WO2023171605A1 - 入力装置用部材、入力装置、及び入力装置用カバー部材の製造方法 - Google Patents

入力装置用部材、入力装置、及び入力装置用カバー部材の製造方法 Download PDF

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Publication number
WO2023171605A1
WO2023171605A1 PCT/JP2023/008289 JP2023008289W WO2023171605A1 WO 2023171605 A1 WO2023171605 A1 WO 2023171605A1 JP 2023008289 W JP2023008289 W JP 2023008289W WO 2023171605 A1 WO2023171605 A1 WO 2023171605A1
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WIPO (PCT)
Prior art keywords
unevenness
input
input device
glass substrate
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2023/008289
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English (en)
French (fr)
Japanese (ja)
Inventor
直樹 藤田
沢泉 木下
克 岩尾
義孝 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Kumamoto University NUC
Original Assignee
Nippon Electric Glass Co Ltd
Kumamoto University NUC
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Application filed by Nippon Electric Glass Co Ltd, Kumamoto University NUC filed Critical Nippon Electric Glass Co Ltd
Priority to JP2024506308A priority Critical patent/JPWO2023171605A1/ja
Publication of WO2023171605A1 publication Critical patent/WO2023171605A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to an input device member, an input device, and a method for manufacturing an input device cover member included in the input device member.
  • an input device has been known that can input characters, figures, etc. using an input medium such as an input pen.
  • Such an input device includes a transparent cover member made of, for example, a glass substrate and placed on the front side of a display device such as a liquid crystal display or an organic EL display, and an input medium for performing input operations.
  • An input device member is provided, and various input operations can be performed by touching and moving an input medium with respect to this cover member.
  • the surface of the glass substrate is generally smooth with little unevenness, so when an input medium is brought into contact with the surface of the glass substrate and moved, the corresponding input
  • the leading edge of the medium for example, the nib of an input pen
  • Patent Document 1 in order to improve the writing comfort of an input pen in a pen input device (input device), a glass substrate for a pen input device (cover Friction can be reduced by forming unevenness on the surface of the member) in which the maximum valley depth Rv of the roughness curve is 10 nm or more and 400 nm or less, and the average length RSm of the roughness curve is 500 nm or more and 2000 nm or less. Techniques for improving this are disclosed.
  • the present invention has been made in view of the current problems described above, and provides an input device member, an input device, and the like that provide excellent writing comfort when performing input operations using an input medium such as an input pen.
  • a method of manufacturing an input device cover member included in an input device member is provided.
  • the input device member according to the present invention is an input device member comprising an input device cover member and an input medium for performing an input operation, the input device cover member having irregularities on at least one main surface. and on the main surface having the unevenness, the average value of the interval width of the unevenness when the cutoff value of the high-pass filter ⁇ c is set to a value four times the interval width of the unevenness of the measurement cross-sectional curve. is X, and the diameter of the contact portion of the tip of the input medium with the input device cover member is Y, the relationship between the two satisfies 0.015 ⁇ [X/Y] ⁇ 1.15.
  • the unevenness in the main surface having the unevenness, when the cutoff value of the high-pass filter ⁇ c is set to a value four times the width of the interval between the unevenness of the measurement cross-sectional curve, the unevenness It is preferable that the maximum height Rz is 3 nm or more and 5000 nm or less, and the interval width RSm1 of the unevenness is 10 ⁇ m or more and 2100 ⁇ m or less.
  • the three-dimensional arithmetic mean height Sa of the unevenness is 0.5 nm or more. , 50 nm or less, and the interval width RSm2 of the unevenness is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the diameter of the contact portion of the tip of the input medium with the cover member for the input device is 0.1 mm or more and 2 mm or less.
  • the haze of the input device cover member is less than 15% in the wavelength range of visible light.
  • the transparency of the input device cover member can be maintained, and for example, a display device in which the input device cover member is provided on the front side (the side on which the image is displayed) visibility can be maintained.
  • the input device includes any of the input device members described above, a display device that displays an image, and a detection circuit that detects an input in response to an input operation performed using the input medium.
  • the method for manufacturing a cover member for an input device of the present invention is a method for manufacturing a cover member for an input device having unevenness on at least one main surface, wherein the unevenness is formed based on processing conditions set in a previous step.
  • the pre-process is executed for each type of input device cover member to be manufactured, and includes a preparation step of preparing an input medium for performing an input operation, and a preparatory step of preparing an input medium for performing an input operation; a measuring step of measuring the diameter of the contact portion with the cover member; and a setting step of determining the size of the interval width of the unevenness in accordance with the diameter of the contact portion with the input device cover member at the leading end of the input medium. It is characterized by comprising: By manufacturing with such a manufacturing method, it is possible to obtain a cover member for an input device that provides excellent writing comfort when performing an input operation using an input medium such as an input pen.
  • the writing comfort when performing an input operation using an input medium such as an input pen can be improved. , it can be made even better.
  • FIG. 1 is a schematic side sectional view showing the configuration of an input device according to an embodiment of the present invention.
  • FIG. 2 is a diagram showing the relationship between the width of the unevenness in the measured cross-sectional curve of the main surface of the cover member, where X is the width of the interval between the concave and convex portions, and the diameter of the contact portion with the cover member at the tip of the input medium is Y. .
  • FIG. 7 is a diagram showing a measured cross-sectional curve, unevenness of a waviness component, and minute unevenness of the main surface of the cover member.
  • FIG. 3 is a diagram showing cutoff values of a high-pass filter ⁇ c and a low-pass filter ⁇ s.
  • FIG. 7 is a diagram showing how the leading end of the input medium comes into contact with the main surface of the cover member on which unevenness of the undulation component and minute unevenness are formed.
  • FIG. 7 is a diagram showing how the leading end of the input medium comes into contact with the main surface of the cover member in which the interval between the concave and convex portions of the undulation component is narrow.
  • FIG. 7 is a diagram showing how the leading end of the input medium comes into contact with the main surface of the cover member when the interval between the concave and convex portions of the undulation component is larger than the contact portion of the leading end of the input medium with the cover member.
  • FIG. 2 is a diagram showing the configuration of a contact portion observation device for observing a contact portion between the tip end of an input medium and a cover member, in which (a) is a plan view thereof, and (b) is a side view thereof. .
  • FIG. 2 is a diagram showing an image of a contact portion of an input medium measured by a contact surface observation device, in which (a) is a diagram showing an image of a contact portion of an input medium made of a polyester elastomer, and (b) (c) is a diagram showing an image of a contact portion of an input medium made of polyacetal, and (c) is a diagram showing an image of a contact portion of an input medium made of resin-reinforced felt. It is a process diagram showing the manufacturing method of the cover member for input devices.
  • FIGS. 1 to 10 Next, one embodiment of the present invention will be described using FIGS. 1 to 10.
  • the input device 1 is an embodiment of an input device including an input device member according to the present invention, and the input device member includes an input device cover member and an input medium for performing an input operation. be done.
  • the input device 1 includes a display element 10 that displays an image, a glass substrate 20 as a cover member placed on the front side of the display element 10, a digitizer circuit 30 placed on the rear side of the display element 10, and an input pen. 40.
  • the input pen 40 is an example of an input medium according to the present invention
  • the display element 10 is an example of a display device according to the present invention
  • the glass substrate 20 is an example of a cover member for an input device according to the present invention.
  • the digitizer circuit 30 is an example of a detection circuit that detects an input to the input device 1 performed by the input pen 40 according to the present invention.
  • the "front side” of the display element 10 refers to the side on which an image is displayed
  • the “rear side” of the display element 10 refers to the side opposite to the side on which the image is displayed.
  • the "front side” of the display element 10 is at the top of the page
  • the “back side” is at the bottom of the page.
  • the input device 1 is capable of inputting characters, figures, etc. by moving the input pen 40 in contact with the glass substrate 20. Input to the input device 1 can also be performed using input media other than the input pen 40. For example, by moving a user's finger in contact with the glass substrate 20, it is possible to input characters, figures, and the like.
  • the input device 1 is, for example, a tablet terminal.
  • This tablet terminal broadly refers to an input display device that has a display function and an input function.
  • Tablet terminals include devices such as tablet PCs, mobile PCs, smartphones, and game consoles.
  • the glass substrate 20 is made of a transparent glass plate with unevenness formed on at least one main surface 20a, and the main surface 20a on which the unevenness is formed is the surface on which the input pen 40 comes into contact. It is located.
  • the glass substrate 20 for example, a glass plate made of aluminosilicate glass or borosilicate glass can be used.
  • the glass substrate 20 is a glass plate made of alkali-containing aluminosilicate glass, the glass substrate 20 may have a chemically strengthened layer on its surface. Note that details of the glass substrate 20 will be described later.
  • the digitizer circuit 30 includes a detection sensor that detects input from an input medium such as an input pen 40.
  • the input pen 40 is an example of an input medium according to the present invention, and is also an input device member according to the present invention together with the glass substrate 20, which is an example of an input device cover member according to the present invention. It constitutes.
  • the input pen 40 is an input tool having a shape similar to a writing instrument such as a pencil or a ballpoint pen, and the pen tip 41 that comes into contact with the glass substrate 20 is made of synthetic resin material such as elastomer or polyacetal resin, or fiber such as felt. has been done.
  • the pen tip 41 made of these members differs greatly in the degree of deformation when pressed against the glass substrate 20.
  • the tip of the input pen 40 (pen nib 41) when pressed against the glass substrate 20
  • the actual contact area will vary widely.
  • the present inventors have investigated the characteristics of the material of the input medium (input pen 40) described above, and the contact area between the tip of the input medium and the cover member (glass substrate 20) when actually inputting data using the input medium.
  • the present invention was devised by focusing on the relationship between the diameter of the contact area and the width of the unevenness formed on the surface of the cover member (principal surface 20a of the glass substrate 20).
  • the above contact area is the area between the main surface 20a of the glass substrate 20 and the nib 41 of the input pen 40 when the input pen 40 is brought into contact with the main surface 20a of the glass substrate 20 and a test load is applied. This refers to the contact area, and the contact area between the tip of the input medium (pen nib 141) and the main surface 20a of the glass substrate 20 is observed using the contact area observation device 101, which will be described later. This value is obtained by measuring the diameter Y at .
  • the glass substrate 20 is used as the cover member for the input device, but the invention is not limited to this, and a resin substrate formed of synthetic resin and having unevenness formed on at least one main surface may be used. It is also possible to use it as a cover member.
  • the unevenness of the resin substrate can be formed by, for example, performing a blasting process such as wet blasting on the main surface of the resin substrate, or by embossing the main surface of the resin substrate.
  • a glass sheet or a resin sheet having an uneven surface formed thereon may be used as the cover member.
  • the cover member can be constructed by attaching a glass sheet or a resin sheet with unevenness formed on the surface to the main surface 20a of the glass substrate 20.
  • the unevenness of the glass sheet can be manufactured by the method for manufacturing the glass substrate 20 described later. Further, the unevenness of the resin sheet can be formed by, for example, embossing the surface of the resin sheet or forming a synthetic resin mixed with powder into a sheet shape. Alternatively, the unevenness may be created by forming a resin layer on a glass sheet or a resin sheet. Further, the resin layer can also be formed by a spray method in which synthetic resin is sprayed onto the main surface 20a of the glass substrate 20.
  • the surface hardness is higher than when a resin substrate or a resin layer is formed on the main surface 20a of the glass substrate 20. It is advantageous in that the surface is less likely to be scratched.
  • the glass substrate 20 is an embodiment of the input device cover member according to the present invention, and is also used together with the input pen 40, which is an example of the input medium according to the present invention. It constitutes a member for use.
  • the main surface 20a of the glass substrate 20 has projections and depressions formed therein.
  • the glass substrate 20 is used as a cover member for an input device, but it is clear from the spirit of the present application that the glass substrate 20 is not limited thereto. It can be read differently.
  • the glass substrate 20 has an uneven main surface 20a when the cutoff value of the high-pass filter ⁇ c is set to a value four times the width of the interval between the unevenness of the measurement cross-sectional curve.
  • the average value of the interval width of the unevenness is X
  • the diameter of the contact part with the glass substrate 20 (input device cover member) at the pen tip 41 (tip part) of the input pen 40 (input medium) is Y
  • the value of [X/Y] representing the relationship between the pen tip 41 and the glass substrate 20 is formed to be within the range of 0.015 or more and 1.15 or less.
  • the lower limit of the value of [X/Y] is preferably 0.03 or more, more preferably 0.04 or more, and most preferably 0.05 or more.
  • the upper limit of the value of [X/Y] is preferably 1.10 or less, more preferably 1.05 or less, and most preferably 1 or less.
  • a more preferable range may vary depending on the material of the pen tip 41. In other words, if the material of the nib 41 is different, the amount of deformation and hardness of the nib 41 itself, and the adhesion force between the objects to be adhered will differ. It will be different.
  • an elastomer pen tip is made of a material that has high adhesive strength and is easily deformed, so the coefficient of friction tends to increase when the contact area is large.
  • the lower limit of the value of [X/Y] is preferably 0.04 or more, more preferably 0.2 or more, and most preferably 0.5 or more.
  • the upper limit of the value of [X/Y] is preferably less than 1.10, more preferably 1.05 or less, and most preferably 1.00 or less.
  • a pen tip made of a hard material such as polyacetal has low adhesive strength and is difficult to deform, so the diameter Y of the contact portion between the pen tip 41 and the glass substrate 20 tends to be small and the coefficient of friction tends to be low. .
  • the lower limit of the value of [X/Y] is preferably 0.05 or more, more preferably 0.3 or more, and most preferably 0.5 or more.
  • the upper limit of the value of [X/Y] is preferably less than 1.12, more preferably 1.11 or less, and most preferably 1.10 or less.
  • felt-based pen nibs have lower adhesion than elastomer-based pen nibs, they are more easily deformed than polyacetal and tend to exhibit frictional behavior intermediate between elastomer and polyacetal.
  • the lower limit of the value of [X/Y] is preferably 0.05 or more, more preferably 0.2 or more, and most preferably 0.5 or more.
  • the upper limit of the value of [X/Y] is preferably less than 1.10, more preferably 1.08 or less, and most preferably 1.05 or less.
  • the unevenness formed on the main surface 20a of the glass substrate 20 is composed of unevenness of the undulation component and minute unevenness.
  • the maximum height Rz of the unevenness of the undulation component is 3 nm or more and 5000 nm or less, and the interval width RSm1 of the unevenness is 10 ⁇ m or more and 2100 ⁇ m or less.
  • the three-dimensional arithmetic mean height Sa of the minute unevenness is 0.5 nm or more and 50 nm or less, and the interval width RSm2 of the unevenness is 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the maximum height Rz of the undulation component in the unevenness is preferably larger than the three-dimensional arithmetic mean height Sa of the minute unevenness. Further, it is more preferable that the maximum height Rz of the undulation component in the unevenness is 1.1 times or more and 500 times or less the three-dimensional arithmetic mean height Sa of the minute unevenness.
  • the maximum height Rz is the sum of the height of the highest peak and the depth of the deepest valley in the unevenness
  • the interval width RSm1 of the unevenness is the sum of the height of the highest peak and the depth of the deepest valley in the unevenness.
  • This is the average of the cycle lengths Xa.
  • the three-dimensional arithmetic mean height Sa is the average of the absolute values of the peak height Z1 and the valley depth Z2 of the irregularities in a predetermined three-dimensional area
  • the interval width RSm2 of the irregularities is a predetermined It is the average of each cycle length Xb of the unevenness in the reference length of .
  • the values of the maximum height Rz and the interval width RSm1 of the unevenness of the undulation component described above are determined to block the long wavelength component from the measured cross-sectional curve of the main surface 20a. This is the value obtained when the cutoff value ⁇ c1 of the high-pass filter ⁇ c is set to a value four times the width of the interval between the unevenness of the measurement cross-sectional curve, and the cutoff value ⁇ s1 of the low-pass filter ⁇ s is set to 25 ⁇ m.
  • the above-mentioned values of the three-dimensional arithmetic mean height Sa and the interval width RSm2 of the minute irregularities are the cutoff value ⁇ c2 of the high-pass filter ⁇ c for blocking long wavelength components from the measurement cross-sectional curve of the main surface 20a.
  • This value is obtained when ⁇ s is set to 25 ⁇ m, and this value is obtained when the cutoff value ⁇ s2 of the low-pass filter ⁇ s is set to 0.345 ⁇ m.
  • the visibility of the display element 10 can be maintained in the input device 1. , it is possible to improve the writing comfort, especially the smoothness, of the input medium such as the input pen 40. Furthermore, it is possible to suppress the occurrence of glare called sparkling due to interference of scattered light due to the formed unevenness. Furthermore, since no resin layer is formed on the main surface 20a of the glass substrate 20, and the unevenness is directly formed, the main surface 20a has high scratch resistance and is hard to be scratched, so that the display element 10 visibility will not be reduced.
  • the unevenness of the undulation component affects the contact portion between the main surface 20a of the glass substrate 20 and the pen tip 41 of the input pen 40.
  • the contact portion refers to the contact portion of the pen tip 41 of the input pen 40 while the pen tip 41 is actually in contact with the main surface 20a of the glass substrate 20 and is being moved. .
  • the pen tip 41 contacts the convex portion of the unevenness of the undulation component on the main surface 20a of the glass substrate 20 at the contact portion, and also contacts the concave portion of the unevenness of the undulation component.
  • the writing comfort of the pen 40, especially the smooth operability of the pen tip 41 can be improved. Further, even when the user's finger is moved while in contact with the glass substrate 20, the finger can be moved appropriately and smoothly, and the sliding feeling when inputting with the finger is excellent. I can do it.
  • the pen tip 41 will similarly fit into the concave portion of the unevenness. Because of the contact, the effect of reducing the contact area of the contact area of the pen tip 41 with the main surface 20a of the glass substrate 20 cannot be sufficiently obtained and the frictional force increases, resulting in a good writing feeling. I can't.
  • the unevenness of the undulation component having the above-mentioned appropriate shape improves the writing comfort of the input medium such as the input pen 40 or a finger. It is possible to improve.
  • the upper limit of the maximum height Rz of the unevenness of the waviness component is set to 5000 nm, but it is preferably set to 1000 nm, and more preferably set to 500 nm. Further, the lower limit of the maximum height Rz of the unevenness of the waviness component is set to 3 nm, but it is preferably set to 4 nm, and more preferably set to 5 nm.
  • the upper limit of the interval width RSm1 of the unevenness in the unevenness of the undulation component is set to 2100 ⁇ m, preferably set to 2000 ⁇ m, and more preferably set to 1800 ⁇ m.
  • the lower limit of the interval width RSm1 of the unevenness in the unevenness of the undulation component is set to 10 ⁇ m, but it is preferably set to 11 ⁇ m, and more preferably set to 15 ⁇ m.
  • the minute irregularities contribute to increasing or decreasing the frictional force at the contact portion between the main surface 20a of the glass substrate 20 and the pen tip 41 of the input pen 40.
  • the contact portion refers to the contact portion of the pen tip 41 of the input pen 40 while the pen tip 41 is actually in contact with the main surface 20a of the glass substrate 20 and is being moved. .
  • the pen tip 41 of the input pen 40 is formed of an elastomer with high adhesive force, the contact area with the micro-asperities is reduced, and the adhesive force is reduced, thereby reducing the frictional force. Further, if the pen tip 41 of the input pen 40 is made of polyacetal with low adhesive strength, cutting friction occurs between the pen tip 41 and the convex portions of the minute irregularities, and the frictional force increases. For these reasons, it is possible to prevent the pen tip 41 from slipping excessively on the main surface 20a of the glass substrate 20 and from becoming excessively difficult to slip, thereby providing an excellent writing experience with the input pen 40. be able to.
  • the finger can be moved appropriately and smoothly, and the sliding feeling when inputting with the finger is excellent. Can be done.
  • the main surface 20a of the glass substrate 20 in this embodiment has minute irregularities having the above-described shape, thereby making it possible to improve the writing comfort of an input medium such as the input pen 40 or a finger. ing.
  • the upper limit of the three-dimensional arithmetic mean height Sa of minute irregularities is set to 50 nm, but it is preferably set to 40 nm, and more preferably set to 30 nm. Further, the lower limit value of the three-dimensional arithmetic mean height Sa of minute irregularities is set to 0.5 nm, but it is preferably set to 1 nm, and more preferably set to 2 nm.
  • the upper limit of the interval width RSm2 of the unevenness in the minute unevenness is set to 10 ⁇ m, but it is preferably set to 7 ⁇ m, and more preferably set to 5 ⁇ m.
  • the lower limit of the interval width RSm2 between the unevenness in the minute unevenness is set to 0.01 ⁇ m, but it is preferably set to 0.1 ⁇ m, and more preferably set to 0.5 ⁇ m.
  • the maximum height Rz of the undulation component in the unevenness is preferably 1.1 times or more and 500 times or less, and preferably 1.5 times or more and 200 times or less, as the three-dimensional arithmetic mean height Sa of the minute unevenness. It is more preferable.
  • the main surface 20a of the glass substrate 20 is made of a thermosetting elastomer such as the above-mentioned silicone rubber, a thermoplastic elastomer such as polyester, a resin material such as polyacetal resin, metal, fiber, etc., so that it does not get caught on unevenness.
  • the pen tip 41 is made of a material that is prone to scratches, and has particularly excellent writing comfort.
  • the elastomer refers to a material having rubber elasticity, and is not limited to the silicone rubber or polyester type mentioned above.
  • elastomers made of various materials such as natural rubber, fluorine-based, styrene-based, olefin-based, vinyl chloride-based, urethane-based, and amide-based are included.
  • the diameter of the contact portion of the pen tip 41 (tip portion) of the input pen 40 (input medium) with the glass substrate 20 (input device cover member) is 0.1 mm or more and 2 mm or less.
  • the above-mentioned contact portion refers to the contact portion of the pen tip 41 of the input pen 40 during the actual movement of the pen tip 41 in contact with the main surface 20a of the glass substrate 20.
  • the lower limit of the diameter range of the contact portion is preferably 0.11 mm or more, more preferably 0.15 mm or more.
  • the upper limit of the range of the diameter of the contact portion is preferably 1.9 mm or less, more preferably 1.8 mm or less.
  • the glass substrate 20 has a haze, which represents cloudiness, which is an index related to transparency, in the wavelength range of visible light ( 380 nm to 780 nm).
  • a haze which represents cloudiness, which is an index related to transparency, in the wavelength range of visible light ( 380 nm to 780 nm).
  • the haze of the glass substrate 20 is set to less than 15%, preferably less than 7%, more preferably less than 5%, and even more preferably less than 4%. preferable.
  • the lower limit of the thickness of the glass substrate 20 is preferably 10 ⁇ m or more, more preferably 50 ⁇ m or more, and even more preferably 100 ⁇ m or more.
  • the upper limit of the thickness of the glass substrate 20 is preferably 1500 ⁇ m or less, more preferably 1100 ⁇ m or less, and even more preferably 1000 ⁇ m or less.
  • the upper limit of the thickness of the glass substrate 20 is preferably 700 ⁇ m or less, more preferably 500 ⁇ m or less, and even more preferably 300 ⁇ m or less.
  • the thinner the glass substrate 20 is, the easier it is to use.
  • the upper limit of the thickness of the glass substrate 20 is more preferably 200 ⁇ m or less, and more preferably 100 ⁇ m or less. , less than 100 ⁇ m is most preferred.
  • the main surface 20a of the glass substrate 20 is provided with an antireflection film to reduce the reflectance on the side that the input pen 40 contacts, or an antireflection film to prevent fingerprints from adhering and to provide water repellency and oil repellency.
  • a foul film can be formed.
  • the antireflection film is provided on at least the main surface 20a of the front side of the glass substrate 20 (the side that the input pen 40 contacts). Further, if there is a gap between the glass substrate 20 and the display element 10, it is preferable that the main surface 20a on the back side (display element 10 side) of the glass substrate 20 also has an antireflection film.
  • the anti-reflection film for example, a low refractive index film having a refractive index lower than that of the glass substrate 20, or a low refractive index film having a relatively low refractive index and a high refractive index film having a relatively high refractive index are laminated alternately.
  • a dielectric multilayer film or the like is used.
  • the antireflection film can be formed by a sputtering method, a CVD method, or the like.
  • the unevenness on the surface of the antireflection film has the above-mentioned surface roughness (maximum height Rz of the unevenness of the waviness component, interval width RSm1 of the unevenness, and fine unevenness).
  • the unevenness on the main surface 20a of the glass substrate 20 is formed so as to fall within the range of the three-dimensional arithmetic mean height Sa and the unevenness interval width RSm2).
  • the unevenness of the main surface 20a of the glass substrate 20 is formed so that the haze of the glass substrate 20 having the anti-reflection film falls within the above range. .
  • the above surface roughness (the maximum height Rz of the unevenness of the waviness component and the interval width RSm1 of the unevenness, the three-dimensional arithmetic mean height Sa of minute unevenness and the interval width RSm2 of the unevenness)
  • a 10 nm Au film is formed and then these values are measured.
  • the antifouling film is provided on the main surface 20a of the front side of the glass substrate 20 (the side that the input pen 40 contacts).
  • the antifouling film preferably contains a fluorine-containing polymer containing silicon in its main chain.
  • the fluorine-containing polymer for example, a polymer having a -Si-O-Si- unit in the main chain and a water-repellent functional group containing fluorine in the side chain can be used. Further, the fluoropolymer can be synthesized, for example, by dehydrating and condensing silanol.
  • the antireflection film is formed on the main surface 20a of the glass substrate 20, and the antifouling film is formed on the antireflection film. is formed.
  • the unevenness on the surface of the antifouling film has the above-mentioned surface roughness.
  • the main surface 20a of the glass substrate 20 is adjusted so as to fall within the range of (the maximum height Rz of the unevenness of the undulation component, the interval width RSm1 of the unevenness, the three-dimensional arithmetic mean height Sa of minute unevenness and the interval width RSm2 of the unevenness). Irregularities are formed.
  • the glass substrate 20 after forming the antifouling film when the main surface 20a of the glass substrate 20 has an antifouling film, or when the main surface 20a of the glass substrate 20 has an antireflection film and an antifouling film, the glass substrate 20 after forming the antifouling film.
  • the irregularities on the main surface 20a of the glass substrate 20 are formed so that the haze, or the haze of the glass substrate 20 after forming the antireflection film and the antifouling film, falls within the above range.
  • FIGS. 1, 3, and 10 Method for manufacturing glass substrate 20
  • a method for manufacturing the glass substrate 20 will be described using FIGS. 1, 3, and 10.
  • the manufacturing method shown below is an example of the manufacturing method of the input device cover member according to the present invention, and the input device cover member is not limited to the glass substrate 20, but as described above. , a resin substrate made of synthetic resin, a glass sheet with unevenness formed on its surface, or a resin sheet pasted onto the glass substrate 20.
  • the manufacturing method of the glass substrate 20 in this embodiment is a manufacturing method of the glass substrate 20 having unevenness on at least one main surface 20a, and is based on the processing conditions once set in the pre-process S100, which will be described later.
  • the irregularities are formed according to the processing step S200.
  • the above pre-process S100 is executed for each type of glass substrate 20 to be manufactured. Once the pre-process S100 is executed and the processing conditions are once set, the type of glass substrate 20 is switched again. is continuously manufactured in the processing step S200 based on the processing conditions.
  • the above-mentioned "design of the type of glass substrate 20 to be manufactured" refers to the input device cover member (in this embodiment, the glass substrate 20) that constitutes the input device member, and the input medium (in this embodiment, , input pen 40), the product type (material, shape, etc.) to be manufactured is designed.
  • the pre-process S100 mainly includes a preparation process S01, a measurement process S02, a setting process S03, etc., which are sequentially executed over time.
  • the preparation step S01 is a step of preparing an input medium for performing an input operation. This step is a step of preparing an input medium that constitutes an input device member together with the manufactured glass substrate 20, and is, for example, a step of selecting the input pen 40 described above.
  • the measurement step S02 is a step of measuring the diameter of the contact portion of the pen tip of the input pen 40 (the tip of the input medium) with the glass substrate 20 (input device cover member). In this step, the diameter of the contact portion is determined using a contact portion observation device 101, which will be described later.
  • the setting step S03 is a step of determining the size of the interval width of the unevenness according to the diameter of the contact part with the glass substrate 20 (input device cover member) at the pen tip of the input pen 40 (the tip of the input medium). It is. In this step, the diameter of the contact portion is set within a range that is neither too large nor too small compared to the width of the interval between the concave and convex portions of the glass substrate 20 (input device cover member).
  • the cutoff value of the high-pass filter ⁇ c is set to a value four times the interval width of the unevenness of the measurement cross-sectional curve
  • the width of the interval between the unevenness is preferably determined to satisfy 0.015 ⁇ [X/Y] ⁇ 1.15.
  • the size of the interval width of the unevenness on the main surface 20 of the glass substrate 20 is set as a processing condition, and then, based on the processing condition, the following processing is performed.
  • the glass substrate 20 having a predetermined shape of unevenness on the main surface 20a is continuously manufactured.
  • the processing step S200 is, for example, a step of forming unevenness as shown below.
  • the unevenness formed on at least one main surface 20a of the glass substrate 20 (input device cover member) can be obtained by applying a treatment method such as wet blasting, sandblasting, chemical etching, or silica coating to the main surface 20a. It is formed by combining at least one or more types.
  • a slurry made by uniformly stirring abrasive grains made of solid particles such as alumina and a liquid such as water is sprayed onto a workpiece made of glass using compressed air. This is a process in which fine irregularities are formed on the workpiece by jetting it from a nozzle at high speed.
  • the injection nozzle that injects the slurry is a round nozzle whose slurry injection port area is narrowed down to a smaller area than the area of the workpiece. By moving this round nozzle relative to the workpiece, various surface shapes can be created. can be formed.
  • the glass substrate 20 is obtained by cutting a workpiece on which two types of irregularities, large and small, with different interval widths between the irregularities are formed, into a desired size and shape.
  • the surface roughness of the minute irregularities formed on the main surface of the workpiece by wet blasting can be adjusted mainly by the particle size distribution of the abrasive grains contained in the slurry and the injection pressure when spraying the slurry onto the workpiece. be. Further, the maximum height Rz of the unevenness of the undulation component and the interval width RSm1 of the unevenness can be adjusted by the size of the injection nozzle that injects the slurry, the feed pitch width, and the injection pressure.
  • wet blasting when slurry is injected onto the workpiece, the liquid carries the abrasive grains to the workpiece, so it is possible to use finer abrasive grains compared to dry blasting, and when the abrasive grains collide with the workpiece, The impact is smaller, allowing precision machining. In this way, by performing wet blasting on the workpiece, it is easy to simultaneously form moderately sized undulation component irregularities and minute irregularities on the main surface 20a of the glass substrate 20, and the transparency of the glass substrate 20 can be improved. It is possible to improve the writing comfort of the input medium such as the input pen 40 without damaging the input pen 40 or the like.
  • the chemical etching process is a process in which the main surface 20a of the glass substrate 20 is chemically etched using hydrogen fluoride (HF) gas or hydrofluoric acid.
  • the silica coating process is a process in which a coating agent containing a matrix precursor such as a silica precursor and a liquid medium that dissolves the matrix precursor is applied to the main surface 20a of the glass substrate 20 and heated.
  • the glass substrate 20 is not limited to this.
  • samples 1 to 11 were produced as examples of the glass substrate 20, and samples 12 to 18 were produced as comparative examples.
  • the glass substrate 20 used in Samples 1 to 18 an alkali-containing aluminosilicate glass having a thickness of 1.1 mm obtained by overflow molding was used.
  • one main surface 20a was wet-blasted.
  • two types of unevenness were formed, consisting of unevenness of the undulation component and minute unevenness.
  • each glass substrate 20 was A slurry prepared by uniformly stirring water and abrasive grains made of alumina having a particle size of #8000 is applied to the entire main surface 20a at a processing pressure of 0.1 to 0.3 MPa.
  • Wet blasting was performed using air by scanning and spraying with an injection nozzle consisting of a round nozzle moving at a speed of 0.5 to 10 mm/s.
  • the round nozzle one with an injection opening of 0.5 x 0.5 to 1 x 1 mm 2 was used.
  • the injection nozzle that performs wet blasting is a nozzle that narrows the cross-sectional area of the slurry injection port to be smaller than the area of the main surface 20a, and partially injects the slurry onto the main surface 20a of the glass substrate 20. It is.
  • the interval width RSm1 of the unevenness in the unevenness of the undulation component was varied by changing the scanning distance of the injection nozzle and the size (aperture) of the injection port. Further, the maximum height Rz of the unevenness of the undulation component was varied by changing the scanning speed of the injection nozzle.
  • the three-dimensional arithmetic mean height Sa of the minute irregularities and the interval width RSm2 of the irregularities were varied by changing the particle size of alumina or by changing the processing pressure.
  • the abrasive grains polygonal abrasive grains were used.
  • the interval width RSm1 of the unevenness in the unevenness of the undulation component is the same as that of the injection nozzle (injection port 0.5 x 0.5 - 1 x 1 mm 2 )
  • Samples were prepared by varying the inter-scanning distance within the range of 100 to 1000 ⁇ m.
  • the maximum height Rz of the unevenness of the undulation component can be determined by varying the scanning speed of the round nozzle within the range of 1/2 to 1/20 times that of the lower height of the same interval width. A sample was prepared.
  • the maximum height Rz of the unevenness of the undulation component will be doubled.
  • the three-dimensional arithmetic mean height Sa of minute irregularities is also related to the scanning speed of the injection nozzle, and the slower the scanning speed is, the more the value of the three-dimensional arithmetic mean height Sa can be increased.
  • the three-dimensional arithmetic mean height Sa of minute irregularities and the interval width RSm2 of irregularities can be determined by changing the particle size of alumina from #4000 to #8000 and increasing the processing pressure in the range of 0.1 to 0.3 MPa. , a sample was prepared.
  • Samples 5 and 8 which are examples, and Sample 12, which is a comparative example
  • 10 vol% of abrasive grains made of alumina with a particle size of #4000 and pure water were uniformly stirred to prepare a slurry, and each glass substrate was
  • the injection nozzle is moved and scanned over the entire main surface 20a of the main surface 20a at a processing speed of 5 to 10 mm/s, and the injection is performed using air at a processing pressure of 0.1 to 0.25 MPa.
  • Preliminary unevenness of the undulation component was formed by performing a wet blasting process in which the prepared slurry was sprayed from a nozzle.
  • the main surface 20a of the glass 20 having the preliminary unevenness is immersed in an etching solution consisting of 2 to 5 wt% hydrofluoric acid, 0 to 45 wt% sulfuric acid, and 45 to 95 wt% pure water.
  • the treatment was performed at a liquid temperature of 30° C. for 10 to 30 minutes to form unevenness of the undulation component.
  • abrasive grains made of alumina having a particle size of #8000 and pure water are uniformly stirred onto the main surface 20a of the glass 20 having the unevenness of the waviness component produced by the above-mentioned edging method.
  • a wet blasting process is performed in which the slurry prepared by the process is scanned while moving the spray nozzle at a processing speed of 10 mm/s, and the slurry prepared is sprayed from the spray nozzle using air at a processing pressure of 0.25 MPa. As a result, minute irregularities were formed.
  • the main surface 20a of the glass substrate 20 was not subjected to any treatment. In other words, the glass substrates 20 of samples 14, 16, and 18 are untreated.
  • the measured surface roughness parameters are the maximum height Rz and the interval width RSm1 of the unevenness for the unevenness of the undulation component, and the three-dimensional arithmetic mean height Sa and the interval width RSm2 of the unevenness for the minute unevenness. These surface roughness measurements were performed using a white interference microscope and an atomic force microscope.
  • the white interference microscope and atomic force microscope used to measure the above surface roughness were a white interference microscope (New View 7300) manufactured by Zygo and an atomic force microscope (trade name (SPM unit) manufactured by Bruker), respectively. Dimension Icon, product name (Controller unit): Nano Scope V), and both were measured based on JIS B0601-2013.
  • the conditions for measuring the unevenness of the waviness component were as follows: using a white interference microscope, the magnification of the objective lens was 2.5x, and the magnification of the zoom lens was 0. .5 times, the number of camera pixels was 640 x 480, and the number of integration was 1 for a measurement area of 5658 x 4244 ⁇ m. Furthermore, when measuring the maximum height Rz and the interval width RSm1 of the unevenness of the undulation component, the cutoff value ⁇ c1 of the high-pass filter ⁇ c is set to be approximately four times the interval width RSm1 of the unevenness. , the cutoff value ⁇ s1 of the low-pass filter ⁇ s was set to 25 ⁇ m.
  • the measurement conditions for minute irregularities were as follows: using a white interference microscope, the magnification of the objective lens was 50x, and the magnification of the zoom lens was 2x. The measurement was carried out so that the number of camera pixels was 640 x 480 and the number of integrations was 10 for a measurement area of 74 x 55 ⁇ m.
  • the cutoff value ⁇ c2 of the high-pass filter ⁇ c is 25 ⁇ m
  • the cutoff value ⁇ s2 of the low-pass filter ⁇ s is 0.345 ⁇ m. It was set to
  • the measurement conditions for the unevenness of the waviness component were as follows: Using a white interference microscope, the magnification of the objective lens was set to 50x, the magnification of the zoom lens was set to 2x, and the measurement area was 640 x 480 ⁇ m. In contrast, the number of camera pixels was 640 ⁇ 480, and the number of integrations was 10. Furthermore, when measuring the maximum height Rz and the interval width RSm1 of the unevenness of the undulation component, the cutoff value ⁇ c1 of the high-pass filter ⁇ c is set to be approximately four times the interval width RSm1 of the unevenness. , the cutoff value ⁇ s1 of the low-pass filter ⁇ s was set to 0.345 ⁇ m.
  • the measurement conditions for the three-dimensional arithmetic mean height Sa and the interval width RSm2 of the micro-asperities were as follows: an atomic force microscope was used in tapping mode, and the measurement area was 5 x 5 ⁇ m. The scan rate was 1 Hz and the number of acquired data was 512 x 512 for the area.
  • the maximum height Rz of the unevenness of the waviness component is 5 nm to 450 nm for Samples 1 to 11 as Examples and Samples 12, 13, 15, and 17 as Comparative Examples. It was within the range. On the other hand, for Samples 14, 16, and 18, which are untreated comparative examples, the maximum height Rz of the unevenness of the waviness component could not be confirmed.
  • the interval width RSm1 of the unevenness in the unevenness of the undulation component was within the range of 10 ⁇ m to 1000 ⁇ m for Samples 1 to 11 as Examples and Samples 12, 13, 15, and 17 as Comparative Examples. On the other hand, in Samples 14, 16, and 18, which are untreated comparative examples, no unevenness of the waviness component was observed.
  • the three-dimensional arithmetic mean height Sa of minute irregularities was within the range of 2.1 nm to 16.1 nm for Samples 1 to 11 serving as Examples and Samples 12, 13, 15, and 17 serving as Comparative Examples. .
  • the three-dimensional arithmetic mean height Sa of minute irregularities was 0.1 nm, which is smaller than Samples 1 to 13, 15, and 17. .
  • the interval width RSm2 of the unevenness in the minute unevenness was within the range of 1.7 to 4.0 ⁇ m for Samples 1 to 11 as Examples and Samples 12, 13, 15, and 17 as Comparative Examples. On the other hand, for Samples 14, 16, and 18, which are untreated comparative examples, the interval width RSm2 of the unevenness in the minute unevenness was 0.9 ⁇ m, which is smaller than that of Samples 1 to 13, 15, and 17.
  • the contact portion observation device 101 holds the glass substrate 20 to be measured in a horizontal position with the main surface 20a on which the unevenness is formed facing downward.
  • the pen tip 141 which is an example of the tip of the input medium and is a friction element, is pressed against the main surface 20a of the glass substrate 20 with a predetermined load, so that the tip of the pen tip 141 and the glass
  • This is a device for observing the contact surface of the pen tip 141 at the contact portion with the main surface 20a of the substrate 20. Note that, for convenience, the following description will be made by defining the vertical direction and horizontal direction of the contact portion observation device 101 according to the directions of arrows in FIGS. 8(a) and 8(b).
  • the contact portion observation device 101 mainly includes a glass substrate holding section 102 that holds the glass substrate 20 and a pen tip holding section 103 that mounts the pen tip 141.
  • the glass substrate holding unit 102 includes a surface plate portion 121 on which the glass substrate 20 is placed, and a pair of holding members 122 that hold the glass substrate 20 placed on the surface plate portion 121.
  • the surface plate portion 121 includes a first surface plate 121a serving as a base, a second surface plate 121b arranged on the upper surface of the first surface plate 121a, and the like.
  • the second surface plate 121b has a substantially gate-like shape with a horizontal top plate 121b1, and an opening 121b2 having a size of 20 mm x 20 mm is formed in the center of the top plate 121b1. There is.
  • the glass substrate 20 is placed on the top plate part 121b1 of the second surface plate 121b with the main surface 20a on which the unevenness is formed facing downward, so as to close the opening part 121b2, and then A pair of holding members 122 are fixed so as to press both ends of the glass substrate 20 from above. Thereby, the glass substrate 20 is held by the glass substrate holder 102 with the main surface 20a exposed through the opening 121b2.
  • the pen nib holder 103 is rotatably supported by a third surface plate 131 serving as a base, a bearing 132 arranged on the upper surface of the third surface plate 131, and a support for mounting the pen nib 141. It has a member 133 and a load weight 134 that applies a pressing force to the pen tip 141 via the support member 133.
  • the support member 133 is made of a rod-shaped member that extends in one direction, and one end (in this embodiment, the left end) in the extending direction is located directly below the top plate portion 121b1 of the second surface plate 121b. It is placed in a substantially horizontal position. Further, the support member 133 is supported so as to be rotatable in the vertical direction by a bearing 132 via a rotation shaft 133a penetrating through the center of the extension direction (in the present embodiment, the left-right direction). .
  • a pen tip 141 is arranged diagonally upward (for example, the angle between the glass substrate 20 and the pen tip 141 is 60°).
  • the support member 133 is attached so as to extend, and a load weight 134 is suspended from the other end (in this embodiment, the right end) of the support member 133 in the extending direction via a latching pin 133b.
  • the distance S1 from the center of the rotation shaft 133a to the end of the pen tip 141 attached to the support member 133 is the distance S1 from the center of the rotation shaft 133a to the latching pin 133b on which the load weight 134 is suspended.
  • the distance S2 is set approximately equal to the distance S2, and one end (more specifically, the pen tip 141) and the other end (more specifically, the latching pin) of the support member 133 have the bearing 132 as a fulcrum.
  • the fulcrum of the support member 133 is set so that the moments of each of the support members 133b) balance each other.
  • the support member 133 is held in a horizontal position, and the tip of the pen nib 141 is attached to the lower surface of the glass substrate 20 (main surface 20a). ), it is possible to touch it without pressing it.
  • the load due to the load weight 134 acts on the tip of the pen nib 141, and the tip of the pen nib 141 is is configured to press the lower surface (principal surface 20a) of the glass substrate 20.
  • the contact portion between the main surface 20a of the glass substrate 20 and the tip of the pen nib 141 was observed using a laser microscope (LEXT OLS5000-SAT) manufactured by Olympus.
  • the observation conditions for the above-mentioned contact area are as follows: Use a long working distance lens (10x lens: MPFLN10XLEXT, 50x lens: LMPLFLN50XLEXT), set the objective lens magnification to 10 to 50x, and set the optical magnification to 1 to 2x.
  • the contact portion between the pen tip 141 and the main surface 20a of the glass substrate 20 (more specifically, the contact portion of the pen tip 141 that presses the main surface 20a of the glass substrate 20) (contact surface) was observed.
  • the tips (pen tips 141) of three types of input media and the main surface 20a of the glass substrate 20 are measured.
  • the diameter Y of the contact surface of the pen tip 141 was measured.
  • the above three types of tips (pen nibs 141) include refills made by Wacom (product name: ACK-20004: Elastomer nibs) having a polyester elastomer nib 141, and polyacetal nibs.
  • 141 made by Wacom product name "ACK-20001: standard polyacetal lead
  • a refill made by Wacom with a nib 141 made of resin-reinforced felt product name "ACK-20003: hard felt”
  • core were used respectively. Note that, as the diameter Y, the value of the largest diameter on the contact surface of the pen tip 141 is adopted.
  • FIGS. 9(a), 9(b), and 9(c) Images of the contact surface of the pen tip 141 thus observed are shown in FIGS. 9(a), 9(b), and 9(c).
  • FIG. 9(a) shows an image of the contact surface of the pen nib 141 made of polyester elastomer
  • FIG. 9(b) shows an image of the contact surface of the pen nib 141 made of polyacetal
  • 9(c) shows an image of the contact surface of the pen tip 141 made of resin-reinforced felt.
  • sample 12 which is a comparative example, it was 0.012, and for samples 13, 15, and 17, which were comparative examples, it was within the range of 1.176 to 5.556. Moreover, it was 0 for Samples 14, 16, and 18, which are untreated comparative examples.
  • the pen can be slid very smoothly.
  • 4 The pen can be slid smoothly.
  • 3 The pen can be slid somewhat smoothly.
  • 2 It is not very smooth and the pen feels heavy.
  • 1 There is no smoothness, and the pen clearly feels heavy and slippery.
  • Sample 12 which is a comparative example, had a high frequency of snagging and was unable to reduce the contact area, resulting in poor evaluation of writing comfort.
  • Samples 13, 15, and 17, which are comparative examples the contact area could not be reduced, and the reduction in friction was not sufficient, resulting in a decrease in smoothness and poor evaluation results of writing comfort.
  • sample 14, which is an untreated comparative example the contact area could not be reduced and the friction was too high, resulting in poor smoothness, resulting in poor writing comfort evaluation results.
  • Samples 16 and 18, which are untreated comparative examples the irregularities on the main surface 20a that the input pen 40 contacts were small, and the writing comfort was poor because friction could not be controlled.
  • This invention can be utilized for the input device which can input characters, figures, etc. using input media, such as an input pen, and the cover member for input devices which the said input device is equipped with,
  • the display of an input device The present invention can be used for an input device cover member that is disposed on the front side of the device and has unevenness on at least one main surface, and for an input device that includes the input device cover member.
  • Input device 10 Display element (display device) 20 Glass substrate (cover member for input device) 20a Main surface 30 Digitizer circuit (detection circuit) 40 Input pen (input medium) 41 Pen tip S100 Pre-process S01 Preparation process S02 Measurement process S03 Setting process

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PCT/JP2023/008289 2022-03-09 2023-03-06 入力装置用部材、入力装置、及び入力装置用カバー部材の製造方法 Ceased WO2023171605A1 (ja)

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JP2018165245A (ja) * 2012-11-30 2018-10-25 コーニング インコーポレイテッド 反射低減ガラス物品ならびにその製造方法および使用方法
JP2021077032A (ja) * 2019-11-07 2021-05-20 日本電気硝子株式会社 入力装置用カバー部材、及び入力装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018165245A (ja) * 2012-11-30 2018-10-25 コーニング インコーポレイテッド 反射低減ガラス物品ならびにその製造方法および使用方法
JP2021077032A (ja) * 2019-11-07 2021-05-20 日本電気硝子株式会社 入力装置用カバー部材、及び入力装置

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