate and the wiring substrate. (see, for example, Patent Document 1).

Japanese Unexamined Patent Application Publication No. 2017-149108

However, in the conventional liquid ejection head, when inserting the connector inserting portion of the flexible substrate into the connector, it may be difficult to insert the connector inserting portion due to the large frictional force at the contact portion between the connector inserting portion and the connector.

One aspect of the embodiments has been made in view of the above, and an object thereof is to provide a liquid ejection head and a recording apparatus in which a connector insertion portion of a flexible substrate can be easily inserted into a connector.

A liquid ejection head according to one aspect of an embodiment includes a head body, a driver IC, a flexible substrate, and a wiring substrate. The head main body has ejection holes for ejecting liquid. A driver IC controls driving of the head body. A flexible substrate has a base substrate, a wiring layer and a cover layer, has the driver IC mounted thereon, and is electrically connected to the head main body. The wiring board has a connector into which a part of the flexible board can be inserted. Moreover, the connector inserting portion of the flexible substrate to be inserted into the connector has a notch.

A recording apparatus according to an aspect of an embodiment includes the liquid ejection head described above, a transport section, and a control section. The transport unit transports the recording medium to the liquid ejection head. A controller controls the driver IC of the liquid ejection head.

According to one aspect of the embodiment, it is possible to provide a liquid ejection head and a recording apparatus in which the connector insertion portion of the flexible substrate can be easily inserted into the connector.

FIG. 1 is an explanatory diagram (part 1) of the recording apparatus according to the embodiment. FIG. 2 is an explanatory diagram (part 2) of the recording apparatus according to the embodiment. FIG. 3 is an exploded perspective view showing a schematic configuration of the liquid ejection head according to the embodiment. 4 is an enlarged plan view of the liquid ejection head shown in FIG. 3. FIG. FIG. 5 is an enlarged view of the area surrounded by the dashed line shown in FIG. 6 is a cross-sectional view taken along the line AA shown in FIG. 4. FIG. FIG. 7 is a perspective view for explaining a flexible substrate and a structure around the flexible substrate according to the embodiment. FIG. 8 is a schematic cross-sectional view in the vicinity of a connector insertion portion of the flexible substrate according to the embodiment. FIG. 9 is a diagram for explaining the configuration of the connector insertion portion of the flexible substrate according to the embodiment; FIG. 10 is a diagram for explaining a connector insertion portion of a flexible substrate of a reference example. FIG. 11 is a diagram for explaining the configuration of the connector insertion portion of the flexible substrate according to Modification 1 of the embodiment. FIG. 12 is a diagram for explaining the configuration of the connector insertion portion of the flexible substrate according to Modification 2 of the embodiment. FIG. 13 is a diagram for explaining a configuration of a connector insertion portion of a flexible substrate according to Modification 3 of the embodiment; FIG. 14 is a diagram for explaining a configuration of a connector insertion portion of a flexible substrate according to Modification 4 of the embodiment; FIG. 15 is a diagram for explaining the configuration of the connector insertion portion of the flexible substrate according to Modification 5 of the embodiment. FIG. 16 is a diagram for explaining the configuration of the connector insertion portion of the flexible substrate according to Modification 6 of the embodiment.

Hereinafter, embodiments of a liquid ejection head and a recording apparatus disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

2. Description of the Related Art Inkjet printers and inkjet plotters using an inkjet recording method are known as printing apparatuses. Such an inkjet printing apparatus is equipped with a liquid ejection head for ejecting liquid.

A piezoelectric method is one of methods for ejecting liquid from a liquid ejection head. Such a piezoelectric liquid ejection head bends and displaces a portion of the wall of the ink channel by a displacement element to mechanically pressurize and eject the ink in the ink channel. In order to drive the piezoelectric element, the liquid ejection head is provided with a driver IC.

Further, in the liquid ejection head, a portion of the flexible substrate on which the driver IC is mounted (hereinafter also referred to as a connector insertion portion) is inserted into the connector of the wiring substrate, thereby electrically connecting the flexible substrate and the wiring substrate. It is connected. Thereby, the flexible substrate and the wiring substrate can be easily connected.

However, in the conventional liquid ejection head, when inserting the connector inserting portion of the flexible substrate into the connector, it may be difficult to insert the connector inserting portion due to the large frictional force at the contact portion between the connector inserting portion and the connector. As a result, workability in manufacturing the liquid ejection head may deteriorate.

Therefore, it is expected to realize a liquid ejection head and a recording apparatus which can overcome the above-mentioned problems and can easily insert the connector insertion portion of the flexible substrate into the connector.

<Printer configuration>
First, an overview of a printer 1, which is an example of a recording apparatus according to an embodiment, will be described with reference to FIGS. 1 and 2. FIG. 1 and 2 are explanatory diagrams of the printer 1 according to the embodiment.

Specifically, FIG. 1 is a schematic side view of the printer 1, and FIG. 2 is a schematic plan view of the printer 1. As shown in FIG. The printer 1 according to the embodiment is, for example, a color inkjet printer.

As shown in FIG. 1, the printer 1 includes a paper feed roller 2, a guide roller 3, a coating machine 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads. 8 , a conveying roller 9 , a dryer 10 , a conveying roller 11 , a sensor section 12 , and a collecting roller 13 . The transport roller 6 is an example of a transport section.

Further, the printer 1 includes a paper feed roller 2, a guide roller 3, a coater 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, a plurality of liquid ejection heads 8, a transport roller 9, a dryer 10, a transport It has a control unit 14 that controls the roller 11 , the sensor unit 12 and the collecting roller 13 .

The printer 1 records images and characters on the printing paper P by causing droplets to land on the printing paper P. FIG. The printing paper P is an example of a recording medium. The printing paper P is wound around the paper feed roller 2 before use. The printer 1 conveys the printing paper P from the paper supply roller 2 to the inside of the head case 5 via the guide rollers 3 and the coater 4 .

The coater 4 evenly coats the printing paper P with the coating agent. As a result, since the printing paper P can be surface-treated, the printing quality of the printer 1 can be improved.

The head case 5 accommodates a plurality of transport rollers 6 , a plurality of frames 7 and a plurality of liquid ejection heads 8 . Inside the head case 5, a space is formed that is isolated from the outside, except for a part that is connected to the outside, such as a portion where the printing paper P enters and exits.

At least one of the control factors such as temperature, humidity, and atmospheric pressure of the internal space of the head case 5 is controlled by the control unit 14 as necessary. The transport roller 6 transports the printing paper P to the vicinity of the liquid ejection head 8 inside the head case 5 .

The frame 7 is a rectangular flat plate and is positioned close to above the printing paper P conveyed by the conveying rollers 6 . Further, as shown in FIG. 2, the frame 7 is positioned so that its longitudinal direction is perpendicular to the direction in which the printing paper P is conveyed. A plurality of (for example, four) frames 7 are positioned along the transport direction of the printing paper P inside the head case 5 .

In the following description, the direction in which the printing paper P is transported is also called the "sub-scanning direction", and the direction perpendicular to the sub-scanning direction and parallel to the printing paper P is also called the "main scanning direction".

Liquid, for example, ink is supplied to the liquid ejection head 8 from a liquid tank (not shown). The liquid ejection head 8 ejects liquid supplied from such a liquid tank.

The control unit 14 controls the liquid ejection head 8 based on data such as images and characters to eject the liquid onto the printing paper P. FIG. The distance between the liquid ejection head 8 and the printing paper P is, for example, approximately 0.5 to 20 mm.

The liquid ejection head 8 is fixed to the frame 7 . The liquid ejection head 8 is fixed to the frame 7 at both ends in the longitudinal direction, for example. The liquid ejection head 8 is positioned so that its longitudinal direction is orthogonal to the direction in which the printing paper P is conveyed.

That is, the printer 1 according to the embodiment is a so-called line printer in which the liquid ejection head 8 is fixed inside the printer 1 . Note that the printer 1 according to the embodiment is not limited to a line printer, and may be a so-called serial printer.

This serial printer combines the operation of recording while moving the liquid ejection head 8 back and forth in a direction intersecting with the transport direction of the printing paper P, for example, in a direction substantially orthogonal to the transport direction, and transporting the printing paper P. This is an alternate printer.

As shown in FIG. 2, a plurality of (for example, five) liquid ejection heads 8 are fixed to one frame 7 . FIG. 2 shows an example in which three liquid ejection heads 8 are positioned forward in the transport direction of the printing paper P and two liquid ejection heads 8 are positioned in the rear. The liquid ejection head 8 is positioned so that the centers of the two do not overlap.

A plurality of liquid ejection heads 8 positioned on one frame 7 constitute a head group 8A. The four head groups 8A are positioned along the direction in which the printing paper P is transported. The same color ink is supplied to the liquid ejection heads 8 belonging to the same head group 8A. Thus, the printer 1 can print with four color inks using the four head groups 8A.

The colors of ink ejected from each head group 8A are, for example, magenta (M), yellow (Y), cyan (C) and black (K). The control unit 14 can print a color image on the printing paper P by controlling each head group 8A to eject a plurality of colors of ink onto the printing paper P. FIG.

In order to treat the surface of the printing paper P, a coating agent may be ejected onto the printing paper P from the liquid ejection head 8 .

Further, the number of liquid ejection heads 8 included in one head group 8A and the number of head groups 8A mounted on the printer 1 can be appropriately changed according to the target to be printed and printing conditions. For example, if the color printed on the printing paper P is a single color and the printable range is printed with one liquid ejection head 8, the number of the liquid ejection heads 8 mounted in the printer 1 may be one. .

The print paper P printed inside the head case 5 is transported outside the head case 5 by transport rollers 9 and passes through the inside of the dryer 10 . The dryer 10 dries the printing paper P that has been printed. The printing paper P dried by the dryer 10 is conveyed by the conveying roller 11 and collected by the collecting roller 13 .

In the printer 1 , by drying the printing paper P with the dryer 10 , it is possible to suppress adhesion of the printing papers P that are wound together in the collecting roller 13 and prevent undried liquid from rubbing against each other. can.

The sensor unit 12 is composed of a position sensor, a speed sensor, a temperature sensor, and the like. The control unit 14 can determine the state of each unit of the printer 1 and control each unit of the printer 1 based on the information from the sensor unit 12 .

In the printer 1 described so far, the printing paper P is used as the printing object (that is, the recording medium). good too.

Further, the printer 1 may convey the printing paper P on a conveyor belt instead of directly conveying it. By using the conveyor belt, the printer 1 can print on sheets, cut cloth, wood, tiles, and the like.

Further, the printer 1 may print a wiring pattern of an electronic device by ejecting liquid containing conductive particles from the liquid ejection head 8 . Further, the printer 1 may eject a predetermined amount of liquid chemical agent or liquid containing the chemical agent from the liquid ejection head 8 toward a reaction container or the like to produce a chemical agent.

The printer 1 may also include a cleaning section that cleans the liquid ejection head 8 . The cleaning section cleans the liquid ejection head 8 by, for example, a wiping process or a capping process.

The wiping process is, for example, using a flexible wiper to wipe the surface of the part from which the liquid is discharged, for example, the second surface 21b (see FIG. 6) of the flow path member 21 (see FIG. 3). This is a process for removing the liquid adhering to the surface 21b.

Also, the capping process is performed, for example, as follows. First, a cap is placed so as to cover the part where the liquid is to be discharged, for example, the second surface 21b of the channel member 21 (this is called capping). Thereby, a substantially closed space is formed between the second surface 21b and the cap.

Next, liquid ejection is repeated in such a closed space. As a result, it is possible to remove the liquid, the foreign matter, and the like, which are clogged in the discharge hole 63 (see FIG. 4) and have a viscosity higher than that in the standard state.

<Structure of Liquid Ejection Head>
Next, the configuration of the liquid ejection head 8 according to the embodiment will be described with reference to FIG. FIG. 3 is an exploded perspective view showing a schematic configuration of the liquid ejection head 8 according to the embodiment.

The liquid ejection head 8 includes a head body 20 , a wiring section 30 , a housing 40 and a pair of heat sinks 50 . The head body 20 has a channel member 21 , a piezoelectric actuator substrate 22 (see FIG. 4), and a reservoir 23 .

In the following description, for the sake of convenience, the direction in which the head body 20 is provided in the liquid ejection head 8 is also referred to as "bottom", and the direction in which the housing 40 is provided with respect to the head body 20 is also referred to as "upper". do.

The flow path member 21 of the head body 20 has a substantially flat plate shape, and includes a first surface 21a (see FIG. 6), which is one main surface, and a second surface 21b (see FIG. 6) located on the opposite side of the first surface 21a. See). The first surface 21a has an opening 61a (see FIG. 4), and the liquid is supplied from the reservoir 23 to the inside of the channel member 21 through the opening 61a.

A plurality of ejection holes 63 (see FIG. 4) for ejecting liquid onto the printing paper P are positioned on the second surface 21b. A flow path is formed inside the flow path member 21 to allow the liquid to flow from the first surface 21a to the second surface 21b. Details of the flow path member 21 will be described later.

The piezoelectric actuator substrate 22 is positioned on the first surface 21 a of the flow path member 21 . The piezoelectric actuator substrate 22 has a plurality of displacement elements 70 (see FIG. 5). A flexible substrate 31 of a wiring portion 30 is electrically connected to the piezoelectric actuator substrate 22 . Details of the piezoelectric actuator substrate 22 will be described later.

A reservoir 23 is arranged on the piezoelectric actuator substrate 22 . The reservoir 23 is provided with openings 23a at both ends in the main scanning direction. The reservoir 23 has a channel inside and is supplied with liquid from the outside through an opening 23a. The reservoir 23 has a function of supplying liquid to the channel member 21 and a function of storing the supplied liquid.

The wiring section 30 has a flexible substrate 31 , a wiring substrate 32 , a driver IC 33 , a pressing member 34 and an elastic member 35 . The flexible substrate 31 has a function of transmitting a predetermined signal sent from the outside to the head body 20 . In addition, as shown in FIG. 3, the liquid ejection head 8 according to the embodiment has two flexible substrates 31 .

One end of the flexible substrate 31 is electrically connected to the piezoelectric actuator substrate 22 of the head body 20 . The other end of the flexible substrate 31 is drawn upward so as to pass through the opening 23 b of the reservoir 23 and is electrically connected to the wiring substrate 32 .

Thereby, the piezoelectric actuator substrate 22 of the head body 20 and the outside can be electrically connected. The details of the flexible substrate 31 will be described later.

The wiring board 32 is positioned above the head body 20 . The wiring board 32 has a function of distributing signals to the driver ICs 33 .

The driver IC 33 is provided on one main surface of the flexible substrate 31 . As shown in FIG. 3 , in the liquid ejection head 8 according to the embodiment, two driver ICs 33 are provided on one flexible substrate 31 . In the embodiment, the number of driver ICs 33 provided on one flexible substrate 31 is not limited to two.

The driver IC 33 drives the piezoelectric actuator substrate 22 of the head body 20 based on a signal sent from the control section 14 (see FIG. 1). Thereby, the driver IC 33 drives the liquid ejection head 8 .

The pressing member 34 has a substantially U-shaped cross section and presses the driver IC 33 on the flexible substrate 31 toward the heat sink 50 from the inside. As a result, in the embodiment, the heat generated when the driver IC 33 is driven can be efficiently radiated to the outer radiator plate 50 .

The elastic member 35 is positioned so as to contact the outer wall of the pressing portion (not shown) of the pressing member 34 . By providing the elastic member 35 , it is possible to reduce the possibility that the pressing member 34 will damage the flexible substrate 31 when the pressing member 34 presses the driver IC 33 .

The elastic member 35 is composed of, for example, double-sided foam tape. Further, by using a non-silicon thermally conductive sheet as the elastic member 35, for example, the heat dissipation of the driver IC 33 can be improved. Note that the elastic member 35 does not necessarily have to be provided.

The housing 40 is arranged on the head main body 20 so as to cover the wiring section 30 . Thereby, the housing 40 can seal the wiring portion 30 . The housing 40 is made of resin, metal, or the like, for example.

The housing 40 has a box shape elongated in the main scanning direction, and has a first opening 40a and a second opening 40b on side faces facing the sub scanning direction. The first opening 40a and the second opening 40b are examples of openings. Further, the housing 40 has a third opening 40c on its bottom surface and a fourth opening 40d on its top surface.

One of the heat sinks 50 is arranged in the first opening 40a so as to close the first opening 40a, and the other side of the heat sink 50 is arranged in the second opening 40b so as to close the second opening 40b. there is

The heat sink 50 is provided so as to extend in the main scanning direction, and is made of a metal, an alloy, or the like with high heat dissipation. The heat dissipation plate 50 is provided so as to be in contact with the driver IC 33 and has a function of dissipating heat generated in the driver IC 33 .

The pair of heat sinks 50 are fixed to the housing 40 by screws (not shown). Therefore, the housing 40 to which the heat sink 50 is fixed has a box shape in which the first opening 40a and the second opening 40b are closed and the third opening 40c and the fourth opening 40d are opened.

The third opening 40 c is provided so as to face the reservoir 23 . The flexible substrate 31 and the pressing member 34 are inserted through the third opening 40c.

40 d of 4th openings are provided in order to insert the connector (not shown) provided in the wiring board 32. As shown in FIG. A space between the connector and the fourth opening 40d is preferably sealed with resin or the like. As a result, it is possible to prevent liquid, dust, and the like from entering the housing 40 .

Further, the housing 40 has a heat insulating portion 40e. The heat insulating portion 40e is arranged adjacent to the first opening 40a and the second opening 40b, and protrudes outward from the side surface of the housing 40 facing in the sub-scanning direction.

Also, the heat insulating portion 40e is formed to extend in the main scanning direction. That is, the heat insulating portion 40 e is positioned between the heat sink 50 and the head body 20 . By providing the heat insulating portion 40 e in the housing 40 in this way, it is possible to suppress the heat generated in the driver IC 33 from being transferred to the head main body 20 via the heat sink 50 .

Note that the liquid ejection head 8 may further include members other than the members shown in FIG.

<Structure of head body>
Next, the configuration of the head body 20 according to the embodiment will be described with reference to FIGS. 4 to 6. FIG. FIG. 4 is an enlarged plan view of the head body 20 according to the embodiment. FIG. 5 is an enlarged view of the area surrounded by the dashed line shown in FIG. 6 is a cross-sectional view taken along the line AA shown in FIG. 4. FIG.

As shown in FIG. 4, the head body 20 has a channel member 21 and a piezoelectric actuator substrate 22. As shown in FIG. The flow path member 21 has a supply manifold 61 , a plurality of pressure chambers 62 and a plurality of discharge holes 63 .

A plurality of pressurization chambers 62 are connected to the supply manifold 61 . The plurality of discharge holes 63 are connected to the plurality of pressurization chambers 62 respectively.

The pressure chamber 62 opens to the first surface 21a (see FIG. 6) of the flow path member 21. As shown in FIG. Further, the first surface 21 a of the channel member 21 has an opening 61 a that communicates with the supply manifold 61 . Then, the liquid is supplied from the reservoir 23 (see FIG. 2) to the inside of the channel member 21 through the opening 61a.

In the example of FIG. 4, the head body 20 has four supply manifolds 61 positioned inside the flow path member 21 . The supply manifold 61 has an elongated shape extending along the longitudinal direction (that is, the main scanning direction) of the flow path member 21 . 61a is formed.

A plurality of pressure chambers 62 are formed in the flow path member 21 so as to spread two-dimensionally. As shown in FIG. 5, the pressurizing chamber 62 is a hollow area having a substantially rhombic planar shape with rounded corners. The pressurizing chamber 62 is open to the first surface 21a of the flow path member 21, and is closed by joining the piezoelectric actuator substrate 22 to the first surface 21a.

The pressurization chambers 62 constitute rows of pressurization chambers arranged in the longitudinal direction. The pressurizing chambers 62 in the pressurizing chamber row are arranged in a staggered manner between two adjacent pressurizing chamber rows. Four pressurization chamber rows connected to one supply manifold 61 constitute one pressurization chamber group. In the example of FIG. 4, there are four pressure chamber groups to which the flow path member 21 is applied.

Also, the relative arrangement of the pressurizing chambers 62 in each pressurizing chamber group is the same, and each pressurizing chamber group is arranged with a slight shift in the longitudinal direction.

The discharge hole 63 is arranged at a position avoiding a region of the flow path member 21 facing the supply manifold 61 . That is, the discharge holes 63 do not overlap the supply manifold 61 when the channel member 21 is seen through from the side of the first surface 21a.

Further, the ejection holes 63 are arranged so as to fit within the mounting area of the piezoelectric actuator substrate 22 in plan view. Such ejection holes 63 occupy an area having substantially the same size and shape as the piezoelectric actuator substrate 22 as one group.

Droplets are ejected from the ejection holes 63 by displacing the corresponding displacement elements 70 (see FIG. 6) of the piezoelectric actuator substrate 22 .

As shown in FIG. 6, the flow path member 21 has a laminated structure in which a plurality of plates are laminated. These plates are a cavity plate 21A, a base plate 21B, an aperture plate 21C, a supply plate 21D, manifold plates 21E, 21F, 21G, a cover plate 21H and a nozzle plate 21I in this order from the upper surface of the channel member 21.

A large number of holes are formed in the plate. The thickness of the plate is about 10 μm to 300 μm. Thereby, the hole formation accuracy can be improved. The plates are aligned and stacked such that these holes communicate with each other to form predetermined flow paths.

In the channel member 21 , the supply manifold 61 and the discharge holes 63 are connected by individual channels 64 . The supply manifold 61 is positioned on the second surface 21 b side inside the flow path member 21 , and the discharge holes 63 are positioned on the second surface 21 b of the flow path member 21 .

The individual channel 64 has a pressure chamber 62 and an individual supply channel 65 . The pressure chamber 62 is located on the first surface 21 a of the flow path member 21 , and the individual supply flow path 65 is a flow path that connects the supply manifold 61 and the pressure chamber 62 .

Also, the individual supply channel 65 includes a constriction 66 that is narrower than the other portions. Since the constriction 66 is narrower than the other portions of the individual supply channel 65, the channel resistance is high. Thus, when the flow path resistance of the constriction 66 is high, the pressure generated in the pressure chamber 62 is less likely to escape to the supply manifold 61 .

The piezoelectric actuator substrate 22 has piezoelectric ceramic layers 22A and 22B, a common electrode 71, individual electrodes 72, connection electrodes 73, dummy connection electrodes 74, and surface electrodes 75 (see FIG. 4).

Also, in the piezoelectric actuator substrate 22, the piezoelectric ceramic layer 22A, the common electrode 71, the piezoelectric ceramic layer 22B, and the individual electrodes 72 are laminated in this order.

Both of the piezoelectric ceramic layers 22A and 22B extend over the first surface 21a of the flow path member 21 so as to straddle the plurality of pressure chambers 62. As shown in FIG. The piezoelectric ceramic layers 22A and 22B each have a thickness of about 20 μm. The piezoelectric ceramic layers 22A and 22B are made of, for example, a ferroelectric lead zirconate titanate (PZT) ceramic material.

The common electrode 71 is formed over substantially the entire surface in the region between the piezoelectric ceramic layers 22A and 22B. That is, the common electrode 71 overlaps with all the pressure chambers 62 in the area facing the piezoelectric actuator substrate 22 .

The thickness of the common electrode 71 is approximately 2 μm. The common electrode 71 is made of, for example, Ag--Pd-based metal material.

The individual electrode 72 includes a body electrode 72a and an extraction electrode 72b. The body electrode 72a is located in a region facing the pressure chamber 62 on the piezoelectric ceramic layer 22B. The body electrode 72 a is one size smaller than the pressure chamber 62 and has a shape substantially similar to that of the pressure chamber 62 .

The extraction electrode 72b is extracted from the body electrode 72a to the outside of the area facing the pressure chamber 62 . The individual electrodes 72 are made of, for example, an Au-based metal material.

The connection electrode 73 is positioned on the extraction electrode 72b and is formed in a convex shape with a thickness of about 15 μm. The connection electrodes 73 are electrically connected to electrodes provided on the flexible substrate 31 (see FIG. 3). The connection electrode 73 is made of silver-palladium containing glass frit, for example.

The dummy connection electrode 74 is positioned on the piezoelectric ceramic layer 22B so as not to overlap various electrodes such as the individual electrode 72 . The dummy connection electrode 74 connects the piezoelectric actuator substrate 22 and the flexible substrate 31 to increase the connection strength.

In addition, the dummy connection electrodes 74 equalize the distribution of contact positions between the piezoelectric actuator substrates 22 and stabilize the electrical connection. The dummy connection electrode 74 may be made of the same material as the connection electrode 73 and formed in the same process as the connection electrode 73 .

The surface electrodes 75 shown in FIG. 4 are formed at positions avoiding the individual electrodes 72 on the piezoelectric ceramic layer 22B. The surface electrode 75 is connected to the common electrode 71 through via holes formed in the piezoelectric ceramic layer 22B.

As a result, the surface electrode 75 is grounded and held at the ground potential. The surface electrodes 75 are preferably made of the same material as the individual electrodes 72 and formed in the same process as the individual electrodes 72 .

The plurality of individual electrodes 72 are individually electrically connected to the control unit 14 (see FIG. 1) via the flexible substrate 31 and wiring to individually control potentials. When the individual electrode 72 and the common electrode 71 are set at different potentials and an electric field is applied in the polarization direction of the piezoelectric ceramic layer 22A, the portion of the piezoelectric ceramic layer 22A to which the electric field is applied becomes an active portion that is distorted by the piezoelectric effect. Operate.

That is, in the piezoelectric actuator substrate 22 , portions of the individual electrodes 72 , the piezoelectric ceramic layer 22</b>A and the common electrode 71 facing the pressure chambers 62 function as the displacement elements 70 .

When the displacement element 70 undergoes unimorph deformation, the pressure chamber 62 is pressed and the liquid is discharged from the discharge hole 63 .

Next, a procedure for driving the liquid ejection head 8 according to the embodiment will be described. The individual electrode 72 is set to a potential higher than that of the common electrode 71 (hereinafter referred to as high potential) in advance. Each time an ejection request is issued, the individual electrode 72 is once set to the same potential as the common electrode 71 (hereinafter referred to as a low potential), and then set to a high potential again at a predetermined timing.

As a result, when the potential of the individual electrode 72 becomes low, the piezoelectric ceramic layers 22A and 22B return to their original shapes, and the volume of the pressure chamber 62 increases from the initial state, ie, the high potential state.

At this time, since a negative pressure is applied to the pressurizing chamber 62 , the liquid in the supply manifold 61 is sucked into the pressurizing chamber 62 .

After that, when the potential of the individual electrode 72 is set to a high potential again, the piezoelectric ceramic layers 22A and 22B are deformed so as to protrude toward the pressurizing chamber 62 side.

That is, the pressure in the pressurization chamber 62 becomes a positive pressure by reducing the volume of the pressurization chamber 62 . As a result, the pressure of the liquid inside the pressurizing chamber 62 is increased, and droplets are ejected from the ejection holes 63 .

That is, the control unit 14 uses the driver IC 33 to supply the individual electrode 72 with a drive signal including a pulse based on a high potential in order to eject droplets from the ejection holes 63 . This pulse width may be AL (Acoustic Length), which is the length of time for the pressure wave to propagate from the constriction 66 to the ejection hole 63 .

As a result, when the inside of the pressurizing chamber 62 is reversed from the negative pressure state to the positive pressure state, both pressures are combined, and droplets can be ejected with stronger pressure.

In gradation printing, gradation is expressed by the number of droplets continuously ejected from the ejection holes 63, that is, the amount of droplets (volume) adjusted by the number of droplet ejections. For this reason, droplets are ejected the number of times corresponding to the designated gradation expression from the ejection holes 63 corresponding to the designated dot areas.

In general, when liquid ejection is performed continuously, the interval between pulses supplied for ejecting liquid droplets may be AL. As a result, the period of the residual pressure wave generated when ejecting the previously ejected droplet matches the period of the pressure wave of the pressure generated when ejecting the subsequently ejected droplet.

Therefore, the residual pressure wave and the pressure wave are superimposed, and the pressure for ejecting the droplet can be amplified. Note that in this case, the speed of the droplets ejected later increases, and the landing points of the plurality of droplets become closer.

<Details of flexible substrate>
Next, details of the flexible substrate 31 according to the embodiment will be described with reference to FIGS. 7 to 10. FIG. FIG. 7 is a perspective view for explaining the flexible substrate 31 and the structure around the flexible substrate 31 according to the embodiment. 7, the wiring layer 31b (see FIG. 8) formed in the flexible substrate 31 and various elements on the wiring substrate 32 are omitted.

The flexible substrate 31 has a shape that gradually tapers in two directions as it goes upward. A lower portion of the flexible substrate 31 is electrically connected to the piezoelectric actuator substrate 22 (see FIG. 3) of the head body 20 (see FIG. 3).

Two connector insertion portions 31t, which are bifurcated tapered ends on the upper portion of the flexible substrate 31, are inserted into two connectors 32a provided on the wiring substrate 32, respectively. By inserting the connector insertion portion 31t into the connector 32a, the flexible substrate 31 and the wiring substrate 32 can be electrically connected.

A driver IC 33 is mounted on the flexible substrate 31 below the connector insertion portion 31t. A pressing member 34 is provided on the side of the flexible substrate 31 opposite to the side on which the driver IC 33 is mounted. The pressing member 34 presses the driver IC 33 toward the heat sink 50 (see FIG. 3) from the inside. The mounting position of the driver IC 33 is not limited to below the connector insertion portion 31t.

FIG. 8 is a schematic cross-sectional view in the vicinity of the connector insertion portion 31t of the flexible substrate 31 according to the embodiment. In the vicinity of the connector insertion portion 31t, the flexible substrate 31 has a base substrate 31a, a wiring layer 31b, a cover layer 31c, and a reinforcing plate 31d.

The base substrate 31a is made of a flexible insulator (such as a resin material, for example). The wiring layer 31b is formed on the front surface of the base substrate 31a and is made of a conductor (for example, metal). A desired wiring pattern is formed on the flexible substrate 31 by the wiring layer 31b.

The cover layer 31c is formed to cover the wiring layer 31b on the front surface of the base substrate 31a. The cover layer 31c is provided to protect the wiring layer 31b.

The reinforcing plate 31d is a member that reinforces the flexible substrate 31 near the connector insertion portion 31t. The reinforcing plate 31d is arranged on the back surface of the base substrate 31a, and is made of, for example, resin such as glass epoxy, composite, polyetherimide, polyimide, or polyester, or metal such as stainless steel, aluminum, or alloys thereof. .

FIG. 9 is a diagram for explaining the configuration of the connector insertion portion 31t of the flexible substrate 31 according to the embodiment. In FIG. 9, the connector insertion portion 31t and the portion where the reinforcing plate 31d is provided in the vicinity of the connector insertion portion 31t are hatched, and the position of the corresponding connector 32a is indicated by a dashed line.

As shown in FIG. 9, the connector insertion portion 31t of the flexible substrate 31 has a notch portion 31n. Assuming that the direction in which the connector insertion portion 31t is inserted into the connector 32a is the insertion direction T, and the direction orthogonal to the insertion direction T is the width direction W, in the example of FIG. It is formed so as to extend from one end 31e of W to the other end 31e, and the notch 31n has a substantially isosceles triangular shape in plan view.

That is, if the dimension of the notch portion 31n in the insertion direction T of the connector insertion portion 31t is the notch length, and the dimension of the notch portion 31n in the width direction W of the connector insertion portion 31t is the notch width, then there is a constant , and the length of the cutout gradually increases at a constant rate as the distance from the end 31e in the width direction W of the connector insertion portion 31t increases.

Further, as shown in FIG. 9, in the connector insertion portion 31t of the flexible substrate 31, the base substrate 31a is provided with a notch portion 31n, and the reinforcing plate 31d is also provided with a notch portion 31n.

Thus, by providing the notch portion 31n in the connector insertion portion 31t of the flexible substrate 31, the area of the connector insertion portion 31t when being inserted into the connector 32a can be reduced. This can reduce the frictional force when inserting the connector insertion portion 31t into the connector 32a.

Therefore, according to the embodiment, the connector insertion portion 31t of the flexible substrate 31 can be easily inserted into the connector 32a.

Further, in the embodiment, it is preferable that the notch 31n is formed at least in the base substrate 31a of the flexible substrate 31. As shown in FIG. By providing the notch portion 31n in the base substrate 31a, which is the main member of the flexible substrate 31, the area of the connector insertion portion 31t when being inserted into the connector 32a can be effectively reduced.

Therefore, according to the embodiment, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

Moreover, in the embodiment, the notch 31n may also be formed in the reinforcing plate 31d of the flexible substrate 31 . By providing the notch portion 31n in the reinforcing plate 31d in addition to the base substrate 31a, the area of the connector insertion portion 31t when being inserted into the connector 32a can be further effectively reduced.

Therefore, according to the embodiment, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

In the flexible substrate 31, at least a portion of the connector insertion portion 31t is not covered with the cover layer 31c, and the wiring layer 31b is exposed from at least a portion of the connector insertion portion 31t. As a result, the exposed wiring layer 31b and the terminals in the connector 32a can be brought into contact with each other, so that the flexible substrate 31 and the wiring substrate 32 can be electrically connected.

Also, in the embodiment, both ends 31e of the connector insertion portion 31t are preferably positioned substantially at the same position in the insertion direction T of the connector insertion portion 31t. The reason for this will be described with reference to FIG. 10 as well. FIG. 10 is a diagram for explaining a connector insertion portion 31t of the flexible substrate 31 of the reference example.

For example, as shown in (a) of FIG. 10, if both ends 31e have different positions in the insertion direction T, as shown in (b) of FIG. turn into.

This is because when the connector insertion portion 31t is inserted into the connector 32a, the contact area near one (for example, left) end 31e becomes larger than the contact area near the other (for example, right) end 31e. This is because a difference in frictional force is generated between both ends 31e.

On the other hand, in the embodiment, since the positions in the insertion direction T are substantially equal between both ends 31e, the difference in frictional force as described above is less likely to occur. Therefore, according to the embodiment, it is possible to reduce the probability that the connector insertion portion 31t is obliquely inserted into the connector 32a.

Further, in the embodiment, the connector insertion portion 31t may have a line-symmetrical shape with respect to a straight line passing through the center of the connector insertion portion 31t in the width direction W in the insertion direction T in plan view.

As a result, when the connector insertion portion 31t is inserted into the connector 32a, the difference between the contact area near one end 31e and the contact area near the other end 31e can be reduced. It is possible to suppress the occurrence of a difference in frictional force between 31e.

Therefore, according to the embodiment, it is possible to further reduce the probability that the connector insertion portion 31t is obliquely inserted into the connector 32a.

Further, in the embodiment, it is preferable to increase the notch width of the notch portion 31n toward the insertion direction T of the connector insertion portion 31t. As a result, the initial resistance when inserting the connector insertion portion 31t into the connector 32a can be reduced. Therefore, according to the embodiment, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

Furthermore, in the embodiment, the notch width of the notch portion 31n may be gradually increased toward the insertion direction T of the connector insertion portion 31t. As a result, the initial resistance when inserting the connector insertion portion 31t into the connector 32a can be reduced, and a rapid change in resistance during insertion can be suppressed.

Therefore, according to the embodiment, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

Further, in the embodiment, a gripping portion 31g projecting in the width direction W may be provided on the side portion of the flexible substrate 31 adjacent to the connector insertion portion 31t. In addition, in the example of FIG. 9, two holding portions 31g are provided on one side portion.

In the embodiment, by inserting the connector insertion portion 31t into the connector 32a while gripping the grip portion 31g, the connector insertion portion 31t can be more easily inserted into the connector 32a.

Further, as shown in FIG. 9, by providing a reinforcing plate 31d to the grip portion 31g as well, it is possible to prevent the grip portion 31g from being damaged when gripped. Therefore, according to the embodiment, the connector insertion portion 31t can be stably inserted into the connector 32a.

<various modifications>
Various modifications of the connector insertion portion 31t of the flexible substrate 31 according to the embodiment will be described with reference to FIGS. 11 to 16. FIG. FIG. 11 is a diagram for explaining the configuration of the connector insertion portion 31t of the flexible substrate 31 according to Modification 1 of the embodiment. In addition, in the following various modifications, the same code|symbol is attached|subjected to the same site|part as embodiment, and the overlapping description is abbreviate|omitted.

As shown in FIG. 11, in the connector insertion portion 31t according to Modification 1, the shape of the notch portion 31n is different from that in the embodiment. Specifically, the notch length of the notch 31n gradually increases as the distance from the end 31e in the width direction W of the connector insertion portion 31t increases.

That is, in Modification 1, the notch length increases exponentially as the distance from the end 31e in the width direction W of the connector insertion portion 31t increases. Thereby, the strength of the end portion 31e in the width direction W of the connector insertion portion 31t can be increased.

Also in Modification 1, the notch width of the notch portion 31n is gradually increased toward the insertion direction T of the connector insertion portion 31t. As a result, the initial resistance when inserting the connector insertion portion 31t into the connector 32a can be reduced, and a rapid change in resistance during insertion can be suppressed.

Therefore, according to Modification 1, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

FIG. 12 is a diagram for explaining the configuration of a connector insertion portion 31t of a flexible substrate 31 according to Modification 2 of the embodiment. As shown in FIG. 12, in the cutout portion 31n according to Modification 2, the rate of increase in cutout length gradually decreases as the distance from the end portion 31e in the width direction W of the connector insertion portion 31t increases.

That is, in Modification 2, the notch length increases logarithmically with distance from the end 31e in the width direction W of the connector insertion portion 31t.

Also in Modification 2, the notch width of the notch portion 31n is gradually increased toward the insertion direction T of the connector insertion portion 31t. As a result, the initial resistance when inserting the connector insertion portion 31t into the connector 32a can be reduced, and a rapid change in resistance during insertion can be suppressed.

Therefore, according to Modification 2, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

FIG. 13 is a diagram for explaining the configuration of a connector insertion portion 31t of a flexible substrate 31 according to Modification 3 of the embodiment.

As shown in FIG. 13, the cutout portion 31n according to Modification 3 gradually increases in length at a constant rate up to a predetermined point as the cutout portion 31n moves away from the end portion 31e in the width direction W of the connector insertion portion 31t. While increasing, the notch length is constant from this predetermined point. That is, the cutout portion 31n of Modification 3 has a substantially trapezoidal shape in plan view.

Also in Modification 3, the notch width of the notch portion 31n is increased toward the insertion direction T of the connector insertion portion 31t. As a result, the initial resistance when inserting the connector insertion portion 31t into the connector 32a can be reduced.

Therefore, according to Modification 3, the connector insertion portion 31t of the flexible substrate 31 can be easily inserted into the connector 32a.

FIG. 14 is a diagram for explaining the configuration of a connector insertion portion 31t of a flexible substrate 31 according to Modification 4 of the embodiment. As shown in FIG. 14, the notch length of the notch 31n according to Modification 4 increases stepwise as the distance from the end 31e in the width direction W of the connector insertion portion 31t increases.

Also in Modification 4, the notch width of the notch portion 31n is increased toward the insertion direction T of the connector insertion portion 31t. As a result, the initial resistance when inserting the connector insertion portion 31t into the connector 32a can be reduced.

Therefore, according to Modification 4, the connector insertion portion 31t of the flexible substrate 31 can be easily inserted into the connector 32a. In this manner, the notch width of the notch portion 31n can be increased stepwise toward the insertion direction T of the connector insertion portion 31t.

In the embodiment and various modifications described so far, an example in which one notch portion 31n is provided in one connector insertion portion 31t is shown, but the number of notch portions 31n provided in one connector insertion portion 31t is one. It is not limited to one, and may be plural. FIG. 15 is a diagram for explaining the configuration of a connector insertion portion 31t of a flexible substrate 31 according to Modification 5 of the embodiment.

As shown in FIG. 15, the connector insertion portion 31t of the flexible substrate 31 according to Modification 5 has two notches 31n. Also, two notch portions 31n are arranged along the width direction W and formed to extend from one end portion 31e to the other end portion 31e. An intermediate portion 31m is formed in the region between the two notch portions 31n.

The notch 31n of Modification 5 has a substantially isosceles triangular shape in plan view. That is, the notch length of the notch portion 31n of Modification 5 gradually increases at a constant rate as the distance from the end portion 31e or the intermediate portion 31m increases.

Thus, by providing a plurality of notches 31n in the connector insertion portion 31t of the flexible substrate 31, it is possible to reduce the area of the connector insertion portion 31t when inserting it into the connector 32a. This can reduce the frictional force when inserting the connector insertion portion 31t into the connector 32a.

Therefore, according to Modification 5, the connector insertion portion 31t of the flexible substrate 31 can be easily inserted into the connector 32a.

Further, in Modification 5, since the notch width of the notch portion 31n (sum of the notch widths of the two notch portions 31n) is gradually increased toward the insertion direction T of the connector insertion portion 31t, the connector insertion The initial resistance when inserting the portion 31t into the connector 32a can be reduced, and a rapid change in resistance during insertion can be suppressed.

Therefore, according to Modification 5, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

Further, in Modification 5, the intermediate portion 31m of the connector insertion portion 31t is preferably positioned substantially at the same position in the insertion direction T of the connector insertion portion 31t as both the end portions 31e.

As a result, when the connector insertion portion 31t is inserted into the connector 32a, a difference in frictional force is less likely to occur near the intermediate portion 31m and near both ends 31e. Therefore, according to Modification 5, it is possible to reduce the probability that the connector insertion portion 31t is obliquely inserted into the connector 32a.

The shape of the plurality of notch portions 31n provided in the connector insertion portion 31t is not limited to a substantially isosceles triangle shape in plan view. For example, as shown in FIG. 16, a plurality of notches 31n shown in Modification 1 may be provided in connector insertion portion 31t, and a plurality of notches 31n shown in other modifications may be provided in connector insertion portion 31t. may FIG. 16 is a diagram for explaining the configuration of a connector insertion portion 31t of a flexible substrate 31 according to Modification 6 of the embodiment.

Further, the number of notches 31n provided in the connector insertion portion 31t is not limited to two, and may be three or more. Moreover, the plurality of notch portions 31n provided in one connector insertion portion 31t may have the same shape or different shapes.

Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present disclosure. For example, in the above-described embodiment, the gripping portion 31g is provided in the vicinity of the connector insertion portion 31t of the flexible substrate 31, but the gripping portion 31g may not necessarily be provided.

Further, in the above-described embodiment, an example in which the gripping portion 31g is also provided with the reinforcing plate 31d is shown, but the gripping portion 31g may not necessarily be provided with the reinforcing plate 31d.

As described above, the liquid ejection head 8 according to the embodiment includes the head main body 20, the driver IC 33, the flexible substrate 31, and the wiring substrate 32. The head body 20 has ejection holes 63 for ejecting liquid. The driver IC 33 controls driving of the head body 20 . The flexible substrate 31 has a base substrate 31 a , a wiring layer 31 b and a cover layer 31 c , has a driver IC 33 mounted thereon, and is electrically connected to the head body 20 . The wiring board 32 has a connector 32a into which a part of the flexible board 31 can be inserted. A connector insertion portion 31t of the flexible substrate 31 to be inserted into the connector 32a has a notch portion 31n. Thereby, the connector insertion portion 31t of the flexible substrate 31 can be easily inserted into the connector 32a.

Further, in the liquid ejection head 8 according to the embodiment, the notch 31n is formed at least in the base substrate 31a of the flexible substrate 31. As shown in FIG. Thereby, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

In addition, in the liquid ejection head 8 according to the embodiment, both ends 31e in the width direction W of the connector insertion portion 31t are substantially at the same position in the insertion direction T of the connector insertion portion 31t. As a result, the probability that the connector insertion portion 31t is obliquely inserted into the connector 32a can be reduced.

Further, in the liquid ejection head 8 according to the embodiment, the notch width of the notch portion 31n increases toward the insertion direction T of the connector insertion portion 31t. Thereby, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

Further, in the liquid ejection head 8 according to the embodiment, the notch width of the notch portion 31n gradually increases toward the insertion direction T of the connector insertion portion 31t. Thereby, the connector insertion portion 31t of the flexible substrate 31 can be more easily inserted into the connector 32a.

Further, in the liquid ejection head 8 according to the embodiment, the connector insertion portion 31t has a plurality of notches 31n. Thereby, the connector insertion portion 31t of the flexible substrate 31 can be easily inserted into the connector 32a.

In addition, in the liquid ejection head 8 according to the embodiment, the region (intermediate portion 31m) between the adjacent cutout portions 31n is formed by inserting both ends 31e in the width direction W of the connector insertion portion 31t and the connector insertion portion 31t. The positions in direction T are substantially equal. As a result, the probability that the connector insertion portion 31t is obliquely inserted into the connector 32a can be reduced.

Further, in the liquid ejection head 8 according to the embodiment, the connector insertion portion 31t has a shape symmetrical with respect to a straight line passing through the center of the connector insertion portion 31t in the width direction W in the insertion direction T. As shown in FIG. This can further reduce the probability that the connector insertion portion 31t will be obliquely inserted into the connector 32a.

Further, the recording apparatus (printer 1) according to the embodiment includes the liquid ejection head 8 described above, a transport section (transport roller 6) that transports the recording medium (printing paper P) to the liquid ejection head 8, and the liquid ejection head 8. and a control unit 14 that controls the head 8 . This makes it possible to realize the printer 1 in which the connector insertion portion 31t of the flexible substrate 31 can be easily inserted into the connector 32a.

Further, the recording apparatus (printer 1) according to the embodiment includes the liquid ejection head 8 described above and the applicator 4 that applies a coating agent to the recording medium (printing paper P). As a result, since the printing paper P can be surface-treated, the printing quality of the printer 1 can be improved.

Further, the recording apparatus (printer 1) according to the embodiment includes the liquid ejection head 8 described above and a dryer 10 that dries the recording medium (printing paper P). As a result, it is possible to suppress adhesion of the printing papers P that are wound together on the collection roller 13 and friction between the undried liquids.

It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. Indeed, the above-described embodiments may be embodied in many different forms. Also, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

1 Printer (an example of a recording device)
4 Coating machine 6 Conveying roller (an example of a conveying part)
7 Frame 8 Liquid Ejection Head 10 Dryer 14 Controller 20 Head Main Body 31 Flexible Board 31a Base Board 31b Wiring Layer 31c Cover Layer 31d Reinforcing Plate 31e End 31g Holding Part 31n Notch 31t Connector Inserting Portion 32 Wiring Board 32a Connector 33 Driver IC
63 ejection hole P printing paper (an example of a recording medium)
T Insertion direction W Width direction

Claims (12)

a head body having ejection holes for ejecting liquid;
a driver IC for controlling driving of the head body;
a flexible substrate having a base substrate, a wiring layer, and a cover layer, on which the driver IC is mounted, and which is electrically connected to the head main body;
a wiring board having a connector into which a part of the flexible board can be inserted;
with
The connector inserting portion of the flexible substrate includes :
a first protrusion at one end in the width direction;
a second protrusion at the other end in the width direction;
a third convex portion in the central portion in the width direction;
at least a first notch between the first protrusion and the third protrusion;
at least a second notch between the second protrusion and the third protrusion;
and
The cutout width of the first cutout portion and the cutout width of the second cutout portion increase toward the insertion direction of the connector insertion portion.
liquid ejection head. The liquid according to claim 1, wherein the first notch and the second notch are arranged in the width direction and are formed to extend from the one end to the other end. ejection head. 3. The liquid ejection head according to claim 1, wherein the notch length of the first notch portion and the notch length of the second notch portion are the same . In plan view,
the first convex portion and the second convex portion form an acute angle at an end portion of the connector insertion portion in the insertion direction;
The liquid ejection head according to any one of claims 1 to 3, wherein the third projection forms an obtuse angle at the end of the connector insertion portion in the insertion direction. The notch length of the first notch is smaller than the notch width of the first notch,
The liquid ejection head according to any one of claims 1 to 4 , wherein the notch length of the second notch is smaller than the notch width of the second notch . 6. The liquid ejection head according to any one of claims 1 to 5 , wherein each of the first notch and the second notch has a substantially isosceles triangular shape in plan view . 7. The liquid ejection head according to claim 1, wherein the first notch and the second notch are formed at least in the base substrate of the flexible substrate . The flexible substrate further has a reinforcing plate,
The liquid ejection head according to any one of claims 1 to 7, wherein the connector insertion portion has the first notch and the second notch in the reinforcing plate. The liquid ejection head according to any one of claims 1 to 8, wherein the connector insertion portion has a shape symmetrical with respect to a straight line passing through the center of the connector insertion portion in the width direction in the insertion direction. a liquid ejection head according to any one of claims 1 to 9;
a transport unit that transports a recording medium to the liquid ejection head;
a control unit that controls the driver IC of the liquid ejection head;
recording device. a liquid ejection head according to any one of claims 1 to 9;
A recording apparatus comprising: an applicator that applies a coating agent to a recording medium; a liquid ejection head according to any one of claims 1 to 9;
A recording apparatus comprising: a dryer for drying a recording medium;

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