WO2023170649A1 - Film flexible stratifié 3d en tant que réducteur de contrainte - Google Patents

Film flexible stratifié 3d en tant que réducteur de contrainte Download PDF

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Publication number
WO2023170649A1
WO2023170649A1 PCT/IB2023/052316 IB2023052316W WO2023170649A1 WO 2023170649 A1 WO2023170649 A1 WO 2023170649A1 IB 2023052316 W IB2023052316 W IB 2023052316W WO 2023170649 A1 WO2023170649 A1 WO 2023170649A1
Authority
WO
WIPO (PCT)
Prior art keywords
area
component
flexible
lamination
type component
Prior art date
Application number
PCT/IB2023/052316
Other languages
English (en)
Inventor
Fernando Biagtan PASCUAL
Christian John Paez LLANOS
Wai WAI
Manu Juha Heikki MYRY
Original Assignee
Jabil Circuit (Singapore) Pte. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jabil Circuit (Singapore) Pte. Ltd. filed Critical Jabil Circuit (Singapore) Pte. Ltd.
Publication of WO2023170649A1 publication Critical patent/WO2023170649A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers

Definitions

  • FIG. 1 is a diagram of an example flex circuit and a printed circuit board (PCB) prior to interconnection.
  • FIG. 2 is a diagram of an example of a flex circuit and a printed circuit board (PCB) after interconnection in accordance with some implementations.
  • FIG. 3 is a diagram of an example a flex circuit A and a flex circuit B prior to interconnection.
  • FIG. 4 is a diagram of an example a flex circuit A and a flex circuit B after interconnection in accordance with some implementations.
  • FIG. 5 is a diagram of an example of a lamination area in accordance with some implementations.
  • FIG.6 is a photograph of an example of protruding PCB edge in accordance with some implementations.
  • FIG. 7 is a diagram of an example of a cut flexible film area for a PCB bonded with a flex circuit in accordance with some implementations. [0016] FIG.
  • FIG. 8 is a diagram of an example of 3D laminated flexible film with overhang for protruding PCB edge in accordance with some implementations.
  • FIG. 9 is a stack view of a diagram of an interconnect being provisioned with a 3D laminated flexible film in accordance with some implementations.
  • FIG.10 is a diagram of a bonding tool in accordance with some implementations.
  • FIG.11 is a diagram of a machine or tool in accordance with some implementations.
  • FIG. 12 is an exploded view of a diagram of a 3D lamination tool in accordance with some implementations.
  • FIG.13 is a diagram of a heat press in accordance with some implementations. [0022] FIG.
  • FIG. 14 is a diagram of an example of an interconnect with a 3D laminated flexible film in accordance with some implementations.
  • FIG.15 is a photograph of an example of an interconnect with a 3D laminated flexible film in accordance with some implementations.
  • FIG.16 is a photograph of an example of bending an interconnect with a 3D laminated flexible film in accordance with some implementations.
  • DETAILED DESCRIPTION [0025]
  • the method for using a 3D laminated flexible film as a stiffener or strain relief may be modified for a variety of applications and uses while remaining within the spirit and scope of the claims.
  • the embodiments and variations described herein, and/or shown in the drawings, are presented by way of example only and are not limiting as to the scope and spirit.
  • the descriptions herein may be applicable to all embodiments for using a 3D laminated flexible film as a stiffener or strain relief.
  • Described herein is a method for using a 3D laminated flexible film as a stiffener or strain relief.
  • the method includes providing a flexible film on or around an interconnection area between a flexible component and a rigid component and an area which extends beyond the rigid component toward the flexible component.
  • the lamination area includes an edge area around the interconnection area. In some implementations, the lamination area includes an overhang area beyond, for example, the rigid component.
  • the flexible film includes two flexible films, one flexible film on a top, front, or upper (collectively “upper”) surface of the lamination area and the other flexible film on a bottom, back, or lower (collectively “lower”) surface of the lamination area. The lamination area is laminated with the flexible film or between the flexible films using a 3D lamination tool to create a stiffening mechanism or stiffener.
  • FIG.1 is a diagram of an example a printed circuit board (PCB) 1100 and a flex circuit 1200 prior to interconnection.
  • the flex circuit 1200 can include silver traces 1210 for electrical conduction or connection to components on the PCB 1100.
  • the flex circuit 1200 and other flex circuits noted herein are a flexible component or a first type component.
  • the PCB 1100 and other PCBs noted herein are a hard, rigid, and/or non-flexible component or a second type component.
  • FIG. 2 is a diagram of an example of a PCB 2100 bonded to a flex circuit 2200 in accordance with some implementations.
  • FIG.3 is a diagram of an example a flex circuit A 3100 and a flex circuit B 3200 prior to interconnection.
  • FIG.4 is a diagram of an example a flex circuit A 4100 bonded to a flex circuit B 4200 in accordance with some implementations.
  • FIG. 5 is a diagram of an example of a lamination area for a PCB bonded to a flex circuit in accordance with some implementations. For either of the PCB-flex or flex-flex configuration, an edge area is provided around an interconnection area. A lamination area is the interconnection area plus the edge area.
  • FIG.5 includes a PCB 5100 bonded to a flex circuit 5200 using for example, ACF bonding, which establishes an interconnection area 5300.
  • the edge area 5400 is an area defined from an edge of the interconnection area 5300 plus a defined width on the PCB 5100 (as indicated by the white arrow for example).
  • the edge area 5400 is a free or unpopulated area. That is, the edge area 5400 is absent any components.
  • the defined width from the edge of the interconnection area 5300 is at least approximately 5 mm.
  • the lamination area 5500 is then at least the edge area 5400 plus the interconnection area 5300.
  • FIG.7 is a diagram of an example of a cut flexible film 7500 for a PCB bonded with a flex circuit in accordance with some implementations.
  • a PCB 7100 is bonded with a flex circuit 7200.
  • the flexible film 7500 extends a defined length beyond an edge of the PCB 7100 (or a flex A circuit) in accordance with the lamination area 7300. This is shown by arrow 7400.
  • the flexible film 7500 is cut the width of the lamination area 7300. In some implementations, the defined length is approximately at least 4 mm.
  • the PCB or flex A and/or flex B can have a protruded connection implementation.
  • FIG. 1 is a protruded connection implementation.
  • the lamination area includes an overhang area which is in a direction substantially perpendicular toward the flexible component.
  • FIG. 8 shows a diagram of an example of a 3D laminated flexible film 8300 with overhang 8310 for a protruding PCB configuration 8100 bonded with a flex circuit 8200 in accordance with some implementations.
  • the overhang area can be approximately at least 3 mm.
  • the overhang 8310 can provide added adhesion strength and moisture protection beyond a 3D laminated flexible film 8300 which does not include the overhang 8310.
  • a flexible film 7500 can include two thermoplastic films with adhesive or adhesive films, two thermoplastic polyurethane hot melt films, two thermal adhesive films, and the like.
  • FIG. 9 is a stack view of a diagram of an interconnect being provisioned with a 3D laminated flexible film in accordance with some implementations.
  • a PCB 9100 is bonded with a flex circuit 9200 using a ACF bond 9300, which establishes an interconnection area 9400.
  • FIG.10 is a diagram of a bonding tool 10000 used to form the ACF bond 9300 in accordance with some implementations.
  • Two flexible films 9500 and 9510 are cut in line with a lamination area.
  • FIG. 11 is a diagram of a machine or tool 11000 in accordance with some implementations.
  • a PCB 11100 bonded with a flex circuit 11200 is placed in the tool 11000.
  • the tool 11000 includes a top and bottom heated press machine 11300 within which is a 3D lamination tool 11400.
  • FIG.12 is an exploded view of a diagram of the 3D lamination tool 11400 in accordance with some implementations.
  • the 3D lamination tool 11400 includes a bottom plate 12100, a bottom bushing 12200, guide pins 12300 and 12310, alignment pins 12400 and 12410, a silicon sponge 12500, a stopper 12600, a top busing 12700, and a top plate 12800.
  • FIG.13 is a diagram of the heat press 11300 in accordance with some implementations.
  • the heat press 11300 includes a top heater plate and a bottom heater plate with independent temperature control features.
  • the heat press 11300 can have a pressure range of approximately 0- 10 bars, for example.
  • the heat press 11300 can have a temperature range of approximately 0°C- 250oC, for example.
  • the heat press 11300 can timer control features, for example.
  • FIG.14 is a diagram of an example of an interconnect area 14000 with a 3D laminated flexible film 14100 in accordance with some implementations.
  • a bottom portion 14200 can act as a stiffener for the connections in the interconnect area 14000.
  • FIG. 15 is a photograph of an example of an interconnect with a 3D laminated flexible film in accordance with some implementations.
  • FIG. 16 is a photograph of an example of bending an interconnect with a 3D laminated flexible film in accordance with some implementations.
  • Described herein is a method for providing strain relief for two interconnected components.
  • the method includes providing a flexible film on or around a surface of a lamination area between a first type component and a second type component, wherein the lamination area includes at least an interconnection area between the first type component and the second type component and an area which extends beyond the second type component toward the first type component and laminating, with a 3D lamination tool, the lamination area with the flexible film, the 3D laminated flexible film performing as a stiffener between the first type component and the second type component.
  • the first type component is a flexible component and the second type component is a rigid component.
  • the method further includes providing another flexible film on or around another surface of the lamination area to envelope the lamination area.
  • the lamination area includes an edge area around the interconnection area on the second type component and wherein at least a first instance of the providing further includes providing the flexible film on or around a surface of the edge area.
  • the edge area is an unpopulated area.
  • the lamination area includes an overhang which extends beyond the second type component in a direction substantially perpendicular toward the first type component and wherein at least the first instance of the providing further includes providing the flexible film on or around a surface of the overhang area.
  • the flexible film is one of a thermoplastic film with adhesive or adhesive film, a thermoplastic polyurethane hot melt film, or a thermal adhesive film.
  • the 3D lamination tool provides pressing heat toward the surface of the lamination area between the first type component and the second type component. In implementations, the 3D lamination tool provides pressing heat toward the another surface of the lamination area between the first type component and the second type component. In implementations, the first type component and the second type component are directly bonded in the intersection area. In implementations, the first type component is a first flexible component and the second type component is a second flexible component.
  • a device which includes a flexible component, a rigid component, and a 3D laminated flexible film stiffener established between the flexible component and the rigid component by laminating a flexible film on or around a surface of a lamination area between the flexible component and the rigid component, where the lamination area includes at least an interconnection area between the flexible component and the rigid component and an area which extends beyond the rigid component toward the flexible component.
  • the flexible film is at least two flexible films.
  • the lamination area includes an edge area around the interconnection area on the rigid component.
  • the edge area is an unpopulated area the rigid component.
  • the lamination area includes an overhang which extends beyond the rigid component substantially perpendicular to a direction toward the flexible component.
  • the flexible film is one of a thermoplastic film with adhesive or adhesive film, a thermoplastic polyurethane hot melt film, or a thermal adhesive film.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé et un appareil d'utilisation d'un film flexible stratifié 3D en tant que raidisseur ou réducteur de contrainte. Le procédé comprenant la fourniture d'un film flexible sur ou autour d'une surface d'une zone de stratification entre un composant de premier type et un composant de deuxième type, la zone de stratification comprenant au moins une zone d'interconnexion entre le composant de premier type et le composant de deuxième type et une zone qui s'étend au-delà du composant de deuxième type vers le composant de premier type, et la stratification, avec un outil de stratification 3D, de la zone de stratification avec le film flexible, le film flexible stratifié 3D agissant comme raidisseur entre le composant de premier type et le composant de deuxième type. La zone de stratification est stratifiée avec un film flexible ou entre des films flexibles à l'aide de l'outil de stratification 3D pour créer le mécanisme de raidissement ou le raidisseur.
PCT/IB2023/052316 2022-03-11 2023-03-10 Film flexible stratifié 3d en tant que réducteur de contrainte WO2023170649A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202263318862P 2022-03-11 2022-03-11
US63/318,862 2022-03-11

Publications (1)

Publication Number Publication Date
WO2023170649A1 true WO2023170649A1 (fr) 2023-09-14

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ID=87936290

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2023/052316 WO2023170649A1 (fr) 2022-03-11 2023-03-10 Film flexible stratifié 3d en tant que réducteur de contrainte

Country Status (1)

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WO (1) WO2023170649A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275932A (ja) * 1993-03-19 1994-09-30 Canon Inc プリント回路基板及びその接続構造
CN206602707U (zh) * 2017-03-07 2017-10-31 深南电路股份有限公司 一种基于双向黏合层的刚挠结合pcb
KR20180037178A (ko) * 2015-06-18 2018-04-11 엠코 테크놀로지즈 리미티드 3d 프린팅 장치 및 해당 3d 금속 프린팅 방법
KR102145239B1 (ko) * 2020-04-22 2020-08-18 서정하 3d 프린트된 벤딩 가이드 어댑터 블럭을 포함하는 폴더블 벤딩 타입 테스트 커넥터 모듈 및 그 제조방법 및 이를 이용한 테스트 소켓
KR20200103386A (ko) * 2019-02-25 2020-09-02 주식회사 이랜텍 박판형 데이터 케이블과 pcb간의 결합구조.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275932A (ja) * 1993-03-19 1994-09-30 Canon Inc プリント回路基板及びその接続構造
KR20180037178A (ko) * 2015-06-18 2018-04-11 엠코 테크놀로지즈 리미티드 3d 프린팅 장치 및 해당 3d 금속 프린팅 방법
CN206602707U (zh) * 2017-03-07 2017-10-31 深南电路股份有限公司 一种基于双向黏合层的刚挠结合pcb
KR20200103386A (ko) * 2019-02-25 2020-09-02 주식회사 이랜텍 박판형 데이터 케이블과 pcb간의 결합구조.
KR102145239B1 (ko) * 2020-04-22 2020-08-18 서정하 3d 프린트된 벤딩 가이드 어댑터 블럭을 포함하는 폴더블 벤딩 타입 테스트 커넥터 모듈 및 그 제조방법 및 이를 이용한 테스트 소켓

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