WO2023165189A1 - 基于晶圆传送监管控制方法、系统、计算机设备和存储介质 - Google Patents

基于晶圆传送监管控制方法、系统、计算机设备和存储介质 Download PDF

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WO2023165189A1
WO2023165189A1 PCT/CN2022/135181 CN2022135181W WO2023165189A1 WO 2023165189 A1 WO2023165189 A1 WO 2023165189A1 CN 2022135181 W CN2022135181 W CN 2022135181W WO 2023165189 A1 WO2023165189 A1 WO 2023165189A1
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Prior art keywords
target
transfer
control unit
wafer
transmission
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PCT/CN2022/135181
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English (en)
French (fr)
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申国莉
缪峰
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弥费科技(上海)股份有限公司
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Publication of WO2023165189A1 publication Critical patent/WO2023165189A1/zh

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32252—Scheduling production, machining, job shop
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present application belongs to the technical field of semiconductor wafer transfer control, and more precisely relates to a method, system, computer equipment and storage medium based on wafer transfer supervisory control.
  • the manufacturing execution system Manufacturing Execution System, MES
  • MES Manufacturing Execution System
  • MCS Material Control System
  • the present application provides a technical solution to solve the above technical problems.
  • An embodiment of the present application provides a supervision and control method based on wafer transfer, including: a manufacturing execution unit generates a transfer instruction, the transfer instruction carries the transfer information of the target wafer, the transfer instruction includes multiple commands, and the multiple commands are based on the instruction
  • the sequences together form the first transmission path;
  • the material control unit receives the transmission instruction sent by the production unit according to the instruction sequence;
  • the material control unit obtains the transmission status information of the target wafer in the transmission instruction;
  • the logistics The management and control unit adjusts the first transmission path in the transmission information according to the transmission state information, and generates the target transmission path of the target wafer, and sends the target transmission path to the material handling unit according to the instruction sequence; controls the material handling The unit transports the target wafer according to the target transport path sent by the logistics control unit.
  • a supervision and control system based on wafer transfer includes: a manufacturing execution unit, configured to generate a transfer instruction, the transfer instruction carries transfer information of a target wafer, the transfer instruction includes multiple commands, and the multiple commands are based on the instruction
  • the sequences together form the first transmission path;
  • the material control unit is used to receive the transmission instruction sent by the production unit according to the instruction sequence; obtain the transmission status information of the target wafer in the transmission instruction; according to the transmission status
  • the information adjusts the first transmission path in the transmission information, and generates the target transmission path of the target wafer, and sends the target transmission path to the material handling unit according to the instruction sequence; the material handling unit is used for according to the logistics
  • the target transport path sent by the management and control unit transports the target wafer.
  • a computer device includes a memory and a processor, the memory stores a computer program, wherein the processor implements the steps of the above method when executing the computer program.
  • a computer-readable storage medium on which a computer program is stored, wherein, when the computer program is executed by a processor, the steps of the above-mentioned method are realized.
  • FIG. 1 is a schematic structural diagram of a supervisory control system based on wafer transfer in an embodiment of the present application
  • FIG. 2 is a schematic flow diagram of a wafer transfer supervisory control method in an embodiment of the present application
  • Fig. 3 is a schematic flow chart of the operation of the material control unit in the embodiment of the present application.
  • Fig. 4 is a schematic flowchart of the step of generating a target transmission path in an embodiment of the present application.
  • the manufacturing process of semiconductor devices generally includes a series of processes, which are implemented in a specific order and usually within a specific time period using various equipment.
  • the main function of the material flow system in the wafer fabrication plant (Fab) is to transfer the wafer to each device at the correct time point, and to track the position and status of the wafer throughout the manufacturing process.
  • AMHS Automated Material Handling System
  • the manufacturing execution system Manufacturing Execution System, MES
  • MES Manufacturing Execution System
  • MCS Material Control System
  • An embodiment of the present application provides a supervision and control method based on wafer transfer, including: a manufacturing execution unit generates a transfer instruction, the transfer instruction carries the transfer information of the target wafer, the transfer instruction includes multiple commands, and the multiple commands are based on the instruction
  • the sequences together form the first transmission path;
  • the material control unit receives the transmission instruction sent by the production unit according to the instruction sequence;
  • the material control unit obtains the transmission status information of the target wafer in the transmission instruction;
  • the logistics The management and control unit adjusts the first transmission path in the transmission information according to the transmission state information, and generates the target transmission path of the target wafer, and sends the target transmission path to the material handling unit according to the instruction sequence; controls the material handling The unit transports the target wafer according to the target transport path sent by the logistics control unit.
  • the present application has the advantages that multiple instructions can be transmitted at one time, reducing the interaction time and times of transmission between different units, and improving the program processing speed.
  • the embodiment of the present application provides a supervision and control system based on wafer transfer.
  • the system includes a manufacturing execution unit 101 , a material control unit 102 and a material handling unit 103 .
  • the manufacturing execution unit 101 is configured to generate a transmission instruction, the transmission instruction carries the transmission information of the target wafer, the transmission instruction includes multiple commands, and the multiple commands together form the first transmission path according to the instruction sequence.
  • the manufacturing execution unit 101 is a production information management unit (MES) oriented to the execution layer of the workshop of the manufacturing enterprise.
  • the MES can issue a transmission command to the material control unit 102 (MCS) according to the storage bin list, and the MES will notify the MCS of the next stop of the wafer transfer.
  • MCS material control unit 102
  • the MCS uses the storage in the storage warehouse as the basis for load balancing.
  • the material control unit 102 is used to receive the transmission instruction sent by the production unit according to the instruction sequence; obtain the transmission status information of the target wafer in the transmission instruction; adjust the first transmission path in the transmission information according to the transmission status information, and generate the target wafer.
  • the target transfer path of the circle, the target transfer path is sent to the material handling unit according to the command sequence.
  • the material control unit is MCS (Material Control System), which is mainly used in the transportation management of the wafer transfer box (Foup) in the semiconductor factory. Inter-machine delivery and cross-floor delivery.
  • the delivery locations include machines, storage warehouses (STK), suspended temporary storage shelves (OHB), and conveyors (Convery). The goal is to reduce the delivery time between machines and improve delivery efficiency.
  • the material handling unit 103 is configured to transport the target wafer according to the target transport route sent by the logistics control unit.
  • the material handling unit 103 is an automatic material handling unit (AMHS: Automatic Material Handling System).
  • AMHS Automatic Material Handling System
  • the transportation of AMHS is generally divided into Interbay (inter-compartment) and Intrabay (inside the compartment).
  • OHS air-walking shuttle
  • OHT air-walking shuttle
  • Intrabay inside the compartment
  • OHT over-the-air shuttle
  • the embodiment of the present application provides a supervision and control method based on wafer transfer, the method includes the following steps:
  • step 201 the manufacturing execution unit generates a transmission instruction, the transmission instruction carries the transmission information of the target wafer, the transmission instruction includes multiple commands, and the multiple commands together form a first transmission path according to the instruction sequence.
  • the manufacturing execution unit MES can generate a transfer instruction, and the transfer instruction carries transfer information of the target wafer.
  • the transfer information may at least include the first transfer route of the target wafer, and may also include at least the initial storage location and the destination storage location of the target wafer.
  • the transmission information may also include the storage space required by the target wafer and the like.
  • the transmission instruction may include multiple commands, and the multiple commands together form the first transmission path. There is a sequence relationship between multiple commands, and the manufacturing execution unit can send the commands to the material control unit one by one according to the sequence relationship of the commands. MES sends the transmission command to MCS. Under normal circumstances, the commands in the transmission command will be sent one by one.
  • MCS When two commands are sent at one time, MCS guarantees to send the two commands on this transmission link according to the received command sequence. Give OHVC (sequences are not confusing). Therefore, multiple instructions can be transmitted at one time, reducing the interaction time and frequency of transmission between different units, and improving the program processing speed.
  • Step 202 the material control unit receives the transmission instruction sent by the production unit according to the instruction sequence.
  • the material control unit MCS receives the transmission instruction sent by the production unit according to the instruction sequence.
  • the material control unit may not receive multiple commands according to the order of the commands.
  • the material control unit will temporarily store the received multiple commands until it is determined that the commands have been received completely.
  • the material control unit then analyzes multiple commands and obtains the first transmission from the command. path.
  • Step 203 the material control unit obtains the transfer status information of the target wafer in the transfer instruction.
  • the material control unit MCS obtains the transfer status information of the target wafer in the transfer instruction.
  • the transfer status information may include whether the target wafer exists, the current actual location, whether there are unexecuted historical transfer instructions, and the like.
  • Step 204 adjust the first transport path in the transport information according to the transport status information, generate a target transport path for the target wafer, and send the target transport path to the material handling unit according to the instruction sequence.
  • the logistics control unit MCS adjusts the first transport path in the transport information according to the transport status information, and generates a target transport route for the target wafer. As shown in FIG. 3 , the logistics control unit MCS determines whether the target wafer exists in the delivery system according to the transmission status information. If it does not exist, the logistics control unit MCS reports an error and refuses to execute the instruction. The logistics control unit MCS also judges whether there is a historical transmission instruction according to the transmission status information. When there is no historical transmission instruction, the logistics control unit MCS generates the target transmission path; when there is a historical transmission instruction, the logistics control unit MCS replaces the historical transmission according to the newly received transmission instruction. instruction, and generate a target transfer path for the target wafer according to the newly received transfer instruction. The goods referred to in FIG. 3 are all target wafers, and the destination is the destination storage location.
  • the material control unit can send the commands to the material handling unit one by one according to the sequence of commands according to the sequence of commands.
  • Step 205 controlling the material handling unit to transport the target wafer according to the target transport route sent by the logistics control unit.
  • the material handling unit AMHS transports the target wafer according to the target delivery route sent by the logistics control unit.
  • the MCS ensures that the two commands are sent to the OHVC on the transmission link according to the received command sequence (the sequence cannot be confused). Therefore, multiple instructions can be transmitted at one time, reducing the interaction time and frequency of transmission between different units, and improving the program processing speed.
  • the logistics control unit adjusts the delivery information according to the delivery status information, and generates a target delivery path for the target wafer, including:
  • Step 401 identifying the first transfer path, initial storage location and destination storage location of the target wafer carried in the transfer information.
  • the server of the logistics control unit MCS can identify the first delivery route, the initial storage location and the destination storage location of the target wafer carried in the delivery information.
  • Step 402 obtain the routing node list mapped by all storage locations, the routing node list carries the attribute information of the routing node corresponding to the storage location, and the attribute information includes storage status information and weight.
  • the server of the logistics control unit MCS obtains the routing node list mapped by all storage locations, and the routing node list carries attribute information of the routing node corresponding to the storage location, and the attribute information includes storage status information and weight.
  • the storage location includes all geographic addresses of the MCS unit that can store the Foups, and thus also includes the geographic addresses of the initial storage location and the destination storage location.
  • One routing node can correspond to one storage location, but one storage location can correspond to multiple routing nodes.
  • a storage location may have at least one storage entrance of the Foup and a transmission exit of the Foup, and the storage entrance and the transmission exit respectively correspond to a routing node.
  • Attribute information can include the transmission equipment that the routing node can connect to, storage status information and weight, etc.
  • the weight is obtained according to the working frequency of the transmission equipment in the historical data of the material control unit.
  • the storage status information may include wafer information that the routing node has stored, wafer information that the routing node will store in a specific period of time
  • Step 403 screening the transfer routing nodes that can temporarily store the target wafer from the routing node list based on the storage state information.
  • the server in the MCS unit screens the transfer routing nodes that can temporarily store the wafers to be transferred from the routing node list based on the storage state information.
  • the server can filter out all idle transfer routing nodes according to the storage state information.
  • Step 404 Determine multiple second delivery paths for the initial storage location and the destination storage location according to the delivery routing node, the second delivery paths carry the current waiting time and estimated current transfer time of each delivery routing node.
  • the server in the MCS unit determines the connection between each node according to the selected transmission routing node, initial storage location and destination storage location, and determines the multiple between the initial storage location and the destination storage location according to the connection between each node. second transmission path.
  • the connection lines between the nodes indicate that there is a conveying device that can transfer wafers between the nodes.
  • the server in the MCS unit calculates the total elapsed time according to the current waiting time and the estimated current transfer time, and selects the second transmission path with the smallest total elapsed time.
  • Step 405 comparing the second transport path with the first transport path to generate a target transport path for the target wafer.
  • the server in the MCS unit calculates the total elapsed time of the first delivery path according to the current waiting time and the estimated current transfer time, and selects the second delivery path and the delivery path with the smaller total consumption time of the first delivery path as the target delivery path .
  • the above method can screen the shortest path available from the initial storage location and the destination storage location, so as to achieve the effect of short delivery time, and ensure the uniformity of delivery between the delivery equipment and the equipment receiving the wafers to be delivered, avoiding Some transmission devices are too busy or too idle to make full use of transmission resources.
  • screening the transfer routing node that can temporarily store the target wafer from the routing node list includes: obtaining the queuing wafer list and the pre-arranged wafer list of each routing node whose status is positive in the routing node list. Set the storage threshold; determine the transmission routing node that can temporarily store the target wafer according to the preset storage threshold, the target wafer, and the queuing wafers in the wafer list, and transfer the routing nodes that cannot store the target wafer for a preset number of times The status in the week is set to negative status.
  • the server obtains the queued wafer list and the preset storage threshold of each routing node whose status is positive in the routing node list.
  • the preset storage threshold may include the minimum storage capacity and maximum storage capacity of the storage bin where the routing node is located.
  • the server can count the used storage capacity according to the queuing wafer list of each routing node.
  • the server determines the transfer routing nodes that can temporarily store the wafers to be transferred according to the preset storage threshold, the wafers to be transferred, and the queued wafers in the wafer list, and transfers the routing nodes that cannot store the wafers to be transferred for a preset number of times
  • the status in the week is set to negative status.
  • Each transmission task is recorded as a transmission cycle, so the status information of the routing node will change at any time.
  • the state information is negative information; when the routing node is in an idle state, the state information is positive information.
  • the material control unit receives the transmission instruction sent by the production unit, including: the material control unit receives the transmission instruction, sets the status information of the transmission instruction as waiting, and stores the transmission instruction and the status information correspondingly; The management and control unit changes and stores the status information of the transmission instruction according to the transfer information fed back by the material handling unit.
  • the material control unit MCS receives the transmission instruction, sets the status information of the transmission instruction as waiting, and stores the transmission instruction and the status information correspondingly.
  • the MCS sets the status of the transmission instruction as "waiting in queue”, and stores the transmission instruction in the queue list.
  • the material control unit changes and stores the status information of the transmission instruction according to the transfer information fed back by the material handling unit.
  • the status information will be updated according to the events reported by the AMHS, for example, when the AMHS reports that the instruction is completed, the status information can be changed to "completed”; when the AMHS reports the instruction "the storage bin is full and cannot be stored", the status information can be changed to " Warehouse full, unfinished” etc.
  • the material control unit determines the cause of the fault according to the fault information; when it is determined that the cause of the fault is related to the receiving node storing the target wafer, the material control unit regenerates the target wafer The target transfer path; the material handling unit is controlled to transfer the target wafer according to the target transfer path regenerated by the logistics control unit.
  • the material control unit MCS determines the cause of the failure according to the failure information, and the material control unit MCS determines whether it is a failure of the storage bin or a failure of the material handling unit AMHS according to the feedback failure information.
  • the MCS can regenerate the target delivery path of the target wafer; circle for transport.
  • the MCS can also move the FOUP from the vehicle to the storage bin by issuing a transfer command from the vehicle to a nearby storage bin, and after the FOUP returns to the storage bin, the MCS moves the FOUP again to its intended storage location. If the new transmission fails again, the MCS should calculate the error number and try again. If the error count exceeds 50, the MCS shall issue an alarm and stop the command.
  • the material control unit when it is determined that the cause of the failure is related to the receiving node storing the target wafer, the material control unit regenerates the target delivery path of the target wafer, including: acquiring temporary nodes near the receiving node, and Obtain the target storage location of the target wafer; according to the temporary node, the target storage location and the routing node list, the material control unit regenerates the target transmission path of the target wafer.
  • the MCS obtains the temporary nodes near the receiving node, and obtains the destination storage location of the target wafer from the transmission information.
  • the material control unit may use steps 401-405 to regenerate the target transfer path of the target wafer according to the temporary node, the destination storage location and the routing node list.
  • a computer device including a memory and a processor, the memory stores a computer program, and the processor implements the following steps when executing the computer program: a manufacturing execution unit generates a transfer instruction, and the transfer instruction carries a target crystal For round transmission information, the transmission instruction contains multiple commands, and the multiple commands together form the first transmission path according to the instruction sequence; the material control unit receives the transmission instruction sent by the production unit according to the instruction sequence; the material control unit obtains the target wafer in the transmission instruction Transmission status information; the logistics control unit adjusts the first transmission path in the transmission information according to the transmission status information, and generates the target transmission path of the target wafer, and sends the target transmission path to the material handling unit according to the instruction sequence; controls the material handling unit The target wafer is transported according to the target transport path sent by the logistics control unit.
  • the first transmission path in the transmission information is adjusted according to the transmission state information, and the target transmission path of the target wafer is generated, including: identifying the target wafer carried in the transmission information The first transmission path, the initial storage location and the destination storage location; obtain the routing node list mapped by all storage locations, the routing node list carries the attribute information of the routing node corresponding to the storage location, and the attribute information includes storage status information and weight; Based on the storage state information, select the transfer routing node that can temporarily store the target wafer from the routing node list; determine the second transfer path of the initial storage location and the destination storage location according to the transfer routing node, and the second transfer path carries the information of each transfer routing node The current waiting time and the estimated current transfer time; comparing the second transport path with the first transport path to generate a target transport path for the target wafer.
  • the routing node that can temporarily store the target wafer is selected from the routing node list based on the storage status information, including: obtaining each routing node whose status is positive in the routing node list The list of queued wafers and the preset storage threshold; according to the preset storage threshold, target wafers, and the queued wafers in the wafer list, determine the transfer routing node that can temporarily store the target wafer, and will not store the route of the target wafer The node's status is set to negative status for a preset number of transfer cycles.
  • the processor when the processor executes the computer program, before obtaining the queuing wafer list of each routing node in the routing node list whose status is positive and the preset storage threshold, it also includes: receiving the information sent to the specific routing node Closing command; updating the state of each specific routing node in the routing node list to a negative state according to the closing command.
  • the material control unit implemented when the processor executes the computer program receives the transmission instruction sent by the production unit, including: the material control unit receives the transmission instruction, sets the status information of the transmission instruction as waiting, and sets the transmission instruction and The state information is correspondingly stored; the material control unit changes and stores the state information of the transmission instruction according to the transfer information fed back by the material handling unit.
  • the material control unit determines the cause of the fault according to the fault information; when it is determined that the cause of the fault is related to the receiving node storing the target wafer, the material The management and control unit regenerates the target delivery path of the target wafer; the material handling unit is controlled to transport the target wafer according to the target delivery path regenerated by the logistics control unit.
  • the material control unit regenerates the target delivery path of the target wafer, including: obtaining a temporary location near the receiving node node, and obtain the target storage location of the target wafer from the transmission information; according to the temporary node, the target storage location and the routing node list, the material control unit regenerates the target transmission path of the target wafer.
  • a computer-readable storage medium on which a computer program is stored.
  • the computer program is executed by a processor, the following steps are implemented: a manufacturing execution unit generates a transfer instruction, and the transfer instruction carries the transfer of the target wafer.
  • the transmission instruction contains multiple commands, and the multiple commands together form the first transmission path according to the instruction sequence;
  • the material control unit receives the transmission instruction sent by the production unit according to the instruction sequence;
  • the material control unit obtains the transmission status information of the target wafer in the transmission instruction
  • the logistics control unit adjusts the first transmission path in the transmission information according to the transmission status information, and generates the target transmission path of the target wafer, and sends the target transmission path to the material handling unit according to the instruction sequence;
  • the material handling unit is controlled according to the logistics control
  • the target transfer path sent by the unit transports the target wafer.
  • the first transmission path in the transmission information is adjusted according to the transmission state information, and the target transmission path of the target wafer is generated, including: identifying the target wafer carried in the transmission information The first transmission path of the circle, the initial storage location and the destination storage location; obtain the routing node list mapped by all storage locations, the routing node list carries the attribute information of the routing node corresponding to the storage location, and the attribute information includes storage status information and weight ; Based on the storage state information, select the transfer routing node that can temporarily store the target wafer from the routing node list; determine the second transfer path of the initial storage location and the destination storage location according to the transfer routing node, and the second transfer path carries each transfer routing node The current waiting time and the estimated current transfer time; comparing the second transport path with the first transport path to generate a target transport path for the target wafer.
  • the routing node that can temporarily store the target wafer is screened from the routing node list based on the storage status information, including: obtaining each route whose status is positive in the routing node list The node's queuing wafer list and the preset storage threshold; determine the transfer routing node that can temporarily store the target wafer according to the preset storage threshold, the target wafer, and the queuing wafers in the wafer list, and will not be able to store the target wafer.
  • the state of the routing node is set to a negative state for a preset number of transmission cycles.
  • the computer program when the computer program is executed by the processor, before obtaining the queuing wafer list of each routing node whose status is positive in the routing node list and the preset storage threshold, the computer program further includes: receiving and sending to a specific routing node according to the closing command; update the state of each specific routing node in the routing node list to a negative state according to the closing command.
  • the material control unit realized when the computer program is executed by the processor receives the transmission instruction sent by the production unit, including: the material control unit receives the transmission instruction, sets the status information of the transmission instruction as waiting, and sets the transmission instruction Correspondingly stored with the state information; the material control unit changes and stores the state information of the transmission instruction according to the transfer information fed back by the material handling unit.
  • the material control unit determines the cause of the failure according to the failure information; when it is determined that the cause of the failure is related to the receiving node storing the target wafer, The material control unit regenerates the target delivery path of the target wafer; the material handling unit is controlled to transport the target wafer according to the target delivery path regenerated by the logistics control unit.
  • the material management and control unit regenerates the target delivery path of the target wafer, including: acquiring the location near the receiving node Temporary node, and obtain the target storage location of the target wafer from the transmission information; according to the temporary node, the target storage location and the routing node list, the material control unit regenerates the target transmission path of the target wafer.

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Abstract

一种基于晶圆传送监管控制方法、系统、计算机设备和存储介质，属于晶圆传送控制领域，方法包括制造执行单元生成传输指令，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径（201）；物料管控单元接收根据指令序列发送的传输指令（202）；物料管控单元获取传输指令中目标晶圆的传输状态信息（203）；物料管控单元根据传输状态信息对传送信息中的第一传送路径进行调整，并生成目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元（204）；控制物料搬运单元根据物流管控单元发送来的目标传送路径对目标晶圆进行搬运（205）。可以一次性传输多条指令，减少不同单元之间传输的交互时间及次数，提高程序处理速度。

Description

基于晶圆传送监管控制方法、系统、计算机设备和存储介质
本申请基于申请号为“202210208127.7”、申请日为2022年03月04日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此以引入方式并入本申请。
技术领域
本申请属于半导体晶圆传送控制技术领域，更确切的说涉及一种基于晶圆传送监管控制方法、系统、计算机设备和存储介质。
背景技术
当晶圆传送盒(Front Opening Unified Pod，FOUP)欲传送时，制造执行系统(Manufacturing Execution System，MES)将给出目标存储柜(Destination Stocker)，之后，制造执行系统向自动化物料搬运系统中的物料控制系统(Material Control System，MCS)发出传送命令，后者接受命令后，通知传送管理者执行该传送。上述执行该传送过程中，MES仅能将传输指令一条一条发送给MCS，MCS需要和MES多次进行交互，然而这需要较长时间周期且成本较大。
基于此，本申请提供了解决以上技术问题的技术方案。
发明概述
本申请实施例提供了一种基于晶圆传送监管控制方法，包括：制造执行单元生成传输指令，所述传输指令携带有目标晶圆的传送信息，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径；物料管控单元接收所述生产单元根据指令序列发送的所述传输指令；所述物料管控单元获取所述传输指令中所述目标晶圆的传输状态信息；所述物流管控单元根据所述传输状态信息对所述传送信息中的第一传送路径进行调整，并生成所述目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元；控制物料搬运单元根据所述物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
一种基于晶圆传送监管控制系统，所述系统包括：制造执行单元，用于生成传输指令，所述传输指令携带有目标晶圆的传送信息，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径；物料管控单元，用于接收所述生产单元根据指令序列发送的所述传输指令；获取所述传输指令中所述目标晶圆的传输状态信息；根据所述传输状态信息对所述传送信息中的第一传送路径进行调整，并生成所述目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元；物料搬运单元，用于根据所述物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
一种计算机设备，包括存储器和处理器，所述存储器存储有计算机程序，其中，所述处理器执行所述计算机程序时实现上述方法的步骤。
一种计算机可读存储介质，其上存储有计算机程序，其中，所述计算机程序被处理器执行时实现上述的方法的步骤。
附图说明
下面将以明确易懂的方式，结合附图说明优选实施方式，对上述特性、技术特征、优点及其实现方式予以进一步说明。
图1是本申请的实施例中基于晶圆传送监管控制系统的结构简图；
图2是本申请的实施例中基于晶圆传送监管控制方法的流程示意图；
图3是本申请的实施例中物料管控单元运行的流程示意图；
图4是本申请的实施例中目标传送路径生成步骤的流程示意图。
本发明的实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请部分实施例进行进一步详细说明。
以下通过特定的具体实例说明本申请的实施例，本领域技术人员可由本说明书所揭露的内容轻易地了解本申请的其他优点与功效。显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。本申请还可以通过另外不同的具体实施例加以实施或应用，本说明书中的各项细节也可以基于不同观点与应用，在没有背离本申请的精神下进行各种修饰或改变。需说明的是，在不冲 突的情况下，以下实施例及实施例中的特征可以相互组合。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
要说明的是，下文描述在所附权利要求书的范围内的实施例的各种方面。应显而易见，本文中所描述的方面可体现于广泛多种形式中，且本文中所描述的任何特定结构及/或功能仅为说明性的。基于本申请，所属领域的技术人员应了解，本文中所描述的一个方面可与任何其它方面独立地实施，且可以各种方式组合这些方面中的两者或两者以上。举例来说，可使用本文中所阐述的任何数目和方面来实施设备及/或实践方法。另外，可使用除了本文中所阐述的方面中的一或多者之外的其它结构及/或功能性实施此设备及/或实践此方法。
还需要说明的是，以下实施例中所提供的图示仅以示意方式说明本申请的基本构想，图式中仅显示与本申请中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制，其实际实施时各组件的型态、数量及比例可为一种随意的改变，且其组件布局型态也可能更为复杂。
另外，在以下描述中，提供具体细节是为了便于透彻理解实例。然而，所属领域的技术人员将理解，可在没有这些特定细节的情况下实践所述方面。
半导体元件在制作过程中通常包含一系列工艺，上述工艺按照特定的顺序且通常在特定的时间段内利用各种设备实现。晶圆制造厂(Fab)中的物料流系统的主要功能在于在正确时间点将晶圆传送到每一设备上，并追踪整个制造过程中晶圆的位置以及状态。
自动化物料搬运系统(AutomatedMaterialHandingSystem，AMHS)由于相对手动装置能更有效、一致、以及安全地实现自动化功能，因而近年来被广泛地用于物料流系统中。
当晶圆传送盒(Front Opening Unified Pod，FOUP)欲传送时，制造执行系统(Manufacturing Execution System，MES)将给出目标存储柜(Destination Stocker)，之后，制造执行系统向自动化物料搬运系统中的物料控制系统(Material Control System，MCS)发出传送命令，后者接受命令后，通知传送管理者执行该传送。上述执行该传送过程中，MES仅能将传输指令一条一条发 送给MCS，MCS需要和MES多次进行交互，然而这需要较长时间周期且成本较大。
本申请实施例提供了一种基于晶圆传送监管控制方法，包括：制造执行单元生成传输指令，所述传输指令携带有目标晶圆的传送信息，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径；物料管控单元接收所述生产单元根据指令序列发送的所述传输指令；所述物料管控单元获取所述传输指令中所述目标晶圆的传输状态信息；所述物流管控单元根据所述传输状态信息对所述传送信息中的第一传送路径进行调整，并生成所述目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元；控制物料搬运单元根据所述物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
与相关技术相比，本申请的优点在于：可以一次性传输多条指令，减少不同单元之间传输的交互时间及次数，提高程序处理速度。
下面结合附图及实施例，对本申请部分实施例进行进一步详细说明。
如图1所示，本申请实施例提供一种基于晶圆传送监管控制系统，系统包括制造执行单元101、物料管控单元102和物料搬运单元103。
制造执行单元101，用于生成传输指令，传输指令携带有目标晶圆的传送信息，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径。制造执行单元101为面向制造企业车间执行层的生产信息化管理单元(MES)，MES可以根据存储仓列表向物料管控单元102(MCS)发出传输命令，由MES通知MCS晶圆下一站的传送位置，MCS收到MES的传送请求后，MCS使用存储仓中的存储库作为基础来进行负载平衡。
物料管控单元102，用于接收生产单元根据指令序列发送的传输指令；获取传输指令中目标晶圆的传输状态信息；根据传输状态信息对传送信息中的第一传送路径进行调整，并生成目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元。物料管控单元为MCS(MaterialControlSystem)，主要应用于半导体工厂对晶圆传送盒(Foup)的运送管理，运送的范围包括洁净室(FAB)内部运送、洁净室(FAB)与洁净室(FAB)之间的运送、跨楼层的运送，运送的地点包括机台、存储仓(STK)、悬挂式暂存货架(OHB)、传送机 (Convery)，其目标是减少机台之间运送时间，提升运送效率。
物料搬运单元103，用于根据物流管控单元发送来的目标传送路径对目标晶圆进行搬运。物料搬运单元103为自动物料搬送单元(AMHS：AutomaticMaterialHandlingSystem)。AMHS的搬送一般分为Interbay(隔室间)和Intrabay(隔室内)，OHS(空中走行式穿梭车)负责Interbay(隔室间)，而OHT(空中走行式穿梭车)负责Intrabay(隔室内)。OHT(空中走行式穿梭车)可以是AGV(自动导引传送车)或者PGV(导航定位车辆)或者RGV(有轨制导车辆)。
如图2所示，本申请实施例提供一种基于晶圆传送监管控制方法，方法包括以下步骤：
步骤201，制造执行单元生成传输指令，传输指令携带有目标晶圆的传送信息，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径。
制造执行单元MES可以生成传输指令，传输指令携带有目标晶圆的传送信息。传送信息可以至少包含目标晶圆的第一传送路径，也可以至少包含目标晶圆的初始储存位置以及目的储存位置。传送信息还可以包含目标晶圆需要的存储空间等。传输指令可以包含多条命令，多条命令共同组成第一传送路径。多条命令之间存在先后关系，制造执行单元可以根据命令的先后关系将命令逐条发送给物料管控单元。MES将传输指令发送给MCS，正常情况下会将传输指令中的命令一条一条发送，当出现一次性发送两条命令时，MCS保证在此传输链路上将两条命令依据收到指令序列发送给OHVC(序列不可混淆)。因而可以一次性传输多条指令，减少不同单元之间传输的交互时间及次数，提高程序处理速度。
步骤202，物料管控单元接收生产单元根据指令序列发送的传输指令。
物料管控单元MCS接收生产单元根据指令序列发送的传输指令。物料管控单元可以不按照命令的先后关系接收多条命令，物料管控单元会暂存接收到的多条命令，直至判定命令接收完全，物料管控单元再分析多条命令，并从命令获取第一传送路径。
步骤203，物料管控单元获取传输指令中目标晶圆的传输状态信息。
物料管控单元MCS获取传输指令中目标晶圆的传输状态信息。传输状态信息可以包含目标晶圆是否存在、当前实际所处的位置、是否存在未被执行的历史传送指令等。
步骤204，根据传输状态信息对传送信息中的第一传送路径进行调整，并生成目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元。
物流管控单元MCS根据传输状态信息对传送信息中的第一传送路径进行调整，并生成目标晶圆的目标传送路径。如图3所示，物流管控单元MCS根据传输状态信息确定目标晶圆是否在传送系统中存在，当不存在时，物流管控单元MCS报错并拒绝执行该指令。物流管控单元MCS还根据传输状态信息判断是否存在历史传送指令，当不存在时，物流管控单元MCS生成目标传送路径；当存在历史传送指令时，物流管控单元MCS根据新接收的传送指令替代历史传送指令，并根据新接收的传送指令生成目标晶圆的目标传送路径。图3中所指的货物均为目标晶圆，目的地为目的存储位置。物料管控单元可以按照指令序列根据命令的先后关系将命令逐条发送给物料搬运单元。
步骤205，控制物料搬运单元根据物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
物料搬运单元AMHS根据物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
上述方法中，当出现一次性发送两条命令时，MCS保证在此传输链路上将两条命令依据收到指令序列发送给OHVC(序列不可混淆)。因而可以一次性传输多条指令，减少不同单元之间传输的交互时间及次数，提高程序处理速度。
如图4所示，在其中一个实施例中，物流管控单元根据传输状态信息对传送信息进行调整，并生成目标晶圆的目标传送路径，包括：
步骤401，识别传送信息中携带目标晶圆的第一传送路径、初始储存位置以及目的储存位置。
物流管控单元MCS的服务器可以识别出传送信息中携带目标晶圆的第一传送路径、初始储存位置以及目的储存位置。
步骤402，获取由所有储存位置映射的路由节点列表，路由节点列表携带有与储存位置对应的路由节点的属性信息，属性信息包括存储状态信息和权重。
物流管控单元MCS的服务器获取由所有储存位置映射的路由节点列表，路由节点列表携带有与储存位置对应的路由节点的属性信息，属性信息包括存储状态信息和权重。储存位置囊括在MCS单元的所有可以存储晶圆传送盒(Foup)的地理地址，因而也包含初始储存位置以及目的储存位置的地理地址。一个路由节点可与一个储存位置对应，但一个储存位置可以与多个路由节点对应。一个储存位置可以具有至少一个晶圆传送盒(Foup)的存储入口和晶圆传送盒(Foup)的传送出口，存储入口和传送出口分别与一个路由节点对应。属性信息可以包含该路由节点可对接的传输设备、存储状态信息和权重等。权重是根据物料管控单元的历史数据中传输设备的工作频次得到的。存储状态信息可以包含该路由节点已存储的晶圆信息、该路由节点在特定时间段即将存储的晶圆信息等。
步骤403，基于存储状态信息从路由节点列表中筛选可暂时存储目标晶圆的传送路由节点。
MCS单元中的服务器基于存储状态信息从路由节点列表中筛选可暂时存储待传送晶圆的传送路由节点。服务器可以根据存储状态信息筛选出所有空闲的传送路由节点。
步骤404，根据传送路由节点确定初始储存位置以及目的储存位置的多条第二传送路径，第二传送路径携带有各传送路由节点的当前等待时间和预估当前转移时间。
MCS单元中的服务器根据筛选出的传送路由节点、初始储存位置以及目的储存位置确定各节点之间的连线，并根据各节点之间的连线确定初始储存位置以及目的储存位置之间的多条第二传送路径。节点之间的连线表示节点之间存在可以传送晶圆的输送设备。MCS单元中的服务器根据当前等待时间和预估当前转移时间计算总消耗时间，并选取总消耗时间最小的第二传送路径。
步骤405，将该第二传送路径与第一传送路径进行比对，生成目标晶圆的目标传送路径。
MCS单元中的服务器根据当前等待时间和预估当前转移时间计算第一传送路径的总消耗时间，并将第二传送路径与第一传送路径中的总消耗时间小的传送路径选择为目标传送路径。
上述方法，可以筛选从初始储存位置以及目的储存位置中的可使用的最短路径，从而达到传送时间短的效果，并保证传送设备到达各接收待传送晶圆的设备之间的传送均匀性，避免某些传送设备过于忙碌或是过于空闲，实现传送资源的充分利用。
在其中一个实施例中，基于存储状态信息从路由节点列表中筛选可暂时存储目标晶圆的传送路由节点，包括：获取路由节点列表中状态为肯定状态的各路由节点的排队晶圆清单以及预设存储阈值；根据预设存储阈值、目标晶圆以及晶圆清单中的排队晶圆确定可暂时存储目标晶圆的传送路由节点，并将不可存储目标晶圆的路由节点在预设次数的传送周次中的状态设置为否定状态。
服务器获取路由节点列表中状态为肯定状态的各路由节点的排队晶圆清单以及预设存储阈值。预设存储阈值可以包含路由节点所在的储存仓的最小存储容量和最大存储容量等。服务器可以根据各路由节点的排队晶圆清单统计已使用的存储容量。服务器根据预设存储阈值、待传送晶圆以及晶圆清单中的排队晶圆确定可暂时存储待传送晶圆的传送路由节点，并将不可存储待传送晶圆的路由节点在预设次数的传送周次中的状态设置为否定状态。每次传送任务被记为一个传送周次，因此路由节点的状态信息会随时发生变化。当路由节点处于接收晶圆状态或即将接收晶圆状态时，状态信息为否定信息；当路由节点处于空闲状态时，状态信息为肯定信息。
在其中一个实施例中，物料管控单元接收生产单元发送的传输指令，包括：物料管控单元接收传输指令，将传输指令的状态信息设置为等待中，并将传输指令和状态信息进行对应存储；物料管控单元根据物料搬运单元反馈的转移信息将传输指令的状态信息进行变更并存储。
物料管控单元MCS接收传输指令，将传输指令的状态信息设置为等待中，并将传输指令和状态信息进行对应存储。当MCS接收到新的传输指令时，MCS将传输指令的状态设置为“队列等待中”，并将传输指令存储在队列列表中。 物料管控单元根据物料搬运单元反馈的转移信息将传输指令的状态信息进行变更并存储。状态信息将根据AMHS报告的事件进行更新，例如，当AMHS报告指令完成时，状态信息可以变更为“已完成”；当AMHS报告指令“存储仓满，无法存储”时，状态信息可以变更为“仓满，未完成”等。
在其中一个实施例中，当物料搬运单元反馈传送发生故障时，物料管控单元根据故障信息确定故障起因；当确定故障起因与存储目标晶圆的接收节点相关时，物料管控单元重新生成目标晶圆的目标传送路径；控制物料搬运单元根据物流管控单元重新生成的目标传送路径对目标晶圆进行搬运。
当物料搬运单元AMHS反馈传送发生故障时，物料管控单元MCS根据故障信息确定故障起因，物料管控单元MCS根据反馈的故障信息确定是存储仓故障还是物料搬运单元AMHS的故障。当确定为存储仓故障时，由于FOUP仍在物料搬运单元AMHS的搬运车上，MCS可以重新生成目标晶圆的目标传送路径；控制物料搬运单元根据物流管控单元重新生成的目标传送路径对目标晶圆进行搬运。MCS也可以通过发出从车辆到附近存储仓的转移命令，将FOUP从车辆移动到存储仓，在FOUP返回到存储仓之后，MCS再次将FOUP移动到其目的储存位置。如果新的传输再次失败，MCS应计算错误号，然后重试。如果错误计数超过50，MCS应发出报警并停止该命令。
在其中一个实施例中，当确定故障起因与存储目标晶圆的接收节点相关时，物料管控单元重新生成目标晶圆的目标传送路径，包括：获取接收节点附近的临时节点，并从传送信息中获取目标晶圆的目的储存位置；根据临时节点、目的存储位置以及路由节点列表，物料管控单元重新生成目标晶圆的目标传送路径。
MCS获取接收节点附近的临时节点，并从传送信息中获取目标晶圆的目的储存位置。物料管控单元可以采用步骤401～405根据临时节点、目的存储位置以及路由节点列表，重新生成目标晶圆的目标传送路径。
在一个实施例中，提供了一种计算机设备，包括存储器和处理器，该存储器存储有计算机程序，该处理器执行计算机程序时实现以下步骤：制造执行单元生成传输指令，传输指令携带有目标晶圆的传送信息，传输指令包含多条命 令，多条命令根据指令序列共同组成第一传送路径；物料管控单元接收生产单元根据指令序列发送的传输指令；物料管控单元获取传输指令中目标晶圆的传输状态信息；物流管控单元根据传输状态信息对传送信息中的第一传送路径进行调整，并生成目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元；控制物料搬运单元根据物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
在一个实施例中，处理器执行计算机程序时实现的根据传输状态信息对传送信息中的第一传送路径进行调整，并生成目标晶圆的目标传送路径，包括：识别传送信息中携带目标晶圆的第一传送路径、初始储存位置以及目的储存位置；获取由所有储存位置映射的路由节点列表，路由节点列表携带有与储存位置对应的路由节点的属性信息，属性信息包括存储状态信息和权重；基于存储状态信息从路由节点列表中筛选可暂时存储目标晶圆的传送路由节点；根据传送路由节点确定初始储存位置以及目的储存位置的第二传送路径，第二传送路径携带有各传送路由节点的当前等待时间和预估当前转移时间；将该第二传送路径与第一传送路径进行比对，生成目标晶圆的目标传送路径。
在一个实施例中，处理器执行计算机程序时实现的基于存储状态信息从路由节点列表中筛选可暂时存储目标晶圆的传送路由节点，包括：获取路由节点列表中状态为肯定状态的各路由节点的排队晶圆清单以及预设存储阈值；根据预设存储阈值、目标晶圆以及晶圆清单中的排队晶圆确定可暂时存储目标晶圆的传送路由节点，并将不可存储目标晶圆的路由节点在预设次数的传送周次中的状态设置为否定状态。
在一个实施例中，处理器执行计算机程序时实现的获取路由节点列表中状态为肯定状态的各路由节点的排队晶圆清单以及预设存储阈值之前，还包括：接收发送来针对特定路由节点的关闭命令；根据关闭命令对路由节点列表中的各特定路由节点的状态更新为否定状态。
在一个实施例中，处理器执行计算机程序时实现的物料管控单元接收生产单元发送的传输指令，包括：物料管控单元接收传输指令，将传输指令的状态信息设置为等待中，并将传输指令和状态信息进行对应存储；物料管控单元根 据物料搬运单元反馈的转移信息将传输指令的状态信息进行变更并存储。
在一个实施例中，处理器执行计算机程序时实现的当物料搬运单元反馈传送发生故障时，物料管控单元根据故障信息确定故障起因；当确定故障起因与存储目标晶圆的接收节点相关时，物料管控单元重新生成目标晶圆的目标传送路径；控制物料搬运单元根据物流管控单元重新生成的目标传送路径对目标晶圆进行搬运。
在一个实施例中，处理器执行计算机程序时实现的当确定故障起因与存储目标晶圆的接收节点相关时，物料管控单元重新生成目标晶圆的目标传送路径，包括：获取接收节点附近的临时节点，并从传送信息中获取目标晶圆的目的储存位置；根据临时节点、目的存储位置以及路由节点列表，物料管控单元重新生成目标晶圆的目标传送路径。
在一个实施例中，提供了一种计算机可读存储介质，其上存储有计算机程序，计算机程序被处理器执行时实现以下步骤：制造执行单元生成传输指令，传输指令携带有目标晶圆的传送信息，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径；物料管控单元接收生产单元根据指令序列发送的传输指令；物料管控单元获取传输指令中目标晶圆的传输状态信息；物流管控单元根据传输状态信息对传送信息中的第一传送路径进行调整，并生成目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元；控制物料搬运单元根据物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
在一个实施例中，计算机程序被处理器执行时实现的根据传输状态信息对传送信息中的第一传送路径进行调整，并生成目标晶圆的目标传送路径，包括：识别传送信息中携带目标晶圆的第一传送路径、初始储存位置以及目的储存位置；获取由所有储存位置映射的路由节点列表，路由节点列表携带有与储存位置对应的路由节点的属性信息，属性信息包括存储状态信息和权重；基于存储状态信息从路由节点列表中筛选可暂时存储目标晶圆的传送路由节点；根据传送路由节点确定初始储存位置以及目的储存位置的第二传送路径，第二传送路径携带有各传送路由节点的当前等待时间和预估当前转移时间；将该第二传送 路径与第一传送路径进行比对，生成目标晶圆的目标传送路径。
在一个实施例中，计算机程序被处理器执行时实现的基于存储状态信息从路由节点列表中筛选可暂时存储目标晶圆的传送路由节点，包括：获取路由节点列表中状态为肯定状态的各路由节点的排队晶圆清单以及预设存储阈值；根据预设存储阈值、目标晶圆以及晶圆清单中的排队晶圆确定可暂时存储目标晶圆的传送路由节点，并将不可存储目标晶圆的路由节点在预设次数的传送周次中的状态设置为否定状态。
在一个实施例中，计算机程序被处理器执行时实现的获取路由节点列表中状态为肯定状态的各路由节点的排队晶圆清单以及预设存储阈值之前，还包括：接收发送来针对特定路由节点的关闭命令；根据关闭命令对路由节点列表中的各特定路由节点的状态更新为否定状态。
在一个实施例中，计算机程序被处理器执行时实现的物料管控单元接收生产单元发送的传输指令，包括：物料管控单元接收传输指令，将传输指令的状态信息设置为等待中，并将传输指令和状态信息进行对应存储；物料管控单元根据物料搬运单元反馈的转移信息将传输指令的状态信息进行变更并存储。
在一个实施例中，计算机程序被处理器执行时实现的当物料搬运单元反馈传送发生故障时，物料管控单元根据故障信息确定故障起因；当确定故障起因与存储目标晶圆的接收节点相关时，物料管控单元重新生成目标晶圆的目标传送路径；控制物料搬运单元根据物流管控单元重新生成的目标传送路径对目标晶圆进行搬运。
在一个实施例中，计算机程序被处理器执行时实现的当确定故障起因与存储目标晶圆的接收节点相关时，物料管控单元重新生成目标晶圆的目标传送路径，包括：获取接收节点附近的临时节点，并从传送信息中获取目标晶圆的目的储存位置；根据临时节点、目的存储位置以及路由节点列表，物料管控单元重新生成目标晶圆的目标传送路径。
以上所述，仅为本申请的具体实施例，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以 权利要求的保护范围为准。

Claims (10)

  1. 一种基于晶圆传送监管控制方法，包括：
    制造执行单元生成传输指令，所述传输指令携带有目标晶圆的传送信息，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径；
    物料管控单元接收所述生产单元根据所述指令序列发送的所述传输指令；
    所述物料管控单元获取所述传输指令中所述目标晶圆的传输状态信息；
    所述物流管控单元根据所述传输状态信息对所述传送信息中的第一传送路径进行调整，并生成所述目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元；
    控制物料搬运单元根据所述物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
  2. 根据权利要求1所述的方法，其中，所述物流管控单元根据所述传输状态信息对所述传送信息中的第一传送路径进行调整，并生成所述目标晶圆的目标传送路径，包括：
    识别所述传送信息中携带所述目标晶圆的第一传送路径、初始储存位置以及目的储存位置；
    获取由所有储存位置映射的路由节点列表，所述路由节点列表携带有与所述储存位置对应的路由节点的属性信息，所述属性信息包括存储状态信息和权重；
    基于所述存储状态信息从所述路由节点列表中筛选可暂时存储所述目标晶圆的传送路由节点；
    根据所述传送路由节点确定所述初始储存位置以及所述目的储存位置的第二传送路径，所述第二传送路径携带有各所述传送路由节点的当前等待时间和预估当前转移时间；
    将该第二传送路径与所述第一传送路径进行比对，生成所述目标晶圆的目标传送路径。
  3. 根据权利要求2所述的方法，其中，所述基于所述存储状态信息从所述路由节点列表中筛选可暂时存储所述目标晶圆的传送路由节点，包括：
    获取所述路由节点列表中状态为肯定状态的各所述路由节点的排队晶圆 清单以及预设存储阈值；
    根据所述预设存储阈值、所述目标晶圆以及所述晶圆清单中的排队晶圆确定可暂时存储所述目标晶圆的传送路由节点，并将不可存储所述目标晶圆的路由节点在预设次数的传送周次中的状态设置为否定状态。
  4. 根据权利要求3所述的方法，其中，所述获取所述路由节点列表中状态为肯定状态的各所述路由节点的排队晶圆清单以及预设存储阈值之前，还包括：
    接收发送来针对特定路由节点的关闭命令；
    根据所述关闭命令对所述路由节点列表中的各所述特定路由节点的状态更新为否定状态。
  5. 根据权利要求1所述的方法，其中，所述物料管控单元接收所述生产单元发送的所述传输指令，包括：
    所述物料管控单元接收所述传输指令，将所述传输指令的状态信息设置为等待中，并将所述传输指令和所述状态信息进行对应存储；
    所述物料管控单元根据所述物料搬运单元反馈的转移信息将所述传输指令的状态信息进行变更并存储。
  6. 根据权利要求1所述的方法，其中，当所述物料搬运单元反馈传送发生故障时，所述物料管控单元根据故障信息确定故障起因；
    当确定所述故障起因与存储目标晶圆的接收节点相关时，所述物料管控单元重新生成所述目标晶圆的目标传送路径；
    控制物料搬运单元根据所述物流管控单元重新生成的目标传送路径对目标晶圆进行搬运。
  7. 根据权利要求6所述的方法，其中，当确定所述故障起因与存储目标晶圆的接收节点相关时，所述物料管控单元重新生成所述目标晶圆的目标传送路径，包括：
    获取所述接收节点附近的临时节点，并从所述传送信息中获取所述目标晶圆的目的储存位置；
    根据所述临时节点、所述目的存储位置以及路由节点列表，所述物料管 控单元重新生成所述目标晶圆的目标传送路径。
  8. 一种基于晶圆传送监管控制系统，其中，所述系统包括：
    制造执行单元，用于生成传输指令，所述传输指令携带有目标晶圆的传送信息，传输指令包含多条命令，多条命令根据指令序列共同组成第一传送路径；
    物料管控单元，用于接收所述生产单元根据指令序列发送的所述传输指令；获取所述传输指令中所述目标晶圆的传输状态信息；根据所述传输状态信息对所述传送信息中的第一传送路径进行调整，并生成所述目标晶圆的目标传送路径，根据指令序列将目标传送路径发送给物料搬运单元；
    物料搬运单元，用于根据所述物流管控单元发送来的目标传送路径对目标晶圆进行搬运。
  9. 一种计算机设备，包括存储器和处理器，所述存储器存储有计算机程序，其中，所述处理器执行所述计算机程序时实现权利要求1至7中任一项所述方法的步骤。
  10. 一种计算机可读存储介质，其上存储有计算机程序，其中，所述计算机程序被处理器执行时实现权利要求1至7中任一项所述的方法的步骤。
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