WO2023181791A1 - Dispositif de test et procédé de test - Google Patents

Dispositif de test et procédé de test Download PDF

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Publication number
WO2023181791A1
WO2023181791A1 PCT/JP2023/007017 JP2023007017W WO2023181791A1 WO 2023181791 A1 WO2023181791 A1 WO 2023181791A1 JP 2023007017 W JP2023007017 W JP 2023007017W WO 2023181791 A1 WO2023181791 A1 WO 2023181791A1
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WIPO (PCT)
Prior art keywords
wiring board
printed wiring
sensor
electronic component
jig
Prior art date
Application number
PCT/JP2023/007017
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English (en)
Japanese (ja)
Inventor
陽介 金川
大樹 山上
裕之 石川
和幸 須藤
浩平 中西
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to TW112110216A priority Critical patent/TW202400981A/zh
Publication of WO2023181791A1 publication Critical patent/WO2023181791A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces

Definitions

  • the present disclosure relates to a test device and a test method.
  • Non-Patent Document 1 stipulates a test method in which electronic components are mounted on a printed wiring board for testing. In this test method, judgment is made based on the performance and appearance abnormalities of electronic components after bending a printed wiring board to a specified dimension.
  • limit value the bending dimension at which the electronic component broke is not known. In order to know the limit value, it is not necessary to bend the printed wiring board to a certain dimension, but rather to bend the printed wiring board until the electronic components break, such as cracking, and to know the bending dimension at that time.
  • Patent Document 1 describes that in an apparatus for measuring the bending strength of a single object to be measured such as an electronic component, an acoustic emission sensor (hereinafter referred to as "AE It is disclosed that an AE sensor is provided to detect vibrations caused by destruction of the object to be measured.
  • AE acoustic emission sensor
  • Patent Document 1 does not assume that the printed wiring board on which the object to be measured is mounted is bent, and does not have a structure for placing the printed wiring board on a stage and bending it.
  • an object of the present disclosure is to provide a technology that can detect vibrations caused by destruction of electronic components with high accuracy in a bendability test of a printed wiring board on which electronic components are mounted.
  • a test device includes a support base that supports both ends of a mounting surface of a printed wiring board on which electronic components are mounted, and a support base that is disposed on a side of the printed wiring board opposite to the mounting surface, and , a pusher jig that applies a load to the electronic component via the printed wiring board, and a pusher jig that is disposed around the electronic component on the mounting surface of the printed wiring board, and that is caused by destruction of the electronic component.
  • a sensor that detects vibration caused by the sensor and outputs a voltage signal according to the vibration; a fixing jig that fixes the sensor to the printed wiring board; a pressing member that presses the sensor against the printed wiring board; and a measuring section for measuring the waveform of the output voltage signal.
  • the pusher jig since the support base supports both ends of the mounting surface of the printed wiring board, the pusher jig applies a load to the electronic component via the printed wiring board, so that the electronic component is mounted.
  • Printed wiring boards can be bent. Further, since the sensor is fixed to the printed wiring board by the fixing jig and pressed against the printed wiring board by the pressing member, it is possible to stably attach the sensor to the printed wiring board.
  • vibrations caused by destruction of electronic components can be detected with high accuracy in a bendability test of a printed wiring board on which electronic components are mounted.
  • FIG. 1 is a schematic diagram of a test device according to Embodiment 1.
  • FIG. FIG. 3 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 1, viewed from the -Y direction.
  • FIG. 3 is a schematic diagram of the mounting location of a sensor included in the test device according to the first embodiment, viewed from the X direction.
  • FIG. 2 is a schematic diagram showing a state in which a vibrator and a sensor are fixed on a printed wiring board included in the test device according to the first embodiment.
  • FIG. 3 is a diagram showing the relationship between the pressing force of a sensor against a printed wiring board and the output voltage of the sensor.
  • FIG. 3 is a schematic diagram showing the distance between a sensor and an exciter.
  • FIG. 7 is a diagram showing the relationship between the distance between the vibrator and the sensor and the output voltage of the sensor when a constant vibration is applied to the printed wiring board by the vibrator.
  • FIG. 2 is a schematic diagram of a test device according to a second embodiment.
  • FIG. 7 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 2, viewed from the X direction.
  • FIG. 3 is a schematic diagram of a test device according to Embodiment 3.
  • FIG. 6 is a diagram showing an output signal waveform detected by a sensor regarding vibration caused by destruction when a ceramic multilayer capacitor reaches a limit value.
  • FIG. 6 is a diagram showing a histogram for each frequency included in vibrations caused by destruction when a ceramic multilayer capacitor reaches a limit value.
  • FIG. 7 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 4, viewed from the -Y direction.
  • FIG. 12 is an enlarged view showing a portion of the outer circumferential surface of a fixing jig included in the test apparatus according to Embodiment 4, which faces a pusher jig.
  • FIG. 12 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 5, viewed from the X direction.
  • FIG. 7 is an enlarged view showing a portion of the inner circumferential surface of the fixing jig included in the test apparatus according to Embodiment 5 that contacts the printed wiring board, and a portion of the outer circumferential surface of the fixing jig that faces the pusher jig. .
  • FIG. 7 is a schematic diagram of a positioning jig according to a sixth embodiment, viewed from the Z direction.
  • FIG. 7 is a schematic diagram of a positioning jig according to a sixth embodiment, viewed from the -Y direction.
  • FIG. 12 is a schematic diagram of a state in which a sensor is attached using a positioning jig according to a sixth embodiment, viewed from the Z direction.
  • FIG. 12 is a schematic diagram of a state in which a sensor is attached using a positioning jig according to a sixth embodiment, viewed from the -Y direction.
  • FIG. 1 is a schematic diagram of a test apparatus according to Embodiment 1.
  • FIG. 2 is a schematic diagram of the mounting location of the sensor 6 included in the test apparatus according to the first embodiment, viewed from the -Y direction.
  • FIG. 3 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the first embodiment, viewed from the X direction.
  • the X direction, Y direction, and Z direction are orthogonal to each other.
  • the X, Y, and Z directions shown in the figures below are also orthogonal to each other.
  • the direction including the X direction and the ⁇ X direction, which is the opposite direction to the X direction will also be referred to as the "X-axis direction.”
  • a direction including the Y direction and the -Y direction, which is the opposite direction to the Y direction is also referred to as the "Y-axis direction.”
  • a direction including the Z direction and the -Z direction, which is the opposite direction to the Z direction is also referred to as the "Z-axis direction.”
  • the test device includes a pair of support stands 3, a load application section 1, a sensor 6, a fixing jig 8, an elastic member 7 as a pressing member, an amplifier 9, and a measurement section 10. It is equipped with
  • the pair of support stands 3 are cylindrical columns extending in the Y-axis direction so as to be able to support both ends (ends in the X-axis direction) of the mounting surface of the printed wiring board 4 arranged parallel to the XY plane. It is composed of members. At the center of the mounting surface of the printed wiring board 4, an electronic component 5, which is an object to be measured, is mounted.
  • the load application unit 1 is arranged on the side of the printed wiring board 4 opposite to the mounting surface, that is, above the printed wiring board 4 (in the Z direction).
  • the load applying section 1 is provided with a pusher jig 2 that protrudes downward (-Z direction).
  • the pusher jig 2 applies a load to the electronic component 5 via the printed wiring board 4 by descending together with the load applying section 1 .
  • the sensor 6 is arranged around the electronic component 5 on the mounting surface of the printed wiring board 4.
  • the sensor 6 is an AE sensor that detects vibrations caused by destruction of the electronic component 5 and outputs a voltage signal in accordance with the vibrations.
  • the elastic member 7 is an elastic member such as a leaf spring, coil spring, rubber, or sponge, and is used at the lower end of the sensor 6 to press the sensor 6 against the printed wiring board 4. (the end in the -Z direction).
  • Fixing jig 8 is a jig for fixing sensor 6 to printed wiring board 4 .
  • the fixing jig 8 is formed into a rectangular frame shape when viewed from the X direction so that the sensor 6 can be pressed against the printed wiring board 4 via the elastic member 7.
  • the amplifier 9 amplifies the voltage signal output from the sensor 6 and outputs it to the measurement section 10.
  • the measuring unit 10 is a voltage waveform measuring device for measuring the waveform of the amplified voltage signal. Note that although the amplifier 9 is not an essential component and can be omitted, it is more preferable for the test apparatus to include the amplifier 9.
  • the mounting position of the elastic member 7 does not have to be below the sensor 6 (in the ⁇ Z direction), and may be any mounting position where the sensor 6 is pressed against the printed wiring board 4.
  • the mounting position of the elastic member 7 may be between the fixing jig 8 and the printed wiring board 4 on the surface opposite to the mounting surface of the printed wiring board 4.
  • the printed wiring board 4 is placed on the pair of support stands 3 so that the electronic component 5 is located on the lower side (-Z direction). At this time, the electronic component 5 is oriented so as not to come into direct contact with the pusher jig 2.
  • the load applying section 1 is lowered together with the pusher jig 2, and the pusher jig 2 is brought into contact with the surface of the printed wiring board 4 opposite to the mounting surface.
  • the position of the pusher jig 2 when the pusher jig 2 contacts the printed wiring board 4 is defined as the reference position.
  • the load applying section 1 is further lowered together with the pusher jig 2, and a further load is applied from the reference position.
  • the printed wiring board 4 bends due to the load, and when further load is applied, the electronic component 5 is destroyed, and vibrations due to the destruction are emitted from the electronic component 5. This vibration propagates to the sensor 6 via the printed wiring board 4. Vibration caused by destruction of the electronic component 5 is detected by the sensor 6, converted into a voltage signal corresponding to the vibration, and output.
  • the signals input to the measurement unit 10 include, in addition to signals caused by the destruction of the electronic component 5, noise signals from the load application unit 1 and peripheral equipment, and noise output from the sensor 6 due to vibrations generated in the surrounding area. Contains signals.
  • a threshold is set to the voltage value between the voltage amplitude value of the noise signal and the voltage amplitude value of the voltage signal corresponding to vibration caused by destruction of the electronic component 5. do.
  • a printed wiring board bending resistance test is performed with the electronic component 5 mounted on the printed wiring board, the sensor 6 detects vibrations caused by destruction of the electronic component 5, and the measurement unit 10 measures the amplitude value of the voltage signal. . Further, a printed wiring board bending resistance test is performed with no electronic component 5 mounted on the printed wiring board 4, and the amplitude value of the voltage signal is measured by the measurement unit 10. A voltage signal measured without electronic component 5 mounted on printed wiring board 4 is a noise signal.
  • a threshold value is determined at a voltage value between the voltage amplitude value of the voltage signal caused by the destruction of the electronic component 5 and the voltage amplitude value of the noise signal.
  • the threshold value is determined in consideration of the amplification amount.
  • the threshold value determined in this way is set in the measurement unit 10, and while applying a load to the printed wiring board 4 by the load application unit 1 via the pusher jig 2, the voltage output from the sensor 6 is measured by the measurement unit 10. Measure the signal.
  • the electronic component 5 If a load is continued to be applied to the printed wiring board 4, the electronic component 5 will be destroyed.
  • the sensor 6 detects the vibration when the electronic component 5 is destroyed, and when the waveform of the voltage signal measured by the measurement unit 10 exceeds the threshold, the pushing dimension of the pusher jig 2 from the reference position is determined by the electronic component 5.
  • the push-in dimension of the pusher jig 2 from the reference position may be measured with the operation of the load application section 1 stopped by a trigger signal, or with the downward speed of the load application section 1 constant and It may be calculated based on the time required from the time at the position to the detection time of the trigger signal. Furthermore, the pushing dimension of the pusher jig 2 from the reference position may be measured using a laser displacement meter or the like.
  • the senor 6 may be fixed to either the mounting surface of the printed wiring board 4 or the surface opposite thereto, but it may be fixed to the same side of the printed wiring board 4 as the electronic component 5. desirable.
  • the vibration caused by the destruction of the electronic component 5 contains a lot of energy that propagates through the mounting surface of the printed wiring board 4, so the amplitude of the voltage signal output from the sensor 6 increases, and the vibration caused by the destruction of the electronic component 5 contains a large amount of energy that propagates through the mounting surface of the printed wiring board 4. The reason for this is that the detection sensitivity of vibrations caused by vibrations is improved.
  • the detection sensitivity of vibrations caused by destruction of the electronic component 5 is improved.
  • the voltage signal corresponding to the vibration caused by the destruction of the electronic component 5 becomes larger than the noise signal, and the amplitude voltage value of the voltage signal corresponding to the destruction of the electronic component 5 and the amplitude voltage value of the noise signal become different. The difference becomes larger.
  • the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage value of the noise signal, and the rate of false detection of vibrations due to destruction of the electronic component 5 is reduced.
  • a couplant 11 such as vaseline or grease to the contact surface between the sensor 6 and the printed wiring board 4.
  • FIG. 4 is a schematic diagram showing a state in which the vibrator 13 and the sensor 6 are fixed on the printed wiring board 4 included in the test apparatus according to the first embodiment.
  • FIG. 5 is a diagram showing the relationship between the pressing force of the sensor 6 against the printed wiring board 4 and the output voltage of the sensor 6.
  • FIG. 4 shows a vibrator 13 in FIG. 4, before conducting the printed wiring board bending resistance test, a vibrator 13 is fixed around the sensor 6 on the mounting surface of the printed wiring board 4 without any electronic components 5 mounted thereon. .
  • a signal generator 14 is connected to the vibrator 13 . Vibration with a constant amplitude is applied to the printed wiring board 4 from the vibrator 13.
  • FIG. 5 shows a voltage signal output from the sensor 6 when the pressing force of the sensor 6 against the printed wiring board 4 is changed.
  • the amplitude of the voltage signal output from the sensor 6 becomes smaller from around 0.4 kg/cm 2 . Therefore, by setting the pressing force of the sensor 6 against the printed wiring board 4 to be at least a certain pressure, specifically at least 0.4 kg/cm 2 , the voltage signal output from the sensor 6 will increase. The amplitude difference with the noise signal increases. When the amplitude difference becomes large, the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage value of the noise signal, and the rate of false detection of vibrations due to destruction of the electronic component 5 decreases. As a result, it can be expected that the accuracy of measuring vibrations caused by destruction of the electronic component 5 will be improved.
  • FIG. 6 is a schematic diagram showing the distance between the sensor 6 and the vibrator 13. As shown in FIG. 6, it is desirable that the distance from the sensor 6 to the vibrator 13 is a certain distance or less.
  • the vibrator 13 is bonded and fixed to the mounting surface of the printed wiring board 4 at the position where the electronic component 5 is mounted.
  • the sensor 6 is fixed by the fixing jig 8 and the elastic member 7.
  • a signal having a constant vibration width is input from the signal generator 14 to the vibrator 13, the printed wiring board 4 is vibrated.
  • FIG. 7 is a diagram showing the relationship between the distance between the vibrator 13 and the sensor 6 and the output voltage of the sensor 6 when a constant vibration is applied to the printed wiring board 4 by the vibrator 13. As shown in FIG. 7, it can be seen that as the distance between the sensor 6 and the vibrator 13 increases, the voltage value output from the sensor 6 decreases.
  • the sensor 6 can cope with the vibration caused by the destruction of the electronic component 5.
  • the output voltage is large and the sensitivity is high.
  • the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage of the noise signal, which has the effect of reducing the false detection rate of vibrations caused by destruction of the electronic component 5 and improving measurement accuracy. You can expect it.
  • the test apparatus includes a support base 3 that supports both ends of the mounting surface of the printed wiring board 4 on which the electronic component 5 is mounted, and a mounting surface of the printed wiring board 4 that is opposite to the supporting base 3.
  • the test device further includes an amplifier 9 that amplifies the voltage signal output from the sensor 6.
  • the measuring section 10 measures the waveform of the voltage signal amplified by the amplifier 9.
  • the pusher jig 2 applies a load to the electronic component 5 via the printed wiring board 4, so that the electronic component 5 is mounted.
  • Printed wiring board 4 can be bent. Further, since the sensor 6 is fixed to the printed wiring board 4 by the fixing jig 8 and pressed against the printed wiring board 4 by the pressing member, the sensor 6 can be stably attached to the printed wiring board 4.
  • the work time required for attaching and removing the sensor 6 can be shortened.
  • the pressing member includes the elastic member 7, by employing the elastic member 7 whose elastic modulus is known, the reproducibility of attaching the sensor 6 is increased. By changing the elastic coefficient of the elastic member 7, it is possible to easily obtain an appropriate pressing force against the sensor 6. As a result, the sensor 6 can be attached stably with good reproducibility.
  • the pressing force for pressing the sensor 6 against the printed wiring board 4 is 0.4 kg/cm 2 or more, the limit value of the electronic component 5 in the printed wiring board bending resistance test can be detected with high sensitivity.
  • the limit value of the electronic component 5 in the printed wiring board bending resistance test can be detected with high sensitivity.
  • FIG. 8 is a schematic diagram of a test device according to the second embodiment.
  • FIG. 9 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the second embodiment, viewed from the X direction. Note that, in the second embodiment, the same components as those described in the first embodiment are given the same reference numerals, and a description thereof will be omitted.
  • a screw 12 is provided as a pressing member. Specifically, in order to fix the sensor 6 to the printed wiring board 4, a fixing jig 8 and screws 12 are provided.
  • the senor 6 is pressed against the printed wiring board 4 by the screw 12 from the mounting surface side of the printed wiring board 4, but the screw 12 is pressed from the side opposite to the mounting surface of the printed wiring board 4 via the fixing jig 8.
  • the printed wiring board 4 may also be pressed by.
  • a bolt may be used instead of the screw 12.
  • the pressing member includes the bolt or screw 12
  • the sensor 6 can be fixed with a stable pressing force without using the elastic member 7.
  • the necessary pressing force of the sensor 6 against the printed wiring board 4 can be easily adjusted, so that an appropriate pressing force against the sensor 6 can be easily obtained. becomes possible.
  • vibrations caused by destruction of the electronic component 5 can be detected with high sensitivity, and the effect of lowering the false detection rate can be obtained.
  • the elastic modulus of the elastic member 7 needs to be known in order to ensure the desired pressing force, but the elastic modulus may change over time. Therefore, the surface pressure of the sensor 6 changes over time. Therefore, in order to obtain a stable pressing force, it is necessary to constantly manage the elastic modulus of the elastic member 7, but when the screw 12 is used, the effect that managing the elastic modulus of the elastic member 7 is not necessary can be expected. Furthermore, compared to the method of bonding the sensor 6 to the printed wiring board 4, the working time required for attaching and removing the sensor 6 can be shortened.
  • FIG. 10 is a schematic diagram of a test device according to Embodiment 3.
  • the same components as those explained in the first and second embodiments are designated by the same reference numerals, and the explanation thereof will be omitted.
  • a band rejection filter 15 is provided between the sensor 6 and the measurement unit 10 to attenuate the voltage signal in a specific frequency band. It is being Note that in addition to the configuration of the second embodiment, a band rejection filter 15 may be provided.
  • the output signal of the sensor 6 includes, in addition to signals caused by the destruction of the electronic component 5, noise signals from the load application unit 1 and peripheral devices, and vibrations generated in the surrounding area. Contains noise signals.
  • the signal caused by the vibration caused by the destruction of the electronic component 5 should be detected, but if the noise signal is mistakenly detected as the vibration caused by the destruction of the electronic component 5, the electronic There may be cases where it is erroneously determined that the limit value of the component 5 is different from the original limit value. Therefore, by arranging the band-rejection filter 15 between the sensor 6 and the measurement unit 10, it is possible to suppress erroneous detection of a noise signal as vibration caused by destruction of the electronic component 5.
  • the electronic component 5 is a ceramic multilayer capacitor and the sensor 6 detects vibration at the time of destruction, a signal is detected in a wide frequency range. Even if a voltage signal in a specific frequency band is attenuated by the band-removal filter 15, voltage signals in other frequency bands pass through the band-removal filter 15 without being substantially attenuated.
  • the frequency of the noise signal is 400 kHz
  • the band rejection filter 15 that attenuates the frequency around 400 kHz is selected.
  • the frequency of the vibration caused by the destruction of the electronic component 5 is between 100 kHz and 600 kHz
  • the 400 kHz voltage signal caused by the vibration caused by the destruction of the electronic component 5 is attenuated together with the 400 kHz noise signal.
  • FIG. 11 shows the output signal waveform detected by the sensor 6 regarding vibrations caused by destruction when the ceramic multilayer capacitor reaches its limit value.
  • FIG. 12 shows a histogram for each frequency included in vibrations caused by destruction when a ceramic multilayer capacitor reaches its limit value.
  • the test device further includes a band-rejection filter 15 disposed between the sensor 6 and the measuring section 10. Therefore, the band-rejection filter 15 can attenuate the noise signal to below the threshold set in the measuring section 10. As a result, it is expected that the rate of false detection of the limit value of the electronic component 5 due to noise signals will be reduced, and the detection accuracy will be improved.
  • FIG. 13 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the fourth embodiment, viewed from the -Y direction.
  • FIGS. 14(a) and 14(b) are enlarged views showing a portion 8a facing the pusher jig 2 of the outer peripheral surface of the fixing jig 8 included in the testing apparatus according to the fourth embodiment.
  • the same components as those described in Embodiments 1 to 3 are given the same reference numerals, and the explanation thereof will be omitted.
  • the shape of the outer peripheral surface of the fixing jig 8 is different from the configuration of the first embodiment.
  • the fixing jig 8 will be explained below.
  • the fixing jig 8 is formed in a rectangular frame shape surrounding the printed wiring board 4 and the elastic member 7 as a pressing member when viewed from the X direction.
  • the pressing member includes the elastic member 7, but the pressing member may include a screw 12 or a bolt.
  • the inner circumferential surface of the fixing jig 8 is in contact with the surface of the printed wiring board 4 on the opposite side to the mounting surface and the portion of the elastic member 7 on the side opposite to the printed wiring board 4.
  • a portion 8a of the outer peripheral surface of the fixing jig 8 that faces the pusher jig 2 is formed in an arc shape.
  • the fixing jig 8 In order to improve the vibration detection sensitivity, it is necessary to fix the sensor 6 around the electronic component 5, and as the fixing jig 8 approaches the electronic component 5, the fixing jig 8 comes into contact with the pusher jig 2. . If they come into contact, the pusher jig 2 and the fixing jig 8 will rub against each other during the bending test, causing vibration. This vibration generates noise, which increases the false detection rate.
  • the portion 8a of the outer circumferential surface of the fixing jig 8 that faces the pusher jig 2 is formed in an arc shape, but the shape is not limited to this. Any shape that avoids contact is fine.
  • a portion 8a of the outer peripheral surface of the fixing jig 8 that faces the pusher jig 2 may be formed in an inclined shape.
  • the fixing jig 8 is formed in a frame shape surrounding the printed wiring board 4 and the pressing member, and the inner peripheral surface of the fixing jig 8 is A portion 8a of the outer circumferential surface of the fixing jig 8 that faces the pusher jig 2 is in contact with the surface opposite to the mounting surface in 4 and the portion of the pressing member opposite to the printed wiring board 4. , is formed in an arcuate or slanted shape.
  • the sensor 6 even closer to the electronic component 5 than in the first embodiment. As a result, it becomes possible to detect vibrations caused by destruction of the electronic component 5 with even higher sensitivity, resulting in the effect that the false detection rate is further reduced.
  • FIG. 15 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the fifth embodiment, viewed from the X direction.
  • 16(a) and 16(b) are enlarged views showing a portion 8b of the inner circumferential surface of the fixing jig 8 included in the test apparatus according to the fifth embodiment, which contacts the printed wiring board 4.
  • 16(c) and (d) show a portion 8b of the inner circumferential surface of the fixture 8 provided in the test apparatus according to the fifth embodiment, which contacts the printed wiring board 4, and a portion 8b of the outer circumferential surface of the fixture 8. It is an enlarged view showing a portion 8a facing the pusher jig 2.
  • the same components as those explained in Embodiments 1 to 4 are given the same reference numerals, and the explanation thereof will be omitted.
  • the shape of the inner circumferential surface of the fixing jig 8 is different from that in the fourth embodiment.
  • the portion 8b that contacts the printed wiring board 4 is formed in an arc shape.
  • the printed wiring board 4 When a load is continued to be applied to the printed wiring board 4 by the pusher jig 2, the printed wiring board 4 is deformed into an arc shape (see FIG. 13), and tensile stress is applied to the electronic component 5. As the deformation of the printed wiring board 4 increases, the stress on the electronic component 5 also increases, eventually reaching a limit value and causing the electronic component 5 to break. Therefore, the limit value of the electronic component 5 influences the shape in which the printed wiring board 4 deforms. Ideally, it is desirable that the printed wiring board 4 is deformed into the same shape as it would be without the fixing jig 8 attached. The smaller the area of the portion 8b of the fixing jig 8 that contacts the printed wiring board 4, the smaller the influence on the deformed shape of the printed wiring board 4. As a result, there is no difference in the magnitude of the tensile stress acting on the electronic component 5 between when the fixing jig 8 is attached to the printed wiring board 4 and when it is not attached, making it possible to perform highly accurate testing.
  • the portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the printed wiring board 4 is formed in an arc shape, but the printed wiring in the fixing jig 8 is not limited to this. Any shape is sufficient as long as the area of the portion 8b in contact with the plate 4 is small.
  • a portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the printed wiring board 4 may be formed in an inclined shape.
  • the shape of the inner circumferential surface of the fixing jig 8 of the fifth embodiment and the shape of the outer circumferential surface of the fixing jig 8 of the fourth embodiment can be combined. is also possible.
  • the fixing jig 8 is formed in a frame shape surrounding the printed wiring board 4 and the pressing member, and the inner peripheral surface of the fixing jig 8 is A portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the surface opposite to the mounting surface of the fixing jig 8 and a portion of the pressing member opposite to the printed wiring board 4 is , is formed in an arcuate or slanted shape.
  • FIG. 17 is a schematic diagram of the positioning jig 16 according to the sixth embodiment viewed from the Z direction.
  • FIG. 18 is a schematic diagram of the positioning jig 16 according to the sixth embodiment viewed from the -Y direction.
  • FIG. 19 is a schematic diagram of a state in which the sensor 6 is attached using the positioning jig 16 according to the sixth embodiment, viewed from the Z direction.
  • FIG. 20 is a schematic diagram of a state in which the sensor 6 is attached using the positioning jig 16 according to the sixth embodiment, viewed from the -Y direction.
  • the same components as those explained in the first to fifth embodiments are designated by the same reference numerals, and the explanation thereof will be omitted.
  • a positioning jig 16 is used to position the sensor 6.
  • the positioning jig 16 includes a plate-shaped base 16a, two guide pins 17, two fixing plungers 18, a sensor positioning plate 19, and a micrometer head 20. It is equipped with
  • the base 16a is formed into a rectangular shape when viewed from the Z direction. A portion of the base 16a closer to the ⁇ X direction than the central portion in the X-axis direction is provided with a base for preventing the fixing jig 8 and the positioning jig 16 from coming into contact with each other when the fixing jig 8 is set in the positioning jig 16. - A recess 21 recessed in the Z direction is provided.
  • the two guide pins 17 are provided on both sides of the base 16a in the X-axis direction with the recess 21 in between, and position the printed wiring board 4 in the Y-axis direction.
  • the two fixing plungers 18 are provided at positions facing the two guide pins 17 on the base 16a, respectively, and press the printed wiring board 4 against the two guide pins 17.
  • the sensor positioning plate 19 is provided at the periphery of the recess 21 in the base 16a in the X direction, and has a semicircular notch 19a that matches the cross-sectional size of the sensor 6 in order to position the sensor 6.
  • the micrometer head 20 is provided at the end of the main body 6a in the X direction, and positions the printed wiring board 4 in the X direction.
  • the fixing jig 8 is placed in the recess 21 of the positioning jig 16. Thereafter, the printed wiring board 4 on which the electronic component 5 is mounted is placed through an opening formed on the inner circumferential side of the fixing jig 8 on the positioning jig 16. At this time, the recess 21 has a structure that allows the printed wiring board 4 and the fixing jig 8 to be placed horizontally (parallel to the XY plane) with respect to the base 16a of the positioning jig 16 without coming into contact with each other. There is.
  • the position of the printed wiring board 4 in the Y-axis direction is determined along the guide pin 17 of the positioning jig 16 and the fixing plunger 18.
  • Position adjustment in the X-axis direction is performed by moving the printed wiring board 4 until it hits the micrometer head 20.
  • the position of the micrometer head 20 on the positioning jig 16 is adjusted in advance to a position where the distance between the electronic component 5 and the sensor 6 is a desired distance.
  • the sensor 6 is pressed against the semicircular notch 19a of the sensor positioning plate 19 to determine the position of the sensor 6, and the elastic member 7 fixes the sensor 6.
  • the printed wiring board 4 is moved in the -X direction and removed from the positioning jig 16, thereby completing the positioning and fixing of the sensor 6.
  • the sensor 6 As shown in FIG. 7, as the distance between the sensor 6 and the vibrator 13 increases, the voltage value output from the sensor 6 decreases. Therefore, the sensor 6 is fixed so that the distance between the sensor 6 and the electronic component 5 is 5 mm or less. However, if the sensor 6 is brought close to the electronic component 5, the fixing jig 8 will come into contact with the pusher jig 2 during the bending test.
  • the electronic component 5 is mounted on the mounting surface of the printed wiring board 4, and the sensor 6 is mounted around the electronic component 5 on the mounting surface of the printed wiring board 4 using a fixing jig.
  • a positioning jig 16 is used to position the sensor 6 on the printed wiring board 4.
  • Pusher jig 3. Support stand, 4. Printed wiring board, 5. Electronic components, 6. Sensor, 7. Elastic member, 8. Fixing jig, 9. Amplifier, 10. Measuring section, 12. Screw, 15. Band rejection filter, 16. Positioning jig. .

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Le but de la présente invention est de fournir une fonctionnalité dans laquelle, dans un test des propriétés de flexion d'une carte de circuit imprimé sur laquelle un composant électronique est monté, il est possible de détecter avec une grande précision une vibration provoquée par une panne du composant électronique. Un dispositif de test comprend : une base de support (3) permettant de supporter les deux extrémités d'une surface de montage d'une carte de circuit imprimé (4) sur laquelle un composant électronique (5) est monté ; un gabarit de piston (2) disposé sur la surface de la carte de circuit imprimé (4) sur le côté opposé à la surface de montage, le gabarit de piston (2) appliquant une charge au composant électronique (5) par l'intermédiaire de la carte de circuit imprimé (4) ; un capteur (6) disposé autour du composant électronique (5) sur la surface de montage de la carte de circuit imprimé (4), le capteur (6) détectant une vibration provoquée par la rupture du composant électronique (5) et émettant un signal de tension qui correspond à la vibration ; un gabarit de fixation (8) permettant de fixer le capteur (6) à la carte de circuit imprimé (4) ; un élément de pression permettant de presser le capteur (6) contre la carte de circuit imprimé (4) ; et une unité de mesure (10) permettant de mesurer la forme d'onde du signal de tension émis par le capteur (6).
PCT/JP2023/007017 2022-03-24 2023-02-27 Dispositif de test et procédé de test WO2023181791A1 (fr)

Priority Applications (1)

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TW112110216A TW202400981A (zh) 2022-03-24 2023-03-20 測試裝置以及測試方法

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JP2022-047731 2022-03-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117782848A (zh) * 2024-02-23 2024-03-29 梨树全创科技有限公司 一种线路板弯曲性能测试装置及其测试方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03146843A (ja) * 1989-10-31 1991-06-21 Murata Mfg Co Ltd 電子部品の衝撃破壊試験方法
JPH11230878A (ja) * 1998-02-10 1999-08-27 Sumitomo Electric Ind Ltd 表面実装部品の耐基板曲げ性試験方法及び装置
JP2020041885A (ja) * 2018-09-10 2020-03-19 株式会社ディスコ チップ破壊ユニット、チップの強度の比較方法
JP2021025786A (ja) * 2019-07-31 2021-02-22 株式会社村田製作所 表面実装部品の耐プリント板曲げ性試験方法、及び、表面実装部品の耐プリント板曲げ性試験装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03146843A (ja) * 1989-10-31 1991-06-21 Murata Mfg Co Ltd 電子部品の衝撃破壊試験方法
JPH11230878A (ja) * 1998-02-10 1999-08-27 Sumitomo Electric Ind Ltd 表面実装部品の耐基板曲げ性試験方法及び装置
JP2020041885A (ja) * 2018-09-10 2020-03-19 株式会社ディスコ チップ破壊ユニット、チップの強度の比較方法
JP2021025786A (ja) * 2019-07-31 2021-02-22 株式会社村田製作所 表面実装部品の耐プリント板曲げ性試験方法、及び、表面実装部品の耐プリント板曲げ性試験装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117782848A (zh) * 2024-02-23 2024-03-29 梨树全创科技有限公司 一种线路板弯曲性能测试装置及其测试方法
CN117782848B (zh) * 2024-02-23 2024-05-14 梨树全创科技有限公司 一种线路板弯曲性能测试装置及其测试方法

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