WO2023155527A1 - 背光模组及显示装置 - Google Patents

背光模组及显示装置 Download PDF

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Publication number
WO2023155527A1
WO2023155527A1 PCT/CN2022/134257 CN2022134257W WO2023155527A1 WO 2023155527 A1 WO2023155527 A1 WO 2023155527A1 CN 2022134257 W CN2022134257 W CN 2022134257W WO 2023155527 A1 WO2023155527 A1 WO 2023155527A1
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WO
WIPO (PCT)
Prior art keywords
backlight module
led chip
adhesive layer
module according
prism
Prior art date
Application number
PCT/CN2022/134257
Other languages
English (en)
French (fr)
Inventor
叶旭华
杨宇琦
朱法栋
李健林
Original Assignee
惠州视维新技术有限公司
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Publication of WO2023155527A1 publication Critical patent/WO2023155527A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133611—Direct backlight including means for improving the brightness uniformity

Definitions

  • the present application belongs to the field of display technology, and more specifically, relates to a backlight module and a display device.
  • liquid crystal displays are widely used in information communication tools such as TVs, smart phones, and tablet computers.
  • the liquid crystal module of the liquid crystal display does not emit light itself, but the backlight module provides the light source for the liquid crystal module.
  • LCD backlight modules mainly include direct-type backlight modules and side-type backlight modules, among which the Mini
  • the direct-lit backlight module of LED lights has the advantages of high brightness, zonal light control, and high contrast, and has gradually become the mainstream of the market.
  • the LED lamp beads due to the limited light angle of the Mini LED lamp beads, it is necessary to arrange the LED lamp beads densely and reserve a large mixing distance OD (Optical Distance), and at the same time with a thicker diffusion plate, the overall thickness of the backlight module is thicker, and the cost is high, so it is difficult to achieve a backlight module with a thinner thickness and uniform light output.
  • OD Optical Distance
  • Embodiments of the present application provide a backlight module and a display device.
  • An embodiment of the present application provides a backlight module, including:
  • LED chips are arranged on the substrate;
  • the optical film is arranged on the side of the LED chip away from the substrate, and a plurality of first prism structures are formed on the side of the optical film facing the LED chip.
  • the height of the first prism structure is between 30 microns and 50 microns.
  • the heights of the plurality of first prism structures are different.
  • a plurality of the first prism structures are arranged at intervals, and the distance between adjacent first prism structures is between 30 microns and 70 microns.
  • a plurality of second prism structures are formed on the side of the optical film facing away from the LED chip.
  • the optical film includes a base body, the side of the base body facing the LED chip is formed with the first prism structure, and the side of the base body facing away from the first prism structure is formed with multiple the second prism structure.
  • the prism section of the first prism structure is in the shape of an inverted triangle
  • the prism interface of the second prism structure is in the shape of an inverted triangle
  • the pitch between adjacent second prism structures is the same as the pitch between adjacent first prism structures.
  • the light emitted by the LED chip is blue light.
  • the surface of the first prism structure is provided with a scattering layer, and the scattering layer is formed by providing a rough surface or coating a scattering ink on the surface of the first prism structure.
  • the backlight module further includes a filter film, the filter film is arranged between the optical film and the LED chip, and the filter film allows red light, green light and incident The blue light whose angle is greater than or equal to the preset angle passes through, and the blue light whose incident angle is smaller than the preset angle is reflected.
  • the backlight module further includes a quantum dot film, and the quantum dot film is disposed on a side of the optical film away from the LED chip.
  • the backlight module further includes a first packaging adhesive layer covering the LED chips.
  • the first packaging adhesive layer also covers the substrate.
  • the thickness of the first sealing layer is higher than the height of the LED chip.
  • the shape of the first sealing layer is cylindrical.
  • the backlight module further includes a second packaging adhesive layer, the second packaging adhesive layer is disposed on the first packaging adhesive layer, and the second packaging adhesive layer is facing the LED chip .
  • the shape of the second packaging adhesive layer is a convex lens shape.
  • the backlight module further includes a reflective layer disposed between the first encapsulant layer and the substrate.
  • An embodiment of the present application further provides a display device, the display device comprising the backlight module described in any one of the foregoing.
  • an optical film is provided on the side of the LED chip away from the substrate, and a first prism structure is formed on the side of the optical film facing the LED chip, and the light emitted by the LED chip passes through the first prism structure. Diffusion occurs in a prism structure to increase the light mixing effect, improve the brightness uniformity of the backlight module, and at the same time reduce the light mixing distance, which is beneficial to realize the thinning of the backlight module.
  • FIG. 1 is a schematic diagram of a first structure of a backlight module provided by an embodiment of the present application.
  • FIG. 2 is a partially enlarged schematic diagram of part A shown in FIG. 1 .
  • FIG. 3 is a schematic structural diagram of the second embodiment of the optical film shown in FIG. 1 .
  • FIG. 4 is a schematic structural diagram of a third embodiment of the optical film shown in FIG. 1 .
  • FIG. 5 is a schematic diagram of the second structure of the backlight module provided by the embodiment of the present application.
  • FIG. 6 is a schematic diagram of the third structure of the backlight module provided by the embodiment of the present application.
  • FIG. 7 is a schematic diagram of light filtering of the filter film shown in FIG. 6 .
  • FIG. 8 is a schematic diagram of a fourth structure of a backlight module provided by an embodiment of the present application.
  • FIG. 9 is a simulation diagram of the light output effect of the backlight module provided by the embodiment of the present application.
  • FIG. 10 is a simulation diagram of the light emitting effect of a conventional backlight module.
  • the embodiment of the present application provides a backlight module and a display device to solve the problems of the existing backlight module LED lamp beads with small light emission angle and poor light mixing effect, resulting in uneven brightness of the backlight module and difficulty in realizing the thinning of the backlight module. question. It will be described below in conjunction with the accompanying drawings.
  • FIG. 1 is a schematic diagram of a first structure of a backlight module provided by an embodiment of the present application.
  • the embodiment of the present application provides a backlight module, including a substrate 10 , an LED chip 20 , an encapsulation adhesive layer 30 and an optical film 40 .
  • the LED chip 20 is disposed on the substrate 10
  • the encapsulation adhesive layer 30 covers the LED chip 20 and the substrate 10
  • the optical film 40 is disposed on the side of the encapsulation adhesive layer 30 away from the substrate 10, and the optical film 40 faces one side of the LED chip 20.
  • a first prism structure 41 is formed on the side.
  • the substrate 10 may be a PCB board or a flexible circuit board. Circuits are arranged on the substrate 10 , and the LED chip 20 is connected to the substrate 10 . Specifically, the LED chip 20 is disposed on the surface of the substrate 10 and electrically connected to the substrate 10 , and an external circuit can provide power to the LED chip 20 through the substrate 10 to make the LED chip 20 emit light.
  • the LED chip 20 is used as the light source of the backlight module.
  • the LED chip 20 is a Mini LED chip 20, and the light emitting mode of the LED chip 20 is top light emission.
  • a plurality of LED chips 20 are arranged on the substrate 10, and the plurality of LED chips 20 are arranged on the substrate 10 in an array arrangement, or arranged on the substrate 10 in other regular or irregular ways, which is not specifically limited in this application .
  • the LED chips 20 are arranged on the surface of the substrate 10 in an arrangement of M rows*N columns, and both M and N are integers not less than 2.
  • the optical film 40 is disposed on the side of the encapsulation adhesive layer 30 away from the substrate 10, the optical film 40 includes a base 42, and a first prism structure 41 is formed on the side of the base 42 facing the LED chip 20, the first The prism structure 41 is equivalent to the light incident surface of the optical film 40 .
  • the area of the light incident surface of the optical film 40 can be increased, and the light emitted by the LED chip 20 is refracted and diffused when passing through the first prism structure 41, and the first prism
  • the uniform light effect of the structure 41 can improve the brightness uniformity of the backlight module.
  • FIG. 2 is a partially enlarged schematic diagram of part A shown in FIG. 1 .
  • the first prism structure 41 protrudes from the substrate 42, and its prism cross-section is in the shape of an inverted triangle.
  • the top of the first prism structure 41 faces the encapsulation adhesive layer 30, and the vertical distance H1 from the top to the substrate 42 is between 30 microns and 50 microns. It is understood that the height H1 of the first prism structure 41 ranges from 30 microns to 50 microns.
  • the vertical distance H1 from the tip of the first prism structure 41 to the base 42 may be any one of 30 microns, 40 microns, 45 microns, and 50 microns.
  • the first prism structures 41 are arranged at intervals, and the pitch P1 between adjacent first prism structures 41 is between 30 microns and 70 microns.
  • the distance between adjacent first prism structures 41 may be any one of 30 microns, 50 microns, 60 microns, and 70 microns.
  • H1 and P1 are related to factors such as LED light intensity distribution, the distance between adjacent LED chips 20, and the refractive index of materials used.
  • the values of H1 and P1 are adjusted according to factors such as power ratio, so that the luminous effect of the backlight module meets the requirements of the display device.
  • FIG. 3 is a schematic structural diagram of a second embodiment of the optical film 40 shown in FIG. 1 .
  • the corners of the first prism structure 41 may be partially rounded.
  • the optical film 40 is made of a transparent material, which does not affect the light transmittance.
  • the base 42 of the optical film 40 can be made of PET (polyethylene terephthalate), PC (polycarbonate) or PMMA (polymethyl methacrylate).
  • the thickness of the base body 42 ranges from 0.1 mm to 2.0 mm, preferably, the thickness of the base body 42 is 0.25 mm or 0.5 mm.
  • the first prism structure 41 is formed by coating UV glue on the substrate 42 , and then molded by embossing, and cured by ultraviolet light to form the first prism structure 41 .
  • the first prism structure 41 can also be integrally injection molded with the base 42, and the base 42 of the optical film 40 obtained in this way is integral with the first prism structure 41, and the first prism structure 41 and the first prism structure 41 are integrated.
  • the material of the substrate 42 is the same, for example, PET, PC or PMMA.
  • a plurality of second prism structures 43 are formed on the side of the base body 42 of the optical film 40 away from the first prism structure 41, and the second prism structures 43 are equivalent to optical The light-emitting surface of the diaphragm 40 . It can also be understood that a plurality of second prism structures 43 are formed on the side of the optical film 40 away from the LED chip 20 .
  • the second prism structure 43 is disposed opposite to the first prism structure 41 and is respectively located on two sides of the base body 42 .
  • the second prism structure 43 protrudes from the base body 42 , and its prism cross-section is triangular.
  • the vertical distance H2 from the tip of the second prism structure 43 to the base 42 may be the same as that of the first prism structure 41 or different from the first prism structure 41 .
  • the vertical distance H2 from the tip of the second prism structure 43 to the base 42 may be any one of 30 microns, 40 microns, 45 microns, and 50 microns.
  • the top of the second prism structure 43 is opposite to the top of the first prism.
  • the top of the second prism structure 43 faces the top of the first prism structure 41 .
  • a plurality of second prism structures 43 are arranged at intervals, and the pitch P2 of adjacent second prism structures 43 may be the same as the pitch P1 of the first prisms, or may be different from the pitch of the first prisms.
  • the pitch P2 of adjacent second prism structures 43 is the same as the pitch P1 of the first prisms.
  • the second prism structure 43 is formed by coating UV glue on the substrate 42 , and then embossing with a mold, and curing by ultraviolet light to form the second prism structure 43 .
  • the second prism structure 43 can also be integrally injection molded with the base 42, and the base 42 of the optical film 40 obtained in this way is integrated with the second prism structure 43, and the second prism structure 43 is integrated with the second prism structure 43.
  • the material of the substrate 42 is the same, for example, PET, PC or PMMA.
  • the second prism structure 43 has a better function of converging light, and can gather and refract the light passing through the substrate 42. to obtain high-illuminance light, thereby increasing the brightness of the backlight module.
  • first prism structure 41 and the second prism structure 43 are respectively located on two sides of the base 42 , and the top of the first prism structure 41 is opposite to the top of the second prism structure 43 .
  • the first prism structure 41 can diffuse and refract the light to make the light uniform; and when the light passes through the matrix 42 and passes through the second prism structure 43 , the second prism structure 43 can converge and refract the light. Therefore, the light finally emitted from the optical film 40 can obtain high-brightness and uniform light, improve the light mixing effect of the light emitted by the LED chip, and help realize a backlight module with high brightness and uniform light emission.
  • the surface of the first prism structure 41 may also be provided with a scattering layer, which has a light scattering function, so as to further diffuse and evenly light the light emitted by the LED chip 20 .
  • the scattering layer can be formed by setting a rough surface on the surface of the first prism structure 41 or coating a scattering ink.
  • the first prism structure 41 and the second prism structure 43 are respectively provided on both sides of the base 42 of the optical film 40, which can achieve uniform light and improve brightness, and can reduce confusion. Light distance, realize ultra-thin backlight module.
  • the optical film 40 can replace the diffuser plate, or cooperate with a diffuser plate with a lower thickness, so as to reduce the overall thickness and cost of the backlight module.
  • the thickness of the diffusion plate of the conventional backlight module is 2.0 mm to 3.0 mm, while the backlight module of the embodiment of the present application adopts the optical film 40, and the thickness of the diffusion plate can be reduced to 1.0 mm, greatly The thickness of the backlight module is reduced.
  • the backlight module of the embodiment of the present application can also eliminate the diffusion plate depending on the subjective situation, further reduce the overall thickness of the backlight module, and realize the thinning of the backlight module.
  • a first prism structure 41 is provided on the side of the optical film 40 facing the LED chip 20 , and the heights of the first prism structures 41 are different. It can also be understood that the vertical distances from the apex of the first prism structure 41 to the base 42 are different.
  • the light diffusion effect of the first prism structures 41 can be further improved, which is beneficial to improve the light uniformity effect of the optical film 40 .
  • the vertical distances from the top of the first prism structure 41 to the substrate 42 are different, it is also possible to prevent the first prism structure 41 from being adsorbed on other transparent devices or films between the optical film 40 and the LED chip 20. Together, they affect the diffusion effect when the light emitted by the LED passes through the first prism structure 41 .
  • an encapsulation adhesive layer 30 is disposed on the substrate 10 , and the encapsulation adhesive layer 30 and the LED chip 20 are located on the same side of the substrate 10 .
  • the packaging adhesive layer 30 is a transparent adhesive layer.
  • the encapsulation adhesive layer 30 is made of transparent material, especially highly transparent material, and its light transmittance is preferably 90% or above.
  • the material of the encapsulation adhesive layer 30 can be selected from silica gel, epoxy adhesive or rubber.
  • phosphor particles may also be arranged in the encapsulation layer 30 , and the phosphor particles are uniformly dispersed in the encapsulation layer 30 . Since the light emitted by the LED chip 20 is generally blue light, the light emitted by the LED chip 20 is converted into white light by the fluorescent powder particles in the encapsulation layer 30 . It should be noted that the matching of the LED chip 20 into white light through phosphor particles is a prior art, and will not be repeated in this application.
  • the packaging adhesive layer 30 includes a first packaging adhesive layer 31 and a second packaging adhesive layer 32 .
  • the first encapsulating adhesive layer 31 covers the LED chip 20 and the substrate 10 , it can also be understood that the first encapsulating adhesive layer 31 covers the entire surface of the substrate 10 , and the thickness of the first encapsulating adhesive layer 31 is higher than the height of the LED chip 20 .
  • the second packaging adhesive layer 32 is disposed on the first packaging adhesive layer 31 , and the second packaging adhesive layer 32 faces the LED chip 20 .
  • the first packaging adhesive layer 31 can effectively maintain the airtightness of the LED chip 20 and protect the LED chip 20 from the influence of humidity and temperature in the surrounding environment, and at the same time, the first packaging adhesive layer 31 can also play a buffering role. , effectively preventing the LED chip 20 from being damaged by mechanical vibration, external impact or causing changes in characteristics to affect its luminous performance.
  • the second packaging adhesive layer 32 is disposed on the first packaging adhesive layer 31 , and the second packaging adhesive layer 32 faces the LED chip 20 .
  • the shape of the second encapsulant layer 32 is an ellipsoid, similar to a convex lens. Since the second encapsulation adhesive layer 32 is facing the position of the LED chip 20 , an alignment operation is required when dispensing the second encapsulation adhesive layer 32 .
  • the diffusion of the light emitted by the LED chip 20 through the first encapsulating adhesive layer 31 and the second encapsulating adhesive layer 32 can increase the light emitting angle and light mixing uniformity of the LED chip 20 .
  • the convex lens shape of the second packaging adhesive layer 32 can weaken the light intensity directly above the LED chip 20 after the light emitted from the surface of the first packaging adhesive layer 31 is scattered and blocked by the convex lens of the second packaging adhesive layer 32, and increase The surrounding brightness further increases the light emitting angle of the LED chip 20 and the uniformity of light mixing to achieve a relatively uniform surface light source, thereby reducing the number of LED chips 20 and reducing costs.
  • the light mixing distance can be shortened to achieve a light and thin backlight module change.
  • the first encapsulating adhesive layer 31 covers the entire surface of the substrate 10, the thickness of the first encapsulating adhesive layer 31 is preferably 0.44 mm, the second encapsulating adhesive layer 32 is arranged on the first encapsulating adhesive layer 31, and the second encapsulating adhesive layer 32
  • the height of the second packaging adhesive layer 32 is preferably 0.76 mm, and the diameter of the bottom surface of the convex lens is preferably 2.4 mm. It should be noted that the projected area of the convex lens on the substrate 10 needs to be larger than the size of the LED chip 20 .
  • the glue itself of the first encapsulation adhesive layer 31 and the second encapsulation adhesive layer 32 can be used as a support, and no additional support columns are required (conventional direct-type backlight modules generally require support columns to increase light mixing. distance), so the thickness of the backlight module can be reduced, which is beneficial to realize the thinning of the backlight module.
  • FIG. 5 is a schematic diagram of a second structure of the backlight module provided by the embodiment of the present application.
  • the first encapsulation adhesive layer 31 only covers the position of the LED chip 20 , so as to reduce the coverage area of the first encapsulation adhesive layer 31 , thereby reducing the amount of glue used to save cost.
  • the first packaging adhesive layer 31 is in the shape of a cylinder, and the first packaging adhesive layer 31 completely covers the LED chip 20 .
  • the second encapsulating adhesive layer 32 is disposed on the first encapsulating adhesive layer 31 , and the shape of the second encapsulating adhesive layer 32 is an ellipsoid, similar to a convex lens. Since the first encapsulating adhesive layer 31 and the second encapsulating adhesive layer 32 are facing the position of the LED chip 20 , an alignment operation is required when dispensing the first encapsulating adhesive layer 31 and the second encapsulating adhesive layer 32 .
  • the first packaging adhesive layer 31 covers the position of the LED chip 20, the height of the cylinder of the first packaging adhesive layer 31 is preferably 0.44 mm, and the diameter of the cylinder is preferably 2.4 mm; the second packaging adhesive layer 32 is arranged on the first packaging adhesive layer 31.
  • the second encapsulation adhesive layer 32 is in the shape of a convex lens, the height of the second encapsulation adhesive layer 32 is preferably 0.76 mm, and the diameter of the bottom surface of the convex lens is preferably 2.4 mm.
  • the light emitted by the LED chip 20 diffuses through the first encapsulation adhesive layer 31 and the second encapsulation adhesive layer 32 , which can increase the light emission angle and light mixing uniformity of the LED chip 20 .
  • the convex lens shape of the second packaging adhesive layer 32 can weaken the light intensity directly above the LED chip 20 after the light emitted from the surface of the first packaging adhesive layer 31 is scattered and blocked by the convex lens of the second packaging adhesive layer 32, and increase
  • the surrounding brightness further increases the light emitting angle of the LED chip 20 and the uniformity of light mixing to achieve a relatively uniform surface light source, thereby reducing the number of LED chips 20 and reducing costs.
  • the light mixing distance can be shortened to achieve a light and thin backlight module change.
  • FIG. 6 is a schematic diagram of a third structure of a backlight module provided by an embodiment of the present application
  • FIG. 7 is a schematic diagram of light filtering by the filter film 50 shown in FIG. 6 .
  • the backlight module provided by the embodiment of the present application includes a substrate 10 , an LED chip 20 , a first packaging adhesive layer 31 , a second packaging adhesive layer 32 , a filter film 50 , an optical film 40 and a quantum dot film 60 .
  • the LED chip 20 is disposed on the substrate 10; the first encapsulation adhesive layer 31 covers the LED chip 20 and the substrate 10; the second encapsulation adhesive layer 32 is disposed on the first encapsulation adhesive layer 31, and faces the LED chip 20; the optical film
  • the sheet 40 is arranged on the side of the second packaging adhesive layer 32 away from the first packaging adhesive layer 31; the filter film 50 is arranged between the optical film 40 and the second packaging adhesive layer 32; the quantum dot film 60 and the optical film 40 are stacked, and the quantum dot film 60 is located on the side of the optical film 40 away from the filter film 50 .
  • the side of the optical film 40 facing the filter film 50 is provided with a first prism structure 41
  • the side of the optical film 40 facing the quantum dot film 60 is provided with a second prism structure 43 .
  • the filter film 50 allows red light, green light, and blue light whose incident angle ⁇ is greater than or equal to a predetermined angle to pass through, and reflects blue light whose incident angle ⁇ is smaller than the predetermined angle.
  • the light emitted by the LED chip 20 is blue light.
  • most of the blue light whose incident angle ⁇ is greater than or equal to 60 degrees can pass through the filter film 50 , while most of the blue light whose incident angle is less than 60 degrees is reflected by the filter film 50 .
  • the LED chip 20 emits blue light
  • the filter film 50 the blue light transmittance directly above the LED chip 20 can be reduced to prevent the brightness directly above the LED chip 20 from being too bright, and the brightness around the LED chip 20 can be increased to achieve uniformity. light effect.
  • Quantum dot film 60 is set on the side of optical film 40 away from filter film 50, blue light can excite red quantum dot and green quantum dot in quantum dot film 60 to emit red light and green light, and then red, green light and blue light After mixing, it forms white light, which provides a uniform light source for the backlight module.
  • the backlight module further includes: a reflective layer 70 disposed between the substrate 10 and the first packaging adhesive layer 31 . It can be understood that the reflective layer 70 is disposed on the substrate 10 , the reflective layer 70 is hollowed out at the position of the LED chip 20 to expose the LED chip 20 , and the first packaging adhesive layer 31 covers the reflective layer 70 and the LED chip 20 .
  • the reflective layer 70 may be a reflective sheet pasted on the side of the substrate 10 facing the LED chip 20 or a sprayed reflective coating. Wherein, both the reflective sheet and the reflective coating can be made of materials such as metal, which is not specifically limited in this application.
  • the reflective surface of the reflective layer 70 may be a mirror surface or a fog surface, which needs to be specifically designed according to practical applications.
  • the brightness of the surface light source of the backlight module can be further improved, the utilization rate of the light emitted by the LED chip 20 can be maximized, and the uniformity of light mixing can be improved.
  • the light leakage from the LED chip 20 can also enter the encapsulation adhesive layer 30 again after being reflected by the reflective layer 70 , which can prevent the light leakage from the LED chip 20 and further improve the performance of the backlight module.
  • FIG. 9 is a simulation diagram of the light output effect of the backlight module provided by the embodiment of the present application
  • FIG. 10 is a simulation diagram of the light output effect of a conventional backlight module.
  • the optical film 40 and the encapsulation adhesive layer 30 of the backlight module provided by the embodiment of the present application can more effectively disperse the light when performing optical simulation, so that the light emitted by the LED chip 20 can express It is more uniform and can realize the brightness uniformity of the backlight module.
  • An embodiment of the present application further provides a display device, including the above-mentioned backlight module, and the backlight module provides a backlight source for the display device.
  • the display device may be any product or component with a display function such as a liquid crystal display panel, electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, and the like.
  • the optical film 40 is provided on the side of the LED chip 20 away from the substrate 10, and the side of the optical film 40 facing the LED chip 20 is formed with a first prism structure 41, and the LED The light emitted by the chip 20 diffuses when passing through the first prism structure 41 to increase the light mixing effect, improve the brightness uniformity of the backlight module, and at the same time reduce the light mixing distance, which is beneficial to realize the thinning of the backlight module.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • features defined as “first” and “second” may explicitly or implicitly include one or more features.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种背光模组，包括：基板（10）；LED芯片（20），设置于基板（10）上；光学膜片（40），设置于LED芯片（20）背离基板（10）的一侧，光学膜片（40）朝向LED芯片（20）的一侧形成有第一棱镜结构（41）。

Description

背光模组及显示装置
本申请要求于2022年02月18日提交中国专利局、申请号为202210150230.0、申请名称为“背光模组及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请属于显示技术领域，更具体的说，涉及一种背光模组及显示装置。
 背景技术
液晶显示器作为用户与信息的沟通界面，在电视、智能手机、平板电脑等信息沟通工具中被广泛使用，液晶显示器的液晶模组本身不发光，而是由背光模组为液晶模组提供光源。液晶显示器的背光模组主要包括直下式背光模组和侧入式背光模组，其中搭配Mini LED灯的直下式背光模组具有高亮度、可分区控光、对比度高等优点，逐渐成为市场的主流。
 技术问题
现有的Mini LED背光模组，由于Mini LED灯珠发光角度有限，需要将LED灯珠设置的较为密集，并预留较大的混光距离OD (Optical Distance)，同时搭配较厚的扩散板，导致背光模组的整体厚度较厚，且成本高，难以实现厚度较薄且出光均匀的背光模组。
 技术解决方案
本申请实施例提供一种背光模组及显示装置。
本申请实施例提供一种背光模组，包括：
基板；
LED芯片，设置于所述基板上；
光学膜片，设置于所述LED芯片背离所述基板的一侧，所述光学膜片朝向所述LED芯片的一侧形成有多个第一棱镜结构。
在一些实施例中，所述第一棱镜结构的高度为30微米~50微米之间。
在一些实施例中，多个所述第一棱镜结构的高度各不相同。
在一些实施例中，多个所述第一棱镜结构间隔设置，相邻所述第一棱镜结构的间距为30微米~70微米之间。
在一些实施例中，所述光学膜片背离所述LED芯片的一侧形成有多个第二棱镜结构。
在一些实施例中，所述光学膜片包括基体，所述基体朝向所述LED芯片的一侧形成有所述第一棱镜结构，所述基体背离所述第一棱镜结构的一侧形成有多个所述第二棱镜结构。
在一些实施例中，所述第一棱镜结构的棱镜截面呈倒三角形状，且所述第二棱镜结构的棱镜界面呈倒三角形状。
在一些实施例中，相邻的所述第二棱镜结构的间距与相邻的所述第一棱镜结构的间距相同。
在一些实施例中，所述LED芯片发出的光线为蓝光。
在一些实施例中，所述第一棱镜结构的表面设置有散射层，所述散射层通过在所述第一棱镜结构的表面上设置粗糙面或涂覆散射油墨形成。
在一些实施例中，所述背光模组还包括滤光膜，所述滤光膜设置在所述光学膜片与所述LED芯片之间，所述滤光膜允许红光、绿光以及入射角大于等于预设角度的蓝光通过，且反射入射角小于预设角度的蓝光。
在一些实施例中，所述背光模组还包括量子点膜片，所述量子点膜片设置于所述光学膜片背离所述LED芯片的一侧。
在一些实施例中，所述背光模组还包括第一封装胶层，所述第一封装胶层覆盖所述LED芯片。
在一些实施例中，所述第一封装胶层还覆盖所述基板。
在一些实施例中，所述第一封胶层的厚度高于所述LED芯片的高度。
在一些实施例中，所述第一封胶层的形状呈圆柱体状。
在一些实施例中，所述背光模组还包括第二封装胶层，所述第二封装胶层设置于所述第一封装胶层上，所述第二封装胶层正对所述LED芯片。
在一些实施例中，所述第二封装胶层的形状呈凸透镜形状。
在一些实施例中，所述背光模组还包括反射层，所述反射层设置于所述第一封装胶层与所述基板之间。
本申请实施例还提供一种显示装置，所述显示装置包括上述任一项所述的背光模组。
 有益效果
本申请实施例提供的背光模组及显示装置，通过在LED芯片背离基板的一侧设置光学膜片，光学膜片朝向LED芯片的一侧形成有第一棱镜结构，LED芯片发出的光线通过第一棱镜结构时发生扩散，以增加混光效果，提高背光模组亮度均匀性，同时减小混光距离，有利于实现背光模组轻薄化。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
为了更完整地理解本申请及其有益效果，下面将结合附图来进行以下说明，其中在下面的描述中相同的附图标号表示相同部分。
图1为本申请实施例提供的背光模组的第一种结构示意图。
图2为图1所示A部分的局部放大示意图。
图3为图1所示的光学膜片第二种实施方式的结构示意图。
图4为图1所示的光学膜片第三种实施方式的结构示意图。
图5为本申请实施例提供的背光模组的第二种结构示意图。
图6为本申请实施例提供的背光模组的第三种结构示意图。
图7为图6所示的滤光膜的滤光示意图。
图8为本申请实施例提供的背光模组的第四种结构示意图。
图9为本申请实施例提供的背光模组的出光效果仿真图。
图10为常规背光模组的出光效果仿真图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本申请的保护范围。
本申请实施例提供一种背光模组及显示装置，以解决现有的背光模组LED灯珠出光角度小，混光效果差，导致背光模组亮度不均以及难以实现背光模组轻薄化的问题。以下将结合附图进行说明。
请参考图1，图1为本申请实施例提供的背光模组的第一种结构示意图。本申请实施例提供一种背光模组，包括基板10、LED芯片20、封装胶层30以及光学膜片40。
其中，LED芯片20设置于基板10上，封装胶层30覆盖LED芯片20及基板10，光学膜片40设置于封装胶层30背离基板10的一侧，光学膜片40朝向LED芯片20的一侧形成有第一棱镜结构41。
本申请实施例中，基板10可以为PCB板或者柔性线路板，基板10上布置有线路，LED芯片20连接在基板10上。具体的，LED芯片20设置在基板10表面，并与基板10电性连接，外部的电路可以通过基板10为LED芯片20提供电源，以使LED芯片20发光。
LED芯片20用于背光模组的光源。优选的，LED芯片20为Mini LED芯片20，LED芯片20的发光方式为顶发光。
基板10上设置有多个LED芯片20，多个LED芯片20呈阵列排布方式设置于基板10上，或者呈其他规则或不规则的方式设置于基板10上，对此本申请不做具体限制。示例性的，LED芯片20呈M行*N列排列方式设置于基板10的表面上，M和N均为不小于2的整数。
本申请实施例中，光学膜片40设置于封装胶层30背离基板10的一侧，光学膜片40包括基体42，基体42朝向LED芯片20的一侧形成有第一棱镜结构41，第一棱镜结构41相当于光学膜片40的入光面。通过在光学膜片40上设置第一棱镜结构41，可以增大光学膜片40的入光面的面积，且LED芯片20发出的光线通过第一棱镜结构41时发生折射及扩散，第一棱镜结构41的均光效果，可以提高背光模组亮度均匀性。
请参考图1和图2，图2为图1所示A部分的局部放大示意图。
第一棱镜结构41凸出基体42，其棱镜截面呈倒三角形状，第一棱镜结构41的顶端朝向封装胶层30，顶端到基体42的垂直距离H1为30微米~50微米之间，也可以理解为第一棱镜结构41的高度H1范围为30微米~50微米。示例性的，第一棱镜结构41的顶端到基体42的垂直距离H1可以为30微米、40微米、45微米、50微米中的任意一种。
如图2所示，第一棱镜结构41间隔设置，相邻第一棱镜结构41的间距P1为30微米~70微米之间。示例性的，相邻第一棱镜结构41的间距可以为30微米、50微米、60微米、70微米中的任意一种。
需要说明的是，通过调整第一棱镜结构41的高度H1及间距P1，可以改变光线进入光学膜片40的视角。H1和P1值的大小与LED光强分布、相邻LED芯片20的间距、所用材料的折射率等因素有关，可以根据LED芯片20光强分布、相邻LED芯片20的间距、所用材料的折射率等因素调整H1、P1值，以使背光模组的发光效果符合显示装置的要求。
如图3所示，图3为图1所示的光学膜片40第二种实施方式的结构示意图。在一些实施例中，为缓解光线在第一棱镜结构41的棱角处因光折射方向突然改变所造成的视角变化，第一棱镜结构41的棱角可部分圆角化。
本申请实施例中，光学膜片40采用透明材料制成，不影响光线的穿透率。光学膜片40的基体42可以采用PET（聚对苯二甲酸乙二醇酯）或PC（聚碳酸酯）或PMMA（聚甲基丙烯酸甲酯）材料制成。其中，基体42的厚度范围为0 .1毫米至2.0毫米，优选的，基体42的厚度为0.25mm或0.5mm。
在一些实施例中，第一棱镜结构41通过在基体42上涂布UV胶，然后通过模具压印成型，经紫外光固化后形成第一棱镜结构41。
在其他一些实施例中，第一棱镜结构41也可以采用与基体42一体注塑成型，该种方式获得的光学膜片40的基体42与第一棱镜结构41为一体结构，第一棱镜结构41与基体42的材质相同，例如可以为PET或PC或PMMA。
请继续参考图1，为了进一步提高背光模组的亮度，光学膜片40的基体42背离第一棱镜结构41的一侧还形成有多个第二棱镜结构43，第二棱镜结构43相当于光学膜片40的出光面。也可以理解为，光学膜片40背离LED芯片20的一侧形成有多个第二棱镜结构43。
第二棱镜结构43与第一棱镜结构41相对设置，分别位于基体42的两侧。第二棱镜结构43凸出基体42，其棱镜截面呈三角形状。第二棱镜结构43的顶端到基体42的垂直距离H2可以与第一棱镜结构41相同，也可以与第一棱镜结构41不同。示例性的，第二棱镜结构43的顶端到基体42的垂直距离H2可以为30微米、40微米、45微米、50微米中的任意一种。
第二棱镜结构43的顶端与第一棱镜的顶端相对设置，优选的，第二棱镜结构43的顶端正对第一棱镜结构41的顶端。多个第二棱镜结构43间隔设置，相邻第二棱镜结构43的间距P2可以与第一棱镜的间距P1相同，也可以与第一棱镜的间距不同。优选的，相邻第二棱镜结构43的间距P2与第一棱镜的间距P1相同。
在一些实施例中，第二棱镜结构43通过在基体42上涂布UV胶，然后通过模具压印成型，经紫外光固化后形成第二棱镜结构43。
在其他一些实施例中，第二棱镜结构43也可以采用与基体42一体注塑成型，该种方式获得的光学膜片40的基体42与第二棱镜结构43为一体结构，第二棱镜结构43与基体42的材质相同，例如可以为PET或PC或PMMA。
本申请实施例中，第二棱镜结构43具有较好的聚合光线的作用，可以聚集并折射透过基体42的光线，第二棱镜结构43通过聚光可以提高LED光线穿过光学膜片40后的亮度，以获得高照度的光，进而提高背光模组的亮度。
可以理解的，第一棱镜结构41和第二棱镜结构43分别位于基体42的两侧，且第一棱镜结构41的顶端与第二棱镜结构43的顶端相对设置。当LED芯片20发出光线穿过第一棱镜结构41时，第一棱镜结构41可以对光线进行扩散及折射，以对光线进行均匀化；而当光线透过基体42并穿过第二棱镜结构43时，第二棱镜结构43可以对光线进行汇聚及折射。因此，最终从光学膜片40出射的光，可以获得高亮度且均匀的光线，提高LED芯片出光的混光效果，有利于实现高亮度且出光均匀的背光模组。
进一步的，第一棱镜结构41的表面还可以设置散射层，其具有散光功能，以对LED芯片20发出的光线进一步扩散及均光。示例性的，该散射层可通过在第一棱镜结构41的表面上设置粗糙面或涂覆散射性油墨形成。
本申请实施例中，由于设置光学膜片40，光学膜片40的基体42两侧分别设置第一棱镜结构41和第二棱镜结构43，可以实现均匀光线以及提升亮度的效果，并且能够降低混光距离，实现超薄背光模组。
一些实施例中，该光学膜片40可以取代扩散板，或者搭配厚度较低的扩散板，以降低背光模组的整体厚度及成本。
示例性的，常规背光模组的扩散板厚度为2.0毫米~3.0毫米，而本申请实施例的背光模组采用该光学膜片40，其搭配的扩散板的厚度可以减薄到1.0毫米，大大降低了背光模组的厚度。另外，本申请实施例的背光模组也可以视主观情况取消扩散板，进一步降低背光模组的整体厚度，实现背光模组的轻薄化。
请参考图4，作为本申请实施例的进一步改进，光学膜片40朝向LED芯片20的一侧设置第一棱镜结构41，且第一棱镜结构41的高度各不相同。也可以理解为，第一棱镜结构41的顶端到基体42的垂直距离分别不同。
通过设置不同高度的第一棱镜结构41，可以进一步提高第一棱镜结构41对光线的扩散效果，有利于提高光学膜片40的均光效果。同时，当第一棱镜结构41的顶端到基体42的垂直距离各不相同时，还可以避免第一棱镜结构41与介于光学膜片40与LED芯片20之间的其他透明器件或薄膜吸附在一起，影响LED发出的光线穿过第一棱镜结构41时的扩散效果。
本申请实施例中，在基板10上设置有封装胶层30，封装胶层30与LED芯片20位于基板10的同侧。为使LED芯片20发出原始颜色的光线，封装胶层30为透明胶层。通过将封装胶层30设置为透明胶层，使得LED芯片20发出的光线通过透明胶层以原始光线射出。例如，当LED芯片20发蓝光时，蓝光穿过封装胶层30后仍为蓝光，封装胶层30对背光源不造成色差。
示例性的，封装胶层30采用透明材质制成，尤其是高透明材质，其透光率优选为90％或以上。封装胶层30的材质可以选用硅胶、环氧胶或橡胶等。
在一些实施例中，为了使LED芯片20发出的光线转化为白光，封装胶层30内还可以设置荧光粉颗粒，荧光粉颗粒均匀分散于封装胶层30内。由于通常LED芯片20发出的光线为蓝光，通过在封装胶层30内设置荧光粉颗粒，使得LED芯片20发出的光线在荧光粉颗粒的作用下转化为白光。需要说明的是，LED芯片20通过荧光粉颗粒转化为白光的搭配为现有技术，本申请不再赘述。
本申请实施例中，封装胶层30包括第一封装胶层31和第二封装胶层32。请参考图1，第一封装胶层31覆盖LED芯片20以及基板10，也可以理解为第一封装胶层31整面覆盖基板10，第一封装胶层31的厚度高于LED芯片20的高度。第二封装胶层32设置于第一封装胶层31上，并且第二封装胶层32正对LED芯片20。
需要说明的是，第一封装胶层31可以有效维护LED芯片20的气密性并保护LED芯片20不受周围环境中湿度及温度的影响，同时第一封装胶层31还可以起到缓冲作用，有效防止LED芯片20受到机械振动、外界冲击产生破损或引起特性的变化而影响其发光性能。
第二封装胶层32设置于第一封装胶层31上，且第二封装胶层32正对LED芯片20。请参考图1，第二封装胶层32的形状呈椭球形，类似于凸透镜。由于第二封装胶层32正对LED芯片20位置，在进行第二封装胶层32点胶时需进行对位操作。
需要说明的是，LED芯片20发出光线经第一封装胶层31和第二封装胶层32的扩散，可以增加LED芯片20出光角度及混光均匀性。同时，第二封装胶层32的凸透镜形状，从第一封装胶层31表面出射的光线经第二封装胶层32的凸透镜的散射遮挡后，可以削弱LED芯片20正上方的光强度，并增加周围的亮度，进一步增加LED芯片20出光角度及混光均匀性，实现较为均匀的面光源，进而减少LED芯片20的数量，降低成本，同时还可以缩短混光距离，以实现背光模组的轻薄化。示例性的，第一封装胶层31整面覆盖基板10，第一封装胶层31的厚度优选0.44毫米，第二封装胶层32设置于第一封装胶层31上，第二封装胶层32呈凸透镜形状，第二封装胶层32的高度优选0.76毫米，其凸透镜的底面直径优选2.4毫米。需要说明的是，凸透镜在基板10上的投影面积需大于LED芯片20的尺寸。
本申请实施例中，第一封装胶层31和第二封装胶层32的胶体本身可作为支撑件，不需要额外设置支撑柱(常规直下式背光模组一般需要设置支撑柱，以增加混光距离)，因此可以减薄背光模组的厚度，有利于实现背光模组的轻薄化。
请参考图5，图5为本申请实施例提供的背光模组的第二种结构示意图。
在一些实施例中，第一封装胶层31仅覆盖LED芯片20位置，以减少第一封装胶层31的覆盖面积，进而减少胶体用量，以节约成本。如图5所示，第一封装胶层31呈圆柱体状，且第一封装胶层31完全覆盖LED芯片20。
继续参考图5，第二封装胶层32设置于第一封装胶层31上，第二封装胶层32的形状呈椭球形，类似凸透镜。由于第一封装胶层31和第二封装胶层32正对LED芯片20位置，在进行第一封装胶层31和第二封装胶层32点胶时均需对位操作。
示例性的，第一封装胶层31覆盖LED芯片20位置，第一封装胶层31圆柱体的高度优选0.44毫米，圆柱体的直径优选2.4毫米；第二封装胶层32设置于第一封装胶层31上，第二封装胶层32呈凸透镜形状，第二封装胶层32的高度优选0.76毫米，其凸透镜的底面直径优选2.4毫米。
本申请实施例中，LED芯片20发出光线经第一封装胶层31和第二封装胶层32的扩散，可以增加LED芯片20出光角度及混光均匀性。同时，第二封装胶层32的凸透镜形状，从第一封装胶层31表面出射的光线经第二封装胶层32的凸透镜的散射遮挡后，可以削弱LED芯片20正上方的光强度，并增加周围的亮度，进一步增加LED芯片20出光角度及混光均匀性，实现较为均匀的面光源，进而减少LED芯片20的数量，降低成本，同时还可以缩短混光距离，以实现背光模组的轻薄化。
请参考图6和图7，图6为本申请实施例提供的背光模组的第三种结构示意图，图7为图6所示的滤光膜50的滤光示意图。
本申请实施例提供的背光模组包括基板10、LED芯片20、第一封装胶层31、第二封装胶层32、滤光膜50、光学膜片40以及量子点膜片60。
其中，LED芯片20设置于基板10上；第一封装胶层31覆盖LED芯片20及基板10；第二封装胶层32设置于第一封装胶层31上，且正对LED芯片20；光学膜片40设置于第二封装胶层32背离第一封装胶层31的一侧；滤光膜50设置在光学膜片40与第二封装胶层32之间；量子点膜片60与光学膜片40层叠设置，量子点膜片60位于光学膜片40背离滤光膜50的一侧。
其中，光学膜片40朝向滤光膜50的一侧设置有第一棱镜结构41，光学膜片40朝向量子点膜片60的一侧设置有第二棱镜结构43。本申请实施例中，滤光膜50允许红光、绿光以及入射角α大于等于预设角度的蓝光通过，且反射入射角α小于预设角度的蓝光。
需要说明的是，LED芯片20发出的光为蓝光。
一些实施例中，入射角α大于等于60度的蓝光大部分可以通过滤光膜50，而入射角小于60度的蓝光则大部分被滤光膜50反射。
由于LED芯片20发光为蓝光，通过设置滤光膜50，可以降低LED芯片20正上方蓝光穿透率，以防止LED芯片20正上方亮度过亮，并增大LED芯片20周围亮度，以实现均光效果。
在光学膜片40背离滤光膜50的一侧设置量子点膜片60，蓝光可以激发量子点膜片60中红色量子点和绿色量子点发出红光和绿光，进而红色、绿光和蓝光混合后形成白光，为背光模组提供均匀的光源。
请参考图8，图8为本申请实施例提供的背光模组的第四种结构示意图。在一些实施例中，背光模组还包括：反射层70，反射层70设置于基板10与第一封装胶层31之间。可以理解的，反射层70设置于基板10上，反射层70在LED芯片20位置镂空以露出LED芯片20，第一封装胶层31覆盖反射层70及LED芯片20。
需要说明的是，反射层70可以为基板10朝向LED芯片20一侧粘贴的反射片或者喷涂的反射涂层。其中，反射片和反射涂层均可以为金属等材质，对此本申请不做具体限制。反射层70的反射面可以为镜面或者雾面，对此需要根据实际应用进行具体设计。
通过设置反射层70，可以进一步提高背光模组面光源的亮度，以及将LED芯片20出射光线利用率达到最大化，并提高混光均匀性。同时，LED芯片20的漏光还能够通过反射层70的反射后再次进入封装胶层30，可以防止LED芯片20的漏光问题，进一步提高背光模组的性能。
请参考图9和图10，图9为本申请实施例提供的背光模组的出光效果仿真图；图10为常规背光模组的出光效果仿真图。
根据图9和图10对比可以发现，本申请实施例提供的背光模组的光学膜片40及封装胶层30，在进行光学仿真时能更有效的分散光线，让LED芯片20发出的光线表现更为均匀，可以实现背光模组亮度均匀性。
本申请实施例还提供一种显示装置，包括上述的背光模组，背光模组为显示装置提供背光源。所述显示装置可以为：液晶显示面板、电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本申请实施例提供的背光模组及显示装置，通过在LED芯片20背离基板10的一侧设置光学膜片40，光学膜片40朝向LED芯片20的一侧形成有第一棱镜结构41，LED芯片20发出的光线通过第一棱镜结构41时发生扩散，以增加混光效果，提高背光模组亮度均匀性，同时减小混光距离，有利于实现背光模组轻薄化。
在本申请的描述中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个特征。
以上对本申请实施例所提供的背光模组及显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种背光模组，其中，包括：
    基板；
    LED芯片，设置于所述基板上；
    光学膜片，设置于所述LED芯片背离所述基板的一侧，所述光学膜片朝向所述LED芯片的一侧形成有多个第一棱镜结构。
  2. 根据权利要求1所述的背光模组，其中，所述第一棱镜结构的高度为30微米~50微米之间。
  3. 根据权利要求2所述的背光模组，其中，多个所述第一棱镜结构的高度各不相同。
  4. 根据权利要求1所述的背光模组，其中，多个所述第一棱镜结构间隔设置，相邻所述第一棱镜结构的间距为30微米~70微米之间。
  5. 根据权利要求1所述的背光模组，其中，所述光学膜片背离所述LED芯片的一侧形成有多个第二棱镜结构。
  6. 根据权利要求5所述的背光模组，其中，所述光学膜片包括基体，所述基体朝向所述LED芯片的一侧形成有所述第一棱镜结构，所述基体背离所述第一棱镜结构的一侧形成有多个所述第二棱镜结构。
  7. 根据权利要求5所述的背光模组，其中，所述第一棱镜结构的棱镜截面呈倒三角形状，且所述第二棱镜结构的棱镜界面呈倒三角形状。
  8. 根据权利要求5所述的背光模组，其中，相邻的所述第二棱镜结构的间距与相邻的所述第一棱镜结构的间距相同。
  9. 根据权利要求1所述的背光模组，其中，所述LED芯片发出的光线为蓝光。
  10. 根据权利要求1所述的背光模组，其中，所述第一棱镜结构的表面设置有散射层，所述散射层通过在所述第一棱镜结构的表面上设置粗糙面或涂覆散射油墨形成。
  11. 根据权利要求1所述的背光模组，其中，所述背光模组还包括滤光膜，所述滤光膜设置在所述光学膜片与所述LED芯片之间，所述滤光膜允许红光、绿光以及入射角大于等于预设角度的蓝光通过，且反射入射角小于预设角度的蓝光。
  12. 根据权利要求1所述的背光模组，其中，所述背光模组还包括量子点膜片，所述量子点膜片设置于所述光学膜片背离所述LED芯片的一侧。
  13. 根据权利要求1所述的背光模组，其中，所述背光模组还包括第一封装胶层，所述第一封装胶层覆盖所述LED芯片。
  14. 根据权利要求13所述的背光模组，其中，所述第一封装胶层还覆盖所述基板。
  15. 根据权利要求14所述的背光模组，其中，所述第一封胶层的厚度高于所述LED芯片的高度。
  16. 根据权利要求14所述的背光模组，其中，所述第一封胶层的形状呈圆柱体状。
  17. 根据权利要求14所述的背光模组，其中，所述背光模组还包括第二封装胶层，所述第二封装胶层设置于所述第一封装胶层上，所述第二封装胶层正对所述LED芯片。
  18. 根据权利要求17所述的背光模组，其中，所述第二封装胶层的形状呈凸透镜形状。
  19. 根据权利要求13所述的背光模组，其中，所述背光模组还包括反射层，所述反射层设置于所述第一封装胶层与所述基板之间。
  20. 一种显示装置，其中，包括权利要求1至19任一项所述的背光模组。
PCT/CN2022/134257 2022-02-18 2022-11-25 背光模组及显示装置 WO2023155527A1 (zh)

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