WO2023185670A1 - 一种显示组件和终端设备 - Google Patents

一种显示组件和终端设备 Download PDF

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Publication number
WO2023185670A1
WO2023185670A1 PCT/CN2023/083634 CN2023083634W WO2023185670A1 WO 2023185670 A1 WO2023185670 A1 WO 2023185670A1 CN 2023083634 W CN2023083634 W CN 2023083634W WO 2023185670 A1 WO2023185670 A1 WO 2023185670A1
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WO
WIPO (PCT)
Prior art keywords
display
area
settlement
plate surface
display assembly
Prior art date
Application number
PCT/CN2023/083634
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English (en)
French (fr)
Inventor
代晓涛
罗中元
丁洪
饶兴堂
吕坤
王成龙
王荣
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023185670A1 publication Critical patent/WO2023185670A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular, to a display component and a terminal device.
  • terminal devices With the continuous popularity and development of terminal devices such as smartphones or tablets, terminal devices with higher screen-to-body ratios have become more popular.
  • a terminal device with a higher screen-to-body ratio can significantly reduce the width of the frame and provide a larger display area and operating area, which can significantly improve the user's visual experience and user experience.
  • the edge of the flexible screen is usually bent toward the back.
  • Devices such as driver chips can be located on the back of the flexible screen, thereby reducing the frame size of the entire flexible screen. Width size to increase display area. However, this will significantly increase the thickness of the flexible screen, which is not conducive to achieving a thin and light design.
  • This application provides a display component and a terminal device that can effectively reduce the thickness size.
  • the present application provides a display assembly, which may include a support plate and a display layer; the support plate has a first board surface and a second board surface, and the first board surface and the second board surface are two board surfaces that are away from each other.
  • the display layer includes a display part, a bending part and a connecting part connected in sequence.
  • the display part is disposed on the first plate surface, the bending part is disposed on the edge of the support plate, and the connecting part is disposed on the second plate surface, wherein the connecting part has a sinking area that is concave toward the second plate surface.
  • the display part, the bending part and the connecting part are different parts of the display component.
  • the main function of the display part is to provide the display function
  • the main function of the connecting part is to connect with the display driver chip or circuit board.
  • the bending part is mainly used to connect the display part and the connection part, and provides a certain curvature so that the display part of the display assembly can be located on the first surface of the support plate and the connection part can be located on the second surface of the support plate.
  • connection part has a subsidence area that is recessed toward the second panel surface. Therefore, the thickness of the display component in the subsidence area can be effectively reduced, and the space occupied by the display component can be reduced. Furthermore, the subsidence area The arrangement will not have any adverse effect on the bending part, so that the bending part has enough curvature to prevent the bending part from being over-bent.
  • connection part may further include a holding area connected to the bending part, and the minimum distance between the holding area and the second plate surface is greater than the maximum distance between the settling area and the second plate surface.
  • the holding area can insulate the settlement area and the bending area to prevent the bending area from being affected when the settlement area is manufactured or assembled.
  • the holding area can also be connected to the support plate to effectively improve the connection stability between the connection part and the support plate.
  • connection portion may also include a transition zone.
  • the transition zone may be located between the settlement zone and the bending part, and is used to realize the transition between the settlement zone and the bending part. For example, when the bent portion is bent from the first plate surface of the support plate to the second plate surface, The curvature of the bend cannot be too small, otherwise the bent part will have undesirable phenomena such as creases, cracks or breaks.
  • the depth of the settlement zone can satisfy 0.15mm ⁇ D ⁇ 0.25mm.
  • the depth D of the settlement zone can also be any other value, which is not limited in this application.
  • the surface of the settlement zone may be a plane or a curved surface, which is not limited in this application.
  • the length of the transition zone in the linear direction of the holding zone and the settling zone is greater than or equal to 1 mm.
  • the length of the transition zone can be reasonably set according to the actual situation to effectively transition the height difference between the settlement zone and the bending part.
  • a first glue layer may be provided between the settling area and the support plate. That is, a certain distance is maintained between the settlement zone and the second board surface of the support plate. At the same time, the settlement zone can be bonded to the second board surface through the first adhesive layer to achieve a fixed connection between the settlement zone and the support plate. Prevent relative displacement and other undesirable situations between the settlement area and the support plate.
  • a second glue layer can be provided between the holding area and the second board surface, that is, the holding area can be bonded to the second board surface through the second glue layer to achieve a fixed connection between the holding area and the support plate to prevent holding Undesirable situations such as relative displacement between the area and the support plate may occur.
  • the display component may further include a display driver chip.
  • the display driving chip and the connecting portion are located on the same side of the second board surface, and the display driving chip is connected to the connecting portion.
  • the display driver chip can be located on the surface of the settlement area. Since the settlement area is recessed in the direction of the support plate, a certain amount of space can be freed up. Placing the display driver chip on the surface of the settlement area can effectively utilize the space vacated by the settlement area, thereby helping to reduce the space size of the display component. .
  • the display assembly may further include a circuit board, the circuit board and the connecting part are located on the same side of the second board surface, and the circuit board is connected to the connecting part.
  • one end of the circuit board is also located in the settlement area, that is, the circuit board is connected to the settlement area, thereby realizing the connection between the circuit board and the entire display layer.
  • the circuit board may be a flexible circuit board, a printed circuit board, etc. This application does not limit the specific type of the circuit board.
  • this application also provides a terminal device, including a housing and any one of the above display components.
  • the support plate in the display component can be connected to the housing to achieve a fixed connection between the display component and the housing.
  • the terminal device may be a smartphone, a tablet, a laptop, a television, a monitor, etc. This application does not limit the specific type of the terminal device or the specific application scenarios of the display component.
  • Figure 1 is a schematic plan view of a conventional smart phone provided by an embodiment of the present application.
  • Figure 2 is a schematic cross-sectional structural diagram of a conventional smart phone provided by an embodiment of the present application.
  • Figure 3 is a schematic cross-sectional structural diagram of a conventional display component provided by an embodiment of the present application.
  • Figure 4 is a partial cross-sectional structural schematic diagram of a conventional display component provided by an embodiment of the present application.
  • Figure 5 is a partial cross-sectional structural schematic diagram of another conventional display component provided by an embodiment of the present application.
  • Figure 6 is a schematic cross-sectional structural diagram of a display component provided by an embodiment of the present application.
  • Figure 7 is an expanded plan view of the display layer in Figure 6;
  • Figure 8 is a schematic cross-sectional structural diagram of another display component provided by an embodiment of the present application.
  • Figure 9 is an expanded plan view of the display layer in Figure 8.
  • Figure 10 is a schematic cross-sectional structural diagram of another display component provided by an embodiment of the present application.
  • Figure 11 is an expanded plan view of the display layer in Figure 10;
  • Figure 12 is a schematic cross-sectional structural diagram of a display component provided by an embodiment of the present application.
  • Figure 13 is a schematic structural diagram indicating the size parameters of the display component in Figure 12;
  • Figure 14 is a schematic cross-sectional structural diagram of a display component provided by an embodiment of the present application.
  • Figure 15 is a schematic structural diagram when assembling a display component according to an embodiment of the present application.
  • Figure 16 is a schematic cross-sectional structural diagram of a display component provided by an embodiment of the present application.
  • Figure 17 is a schematic cross-sectional structural diagram of a display layer provided by an embodiment of the present application.
  • Figure 18 is a schematic cross-sectional structural diagram of a display component provided by an embodiment of the present application when the settlement area is not pressed together;
  • Figure 19 is a schematic cross-sectional structural diagram of a display assembly provided by an embodiment of the present application after the settlement area is pressed together;
  • Figure 20 is a schematic structural diagram indicating the dimensional parameters of the display component in Figure 19;
  • Figure 21 is the stress simulation diagram of area C in Figure 19;
  • Figure 22 is a schematic cross-sectional structural diagram of a smart phone provided by an embodiment of the present application.
  • FIG. 1 is a schematic plan view of a conventional smart phone 01
  • FIG. 2 is a schematic cross-sectional view of a conventional smart phone 01
  • the smart phone 01 may include a housing 011 and a display component 012.
  • the display component 012 may be installed on one side of the housing 011 (the upper side in Figure 2), and together with the housing 011, form an accommodation space 010; wherein, the housing 012
  • the body 011 has a frame 0111, and the frame 0111 can be located at the edge of the display component 012, thereby providing good protection to the display component 012.
  • Devices such as the battery 013 and processor (not shown in the figure) of the smart phone 01 can be arranged in the accommodation space 010 .
  • the display component 012 includes a front surface (upper surface in Figure 2 ) and a back surface (lower surface in Figure 2 ).
  • the front surface can also be called a display surface, and can display content such as pictures, text, or videos.
  • the smartphone 01 needs to be equipped with a display driver integrated circuit chip (DDIC) or integrated circuit and other devices.
  • the display driver chip is used to drive the display component 012 to work normally, and the display driver chip and other devices are closely related to the display
  • the relative positions between the components 012 will affect the display area of the display component 012 .
  • the display component 012 can be of various types. The following is a brief explanation taking the display component 012 as a flexible screen (organic electroluminescence display, OLED) as an example.
  • the display assembly 012 may include a cover plate 0121 , a display layer 0122 and a support plate 0123 arranged in a stack.
  • a packaging process such as chip on polyimide (COP) or chip on film (COF) can be used to dispose the display driver chip 0124 on one side of the display layer 0122.
  • Devices such as the display driver chip 0124 or the circuit board 0125 are connected to the display layer 0122 and are arranged close to the edge of the display layer 0122 .
  • COP chip on polyimide
  • COF chip on film
  • the edge portion of the display layer 0122 can be bent toward the back. Fold, and the part bent toward the back can be bonded to the support plate 0123 through the glue layer 0126.
  • Devices such as the display driver chip 0124 and the circuit board 0125 can be arranged on the side away from the display surface. Therefore, as shown in Figure 4, the entire upper surface of the display component 012 can implement the display function. Therefore, the display component 012 will be effectively improved. display area.
  • the display component 012 is usually a flexible screen (organic electroluminescence display, OLED).
  • OLED organic electroluminescence display
  • the bending area needs to be relatively large. The large curvature will increase the thickness of the display component 012, which will occupy a larger space and is not conducive to the thin and light design of the smartphone. If the arc is too small, the display component 012 may crack, break or fail.
  • FIG. 4 and FIG. 5 two display components 012 of the same type with different size ratios are respectively shown.
  • the display area of the display component 012 is smaller.
  • the display component 012 has a smaller display area.
  • the display area of component 012 is larger.
  • the connection area between the circuit board 0125 and the display component 012 is also larger.
  • the display area of the display component 012 is larger, the area of the part of the display component 012 that is bent toward the back is also larger, thereby providing a large enough connection area for the transmission line (or circuit board 0125). Therefore, the display will be significantly increased.
  • the display area of the display component 012 equipped in the foldable smartphone is becoming larger and larger. Therefore, how to reduce the thickness and size of the display component 012 becomes more important.
  • the present application provides a display component that can effectively reduce the thickness size.
  • the display assembly 10 may include a support plate 11 and a display layer 12; the support plate 11 has a first plate surface (not shown in the figure) and a second plate surface 11b (The lower plate surface in the figure), the first plate surface and the second plate surface 11b are two plate surfaces facing away from each other.
  • the display layer 12 includes a display part 121, a bending part 122 and a connecting part 123 connected in sequence.
  • the display part 121 is provided on the first plate surface, the bending part 122 is located on the edge of the support plate 11 , and the connecting part 123 is provided on the second plate surface 11 b , wherein the connecting part 123 has a sinking area 1231 that is recessed toward the second plate surface 11 b.
  • the display part 121, the bending part 122 and the connecting part 123 are different parts of the display component 10.
  • the main function of the display part 121 is to provide a display function
  • the main function of the connecting part 123 is to communicate with the display driver chip or circuit. board (not shown in the figure) connection.
  • the bending portion 122 is mainly used to connect the display portion 121 and the connecting portion 123 and provide a certain curvature so that the display portion 121 of the display assembly 10 can be located on the first surface of the supporting plate 11 and the connecting portion 123 can be located on the supporting plate.
  • the connecting portion 123 has a surface facing the second board surface 11b.
  • the recessed subsidence area 1231 can effectively reduce the thickness of the display component 10 in the subsidence area 1231 and reduce the space occupied by the display component 10.
  • the setting of the subsidence area 1231 will not cause any adverse effects on the bending part 122.
  • the influence is such that the bending portion 122 has sufficient curvature to prevent the bending portion 122 from being over-bent.
  • the distance between the settlement area 1231 and the second plate surface 11b may be nearly zero. That is, the settlement area 1231 can be in close contact with the second plate surface 11b. Of course, a certain distance can also be maintained between the settlement area 1231 and the second plate surface 11b.
  • a first glue layer 124 may be provided between the settling area 1231 and the support plate 11 . That is, a certain distance is maintained between the settlement area 1231 and the second board surface 11b of the support plate 11 (the lower board surface in the figure). At the same time, the settlement area 1231 can be bonded to the second board surface through the first adhesive layer 124 11b, to achieve a fixed connection between the settlement area 1231 and the support plate 11, and to prevent relative displacement and other undesirable situations between the settlement area 1231 and the support plate 11.
  • the thickness of the first glue layer 124 can be reasonably set according to actual conditions, and this application does not limit this.
  • the thickness dimensions of different areas of the first adhesive layer 124 may be substantially the same, or the thicknesses of different areas of the first adhesive layer 124 may also be different.
  • the settlement area 1231 and the support plate 11 can also be fixedly connected through welding or screw connection. This application does not specifically limit the connection method between the settlement area 1231 and the support plate.
  • the location and number of settlement areas 1231 can also be diverse.
  • the settlement area 1231 may also maintain a certain distance from the edge of the display layer 12 .
  • two settlement areas 1231 may be provided, namely a settlement area 1231a and a settlement area 1231b.
  • the settlement area 1231a is provided close to an edge of one side of the display layer 12
  • the settlement area 1231b maintains a certain distance from the edge of the display layer 12 .
  • three or more settlement areas 1231 may be provided.
  • the location and number of settlement zones 1231 can be flexibly set according to different needs, and this application does not specifically limit this.
  • the settlement area 1231 will be taken as an example for detailed description.
  • the connecting part 123 may also include a transition zone 1232.
  • the transition zone 1232 is located between the settlement zone 1231 and the bending part 122, and is used to realize the transition between the settlement zone 1231 and the bending part 122. transition.
  • the bending portion 122 is bent from the upper plate surface (the first plate surface) to the lower plate surface (the second plate surface 11b) of the support plate 11, the bending arc cannot be too small, otherwise the bending portion 122 will be bent. defects such as marks, cracks or breaks.
  • the distance between the lower end of the bent portion 122 and the lower surface of the support plate 11 is set to H1, and the distance between the settlement area 1231 and the lower surface of the support plate 11 is set to H2.
  • the function of the transition area 1232 is to realize the transition between H1 and H2.
  • the length dimension L of the transition zone 1232 also needs to be set appropriately to prevent excessive stress from occurring at the junction of the transition zone 1232 and the bending part 122, and to prevent the transition zone from Excessive stress occurs at the junction of 1232 and settlement zone 1231.
  • the length dimension L of the transition region 1232 may be greater than or equal to 1 mm.
  • the length of the transition zone 1232 can be reasonably set according to the actual situation to effectively adjust the settlement zone 1231 and the bending portion 122 transition between height differences.
  • the connecting part 123 may also include a holding area 1233, the holding area 1233 is connected to the bending part 122, and the holding area 1233 is connected to the second plate surface 11b The minimum distance between them is greater than the maximum distance between the settlement area 1231 and the second plate surface 11b.
  • a second glue layer 125 can be disposed between the holding area 1233 and the second plate surface 11b. That is, the holding area 1233 can be bonded to the second plate surface 11b through the second glue layer 125 to realize the connection between the holding area 1233 and the support plate 11.
  • the fixed connection between the holding area 1233 and the supporting plate 11 prevents relative displacement and other undesirable situations. It can be understood that in specific applications, the thickness of the second glue layer 125 can be reasonably set according to actual conditions, and this application does not limit this.
  • the holding area 1233 and the support plate 11 can also be fixedly connected through welding or screw connection. This application does not specifically limit the connection method between the holding area 1233 and the support plate.
  • the first glue layer 124 and the second glue layer 125 can be used to achieve a fixed connection between the connecting portion 123 and the supporting plate 11 , thereby effectively improving the connection stability between the connecting portion 123 and the supporting plate 11 .
  • the thickness of the first glue layer 124 the distance between the settlement area 1231 and the second plate surface 11b can be effectively ensured.
  • the thickness of the second glue layer 125 the distance between the holding area 1233 and the second plate surface 11b can be effectively ensured.
  • first glue layer 124 and the second glue layer 125 also helps to improve the convenience during production.
  • the first glue layer 124 and the second glue layer 125 can be disposed on the second board surface 11b first, and then the display layer 12 is disposed Above the second plate surface 11b, two pressure heads 100 are used to align the settlement area 1231 and the holding area 1233 respectively.
  • the two pressure heads 100 can move in the direction of the second plate surface 11b at the same time to press the settlement area 1231 together.
  • the holding area 1233 is pressed to the area corresponding to the second glue layer 125.
  • the settlement area 1231 can be bonded to the second panel surface 11b through the first adhesive layer 124, and the holding area 1233 can be bonded to the second panel surface 11b through the second adhesive layer 125, thereby effectively improving the display layer 12 and the second panel surface 11b. Stability of connection between support plates 11.
  • two press heads 100 can be used to press together at the same time, so that molding can be performed at one time and alignment deviation caused by staged pressing can be avoided.
  • the materials of the first glue layer 124 and the second glue layer 125 may include polyethylene, polypropylene, etc. This application does not limit the specific material components of the first glue layer 124 and the second glue layer 125 .
  • spacers may be filled in the first glue layer 124 or the second glue layer 125 to ensure the thickness of the first glue layer 124 or the second glue layer 125 .
  • the isolator refers to hard particles and has a certain ability to withstand pressure.
  • the first glue layer 124 or the second glue layer 125 is filled with spacers, when the settlement area 1231 and the holding area 1233 are pressed on the second board surface 11b, it can effectively ensure that the first glue layer 124 and the second
  • the thickness of the glue layer 125 ensures the distance between the settling area 1231 and the second plate surface 11b and the distance between the holding area 1233 and the second plate surface 11b.
  • the supporting plate 11 may be a flexible plate or a rigid plate.
  • the display assembly 10 may be a foldable flexible screen or a non-foldable rigid screen.
  • the main function of the support plate 11 is to provide a certain support function for the display layer 12 to prevent the display layer 12 from deforming when it is touched or pressed.
  • the support plate 11 can also improve the flatness of the display layer 12, so that the display layer 12 can display a better image.
  • the support plate 11 can be made of currently more conventional materials and types, which is not limited in this application.
  • a part of the display layer 12 can first be arranged on the support plate. 11, and then bend the other part of the display layer 12 to one side of the second plate surface 11b, and press the other part of the display layer 12 to the second surface of the support plate 11 through the press head 100. Panel 11b.
  • a part of the display layer 12 can be pressed onto the second surface 11b of the support plate 11 using the press head 100, and then the other part of the display layer 12 can be bent toward one side of the first surface 11a, and Another part of the display layer 12 is provided on the first panel surface 11a. It can be understood that during actual production, an appropriate production technology and process can be selected according to actual conditions, and this application does not limit this.
  • the circuit board 13 and the display layer 12 can be connected first, and then the display layer 12 and the support plate 11 are assembled together.
  • the display layer 12 and the support plate 11 can be assembled together first, and then the circuit board 13 and the display layer 12 can be connected.
  • the display component 10 may also include a display driver chip 14 .
  • the display driving chip 14 and the connecting portion 123 are located on the same side of the second board surface 11 b, and the display driving chip 14 is connected to the connecting portion 123 .
  • the display driving chip 14 is located on the surface of the settlement area 1231 . Since the subsidence area 1231 is recessed toward the support plate 11, a certain space can be freed up.
  • the display driver chip 14 is disposed on the surface of the subsidence area 1231, which can effectively utilize the space vacated by the subsidence area 1231, thereby conducive to lowering the cost. Displays the space size of component 10.
  • one end of the circuit board 13 is also located in the settlement area 1231 , that is, the circuit board 13 is connected to the settlement area 1231 , thereby realizing the connection between the circuit board 13 and the entire display layer 12 .
  • the circuit board 13 may be a flexible circuit board or a printed circuit board. This application does not limit the specific type of the circuit board 13 .
  • the display driver chip 14 can also be located at other positions of the connection portion 123 , and the circuit board 13 can also be connected to other positions of the connection portion 123 , which is not limited in this application.
  • the display layer 12 can be a currently common screen such as a flexible screen (organic electroluminescence display, OLED).
  • OLED organic electroluminescence display
  • the display layer 12 may include a cover plate 12 a , a cathode 12 b , an electron transport layer 12 c , a light emitting layer 12 d , a hole transport layer 12 e and an anode that are stacked in sequence. 12f.
  • the light-emitting principle of the display layer 12 is as follows: a thin film made of indium tin oxide can be used as the anode 12f, a metal composition can be used as the cathode 12b, and an organic material layer (such as the above-mentioned hole transport layer 12e) is mixed between the anode 12f and the cathode 12b.
  • the light-emitting layer 12d and the electron transport layer 12c forming a layer structure similar to a sandwich.
  • the holes in the anode 12f and the electrons in the cathode 12b are combined in the light-emitting layer 12d, thereby generating light.
  • the size of the display component 10 can also be reasonably set according to actual needs.
  • the depth dimension of the settlement zone 1231 and the length dimension of the transition zone 1232 can also be reasonably set based on simulation testing.
  • the structure shown in Figure 18 can be used as a simulation model. Specifically, in the display assembly 10 shown in FIG. 18 , the holding area 1233 has been bonded to the surface of the supporting plate 11 through the second glue layer 125 , and the transition area 1232 and the settlement area 1231 are in a cantilevered state.
  • the depth D of the settlement area 1231 is 0.15 mm.
  • the settlement area 1231 is bonded to the second plate surface 11 b of the support plate 11 through the first glue layer 124 .
  • the simulation test multiple tests were conducted using the length L of the transition region 1232 as a variable, and the test conclusion was that when the length L of the transition region 1232 increases, the maximum stress of the display layer 12 decreases significantly.
  • the results obtained through a large number of simulations and experiments are that if the length of the transition region 1232 increases by 1 mm, the maximum stress of the display layer 12 can decrease by more than 56%, that is, the strain state of the display layer 12 is strongly related to the step slope.
  • the length dimension L of the transition zone 1232 can be 1.3mm, 1.5mm, 2.0mm, 2.3mm, etc., which is not limited in this application.
  • the display component 10 can be applied to many different types of terminal devices.
  • the smartphone 20 may include a housing 21 and a display component 10.
  • the display component 10 may be installed on one side of the housing 21 (the upper side in the figure). ), and together with the casing 21 form an accommodation space; the casing 21 has a frame 211, and the frame 211 can be located at the edge of the display component 10, thereby providing good protection to the display component 10.
  • the thickness dimension of the display component 10 can be effectively reduced (for example, the thickness dimension can be reduced by 0.15-0.2 mm), but also the thickness dimension of the smart phone 20 can be effectively reduced (such as the thickness dimension can be reduced by 0.15-0.2 mm).
  • the size can be reduced by 0.3-0.4mm), thereby facilitating the realization of a thin and light design of the smartphone 20.
  • the smart phone 20 may be a straight phone or a foldable phone.
  • the display component 10 can also be applied to terminal devices such as tablet computers, notebook computers, televisions, monitors, etc. This application does not limit the specific types of terminal devices and specific application scenarios of the display component 10 .

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

提供了一种显示组件和终端设备，涉及电子设备技术领域，以解决显示组件的厚度尺寸较大的问题。显示组件包括支撑板（11）和显示层（12），支撑板（11）具有第一板面和第二板面（11b），显示层（12）包括依次连接的显示部（121）、弯折部（122）和连接部（123），显示部（121）设置在第一板面，弯折部（122）位于支撑板（11）的边缘，连接部（123）设置在第二板面（11b），其中，连接部（123）具有朝第二板面（11b）凹陷的沉降区（1231）。在显示组件中，通过设置沉降区（1231），可以有效降低显示组件在沉降区（1231）的厚度尺寸，能缩减显示组件所占用的空间大小，并且，沉降区（1231）的设置并不会对弯折部（122）造成不良影响，以使弯折部（122）具有足够的弧度以防止弯折部被过度弯折。

Description

一种显示组件和终端设备
相关申请的交叉引用
本申请要求在2022年03月29日提交中国专利局、申请号为202220708547.7、申请名称为“一种显示组件和终端设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种显示组件和终端设备。
背景技术
随着智能手机或平板等终端设备的不断普及和发展，更高屏占比的终端设备受到了较大的青睐。在相同体积大小的终端设备中，较高屏占比的终端设备能够明显缩小边框的宽度，并提供更大的显示面积和操作面积，能够明显提升用户的视觉感受和使用体验。
在目前的一些封装工艺中(如chip on plastic，COP)，通常会将柔性屏幕的边缘部分向背部进行弯折，驱动芯片等器件可以位于柔性屏幕的背部，从而可以降低整个柔性屏的边框的宽度尺寸，以增加显示面积。但是，这会明显增加柔性屏幕的厚度，不利于实现轻薄化设计。
发明内容
本申请提供了一种能有效降低厚度尺寸的显示组件和终端设备。
一方面，本申请提供了一种显示组件，可以包括支撑板和显示层；支撑板具有第一板面和第二板面，第一板面和第二板面为相互背离的两个板面。显示层包括依次连接的显示部、弯折部和连接部。显示部设置在第一板面，弯折部位于支撑板的边缘，连接部设置在第二板面，其中，连接部具有朝第二板面凹陷的沉降区。具体来说，显示部、弯折部和连接部分别为显示组件的不同部位，显示部的主要作用是提供显示功能，连接部的主要作用是为了与显示驱动芯片或电路板连接。弯折部主要用于连接显示部和连接部，并提供一定的弧度，以使显示组件的显示部能够位于支撑板的第一板面，使连接部能够位于支撑板的第二板面。
在本申请提供的显示组件中，连接部具有朝第二板面凹陷的沉降区，因此，可以有效降低显示组件在沉降区的厚度尺寸，能缩减显示组件所占用的空间大小，并且，沉降区的设置并不会对弯折部造成不良影响，以使弯折部具有足够的弧度以防止弯折部被过度弯折。
在一种示例中，连接部还可以包括保持区，保持区与弯折部连接，并且，保持区与第二板面之间的最小距离大于沉降区与第二板面之间的最大距离。保持区可以对沉降区和弯折区起到隔绝作用，防止在对沉降区进行制作或装配时影响到弯折区。另外，保持区也可以与支撑板进行连接，以有效提升连接部与支撑板之间的连接稳定性。
在一种示例中，连接部还可以包括过渡区。过渡区可以位于沉降区和弯折部之间，用于实现沉降区和弯折部之间的过渡。例如，弯折部由支撑板的第一板面向第二板面弯折时， 弯曲的弧度不能过小，否则弯折部会出现折痕、裂痕或断裂等不良情况。
在具体应用时，沉降区的深度可以满足0.15mm≤D≤0.25mm。其中，沉降区的深度D也可以是其他的任意值，本申请对此不作限定。另外，沉降区的表面可以是平面也可以曲面，本申请对此不作限制。
另外，保持区和沉降区的直线方向上，过渡区的长度大于或等于1mm。当然，过渡区的长度可以根据实际情况进行合理设置，以有效的对沉降区和弯折部之间的高度差进行过渡。
在一种示例中，沉降区与支撑板之间可以设置第一胶层。即沉降区与支撑板的第二板面之间保持有一定的距离，同时，沉降区可以通过第一胶层粘接在第二板面，以实现沉降区与支撑板之间的固定连接，防止沉降区与支撑板之间产生相对位移等不良情况。
另外，保持区和第二板面之间可以设置第二胶层，即保持区可以通过第二胶层粘接在第二板面，以实现保持区与支撑板之间的固定连接，防止保持区与支撑板之间产生相对位移等不良情况。
在一种示例中，显示组件还可以包括显示驱动芯片。显示驱动芯片和连接部位于第二板面的同一侧，并且，显示驱动芯片与连接部连接。
另外，显示驱动芯片可以位于沉降区的表面。由于沉降区向支撑板的方向凹陷，因此，可以腾出一定的空间，将显示驱动芯片设置在沉降区的表面，可以有效利用沉降区所腾出的空间，从而有利于降低显示组件的空间大小。
另外，显示组件还可以包括电路板，电路板和连接部位于第二板面的同一侧，并且，电路板与连接部连接。
其中，电路板的一端也位于沉降区，即电路板与沉降区连接，从而实现电路板与整个显示层之间的连接。其中，电路板可以是柔性电路板，也可以是印制电路板等，本申请对电路板的具体类型不作限制。
另一方面，本申请还提供了一种终端设备，包括壳体和上述任一种显示组件，显示组件中的支撑板可以与壳体连接，以实现显示组件和壳体之间的固定连接。通过应用本申请实施例提供的显示组件，不仅可以有效降低显示组件的厚度尺寸，并且，还可以有效降低智能手机的厚度尺寸，从而便于实现智能手机的轻薄化设计。
其中，终端设备可以是智能手机、平板电脑、笔记本电脑、电视、显示器等，本申请对终端设备的具体类型和显示组件的具体应用场景不作限制。
附图说明
图1为本申请实施例提供的一种常规的智能手机的平面结构示意图；
图2为本申请实施例提供的一种常规的智能手机的剖面结构简图；
图3为本申请实施例提供的一种常规的显示组件的剖面结构简图；
图4为本申请实施例提供的一种常规的显示组件的局部剖面结构示意图；
图5为本申请实施例提供的另一种常规的显示组件的局部剖面结构示意图；
图6为本申请实施例提供的一种显示组件的剖面结构简图；
图7为图6中的显示层的展开后的平面图；
图8为本申请实施例提供的另一种显示组件的剖面结构简图；
图9为图8中的显示层的展开后的平面图；
图10为本申请实施例提供的另一种显示组件的剖面结构简图；
图11为图10中的显示层的展开后的平面图；
图12为本申请实施例提供的一种显示组件的剖面结构简图；
图13为标示图12中的显示组件的尺寸参数的结构示意图；
图14为本申请实施例提供的一种显示组件的剖面结构简图；
图15为本申请实施例提供的一种在对显示组件进行装配时的结构示意图；
图16为本申请实施例提供的一种显示组件的剖面结构简图；
图17为本申请实施例提供的一种显示层的剖面结构示意图；
图18为本申请实施例提供的一种显示组件的沉降区未压合时的剖面结构示意图；
图19为本申请实施例提供的一种显示组件的沉降区被压合后的剖面结构示意图；
图20为标示图19中的显示组件的尺寸参数的结构示意图；
图21为图19中C区域的应力仿真图；
图22为本申请实施例提供的一种智能手机的剖面结构简图。
具体实施方式
为了方便理解本申请实施例提供的显示组件，下面首先介绍一下其应用场景。
请结合参阅图1和图2。图1为一种常规的智能手机01的平面结构示意图，图2为一种常规的智能手机01的剖面结构简图。智能手机01可以包括壳体011和显示组件012，显示组件012可以安装在壳体011的一侧(如图2中的上侧)，并与壳体011共同围成容纳空间010；其中，壳体011具有边框0111，并且，边框0111可以位于显示组件012的边缘，从而可以对显示组件012起到良好的保护作用。智能手机01的电池013、处理器(图中未示出)等器件可以设置在容纳空间010内。显示组件012包括正面(如图2中的上表面)和背面(如图2中的下表面)，正面也可以称为显示面，可以显示图片、文字或视频等内容。
在具体应用时，智能手机01中需要配备显示驱动芯片(display driver integrated circuit chip，DDIC)或集成电路等器件，显示驱动芯片用于驱动显示组件012正常工作，并且，显示驱动芯片等器件与显示组件012之间的相对位置会影响到显示组件012的显示面积。其中，显示组件012的类型可以是多种，下面将以显示组件012为柔性屏(organic electroluminescence display，OLED)为例进行简单说明。
如图3所示，显示组件012可以包括层叠设置的盖板0121、显示层0122和支撑板0123。在一些实施方式中，可以采用覆晶聚酰亚胺(chip on polyimide，COP)，或覆晶薄膜(chip on film，COF)等封装工艺将显示驱动芯片0124设置在显示层0122的一侧，显示驱动芯片0124或电路板0125等器件与显示层0122连接，并靠近显示层0122的边缘设置。在实际应用中，由于显示驱动芯片0124和电路板0125等器件会占用一定的空间，因此，在显示组件012的区域A中可以实现正常的显示功能，在B区域则不能显示图像，因此，会降低显示组件012的显示比例。
如图1所示，在智能手机01的实际产品中，在对应B区域的位置，会存在较大宽度的黑边(如俗称的下巴)，因此，会明显降低显示组件012的显示面积，不利于提升产品竞争力。
另外，如图4所示，在另一些实施方式中，可以将显示层0122的边缘部分向背面弯 折，并且，向背面弯折的部分可以通过胶层0126与支撑板0123粘接。显示驱动芯片0124和电路板0125等器件可以设置在背离显示面的一侧，因此，在图4中来看，显示组件012的整个上表面均可以实现显示功能，因此，会有效提升显示组件012的显示面积。
在实际应用中，由于显示组件012的一部分需要向背面弯折，因此，显示组件012通常为柔性屏(organic electroluminescence display，OLED)，为了保证显示组件012的安全性，产生弯曲的区域需要具有较大的弧度，这会增加显示组件012的厚度，进而会占用较大空间，不利于智能手机的轻薄化设计。若弧度过小，显示组件012则可能会出现裂痕、断裂或失效等不良情况。
另外，结合参阅图4和图5所示，分别示出了同种类型的两种不同尺寸比例的显示组件012，在图4中，显示组件012的显示面积较小，在图5中，显示组件012的显示面积较大。在实际应用中，由于显示面积越大的显示组件012需要与更多数量的传输线进行连接，因此，电路板0125与显示组件012之间的连接区域也就越大。当显示组件012的显示面积越大时，显示组件012向背面弯折的部分的面积也越大，以此来为传输线(或电路板0125)提供足够大的连接区域，因此，会明显增加显示组件012所占用的体积大小。
另外，随着可折叠智能手机的不断发展和普及，在可折叠智能手机中配备的显示组件012的显示面积也越来越大，因此，如何降低显示组件012的厚度尺寸就显得更加重要。
为此，本申请提供了一种能够有效降低厚度尺寸的显示组件。
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图和具体实施例对本申请作进一步地详细描述。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”和“该”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。还应当理解，在本申请以下各实施例中，“至少一个”是指一个、两个或两个以上。
在本说明书中描述的参考“一个实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施方式中”、“在另外的实施方式中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
如图6所示，在本申请提供的一种示例中，显示组件10可以包括支撑板11和显示层12；支撑板11具有第一板面(图中未示出)和第二板面11b(图中的下板面)，第一板面和第二板面11b为相互背离的两个板面。显示层12包括依次连接的显示部121、弯折部122和连接部123。显示部121设置在第一板面，弯折部122位于支撑板11的边缘，连接部123设置在第二板面11b，其中，连接部123具有朝第二板面11b凹陷的沉降区1231。具体来说，显示部121、弯折部122和连接部123分别为显示组件10的不同部位，显示部121的主要作用是提供显示功能，连接部123的主要作用是为了与显示驱动芯片或电路板(图中未示出)连接。弯折部122主要用于连接显示部121和连接部123，并提供一定的弧度，以使显示组件10的显示部121能够位于支撑板11的第一板面，使连接部123能够位于支撑板11的第二板面11b。在本申请提供的显示组件10中，连接部123具有朝第二板面11b 凹陷的沉降区1231，因此，可以有效降低显示组件10在沉降区1231的厚度尺寸，能缩减显示组件10所占用的空间大小，并且，沉降区1231的设置并不会对弯折部122造成不良影响，以使弯折部122具有足够的弧度以防止弯折部122被过度弯折。
在具体应用时，沉降区1231与第二板面11b之间的距离可以近乎为零。即沉降区1231可以与第二板面11b紧贴。当然，沉降区1231与第二板面11b之间也可以保持一定的距离。
例如，如图6所示，沉降区1231与支撑板11之间可以设置第一胶层124。即沉降区1231与支撑板11的第二板面11b(如图中的下板面)之间保持有一定的距离，同时，沉降区1231可以通过第一胶层124粘接在第二板面11b，以实现沉降区1231与支撑板11之间的固定连接，防止沉降区1231与支撑板11之间产生相对位移等不良情况。
可以理解的是，在具体应用时，第一胶层124的厚度可以根据实际情况进行合理设置，本申请对此不作限定。其中，第一胶层124的不同区域的厚度尺寸可以是大致相同的，或者，在第一胶层124的不同区域的厚度也可以是不相同的。另外，在其他的实施方式中，沉降区1231与支撑板11之间也可以通过焊接或螺钉连接等方式实现固定连接，本申请对沉降区1231与支持板之间的连接方式不作具体限定。
另外，在具体应用时，沉降区1231的设置位置和数量也可以是多样的。
例如，请结合图6和图7，在本申请提供的一种示例中，沉降区1231为一个，并靠近显示层12的一侧的边缘设置。
或者，如图8和图9所示，沉降区1231也可以与显示层12的边缘保持一定的距离。
或者，如图10和图11所示，沉降区1231也可以设置两个，分别为沉降区1231a和沉降区1231b。其中，沉降区1231a靠近显示层12的一侧的边缘设置，沉降区1231b与显示层12的边缘保持一定的距离。
当然，在其他的实施方式中，沉降区1231也可以设置三个或者三个以上。在实际应用时，可以根据不同需求对沉降区1231的设置位置和数量进行灵活设置，本申请对此不作具体限定。
为了便于理解本申请提供的显示组件10，在以下的实施例中，将以沉降区1231为一个为例进行具体说明。
如图12所示，在具体应用时，连接部123还可以包括过渡区1232，过渡区1232位于沉降区1231和弯折部122之间，用于实现沉降区1231和弯折部122之间的过渡。例如，弯折部122由支撑板11的上板面(第一板面)向下板面(第二板面11b)弯折时，弯曲的弧度不能过小，否则弯折部122会出现折痕、裂痕或断裂等不良情况。
请结合参阅图12和图13。设定弯折部122的下端与支撑板11的下板面之间的距离为H1，沉降区1231与支撑板11的下板面之间的距离为H2。过渡区1232的作用则是实现H1和H2之间的过渡。
在实际应用中，沉降区1231的深度D可以满足0.15mm≤D≤0.25mm。其中，D＝H1-H2，在实际应用中，沉降区1231的深度D也可以是其他的任意值，本申请对此不作限定。
当然，在沉降区1231和弯折部122的直线方向上，过渡区1232的长度尺寸L也需要进行合理设置，以防止过渡区1232与弯折部122的交界处出现过大应力，防止过渡区1232与沉降区1231的交界处出现过大应力。
例如，过渡区1232的长度尺寸L可以大于或等于1mm。当然，在其他的实施方式中，过渡区1232的长度可以根据实际情况进行合理设置，以有效的对沉降区1231和弯折部122 之间的高度差进行过渡。
另外，如图14所示，在本申请提供的另一个实施例中，连接部123还可以包括保持区1233，保持区1233与弯折部122连接，并且，保持区1233与第二板面11b之间的最小距离大于沉降区1231与第二板面11b之间的最大距离。
在保持区1233和第二板面11b之间可以设置第二胶层125，即保持区1233可以通过第二胶层125粘接在第二板面11b，以实现保持区1233与支撑板11之间的固定连接，防止保持区1233与支撑板11之间产生相对位移等不良情况。可以理解的是，在具体应用时，第二胶层125的厚度可以根据实际情况进行合理设置，本申请对此不作限定。另外，在其他的实施方式中，保持区1233与支撑板11之间也可以通过焊接或螺钉连接等方式实现固定连接，本申请对保持区1233与支持板之间的连接方式不作具体限定。
在实际应用中，可以通过第一胶层124和第二胶层125实现连接部123和支撑板11之间的固定连接，从而可以有效提升连接部123和支撑板11之间的连接稳定性。
另外，通过对第一胶层124的厚度尺寸进行合理设置，可以有效保证沉降区1231与第二板面11b之间的距离。相应的，通过对第二胶层125的厚度尺寸进行合理设置，可以有效保证保持区1233与第二板面11b之间的距离。
另外，通过设置第一胶层124和第二胶层125还有利于提升制作时的便利性。
例如，如图15所示，在对支撑板11和显示层12进行组装时，可以先将第一胶层124和第二胶层125设置在第二板面11b，然后，将显示层12设置在第二板面11b的上方，并采用两个压头100分别对准沉降区1231和保持区1233，两个压头100可以同时朝第二板面11b的方向移动，将沉降区1231压合在第一胶层124对应的区域，将保持区1233压合在第二胶层125对应的区域。
概括来说，沉降区1231可以通过第一胶层124粘接在第二板面11b，保持区1233可以通过第二胶层125粘接在第二板面11b，从而可以有效提升显示层12与支撑板11之间的连接稳定性。另外，在进行制作时，可以采用两个压头100同时压合，从而可以一次成型，避免分次压合导致的对位偏差。
在实际应用时，第一胶层124和第二胶层125的材料可以包括聚乙烯、聚丙烯等，本申请对第一胶层124和第二胶层125的具体材料组分不作限制。
另外，在一些实施方式中，第一胶层124或第二胶层125中还可以填充隔离子，以保证第一胶层124或第二胶层125的厚度尺寸。
其中，隔离子指的是硬质的颗粒物，并且，具有一定的抗压能力。当第一胶层124或第二胶层125中填充有隔离子后，在将沉降区1231和保持区1233压合在第二板面11b上时，能够有效保证第一胶层124和第二胶层125的厚度尺寸，进而保证沉降区1231与第二板面11b之间的距离、保持区1233与第二板面11b之间的距离。
另外，在实际应用中，支撑板11可以是柔性的板体，也可以是刚性的板体。或者，可以理解的是，显示组件10可以是可折叠的柔性屏，也可以是不可折叠的刚性屏。其中，支撑板11的主要作用是为显示层12提供一定的支撑作用，以防止显示层12被触摸或按压时产生形变。另外，通过支撑板11还能够提升显示层12的平整性，从而能够使显示层12显示较好效果的图像。在实际应用时，支撑板11可以选用目前较为常规的材料和类型，本申请对此不作限定。
请结合参阅图15和图16。在具体制作时，可以先将显示层12的一部分设置在支撑板 11的第一板面11a，然后，将显示层12的另一部分向第二板面11b的一侧弯折，并通过压头100将显示层12的另一部分压合在支撑板11的第二板面11b。或者，可以先将通过压头100将显示层12的一部分压合在支撑板11的第二板面11b，然后，将显示层12的另一部分向第一板面11a的一侧弯折，并将显示层12的另一部分设置在第一板面11a。可以理解的是，在实际制作时，可以根据实际情况选择合适的制作工艺和流程，本申请对此不作限定。
另外，如图15所示，在具体制作时，可以先将电路板13与显示层12进行连接，然后将显示层12与支撑板11组装到一起。当然，在其他的制作方式中，也可以先将显示层12与支撑板11组装到一起，然后将电路板13与显示层12进行连接。
如图16所示，在实际应用中，显示组件10还可以包括显示驱动芯片14。显示驱动芯片14和连接部123位于第二板面11b的同一侧，并且，显示驱动芯片14与连接部123连接。具体的，在图16中示出的示例中，显示驱动芯片14位于沉降区1231的表面。由于沉降区1231向支撑板11的方向凹陷，因此，可以腾出一定的空间，将显示驱动芯片14设置在沉降区1231的表面，可以有效利用沉降区1231所腾出的空间，从而有利于降低显示组件10的空间大小。
相应的，在图16中示出的示例中，电路板13的一端也位于沉降区1231，即电路板13与沉降区1231连接，从而实现电路板13与整个显示层12之间的连接。其中，电路板13可以是柔性电路板，也可以是印制电路板等，本申请对电路板13的具体类型不作限制。
可以理解的是，在其他的实施方式中，显示驱动芯片14也可以位于连接部123的其他位置，电路板13也可以与连接部123的其他位置进行连接，本申请对此不作限定。
另外，在实际应用中，显示层12可以是柔性屏(organic electroluminescence display，OLED)等目前较为普遍的屏幕。
例如，如图17所示，在本申请提供的一种示例中，显示层12可以包括依次层叠设置的盖板12a、阴极12b、电子传输层12c、发光层12d、空穴传输层12e和阳极12f。显示层12的发光原理为：可以将铟锡氧化物制成的薄膜作为阳极12f，金属组合物作为阴极12b，在阳极12f和阴极12b之间夹杂有机材料层(如上述的空穴传输层12e、发光层12d和电子传输层12c)，形成一个类似于三明治的层结构。阳极12f和阴极12b接通电流后，阳极12f的空穴与阴极12b的电子在发光层12d中结合，从而产生光亮。
可以理解的是，在实际应用中，显示层12的具体类型和结构本申请不作限制。
另外，在实际应用中，显示组件10的尺寸也可以根据实际需求进行合理设置。沉降区1231的深度尺寸，过渡区1232的长度尺寸也可以结合仿真测试进行合理设置。
例如，可以图18中所示的结构作为仿真模型。具体的，在图18中示出的显示组件10中，保持区1233已经通过第二胶层125粘合在支撑板11的板面，过渡区1232和沉降区1231处于悬臂状态。
需要说明的是，在以下的图18至图20中，沉降区1231的深度D均为0.15mm。
如图19所示，通过压合后，沉降区1231通过第一胶层124粘合在支撑板11的第二板面11b。
如图20所示，标示了图19中所示的部分结构的尺寸。
如图21所示，示出了图19中的局部区域C的受力仿真图。图中，颜色越深，则表示对应的区域的应力越大，相反的，颜色越浅，则表示对应的区域的应力越小。
在仿真测试中，以过渡区1232的长度尺寸L为变量进行了多次测试，得到的测试结论为：当过渡区1232的长度L增加后，显示层12的最大应力明显下降。另外，通过大量的模拟和实验得到的结果是，若过渡区1232的长度尺寸每增加1mm，显示层12的最大应力可下降越56％，即显示层12的应变状态与段差斜率强相关。
在实际的仿真测试中，过渡区1232的长度尺寸L可以是1.3mm、1.5mm、2.0mm、2.3mm等，本申请对此不作限定。
另外，在实际应用中，显示组件10可以应用到多种不同类型的终端设备中。例如，如图22所示，以终端设备为智能手机20为例，智能手机20可以包括壳体21和显示组件10，显示组件10可以安装在壳体21的一侧(如图中的上侧)，并与壳体21共同围成容纳空间；其中，壳体21具有边框211，并且，边框211可以位于显示组件10的边缘，从而可以对显示组件10起到良好的保护作用。通过应用本申请实施例提供的显示组件10，不仅可以有效降低显示组件10的厚度尺寸(如厚度尺寸可以减小0.15-0.2mm)，并且，还可以有效降低智能手机20的厚度尺寸(如厚度尺寸可以减小0.3-0.4mm)，从而便于实现智能手机20的轻薄化设计。其中，智能手机20可以是直板手机也可以是可折叠手机等类型。
当然，在其他的实施方式中，显示组件10也可以应用到平板电脑、笔记本电脑、电视、显示器等终端设备中，本申请对终端设备的具体类型和显示组件10的具体应用场景不作限制。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。本申请的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种显示组件，其特征在于，包括：
    支撑板，具有第一板面和与所述第一板面相背离的第二板面；
    显示层，包括依次连接的显示部、弯折部和连接部；
    所述显示部设置在所述第一板面，所述弯折部位于所述支撑板的边缘，所述连接部设置在所述第二板面；
    其中，所述连接部具有朝所述第二板面凹陷的沉降区。
  2. 根据权利要求1所述的显示组件，其特征在于，所述连接部还包括保持区，所述保持区与所述弯折部连接，所述保持区与所述第二板面之间的最小距离大于所述沉降区与所述第二板面之间的最大距离。
  3. 根据权利要求2所述的显示组件，其特征在于，所述连接部还包括过渡区，所述过渡区位于所述保持区和所述沉降区之间。
  4. 根据权利要求3所述的显示组件，其特征在于，在所述保持区和所述沉降区的直线方向上，所述过渡区的长度大于或等于1mm。
  5. 根据权利要求2至4中任一项所述的显示组件，其特征在于，还包括第一胶层和第二胶层；
    所述第一胶层位于所述沉降区和所述第二板面之间，所述第二胶层位于所述保持区和所述第二板面之间。
  6. 根据权利要求1至4中任一项所述的显示组件，其特征在于，所述沉降区的深度D满足：0.15mm≤D≤0.25mm。
  7. 根据权利要求1至4中任一项所述的显示组件，其特征在于，所述沉降区背离所述支撑板的表面为平面。
  8. 根据权利要求1至4中任一项所述的显示组件，其特征在于，还包括显示驱动芯片，所述显示驱动芯片和所述连接部位于所述第二板面的同一侧，并且，所述显示驱动芯片与所述连接部连接。
  9. 根据权利要求8所述的显示组件，其特征在于，所述显示驱动芯片设置在所述沉降区。
  10. 根据权利要求1至4中任一项所述的显示组件，其特征在于，还包括电路板，所述电路板和所述连接部位于所述第二板面的同一侧，并且，所述电路板与所述连接部连接。
  11. 根据权利要求10所述的显示组件，其特征在于，所述电路板的至少一部分位于所述沉降区。
  12. 一种终端设备，其特征在于，包括壳体和如权利要求1至11中任一项所述的显示组件，所述支撑板与所述壳体连接。
PCT/CN2023/083634 2022-03-29 2023-03-24 一种显示组件和终端设备 WO2023185670A1 (zh)

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