WO2023160141A1 - 扬声器及电子设备 - Google Patents

扬声器及电子设备 Download PDF

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Publication number
WO2023160141A1
WO2023160141A1 PCT/CN2022/138938 CN2022138938W WO2023160141A1 WO 2023160141 A1 WO2023160141 A1 WO 2023160141A1 CN 2022138938 W CN2022138938 W CN 2022138938W WO 2023160141 A1 WO2023160141 A1 WO 2023160141A1
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WO
WIPO (PCT)
Prior art keywords
voice coil
magnetic
magnetic circuit
sound
circuit system
Prior art date
Application number
PCT/CN2022/138938
Other languages
English (en)
French (fr)
Inventor
贾锋超
张铁男
陈志鹏
Original Assignee
华为技术有限公司
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Publication date
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Publication of WO2023160141A1 publication Critical patent/WO2023160141A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the embodiments of the present application relate to the technical field of electronic devices, and in particular to a loudspeaker and electronic equipment.
  • Speakers are essential components in electronic devices such as headphones and smart glasses to convert received electrical signals into acoustic signals.
  • speakers built in electronic equipment With the evolution trend of miniaturization and portability of electronic equipment, speakers built in electronic equipment also need to be miniaturized, and at the same time, it is necessary to further improve the performance of speakers while miniaturizing to meet consumer demand.
  • the loudspeaker may include multiple sounding units, and different sounding units are respectively responsible for the corresponding frequency bands through analog frequency division or digital frequency division, so as to broaden the overall bandwidth of the loudspeaker, so that electronic devices such as earphones sound quality is improved.
  • the loudspeaker may include a low-frequency unit and a high-frequency unit, the low-frequency unit is responsible for low-frequency sound generation, and the high-frequency unit is responsible for high-frequency sound generation, so that the low-frequency sensitivity and high-frequency sensitivity of the speaker are improved.
  • each sounding unit of the above-mentioned speaker is independent of each other, so that the overall size of the speaker is relatively large, and the assembly process is complicated.
  • Embodiments of the present application provide a loudspeaker and electronic equipment, which reduce the occupied size of the loudspeaker and simplify the assembly process of the loudspeaker.
  • an embodiment of the present application provides a loudspeaker, including a first vibration system, a second vibration system, and a magnetic circuit system;
  • the magnetic circuit system includes a first side and a second side opposite to each other in the thickness direction of the magnetic circuit system , the first vibration system is located on the first side of the magnetic circuit system, the second vibration system is located on the second side of the magnetic circuit system, and the magnetic circuit system is configured to provide a magnetic source for the first vibration system and the second vibration system to vibrate, the first A vibration system and a magnetic circuit system are formed as a first sounding unit, and a second vibration system and a magnetic circuit system are formed as a second sounding unit; the parts of the first side and the second side opposite in the thickness direction are magnetically opposite, and the first The working frequency bands of the sounding unit and the second sounding unit are different.
  • the first vibration system of the first sound generating unit is arranged on the first side of the magnetic circuit system
  • the second vibration system of the second sound generating unit is arranged on the second side of the magnetic circuit system
  • the magnetic circuit system is provided as a magnetic source for vibrating the first sub-vibration system and the second vibration system, and at least part of the magnetic circuit system on the first side and the second side opposite in the thickness direction is magnetically opposite, so that the first sound
  • the first vibration system of the unit can vibrate under the action of the magnetic field of the magnetic circuit system, so that the first vibration system pushes the air on both sides to vibrate, so that the first sound unit can produce a certain frequency band of sound.
  • the second vibration system can be Vibration occurs under the action of the magnetic field of the magnetic circuit system, so that the second vibration system pushes the air on both sides to vibrate, so that the second sounding unit generates sound of a certain frequency band.
  • the working frequency bands of the first sounding unit and the second sounding unit can be different, the overall frequency bandwidth of the speaker can be widened, thereby improving the sound quality.
  • the first vibration system and the second vibration system of the first sound unit share the same magnetic circuit system, which reduces the number of components of the speaker, thus simplifies the assembly process of the speaker, reduces the overall size of the speaker, and makes the implementation of the present application Example speakers are miniaturized.
  • the magnetic circuit system includes a magnetic part and a support part, and the support part and the magnetic part are sequentially arranged along the thickness direction of the magnetic circuit system, and the first vibration system is supported on the side of the support part facing away from the magnetic part.
  • the second vibration system is located on the side of the magnetic part facing away from the supporting part, the magnetic part has a first gap, and at least part of the second vibration system is inserted in the first gap, so that the second sounding unit can be a moving coil unit,
  • the second sounding unit can be responsible for sounding in the low frequency range, and on the other hand, the structure of the second sounding unit is also simplified.
  • the first vibration system is stably supported on one side of the magnetic circuit system.
  • the setting of the support also ensures that the first vibration system and the magnetic circuit system A stable cavity is formed between one end, making the rear cavity structure of the first sounding unit formed by the first vibration system and the magnetic circuit system more stable.
  • the magnetic component includes a central magnet and a side magnet.
  • the side magnet is sheathed on the outer periphery of the center magnet, and a first gap is formed between the side magnet and the center magnet.
  • the center magnet and the side magnet The magnetism at one end of the magnet facing the first vibration system is opposite.
  • the magnetism at the end of the center magnet and the side magnet is opposite to the first vibration system, which makes the center magnet and the side magnet together form a magnetic circuit, wherein a part of the magnetic circuit On the side of the magnetic part facing the first vibration system, an inverted U-shaped magnetic field can be formed.
  • the first vibration system can vibrate under the action of the inverted U-shaped magnetic field, and the other part of the magnetic force line of the magnetic circuit can be located between the first gap and In the second gap, it can act on the second vibration system to make the second vibration system vibrate, so as to ensure the driving reliability of the magnetic parts for the first vibration system and the second vibration system, and ensure the acoustic performance of the speaker.
  • the first vibration system includes a first voice coil, the first voice coil is located in the magnetic field of the magnetic circuit system, and the projection area of the first voice coil on the magnetic circuit system is at least partly from the first gap overlapping.
  • the first voice coil of the first vibration system can be located in the magnetic circuit generated by the magnetic circuit system, for example, the first voice coil can be located on the top of the inverted U-shaped magnetic field on one side of the magnetic circuit system, so that the inverted U-shaped magnetic field
  • the horizontal magnetic force line at the top passes vertically through the side of the first voice coil, so that the first voice coil after electrification can move along the thickness direction driven by the Lorentz force.
  • the projection of the top position of the inverted U-shaped magnetic field on the magnetic member is located on the first gap.
  • the magnetic field facing the first gap position has a horizontal magnetic field parallel to the first magnetic member.
  • the projected area of the coil on the magnetic circuit system at least partially overlaps the first gap, that is, the first voice coil is arranged at a position facing the first gap, so as to increase the area of the first voice coil subjected to the horizontal magnetic force lines, thereby increasing the first
  • the magnetic induction intensity of the horizontal magnetic field received by the voice coil improves the sensitivity of the first sounding unit.
  • the first gap can be used as a positioning reference for the first voice coil, that is, it only needs to set the first voice coil on one side of the first gap, for example, the first voice coil is facing the first gap, and the second gap can be realized.
  • the positioning of a voice coil perpendicular to the thickness direction, and then by adjusting the position of the first voice coil in the thickness direction, the first voice coil can be placed at the top position of the inverted U-shaped magnetic field.
  • the first voice coil after electrification A voice coil moves along the thickness direction under the action of the magnetic field at the top of the inverted U-shaped magnetic field.
  • the positioning efficiency of the first voice coil is improved, thereby improving the assembly efficiency of the speaker.
  • the magnetic circuit system further includes a washer located between the magnetic part and the second vibration system; the washer includes a central washer and a side washer, and in the second section, the side washer is sleeved on The periphery of the center washer; at least part of the center washer faces the center magnet of the magnetic member, at least part of the side washer faces the side magnet of the magnetic member, and between the outer edge of the center washer and the inner edge of the side washer A second gap is formed, the second gap communicates with the first gap, at least part of the second vibration system is inserted in the first gap and the second gap; the second section is perpendicular to the thickness direction of the magnetic member.
  • the magnetic field lines on the side of the magnetic part facing away from the first vibration system form a loop and concentrate on the second side of the magnetic part, such as the first gap and the central Huasi In the second gap between the company and Bian Huasi, it is ensured that the second vibration system in the first gap and the second gap can receive a strong magnetic induction intensity, thereby improving the sensitivity of the second vibration system and making the second sound unit The sound pressure level is guaranteed.
  • a concave cavity is formed on the side of the magnetic circuit system facing the first vibration system, and the first cavity is formed between the first vibration system, the surface of the magnetic circuit system, and the inner wall of the concave cavity.
  • the first cavity is the back cavity of the first sounding unit, that is, the setting of the concave cavity in the magnetic circuit system increases the space size of the back cavity of the first sounding unit and reduces the stiffness of the back cavity of the first sounding unit , so that the resonance point of the first sounding unit can be moved forward to the mid-frequency range or low-frequency range, thereby improving the mid-frequency or low-frequency sensitivity of the first sounding unit, making the first sounding unit more suitable for mid-frequency output or low-frequency output, and enhancing the speaker’s
  • the performance of intermediate frequency or low frequency is convenient to meet the actual demand, and the structure of the first sound generating unit is simple, which is convenient for manufacture.
  • the second vibration system includes a second voice coil and a second diaphragm, at least part of the second voice coil is inserted in the first magnetic gap and the second magnetic gap of the magnetic circuit system, and the second The two diaphragms are located on the side of the magnetic circuit system facing away from the first vibration system, a second cavity is formed between the second diaphragm and the magnetic circuit system, and the cavity and the second cavity are sealed.
  • the second cavity can be used as the front cavity of the second sounding unit.
  • the rear cavity of the first sounding unit is sealed and isolated from the front cavity of the second sounding unit. , improving the crosstalk problem between the first sounding unit and the second sounding unit.
  • the concave cavity penetrates to the surface of the magnetic part facing the Huasi of the magnetic circuit system to form a blind hole in the magnetic circuit system, so that the Huasi can connect the first cavity and the second cavity
  • the body is sealed and isolated to improve the crosstalk problem between the first sounding unit and the second sounding unit.
  • the concave cavity as a blind hole
  • the first cavity and the second cavity can be connected by the structure of the magnetic circuit system itself.
  • the body is sealed and isolated, and the number of parts of the speaker is also reduced, thereby simplifying the assembly process of the speaker.
  • the resonance point of the first sounding unit can be moved forward to the intermediate frequency range, which can improve the intermediate frequency sensitivity of the first sounding unit, that is, the first sounding unit is more It is suitable for intermediate frequency output, and enhances the intermediate frequency performance of the loudspeaker, so that the embodiment of the present application can be responsible for low-frequency and intermediate-frequency sound generation.
  • the concave cavity penetrates to the side of the magnetic circuit system facing the second cavity, so as to form a through hole in the magnetic circuit system, so as to simplify the manufacturing process of the concave cavity and improve the production efficiency of the speaker .
  • a damping mesh is provided on the end cover of the through hole facing the second cavity to separate the concave cavity from the second cavity and improve the sealing between the first cavity and the second cavity , to ensure the acoustic performance of the second sounding unit and the first sounding unit.
  • the second sounding unit at least a seal is provided in the second cavity, and the two ends of the seal are respectively connected to the magnetic circuit system and the second diaphragm in a sealed manner, and the second diaphragm faces away from the
  • a third cavity is formed on one side of the magnetic circuit system, and a conduction hole is formed in the sealing member, and the two ends of the conduction hole communicate with the concave cavity and the third cavity respectively.
  • the third cavity can be used as the back cavity of the second sounding unit, and the concave cavity is connected with the third cavity through the conduction hole in the sealing member, that is, the back cavity of the second sounding unit also serves as the first sounding unit Part of the back cavity of the first sound unit to expand the back cavity space of the first sound unit, so that the resonance frequency of the first sound unit can be moved forward to the low frequency range, so that the low frequency sensitivity and transient characteristics of the first sound unit can be improved, thereby The low-frequency performance of the loudspeaker of the embodiment of the present application is improved.
  • both ends of the sealing member are sealed and connected with the magnetic circuit system and the second diaphragm, so as to improve the sealing between the first cavity and the second cavity, and improve or avoid the gap between the second sound unit and the first sound unit. Crosstalk occurs.
  • the seal is located in the second cavity, which also ensures that the size of the speaker is not affected.
  • the concave cavity is located in the central area of the magnetic circuit system, wherein the projection of the first voice coil on the magnetic circuit system is located in the outer periphery of the central area, that is, the concave cavity is set in the magnetic circuit system with a relatively low magnetic induction.
  • Weak position in this way, can reduce the impact of the setting of the concave cavity on the magnetic induction intensity generated by the magnetic circuit system, thereby ensuring the magnetic induction intensity of the magnetic circuit system received by the first voice coil and the second voice coil, that is, ensuring that the first voice coil and the force factor of the second voice coil, so that the sound pressure level of the speaker is not affected.
  • the concave cavity is filled with sound-absorbing components, so as to reduce the interference of the standing wave caused by the concave cavity to the sound emitted by the first sounding unit, and improve the cleanliness and clarity of the sound of the first sounding unit.
  • the loudspeaker also includes a basin frame and a flexible circuit board;
  • the basin frame has a side wall, and at least part of the first sounding unit, the second sounding unit and the magnetic circuit system are located in the area surrounded by the side wall of the basin frame
  • there are two first conductive plugs in the side wall of the basin frame the first end of each first conductive plug has a first conductive pin, and the second end of each first conductive plug has a second conductive plug.
  • each first conductive pin and each second conductive pin are exposed on the outer surface of the side wall of the frame; the first voice coil and the flexible circuit board are stacked along the height direction of the frame, and each second The conductive pin is electrically connected with the first voice coil through the flexible circuit board.
  • the first voice coil can be electrically connected to the first conductive plug-in, and the external circuit only needs to be electrically connected to the second conductive pin at the second end of the conductive plug-in to realize the first voice coil.
  • the voice coil provides current, which simplifies the assembly process of the first sound unit.
  • the first ends of the two second conductive inserts are located in the frame and electrically connected to the second voice coil
  • the two The second end of the second conductive insert has a third conductive pin
  • the third conductive pin is exposed on the outer surface of the side wall of the frame, that is to say, the second voice coil is led out to the side wall of the frame through the second conductive insert
  • the outer surface of the outer surface of the frame so as to facilitate the electrical connection between the second voice coil and the external circuit.
  • connection simplifies the assembly process between the second voice coil and the external circuit, and also makes the connection between the second voice coil and the external circuit more reliable, thereby improving the reliability of the electrical connection between the second voice coil and the external circuit .
  • the second sounding unit is modularized. For example, when assembling, only the second sounding unit needs to be assembled into the basin frame, and then the second sounding unit in the second sounding unit The pins of the second voice coil are electrically connected to the first end of the second conductive plug-in, and the assembly of the second sounding unit is completed. Afterwards, only the external circuit is electrically connected to the third conductive pin of the second end of the second conductive plug-in.
  • the second voice coil in the second sounding unit can be energized, which simplifies the wiring process of the second sounding unit and improves the assembly efficiency of the loudspeaker.
  • the outer surface of the side wall of the pot frame has a first wiring area, the first wiring area is located between the two first conductive pins, and the two second conductive pins and the two third conductive pins are both located at the first wiring.
  • only one circuit board such as a flexible circuit board, can be directly welded to the two second conductive pins and the two third conductive pins in the first wiring area, and then the first voice coil and the second The second voice coil is fed with current, which simplifies the electrical connection structure between the positive and negative pins of the first voice coil and the second voice coil and the external circuit, thus simplifying the electrical connection between the two sounding units of the speaker and the external circuit process, so as to facilitate the whole-machine application of the loudspeaker in the embodiment of the present application.
  • the loudspeaker further includes a first auxiliary magnet, the first auxiliary magnet is located in the sound generating unit, the second voice coil of the second vibration system is located in the first auxiliary magnetic field of the first auxiliary magnet, and the first The direction of the magnetic field of the secondary magnetic field passing through the second voice coil is the same as the direction of the magnetic field acting on the second voice coil by the magnetic circuit system, that is, the magnetic field passing through the second voice coil is magnetized by the first secondary magnetic field to strengthen the magnetic field of the second voice coil.
  • the magnetic induction received by the second voice coil increases the force factor of the second voice coil, improves the low-frequency sensitivity of the second vibration system, and improves the low-frequency sound pressure level of the second sounding unit.
  • the loudspeaker further includes a first cover, the first cover is arranged on an opening at one end of the frame where the sounding unit is arranged, and the first auxiliary magnet is located on a side of the first cover facing the second voice coil. side surface to enhance the structural stability of the first sub-magnet in the speaker, thereby ensuring the reliability of the magnetization of the first sub-magnet to the second voice coil, and avoiding the deviation of the first sub-magnet in the speaker and affecting the effect on the second voice coil. The magnetization effect at the second voice coil.
  • the loudspeaker further includes a second auxiliary magnet, the second auxiliary magnet is located on the side of the magnetic circuit system facing the first vibration system, and the first voice coil of the first vibration system is located on the first side of the second auxiliary magnet.
  • the direction of the magnetic field that the second secondary magnetic field passes through the first voice coil is the same as the direction of the magnetic field that the magnetic circuit system acts on the first voice coil, that is, the magnetic field that passes through the first voice coil through the second secondary magnetic pair Magnetization is performed to enhance the magnetic induction intensity of the first voice coil, thereby increasing the force factor of the first voice coil, so that the acoustic performance of the first sounding unit, such as transient characteristics, is improved.
  • the loudspeaker further includes a second cover, the second cover is set on an opening at one end of the basin frame provided with the first vibration system, and the second auxiliary magnet is located on the second cover facing the first vibration system.
  • the second cover is set on an opening at one end of the basin frame provided with the first vibration system
  • the second auxiliary magnet is located on the second cover facing the first vibration system.
  • the speaker further includes a third sounding unit; the third sounding unit is located on the same side as the first sounding unit on the same side of the second sounding unit.
  • the working frequency band of the third sounding unit is greater than that of the first sounding unit and greater than that of the second sounding unit.
  • the arrangement of the third sound generating unit broadens the operating frequency band of the speaker, improves the audio effect of the speaker, and makes the use scenarios of the speaker in the embodiment of the present application more extensive.
  • the first sounding unit and the third sounding unit are located on the same side of the second sounding unit, that is, the two higher-frequency sounding units are located on the same side of the lower-frequency second sounding unit, so that when assembling, the The sound outlets of the first sounding unit and the third sounding unit are set close to the sound outlets of the electronic equipment at the same time, so as to improve the audio performance of the two sounding units with higher frequencies.
  • the embodiment of the present application further provides an electronic device, which includes a casing and at least one speaker as above, and the speaker is located in the inner cavity of the casing.
  • the embodiment of the present application arranges the above-mentioned speaker on the electronic device.
  • the overall bandwidth of the speaker is widened to improve the sound quality of the electronic device such as earphones.
  • the structure of the speaker is simplified, thereby simplifying the assembly process of the speaker and reducing the The overall size of the speaker is reduced, which saves the space occupied by the speaker in the electronic device, thereby providing a suitable space for the installation of other components in the electronic device.
  • the electronic device can be miniaturized.
  • the electronic device further includes a feedback microphone.
  • the feedback microphone is located on the side of the first vibration system of the speaker facing away from the sound unit. On the one hand, it can ensure the active noise reduction effect of the electronic device.
  • the feedback microphone is set in the first sounding unit, which utilizes the internal space of the first sounding unit to avoid the feedback microphone occupying space in other areas of the electronic equipment, thereby providing a suitable installation space for components in other areas. From another perspective, It is also possible to reduce the size of the electronic equipment, realizing the miniaturization of the electronic equipment.
  • the electronic device is an earphone
  • the above-mentioned speaker is arranged in the earphone to improve the sound quality of the earphone, and also save the space occupied by the speaker in the earphone, so that the miniaturization of the earphone can be realized during installation.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 2 is an exploded view of Figure 1;
  • Fig. 3 is a sectional view of Fig. 1;
  • Fig. 4 is a schematic structural diagram of a speaker provided by an embodiment of the present application.
  • Figure 5 is an exploded view of Figure 4.
  • Fig. 6 is a sectional view of Fig. 4;
  • Fig. 7 is a sectional view of Fig. 4.
  • Fig. 8 is a schematic diagram of the distribution of the magnetic field in Fig. 7;
  • Fig. 9 is a performance simulation result diagram of the loudspeaker corresponding to Fig. 8 in the electronic device
  • Fig. 10 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Fig. 11 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Fig. 12 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Fig. 13 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Fig. 14 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Fig. 15 is a sectional view of the speaker corresponding to Fig. 14;
  • Figure 16 is an exploded view of the loudspeaker corresponding to Figure 14;
  • Fig. 17 is a performance simulation result diagram of the loudspeaker corresponding to Fig. 15 in the electronic device
  • Fig. 18 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Fig. 19 is a sectional view of the speaker corresponding to Fig. 18;
  • Figure 20 is an exploded view of the loudspeaker corresponding to Figure 18;
  • Fig. 21 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Fig. 22a is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Fig. 22b is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • Figure 23 is a partial exploded view of Figure 4.
  • Fig. 24 is a schematic structural view of the basin frame in Fig. 23;
  • Fig. 25 is a schematic structural view of the first conductive insert and the second conductive insert in Fig. 24;
  • Fig. 26 is one of the partial cross-sectional views of Fig. 4.
  • Fig. 27 is a schematic structural view of the first vibration system in Fig. 25;
  • Figure 28 is an exploded view of Figure 27;
  • Fig. 29 is a structural schematic diagram of another viewing angle in Fig. 27;
  • Fig. 30 is another partial sectional view of Fig. 4.
  • Fig. 31 is a schematic structural diagram of another loudspeaker provided by an embodiment of the present application.
  • Figure 32 is an exploded view of Figure 31;
  • Fig. 33 is a schematic structural diagram of the third sounding unit in Fig. 31;
  • Figure 34 is a sectional view of Figure 31;
  • Fig. 35 is a partial structural schematic diagram of Fig. 31;
  • Fig. 36 is a schematic structural view of the first flexible circuit board in Fig. 35;
  • Figure 37 is a partial sectional view of Figure 36;
  • Figure 38 is a partial sectional view of Figure 36;
  • Fig. 39 is a schematic structural view of a third conductive insert in Fig. 35;
  • Fig. 40 is a schematic structural diagram of another loudspeaker provided by an embodiment of the present application.
  • Fig. 41 is a structural schematic diagram of another viewing angle of Fig. 40;
  • Fig. 42 is a schematic structural diagram of the second flexible circuit board in Fig. 41;
  • Figure 43 is a sectional view of Figure 41;
  • Fig. 44 is a schematic structural diagram of another loudspeaker provided by an embodiment of the present application.
  • Fig. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application
  • Fig. 2 is an exploded view of Fig. 1
  • Fig. 3 is a cross-sectional view of Fig. 1
  • an embodiment of the present application provides an electronic device, including a housing 100 and a speaker 300 located in an inner cavity of the housing 100 (shown in FIG. 2 and FIG. 3 ).
  • the speaker 300 is a device for converting electrical signals into acoustic signals.
  • the loudspeaker 300 has commonly used acoustic indicators such as sound pressure level (sound pressure level, SPL for short), bandwidth, and the like.
  • the electronic devices in the embodiments of the present application may include, but are not limited to, mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (ultra-mobile personal computers, UMPCs), handheld computers, touch TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (personal digital assistant, PDA), wearable devices such as earphones, smart glasses, etc., virtual reality devices and other mobile or fixed terminals with acoustic transducers such as speakers 300.
  • PDA personal digital assistant
  • wearable devices such as earphones, smart glasses, etc.
  • virtual reality devices such as speakers 300.
  • the housing 100 of the earphone generally includes a first housing 110 and a second housing 120 , and the first housing 110 and the second housing 120 that are arranged oppositely enclose the interior of the earphone.
  • the speaker 300 is located in the inner cavity of the earphone.
  • the inner cavity of the earphone includes a front cavity 101 of the earphone and a rear cavity 102 of the earphone.
  • one side (such as the front side) of the speaker 300 and a part of the casing wall (such as a part of the casing wall of the second casing 120) form the earphone front cavity 101
  • the other side (such as the rear side) of the speaker 300 and the Another part of the housing wall (for example, part of the housing wall of the first housing 110 ) forms the earphone rear cavity 102
  • the speaker 300 divides the earphone inner cavity into the earphone front cavity 101 and the earphone rear cavity 102 .
  • the casing 100 such as the second casing 120 has a sound outlet 100a, and the sound outlet 100a communicates with the front cavity 101 of the earphone.
  • One side (for example, the front side) of the speaker 300 faces the mouthpiece 100a, and the other side (for example, the rear side) of the speaker 300 faces away from the mouthpiece 100a.
  • the vibration system in the loudspeaker 300 will vibrate at a certain frequency, thereby pushing the two sides of the vibration system, such as the earphone front chamber 101 on the front side of the loudspeaker 300, and the earphone rear chamber 102 on the rear side of the loudspeaker 300.
  • the air vibrates to produce sound.
  • Part of the sound can be transmitted to the front cavity 101 of the earphone through the space between the vibration system of the speaker 300 and the front side, and then transmitted to the outside of the earphone through the mouthpiece 100a.
  • the other part of the sound can be From the space between the back side of the speaker 300 and the vibration system, through the through hole at the vibration system, it propagates to the space between the vibration system and the front side, and then transmits to the outside of the earphone through the earphone front chamber 101 and the sound outlet 100a.
  • the sound from the speaker 300 can be emitted from the mouthpiece 100a and enter the user's ear canal.
  • earmuffs 200 can be sleeved on the sound outlet 100a, and the earmuffs 200 are used to be attached to the inner wall of the ear canal when the earphone is worn on the ear, so as to connect the ear canal to the ear canal.
  • the external environment is isolated, thereby reducing the noise of the external environment.
  • the built-in speaker 300 of the electronic device also needs to be miniaturized, and the acoustic performance of the speaker 300, such as sound pressure level or bandwidth, needs to be guaranteed to meet user needs. .
  • the loudspeaker may be a single moving coil loudspeaker.
  • the loudspeaker may be composed of a vibration system and a magnetic circuit system, wherein the vibration system includes a voice coil and a diaphragm on one side of the voice coil, and the magnetic circuit system includes a magnet.
  • the basin frame after the magnet passes through the magnetic field, a magnetic field perpendicular to the side wall of the basin frame is generated in the inner cavity of the basin frame (that is, the magnetic gap).
  • the voice coil is inserted into the basin frame, and the magnetic field in the basin frame is perpendicular to the side of the voice coil .
  • the energized voice coil When the voice coil is fed with current, the energized voice coil generates Lorentz force in the magnetic field perpendicular to the voice coil, and the Lorentz force drives the voice coil to move along the axis parallel to the voice coil to drive the diaphragm along the parallel direction.
  • the axial movement of the voice coil drives the air in the speaker to vibrate to produce sound.
  • the above-mentioned loudspeaker has a single sounding frequency band, and cannot take into account the sounding of multiple frequency bands such as bass and treble, so that the electronic equipment equipped with the loudspeaker, such as earphones, has poor sound quality.
  • the speakers in some high-end earphones adopt a multi-sound unit design.
  • the function of the frequency band to broaden the overall bandwidth of the speaker and improve the sound quality of electronic devices such as headphones.
  • the loudspeaker can include a low-frequency sounding unit and a high-frequency sounding unit, the low-frequency sounding unit is responsible for the sounding of the low-frequency band (such as a frequency band within 8 kHz), and the high-frequency sounding unit can be responsible for the sounding of a high-frequency band (such as a frequency band above 11 kHz), wherein , the low-frequency sound unit can be a moving coil unit, and the high-frequency unit can be a moving coil unit or a moving iron unit.
  • each sounding unit is independent of each other, and is fixed in an electronic device such as an earphone through a structural member.
  • each sounding unit has its own structure, for example, each sounding unit has its own parts and internal acoustic cavity, for example, the loudspeaker includes two moving coil units, and each moving coil unit has a vibration system and Magnetic circuit system, and each moving coil unit has its own front cavity and rear cavity, which makes the overall space size of the speaker larger, and also increases the space requirement and assembly difficulty of the speaker.
  • An embodiment of the present application provides a speaker.
  • the vibration system of one of the sounding units and the vibration system of the other sounding unit share a magnetic circuit system, that is, the first vibration system and the second vibration system vibrate under the magnetic field of one magnetic circuit system, thereby generating sound,
  • the number of components of the speaker is reduced, thereby simplifying the assembly process of the speaker and reducing the overall size of the speaker, so that the speaker in the embodiment of the present application is miniaturized.
  • FIG. 4 is a schematic structural view of a speaker provided by an embodiment of the present application
  • FIG. 5 is an exploded view of FIG. 4
  • FIG. 6 is a sectional view of FIG. 4
  • FIG. 7 is a sectional view of FIG. 4
  • the embodiment of the present application provides a speaker 300 , including a first vibration system 311 , a second vibration system 321 and a magnetic circuit system 322 .
  • the second vibrating system 321 is located on one side of the magnetic circuit system 322, and the first vibrating system 311 is located on the other side of the magnetic circuit system 322, for example, the magnetic circuit system 322 includes Direction) on the opposite first side and second side, the first vibrating system 311 is located on the first side of the magnetic circuit system 322 , and the second vibrating system 321 is located on the second side of the magnetic circuit system 322 .
  • the magnetic circuit system 322 is configured to provide a magnetic source for the first vibration system 311 and the second vibration system 321 to vibrate, in other words, the first vibration system 311 and the second vibration system 321 realize the magnetic source of vibration.
  • the sources are all the magnetic circuit system 322 .
  • both the first vibration system 311 and the second vibration system 321 are located in the magnetic field of the magnetic circuit system 322 , and the first vibration system 311 and the second vibration system 321 are used to vibrate in the magnetic field generated by the magnetic circuit system 322 .
  • the first vibration system 311 and the magnetic circuit system 322 form the first sounding unit 310
  • the second vibration system 321 and the magnetic circuit system 322 form the second sounding unit 320 .
  • the first vibrating system 311 may be located outside the first side of the magnetic circuit system 322, that is to say, the first vibrating system 311 does not protrude into the inside or the side wall of the magnetic circuit system 322, for example, the first vibrating system 311 A vibration system 311 may be a vibration system of a planar membrane unit, that is, the first sound generating unit 310 is a planar membrane unit.
  • FIG. 8 is a schematic diagram of the distribution of the magnetic field in FIG. 7 .
  • the first side of the magnetic circuit system 322 and the second side of the magnetic circuit system 322 are opposite to each other in the z direction.
  • the N pole is the N pole
  • the second side of the magnetic circuit system 322 corresponds to the above-mentioned partial area (hereinafter referred to as the second area) as the S pole, so that the magnetic force lines generated by the magnetic circuit system 322 can be sent from the N pole , and enter the second side through the top and side of the first side, and enter the S pole of the second side, and then reach the N pole from the inside of the magnetic circuit system 322 from the S pole, so that the magnetic circuit system 322 can generate magnetic
  • the loop that is, the ring magnetic field, a part of the ring magnetic field is located in the space above the first side of the magnetic circuit system 322, and part of the magnetic field lines can pass through the first vibration system 311, so that the first vibration system 311 can be in its own thickness direction
  • first region and the second region are two regions opposite to each other along the thickness direction of the magnetic circuit system 322 (shown with reference to the z direction in FIG. 8 ).
  • the first sound unit 310 can be a planar membrane unit, for example, the first vibration system 311 can include a first voice coil 3111 and a first diaphragm 3112, the first voice coil 3111 is positioned on the magnetic outside (for example, above) the first side of the magnetic circuit system 322, the first diaphragm 3112 is located on the side of the first voice coil 3111 facing away from the magnetic circuit system 322, for example, one side of the first voice coil 3111 can be bonded, etc.
  • the method is fixed on the side surface of the first diaphragm 3112 facing the magnetic circuit system 322 .
  • the first diaphragm 3112 may face the mouthpiece 100a, and the first diaphragm 3112 may face the front cavity 101 of the earphone.
  • first cavity 301 between the first vibration system 311 and the magnetic circuit system 322
  • a fourth cavity 304 is formed on the side of the first vibration system 311 facing away from the magnetic circuit system 322 .
  • first cavity 301 between the first diaphragm 3112 and the first side of the magnetic circuit system 322
  • a fourth cavity 304 is formed on the side of the first diaphragm 3112 facing away from the magnetic circuit system 322 .
  • the first cavity 301 is used as the rear cavity of the first sounding unit 310
  • the fourth cavity 304 is used as the front cavity of the first sounding unit 310 .
  • the magnetic circuit system 322 after the magnetic circuit system 322 is magnetized, it will generate a ring magnetic field, and the part of the ring magnetic field located in the first cavity 301 can be perpendicular to the side of the first voice coil 3111, so that the first voice coil 3111 after electrification
  • the voice coil 3111 can generate a Lorentz force under the action of the magnetic field of the magnetic circuit system 322.
  • the Lorentz force is parallel to the thickness direction of the first voice coil 3111 (such as shown in the z direction in FIG.
  • the Lorentz force can be used as the driving force of the first voice coil 3111 to drive the first voice coil 3111 to vibrate along the thickness direction, thereby driving the first diaphragm 3112 to vibrate to push the first sound unit 310
  • the side surface of the first voice coil 3111 refers to the surface of the first voice coil 3111 parallel to the axis of the first voice coil 3111 .
  • the current of the first voice coil 3111 can be an alternating current, so that the direction of the Lorentz force on the first voice coil 3111 can alternately change toward the direction of the magnetic circuit system 322 and the direction away from the magnetic circuit system 322,
  • the first voice coil 3111 drives the first diaphragm 3112 to move back and forth along the thickness direction of the first voice coil 3111, that is, to vibrate, that is, the first voice coil 3111 after electrification can drive the first diaphragm 3112 to approach or move away from the magnetic circuit system 322 direction vibration.
  • there may be a certain gap between the first voice coil 3111 and the first side of the magnetic circuit system 322 (refer to A shown in FIG. The direction of the road system 322 vibrates back and forth.
  • the first voice coil 3111 of the embodiment of the present application can be a sheet-shaped annular structure, which is light in weight and can vibrate at medium and high frequencies, so that the first sounding unit 310 (such as a planar membrane unit) formed by the first vibration system 311 can be used as a medium-high frequency unit.
  • the first sounding unit 310 may be responsible for sounding in frequency bands of 3 kHz and higher than 3 kHz.
  • the fourth cavity 304 such as the front cavity of the first sounding unit 210, can communicate with the earphone front cavity 101, so as to transmit the sound generated by the first sounding unit 210 through the earphone front cavity 101 and the mouthpiece 100a.
  • the outside of the headset such as inside the user's ear canal.
  • the earphone front chamber 101 can directly serve as the front chamber (such as the fourth chamber 304) of the first sound unit 310, for example, the fourth chamber 304 is facing away from the first vibration system 311.
  • One side of the magnetic circuit system 322 is surrounded by a part of the housing wall of the second housing 120 .
  • the first diaphragm 3112 of the first vibration system 311 directly pushes the air in the first cavity 301 and the fourth cavity 304 to vibrate during the vibration process, that is, the first vibration system 311 pushes the first sound unit 310 during the vibration process.
  • the air in the back chamber of the earphone and the earphone front chamber 101 vibrates to produce sound, which is transmitted to the outside of the earphone through the mouthpiece 100a.
  • the mouthpiece 100a is used as the sound outlet (for example, the first sound outlet) of the first sound unit 310, which can emit the sound produced by the first sound unit 310, so that the first sound output can be reduced.
  • the sound emitted by the unit 310 propagates to the path of the mouthpiece 100a, thereby reducing the sound loss of the first sound emitting unit 310, increasing the sound pressure level of the speaker, and subjectively improving the loudness of the speaker.
  • part of the magnetic field of the ring magnetic field generated by the magnetic circuit system 322 can act on the second vibration system 321, so that the second vibration system 321 can be in the magnetic circuit system 322 Vibrates under the action of the second vibration system 321 to push the air on both sides to vibrate, thereby emitting sound.
  • the second sound unit 320 can be a moving coil unit, at least part of the second vibration system 321 can be inserted in the magnetic gap at the second end of the magnetic circuit system 322, and a part of the annular magnetic field generated by the magnetic circuit system 322 Located in the magnetic gap and acting on the second vibration system 321 in the magnetic gap, the second vibration system 321 vibrates along the magnetic gap to push the air on both sides of the second vibration system 321 to vibrate, so that the second sound unit 320 produce sound.
  • the magnetic gap of the magnetic circuit system 322 can be the side wall of the magnetic circuit system 322 and the fixing part of the speaker (for example, the gap between the frame 340), then in this example, at least the second vibration system 321 A part is inserted between the side wall of the second end of the magnetic circuit system 322 and the inner wall of the basin frame 340 .
  • the second vibration system 321 may include a second voice coil 3211 and a second diaphragm 3212, at least part of the second voice coil 3211 is inserted in the magnetic gap of the magnetic circuit system 322, and the second diaphragm 3212 is located in the second
  • the side of the voice coil 3211 away from the first vibration system 311 for example, the second voice coil 3211 can be fixed on the side surface of the second diaphragm 3212 by means of bonding or the like.
  • there is a second cavity 302 between the second diaphragm 3212 and the magnetic circuit system 322 there is a second cavity 302 between the second diaphragm 3212 and the magnetic circuit system 322 , and a third cavity 303 is formed on the side of the second diaphragm 3212 facing away from the magnetic circuit system 322 .
  • the second cavity 302 is used as the front cavity of the second sounding unit 320
  • the third cavity 303 is used as the rear cavity of the second sounding unit 320 .
  • a circular magnetic field can be generated, a part of the circular magnetic field is located in the magnetic gap of the magnetic circuit system 322, and the magnetic field located in the magnetic gap is perpendicular to the second sound.
  • the second voice coil 3211 after electrification can generate a Lorentz force under the action of the magnetic circuit system 322, and according to the left-hand rule, the Lorentz force is parallel to the thickness of the second voice coil 3211 direction (shown in the z direction with reference to FIG.
  • the Lorentz force can be used as the driving force of the second voice coil 3211 to drive the second voice coil 3211 to vibrate along the thickness direction, thereby driving the second diaphragm 3212 to vibrate to The air that pushes the front cavity (ie the second cavity 302 ) and the rear cavity (ie the third cavity 303 ) in the second sounding unit 320 vibrates, so that the second sounding unit 320 emits sound.
  • the side surface of the second voice coil 3211 refers to the surface of the second voice coil 3211 parallel to the axis of the second voice coil 3211 .
  • the current of the second voice coil 3211 can be an alternating current, so that the direction of the Lorentz force received by the second voice coil 3211 can alternately change in the direction toward the magnetic circuit system 322 and the direction away from the magnetic circuit system 322,
  • the second voice coil 3211 drives the second diaphragm 3212 to move back and forth along the thickness direction of the second voice coil 3211, that is, to vibrate, that is, the second voice coil 3211 after electrification can drive the second diaphragm 3212 to approach or move away from the magnetic circuit system 322 direction vibration.
  • the second voice coil 3211 of the second sounding unit 320 needs to be inserted into the magnetic gap of the magnetic circuit system 322.
  • the second voice coil 3211 is generally cylindrical in shape, has a heavy mass, and can vibrate at a low frequency.
  • the second sound generating unit 320 is usually a low frequency unit.
  • the second sounding unit 320 may be responsible for sounding in a frequency band within 3 kHz, such as 20-2 kHz.
  • the working frequency bands of the first sounding unit 310 and the second sounding unit 320 are different.
  • the working frequency band is a frequency range, so it can be understood that the different working frequency bands of the first sounding unit 310 and the second sounding unit 320 may be: the working frequency bands of the first sounding unit 310 and the second sounding unit 320 do not overlap at all
  • the working frequency band of the first sounding unit 310 may be greater than or equal to 3 kHz
  • the working frequency band of the second sounding unit 320 may be 20-2 kHz.
  • the difference between the working frequency bands of the first sounding unit 310 and the second sounding unit 320 may be that the partial frequency bands of the working frequency bands of the first sounding unit 310 and the second sounding unit 320 overlap, for example, the working frequency of the first sounding unit 310
  • the frequency band can be 1kHz-8kHz
  • the working frequency band of the second sounding unit 320 can be 20-2kHz, so the working frequency bands of the first sounding unit 310 and the second sounding unit 320 overlap.
  • the operating frequency bands of the first vibration system 311 and the second vibration system 321 are set to be different.
  • the first sound unit 310 is responsible for mid-frequency or high-frequency sound
  • the second sound unit 320 is responsible for low-frequency sound, so as to widen the speaker. 300 overall bandwidth, thereby improving the sound quality of electronic devices such as headphones.
  • the first vibration system 311 of the first sound unit 310 and the second vibration system 321 of the second sound unit 320 share a magnetic circuit system 322, that is, the magnetic circuit system 322 serves as the first vibration system 311 and the second vibration system 321.
  • the vibrating magnetic source on the one hand, enables the first sounding unit 310 and the second sounding unit 320 to produce sounds of corresponding frequency bands, and on the other hand, also reduces the number of components of the speaker 300, thereby simplifying the assembly process of the speaker 300 , the overall size of the speaker 300 is reduced, so that the speaker 300 in the embodiment of the present application is miniaturized.
  • both the first vibrating system 311 and the second vibrating system 321 are set close to the magnetic circuit system 322, which ensures that the magnetic induction intensity received by the first vibrating system 311 and the second vibrating system 321 will not be affected, ensuring that the first vibrating system 311 and the force factor of the second vibration system 321, thereby ensuring that the amplitude of the first vibration system 311 and the second vibration system 321 will not be limited, ensuring the sensitivity of the second sound unit 320 and the first sound unit 310 in the speaker 300 , so that the sound pressure level of the speaker 300 can be improved.
  • the force factor is one of the design parameters of the loudspeaker.
  • the force factor is the product between the magnetic induction intensity B and the effective line length L of the voice coil, so the force factor can be referred to as BL.
  • the force factor BL is equal to the ratio between the current i on the voice coil and the driving force F (Lorentz force) received by the voice coil, that is, the larger the BL, the greater the force of the voice coil under the same current. the stronger the driving force.
  • the manufacturing process of the speaker 300 in the embodiment of the present application is simple, for example, the assembly precision between the first vibration system 311 and the second vibration system 321 and the magnetic circuit system 322 is low, and the tolerance is low, thereby ensuring the product yield of the speaker 300 .
  • the first sound generating unit 310 may also be a moving coil unit, for example, at least part of the first vibration system 311 may be inserted into the magnetic gap at the first end of the magnetic circuit system 322 .
  • the embodiment of the present application does not specifically limit the specific structures of the first sounding unit 310 and the second sounding unit 320 , as long as the two sounding units can emit sounds of different frequency bands.
  • the embodiment of the present application is specifically described by taking the first sound emitting unit 310 as a planar membrane unit as an example.
  • the speaker 300 may further include a basin frame 340 and a first cover 350 .
  • the basin frame 340 is a cylindrical structure with openings up and down.
  • the basin frame 340 has a side wall 342B.
  • the first vibrating system 311, the second vibrating system 321 and the magnetic circuit system 322 are all located at the side wall B of the basin frame 340. in the lumen.
  • the first vibrating system 311, the second vibrating system 321 and the magnetic circuit system 322 can be fixed on the inner wall of the basin frame 340 by means of bonding or the like.
  • the first diaphragm 3112 in the first vibration system 311 can be located outside the first end of the basin frame 340, and the first voice coil 3111, the magnetic circuit system 322 and the second vibration system 321 can all be located in the basin.
  • the embodiment of the present application does not specifically limit the first sounding unit 310, the second sounding unit 320, and the components of the magnetic circuit system 322 located inside or outside the basin frame 340, as long as they can It only needs to ensure that the components of the first sounding unit 310 , the second sounding unit 320 and the magnetic circuit system 322 can be stably assembled on the basin frame 340 .
  • the outer edge of the second diaphragm 3212 can be fixed on the first end of the basin frame 340 through the steel ring 370 .
  • the outer edge of the second diaphragm 3212 is fixed on the inner wall of the first end of the basin frame 340 .
  • the outer edge of the first diaphragm 3112 can be fixed on the second end of the basin frame 340 through the steel ring 370 .
  • the first diaphragm 3112 may include a first dome 311a and a first ring 311b, the first ring 311b has a ring structure, the first dome 311a is located at the inner edge of the first ring 311b, for example, the first
  • the outer edge of a dome 311a can be fixed on the inner edge surface of the first ring 311b by bonding or the like, and the outer edge of the first ring 311b is fixed on the second end of the basin frame 340, for example, the end surface of the second end.
  • composition materials of the first diaphragm 3112 and the second diaphragm 3212 include but are not limited to silica gel, rubber, liquid crystal polymer (Liquid Crystal Polyester, referred to as LCP) and polyimide (Polyimide, referred to as PI).
  • LCP liquid crystal polymer
  • PI polyimide
  • the magnetic circuit system 322 and the outer peripheral sidewall of the magnetic circuit system 322 can be fixed on the inner wall of the basin frame 340 .
  • the magnetic circuit system 322 and the side walls of the magnetic circuit system 322 may be fixed on the inner wall of the basin frame 340 by bonding or the like.
  • first end and the second end of the frame 340 respectively refer to opposite ends of the frame 340 along the axial direction.
  • the first cover body 350 is set on the first end opening of the basin frame 340, for example, a card slot can be set on the first end side wall of the basin frame 340, and the first cover body 350 Buckles can be arranged on the outer edge, and the first cover body 350 can be locked on the first end of the basin frame 340 by locking the buckles in the slots.
  • the first cover body 350 and the first end of the basin frame 340 can be bonded together by dispensing glue in the glue tank.
  • a glue groove can be opened on the first end side wall of the pot frame 340, and an adhesive layer is filled in the glue groove, and the outer edge of the first cover body 350 can be bonded to the pot frame 340 through the glue layer.
  • the first cover body 350 is stably clamped at the first end of the basin frame 340 .
  • the second diaphragm 3212 may include a second dome 321a and a second ring 321b, the second ring 321b has a ring structure, and the second dome 321a is located inside the second ring 321b
  • the outer edge of the second dome 321a can be fixed on the inner edge surface of the second ring 321b by bonding or the like.
  • at least part of the outer edge of the second ring 321b can be fixed by bonding or the like. It is fixed on a part of the inner surface of the first cover body 350 to improve the stability of the second ring 321b in the cavity of the speaker 300 .
  • a third cavity 303 that is, a rear cavity of the second sound unit 320 .
  • the third cavity 303 can communicate with the earphone rear cavity 102, so that the earphone rear cavity 102 and the third cavity 303 can be shared as the rear of the second sound unit 320
  • the second diaphragm 3212 can push the air in the second cavity 302 , the third cavity 303 and the earphone rear cavity 102 to vibrate during the vibration process to produce sound.
  • an air outlet 351 may be provided on the first cover body 350 to communicate with the third cavity 303 and the earphone rear cavity 102 .
  • the air outlet 351 can be covered with a first damping mesh 352 to improve compliance between the third cavity 303 and the rear cavity 102 of the earphone, thereby improving the sound quality of the earphone.
  • a second sound outlet 323 can be opened on the side wall of the basin frame 340, and the second sound outlet 323 can communicate the second cavity 302 with the outside of the speaker 300.
  • the second cavity 302 communicates with the earphone front cavity 101 through the second sound outlet 323, that is to say, the second cavity 302 can communicate with the outside of the speaker 300 through the earphone front cavity 101, so that the first The sound emitted by the second sound unit 320 can be transmitted to the outside of the speaker 300 , such as the user's ear canal, through the second sound outlet 323 , the earphone front chamber 101 and the sound outlet 100 a.
  • the side wall of the basin frame 340 may have a stepped surface 341, the stepped surface 341 faces the sound nozzle 100a, and the second sound outlet 323 is opened on the stepped surface 341, so that Make the second sound outlet 323 towards the sound outlet 100a, that is, the second sound outlet 323 and the sound outlet 100a are arranged oppositely along the propagation direction of the sound (shown in the a direction with reference to Fig. 3 ), to reduce the sound from the second sound outlet.
  • the propagation path from the sound outlet 323 to the sound outlet 100a reduces the loss of the sound emitted by the second sound generating unit 320 to the sound outlet 100a, and improves the sound quality of the electronic device in the low frequency range.
  • the wavelength of the mid-high frequency sound is shorter than the wavelength of the low-frequency sound.
  • the sound pressure level can meet the requirements.
  • the first sound-emitting unit 310 can be arranged closer to the mouthpiece 100a of the earphone to improve the mid-frequency or high-frequency sound quality of the earphone such as the sound pressure level.
  • the constituent materials of the basin frame 340 and the first cover body 350 may include but not limited to carbon steel, aluminum alloy and other materials with high rigidity, so as to support the sounding units such as the first sounding unit 310 and the second sounding unit
  • the 320 plays a very good protective role, preventing the loudspeaker 300 from being deformed due to external forces such as bumps.
  • FIG. 9 is a performance simulation result diagram of the speaker corresponding to FIG. 8 in the electronic device.
  • curve a is the performance curve of the second sounding unit 320
  • curve b is the performance curve of the first sounding unit 310
  • the dotted line c is the standard line with a sensitivity of -10dB within 1kHz.
  • the high-frequency cutoff frequency of the second sounding unit 320 is 11 kHz.
  • the operating frequency of the second sounding unit 320 in the speaker 300 of the embodiment of the present application is within 11 kHz.
  • the high-frequency cut-off frequency of the first sound unit 310 is 14kHz, that is, compared with the dynamic speaker, the speaker 300 of the embodiment of the present application is provided with a first vibration system 311 on one side of the second sound unit 320 to form a first sound
  • the unit 310 enables the frequency band of the speaker 300 to be expanded.
  • the frequency of the speaker 300 is at a high frequency between 11kHz-14kHz, and the sensitivity of the speaker 300 is higher than the standard value, and compared with a single dynamic speaker, the sensitivity is improved. , that is, high-frequency transient characteristics such as sound pressure levels are improved.
  • the low frequency cutoff frequency of the first sounding unit 310 is 8kHz.
  • the working frequency band of the first sounding unit 310 of the speaker 300 can be between 8kHz-14kHz.
  • the low-frequency cutoff frequency of the second sound unit 320 is about 20Hz.
  • the operating frequency of the speaker 300 is between 20Hz-11kHz, and its sensitivity is greater than the standard value.
  • the pressure level is increased.
  • the second sounding unit 320 can be responsible for low-frequency sounding between 20Hz-11kHz
  • the first sounding unit 310 can be responsible for high-frequency sounding between 11kHz-14kHz. It can be understood that in the structures corresponding to FIGS. 5 to 8 , the first sounding unit 310 is responsible for high-frequency sounding.
  • the magnetic circuit system 322 of the embodiment of the present application may include a magnetic part 3221, and the first vibrating system 311 is located at the first end of the magnetic part 3221, for example, the first vibrating system 311 may be located at the first end of the magnetic part 3221 Outside, for example above, the magnetic part 3221 has a first gap 322c, and the second vibrating system 321 is located at the second end of the magnetic part 3221 and is at least partially inserted in the first gap 322c.
  • the magnetic member 3221 may be a magnet.
  • first end and the second end of the magnetic member 3221 respectively refer to opposite ends of the magnetic member 3221 in the thickness direction of the magnetic member 3221 (refer to the direction shown by z in FIG. 7 ).
  • the thickness direction of the magnetic member 3221 can be understood as the thickness direction of the speaker 300 .
  • the magnetic member 3221 may include a central magnet 322a and a side magnet 322b.
  • the side magnet 322b is sheathed on the outer periphery of the central magnet 322a.
  • the first section refers to a section on the magnetic member 3221 perpendicular to the thickness direction (refer to the direction shown by z in FIG. 7 ).
  • the center magnet 322a is magnetically opposed to the end of the side magnet 322b facing the first vibration system 311, for example, the center magnet 322a is magnetically opposite to the end of the side magnet 322b facing the first voice coil 3111, that is, the first end of the center magnet 322a
  • the magnetism of the end and the first end of side magnet 322b is opposite, correspondingly, center magnet 322a and side magnet 322b are opposite to one end of first vibrating system 311 magnetism, for example, the second end of center magnet 322a and the first end of side magnet 322b
  • the magnetic properties at the two ends are opposite, so that a U-shaped magnetic field is formed between the central magnet 322a and the side magnet 322b.
  • the first end (i.e. the end of the first side) of the center magnet 322a is N pole
  • the first end (i.e. the end of the first side) of side magnet 322b is the S pole
  • the center magnet The first end of 322a will send out the magnetic field line, and reach the first end of side magnet 322b toward the space above the first voice coil 3111 through the center magnet 322a, and enter into the side magnet 322b, so that the magnetic circuit system 322 faces the first voice coil
  • a U-shaped magnetic field is formed above one side of the 3111, and the first voice coil 3111 can be located on the top of the U-shaped magnetic field.
  • the first voice coil 3111 after electrification can move along the thickness direction under the action of the Lorentz force
  • the structure of the magnetic circuit system 322 is also simplified, and the production efficiency of the loudspeaker 300 is improved.
  • the second end (i.e. one end on the second side) of the center magnet 322a is an S pole
  • the second end (i.e. an end on the second side) of the side magnet 322b is an N pole.
  • the second end of the side magnet 322b At least part of the emitted magnetic flux can enter the second end of the central magnet 322a through the first gap 322c, so that the second voice coil 3211 located in the first gap 322c can receive the magnetic flux perpendicular to the side wall of the second voice coil 3211, Therefore, the second voice coil 3211 after electrification can generate a Lorentz force parallel to the thickness direction of the second voice coil 3211 under the action of the magnetic field of this part of the magnetic force line, ensuring that the second voice coil 3211 is driven along the Lorentz force.
  • the second voice coil 3211 moves in the thickness direction (shown with reference to the z direction in FIG. 8 ).
  • the first end of the center magnet 322a i.e., the end on the first side
  • the first end (i.e., the end on the first side) of the side magnet 322b the second end of the side magnet 322b (i.e., the end on the first side).
  • One end on both sides) and the second end (ie, one end on the second side) of the central magnet 322a jointly generate a circular magnetic force line (ie, a magnetic circuit).
  • the first end of the center magnet 322a (that is, one end on the first side) can be an S pole
  • the first end of the side magnet 322b that is, an end on the first side
  • One end of the first side is an N pole
  • the second end (ie, one end of the second side) of the central magnet 322a is an N pole
  • the second end (ie, one end of the second side) of the side magnet 322b is an S pole
  • the first end of the side magnet 322b can emit magnetic force lines, and enter the first end of the center magnet 322a through the top of the side magnet 322b and the center magnet 322a, and then reach the second end of the center magnet 322a through the inside of the center magnet 322a, Then send out from the second end of the center magnet 322a, and reach the second end of the side magnet 322b through the first gap 322c, then reach the first end of the side magnet 322b from the inside of the side magnet 322b, thereby forming the annular magnetic field line (i.e. the magnetic circuit ), the embodiment of the present application specifically does not limit the magnetic directions of the central magnet 322a and the side magnets 322b.
  • the central magnet 322a can be a whole magnet (as shown in FIG. 5 ), or can be spliced by multiple magnets.
  • the central magnet 322a can be a circular magnet (shown in FIG. 5 ), a square magnet or a magnet of other shapes.
  • the central magnet 322a can also be a magnet of other irregular shapes. The shape is restricted, which can be selected according to actual needs.
  • the side magnet 322b can be a ring magnet (as shown in FIG. 5 ) sleeved on the outer periphery of the center magnet 322a, or a ring magnet formed by splicing a plurality of bar magnets around the center magnet 322a.
  • each bar magnet may be an arc magnet or a rectangular magnet, and the embodiment of the present application does not specifically limit the shape of the bar magnet.
  • the side magnet 322b can be a ring magnet (as shown in FIG. 5 ), a square ring magnet or other shapes of side magnets. The embodiment of the present application does not limit the shape of the side magnet 322b, which can be selected according to actual needs.
  • the magnetic circuit system 322 may also include a washer 3222, and the washer 3222 is located at the second end of the magnetic part 3221, that is, the washer 3222 is located at the magnetic part 3221 facing away from the first vibration system 311 one end.
  • the washer 3222 has a second gap 322f communicating with the first gap 322c, and at least part of the second vibration system 321 is inserted in the first gap 322c and the second gap 322f.
  • the washer 3222 By setting the washer 3222 on the side of the magnetic member 3221 facing away from the first vibrating system 311, the magnetic lines of force at the second end of the magnetic circuit system 322 are concentrated at the second end of the magnetic circuit system 322, and the magnetic line at the second end of the magnetic circuit system 322 The two ends form a loop to ensure that the magnetic gaps of the magnetic circuit system 322, such as the second voice coil 3211 in the first gap 322c and the second gap 322f, are subject to strong magnetic induction, ensuring the sound pressure level of the second sound unit 320.
  • the arrangement of the washer 3222 simplifies the structure of the magnetic circuit system 322 and improves the production efficiency of the loudspeaker 300 .
  • the washer 3222 may be a fastener, and in some embodiments, the washer 3222 may be a washer, such as a spring washer, a metal washer, and the like.
  • the washer 3222 may include a center washer 322d and a side washer 322e, wherein, in the second section, the side washer 322e is sleeved on the outer periphery of the center washer 322d .
  • the second section is perpendicular to the thickness direction of the magnetic member 3221 (refer to the z direction in FIG. 7 ), that is, the second section is parallel to the first section, that is to say, the second section is perpendicular to the z direction .
  • the center washer 322d faces the center magnet 322a
  • at least a portion of the side washer 322e faces the side magnets 322b.
  • the center magnet 322a is facing the second end surface of the center magnet 322a
  • the side washer 322e is facing the second end surface of the side magnet 322b
  • the magnetic field on the side of the edge washer 322e when at least part of the second voice coil 3211 is inserted into the second gap 322f and the first gap 322c, in the annular magnetic field formed by the magnetic member 3221, it is located in the first gap 322c and the second gap Part of the magnetic field in 322f is perpendicular to the side wall of the second voice coil 3211 , thereby increasing the magnetic induction intensity received by the second voice coil 3211 , thereby increasing the low-frequency sound pressure level of the speaker 300 .
  • the magnetic induction intensity of the washer 3222 close to the second gap 322f can reach a maximum of 1.7T, so that the second voice coil 3211 located in the second gap 322f is subject to a stronger magnetic induction intensity.
  • the composition material of the Washer 3222 includes but not limited to magnetic materials such as iron, low-carbon steel or iron-aluminum, which can be selected according to actual needs.
  • the washer 3222 can be attached to the surface of the magnetic circuit system 322 facing away from the magnetic circuit system 322 by bonding or magnetic adsorption. The assembly process between Washer 3222 and basin frame 340. The embodiment of the present application does not limit the connection mode between the washer 3222 and the magnetic circuit system 322 .
  • the projected area of the first voice coil 3111 on the magnetic circuit system 322 overlaps at least partially with the first gap 322c, that is to say, the first voice coil 3111 and the first gap 322c are in the first voice coil 3111
  • the projections in the thickness direction overlap, for example, the first voice coil 3111 can face the first gap 322c, that is, the center between the inner edge and the outer edge of the first voice coil 3111 The position is facing the first gap 322c along the thickness direction of the first voice coil 3111 .
  • the projection of the top position of the U-shaped magnetic field on the magnetic circuit system 322 is located on the first gap 322c, in other words, the magnetic circuit facing the position of the first gap 322c has a horizontal magnetic circuit parallel to the magnetic circuit system 322 , by overlapping the first voice coil 3111 and the first gap 322c in the thickness direction of the first voice coil 3111, that is, the first voice coil 3111 is arranged at a position facing the first gap 322c, so as to increase the impact of the first voice coil 3111
  • the area of the horizontal magnetic circuit increases the magnetic induction intensity of the horizontal magnetic circuit received by the first voice coil 3111 and increases the sound pressure level of the first sound generating unit 310 .
  • the first gap 322c can be used as a positioning reference for the first voice coil 3111, that is, only the first voice coil 3111 needs to be set on one side of the first gap 322c, for example, the first voice coil 3111 is facing the first gap 322c , the positioning of the first voice coil 3111 perpendicular to the thickness direction can be realized, and then by adjusting the position of the first voice coil 3111 in the thickness direction, the first voice coil 3111 can be placed at the top position of the U-shaped loop On the one hand, the first voice coil 3111 after electrification moves along the thickness direction under the action of the magnetic field at the top of the U-shaped loop; Assembly efficiency.
  • the magnetic member 3221 of the magnetic circuit system 322 may be a block magnet (not shown in the figure).
  • the first end of the magnetic element 3221 is an N pole
  • the second end of the magnetic element 3221 is an S pole.
  • the magnetic element 3221 can form a plurality of magnetic circuits, that is, a ring magnetic field.
  • the magnetic field lines of each magnetic circuit can be emitted from the N pole of the magnetic part 3221, surround the side of the magnetic part 3221 facing the first voice coil 3111 and one of the sides of the magnetic part 3221, such as the left side, and enter the S pole of the magnetic part 3221, Then it reaches the N pole of the magnetic piece 3221 through the inside of the magnetic piece 3221 .
  • the magnetic gap of the magnetic member 3221 is the gap between the side wall of the magnetic member 3221 and the frame 340, at least part of the second voice coil 2311 of the second vibration system 321 is inserted in the magnetic The outer periphery of the part 3221.
  • part of the magnetic force lines on the side of the magnetic member 3221 of the magnetic circuit system 322 facing the first voice coil 3111 can pass through the side of the first voice coil 3111 vertically, so that the first voice coil 3111 after electrification generates a force parallel to the first voice coil 3111.
  • the Lorentz force in the thickness direction of the voice coil 3111 drives the first voice coil 3111 to vibrate back and forth along the thickness direction.
  • part of the magnetic field lines located on the side of the magnetic circuit system 322 can pass through the side of the second voice coil 3211 vertically, so that the second voice coil 3211 after electrification produces a Loren of force parallel to the thickness direction of the second voice coil 3211. Zi force, thereby driving the second voice coil 3211 to vibrate back and forth along the thickness direction.
  • the magnetic circuit system 322 can also include a support 3223, the support 3223 is located at the end of the magnetic part 3221 facing the first vibration system 311, that is to say, the support 3223, the magnetic part 3221 and the The divisions 3222 are sequentially arranged along the thickness direction of the magnetic circuit system 322 (refer to the direction shown by z in FIG. The side of the side 3222 facing away from the magnetic part 3221.
  • the support member 3223 can be fixed on the first end surface of the magnetic member 3221 by bonding or the like, or the outer edge of the support member 3223 can be fixed on the inner wall of the basin frame 340 by bonding or the like, so that the support member 3223 can be stably Assembled on the first end of the magnetic piece 3221 .
  • the support member 3223 in the embodiment of the present application is made of a non-magnetically permeable material or a weakly magnetically permeable material, so as to improve or avoid the magnetic field lines emanating from the first side of the magnetic member 3221 or reaching near the first side of the magnetic member 3221
  • the magnetic lines of force propagate along the surface of the support member 3223 , so as to ensure the magnetic flux density of the annular magnetic circuit formed by the magnetic member 3221 and the magnetic field strength of the annular magnetic circuit formed by the magnetic member 3221 .
  • the supporting member 3223 may be made of one or more materials not containing iron, cobalt and nickel, such as copper, copper alloy, aluminum, and aluminum alloy.
  • the outer edge of the first vibration system 311 is set on the support 3223, so that the first vibration system 311 is stably supported on one side of the magnetic circuit system 322, for example, in the first vibration system 311, the first The outer edge of the diaphragm 3112 can be fixed on the supporting member 3223 through the steel ring 370 .
  • the setting of the support member 3223 also ensures that a stable cavity (such as the first cavity 301 ) is formed between the first vibration system 311 and one end of the magnetic circuit system 322 , making the rear cavity structure of the first sound unit 310 more stable.
  • Fig. 10 is a sectional view of another speaker provided by an embodiment of the present application
  • Fig. 11 is a sectional view of another speaker provided by an embodiment of the present application
  • Fig. 12 is a sectional view of another speaker provided by an embodiment of the present application sectional view.
  • the speaker 300 of the embodiment of the present application may further include a first secondary magnetic field 324, and the second voice coil 3211 is located in the magnetic field generated by the first secondary magnetic field 324 (for example, the first secondary magnetic field ), and the direction of the magnetic force lines of the first secondary magnetic field passing through the second voice coil 3211 is the same as the direction of the magnetic field that the magnetic circuit system 322 acts on the second voice coil 3211, that is to say, the first secondary magnetic field passes through the second voice coil
  • the direction of the magnetic force line of 3211 is the same as the direction of the magnetic force line of the magnetic circuit passing through the second voice coil 3211, that is, the magnetic field of the second sound unit 320 is magnetized through the first secondary magnet 324, that is, the first secondary magnet 324 passes through the second voice coil 3211
  • the magnetic field of the second voice coil 3211 is magnetized to enhance the magnetic induction intensity of the second voice coil 3211 , thereby increasing the force factor of the second voice coil 3211 , so that the low-frequency sound pressure
  • the first auxiliary magnet 324 can be arranged in the second sound generating unit 320 during specific installation.
  • the projection of the first auxiliary magnet 324 on the thickness direction of the second voice coil 3211 (such as the direction shown by z in Figure 11) can be located in the second voice coil 3211 , in this way, the first auxiliary magnet 324 can uniformly magnetize the magnetic field passing through each position of the second voice coil 3211 in the circumferential direction, so as to increase the force factor of the second voice coil 3211 .
  • the symmetry of the second sounding unit 320 is ensured by disposing the first auxiliary magnet 324 in the cavity region of the second voice coil 3211 , so that the sound quality of the second sounding unit 320 will not be affected.
  • the first auxiliary magnet 324 may be a magnetic sheet, and the magnetic sheet may be disposed in the second cavity 302 and opposite to the central magnet 322 a of the magnetic circuit system 322 .
  • the first auxiliary magnet 324 is located directly below the central magnet 322a.
  • the magnetization direction of the first secondary magnet 324 is related to the direction of the magnetic field received by the second voice coil 3211, that is to say, the magnetization direction of the first secondary magnet 324 is related to the direction of the magnetic circuit system 322. Depends on the magnetization direction.
  • Fig. 8 and shown in Fig. 10 take the first end of center magnet 322a as N pole, the second end of this center magnet 322a is S pole, the first end of side magnet 322b is S pole, the first end of this side magnet 322b
  • the two ends are an example of N poles, and the magnetic circuit generated by the magnetic circuit system 322 penetrates perpendicularly from the outer surface of the second voice coil 3211 to the inner surface of the second voice coil 3211 .
  • the end of the first secondary magnet 324 facing the magnetic circuit system 322 can be an S pole, and correspondingly, the first secondary magnet 324 is facing away from the end of the magnetic circuit system 322.
  • N pole so that the first The magnetic field lines generated by the secondary magnet 324 are emitted from the S pole, and enter the N pole of the first secondary magnet 324 through the outside of the first secondary magnet 324, so that part of the magnetic field of the first secondary magnet 324 passes through the outer surface of the second voice coil 3211 vertically.
  • the amplitude of the second diaphragm 3212 can be increased, and the sound pressure level of the second sound unit 320 can be increased.
  • the first auxiliary magnet 324 can be fixed on the end of the magnetic circuit system 322 facing the second cavity 302 by means of bonding or the like, for example, the first auxiliary magnet 324 can be glued on The center washer 322d is used to improve the stability of the first auxiliary magnet 324 inside the speaker 300 .
  • the first auxiliary magnet 324 can also be disposed in the third cavity 303 , for example, the first auxiliary magnet 324 can be located on the first housing 350 facing the second voice coil 3211
  • One side surface of the first cover 350 (hereinafter referred to as the inner surface of the first cover 350), for example, the first secondary magnet 324 can be fixed on the inner surface of the first cover 350 by bonding or other means to enhance the first secondary magnet 324 in the speaker 300, so as to ensure the reliability of the magnetization of the first auxiliary magnet 324 to the second voice coil 3211, and avoid the deviation of the first auxiliary magnet 324 in the speaker 300 and affect the magnetization of the second voice coil 3211. Magnetizing effect.
  • the first secondary magnet 324 in a ring structure can be a whole side magnet, or a side magnet formed by splicing a plurality of bar magnets. It can be understood that each bar magnet can be an arc magnet or a rectangular magnet, and the embodiment of the present application does not limit the shape of the bar magnet, which can be selected according to actual needs.
  • the first secondary magnet 324 may be located directly below the second voice coil 3211 .
  • the first auxiliary magnet 324 can be fixed on the inner surface of the first cover 350 by means of bonding or the like.
  • the outer edge of the first auxiliary magnet 324 can be an S pole.
  • the outer edge of the first auxiliary magnet 324 is an N pole, and part of the magnetic force lines of the first auxiliary magnet 324 are emitted from the N pole and enter the first auxiliary magnet 324 through the outside of the first auxiliary magnet.
  • the S pole of the magnetic 324 is an S pole.
  • the outer part of the magnetic field of the first auxiliary magnet 324 penetrates vertically from the outer surface of the second voice coil 3211 to the inner surface of the second voice coil 3211, thereby enhancing the magnetic induction intensity received by the second voice coil 3211, so that The vibration amplitude of the second diaphragm 3212 is increased to increase the sound pressure level of the second sound generating unit 320 .
  • Fig. 13 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • the speaker 300 may further include a second secondary magnet 314, the first voice coil 3111 is located in the magnetic field (such as the second secondary magnetic field) of the second secondary magnet 314, and the second The direction of the magnetic field of the second secondary magnetic field passing through the first voice coil 3111 is the same as the direction of the magnetic field that the magnetic circuit system 322 acts on the first voice coil 3111, that is to say, the direction of the magnetic field of the second secondary magnetic field passing through the first voice coil 3111 is the same as The direction of the magnetic field passing through the first voice coil 3111 in the magnetic circuit is the same, that is, the second auxiliary magnet 314 is used to magnetize the magnetic field passing through the first voice coil 3111 to enhance the magnetic induction intensity of the first voice coil 3111, thereby increasing the A force factor of the voice coil 3111 increases the high frequency sound pressure level of the first sound generating unit 310 .
  • the second auxiliary magnet 314 may be located on the side of the magnetic circuit system 322 facing the first vibration system 311 during specific installation, for example, the second auxiliary magnet 314 may be located in the first sound unit 310 .
  • the projection of the second auxiliary magnet 314 on the thickness direction of the first voice coil 3111 (such as the direction shown by z in FIG.
  • the second auxiliary magnet 314 can be in a ring structure, and can be arranged facing the first voice coil 3111, for example, the second auxiliary magnet 314 is located directly above the first voice coil 3111, so as to
  • the magnetic field of the voice coil 3111 is magnetized to increase the force factor of the first voice coil 3111 and also ensure the symmetry of the first sound unit 310 so that the sound quality of the first sound unit 310 will not be affected.
  • the magnetization direction of the second auxiliary magnet 314 is related to the direction of the magnetic field received by the first voice coil 3111 .
  • the magnetic circuit generated by the magnetic circuit system 322 penetrates perpendicularly from the inner surface of the first voice coil 3111 to the outer surface of the second voice coil 3211, corresponding to the example shown in FIG.
  • the inner edge of 314 can be an N pole, and correspondingly, the outer edge of the second auxiliary magnet 314 is an S pole, then part of the magnetic field lines of the second auxiliary magnet 314 are emitted from the N pole, and enter through the outside of the second auxiliary magnet 314 to The S pole of the second secondary magnet 314, the part of the magnetic field outside the second secondary magnet 314 penetrates vertically from the inner side of the first voice coil 3111 to the outer side of the first voice coil 3111, thereby strengthening the first voice coil
  • the magnetic induction received by 3111 increases the amplitude of the first diaphragm 3112 and increases the sound pressure level of the first sound generating unit 310 .
  • the loudspeaker 300 can also include a second cover 360, the second cover 360 is set on the opening of one end of the basin frame 340 provided with the first sound unit 310, that is, the second cover 360 is set on the On the opening of the second end of the basin frame 340 , for example, the second cover body 360 may be fixed on the second end surface of the basin frame 340 by bonding or screwing. It can be understood that the outer edge of the first diaphragm 3112 can be fixed on the second end surface of the frame 340 , and the outer edge of the second cover 360 can be directly fixed, for example bonded, to the outer edge of the first diaphragm 3112 .
  • the first cover body 350 , the basin frame 340 and the second cover body 360 jointly enclose the inner cavity of the loudspeaker 300 , so that the sounding units such as the first sounding unit 310 and the second sounding unit 320 are accommodated in the loudspeaker 300 in the lumen.
  • a fourth cavity 304 such as a front cavity of the first sound unit 310 may be formed between the side of the first diaphragm 3112 facing the second cover 360 and the second cover 360 .
  • the first sound outlet 312 can be opened on the second cover 360, and the first sound outlet 312 communicates the front chamber of the first sound unit 310 with the outside of the speaker 300, so that the first sound unit 310 can transmit the high-frequency sound to the outside of the speaker 300 through the first sound outlet 312 .
  • the wavelength of high-frequency sound is shorter, therefore, compared with the second sound outlet 323, the first sound outlet 312 is set closer to the sound outlet 100a of the electronic device such as earphones, so as to ensure that the user receives The sound pressure level of high-frequency sounds.
  • the second cover 360 can directly serve as a part of the housing 100 of an electronic device such as an earphone, and the first sound outlet 312 on the second cover 360 can directly serve as an outlet of the electronic device such as an earphone.
  • Voice mouth 100a can directly serve as a part of the housing 100 of an electronic device such as an earphone, and the first sound outlet 312 on the second cover 360 can directly serve as an outlet of the electronic device such as an earphone.
  • the second secondary magnet 314 can be located on the side surface of the second cover 360 facing the magnetic circuit system 322 (hereinafter referred to as the inner surface of the second cover 360), for example, the second The secondary magnet 314 can be fixed on the inner surface of the second cover 360 by bonding or other means to enhance the structural stability of the second secondary magnet 314 in the loudspeaker 300, thereby ensuring that the second secondary magnet 314 passes through the first voice coil
  • the magnetization reliability of the magnetic field of 3111 prevents the second secondary magnet 314 from shifting in the loudspeaker 300 to affect the magnetization effect of the magnetic field passing through the second voice coil 3211 .
  • the projection of the second auxiliary magnet 314 on the thickness direction of the first voice coil 3111 can be located in the cavity of the first voice coil 3111, for example, the second auxiliary magnet 314 can be connected with the center magnet 322a Oppositely, for example, the second secondary magnet 314 is located directly above the central magnet 322a, and the second secondary magnet 314 can be fixed on the inner surface of the second cover 360 by bonding or the like.
  • the embodiment of the present application specifically does not limit the arrangement positions of the first auxiliary magnet 324 and the second auxiliary magnet 314 .
  • the examples shown in FIGS. 10 to 13 are that the speaker 300 includes the first auxiliary magnet 324 or the second auxiliary magnet 314. In other examples, the speaker 300 may also include the first auxiliary magnet 324 and the second auxiliary magnet.
  • the magnet 314 is used to increase the magnetic induction of the first sound unit 310 and the second sound unit 320, thereby improving the low-frequency sensitivity and the mid-frequency or high-frequency sensitivity of the speaker 300, so that the sound pressure level of the speaker 300 can be improved.
  • the upper surface of the magnetic circuit system 322 is a flat surface without concave cavity and other structures, and the rear cavity of the first sound unit 310 is the first vibrating system 311
  • the cavity between the first diaphragm 3112 and the upper surface of the magnetic circuit system 322, the first sounding unit 310 can be responsible for high-frequency sounding, for example, as shown in Figure 7, the working frequency band of the first sounding unit 310 is 11kHz -14kHz band.
  • the second sounding unit 320 is responsible for low-frequency sounding.
  • the operating frequency band of the second sounding unit 320 is within the frequency band of 11 kHz. Based on this, in the examples corresponding to FIGS. 5 to 13 , the speaker 300 Realized low frequency and high frequency sound.
  • FIG. 14 is a sectional view of another speaker provided by an embodiment of the present application
  • FIG. 15 is a sectional view of the speaker corresponding to FIG. 14
  • FIG. 16 is an exploded view of the speaker corresponding to FIG. 14 .
  • the side of the magnetic circuit system 322 facing the first vibration system 311 may be formed with a cavity 3224, and the opening of the cavity 3224 faces the first vibration of the first vibration system 311.
  • the first cavity 301 is formed between the first vibration system 311 such as the first diaphragm 3112, the surface of the magnetic circuit system 322 and the inner wall of the concave cavity 3224, that is, the first vibration system 311 faces one side of the magnetic circuit system 322
  • the rear cavity of the first sound generating unit 310 is formed between the side, the surface of the magnetic circuit system 322 and the inner wall of the concave cavity 3224 .
  • the surface of the magnetic circuit system 322 refers to the surface of the magnetic circuit system 322 facing the first diaphragm 3112 .
  • the space size of the back cavity of the first sounding unit 310 is increased, the stiffness of the back cavity of the first sounding unit 310 is reduced, and the resonance point of the first sounding unit 310 is moved forward to
  • the intermediate frequency range improves the intermediate frequency sensitivity of the first sounding unit 310, that is, the first sounding unit 310 is more suitable for intermediate frequency output, and enhances the intermediate frequency performance of the speaker 300, so that the speaker 300 meets actual needs, and the structure of the first sounding unit 310 is simple, Easy to make.
  • the concave cavity 3224 and the second cavity 302 can be sealed to ensure that the first cavity 301 (such as the rear of the first sound unit 310) Cavity) is sealed and isolated from the front cavity of the second sound unit 320, which improves the crosstalk problem between the first sound unit 310 and the second sound unit 320, and improves the low-frequency and mid-frequency sound quality of the speaker 300 such as the cleanliness of the sound.
  • the concave cavity 3224 can penetrate to the side surface of the magnetic member 3221 facing the washer 3222 .
  • the end penetrates to the second end of the magnetic member 3221 (refer to FIG. 15 ), so as to form a blind hole in the magnetic circuit system 322 .
  • the first end of the magnetic member 3221 faces the first diaphragm 3112
  • the second end of the magnetic member 3221 faces the second diaphragm 3212 .
  • a through hole (shown in FIG. 16 ) is formed on the support member 3223 and the central magnet 322a of the magnetic member 3221 .
  • direction) coaxial setting for example, the supporting member 3223 and the central magnet 322a can be in a ring structure, so that the inner cavities of the supporting member 3223 and the central magnet 322a can jointly form a concave cavity 3224 .
  • Such setting can increase the volume of the first cavity 301 such as the back cavity of the first sound unit 310 , so that the intermediate frequency performance of the first sound unit 310 is better.
  • FIG. 17 is a performance simulation result diagram of the loudspeaker corresponding to FIG. 15 in the electronic device.
  • curve a is the performance curve of the second sounding unit 320
  • curve d is the performance curve of the first sounding unit 310.
  • the second sounding unit 320 in a high output state, that is, the sensitivity of the second sounding unit 320 in the frequency band of 20Hz-2kHz, that is, the sound pressure level is relatively high, and it can be responsible for the low-frequency sounding of the speaker 300, and the frequency is around 3kHz , the first sounding unit 310 can replace the output of the second sounding unit 320, which provides higher sensitivity and transient characteristics, that is, the first sounding unit 310 has a higher sound pressure level near 3 kHz, and is responsible for the mid-frequency sound of the speaker 300 .
  • the washer 3222 can seal and isolate the first cavity 301 and the second cavity 302 , for example, the central washer 322d blocks the opening of the concave cavity 3224 toward one end of the second cavity 302 .
  • the structure of the magnetic circuit system 322 itself can be used for the first cavity 301
  • the sealed isolation from the second cavity 302 also reduces the number of components of the speaker 300 , thereby simplifying the assembly process of the speaker 300 .
  • FIG. 18 is a sectional view of another speaker provided by an embodiment of the present application
  • FIG. 19 is a sectional view of the speaker corresponding to FIG. 18
  • FIG. 20 is an exploded view of the speaker corresponding to FIG. 18 .
  • the concave cavity 3224 can go through the magnetic circuit system 322 and the side of the second cavity 302 facing the second cavity 302 , in other words, the concave cavity 3224 runs through the magnetic circuit system 322
  • Two ends along the thickness direction (for example, the direction shown by z in FIG. 19 ) are used to form through holes in the magnetic circuit system 322 .
  • through holes are formed on the support member 3223 , the central magnet 322 a and the washer 3222 , and the through holes are coaxially arranged along the z direction.
  • the supporting member 3223, the central magnet 322a and the central washer 322d can all have a ring structure, so that the inner cavity of the supporting member 3223, the central magnet 322a and the central washer 322d can jointly form a concave cavity 3224 .
  • the first vibration system 311 such as the first diaphragm 3112, the surface of the magnetic circuit system 322 and the inner wall of the through hole form the rear cavity of the first sound unit 310, in other words, the first
  • the cavity between the side of the diaphragm 3112 facing the magnetic circuit system 322 and the surface of the magnetic circuit system 322, and the inner cavity of the through hole are the rear cavity of the first sound unit 310, which improves the sound quality of the first sound unit 310.
  • the space size of the rear cavity improves the intermediate frequency sensitivity of the first sound generating unit 310 .
  • the manufacturing process of the concave cavity 3224 is simplified and the manufacturing efficiency of the speaker 300 is improved.
  • a second damping mesh 3225 can be provided on the end cover of the concave cavity 3224 (such as a through hole) facing the second cavity 302 to separate the concave cavity 3224 from the second cavity 302 and improve the first cavity.
  • Fig. 21 is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • the concave cavity 3224 of the embodiment of the present application can be filled with a sound-absorbing member 3226 to reduce the interference of the standing wave caused by the concave cavity 3224 on the sound emitted by the first sound unit 310 and avoid the formation of the first cavity 301
  • the resonant cavity improves the cleanliness and clarity of the sound of the first sound unit 310 .
  • the sound-absorbing member 3226 can be filled in the cavity 3224 of the speaker 300 with any of the above-mentioned structures.
  • the sound-absorbing member 3226 may include but not limited to any one or several sound-absorbing structures with voids inside sound-absorbing cotton, plastic foam, zeolite molecular sieve and mesoporous materials, so that the voids in the sound-absorbing member 3226 can be used as the first A part of the back cavity of the sound unit 310 .
  • the pore size of the zeolite molecular sieve and the mesoporous material is at the nanometer level, which can improve the sound absorption effect on the one hand, and on the other hand, the space inside the sound absorption part 3226 can be used as a part of the rear cavity of the first sound unit 310, thereby expanding the first sound unit 310 The rear cavity, thereby reducing the working frequency band of the first sound unit 310.
  • the first sound unit 310 can be responsible for mid-frequency sound generation, and the second sound generation unit 320 can be responsible for low-frequency sound generation, so that the speaker in the embodiment of the present application realizes Frequency division design of low frequency and intermediate frequency.
  • Fig. 22a is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • a concave cavity 3224 can be formed in the magnetic circuit system 322, and the concave cavity 3224 can penetrate to the side of the magnetic circuit system 322 facing the second cavity 302.
  • the concave cavity 3224 runs through both ends of the magnetic circuit system 322 along the thickness direction (for example, the direction indicated by z in FIG. 22 a ), so as to form a through hole in the magnetic circuit system 322 .
  • a sealing member may be provided in the second sound unit 320, for example, a sealing member such as a first sealing member 315 may be provided in the second cavity 302, and the two ends of the first sealing member 315 are connected to the magnetic circuit system 322 respectively. Sealed connection with the second diaphragm 3212, for example, one end of the first seal 315 can be sealed with the side of the washer 3222 facing the second cavity 302, and the other end of the first seal 315 can be connected with the second diaphragm 3212 is sealingly connected to one side of the second cavity 302 .
  • the first sealing member 315 may have a first through hole 3151, and the two ends of the first through hole 3151 communicate with the cavity 3224 and the third cavity 303 respectively.
  • the cavity 3224 is The through hole formed on the magnetic circuit system 322, the second diaphragm 3212 such as the second dome 321a has a through hole m, one end of the first through hole 3151 communicates with the through hole, and the other end of the first through hole 3151 It communicates with the through hole m on the second diaphragm 3212, so that the through hole, that is, the concave cavity 3224, can be communicated with the third cavity 303 such as the back cavity of the second sound unit 320, so that the back cavity of the second sound unit 320 Also as a part of the back chamber of the first sound unit 310, compared to the examples in Fig.
  • the space of the back chamber of the first sound unit 310 is further enlarged, so that the resonance frequency of the first sound unit 310 can be shifted forward to low frequency Range, for example, the resonance point of the first sounding unit 310 can be moved forward to the frequency band within 11kH, thereby improving the low-frequency sensitivity and transient characteristics of the first sounding unit 310, that is to say, the first sounding unit 310 can be responsible for low-frequency sounding , thereby improving the low-frequency output capability of the speaker 300 in the embodiment of the present application, so that the low-frequency sound pressure level of the speaker 300 can be improved.
  • the two ends of the first sealing member 315 are hermetically connected with the magnetic circuit system 322 and the second diaphragm 3212, so as to ensure the sealing between the first cavity 301 and the second cavity 302 and avoid the second sound unit 320 There is a crosstalk with the first sound generating unit 310 .
  • one end of the first sealing member 315 can be bonded to the washer 3222 through a sealant, and the other end of the first sealing member 315 can be bonded to the second diaphragm 3212 through a sealant.
  • the embodiment of the application specifically does not limit the connection manner between the first sealing member 315 and the washer 3222 and the second diaphragm 3212 .
  • Fig. 22b is a cross-sectional view of another speaker provided by an embodiment of the present application.
  • a second sealing member 316 may also be provided in the second sound generating unit 320 . Both ends of the second sealing member 316 are respectively sealed and connected to the second diaphragm 3212 and the first cover 350 , for example, one end of the second sealing member 316 is connected to the side of the second diaphragm 3212 facing the second cavity 302 The other end of the second sealing member 316 is in sealing connection with the first cover body 350 .
  • the second sealing member 316 may have a second conduction hole 3161, and the two ends of the second conduction hole 3161 are respectively connected to the first conduction hole 3151 and the earphone rear chamber 102 (refer to FIG. 3 ). shown) connected.
  • the concave cavity 3224 is a through hole formed on the magnetic circuit system 322, the second diaphragm 3212, such as the second dome 321a, has a through hole, and one end of the second via hole 3161 passes through the through hole on the second diaphragm 3212.
  • the hole communicates with the first via hole 3151 , so that one end of the second via hole 3161 communicates with the cavity 3224 .
  • the first cover 350 has a through hole n communicating with the earphone rear chamber 102, and the other end of the second through hole 3161 communicates with the through hole n on the first cover 350, so that the other end of the second through hole 3161 It communicates with the rear cavity 102 of the earphone.
  • the through hole n of the first cover body 350 can communicate with the earphone rear cavity 102 through the pores on the first damping mesh 352 .
  • the concave cavity 3224 on the magnetic circuit system 322 can communicate with the earphone rear cavity 102 through the first conduction hole 3151 and the second conduction hole 3161, so that the earphone rear cavity 102 also serves as a part of the rear cavity of the first sound unit 310 , while the earphone rear chamber 102 has a relatively large space, expanding the rear chamber space of the first sound unit 310, so that the resonance frequency of the first sound unit 310 can be moved forward to the low frequency range, for example, the resonance point of the first sound unit 310 can be advanced Move to the frequency band within 11kH, thereby improving the low frequency sensitivity of the first sound generating unit 310 .
  • the two ends of the second sealing member 316 are hermetically connected with the second diaphragm 3212 and the first cover 350, so as to ensure the sealing between the first cavity 301 and the third cavity 303 and avoid the second sound unit Crosstalk occurs between 320 and the first sound generating unit 310 .
  • one end of the second sealing member 316 can be bonded to the second diaphragm 3212 through a sealant, and the other end of the second sealing member 316 can be bonded to the first cover 350 through a sealant.
  • the embodiment of the present application specifically does not limit the connection manner between the second sealing member 316 , the second diaphragm 3212 and the first cover 350 .
  • one end of the second sealing member 316 can directly pass through the through hole of the second diaphragm 3212, and be sealingly connected with one end of the first sealing member 315, for example, one end of the second sealing member 316 can be bonded are fixed on one end of the first sealing member 315 in an equal manner, so that the second via hole 3161 is directly communicated with the first via hole 3151 .
  • first sealing member 315 and the second sealing member 316 can also be an integrally formed sealing member, the sealing member is passed through the through hole of the second diaphragm 3212, and one end can be sealingly connected with the washer 3222, The other end is sealingly connected with the first cover body 350 , so that the through hole in the magnetic circuit system 322 communicates with the earphone rear chamber 102 through the conduction hole in the sealing member, so as to expand the space size of the first sound unit 310 rear chamber.
  • first sealing member 315 and the second sealing member 316 can be a cylindrical member with openings at both ends, and the cylindrical member can be a cylinder, a square cylinder or a cylinder of other shapes.
  • the embodiment of the present application is not correct.
  • the configuration of the first seal 315 and the second seal 316 is constrained.
  • the constituent materials of the first sealing member 315 and the second sealing member 316 may include but not limited to any one of rigid materials such as copper, aluminum, carbon steel and flexible materials such as rubber and silica gel, which can be selected according to actual needs. .
  • the magnetism of the central area of the magnetic circuit system 322 is weaker than that of the edge area, which makes most of the magnetic lines of force of the magnetic circuit system 322 be sent out through the edge area of the common magnetic circuit system to form a magnetic circuit and drive
  • the first voice coil 3111 and the second voice coil 3211 move.
  • the central area of the magnetic circuit system 322 refers to a part of the area away from the inner side of the first voice coil 3111 and the second voice coil 3211, for example, the projection of the first voice coil 3111 on the magnetic circuit system 322 is located in the central area peripheral.
  • the concave cavity 3224 of the embodiment of the present application can be located in the central area of the magnetic circuit system 322 when it is specifically set, that is, the magnetic induction intensity of the concave cavity 3224 is set in the magnetic circuit system 322 is relatively weak
  • the concave cavity 3224 can be set in the central area of the central magnet 322a, the central area of the support member 3223 and the central area of the central washer 322d, so that the impact of the concave cavity 3224 on the magnetic circuit system 322 can be reduced.
  • the influence of the magnetic induction intensity of the first voice coil 3111 and the second voice coil 3211 to ensure the magnetic induction of the magnetic circuit that is, to ensure the force factor of the first voice coil 3111 and the second voice coil 3211, so that the loudspeaker 300 at low frequencies, Neither mid-range nor high-frequency sound pressure levels are affected.
  • Figure 23 is a partial exploded view of Figure 4
  • Figure 24 is a schematic structural view of the basin frame in Figure 23
  • Figure 25 is a structural schematic view of the first conductive insert and the second conductive insert in Figure 24
  • Figure 26 is one of Figure 4 Partial cutaway view.
  • the pin is led out to the outer surface of the side wall of the basin frame 340 through one of the first conductive inserts, such as the first conductive insert 3401a, and is electrically connected to the external circuit.
  • the negative pin of the first voice coil 3111 is passed through another first conductive insert, such as The first conductive insert 3401b is led out to the outer surface of the side wall of the basin frame 340 and is electrically connected to an external circuit.
  • each first conductive insert has a first conductive pin
  • the second end of each first conductive insert has a second conductive pin
  • the first conductive pin and the second conductive pin The pins are all exposed on the outer surface of the side wall B of the basin frame 340, wherein the two first conductive pins 341a (341b) are used to electrically connect with the first voice coil 3111, and the two second conductive pins 342a (342b ) is used for electrical connection with the external circuit, so that the first voice coil 3111 is electrically connected with the external circuit through two first conductive inserts 3401a (3401b).
  • one of the first conductive pins such as the first conductive pin 341a, is electrically connected to the positive pin of the first voice coil 3111, and the other first conductive pin, such as the first conductive pin 341b, is electrically connected to the positive pin of the first voice coil 3111.
  • the negative pin is electrically connected.
  • one of the second conductive pins such as the second conductive pin 342a is electrically connected to the positive pole of the external circuit
  • the other second conductive pin such as the second conductive pin 342b is electrically connected to the negative pole of the external circuit, so that the first
  • the two pins of the voice coil 3111 are electrically connected to the external circuit to ensure that the external circuit feeds a current to the first voice coil 3111, so that the first voice coil 3111 after electrification generates Lorentz force under the magnetic field of the magnetic circuit, and Driven by the Lorentz force to vibrate.
  • the first voice coil 3111 can be formed by winding a wire along the thickness direction perpendicular to the first voice coil 3111 (refer to the direction shown by z in FIG. 23 ). Winding from inside to outside or from outside to inside, the positive pin and negative pin of the first voice coil 3111 can be the two ends of the wire forming the first voice coil 3111 respectively.
  • each first conductive insert further includes a first conductive member, and the first conductive pin and the second conductive pin are respectively connected to two ends of the first conductive member.
  • the first conductive insert 3401a includes a first conductive member 343a, and the first conductive pin 341a and the second conductive pin 342a are respectively connected to two ends of the first conductive member 343a (refer to FIG. 26 ).
  • the external circuit may include electrical connections and electronics such as an audio encoder on the motherboard of the headset.
  • one end of the electrical connector such as the flexible circuit board is electrically connected to the audio encoder
  • the other end of the electrical connector such as the flexible circuit board is electrically connected to the two second conductive pins 342a (342b) 352, so that the audio encoder and the first
  • the first voice coil 3111 of a sound unit 310 is electrically connected.
  • the audio encoder transmits the audio signal to the first voice coil 3111 in the form of electric current through the electrical connector and the two first conductive inserts 3401a (3401b), so that the first voice coil 3111 generates a sound with a certain frequency.
  • the current generates Lorentz force under the action of the magnetic field to drive the first voice coil 3111 to vibrate according to the audio signal.
  • the first conductive inserts are more convenient to be electrically connected to the first voice coil 3111 , thereby simplifying the electrical connection process between the first sound generating unit 310 and the first conductive insert, and improving the assembly efficiency of the speaker 300 .
  • FIG. 27 is a schematic structural view of the first vibration system in FIG. 25
  • FIG. 28 is an exploded view of FIG. 27
  • FIG. 29 is a structural schematic view of another viewing angle of FIG. 27 .
  • the speaker 300 of the embodiment of the present application may include a flexible circuit board (such as a first flexible circuit board 313), the first flexible circuit board 313 and the first voice coil 3111 along the height of the basin frame 340 Direction (eg z-direction) cascading settings.
  • a flexible circuit board such as a first flexible circuit board 313
  • the first flexible circuit board 313 and the first voice coil 3111 along the height of the basin frame 340
  • Direction eg z-direction
  • at least part of the first flexible circuit board 313 is located on the side of the first voice coil 3111 facing away from the magnetic circuit system 340 .
  • the first conductive pin 341 a and the first conductive pin 341 b are electrically connected to the first voice coil 3111 through the first flexible circuit board 313 ,
  • a part of the first flexible circuit board 313 such as the first body portion 3131 is horizontally arranged between the first voice coil 3111 and the first diaphragm 3112, that is, the first voice coil 3111,
  • the first body part 3131 and the first diaphragm 3112 are stacked sequentially along the z direction, for example, the first voice coil 3111 is located on the inner surface of the first flexible circuit board 313, and the first diaphragm 3112 is located on the outside of the first flexible circuit board 313 surface, and the first body portion 3131 of the first flexible circuit board 313 is electrically connected to the pins of the first voice coil 3111, and the other part of the first flexible circuit board 313 extends to the outer side wall of the frame 340, for example, the The outer edge of the first flexible circuit board 313 has two first extensions, respectively the first extension 3132a and the first extension 3132b, and the first extension 3132a and the first extension 3132b can extend to the outside of the frame 340 wall (as shown in FIG.
  • the pins 341b are electrically connected, so that the positive pin and the negative pin of the first voice coil 3111 are electrically connected to the two first conductive pins 341a ( 341b ) through the first flexible circuit board 313 .
  • the inner surface of the first flexible circuit board 313 refers to the side surface of the first flexible circuit board 313 facing the magnetic circuit system 340
  • the outer surface of the first flexible circuit board 313 refers to the back surface of the first flexible circuit board 313.
  • the pins of the first voice coil 3111 are electrically connected to the two first conductive pins 341a (341b) through the first flexible circuit board 313, making the electrical connection between the first voice coil 3111 and the first conductive pins more convenient and reliability, thereby improving the efficiency and reliability of the electrical connection between the first voice coil 3111 and the first conductive insert.
  • the flexibility of the first flexible circuit board 313 is better, so that a part of the first flexible circuit board 313 such as the first extension 3132 is attached to the outer wall of the frame 340.
  • the first voice coil 3111 is in Luo
  • the first diaphragm 3112 can be driven to move along the thickness direction of the first voice coil 3111 by pressing against the flexible circuit board, that is, the setting of the flexible circuit board ensures that the first diaphragm 3112 the vibration amplitude.
  • the first flexible circuit board 313 has a wiring layer, one end of the wiring layer is electrically connected to the first voice coil 3111, and the other end of the wiring layer extends to the first extension part. terminal, and electrically connected with the first conductive pin.
  • the wiring layer may include but not limited to a copper layer and the like.
  • the first flexible circuit board 313 includes at least two wiring layers, and the first end of one wiring layer (such as the first wiring layer a1) is electrically connected to the positive pin of the first voice coil 3111, and the first end of the first wiring layer a1 is electrically connected to the positive pin of the first voice coil 3111.
  • the second end of a wiring layer a1 extends to the end of the first extension portion 3132a, and is electrically connected to the first conductive pin 341a.
  • the first end of another wiring layer (such as the second wiring layer a2) is electrically connected to the negative pin of the first voice coil 3111, and the second end of the second wiring layer a2 extends to the end of the first extension part 3132b part, and is electrically connected to the first conductive pin 341b.
  • first wiring layer a1 and the second wiring layer a2 are located in the first body part 3131 , and another part is located in the first extension part 3132 a and the first extension part 3132 b.
  • first wiring layer a1 and the second wiring layer a2 may be the same metal layer of the first flexible circuit board 313 in the z direction, and the first wiring layer a1 and the second wiring layer a2 It may also be a metal layer of different layers in the z direction of the first flexible circuit board 313 .
  • the first body part 3131 of the first flexible circuit board 313 may have an avoidance hole (for example, a third avoidance hole 313 a ).
  • the weight of the first flexible circuit board 313 is increased, thereby increasing the vibration amplitude of the first diaphragm 3112, so that the sensitivity of the first sound unit 310 is improved.
  • two third extensions may be provided on the inner wall of the third avoidance hole 313a, and the third extension 3134a and one end of the third extension part 3134b is connected to the inner wall of the third avoidance hole 313a, the third extension part 3134a and the third extension part 3134b are located in the inner cavity of the third escape hole 313a, and each third extension part is at least toward the first
  • a part of the wiring layer such as a copper sheet
  • the exposed copper sheet on the three extensions is, for example, on the first pad.
  • the exposed copper sheet on the third extension 3134a such as the first pad n1 (shown in FIG. 27 ), is a part of the first wiring layer a1, and the first pad n1 on the third extension 3134a
  • the positive pin of a voice coil 3111 is soldered, and the exposed copper sheet on the third extension 3134b, such as the first pad n2 (shown in FIG. 27 ), is part of the second wiring layer a2.
  • the third extension 3134b The first pad n2 on the first voice coil 3111 is electrically connected to the negative pin of the first voice coil 3111, so that the positive pin and the negative pin of the first voice coil 3111 are respectively soldered to the first wiring layer of the first flexible circuit board 313 a1 and the second wiring layer a2, so that the positive and negative pins of the first voice coil 3111 can be drawn out to the first extension part 3132a and the first extension through the first wiring layer a1 and the second wiring layer a2
  • the end portion of the portion 3132b so that the first extension portion 3132a is electrically connected to the first conductive pin 341a, and the first extension portion 3132b is electrically connected to the first conductive pin 341b.
  • an annular hole (such as the first annular hole 313 b ) can be provided in the area near the outer edge of the first body portion 3131 .
  • the first annular hole 313b and the third escape hole 313a divide the first body part 3131 into an inner ring 313e and an outer ring 313f, the third extension part 3134a and the third extension part 3134b are located at the inner edge of the inner ring 313e, and It is electrically connected with the pin of the first voice coil 3111.
  • a plurality of connecting parts may be provided in the first annular hole 313b, and the plurality of first connecting parts 3135 are arranged at intervals along the circumferential direction of the first annular hole 313b, and each One end of a connecting portion 3135 is connected to the inner ring 313e, and the other end of each first annular hole 313b is connected to the outer ring 313f, ensuring that the first flexible circuit board 313 is a complete structural member, so that the first flexible circuit board 313 assembly.
  • first extensions are formed on the outer edge of the outer ring 313f, and each first extension is connected to the inner ring 313e through the outer ring 313f and the first connecting portion 3135, in other words, the first voice coil 3111
  • the pins are electrically connected to the first extension part through the inner ring 313e, the first connecting part 3135 and the outer ring 313f.
  • the positive pin of the first voice coil 3111 is electrically connected to the first wiring layer a1 in the inner ring 313e through the first pad n1 on the third extension part 3134a, and then through one of the first connecting parts 3135 and The first wiring layer a1 in the outer ring 313f is electrically connected to the first wiring layer a1 in the first extension part 3132a, so that the positive pin of the first voice coil 3111 is led out to the end of the first extension part 3132a.
  • the negative pin of the first voice coil 3111 is electrically connected to the second wiring layer a2 in the inner ring 313e through the first pad n2 on the third extension part 3134b, and then through another first connection part 3135 in turn and the second wiring layer a2 in the outer ring 313f are electrically connected to the second wiring layer a2 in the first extension 3132b, so that the negative pin of the first voice coil 3111 is led out to the end of the first extension 3132b .
  • each first connecting portion 3135 can be in an “S” shape, that is to say, at least part of the two ends of each first connecting portion 3135 extend in a different direction from the middle portion, so as to optimize the first connecting portion 3135.
  • the setting of the first annular hole 313b also reduces the weight of the first flexible circuit board 313, thereby increasing the vibration amplitude of the first flexible circuit board 313, so that the vibration amplitude of the first vibration system 311 can be improved, thereby improving the vibration amplitude of the first flexible circuit board 313.
  • the audio performance of a sound unit 310 is also reduced.
  • a steel ring 370 is also provided on the inner surface of the first flexible circuit board 313, and the steel ring 370 is located on the inner surface of the outer edge of the first flexible circuit board 313, and the first flexible circuit board 313
  • the plate 313 is fixed on the second end of the basin frame 340 through the steel ring 370 .
  • the first sound unit 310 is modularized, for example, when assembling, only the first sound unit 310 needs to be assembled to the basin frame 340 Then, the first flexible circuit board 313 of the first sound unit 310 is electrically connected to the first conductive pin 341a of the first conductive insert 3401a, and the first flexible circuit board 313 is connected to the first conductive pin 3401b of the first conductive insert 3401b. When the pins 341b are electrically connected, the assembly of the first sound unit 310 is completed.
  • the second conductive pin 342b of the first conductive insert 3401b is electrically connected to energize the first voice coil 3111 in the first sound generating unit 310, which simplifies the wiring process of the first sound generating unit 310 and improves the assembly of the speaker 300 efficiency.
  • a first mounting hole 313c may be formed on the first extension portion 3132a and the first extension portion 3132b, and the first conductive pins 341a and the first conductive pins 341b are respectively passed through corresponding In the first installation hole 313c (refer to FIG. 4 ), and the first conductive pin is electrically connected with the inner wall of the first installation hole 313c, for example, the first conductive pin 341a is passed through the first extension part 3132a In the first installation hole 313c, and electrically connected with the inner wall of the first installation hole 313c, the first conductive pin 341b passes through the first installation hole 313c on the first extension part 3132b, and is connected with the first installation hole 313c.
  • the inner wall is electrically connected.
  • each first mounting hole 313c is exposed with a ring-shaped copper sheet, which can be used as a second pad and welded to the outer wall of the first conductive pin, so that the first extension part and the second A conductive pin is electrically connected.
  • the annular copper sheet is a part of the wiring layer in the first flexible circuit board 313 .
  • one end of the first wiring layer a1 is exposed on the inner surface of the third extension part 3134a, so as to form a first pad n1 on the third extension part 3134a, and weld it to the positive pin of the first voice coil 3111,
  • the other end of the first wiring layer a1 is exposed on the inner edge of the first installation hole 313c of the first extension part 3132a, and a second pad is formed around the inner edge of the first installation hole 313c (refer to m1 in FIG.
  • the second pad m1 may be an annular copper sheet
  • the first extension 3132a is welded to the first conductive pin 341a through the second pad m1, so that the first voice coil 3111 passes through the first flexible circuit board 313
  • the first wiring layer a1 is electrically connected to the first conductive pin 341a.
  • one end of the second wiring layer a2 is exposed on the inner surface of the third extension part 3134b, so as to form a first pad n2 on the third extension part 3134b, and weld it to the negative pin of the first voice coil 3111
  • the other end of the second wiring layer a2 is exposed on the inner edge of the first mounting hole 313c of the first extension part 3132b, and a second pad is formed around the inner edge of the first mounting hole 313c (refer to m2 in FIG.
  • the second pad m2 can be an annular copper sheet, and the first extension 3132b is welded to the first conductive pin 341b through the second pad m2, so that the negative pin of the first voice coil 3111 passes through the first
  • the second wiring layer a2 in the flexible circuit board 313 is electrically connected to the first conductive pin 341b.
  • the electrical connection between the pins for example, when the first extension 3132a is welded to the first conductive pin 341a, can be along the ring between the inner wall of the first mounting hole 313c and the side wall of the first conductive pin 341a. Soldering the gap makes the welding between the first extension part 3132a and the first conductive pin 341a easier and quicker, and improves the reliability of the electrical connection between the first extension part 3132a and the first conductive pin 341a.
  • a first wiring region 340a may be formed on the outer surface of the side wall of the basin frame 340, and the first wiring region 340a is located between two first conductive pins 341a (341b), namely The first wiring area 340a is located between the first conductive pin 341a and the first conductive pin 341b, and two second conductive pins 342a (342b) such as the second conductive pin 342a and the second conductive pin 342b are located between the first conductive pin 341a and the first conductive pin 341b.
  • the positive and negative pins of the first voice coil 3111 are led from the first conductive pin 341a and the first conductive pin 341b which are far away to the second conductive pin 342a and the second conductive pin which are relatively close.
  • pin 342b so that the outside world only needs one electrical connector such as a flexible circuit board to be directly welded to the two second conductive pins 342a (342b) in the first wiring area 340a, and then the first voice coil 3111 Passing in the current simplifies the electrical connection structure between the positive and negative pins of the first voice coil 3111 and the external circuit, thereby facilitating the application of the speaker 300 in the embodiment of the present application.
  • the first vibration system 311 can be mounted on the second sound unit 320, and the first extension 3132a of the first flexible circuit board 313 in the first sound unit 310 can be attached to the first extension 3132a of the first flexible circuit board 313.
  • the first conductive pin 341a is electrically connected
  • the first extension part 3132b of the first flexible circuit board 313 is electrically connected to the first conductive pin 341b, and then the assembly of the first sound unit 310 can be completed.
  • the second conductive pin 342a and the second conductive pin 342b on the outside of the pot frame 340 can be electrically connected, which realizes the modularization of the first sound unit 310, simplifies the wiring process of the first sound unit 310, and improves the speaker 300. assembly efficiency.
  • the surface of the pot frame 340 located in the first wiring area 340a can be a plane, so that a part of an external electrical connector such as a flexible circuit board can be attached to the plane to facilitate the connection with the second conductive pin 342a and the second conductive pin 342a.
  • the second conductive pins 342b are electrically connected, such as soldered, and also make the electrical connection between the external flexible circuit board and the two second conductive pins 342a ( 342b ) more stable and reliable.
  • the plane can be a slope
  • the top of the slope is inclined to the axis of the basin frame 340, so as to facilitate the welding operation of the external flexible circuit board and the second conductive pin, and also reduce the radial distance of the basin frame 340.
  • the occupied size that is, the radial size of the loudspeaker 300 is reduced.
  • the top of the slope is the end of the slope close to the second end of the basin frame 340 .
  • the two first conductive inserts 3401a (3401b) and the basin frame 340 of the embodiment of the present application can be integrally formed as one piece, so as to reduce the number of components of the speaker 300, thereby improving the assembly efficiency of the speaker 300, and also improving the
  • the assembly stability between each first conductive insert and the basin frame 340 makes the connection between the two ends of the first conductive insert, the first flexible circuit board 313 and the external circuit more reliable.
  • the two first conductive inserts 3401a may be detachably fixed on the side wall of the basin frame 340 by clipping or the like.
  • Fig. 30 is another partial sectional view of Fig. 4 .
  • the two second conductive inserts 3402a (3402b) are the second conductive insert 3402a and the second conductive insert 3402a respectively
  • the first ends of the second conductive insert 3402a and the second conductive insert 3402a are both located in the basin frame 340, and are respectively connected to the positive pin of the second voice coil 3211 It is electrically connected with the negative pin, for example, as shown in FIG.
  • the first end of the conductive insert 3402b is electrically connected to, for example welded to, the negative pin of the second voice coil 3211 .
  • the second conductive insert 3402a and the second end of the second conductive insert 3402a both have a third conductive pin, for example, the second end of the second conductive insert 3402a has a third conductive pin 344a , the second end of the second conductive insert 3402b has a third conductive pin 344b , and the third conductive pin 344a and the third conductive pin 344b are exposed on the outer surface of the side wall of the basin frame 340 .
  • each second conductive insert may include a second conductive member, the first end of the second conductive member is the first end of the conductive insert, for connecting with the second voice coil 3211 is electrically connected, and the second end of the second conductive member is electrically connected to the third conductive pin, so that the second voice coil 3211 is electrically connected to the third conductive pin through the second conductive member.
  • the second conductive insert 3402a may include a second conductive member 349a.
  • the positive pin C of the voice coil 3211 is electrically connected, and the second end of the second conductive member 349a is electrically connected to the third conductive pin 344a, so that the positive pin of the second voice coil 3211 is connected to the third conductive pin through the second conductive member 349a.
  • the needle 344a is electrically connected.
  • the second conductive insert 3402b may include a second conductive member 349b, and the first end of the second conductive member 349b is the first end of the second conductive insert 3402b, which is used for connecting with the second voice coil 3211.
  • the negative pin is electrically connected, and the second end of the second conductive member 349b is electrically connected to the third conductive pin 344b, so that the negative pin of the second voice coil 3211 is electrically connected to the third conductive pin 344b through the second conductive member 349b .
  • Fig. 30 shows the electrical connection structure between the second conductive insert 3402a and the positive pin C of the second voice coil 3211, and the connection between the second conductive insert 3402b and the negative pin of the second voice coil 3211 The electrical connection structure between them is consistent with the electrical connection structure between the second conductive insert 3402a and the positive pin C of the second voice coil 3211, which can be directly referred to as shown in FIG. 30 .
  • the second conductive member 349a and the second conductive member 349a are embedded in the side wall B of the frame 340 to ensure that the two second conductive inserts 3402a (3402b) are firmly fixed in the side wall of the frame 340, and the second conductive One end of the piece 349a and one end of the second conductive piece 349a are exposed on the outer surface of the side wall B of the basin frame 340 (refer to FIG. 26 ).
  • the two third conductive pins 344a are used for electrical connection with the external circuit, for example, the third conductive pin 344a is electrically connected with the positive pole of the external circuit, and the third conductive pin 344b is electrically connected with the negative pole of the external circuit , so that the second voice coil 3211 is electrically connected to the external circuit through the third conductive pin 344a and the third conductive pin 344b, so that the second voice coil 3211 is electrically connected to the external circuit, and the second voice coil 3211 is connected to the external circuit
  • the connection between the circuits is more reliable, thereby improving the reliability of the electrical connection between the second voice coil 3211 and the external circuit.
  • the second voice coil 3211 can be formed by winding wires along the thickness direction of the voice coil (refer to the direction shown by z in FIG. 7 ), then the positive pin and the negative pin of the second voice coil 3211 It can be the two ends of the wire forming the second voice coil 3211 respectively. It can be understood that the two pins of the second voice coil 3211 (such as the two ends of the wire) are respectively located at the two ends of the second voice coil 3211 along the thickness direction.
  • the second sounding unit 320 is modularized. , and then the pins of the second voice coil 3211 in the second sounding unit 320 are electrically connected to the first ends of the two third conductive pins 344a (344b), and the assembly of the second sounding unit 320 is completed.
  • the external circuit is electrically connected to the third conductive pins at the second ends of the two third conductive inserts 3403a (3403b), so that the second voice coil 3211 in the second sounding unit 320 can be energized, which simplifies the installation of the second sounding unit 320.
  • the wire process improves the assembly efficiency of the speaker 300 .
  • both the third conductive pins 344a and the third conductive pins 344b can be located in the first wiring area 340a of the basin frame 340, that is, the two third conductive pins 344a (344b) and The two second conductive pins 342a (342b) are all located in the first wiring area 340a, so that the outside world can directly connect with the two second conductive pins in the first wiring area 340a with only one electrical connector such as a flexible circuit board.
  • the pin 342a (342b) is welded with the two third conductive pins 344a (344b), so that the current can be passed to the first voice coil 3111 and the second voice coil 3211, which simplifies the first voice coil 3111 and the second voice coil 3211
  • the electrical connection structure between the positive and negative pins of the speaker 300 and the external circuit simplifies the electrical connection process between the two sounding units of the speaker 300 and the external circuit, thereby facilitating the application of the speaker 300 in the embodiment of the present application.
  • the two second conductive inserts 3402a (3402b) and the pot frame 340 can be integrally formed as one piece, for example, the second conductive insert 3402a and the second conductive insert 3402a and the pot frame 340 can be integrally injection-molded to simplify the pot frame 340 and the second conductive insert 3402a and the assembly process between the second conductive insert 3402a also reduces the number of components of the loudspeaker 300, so that the assembly efficiency of the loudspeaker 300 is improved, in addition, the basin frame 340 and the two
  • the connection stability between the second conductive inserts 3402a ( 3402b ) ensures the reliability of the electrical connection between the first sounding unit 310 and the second sounding unit 320 and the external circuit.
  • Fig. 31 is a schematic structural view of another loudspeaker provided by an embodiment of the present application
  • Fig. 32 is an exploded view of Fig. 31
  • Fig. 33 is a schematic structural view of the third sound generating unit in Fig. 31
  • Fig. 34 is a cross-sectional view of Fig. 31
  • the speaker 300 of the embodiment of the present application may further include a third sounding unit 330, wherein the operating frequency band of the second sounding unit 320 is smaller than that of the first sounding unit 310 and is smaller than that of the third sounding unit 330.
  • the working frequency band, and the third sounding unit 330 and the first sounding unit 310 are located on the same side of the second sounding unit 320 .
  • the third sounding unit 330 may be a micro-electromechanical system (Micro Electro Mechanical System, referred to as MEMS) (hereinafter may be referred to as a micro-electromechanical sounding unit), which is generally responsible for high-frequency sounding, for example, the third sounding unit 330 may be Responsible for the sound of the frequency band above 14kHz.
  • the first sounding unit 310 can be a planar membrane unit, which can be responsible for the intermediate frequency part (the frequency band between 11kHz-14kHz), and the second sounding unit 320 can be a dynamic unit, and can be responsible for the low frequency part (the frequency band between 20Hz-11kHz).
  • the side of the magnetic circuit system 322 facing the first diaphragm 3112 may be formed with a concave cavity 3224, the concave cavity
  • the opening of 3224 faces the first diaphragm 3112, so that the first cavity 301 is formed between the first diaphragm 3112, the surface of the magnetic circuit system 322 and the inner wall of the concave cavity 3224, that is, the first diaphragm 3112 faces the side of the magnetic circuit system 322.
  • One side, the surface of the magnetic circuit system 322 and the inner wall of the concave cavity 3224 form the rear cavity of the first sound generating unit 310 .
  • the surface of the magnetic circuit system 322 refers to the surface of the magnetic circuit system 322 facing the first diaphragm 3112 .
  • the space size of the back cavity of the first sounding unit 310 is increased, the stiffness of the back cavity of the first sounding unit 310 is reduced, and the resonance point of the first sounding unit 310 is moved forward to
  • the intermediate frequency range improves the intermediate frequency sensitivity of the first sounding unit 310, that is, the first sounding unit 310 is more suitable for intermediate frequency output, and enhances the intermediate frequency performance of the speaker 300, so that the speaker 300 meets actual needs, and the structure of the first sounding unit 310 is simple, Easy to make.
  • the micro-electromechanical sounding unit that is, the MEMS sounding unit is prepared by MEMS technology, which uses the internal piezoelectric material to warp and deform under the action of an electric field to drive the diaphragm of the MEMS sounding unit to vibrate, so that the piezoelectric material and the vibration The membrane pushes the air in the MEMS sound unit to vibrate, and sound is produced.
  • the MEMS sounding unit is generally made of MEMS technology, which shows excellent potential and effect in the process of device miniaturization, and can effectively reduce the volume of the MEMS sounding unit, so that the speaker 300 can be reduced on the basis of improving the high-frequency performance of the speaker 300.
  • the size of the speaker can have significant advantages in the scene of micro speakers, such as earphones, smart glasses, bracelet watches and other portable products.
  • the setting of the third sounding unit 330 that is, the MEMS sounding unit broadens the operating frequency band of the speaker 300 , improves the audio effect of the speaker 300 , and makes the usage scenarios of the speaker 300 in the embodiment of the present application more extensive.
  • the first sounding unit 310 and the third sounding unit 330 are located on the same side of the second sounding unit 320, that is, the two higher frequency sounding units are located on the lower frequency second sounding unit. 320, in this way, during assembly, the sound outlets of the first sound unit 310 and the third sound unit 330 can have the same orientation, and at the same time be set close to the sound outlets of electronic devices such as earphones, so as to increase the frequency of higher frequencies. Sensitivity of the two sounding units.
  • the sound outlet of the third sound unit 330 (such as the third sound outlet 331) and the first diaphragm 3112 of the first sound unit 310 face the same direction, for example, both face upward, and the first diaphragm 3112 faces
  • the first sound outlet of the first sound unit 310 wherein, according to the relevant content above, the first sound outlet can be the sound outlet 100a (shown in FIG.
  • the third sound outlet 331 is towards the sound outlet 100a, like this, can reduce the propagation path of the sound from the third sound outlet 331 to the sound outlet 100a, that is, reduce the sound of high-frequency sound
  • the path length reduces the loss of the sound emitted by the third sound generating unit 330300 propagating to the mouthpiece 100a, thereby improving the sound quality of the high frequency sound of the speaker 300.
  • the third sounding unit 330 may be located in the rear cavity of the first sounding unit 310 .
  • one end of the third sound emitting unit 330 for example, the end having the third sound outlet 331 can be fixed on the inner surface of the first diaphragm 3112 .
  • the end of the third sounding unit 330 having the third sound outlet 331 is taken as the top of the third sounding unit 330, and the end of the third sounding unit 330 facing away from the third sound outlet 331 is taken as the third sounding unit 330 bottom end.
  • the top end of the third sounding unit 330 can be fixed on the inner surface of the first diaphragm 3112 through a steel ring 370 .
  • the inner surface of the first diaphragm 3112 refers to the surface of the first diaphragm 3112 facing the magnetic circuit system 322 . It can be understood that, when the inner surface of the first diaphragm 3112 has the first flexible circuit board 313, the top of the third sounding unit 330 can be fixed on the surface of the first flexible circuit board 313 facing away from the first diaphragm 3112 (refer to Figure 34).
  • the first diaphragm 3112 may have an avoidance hole (for example, the second escape hole 311c), and the third sound outlet 331 of the third sound unit 330 communicates with the second avoidance hole 311c, for example,
  • the third sound outlet 331 can be arranged facing the second escape hole 311c, so that the sound of the third sound generating unit 330 can be emitted to the outside of the speaker 300 through the third sound outlet 331 and the second avoidance hole 311c.
  • the magnetic circuit system 322 may have an avoidance hole (for example, a first avoidance hole 322g), and at least part of the third sounding unit 330 is located in the first avoidance hole 322g, that is to say, The third sounding unit 330 is disposed in the first sounding unit 310 to reduce the space occupied by the third sounding unit 330 in other areas of the speaker 300 , thereby reducing the height of the speaker 300 .
  • an avoidance hole for example, a first avoidance hole 322g
  • the third sounding unit 330 is disposed in the first sounding unit 310 to reduce the space occupied by the third sounding unit 330 in other areas of the speaker 300 , thereby reducing the height of the speaker 300 .
  • the first escape hole 322g may be a part of the concave cavity 3224 .
  • the concave cavity 3224 runs through the entire magnetic circuit system 322 to form a through hole in the magnetic circuit system 322, wherein the part of the concave cavity 3224 located in the support member 3223, that is, the through hole on the support member 3223 can be used to accommodate the third The first avoidance hole 322g of the sound unit 330 .
  • the radial dimension of the first avoidance hole 322 g on the support member 3223 may be larger than the radial dimension of the through holes in the magnetic member 3221 and the washer 3222 .
  • the bottom of the third sound unit 330 may be a gap between the bottom of the third sound unit 330 and the side of the magnetic member 3221 facing the first diaphragm 3112, so as to ensure that the first escape hole 322g on the support member 3223 and the concave cavity 3224 on the magnetic member 3221 ( For example, the through hole) is connected, so as to ensure that the space size of the rear cavity of the first sound unit 310 is not affected, for example, all the cavities between the first diaphragm 3112 and the inner wall of the concave cavity 3224 of the magnetic circuit system 322 can be used as the second
  • the rear cavity of a sounding unit 310 ensures the intermediate frequency sensitivity of the first sounding unit 310 .
  • FIG. 35 is a partial structural schematic diagram of FIG. 31
  • FIG. 36 is a structural schematic diagram of the first flexible circuit board in FIG. 35 .
  • the third sound unit 330 can be electrically connected to an external circuit through the first flexible circuit board 313 in the first sound unit 310, for example, the third sound unit 330 is connected to the first
  • the first body part 3131 of the flexible circuit board 313 is electrically connected, and the outer edge of the first flexible circuit board 313 may have two second extension parts, and the two second extension parts are respectively the second extension part 3133a and the second extension part 3133b , the second extension 3133a and the second extension 3133b respectively extend to the outer side wall of the frame 340, so that the external circuit can be electrically connected to the second extension 3133a and the second extension 3133b, and the third Unit 330 is powered on.
  • the third sounding unit 330 and the first sounding unit 310 share a first flexible circuit board 313, which reduces the number of components in the speaker 300, reduces the size of the speaker 300 on the one hand, and simplifies the The assembly process of the speaker 300 improves the assembly efficiency of the speaker 300 .
  • FIG. 37 is a partial sectional view of FIG. 36
  • FIG. 38 is a partial sectional view of FIG. 36
  • a1 and a2 are respectively the two wiring layers used to electrically connect the first voice coil 3111 and the two first extension parts in the first flexible circuit board 313, for example, referring to Fig. 37
  • a1 is the first wiring layer
  • a2 is the second wiring layer.
  • a3 and a4 are two wiring layers in the first flexible circuit board 313 for electrically connecting the third sounding unit 330 and the two second extension parts, for example, a3 is for electrically connecting the first flexible circuit board 313.
  • the positive pin of the third sounding unit 330 and the third wiring layer of the second extension 3133a, a4 is used for electrically connecting the negative pin of the third sounding unit 330 and the fourth wiring layer of the second extension 3133b.
  • the copper sheets exposed on the third extension part 3134a and the third extension part 3134b, such as the first pad, are shown as n1 and n2 in FIG. 38
  • the annular copper strip exposed on the first extension part 3132a and the first extension part 3132b, such as the second pad, is shown as m1 and m2 in FIG. 38 .
  • the third sound unit 330 is located on one side of the inner ring 313e of the first body portion 3131, for example, the top of the third sound unit 330 can be fixed to the inner ring 313e by bonding or the like the inner surface of the inner ring 313e, the third escape hole 313a can communicate with the third sound outlet 331, for example, the third sound outlet 331, the third escape hole 313a and the second escape hole on the first diaphragm 3112 313a is coaxially arranged along the z direction, so that the sound from the third sound outlet 331 can be transmitted to the outside of the speaker 300 , such as the earphone front chamber 101 , through the third avoidance hole 313a and the second escape hole 313a .
  • an annular hole (such as a second annular hole 313j) may be opened in the inner ring 313e, and the second annular hole 313j separates the inner ring 313e into a first part 313g and a second part 313h, Specifically, the third sound unit 330 can be fixed on the inner surface of the first part 313g.
  • both the first part 313g and the second part 313h are ring structures, the first part 313g is located inside the second part 313h, and the first connecting part 3135 is located between the second part 313h and the outer ring 313f.
  • the third sounding unit 330 may be located on one side of the first part 313g, the third escape hole 313a is located on the first part 313g, and the first voice coil 3111 is located on one side of the second part 313h.
  • the third extension portion and the first pad exposed on the third extension portion are located at the inner edge of the second portion 313h.
  • the first end of the first wiring layer a1 is exposed on the inner surface of the third extension 3134a on the inner edge of the second part 313h, and forms the first pad n1, the positive pole of the first voice coil 3111
  • the pin is welded on the first pad n1, so that the positive pin of the first voice coil 3111 is electrically connected to the first wiring layer a1, and the first wiring layer a1 can be connected via the second part 313h, one of the first The part 3135 and the outer ring 313f extend to the first extension part 3132a, and the second pad m1 is exposed on the first extension part 3132a, and the second pad m1 is welded on the first conductive pin 341a, so that The anode pin of the first voice coil 3111 is electrically connected to the first conductive pin 341a.
  • the first end of the second wiring layer a2 is exposed on the inner surface of the third extension part 3134b on the inner edge of the second part 313h, and forms the first pad n2, and the negative pin of the first voice coil 3111 is soldered to the first pad n2, so that the negative pin of the first voice coil 3111 is electrically connected to the second wiring layer a2, and the second wiring layer a2 can be extended to the On the first extension part 3132b, the second pad m2 is exposed on the first extension part 3132b, and the second pad m2 is welded on the first conductive pin 341b, so that the negative lead of the first voice coil 3111 The pin is electrically connected to the first conductive pin 341b.
  • the setting of the second annular hole j in the embodiment of the present application increases the vibration amplitude of the second part 313h, so that the first voice coil 3111 can drive the first diaphragm 3112 to freely vibrate along the z direction through the second part 313h during the movement process (As shown in FIG. 35 ), that is, the vibration amplitude of the first diaphragm 3112 is increased.
  • a plurality of connecting parts may be provided in the second annular hole 313j, and the plurality of second connecting parts 3136 are arranged at intervals along the circumference of the second annular hole 313j, One end of each second connecting portion 3136 is connected to the outer edge of the first portion 313g, and the other end of each second connecting portion 3136 is connected to the inner edge of the second portion 313h, ensuring that the first flexible circuit board 313 is a complete structure parts, so as to facilitate the assembly of the first flexible circuit board 313.
  • first part 313g is electrically connected to the third sound unit 330
  • the outer edge of the first part 313g can be connected to the second part 3136 through the second part 3136, the second part 313h and the first part 3135.
  • the extension part is electrically connected, so that the third sound unit 330 is electrically connected to the second extension part.
  • the first part 313g is electrically connected to the anode of the third sounding unit 330
  • part of the outer edge of the first part 313g can be connected to the second connecting part 3136, the second part 313h, one of the first connecting parts 3135 and the outer ring 313f.
  • the extension part 3133a is electrically connected, so that the anode of the third sound generating unit 330 is electrically connected to the second extension part 3133a.
  • the first part 313g is also electrically connected to the negative electrode of the third sounding unit 330, and part of the outer edge of the first part 313g can be connected to the first part 313g through another second connection part 3136, the second part 313h, another first connection part 3135 and the outer ring 313f.
  • the two extension parts 3133b are electrically connected, so that the negative electrode of the third sound generating unit 330 is electrically connected to the second extension part 3133b.
  • FIG. 39 is a schematic structural diagram of the third conductive insert in FIG. 35 .
  • two third conductive inserts 3403a (3403b) may be provided in the side wall of the basin frame 340, and the two third conductive inserts 3403a (3403b) are respectively third conductive Insert 3053a and third conductive insert 3053b.
  • the first ends of the two third conductive inserts 3403a (3403b) have fourth conductive pins respectively
  • the second ends of the two third conductive inserts 3403a (3403b) have fifth conductive pins
  • the two fourth conductive inserts 3403a (3403b) have fifth conductive pins.
  • the pin 345a (345b) and the two fifth conductive pins 346a (346b) are exposed on the outer surface of the side wall of the basin frame 340, and the two fourth conductive pins 345a (345b) are respectively connected to the corresponding second extension part. Electrically connected, so that the two fourth conductive pins 345a (345b) are electrically connected to the third sound unit 330 through the first flexible circuit board 313, and the two fifth conductive pins 346a (346b) are used to communicate with external circuits such as flexible circuits
  • the boards are electrically connected, so that the third sound generating unit 330 is electrically connected to an external circuit such as an audio encoder through two third conductive inserts 3403a ( 3403b ).
  • the fourth conductive pin 345a of the third conductive insert 3053a is electrically connected to the second extension part 3133a, so that the fourth conductive pin 345a is electrically connected to the positive pole of the third sound unit 330, and the fourth conductive pin 345a of the third conductive insert 3053b
  • the pin 345b is electrically connected to the second extension part 3133b, so that the fourth conductive pin 345b is electrically connected to the negative pole of the third sound unit 330, so that the positive and negative poles of the third sound unit 330 are connected to the two through the first flexible circuit board 313.
  • the fourth conductive pin 345a ( 345b ) is electrically connected.
  • the fifth conductive pin 346a of the third conductive insert 3053a is electrically connected to the positive pole of the external circuit (such as an audio encoder), and the fifth conductive pin 346b of the third conductive insert 3053b is electrically connected to the negative pole of the external circuit, so that the two second The five conductive pins 346a ( 346b ) are electrically connected to the external circuit, so that the positive and negative poles of the third sound generating unit 330 are electrically connected to the external circuit through the first flexible circuit board 313 and the two third conductive inserts 3403a ( 3403b ).
  • the audio encoder can apply the audio signal to the piezoelectric material of the third sound generating unit 330 in the form of voltage through the electrical connector and the two third conductive inserts 3403a (3403b), so that the piezoelectric material is Warping and deformation occurs under the action of the electric field, thereby driving the diaphragm of the third sounding unit 330 to vibrate, so as to push the air on both sides of the third sounding unit 330 to vibrate, thereby generating sound.
  • the third sounding unit 330 of the embodiment of the present application is electrically connected to an external circuit through the first flexible circuit board 313 and two third conductive inserts, so as to facilitate the electrical connection between the third sounding unit 330 and the external circuit.
  • the setting of the fourth conductive pin also makes the connection between the first flexible circuit board 313 and the first end of the third conductive insert more convenient and reliable
  • the setting of the fifth conductive pin also makes the connection between the external circuit and the third conductive insert more convenient and reliable.
  • the electrical connection between the second ends is more convenient and reliable, thereby improving the reliability of the electrical connection between the third sound generating unit 330 and the external circuit.
  • the third sound unit 330 is modularized.
  • the sounding unit 330 is electrically connected to the first flexible circuit board 313, and the two second extensions of the first flexible circuit board 313 are electrically connected to the two fourth conductive pins 345a (345b), thus completing the third sounding unit
  • the third sounding unit 330 can be energized only by electrically connecting the external circuit with the two fifth conductive pins, which simplifies the wiring process of the third sounding unit 330 and improves the assembly efficiency of the speaker 300 .
  • the first end of one of the third wiring layers b1 in the first flexible circuit board 313 is exposed on the surface of the first part 313g facing the third sound unit 330, so as to form the surface of the first part 313g.
  • the third pad (shown with reference to p1 in Figure 38), the positive pin of the third sounding unit 330 is welded on the third pad p1, so that the positive pin of the third sounding unit 330 is electrically connected to the third wiring layer b1 connection, the third wiring layer b1 extends to the second extension part 3133a through the first part 313g, one of the second connection parts 3136, the second part 313h, one of the first connection parts 3135 and the outer ring 313f, and the third The second end of the wiring layer b1 is exposed on the second extension part 3133a to form a fourth pad q1 on the second extension part 3133, and soldered to the fourth conductive pin 345a, so that the third sound unit The positive pin of 330 is electrically connected with the fourth conductive pin 345a.
  • the first end of the fourth wiring layer b2 is exposed on the surface of the first part 313g facing the third sounding unit 330, so as to form a third pad on the surface of the first part 313g (refer to p2 in FIG. 38 ), the third sounding unit
  • the negative pin of 330 is soldered to the third pad p2, so that the negative pin of the third sounding unit 330 is electrically connected to the fourth wiring layer b2, and the fourth wiring layer b21 is connected to the second part through the first part 313g.
  • a fourth pad q2 is formed on the second extension portion 3133b, and welded to the fourth conductive pin 345b, so that the negative pin of the third sound generating unit 330 is electrically connected to the fourth conductive pin 345b.
  • each second connecting portion 3136 has an “S”-shaped structure, that is to say, at least part of the two ends of each second connecting portion 3136 extend in a different direction from the middle portion, so as to optimize The resonance problem of wiring layers such as the third wiring layer b1 and the fourth wiring layer b2.
  • a second mounting hole 313d may be formed on each second extending portion such as the second extending portion 3133a and the second extending portion 3133a, and the fourth conductive pin passes through the second mounting hole.
  • hole 313d, and the fourth conductive pin is electrically connected to the inner wall of the second mounting hole 313d
  • the fourth conductive pin 345a is passed through the second mounting hole 313d of the second extension part 3133a
  • the fourth conductive pin The pin 345a is electrically connected to the inner wall of the second mounting hole 313d
  • the fourth conductive pin 345b is passed through the second mounting hole 313d of the second extension part 3133b
  • the fourth conductive pin 345b is connected to the second mounting hole 313d.
  • the inner wall is electrically connected.
  • the copper sheet (such as the fourth pad) exposed on the second extension part of the second end of the wiring layer can be located around the inner edge of the second mounting hole 313d, that is, the fourth pad can be an annular copper sheet,
  • the annular copper sheet is disposed around the inner edge of the second mounting hole 313d, and the outer wall of the fourth conductive pin can be welded on the annular copper sheet, so as to realize the electrical connection between the wiring layer on the second extension part and the fourth conductive pin .
  • the second end of the third wiring layer b1 is exposed on the second extension portion 3133a to form a ring-shaped fourth pad q1, and the fourth conductive pin 345a is welded on the fourth pad q1.
  • the third wiring layer b1 is electrically connected to the fourth conductive pin 345a
  • the second end of the fourth wiring layer b2 is exposed on the second extension part 3133b to form a ring-shaped fourth pad q2, and the fourth conductive pin
  • the pin 345b is welded on the fourth pad q2, so that the fourth wiring layer b2 is electrically connected to the fourth conductive pin 345b.
  • each third conductive insert may further include a third conductive member, and the fourth conductive pin and the fifth conductive pin on each third conductive insert are respectively connected to at both ends of the third conductor.
  • the fifth conductive pin 346a is electrically connected to the fourth conductive pin 345a through the third conductive member 347a
  • the fifth conductive pin 346b is electrically connected to the fourth conductive pin 345b through the third conductive member 347b.
  • the outer surface of the side wall of the pot frame 340 may have a second wiring region 340b, and the second wiring region 340b is located at two fourth conductive pins 345a (345b) such as the fourth conductive pin 345a and Between the fourth conductive pins 345b, two fifth conductive pins 346a (346b) such as the fifth conductive pins 346a and the fifth conductive pins 346b are located in the second wiring area 340b, that is, through the two third conductive pins.
  • the two fifth conductive pins 346a (346b) lead the two fourth conductive pins 345a (345b) 355 to the second wiring area 340b of the side wall of the basin frame 340, in other words, the third sound unit 330
  • the two electrode layers of the two electrode layers are led from the fourth conductive pins that are far away to the fifth conductive pins that are relatively close, so that the outside world can be directly connected to the two electrode layers with only one electrical connector such as a flexible circuit board.
  • the two fifth conductive pins 346a (346b) in the second wiring area 340b are welded to apply voltage to the two electrode layers of the third sound unit 330, which simplifies the electrical connection between the third sound unit 330 and the external circuit.
  • the connection structure facilitates the application of the loudspeaker 300 in the embodiment of the present application.
  • the second wiring area 340b and the first wiring area 340a can be located on different areas of the outer wall of the frame 340 , for example, the second wiring area 340b and the first wiring area 340a can be disposed opposite to the outer side of the frame 340 In this way, when the speaker 300 of the embodiment of the present application is electrically connected to an external circuit, two flexible circuit boards may be required. One of them is electrically connected to two second conductive pins 342a (342b) and two third conductive pins 344a (344b) on the first wiring area 340a, so that the external circuit is connected with the first sound unit 310 and the second The sound unit 320 is electrically connected. Another flexible circuit board is electrically connected to the two fifth conductive pins 346a ( 346b ) of the second wiring area 350b , so that the external circuit is electrically connected to the third sound generating unit 330 .
  • the embodiment of the present application does not exclude the example that the first wiring region 340a and the second wiring region 340b are the same wiring region, for example, when the first wiring region 340a and the second wiring region 340b are the same wiring region, the external A flexible circuit board is required to be electrically connected to the second conductive pin, the third conductive pin and the fifth conductive pin at the same time, so that the electrical connection between the external circuit and the three sounding units can be realized, thereby simplifying the speaker
  • the electrical connection process between the speaker 300 and the external circuit facilitates the use of the speaker 300 .
  • the second connection area 340b is consistent with the specific setting method of the second connection area 340b, for details, please refer to the specific content of the second connection area 350b.
  • Figure 40 is a structural schematic diagram of another speaker provided by an embodiment of the present application
  • Figure 41 is a structural schematic diagram of another viewing angle of Figure 40
  • Figure 42 is a structural schematic diagram of the second flexible circuit board in Figure 41
  • Figure 43 is a diagram 41 Cutaway view.
  • the third sound unit 330 can also be located between the first diaphragm 3112 and the second cover 360, that is, the MEMS speaker 300 can use the first sound unit 310 The space of the front cavity, so that the third sound unit 330 is assembled in the speaker 300 .
  • the third sounding unit 330 can be fixed on the second cover 360 to improve the structural stability of the third sounding unit 330 .
  • the top end of the third sound generating unit 330 may be fixed on the inner surface of the second cover 360 by means of bonding or the like.
  • the inner surface of the second cover 360 refers to the surface of the second cover 360 facing the first diaphragm 3112 .
  • the third sound outlet 331 of the third sound unit 330 can be connected to the second cover 360
  • the first sound outlet 314 is connected, for example, the third sound outlet 331 can face the first sound outlet 314, so that the sound of the third sound unit 330 and the sound of the first sound unit 310 both pass through the first sound outlet 314 out to the outside of the speaker 300 .
  • the projection area of the third sounding unit 330 on the first sounding unit 310 is located in the central area of the first sounding unit 310, for example, when the third sounding unit 330 is located in the first sounding unit 310, the third sounding unit 330 is located in the central area of the first sounding unit 310, so that the sound outlet of the third sounding unit 330 such as the third sounding port 331 is located in the central area of the first sounding unit 310, which improves the sound quality of the high-frequency sounding unit.
  • the first sound outlet 314 of the first sound unit 310 can be positioned at the central region of the first sound unit 310, and the third sound outlet 331 is facing the first sound outlet 314, so that when the center of the first sound unit 310 When the area can be located in the central area of the speaker 300 , the sound outlets of the first sounding unit 310 and the third sounding unit 330 can be located in the central area of the speaker 300 , thereby improving the sound quality of the middle frequency and high frequency of the speaker 300 .
  • the third sounding unit 330 When the third sounding unit 330 is located between the first diaphragm 3112 and the second cover 360 , the third sounding unit 330 can be electrically connected to an external circuit through the second flexible circuit board 332 .
  • a part of the second flexible circuit board 332 is located between the second cover 360 and the third sound unit 330, and the second flexible circuit board 332 is electrically connected to the third sound unit 330, and the other part of the second flexible circuit board 332 A part extends to the outer wall of the basin frame 340 to be electrically connected to an external circuit.
  • the part of the second flexible circuit board 332 extending to the outer wall of the basin frame 340 can be electrically connected to the fourth conductive pin 355, and the fourth conductive
  • the contact pin 355 is used for electrical connection with an external circuit, for example, the fourth conductive contact pin 355 can be electrically connected with the external circuit through the third conductive member 357 and the fifth conductive contact pin 356 .
  • the second flexible circuit board 332 may include a second body portion 3321 and two branch portions (a branch portion 3322 a and a branch portion 3322 b ) connected to the outer edge of the second body portion 3321 .
  • the second body part 3321 is sandwiched between the inner surface of the second cover body 360 and the top end of the third sound unit 330 (as shown in FIG. 43 ), and the second body part 3321 can be connected with the third sound unit 330 Electrically connected, the branch portion 3322a and the branch portion 3322b can be electrically connected to two fourth conductive pins 345a (345b) respectively (refer to FIG.
  • the poles are respectively led to the two fourth conductive pins 345a ( 345b ) 355 so as to facilitate the electrical connection between the third sound generating unit 330 and the external circuit.
  • the branch part 3322a is electrically connected to the fourth conductive pin 345a, so that the anode of the third sounding unit 330 is electrically connected to the fourth conductive pin 345a
  • the branch part 3322b is electrically connected to the fourth conductive pin 345b, so that the third sounding unit 330 is electrically connected
  • the negative electrode of the unit 330 is electrically connected to the fourth conductive pin 345b, so that the third sound generating unit 330 can be electrically connected to an external circuit through two third conductive inserts 3403a (3403b).
  • the second body part 3321 may have a third escape hole 313a, and the third avoidance hole 313a communicates with the third sound outlet 331 and the first sound outlet 314 respectively, so that the third sound outlet 331 emits The sound transmitted to the outside of the speaker 300 through the third avoidance hole 313a and the first sound outlet 314 in turn, and finally can be transmitted to the user's ear canal through the electronic device such as the sound outlet 100a of the earphone.
  • a third mounting hole 332a may be formed on each branch, and the fourth conductive pin is passed through the third mounting hole 332a, and the fourth conductive pin is connected with the third mounting hole.
  • the inner walls of the holes 332a are electrically connected.
  • the fourth conductive pin 345a is passed through the third mounting hole 332a of the branch portion 3322a, and is electrically connected with the inner wall of the third mounting hole 332a
  • the fourth conductive pin 345b is passed through the third mounting hole 332a of the branch portion 3322b. inside the installation hole 332a and electrically connected to the inner wall of the third installation hole 332a.
  • the branch portion 3322a By opening a third installation hole 332a on the branch part, and passing the corresponding fourth conductive pin through the third installation hole 332a, so as to facilitate the electrical connection between the branch part and the fourth conductive pin, for example,
  • the branch portion 3322a When the branch portion 3322a is welded to the fourth conductive pin 345a, it can be soldered along the annular gap between the inner wall of the third mounting hole 332a and the side wall of the fourth conductive pin 345a, so that the branch portion 3322a is connected to the fourth conductive pin 345a.
  • the soldering between the pins 345a is simpler and quicker, and the reliability of the electrical connection between the branch portion 3322a and the fourth conductive pin 345a is improved.
  • the specific setting method for the second flexible circuit board 332 to lead the positive and negative poles of the third sound unit 330 to the fourth conductive pin 355 can directly refer to the first flexible circuit board 313 in the above example to connect the third sound unit 330 to the fourth conductive pin 355.
  • the positive and negative poles of the unit 330 lead to the fourth conductive pin 355 , which will not be repeated here.
  • the third sounding unit in the embodiment of the present application may be a high-frequency sounding unit, for example, it may be the micro-electromechanical sounding unit in the above example, or it may be a sounding unit of other frequency bands, for example, it may be an intermediate frequency sounding unit. sound unit or low-frequency sound unit.
  • the assembly process of the electronic device is simplified, and the assembly efficiency of the electronic device is improved.
  • the overall bandwidth of the speaker 300 is widened, and the sound quality of the electronic device such as an earphone is improved; on the other hand, the structure of the speaker 300 is simplified, thereby simplifying the
  • the assembly process of the speaker 300 reduces the overall size of the speaker 300 and saves the space occupied by the speaker 300 in the electronic device, thereby providing a suitable space for the installation of other components in the electronic device. From another perspective, the electronic device can be miniaturization.
  • Fig. 44 is a schematic structural diagram of another loudspeaker provided by an embodiment of the present application.
  • the electronic device in this embodiment of the present application may further include a feedback microphone 400 .
  • a feedback microphone 400 may be provided in the earphone front chamber 101, and the feedback microphone 400 is also called a residual noise reference microphone (Residual Noise Reference Microphone). There is a feedforward reference microphone (Feedforward Reference Microphone) inside.
  • the feed-forward reference microphone quickly receives the noise of the external environment, and performs fitting processing on the noise through the filter in the housing 100, so that the phase of the noise is converted into a reverse phase, and the noise is transmitted through the speaker It enters the ear canal and cancels out the positive-phase noise directly received in the ear canal to achieve noise reduction. And in some examples, it is difficult for the filter to inversely fit all the noise. Therefore, when the filter does not perform inverse phase fitting processing on all the noise, the feedback microphone 400 can monitor the residual signal and feed back the residual signal to the feedforward reference microphone, so that the filter continues to perform inverse phase fitting on the residual signal. Combined processing, and then passed to the ear canal again, and so on, until the noise transmitted from the filter to the ear canal and the positive phase noise directly received in the ear canal are completely offset.
  • the residual signal refers to the remaining normal-phase noise signal after the positive-phase noise directly received in the ear canal and the reverse-phase noise emitted by the speaker are canceled out.
  • the first sounding unit 310 is set close to the mouthpiece 100 a of the earphone, and the feedback microphone 400 can be located in the first sounding unit 310 of the speaker 300 .
  • the feedback microphone 400 can be arranged in the fourth cavity 304 of the first sounding unit 310, that is to say, the feedback microphone 400 can be located in the first vibration system 311 facing away from the sounding unit (such as the second sounding unit 320 ) side.
  • the fourth cavity 304 may be the front cavity 101 of the earphone, or communicate with the front cavity 101 of the earphone.
  • the feedback microphone 400 may be fixed on the inner surface of the second cover 360 by bonding or other means, so as to improve the stability of the feedback microphone 400 in the speaker 300 .
  • the active noise reduction effect of the electronic device can be ensured;
  • the internal space of the feedback microphone 400 can avoid occupying space in other areas of electronic equipment such as earphones, thereby providing a suitable installation space for components in other areas of electronic equipment. From another perspective, it can also reduce the size of electronic equipment and realize electronic equipment. Miniaturization of equipment.
  • the feedback microphone 400 can be electrically connected to an external circuit through the second flexible circuit board 332 and the third conductive insert, for example, the feedback microphone 400 can be connected to the second flexible circuit board 332 is electrically connected to the second body part 3321, so that the feedback microphone 400 is electrically connected to the fourth conductive pin of the third conductive plug, so as to realize the electrical connection with the external circuit through the fifth conductive pin of the third conductive plug.
  • An electronic device such as a motherboard in an earphone can be electrically connected to the feedback microphone 400 through an external circuit, so as to provide power and signal control to the feedback microphone 400 .
  • the specific arrangement of the feedback microphone 400 being electrically connected to the external circuit through the second flexible circuit board 332 can directly refer to the specific content of the electrical connection between the third sounding unit 330 and the external circuit in the above example, and will not be repeated here. .
  • connection in this application can be understood as the physical contact and electrical conduction of components; it can also be understood as the connection between different components in the circuit structure through printed circuit board (printed circuit board, PCB) copper foil or wires A form of connection such as physical lines that can transmit electrical signals.
  • connection can refer to a mechanical or physical connection relationship, that is, the connection between A and B or the connection between A and B can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B. etc.), or A and B are in contact with each other and A and B are difficult to be separated.
  • connection can be detachable
  • connection can also be a non-detachable connection; it can be a direct contact connection, or an indirect connection through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements.
  • references to "one embodiment” or “some embodiments” or the like in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically stated otherwise.
  • the terms “including”, “comprising”, “having” and variations thereof mean “including but not limited to”, unless specifically stated otherwise.

Abstract

本申请实施例提供一种扬声器及电子设备，包括第一振动系统、第二振动系统和磁路系统，第一振动系统位于磁路系统的第一侧，第二振动系统位于磁路系统的第二侧，磁路系统被配置为提供第一振动系统和第二振动系统进行振动的磁源，第一振动系统与磁路系统形成为第一发声单元，第二振动系统与磁路系统形成为第二发声单元；第一侧与第二侧在厚度方向上相背的部分磁性相反，且第一发声单元和第二发声单元的工作频段不同，这样，第一振动系统和第二振动系统可在一个磁路系统的磁场作用下振动，简化了扬声器的组装工序，减小了扬声器的整体尺寸，使得本申请实施例的扬声器实现了小型化，也拓宽了扬声器的整体频宽，提升了电子设备的音质。

Description

扬声器及电子设备
本申请要求于2022年02月25日提交中国专利局、申请号为202210182229.6、申请名称为“扬声器及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及电子器件技术领域，特别涉及一种扬声器及电子设备。
背景技术
扬声器是耳机、智能眼镜等电子设备中的必备器件，用以将接收到的电信号转化为声信号。随着电子设备小型化、便携化的演进趋势，电子设备中内置的扬声器也需要进行小型化演进，同时需要在小型化的同时进一步提升扬声器性能，以满足消费者需求。
为了提升扬声器的性能，相关技术中，扬声器可包括多个发声单元，不同的发声单元通过模拟分频或者数字分频的方式各自负责相应的频段，拓宽扬声器的整体频宽，使得电子设备例如耳机的音质得以提升。例如，扬声器可包括低频单元和高频单元，低频单元负责低频段的发声，高频单元负责高频段的发声，使得扬声器的低频灵敏度和高频灵敏度均得以提升。
然而，上述扬声器的各个发声单元相互独立，使得扬声器的整体尺寸较大，组装工序复杂。
发明内容
本申请实施例提供了一种扬声器及电子设备，缩小了扬声器的占用尺寸，简化了扬声器的组装工序。
一方面，本申请实施例提供一种扬声器，包括第一振动系统、第二振动系统和磁路系统；磁路系统包括在该磁路系统的厚度方向上相背的第一侧和第二侧，第一振动系统位于磁路系统的第一侧，第二振动系统位于磁路系统的第二侧，磁路系统被配置为提供第一振动系统和第二振动系统进行振动的磁源，第一振动系统与磁路系统形成为第一发声单元，第二振动系统与磁路系统形成为第二发声单元；第一侧与第二侧在厚度方向上相背的部分磁性相反，且第一发声单元和第二发声单元的工作频段不同。
本申请实施例提供的扬声器，通过将第一发声单元的第一振动系统设置在磁路系统的第一侧，将第二发声单元的第二振动系统设置在磁路系统的第二侧，且将该磁路系统提供第一子振动系统和第二振动系统进行振动的磁源，将第一侧与第二侧在厚度方向上相背的至少部分磁路系统磁性相反，这样，第一发声单元的第一振动系统可在磁路系统的磁场作用下振动，使得第一振动系统推动两侧的空气振动，从而使得该第一发声单元产生一定频段的声音，另外，第二振动系统可在磁路系统的磁场作用下发生振动，使得第二振动系统推动两侧的空气振动，使得第二发声单元产生一定频段的声音。通过将第一发声单元和第 二发声单元的工作频段设置为不同，可拓宽扬声器的整体频宽，从而提升音质。另外，第一发声单元的第一振动系统和第二振动系统共用一个磁路系统，减少了扬声器的零部件数量，从而简化了扬声器的组装工序，减小了扬声器的整体尺寸，使得本申请实施例的扬声器实现了小型化。
在一种可行的实现方式中，磁路系统包括磁性件和支撑件，支撑件和磁性件沿磁路系统的厚度方向依次设置，第一振动系统支撑于支撑件背向磁性件的一侧，第二振动系统位于磁性件背向支撑件的一侧，磁性件上具有第一间隙，第二振动系统的至少部分插设于第一间隙内，这样，第二发声单元可为动圈单元，一方面，使得第二发声单元可负责低频段的发声，另一方面，也简化了第二发声单元的结构。另外，通过将第一振动系统的外缘支撑在支撑件上，使得第一振动系统稳定地支撑在磁路系统的一侧，另外，支撑件的设置也确保第一振动系统与磁路系统的一端之间形成稳定地腔体，使得第一振动系统与磁路系统形成第一发声单元的后腔结构更加稳定。
在一种可行的实现方式中，磁性件包括中心磁铁和边磁铁，在第一截面，边磁铁套设在中心磁铁的外周，边磁铁与中心磁铁之间形成有第一间隙，中心磁铁与边磁铁朝向第一振动系统的一端磁性相反，相应地，中心磁铁与边磁铁背向第一振动系统的一端磁性相反，这就使得中心磁铁和边磁铁共同形成磁回路，其中，该磁回路的一部分在磁性件朝向第一振动系统的一侧的可形成类似倒U形的磁场，第一振动系统可受到该倒U形磁场的作用而发生振动，磁回路的另一部分磁力线可位于第一间隙和第二间隙中，并可作用下第二振动系统上，使得第二振动系统振动，从而确保磁性件对第一振动系统和第二振动系统的驱动可靠性，保证扬声器的声学性能。
在一种可行的实现方式中，第一振动系统包括第一音圈，第一音圈位于磁路系统的磁场中，且第一音圈在磁路系统上的投影区域与第一间隙至少部分重叠。
实际中，第一振动系统的第一音圈可位于磁路系统产生的磁回路中，例如，该第一音圈可位于磁路系统一侧的倒U形磁场的顶部，使得倒U形磁场顶部的水平磁力线垂直穿过第一音圈的侧面，这样，通电后的第一音圈可在洛伦兹力的驱动下沿厚度方向运动。可以理解，倒U形磁场的顶部位置在磁性件上的投影位于第一间隙上，换句话说，对着第一间隙位置的磁场具有平行于第一磁性件的水平磁场，通过将第一音圈在磁路系统上的投影区域与第一间隙至少部分重叠，即第一音圈设置在对着第一间隙的位置，以增大第一音圈受到水平磁力线的面积，从而增大第一音圈受到的水平磁场的磁感应强度，提高第一发声单元的灵敏度。
另外，该第一间隙可以作为第一音圈的定位基准，即只需要将第一音圈设置在第一间隙的一侧，例如将第一音圈正对第一间隙，便可实现该第一音圈在垂直于厚度方向上的定位，继而通过调整第一音圈在厚度方向上的位置，便可使第一音圈处于倒U形磁场的顶部位置，一方面，使得通电后的第一音圈在倒U形磁场顶部位置的磁场作用下沿厚度方向运动，另一方面，提高了第一音圈的定位效率，从而提高了扬声器的装配效率。
在一种可行的实现方式中，磁路系统还包括位于磁性件与第二振动系统之间的华司；华司包括中心华司和边华司，在第二截面，边华司套设在中心华司的外周；中心华司的至少部分面对磁性件的中心磁铁，边华司的至少部分面对磁性件的边磁铁，且中心华司的外缘与边华司的内缘之间形成有第二间隙，第二间隙与第一间隙连通，第二振动系统的至少 部分插设于第一间隙与第二间隙内；第二截面与磁性件的厚度方向垂直。
通过在磁性件背向支撑件的一侧设置华司，以将磁性件背向第一振动系统的一侧的磁力线形成回路，并集中在磁性件的第二侧，例如第一间隙和中心华司与边华司之间的第二间隙内，确保第一间隙和第二间隙内的第二振动系统能够受到较强的磁感应强度，从而提高了第二振动系统的灵敏度，使得第二发声单元的声压级得以保证。
在一种可行的实现方式中，磁路系统朝向第一振动系统的一侧形成有凹腔，第一振动系统、磁路系统的表面及凹腔的内壁之间形成第一腔体。
其中，该第一腔体为第一发声单元的后腔，即磁路系统内凹腔的设置，增大了第一发声单元的后腔空间尺寸，减小了第一发声单元的后腔刚度，使得第一发声单元的谐振点可前移至中频范围或者低频范围，从而可提升第一发声单元的中频或者低频灵敏度，使得第一发声单元更适用于中频输出或者低频输出，可增强扬声器的中频或者低频性能，便于满足实际需求，且第一发声单元结构简单，便于制作。
在一种可行的实现方式中，第二振动系统包括第二音圈和第二振膜，第二音圈的至少部分插设于磁路系统的第一磁间隙和第二磁间隙内，第二振膜位于磁路系统背向第一振动系统的一侧，第二振膜与磁路系统之间形成第二腔体，凹腔与第二腔体之间密封设置。
实际中，第二腔体可作为第二发声单元的前腔，通过将凹腔与第二腔体之间密封设置，以保证第一发声单元的后腔与第二发声单元的前腔密封隔离，改善了第一发声单元与第二发声单元之间的串音问题。
在一种可行的实现方式中，凹腔贯穿至磁性件朝向磁路系统中华司的一侧表面，以在磁路系统中形成盲孔，这样，华司可对第一腔体与第二腔体进行密封隔离，改善第一发声单元与第二发声单元之间的串音问题，另外，通过将凹腔设置为盲孔，可借助磁路系统本身的结构对第一腔体和第二腔体进行密封隔离，也减小了扬声器的零部件数量，从而简化了扬声器的装配工序。另外，通过将凹腔的一端贯穿至磁性件朝向华司的一侧，使得第一发声单元的谐振点可前移至中频范围，可提升第一发声单元的中频灵敏度，即第一发声单元更适用于中频输出，增强了扬声器的中频性能，使得本申请实施例可负责低频和中频发声。
在一种可行的实现方式中，凹腔贯穿至磁路系统中华司朝向第二腔体的一侧，以在磁路系统中形成通孔，以简化凹腔的制作工艺，提高扬声器的制作效率。
在一种可行的实现方式中，通孔朝向第二腔体的一端盖设有阻尼网布，以分隔凹腔与第二腔体，提高第一腔体与第二腔体之间的密封性，保证第二发声单元与第一发声单元的声学性能。
在一种可行的实现方式中，第二发声单元中，至少在第二腔体内设有密封件，密封件的两端分别与磁路系统和第二振膜密封连接，第二振膜背向磁路系统的一侧形成有第三腔体，密封件内具有导通孔，导通孔的两端分别与凹腔和第三腔体连通。
实际中，该第三腔体可以作为第二发声单元的后腔，通过密封件内的导通孔将凹腔与第三腔体连通，即第二发声单元的后腔也作为第一发声单元的后腔的一部分，以扩大第一发声单元的后腔空间，使得第一发声单元的谐振频率可前移至低频范围，从而使得该第一发声单元的低频灵敏度和瞬态特性得以提升，从而提高了本申请实施例的扬声器的低频性能。另外，密封件的两端与磁路系统和第二振膜密封连接，以提高第一腔体与第二腔体之 间的密封性，改善或者避免第二发声单元与第一发声单元之间出现串音情况。另外，密封件位于第二腔体内，也确保了扬声器的尺寸不受影响。
在一种可行的实现方式中，凹腔位于磁路系统的中心区域，其中，第一音圈在磁路系统上的投影位于中心区域的外周，即凹腔开设在磁路系统中磁感应强度较弱的位置，这样，可减小凹腔的设置对磁路系统产生的磁感应强度的影响，从而保证第一音圈和第二音圈受到的磁路系统的磁感应强度，即确保第一音圈和第二音圈的力因子，使得扬声器的声压级不受影响。
在一种可行的实现方式中，凹腔内填充有吸音件，以减轻凹腔引起的驻波对第一发声单元发出的声音的干扰，提高第一发声单元的声音的干净度和清晰度。
在一种可行的实现方式中，扬声器还包括盆架和柔性电路板；盆架具有侧壁，第一发声单元、第二发声单元及磁路系统的至少部分位于盆架的侧壁围成的内腔中，盆架的侧壁内具有两个第一导电插件，每个第一导电插件的第一端具有第一导电插针，每个第一导电插件的第二端具有第二导电插针，每个第一导电插针和每个第二导电插针均裸露于盆架侧壁的外表面；第一音圈与柔性电路板沿盆架的高度方向层叠设置，且每个第二导电插针通过柔性电路板与第一音圈电连接。
通过在盆架的侧壁内部设置两个第一导电插件，并将两个第一导电插件第一端的第一导电插针裸露于盆架侧壁的外表面，并通过柔性电路板与第一音圈电连接，使得第一音圈与第一导电插针之间的电连接工序更加简单可控，另外，通过将两个第一导电插件第二端的第二导电插针裸露于盆架侧壁的外表面，以便于两个第一导电插件的第二端与外部电路电连接，这样，在盆架内装配第一发声单元时，只需将柔性电路板的两端与第一音圈和对应的第一导电插针电连接，便可将第一音圈与第一导电插件电连接，外部电路只需与导电插件第二端的第二导电插针电连接，便可对第一音圈提供电流，简化了第一发声单元的装配工序。
在一种可行的实现方式中，盆架的侧壁内还具有两个第二导电插件，两个第二导电插件的第一端位于盆架内、且与第二音圈电连接，两个第二导电插件的第二端具有第三导电插针，第三导电插针裸露于盆架侧壁的外表面，也即是说，第二音圈通过第二导电插件引出至盆架侧壁的外表面，以便于第二音圈与外部电路的电连接，例如，外部电路可通过与裸露在盆架侧壁外表面的第三导电插针电连接，便可与第二音圈实现电连接，简化了第二音圈与外部电路之间的组装工序，也使得第二音圈与外部电路之间的连接更加可靠，从而提高了第二音圈与外部电路之间的电连接可靠性。另外，通过在盆架上设置第二导电插件，使得第二发声单元模组化，例如，在装配时，只需将第二发声单元装配至盆架内后，继而将第二发声单元中第二音圈的引脚与第二导电插件的第一端电连接，便完成第二发声单元的组装，后续只需将外部电路与第二导电插件第二端的第三导电插针电连接，便可对第二发声单元中的第二音圈通电，简化了第二发声单元的装线工序，提高了扬声器的组装效率。
另外，盆架侧壁的外表面具有第一接线区域，第一接线区域位于两个第一导电插针之间，两个第二导电插针和两个第三导电插针均位于第一接线区域上，外界可只需一根电路板例如柔性电路板直接与该第一接线区域内的两个第二导电插针和两个第三导电插针焊接，便可向第一音圈和第二音圈通入电流，简化了第一音圈和第二音圈的正负引脚与外部电路之间的电连接结构，从而简化了扬声器的两个发声单元与外部电路之间的电连接工序， 从而便于本申请实施例的扬声器的整机应用。
在一种可行的实现方式中，扬声器还包括第一副磁，第一副磁位于发声单元内，第二振动系统的第二音圈位于第一副磁的第一副磁场中，且第一副磁场穿过第二音圈的磁场方向与磁路系统作用在第二音圈上的磁场方向相同，即通过该第一副磁对穿过第二音圈的磁场进行充磁，以增强第二音圈受到的磁感应强度，从而提升第二音圈的力因子，提高了第二振动系统的低频灵敏度，使得第二发声单元的低频声压级得以提升。
在一种可行的实现方式中，扬声器还包括第一罩体，第一罩体罩设在盆架设有发声单元的一端开口上，第一副磁位于第一罩体朝向第二音圈的一侧表面，以增强第一副磁在扬声器内的结构稳定性，从而确保第一副磁对第二音圈处的充磁可靠性，避免第一副磁在扬声器内发生偏移而影响对第二音圈处的充磁效果。
在一种可行的实现方式中，扬声器还包括第二副磁，第二副磁位于磁路系统朝向第一振动系统的一侧，第一振动系统的第一音圈位于第二副磁的第二副磁场中，且第二副磁场穿过第一音圈的磁场方向与磁路系统作用在第一音圈上的磁场方向相同，即通过第二副磁对穿过第一音圈的磁场进行充磁，以增强第一音圈受到的磁感应强度，从而提升第一音圈的力因子，使得第一发声单元的声学性能例如瞬态特性得以提升。
在一种可行的实现方式中，扬声器还包括第二罩体，第二罩体盖设在盆架设有第一振动系统的一端开口上，第二副磁位于第二罩体朝向第一振动系统的一侧表面，以增强第二副磁在扬声器内的结构稳定性，从而确保第二副磁对穿过第一音圈的磁场的充磁可靠性，避免第二副磁在扬声器内发生偏移而影响对穿过第二音圈的磁场的充磁效果。
在一种可行的实现方式中，扬声器还包括第三发声单元；第三发声单元与第一发声单元位于第二发声单元的同侧。第三发声单元的工作频段大于第一发声单元的工作频段大于第二发声单元的工作频段。
第三发声单元的设置拓宽了扬声器的工作频带，提高了扬声器的音频效果，使得本申请实施例的扬声器的使用场景更加广泛。另外，第一发声单元与第三发声单元位于第二发声单元的同侧，即两个频率较高的发声单元位于频率较低的第二发声单元的同侧，这样，在装配时，可将第一发声单元和第三发声单元的出音口同时靠近电子设备的出音口设置，以提高频率较高的两个发声单元的音频性能。
另一方面，本申请实施例还提供一种电子设备，包括壳体和至少一个如上的扬声器，扬声器位于壳体的内腔中。
本申请实施例通过在电子设备设置上述扬声器，一方面，拓宽扬声器的整体频宽，提高了电子设备例如耳机的音质，另一方面，简化了扬声器的结构，从而简化了扬声器的组装工序，减小了扬声器的整体尺寸，节约了扬声器在电子设备内的占用空间，从而为电子设备内其他元器件的安装提供合适的空间，换个角度讲，可使电子设备小型化。
在一种可行的实现方式中，电子设备还包括反馈麦克，反馈麦克位于扬声器的第一振动系统背向发声单元的一侧，一方面可保证电子设备的主动降噪效果，另一方面，该反馈麦克设置在第一发声单元内，利用了第一发声单元的内部空间，避免反馈麦克占用电子设备其他区域的空间，从而可为其他区域的元器件设置提供合适的安装空间，换个角度讲，也可缩小电子设备的尺寸，实现了电子设备的小型化。
在一种可行的实现方式中，电子设备为耳机，通过在耳机内设置上述扬声器，以提升 耳机的音质，也节约了扬声器在耳机内的占用空间，从而在设置时可实现耳机的小型化。
附图说明
图1是本申请一实施例提供的电子设备的结构示意图；
图2是图1的爆炸图；
图3是图1的剖面图；
图4是本申请一实施例提供的其中一种扬声器的结构示意图；
图5是图4的爆炸图；
图6是图4的剖视图；
图7是图4的剖面图；
图8是图7中磁场的分布原理图；
图9是图8对应的扬声器在电子设备内的性能仿真结果图；
图10是本申请一实施例提供的另一种扬声器的剖面图；
图11是本申请一实施例提供的再一种扬声器的剖面图；
图12是本申请一实施例提供的又一种扬声器的剖面图；
图13是本申请一实施例提供的又一种扬声器的剖面图；
图14是本申请一实施例提供的又一种扬声器的剖视图；
图15是图14对应的扬声器的剖面图；
图16是图14对应的扬声器的爆炸图；
图17是图15对应的扬声器在电子设备内的性能仿真结果图；
图18是本申请一实施例提供的又一种扬声器的剖视图；
图19是图18对应的扬声器的剖面图；
图20是图18对应的扬声器的爆炸图；
图21是本申请一实施例提供的又一种扬声器的剖面图；
图22a是本申请一实施例提供的又一种扬声器的剖面图；
图22b是本申请一实施例提供的再一种扬声器的剖面图；
图23是图4的部分爆炸图；
图24是图23中盆架的结构示意图；
图25是图24中第一导电插件和第二导电插件的结构示意图；
图26是图4的其中一种局部剖视图；
图27是图25中第一振动系统的结构示意图；
图28是图27的爆炸图；
图29是图27的另一视角的结构示意图；
图30是图4的另一种局部剖视图；
图31是本申请一实施例提供的又一种扬声器的结构示意图；
图32是图31的爆炸图；
图33是图31中第三发声单元的结构示意图；
图34是图31的剖面图；
图35是图31的部分结构示意图；
图36是图35中第一柔性电路板的结构示意图；
图37是图36的局部剖视图；
图38是图36的局部剖视图；
图39是图35中第三导电插件的结构示意图；
图40是本申请一实施例提供的又一种扬声器的结构示意图；
图41是图40的另一视角的结构示意图；
图42是图41中第二柔性电路板的结构示意图；
图43是图41的剖视图；
图44是本申请一实施例提供的又一种扬声器的结构示意图。
附图标记说明：
100-壳体；200-耳套；300-扬声器；400-反馈麦克；
110-第一壳体；120-第二壳体；101-耳机前腔；102-耳机后腔；100a-出音嘴；
301-第一腔体；302-第二腔体；303-第三腔体；304-第四腔体；310-第一发声单元；320-第二发声单元；330-第三发声单元；340-盆架；350-第一罩体；360-第二罩体；370-钢圈；
311-第一振动系统；312-第一出音口；313-第一柔性电路板；314-第二副磁；315-第一密封件；316-第二密封件；
3111-第一音圈；3112-第一振膜；3131-第一本体部；3132a、3132b-第一延伸部；3133a、3133b-第二延伸部；3134a、3134b-第三延伸部；3135-第一连接部；3136-第二连接部；313a-第三避让孔；313b-第一环形孔；313j-第二环形孔；313c-第一安装孔；313d-第二安装孔；313e-内环；313f-外环；3151-第一导通孔；3161-第二导通孔；
311a-第一球顶；311b-第一折环；311c-第二避让孔；313g-第一部分；313h-第二部分；
321-第二振动系统；322-磁路系统；323-第二出音口；324-第一副磁；
3211-第二音圈；3212-第二振膜；3221-磁性件；3222-华司；3223-支撑件；3224-凹腔；3225-第二阻尼网布；3226-吸音件；
321a-第二球顶；321b-第二折环；322a-中心磁铁；322b-边磁铁；322c-第一间隙；322d-中心华司；322e-边华司；322f-第二间隙；322g-第一避让孔；
331-第三出音口；332-第二柔性电路板；
3321-第二本体部；3322a、3322b-分支部；332a-第三安装孔；
3401a、3401b-第一导电插件；3402a、3402b-第二导电插件；3403a、3403b-第三导电插件；341a、341b-第一导电插针；342a、342b-第二导电插针；343a、343b-第一导电件；344a、344b-第三导电插针；349a、349b-第二导电件；345a、345b-第四导电插针；346a、346b-第五导电插针；347a、347b-第三导电件；
341-台阶面；340a-第一接线区域；340b-第二接线区域；351-出气口；352-第一阻尼网布。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请。
图1是本申请一实施例提供的电子设备的结构示意图，图2是图1的爆炸图，图3是 图1的剖面图。参照图1至图3所示，本申请实施例提供一种电子设备，包括壳体100和位于壳体100内腔中的扬声器300(参照图2和图3所示)。其中，扬声器300是一种将电信号转化为声信号的器件。根据扬声器300产生的声信号来评价，扬声器300具有声压级(sound pressure level，简称SPL)、频宽等常用的声学指标。
需要说明的是，本申请实施例的电子设备可以包括但不限于手机、平板电脑、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持计算机、触控电视、对讲机、上网本、POS机、个人数字助理(personal digital assistant，PDA)、可穿戴设备例如耳机、智能眼镜等、虚拟现实设备等具有声学换能器例如扬声器300的移动或固定终端。
参照图3所示，以耳机为例，耳机的壳体100一般可包括第一壳体110和第二壳体120，相对设置的第一壳体110与第二壳体120围合成耳机的内腔，扬声器300位于耳机的内腔中。在一些示例中，耳机的内腔包括耳机前腔101和耳机后腔102。示例性地，扬声器300的一侧(例如前侧)与一部分壳体壁(例如第二壳体120的部分壳体壁)形成耳机前腔101，扬声器300的另一侧(例如后侧)与另一部分壳体壁(例如第一壳体110的部分壳体壁)形成耳机后腔102，换句话说，扬声器300将耳机的内腔分隔为耳机前腔101和耳机后腔102。
其中，壳体100例如第二壳体120上具有出音嘴100a，该出音嘴100a与耳机前腔101连通。扬声器300的一侧(例如前侧)面向出音嘴100a，扬声器300的另一侧(例如后侧)背对出音嘴100a。扬声器300收到电信号后，该扬声器300内的振动系统会发生一定频率的振动，从而推动振动系统两侧例如扬声器300前侧的耳机前腔101、以及扬声器300后侧的耳机后腔102的空气振动，从而发出的声音，该声音的一部分可经扬声器300的振动系统与前侧之间的空间传出至耳机前腔101，继而经出音嘴100a传出至耳机外部，另一部分声音可从扬声器300的后侧与振动系统的空间经振动系统处的通孔传播至振动系统与前侧之间的空间，再经耳机前腔101及出音嘴100a传出至耳机外部。
在耳机佩戴于用户的耳朵上时，扬声器300发出的声音可从出音嘴100a传出，并进入至用户的耳道内。
参照图3所示，通常，在出音嘴100a上可套设有耳套200，该耳套200用于在耳机佩戴于耳朵上时，贴设在耳道的内壁上，以将耳道与外部环境隔离，从而降低外部环境的噪声。
随着电子设备例如耳机的小型化、便携化的演进趋势，电子设备内置的扬声器300也需要进行小型化演进，且需保证扬声器300的声学性能例如声压级或者频宽等，以满足用户需求。
在一些示例中，扬声器可以是单动圈扬声器，例如，扬声器可以由一个振动系统和一个磁路系统构成，其中，振动系统包括音圈和位于音圈一侧的振膜，磁路系统包括磁铁和盆架，磁铁通磁后在盆架的内腔(即磁间隙)中产生垂直于盆架侧壁的磁场，音圈插入至盆架内，且盆架内的磁场垂直于音圈的侧面。当音圈通入电流后，通电的音圈在垂直于音圈的磁场中产生洛伦兹力，该洛伦兹力驱动音圈沿平行于音圈的轴向运动，以带动振膜沿平行于音圈的轴向运动，进而带动扬声器内的空气振动，产生声音。
上述扬声器的发声频段单一，无法兼顾多个频段的发声例如低音和高音，使得装配有 该扬声器的电子设备例如耳机的音质较差。目前，在其他一些示例中，诸如一些高端耳机中的扬声器采用多发声单元设计方案，例如，扬声器可包括多个发声单元，不同的发声单元通过模拟分频或数字分频的方式实现各自负责相应的频段的功能，以拓宽扬声器的整体频宽，提高电子设备例如耳机的音质。
相关技术中，扬声器可包括低频发声单元和高频发声单元，低频发声单元负责低频段(例如8kHz以内的频段)的发声，高频发声单元可负责高频段(例如11kHz以上频段)的发声，其中，低频发声单元可以是动圈单元，高频单元可以是动圈单元或者动铁单元。
上述扬声器中，各个发声单元相互独立，并通过结构件固定在电子设备例如耳机内。其中，每个发声单元具有各自的结构，例如，每个发声单元具有各自的零部件和内部声学腔体，示例性地，扬声器包括两个动圈单元，每个动圈单元均具有振动系统和磁路系统，且每个动圈单元均具有各自的前腔和后腔，这就使得扬声器的整体空间尺寸较大，也提高了扬声器的空间需求和组装难度。
本申请实施例提供一种扬声器，通过设置独立的两个振动系统，以在振动过程中发出不同频段的声音，拓宽扬声器的发声频宽，提升了音质。另外，将其中一个发声单元的振动系统和另一个发声单元的振动系统共用一个磁路系统，即第一振动系统和第二振动系统在一个磁路系统的磁场作用下发生振动，从而发生声音，减少了扬声器的零部件数量，从而简化了扬声器的组装工序，减小了扬声器的整体尺寸，使得本申请实施例的扬声器实现了小型化。
以下结合附图对本申请实施例提供的扬声器的结构进行详细说明。
图4是本申请一实施例提供的其中一种扬声器的结构示意图，图5是图4的爆炸图，图6是图4的剖视图，图7是图4的剖面图。参照图4至图7所示，本申请实施例提供一种扬声器300，包括第一振动系统311、第二振动系统321和磁路系统322。其中，第二振动系统321位于磁路系统322的一侧，第一振动系统311位于磁路系统322的另一侧，例如，磁路系统322包括在厚度方向(参照图7中z所示的方向)上相背的第一侧和第二侧，第一振动系统311位于磁路系统322的第一侧，第二振动系统321位于磁路系统322的第二侧。
本申请实施例中，磁路系统322被配置为提供第一振动系统311和第二振动系统321进行振动的磁源，换句话说，第一振动系统311和第二振动系统321实现振动的磁源均为该磁路系统322。例如，第一振动系统311和第二振动系统321均位于磁路系统322的磁场中，第一振动系统311和第二振动系统321用于在磁路系统322产生的磁场中振动。
本申请实施例中，第一振动系统311和磁路系统322形成为第一发声单元310，第二振动系统321和磁路系统322形成为第二发声单元320。
在一些示例中，第一振动系统311可位于磁路系统322第一侧的外部，也即是说，第一振动系统311未伸入至磁路系统322的内部或者侧壁，例如，该第一振动系统311可为平面膜单元的振动系统，即第一发声单元310为平面膜单元。
图8是图7中磁场的分布原理图。参照图8所示，磁路系统322的第一侧和第二侧在z方向上相背的部分磁性相反，例如，当磁路系统322的第一侧的部分区域(以下称为第一区域)为N极，磁路系统322的第二侧中与上述部分区域向对应的另一部分区域(以下称为第二区域)为S极，这样，磁路系统322产生的磁力线可从N极发出，并经第一侧上 方、侧方环绕进入至第二侧，并进入至第二侧的S极，再从S极经磁路系统322的内部到达N极，使得磁路系统322可产生磁回路，即环形磁场，该环形磁场的一部分位于磁路系统322的第一侧上方空间，且部分磁力线可穿过第一振动系统311，使得第一振动系统311可在自身的厚度方向(例如图8中z方向)振动，从而推动第一振动系统311两侧的空气振动而发出声音。
需要说明的是，第一区域和第二区域为磁路系统322沿自身的厚度方向(参照图8中z方向所示)正相背的两个区域。
参照图7所示，在上述示例中，第一发声单元310可以为平面膜单元，例如，第一振动系统311可包括第一音圈3111和第一振膜3112，第一音圈3111位于磁路系统322的第一侧的外部(例如上方)，第一振膜3112位于第一音圈3111背向磁路系统322的一侧，例如，第一音圈3111的一侧可通过粘接等方式固定在第一振膜3112朝向磁路系统322的一侧表面。在一些实现方式中，第一振膜3112可以面向出音嘴100a，第一振膜3112可以面向耳机前腔101。
参照图7所示，第一振动系统311与磁路系统322之间具有第一腔体301，第一振动系统311背向磁路系统322的一侧具有第四腔体304。例如，第一振膜3112与磁路系统322的第一侧之间具有第一腔体301，第一振膜3112背向磁路系统322的一侧具有第四腔体304。本申请实施例将第一腔体301作为第一发声单元310的后腔，第四腔体304作为第一发声单元310的前腔。
参照图8所示，磁路系统322充磁后，会产生环形磁场，环形磁场中位于第一腔体301的部分磁场可垂直于该第一音圈3111的侧面，这样，通电后的第一音圈3111可在该磁路系统322的磁场作用下产生洛伦兹力，根据左手定则，该洛伦兹力平行于第一音圈3111的厚度方向(例如图8中z方向所示)，这样，该洛伦兹力可作为第一音圈3111的驱动力，以驱动该第一音圈3111沿厚度方向振动，从而带动第一振膜3112振动，以推动第一发声单元310中的前腔(即第四腔体304)和后腔(即第一腔体301)的空气振动，使得该第一发声单元310发出声音。其中，第一音圈3111的侧面是指第一音圈3111中平行于第一音圈3111轴线的表面。
可以理解，第一音圈3111的电流可以为交变电流，这样可使第一音圈3111受到的洛伦兹力的方向在朝向磁路系统322和背向磁路系统322的方向交替变化，使得该第一音圈3111带动第一振膜3112沿第一音圈3111的厚度方向来回运动即振动，即通电后的第一音圈3111可带动第一振膜3112往靠近或者远离磁路系统322的方向振动。其中，第一音圈3111可与磁路系统322的第一侧之间具有一定间隙(参照图7中A所示)，这样可确保第一音圈3111在朝向磁路系统322和背向磁路系统322的方向来回振动。
本申请实施例的第一音圈3111可为片状环形结构，质量较轻，可在中高频下振动，使得第一振动系统311形成的第一发声单元310(例如平面膜单元)可做中高频单元。例如，第一发声单元310可负责3kHz及高于3kHz以上频段的发声。
本申请实施例中，第四腔体304例如第一发声单元210的前腔可与耳机前腔101连通，以将第一发声单元210产生的声音经耳机前腔101及出音嘴100a传出至耳机外部，例如用户耳道内。
参照图3所示，在一些示例中，耳机前腔101可直接作为第一发声单元310的前腔(例 如第四腔体304)，例如，第四腔体304由第一振动系统311背向磁路系统322的一侧和第二壳体120的部分壳体壁围合而成。
这样，第一振动系统311的第一振膜3112在振动过程中直接推动第一腔体301和第四腔体304的空气振动，即第一振动系统311在振动过程中推动第一发声单元310的后腔和耳机前腔101中的空气振动，从而发出声音，并经出音嘴100a传出至耳机外部。可以理解，在该示例中，出音嘴100a作为第一发声单元310的出音口(例如第一出音口)，可发出第一发声单元310产生的声音，这样，可减小第一发声单元310发出的声音传播至出音嘴100a的路径，从而减小第一发声单元310的声音损耗，提高了扬声器的声压级，从而在主观上提高了扬声器的响度。
参照图6和图7所示，在第二发声单元320中，磁路系统322产生的环形磁场的部分磁场可作用在第二振动系统321上，使得第二振动系统321可在磁路系统322的作用下振动，以推动第二振动系统321两侧的空气振动，从而发出声音。
在一些示例中，第二发声单元320可以为动圈单元，其中的第二振动系统321的至少部分可插设于磁路系统322第二端的磁间隙中，磁路系统322产生的环形磁场一部分位于磁间隙中，并作用在磁间隙中的第二振动系统321上，使得第二振动系统321沿磁间隙振动，以推动第二振动系统321两侧的空气振动，从而使得第二发声单元320产生声音。
可以理解的是，磁路系统322的磁间隙可以是磁路系统322的侧壁与扬声器的固定件(例如盆架340之间的间隙)，则在该示例中，第二振动系统321的至少部分插设于磁路系统322第二端的侧壁与盆架340的内壁之间。
实际中，第二振动系统321可包括第二音圈3211和第二振膜3212，第二音圈3211的至少部分插设于磁路系统322的磁间隙中，第二振膜3212位于第二音圈3211远离第一振动系统311的一侧，例如，第二音圈3211可通过粘接等方式固定在第二振膜3212的一侧表面。其中，第二振膜3212与磁路系统322之间具有第二腔体302，第二振膜3212背向磁路系统322的一侧具有第三腔体303。本申请实施例将第二腔体302作为第二发声单元320的前腔，第三腔体303作为第二发声单元320的后腔。
参照图8所示，示例性地，磁路系统322充磁后，可产生环形磁场，环形磁场的一部分位于磁路系统322的磁间隙中，且位于磁间隙中的磁场垂直于该第二音圈3211的侧面，这样，通电后的第二音圈3211可在该磁路系统322的作用下产生洛伦兹力，根据左手定则，该洛伦兹力平行于第二音圈3211的厚度方向(参照图8中z方向所示)，洛伦兹力可作为第二音圈3211的驱动力，以驱动该第二音圈3211沿厚度方向振动，从而带动第二振膜3212振动，以推动第二发声单元320中的前腔(即第二腔体302)和后腔(即第三腔体303)的空气振动，使得该第二发声单元320发出声音。其中，第二音圈3211的侧面是指第二音圈3211平行于第二音圈3211轴线的表面。
可以理解，第二音圈3211的电流可以为交变电流，这样可使第二音圈3211受到的洛伦兹力的方向在朝向磁路系统322和背向磁路系统322的方向交替变化，使得该第二音圈3211带动第二振膜3212沿第二音圈3211的厚度方向来回运动即振动，即通电后的第二音圈3211可带动第二振膜3212往靠近或者远离磁路系统322的方向振动。
在一些示例中，第二发声单元320的第二音圈3211需插入至磁路系统322的磁间隙内，该第二音圈3211一般为圆筒型，质量较重，可在低频下振动，则第二发声单元320通常做 低频单元。例如，第二发声单元320可负责3kHz以内频段的发声，例如20-2kHz。
本申请实施例中，第一发声单元310和第二发声单元320的工作频段不同。应当说明的是，工作频段为频率范围，则可以理解，第一发声单元310和第二发声单元320的工作频段不同可以是：第一发声单元310和第二发声单元320的工作频段完全不重叠，例如，如上文所述，第一发声单元310的工作频段可为大于等于3kHz，第二发声单元320的工作频段可为20-2kHz。
在一些示例中，第一发声单元310和第二发声单元320的工作频段不同可以是第一发声单元310和第二发声单元320的工作频段的部分频段重叠，例如，第一发声单元310的工作频段可为1kHz-8kHz，第二发声单元320的工作频段可为20-2kHz，则第一发声单元310和第二发声单元320的工作频段中，1kHz-2kHz的工作频段重叠。
通过第一振动系统311和第二振动系统321的工作频段设置为不同，例如，在上述示例中，第一发声单元310负责中频或者高频发声，第二发声单元320负责低频发声，以拓宽扬声器300的整体频宽，从而提高了电子设备例如耳机的音质。
另外，第一发声单元310的第一振动系统311和第二发声单元320的第二振动系统321共用一个磁路系统322，即该磁路系统322作为第一振动系统311和第二振动系统321进行振动的磁源，一方面，使得第一发声单元310和第二发声单元320产生相应频段的声音，另一方面，也减小了扬声器300的零部件数量，从而简化了扬声器300的组装工序，减小了扬声器300的整体尺寸，使得本申请实施例的扬声器300实现了小型化。
另外，第一振动系统311和第二振动系统321均靠近磁路系统322设置，确保了第一振动系统311和第二振动系统321分别受到的磁感应强度不会受到影响，保证了第一振动系统311和第二振动系统321的力因子，从而保证了第一振动系统311和第二振动系统321的振幅不会受到限制，确保了扬声器300中第二发声单元320和第一发声单元310的灵敏度，使得扬声器300的声压级得以提升。
其中，力因子是扬声器的设计参数之一。该力因子为磁感应强度B和音圈有效线长L之间的乘积，因此，该力因子可用BL指代。另外，根据F＝BL*i可知，力因子BL等于音圈上电流i与音圈受到的驱动力F(即洛伦兹力)之间的比值，即BL越大，相同电流下音圈受到的驱动力越强。
本申请实施例的扬声器300的工艺制程简单，例如第一振动系统311和第二振动系统321与磁路系统322之间的装配精度低，公差低，从而确保了扬声器300的产品良率。
可以理解的是，在其他示例中，第一发声单元310还可以为动圈单元，例如，第一振动系统311的至少部分可插设于磁路系统322第一端的磁间隙中。本申请实施例具体不对第一发声单元310和第二发声单元320的具体结构进行限制，只要保证两个发声单元可发出不同频段的声音即可。
本申请实施例具体是以第一发声单元310为平面膜单元为例进行说明。
参照图4和图5所示，本申请实施例中，扬声器300还可以包括盆架340和第一罩体350。其中，盆架340为上下具有开口的筒状结构，该盆架340具有侧壁342B，第一发声单元310、第二发声单元320及磁路系统322的至少部分均收纳在该盆架340的侧壁B围合成的内腔中，例如，参照图6和图7所示，第一振动系统311、第二振动系统321及磁路系统322均位于该盆架340的侧壁B围合成的内腔中。在一些示例中，第一振动系统311、第二振动系统321及 磁路系统322可通过粘接等方式固定在盆架340的内壁。
当然，在一些示例中，第一振动系统311中的第一振膜3112可位于盆架340第一端的外部，第一音圈3111、磁路系统322和第二振动系统321可均位于盆架340的侧壁B围合成的内腔中，本申请实施例具体不对第一发声单元310、第二发声单元320及磁路系统322中位于盆架340内部或者外部的部件进行限制，只要能够确保第一发声单元310、第二发声单元320及磁路系统322的部件能够稳定地装配在盆架340上即可。
参照图5和图6所示，例如，第二振膜3212的外缘可通过钢圈370固定在盆架340的第一端上。在一些示例中，第二振膜3212的外缘固定在盆架340的第一端内壁上。
第一振膜3112的外缘可通过钢圈370固定在盆架340的第二端上。在一些示例中，第一振膜3112可包括第一球顶311a和第一折环311b，第一折环311b呈环形结构，第一球顶311a位于第一折环311b的内缘，例如第一球顶311a的外缘可通过粘接等方式固定在第一折环311b的内缘表面，第一折环311b的外缘固定在盆架340的第二端例如第二端的端面上。
其中，第一振膜3112与第二振膜3212的组成材料包括但不限于硅胶、橡胶、液晶高分子聚合物(Liquid Crystal Polyester，简称为LCP)及聚酰亚胺(Polyimide，简称PI)中的一种或者几种，具体可根据实际需要进行选择。
参照图6所示，磁路系统322和磁路系统322的外周侧壁可固定在盆架340的内壁上。例如，磁路系统322和磁路系统322的侧壁可通过粘接等方式固定在盆架340的内壁上。
需要说明的是，盆架340的第一端和第二端分别是指盆架340沿轴线方向相对的两端。参照图6所示，其中，第一罩体350罩设在盆架340的第一端开口上，例如，可在盆架340的第一端侧壁上开设卡槽，第一罩体350的外缘上可设置有卡扣，通过将卡扣卡设于卡槽内，使得第一罩体350卡设在盆架340的第一端。或者，第一罩体350与盆架340的第一端之间可通过在胶槽内点胶的方式粘接在一起。例如，在一些示例中，可以在盆架340的第一端侧壁上开设胶槽，在胶槽内填充有胶层，第一罩体350的外缘可通过胶层粘接在盆架340第一端的胶槽内，从而使得第一罩体350稳定地卡设在盆架340的第一端。
参照图6所示，实际中，第二振膜3212可包括第二球顶321a和第二折环321b，第二折环321b呈环形结构，第二球顶321a位于第二折环321b的内缘，例如第二球顶321a的外缘可通过粘接等方式固定在第二折环321b的内缘表面，在一些示例中，第二折环321b外缘的至少部分可通过粘接等方式固定在第一罩体350的部分内表面，以提高该第二折环321b在扬声器300内腔中的稳固性。
参照图6和图7所示，第二振膜3212朝向第一罩体350的一侧与第一罩体350之间可形成第三腔体303即第二发声单元320的后腔。参照图3和图6所示，在一些示例中，第三腔体303可与耳机后腔102连通，这样，可将耳机后腔102和第三腔体303共用作为第二发声单元320的后腔，第二振膜3212在振动过程中可推动第二腔体302、第三腔体303及耳机后腔102的空气振动，以发出声音。例如，可在第一罩体350上开设出气口351，以连通第三腔体303和耳机后腔102。另外，可在出气口351上盖设第一阻尼网布352，以提高第三腔体303和耳机后腔102的顺性，从而提高耳机的音质。
其中，参照图4所示，盆架340的侧壁上可开设有第二出音口323，该第二出音口323可将第二腔体302与扬声器300的外部连通，例如，参照图3所示，第二腔体302通过第二出音口323与耳机前腔101连通，也即是说，该第二腔体302可通过耳机前腔101与扬声器300的 外部连通，这样，第二发声单元320发出的声音可经第二出音口323、耳机前腔101及出音嘴100a传出至扬声器300的外部，例如用户的耳道内。
参照图4所示，示例性地，盆架340的侧壁上可具有台阶面341，该台阶面341朝向出音嘴100a，第二出音口323开设在该台阶面341上，这样，可使得第二出音口323朝向出音嘴100a，即第二出音口323与出音嘴100a沿声音的传播方向(参照图3中a方向所示)相对设置，以减小声音从第二出音口323传至出音嘴100a的传播路径，从而减小第二发声单元320发出的声音传至出音嘴100a的损耗，提高电子设备的低频段的音质。
可以理解，中高频的声音的波长较低频声音的波长短，为了确保中高频发声单元发出的声音到达出音嘴100a时的声压级能够满足要求，本申请实施例中，当第二发声单元320负责中频或者高频发声时，相较于第二发声单元320，第一发声单元310可靠近耳机的出音嘴100a设置，以提高耳机的中频或者高频音质例如声压级。
本申请实施例中，盆架340和第一罩体350的组成材料可以包括但不限于碳钢、铝合金等刚度较大的材料，以对发声单元例如第一发声单元310和第二发声单元320起到很好的保护作用，避免扬声器300因磕碰等外力作用而发生变形。
图9是图8对应的扬声器在电子设备内的性能仿真结果图。参照图9所示，曲线a为第二发声单元320的性能曲线，曲线b为第一发声单元310的性能曲线，虚线c为1kHz以内灵敏度为-10dB的标准线。
从图9中可看出，第二发声单元320的高频截止频率为11kHz，换句话说，本申请实施例的扬声器300中第二发声单元320的工作频率为11kHz以内。第一发声单元310的高频截止频率为14kHz，即相比于动圈扬声器，本申请实施例的扬声器300在第二发声单元320的一侧设置了第一振动系统311，以形成第一发声单元310，使得扬声器300的频带得以拓展，例如，扬声器300的频率在11kHz-14kHz之间的高频下，扬声器300的灵敏度均高于标准值，且相比于单动圈扬声器，灵敏度得以提升，即高频瞬态特性例如声压级得以提升。
参照图9所示，第一发声单元310的低频截止频率为8kHz，换句话说，扬声器300的第一发声单元310的工作频段可在8kHz-14kHz之间。第二发声单元320的低频截止频率为20Hz左右，例如，扬声器300的工作频率在20Hz-11kHz之间，其灵敏度均大于标准值，即相比于单平面膜扬声，低频瞬态特性例如声压级得以提升。则本申请实施例的扬声器300中，第二发声单元320可负责频率为20Hz-11kHz之间的低频发声，第一发声单元310可负责频率为11kHz-14kHz之间的高频发声。可以理解，图5至图8对应的结构中，第一发声单元310负责高频发声。
参照图6所示，本申请实施例的磁路系统322可包括磁性件3221，第一振动系统311位于磁性件3221的第一端，例如，第一振动系统311可位于磁性件3221第一端的外侧例如上方，磁性件3221上具有第一间隙322c，第二振动系统321位于磁性件3221的第二端，且至少部分插设于第一间隙322c内。实际中，该磁性件3221可以是磁铁。
需要说明的是，磁性件3221的第一端和第二端分别是指磁性件3221在磁性件3221的厚度方向(参照图7中z所示的方向)上相背的两端。其中，磁性件3221的厚度方向可以理解为扬声器300的厚度方向。
参照5和图7所示，在一些示例中，磁性件3221可以包括中心磁铁322a和边磁铁322b，在第一截面上，边磁铁322b套设在中心磁铁322a的外周。其中，第一截面是指磁性件3221 上垂直于厚度方向(参照图7中z所示的方向)的截面。
其中，边磁铁322b的内缘与中心磁铁322a的外缘之间具有第一间隙322c，也即是说，中心磁铁322a与边磁铁322b间隔设置，避免中心磁铁322a与边磁铁322b通磁。
在一些示例中，中心磁铁322a与边磁铁322b朝向第一振动系统311的一端磁性相反，例如，中心磁铁322a与边磁铁322b朝向第一音圈3111的一端磁性相反，即中心磁铁322a的第一端和边磁铁322b的第一端的磁性相反，相应地，中心磁铁322a与边磁铁322b背向第一振动系统311的一端磁性相反，例如，中心磁铁322a的第二端和边磁铁322b的第二端的磁性相反，这样，中心磁铁322a和边磁铁322b之间会形成类似U形的磁场。
例如，参照图8所示，中心磁铁322a的第一端(即第一侧的一端)为N极，边磁铁322b的第一端(即第一侧的一端)为S极，这样，中心磁铁322a的第一端会发出磁力线，并经中心磁铁322a朝向第一音圈3111的上方空间到达边磁铁322b的第一端，并进入至边磁铁322b内，使得磁路系统322朝向第一音圈3111的一侧上方形成类似U形的磁场，第一音圈3111可位于U形磁场的顶部，一方面，使得通电后的第一音圈3111可在洛伦兹力的作用下沿厚度方向运动，另一方面，也简化了磁路系统322的结构，提高了扬声器300的制作效率。
相应地，中心磁铁322a的第二端(即第二侧的一端)为S极，边磁铁322b的第二端(即第二侧的一端)为N极，这样，边磁铁322b的第二端发出的磁力线的至少部分可经第一间隙322c进入至中心磁铁322a的第二端，使得位于第一间隙322c内的第二音圈3211可受到垂直于该第二音圈3211侧壁的磁力线，从而使得通电后的第二音圈3211可在该部分磁力线的磁场作用下产生平行于第二音圈3211厚度方向的洛伦兹力，保证第二音圈3211在洛伦兹力的驱动下沿第二音圈3211的厚度方向(参照图8中z方向所示)运动。
可以理解，在上述示例中，中心磁铁322a的第一端(即第一侧的一端)、边磁铁322b的第一端(即第一侧的一端)、边磁铁322b的第二端(即第二侧的一端)及中心磁铁322a的第二端(即第二侧的一端)共同产生环形磁力线(即磁回路)。
需要说明的是，上述磁性方向仅为其中一种示例，在另外一些示例中，中心磁铁322a的第一端(即第一侧的一端)可为S极，边磁铁322b的第一端(即第一侧的一端)为N极，相应地，中心磁铁322a的第二端(即第二侧的一端)为N极，边磁铁322b的第二端(即第二侧的一端)为S极，使得边磁铁322b的第一端可发出磁力线，并经边磁铁322b和中心磁铁322a的上方进入至中心磁铁322a的第一端，再经中心磁铁322a的内部到达中心磁铁322a的第二端，继而从中心磁铁322a的第二端发出，并经第一间隙322c到达边磁铁322b的第二端，再从边磁铁322b的内部到达边磁铁322b的第一端，从而形成环形磁力线(即磁回路)，本申请实施例具体不对中心磁铁322a和边磁铁322b的磁性方向进行限制。
参照图8所示，示例性地，在z方向上，磁路系统322的第一侧位于第二侧的上方时，第一振动系统311位于磁路系统322的上方，中心磁铁322a与边磁铁322b一侧形成“倒U形”的磁场，即U形磁场的开口朝下，顶部位置朝上。当磁路系统322的第一侧位于第二侧的下方时，第一振动系统311位于磁路系统322的下方，则中心磁铁322a与边磁铁322b一侧形成“正U形”的磁路，即U形磁场的开口朝上，顶部位置朝下。
具体设置时，中心磁铁322a可以是一个整片磁铁(参照图5所示)，也可以由多片磁铁拼接而成。另外，中心磁铁322a可以为圆形磁铁(参照图5所示)、方形磁铁或者其他形状的磁铁，例如，该中心磁铁322a还可以是其他不规则形状的磁铁，本申请实施例不对中心 磁铁322a的形状进行限制，具体可根据实际需要进行选择。
另外，边磁铁322b可以是一个套设在中心磁铁322a外周的环形磁铁(参照图5所示)，也可以使由绕中心磁铁322a的多个条形磁铁拼接形成的环形磁铁。其中，每个条形磁铁可以是弧形磁铁，也可以是矩形磁铁，本申请实施例具体不对条形磁铁的形状进行限制。另外，边磁铁322b可以为圆环磁铁(参照图5所示)、方环磁铁或者其他形状的边磁铁，本申请实施例对边磁铁322b的形状不做限制，具体可根据实际需要进行选择。
参照图5、图7和图8所示，磁路系统322还可以包括华司3222，华司3222位于磁性件3221的第二端，即华司3222位于磁性件3221背向第一振动系统311的一端。其中，参照图8所示，华司3222具有与第一间隙322c连通的第二间隙322f，第二振动系统321的至少部分插设于第一间隙322c与第二间隙322f内。
通过在磁性件3221背向第一振动系统311的一侧设置华司3222，以将磁路系统322的第二端的磁力线集中在磁路系统322的第二端，并在磁路系统322的第二端形成回路，确保磁路系统322的磁间隙例如第一间隙322c和第二间隙322f内的第二音圈3211受到较强的磁感应强度，保证第二发声单元320的声压级。另外，华司3222的设置简化了磁路系统322的结构，提高了扬声器300的制作效率。其中，华司3222可以是紧固件，在一些实施例中，华司3222可以是垫片，例如弹簧垫片、金属垫片等。
参照图5和图7所示，在一些示例中，华司3222可包括中心华司322d和边华司322e，其中，在第二截面上，边华司322e套设在中心华司322d的外周。需要说明的是，第二截面与磁性件3221的厚度方向(参照图7中z方向所示)垂直，即该第二截面平行于第一截面，也即是说，第二截面垂直于z方向。
在一些示例中，中心华司322d的至少部分面对中心磁铁322a，边华司322e的至少部分面对边磁铁322b。例如，中心磁铁322a正对中心磁铁322a的第二端表面，边华司322e正对边磁铁322b的第二端表面，且中心华司322d的外缘与边华司322e的内缘之间具有第二间隙322f。
通过在中心磁铁322a的一端设置中心华司322d，在边磁铁322b的一端设置边华司322e，使得中心华司322d与边华司322e之间的第二间隙322f内产生垂直于中心华司322d或者边华司322e侧面的磁场，当第二音圈3211的至少部分插入至该第二间隙322f和第一间隙322c内，磁性件3221形成的环形磁场中，位于第一间隙322c和第二间隙322f内的部分磁场均垂直于第二音圈3211的侧壁，从而增大了第二音圈3211受到的磁感应强度，从而增大了扬声器300的低频声压级。
经仿真得出，在一些示例中，华司3222上靠近第二间隙322f的部分磁感应强度最大可达到1.7T，从而使得位于第二间隙322f内的第二音圈3211受到较强的磁感应强度。
其中，该华司3222的组成材料包括但不限于铁、低碳钢或铁铝等导磁材料，具体可根据实际需要进行选择。另外，华司3222可通过粘接或者磁性吸附在磁路系统322背向磁路系统322的一侧表面，实际中，华司3222的边华司322e可与盆架340一体注塑成型，以简化华司3222与盆架340之间的装配工序。本申请实施例不对华司3222与磁路系统322之间的连接方式进行限制。
参照图7所示，第一音圈3111在磁路系统322上的投影区域与第一间隙322c至少部分重叠，也即是说，第一音圈3111与第一间隙322c在第一音圈3111的厚度方向(例如图7中z所 示的方向)上的投影重叠，例如，第一音圈3111可以正对第一间隙322c，即第一音圈3111的内缘与外缘之间的中心位置沿第一音圈3111的厚度方向正对第一间隙322c。
可以理解，上述U形磁场的顶部位置在磁路系统322上的投影位于第一间隙322c上，换句话说，对着第一间隙322c位置的磁路具有平行于磁路系统322的水平磁路，通过将第一音圈3111与第一间隙322c在第一音圈3111的厚度方向重叠，即第一音圈3111设置在对着第一间隙322c的位置，以增大第一音圈3111受到水平磁路的面积，从而增大第一音圈3111受到的水平磁路的磁感应强度，提高第一发声单元310的声压级。
另外，该第一间隙322c可以作为第一音圈3111的定位基准，即只需要将第一音圈3111设置在第一间隙322c的一侧，例如将第一音圈3111正对第一间隙322c，便可实现该第一音圈3111在垂直于厚度方向上的定位，继而通过调整第一音圈3111在厚度方向上的位置，便可使第一音圈3111处于U形环路的顶部位置，一方面，使得通电后的第一音圈3111在U形环路顶部位置的磁场作用下沿厚度方向运动，另一方面，提高了第一音圈3111的定位效率，从而提高了扬声器300的装配效率。
在其他示例中，磁路系统322的磁性件3221可以为块状磁铁(图中未示出)。例如，该磁性件3221的第一端为N极，该磁性件3221的第二端为S极，磁性件3221可形成多个磁回路即环形磁场。
每个磁回路的磁力线可从磁性件3221的N极发出，环绕磁性件3221朝向第一音圈3111的一侧和磁性件3221的其中一个侧面例如左侧，进入至磁性件3221的S极，继而经磁性件3221的内部到达磁性件3221的N极。
可以理解的是，在该示例中，磁性件3221的磁间隙为磁性件3221的侧壁与盆架340之间的间隙，第二振动系统321的第二音圈2311的至少部分插设在磁性件3221的侧外周。
磁回路中，位于磁路系统322的磁性件3221朝向第一音圈3111一侧的部分磁力线可垂直穿过第一音圈3111的侧面，使得通电后的第一音圈3111产生平行于第一音圈3111厚度方向的洛伦兹力，从而驱动第一音圈3111沿厚度方向来回振动。
另外，磁回路中，位于磁路系统322的侧面的部分磁力线可垂直穿过第二音圈3211的侧面，使得通电后的第二音圈3211产生平行于第二音圈3211厚度方向的洛伦兹力，从而驱动第二音圈3211沿厚度方向来回振动。
参照图5和图6所示，磁路系统322还可以包括支撑件3223，支撑件3223位于磁性件3221朝向第一振动系统311的一端，也即是说，支撑件3223、磁性件3221及华司3222沿磁路系统322的厚度方向(参照图6中z所示的方向)依次设置，第一振动系统311支撑于支撑件3223背向磁性件3221的一侧，第二振动系统321位于华司3222背向磁性件3221的一侧。
例如，支撑件3223可通过粘接等方式固定在磁性件3221的第一端表面，或支撑件3223的外缘可通过粘接等方式固定在盆架340的内壁上，使得支撑件3223稳定地装配于磁性件3221的第一端。
需要说明的是，本申请实施例的支撑件3223为非导磁材料或者弱导磁材料，以改善或者避免从磁性件3221的第一侧发出的磁力线或者到达磁性件3221的第一侧附近的磁力线沿着支撑件3223的表面传播，从而确保磁性件3221形成的环形磁路的磁通密度，保证磁性件3221形成环形磁路的磁场强度。例如，支撑件3223可以由铜、铜合金、铝、铝合金等一种或者多种不含铁钴镍三种金属的材料制成。
参照图6所示，第一振动系统311的外缘设置于支撑件3223上，使得第一振动系统311稳定地支撑在磁路系统322的一侧，例如，第一振动系统311中，第一振膜3112的外缘可通过钢圈370固定在支撑件3223上。另外，支撑件3223的设置也确保第一振动系统311与磁路系统322的一端之间形成稳定地腔体(例如第一腔体301)，使得第一发声单元310的后腔结构更加稳定。
可以理解，第一音圈3111与支撑件3223之间具有间隙A，以确保第一音圈3111在z方向上自由振动。
图10是本申请一实施例提供的另一种扬声器的剖面图，图11是本申请一实施例提供的再一种扬声器的剖面图，图12是本申请一实施例提供的又一种扬声器的剖面图。参照图10至图12所示，在一些示例中，本申请实施例的扬声器300还可以包括第一副磁324，第二音圈3211位于第一副磁324产生的磁场(例如第一副磁场)中，且第一副磁场穿过第二音圈3211的磁力线方向与磁路系统322作用在第二音圈3211的磁场方向相同，也即是说，第一副磁场穿过第二音圈3211的磁力线方向与磁回路穿过第二音圈3211的磁力线方向相同，即通过该第一副磁324对第二发声单元320的磁场进行充磁，即该第一副磁324对穿过第二音圈3211的磁场进行充磁，以增强第二音圈3211受到的磁感应强度，从而提升第二音圈3211的力因子，使得第二发声单元320的低频声压级得以提升。
参照图10至图12所示，第一副磁324在具体安装时，可设置在第二发声单元320内。参照图10和图11所示，作为其中一种设置方式，第一副磁324在第二音圈3211的厚度方向(例如图11中z所示的方向)上的投影可位于第二音圈3211的内腔，这样，该第一副磁324可对穿过第二音圈3211在周向上的各个位置的磁场进行均匀充磁，以提高第二音圈3211的力因子。
另外，通过将第一副磁324设置在第二音圈3211的内腔区域，以保证第二发声单元320的对称性，使得第二发声单元320的音质不会受到影响。
参照图10所示，例如，第一副磁324可以为磁片，该磁片可设置第二腔体302内，且与磁路系统322的中心磁铁322a相对设置。例如，该第一副磁324位于中心磁铁322a的正下方。
可以理解，本申请实施例中，第一副磁324的充磁方向与第二音圈3211受到的磁场方向有关，也即是说，第一副磁324的充磁方向与磁路系统322的充磁方向有关。
参照图8和图10所示，以中心磁铁322a的第一端为N极，该中心磁铁322a的第二端为S极，边磁铁322b的第一端为S极，该边磁铁322b的第二端为N极为例，磁路系统322产生的磁回路从第二音圈3211的外侧面垂直于穿入至第二音圈3211的内侧面。
则在该图10对应的示例中，第一副磁324朝向磁路系统322的一端可为S极，相应地，第一副磁324背向磁路系统322的一端N极，这样，第一副磁324产生的磁力线从S极发出，经第一副磁324的外部进入至第一副磁324的N极，使得第一副磁324的部分磁场从第二音圈3211的外侧面垂直穿入至第二音圈3211的内侧面，从而增强第二音圈3211受到的磁感应强度，使得第二振膜3212的振幅得以提升，提高第二发声单元320的声压级。
参照图10所示，在该示例中，该第一副磁324可通过粘接等方式固定在磁路系统322朝向第二腔体302的一端，例如，该第一副磁324可粘接在中心华司322d上，以提高该第一副磁324在扬声器300内部的稳固性。
参照图11所示，在另外一些示例中，第一副磁324还可以设置在第三腔体303内，示例 性地，第一副磁324可位于第一罩体350朝向第二音圈3211的一侧表面(以下简称第一罩体350的内表面)，例如，第一副磁324可通过粘接等方式固定在第一罩体350的内表面，以增强第一副磁324在扬声器300内的结构稳定性，从而确保第一副磁324对第二音圈3211处的充磁可靠性，避免第一副磁324在扬声器300内发生偏移而影响对第二音圈3211处的充磁效果。
参照图12所示，作为另外一种设置方式，第一副磁324在第二音圈3211的厚度方向(例如图13中z所示的方向)上的投影与第二音圈3211的至少部分重叠，例如，第一副磁324可为环形结构，并可正对第二音圈3211设置，以对穿过第二音圈3211的磁场进行充磁，提高第二音圈3211的力因子，也保证了第二发声单元320的对称性，使得第二发声单元320的音质不会受到影响。
参照图12所示，其中，呈环形结构的第一副磁324可以是一整块边磁铁，也可以是由多个条形磁铁拼接形成的边磁铁。可以理解的是，每个条形磁铁可以为弧形磁铁，也可以为矩形磁铁，本申请实施例不对条形磁铁的形状进行限制，可根据实际需要进行选择。
参照图12所示，示例性地，第一副磁324可位于第二音圈3211的正下方。例如，该第一副磁324可通过粘接等方式固定在第一罩体350的内表面。
继续以磁回路的部分磁力线从第二音圈3211的外侧面垂直穿入至第二音圈3211的内侧面为例，在图13对应的示例中，呈环形结构的第一副磁324的内缘可以为S极，相应地，该第一副磁324的外缘为N极，则第一副磁324的部分磁力线从N极发出，并经第一副磁324的外部进入至第一副磁324的S极。
可以理解，该第一副磁324位于外部的部分磁场从第二音圈3211的外侧面垂直穿入至第二音圈3211的内侧面，从而增强了第二音圈3211受到的磁感应强度，使得第二振膜3212的振幅得以提升，提高第二发声单元320的声压级。
图13是本申请一实施例提供的又一种扬声器的剖面图。参照图13所示，在一种可行的实现方式中，扬声器300还可以包括第二副磁314，第一音圈3111位于第二副磁314的磁场(例如第二副磁场)中，且第二副磁场穿过第一音圈3111的磁场方向与磁路系统322作用在第一音圈3111的磁场方向相同，也即是说，第二副磁场穿过第一音圈3111的磁场方向与磁回路穿过第一音圈3111的磁场方向相同，即通过第二副磁314对穿过第一音圈3111的磁场进行充磁，以增强第一音圈3111受到的磁感应强度，从而提升第一音圈3111的力因子，使得第一发声单元310的高频声压级得以提升。
参照图13所示，第二副磁314在具体安装时，可位于磁路系统322朝向第一振动系统311的一侧，例如，该第二副磁314可位于第一发声单元310内。作为其中一种设置方式，第二副磁314在第一音圈3111的厚度方向(例如图13中z所示的方向)上的投影可与第一音圈3111的至少部分重叠，例如，参照图13所示，第二副磁314可为环形结构，并可正对第一音圈3111设置，例如，该第二副磁314位于第一音圈3111的正上方，以对穿过第一音圈3111的磁场进行充磁，提高第一音圈3111的力因子，也保证了第一发声单元310的对称性，使得第一发声单元310的音质不会受到影响。
可以理解的是，本申请实施例中，第二副磁314的充磁方向与第一音圈3111受到的磁场方向有关。例如，当磁路系统322产生的磁回路从第一音圈3111的内侧面垂直于穿入至第二音圈3211的外侧面时，对应图13的示例中，呈环形结构的第二副磁314的内缘可以 为N极，相应地，该第二副磁314的外缘为S极，则第二副磁314的部分磁力线从N极发出，并经第二副磁314的外部进入至第二副磁314的S极，则该第二副磁314位于外部的部分磁场从第一音圈3111的内侧面垂直穿入至第一音圈3111的外侧面，从而增强了第一音圈3111受到的磁感应强度，使得第一振膜3112的振幅得以提升，提高第一发声单元310的声压级。
参照图13所示，扬声器300还可以包括第二罩体360，第二罩体360盖设在盆架340设有第一发声单元310的一端开口上，即该第二罩体360罩设在盆架340的第二端开口上，例如，第二罩体360可通过粘接或者螺钉连接的方法固定在盆架340的第二端端面。可以理解，第一振膜3112的外缘可固定在盆架340的第二端端面上，第二罩体360的外缘可直接固定例如粘接在第一振膜3112的外缘。
本申请实施例的第一罩体350、盆架340及第二罩体360共同围合成扬声器300的内腔，使得第一发声单元310和第二发声单元320等发声单元收纳在该扬声器300的内腔中。
第一振膜3112朝向第二罩体360的一侧与该第二罩体360之间可形成第四腔体304例如第一发声单元310的前腔。在一些示例中，可在第二罩体360上开设第一出音口312，该第一出音口312将第一发声单元310的前腔与扬声器300的外部连通，这样，第一发声单元310可经该第一出音口312将高频声音传出至扬声器300的外部。
在一些示例中，高频声音的波长较短，因此，相较于第二出音口323，第一出音口312更靠近电子设备例如耳机的出音嘴100a设置，以保证用户接收到的高频声音的声压级。
需要说明的是，在一些示例中，第二罩体360可以直接作为电子设备例如耳机的部分壳体100，第二罩体360上的第一出音口312可直接作为电子设备例如耳机的出音嘴100a。
参照图13所示，本申请实施例中，第二副磁314可位于第二罩体360朝向磁路系统322的一侧表面(以下简称第二罩体360的内表面)，例如，第二副磁314可通过粘接等方式固定在第二罩体360的内表面，以增强第二副磁314在扬声器300内的结构稳定性，从而确保第二副磁314对穿过第一音圈3111的磁场的充磁可靠性，避免第二副磁314在扬声器300内发生偏移而影响对穿过第二音圈3211的磁场的充磁效果。
当然，在其他示例中，第二副磁314在第一音圈3111的厚度方向上的投影可位于该第一音圈3111的内腔中，例如，该第二副磁314可与中心磁铁322a相对设置，例如，该第二副磁314位于中心磁铁322a的正上方，且该第二副磁314可通过粘接等方式固定在第二罩体360的内表面。
本申请实施例具体不对第一副磁324和第二副磁314的设置位置进行限制。
可以理解的是，图10至图13所示的示例为扬声器300中包括第一副磁324或者第二副磁314，在其他示例中，扬声器300还可包括第一副磁324和第二副磁314，以提高第一发声单元310和第二发声单元320的磁感应强度，从而提高扬声器300的低频灵敏度和中频或者高频灵敏度，使得扬声器300的声压级得以提升。
需要说明的是，参照图6至图13所示，上述示例中，磁路系统322的上表面为平整的表面，无凹腔等结构，第一发声单元310的后腔为第一振动系统311的第一振膜3112与磁路系统322的上表面之间的腔体，该第一发声单元310可负责高频发声，例如，参照图7所示，第一发声单元310的工作频段在11kHz-14kHz频段。另外，参照图7所示，第二发声单元320负责低频发声，例如，该第二发声单元320的工作频段在11kHz以内的频段，基于此，在图 5至图13对应的示例中，扬声器300实现了低频和高频发声。
图14是本申请一实施例提供的又一种扬声器的剖视图，图15是图14对应的扬声器的剖面图，图16是图14对应的扬声器的爆炸图。参照图14和图16所示，在一些示例中，磁路系统322朝向第一振动系统311的一侧可形成有凹腔3224，该凹腔3224的开口朝向第一振动系统311的第一振膜3112，使得第一振动系统311例如第一振膜3112、磁路系统322的表面及凹腔3224的内壁之间形成第一腔体301，即第一振动系统311朝向磁路系统322的一侧、磁路系统322的表面及凹腔3224的内壁之间形成第一发声单元310的后腔。
可以理解的是，磁路系统322的表面是指磁路系统322朝向第一振膜3112的表面。
通过在磁路系统322设置凹腔3224，增大了第一发声单元310的后腔空间尺寸，减小了第一发声单元310的后腔刚度，使得第一发声单元310的谐振点前移至中频范围，提升了第一发声单元310的中频灵敏度，即第一发声单元310更适用于中频输出，增强了扬声器300的中频性能，使得扬声器300满足实际需求，且第一发声单元310结构简单，便于制作。
参照图14所示，其中，凹腔3224与第二腔体302(例如第二发声单元320的前腔)之间可密封设置，以保证第一腔体301(例如第一发声单元310的后腔)与第二发声单元320的前腔密封隔离，改善了第一发声单元310与第二发声单元320之间的串音问题，提高了扬声器300的低频和中频音质例如声音的干净度。
参照图14和图15所示，在一些示例中，凹腔3224可贯穿至磁性件3221朝向华司3222的一侧表面，换句话说，凹腔3224从支撑件3223、磁性件3221的第一端贯穿至磁性件3221的第二端(参照图15所示)，以在磁路系统322中形成盲孔。可以理解，磁性件3221的第一端朝向第一振膜3112，磁性件3221的第二端朝向第二振膜3212。
在该示例中，支撑件3223和磁性件3221的中心磁铁322a上均形成有贯穿孔(参照图16所示)，该贯穿孔沿磁路系统322的厚度方向(参照图15中z所示的方向)同轴设置。例如，支撑件3223和中心磁铁322a可以呈环状结构，这样，支撑件3223和中心磁铁322a的内腔可共同形成凹腔3224。如此设置，可增大第一腔体301例如第一发声单元310的后腔体积，使得第一发声单元310的中频性能更佳。
图17是图15对应的扬声器在电子设备内的性能仿真结果图。参照图17所示，曲线a为第二发声单元320的性能曲线，曲线d为第一发声单元310的性能曲线，从图17中可看出，在图14至图16对应的示例中，在20Hz-2kHz的频段内，第二发声单元320处于高输出状态，即第二发声单元320在20Hz-2kHz的频段的灵敏度即声压级较大，可以负责扬声器300的低频发声，频率在3kHz附近，第一发声单元310可以替代第二发声单元320输出，提供了更高的灵敏度和瞬态特性，即第一发声单元310在3kHz附近的声压级较大，负责扬声器300的中频发声。
另外，参照图15所示，华司3222可对第一腔体301与第二腔体302进行密封隔离，例如，中心华司322d挡设在凹腔3224朝向第二腔体302的一端开口，以改善第一发声单元310与第二发声单元320之间的串音问题，也即是说，通过将凹腔3224设置为盲孔，可借助磁路系统322本身的结构对第一腔体301和第二腔体302进行密封隔离，也减小了扬声器300的零部件数量，从而简化了扬声器300的装配工序。
图18是本申请一实施例提供的又一种扬声器的剖视图，图19是图18对应的扬声器的剖面图，图20是图18对应的扬声器的爆炸图。参照图18至图20所示，在另外一些示 例中，凹腔3224可贯穿至磁路系统322中华司3222朝向第二腔体302的一侧，换句话说，凹腔3224贯穿磁路系统322沿厚度方向(例如图19中z所示的方向)的两端，以在磁路系统322中形成通孔。
参照图19和图20所示，在该示例中，支撑件3223、中心磁铁322a及华司3222上均形成有贯穿孔，该贯穿孔沿z方向同轴设置。参照图20所示，例如，支撑件3223、中心磁铁322a及中心华司322d均可以呈环状结构，这样，支撑件3223、中心磁铁322a及中心华司322d的内腔可共同形成凹腔3224。
参照图18和图19所示，第一振动系统311例如第一振膜3112、磁路系统322的表面及通孔的内壁之间形成第一发声单元310的后腔，换句话说，第一振膜3112朝向磁路系统322的一侧与该磁路系统322的表面之间的腔体，以及通孔的内腔均为第一发声单元310的后腔，提高了第一发声单元310的后腔的空间尺寸，使得第一发声单元310的中频灵敏度得以提升。
另外，通过将凹腔3224设置为贯穿磁路系统322的通孔，以简化凹腔3224的制作工艺，提高扬声器300的制作效率。
参照图19所示，可在凹腔3224(例如通孔)朝向第二腔体302的一端盖设有第二阻尼网布3225，以分隔凹腔3224与第二腔体302，提高第一腔体301与第二腔体302之间的密封效果，即提高第一发声单元310的后腔与第二发声单元320的前腔之间的密封效果，从而保证第二发声单元320与第一发声单元310的声学性能。
图21是本申请一实施例提供的又一种扬声器的剖面图。参照图21所示，本申请实施例的凹腔3224内可填充有吸音件3226，以减轻凹腔3224引起的驻波对第一发声单元310发出的声音的干扰，避免第一腔体301形成共振腔，从而提高第一发声单元310的声音的干净度和清晰度。需要说明的是，在上述任一结构的扬声器300的凹腔3224中均可填充吸音件3226。
其中，该吸音件3226可以包括但不限于吸音棉、塑料泡沫、沸石分子筛及介孔材料中的任意一种或者几种内部具有空隙的吸音结构，这样，吸音件3226中的空隙可作为第一发声单元310后腔的一部分。其中，沸石分子筛及介孔材料的孔径在纳米级，一方面可提高吸音效果，另一方面，吸音件3226内部的空隙可作为第一发声单元310后腔的一部分，从而扩大第一发声单元310的后腔，从而降低第一发声单元310的工作频段。
可以理解，在上述示例中，即图15至图21对应的示例中，第一发声单元310可负责中频发声，第二发声单元320可负责低频发声，使得本申请实施例的扬声器实现了低频和中频的分频设计。
图22a是本申请一实施例提供的又一种扬声器的剖面图。参照图22a所示，在一些示例中，可在磁路系统322中形成凹腔3224，凹腔3224可贯穿至磁路系统322中华司3222朝向第二腔体302的一侧，换句话说，凹腔3224贯穿磁路系统322沿厚度方向(例如图22a中z所示的方向)的两端，以在磁路系统322中形成通孔。
另外，可在第二发声单元320内设置密封件，例如，可在第二腔体302内设有密封件例如第一密封件315，该第一密封件315的两端分别与磁路系统322和第二振膜3212密封连接，例如，该第一密封件315的一端可与华司3222朝向第二腔体302的一侧密封连接，该第一密封件315的另一端与第二振膜3212朝向第二腔体302的一侧密封连接。
参照图22a所示，第一密封件315内可具有第一导通孔3151，该第一导通孔3151的两端分别与凹腔3224和第三腔体303连通，例如，凹腔3224为形成在磁路系统322上的通孔，第 二振膜3212例如第二球顶321a上具有贯穿孔m，第一导通孔3151的一端与通孔连通，第一导通孔3151的另一端与第二振膜3212上的贯穿孔m连通，这样，可使通孔即凹腔3224与第三腔体303例如第二发声单元320的后腔连通，这样，第二发声单元320的后腔也作为第一发声单元310的后腔的一部分，相比于图16和图19的示例，进一步扩大第一发声单元310的后腔空间，使得第一发声单元310的谐振频率可前移至低频范围，例如，第一发声单元310的谐振点可前移至11kH以内的频段，从而提高第一发声单元310的低频灵敏度和瞬态特性，也即是说，第一发声单元310可负责低频发声，从而提高了本申请实施例的扬声器300的低频输出能力，使得扬声器300的低频声压级得以提升。
另外，第一密封件315的两端与磁路系统322和第二振膜3212密封连接，这样，保证第一腔体301与第二腔体302之间的密封性，避免第二发声单元320与第一发声单元310之间出现串音情况。参照图23所示，例如，第一密封件315的一端可通过密封胶粘接在华司3222上，第一密封件315的另一端可通过密封胶粘接在第二振膜3212上，本申请实施例具体不对第一密封件315与华司3222及第二振膜3212之间的连接方式进行限制。
图22b是本申请一实施例提供的再一种扬声器的剖面图。参照图22b所示，在一些示例中，还可以在第二发声单元320内设置第二密封件316。该第二密封件316的两端分别与第二振膜3212和第一罩体350密封连接，例如，该第二密封件316的一端与第二振膜3212朝向第二腔体302的一侧密封连接，第二密封件316的另一端与第一罩体350密封连接。
继续参照图22b所示，第二密封件316内可具有第二导通孔3161，该第二导通孔3161的两端分别与第一导通孔3151和耳机后腔102(参照图3所示)连通。
例如，凹腔3224为形成在磁路系统322上的通孔，第二振膜3212例如第二球顶321a上具有贯穿孔，第二导通孔3161的一端通过第二振膜3212上的贯穿孔与第一导通孔3151连通，使得第二导通孔3161的一端与凹腔3224连通。第一罩体350上具有与耳机后腔102连通的贯穿孔n，第二导通孔3161的另一端与第一罩体350上的贯穿孔n连通，使得第二导通孔3161的另一端与耳机后腔102连通。
参照图22b所示，在一些示例中，第一罩体350的贯穿孔n可通过第一阻尼网布352上的孔隙与耳机后腔102连通。
这样，磁路系统322上的凹腔3224可通过第一导通孔3151和第二导通孔3161与耳机后腔102连通，使得耳机后腔102也作为第一发声单元310的后腔的一部分，而耳机后腔102的空间较大，扩大第一发声单元310的后腔空间，使得第一发声单元310的谐振频率可前移至低频范围，例如，第一发声单元310的谐振点可前移至11kH以内的频段，从而提高第一发声单元310的低频灵敏度。
另外，第二密封件316的两端与第二振膜3212和第一罩体350密封连接，这样，保证第一腔体301与第三腔体303之间的密封性，避免第二发声单元320与第一发声单元310之间出现串音情况。参照图22b所示，例如，第二密封件316的一端可通过密封胶粘接在第二振膜3212上，第二密封件316的另一端可通过密封胶粘接在第一罩体350上，本申请实施例具体不对第二密封件316与第二振膜3212及第一罩体350之间的连接方式进行限制。
在一些示例中，第二密封件316的一端可以直接穿过第二振膜3212的贯穿孔，并与第一密封件315的一端密封连接，例如，第二密封件316的一端可通过粘接等方式固定在第一 密封件315的一端，使得第二导通孔3161和第一导通孔3151直接连通。
在其他示例中，第一密封件315和第二密封件316还可以为一体成型的密封件，该密封件穿设于第二振膜3212的贯穿孔，且一端可与华司3222密封连接，另一端与第一罩体350密封连接，使得磁路系统322中的通孔通过该密封件内的导通孔与耳机后腔102连通，以扩大第一发声单元310后腔的空间尺寸。
可以理解的是，第一密封件315和第二密封件316可以为两端具有开口的筒状件，该筒状件可以为圆筒、方筒或者其他形状的筒体，本申请实施例不对第一密封件315和第二密封件316的结构进行限制。另外，第一密封件315和第二密封件316的组成材料可以包括但不限于铜、铝、碳钢等刚性材料及橡胶、硅胶等柔性材料中的任意一种，具体可根据实际需要进行选择。
本申请实施例中，磁路系统322的中心区域的磁性较边缘区域弱，这就使得磁路系统322的大部分磁力线均是通过共同磁路系统的边缘区域发出，以形成磁回路，并驱动第一音圈3111和第二音圈3211运动。
需要说明的是，磁路系统322的中心区域是指远离第一音圈3111和第二音圈3211内侧的部分区域，例如，第一音圈3111在磁路系统322上的投影位于中心区域的外周。
参照图15、图18及图22a所示，本申请实施例的凹腔3224在具体设置时，可位于磁路系统322的中心区域，即凹腔3224开设在磁路系统322中磁感应强度较弱的位置，例如，该凹腔3224可开设在中心磁铁322a的中心区域、支撑件3223的中心区域及中心华司322d的中心区域，这样，可减小凹腔3224的设置对磁路系统322产生的磁感应强度的影响，从而保证第一音圈3111和第二音圈3211受到的磁回路的磁感应强度，即确保第一音圈3111和第二音圈3211的力因子，使得扬声器300在低频、中频或高频的声压级均不受影响。
图23是图4的部分爆炸图，图24是图23中盆架的结构示意图，图25是图24中第一导电插件和第二导电插件的结构示意图，图26是图4的其中一种局部剖视图。参照图23至图26所示，在一些示例中，盆架340的侧壁(参照图24中B所示)内可具有两个第一导电插件3401a(3401b)，第一音圈3111的正极引脚通过其中一个第一导电插件例如第一导电插件3401a引出至盆架340的侧壁外表面，并与外部电路电连接，第一音圈3111的负极引脚通过另一个第一导电插件例如第一导电插件3401b引出至盆架340的侧壁外表面，并与外部电路电连接。
继续参照图25所示，每个第一导电插件的第一端具有第一导电插针，每个第一导电插件的第二端具有第二导电插针，第一导电插针和第二导电插针均裸露于盆架340的侧壁B的外表面，其中，两个第一导电插针341a(341b)用于与第一音圈3111电连接，两个第二导电插针342a(342b)用于与外部电路电连接，使得第一音圈3111通过两个第一导电插件3401a(3401b)与外部电路电连接。
例如，其中一个第一导电插针例如第一导电插针341a与第一音圈3111的正极引脚电连接，另一个第一导电插针例如第一导电插针341b与第一音圈3111的负极引脚电连接。相应地，其中一个第二导电插针例如第二导电插针342a与外部电路的正极电连接，另一个第二导电插针例如第二导电插针342b与外部电路的负极电连接，使得第一音圈3111的两个引脚与外部电路电连接，保证外部电路向第一音圈3111通入电流，使得通电后的第一音圈3111在磁回路的磁场作用下产生洛伦兹力，并在洛伦兹力的驱动下振动。
其中，第一音圈3111可采用导线沿垂直于第一音圈3111的厚度方向(参照图23中z所示的方向)绕制而成，例如，第一音圈3111可采用导线沿x方向自内而外或者自外而内绕制而成，则第一音圈3111的正极引脚和负极引脚可分别为形成第一音圈3111的导线的两端。
参照图25所示，示例性地，每个第一导电插件还包括第一导电件，第一导电插针和第二导电插针分别连接在第一导电件的两端。例如，第一导电插件3401a包括第一导电件343a，第一导电插针341a和第二导电插针342a分别连接在第一导电件343a的两端(参照图26所示)。
实际中，外部电路可以包括电连接件和电子设备例如耳机主板上的音频编码器。其中，电连接件例如柔性电路板的一端与音频编码器电连接，电连接件例如柔性电路板的另一端与两个第二导电插针342a(342b)352电连接，使得音频编码器与第一发声单元310的第一音圈3111电连接。扬声器300工作时，音频编码器将音频信号以电流的方式通过电连接件和两个第一导电插件3401a(3401b)传输至第一音圈3111，使得第一音圈3111上产生具有一定频率的电流，从而在磁场作用下产生洛伦兹力，以驱动该第一音圈3111根据音频信号进行振动。
另外，通过将两个第一导电插件3401a(3401b)的第一端即第一导电插针裸露于盆架340侧壁的外表面，使得第一导电插件更便于与第一音圈3111电连接，从而简化了第一发声单元310与第一导电插件之间的电连接工序，提高了扬声器300的组装效率。
图27是图25中第一振动系统的结构示意图，图28是图27的爆炸图，图29是图27的另一视角的结构示意图。参照图27至图29所示，本申请实施例的扬声器300可以包括柔性电路板(例如第一柔性电路板313)，该第一柔性电路板313与第一音圈3111沿盆架340的高度方向(例如z方向)层叠设置。例如，该第一柔性电路板313的至少部分位于第一音圈3111背向磁路系统340的一侧。第一导电插针341a和第一导电插针341b分别通过第一柔性电路板313与第一音圈3111电连接。
参照图27和图29所示，具体地，第一柔性电路板313的一部分例如第一本体部3131水平设置在第一音圈3111与第一振膜3112之间，即第一音圈3111、第一本体部3131和第一振膜3112沿z方向依次层叠设置，例如，第一音圈3111位于第一柔性电路板313的内表面，第一振膜3112位于第一柔性电路板313的外表面，且该第一柔性电路板313的第一本体部3131与第一音圈3111的引脚电连接，该第一柔性电路板313的另一部分延伸至盆架340的外侧壁，例如，该第一柔性电路板313的外缘具有两个第一延伸部，分别为第一延伸部3132a和第一延伸部3132b，第一延伸部3132a和第一延伸部3132b可延伸至盆架340的外侧壁(参照图4所示)，并可紧密的贴合在盆架340侧壁的外表面，且第一延伸部3132a与第一导电插针341a电连接，第一延伸部3132b与第一导电插针341b电连接，从而使得第一音圈3111的正极引脚和负极引脚通过第一柔性电路板313与两个第一导电插针341a(341b)电连接。
需要说明的是，第一柔性电路板313的内表面是指第一柔性电路板313朝向磁路系统340的一侧表面，第一柔性电路板313的外表面是指第一柔性电路板313背向磁路系统340的一侧表面。
如此，该第一音圈3111的引脚通过第一柔性电路板313与两个第一导电插针341a(341b)电连接，使得第一音圈3111与第一导电插针的电连接更加方便及可靠，从而提高了第一音圈3111与第一导电插件之间的电连接效率和可靠性。
其中，第一柔性电路板313的柔性较好，以便于该第一柔性电路板313的一部分例如第 一延伸部3132贴合在盆架340的外侧壁，另外，当第一音圈3111在洛伦兹力的驱动下沿厚度方向运动时，可通过抵顶柔性电路板以带动第一振膜3112沿第一音圈3111的厚度方向运动，即柔性电路板的设置确保了第一振膜3112的振动幅度。
参照图28所示，可以理解的是，第一柔性电路板313内具有走线层，走线层的一端与第一音圈3111电连接，走线层的另一端延伸至第一延伸部的端部，并与第一导电插针电连接。示例性地，走线层可以包括但不限于铜层等。
具体设置时，第一柔性电路板313至少包括两个走线层，其中一个走线层(例如第一走线层a1)的第一端与第一音圈3111的正极引脚电连接，第一走线层a1的第二端延伸至第一延伸部3132a的端部，并与第一导电插针341a电连接。
另一个走线层(例如第二走线层a2)的第一端与第一音圈3111的负极引脚电连接，第二走线层a2的第二端延伸至第一延伸部3132b的端部，并与第一导电插针341b电连接。
可以理解的是，第一走线层a1和第二走线层a2的一部分位于第一本体部3131内，另一部分位于第一延伸部3132a和第一延伸部3132b内。在一些实施例中，第一走线层a1和第二走线层a2可以是第一柔性电路板313在z方向上的同一层金属层，第一走线层a1和第二走线层a2还可以是第一柔性电路板313在z方向上的不同层的金属层。
另外，参照图28所示，第一柔性电路板313的第一本体部3131上可以开设避让孔(例如第三避让孔313a)，该第三避让孔313a的设置可减轻第一柔性电路板313的重量，提高第一柔性电路板313的振幅，从而提高第一振膜3112的振动幅度，使得第一发声单元310的灵敏度得提升。
参照图28所示，在一些示例中，可以在第三避让孔313a的内壁上设有两个第三延伸部，(例如第三延伸部3134a和第三延伸部3134b)，第三延伸部3134a和第三延伸部3134b的一端与第三避让孔313a的内壁连接，第三延伸部3134a和第三延伸部3134b位于第三避让孔313a的内腔，每个第三延伸部至少在朝向第一音圈3111的一侧裸露有部分走线层(例如铜片)，该铜片可作为走线层在第三延伸部表面的第一焊盘，第一音圈3111的引脚可焊接在第三延伸部上裸露的铜片例如第一焊盘上。
例如，第三延伸部3134a上裸露的铜片例如第一焊盘n1(参照图27所示)为第一走线层a1的一部分，该第三延伸部3134a上的第一焊盘n1与第一音圈3111的正极引脚焊接，第三延伸部3134b上裸露的铜片例如第一焊盘n2(可参照图27所示)为第二走线层a2的一部分，该第三延伸部3134b上的第一焊盘n2与第一音圈3111的负极引脚电连接，从而将第一音圈3111的正极引脚和负极引脚分别焊接在第一柔性电路板313的第一走线层a1和第二走线层a2，从而可将第一音圈3111的正极引脚和负极引脚通过第一走线层a1和第二走线层a2引出至第一延伸部3132a和第一延伸部3132b的端部，以使得第一延伸部3132a与第一导电插针341a电连接，第一延伸部3132b与第一导电插针341b电连接。
参照图28所示，另外，可在第一本体部3131靠近外缘的区域开设环形孔(例如第一环形孔313b)。可以理解，第一环形孔313b和第三避让孔313a将第一本体部3131分为内环313e和外环313f，第三延伸部3134a和第三延伸部3134b位于内环313e的内缘，并与第一音圈3111的引脚电连接。
参照图28所示，第一环形孔313b内可设置有多个连接部(例如第一连接部3135)，多个第一连接部3135沿第一环形孔313b的周向间隔设置，每个第一连接部3135的一端与内环 313e连接，每个第一环形孔313b的另一端与外环313f连接，确保第一柔性电路板313为一个完整的结构件，以便于第一柔性电路板313的装配。
其中，两个第一延伸部形成在外环313f的外缘上，每个第一延伸部通过外环313f和第一连接部3135与内环313e连接，换句话说，第一音圈3111的引脚通过内环313e、第一连接部3135及外环313f与第一延伸部电连接。
例如，第一音圈3111的正极引脚通过第三延伸部3134a上的第一焊盘n1与内环313e内的第一走线层a1电连接，继而依次通过其中一个第一连接部3135和外环313f内的第一走线层a1与第一延伸部3132a内的第一走线层a1电连接，从而使得第一音圈3111的正极引脚引出至第一延伸部3132a的端部。
相应地，第一音圈3111的负极引脚通过第三延伸部3134b上的第一焊盘n2与内环313e内的第二走线层a2电连接，继而依次通过另一个第一连接部3135和外环313f内的第二走线层a2与第一延伸部3132b内的第二走线层a2电连接，从而使得第一音圈3111的负极引脚引出至第一延伸部3132b的端部。
继续参照图27所示，每个第一连接部3135可呈“S”形结构，也即是说，每个第一连接部3135的两端的至少部分与中间部分的延伸方向不同，以优化第一走线层a1和第二走线层a2的谐振问题。
另外，第一环形孔313b的设置也减轻了第一柔性电路板313的重量，从而提高了第一柔性电路板313的振动幅度，使得第一振动系统311的振动幅度得以提升，从而提高了第一发声单元310的音频性能。
参照图27和图28所示，其中，在第一柔性电路板313的内表面还设有钢圈370，该钢圈370位于第一柔性电路板313的外缘内表面，该第一柔性电路板313通过钢圈370固定在盆架340的第二端。
通过在盆架340的侧壁内设置两个第一导电插件3401a(3401b)，使得第一发声单元310模组化，例如，在装配时，只需将第一发声单元310装配至盆架340内后，继而将第一发声单元310的第一柔性电路板313与第一导电插件3401a的第一导电插针341a电连接，将第一柔性电路板313与第一导电插件3401b的第一导电插针341b电连接，便完成第一发声单元310的组装，后续只需将外部电路例如电连接件与第一导电插件3401a的第二导电插针342a电连接，将外部电路例如电连接件与第一导电插件3401b的第二导电插针342b电连接，便可对第一发声单元310中的第一音圈3111通电，简化了第一发声单元310的装线工序，提高了扬声器300的组装效率。
参照图28所示，示例性地，可在第一延伸部3132a和第一延伸部3132b上形成有第一安装孔313c，第一导电插针341a和第一导电插针341b分别穿设于对应的第一安装孔313c内(参照图4所示)，且第一导电插针与第一安装孔313c的内壁电连接，例如，第一导电插针341a穿设于第一延伸部3132a上的第一安装孔313c内，并与第一安装孔313c的内壁电连接，第一导电插针341b穿设于第一延伸部3132b上的第一安装孔313c内，并与第一安装孔313c的内壁电连接。
示例性地，每个第一安装孔313c的内壁一周裸露有环形铜片，该环形铜片可作为第二焊盘，并与第一导电插针的外侧壁焊接，使得第一延伸部与第一导电插针电连接。
可以理解，该环形铜片为第一柔性电路板313内的走线层的一部分。例如，第一走线 层a1的一端裸露于第三延伸部3134a的内表面，以在该第三延伸部3134a上形成第一焊盘n1，并与第一音圈3111的正极引脚焊接，第一走线层a1的另一端裸露于第一延伸部3132a的第一安装孔313c的内缘，并在第一安装孔313c的内缘一周形成第二焊盘(参照图28中m1所示)，该第二焊盘m1可以为环形铜片，该第一延伸部3132a通过第二焊盘m1与第一导电插针341a焊接，使得第一音圈3111通过第一柔性电路板313内的第一走线层a1与第一导电插针341a电连接。
相应地，第二走线层a2的一端裸露于第三延伸部3134b的内表面，以在该第三延伸部3134b上形成第一焊盘n2，并与第一音圈3111的负极引脚焊接，第二走线层a2的另一端裸露于第一延伸部3132b的第一安装孔313c的内缘，并在第一安装孔313c的内缘一周形成第二焊盘(参照图28中m2所示)，该第二焊盘m2可以为环形铜片，该第一延伸部3132b通过该第二焊盘m2与第一导电插针341b焊接，使得第一音圈3111的负极引脚通过第一柔性电路板313内的第二走线层a2与第一导电插针341b电连接。
通过在第一延伸部3132a和第一延伸部3132b上开设第一安装孔313c，并将第一导电插针穿设于对应的第一安装孔313c内，以便于第一延伸部与第一导电插针之间的电连接，例如，当第一延伸部3132a与第一导电插针341a焊接时，可沿着第一安装孔313c的内壁与第一导电插针341a的侧壁之间的环形间隙进行锡焊，使得第一延伸部3132a与第一导电插针341a之间的焊接更加简单快捷，且提高了第一延伸部3132a与第一导电插针341a之间的电连接可靠性。
参照图4和图23所示，其中，可在盆架340的侧壁外表面形成有第一接线区域340a，第一接线区域340a位于两个第一导电插针341a(341b)之间，即第一接线区域340a位于第一导电插针341a和第一导电插针341b之间，两个第二导电插针342a(342b)例如第二导电插针342a和第二导电插针342b位于第一接线区域340a上，第一音圈3111的正负引脚从距离较远的第一导电插针341a和第一导电插针341b引至距离较近的第二导电插针342a和第二导电插针342b上，这样，外界可只需一根电连接件例如柔性电路板直接与该第一接线区域340a内的两个第二导电插针342a(342b)焊接，便可向第一音圈3111通入电流，简化了第一音圈3111的正负引脚与外部电路之间的电连接结构，从而便于本申请实施例的扬声器300的整机应用。
例如，第一振动系统311在装配前，可先将第一振动系统311贴装在第二发声单元320上，并将第一发声单元310中第一柔性电路板313的第一延伸部3132a与第一导电插针341a电连接，将第一柔性电路板313的第一延伸部3132b与第一导电插针341b电连接，便可完成第一发声单元310的组装，后续只需将外部电路与盆架340外部的第二导电插针342a和第二导电插针342b电连接即可，实现了第一发声单元310的模组化，简化了第一发声单元310的引线工序，提高了扬声器300的装配效率。
具体设置时，盆架340位于第一接线区域340a的表面可为平面，这样，外部的电连接件例如柔性电路板的一部分可贴设在该平面上，以便于与第二导电插针342a和第二导电插针342b电连接例如焊接，另外，也使得外部的柔性电路板与两个第二导电插针342a(342b)之间的电连接更加稳定可靠。
其中，该平面可为斜面，该斜面的顶端往盆架340的轴线倾斜，以便于外部的柔性电路板与第二导电插针的焊接操作，另外，也减小了盆架340在径向上的占用尺寸，即减小 了扬声器300的径向尺寸。需要说明的是，该斜面的顶端为斜面靠近盆架340第二端的一端。
本申请实施例的两个第一导电插件3401a(3401b)与盆架340可为一体成型的一体件，以减小扬声器300的零部件数量，从而提高扬声器300的装配效率，另外，也提高了每个第一导电插件与盆架340之间的装配稳固性，使得第一导电插件的两端与第一柔性电路板313和外部电路之间的连接更加可靠。
当然，在其他示例中，两个第一导电插件3401a(3401b)可通过卡接等可拆卸方式固定在盆架340的侧壁上。
图30是图4的另一种局部剖视图。参照图26和图30所示，本申请实施例中，盆架340的侧壁内还具有两个第二导电插件3402a(3402b)(参照图25所示)，两个第二导电插件3402a(3402b)分别为第二导电插件3402a和第二导电插件3402a，第二导电插件3402a和第二导电插件3402a的第一端均位于盆架340内，且分别与第二音圈3211的正极引脚和负极引脚电连接，例如，参照图30所示，第二导电插件3402a的第一端与第二音圈3211的正极引脚(参照图30中C所示)电连接例如焊接，第二导电插件3402b的第一端与第二音圈3211的负极引脚电连接例如焊接。
参照图25和图26所示，第二导电插件3402a和第二导电插件3402a的第二端均具有第三导电插针，例如，第二导电插件3402a的第二端具有第三导电插针344a，第二导电插件3402b的第二端具有第三导电插针344b，第三导电插针344a和第三导电插针344b裸露于盆架340侧壁的外表面。
参照图25和图26所示，在一些示例中，每个第二导电插件可包括第二导电件，第二导电件的第一端即导电插件的第一端，用于与第二音圈3211电连接，第二导电件的第二端与第三导电插针电连接，从而使得第二音圈3211通过第二导电件与第三导电插针电连接。例如，参照图27和图30所示，第二导电插件3402a可包括第二导电件349a，第二导电件349a的第一端即第二导电插件3402a的第一端，用于与第二音圈3211的正极引脚C电连接，第二导电件349a的第二端与第三导电插针344a电连接，使得第二音圈3211的正极引脚通过第二导电件349a与第三导电插针344a电连接，相应地，第二导电插件3402b可包括第二导电件349b，第二导电件349b的第一端即第二导电插件3402b的第一端，用于与第二音圈3211的负极引脚电连接，第二导电件349b的第二端与第三导电插针344b电连接，使得第二音圈3211的负极引脚通过第二导电件349b与第三导电插针344b电连接。
可以理解的是，图30中示出了第二导电插件3402a与第二音圈3211的正极引脚C之间的电连接结构，第二导电插件3402b与第二音圈3211的负极引脚之间的电连接结构与第二导电插件3402a与第二音圈3211的正极引脚C之间的电连接结构一致，可直接参照图30中所示。
其中，第二导电件349a和第二导电件349a嵌设于盆架340的侧壁B内，以确保两个第二导电插件3402a(3402b)稳固于盆架340的侧壁内，第二导电件349a的一端和第二导电件349a的一端裸露于盆架340的侧壁B外表面(参照图26所示)。
其中，两个第三导电插针344a(344b)用于与外部电路电连接，例如，第三导电插针344a与外部电路的正极电连接，第三导电插针344b与外部电路的负极电连接，使得第二音圈3211通过第三导电插针344a和第三导电插针344b与外部电路电连接，以便于第二音圈3211与外部电路的电连接，并使得第二音圈3211与外部电路之间的连接更加可靠，从 而提高了第二音圈3211与外部电路之间的电连接可靠性。
需要说明的是，第二音圈3211可均采用导线沿音圈的厚度方向(参照图7中z所示的方向)绕制而成，则第二音圈3211的正极引脚和负极引脚可分别为形成第二音圈3211的导线的两端，可以理解，第二音圈3211的两个引脚(例如导线的两端)分别位于第二音圈3211沿厚度方向的两端。
另外，通过在盆架340的侧壁内设置两个第二导电插件，使得第二发声单元320模组化，例如，在装配时，只需将第二发声单元320装配至盆架340内后，继而将第二发声单元320中第二音圈3211的引脚与两个第三导电插针344a(344b)的第一端电连接，便完成第二发声单元320的组装，后续只需将外部电路与两个第三导电插件3403a(3403b)第二端的第三导电插针电连接，便可对第二发声单元320中的第二音圈3211通电，简化了第二发声单元320的装线工序，提高了扬声器300的组装效率。
参照图26所示，在一些示例中，第三导电插针344a和第三导电插针344b均可位于盆架340的第一接线区域340a，即两个第三导电插针344a(344b)和两个第二导电插针342a(342b)均位于第一接线区域340a，这样，外界可只需一根电连接件例如柔性电路板直接与该第一接线区域340a内的两个第二导电插针342a(342b)和两个第三导电插针344a(344b)焊接，便可向第一音圈3111和第二音圈3211通入电流，简化了第一音圈3111和第二音圈3211的正负引脚与外部电路之间的电连接结构，从而简化了扬声器300的两个发声单元与外部电路之间的电连接工序，从而便于本申请实施例的扬声器300的整机应用。
其中，两个第二导电插件3402a(3402b)与盆架340可为一体成型的一体件，例如，第二导电插件3402a和第二导电插件3402a与盆架340可一体注塑成型，以简化盆架340与第二导电插件3402a和第二导电插件3402a之间的装配工序，也减小了扬声器300的零部件数量，使得扬声器300的组装效率得以提升，另外，也提高了盆架340与两个第二导电插件3402a(3402b)之间的连接稳固性，从而确保第一发声单元310和第二发声单元320与外部电路之间的电连接可靠性。
图31是本申请一实施例提供的又一种扬声器的结构示意图，图32是图31的爆炸图，图33是图31中第三发声单元的结构示意图，图34是图31的剖面图。参照图31至图34所示，本申请实施例的扬声器300还可包括第三发声单元330，其中，第二发声单元320的工作频段小于第一发声单元310的工作频段小于第三发声单元330的工作频段，且第三发声单元330与第一发声单元310均位于第二发声单元320的同侧。
在一些示例中，第三发声单元330可以为微机电系统(Micro Electro Mechanical System，简称MEMS)(以下可称为微机电发声单元)，通常负责高频发声，例如，该第三发声单元330可负责14kHz以上频段的发声。第一发声单元310可为平面膜单元，可负责中频部分(11kHz-14kHz之间的频段)，第二发声单元320可为动圈单元，可负责低频部分(20Hz-11kHz之间的频段)。
可以理解的是，参照图14所示，为了提高第一发声单元310的中频音质，在上述示例中，磁路系统322朝向第一振膜3112的一侧可形成有凹腔3224，该凹腔3224的开口朝向第一振膜3112，使得第一振膜3112、磁路系统322的表面及凹腔3224的内壁之间形成第一腔体301，即第一振膜3112朝向磁路系统322的一侧、磁路系统322的表面及凹腔3224的内壁之间形成第一发声单元310的后腔。
可以理解的是，磁路系统322的表面是指磁路系统322朝向第一振膜3112的表面。
通过在磁路系统322设置凹腔3224，增大了第一发声单元310的后腔空间尺寸，减小了第一发声单元310的后腔刚度，使得第一发声单元310的谐振点前移至中频范围，提升了第一发声单元310的中频灵敏度，即第一发声单元310更适用于中频输出，增强了扬声器300的中频性能，使得扬声器300满足实际需求，且第一发声单元310结构简单，便于制作。
本申请实施例中，微机电发声单元即MEMS发声单元是通过MEMS工艺制备，其利用内部的压电材料在电场作用下翘曲变形从而带动MEMS发声单元的振膜振动，使得压电材料和振膜推动MEMS发声单元中的空气振动，而发生声音。
MEMS发声单元一般采用MEMS工艺制作，在器件小型化进程中体现出优异的潜力与效果，可有效地缩小MEMS发声单元的体积，从而在提高扬声器300的高频性能的基础上，可缩小扬声器300的体积，可在微型扬声器场景中具有显著优势，如耳机、智能眼镜、手环手表等便携产品。
第三发声单元330即MEMS发声单元的设置拓宽了扬声器300的工作频带，提高了扬声器300的音频效果，使得本申请实施例的扬声器300的使用场景更加广泛。
参照图34所示，在一些示例中，第一发声单元310与第三发声单元330位于第二发声单元320的同侧，即两个频率较高的发声单元位于频率较低的第二发声单元320的同侧，这样，在装配时，可将第一发声单元310和第三发声单元330的出音口的朝向相同，同时靠近电子设备例如耳机的出音嘴设置，以提高频率较高的两个发声单元的灵敏度。
参照图34所示，第三发声单元330的出音口(例如第三出音口331)与第一发声单元310的第一振膜3112朝向相同，例如均朝上，第一振膜3112朝向第一发声单元310的第一出音口，其中，根据上文中的相关内容可知，该第一出音口可以为出音嘴100a(参照图3所示)，或者该第一出音口朝向出音嘴100a，则第三出音口331朝向出音嘴100a，这样，可减小声音从第三出音口331传播至出音嘴100a的传播路径，即减小高频声音的出声路径长度，降低了第三发声单元330300发出的声音传播至出音嘴100a的损耗，从而提高扬声器300的高频声音的音质。
参照图34所示，示例性地，第三发声单元330可位于第一发声单元310的后腔中。具体装配时，该第三发声单元330的一端例如具有第三出音口331的一端可固定在第一振膜3112的内表面。为方便描述，将第三发声单元330具有第三出音口331的一端作为第三发声单元330的顶端，将第三发声单元330背向第三出音口331的一端作为第三发声单元330的底端。
参照图34所示，例如，第三发声单元330的顶端可通过钢圈370固定在第一振膜3112的内表面。其中，第一振膜3112的内表面是指第一振膜3112朝向磁路系统322的表面。可以理解的是，当第一振膜3112的内表面具有第一柔性电路板313时，第三发声单元330的顶端可固定在第一柔性电路板313背向第一振膜3112的表面(参照图34所示)。
参照图32和图34所示，第一振膜3112上可具有避让孔(例如第二避让孔311c)，第三发声单元330的第三出音口331与第二避让孔311c连通，例如，第三出音口331可正对第二避让孔311c设置，这样，第三发声单元330的声音可经第三出音口331和第二避让孔311c发出至扬声器300的外部。
参照图34所示，在一些示例中，磁路系统322上可具有避让孔(例如第一避让孔322g)， 第三发声单元330的至少部分位于第一避让孔322g内，也即是说，第三发声单元330设置在第一发声单元310内，以减小第三发声单元330占用扬声器300其他区域的空间，从而减小了扬声器300的高度。
可以理解的是，第一避让孔322g可以是凹腔3224的一部分。例如，凹腔3224贯穿整个磁路系统322，以在磁路系统322形成通孔，其中，凹腔3224位于支撑件3223内的部分，即支撑件3223上的通孔可作为用于容纳第三发声单元330的第一避让孔322g。
为了便于第三发声单元330的安装，支撑件3223上的第一避让孔322g的径向尺寸可大于磁性件3221和华司3222中通孔的径向尺寸。
其中，第三发声单元330的底部与磁性件3221朝向第一振膜3112的一侧之间可具有间隙，以保证支撑件3223上的第一避让孔322g与磁性件3221上的凹腔3224(例如通孔)连通，从而保证第一发声单元310的后腔的空间尺寸不受影响，例如，第一振膜3112与磁路系统322的凹腔3224内壁之间的所有腔体均可作为第一发声单元310的后腔，确保第一发声单元310的中频灵敏度。
图35是图31的部分结构示意图，图36是图35中第一柔性电路板的结构示意图。参照图35和图36所示，在一些示例中，第三发声单元330可通过第一发声单元310中的第一柔性电路板313与外部电路电连接，例如，第三发声单元330与第一柔性电路板313的第一本体部3131电连接，第一柔性电路板313的外缘可具有两个第二延伸部，两个第二延伸部分别为第二延伸部3133a和第二延伸部3133b，第二延伸部3133a和第二延伸部3133b分别延伸至盆架340的外侧壁上，这样，外部电路可通过与第二延伸部3133a和第二延伸部3133b电连接，便可对第三发声单元330进行通电。
另外，第三发声单元330和第一发声单元310共用一个第一柔性电路板313，减小了扬声器300内零部件设置数量，一方面减小了扬声器300的尺寸，另一方面，也简化了扬声器300的组装工序，提高了扬声器300的组装效率。
图37是图36的局部剖视图，图38是图36的局部剖视图。参照图37和图38所示，a1和a2分别为第一柔性电路板313中用于电连接第一音圈3111和两个第一延伸部的两个走线层，例如，参照图37所示，a1为第一走线层，a2为第二走线层。参照图38所示，a3和a4分别为第一柔性电路板313中用于电连接第三发声单元330与两个第二延伸部的两个走线层，例如，a3为用于电连接第三发声单元330的正极引脚与第二延伸部3133a的第三走线层，a4为用于电连接第三发声单元330的负极引脚与第二延伸部3133b的第四走线层。
其中，第一走线层a1和第二走线层a2中，裸露于第三延伸部3134a和第三延伸部3134b上的铜片例如第一焊盘如图38中的n1和n2所示，裸露于第一延伸部3132a和第一延伸部3132b上的环形铜片例如第二焊盘如图38中的m1和m2所示。
参照图35和图36所示，其中，第三发声单元330位于第一本体部3131的内环313e的一侧，例如，第三发声单元330的顶部可通过粘接等方式固定在内环313e的内表面，内环313e上的第三避让孔313a可与第三出音口331连通，例如，第三出音口331、第三避让孔313a及第一振膜3112上的第二避让孔313a沿z方向同轴设置，这样，第三出音口331发出的声音可经第三避让孔313a及第二避让孔313a传出至扬声器300的外部，例如耳机前腔101内。
参照图36所示，在一些示例中，可在内环313e中开设有环形孔(例如第二环形孔313j)， 第二环形孔313j将内环313e分隔为第一部分313g和第二部分313h，第三发声单元330具体可固定在第一部分313g的内表面。
可以理解，第一部分313g和第二部分313h均为环形结构，第一部分313g位于第二部分313h的内部，第一连接部3135位于第二部分313h与外环313f之间。示例性地，第三发声单元330可位于第一部分313g的一侧，第三避让孔313a位于第一部分313g上，第一音圈3111位于第二部分313h的一侧。其中，参照图38所示，第三延伸部以及裸露于第三延伸部上的第一焊盘位于第二部分313h的内缘。
参照图37所示，例如，第一走线层a1的第一端裸露于第二部分313h内缘的第三延伸部3134a内表面，并形成第一焊盘n1，第一音圈3111的正极引脚焊接在第一焊盘n1上，使得第一音圈3111的正极引脚与第一走线层a1电连接，该第一走线层a1可经第二部分313h、其中一个第一连接部3135及外环313f延伸至第一延伸部3132a上，并在该第一延伸部3132a上裸露形成第二焊盘m1，该第二焊盘m1焊接在第一导电插针341a上，从而使得第一音圈3111的正极引脚与该第一导电插针341a电连接。
第二走线层a2的第一端裸露于第二部分313h内缘的第三延伸部3134b内表面，并形成第一焊盘n2，第一音圈3111的负极引脚焊接在第一焊盘n2上，使得第一音圈3111的负极引脚与第二走线层a2电连接，该第二走线层a2可经第二部分313h、另一个第一连接部3135及外环313f延伸至第一延伸部3132b上，并在该第一延伸部3132b上裸露形成第二焊盘m2，该第二焊盘m2焊接在第一导电插针341b上，从而使得第一音圈3111的负极引脚与该第一导电插针341b电连接。
本申请实施例的第二环形孔j的设置提高了第二部分313h的振动幅度，从而使得第一音圈3111在运动过程中可通过第二部分313h带动第一振膜3112沿z方向自由振动(参照图35所示)，即提高了第一振膜3112的振动幅度。
参照图35和图36所示，第二环形孔313j内可设置有多个连接部(例如第二连接部3136)，多个第二连接部3136沿第二环形孔313j的周向间隔设置，每个第二连接部3136的一端与第一部分313g的外缘连接，每个第二连接部3136的另一端与第二部分313h的内缘连接，确保第一柔性电路板313为一个完整的结构件，以便于第一柔性电路板313的装配。
参照图34和图35所示，其中，第一部分313g与第三发声单元330电连接，第一部分313g的外缘可通过第二连接部3136、第二部分313h及第一连接部3135与第二延伸部电连接，使得第三发声单元330与第二延伸部电连接。例如，第一部分313g与第三发声单元330的正极电连接，第一部分313g的部分外缘可通过第二连接部3136、第二部分313h、其中一个第一连接部3135及外环313f与第二延伸部3133a电连接，使得第三发声单元330的正极与第二延伸部3133a电连接。
第一部分313g还与第三发声单元330的负极电连接，第一部分313g的部分外缘可通过另一个第二连接部3136、第二部分313h、另一个第一连接部3135及外环313f与第二延伸部3133b电连接，使得第三发声单元330的负极与第二延伸部3133b电连接。
图39是图35中第三导电插件的结构示意图。参照图35和图39所示，在一些示例中，盆架340的侧壁内可设有两个第三导电插件3403a(3403b)，两个第三导电插件3403a(3403b)分别为第三导电插件3053a和第三导电插件3053b。其中，两个第三导电插件3403a(3403b)的第一端分别具有第四导电插针，两个第三导电插件3403a(3403b)的第二端具有第五导 电插针，两个第四导电插针345a(345b)和两个第五导电插针346a(346b)均裸露于盆架340侧壁的外表面，且两个第四导电插针345a(345b)分别与对应的第二延伸部电连接，使得两个第四导电插针345a(345b)通过第一柔性电路板313与第三发声单元330电连接，两个第五导电插针346a(346b)用于与外部电路例如柔性电路板电连接，从而使得第三发声单元330通过两个第三导电插件3403a(3403b)与外部电路例如音频编码器电连接。
例如，第三导电插件3053a的第四导电插针345a与第二延伸部3133a电连接，使得第四导电插针345a与第三发声单元330的正极电连接，第三导电插件3053b的第四导电插针345b与第二延伸部3133b电连接，使得第四导电插针345b与第三发声单元330的负极电连接，使得第三发声单元330的正负极通过第一柔性电路板313与两个第四导电插针345a(345b)电连接。
第三导电插件3053a的第五导电插针346a与外部电路(例如音频编码器)的正极电连接，第三导电插件3053b的第五导电插针346b与外部电路的负极电连接，使得两个第五导电插针346a(346b)与外部电路电连接，从而使得第三发声单元330的正负极通过第一柔性电路板313和两个第三导电插件3403a(3403b)与外部电路电连接。
扬声器300工作时，音频编码器可将音频信号以电压的方式通过电连接件和两个第三导电插件3403a(3403b)施加在第三发声单元330的压电材料上，使得该压电材料在电场作用下发生翘曲变形，从而带动第三发声单元330的振膜振动，以推动第三发声单元330两侧的空气振动，从而产生声音。
本申请实施例的第三发声单元330通过第一柔性电路板313和两个第三导电插件与外部电路电连接，以便于第三发声单元330与外部电路的电连接。另外，第四导电插针的设置也使得第一柔性电路板313与第三导电插件的第一端之间的连接更加方便可靠，第五导电插针的设置也使得外部电路与第三导电插件第二端之间的电连接更加方便可靠，从而提高了第三发声单元330与外部电路之间的电连接可靠性。
另外，通过在盆架340上设置第三导电插件，使得第三发声单元330模组化，例如，在装配时，只需将第三发声单元330装配至盆架340内后，继而将第三发声单元330与第一柔性电路板313电连接，且将该第一柔性电路板313的两个第二延伸部与两个第四导电插针345a(345b)电连接，便完成第三发声单元330的组装，后续只需将外部电路与两个第五导电插针电连接，便可对第三发声单元330通电，简化了第三发声单元330的装线工序，提高了扬声器300的组装效率。
参照图38所示，例如，第一柔性电路板313内的其中一个第三走线层b1的第一端裸露于第一部分313g朝向第三发声单元330的表面，以在第一部分313g的表面形成第三焊盘(参照图38中p1所示)，第三发声单元330的正极引脚焊接在第三焊盘p1上，使得第三发声单元330的正极引脚与第三走线层b1电连接，第三走线层b1经第一部分313g、其中一个第二连接部3136、第二部分313h、其中一个第一连接部3135及外环313f延伸至第二延伸部3133a上，且该第三走线层b1的第二端裸露于该第二延伸部3133a上，以在该第二延伸部3133上形成第四焊盘q1，并焊接在第四导电插针345a上，使得第三发声单元330的正极引脚与第四导电插针345a电连接。
第四走线层b2的第一端裸露于第一部分313g朝向第三发声单元330的表面，以在第一部分313g的表面形成第三焊盘(参照图38中p2所示)，第三发声单元330的负极引脚 焊接在该第三焊盘p2，使得第三发声单元330的负极引脚与第四走线层b2电连接，第四走线层b21经第一部分313g、另一个第二连接部3136、第二部分313h、另一个第一连接部3135及外环313f延伸至第二延伸部3133b上，且该第四走线层b2的第二端裸露于该第二延伸部3133b上，以在该第二延伸部3133b上形成第四焊盘q2，并焊接在第四导电插针345b上，使得第三发声单元330的负极引脚与第四导电插针345b电连接。
其中，继续参照图38所示，每个第二连接部3136呈“S”形结构，也即是说，每个第二连接部3136的两端的至少部分与中间部分的延伸方向不同，以优化走线层例如第三走线层b1和第四走线层b2的谐振问题。
参照图38所示，示例性地，可在每个第二延伸部例如第二延伸部3133a和第二延伸部3133a上形成有第二安装孔313d，第四导电插针穿设于第二安装孔313d内，且第四导电插针与第二安装孔313d的内壁电连接，例如，第四导电插针345a穿设于第二延伸部3133a的第二安装孔313d内，且第四导电插针345a与该第二安装孔313d的内壁电连接，第四导电插针345b穿设于第二延伸部3133b的第二安装孔313d内，且第四导电插针345b与该第二安装孔313d的内壁电连接。
其中，走线层的第二端在第二延伸部上裸露的铜片(例如第四焊盘)可位于第二安装孔313d的内缘一周，即该第四焊盘可以为环形铜片，该环形铜片环绕设置在第二安装孔313d的内缘，第四导电插针的外壁可焊接在该环形铜片上，从而实现第二延伸部上的走线层与第四导电插针电连接。
参照图38所示，例如，第三走线层b1的第二端在第二延伸部3133a上裸露形成环形的第四焊盘q1，第四导电插针345a焊接在该第四焊盘q1上，使得第三走线层b1与该第四导电插针345a电连接，第四走线层b2的第二端在第二延伸部3133b上裸露形成环形的第四焊盘q2，第四导电插针345b焊接在该第四焊盘q2上，使得第四走线层b2与该第四导电插针345b电连接。
通过在第二延伸部3133a和第二延伸部3133a上开设第二安装孔313d，并将第四导电插针345a和第四导电插针345b分别穿设于对应的该第二安装孔313d内，以便于第二延伸部与第四导电插针之间的电连接，例如，当第二延伸部3133a与第四导电插针345a焊接时，可沿着第二安装孔313d的内壁与第四导电插针345a的侧壁之间的环形间隙进行锡焊，使得第二延伸部3133a与第四导电插针345a之间的焊接更加简单快捷，且提高了第二延伸部3133a与第四导电插针345a之间的电连接可靠性。
继续参照图35和图39所示，在一些示例中，每个第三导电插件还可以包括第三导电件，每个第三导电插件上的第四导电插针和第五导电插针分别连接在第三导电件的两端。例如，第五导电插针346a通过第三导电件347a与第四导电插针345a电连接，第五导电插针346b通过第三导电件347b与第四导电插针345b电连接。
参照图35所示，其中，盆架340侧壁的外表面可具有第二接线区域340b，该第二接线区域340b位于两个第四导电插针345a(345b)例如第四导电插针345a与第四导电插针345b之间，两个第五导电插针346a(346b)例如第五导电插针346a和第五导电插针346b均位于第二接线区域340b内，即通过两个第三导电件和两个第五导电插针346a(346b)将两个第四导电插针345a(345b)355引至盆架340侧壁的第二接线区域340b，换句话说，将第三发声单元330的两个电极层从两个距离较远的第四导电插针引至距离较近的第五导 电插针上，这样，外界可只需一根电连接件例如柔性电路板便可直接与该第二接线区域340b内的两个第五导电插针346a(346b)焊接，便可向第三发声单元330的两个电极层施加电压，简化了第三发声单元330与外部电路之间的电连接结构，从而便于本申请实施例的扬声器300的整机应用。
在一些示例中，第二接线区域340b与第一接线区域340a可位于盆架340外侧壁的不同区域，例如，第二接线区域340b与第一接线区域340a可相背设置在盆架340的外侧壁上，这样，本申请实施例的扬声器300与外部电路电连接时，可需两根柔性电路板。其中一根柔性与第一接线区域340a上的两个第二导电插针342a(342b)和两个第三导电插针344a(344b)电连接，使得外部电路与第一发声单元310和第二发声单元320电连接。另一根柔性电路板与第二接线区域350b的两个第五导电插针346a(346b)电连接，使得外部电路与第三发声单元330电连接。
当然，本申请实施例并不排除第一接线区域340a和第二接线区域340b为同一个接线区域的示例，例如，当第一接线区域340a和第二接线区域340b为同一个接线区域时，外部可需一根柔性电路板，便可同时与第二导电插针、第三导电插针及第五导电插针电连接，从而可实现外部电路与三个发声单元的电连接，从而简化了扬声器300与外部电路的电连接工序，便于扬声器300的使用。
其中，第二接线区域340b与第二接线区域340b的具体设置方式一致，具体可参照第二接线区域350b的具体内容。
图40是本申请一实施例提供的又一种扬声器的结构示意图，图41是图40的另一视角的结构示意图，图42是图41中第二柔性电路板的结构示意图，图43是图41的剖视图。参照图40至图43所示，在另外一些示例中，第三发声单元330还可位于第一振膜3112与第二罩体360之间，即该微机电扬声器300可利用第一发声单元310的前腔空间，使得该第三发声单元330装配在扬声器300内。
在该示例中，可将该第三发声单元330固定在第二罩体360上，以提高该第三发声单元330的结构稳定性。例如，第三发声单元330的顶端可通过粘接等方式固定在第二罩体360的内表面。第二罩体360的内表面是指第二罩体360朝向第一振膜3112的表面。
参照图43所示，当第三发声单元330还可位于第一振膜3112与第二罩体360之间时，第三发声单元330的第三出音口331可与第二罩体360上的第一出音口314连通，例如，第三出音口331可正对第一出音口314，使得第三发声单元330的声音与第一发声单元310的声音均通过第一出音口314传出至扬声器300的外部。
具体设置时，第三发声单元330在第一发声单元310上投影区域位于第一发声单元310的中心区域，例如，当第三发声单元330位于第一发声单元310内时，该第三发声单元330位于第一发声单元310的中心区域，这样，可使得第三发声单元330的出音口例如第三出音口331位于第一发声单元310的中心区域，提高了高频发声单元的音质。
其中，第一发声单元310的第一出音口314可位于第一发声单元310的中心区域，第三出音口331正对第一出音口314，这样，当第一发声单元310的中心区域可位于扬声器300的中心区域时，第一发声单元310和第三发声单元330的出音口均可位于扬声器300的中心区域，从而提高了扬声器300的中频和高频的音质。
当第三发声单元330位于第一振膜3112与第二罩体360之间时，该第三发声单元330 可通过第二柔性电路板332与外部电路电连接。例如，第二柔性电路板332的一部分位于第二罩体360与第三发声单元330之间，且该第二柔性电路板332与第三发声单元330电连接，第二柔性电路板332的另一部分延伸至盆架340的外侧壁，以与外部电路电连接，例如，该第二柔性电路板332延伸至盆架340外侧壁的部分可与第四导电插针355电连接，该第四导电插针355用于与外部电路电连接，例如该第四导电插针355可通过第三导电件357和第五导电插针356与外部电路电连接。
参照图41所示，例如，第二柔性电路板332可包括第二本体部3321和连接在第二本体部3321外缘的两个分支部(分支部3322a和分支部3322b)。其中，第二本体部3321夹持在第二罩体360的内表面与第三发声单元330的顶端之间(参照图43所示)，且该第二本体部3321可与第三发声单元330电连接，分支部3322a和分支部3322b可分别与两个第四导电插针345a(345b)电连接(参照图41所示)，使得第二柔性电路板332将第三发声单元330的正负极分别引至两个第四导电插针345a(345b)355上，以便于第三发声单元330与外部电路电连接。
例如，分支部3322a与第四导电插针345a电连接，使得第三发声单元330的正极与第四导电插针345a电连接，分支部3322b与第四导电插针345b电连接，使得第三发声单元330的负极与第四导电插针345b电连接，从而使得第三发声单元330可通过两个第三导电插件3403a(3403b)与外部电路电连接。
可以理解的是，第二本体部3321上可具有第三避让孔313a，该第三避让孔313a分别与第三出音口331和第一出音口314连通，使得第三出音口331发出的声音依次经第三避让孔313a和第一出音口314传播至扬声器300的外部，最后可经电子设备例如耳机的出音嘴100a传播至用户耳道内。
参照图42所示，示例性地，可在每个分支部上形成有第三安装孔332a，第四导电插针穿设于第三安装孔332a内，且第四导电插针与第三安装孔332a的内壁电连接。例如，第四导电插针345a穿设于分支部3322a的第三安装孔332a内，且与该第三安装孔332a的内壁电连接，第四导电插针345b穿设于分支部3322b的第三安装孔332a内，且与该第三安装孔332a的内壁电连接。
通过在分支部上开设第三安装孔332a，并将相应地第四导电插针穿设于该第三安装孔332a内，以便于分支部与第四导电插针之间的电连接，例如，当分支部3322a与第四导电插针345a焊接时，可沿着第三安装孔332a的内壁与第四导电插针345a的侧壁之间的环形间隙进行锡焊，使得分支部3322a与第四导电插针345a之间的焊接更加简单快捷，且提高了分支部3322a与第四导电插针345a之间的电连接可靠性。
可以理解的是，第二柔性电路板332将第三发声单元330的正负极引出至第四导电插针355上的具体设置方式可直接参照上述示例中第一柔性电路板313将第三发声单元330的正负极引出至第四导电插针355的内容，此处不再赘述。
需要说明的是，本申请实施例的第三发声单元可以是高频发声单元，例如，可以是上述示例中的微机电发声单元，也可以是其他频段的发声单元，例如，可以是中频发声单元或者低频发声单元。
本申请实施例通过在电子设备内设置上述扬声器300，简化了电子设备的组装工序，提高了电子设备的装配效率。
本申请实施例通过在电子设备例如耳机内设置上述扬声器300，一方面，拓宽扬声器300的整体频宽，提高了电子设备例如耳机的音质，另一方面，简化了扬声器300的结构，从而简化了扬声器300的组装工序，减小了扬声器300的整体尺寸，节约了扬声器300在电子设备内的占用空间，从而为电子设备内其他元器件的安装提供合适的空间，换个角度讲，可使电子设备小型化。
图44是本申请一实施例提供的又一种扬声器的结构示意图。参照图44所示，本申请实施例的电子设备还可以包括反馈麦克400。
在一些示例中，对于反馈式降噪耳机，可在耳机前腔101内设置有反馈麦克400，该反馈麦克400又称残余噪声参考麦克(Residual Noise Reference Microphone)，在耳机后腔102例如耳杆内设置有前馈参考麦克(Feedforward Reference Microphone)。
在降噪处理过程中，前馈参考麦克快速接收到外部环境的噪声，并通过壳体100内的滤波器对该噪声进行拟合处理，使该噪声的相位转换为反向相位，并经扬声器进入耳道内，与耳道内直接接收到的正相噪声进行抵消，实现降噪效果。而在一些示例中，滤波器很难将全部噪声进行反相拟合处理。因此，当滤波器未将全部噪声进行反相拟合处理时，反馈麦克400便能够监测到残余信号，并将该残余信号反馈至前馈参考麦克，使滤波器对残余信号继续进行反相拟合处理，并再次传递至耳道内，如此反复，直至从滤波器传出至耳道内的噪声与耳道内直接接收到的正相噪声完全抵消为止。
其中，残余信号是指耳道内直接接收到的正相噪声与扬声器发出的反相噪声相互抵消后所剩余的正相噪声信号。
参照图44所示，本申请实施例中，第一发声单元310靠近耳机的出音嘴100a设置，则该反馈麦克400可位于扬声器300第一发声单元310内。示例性地，该反馈麦克400可设置在第一发声单元310的第四腔体304内，也即是说，反馈麦克400可位于第一振动系统311背向发声单元(例如第二发声单元320)的一侧。其中，该第四腔体304可以是耳机前腔101，也可以与耳机前腔101连通。
例如，反馈麦克400可以通过粘接等方式固定在第二罩体360的内表面，以提高反馈麦克400在扬声器300内的稳固性。
通过将反馈麦克400设置在第一发声单元310内，一方面可保证电子设备的主动降噪效果，另一方面，该反馈麦克400设置在第一发声单元310内，利用了第一发声单元310的内部空间，避免反馈麦克400占用电子设备例如耳机其他区域的空间，从而可为电子设备的其他区域的元器件设置提供合适的安装空间，换个角度讲，也可缩小电子设备的尺寸，实现电子设备的小型化。
参照图44所示，可以理解的是，在一些示例中，反馈麦克400可通过第二柔性电路板332和第三导电插件与外部电路电连接，例如，反馈麦克400可与第二柔性电路板332的第二本体部3321电连接，使得反馈麦克400与第三导电插件的第四导电插针电连接，从而通过第三导电插件的第五导电插针实现与外部电路的电连接，这样，电子设备例如耳机内的主板可通过外部电路与反馈麦克400电连接，以对反馈麦克400进行供电以及信号控制。
需要说明的是，反馈麦克400通过第二柔性电路板332和与外部电路电连接的具体设置方式可直接参照上述示例中第三发声单元330与外部电路电连接的具体内容，此处不再 赘述。
这里需要说明的是，本申请实施例涉及的数值和数值范围为近似值，受制造工艺的影响，可能会存在一定范围的误差，这部分误差本领域技术人员可以认为忽略不计。
以上，仅为本申请的具体实施例，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内；在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。因此，本申请的保护范围应以权利要求的保护范围为准。
应理解，在本申请中“电连接”可理解为元器件物理接触并电导通；也可理解为线路构造中不同元器件之间通过印制电路板(printed circuit board，PCB)铜箔或导线等可传输电信号的实体线路进行连接的形式。“连接”、“相连”均可以指一种机械连接关系或物理连接关系，即A与B连接或A与B相连可以指，A与B之间存在紧固的构件(如螺钉、螺栓、铆钉等)，或者A与B相互接触且A与B难以被分离。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，“连接”可以是可拆卸地连接，也可以是不可拆卸地连接；可以是直接接触连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。本申请实施例中所提到的方位用语，例如，“上”、“下”、“左”、“右”、“内”、“外”等，仅是参考附图的方向，因此，使用的方位用语是为了更好、更清楚地说明及理解本申请实施例，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。“多个”是指至少两个。
在本申请实施例中，“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。

Claims (23)

  1. 一种扬声器，其特征在于，包括第一振动系统、第二振动系统和磁路系统；
    所述磁路系统包括在所述磁路系统的厚度方向上相背的第一侧和第二侧，所述第一振动系统位于所述磁路系统的所述第一侧，所述第二振动系统位于所述磁路系统的所述第二侧，所述磁路系统被配置为提供所述第一振动系统和所述第二振动系统进行振动的磁源，所述第一振动系统与所述磁路系统形成为第一发声单元，所述第二振动系统与所述磁路系统形成为第二发声单元；
    所述第一侧与所述第二侧在所述厚度方向上相背的至少部分所述磁路系统磁性相反，且所述第一发声单元和所述第二发声单元的工作频段不同。
  2. 根据权利要求1所述的扬声器，其特征在于，所述磁路系统包括磁性件和支撑件；
    所述支撑件和所述磁性件沿所述厚度方向依次设置，所述第一振动系统的外缘支撑于所述支撑件背向所述磁性件的一侧，所述第二振动系统位于所述磁性件背向所述支撑件的一侧；
    所述磁性件上具有第一间隙，所述第二振动系统的至少部分插设于所述第一间隙内。
  3. 根据权利要求2所述的扬声器，其特征在于，所述磁性件包括中心磁铁和边磁铁，在第一截面，所述边磁铁套设在所述中心磁铁的外周，所述边磁铁与所述中心磁铁的之间形成有所述第一间隙，所述中心磁铁与所述边磁铁朝向所述第一振动系统的一端磁性相反；
    所述第一截面与所述磁性件的厚度方向垂直。
  4. 根据权利要求3所述的扬声器，其特征在于，所述第一振动系统包括第一音圈，所述第一音圈在所述磁路系统上的投影区域与所述第一间隙至少部分重叠。
  5. 根据权利要求2-4任一项所述的扬声器，其特征在于，所述磁路系统还包括位于所述磁性件与所述第二振动系统之间的华司；
    所述华司包括中心华司和边华司，在第二截面，所述边华司套设在所述中心华司的外周，所述中心华司的至少部分面对所述磁性件的中心磁铁，所述边华司的至少部分面对所述磁性件的边磁铁，且所述中心华司的外缘与所述边华司的内缘之间形成有第二间隙，所述第二间隙与所述第一间隙连通，所述第二振动系统的至少部分插设于所述第一间隙与所述第二间隙内；
    所述第二截面与所述磁性件的厚度方向垂直。
  6. 根据权利要求1-5任一项所述的扬声器，其特征在于，所述磁路系统朝向所述第一振动系统的一侧形成有凹腔，所述第一振动系统、所述磁路系统的表面及所述凹腔的内壁之间形成第一腔体。
  7. 根据权利要求6所述的扬声器，其特征在于，所述第二振动系统包括第二音圈和第二振膜，所述第二音圈的至少部分插设于所述磁路系统的第一磁间隙和第二磁间隙内，所述第二振膜位于所述磁路系统背向所述第一振动系统的一侧，所述第二振膜与所述磁路系统之间形成第二腔体，所述凹腔与所述第二腔体之间密封设置。
  8. 根据权利要求7所述的扬声器，其特征在于，所述凹腔贯穿至所述磁路系统的磁性件朝向华司的一侧表面，并在所述磁路系统中形成盲孔。
  9. 根据权利要求7所述的扬声器，其特征在于，所述凹腔贯穿至所述磁路系统中华司 朝向所述第二腔体的一侧，并在所述磁路系统中形成通孔。
  10. 根据权利要求9所述的扬声器，其特征在于，所述通孔朝向所述第二腔体的一端盖设有阻尼网布，以分隔所述凹腔与所述第二腔体。
  11. 根据权利要求9所述的扬声器，其特征在于，所述第二发声单元中，至少在所述第二腔体内设有密封件，所述密封件的两端分别与所述磁路系统和所述第二振膜密封连接；
    所述第二振膜背向所述磁路系统的一侧形成有第三腔体，所述密封件内具有导通孔，所述导通孔的两端分别与所述凹腔和所述第三腔体连通。
  12. 根据权利要求6-11任一项所述的扬声器，其特征在于，所述凹腔位于所述磁路系统的中心区域；
    其中，所述第一振动系统的第一音圈在所述磁路系统上的投影位于所述中心区域的外周。
  13. 根据权利要求6-12任一项所述的扬声器，其特征在于，所述凹腔内填充有吸音件。
  14. 根据权利要求1-13任一项所述的扬声器，其特征在于，还包括盆架和柔性电路板；
    所述盆架具有侧壁，所述第一发声单元、第二发声单元即所述磁路系统的至少部分位于所述盆架的侧壁围成的内腔中，所述盆架的侧壁内具有两个第一导电插件，每个所述第一导电插件的第一端具有第一导电插针，每个所述第一导电插件的第二端具有第二导电插针，每个所述第一导电插针和每个所述第二导电插针均裸露于所述盆架侧壁的外表面；
    所述第一振动系统的第一音圈与所述柔性电路板沿所述盆架的高度方向层叠设置，且每个所述第二导电插针通过所述柔性电路板与所述第一音圈电连接。
  15. 根据权利要求14所述的扬声器，其特征在于，所述盆架的侧壁内还具有两个第二导电插件，两个所述第二导电插件的第一端位于所述盆架内、且与所述第二振动系统的第二音圈电连接，两个所述第二导电插件的第二端具有第三导电插针，所述第三导电插针裸露于所述盆架侧壁的外表面；
    所述盆架侧壁的外表面具有第一接线区域，所述第一接线区域位于两个所述第一导电插针之间，两个所述第二导电插针和两个所述第三导电插针均位于所述第一接线区域上。
  16. 根据权利要求1-15任一项所述的扬声器，其特征在于，所述扬声器还包括第一副磁；
    所述第一副磁位于所述发声单元内，所述第二振动系统的第二音圈位于所述第一副磁的第一副磁场中，且所述第一副磁场穿过所述第二音圈的磁场方向与所述磁路系统作用在所述第二音圈上的磁场方向相同。
  17. 根据权利要求16所述的扬声器，其特征在于，所述扬声器还包括第一罩体；
    所述第一罩体罩设在盆架设有所述发声单元的一端开口上，所述第一副磁位于所述第一罩体朝向所述第二音圈的一侧表面。
  18. 根据权利要求1-17任一项所述的扬声器，其特征在于，所述扬声器还包括第二副磁；
    所述第二副磁位于所述磁路系统朝向所述第一振动系统的一侧，所述第一振动系统的第一音圈位于所述第二副磁的第二副磁场中，且所述第二副磁场穿过所述第一音圈的磁场方向与所述磁路系统作用在所述第一音圈上的磁场方向相同。
  19. 根据权利要求18所述的扬声器，其特征在于，所述扬声器还包括第二罩体，所 述第二罩体盖设在盆架设有所述第一振动系统的一端开口上，所述第二副磁位于所述第二罩体朝向所述第一振动系统的一侧表面。
  20. 根据权利要求1-19任一项所述的扬声器，其特征在于，所述扬声器还包括第三发声单元；
    所述第三发声单元与所述第一发声单元位于所述第二发声单元的同侧；
    所述第三发声单元的工作频段大于所述第一发声单元的工作频段大于所述第二发声单元的工作频段。
  21. 一种电子设备，其特征在于，包括壳体和至少一个如权利要求1-20任一项所述的扬声器；
    所述扬声器位于所述壳体的内腔中。
  22. 根据权利要求21所述的电子设备，其特征在于，所述电子设备还包括反馈麦克；
    所述反馈麦克位于所述扬声器的第一振动系统背向第二发声单元的一侧。
  23. 根据权利要求21或22所述的电子设备，其特征在于，所述电子设备为耳机。
PCT/CN2022/138938 2022-02-25 2022-12-14 扬声器及电子设备 WO2023160141A1 (zh)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004048487A (ja) * 2002-07-12 2004-02-12 Mitsubishi Electric Corp 音響装置及びその製造方法
CN205793307U (zh) * 2016-05-31 2016-12-07 歌尔股份有限公司 扬声器
CN108574918A (zh) * 2018-07-19 2018-09-25 陈新得 一种两分频双磁路扬声器
CN113286232A (zh) * 2021-05-26 2021-08-20 东莞立讯精密工业有限公司 扬声器结构
WO2021174576A1 (zh) * 2020-03-05 2021-09-10 瑞声声学科技(深圳)有限公司 发声器件
CN214851805U (zh) * 2021-03-19 2021-11-23 益阳市信维声学科技有限公司 一种双面发声的微型扬声器
WO2022006791A1 (zh) * 2020-07-08 2022-01-13 瑞声声学科技(深圳)有限公司 扬声器箱
CN114697825A (zh) * 2022-02-15 2022-07-01 华为技术有限公司 扬声器及电子设备

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004048487A (ja) * 2002-07-12 2004-02-12 Mitsubishi Electric Corp 音響装置及びその製造方法
CN205793307U (zh) * 2016-05-31 2016-12-07 歌尔股份有限公司 扬声器
CN108574918A (zh) * 2018-07-19 2018-09-25 陈新得 一种两分频双磁路扬声器
WO2021174576A1 (zh) * 2020-03-05 2021-09-10 瑞声声学科技(深圳)有限公司 发声器件
WO2022006791A1 (zh) * 2020-07-08 2022-01-13 瑞声声学科技(深圳)有限公司 扬声器箱
CN214851805U (zh) * 2021-03-19 2021-11-23 益阳市信维声学科技有限公司 一种双面发声的微型扬声器
CN113286232A (zh) * 2021-05-26 2021-08-20 东莞立讯精密工业有限公司 扬声器结构
CN114697825A (zh) * 2022-02-15 2022-07-01 华为技术有限公司 扬声器及电子设备

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