CN117782848A - Circuit board bending performance testing device and testing method thereof - Google Patents
Circuit board bending performance testing device and testing method thereof Download PDFInfo
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- CN117782848A CN117782848A CN202410199195.0A CN202410199195A CN117782848A CN 117782848 A CN117782848 A CN 117782848A CN 202410199195 A CN202410199195 A CN 202410199195A CN 117782848 A CN117782848 A CN 117782848A
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- 238000005452 bending Methods 0.000 title claims abstract description 71
- 238000012360 testing method Methods 0.000 title claims abstract description 33
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000006073 displacement reaction Methods 0.000 claims description 42
- 238000003825 pressing Methods 0.000 claims description 31
- 230000006835 compression Effects 0.000 claims 2
- 238000007906 compression Methods 0.000 claims 2
- 238000011056 performance test Methods 0.000 claims 1
- 238000010998 test method Methods 0.000 claims 1
- 230000035882 stress Effects 0.000 description 26
- 230000006978 adaptation Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
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Abstract
The invention discloses a device and a method for testing bending performance of a circuit board, which relate to the technical field of circuit board testing equipment, the circuit board comprises a base and a circuit board body, wherein a supporting plate is arranged at the top of the base, and a positioning plate is arranged at one side of the top of the supporting plate; after the fixed point, the stress point and the bending fulcrum are determined, the stress point on the circuit board body is pressed by the press roller, and after the press roller is pressed down to a certain distance, the circuit board body is bent, so that the bending performance of the circuit board is detected; the invention can accurately measure the stress point, the pivot and the pressure, improves the accuracy of the circuit board body during bending detection, and can conveniently and intuitively clearly display and compare the bending condition and the bending performance detection result of the circuit board when the positions of the stress point and the pivot are changed by displaying the detection data and the result in a function chart mode.
Description
Technical Field
The invention relates to the technical field of circuit board testing equipment, in particular to a circuit board bending performance testing device and a testing method thereof.
Background
In modern electronics manufacturing today, printed circuit boards are an integral part, and surface mounting and through-hole mounting of electronic packages have become the primary means of high density electronic device packaging, but they also present challenges for mechanical reliability, and the use of high density component packages and complex layouts may lead to PCBs being subjected to mechanical and thermal stresses during assembly, thereby increasing the risk of failure. As a result, understanding the mechanical reliability of the finished PCB becomes particularly important, and performing mechanical reliability tests on the finished PCB typically includes bending strength tests: the circuit board is typically bent to an angle at which the bending strength of the circuit board is measured, which ensures that the circuit board is not damaged during use due to insufficient mechanical strength.
The existing circuit board bending performance testing device has the following defects when in use:
firstly, the stress point of the circuit board during bending cannot be flexibly and accurately adjusted, so that the adjustment is inconvenient according to the size of the circuit board, and the applicability is low;
secondly, when bending performance is tested, the position of the stress point is inconvenient to adjust, the existing method generally collects the pressure value received by the circuit board in a state of being bent by a certain angle as an index for testing the bending performance, but under the condition that the bending angles of the circuit board are the same, the position change of the stress point and the supporting point also affects the corresponding required pressure value, so that the comprehensiveness and the accuracy of testing are reduced, and especially when the bending resistance difference between two or more groups of circuit boards is needed to be compared and known through testing, the accuracy and the fairness of the comparison result are easy to be affected, so that the circuit board bending performance testing device and the circuit board bending performance testing method are needed to be provided.
Disclosure of Invention
The invention aims to provide a circuit board bending performance testing device and a testing method thereof, which have the advantages of being applicable to circuit board tests with various sizes, enabling test data and test results to be more accurate, enabling the test results to be intuitively and conveniently compared, and solving the problems in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the device comprises a base and a circuit board body, wherein a supporting plate is arranged at the top of the base, a positioning plate is arranged on one side of the top of the supporting plate, a supporting component for clamping and fixing the circuit board body is arranged at the top of the positioning plate, and one end of the circuit board body is inserted into the supporting component;
a first adjusting component for adjusting the bending pivot of the circuit board body is arranged on one side of the supporting component, the first adjusting component is positioned below the circuit board body, and the top of the first adjusting component is in sliding fit with the bottom of the circuit board body;
a pressing component for providing power for bending of the circuit board body is arranged above the other end of the circuit board body, and a contact point of the circuit board body and the pressing component is a stress point of the circuit board body;
the vertical plates are arranged in front of and behind the pressing component, a second adjusting component used for flexibly adjusting the position of the stress point is arranged in the supporting plate, and the bottoms of the vertical plates are connected with the top of the second adjusting component;
the bottom of first adjusting part installs first displacement sensor, the inboard of riser just is located the below of first displacement sensor and installs second displacement sensor, the surface mounting of locating plate has the first locating target with first displacement sensor and second displacement sensor looks adaptation.
Preferably, the support assembly comprises a support seat, the support seat is arranged at the top of the positioning plate, a groove is formed in one side, close to the circuit board body, of the support seat, and one end of the circuit board body extends to the inside of the groove.
Preferably, the top threaded connection of supporting seat has first lead screw, the bottom of first lead screw extends to the inside of recess and rotates and install the clamp plate, the bottom of clamp plate is laminated with the top of circuit board body.
Preferably, the first adjusting component comprises a supporting block, the top of the supporting block is provided with an arc surface and is attached to the bottom of the circuit board body, one side of the supporting block is rotatably provided with a second screw rod, one end of the second screw rod penetrates through the supporting seat and extends to the outside of the supporting seat, the surface of second lead screw and the inside threaded connection of supporting seat, the gag lever post is installed to one side of supporting shoe, the one end of gag lever post slides and runs through the supporting seat and extend to the outside of supporting seat, first displacement sensor installs in the bottom of supporting shoe.
Preferably, the pushing component comprises a mounting seat arranged at the top of the inner side of the vertical plate, an electric cylinder is arranged at the bottom of the mounting seat, a support is arranged at the power output end of the electric cylinder, a pressure sensor for measuring a pressure value is arranged between the support and the power output end of the electric cylinder, a pressing roller is rotatably arranged at the bottom of the support, and the pressing roller is located above the circuit board body.
Preferably, the second adjusting component comprises a first through groove which is formed in the supporting plate and corresponds to the vertical plate, a sliding rod is mounted in the first through groove, a sliding sleeve is sleeved on the surface of the sliding rod in a sliding mode, a second through groove which is matched with the vertical plate is formed in the top of the supporting plate, and the bottom of the vertical plate penetrates through the second through groove in a sliding mode and is connected with the top of the sliding sleeve.
Preferably, the fixed block is installed to one side of riser, the inside threaded connection of fixed block has the screw rod, the bottom of screw rod is laminated with the top of backup pad.
Preferably, a third displacement sensor is installed at the top of the support, and a second positioning target matched with the third displacement sensor is installed at the bottom of the installation seat.
Preferably, the supporting table is installed at the top of base and is located one side of keeping away from the locating plate, accomodate the groove has been seted up at the top of supporting table, accomodate the inside in groove and articulate there is the display, the controller is installed at the top of base and the below that is located the supporting table, controller and electric cylinder electric connection.
A testing method of a circuit board bending performance testing device comprises the following steps:
s1, measuring the length of a circuit board to be tested, and marking the length as L1;
the point position of one fixed end of the circuit board is marked as L2 when bending detection is set on the circuit board;
setting a point position of a bending fulcrum of the circuit board during bending detection on the circuit board, and marking the point position as L3;
setting a point position of an initial stress point of the circuit board during bending detection on the circuit board, and marking the point position as L4;
s2, fixing one end, namely a point location L2, of the circuit board to be detected through the supporting component; moving and fixing the support block at the bottom of the point location L3 by moving the first adjusting component; the pressing component is moved to the top of the supporting point position L4 through the second adjusting component;
s3, pressing down a point location L4 on the circuit board by starting the pressing down assembly, bending the circuit board after the circuit board is subjected to pressure, measuring the pressure M generated when the pressing down assembly is pressed down by a sensor, measuring the displacement distance D when the pressing roller is pressed down by the sensor, and summing the initial stress point location L4 and the displacement distance D to obtain a final stress point location L5;
s4, setting three points L2, L3 and L5 into a function chart, after connection, forming a function curve N for simulating the bending trend of the circuit board;
s5, adjusting the positions of the L3 and the L4, keeping the pressure M unchanged, repeating the steps S3 and S4, correspondingly changing the numerical values and the positions of the D and the L5, recording the changed D and L5, drawing a new function curve NX according to a change result, and comparing the function curve N with the function curve NX in a function chart to obtain an intuitive expression result affecting the bending trend of the circuit board.
Compared with the prior art, the invention has the beneficial effects that:
after the fixed point, the stress point and the bending fulcrum are determined, the press roller presses the stress point on the circuit board body, and after the press roller is pressed down to a certain distance, the circuit board body is bent. The pressure sensor can detect the pressure applied by the electric cylinder, the circuit board body is detected for a plurality of times, and the bending performance data of the circuit board can be obtained accurately through a plurality of times of detection data, so that the bending performance detection of the circuit board is completed.
The invention can accurately measure the stress point, the pivot and the pressure, improves the accuracy of the circuit board body during bending detection, and can conveniently and intuitively clearly display and compare the bending condition and the bending performance detection result of the circuit board when the positions of the stress point and the pivot are changed by displaying the detection data and the result in a function chart mode.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic side view of the support base of the present invention;
FIG. 3 is a schematic side view of the bracket of the present invention;
FIG. 4 is a schematic cross-sectional view of a first through slot of the present invention;
FIG. 5 is a partial cross-sectional view of a support plate of the present invention;
fig. 6 is a schematic structural view of the display in the storage state of the invention.
In the figure: 1. a base; 2. a circuit board body; 3. a support plate; 4. a positioning plate; 5. a riser; 6. a first displacement sensor; 7. a second displacement sensor; 8. a first positioning target; 9. a support base; 10. a first screw rod; 11. a pressing plate; 12. a support block; 13. a second screw rod; 14. a limit rod; 15. a mounting base; 16. an electric cylinder; 17. a bracket; 18. a pressure sensor; 19. a press roller; 20. a first through groove; 21. a slide bar; 22. a sliding sleeve; 23. a second through slot; 24. a fixed block; 25. a screw; 26. a third displacement sensor; 27. a second positioning target; 28. a support table; 29. a display; 30. and a controller.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-3, the present invention provides a technical solution: the device comprises a base 1 and a circuit board body 2, wherein a supporting plate 3 is arranged at the top of the base 1, a positioning plate 4 is arranged on one side of the top of the supporting plate 3, a supporting component for clamping and fixing the circuit board body 2 is arranged at the top of the positioning plate 4, and one end of the circuit board body 2 is inserted into the supporting component; the supporting component comprises a supporting seat 9, the supporting seat 9 is arranged at the top of the positioning plate 4, one side of the supporting seat 9, which is close to the circuit board body 2, is provided with a groove, and one end of the circuit board body 2 extends to the inside of the groove. Through setting up the recess, the inside at the recess is placed to the one end of circuit board body 2, can support through the recess to the one end of circuit board body 2.
Specifically, the top threaded connection of supporting seat 9 has first lead screw 10, and the bottom of first lead screw 10 extends to the inside of recess and rotates and install clamp plate 11, and clamp plate 11's bottom is laminated with circuit board body 2's top. Through rotating first lead screw 10, drive clamp plate 11 and remove when first lead screw 10 rotates, clamp plate 11 compresses tightly circuit board body 2 when removing, and the bearing of cooperation recess can be fixed circuit board body 2, provides stable environment for the bending detection of circuit board body 2.
Further, a first adjusting component for adjusting the bending pivot of the circuit board body 2 is arranged on one side of the supporting component, the first adjusting component is positioned below the circuit board body 2, and the top of the first adjusting component is in sliding fit with the bottom of the circuit board body 2; the first adjusting part comprises a supporting block 12, the top of the supporting block 12 is provided with an arc surface and is attached to the bottom of the circuit board body 2, one side of the supporting block 12 is rotatably provided with a second screw rod 13, one end of the second screw rod 13 penetrates through the supporting seat 9 and extends to the outside of the supporting seat 9, the surface of the second screw rod 13 is in threaded connection with the inside of the supporting seat 9, one side of the supporting block 12 is provided with a limiting rod 14, one end of the limiting rod 14 penetrates through the supporting seat 9 in a sliding mode and extends to the outside of the supporting seat 9, and the first displacement sensor 6 is arranged at the bottom of the supporting block 12. By rotating the second screw rod 13, the second screw rod 13 can drive the supporting block 12 to move while rotating, and the bending supporting point of the circuit board body 2 can be adjusted and determined by the supporting block 12 to move.
The support block 12 moves and drives the limiting rod 14 to slide in the support seat 9, so that the moving track of the support block 12 can be limited.
Specifically, a pressing component for providing power for bending of the circuit board body 2 is arranged above the other end of the circuit board body 2, and a contact point between the circuit board body 2 and the pressing component is a stress point of the circuit board body 2; the pushing component comprises a mounting seat 15 mounted at the top of the inner side of the vertical plate 5, an electric cylinder 16 is mounted at the bottom of the mounting seat 15, a support 17 is arranged at the power output end of the electric cylinder 16, a pressure sensor 18 for measuring pressure values is mounted between the support 17 and the power output end of the electric cylinder 16, a pressing roller 19 is rotatably mounted at the bottom of the support 17, the pressing roller 19 is located above the circuit board body 2, and abrasion of the circuit board body 2 can be reduced by the rotating pressing roller 19.
Referring to fig. 1, 4 and 5, further, risers 5 are installed at the front and rear of the pressing component, a second adjusting component for flexibly adjusting the position of the stress point is installed in the supporting plate 3, and the bottom of each riser 5 is connected with the top of each second adjusting component; the second adjusting component comprises a first through groove 20 which is formed in the supporting plate 3 and corresponds to the vertical plate 5, a sliding rod 21 is arranged in the first through groove 20, a sliding sleeve 22 is sleeved on the surface of the sliding rod 21 in a sliding mode, a second through groove 23 which is matched with the vertical plate 5 is formed in the top of the supporting plate 3, and the bottom of the vertical plate 5 penetrates through the second through groove 23 in a sliding mode and is connected with the top of the sliding sleeve 22. By providing the second through slots 23, it is possible to facilitate sliding of the risers 5 inside the support plate 3.
By moving the vertical plate 5, the movement of the vertical plate 5 can drive the positions of the electric cylinder 16 and the press roller 19 to be adjusted, so that the stress points on the circuit board body 2 are adjusted and determined.
In addition, a fixed block 24 is installed on one side of the vertical plate 5, a screw 25 is connected to the internal thread of the fixed block 24, and the bottom of the screw 25 is attached to the top of the supporting plate 3. After the position of the stress point is determined, the bottom of the screw 25 is attached to the top of the support plate 3 by rotating the screw 25, and the position of the riser 5 can be defined by the friction between the screw 25 and the support plate 3, so that the stress point is prevented from being laterally offset.
After the fixed point, the stress point and the bending fulcrum are all determined, the power output end of the electric cylinder 16 drives the press roller 19 to move through the bracket 17 by starting the electric cylinder 16, the press roller 19 presses the stress point on the circuit board body 2, and after the press roller 19 is pressed down to a certain distance, the circuit board body 2 is bent. The pressure applied by the electric cylinder 16 can be detected by the pressure sensor 18, the circuit board body 2 is detected for a plurality of times by the method, and the bending performance data of the circuit board can be obtained accurately by detecting the data for a plurality of times, so that the bending performance detection of the circuit board is completed.
Noteworthy are: the first displacement sensor 6 is installed to the bottom of first regulation subassembly, and the inboard of riser 5 just is located the below of first displacement sensor 6 and installs second displacement sensor 7, and the surface mounting of locating plate 4 has the first locating target 8 with first displacement sensor 6 and second displacement sensor 7 looks adaptation, and third displacement sensor 26 is installed at the top of support 17, and the second locating target 27 with third displacement sensor 26 looks adaptation is installed to the bottom of mount pad 15. By providing the first displacement sensor 6, the first displacement sensor 6 can measure the position movement distance of the support block 12 and the bending fulcrum. By providing the second displacement sensor 7, the displacement distance of the pressing roller 19, that is, the stress point on the circuit board body 2 can be measured. By arranging the third displacement sensor 26, the bracket 17 drives the third displacement sensor 26 to move at the corresponding position while descending, so that the downward movement distance of the stress point can be measured.
Referring to fig. 1 and 6, in addition, a supporting table 28 is mounted on a side of the top of the base 1 away from the positioning plate 4, a receiving slot is formed at the top of the supporting table 28, and a display 29 is hinged inside the receiving slot. A controller 30 is mounted on the top of the base 1 and below the support table 28, and the controller 30 is electrically connected with the electric cylinder 16. The data measured by the first displacement sensor 6, the second displacement sensor 7, the third displacement sensor 26 and the pressure sensor 18 can be displayed on the display 29 by an information processor. By providing controller 30, it can be used to control electric cylinder 16. By providing the recess, the display 29 can be conveniently stored.
Through the data of above-mentioned structure measurement and demonstration, can be accurate measure stress point, fulcrum and pressure, improve the accuracy of circuit board body 2 when carrying out the bending detection.
A testing method of a circuit board bending performance testing device comprises the following steps:
s1, measuring the length of a circuit board to be tested, and marking the length as L1;
the point position of one fixed end of the circuit board is marked as L2 when bending detection is set on the circuit board;
setting a point position of a bending fulcrum of the circuit board during bending detection on the circuit board, and marking the point position as L3;
setting a point position of an initial stress point of the circuit board during bending detection on the circuit board, and marking the point position as L4;
s2, fixing one end, namely a point location L2, of the circuit board to be detected through the supporting component; moving and fixing the support block at the bottom of the point location L3 by moving the first adjusting component; the pressing component is moved to the top of the supporting point position L4 through the second adjusting component;
s3, pressing down a point location L4 on the circuit board by starting the pressing down assembly, bending the circuit board after the circuit board is subjected to pressure, measuring the pressure M generated when the pressing down assembly is pressed down by a sensor, measuring the displacement distance D when the pressing roller is pressed down by the sensor, and summing the initial stress point location L4 and the displacement distance D to obtain a final stress point location L5;
s4, setting three points L2, L3 and L5 into a function chart, and forming a function curve N after connection, wherein the function curve N is used for simulating the bending trend of the circuit board;
s5, adjusting the positions of the L3 and the L4, keeping the pressure M unchanged, repeating the steps S3 and S4, correspondingly changing the numerical values and the positions of the D and the L5, recording the changed D and L5, drawing a new function curve NX according to a change result, and comparing the function curve N with the function curve NX in a function chart to obtain an intuitive expression result affecting the bending trend of the circuit board.
The detection data and the result are displayed in a function chart mode, so that the bending condition and the bending performance detection result of the circuit board can be displayed and compared intuitively when the positions of the stress points and the fulcrums are changed conveniently.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a circuit board bending property testing arrangement, includes base (1) and circuit board body (2), its characterized in that: the device is characterized in that a supporting plate (3) is arranged at the top of the base (1), a positioning plate (4) is arranged on one side of the top of the supporting plate (3), a supporting component used for clamping and fixing the circuit board body (2) is arranged at the top of the positioning plate (4), and one end of the circuit board body (2) is inserted into the supporting component;
a first adjusting component for adjusting the bending pivot of the circuit board body (2) is arranged on one side of the supporting component, the first adjusting component is positioned below the circuit board body (2), and the top of the first adjusting component is in sliding fit with the bottom of the circuit board body (2);
a pressing component for providing power for bending of the circuit board body (2) is arranged above the other end of the circuit board body (2), and a contact point of the circuit board body (2) and the pressing component is a stress point of the circuit board body (2);
the vertical plates (5) are arranged in front of and behind the pressing component, a second adjusting component used for flexibly adjusting the position of the stress point is arranged in the supporting plate (3), and the bottom of the vertical plate (5) is connected with the top of the second adjusting component;
the bottom of the first adjusting component is provided with a first displacement sensor (6), the inner side of the vertical plate (5) is provided with a second displacement sensor (7) positioned below the first displacement sensor (6), and the surface of the positioning plate (4) is provided with a first positioning target (8) which is matched with the first displacement sensor (6) and the second displacement sensor (7);
the supporting assembly comprises a supporting seat (9), the supporting seat (9) is arranged at the top of the positioning plate (4), a groove is formed in one side, close to the circuit board body (2), of the supporting seat (9), and one end of the circuit board body (2) extends to the inside of the groove;
the first adjusting component comprises a supporting block (12), the top of the supporting block (12) is provided with an arc surface and is attached to the bottom of the circuit board body (2), one side of the supporting block (12) is rotatably provided with a second screw rod (13), one end of the second screw rod (13) penetrates through the supporting seat (9) and extends to the outside of the supporting seat (9), the surface of the second screw rod (13) is in threaded connection with the inside of the supporting seat (9), one side of the supporting block (12) is provided with a limiting rod (14), one end of the limiting rod (14) penetrates through the supporting seat (9) in a sliding mode and extends to the outside of the supporting seat (9), and the first displacement sensor (6) is arranged at the bottom of the supporting block (12);
the second adjusting component comprises a first through groove (20) which is formed in the supporting plate (3) and corresponds to the vertical plate (5), a sliding rod (21) is arranged in the first through groove (20), a sliding sleeve (22) is sleeved on the surface of the sliding rod (21) in a sliding mode, a second through groove (23) which is matched with the vertical plate (5) is formed in the top of the supporting plate (3), and the bottom of the vertical plate (5) penetrates through the second through groove (23) in a sliding mode and is connected with the top of the sliding sleeve (22).
2. The device for testing bending performance of a circuit board according to claim 1, wherein: the top threaded connection of supporting seat (9) has first lead screw (10), the inside of recess is extended to the bottom of first lead screw (10) rotates and installs clamp plate (11), the bottom of clamp plate (11) is laminated with the top of circuit board body (2).
3. The device for testing bending performance of a circuit board according to claim 2, wherein: the utility model discloses a circuit board body, including riser (5) inboard top, push down subassembly is including installing mount pad (15) at riser (5) inboard top, electronic jar (16) are installed to the bottom of mount pad (15), the power take off end of electronic jar (16) is provided with support (17), install between the power take off end of support (17) and electronic jar (16) and be used for measuring pressure sensor (18) of pressure value, compression roller (19) are installed in the bottom rotation of support (17), compression roller (19) are located the top of circuit board body (2).
4. A circuit board bending property testing device according to claim 3, wherein: one side of the vertical plate (5) is provided with a fixed block (24), the inside thread of the fixed block (24) is connected with a screw rod (25), and the bottom of the screw rod (25) is attached to the top of the supporting plate (3).
5. The device and the method for testing bending performance of a circuit board according to claim 4 are characterized in that: a third displacement sensor (26) is arranged at the top of the bracket (17), and a second positioning target (27) matched with the third displacement sensor (26) is arranged at the bottom of the mounting seat (15).
6. The device for testing bending performance of a circuit board according to claim 5, wherein: the utility model discloses a motor vehicle seat, including base (1), locating plate (4) and support platform (28) are installed to one side that just is located to keep away from the top of base (1), accomodate the groove has been seted up at the top of support platform (28), accomodate the inside in groove and articulate there is display (29), controller (30) are installed at the top of base (1) and the below that is located support platform (28), controller (30) and electric cylinder (16) electric connection.
7. A test method applied to the circuit board bending performance test device according to any one of claims 1 to 6, characterized in that: the method comprises the following steps:
s1, measuring the length of a circuit board to be tested, and marking the length as L1;
the point position of one fixed end of the circuit board is marked as L2 when bending detection is set on the circuit board;
setting a point position of a bending fulcrum of the circuit board during bending detection on the circuit board, and marking the point position as L3;
setting a point position of an initial stress point of the circuit board during bending detection on the circuit board, and marking the point position as L4;
s2, fixing one end, namely a point location L2, of the circuit board to be detected through the supporting component; moving and fixing the support block at the bottom of the point location L3 by moving the first adjusting component; the pressing component is moved to the top of the supporting point position L4 through the second adjusting component;
s3, pressing down a point location L4 on the circuit board by starting the pressing down assembly, bending the circuit board after the circuit board is subjected to pressure, measuring the pressure M generated when the pressing down assembly is pressed down by a sensor, measuring the displacement distance D when the pressing roller is pressed down by the sensor, and summing the initial stress point location L4 and the displacement distance D to obtain a final stress point location L5;
s4, setting three points L2, L3 and L5 into a function chart, and forming a function curve N after connection, wherein the function curve N is used for simulating the bending trend of the circuit board;
s5, adjusting the positions of the L3 and the L4, keeping the pressure M unchanged, repeating the steps S3 and S4, correspondingly changing the numerical values and the positions of the D and the L5, recording the changed D and L5, drawing a new function curve NX according to a change result, and comparing the function curve N with the function curve NX in a function chart to obtain an intuitive expression result affecting the bending trend of the circuit board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410199195.0A CN117782848B (en) | 2024-02-23 | 2024-02-23 | Circuit board bending performance testing device and testing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410199195.0A CN117782848B (en) | 2024-02-23 | 2024-02-23 | Circuit board bending performance testing device and testing method thereof |
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| CN117782848B CN117782848B (en) | 2024-05-14 |
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| CN218271707U (en) * | 2022-08-03 | 2023-01-10 | 济南华冠智能电器有限公司 | Check out test set is used in circuit board production |
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| CN220271047U (en) * | 2023-07-13 | 2023-12-29 | 梅州市格兰沃电子有限公司 | Circuit board bending performance testing device |
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| CN117782848B (en) | 2024-05-14 |
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