WO2023184256A1 - 显示模组及显示装置 - Google Patents

显示模组及显示装置 Download PDF

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Publication number
WO2023184256A1
WO2023184256A1 PCT/CN2022/084151 CN2022084151W WO2023184256A1 WO 2023184256 A1 WO2023184256 A1 WO 2023184256A1 CN 2022084151 W CN2022084151 W CN 2022084151W WO 2023184256 A1 WO2023184256 A1 WO 2023184256A1
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WO
WIPO (PCT)
Prior art keywords
display
circuit board
area
display substrate
display module
Prior art date
Application number
PCT/CN2022/084151
Other languages
English (en)
French (fr)
Inventor
魏俊波
杨盛际
卢鹏程
黄冠达
田元兰
Original Assignee
京东方科技集团股份有限公司
云南创视界光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 云南创视界光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202280000653.2A priority Critical patent/CN117546632A/zh
Priority to PCT/CN2022/084151 priority patent/WO2023184256A1/zh
Publication of WO2023184256A1 publication Critical patent/WO2023184256A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits

Definitions

  • Embodiments of the present disclosure relate to, but are not limited to, the field of display technology, and specifically relate to a display module and a display device.
  • Micro-organic light-emitting diode is a micro-display developed in recent years, and silicon-based OLED is one of them.
  • Silicon-based OLED has the advantages of small size and high resolution. It is manufactured using mature complementary metal oxide semiconductor (CMOS) integrated circuit technology. It can not only realize active addressing of pixels, but also realize the preparation of pixel drivers on silicon-based substrates. circuit, timing control (TCON) circuit and over-current protection (OCP) circuit, etc., which are conducive to reducing the system size and achieving lightweight.
  • CMOS complementary metal oxide semiconductor
  • TCON timing control
  • OCP over-current protection
  • Silicon-based OLEDs are widely used in near-eye display fields such as virtual reality (VR) and augmented reality (AR), such as AR/VR head-mounted display devices.
  • VR virtual reality
  • AR augmented reality
  • An embodiment of the present disclosure provides a display module, including a circuit board and a display substrate disposed on a first surface of the circuit board; the first surface of the circuit board includes a flat area and non-linear areas located around the flat area. A flat area, the display substrate is disposed in the flat area, and electronic components are provided in the non-flat area.
  • An embodiment of the present disclosure also provides a display device, including the display module.
  • Figure 1 is a schematic three-dimensional structural diagram of a display module according to some exemplary embodiments
  • Figure 2 is a schematic diagram of the assembly structure of the circuit board and display panel of the display module of Figure 1;
  • Figure 3 is a schematic structural diagram of the A-A cross-section of the display module of Figure 1 in some exemplary embodiments;
  • Figure 4 is a schematic structural diagram of the A-A cross-section of the display module of Figure 1 in other exemplary embodiments;
  • Figure 5 is a schematic structural diagram of the A-A cross-section of the display module of Figure 1 in some exemplary embodiments;
  • Figure 6 is a schematic plan view of a display module according to some exemplary embodiments.
  • Figure 7 is a schematic diagram of the film layer structure and cover structure of the display substrate of the display module in some exemplary embodiments
  • Figure 8 is a schematic plan view of the display substrate and cover of the display module in some exemplary embodiments.
  • Figure 9 is a flow chart of manufacturing a display module according to some exemplary embodiments.
  • An embodiment of the present disclosure provides a display module, including a circuit board and a display substrate disposed on a first surface of the circuit board; the first surface of the circuit board includes a flat area and non-linear areas located around the flat area. A flat area, the display substrate is disposed in the flat area, and electronic components are provided in the non-flat area.
  • the display substrate is arranged in the flat area of the first surface of the circuit board, and the electronic components are arranged in the non-flat area of the first surface of the circuit board. That is, the electronic components surround the display substrate.
  • Peripheral setting in this way, can ensure that the part of the circuit board that is in contact with the display substrate is a flat surface, and the surface of the circuit board that is away from the display substrate is a flat surface.
  • display devices such as AR/VR display devices
  • the height of the electronic component in a direction perpendicular to the display substrate, is lower than the height of a surface of the display substrate facing away from the circuit board.
  • the display substrate includes a display area and a non-display area located at the periphery of the display area; in a plane parallel to the display substrate, the edge of the circuit board is in contact with the edge of the display substrate. The distance between edges is greater than the width of the non-display area.
  • the display module further includes a plastic frame, which is disposed on the first surface of the circuit board and covers the non-flat area.
  • the display substrate includes a display area and a non-display area located at the periphery of the display area; the plastic frame also covers the non-display area of the display substrate and exposes the display area.
  • the non-display area includes a binding area located on one side of the display area, and the binding area is provided with a first pad; the non-flat area is provided with a first bonding pad close to the binding area.
  • the second soldering pad, the first soldering pad and the second soldering pad are connected through metal wires; the plastic frame also covers the metal wires.
  • the first soldering pad is disposed close to the first side of the display substrate
  • the second soldering pad is disposed close to the first side of the circuit board
  • the first side of the circuit board is in contact with the first side of the circuit board.
  • the distance between the first sides of the display substrate is greater than the distance between the remaining sides of the circuit board and the corresponding sides of the display substrate.
  • a test pad is provided on the surface of the circuit board away from the display substrate at a position corresponding to the binding area, and the binding area is also provided with a third pad connected to the test pad. pad.
  • the display module may further include a plastic frame disposed on the first surface of the circuit board, and a cover disposed on a surface of the display substrate away from the circuit board. board;
  • the display substrate includes a display area and a non-display area located on the periphery of the display area, and the cover plate completely covers the display area;
  • the plastic frame includes a frame plate with a window, and is located on the A first annular support portion is provided on the first side of the frame plate and along the circumferential edge of the frame plate away from the window; the first annular support portion is fixed on the first surface of the circuit board On the part near the circumferential edge, the part of the first side of the frame plate close to the window is supported on the cover plate, and the orthographic projection of the window on the circuit board includes the display area Orthographic projection on the circuit board.
  • Figure 1 is a schematic three-dimensional structural diagram of the display module of some exemplary embodiments
  • Figure 2 is a circuit board and display panel of the display module of Figure 1 3 is a schematic diagram of the A-A cross-sectional structure of the display module of FIG. 1 in some exemplary embodiments.
  • the display module includes a circuit board 30 and is disposed on the first surface of the circuit board 30
  • the display panel 80 and the plastic frame 40; the display panel 80 includes the display substrate 10 and the cover plate 20.
  • the first surface of the circuit board 30 includes a flat area and a non-flat area located around the flat area.
  • the display substrate 10 is disposed in the flat area.
  • the non-flat area is provided with electronic components 32, such as Resistors, capacitors, inductors, etc.
  • the display substrate 10 includes a display area and a non-display area located at the periphery of the display area; in a plane parallel to the display substrate 10, the distance between the edge of the circuit board 30 and the edge of the display substrate 10 is The distance may be greater than the width of the non-display area. In this way, it can be ensured that the circuits in the non-flat area of the circuit board 30 do not overlap with the display substrate 10 and there will be no circuit short circuit problem.
  • the non-display area includes a bonding area located on one side of the display area, and the bonding area is provided with a first pad 103 .
  • a second bonding pad 31 is provided in the non-flat area close to the binding area.
  • the first bonding pad 103 and the second bonding pad 31 are connected through a metal wire 61 to connect the display substrate 10 to the circuit. Board 30 bonded connection.
  • the first soldering pad 103 is disposed close to the first side of the display substrate 10
  • the second soldering pad 31 is disposed close to the first side of the circuit board 30 .
  • the distance from the first side of the display substrate 10 may be greater than the distance between the remaining sides of the circuit board 30 and the corresponding side of the display substrate 10 . In this way, the distance between the first side of the circuit board 30 and the first side of the display substrate 10 is relatively large, which is beneficial to the arrangement of the second bonding pad 31 and the metal line 61 and ensures the effectiveness of the metal line 61 .
  • a test pad may be provided on the surface of the circuit board 30 away from the display substrate 10 at a position corresponding to the binding area.
  • the binding area of the display substrate 10 may also be provided with a test pad corresponding to the binding area. Through the connected third pad, the display substrate 10 can be tested for voltage, impedance, etc. through the test pad.
  • the cover 20 is disposed on the display side of the display substrate 10 and completely covers the display area and exposes the first pad 103 .
  • the plastic frame 40 is disposed on the first surface of the circuit board 30 and covers the non-flat area.
  • the plastic frame 40 can also cover the non-display area of the display substrate 10 and expose the display area, wherein the plastic frame 40 also covers the metal lines 61 .
  • the plastic frame 40 can protect the electronic components 32 and circuits in the non-flat areas of the circuit board 30 to prevent the electronic components 32 from being squeezed and damaged; the plastic frame 40 can also protect the non-display areas and areas of the display substrate 10
  • the metal wire 61 provides protection.
  • the height of the electronic component 32 may be lower than the height of the surface of the display substrate 10 away from the circuit board 30 , so that the electronic component 32 will not affect
  • the thickness of the display substrate 10 allows the plastic frame 40 to easily cover the non-flat area.
  • the plastic frame 40 may include a frame plate 41 provided with a window 410, and a frame plate 41 provided on a first side of the frame plate 41 and along a circumferential edge of the frame plate 41 away from the window 410.
  • the first annular support part 42; the first annular support part 42 is fixed on a part of the first surface of the circuit board 30 close to the circumferential edge, and a part of the first side of the frame plate 41 close to the window
  • a portion of 410 is supported on the cover 20 , and the orthographic projection of the window 410 on the circuit board 30 includes the orthographic projection of the display area on the circuit board 30 .
  • the disposed plastic frame 40 can block the areas of the display substrate 10 that are not covered by the cover plate 20 , the non-flat areas of the circuit board 30 and the metal lines 61 , thereby avoiding damage to the display substrate 10 and the circuit board 30 .
  • the plastic frame 40 is not easy to damage the metal wire 61, ensuring reliable electrical connection between the display substrate 10 and the circuit board 30; the plastic frame 40 is supported on the cover 20 , the surface of the plastic frame 40 facing away from the circuit board 30 protrudes from the surface of the cover 20, which can protect the cover 20 and prevent the edge of the cover 20 from being damaged and light leakage; setting the plastic frame 40 can improve the display module
  • the surface flatness is conducive to effective matching and alignment of the display module and the optical structure in the display device.
  • a second annular support portion 43 may be provided on the first side of the frame plate 41 along the circumferential edge of the window 410 .
  • the portion 43 is supported on the cover plate 20 .
  • the shape of the second annular supporting portion 43 can be the same as the shape of the cover plate 20 , for example, both are rectangular.
  • the circumferential edge of the first side of the frame panel close to the window opening may be directly supported on the cover panel.
  • the end surface of the first annular support portion 42 away from the frame plate 41 can be fixed on the circuit board 30 through fixing glue 51 , thereby fixing the glue frame 40 on the circuit board 30 .
  • FIG. 4 is a schematic structural diagram of the A-A cross-section of the display module of FIG. 1 in other exemplary embodiments.
  • the non-display area of the display substrate 10 It includes a binding area located on one side of the display area, and the binding area is provided with a first bonding pad 103; the non-flat area of the circuit board 30 is provided with a second bonding pad close to the binding area. 31.
  • the first bonding pad 103 and the second bonding pad 31 are connected through a metal wire 61.
  • the cover plate 20 exposes the first pad 103, and the circumferential edge of the cover plate 20 protrudes from the circumferential edge of the display area.
  • the circumferential edge of the display substrate 10 may protrude from the circumferential edge of the display area.
  • the circumferential edge of the cover plate 20 may be provided on the first side of the frame plate 41 along the circumferential edge of the window 410 , and the second annular support part 43 is supported close to the circumferential edge of the cover plate 20 part, and supported on the non-display area of the display substrate 10 except the binding area.
  • the second annular support portion 43 plays a supporting role, and on the other hand, because it is also supported on the non-display area of the display substrate 10 except the binding area, the second annular support portion 43 is also partially The ground is located at the circumferential side wall of the cover plate 20, so the second annular support portion 43 can also play a limiting role to fix the plastic frame 40 more firmly.
  • the end surface of the first annular support portion 42 away from the frame plate 41 can be fixed on the circuit board 30 through fixing glue 51 , thereby fixing the glue frame 40 on the circuit board 30 .
  • the display substrate 10 and the cover 20 may both be rectangular, and the display substrate 10 includes opposite first and second sides, and an opposite third side. side and the fourth side, and the area of the display substrate 10 close to the first side is the binding area.
  • the second annular support part 43 is correspondingly rectangular.
  • the second annular support part 43 may include an annular base 431 and a rib 432 provided on an end surface of the annular base 431 away from the frame plate 41 .
  • the two annular supporting parts 43 are not provided with the convex ribs at positions corresponding to the binding area (that is, the convex ribs 432 are arranged to avoid the binding area); the annular base part 431 is away from the frame plate 41
  • the end surface of the cover plate 20 is supported on a portion of the surface of the cover plate 20 that is away from the display substrate 10 and close to the circumferential edge.
  • the ribs 432 are located at the circumferential side walls of the cover plate 20 and are supported on a portion of the display substrate 10 close to the second On parts of the side, the third side and the fourth side, the ribs 432 are arranged to avoid the binding area to prevent damage to the metal wire 61 .
  • FIG. 5 is a schematic structural diagram of the A-A cross-section of the display module in FIG. 1 in still other exemplary embodiments.
  • the structure of the plastic frame 40 can be The structure of the glue frame 40 in the example of Figure 4 is the same.
  • Glue 52 can be filled between the first side of the frame plate 41 and the circuit board 30.
  • the glue 52 fixes the glue frame 40 to the circuit board. on board 30.
  • the glue 52 can also cover the metal wire to improve the water vapor isolation effect.
  • the glue 52 can fill the gap between the first side of the frame plate 41 and the circuit board 30 .
  • the metal wire can be a gold wire or an aluminum wire. Gold wire has strong hardness and anti-oxidation ability. Gold wire does not need to be protected by glue 52, which can avoid damage to the metal wire during the glue coating process; aluminum wire is easy to be Oxidation, the glue 52 can cover the metal wire to improve the water vapor isolation effect.
  • the cover plate 20 completely covers the display area 101 of the display substrate 10 , so The orthographic projection of the cover 20 on the circuit board 30 includes the orthographic projection of the window 410 on the circuit board 30 , and the orthographic projection of the window 410 on the circuit board 30 includes the display Orthographic projection of area 101 on the circuit board 30 . Therefore, the image displayed in the display area 101 can be viewed from the window 410 of the plastic frame.
  • the size of the window 410 may be larger than the size of the display area 101 .
  • the perimeter of the cover 20 The distance between the lateral edge and the circumferential edge of the window 410 may be smaller than the distance between the circumferential edge of the cover plate 20 and the circumferential edge of the display area 101 .
  • the distance between the circumferential edge of the cover plate 20 and the circumferential edge of the display area 101 may be greater than 500 micrometers, such as 500 micrometers to 1000 micrometers.
  • the circumferential edge of the cover plate protrudes from the circumferential edge of the display area; the side edge of the binding area away from the display area protrudes from the cover plate.
  • the remaining sides of the display substrate may protrude from or be flush with the corresponding sides of the cover plate.
  • the display substrate 10 and the cover plate 20 are both rectangular in shape, both include four sides, and the display area 101 is rectangular; so The circumferential edge of the cover plate 20 protrudes from the circumferential edge of the display area 101 , and the four sides of the display substrate 10 protrude from the corresponding sides of the cover plate 20 .
  • the circuit board 30 and the display substrate 10 may both be rectangular in shape and include four sides.
  • the first soldering pad 103 is disposed close to the first side of the display substrate 10
  • the second soldering pad 31 is disposed close to the first side of the circuit board 30 .
  • the first bonding pads 103 and the second bonding pads 31 may be arranged in multiples and arranged in a line.
  • the plurality of the first bonding pads 103 may be arranged in a line
  • the plurality of the second bonding pads 31 may be arranged in a line. Line up in two lines.
  • the electronic components 32 in the non-flat area of the circuit board 30 may be located between the remaining three sides of the circuit board 30 and the corresponding sides of the display substrate 10 .
  • the electronic components 32 may all be disposed in the non-flat area of the first surface of the circuit board 30 , and no electronic components 32 may be disposed on the surface of the circuit board 30 facing away from the display substrate 10 , thus ensuring that the circuit board 30 faces away from the display substrate 10 .
  • the surface of 10 is relatively flat, which is conducive to the alignment and fixation of the display module during the assembly of the whole machine.
  • a connector 33 may be provided on the surface of the circuit board 30 away from the display substrate 10 , and the connector 33 is configured to be connected to an external driving device.
  • the display substrate 10 is driven to perform display.
  • the circuit board 30 may be a hard printed circuit board.
  • the outer peripheral outline shape and size of the plastic frame 40 and the outline shape and size of the circuit board 30 may be the same.
  • the window 410 may be provided at the middle position of the frame plate 41 .
  • the plastic frame may be made of polycarbonate (PC) or acrylonitrile-butadiene-styrene copolymer (ABS).
  • PC polycarbonate
  • ABS acrylonitrile-butadiene-styrene copolymer
  • the surface of the display substrate 10 facing the circuit board 30 may be fixed on the first surface of the circuit board 30 through an adhesive layer (not shown). .
  • the height of the second annular support portion 43 may be greater than the thickness of the adhesive layer.
  • the display substrate 10 may include a driving backplane. board 11, and the anode 12, the light-emitting functional layer 13, the cathode layer 14, the first encapsulation layer 15, the color filter layer 16 and the second encapsulation layer 17 that are stacked on the driving back plate 11 in sequence.
  • the cover plate 20 can be disposed on the second packaging layer 17 .
  • the driving backplane 11 may include a substrate and a driving circuit layer provided on the substrate.
  • the driving circuit layer may include a pixel driving circuit, and the pixel driving circuit may include a plurality of transistors and capacitors.
  • the anode 12, the light-emitting functional layer 13 and the cathode layer 14 are stacked in sequence to form a light-emitting device.
  • the display substrate 10 may be a silicon-based OLED display substrate, and the substrate may be a silicon substrate.
  • the pixel driving circuit may be manufactured using a CMOS integrated circuit process, and may be manufactured using a 180 nm or 110 nm semiconductor process.
  • the light-emitting device may be a white light OLED device, and may be a series OLED device structure.
  • the anode 12 of the light-emitting device can be made of metal or/and metal oxide materials with conductive properties and high work function values.
  • the anode 12 can have a single-layer structure or a multi-layer structure.
  • the anode 12 can include A first titanium metal layer, an aluminum or silver metal layer, a second titanium metal layer and an indium tin oxide (ITO) layer are sequentially stacked in the direction of the driving backplane 11 .
  • the material of the cathode layer 14 of the light-emitting device may be magnesium-silver alloy or the like.
  • the first encapsulation layer 15 and the second encapsulation layer 17 can be made of one or more of organic materials and inorganic materials with good sealing performance.
  • the inorganic materials can be silicon oxide, nitrogen, etc. Silicone etc.
  • the first encapsulation layer 15 and the second encapsulation layer 17 can block water vapor and oxygen, and protect the light-emitting device from being corroded by water and oxygen.
  • the color filter layer 16 may include a plurality of filter units that can transmit light of a set color, such as a red filter unit that transmits red light, a green filter unit that transmits green light, and a blue filter unit that transmits blue light. unit.
  • the white light emitted by each light-emitting device passes through a corresponding filter unit and then emits light of a corresponding color to achieve color display of the display substrate 10 .
  • the cover 20 may be disposed on the second packaging layer 17 of the display substrate 10 .
  • the cover 20 may be made of a high transmittance material, such as glass.
  • Figure 8 is a schematic plan view of a display substrate and a cover plate of a display module in some exemplary embodiments.
  • the display substrate includes a display area and a non-display area located at the periphery of the display area.
  • the cover The panel 20 completely covers the display area of the display substrate, and the circumferential edge of the display substrate (ie, the circumferential edge of the driving backplane 11) can protrude from the circumferential edge of the cover plate 20. There is a certain distance around the base plate that is not covered by the cover 20, which can be used to position and fix the display module in the entire machine.
  • the orthographic projection of the light-emitting functional layer 13 on the driving backplane 11 may include the orthographic projection of the anode 12 of the light-emitting device on the driving backplane 11 .
  • the orthographic projection of the color filter layer 16 on the driving backplane 11 may include the orthographic projection of the light-emitting functional layer 13 on the driving backplane 11 .
  • the manufacturing process of the display module may include the following steps: (1) Making a circuit Plate 30.
  • the circuit board 30 may be a rigid printed circuit board (PCB).
  • the first surface of the circuit board 30 includes a flat area and a non-flat area located around the flat area.
  • the non-flat area is provided with a second solder joint.
  • disk 31, and electronic components 32 such as resistors, capacitors, inductors, power ICs, etc.
  • a connector 33 is provided on the second surface of the circuit board 30 (the surface away from the first surface).
  • the connector 33 is configured to be connected to an external driving device to realize the transmission of electrical signals.
  • glue 52 can be dotted on the first side of the frame plate 41 of the glue frame 40 , and the glue can be filled 52 in the first annular support portion 42 , the frame plate 41 and the second annular shape of the glue frame 40 Between the supporting parts 43, the plastic frame 40 is then bonded and fixed on the circuit board 30.
  • An embodiment of the present disclosure also provides a display device, including the display module described in any of the previous embodiments.
  • the display device may be a near-eye display device, such as VR glasses, helmet-mounted display, etc.
  • parallel refers to a state in which the angle formed by two straight lines is -10° or more and less than 10°, and therefore includes a state in which the angle is -5° or more and 5° or less.
  • vertical refers to a state where the angle formed by two straight lines is 80° or more and 100° or less, and therefore includes an angle of 85° or more and 95° or less.
  • connection means a fixed connection or a detachable connection, or Integrated connection
  • installation means a fixed connection or a detachable connection, or Integrated connection
  • installation can be directly connected, or indirectly connected through an intermediary, or internal communication between two components.

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Abstract

一种显示模组，包括电路板(30)和设于电路板(30)的第一表面上的显示基板(10)；电路板(30)的第一表面包括平坦区和位于平坦区周边的非平坦区，显示基板(10)设于平坦区内，非平坦区设有电子元器件(32)。

Description

显示模组及显示装置 技术领域
本公开实施例涉及但不限于显示技术领域，具体涉及一种显示模组及显示装置。
背景技术
微型有机发光二极管(Micro-OLED)是近年来发展起来的微型显示器，硅基OLED是其中一种。硅基OLED具有体积小、分辨率高等优点，采用成熟的互补金属氧化物半导体(CMOS)集成电路工艺制备，不仅可以实现像素的有源寻址，并且可以实现在硅基衬底上制备像素驱动电路、时序控制(TCON)电路和过电流保护(OCP)电路等，有利于减小系统体积，实现轻量化。硅基OLED广泛应用在虚拟现实(VR)、增强现实(AR)等近眼显示领域中，比如AR/VR头戴显示装置中。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本公开实施例提供一种显示模组，包括电路板和设于所述电路板的第一表面上的显示基板；所述电路板的第一表面包括平坦区和位于所述平坦区周边的非平坦区，所述显示基板设于所述平坦区内，所述非平坦区设有电子元器件。
本公开实施例还提供一种显示装置，包括所述的显示模组。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图说明
附图用来提供对本公开技术方案的进一步理解，并且构成说明书的一部分，与本公开的实施例一起用于解释本公开的技术方案，并不构成对本公开 技术方案的限制。附图中部件的形状和大小不反映真实比例，目的只是示意说明本公开内容。
图1为一些示例性实施例的显示模组的立体结构示意图；
图2为图1的显示模组的电路板和显示面板的装配结构示意图；
图3为在一些示例性实施例中图1的显示模组的A-A剖面结构示意图；
图4为在另一些示例性实施例中图1的显示模组的A-A剖面结构示意图；
图5为在又一些示例性实施例中图1的显示模组的A-A剖面结构示意图；
图6为一些示例性实施例的显示模组的平面结构示意图；
图7为在一些示例性实施例中显示模组的显示基板的膜层结构及盖板结构的示意图；
图8为在一些示例性实施例中显示模组的显示基板和盖板的平面结构示意图；
图9为一些示例性实施例的显示模组的制作流程图。
具体实施方式
本领域的普通技术人员应当理解，可以对本公开实施例的技术方案进行修改或者等同替换，而不脱离本公开实施例技术方案的精神和范围，均应涵盖在本公开的权利要求范围当中。
本公开实施例提供一种显示模组，包括电路板和设于所述电路板的第一表面上的显示基板；所述电路板的第一表面包括平坦区和位于所述平坦区周边的非平坦区，所述显示基板设于所述平坦区内，所述非平坦区设有电子元器件。
本公开实施例的显示模组，将显示基板设置在电路板的第一表面的平坦区内，在电路板的第一表面的非平坦区设置电子元器件，即电子元器件围绕在显示基板的周边设置，这样，可以保证电路板的与显示基板接触的部分为平坦表面，以及电路板的背离显示基板的表面为平坦表面，在显示模组应用于显示装置(比如AR/VR显示装置)整机时，有利于显示模组与显示装置 整机内的光学结构进行对位，保证显示模组具有较高的显示均一性。
在一些示例性实施例中，在垂直于所述显示基板的方向上，所述电子元器件的高度低于所述显示基板的背离所述电路板的表面的高度。
在一些示例性实施例中，所述显示基板包括显示区和位于所述显示区外围的非显示区；在平行于所述显示基板的平面内，所述电路板的边缘与所述显示基板的边缘之间的距离大于所述非显示区的宽度。
在一些示例性实施例中，所述的显示模组还包括胶框，所述胶框设于所述电路板的第一表面上并将所述非平坦区覆盖。
本实施例的一个示例中，所述显示基板包括显示区和位于所述显示区外围的非显示区；所述胶框还将所述显示基板的非显示区覆盖并将所述显示区暴露出。
示例性地，所述非显示区包括位于所述显示区一侧的绑定区，所述绑定区设有第一焊盘；所述非平坦区的靠近所述绑定区的位置设有第二焊盘，所述第一焊盘与所述第二焊盘通过金属线连接；所述胶框还将所述金属线覆盖。
示例性地，所述第一焊盘靠近所述显示基板的第一侧边设置，所述第二焊盘靠近所述电路板的第一侧边设置，所述电路板的第一侧边与所述显示基板的第一侧边之间的距离大于所述电路板的其余侧边与所述显示基板的相应侧边之间的距离。
示例性地，所述电路板的背离所述显示基板的表面上与所述绑定区对应的位置设有测试焊盘，所述绑定区还设有与所述测试焊盘连接的第三焊盘。
在一些示例性实施例中，所述的显示模组还可以包括设于所述电路板的第一表面上的胶框，以及设于所述显示基板的背离所述电路板的表面上的盖板；所述显示基板包括显示区和位于所述显示区外围的非显示区，所述盖板将所述显示区完全覆盖；所述胶框包括设有开窗的框板，以及设于所述框板的第一侧面上且沿所述框板的远离所述开窗的周向边缘设置的第一环形支撑部；所述第一环形支撑部固定在所述电路板的第一表面的靠近周向边缘的部分上，所述框板的第一侧面的靠近所述开窗的部分支撑在所述盖板上，所述开窗在所述电路板上的正投影包含所述显示区在所述电路板上的正投影。
在一些示例性实施例中，如图1、图2和图3，图1为一些示例性实施例的显示模组的立体结构示意图，图2为图1的显示模组的电路板和显示面板的装配结构示意图，图3为在一些示例性实施例中图1的显示模组的A-A剖面结构示意图，所述显示模组包括电路板30，以及设于所述电路板30的第一表面上的显示面板80和胶框40；所述显示面板80包括显示基板10和盖板20。
所述电路板30的第一表面包括平坦区和位于所述平坦区周边的非平坦区，所述显示基板10设于所述平坦区内，所述非平坦区设有电子元器件32，比如电阻、电容、电感等。
所述显示基板10包括显示区和位于所述显示区外围的非显示区；在平行于所述显示基板10的平面内，所述电路板30的边缘与所述显示基板10的边缘之间的距离可以大于所述非显示区的宽度。这样，可以确保电路板30的非平坦区的线路不与显示基板10搭接，不会存在电路短路问题。
所述非显示区包括位于所述显示区一侧的绑定区，所述绑定区设有第一焊盘103。所述非平坦区的靠近所述绑定区的位置设有第二焊盘31，所述第一焊盘103与所述第二焊盘31通过金属线61连接，以将显示基板10与电路板30绑定连接。
所述第一焊盘103靠近所述显示基板10的第一侧边设置，所述第二焊盘31靠近所述电路板30的第一侧边设置，所述电路板30的第一侧边与所述显示基板10的第一侧边之间的距离可以大于所述电路板30的其余侧边与所述显示基板10的相应侧边之间的距离。这样，所述电路板30的第一侧边与所述显示基板10的第一侧边之间的距离较大，有利于设置第二焊盘31和金属线61，保证金属线61的有效性。
所述电路板30的背离所述显示基板10的表面上与所述绑定区对应的位置可以设有测试焊盘，所述显示基板10的绑定区还可以设有与所述测试焊盘连接的第三焊盘，可以通过所述测试焊盘对显示基板10进行电压、阻抗等测试。
所述盖板20设于所述显示基板10的显示侧，并将所述显示区完全覆盖且将所述第一焊盘103暴露出。所述胶框40设于所述电路板30的第一表面 上并将所述非平坦区覆盖。所述胶框40还可以将所述显示基板10的非显示区覆盖并将所述显示区暴露出，其中，所述胶框40还将所述金属线61覆盖。这样，通过胶框40可以对电路板30的非平坦区的电子元器件32及线路进行保护，防止电子元器件32受到挤压而损伤；胶框40还可以对显示基板10的非显示区以及所述金属线61进行保护。
在垂直于所述显示基板10的方向上，所述电子元器件32的高度可以低于所述显示基板10的背离所述电路板30的表面的高度，这样，电子元器件32不会影响到显示基板10的厚度，胶框40容易覆盖所述非平坦区。
所述胶框40可以包括设有开窗410的框板41，以及设于所述框板41的第一侧面上且沿所述框板41的远离所述开窗410的周向边缘设置的第一环形支撑部42；所述第一环形支撑部42固定在所述电路板30的第一表面的靠近周向边缘的部分上，所述框板41的第一侧面的靠近所述开窗410的部分支撑在所述盖板20上，所述开窗410在所述电路板30上的正投影包含所述显示区在所述电路板30上的正投影。这样，通过设置的胶框40可以将显示基板10的未被盖板20覆盖的区域、电路板30的非平坦区以及所述金属线61遮挡，从而可以避免损伤显示基板10、电路板30的电子元器件32及所述金属线61；此外，所述胶框40不易损坏所述金属线61，保证显示基板10与电路板30之间电性连接可靠；胶框40支撑在盖板20上，胶框40的背离电路板30的表面凸出于盖板20表面，可以起到保护盖板20的作用，可防止盖板20的边缘被损伤和漏光；设置胶框40可提高显示模组的表面平坦性，有利于显示模组与显示装置整机内的光学结构有效匹配对位。
在一些示例性实施例中，如图3所示，所述框板41的第一侧面上沿所述开窗410的周向边缘可以设有第二环形支撑部43，所述第二环形支撑部43支撑在所述盖板20上。所述第二环形支撑部43的形状可以与所述盖板20的形状相同，比如均为矩形。在其他实施方式中，所述框板的第一侧面的靠近所述开窗的周向边缘可以直接支撑在所述盖板上。本示例中，所述第一环形支撑部42的远离所述框板41的端面可以通过固定胶51固定在所述电路板30上，从而将胶框40固定在电路板30上。
在另一些示例性实施例中，如图2和图4所示，图4为在另一些示例性 实施例中图1的显示模组的A-A剖面结构示意图，所述显示基板10的非显示区包括位于所述显示区一侧的绑定区，所述绑定区设有第一焊盘103；所述电路板30的非平坦区的靠近所述绑定区的位置设有第二焊盘31，所述第一焊盘103与所述第二焊盘31通过金属线61连接。所述盖板20将所述第一焊盘103暴露出，所述盖板20的周向边缘凸出于所述显示区的周向边缘，所述显示基板10的周向边缘可以凸出于所述盖板20的周向边缘。所述框板41的第一侧面上沿所述开窗410的周向边缘可以设有第二环形支撑部43，所述第二环形支撑部43支撑在所述盖板20的靠近周向边缘的部分上，并支撑在所述显示基板10的除所述绑定区外的非显示区上。本示例中，第二环形支撑部43一方面起到支撑作用，另一方面由于还支撑在显示基板10的除所述绑定区外的非显示区上，因此第二环形支撑部43还部分地位于盖板20的周向侧壁处，因此第二环形支撑部43还可以起到限位作用，使胶框40固定更牢靠。本示例中，所述第一环形支撑部42的远离所述框板41的端面可以通过固定胶51固定在所述电路板30上，从而将胶框40固定在电路板30上。
示例性地，如图4所示，所述显示基板10和所述盖板20可以均为矩形，所述显示基板10包括相对的第一侧边和第二侧边，以及相对的第三侧边和第四侧边，显示基板10的靠近第一侧边的区域为所述绑定区。所述第二环形支撑部43相应地为矩形，所述第二环形支撑部43可以包括环形基部431和设于环形基部431的远离所述框板41的端面上的凸筋432，所述第二环形支撑部43在对应于所述绑定区的位置不设置所述凸筋(即所述凸筋432避开所述绑定区设置)；所述环形基部431的远离所述框板41的端面支撑在盖板20的背离显示基板10的表面的靠近周向边缘的部分上，所述凸筋432位于所述盖板20的周向侧壁处并支撑在显示基板10的靠近第二侧边、第三侧边和第四侧边的部分上，所述凸筋432避开所述绑定区设置，以防止损伤所述金属线61。
在另一些示例性实施例中，如图5所示，图5为在又一些示例性实施例中图1的显示模组的A-A剖面结构示意图，本示例中，所述胶框40的结构可以与图4示例中的胶框40结构相同，所述框板41的第一侧面与所述电路板30之间可以填充有胶水52，所述胶水52将所述胶框40固定在所述电路 板30上。示例性地，所述胶水52还可以将所述金属线覆盖，提高隔离水汽效果，所述胶水52可以将所述框板41的第一侧面与所述电路板30之间的空隙填满。示例性地，所述金属线可以为金线或者铝线，金线的硬度与抗氧化能力较强，采用金线可以不用胶水52保护，可以避免涂胶过程中损伤金属线；铝线容易被氧化，所述胶水52可以覆盖所述金属线，以提高隔绝水汽效果。
在一些示例性实施例中，如图6所示，图6为一些示例性实施例的显示模组的平面结构示意图，所述盖板20将所述显示基板10的显示区101完全覆盖，所述盖板20在所述电路板30上的正投影包含所述开窗410在所述电路板30上的正投影，所述开窗410在所述电路板30上的正投影包含所述显示区101在所述电路板30上的正投影。由此，可以从胶框的开窗410观看显示区101显示的图像。
本实施例的一个示例中，如图6所示，所述开窗410的尺寸可以大于所述显示区101的尺寸，在平行于所述显示基板10的平面内，所述盖板20的周向边缘与所述开窗410的周向边缘之间的距离可以小于所述盖板20的周向边缘与所述显示区101的周向边缘之间的距离。示例性地，所述盖板20的周向边缘与所述显示区101的周向边缘之间的距离可以大于500微米，比如可以为500微米至1000微米。
在一些示例性实施例中，所述盖板的周向边缘凸出于所述显示区的周向边缘；所述绑定区的远离所述显示区的侧边凸出于所述盖板的相应侧边，所述显示基板的其余侧边可以凸出于或平齐于所述盖板的相应侧边。示例性地，如图6所示，所述显示基板10和盖板20的形状均为矩形，所述显示基板10和盖板20均包括四个侧边，所述显示区101为矩形；所述盖板20的周向边缘凸出于所述显示区101的周向边缘，所述显示基板10的四个侧边均凸出于所述盖板20的相应侧边。
在一些示例性实施例中，如图2所示，所述电路板30和所述显示基板10的形状可以均为矩形并均包括四个侧边。所述第一焊盘103靠近所述显示基板10的第一侧边设置，所述第二焊盘31靠近所述电路板30的第一侧边设置。所述第一焊盘103和第二焊盘31可以均设置为多个并排成一行，在其他实施方式中，多个第一焊盘103可以排成一行，多个第二焊盘31可以排成两 行。所述电路板30的非平坦区的电子元器件32可以位于电路板30的其余三个侧边和显示基板10的相应侧边之间。所述电子元器件32可以全部设置在电路板30的第一表面的非平坦区，电路板30的背离显示基板10的表面上可以不设置电子元器件32，可保证电路板30的背离显示基板10的表面较为平坦，有利于显示模组在整机装配中的对位和固定。
在一些示例性实施例中，如图2所示，所述电路板30的背离所述显示基板10的表面上可以设有连接器33，所述连接器33配置为与外部驱动装置连接，以驱动显示基板10进行显示。所述电路板30可以为硬质印刷电路板。
在一些示例性实施例中，如图1所示，所述胶框40的外周轮廓形状和尺寸与所述电路板30的轮廓形状和尺寸可以相同。所述开窗410可以设于所述框板41的中间位置。
在一些示例性实施例中，所述胶框的材质可以为聚碳酸酯(PC)或者丙烯腈-丁二烯-苯乙烯共聚物(ABS)等。
在一些示例性实施例中，如图3所示，所述显示基板10的朝向所述电路板30的表面可以通过粘结层(未示出)固定在所述电路板30的第一表面上。所述第二环形支撑部43的高度可以大于所述粘结层的厚度。
在一些示例性实施例中，如图7所示，图7为在一些示例性实施例中显示模组的显示基板的膜层结构及盖板结构的示意图，所述显示基板10可以包括驱动背板11，以及依次叠设于所述驱动背板11上的阳极12、发光功能层13、阴极层14、第一封装层15、彩色滤光层16和第二封装层17。所述盖板20可以盖设在第二封装层17上。所述驱动背板11可以包括基底和设于基底上的驱动电路层，所述驱动电路层包括像素驱动电路，所述像素驱动电路可以包括多个晶体管和电容。所述阳极12、所述发光功能层13和阴极层14依次叠设形成发光器件。
示例性地，所述显示基板10可以为硅基OLED显示基板，所述基底可以为硅基底，所述像素驱动电路可以采用CMOS集成电路工艺制备，可以通过180nm或者110nm的半导体工艺制作而成。所述发光器件可以为白光OLED器件，并可以为串联式OLED器件结构。所述发光器件的阳极12可以采用具有导电性能及高功函数值的金属或/和金属氧化物材料，所述阳极 12可以采用单层结构或多层结构，比如所述阳极12可以包括沿远离所述驱动背板11的方向依次叠设的第一钛金属层、铝或银金属层、第二钛金属层和氧化铟锡(ITO)层。所述发光器件的阴极层14的材料可以为镁银合金等。所述第一封装层15和所述第二封装层17可以采用密封性能较好的有机材料、无机材料中的一种或者多种制备而成，所述的无机材料比如可以是氧化硅、氮化硅等。所述第一封装层15和所述第二封装层17可以起到阻挡水汽和氧气的作用，保护发光器件不受水氧侵蚀。所述彩色滤光层16可以包括多个可以透射设定颜色光的滤光单元，比如，包括透射红光的红色滤光单元、透射绿光的绿色滤光单元和透射蓝光的蓝色滤光单元。每个发光器件发射的白光透过对应的一个滤光单元后出射相应颜色的光，以实现显示基板10的彩色化显示。所述盖板20可以盖设在所述显示基板10的第二封装层17上，所述盖板20的材质为高透过率的材质，比如可以为玻璃材质。
如图8所示，图8为在一些示例性实施例中显示模组的显示基板和盖板的平面结构示意图，所述显示基板包括显示区和位于显示区外围的非显示区，所述盖板20将所述显示基板的显示区完全覆盖，所述显示基板的周向边缘(即驱动背板11的周向边缘)可以凸出于所述盖板20的周向边缘，在所述显示基板的周边留有一定的距离不被盖板20盖住，可以用于显示模组在整机中的定位与固定。所述发光功能层13在所述驱动背板11上的正投影可以包含所述发光器件的阳极12在所述驱动背板11上的正投影。所述彩色滤光层16在所述驱动背板11上的正投影可以包含所述发光功能层13在所述驱动背板11上的正投影。
在一些示例性实施例中，如图9所示，图9为一些示例性实施例的显示模组的制作流程图，所述显示模组的制作过程可以包括如下步骤：(1)、制作电路板30。所述电路板30可以为硬质印刷电路板(PCB)，所述电路板30的第一表面包括平坦区和位于所述平坦区周边的非平坦区，所述非平坦区设有第二焊盘31，以及电子元器件32，比如电阻、电容、电感、电源芯片(power IC)等。第二焊盘31为多个并可以排成一行或两行，所述第二焊盘31靠近所述电路板30的一个侧边设置，电子元器件32靠近电路板30的其余侧边设置。所述电路板30的第二表面(背离第一表面的表面)上设置有连接器33， 所述连接器33配置为与外部驱动装置连接，以实现电信号的传输。(2)、在所述电路板30的第一表面的平坦区涂覆粘结剂71，所述粘结剂71用于固定显示面板的显示基板。(3)、在所述粘结剂71的有效操作时间内，把显示面板80(包括贴合在一起的显示基板和盖板)粘接在电路板30的平坦区，然后将粘结剂71固化(粘结剂71固化后形成粘结层)，贴合完成。(4)、在显示基板的绑定区的第一焊盘上打线，并且把此金属线61连接到电路板30的第二焊盘31上，实现第一焊盘与第二焊盘31的电性连接，完成打线操作。(5)、将胶框40固定在电路板30上。先把胶框40与电路板30进行对位，然后，如图3所示，在胶框40的第一环形支撑部42的端面涂胶，将胶框40的第一环形支撑部42的端面固定在电路板30的第一表面的靠近周向边缘的部分上，从而将胶框40粘接固定在电路板30上。或者，如图5所示，可以在胶框40的框板41的第一侧面上点涂胶水52，胶水可以52充满在胶框40的第一环形支撑部42、框板41和第二环形支撑部43之间，然后将胶框40粘接固定在电路板30上。
本公开实施例还提供一种显示装置，包括前文任一实施例所述的显示模组。显示装置可以为近眼显示装置，比如VR眼镜、头盔显示器等。
在附图中，有时为了明确起见，夸大表示了构成要素的大小、层的厚度或区域。因此，本公开的实施方式并不一定限定于该尺寸，附图中每个部件的形状和大小不反映真实比例。此外，附图示意性地示出了一些例子，本公开的实施方式不局限于附图所示的形状或数值。
在本文描述中，“平行”是指两条直线形成的角度为-10°以上且10°以下的状态，因此，包括该角度为-5°以上且5°以下的状态。另外，“垂直”是指两条直线形成的角度为80°以上且100°以下的状态，因此，包括85°以上且95°以下的角度的状态。
在本说明书中，为了方便起见，使用“中部”、“上”、“下”、“前”、“后”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示方位或位置关系的词句以参照附图说明构成要素的位置关系，仅是为了便于描述本说明书和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。构成要素的位置关系根据描述 各构成要素的方向适当地改变。因此，不局限于在说明书中说明的词句，根据情况可以适当地更换。
在本文描述中，除非另有明确的规定和限定，术语“连接”、“固定连接”、“安装”、“装配”应做广义理解，例如，可以是固定连接，或是可拆卸连接，或一体地连接；术语“安装”、“连接”、“固定连接”可以是直接相连，或通过中间媒介间接相连，或是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据情况理解上述术语在本公开实施例中的含义。

Claims (20)

  1. 一种显示模组，包括电路板和设于所述电路板的第一表面上的显示基板；所述电路板的第一表面包括平坦区和位于所述平坦区周边的非平坦区，所述显示基板设于所述平坦区内，所述非平坦区设有电子元器件。
  2. 如权利要求1所述的显示模组，其中，在垂直于所述显示基板的方向上，所述电子元器件的高度低于所述显示基板的背离所述电路板的表面的高度。
  3. 如权利要求1所述的显示模组，其中，所述显示基板包括显示区和位于所述显示区外围的非显示区；在平行于所述显示基板的平面内，所述电路板的边缘与所述显示基板的边缘之间的距离大于所述非显示区的宽度。
  4. 如权利要求1所述的显示模组，还包括胶框，所述胶框设于所述电路板的第一表面上并将所述非平坦区覆盖。
  5. 如权利要求4所述的显示模组，其中，所述显示基板包括显示区和位于所述显示区外围的非显示区；所述胶框还将所述显示基板的非显示区覆盖并将所述显示区暴露出。
  6. 如权利要求5所述的显示模组，其中，所述非显示区包括位于所述显示区一侧的绑定区，所述绑定区设有第一焊盘；所述非平坦区的靠近所述绑定区的位置设有第二焊盘，所述第一焊盘与所述第二焊盘通过金属线连接；所述胶框还将所述金属线覆盖。
  7. 如权利要求6所述的显示模组，其中，所述第一焊盘靠近所述显示基板的第一侧边设置，所述第二焊盘靠近所述电路板的第一侧边设置，所述电路板的第一侧边与所述显示基板的第一侧边之间的距离大于所述电路板的其余侧边与所述显示基板的相应侧边之间的距离。
  8. 如权利要求6所述的显示模组，其中，所述电路板的背离所述显示基板的表面上与所述绑定区对应的位置设有测试焊盘，所述绑定区还设有与所述测试焊盘连接的第三焊盘。
  9. 如权利要求1所述的显示模组，还包括设于所述电路板的第一表面上的胶框，以及设于所述显示基板的背离所述电路板的表面上的盖板；
    所述显示基板包括显示区和位于所述显示区外围的非显示区，所述盖板将所述显示区完全覆盖；
    所述胶框包括设有开窗的框板，以及设于所述框板的第一侧面上且沿所述框板的远离所述开窗的周向边缘设置的第一环形支撑部；所述第一环形支撑部固定在所述电路板的第一表面的靠近周向边缘的部分上，所述框板的第一侧面的靠近所述开窗的部分支撑在所述盖板上，所述开窗在所述电路板上的正投影包含所述显示区在所述电路板上的正投影。
  10. 如权利要求9所述的显示模组，其中，所述框板的第一侧面上沿所述开窗的周向边缘设有第二环形支撑部，所述第二环形支撑部支撑在所述盖板上。
  11. 如权利要求10所述的显示模组，其中，所述非显示区包括位于所述显示区一侧的绑定区，所述绑定区设有第一焊盘；所述非平坦区的靠近所述绑定区的位置设有第二焊盘，所述第一焊盘与所述第二焊盘通过金属线连接；
    所述盖板将所述第一焊盘暴露出，所述盖板的周向边缘凸出于所述显示区的周向边缘，所述显示基板的周向边缘凸出于所述盖板的周向边缘；
    所述第二环形支撑部支撑在所述盖板的靠近周向边缘的部分上，并支撑在所述显示基板的除所述绑定区外的非显示区上。
  12. 如权利要求9所述的显示模组，其中，所述第一环形支撑部的远离所述框板的端面通过固定胶固定在所述电路板上。
  13. 如权利要求10所述的显示模组，其中，所述框板的第一侧面与所述电路板之间填充有胶水，所述胶水将所述胶框固定在所述电路板上。
  14. 如权利要求9所述的显示模组，其中，所述盖板在所述电路板上的正投影包含所述开窗在所述电路板上的正投影。
  15. 如权利要求9所述的显示模组，其中，所述胶框的外周轮廓形状和尺寸与所述电路板的轮廓形状和尺寸相同。
  16. 如权利要求10所述的显示模组，其中，所述显示基板的朝向所述电路板的表面通过粘结层固定在所述电路板上，所述第二环形支撑部的高度大于所述粘结层的厚度。
  17. 如权利要求9所述的显示模组，其中，所述胶框的材质为聚碳酸酯或者丙烯腈-丁二烯-苯乙烯共聚物。
  18. 如权利要求9所述的显示模组，其中，所述非显示区包括位于所述显示区一侧的绑定区，所述绑定区与所述电路板绑定连接；
    所述盖板的周向边缘凸出于所述显示区的周向边缘；所述绑定区的远离所述显示区的侧边凸出于所述盖板的相应侧边，所述显示基板的其余侧边凸出于或平齐于所述盖板的相应侧边。
  19. 如权利要求1所述的显示模组，其中，所述电路板的背离所述显示基板的表面上设有连接器，所述连接器配置为与外部驱动装置连接。
  20. 一种显示装置，包括权利要求1至19任一项所述的显示模组。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103296056A (zh) * 2012-12-30 2013-09-11 上海天马微电子有限公司 有机发光二极管显示装置及其制造方法
CN103345316A (zh) * 2013-06-14 2013-10-09 业成光电（深圳）有限公司 具有触控功能的电子装置
JP2014178614A (ja) * 2013-03-15 2014-09-25 Rohm Co Ltd 画像表示装置および画像表示装置の取付構造
CN107393422A (zh) * 2017-09-04 2017-11-24 武汉华星光电半导体显示技术有限公司 显示面板及显示设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103296056A (zh) * 2012-12-30 2013-09-11 上海天马微电子有限公司 有机发光二极管显示装置及其制造方法
JP2014178614A (ja) * 2013-03-15 2014-09-25 Rohm Co Ltd 画像表示装置および画像表示装置の取付構造
CN103345316A (zh) * 2013-06-14 2013-10-09 业成光电（深圳）有限公司 具有触控功能的电子装置
CN107393422A (zh) * 2017-09-04 2017-11-24 武汉华星光电半导体显示技术有限公司 显示面板及显示设备

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