WO2023170994A1 - Dispositif de commande électronique - Google Patents

Dispositif de commande électronique Download PDF

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Publication number
WO2023170994A1
WO2023170994A1 PCT/JP2022/029712 JP2022029712W WO2023170994A1 WO 2023170994 A1 WO2023170994 A1 WO 2023170994A1 JP 2022029712 W JP2022029712 W JP 2022029712W WO 2023170994 A1 WO2023170994 A1 WO 2023170994A1
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WO
WIPO (PCT)
Prior art keywords
electronic control
control device
plate
front side
gate
Prior art date
Application number
PCT/JP2022/029712
Other languages
English (en)
Japanese (ja)
Inventor
宇亨 池田
義夫 河合
尭之 福沢
務 河野
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Publication of WO2023170994A1 publication Critical patent/WO2023170994A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass

Definitions

  • the present invention relates to an electronic control device.
  • a car is made up of various devices such as engines and brakes, and one of them is an electronic control device that controls the output of these functional parts based on the driver's operations.
  • electronic control devices are sometimes installed in the engine room of an automobile.
  • the engine room reaches a high temperature of over 100°C when the vehicle is running, it is cooled down to the outside temperature when the engine is not in operation, so the repeated thermal stress caused by temperature rises and falls causes electronic control This places a thermal burden on the device. Therefore, the configuration of the device is required to be reliable so that the electronic control device can be placed in such a space.
  • the orientation of reinforcing fibers etc. blended into the resin material is dispersed in the thickness direction, and the weld portion 12 is A configuration is disclosed in which reliability is improved by reducing unevenness.
  • the present invention uses a case made of a synthetic resin product with further improved reliability, so the present invention aims to suppress molding warpage and provide a lightweight and highly reliable electronic control device.
  • the electronic control device includes a casing made of resin containing fibers and having a rectangular plate and side walls standing upright from the plate on three of the four sides of the plate. If, among the four sides, the side where the side wall is not provided is the front side, and the side opposite to the front side is the rear side, there will be gate marks on the board due to the injection of the resin. are formed at two points side by side in the direction from the front side to the rear side.
  • FIG. 2 is an external view and an exploded view of an electronic control device.
  • FIG. 2 is a diagram illustrating the electronic control device housing of FIG. 1.
  • FIG. FIG. 3 is a diagram illustrating warpage that occurs when glass fiber is included in the housing material.
  • FIG. 2 is an explanatory diagram of an electronic control device housing according to a first embodiment of the present invention. It is an explanatory view of an electronic control device case concerning a 2nd embodiment of the present invention. It is an explanatory view of an electronic control device case concerning a 3rd embodiment of the present invention. It is an explanatory view of an electronic control device case concerning a 4th embodiment of the present invention. It is an explanatory view of an electronic control device case concerning a 5th embodiment of the present invention.
  • FIG. 1(a) is an external view of the electronic control device 1
  • FIG. 1(b) is an exploded view of the electronic control device 1.
  • the electronic control device 1 includes a housing 100, a connector 200, a board 300, and a lid 400.
  • the housing 100, the connector 200, and the lid 400 are connected to each other using an adhesive or the like. This protects the board 300 from water and dust entering from the outside in the installation location of the electronic control device 1 (such as an engine room).
  • the connector 200 has a connector housing 201 and connector pins 202.
  • the connector 200 plays the role of inputting and outputting electrical signals to and from other devices (not shown) included in the vehicle.
  • the connector pin 202 is electrically connected to a through hole or the like of the board 300 with solder or the like.
  • the substrate 300 has electrolytic capacitors, semiconductor chips, etc. (not shown) mounted on the front and back sides, and calculations and outputs are performed using these.
  • the substrate 300 is fixed to the housing 100 or the lid 400 using screws or adhesive.
  • the housing 100 includes a rectangular plate 101 and side walls 102 that stand upright from the plate 101 on three of the four sides of the plate 101. Furthermore, a plurality of mounting portions 103 for fixing the electronic control device 1 to the installation space within the automobile are provided on the outside of each of the side walls 102 facing each other with the plate 101 in between.
  • thermosetting resin such as PBT (polybutylene terephthalate) or thermosetting resin such as epoxy resin. Consideration is being given to replacing it with synthetic resins.
  • a highly fluid resin is poured into the plate 101 through a runner gate into a mold that has a hole in the shape of the product and is heated to a temperature higher than room temperature.
  • a manufacturing method is used in which the mold is opened and removed after the resin solidifies.
  • the pin gate is used instead of the runner gate, the gate is automatically cut when the mold is opened, and the product part and the runner part can be easily separated.
  • the resin When PBT, which is a resin, is used as the material for the housing 100, the resin has significantly lower rigidity and strength than conventional aluminum materials. Molding warpage occurs in the housing 100. Therefore, in order to create a resin that achieves both weight reduction and productivity while ensuring rigidity and strength, we used a fiber-blended resin in which fibers such as glass fibers and carbon fibers with diameters of several ⁇ m and lengths of several hundred ⁇ m were dispersed. handle.
  • the fiber 2 such as glass fiber has an elastic modulus 10 times or more greater than a matrix resin such as PBT, and a linear expansion coefficient 1/10 or less. Therefore, during molding shrinkage, while it strongly resists shrinkage in the longitudinal direction of the fibers 2, the effect of suppressing shrinkage in the direction perpendicular to the fibers 2 is small. As a result, when the housing 100 is molded, shrinkage anisotropy (the shrinkage rate varies greatly depending on the fiber orientation) occurs. In particular, when the fibers are aligned (orientated) in one direction, the shrinkage anisotropy becomes significant. An example of this will be explained below.
  • the schematic diagram in FIG. 3 is an explanatory diagram of the relationship between fiber orientation and molding warpage related to shrinkage anisotropy in the plate 101.
  • the plate 101 is made of PBT containing glass fibers 2, and has a high orientation region 3 of the glass fibers 2 in the upper part and a low orientation region 4 of the glass fibers 2 in the lower part.
  • the fibers are oriented in the left-right direction, and the left-right shrinkage of the plate 101A during molding is small.
  • the fibers are not oriented left and right and are scattered, so that the left and right shrinkage of the plate 101A is large during molding.
  • an upwardly convex warp occurs as shown in the plate 101A.
  • a fiber blended resin containing glass fiber 2 is used to improve the rigidity and strength of PBT used as the material for the housing 100, molding warpage may be greater in some cases than when using a resin that does not contain fibers. be. If the plate 101 is highly warped, for example, there will be large variations in the thickness of the adhesive when connecting it with a connector, creating a problem in the reliability of the electronic control device 1.
  • fiber orientation is determined by the position of the molded product and the resin flow pattern during molding, and the resin flow pattern is determined by the number of gates and the gate position, so fiber orientation can be controlled using these principles. It is an object of the present invention to suppress molding warpage by this. Note that it is possible to predict the resin flow pattern, fiber orientation distribution, and warpage due to heat shrinkage in consideration of fiber orientation using molding simulation.
  • FIG. 4 is an explanatory diagram of the casing 100 according to the embodiment of the present invention, when the back side of the casing 100 in FIG. 2 is viewed from the direction of arrow R.
  • the resin material used for the housing 100 is PBT (polybutylene terephthalate) containing 30% glass fiber fibers.
  • the side where the side wall 102 is not provided is the front side
  • the side opposite to the front side and having the side wall 102 is the rear side.
  • the sides provided between the front side and the rear side and having the side wall 102 are defined as the left side and the right side, respectively.
  • Two gate marks 107 are formed on the plate 101, which are lined up in the direction from the front side to the rear side.
  • This gate 107 is a mark formed after the resin is injected and filled into the plate 101, and is therefore the injection position of the gate 107.
  • the resin filled in the plate 101 at the gate 107 flows on the plate 101.
  • a shear flow is generated, and a weld line 109 is formed along with this shear flow. Since the orientation of the fibers contained in the resin is promoted along this weld line 109, the fiber orientation is highly oriented near the weld line 109.
  • the elastic modulus of the housing 100 in the left and right direction is improved and the coefficient of linear expansion is decreased. Furthermore, since the weld line 109 strongly resists thermal contraction during cooling of the housing 100, molding warpage in the left-right direction of the plate 101 can be reduced.
  • the radius of curvature r of the tips when the resin flowing tips 108 collide with each other becomes smaller, so that the left-right direction that occurs after the resin flowing tips 108 collide with each other becomes smaller. It is possible to increase the amount of resin flow that is forced to change in the left-right direction along the shear flow. As a result, the fiber orientation of the weld line 109 is further improved, so that molding warpage in the left-right direction of the plate 101 can be further reduced.
  • the inter-gate distance d1 satisfies d1 ⁇ 20t to achieve the above effect.
  • the wall thickness t does not need to be uniform over the entire plate 101, and if it is not uniform, it is an average value.
  • the two gates 107 are formed at positions closer to the rear side than the front side of the plate 101. Furthermore, the distance d2 between the gate 107 that is closer to the rear side of the two gates 107 and the rear side of the plate 101 is d2 ⁇ 20t. Thereby, in the plate 101, molding warpage at a position near the rear side can be reduced.
  • the reason for adopting such an embodiment is that on the front side of the plate 101 where there is no side wall, the fibers are easily oriented in the left-right direction and are less likely to warp during molding, so the weld line 109 is formed as close to the rear side as possible. This is because the purpose is to form highly oriented regions in the left-right direction. By doing so, the elastic modulus of the weld line 109 in the left-right direction is improved and the coefficient of linear expansion is reduced. As a result, the vicinity of each of the front and rear sides of the plate 101 strongly resists thermal contraction during cooling of the housing 100, so that molding warpage in the left-right direction in a wide area of the plate 101 can be reduced.
  • FIG. 6 (Third embodiment) ( Figure 6)
  • two sets of gates 107 shown in the first embodiment and the second embodiment are formed side by side in the left and right direction orthogonal to the direction from the front side to the rear side.
  • four gates 107 are formed on the plate 101. Note that the two gates 107 near the left side are called gates 107a, and the two gates 107 near the right side are called gates 107b.
  • a weld line 109a is formed on an equidistant line between the gates 107 in the front-rear direction
  • a weld line 109b is formed on an equidistant line between the gates 107a and 107b in the left-right direction.
  • the wall thickness t of the board 101 and the two points formed on the left side of the two sets of gates 107 arranged in the left-right direction are Distance d1s between the gates 107a, distance d1r between the two gates 107b formed on the right side, distance between the gate 107a near the rear side of the two gates 107a formed on the left side and the rear side.
  • d2s the distance d2r between the gate 107b closest to the rear side of the two gates 107b formed on the right side and the rear side, and the respective relationships are d1s ⁇ 20t, d1r ⁇ 20t, and d2s ⁇ 20t. , and it is desirable to satisfy d2r ⁇ 20t.
  • At least one gate is located on the plate 101 at a position closer to the front side than the two sets of gates 107a and 107b (four gates 107) arranged in the left and right direction shown in the third embodiment. 107c is further formed.
  • the weld line 109b which is formed from the center of the rear side to the center of the front side, branches into a Y-shape in the middle and becomes a weld line 109c, which extends toward both ends of the front side. It is formed like this.
  • a triangular region is formed on the front side of the plate 101 surrounded by a highly oriented region with the front side, both ends of that side, and the weld line 109 as three sides, so that Deformation of the plate 101 is suppressed, and molding warpage can be reduced. Furthermore, bending force is applied to the casing 100 due to thermal stress that occurs when the electronic control device 1 is attached to the vehicle body or when the environmental temperature changes after the electronic control device 1 is assembled. This improves the strength with which it can withstand even when stress is applied.
  • the relationship between the wall thickness t of the plate and the distance d3 between the gate 107c and the front side is preferably d3 ⁇ 20t.
  • the plate 101 is bent into a convex shape or a concave shape between the gates 107 formed at two points side by side in the direction from the front side to the rear side shown in the first embodiment.
  • a bent portion (or rib portion) 112 is provided, and a weld line 109 is formed on the bent portion 112.
  • a bend portion (or rib portion) 112 is provided between two gates 107 in each of the two sets of gates 107a and 107b arranged in the left and right direction shown in the third embodiment, and a cross is provided on the bend portion 112.
  • a mold weld line 109 may be formed.
  • FIG. 9 is an explanatory diagram of the bend portion 112a
  • FIG. 9(b) is an explanatory diagram of the rib portion 112b.
  • the bend portion 112a has a fillet shape, and when the fibers in flowing resin are pressed against the bend portion 112a, the straight needle-like fibers cannot exist along the fillet shape having curvature, and the bend portion The resin flows are merged at 112a to form a weld line 109 in the depth direction as shown in FIG. By doing so, fiber orientation in the depth direction in FIG. 9 can be further promoted.
  • the bend portion 112a has a larger moment of inertia of area with respect to bending of the housing 100 in the left-right direction than that of a flat plate. Therefore, the bend portion 112a of the housing 100, which is highly oriented in the left-right direction, strongly resists thermal shrinkage and reduces molding warpage in the left-right direction.
  • the radii ro and ri of the fillet shapes on the outside and inside of the bend part 112a the more fiber orientation can be promoted.
  • the rigidity against bending of the housing 100 in the left and right direction is improved, and molding warpage can be reduced.
  • the thickness tr and width wr of the rib portion 112b are too large, the fiber orientation will be weakened and warpage will increase. Therefore, it is desirable that the relationship between the thickness t of the plate 101 and the thickness tr of the rib 112b be t ⁇ tr ⁇ 2t, and the relationship between the thickness t of the plate 101 and the width wr of the rib portion 112b be wr ⁇ 20t. .
  • a thick path 110 that is thicker than other parts of the plate 101 is formed at a position on the plate 101 near the front side of the two gates 107, and this changes the flow velocity of the resin. .
  • the flow velocity of the resin is proportional to the cube of the thickness of the plate 101, and since the thick path 110 is even thicker than the plate thickness t, the flow velocity of the resin in the thick path 110 increases. As a result, the tip radius of curvature r of the resin flowing forward becomes smaller, and the amount of resin flowing that is forcibly changed to flow in the left-right direction after colliding with the front side of the plate 101 can be increased.
  • the relationship between the thickness t of the plate 101 and the thickness tp of the thick path 110 is tp ⁇ 2t.
  • the width wp of the thick path 110 is too large, the radius of curvature r of the tip of the resin flowing toward the front side becomes large, making it difficult to orient the fibers along the shear flow. Therefore, it is desirable that the relationship between the thickness t of the plate 101 and the width wp of the thick path 110 is wp ⁇ 20t.
  • Two bend portions 112 are formed on the plate 101, with the distance gradually narrowing from both ends of the front side toward the rear side. Further, on the plate 101, between the two bend parts 112, further to the left of the left bend part 112 of the two bend parts 112, and further right of the right bend part of the two bend parts 112, A gate 107 is formed at each location. By doing so, a triangular highly oriented region surrounded by the front side of the plate 101 and the two bend parts 112 is formed, thereby suppressing deformation of the plate 101 and preventing molding warpage. Can be reduced. In order to achieve the above effect, it is desirable that the relationship between the wall thickness t of the plate 101 and the wall thickness tb of the bend portion 112 is tb>0.8t.
  • the resin flow collides with the front side of the plate.
  • the radius of curvature r at the tip when the resin flow collides it is possible to increase the amount of resin flow that is forcibly changed to flow in the left and right direction after the resin flow collision.
  • it is possible to increase the shear in the left-right direction promote fiber orientation along the shear flow, achieve higher orientation, and further reduce molding warpage in the left-right direction, particularly on the front side of the plate 101.
  • it is desirable that the relationship between the wall thickness t of the plate 101 and the distance d4 is d4 ⁇ 20t.
  • the flow velocity of the resin is proportional to the cube of the wall thickness, and since the thick-walled path 110 is thicker than the plate thickness t, the flow speed in the thick-walled path increases.
  • the tip radius r of curvature of the resin flowing toward the front side becomes smaller, and the amount of resin flowing that is forcibly changed to flow in the left-right direction after colliding with the front side of the plate 101 can be increased.
  • This increases shear in the left-right direction promotes fiber orientation along the shear flow, allows for higher orientation, and further reduces molding warpage of the plate 101, particularly in the left-right direction.
  • the relationship between the thickness t of the plate 101 and the thickness tp of the thick path 110 is tp ⁇ 20t.
  • the width wp of the thick path 110 is made too large, the radius of curvature r of the tip of the resin flowing toward the front side becomes large and the effect decreases. Therefore, it is desirable that the relationship between the thickness t of the plate 101 and the width wp of the thick path 110 is wp ⁇ 20t.
  • the gate 107 closer to the front side may be formed on the thick path 110. By doing so, it is possible to further reduce molding warpage, particularly at a position near the front side of the plate 101.
  • the electronic control device 1 is formed of a resin containing fibers 2 and includes a rectangular plate 101 and side walls 102 erected from the plate 101 on three of the four sides of the plate 101.
  • a housing 100 is provided.
  • the side on which the side wall 102 is not provided is the front side, and the side opposite the front side is the rear side.
  • On the board 101 there are gate marks 107 caused by resin injection on the front side. Two points are formed side by side in the direction from the side to the rear side. By doing so, it is possible to suppress molding warpage and provide a lightweight and highly reliable electronic control device.
  • the two gate marks 107 are formed at a position on the plate 101 closer to the rear side than the front side. By doing this, it is possible to reduce molding warpage at a position near the rear side of the plate 101.
  • Two sets of gate marks 107 are formed on the plate 101 in parallel in the left-right direction perpendicular to the direction from the front side to the rear side.
  • the wall thickness of the plate 101 is t, the distance between the two gate marks 107a formed on the left side of the two sets of gate marks 107 arranged in the left-right direction is d1s, and the distance between the two gate marks 107a formed on the right side is Let the distance between the marks 107b be d1r.
  • the distance between the gate mark 107a near the rear side and the rear side is d2s
  • the distance between the gate mark 107b near the rear side and the rear side is d2r
  • d1s ⁇ 20t, d1s ⁇ 20t, d2s ⁇ 20t, and d2r ⁇ 20t are the distance between the gate mark 107b near the rear side and the rear side.
  • At least one gate mark 107 is further formed at a position on the plate 101 closer to the front side than the two sets of gate marks 107 arranged in the left-right direction. By doing this, a triangular region is formed on the front side of the plate 101 surrounded by a highly oriented region with the front side, both ends of that side, and the weld line 109 as three sides. Deformation of the plate 101 is suppressed, and molding warpage can be reduced.
  • a gate mark 107 is formed in which two convex or concave bend portions 112a or rib portions 112b are formed side by side in the direction from the front side to the rear side. is provided in between.
  • a thick path 110 which is thicker than other parts of the plate 101, is provided at a position on the plate 101 closer to the front side than the two gate marks 107. By doing so, molding warpage in the left-right direction can be further reduced, particularly on the front side of the plate 101.
  • One of the two gate marks 107 is formed on the thick path 110. By doing so, it is possible to further reduce molding warpage of the plate 101 in the left-right direction.
  • the thickness of the plate 101 is t
  • the thickness of the thick path 110 is tp
  • the width of the thick path 110 is wp, tp ⁇ 2t and wp ⁇ 20t.
  • the electronic control device 1 is a casing made of a resin containing fibers 2 and having a rectangular plate 101 and side walls 102 erected from the plate on three of the four sides of the plate 101.
  • a body 100 is provided. Of the four sides, the side on which the side wall 102 is not provided is the front side, and the side opposite the front side is the rear side.
  • On the board 101 there are lines from both ends of the front side toward the rear side. It has two bend portions 112 whose distance is gradually narrowed.
  • Gate marks 107 are formed at three locations further to the right of 112. By doing so, deformation of the plate 101 is suppressed, and molding warpage can be reduced.
  • the thick path 110 is located closer to the front side than the gate mark 107 formed between the two bend portions 112 . By doing so, it is possible to further reduce molding warpage of the plate 101, particularly in the left and right directions.
  • the gate mark 107 formed between the two bend portions 112 is formed on the thick path 110. By doing so, it is possible to further reduce molding warpage, particularly at a position near the front side of the plate 101.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un dispositif de commande électronique étant pourvu d'un boîtier comportant une plaque rectangulaire formée d'une résine contenant des fibres, et des parois latérales érigées sur trois des quatre côtés par rapport à la plaque. Lorsqu'un côté non pourvu de la paroi latérale parmi les quatre côtés est un côté avant et que le côté opposé au côté avant est un côté arrière, deux traces de grille d'obturation résultant de l'injection de la résine sont formées côte à côte dans une direction allant du côté avant au côté arrière sur la plaque.
PCT/JP2022/029712 2022-03-07 2022-08-02 Dispositif de commande électronique WO2023170994A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022034859A JP2023130267A (ja) 2022-03-07 2022-03-07 電子制御装置
JP2022-034859 2022-03-07

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WO2023170994A1 true WO2023170994A1 (fr) 2023-09-14

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013179315A (ja) * 2013-04-08 2013-09-09 Fujitsu Ltd 筐体及びその製造方法
WO2018110642A1 (fr) * 2016-12-15 2018-06-21 住友化学株式会社 Composition de résine polymère à cristaux liquides pour plaque externe et plaque externe

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013179315A (ja) * 2013-04-08 2013-09-09 Fujitsu Ltd 筐体及びその製造方法
WO2018110642A1 (fr) * 2016-12-15 2018-06-21 住友化学株式会社 Composition de résine polymère à cristaux liquides pour plaque externe et plaque externe

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