WO2023142866A1 - Capteur d'empreinte vocale osseuse à électret de type vibration mécanique - Google Patents

Capteur d'empreinte vocale osseuse à électret de type vibration mécanique Download PDF

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Publication number
WO2023142866A1
WO2023142866A1 PCT/CN2022/143357 CN2022143357W WO2023142866A1 WO 2023142866 A1 WO2023142866 A1 WO 2023142866A1 CN 2022143357 W CN2022143357 W CN 2022143357W WO 2023142866 A1 WO2023142866 A1 WO 2023142866A1
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WO
WIPO (PCT)
Prior art keywords
electret
mechanical vibration
bone voiceprint
voiceprint sensor
pcb
Prior art date
Application number
PCT/CN2022/143357
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English (en)
Chinese (zh)
Inventor
裴振伟
Original Assignee
青岛歌尔智能传感器有限公司
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Publication date
Application filed by 青岛歌尔智能传感器有限公司 filed Critical 青岛歌尔智能传感器有限公司
Publication of WO2023142866A1 publication Critical patent/WO2023142866A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the utility model relates to the field of sensor design, in particular to a mechanical vibration electret bone voiceprint sensor.
  • the electret bone voiceprint sensor is a sensor that uses the vibration pickup unit to vibrate with the external bone to make the distance between the two plates of the capacitor change, resulting in a change in the capacitance, and to detect bone conduction signals. .
  • the electret bone voiceprint sensor usually consists of a vibration membrane and a mass block, and a vibration pickup unit is composed of a diaphragm capacitor charged with a certain charge.
  • the vibration information of the outside world is sensed by the vibration pickup unit, and output through the matching circuit at the back end. Analog electrical signals are used to express the vibration information.
  • Existing vibration components include a mass block and a diaphragm.
  • the diaphragm is used as an elastic material.
  • the concentricity and the amount of glue overflow cannot be well controlled, resulting in poor consistency of the diaphragm and reducing product assembly yield and reliability.
  • holes of a certain size usually need to be opened on the shell, and special materials need to be used to plug the holes when the product is used, which increases the cost of use and is easily affected by external sound signals.
  • the electret bone voiceprint sensor usually reserves a small vibration space for the vibration component during design and assembly, so the product will appear distortion at some frequency points.
  • the inventor realized that there is an urgent need for an electret bone voiceprint sensor with high product assembly yield, high reliability and low manufacturing cost.
  • the purpose of this application is to provide a mechanical vibration electret bone voiceprint sensor to solve the problems of high cost, low product assembly yield and poor reliability of the traditional electret bone voiceprint sensor.
  • the mechanical vibration electret bone voiceprint sensor provided in the embodiment of the present application includes a PCB and a housing fixed on the PCB, and a packaging structure is formed between the housing and the PCB; inside the packaging structure A mechanical vibrating element and a pole plate are provided, and the mechanical vibrating element and the pole plate are arranged in parallel to form a pick-up unit.
  • the mechanical vibration electret bone voiceprint sensor provided by this application adopts metal mechanical vibration parts, which can effectively reduce the difference of vibration pickup units and greatly improve the consistency of product performance; in addition, due to The vibrating plate in the middle of the mechanical vibrating part is suspended by the cantilever arm, which can significantly improve the vibration effect of the vibrating plate and improve the sensitivity; in addition, the shell can use a non-porous shell to block the impact of sound on the sensor and further improve the sensitivity; in addition, through reasonable PCB arrangement Cloth, to avoid the impact of FET on the vibration of the vibrating plate, so that the vibration range of mechanical parts can be greatly improved, distortion can be eliminated, and sensitivity can be significantly improved.
  • Fig. 1 is a front sectional view of a mechanical vibration electret bone voiceprint sensor according to an embodiment of the present application
  • Fig. 2 is a top view of a mechanical vibrator according to an embodiment of the present application
  • the reference signs include: PCB11, housing 12, FET13, capacitor 131, mechanical vibrating element 14, positioning outer ring 141, cantilever arm 142, positioning inner ring 143, vibrating plate 144, conducting ring 15, insulating cavity 16, Gasket 17, polar plate 18, connecting piece 19.
  • Figure 1 shows the front view cross-sectional structure of the mechanical vibration electret bone voiceprint sensor according to the embodiment of the application.
  • the mechanical vibration electret bone voiceprint sensor provided in the embodiment of the application , including a PCB11 (English full name is Printed Circuit Board, Chinese name is printed circuit board, which is a support for electronic components) for welding the internal circuit of the mechanical vibration electret bone voiceprint sensor and fixed on the PCB11
  • the shell 12 on the top protects components, and a packaging structure is formed between the shell 12 and the PCB 11.
  • a mechanical vibrating element 14 for sensing external vibration information and a pole plate used in conjunction with the mechanical vibrating element 14 are arranged inside the encapsulating structure.
  • the mechanical vibrating element 14 and the polar plate 18 are arranged in parallel to form a pick-up unit for picking up external vibration signals;
  • the external vibration signal picked up by the pick-up unit is converted into an amplified electrical signal and then transmitted to an external signal processing device for signal analysis.
  • FIG. 2 shows the top view structure of the mechanical vibrating element 14 according to the embodiment of the present application. It can be seen from FIG. (usually arranged at the central position inside the positioning outer ring 141), and a gasket 17 is arranged under the positioning outer ring 141, and the gasket 17 is sandwiched between the positioning outer ring 141 and the pole plate 18 to Make the positioning outer ring 141 and the pole plate 18 parallel to each other, thereby forming a parallel capacitance, constituting the pickup unit of the present application.
  • the distance between the mechanical vibrating element 14 and the pole plate 18 can be further increased by arranging the gasket 17, so as to avoid the phenomenon that the positive and negative electrodes of the electret are in contact due to some special external forces in practical applications.
  • the vibrating piece 144 will vibrate with the external vibration signal, so that the capacitance forming the parallel capacitance between the vibrating piece 144 and the pole plate 18 will change, and then the external vibration signal picked up by the pickup unit will be converted Pass the electrical signal to the PCBA component.
  • the cantilever beam 142 can be connected to the inner wall of the positioning outer ring 141, and the positioning inner ring 143 that is compatible with the vibrating piece 144 can be connected to the side of the cantilever beam 142 away from the positioning outer ring 141, and then the vibrating piece 144 is fixed.
  • the interior of the inner ring 143 is positioned, so that the vibrating plate 144 is suspended in the air, and the sensitivity of the vibrating plate 144 is improved.
  • two cantilever beams 142 can be provided between the positioning outer ring 141 and the positioning inner ring 143, so as to avoid the failure of the entire device when one cantilever beam 142 breaks. use.
  • the two cantilever beams 142 need to be arranged on the same side where the inner ring 143 is positioned, and the angle between the two cantilever beams is less than 90 degrees (usually the angle set to about 30 degrees), at this time, the side of the vibrating plate 144 that is not connected to the cantilever beam 142 can vibrate freely.
  • a conduction ring 15 is connected between the positioning outer ring 141 and the PCB 11 , and the upper end of the conduction ring 15 is electrically connected to the internal PCBA component of the packaging structure.
  • the casing 12 is made of metal.
  • a pre-installation between the conducting ring 15 and the casing 12 is required.
  • An insulating cavity 16 is left, and the conducting ring 15 is separated from the casing 12 through the insulating cavity 16 .
  • the PCBA assembly may include a FET13 (full English name is Field Effect Transistor, Chinese name is a field effect transistor, which is a device with signal amplification function) arranged on the PCB11 for signal amplification and a capacitor electrically connected to the FET13 131 , the FET 13 cooperates with the capacitor 131 to amplify the electrical signal from the mechanical vibrating element 14 .
  • FET13 full English name is Field Effect Transistor, Chinese name is a field effect transistor, which is a device with signal amplification function
  • a resistor can also be set on the PCB11, and the drain of the FET13 is connected to an external power supply device through the resistor.
  • the signal amplification factor of the FET13 can be determined by the resistance value of the resistor.
  • the FET 13 and the cantilever beam 142 can be arranged on the same side so that the upper and lower positions of the two correspond. Arranging the FET13 and the cantilever beam 142 on the same side can effectively prevent the FET13 from interfering with the vibration of the vibrating piece 144, so that the vibrating range of the mechanical vibrating piece 14 can be greatly improved and distortion can be eliminated.
  • a connecting piece 19 may be provided between the pole plate 18 and the bottom of the housing 12 to directly electrically connect the pole plate 18 to the housing 12. Since the housing 12 itself is grounded, the grounding effect of the pole plate 18 can be realized at this time.
  • the vibrating plate 144 in the mechanical vibrating element 14 is designed to be suspended, the vibration of the vibrating plate 144 can be realized without adding air guide holes on the housing 12, and at this time, between the housing 12 and the PCB 11
  • the formed packaging structure is a sealed structure, which can block the influence of external sound on the sensor.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

La présente invention concerne un capteur d'empreinte vocale osseuse à électret de type à vibration mécanique, comprenant un circuit imprimé et un boîtier fixé sur le circuit imprimé, une structure d'emballage étant formée entre le boîtier et le circuit imprimé. Un élément de vibration mécanique et une plaque d'électrode sont disposés dans la structure d'emballage, et l'élément de vibration mécanique et la plaque d'électrode sont disposés en parallèle pour former une unité de capture. L'utilisation du modèle d'utilité permet de résoudre les problèmes liés au coût élevé, au faible rendement d'assemblage et à la fiabilité médiocre d'un capteur d'empreinte vocale osseuse à électret traditionnel.
PCT/CN2022/143357 2022-01-25 2022-12-29 Capteur d'empreinte vocale osseuse à électret de type vibration mécanique WO2023142866A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202220209137.8U CN217591077U (zh) 2022-01-25 2022-01-25 机械振动式驻极体骨声纹传感器
CN202220209137.8 2022-01-25

Publications (1)

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WO2023142866A1 true WO2023142866A1 (fr) 2023-08-03

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Application Number Title Priority Date Filing Date
PCT/CN2022/143357 WO2023142866A1 (fr) 2022-01-25 2022-12-29 Capteur d'empreinte vocale osseuse à électret de type vibration mécanique

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CN (1) CN217591077U (fr)
WO (1) WO2023142866A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217591077U (zh) * 2022-01-25 2022-10-14 青岛歌尔智能传感器有限公司 机械振动式驻极体骨声纹传感器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001095097A (ja) * 1999-09-20 2001-04-06 Hosiden Corp エレクトレットコンデンサマイクロホン
JP2011223324A (ja) * 2010-04-09 2011-11-04 Yamaha Corp 収音装置およびコンデンサマイクロホン
CN212278464U (zh) * 2020-07-02 2021-01-01 深圳市新厚泰电子科技有限公司 一种金属振膜骨导咪头
CN212992606U (zh) * 2020-09-01 2021-04-16 苏州中科速衡电子有限公司 一种驻极体骨导麦克风和一种监测仪
CN217591077U (zh) * 2022-01-25 2022-10-14 青岛歌尔智能传感器有限公司 机械振动式驻极体骨声纹传感器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001095097A (ja) * 1999-09-20 2001-04-06 Hosiden Corp エレクトレットコンデンサマイクロホン
JP2011223324A (ja) * 2010-04-09 2011-11-04 Yamaha Corp 収音装置およびコンデンサマイクロホン
CN212278464U (zh) * 2020-07-02 2021-01-01 深圳市新厚泰电子科技有限公司 一种金属振膜骨导咪头
CN212992606U (zh) * 2020-09-01 2021-04-16 苏州中科速衡电子有限公司 一种驻极体骨导麦克风和一种监测仪
CN217591077U (zh) * 2022-01-25 2022-10-14 青岛歌尔智能传感器有限公司 机械振动式驻极体骨声纹传感器

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