WO2023181791A1 - Testing device and testing method - Google Patents

Testing device and testing method Download PDF

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Publication number
WO2023181791A1
WO2023181791A1 PCT/JP2023/007017 JP2023007017W WO2023181791A1 WO 2023181791 A1 WO2023181791 A1 WO 2023181791A1 JP 2023007017 W JP2023007017 W JP 2023007017W WO 2023181791 A1 WO2023181791 A1 WO 2023181791A1
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WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
sensor
electronic component
jig
Prior art date
Application number
PCT/JP2023/007017
Other languages
French (fr)
Japanese (ja)
Inventor
陽介 金川
大樹 山上
裕之 石川
和幸 須藤
浩平 中西
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to TW112110216A priority Critical patent/TW202400981A/en
Publication of WO2023181791A1 publication Critical patent/WO2023181791A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces

Definitions

  • the present disclosure relates to a test device and a test method.
  • Non-Patent Document 1 stipulates a test method in which electronic components are mounted on a printed wiring board for testing. In this test method, judgment is made based on the performance and appearance abnormalities of electronic components after bending a printed wiring board to a specified dimension.
  • limit value the bending dimension at which the electronic component broke is not known. In order to know the limit value, it is not necessary to bend the printed wiring board to a certain dimension, but rather to bend the printed wiring board until the electronic components break, such as cracking, and to know the bending dimension at that time.
  • Patent Document 1 describes that in an apparatus for measuring the bending strength of a single object to be measured such as an electronic component, an acoustic emission sensor (hereinafter referred to as "AE It is disclosed that an AE sensor is provided to detect vibrations caused by destruction of the object to be measured.
  • AE acoustic emission sensor
  • Patent Document 1 does not assume that the printed wiring board on which the object to be measured is mounted is bent, and does not have a structure for placing the printed wiring board on a stage and bending it.
  • an object of the present disclosure is to provide a technology that can detect vibrations caused by destruction of electronic components with high accuracy in a bendability test of a printed wiring board on which electronic components are mounted.
  • a test device includes a support base that supports both ends of a mounting surface of a printed wiring board on which electronic components are mounted, and a support base that is disposed on a side of the printed wiring board opposite to the mounting surface, and , a pusher jig that applies a load to the electronic component via the printed wiring board, and a pusher jig that is disposed around the electronic component on the mounting surface of the printed wiring board, and that is caused by destruction of the electronic component.
  • a sensor that detects vibration caused by the sensor and outputs a voltage signal according to the vibration; a fixing jig that fixes the sensor to the printed wiring board; a pressing member that presses the sensor against the printed wiring board; and a measuring section for measuring the waveform of the output voltage signal.
  • the pusher jig since the support base supports both ends of the mounting surface of the printed wiring board, the pusher jig applies a load to the electronic component via the printed wiring board, so that the electronic component is mounted.
  • Printed wiring boards can be bent. Further, since the sensor is fixed to the printed wiring board by the fixing jig and pressed against the printed wiring board by the pressing member, it is possible to stably attach the sensor to the printed wiring board.
  • vibrations caused by destruction of electronic components can be detected with high accuracy in a bendability test of a printed wiring board on which electronic components are mounted.
  • FIG. 1 is a schematic diagram of a test device according to Embodiment 1.
  • FIG. FIG. 3 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 1, viewed from the -Y direction.
  • FIG. 3 is a schematic diagram of the mounting location of a sensor included in the test device according to the first embodiment, viewed from the X direction.
  • FIG. 2 is a schematic diagram showing a state in which a vibrator and a sensor are fixed on a printed wiring board included in the test device according to the first embodiment.
  • FIG. 3 is a diagram showing the relationship between the pressing force of a sensor against a printed wiring board and the output voltage of the sensor.
  • FIG. 3 is a schematic diagram showing the distance between a sensor and an exciter.
  • FIG. 7 is a diagram showing the relationship between the distance between the vibrator and the sensor and the output voltage of the sensor when a constant vibration is applied to the printed wiring board by the vibrator.
  • FIG. 2 is a schematic diagram of a test device according to a second embodiment.
  • FIG. 7 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 2, viewed from the X direction.
  • FIG. 3 is a schematic diagram of a test device according to Embodiment 3.
  • FIG. 6 is a diagram showing an output signal waveform detected by a sensor regarding vibration caused by destruction when a ceramic multilayer capacitor reaches a limit value.
  • FIG. 6 is a diagram showing a histogram for each frequency included in vibrations caused by destruction when a ceramic multilayer capacitor reaches a limit value.
  • FIG. 7 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 4, viewed from the -Y direction.
  • FIG. 12 is an enlarged view showing a portion of the outer circumferential surface of a fixing jig included in the test apparatus according to Embodiment 4, which faces a pusher jig.
  • FIG. 12 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 5, viewed from the X direction.
  • FIG. 7 is an enlarged view showing a portion of the inner circumferential surface of the fixing jig included in the test apparatus according to Embodiment 5 that contacts the printed wiring board, and a portion of the outer circumferential surface of the fixing jig that faces the pusher jig. .
  • FIG. 7 is a schematic diagram of a positioning jig according to a sixth embodiment, viewed from the Z direction.
  • FIG. 7 is a schematic diagram of a positioning jig according to a sixth embodiment, viewed from the -Y direction.
  • FIG. 12 is a schematic diagram of a state in which a sensor is attached using a positioning jig according to a sixth embodiment, viewed from the Z direction.
  • FIG. 12 is a schematic diagram of a state in which a sensor is attached using a positioning jig according to a sixth embodiment, viewed from the -Y direction.
  • FIG. 1 is a schematic diagram of a test apparatus according to Embodiment 1.
  • FIG. 2 is a schematic diagram of the mounting location of the sensor 6 included in the test apparatus according to the first embodiment, viewed from the -Y direction.
  • FIG. 3 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the first embodiment, viewed from the X direction.
  • the X direction, Y direction, and Z direction are orthogonal to each other.
  • the X, Y, and Z directions shown in the figures below are also orthogonal to each other.
  • the direction including the X direction and the ⁇ X direction, which is the opposite direction to the X direction will also be referred to as the "X-axis direction.”
  • a direction including the Y direction and the -Y direction, which is the opposite direction to the Y direction is also referred to as the "Y-axis direction.”
  • a direction including the Z direction and the -Z direction, which is the opposite direction to the Z direction is also referred to as the "Z-axis direction.”
  • the test device includes a pair of support stands 3, a load application section 1, a sensor 6, a fixing jig 8, an elastic member 7 as a pressing member, an amplifier 9, and a measurement section 10. It is equipped with
  • the pair of support stands 3 are cylindrical columns extending in the Y-axis direction so as to be able to support both ends (ends in the X-axis direction) of the mounting surface of the printed wiring board 4 arranged parallel to the XY plane. It is composed of members. At the center of the mounting surface of the printed wiring board 4, an electronic component 5, which is an object to be measured, is mounted.
  • the load application unit 1 is arranged on the side of the printed wiring board 4 opposite to the mounting surface, that is, above the printed wiring board 4 (in the Z direction).
  • the load applying section 1 is provided with a pusher jig 2 that protrudes downward (-Z direction).
  • the pusher jig 2 applies a load to the electronic component 5 via the printed wiring board 4 by descending together with the load applying section 1 .
  • the sensor 6 is arranged around the electronic component 5 on the mounting surface of the printed wiring board 4.
  • the sensor 6 is an AE sensor that detects vibrations caused by destruction of the electronic component 5 and outputs a voltage signal in accordance with the vibrations.
  • the elastic member 7 is an elastic member such as a leaf spring, coil spring, rubber, or sponge, and is used at the lower end of the sensor 6 to press the sensor 6 against the printed wiring board 4. (the end in the -Z direction).
  • Fixing jig 8 is a jig for fixing sensor 6 to printed wiring board 4 .
  • the fixing jig 8 is formed into a rectangular frame shape when viewed from the X direction so that the sensor 6 can be pressed against the printed wiring board 4 via the elastic member 7.
  • the amplifier 9 amplifies the voltage signal output from the sensor 6 and outputs it to the measurement section 10.
  • the measuring unit 10 is a voltage waveform measuring device for measuring the waveform of the amplified voltage signal. Note that although the amplifier 9 is not an essential component and can be omitted, it is more preferable for the test apparatus to include the amplifier 9.
  • the mounting position of the elastic member 7 does not have to be below the sensor 6 (in the ⁇ Z direction), and may be any mounting position where the sensor 6 is pressed against the printed wiring board 4.
  • the mounting position of the elastic member 7 may be between the fixing jig 8 and the printed wiring board 4 on the surface opposite to the mounting surface of the printed wiring board 4.
  • the printed wiring board 4 is placed on the pair of support stands 3 so that the electronic component 5 is located on the lower side (-Z direction). At this time, the electronic component 5 is oriented so as not to come into direct contact with the pusher jig 2.
  • the load applying section 1 is lowered together with the pusher jig 2, and the pusher jig 2 is brought into contact with the surface of the printed wiring board 4 opposite to the mounting surface.
  • the position of the pusher jig 2 when the pusher jig 2 contacts the printed wiring board 4 is defined as the reference position.
  • the load applying section 1 is further lowered together with the pusher jig 2, and a further load is applied from the reference position.
  • the printed wiring board 4 bends due to the load, and when further load is applied, the electronic component 5 is destroyed, and vibrations due to the destruction are emitted from the electronic component 5. This vibration propagates to the sensor 6 via the printed wiring board 4. Vibration caused by destruction of the electronic component 5 is detected by the sensor 6, converted into a voltage signal corresponding to the vibration, and output.
  • the signals input to the measurement unit 10 include, in addition to signals caused by the destruction of the electronic component 5, noise signals from the load application unit 1 and peripheral equipment, and noise output from the sensor 6 due to vibrations generated in the surrounding area. Contains signals.
  • a threshold is set to the voltage value between the voltage amplitude value of the noise signal and the voltage amplitude value of the voltage signal corresponding to vibration caused by destruction of the electronic component 5. do.
  • a printed wiring board bending resistance test is performed with the electronic component 5 mounted on the printed wiring board, the sensor 6 detects vibrations caused by destruction of the electronic component 5, and the measurement unit 10 measures the amplitude value of the voltage signal. . Further, a printed wiring board bending resistance test is performed with no electronic component 5 mounted on the printed wiring board 4, and the amplitude value of the voltage signal is measured by the measurement unit 10. A voltage signal measured without electronic component 5 mounted on printed wiring board 4 is a noise signal.
  • a threshold value is determined at a voltage value between the voltage amplitude value of the voltage signal caused by the destruction of the electronic component 5 and the voltage amplitude value of the noise signal.
  • the threshold value is determined in consideration of the amplification amount.
  • the threshold value determined in this way is set in the measurement unit 10, and while applying a load to the printed wiring board 4 by the load application unit 1 via the pusher jig 2, the voltage output from the sensor 6 is measured by the measurement unit 10. Measure the signal.
  • the electronic component 5 If a load is continued to be applied to the printed wiring board 4, the electronic component 5 will be destroyed.
  • the sensor 6 detects the vibration when the electronic component 5 is destroyed, and when the waveform of the voltage signal measured by the measurement unit 10 exceeds the threshold, the pushing dimension of the pusher jig 2 from the reference position is determined by the electronic component 5.
  • the push-in dimension of the pusher jig 2 from the reference position may be measured with the operation of the load application section 1 stopped by a trigger signal, or with the downward speed of the load application section 1 constant and It may be calculated based on the time required from the time at the position to the detection time of the trigger signal. Furthermore, the pushing dimension of the pusher jig 2 from the reference position may be measured using a laser displacement meter or the like.
  • the senor 6 may be fixed to either the mounting surface of the printed wiring board 4 or the surface opposite thereto, but it may be fixed to the same side of the printed wiring board 4 as the electronic component 5. desirable.
  • the vibration caused by the destruction of the electronic component 5 contains a lot of energy that propagates through the mounting surface of the printed wiring board 4, so the amplitude of the voltage signal output from the sensor 6 increases, and the vibration caused by the destruction of the electronic component 5 contains a large amount of energy that propagates through the mounting surface of the printed wiring board 4. The reason for this is that the detection sensitivity of vibrations caused by vibrations is improved.
  • the detection sensitivity of vibrations caused by destruction of the electronic component 5 is improved.
  • the voltage signal corresponding to the vibration caused by the destruction of the electronic component 5 becomes larger than the noise signal, and the amplitude voltage value of the voltage signal corresponding to the destruction of the electronic component 5 and the amplitude voltage value of the noise signal become different. The difference becomes larger.
  • the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage value of the noise signal, and the rate of false detection of vibrations due to destruction of the electronic component 5 is reduced.
  • a couplant 11 such as vaseline or grease to the contact surface between the sensor 6 and the printed wiring board 4.
  • FIG. 4 is a schematic diagram showing a state in which the vibrator 13 and the sensor 6 are fixed on the printed wiring board 4 included in the test apparatus according to the first embodiment.
  • FIG. 5 is a diagram showing the relationship between the pressing force of the sensor 6 against the printed wiring board 4 and the output voltage of the sensor 6.
  • FIG. 4 shows a vibrator 13 in FIG. 4, before conducting the printed wiring board bending resistance test, a vibrator 13 is fixed around the sensor 6 on the mounting surface of the printed wiring board 4 without any electronic components 5 mounted thereon. .
  • a signal generator 14 is connected to the vibrator 13 . Vibration with a constant amplitude is applied to the printed wiring board 4 from the vibrator 13.
  • FIG. 5 shows a voltage signal output from the sensor 6 when the pressing force of the sensor 6 against the printed wiring board 4 is changed.
  • the amplitude of the voltage signal output from the sensor 6 becomes smaller from around 0.4 kg/cm 2 . Therefore, by setting the pressing force of the sensor 6 against the printed wiring board 4 to be at least a certain pressure, specifically at least 0.4 kg/cm 2 , the voltage signal output from the sensor 6 will increase. The amplitude difference with the noise signal increases. When the amplitude difference becomes large, the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage value of the noise signal, and the rate of false detection of vibrations due to destruction of the electronic component 5 decreases. As a result, it can be expected that the accuracy of measuring vibrations caused by destruction of the electronic component 5 will be improved.
  • FIG. 6 is a schematic diagram showing the distance between the sensor 6 and the vibrator 13. As shown in FIG. 6, it is desirable that the distance from the sensor 6 to the vibrator 13 is a certain distance or less.
  • the vibrator 13 is bonded and fixed to the mounting surface of the printed wiring board 4 at the position where the electronic component 5 is mounted.
  • the sensor 6 is fixed by the fixing jig 8 and the elastic member 7.
  • a signal having a constant vibration width is input from the signal generator 14 to the vibrator 13, the printed wiring board 4 is vibrated.
  • FIG. 7 is a diagram showing the relationship between the distance between the vibrator 13 and the sensor 6 and the output voltage of the sensor 6 when a constant vibration is applied to the printed wiring board 4 by the vibrator 13. As shown in FIG. 7, it can be seen that as the distance between the sensor 6 and the vibrator 13 increases, the voltage value output from the sensor 6 decreases.
  • the sensor 6 can cope with the vibration caused by the destruction of the electronic component 5.
  • the output voltage is large and the sensitivity is high.
  • the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage of the noise signal, which has the effect of reducing the false detection rate of vibrations caused by destruction of the electronic component 5 and improving measurement accuracy. You can expect it.
  • the test apparatus includes a support base 3 that supports both ends of the mounting surface of the printed wiring board 4 on which the electronic component 5 is mounted, and a mounting surface of the printed wiring board 4 that is opposite to the supporting base 3.
  • the test device further includes an amplifier 9 that amplifies the voltage signal output from the sensor 6.
  • the measuring section 10 measures the waveform of the voltage signal amplified by the amplifier 9.
  • the pusher jig 2 applies a load to the electronic component 5 via the printed wiring board 4, so that the electronic component 5 is mounted.
  • Printed wiring board 4 can be bent. Further, since the sensor 6 is fixed to the printed wiring board 4 by the fixing jig 8 and pressed against the printed wiring board 4 by the pressing member, the sensor 6 can be stably attached to the printed wiring board 4.
  • the work time required for attaching and removing the sensor 6 can be shortened.
  • the pressing member includes the elastic member 7, by employing the elastic member 7 whose elastic modulus is known, the reproducibility of attaching the sensor 6 is increased. By changing the elastic coefficient of the elastic member 7, it is possible to easily obtain an appropriate pressing force against the sensor 6. As a result, the sensor 6 can be attached stably with good reproducibility.
  • the pressing force for pressing the sensor 6 against the printed wiring board 4 is 0.4 kg/cm 2 or more, the limit value of the electronic component 5 in the printed wiring board bending resistance test can be detected with high sensitivity.
  • the limit value of the electronic component 5 in the printed wiring board bending resistance test can be detected with high sensitivity.
  • FIG. 8 is a schematic diagram of a test device according to the second embodiment.
  • FIG. 9 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the second embodiment, viewed from the X direction. Note that, in the second embodiment, the same components as those described in the first embodiment are given the same reference numerals, and a description thereof will be omitted.
  • a screw 12 is provided as a pressing member. Specifically, in order to fix the sensor 6 to the printed wiring board 4, a fixing jig 8 and screws 12 are provided.
  • the senor 6 is pressed against the printed wiring board 4 by the screw 12 from the mounting surface side of the printed wiring board 4, but the screw 12 is pressed from the side opposite to the mounting surface of the printed wiring board 4 via the fixing jig 8.
  • the printed wiring board 4 may also be pressed by.
  • a bolt may be used instead of the screw 12.
  • the pressing member includes the bolt or screw 12
  • the sensor 6 can be fixed with a stable pressing force without using the elastic member 7.
  • the necessary pressing force of the sensor 6 against the printed wiring board 4 can be easily adjusted, so that an appropriate pressing force against the sensor 6 can be easily obtained. becomes possible.
  • vibrations caused by destruction of the electronic component 5 can be detected with high sensitivity, and the effect of lowering the false detection rate can be obtained.
  • the elastic modulus of the elastic member 7 needs to be known in order to ensure the desired pressing force, but the elastic modulus may change over time. Therefore, the surface pressure of the sensor 6 changes over time. Therefore, in order to obtain a stable pressing force, it is necessary to constantly manage the elastic modulus of the elastic member 7, but when the screw 12 is used, the effect that managing the elastic modulus of the elastic member 7 is not necessary can be expected. Furthermore, compared to the method of bonding the sensor 6 to the printed wiring board 4, the working time required for attaching and removing the sensor 6 can be shortened.
  • FIG. 10 is a schematic diagram of a test device according to Embodiment 3.
  • the same components as those explained in the first and second embodiments are designated by the same reference numerals, and the explanation thereof will be omitted.
  • a band rejection filter 15 is provided between the sensor 6 and the measurement unit 10 to attenuate the voltage signal in a specific frequency band. It is being Note that in addition to the configuration of the second embodiment, a band rejection filter 15 may be provided.
  • the output signal of the sensor 6 includes, in addition to signals caused by the destruction of the electronic component 5, noise signals from the load application unit 1 and peripheral devices, and vibrations generated in the surrounding area. Contains noise signals.
  • the signal caused by the vibration caused by the destruction of the electronic component 5 should be detected, but if the noise signal is mistakenly detected as the vibration caused by the destruction of the electronic component 5, the electronic There may be cases where it is erroneously determined that the limit value of the component 5 is different from the original limit value. Therefore, by arranging the band-rejection filter 15 between the sensor 6 and the measurement unit 10, it is possible to suppress erroneous detection of a noise signal as vibration caused by destruction of the electronic component 5.
  • the electronic component 5 is a ceramic multilayer capacitor and the sensor 6 detects vibration at the time of destruction, a signal is detected in a wide frequency range. Even if a voltage signal in a specific frequency band is attenuated by the band-removal filter 15, voltage signals in other frequency bands pass through the band-removal filter 15 without being substantially attenuated.
  • the frequency of the noise signal is 400 kHz
  • the band rejection filter 15 that attenuates the frequency around 400 kHz is selected.
  • the frequency of the vibration caused by the destruction of the electronic component 5 is between 100 kHz and 600 kHz
  • the 400 kHz voltage signal caused by the vibration caused by the destruction of the electronic component 5 is attenuated together with the 400 kHz noise signal.
  • FIG. 11 shows the output signal waveform detected by the sensor 6 regarding vibrations caused by destruction when the ceramic multilayer capacitor reaches its limit value.
  • FIG. 12 shows a histogram for each frequency included in vibrations caused by destruction when a ceramic multilayer capacitor reaches its limit value.
  • the test device further includes a band-rejection filter 15 disposed between the sensor 6 and the measuring section 10. Therefore, the band-rejection filter 15 can attenuate the noise signal to below the threshold set in the measuring section 10. As a result, it is expected that the rate of false detection of the limit value of the electronic component 5 due to noise signals will be reduced, and the detection accuracy will be improved.
  • FIG. 13 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the fourth embodiment, viewed from the -Y direction.
  • FIGS. 14(a) and 14(b) are enlarged views showing a portion 8a facing the pusher jig 2 of the outer peripheral surface of the fixing jig 8 included in the testing apparatus according to the fourth embodiment.
  • the same components as those described in Embodiments 1 to 3 are given the same reference numerals, and the explanation thereof will be omitted.
  • the shape of the outer peripheral surface of the fixing jig 8 is different from the configuration of the first embodiment.
  • the fixing jig 8 will be explained below.
  • the fixing jig 8 is formed in a rectangular frame shape surrounding the printed wiring board 4 and the elastic member 7 as a pressing member when viewed from the X direction.
  • the pressing member includes the elastic member 7, but the pressing member may include a screw 12 or a bolt.
  • the inner circumferential surface of the fixing jig 8 is in contact with the surface of the printed wiring board 4 on the opposite side to the mounting surface and the portion of the elastic member 7 on the side opposite to the printed wiring board 4.
  • a portion 8a of the outer peripheral surface of the fixing jig 8 that faces the pusher jig 2 is formed in an arc shape.
  • the fixing jig 8 In order to improve the vibration detection sensitivity, it is necessary to fix the sensor 6 around the electronic component 5, and as the fixing jig 8 approaches the electronic component 5, the fixing jig 8 comes into contact with the pusher jig 2. . If they come into contact, the pusher jig 2 and the fixing jig 8 will rub against each other during the bending test, causing vibration. This vibration generates noise, which increases the false detection rate.
  • the portion 8a of the outer circumferential surface of the fixing jig 8 that faces the pusher jig 2 is formed in an arc shape, but the shape is not limited to this. Any shape that avoids contact is fine.
  • a portion 8a of the outer peripheral surface of the fixing jig 8 that faces the pusher jig 2 may be formed in an inclined shape.
  • the fixing jig 8 is formed in a frame shape surrounding the printed wiring board 4 and the pressing member, and the inner peripheral surface of the fixing jig 8 is A portion 8a of the outer circumferential surface of the fixing jig 8 that faces the pusher jig 2 is in contact with the surface opposite to the mounting surface in 4 and the portion of the pressing member opposite to the printed wiring board 4. , is formed in an arcuate or slanted shape.
  • the sensor 6 even closer to the electronic component 5 than in the first embodiment. As a result, it becomes possible to detect vibrations caused by destruction of the electronic component 5 with even higher sensitivity, resulting in the effect that the false detection rate is further reduced.
  • FIG. 15 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the fifth embodiment, viewed from the X direction.
  • 16(a) and 16(b) are enlarged views showing a portion 8b of the inner circumferential surface of the fixing jig 8 included in the test apparatus according to the fifth embodiment, which contacts the printed wiring board 4.
  • 16(c) and (d) show a portion 8b of the inner circumferential surface of the fixture 8 provided in the test apparatus according to the fifth embodiment, which contacts the printed wiring board 4, and a portion 8b of the outer circumferential surface of the fixture 8. It is an enlarged view showing a portion 8a facing the pusher jig 2.
  • the same components as those explained in Embodiments 1 to 4 are given the same reference numerals, and the explanation thereof will be omitted.
  • the shape of the inner circumferential surface of the fixing jig 8 is different from that in the fourth embodiment.
  • the portion 8b that contacts the printed wiring board 4 is formed in an arc shape.
  • the printed wiring board 4 When a load is continued to be applied to the printed wiring board 4 by the pusher jig 2, the printed wiring board 4 is deformed into an arc shape (see FIG. 13), and tensile stress is applied to the electronic component 5. As the deformation of the printed wiring board 4 increases, the stress on the electronic component 5 also increases, eventually reaching a limit value and causing the electronic component 5 to break. Therefore, the limit value of the electronic component 5 influences the shape in which the printed wiring board 4 deforms. Ideally, it is desirable that the printed wiring board 4 is deformed into the same shape as it would be without the fixing jig 8 attached. The smaller the area of the portion 8b of the fixing jig 8 that contacts the printed wiring board 4, the smaller the influence on the deformed shape of the printed wiring board 4. As a result, there is no difference in the magnitude of the tensile stress acting on the electronic component 5 between when the fixing jig 8 is attached to the printed wiring board 4 and when it is not attached, making it possible to perform highly accurate testing.
  • the portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the printed wiring board 4 is formed in an arc shape, but the printed wiring in the fixing jig 8 is not limited to this. Any shape is sufficient as long as the area of the portion 8b in contact with the plate 4 is small.
  • a portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the printed wiring board 4 may be formed in an inclined shape.
  • the shape of the inner circumferential surface of the fixing jig 8 of the fifth embodiment and the shape of the outer circumferential surface of the fixing jig 8 of the fourth embodiment can be combined. is also possible.
  • the fixing jig 8 is formed in a frame shape surrounding the printed wiring board 4 and the pressing member, and the inner peripheral surface of the fixing jig 8 is A portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the surface opposite to the mounting surface of the fixing jig 8 and a portion of the pressing member opposite to the printed wiring board 4 is , is formed in an arcuate or slanted shape.
  • FIG. 17 is a schematic diagram of the positioning jig 16 according to the sixth embodiment viewed from the Z direction.
  • FIG. 18 is a schematic diagram of the positioning jig 16 according to the sixth embodiment viewed from the -Y direction.
  • FIG. 19 is a schematic diagram of a state in which the sensor 6 is attached using the positioning jig 16 according to the sixth embodiment, viewed from the Z direction.
  • FIG. 20 is a schematic diagram of a state in which the sensor 6 is attached using the positioning jig 16 according to the sixth embodiment, viewed from the -Y direction.
  • the same components as those explained in the first to fifth embodiments are designated by the same reference numerals, and the explanation thereof will be omitted.
  • a positioning jig 16 is used to position the sensor 6.
  • the positioning jig 16 includes a plate-shaped base 16a, two guide pins 17, two fixing plungers 18, a sensor positioning plate 19, and a micrometer head 20. It is equipped with
  • the base 16a is formed into a rectangular shape when viewed from the Z direction. A portion of the base 16a closer to the ⁇ X direction than the central portion in the X-axis direction is provided with a base for preventing the fixing jig 8 and the positioning jig 16 from coming into contact with each other when the fixing jig 8 is set in the positioning jig 16. - A recess 21 recessed in the Z direction is provided.
  • the two guide pins 17 are provided on both sides of the base 16a in the X-axis direction with the recess 21 in between, and position the printed wiring board 4 in the Y-axis direction.
  • the two fixing plungers 18 are provided at positions facing the two guide pins 17 on the base 16a, respectively, and press the printed wiring board 4 against the two guide pins 17.
  • the sensor positioning plate 19 is provided at the periphery of the recess 21 in the base 16a in the X direction, and has a semicircular notch 19a that matches the cross-sectional size of the sensor 6 in order to position the sensor 6.
  • the micrometer head 20 is provided at the end of the main body 6a in the X direction, and positions the printed wiring board 4 in the X direction.
  • the fixing jig 8 is placed in the recess 21 of the positioning jig 16. Thereafter, the printed wiring board 4 on which the electronic component 5 is mounted is placed through an opening formed on the inner circumferential side of the fixing jig 8 on the positioning jig 16. At this time, the recess 21 has a structure that allows the printed wiring board 4 and the fixing jig 8 to be placed horizontally (parallel to the XY plane) with respect to the base 16a of the positioning jig 16 without coming into contact with each other. There is.
  • the position of the printed wiring board 4 in the Y-axis direction is determined along the guide pin 17 of the positioning jig 16 and the fixing plunger 18.
  • Position adjustment in the X-axis direction is performed by moving the printed wiring board 4 until it hits the micrometer head 20.
  • the position of the micrometer head 20 on the positioning jig 16 is adjusted in advance to a position where the distance between the electronic component 5 and the sensor 6 is a desired distance.
  • the sensor 6 is pressed against the semicircular notch 19a of the sensor positioning plate 19 to determine the position of the sensor 6, and the elastic member 7 fixes the sensor 6.
  • the printed wiring board 4 is moved in the -X direction and removed from the positioning jig 16, thereby completing the positioning and fixing of the sensor 6.
  • the sensor 6 As shown in FIG. 7, as the distance between the sensor 6 and the vibrator 13 increases, the voltage value output from the sensor 6 decreases. Therefore, the sensor 6 is fixed so that the distance between the sensor 6 and the electronic component 5 is 5 mm or less. However, if the sensor 6 is brought close to the electronic component 5, the fixing jig 8 will come into contact with the pusher jig 2 during the bending test.
  • the electronic component 5 is mounted on the mounting surface of the printed wiring board 4, and the sensor 6 is mounted around the electronic component 5 on the mounting surface of the printed wiring board 4 using a fixing jig.
  • a positioning jig 16 is used to position the sensor 6 on the printed wiring board 4.
  • Pusher jig 3. Support stand, 4. Printed wiring board, 5. Electronic components, 6. Sensor, 7. Elastic member, 8. Fixing jig, 9. Amplifier, 10. Measuring section, 12. Screw, 15. Band rejection filter, 16. Positioning jig. .

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Abstract

The purpose of the present invention is to provide a feature in which, in a test of the bending properties of a printed wiring board on which an electronic component is mounted, it is possible to highly accurately detect vibration caused by breakdown of the electronic component. This testing device comprises: a support base (3) for supporting both ends of a mounting surface of a printed wiring board (4) on which an electronic component (5) is mounted; a plunger jig (2) disposed on the surface of the printed wiring board (4) on the opposite side from the mounting surface, the plunger jig (2) applying a load to the electronic component (5) via the printed circuit board (4); a sensor (6) disposed surrounding the electronic component (5) on the mounting surface of the printed wiring board (4), the sensor (6) detecting vibration caused by breakdown of the electronic component (5) and outputting a voltage signal that corresponds to the vibration; a fixing jig (8) for fixing the sensor (6) to the printed wiring board (4); a pressing member for pressing the sensor (6) against the printed wiring board (4); and a measurement unit (10) for measuring the waveform of the voltage signal outputted from the sensor (6).

Description

試験装置および試験方法Test equipment and test method
　本開示は、試験装置および試験方法に関するものである。 The present disclosure relates to a test device and a test method.
　非特許文献１には、耐プリント配線板曲げ性試験に関して、試験用プリント配線板に電子部品を搭載した状態での試験方法が規定されている。この試験方法では、プリント配線板を規定寸法曲げた後の電子部品の性能と外観異常に基づいて判定している。 Regarding a printed wiring board bending resistance test, Non-Patent Document 1 stipulates a test method in which electronic components are mounted on a printed wiring board for testing. In this test method, judgment is made based on the performance and appearance abnormalities of electronic components after bending a printed wiring board to a specified dimension.
　この方法において不合格となった場合、電子部品の破壊が発生した曲げ寸法（以下、「限界値」という）が分からない。限界値を知るためにはプリント配線板を一定寸法曲げるのではなく、プリント配線板を電子部品が割れなどの破壊にいたるまで曲げ、そのときの曲げ寸法を知る必要がある。 If this method fails, the bending dimension (hereinafter referred to as "limit value") at which the electronic component broke is not known. In order to know the limit value, it is not necessary to bend the printed wiring board to a certain dimension, but rather to bend the printed wiring board until the electronic components break, such as cracking, and to know the bending dimension at that time.
　例えば、特許文献１には、電子部品などの測定対象物単体での抗折強度を測定する装置において、測定対象物が載置されるステージを構成する支持部内にアコースティックエミッションセンサー（以下、「ＡＥセンサー」という）が設けられ、測定対象物の破壊に起因する振動をＡＥセンサーにより検出することが開示されている。 For example, Patent Document 1 describes that in an apparatus for measuring the bending strength of a single object to be measured such as an electronic component, an acoustic emission sensor (hereinafter referred to as "AE It is disclosed that an AE sensor is provided to detect vibrations caused by destruction of the object to be measured.
特開２０１０－２３７１９７号公報Japanese Patent Application Publication No. 2010-237197
　しかしながら、特許文献１に記載の技術では、測定対象物を搭載したプリント配線板を曲げることは想定されておらず、ステージにプリント配線板を載置し曲げるための構造とはなっていない。 However, the technique described in Patent Document 1 does not assume that the printed wiring board on which the object to be measured is mounted is bent, and does not have a structure for placing the printed wiring board on a stage and bending it.
　また、特許文献１に記載の技術において、プリント配線基板を載置可能な構造とした場合でも、プリント配線基板の下面全体がテーブルと接触しており、測定対象物の破壊に起因する振動がテーブルにより減衰するため、ＡＥセンサーの検出感度が低下するという問題があった。 In addition, in the technology described in Patent Document 1, even when the structure is such that the printed wiring board can be mounted, the entire lower surface of the printed wiring board is in contact with the table, and vibrations caused by the destruction of the object to be measured are transmitted to the table. Therefore, there was a problem in that the detection sensitivity of the AE sensor decreased.
　そこで、本開示は、電子部品を搭載したプリント配線板の曲げ性試験において、電子部品の破壊に起因する振動を高精度に検出可能な技術を提供することを目的とする。 Therefore, an object of the present disclosure is to provide a technology that can detect vibrations caused by destruction of electronic components with high accuracy in a bendability test of a printed wiring board on which electronic components are mounted.
　本開示に係る試験装置は、電子部品が搭載されたプリント配線板の搭載面における両端部を支持する支持台と、前記プリント配線板における前記搭載面とは反対側の面側に配置され、かつ、前記電子部品に対し前記プリント配線板を介して荷重を印加する押し子治具と、前記プリント配線板の前記搭載面における前記電子部品の周辺に配置され、かつ、前記電子部品の破壊に起因する振動を検出し、前記振動に応じた電圧信号を出力するセンサーと、前記センサーを前記プリント配線板に固定する固定治具と、前記センサーを前記プリント配線板に押し付ける押し付け部材と、前記センサーから出力された前記電圧信号の波形を測定するための測定部とを備えたものである。 A test device according to the present disclosure includes a support base that supports both ends of a mounting surface of a printed wiring board on which electronic components are mounted, and a support base that is disposed on a side of the printed wiring board opposite to the mounting surface, and , a pusher jig that applies a load to the electronic component via the printed wiring board, and a pusher jig that is disposed around the electronic component on the mounting surface of the printed wiring board, and that is caused by destruction of the electronic component. a sensor that detects vibration caused by the sensor and outputs a voltage signal according to the vibration; a fixing jig that fixes the sensor to the printed wiring board; a pressing member that presses the sensor against the printed wiring board; and a measuring section for measuring the waveform of the output voltage signal.
　本開示によれば、支持台はプリント配線板の搭載面における両端部を支持するため、押し子治具が電子部品に対しプリント配線板を介して荷重を印加することで、電子部品を搭載したプリント配線板を曲げることができる。さらに、センサーは、固定治具によりプリント配線板に固定され、押し付け部材によりプリント配線板に押し付けられるため、プリント配線板に対するセンサーの安定した取り付けが可能となる。 According to the present disclosure, since the support base supports both ends of the mounting surface of the printed wiring board, the pusher jig applies a load to the electronic component via the printed wiring board, so that the electronic component is mounted. Printed wiring boards can be bent. Further, since the sensor is fixed to the printed wiring board by the fixing jig and pressed against the printed wiring board by the pressing member, it is possible to stably attach the sensor to the printed wiring board.
　これにより、電子部品を搭載したプリント配線板の曲げ性試験において、電子部品の破壊に起因する振動を高精度に検出することができる。 As a result, vibrations caused by destruction of electronic components can be detected with high accuracy in a bendability test of a printed wiring board on which electronic components are mounted.
　この開示の目的、特徴、局面、および利点は、以下の詳細な説明と添付図面とによって、より明白となる。 Objects, features, aspects, and advantages of this disclosure will become more apparent from the following detailed description and accompanying drawings.
実施の形態１に係る試験装置の概略図である。1 is a schematic diagram of a test device according to Embodiment 1. FIG. 実施の形態１に係る試験装置が備えるセンサーの取り付け箇所を－Ｙ方向から視た概略図である。FIG. 3 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 1, viewed from the -Y direction. 実施の形態１に係る試験装置が備えるセンサーの取り付け箇所をＸ方向から視た概略図である。FIG. 3 is a schematic diagram of the mounting location of a sensor included in the test device according to the first embodiment, viewed from the X direction. 実施の形態１に係る試験装置が備えるプリント配線板上に加振器とセンサーを固定した状態を示す概略図である。FIG. 2 is a schematic diagram showing a state in which a vibrator and a sensor are fixed on a printed wiring board included in the test device according to the first embodiment. プリント配線板に対するセンサーの押し付け力とセンサーの出力電圧との関係を示す図である。FIG. 3 is a diagram showing the relationship between the pressing force of a sensor against a printed wiring board and the output voltage of the sensor. センサーと加振器との間の距離を示す概略図である。FIG. 3 is a schematic diagram showing the distance between a sensor and an exciter. 加振器において一定の振動をプリント配線板に加えたときの加振器とセンサーとの間の距離と、センサーの出力電圧との関係を示す図である。FIG. 7 is a diagram showing the relationship between the distance between the vibrator and the sensor and the output voltage of the sensor when a constant vibration is applied to the printed wiring board by the vibrator. 実施の形態２に係る試験装置の概略図である。FIG. 2 is a schematic diagram of a test device according to a second embodiment. 実施の形態２に係る試験装置が備えるセンサーの取り付け箇所をＸ方向から視た概略図である。FIG. 7 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 2, viewed from the X direction. 実施の形態３に係る試験装置の概略図である。FIG. 3 is a schematic diagram of a test device according to Embodiment 3. セラミック製積層コンデンサが限界値に達したときの破壊に起因する振動についてセンサーにより検出された出力信号波形を示す図である。FIG. 6 is a diagram showing an output signal waveform detected by a sensor regarding vibration caused by destruction when a ceramic multilayer capacitor reaches a limit value. セラミック製積層コンデンサが限界値に達したときの破壊に起因する振動に含まれる周波数毎のヒストグラムを示す図である。FIG. 6 is a diagram showing a histogram for each frequency included in vibrations caused by destruction when a ceramic multilayer capacitor reaches a limit value. 実施の形態４に係る試験装置が備えるセンサーの取り付け箇所を－Ｙ方向から視た概略図である。FIG. 7 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 4, viewed from the -Y direction. 実施の形態４に係る試験装置が備える固定治具の外周面のうち押し子治具と対向する部分を示す拡大図である。FIG. 12 is an enlarged view showing a portion of the outer circumferential surface of a fixing jig included in the test apparatus according to Embodiment 4, which faces a pusher jig. 実施の形態５に係る試験装置が備えるセンサーの取り付け箇所をＸ方向から視た概略図である。FIG. 12 is a schematic diagram of the mounting location of a sensor included in the test device according to Embodiment 5, viewed from the X direction. 実施の形態５に係る試験装置が備える固定治具の内周面のうちプリント配線板と接触する部分、および固定治具の外周面のうち押し子治具と対向する部分を示す拡大図である。FIG. 7 is an enlarged view showing a portion of the inner circumferential surface of the fixing jig included in the test apparatus according to Embodiment 5 that contacts the printed wiring board, and a portion of the outer circumferential surface of the fixing jig that faces the pusher jig. . 実施の形態６に係る位置決め治具をＺ方向から視た概略図である。FIG. 7 is a schematic diagram of a positioning jig according to a sixth embodiment, viewed from the Z direction. 実施の形態６に係る位置決め治具を－Ｙ方向から視た概略図である。FIG. 7 is a schematic diagram of a positioning jig according to a sixth embodiment, viewed from the -Y direction. 実施の形態６に係る位置決め治具を用いてセンサーを取り付けた状態をＺ方向から視た概略図である。FIG. 12 is a schematic diagram of a state in which a sensor is attached using a positioning jig according to a sixth embodiment, viewed from the Z direction. 実施の形態６に係る位置決め治具を用いてセンサーを取り付けた状態を－Ｙ方向から視た概略図である。FIG. 12 is a schematic diagram of a state in which a sensor is attached using a positioning jig according to a sixth embodiment, viewed from the -Y direction.
　＜実施の形態１＞
　＜試験装置の構成＞
　実施の形態１について、図面を用いて以下に説明する。図１は、実施の形態１に係る試験装置の概略図である。図２は、実施の形態１に係る試験装置が備えるセンサー６の取り付け箇所を－Ｙ方向から視た概略図である。図３は、実施の形態１に係る試験装置が備えるセンサー６の取り付け箇所をＸ方向から視た概略図である。 <Embodiment 1>
<Configuration of test equipment>
Embodiment 1 will be described below using the drawings. FIG. 1 is a schematic diagram of a test apparatus according to Embodiment 1. FIG. 2 is a schematic diagram of the mounting location of the sensor 6 included in the test apparatus according to the first embodiment, viewed from the -Y direction. FIG. 3 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the first embodiment, viewed from the X direction.
　図１において、Ｘ方向、Ｙ方向およびＺ方向は、互いに直交する。以下の図に示されるＸ方向、Ｙ方向およびＺ方向も、互いに直交する。以下においては、Ｘ方向と、当該Ｘ方向の反対の方向である－Ｘ方向とを含む方向を「Ｘ軸方向」ともいう。また、以下においては、Ｙ方向と、当該Ｙ方向の反対の方向である－Ｙ方向とを含む方向を「Ｙ軸方向」ともいう。また、以下においては、Ｚ方向と、当該Ｚ方向の反対の方向である－Ｚ方向とを含む方向を「Ｚ軸方向」ともいう。 In FIG. 1, the X direction, Y direction, and Z direction are orthogonal to each other. The X, Y, and Z directions shown in the figures below are also orthogonal to each other. In the following, the direction including the X direction and the −X direction, which is the opposite direction to the X direction, will also be referred to as the "X-axis direction." Furthermore, hereinafter, a direction including the Y direction and the -Y direction, which is the opposite direction to the Y direction, is also referred to as the "Y-axis direction." Furthermore, hereinafter, a direction including the Z direction and the -Z direction, which is the opposite direction to the Z direction, is also referred to as the "Z-axis direction."
　図１に示すように、試験装置は、一対の支持台３と、荷重印加部１と、センサー６と、固定治具８と、押し付け部材としての弾性部材７と、アンプ９と、測定部１０とを備えている。 As shown in FIG. 1, the test device includes a pair of support stands 3, a load application section 1, a sensor 6, a fixing jig 8, an elastic member 7 as a pressing member, an amplifier 9, and a measurement section 10. It is equipped with
　一対の支持台３は、ＸＹ平面と平行に配置されたプリント配線板４の搭載面における両端部（Ｘ軸方向の端部）を支持可能なように、Ｙ軸方向に延在する円柱状の部材により構成されている。プリント配線板４の搭載面の中央部には、測定対象物である電子部品５が搭載されている。 The pair of support stands 3 are cylindrical columns extending in the Y-axis direction so as to be able to support both ends (ends in the X-axis direction) of the mounting surface of the printed wiring board 4 arranged parallel to the XY plane. It is composed of members. At the center of the mounting surface of the printed wiring board 4, an electronic component 5, which is an object to be measured, is mounted.
　荷重印加部１は、プリント配線板４における搭載面とは反対側の面側、すなわち、プリント配線板４の上方（Ｚ方向）に配置されている。荷重印加部１には、下方（－Ｚ方向）に突出する押し子治具２が設けられている。押し子治具２は、荷重印加部１と共に下降することにより、電子部品５に対しプリント配線板４を介して荷重を印加する。 The load application unit 1 is arranged on the side of the printed wiring board 4 opposite to the mounting surface, that is, above the printed wiring board 4 (in the Z direction). The load applying section 1 is provided with a pusher jig 2 that protrudes downward (-Z direction). The pusher jig 2 applies a load to the electronic component 5 via the printed wiring board 4 by descending together with the load applying section 1 .
　センサー６は、プリント配線板４の搭載面における電子部品５の周辺に配置されている。センサー６は、電子部品５の破壊に起因する振動を検出し、振動に応じた電圧信号を出力するＡＥセンサーである。 The sensor 6 is arranged around the electronic component 5 on the mounting surface of the printed wiring board 4. The sensor 6 is an AE sensor that detects vibrations caused by destruction of the electronic component 5 and outputs a voltage signal in accordance with the vibrations.
　図１～図３に示すように、弾性部材７は、板バネ、コイルばね、ゴム、またはスポンジなどの弾性を有する部材であり、センサー６をプリント配線板４に押し付けるために、センサー６の下端（－Ｚ方向の端）に取り付けられている。固定治具８は、センサー６をプリント配線板４に固定するための治具である。固定治具８は、弾性部材７を介してセンサー６をプリント配線板４に押し付けることが可能なように、Ｘ方向から視て矩形枠状に形成されている。 As shown in FIGS. 1 to 3, the elastic member 7 is an elastic member such as a leaf spring, coil spring, rubber, or sponge, and is used at the lower end of the sensor 6 to press the sensor 6 against the printed wiring board 4. (the end in the -Z direction). Fixing jig 8 is a jig for fixing sensor 6 to printed wiring board 4 . The fixing jig 8 is formed into a rectangular frame shape when viewed from the X direction so that the sensor 6 can be pressed against the printed wiring board 4 via the elastic member 7.
　アンプ９は、センサー６から出力された電圧信号を増幅し、測定部１０へ出力する。測定部１０は、増幅された電圧信号の波形を測定するための電圧波形測定装置である。なお、アンプ９は必須の構成ではないため省略可能であるが、試験装置はアンプ９を備えた方がより好ましい。 The amplifier 9 amplifies the voltage signal output from the sensor 6 and outputs it to the measurement section 10. The measuring unit 10 is a voltage waveform measuring device for measuring the waveform of the amplified voltage signal. Note that although the amplifier 9 is not an essential component and can be omitted, it is more preferable for the test apparatus to include the amplifier 9.
　＜試験方法＞
　次に、試験装置を用いた試験方法を説明する。まず、プリント配線板４の搭載面に、はんだにより測定対象物である電子部品５が搭載され、プリント配線板４の搭載面における電子部品５の周辺にセンサー６が固定治具８と弾性部材７により固定される。なお、ＪＩＳ　Ｃ　５１０１－２２の耐プリント配線板曲げ性に準拠した試験を行う場合、プリント配線板４として、厚さ１．６ｍｍ±０．２ｍｍまたは０．８ｍｍ±０．１ｍｍのガラス布基材エポキシ樹脂プリント配線板用銅張積層板が用いられる。また、一対の支持台３の曲率半径は５ｍｍ、一対の支持台３の間隔は９０ｍｍとする規定がある。 <Test method>
Next, a test method using a test device will be explained. First, an electronic component 5 to be measured is mounted on the mounting surface of the printed wiring board 4 with solder, and a sensor 6 is mounted around the electronic component 5 on the mounting surface of the printed wiring board 4 using a fixing jig 8 and an elastic member 7. Fixed by In addition, when conducting a test based on JIS C 5101-22 printed wiring board bending resistance, a glass cloth base material with a thickness of 1.6 mm ± 0.2 mm or 0.8 mm ± 0.1 mm is used as the printed wiring board 4. A copper-clad laminate for epoxy resin printed wiring boards is used. Further, there is a regulation that the radius of curvature of the pair of support stands 3 is 5 mm, and the interval between the pair of support stands 3 is 90 mm.
　なお、弾性部材７の取り付け位置はセンサー６の下側（－Ｚ方向）でなくともよく、センサー６がプリント配線板４に押し付けられる取り付け位置であればよい。例えば、弾性部材７の取り付け位置は、プリント配線板４の搭載面とは反対側の面において、固定治具８とプリント配線板４との間であってもよい。 Note that the mounting position of the elastic member 7 does not have to be below the sensor 6 (in the −Z direction), and may be any mounting position where the sensor 6 is pressed against the printed wiring board 4. For example, the mounting position of the elastic member 7 may be between the fixing jig 8 and the printed wiring board 4 on the surface opposite to the mounting surface of the printed wiring board 4.
　次に、電子部品５が下側（－Ｚ方向）に位置するように、プリント配線板４を一対の支持台３上に載置する。このとき、電子部品５は、押し子治具２と直接接触しない向きとなっている。 Next, the printed wiring board 4 is placed on the pair of support stands 3 so that the electronic component 5 is located on the lower side (-Z direction). At this time, the electronic component 5 is oriented so as not to come into direct contact with the pusher jig 2.
　荷重印加部１を押し子治具２と共に下降させて、プリント配線板４における搭載面とは反対側の面に押し子治具２を接触させる。ここで、押し子治具２がプリント配線板４に接触したときの押し子治具２の位置を基準位置とする。荷重印加部１を押し子治具２と共にさらに下降させて、基準位置からさらに荷重を印加する。 The load applying section 1 is lowered together with the pusher jig 2, and the pusher jig 2 is brought into contact with the surface of the printed wiring board 4 opposite to the mounting surface. Here, the position of the pusher jig 2 when the pusher jig 2 contacts the printed wiring board 4 is defined as the reference position. The load applying section 1 is further lowered together with the pusher jig 2, and a further load is applied from the reference position.
　荷重によりプリント配線板４が曲がり、さらに荷重が印加されると電子部品５が破壊され、破壊に起因する振動が電子部品５から発せられる。この振動は、プリント配線板４を介してセンサー６に伝搬する。電子部品５の破壊に起因する振動は、センサー６により検出され、振動に応じた電圧信号に変換され出力される。 The printed wiring board 4 bends due to the load, and when further load is applied, the electronic component 5 is destroyed, and vibrations due to the destruction are emitted from the electronic component 5. This vibration propagates to the sensor 6 via the printed wiring board 4. Vibration caused by destruction of the electronic component 5 is detected by the sensor 6, converted into a voltage signal corresponding to the vibration, and output.
　この電圧信号はアンプ９により増幅された後、測定部１０に入力される。測定部１０に入力される信号には、電子部品５の破壊に起因する信号以外にも、荷重印加部１と周辺機器からのノイズ信号、および周辺で発生した振動によりセンサー６から出力されるノイズ信号が含まれる。ノイズ信号を考慮した電圧信号の測定を行うために、ノイズ信号の電圧振幅値と、電子部品５の破壊に起因する振動に応じた電圧信号の電圧振幅値との間の電圧値に閾値を設定する。 After this voltage signal is amplified by the amplifier 9, it is input to the measuring section 10. The signals input to the measurement unit 10 include, in addition to signals caused by the destruction of the electronic component 5, noise signals from the load application unit 1 and peripheral equipment, and noise output from the sensor 6 due to vibrations generated in the surrounding area. Contains signals. In order to measure the voltage signal in consideration of the noise signal, a threshold is set to the voltage value between the voltage amplitude value of the noise signal and the voltage amplitude value of the voltage signal corresponding to vibration caused by destruction of the electronic component 5. do.
　次に、閾値を決定する方法について説明する。電子部品５をプリント配線板に搭載した状態で耐プリント配線板曲げ性試験を行い、センサー６により電子部品５の破壊に起因する振動を検出し、測定部１０により電圧信号の振幅値を測定する。さらに、電子部品５をプリント配線板４に搭載していない状態で耐プリント配線板曲げ性試験を行い、測定部１０により電圧信号の振幅値を測定する。電子部品５をプリント配線板４に搭載していない状態で測定された電圧信号がノイズ信号である。 Next, a method for determining the threshold value will be explained. A printed wiring board bending resistance test is performed with the electronic component 5 mounted on the printed wiring board, the sensor 6 detects vibrations caused by destruction of the electronic component 5, and the measurement unit 10 measures the amplitude value of the voltage signal. . Further, a printed wiring board bending resistance test is performed with no electronic component 5 mounted on the printed wiring board 4, and the amplitude value of the voltage signal is measured by the measurement unit 10. A voltage signal measured without electronic component 5 mounted on printed wiring board 4 is a noise signal.
　電子部品５の破壊に起因する電圧信号の電圧振幅値と、ノイズ信号の電圧振幅値との間の電圧値に閾値を決定する。なお、試験装置がアンプ９を備えている場合は、その増幅分を考慮して閾値を決定する。 A threshold value is determined at a voltage value between the voltage amplitude value of the voltage signal caused by the destruction of the electronic component 5 and the voltage amplitude value of the noise signal. In addition, when the test apparatus is equipped with the amplifier 9, the threshold value is determined in consideration of the amplification amount.
　試験装置の動作の説明に戻る。このように決定された閾値を測定部１０に設定し、押し子治具２を介して荷重印加部１によりプリント配線板４へ荷重を印加しながら、測定部１０によりセンサー６から出力される電圧信号を測定する。 Return to the explanation of the operation of the test equipment. The threshold value determined in this way is set in the measurement unit 10, and while applying a load to the printed wiring board 4 by the load application unit 1 via the pusher jig 2, the voltage output from the sensor 6 is measured by the measurement unit 10. Measure the signal.
　プリント配線板４に荷重を印加し続けると電子部品５が破壊に至る。電子部品５が破壊したときの振動をセンサー６により検出し、測定部１０により測定された電圧信号の波形が閾値を超えたとき、基準位置からの押し子治具２の押し込み寸法を電子部品５の限界値とする。 If a load is continued to be applied to the printed wiring board 4, the electronic component 5 will be destroyed. The sensor 6 detects the vibration when the electronic component 5 is destroyed, and when the waveform of the voltage signal measured by the measurement unit 10 exceeds the threshold, the pushing dimension of the pusher jig 2 from the reference position is determined by the electronic component 5. The limit value of
　なお、基準位置からの押し子治具２の押し込み寸法について、トリガー信号により荷重印加部１の動作を停止させた状態で測定してもよいし、荷重印加部１の下降速度を一定とし、基準位置における時間からトリガー信号の検出時間までに要する時間に基づいて算出してもよい。さらに、レーザー変位計等を使用して、基準位置からの押し子治具２の押し込み寸法を測定してもよい。 Note that the push-in dimension of the pusher jig 2 from the reference position may be measured with the operation of the load application section 1 stopped by a trigger signal, or with the downward speed of the load application section 1 constant and It may be calculated based on the time required from the time at the position to the detection time of the trigger signal. Furthermore, the pushing dimension of the pusher jig 2 from the reference position may be measured using a laser displacement meter or the like.
　また、センサー６はプリント配線板４の搭載面またはこれとは反対側の面のどちらの面に固定されてもよいが、プリント配線板４における電子部品５と同じ面側に固定されることが望ましい。電子部品５の破壊に起因する振動には、プリント配線板４の搭載面を伝搬するエネルギーが多く含まれるため、センサー６から出力される電圧信号の振幅は大きくなり、電子部品５の破壊に起因する振動の検出感度が向上することが理由である。 Further, the sensor 6 may be fixed to either the mounting surface of the printed wiring board 4 or the surface opposite thereto, but it may be fixed to the same side of the printed wiring board 4 as the electronic component 5. desirable. The vibration caused by the destruction of the electronic component 5 contains a lot of energy that propagates through the mounting surface of the printed wiring board 4, so the amplitude of the voltage signal output from the sensor 6 increases, and the vibration caused by the destruction of the electronic component 5 contains a large amount of energy that propagates through the mounting surface of the printed wiring board 4. The reason for this is that the detection sensitivity of vibrations caused by vibrations is improved.
　このように、プリント配線板４の搭載面における電子部品５の周辺にセンサー６が固定されることにより、電子部品５の破壊に起因する振動の検出感度が向上する。検出感度が向上すると、電子部品５の破壊に起因する振動に応じた電圧信号がノイズ信号よりも大きくなり、電子部品５の破壊に対応した電圧信号の振幅電圧値とノイズ信号の振幅電圧値との差が大きくなる。その結果、測定部１０に設定する閾値をノイズ信号の振幅電圧値よりも十分高く設定可能となり、電子部品５の破壊に起因する振動の誤検出率が低下する。 In this way, by fixing the sensor 6 around the electronic component 5 on the mounting surface of the printed wiring board 4, the detection sensitivity of vibrations caused by destruction of the electronic component 5 is improved. When the detection sensitivity improves, the voltage signal corresponding to the vibration caused by the destruction of the electronic component 5 becomes larger than the noise signal, and the amplitude voltage value of the voltage signal corresponding to the destruction of the electronic component 5 and the amplitude voltage value of the noise signal become different. The difference becomes larger. As a result, the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage value of the noise signal, and the rate of false detection of vibrations due to destruction of the electronic component 5 is reduced.
　また、センサー６の検出感度をさらに向上させるために、センサー６とプリント配線板４との接触面に、ワセリンまたはグリスなどの接触媒質１１を塗布することが望ましい。 Furthermore, in order to further improve the detection sensitivity of the sensor 6, it is desirable to apply a couplant 11 such as vaseline or grease to the contact surface between the sensor 6 and the printed wiring board 4.
　また、センサー６をプリント配線板４に固定する際に、押し付け力を一定の圧力以上になるよう固定することが望ましい。図４は、実施の形態１に係る試験装置が備えるプリント配線板４上に加振器１３とセンサー６を固定した状態を示す概略図である。図５は、プリント配線板４に対するセンサー６の押し付け力とセンサー６の出力電圧との関係を示す図である。 Furthermore, when fixing the sensor 6 to the printed wiring board 4, it is desirable to fix the sensor 6 so that the pressing force is greater than a certain pressure. FIG. 4 is a schematic diagram showing a state in which the vibrator 13 and the sensor 6 are fixed on the printed wiring board 4 included in the test apparatus according to the first embodiment. FIG. 5 is a diagram showing the relationship between the pressing force of the sensor 6 against the printed wiring board 4 and the output voltage of the sensor 6.
　図４に示すように、耐プリント配線板曲げ性試験を行う前に、電子部品５を搭載していない状態で、プリント配線板４の搭載面におけるセンサー６の周辺に加振器１３を固定する。加振器１３には信号発生器１４が接続されている。加振器１３から一定の振幅の振動をプリント配線板４に印加する。プリント配線板４に対するセンサー６の押し付け力を変化させたときに、センサー６から出力される電圧信号を図５に示す。 As shown in FIG. 4, before conducting the printed wiring board bending resistance test, a vibrator 13 is fixed around the sensor 6 on the mounting surface of the printed wiring board 4 without any electronic components 5 mounted thereon. . A signal generator 14 is connected to the vibrator 13 . Vibration with a constant amplitude is applied to the printed wiring board 4 from the vibrator 13. FIG. 5 shows a voltage signal output from the sensor 6 when the pressing force of the sensor 6 against the printed wiring board 4 is changed.
　押し付け力を低下させると、０.４ｋｇ／ｃｍ2付近から、センサー６から出力される電圧信号の振幅が小さくなる。従って、プリント配線板４に対するセンサー６の押し付け力を、一定の圧力以上、具体的には０.４ｋｇ／ｃｍ2以上になるようにすることにより、センサー６から出力される電圧信号が大きくなり、ノイズ信号との振幅差が大きくなる。振幅差が大きくなると、測定部１０に設定される閾値をノイズ信号の振幅電圧値よりも十分高く設定可能となり、電子部品５の破壊に起因する振動の誤検出率が低下する。これにより、電子部品５の破壊に起因する振動の測定精度が向上する効果が期待できる。 When the pressing force is reduced, the amplitude of the voltage signal output from the sensor 6 becomes smaller from around 0.4 kg/cm 2 . Therefore, by setting the pressing force of the sensor 6 against the printed wiring board 4 to be at least a certain pressure, specifically at least 0.4 kg/cm 2 , the voltage signal output from the sensor 6 will increase. The amplitude difference with the noise signal increases. When the amplitude difference becomes large, the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage value of the noise signal, and the rate of false detection of vibrations due to destruction of the electronic component 5 decreases. As a result, it can be expected that the accuracy of measuring vibrations caused by destruction of the electronic component 5 will be improved.
　図６は、センサー６と加振器１３との間の距離を示す概略図である。図６に示すように、センサー６から加振器１３までの距離は、一定の距離以下であることが望ましい。 FIG. 6 is a schematic diagram showing the distance between the sensor 6 and the vibrator 13. As shown in FIG. 6, it is desirable that the distance from the sensor 6 to the vibrator 13 is a certain distance or less.
　図４に示すように、プリント配線板４の搭載面における電子部品５が搭載される位置に加振器１３が接着され固定される。次に、固定治具８と弾性部材７によりセンサー６が固定される。信号発生器１４から加振器１３に一定の振動幅となる信号が入力されることで、プリント配線板４が加振される。 As shown in FIG. 4, the vibrator 13 is bonded and fixed to the mounting surface of the printed wiring board 4 at the position where the electronic component 5 is mounted. Next, the sensor 6 is fixed by the fixing jig 8 and the elastic member 7. When a signal having a constant vibration width is input from the signal generator 14 to the vibrator 13, the printed wiring board 4 is vibrated.
　図７は、加振器１３において一定の振動をプリント配線板４に加えたときの加振器１３とセンサー６との間の距離と、センサー６の出力電圧との関係を示す図である。図７に示すように、センサー６と加振器１３との間の距離が長くなると、センサー６から出力される電圧値が低下していくことがわかる。 FIG. 7 is a diagram showing the relationship between the distance between the vibrator 13 and the sensor 6 and the output voltage of the sensor 6 when a constant vibration is applied to the printed wiring board 4 by the vibrator 13. As shown in FIG. 7, it can be seen that as the distance between the sensor 6 and the vibrator 13 increases, the voltage value output from the sensor 6 decreases.
　従って、センサー６と電子部品５との間の距離を一定の距離以下、具体的には５ｍｍ以下になるようにセンサー６を固定することにより電子部品５の破壊に起因する振動に対応するセンサー６の出力電圧が大きく出力され感度が高くなる。これにより、測定部１０に設定される閾値をノイズ信号の振幅電圧よりも十分高く設定可能となり、電子部品５の破壊に起因する振動の誤検出率が低下し、測定精度が向上するという効果が期待できる。 Therefore, by fixing the sensor 6 so that the distance between the sensor 6 and the electronic component 5 is less than a certain distance, specifically 5 mm or less, the sensor 6 can cope with the vibration caused by the destruction of the electronic component 5. The output voltage is large and the sensitivity is high. As a result, the threshold value set in the measurement unit 10 can be set sufficiently higher than the amplitude voltage of the noise signal, which has the effect of reducing the false detection rate of vibrations caused by destruction of the electronic component 5 and improving measurement accuracy. You can expect it.
　＜効果＞
　以上のように、実施の形態１に係る試験装置は、電子部品５が搭載されたプリント配線板４の搭載面における両端部を支持する支持台３と、プリント配線板４における搭載面とは反対側の面側に配置され、かつ、電子部品５に対しプリント配線板４を介して荷重を印加する押し子治具２と、プリント配線板４の搭載面における電子部品５の周辺に配置され、かつ、電子部品５の破壊に起因する振動を検出し、振動に応じた電圧信号を出力するセンサー６と、センサー６をプリント配線板４に固定する固定治具８と、センサー６をプリント配線板４に押し付ける押し付け部材と、センサー６から出力された電圧信号の波形を測定するための測定部１０とを備えている。また、試験装置は、センサー６から出力された電圧信号を増幅するアンプ９をさらに備えた方がより好ましい。この場合、測定部１０は、アンプ９により増幅された電圧信号の波形を測定している。 <Effect>
As described above, the test apparatus according to the first embodiment includes a support base 3 that supports both ends of the mounting surface of the printed wiring board 4 on which the electronic component 5 is mounted, and a mounting surface of the printed wiring board 4 that is opposite to the supporting base 3. a pusher jig 2 disposed on the side surface side and applying a load to the electronic component 5 via the printed wiring board 4; and a pusher jig 2 disposed around the electronic component 5 on the mounting surface of the printed wiring board 4; Also, a sensor 6 that detects vibrations caused by destruction of the electronic component 5 and outputs a voltage signal according to the vibration, a fixture 8 that fixes the sensor 6 to the printed wiring board 4, and a fixing jig 8 that fixes the sensor 6 to the printed wiring board 4. 4 and a measuring section 10 for measuring the waveform of the voltage signal output from the sensor 6. Further, it is more preferable that the test device further includes an amplifier 9 that amplifies the voltage signal output from the sensor 6. In this case, the measuring section 10 measures the waveform of the voltage signal amplified by the amplifier 9.
　支持台３はプリント配線板４の搭載面における両端部を支持するため、押し子治具２が電子部品５に対しプリント配線板４を介して荷重を印加することで、電子部品５を搭載したプリント配線板４を曲げることができる。さらに、センサー６は、固定治具８によりプリント配線板４に固定され、押し付け部材によりプリント配線板４に押し付けられるため、プリント配線板４に対するセンサー６の安定した取り付けが可能となる。 Since the support stand 3 supports both ends of the mounting surface of the printed wiring board 4, the pusher jig 2 applies a load to the electronic component 5 via the printed wiring board 4, so that the electronic component 5 is mounted. Printed wiring board 4 can be bent. Further, since the sensor 6 is fixed to the printed wiring board 4 by the fixing jig 8 and pressed against the printed wiring board 4 by the pressing member, the sensor 6 can be stably attached to the printed wiring board 4.
　これにより、電子部品５を搭載したプリント配線板４の曲げ性試験において、電子部品５の破壊に起因する振動を高精度に検出することができる。 Thereby, in the bendability test of the printed wiring board 4 on which the electronic component 5 is mounted, vibrations caused by the destruction of the electronic component 5 can be detected with high accuracy.
　以上より、電子部品５を搭載したプリント配線板４を備える製品の安全性を確保することが可能となる。 From the above, it is possible to ensure the safety of a product that includes the printed wiring board 4 on which the electronic component 5 is mounted.
　また、センサー６をプリント配線板４に接着する方法と比べて、センサー６の取り付けおよび取り外しにかかる作業時間を短縮できる。 Furthermore, compared to the method of bonding the sensor 6 to the printed wiring board 4, the work time required for attaching and removing the sensor 6 can be shortened.
　また、押し付け部材は弾性部材７を含んでいるため、弾性係数が既知である弾性部材７を採用することで、センサー６の取り付けに関する再現性が高くなる。弾性部材７の弾性係数を変えることにより簡単にセンサー６への適切な押し付け力を得ることが可能となる。その結果、再現性良く安定したセンサー６の取り付けが可能となる。 Furthermore, since the pressing member includes the elastic member 7, by employing the elastic member 7 whose elastic modulus is known, the reproducibility of attaching the sensor 6 is increased. By changing the elastic coefficient of the elastic member 7, it is possible to easily obtain an appropriate pressing force against the sensor 6. As a result, the sensor 6 can be attached stably with good reproducibility.
　また、センサー６をプリント配線板４に押し付ける押し付け力は、０.４ｋｇ／ｃｍ2以上であるため、耐プリント配線板曲げ性試験における電子部品５の限界値を感度よく検出することができる。 Further, since the pressing force for pressing the sensor 6 against the printed wiring board 4 is 0.4 kg/cm 2 or more, the limit value of the electronic component 5 in the printed wiring board bending resistance test can be detected with high sensitivity.
　また、センサー６から電子部品５までの距離は５ｍｍ以下であるため、耐プリント配線板曲げ性試験における電子部品５の限界値を感度よく検出することができる。 Furthermore, since the distance from the sensor 6 to the electronic component 5 is 5 mm or less, the limit value of the electronic component 5 in the printed wiring board bending resistance test can be detected with high sensitivity.
　＜実施の形態２＞
　次に、実施の形態２に係る試験装置について説明する。図８は、実施の形態２に係る試験装置の概略図である。図９は、実施の形態２に係る試験装置が備えるセンサー６の取り付け箇所をＸ方向から視た概略図である。なお、実施の形態２において、実施の形態１で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 2>
Next, a test device according to the second embodiment will be explained. FIG. 8 is a schematic diagram of a test device according to the second embodiment. FIG. 9 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the second embodiment, viewed from the X direction. Note that, in the second embodiment, the same components as those described in the first embodiment are given the same reference numerals, and a description thereof will be omitted.
　図８と図９に示すように、実施の形態２では、押し付け部材としてネジ１２が設けられている。具体的には、センサー６をプリント配線板４に固定するために、固定治具８とネジ１２が設けられている。 As shown in FIGS. 8 and 9, in the second embodiment, a screw 12 is provided as a pressing member. Specifically, in order to fix the sensor 6 to the printed wiring board 4, a fixing jig 8 and screws 12 are provided.
　この例では、プリント配線板４の搭載面側からネジ１２によりセンサー６をプリント配線板４に押し付けているが、プリント配線板４の搭載面とは反対側から固定治具８を介してネジ１２によりプリント配線板４を押し付けてもよい。また、ネジ１２に代えてボルトが使用されてもよい。 In this example, the sensor 6 is pressed against the printed wiring board 4 by the screw 12 from the mounting surface side of the printed wiring board 4, but the screw 12 is pressed from the side opposite to the mounting surface of the printed wiring board 4 via the fixing jig 8. The printed wiring board 4 may also be pressed by. Moreover, a bolt may be used instead of the screw 12.
　以上のように、実施の形態２に係る試験装置では、押し付け部材はボルトまたはネジ１２を含んでいるため、弾性部材７を使用することなくセンサー６を安定した押し付け力で固定することができる。 As described above, in the test device according to the second embodiment, since the pressing member includes the bolt or screw 12, the sensor 6 can be fixed with a stable pressing force without using the elastic member 7.
　また、ネジ１２を固定するときの回転数を変えることによりセンサー６のプリント配線板４への必要な押し付け力を容易に調整可能となるため、センサー６への適切な押し付け力を容易に得ることが可能となる。その結果、電子部品５の破壊に起因する振動を感度よく検出が可能となり、誤検出率が低くなるという効果が得られる。 Further, by changing the rotation speed when fixing the screw 12, the necessary pressing force of the sensor 6 against the printed wiring board 4 can be easily adjusted, so that an appropriate pressing force against the sensor 6 can be easily obtained. becomes possible. As a result, vibrations caused by destruction of the electronic component 5 can be detected with high sensitivity, and the effect of lowering the false detection rate can be obtained.
　また、センサー６を固定するために弾性部材７を使用する場合は、所望の押し付け力を確保するためには弾性部材７の弾性率が既知である必要があるが、弾性率の経時変化があるためセンサー６の面圧は経年変化する。そのため、安定した押し付け力を得るためには弾性部材７の弾性率を常に管理する必要があるが、ネジ１２を使用した場合は弾性部材７の弾性率の管理が不要となる効果も期待できる。さらに、センサー６をプリント配線板４に接着する方法と比べて、センサー６の取り付けおよび取り外しにかかる作業時間を短縮できる。 Furthermore, when using the elastic member 7 to fix the sensor 6, the elastic modulus of the elastic member 7 needs to be known in order to ensure the desired pressing force, but the elastic modulus may change over time. Therefore, the surface pressure of the sensor 6 changes over time. Therefore, in order to obtain a stable pressing force, it is necessary to constantly manage the elastic modulus of the elastic member 7, but when the screw 12 is used, the effect that managing the elastic modulus of the elastic member 7 is not necessary can be expected. Furthermore, compared to the method of bonding the sensor 6 to the printed wiring board 4, the working time required for attaching and removing the sensor 6 can be shortened.
　＜実施の形態３＞
　次に、実施の形態３に係る試験装置について説明する。図１０は、実施の形態３に係る試験装置の概略図である。なお、実施の形態３において、実施の形態１，２で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 3>
Next, a test apparatus according to Embodiment 3 will be explained. FIG. 10 is a schematic diagram of a test device according to Embodiment 3. In the third embodiment, the same components as those explained in the first and second embodiments are designated by the same reference numerals, and the explanation thereof will be omitted.
　図１０に示すように、実施の形態３では、実施の形態１の構成に加えて、センサー６と測定部１０との間に、特定の周波数帯域の電圧信号を減衰させる帯域除去フィルタ１５が設けられている。なお、実施の形態２の構成に加えて、帯域除去フィルタ１５が設けられていてもよい。 As shown in FIG. 10, in the third embodiment, in addition to the configuration of the first embodiment, a band rejection filter 15 is provided between the sensor 6 and the measurement unit 10 to attenuate the voltage signal in a specific frequency band. It is being Note that in addition to the configuration of the second embodiment, a band rejection filter 15 may be provided.
　上記のように、センサー６の出力信号には、電子部品５の破壊に起因する信号以外にも、荷重印加部１と周辺機器からのノイズ信号、および周辺で発生した振動によりセンサー６から出力されるノイズ信号が含まれる。本来は電子部品５の破壊の振動に起因する信号を検出すべきであるが、ノイズ信号を誤って電子部品５の破壊に起因する振動として誤検出した場合、耐プリント配線板曲げ性試験における電子部品５の限界値が本来の限界値と違う値であると誤判定する場合が生じる。従って、帯域除去フィルタ１５をセンサー６と測定部１０との間に配置することにより、ノイズ信号を電子部品５の破壊に起因する振動として誤検出することを抑制することが可能となる。 As mentioned above, the output signal of the sensor 6 includes, in addition to signals caused by the destruction of the electronic component 5, noise signals from the load application unit 1 and peripheral devices, and vibrations generated in the surrounding area. Contains noise signals. Originally, the signal caused by the vibration caused by the destruction of the electronic component 5 should be detected, but if the noise signal is mistakenly detected as the vibration caused by the destruction of the electronic component 5, the electronic There may be cases where it is erroneously determined that the limit value of the component 5 is different from the original limit value. Therefore, by arranging the band-rejection filter 15 between the sensor 6 and the measurement unit 10, it is possible to suppress erroneous detection of a noise signal as vibration caused by destruction of the electronic component 5.
　例えば、電子部品５がセラミック製積層コンデンサの場合に破壊時の振動をセンサー６により検出した場合、広い周波数範囲において信号が検出される。帯域除去フィルタ１５により特定の周波数帯域の電圧信号が減衰しても、それ以外の周波数帯域の電圧信号はほぼ減衰せずに帯域除去フィルタ１５を通過する。例えば、ノイズ信号の周波数が４００ｋＨｚの場合、４００ｋＨｚ付近を減衰させる帯域除去フィルタ１５を選択する。電子部品５の破壊に起因する振動の周波数が１００ｋＨｚ以上６００ｋＨｚ以下の場合、４００ｋＨｚのノイズ信号と共に電子部品５が破壊した振動に起因する４００ｋＨｚの電圧信号も減衰する。 For example, when the electronic component 5 is a ceramic multilayer capacitor and the sensor 6 detects vibration at the time of destruction, a signal is detected in a wide frequency range. Even if a voltage signal in a specific frequency band is attenuated by the band-removal filter 15, voltage signals in other frequency bands pass through the band-removal filter 15 without being substantially attenuated. For example, if the frequency of the noise signal is 400 kHz, the band rejection filter 15 that attenuates the frequency around 400 kHz is selected. When the frequency of the vibration caused by the destruction of the electronic component 5 is between 100 kHz and 600 kHz, the 400 kHz voltage signal caused by the vibration caused by the destruction of the electronic component 5 is attenuated together with the 400 kHz noise signal.
　しかしながら、それ以外の周波数帯域の信号は、ほぼ減衰せずに帯域除去フィルタ１５を通過する。その結果、帯域除去フィルタ１５がセンサー６と測定部１０との間に配置されることにより電子部品５であるセラミック製積層コンデンサの振動に起因するセンサー６により検出される電圧信号と、ノイズ信号との電圧差が大きくなる。 However, signals in other frequency bands pass through the band-removal filter 15 without being attenuated. As a result, by disposing the band rejection filter 15 between the sensor 6 and the measurement unit 10, the voltage signal detected by the sensor 6 caused by the vibration of the ceramic multilayer capacitor, which is the electronic component 5, and the noise signal are eliminated. The voltage difference between becomes large.
　参考までに、図１１に、セラミック製積層コンデンサが限界値に達したときの破壊に起因する振動についてセンサー６により検出された出力信号波形を示す。また、図１２に、セラミック製積層コンデンサが限界値に達したときの破壊に起因する振動に含まれる周波数毎のヒストグラムを示す。 For reference, FIG. 11 shows the output signal waveform detected by the sensor 6 regarding vibrations caused by destruction when the ceramic multilayer capacitor reaches its limit value. Further, FIG. 12 shows a histogram for each frequency included in vibrations caused by destruction when a ceramic multilayer capacitor reaches its limit value.
　以上のように、実施の形態３に係る試験装置は、センサー６と測定部１０との間に配置された帯域除去フィルタ１５をさらに備えている。従って、帯域除去フィルタ１５によりノイズ信号を、測定部１０に設定された閾値以下まで減衰させることが可能となる。これにより、ノイズ信号が要因となっている電子部品５の限界値の誤検出率が低下し、検出精度が向上する効果が期待できる。 As described above, the test device according to the third embodiment further includes a band-rejection filter 15 disposed between the sensor 6 and the measuring section 10. Therefore, the band-rejection filter 15 can attenuate the noise signal to below the threshold set in the measuring section 10. As a result, it is expected that the rate of false detection of the limit value of the electronic component 5 due to noise signals will be reduced, and the detection accuracy will be improved.
　＜実施の形態４＞
　次に、実施の形態４に係る試験装置について説明する。図１３は、実施の形態４に係る試験装置が備えるセンサー６の取り付け箇所を－Ｙ方向から視た概略図である。図１４（ａ），（ｂ）は、実施の形態４に係る試験装置が備える固定治具８の外周面のうち押し子治具２と対向する部分８ａを示す拡大図である。なお、実施の形態４において、実施の形態１～３で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 4>
Next, a test apparatus according to Embodiment 4 will be explained. FIG. 13 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the fourth embodiment, viewed from the -Y direction. FIGS. 14(a) and 14(b) are enlarged views showing a portion 8a facing the pusher jig 2 of the outer peripheral surface of the fixing jig 8 included in the testing apparatus according to the fourth embodiment. In Embodiment 4, the same components as those described in Embodiments 1 to 3 are given the same reference numerals, and the explanation thereof will be omitted.
　図１３に示すように、実施の形態４では、実施の形態１の構成に対して固定治具８の外周面の形状が異なっている。以下、固定治具８について説明する。実施の形態１の場合と同様に、固定治具８は、Ｘ方向から視て、プリント配線板４と押し付け部材としての弾性部材７とを囲む矩形枠状に形成されている。ここで、実施の形態４以降においては押し付け部材が弾性部材７を含む場合について説明するが、押し付け部材がネジ１２またはボルトを含む場合であっても良い。固定治具８の内周面は、プリント配線板４における搭載面とは反対側の面と、弾性部材７におけるプリント配線板４とは反対側の部分とに接触している。図１４（ａ）に示すように、実施の形態４では、固定治具８の外周面のうち押し子治具２と対向する部分８ａは、円弧状に形成されている。 As shown in FIG. 13, in the fourth embodiment, the shape of the outer peripheral surface of the fixing jig 8 is different from the configuration of the first embodiment. The fixing jig 8 will be explained below. As in the case of the first embodiment, the fixing jig 8 is formed in a rectangular frame shape surrounding the printed wiring board 4 and the elastic member 7 as a pressing member when viewed from the X direction. Here, in the fourth and subsequent embodiments, a case will be described in which the pressing member includes the elastic member 7, but the pressing member may include a screw 12 or a bolt. The inner circumferential surface of the fixing jig 8 is in contact with the surface of the printed wiring board 4 on the opposite side to the mounting surface and the portion of the elastic member 7 on the side opposite to the printed wiring board 4. As shown in FIG. 14(a), in the fourth embodiment, a portion 8a of the outer peripheral surface of the fixing jig 8 that faces the pusher jig 2 is formed in an arc shape.
　振動の検出感度を向上させるために電子部品５の周辺にセンサー６を固定する必要があり、固定治具８を電子部品５に近づけていくと固定治具８が押し子治具２に接触する。両者が接触すると曲げ試験時に押し子治具２と固定治具８が擦れることにより振動が発生する。この振動によりノイズが発生するため誤検出率が上がる。押し子治具２の先端はＪＩＳの耐プリント板曲げ試験において、Ｒ＝５と規定されており、センサー６と電子部品５との距離を短くするには限界がある。そこで、固定治具８の外周面のうち押し子治具２と対向する部分８ａを円弧状とすることで、両者が接触しにくくなり、センサー６を電子部品５にさらに近づけることが可能となる。その結果、電子部品５の破壊に起因する振動の検出感度が向上する。 In order to improve the vibration detection sensitivity, it is necessary to fix the sensor 6 around the electronic component 5, and as the fixing jig 8 approaches the electronic component 5, the fixing jig 8 comes into contact with the pusher jig 2. . If they come into contact, the pusher jig 2 and the fixing jig 8 will rub against each other during the bending test, causing vibration. This vibration generates noise, which increases the false detection rate. The tip of the pusher jig 2 is specified as R=5 in the JIS printed board bending test, and there is a limit to shortening the distance between the sensor 6 and the electronic component 5. Therefore, by making the portion 8a of the outer peripheral surface of the fixing jig 8 that faces the pusher jig 2 into an arc shape, it becomes difficult for the two to come into contact with each other, and it becomes possible to bring the sensor 6 even closer to the electronic component 5. . As a result, the detection sensitivity of vibrations caused by destruction of the electronic component 5 is improved.
　図１４（ａ）の例では、固定治具８の外周面のうち押し子治具２と対向する部分８ａは、円弧状に形成されているが、これに限らず押し子治具２との接触を避けた形状であれば良い。例えば、図１４（ｂ）に示すように、固定治具８の外周面のうち押し子治具２と対向する部分８ａは、傾斜状に形成されていても良い。 In the example of FIG. 14(a), the portion 8a of the outer circumferential surface of the fixing jig 8 that faces the pusher jig 2 is formed in an arc shape, but the shape is not limited to this. Any shape that avoids contact is fine. For example, as shown in FIG. 14(b), a portion 8a of the outer peripheral surface of the fixing jig 8 that faces the pusher jig 2 may be formed in an inclined shape.
　以上のように、実施の形態５に係る試験装置では、固定治具８は、プリント配線板４と押し付け部材とを囲む枠状に形成され、固定治具８の内周面は、プリント配線板４における搭載面とは反対側の面と、押し付け部材におけるプリント配線板４とは反対側の部分とに接触し、固定治具８の外周面のうち押し子治具２と対向する部分８ａは、円弧状または傾斜状に形成されている。 As described above, in the test apparatus according to the fifth embodiment, the fixing jig 8 is formed in a frame shape surrounding the printed wiring board 4 and the pressing member, and the inner peripheral surface of the fixing jig 8 is A portion 8a of the outer circumferential surface of the fixing jig 8 that faces the pusher jig 2 is in contact with the surface opposite to the mounting surface in 4 and the portion of the pressing member opposite to the printed wiring board 4. , is formed in an arcuate or slanted shape.
　したがって、実施の形態１の場合よりもセンサー６を電子部品５のさらに近くに配置することが可能となる。その結果、電子部品５の破壊に起因する振動をさらに感度良く検出することが可能となり、誤検出率がさらに低下するという効果が得られる。 Therefore, it is possible to arrange the sensor 6 even closer to the electronic component 5 than in the first embodiment. As a result, it becomes possible to detect vibrations caused by destruction of the electronic component 5 with even higher sensitivity, resulting in the effect that the false detection rate is further reduced.
　＜実施の形態５＞
　次に、実施の形態５に係る試験装置について説明する。図１５は、実施の形態５に係る試験装置が備えるセンサー６の取り付け箇所をＸ方向から視た概略図である。図１６（ａ），（ｂ）は、実施の形態５に係る試験装置が備える固定治具８の内周面のうちプリント配線板４と接触する部分８ｂを示す拡大図である。図１６（ｃ），（ｄ）は、実施の形態５に係る試験装置が備える固定治具８の内周面のうちプリント配線板４と接触する部分８ｂ、および固定治具８の外周面のうち押し子治具２と対向する部分８ａを示す拡大図である。なお、実施の形態５において、実施の形態１～４で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 5>
Next, a test device according to Embodiment 5 will be explained. FIG. 15 is a schematic diagram of the mounting location of the sensor 6 included in the test device according to the fifth embodiment, viewed from the X direction. 16(a) and 16(b) are enlarged views showing a portion 8b of the inner circumferential surface of the fixing jig 8 included in the test apparatus according to the fifth embodiment, which contacts the printed wiring board 4. 16(c) and (d) show a portion 8b of the inner circumferential surface of the fixture 8 provided in the test apparatus according to the fifth embodiment, which contacts the printed wiring board 4, and a portion 8b of the outer circumferential surface of the fixture 8. It is an enlarged view showing a portion 8a facing the pusher jig 2. In Embodiment 5, the same components as those explained in Embodiments 1 to 4 are given the same reference numerals, and the explanation thereof will be omitted.
　図１５と図１６（ａ）に示すように、実施の形態５では、実施の形態４に対して固定治具８の内周面の形状が異なっており、固定治具８の内周面のうちプリント配線板４と接触する部分８ｂは、円弧状に形成されている。 As shown in FIGS. 15 and 16(a), in the fifth embodiment, the shape of the inner circumferential surface of the fixing jig 8 is different from that in the fourth embodiment. The portion 8b that contacts the printed wiring board 4 is formed in an arc shape.
　押し子治具２によりプリント配線板４に荷重を印加し続けるとプリント配線板４が円弧状に変形し（図１３参照）、電子部品５には引っ張り応力が加わる。プリント配線板４の変形が大きくなるとともに、電子部品５への応力も大きくなり、最終的には限界値に達して電子部品５は破壊に至る。従って、電子部品５の限界値はプリント配線板４が変形する形状に影響する。理想的には、プリント配線板４は、固定治具８が取り付けられていない場合の形状と同じ形状に変形することが望ましい。固定治具８におけるプリント配線板４と接触する部分８ｂの面積が小さいほど、プリント配線板４の変形形状への影響は小さくなる。その結果、プリント配線板４に固定治具８が取り付けられた場合と取り付けられていない場合との間で電子部品５に作用する引っ張り応力の大きさに差が無くなり、精度の高い試験が可能となる。 When a load is continued to be applied to the printed wiring board 4 by the pusher jig 2, the printed wiring board 4 is deformed into an arc shape (see FIG. 13), and tensile stress is applied to the electronic component 5. As the deformation of the printed wiring board 4 increases, the stress on the electronic component 5 also increases, eventually reaching a limit value and causing the electronic component 5 to break. Therefore, the limit value of the electronic component 5 influences the shape in which the printed wiring board 4 deforms. Ideally, it is desirable that the printed wiring board 4 is deformed into the same shape as it would be without the fixing jig 8 attached. The smaller the area of the portion 8b of the fixing jig 8 that contacts the printed wiring board 4, the smaller the influence on the deformed shape of the printed wiring board 4. As a result, there is no difference in the magnitude of the tensile stress acting on the electronic component 5 between when the fixing jig 8 is attached to the printed wiring board 4 and when it is not attached, making it possible to perform highly accurate testing. Become.
　図１６（ａ）の例では、固定治具８の内周面のうちプリント配線板４と接触する部分８ｂは、円弧状に形成されているが、これに限らず固定治具８におけるプリント配線板４と接触する部分８ｂの面積が小さい形状であれば良い。例えば、図１６（ｂ）に示すように、固定治具８の内周面のうちプリント配線板４と接触する部分８ｂは、傾斜状に形成されていても良い。また、図１６（ｃ），（ｄ）に示すように、実施の形態５の固定治具８の内周面の形状と実施の形態４の固定治具８の外周面の形状とを組み合わせることも可能である。 In the example of FIG. 16(a), the portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the printed wiring board 4 is formed in an arc shape, but the printed wiring in the fixing jig 8 is not limited to this. Any shape is sufficient as long as the area of the portion 8b in contact with the plate 4 is small. For example, as shown in FIG. 16(b), a portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the printed wiring board 4 may be formed in an inclined shape. Furthermore, as shown in FIGS. 16(c) and 16(d), the shape of the inner circumferential surface of the fixing jig 8 of the fifth embodiment and the shape of the outer circumferential surface of the fixing jig 8 of the fourth embodiment can be combined. is also possible.
　以上のように、実施の形態５に係る試験装置では、固定治具８は、プリント配線板４と押し付け部材とを囲む枠状に形成され、固定治具８の内周面は、プリント配線板４における搭載面とは反対側の面と、押し付け部材におけるプリント配線板４とは反対側の部分とに接触し、固定治具８の内周面のうちプリント配線板４と接触する部分８ｂは、円弧状または傾斜状に形成されている。 As described above, in the test apparatus according to the fifth embodiment, the fixing jig 8 is formed in a frame shape surrounding the printed wiring board 4 and the pressing member, and the inner peripheral surface of the fixing jig 8 is A portion 8b of the inner peripheral surface of the fixing jig 8 that contacts the surface opposite to the mounting surface of the fixing jig 8 and a portion of the pressing member opposite to the printed wiring board 4 is , is formed in an arcuate or slanted shape.
　したがって、プリント配線板４に固定治具８が取り付けられた場合と取り付けられていない場合との間で電子部品５に作用する引っ張り応力の大きさに差が無くなり、精度の高い試験が可能となる効果が得られる。 Therefore, there is no difference in the magnitude of the tensile stress acting on the electronic component 5 between when the fixing jig 8 is attached to the printed wiring board 4 and when it is not attached, making it possible to perform highly accurate testing. Effects can be obtained.
　＜実施の形態６＞
　次に、実施の形態６に係る位置決め治具１６について説明する。図１７は、実施の形態６に係る位置決め治具１６をＺ方向から視た概略図である。図１８は、実施の形態６に係る位置決め治具１６を－Ｙ方向から視た概略図である。図１９は、実施の形態６に係る位置決め治具１６を用いてセンサー６を取り付けた状態をＺ方向から視た概略図である。図２０は、実施の形態６に係る位置決め治具１６を用いてセンサー６を取り付けた状態を－Ｙ方向から視た概略図である。なお、実施の形態６において、実施の形態１～５で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 6>
Next, the positioning jig 16 according to the sixth embodiment will be explained. FIG. 17 is a schematic diagram of the positioning jig 16 according to the sixth embodiment viewed from the Z direction. FIG. 18 is a schematic diagram of the positioning jig 16 according to the sixth embodiment viewed from the -Y direction. FIG. 19 is a schematic diagram of a state in which the sensor 6 is attached using the positioning jig 16 according to the sixth embodiment, viewed from the Z direction. FIG. 20 is a schematic diagram of a state in which the sensor 6 is attached using the positioning jig 16 according to the sixth embodiment, viewed from the -Y direction. In the sixth embodiment, the same components as those explained in the first to fifth embodiments are designated by the same reference numerals, and the explanation thereof will be omitted.
　図１７～図２０に示すように、実施の形態６では、位置決め治具１６を用いてセンサー６の位置決めを行う。 As shown in FIGS. 17 to 20, in the sixth embodiment, a positioning jig 16 is used to position the sensor 6.
　まず、位置決め治具１６の構成について説明する。図１７と図１８に示すように、位置決め治具１６は、板状のベース１６ａと、２つのガイドピン１７と、２つの固定用プランジャー１８と、センサー位置決めプレート１９と、マイクロメータヘッド２０とを備えている。 First, the configuration of the positioning jig 16 will be explained. As shown in FIGS. 17 and 18, the positioning jig 16 includes a plate-shaped base 16a, two guide pins 17, two fixing plungers 18, a sensor positioning plate 19, and a micrometer head 20. It is equipped with
　ベース１６ａは、Ｚ方向から視て矩形状に形成されている。ベース１６ａにおけるＸ軸方向中央部よりも－Ｘ方向寄りには、固定治具８を位置決め治具１６にセットした際に、固定治具８と位置決め治具１６が接触しないようにするための、－Ｚ方向に凹む凹部２１が設けられている。 The base 16a is formed into a rectangular shape when viewed from the Z direction. A portion of the base 16a closer to the −X direction than the central portion in the X-axis direction is provided with a base for preventing the fixing jig 8 and the positioning jig 16 from coming into contact with each other when the fixing jig 8 is set in the positioning jig 16. - A recess 21 recessed in the Z direction is provided.
　２つのガイドピン１７は、それぞれベース１６ａにおける凹部２１を挟んでＸ軸方向両側に設けられ、プリント配線板４のＹ軸方向の位置決めを行う。２つの固定用プランジャー１８は、それぞれベース１６ａにおける２つのガイドピン１７と対向する位置に設けられ、プリント配線板４を２つのガイドピン１７に押し当てる。 The two guide pins 17 are provided on both sides of the base 16a in the X-axis direction with the recess 21 in between, and position the printed wiring board 4 in the Y-axis direction. The two fixing plungers 18 are provided at positions facing the two guide pins 17 on the base 16a, respectively, and press the printed wiring board 4 against the two guide pins 17.
　センサー位置決めプレート１９は、ベース１６ａにおける凹部２１のＸ方向の周縁部に設けられ、センサー６の位置決めを行うためにセンサー６の断面寸法に合わせた半円状の切り欠き１９ａを有している。マイクロメータヘッド２０は、本体部６ａのＸ方向端部に設けられ、プリント配線板４のＸ軸方向の位置決めを行う。 The sensor positioning plate 19 is provided at the periphery of the recess 21 in the base 16a in the X direction, and has a semicircular notch 19a that matches the cross-sectional size of the sensor 6 in order to position the sensor 6. The micrometer head 20 is provided at the end of the main body 6a in the X direction, and positions the printed wiring board 4 in the X direction.
　次に、図１９と図２０を用いて、位置決め治具１６を用いたセンサー６の位置決め方法について説明する。最初に、固定治具８を位置決め治具１６の凹部２１に配置する。その後、電子部品５を実装したプリント配線板４を位置決め治具１６上の固定治具８の内周側に形成された開口を通して配置する。このとき、凹部２１は、プリント配線板４と固定治具８とが接触せずに、位置決め治具１６のベース１６ａに対して水平（ＸＹ平面と平行）に配置が可能となる構造となっている。 Next, a method for positioning the sensor 6 using the positioning jig 16 will be described with reference to FIGS. 19 and 20. First, the fixing jig 8 is placed in the recess 21 of the positioning jig 16. Thereafter, the printed wiring board 4 on which the electronic component 5 is mounted is placed through an opening formed on the inner circumferential side of the fixing jig 8 on the positioning jig 16. At this time, the recess 21 has a structure that allows the printed wiring board 4 and the fixing jig 8 to be placed horizontally (parallel to the XY plane) with respect to the base 16a of the positioning jig 16 without coming into contact with each other. There is.
　位置決め治具１６のガイドピン１７と固定用プランジャー１８に沿って、プリント配線板４のＹ軸方向の位置を決める。Ｘ軸方向の位置調整は、プリント配線板４がマイクロメータヘッド２０に当たるところまで移動させて行われる。なお、位置決め治具１６におけるマイクロメータヘッド２０の位置は電子部品５とセンサー６の距離が所望の距離となる位置に事前に調整しておく。この状態で、センサー６をセンサー位置決めプレート１９の半円状の切り欠き１９ａに押し当ててセンサー６の位置を位置決めし、弾性部材７でセンサー６を固定する。その後、プリント配線板４を－Ｘ方向に移動させ、位置決め治具１６からプリント配線板４を取り外すことでセンサー６の位置決めと固定が完了する。 The position of the printed wiring board 4 in the Y-axis direction is determined along the guide pin 17 of the positioning jig 16 and the fixing plunger 18. Position adjustment in the X-axis direction is performed by moving the printed wiring board 4 until it hits the micrometer head 20. Note that the position of the micrometer head 20 on the positioning jig 16 is adjusted in advance to a position where the distance between the electronic component 5 and the sensor 6 is a desired distance. In this state, the sensor 6 is pressed against the semicircular notch 19a of the sensor positioning plate 19 to determine the position of the sensor 6, and the elastic member 7 fixes the sensor 6. Thereafter, the printed wiring board 4 is moved in the -X direction and removed from the positioning jig 16, thereby completing the positioning and fixing of the sensor 6.
　図７に示したように、センサー６と加振器１３との間の距離が長くなると、センサー６から出力される電圧値が低下する。従って、センサー６と電子部品５との間の距離を５ｍｍ以下になるようにセンサー６を固定する。ただし、電子部品５にセンサー６を近づければ、曲げ試験時に固定治具８が押し子治具２に接触する。 As shown in FIG. 7, as the distance between the sensor 6 and the vibrator 13 increases, the voltage value output from the sensor 6 decreases. Therefore, the sensor 6 is fixed so that the distance between the sensor 6 and the electronic component 5 is 5 mm or less. However, if the sensor 6 is brought close to the electronic component 5, the fixing jig 8 will come into contact with the pusher jig 2 during the bending test.
　しかし、図１３と図１４（ａ），（ｂ）に示すように、固定治具８の外周面のうち押し子治具２と対向する部分８ａを円弧状または傾斜状とすることで、押し子治具２に固定治具８をさらに近づけることが可能となる。ただし、上記のようにセンサー６を精度良く位置決めする必要がある。 However, as shown in FIGS. 13 and 14(a) and (b), by making the portion 8a of the outer circumferential surface of the fixing jig 8 that faces the pusher jig 2 into an arc shape or an inclined shape, it is possible to push It becomes possible to bring the fixing jig 8 even closer to the child jig 2. However, as described above, it is necessary to position the sensor 6 with high precision.
　以上のように、実施の形態６に係る試験方法では、プリント配線板４の搭載面に電子部品５を搭載し、プリント配線板４の搭載面における電子部品５の周辺にセンサー６を固定治具８と押し付け部材により固定する工程において、位置決め治具１６を用いてセンサー６をプリント配線板４に位置決めしている。 As described above, in the test method according to the sixth embodiment, the electronic component 5 is mounted on the mounting surface of the printed wiring board 4, and the sensor 6 is mounted around the electronic component 5 on the mounting surface of the printed wiring board 4 using a fixing jig. In the step of fixing the sensor 8 to the printed wiring board 4 using a pressing member, a positioning jig 16 is used to position the sensor 6 on the printed wiring board 4.
　したがって、電子部品５の周辺に精度良くセンサー６を固定することが可能となり、電子部品５の破壊に起因する振動に対応するセンサー６の出力電圧が大きく出力されるため、振動の検出感度が向上ずる。 Therefore, it is possible to fix the sensor 6 around the electronic component 5 with high precision, and the output voltage of the sensor 6 corresponding to the vibration caused by the destruction of the electronic component 5 is outputted to a large extent, so the vibration detection sensitivity is improved. Cheating.
　この開示は詳細に説明されたが、上記した説明は、すべての局面において、例示であって、限定的なものではない。例示されていない無数の変形例が、想定され得るものと解される。 Although this disclosure has been described in detail, the above description is illustrative in all aspects and is not restrictive. It is understood that countless variations not illustrated may be envisioned.
　なお、各実施の形態を自由に組み合わせたり、各実施の形態を適宜、変形、省略することが可能である。 Note that it is possible to freely combine each embodiment, or to modify or omit each embodiment as appropriate.
　２　押し子治具、３　支持台、４　プリント配線板、５　電子部品、６　センサー、７　弾性部材、８　固定治具、９　アンプ、１０　測定部、１２　ネジ、１５　帯域除去フィルタ、１６　位置決め治具。 2. Pusher jig, 3. Support stand, 4. Printed wiring board, 5. Electronic components, 6. Sensor, 7. Elastic member, 8. Fixing jig, 9. Amplifier, 10. Measuring section, 12. Screw, 15. Band rejection filter, 16. Positioning jig. .

Claims (11)

  1. 　電子部品が搭載されたプリント配線板の搭載面における両端部を支持する支持台と、
    　前記プリント配線板における前記搭載面とは反対側の面側に配置され、かつ、前記電子部品に対し前記プリント配線板を介して荷重を印加する押し子治具と、
    　前記プリント配線板の前記搭載面における前記電子部品の周辺に配置され、かつ、前記電子部品の破壊に起因する振動を検出し、前記振動に応じた電圧信号を出力するセンサーと、
    　前記センサーを前記プリント配線板に固定する固定治具と、
    　前記センサーを前記プリント配線板に押し付ける押し付け部材と、
    　前記センサーから出力された前記電圧信号の波形を測定するための測定部と、
    　を備えた、試験装置。     a support stand that supports both ends of a mounting surface of a printed wiring board on which electronic components are mounted;
    a pusher jig disposed on a side of the printed wiring board opposite to the mounting surface and applying a load to the electronic component via the printed wiring board;
    a sensor disposed around the electronic component on the mounting surface of the printed wiring board that detects vibrations caused by destruction of the electronic component and outputs a voltage signal in accordance with the vibration;
    a fixing jig for fixing the sensor to the printed wiring board;
    a pressing member that presses the sensor against the printed wiring board;
    a measurement unit for measuring the waveform of the voltage signal output from the sensor;
    Test equipment equipped with
  2. 　前記センサーから出力された前記電圧信号を増幅するアンプをさらに備え、
    　前記測定部は、前記アンプにより増幅された前記電圧信号の波形を測定する、請求項１に記載の試験装置。     further comprising an amplifier that amplifies the voltage signal output from the sensor,
    The test device according to claim 1, wherein the measurement section measures the waveform of the voltage signal amplified by the amplifier.
  3. 　前記押し付け部材は弾性部材を含む、請求項１または請求項２に記載の試験装置。 The test device according to claim 1 or 2, wherein the pressing member includes an elastic member.
  4. 　前記押し付け部材はボルトまたはネジを含む、請求項１または請求項２に記載の試験装置。 The testing device according to claim 1 or 2, wherein the pressing member includes a bolt or a screw.
  5. 　前記センサーと前記測定部との間に配置された帯域除去フィルタをさらに備えた、請求項１から請求項４のいずれか１項に記載の試験装置。 The test device according to any one of claims 1 to 4, further comprising a band-rejection filter disposed between the sensor and the measuring section.
  6. 　前記センサーを前記プリント配線板に押し付ける押し付け力は、０.４ｋｇ／ｃｍ2以上である、請求項１から請求項５のいずれか１項に記載の試験装置。 The test device according to any one of claims 1 to 5, wherein a pressing force for pressing the sensor against the printed wiring board is 0.4 kg/cm 2 or more.
  7. 　前記センサーから前記電子部品までの距離は５ｍｍ以下である、請求項１から請求項６のいずれか１項に記載の試験装置。 The test device according to any one of claims 1 to 6, wherein the distance from the sensor to the electronic component is 5 mm or less.
  8. 　前記固定治具は、前記プリント配線板と前記押し付け部材とを囲む枠状に形成され、
    　前記固定治具の内周面は、前記プリント配線板における前記搭載面とは反対側の面と、前記押し付け部材における前記プリント配線板とは反対側の部分とに接触し、
    　前記固定治具の外周面のうち前記押し子治具と対向する部分は、円弧状または傾斜状に形成されている、請求項１から請求項７のいずれか１項に記載の試験装置。     The fixing jig is formed in a frame shape surrounding the printed wiring board and the pressing member,
    The inner circumferential surface of the fixing jig contacts a surface of the printed wiring board opposite to the mounting surface and a portion of the pressing member opposite to the printed wiring board,
    The test device according to any one of claims 1 to 7, wherein a portion of the outer circumferential surface of the fixing jig that faces the pusher jig is formed in an arc shape or an inclined shape.
  9. 　前記固定治具は、前記プリント配線板と前記押し付け部材とを囲む枠状に形成され、
    　前記固定治具の内周面は、前記プリント配線板における前記搭載面とは反対側の面と、前記押し付け部材における前記プリント配線板とは反対側の部分とに接触し、
    　前記固定治具の前記内周面のうち前記プリント配線板と接触する部分は、円弧状または傾斜状に形成されている、請求項１から請求項８のいずれか１項に記載の試験装置。     The fixing jig is formed in a frame shape surrounding the printed wiring board and the pressing member,
    The inner circumferential surface of the fixing jig contacts a surface of the printed wiring board opposite to the mounting surface and a portion of the pressing member opposite to the printed wiring board,
    The test device according to any one of claims 1 to 8, wherein a portion of the inner circumferential surface of the fixing jig that contacts the printed wiring board is formed in an arc shape or an inclined shape.
  10. 　請求項１から請求項９のいずれか１項に記載の試験装置を用いた試験方法であって、
    　（ａ）前記プリント配線板の前記搭載面に前記電子部品を搭載し、前記プリント配線板の前記搭載面における前記電子部品の周辺に前記センサーを前記固定治具と前記押し付け部材により固定する工程と、
    　（ｂ）前記電子部品が下側に位置するように前記プリント配線板を前記支持台上に載置する工程と、
    　（ｃ）前記押し子治具を下降させて前記プリント配線板における前記搭載面とは反対側の面に接触させる工程と、
    　（ｄ）前記押し子治具をさらに下降させて、前記押し子治具が前記プリント配線板の上面に接触したときの位置である基準位置から前記プリント配線板に荷重を印加する工程と、
    　（ｅ）前記プリント配線板が曲がることで前記電子部品が破壊され、前記測定部により測定された前記電圧信号の波形が予め設定された閾値を超えたとき、前記基準位置からの前記押し子治具の押し込み寸法を前記電子部品の限界値とする、試験方法。     A test method using the test device according to any one of claims 1 to 9,
    (a) mounting the electronic component on the mounting surface of the printed wiring board, and fixing the sensor around the electronic component on the mounting surface of the printed wiring board using the fixing jig and the pressing member; ,
    (b) placing the printed wiring board on the support base so that the electronic component is located on the lower side;
    (c) lowering the pusher jig to contact a surface of the printed wiring board opposite to the mounting surface;
    (d) further lowering the pusher jig to apply a load to the printed wiring board from a reference position, which is the position when the pusher jig contacts the top surface of the printed wiring board;
    (e) When the electronic component is destroyed due to bending of the printed wiring board and the waveform of the voltage signal measured by the measurement unit exceeds a preset threshold, the pusher is removed from the reference position. A test method in which the indentation dimension of the tool is set as the limit value of the electronic component.
  11. 　前記工程（ａ）において、位置決め治具を用いて前記センサーを前記プリント配線板に位置決めする、請求項１０に記載の試験方法。 The test method according to claim 10, wherein in the step (a), the sensor is positioned on the printed wiring board using a positioning jig.
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CN117782848A (en) * 2024-02-23 2024-03-29 梨树全创科技有限公司 Circuit board bending performance testing device and testing method thereof

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JPH03146843A (en) * 1989-10-31 1991-06-21 Murata Mfg Co Ltd Impact fracture test method for electronic parts
JPH11230878A (en) * 1998-02-10 1999-08-27 Sumitomo Electric Ind Ltd Method and device for testing resistance of substrate to bending of surface-mount component
JP2020041885A (en) * 2018-09-10 2020-03-19 株式会社ディスコ Chip destruction unit and method for comparing chip strength
JP2021025786A (en) * 2019-07-31 2021-02-22 株式会社村田製作所 Method for testing anti-printed board bendability of surface-mount component and device for testing anti-printed board bendability of surface-mount component

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JPH03146843A (en) * 1989-10-31 1991-06-21 Murata Mfg Co Ltd Impact fracture test method for electronic parts
JPH11230878A (en) * 1998-02-10 1999-08-27 Sumitomo Electric Ind Ltd Method and device for testing resistance of substrate to bending of surface-mount component
JP2020041885A (en) * 2018-09-10 2020-03-19 株式会社ディスコ Chip destruction unit and method for comparing chip strength
JP2021025786A (en) * 2019-07-31 2021-02-22 株式会社村田製作所 Method for testing anti-printed board bendability of surface-mount component and device for testing anti-printed board bendability of surface-mount component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117782848A (en) * 2024-02-23 2024-03-29 梨树全创科技有限公司 Circuit board bending performance testing device and testing method thereof
CN117782848B (en) * 2024-02-23 2024-05-14 梨树全创科技有限公司 Circuit board bending performance testing device and testing method thereof

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