WO2023173471A1 - 一种组合式蒸发器均温板及其加工方法 - Google Patents

一种组合式蒸发器均温板及其加工方法 Download PDF

Info

Publication number
WO2023173471A1
WO2023173471A1 PCT/CN2022/083298 CN2022083298W WO2023173471A1 WO 2023173471 A1 WO2023173471 A1 WO 2023173471A1 CN 2022083298 W CN2022083298 W CN 2022083298W WO 2023173471 A1 WO2023173471 A1 WO 2023173471A1
Authority
WO
WIPO (PCT)
Prior art keywords
evaporator
lower cover
combined
cover plate
capillary structure
Prior art date
Application number
PCT/CN2022/083298
Other languages
English (en)
French (fr)
Inventor
张于光
Original Assignee
联德电子科技(常熟)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 联德电子科技(常熟)有限公司 filed Critical 联德电子科技(常熟)有限公司
Publication of WO2023173471A1 publication Critical patent/WO2023173471A1/zh

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • the invention relates to the field of vapor chamber design and processing, and in particular to a combined evaporator vapor chamber and a processing method thereof.
  • the vapor chamber transfers heat through the vapor and liquid phase changes of the circulating medium in a fully enclosed vacuum chamber.
  • the thermal conductivity can be up to hundreds of times that of pure copper. Therefore, in It is widely used in electronics, communications, automobiles, lighting and other industries.
  • the main structure of the vapor chamber consists of five parts: upper plate, lower plate, capillary structure, support structure and phase change medium.
  • the combination of the lower plate and the capillary structure plays the role of returning liquid to the evaporation zone
  • the combination of the lower plate and the support structure serves as the frame of the cavity
  • the combination of the lower plate and the upper plate forms an airtight cavity.
  • the lower plate is the component that is in direct contact with the heat source, and the area where the heat source is facing the inside of the cavity is called the evaporation zone.
  • the evaporation zone pattern within a heat flux density of 25w/cm2 is a two-dimensional planar type, that is, a planar capillary structure and a planar lower plate cavity plane.
  • a three-dimensional evaporation zone structure that is, an evaporator composed of a three-dimensional capillary structure and a lower plate with an enlarged inner cavity three-dimensional structure.
  • evaporator lower plates There are two common methods for evaporator lower plates corresponding to high heat flux densities.
  • One is integrated CNC (computer numerical control) processing or forging, and the other is a flat sheet metal lower plate and the support structure through prefabricated brazing (or Prefabricated diffusion welding) process.
  • the evaporator lower plate made by these two methods has shortcomings such as high contact resistance, poor heat transfer effect, high processing cost, high mold cost, low production capacity and low yield.
  • the object of the present invention is to provide a combined evaporator vapor chamber and a processing method thereof that are less difficult to process and use less material.
  • a combined evaporator uniform temperature plate including an upper cover plate, a lower cover plate, an evaporator, a capillary structure and a support structure.
  • the lower cover plate is provided with a heat source contact area corresponding to the heat source contact area.
  • Installation port the evaporator is combined and connected with the lower cover at the installation port, the upper cover, the lower cover and the evaporator jointly form a chamber, the capillary structure and the support structure are arranged on the In the chamber, a phase change medium is injected into the chamber.
  • the lower cover plate is provided with a downwardly bent extension on the peripheral side of the installation opening, a boss is provided on the peripheral side of the evaporator, and a groove is provided on the upper surface of the boss.
  • the groove matches the extension, the upper surface of the boss contacts and fits with the outer lower surface of the lower cover, and the outer surface of the boss is welded to the lower cover.
  • the extension length of the extension part is 0.5 mm ⁇ 3 mm
  • the outer side of the groove is 0.1 mm ⁇ 0.5 mm away from the outer wall of the extension part
  • the bottom of the groove is 0.1 mm away from the extension part. ⁇ 0.5mm.
  • the boss is provided with an annular convex rib, the convex rib is located inside the groove, the convex rib is inclined outward from the root, and the top end of the convex rib contacts the extension part.
  • the capillary structure includes an upper capillary structure covering the lower surface of the upper cover, a lower capillary structure covering the upper surface of the lower cover, and an evaporator capillary covering the surface of the evaporator.
  • structure, the lower capillary structure and the evaporator capillary structure are made integrally.
  • the evaporator is provided with a support portion, and the support portion is integrally connected to the bottom of the evaporator.
  • the support structure is a capillary support structure, and the capillary support structure contacts the upper capillary structure and the lower capillary structure.
  • a method for processing a combined evaporator vapor plate which includes the following steps:
  • the capillary structure is sintered on the lower surface of the upper cover, the upper surface of the lower cover, and the surface of the evaporator;
  • a support structure is provided between the upper cover and the lower cover
  • the chamber is degassed, phase change medium is injected and sealed.
  • the combined connection of the lower cover plate and the evaporator includes:
  • the combined connection of the lower cover plate and the evaporator further includes: using a fastening mold to deform and engage the convex ribs on the evaporator outward, so that the tops of the convex ribs contact the inside of the extension of the lower cover plate.
  • the capillary structure on the upper surface of the lower cover plate and the capillary structure on the upper surface of the evaporator are filled with powder and sintered into one body.
  • the beneficial effects of the embodiments of the present invention are: by independently designing the evaporator and the lower cover and combining them in a combined manner, the processing difficulty of the components is reduced, the amount of material used is reduced, the processing difficulty is reduced, and the cost of raw materials is also saved. .
  • Figure 1 is a schematic three-dimensional structural diagram of an embodiment of the present application.
  • Figure 2 is a schematic bottom view of an embodiment of the present application.
  • Figure 3 is a schematic cross-sectional view of A-A in Figure 2;
  • embodiments of the present application provide a combined evaporator vaporization plate, including an upper cover plate 1, a lower cover plate 2, an evaporator 3, a capillary structure and a support structure 5.
  • the lower cover 1 has an installation opening corresponding to the heat source contact area, and the evaporator 3 is assembled and connected with the lower cover 1 at the installation opening.
  • the connection method may be one or a combination of welding, riveting, snapping, etc.
  • the upper cover 1, the lower cover 2 and the evaporator 3 together form a chamber 6.
  • the capillary structure 41 and the support structure 5 are arranged in the chamber 6.
  • a phase change medium (not shown in the figure) is injected into the chamber 6. .
  • the evaporator 3 and the lower cover 2 are independently designed and combined in a combined manner. Compared with the existing integrated processing, the processing difficulty of the components is reduced, the amount of material used is reduced, and the processing difficulty is reduced. It also saves raw material costs.
  • the lower cover 2 is provided with a downwardly bent extension 21 on the side of the installation opening.
  • a boss 31 is provided on the peripheral side of the evaporator 3.
  • a groove 31a is formed on the upper surface of the boss 31, and the groove 31a matches the extension 21.
  • the upper plane 31c of the boss 31 is in contact with the outer lower plane of the lower cover 1 , and the outer side of the boss 31 and the lower cover 1 are welded and connected through the ring cloth solder 7 . Since the lower cover 1 is an independent component before installation and assembly, it is convenient to make the bending and extension features of the installation opening, and the evaporator 3 is also convenient to make the groove features and rib features.
  • the cooperation between the groove 31a and the extension 21 facilitates assembly and prevents the risk of filler powder overflow and solder overflow in subsequent processes.
  • the extension length of the extension part 21 may be 0.5 mm to 3 mm.
  • the outer side of the groove 31a is 0.1 mm to 0.5 mm away from the outer wall of the extension part 21, and the bottom of the groove 31a is 1 mm to 0.5 mm away from the extension part.
  • annular rib 31b is provided on the boss 31, and the thickness of the rib 31b is 0.5 mm to 2 mm.
  • the convex rib 31b is located inside the groove 31a. Before the evaporator 3 is assembled with the lower cover 2, the convex rib 31b is vertical. During installation, the convex rib 31b is tilted outward from the root so that the top of the convex rib 31b contacts and extends. 21, thereby ensuring that no powder will enter the groove 31a when the capillary structure is sintered.
  • the capillary structure includes an upper capillary structure 41 covering the lower surface of the upper cover plate 1 , a lower capillary structure 43 covering the upper surface of the lower cover plate 2 , and an evaporator capillary structure 42 covering the surface of the evaporator 3 .
  • the lower capillary structure 43 and the evaporator capillary structure 42 are made integrally, that is, the lower capillary structure 43 and the evaporator capillary structure 42 are sintered into one body, thereby having better liquid return capability.
  • the evaporator 3 is also provided with a support portion 32 , the support portion 32 is integrally connected to the bottom of the evaporator 3 (the portion in direct contact with the heat source), and the upper end of the support portion 32 is in contact with the upper capillary structure 41 .
  • the support portion 32 By providing the support portion 32, the internal evaporation area can be increased while minimizing the heat transfer resistance.
  • the support structure 5 can also be a capillary support structure, for example, the outer surface of the support cylinder can be covered with a capillary structure layer.
  • the capillary support structure contacts the upper capillary structure 41 and the lower capillary structure 42 .
  • the combined evaporator vapor chamber provided in the embodiments of the present application is suitable for more metal materials, such as copper, copper alloy, aluminum alloy, magnesium alloy, iron, stainless steel, etc. due to improvements in structure and processing technology. Titanium, titanium alloys, composite metal materials with metal coating, etc.
  • the embodiment of the present application also provides a method for processing a combined evaporator vapor plate, which includes the following steps: 1 Combine the lower cover plate with the evaporator;
  • this step includes:
  • this step further includes: using a fastening mold to deform and fasten the convex ribs on the evaporator outward, so that the tops of the convex ribs contact the inside of the extension of the lower cover plate.
  • the capillary structure on the upper surface of the cover plate and the capillary structure on the upper surface of the evaporator are filled with powder and sintered into one body.
  • the above method specifically includes:
  • the evaporator and the lower cover are independently designed and combined in a combined manner.
  • the independent lower cover plate facilitates the bending features of the flange opening, and the groove features and rib features of the evaporator. It facilitates assembly while preventing the risk of filling powder spillage and solder spillage. , greatly improving operability and manufacturing yield.
  • the lower cover plate and the evaporator capillary structure are integrated to have better liquid return capability.
  • the evaporator support structure is integrated with the bottom of the heat source in direct contact, which increases the internal evaporation area while minimizing the heat transfer resistance.
  • the above two points ensure the optimal resistance value and maximum heat flux capability of the vapor chamber.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

提供一种组合式蒸发器均温板及其加工方法。所述均温板包括上盖板（1）、下盖板（2）、蒸发器（3）、毛细结构和支撑结构（5），所述下盖板（2）上对应于热源接触区域开设有安装口，所述蒸发器（3）在所述安装口处与所述下盖板（2）组合连接，所述上盖板（1）、下盖板（2）和蒸发器（3）共同形成一腔室（6），所述毛细结构和支撑结构（5）设置于所述腔室（6）内，所述腔室（6）内注入有相变介质。通过将蒸发器和下盖板独立设计并以组合方式进行结合，减少了部件的加工难度，减少了材料使用量，降低了加工难度，同时也节约了原料成本。

Description

一种组合式蒸发器均温板及其加工方法 技术领域
本发明涉及均温板设计加工领域，尤其涉及一种组合式蒸发器均温板及其加工方法。
背景技术
均温板作为当前散热行业最强大的传热元件，其通过在全封闭真空腔内循环介质的汽、液相变来传递热量，导热能力可高达纯铜导热能力的数百倍，因此在电子、通讯、汽车、照明等行业中得到广泛应用。
均温板的主要结构由上板、下板、毛细结构、支撑结构和相变介质五部分构成。其中下板与毛细结构组合起到向蒸发区回液的作用，下板与支撑结构组合作为腔体的框架，下板与上板组合形成气密腔体。下板是直接与热源接触的部件，其热源正对腔体内侧范围称为蒸发区。一般热流密度25w/cm2以内的蒸发区式样为2维平面型，即平面毛细结构与平面下板内腔平面。应对热流密度25w/cm2以上热源则需要3维结构蒸发区结构，即立体毛细结构与增大内腔立体结构下板组成的蒸发器。这种对应高热流密度的蒸发器下板常规做法有两种，其一为一体CNC(计算机数字控制)加工或锻造成型，其二为平面型钣金下板与支撑结构通过预制钎焊(或预制扩散焊)工艺制成。这种两种方法制得的蒸发器下板都存在接触阻抗高、传热效果差、加工成本高、模具成本高、产能低下以及良率低等缺点。
发明内容
本发明的目的在于提供于一种加工难度更低、材料使用量更少的组合式 蒸发器均温板及其加工方法。
以下给出一个或多个方面的简要概述以提供对这些方面的基本理解。此概述不是所有构想到的方面的详尽综览，并且既非旨在指认出所有方面的关键性或决定性要素亦非试图界定任何或所有方面的范围。其唯一的目的是要以简化形式给出一个或多个方面的一些概念以为稍后给出的更加详细的描述之序。
根据本发明的一方面，提供了一种组合式蒸发器均温板，包括上盖板、下盖板、蒸发器、毛细结构和支撑结构，所述下盖板上对应于热源接触区域开设有安装口，所述蒸发器在所述安装口处与所述下盖板组合连接，所述上盖板、下盖板和蒸发器共同形成一腔室，所述毛细结构和支撑结构设置于所述腔室内，所述腔室内注入有相变介质。
在一实施例中，所述下盖板在所述安装口周侧设置有向下弯折的延伸部，所述蒸发器周侧设置有凸台，所述凸台上表面开设有凹槽，所述凹槽与所述延伸部匹配，所述凸台上平面与所述下盖板的外侧下平面接触配合，所述凸台外侧与所述下盖板焊接连接。
在一实施例中，所述延伸部的伸出长度为0.5mm～3mm，所述凹槽外侧距离所述延伸部外侧壁0.1mm～0.5mm，所述凹槽底部距离所述延伸部0.1mm～0.5mm。
在一实施例中，所述凸台设置有一环形凸筋，所述凸筋位于所述凹槽内侧，所述凸筋由根部向外倾斜，所述凸筋的顶端接触所述延伸部。
在一实施例中，所述毛细结构包括覆盖于所述上盖板下表面的上毛细结构、覆盖于所述下盖板上表面的下毛细结构以及覆盖于所述蒸发器表面的蒸 发器毛细结构，所述下毛细结构与所述蒸发器毛细结构一体制成。
在一实施例中，所述蒸发器上设置有支撑部，所述支撑部与蒸发器底部连接为一体。
在一实施例中，所述支撑结构为毛细支撑结构，所述毛细支撑结构接触所述上毛细结构和所述下毛细结构。
根据本发明的另一方面，提供了一种组合式蒸发器均温板的加工方法，包括以下步骤：
将下盖板与蒸发器组合连接；
在上盖板下表面、下盖板上表面、蒸发器表面烧结毛细结构；
在上盖板和下盖板之间设置支撑结构；
将上盖板、下盖板和蒸发器连接密封共同形成一腔室；
对腔室进行除气，注入相变介质并封口。
在一实施例中，所述将下盖板与蒸发器组合连接包括：
将下盖板的延伸部与蒸发器的凹槽配合；
将蒸发器的凸台外侧与所述下盖板焊接。
在一实施例中，所述将下盖板与蒸发器组合连接还包括：使用扣合模具将蒸发器上的凸筋向外形变扣合，使凸筋顶端接触下盖板延伸部的内侧。
在一实施例中，所述下盖板上表面的毛细结构和蒸发器上表面的毛细结构一同填粉并烧结为一体。
本发明实施例的有益效果是：通过将蒸发器和下盖板独立设计并以组合方式进行结合，减少了部件的加工难度，减少了材料使用量，降低了加工难度，同时也节约了原料成本。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本发明的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
在结合以下附图阅读本公开的实施例的详细描述之后，能够更好地理解本发明的上述特征和优点。在附图中，各组件不一定是按比例绘制，并且具有类似的相关特性或特征的组件可能具有相同或相近的附图标记。
图1是本申请实施例的立体结构示意图；
图2是本申请实施例的仰视示意图；
图3是图2中的A-A剖面示意图；
其中：1-上盖板；2-下盖板；21-延伸部；3-蒸发器；31-凸台；31a-凹槽；31b-凸筋；31c-上平面；32-支撑部；41-上毛细结构；42-蒸发器毛细结构；43-下毛细结构；5-支撑结构；6-腔室；7-环布焊料。
具体实施方式
以下结合附图和具体实施例对本发明作详细描述。注意，以下结合附图和具体实施例描述的诸方面仅是示例性的，而不应被理解为对本发明的保护范围进行任何限制。
如图1～图3所示，本申请实施例提供了一种组合式蒸发器均温板，包括上盖板1、下盖板2、蒸发器3、毛细结构和支撑结构5。下盖板1上对应于热源接触区域开设有安装口，蒸发器3在安装口处与下盖板1组合连接。连接方式可以为焊接、铆接、卡合等形式中的一种或多种的组合。上盖板1、下 盖板2和蒸发器3共同形成一腔室6，毛细结构41和支撑结构5设置于腔室6内，腔室6内注入有相变介质(图中未示出)。本实施例通过将蒸发器3和下盖板2独立设计并以组合方式进行结合，相较于现有的一体化加工，减少了部件的加工难度，减少了材料使用量，降低了加工难度，同时也节约了原料成本。
进一步地，在可能的实施例中，下盖板2在安装口周侧设置有向下弯折的延伸部21。相应地，蒸发器3周侧设置有凸台31，凸台31上表面开设有凹槽31a，凹槽31a与延伸部21匹配。同时，凸台31上平面31c与下盖板1的外侧下平面接触配合，凸台31外侧与下盖板1通过环布焊料7焊接连接。由于下盖板1在安装组合前是独立的部件，方便做出安装口的折弯延伸特征、蒸发器3也方便做出凹槽特征和凸筋特征。此外，凹槽31a和延伸部21的配合在方便装配的同时，能够防止后续工序中填粉外溢和焊料溢入的风险。
尺寸方面，延伸部21的伸出长度可以为0.5mm～3mm。将蒸发器3与下盖板2组合后，凹槽31a外侧距离延伸部21外侧壁0.1mm～0.5mm，凹槽31a底部距离延伸部1mm～0.5mm。
进一步地，凸台31上设置有一环形凸筋31b，凸筋31b的厚度为0.5mm～2mm。凸筋31b位于凹槽31a内侧，在将蒸发器3与下盖板2组合前，凸筋31b为竖直的，安装时将凸筋31b由根部向外倾斜，使得凸筋31b的顶端接触延伸部21，从而确保在烧结毛细结构时凹槽31a内不会进粉。
毛细结构包括覆盖于上盖板1下表面的上毛细结构41、覆盖于下盖板2上表面的下毛细结构43以及覆盖于蒸发器3表面的蒸发器毛细结构42。优选地，下毛细结构43与蒸发器毛细结构42一体制成，即下毛细结构43与 蒸发器毛细结构42烧结为一体，从而具有更好的回液能力。
在可能的实施例中，蒸发器3上还设置有支撑部32，支撑部32与蒸发器3的底部(直接接触热源部分)连接为一体，支撑部32的上端与上毛细结构41接触。通过设置支撑部32能够增大内蒸发面积，同时将热传阻值降到最低。
优选地，支撑结构5也可以为毛细支撑结构，例如可以在支撑圆柱体外表面覆盖毛细结构层。毛细支撑结构接触上毛细结构41和下毛细结构42。
材料方面，本申请实施例所提供的组合式蒸发器均温板，由于结构和加工工艺上的改进，适用于更多金属材质，如铜、铜合金、铝合金、镁合金、铁、不锈钢、钛、钛合金、带有金属镀层的复合金属材料等。
本申请实施例还提供了一种组合式蒸发器均温板的加工方法，包括以下步骤：①将下盖板与蒸发器组合连接；
在可能的实施例中，该步骤包括：
将下盖板的延伸部与蒸发器的凹槽配合；
将蒸发器的凸台外侧与所述下盖板焊接。
在可能的实施例中，该步骤还包括：使用扣合模具将蒸发器上的凸筋向外形变扣合，使凸筋顶端接触下盖板延伸部的内侧。
②在上盖板下表面、下盖板上表面、蒸发器表面烧结毛细结构；
优选地，盖板上表面的毛细结构和蒸发器上表面的毛细结构一同填粉并烧结为一体。
③在上盖板和下盖板之间设置支撑结构，包括将支撑结构与上盖板或下盖板焊接；
④将上盖板、下盖板和蒸发器连接密封共同形成一腔室，包括将上盖板和下盖板周侧进行焊接；
⑤对腔室进行除气，注入相变介质并封口。
在可能的实施例中，上述方法具体包括：
①对上盖板、下盖板、蒸发器进行去脂清洗；
②将下盖板安装口的弯折延伸部与蒸发器凹槽中心居中配合，使用扣合模具将蒸发器凹槽特征内侧环形凸筋向外型变扣合，使凸筋外部顶端接触下盖板延伸部内侧；
③使用腔型治具向下盖板与蒸发器铆合组件填粉并烧结，制成一体的蒸发器毛细结构与下毛细结构；
④将上盖板与上毛细结构烧结为组件；
⑤将上盖板组件、下盖板组件、支撑结构组装点布焊料、进行钎焊；
⑥将钎焊完成的均温板进行注液；
⑦将注液完成后的均温板进行一次除气，有必要时进行二次除气；
⑧将除气完成的均温板进行封口。
综上所述，本申请实施例提供的一种组合式蒸发器均温板及其加工方法，与现有技术的主要区别在于蒸发器与下盖板独立设计并以组合方式进行结合，其主要优势有三点，第一：独立的下盖板方便做出法兰开口折弯特征、蒸发器方便做出凹槽特征和凸筋特征，方便装配的同时具备了防止填粉外溢和焊料溢入风险，大大提升了可操作性、制造良率。第二：下盖板与蒸发器毛细结构为一体制成具有更好的回液能力，蒸发器支撑结构与直接接触热源底部为一体，增大内蒸发面积的同时热传阻值降到最低。以上两点保证了均 温板最佳的阻值和最大热通量能力。第三：蒸发器与下盖板独立设计以组合方式进行结合，减少了部件的加工难度，减少了材料使用量，降低了加工难度，节约了原料成本。
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。
提供对本公开的先前描述是为使得本领域任何技术人员皆能够制作或使用本公开。对本公开的各种修改对本领域技术人员来说都将是显而易见的，且本文中所定义的普适原理可被应用到其他变体而不会脱离本公开的精神或范围。由此，本公开并非旨在被限定于本文中所描述的示例和设计，而是应被授予与本文中所公开的原理和新颖性特征相一致的最广范围。
以上所述仅为本申请的较佳实例而已，并不用以限制本申请，凡在本申请的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本申请保护的范围之内。

Claims (11)

  1. 一种组合式蒸发器均温板，其特征在于：包括上盖板、下盖板、蒸发器、毛细结构和支撑结构，所述下盖板上对应于热源接触区域开设有安装口，所述蒸发器在所述安装口处与所述下盖板组合连接，所述上盖板、下盖板和蒸发器共同形成一腔室，所述毛细结构和支撑结构设置于所述腔室内，所述腔室内注入有相变介质。
  2. 根据权利要求1所述的组合式蒸发器均温板，其特征在于：所述下盖板在所述安装口周侧设置有向下弯折的延伸部，所述蒸发器周侧设置有凸台，所述凸台上表面开设有凹槽，所述凹槽与所述延伸部匹配，所述凸台上平面与所述下盖板的外侧下平面接触配合，所述凸台外侧与所述下盖板焊接连接。
  3. 根据权利要求2所述的组合式蒸发器均温板，其特征在于：所述延伸部的伸出长度为0.5mm～3mm，所述凹槽外侧距离所述延伸部外侧壁0.1mm～0.5mm，所述凹槽底部距离所述延伸部0.1mm～0.5mm。
  4. 根据权利要求2所述的组合式蒸发器均温板，其特征在于：所述凸台上设置有一环形凸筋，所述凸筋位于所述凹槽内侧，所述凸筋由根部向外倾斜，所述凸筋的顶端接触所述延伸部。
  5. 根据权利要求1所述的组合式蒸发器均温板，其特征在于：所述毛细结构包括覆盖于所述上盖板下表面的上毛细结构、覆盖于所述下盖板上表面的下毛细结构以及覆盖于所述蒸发器表面的蒸发器毛细结构，所述下毛细结构与所述蒸发器毛细结构一体制成。
  6. 根据权利要求1所述的组合式蒸发器均温板，其特征在于：所述蒸发器上设置有支撑部，所述支撑部与蒸发器底部连接为一体。
  7. 根据权利要求5所述的组合式蒸发器均温板，其特征在于：所述支撑结构 为毛细支撑结构，所述毛细支撑结构接触所述上毛细结构和所述下毛细结构。
  8. 一种组合式蒸发器均温板的加工方法，其特征在于，包括以下步骤：
    将下盖板与蒸发器组合连接；
    在上盖板下表面、下盖板上表面、蒸发器表面烧结毛细结构；
    在上盖板和下盖板之间设置支撑结构；
    将上盖板、下盖板和蒸发器连接密封共同形成一腔室；
    对腔室进行除气，注入相变介质并封口。
  9. 根据权利要求8所述的组合式蒸发器均温板的加工方法，其特征在于，所述将下盖板与蒸发器组合连接包括：
    将下盖板的延伸部与蒸发器的凹槽配合；
    将蒸发器的凸台外侧与所述下盖板焊接。
  10. 根据权利要求9所述的组合式蒸发器均温板的加工方法，其特征在于，所述将下盖板与蒸发器组合连接还包括：使用扣合模具将蒸发器上的凸筋向外形变扣合，使凸筋顶端接触下盖板延伸部的内侧。
  11. 根据权利要求8所述的组合式蒸发器均温板的加工方法，其特征在于，所述下盖板上表面的毛细结构和蒸发器上表面的毛细结构一同填粉并烧结为一体。
PCT/CN2022/083298 2022-03-14 2022-03-28 一种组合式蒸发器均温板及其加工方法 WO2023173471A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210249328.1 2022-03-14
CN202210249328.1A CN114485241A (zh) 2022-03-14 2022-03-14 一种组合式蒸发器均温板及其加工方法

Publications (1)

Publication Number Publication Date
WO2023173471A1 true WO2023173471A1 (zh) 2023-09-21

Family

ID=81485823

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/083298 WO2023173471A1 (zh) 2022-03-14 2022-03-28 一种组合式蒸发器均温板及其加工方法

Country Status (2)

Country Link
CN (1) CN114485241A (zh)
WO (1) WO2023173471A1 (zh)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595861A (zh) * 2012-03-12 2012-07-18 华南理工大学 一种带内烧结结构支撑柱的均热板
CN110678046A (zh) * 2019-10-15 2020-01-10 联德精密材料（中国）股份有限公司 薄型集成结构均温板
US20200049420A1 (en) * 2012-03-12 2020-02-13 Cooler Master Co., Ltd. Flat heat pipe structure
CN210108104U (zh) * 2019-05-24 2020-02-21 爱美达（上海）热能系统有限公司 一种均温板
CN111059946A (zh) * 2019-12-30 2020-04-24 深圳兴奇宏科技有限公司 均温板结构
CN112129147A (zh) * 2020-09-15 2020-12-25 中国科学院上海技术物理研究所 一种渐变浸润性毛细芯平板回路热管蒸发器
CN212573291U (zh) * 2020-08-20 2021-02-19 四川爱创科技有限公司 一种前后壳防水结构
CN217083434U (zh) * 2022-03-14 2022-07-29 联德电子科技(常熟)有限公司 一种组合式蒸发器均温板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3115728B1 (en) * 2015-07-09 2019-05-01 ABB Schweiz AG Cooling apparatus and method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595861A (zh) * 2012-03-12 2012-07-18 华南理工大学 一种带内烧结结构支撑柱的均热板
US20200049420A1 (en) * 2012-03-12 2020-02-13 Cooler Master Co., Ltd. Flat heat pipe structure
CN210108104U (zh) * 2019-05-24 2020-02-21 爱美达（上海）热能系统有限公司 一种均温板
CN110678046A (zh) * 2019-10-15 2020-01-10 联德精密材料（中国）股份有限公司 薄型集成结构均温板
CN111059946A (zh) * 2019-12-30 2020-04-24 深圳兴奇宏科技有限公司 均温板结构
CN212573291U (zh) * 2020-08-20 2021-02-19 四川爱创科技有限公司 一种前后壳防水结构
CN112129147A (zh) * 2020-09-15 2020-12-25 中国科学院上海技术物理研究所 一种渐变浸润性毛细芯平板回路热管蒸发器
CN217083434U (zh) * 2022-03-14 2022-07-29 联德电子科技(常熟)有限公司 一种组合式蒸发器均温板

Also Published As

Publication number Publication date
CN114485241A (zh) 2022-05-13

Similar Documents

Publication Publication Date Title
CN206556484U (zh) 一种新型超薄均热板
TWI407071B (zh) Thin heat pipe structure and manufacturing method thereof
CN110530184A (zh) 铝铜结合的均温板及其制造方法
CN1211483A (zh) 接合金属部件及该部件的接合方法
CN101945561A (zh) 散热装置及其制造方法
CN215261347U (zh) 一种均温板
WO2021208731A1 (zh) 均热板及其制作方法、中框组件及其制作方法及电子设备
CN112082413A (zh) 一种超薄均温板及其加工方法
US20110315351A1 (en) Vapor chamber having composite supporting structure
KR20060107288A (ko) 판형 열전달 장치의 케이스 접합 방법 및 이를 이용하여제조된 장치
WO2023173471A1 (zh) 一种组合式蒸发器均温板及其加工方法
KR20180055696A (ko) 종합성능이 양호한 방열구조부재 및 그 제조 공정
EP3660894A1 (en) Heat dissipation element and preparation method therefor, and igbt module
JP3186291U (ja) 均温板構造
CN217083434U (zh) 一种组合式蒸发器均温板
US6073545A (en) Cooking vessel for use in a cooking installation
CN114608366A (zh) 一种适用于压力电阻焊的均温板及其加工方法
WO2021238662A1 (zh) 薄型均温板元件结构及其制造方法
CN108716871B (zh) 散热元件及其制造方法
WO2023024564A1 (zh) 壳体组件及电子设备
CN113446884B (zh) 均热板的制造方法
WO2006115326A1 (en) Case bonding method for a flat plate heat spreader by brazing and a heat spreader apparatus thereof
TWI813277B (zh) 改良除氣管固定結構的均溫板
CN111843394A (zh) 一种沟槽式超薄铝基均热板及其制备方法
US20230175788A1 (en) Vapor chamber

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22931500

Country of ref document: EP

Kind code of ref document: A1