WO2023142639A1 - 晶圆棒开方系统及方法 - Google Patents

晶圆棒开方系统及方法 Download PDF

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Publication number
WO2023142639A1
WO2023142639A1 PCT/CN2022/134286 CN2022134286W WO2023142639A1 WO 2023142639 A1 WO2023142639 A1 WO 2023142639A1 CN 2022134286 W CN2022134286 W CN 2022134286W WO 2023142639 A1 WO2023142639 A1 WO 2023142639A1
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WO
WIPO (PCT)
Prior art keywords
wafer
wafer bar
bar
unloading
loading
Prior art date
Application number
PCT/CN2022/134286
Other languages
English (en)
French (fr)
Inventor
王晓鹏
梁志慧
李喜珍
贡艺强
王猛
石岩
杨树生
赵艳慧
常顺
林雪龙
李志剑
赵伟
王光宇
尹琨
Original Assignee
Tcl中环新能源科技股份有限公司
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Publication of WO2023142639A1 publication Critical patent/WO2023142639A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Definitions

  • the invention belongs to the technical field of single crystal silicon rod processing, and in particular relates to a wafer rod square finding system and method.
  • the existing equipment is operated on the same sliding track, and the loading and unloading are carried out on the same side, that is to say, the wafer bar loading before squaring and after squaring
  • the same manipulator is used to pick and place the wafer bar blanking.
  • the manipulator cannot carry out the turnover of loading and unloading while grasping the material. In this way, there is a waste of man-hours in the process of loading and unloading, and it cannot be fully connected, which makes the processing efficiency low. , equipment utilization rate is low.
  • due to the unreasonable design of the equipment structure it is easy to collide between the side skins when the square bar is unloaded, and it is also easy to bump or collapse during the turnover process of the square bar blanking.
  • a wafer bar square opening control system includes: a square opening bin for removing the wafer bar edge skin and a mobile platform placed at the end of the square opening bin; the mobile platform is equipped with The feeding mechanism and the unloading mechanism, the loading mechanism and the unloading mechanism are arranged on both sides of the square bin, and the loading mechanism can simultaneously remove the new wafer bar when the unloading mechanism collects all the scrap The wafer rods to be opened are sent to the opening warehouse.
  • the opening bin is equipped with a top clamping mechanism for fixing the wafer bar, and the top clamping mechanism includes a main jacking shaft and a secondary jacking shaft that are suspended;
  • the main jacking shaft is used to hold the end face of the square bar in the solid wafer bar;
  • the auxiliary jacking shaft is used for the end face where the edge skin is set in the alignment setting in the jacking solid wafer bar;
  • the main jacking shaft and the auxiliary jacking shaft can move together to the mobile platform along the length direction of the square bin.
  • the mobile platform includes a sliding table placed outside the open bin, the feeding mechanism and the unloading mechanism are both parallel to the length direction of the open bin and perpendicular to the length direction of the sliding table, the feeding mechanism and The unloading mechanism is independently arranged to slide along the length direction of the slide table.
  • the feeding mechanism includes:
  • Both the loading table and the preparation table are equipped with coaxial feeding tracks;
  • the position of the feeding track placed in the material preparation table is fixed, and higher than the initial position of the feeding track placed in the feeding table; and the feeding table can move up and down in the vertical direction, so that the crystal placed on the feeding table The round bar moves to the material preparation table along the feeding track.
  • the clamping member includes two opposing clamping jaws with C-shaped inner walls; the feeding track placed in the material preparation table runs through the clamping area surrounded by the clamping jaws.
  • a stopper for positioning the wafer bar is also provided on the loading track in the material preparation table, and the stopper is arranged at one end of the loading track in the material preparation table close to the opening bin;
  • the clamping piece close to the stopper can move along the width direction of the preparation table
  • the clips away from the stop are movable along the width of the table as well as its length.
  • the clamping member away from the stopper is provided with a pull rod, and the pull rod is driven by the clamping member where it is located to pull the wafer rod to move toward the end close to the stopper, and make the wafer rod be fixed against the stopper on the preparation table;
  • the pull rod is an L-shaped structure, which is arranged horizontally along the length direction of the material preparation table. One end is fixed on the side wall surface of the clip away from the stopper and close to the material loading table, and the other end is suspended in the air.
  • the unloading mechanism is arranged at one end of the sliding table away from the feeding mechanism, including a unloading table partially fixed on the sliding table and a collection box for collecting the scraps;
  • the unloading platform is located above the collection box and is controlled independently of the collection box;
  • the unloading table can move up and down vertically to pick up the squared wafer bar and move it to the unloading turntable.
  • the unloading platform is provided with unloading tracks
  • Both the unloading track and the loading track are equipped with several rubber rollers;
  • the rubber rollers in the feeding track are all set horizontally;
  • the rubber rollers in the feeding track are set obliquely facing each other;
  • the end of the unloading track near the opening bin is provided with several sets of baffles for preventing the deviation of the wafer bar after opening.
  • the baffles are arranged on both sides of the unloading track along the length of the unloading track.
  • two placement grooves arranged side by side are provided along the width direction of the collection box, and the distance between the placement grooves is not greater than the width of the squared wafer bar;
  • the collection box is moved to just below the wafer bar placed outside the opening bin, and the two placement slots are arranged symmetrically with respect to the length axis of the wafer bar.
  • the present invention provides a wafer bar square extraction control method, adopting any one of the above control systems, the steps include:
  • each group of alignment strips is sequentially cut in the opening bin, and each group of alignment strips is cut in the opening bin and the mobile platform Collect this group of side skins between;
  • the wafer bar before the wafer bar is uploaded to the opening bin, it also includes fixing the wafer bar in the material preparation station, and the steps include:
  • the steps include:
  • the top clamping mechanism is vacantly suspended between the opening bin and the mobile platform, and is preset at both ends of the wafer bar;
  • the top clamping mechanism drives the wafer bar through the clamping piece and enters the opening bin to prepare for cutting;
  • the material preparation table drives the retraction of the opened clamping parts.
  • in the process of collecting edge skin include:
  • the control collection box retracts to its initial position.
  • the wafer bar without strips after collecting all the alignment strips, it also includes collecting the wafer bar without strips, including:
  • the unloading table is controlled to drive the wafer bar back to its initial position.
  • the present invention provides a wafer bar square-cutting system, which includes: a square-opening chamber for removing the edge of the wafer bar; and a mobile platform placed on one side of the square-opening chamber in a first direction.
  • the mobile platform is provided with a material loading mechanism and a material unloading mechanism.
  • the material loading mechanism and the unloading mechanism are respectively arranged on the opposite sides of the mobile platform in a second direction different from the first direction.
  • the material loading mechanism can be collected by the unloading mechanism. While removing the strip and removing the strip, send another wafer to be squared to the square opening bin.
  • the present invention provides a method for squaring a wafer bar.
  • the method for squaring a wafer bar includes: based on the number of groups of side skins set relative to the wafer bar, in the squaring bin Sequentially cut each group of oppositely arranged edges, and after cutting each group of relatively arranged edges, collect the group of edges between the square bin and the mobile platform; obtain the boundless edge through the unloading mechanism At the same time, another wafer bar to be removed from the skin is uploaded to the opening bin by the feeding mechanism.
  • FIG. 1 is a top view of a wafer bar square extraction control system according to an embodiment of the present invention
  • Fig. 2 is a cross-sectional view of the cooperation between the material preparation table and the top clamping mechanism during feeding according to an embodiment of the present invention
  • Fig. 3 is a top view of the cooperation between the material preparation table and the wafer bar according to an embodiment of the present invention
  • Fig. 4 is a cross-sectional view of the cooperation between the material preparation table and the wafer bar according to an embodiment of the present invention
  • Fig. 5 is a cross-sectional view of the cooperation between the unloading table and the wafer bar according to an embodiment of the present invention
  • Fig. 6 is a top view of the cooperation between the collection box and the top clip mechanism when the edge leather is collected according to an embodiment of the present invention
  • Fig. 7 is a cross-sectional view of the cooperation between the unloading platform and the top clamping mechanism during unloading according to an embodiment of the present invention.
  • Bezel 60 Wafer bar 61. Square bar
  • This embodiment proposes a wafer bar squaring system. As shown in FIG. Mobile platform 30 on one side.
  • the term “squaring” here means that the diamond wire moving at high speed rubs against the silicon rod to cut out the square ingot, so as to achieve the purpose of cutting.
  • the wafer bar 60 contains four crystal lines, including four side skins 62 and one square bar 61 (as shown in FIG. 6 ), but not limited thereto. Wafer bar 60 may include six skins and a square bar. Other structures of the wafer bar 60 are common knowledge of those skilled in the art, and the drawings are omitted. In the following, the wafer bar 60 contains four crystal lines as an example for description.
  • the mobile platform 30 may be spaced apart from the opening bin 10 in the first direction X, that is, the mobile platform 30 may be placed on one side of the opening bin 10 in the first direction X.
  • the first direction X may be the direction along which the square bin 10 extends, that is, the length direction of the square bin 10 .
  • the mobile platform 30 is provided with a feeding mechanism 40 for preparing the wafer bar 60 to be cut to be transported to the opening bin 10 and a device for taking out the cut wafer bar 60 from the opening bin 10.
  • Blanking mechanism 50 can be arranged on both sides of the mobile platform 30, that is, the loading mechanism 40 and the unloading mechanism 50 can be respectively arranged on the second direction Y different from the first direction X of the mobile platform 30.
  • the loading mechanism 40 can collect all the edges 62 and remove the square rod 61 (wafer rod after removing all the edges) while the unloading mechanism 50 can remove another wafer to be removed.
  • Rod 60 is delivered to the entrance of square bin 10 near mobile platform 30 .
  • the loading mechanism 40 can send another wafer bar 60 to be removed from the side bar 60 to the open square bin 10 for close movement Entrance to platform 30.
  • the square bin 10 can be a processing chamber surrounded by movable doors on all sides, and the top clamping mechanism 20 can be arranged in the processing chamber.
  • the top clamping mechanism 20 is suspended and disposed on two opposite sides of the wafer rod 60 in the first direction X for top-fixing the end of the wafer rod 60 .
  • the jacking mechanism 20 may include two sets of main jacking shafts 21 and auxiliary jacking shafts that are suspended by the suspension arm 23 and are respectively arranged on opposite sides of the open warehouse 10 in the first direction X. twenty two. In each set of the main jacking shaft 21 and the auxiliary jacking shaft 22 , the auxiliary jacking shaft 22 may be disposed at opposite sides of the main jacking shaft 21 .
  • each set of main top shafts 21 and auxiliary top shafts 22 may include two main top shafts 21 and four auxiliary top shafts 22, as shown in Figures 1 and 2, two main top shafts 21 may Arranged in the second direction Y, the four auxiliary top shafts 22 may include two auxiliary top shafts 22 arranged in the second direction Y and arranged in another direction different from the first direction X and the second direction Y (eg , the two auxiliary top shafts 22 in the third direction).
  • each set of main top shafts 21 and auxiliary top shafts 22 includes one main top shaft 21 and two auxiliary top shafts 22 .
  • each set of main top shafts 21 and auxiliary top shafts 22 includes one main top shaft 21 and four auxiliary top shafts 22 .
  • the central axis of the main top shaft 21 and the central axis of the square rod 61 can be collinear, so as to be used to support the opposite end faces of the solid square rod 61; the secondary top shaft 22 can be aligned with the edge skin 62 in the wafer rod 60 to The opposite end surfaces of the skin 62 in the wafer bar 60 are fixed.
  • the main jacking shaft 21 and the auxiliary jacking shaft 22 can be respectively controlled by two sets of control systems, that is, the main jacking shaft 21 and the auxiliary jacking shaft 22 can be operated independently of each other. As shown in FIG. 2 , the main jacking shaft 21 and the auxiliary jacking shaft 22 can be driven by the suspension arm 23 to move along the first direction X to the mobile platform 30 .
  • the main jacking shaft 21 first contacts with the end surface of the square bar 61 in the wafer bar 60 and is clamped; after the main jacking shaft 21 is stably fixed to the square bar 61, The auxiliary jacking shaft 22 is in contact with the end surfaces of any pair of side skins 62 disposed on opposite sides of the square bar in the wafer bar 60 , and is gradually tightened and fixed. After the pair of strips 62 are cut, the movement of the suspension arm 23 can drive the main jacking shaft 21 , the auxiliary jacking shaft 22 and the wafer bar 60 to move to the transfer area between the opening bin 10 and the mobile platform 30 .
  • the unloading mechanism 50 Move to directly below the wafer bar 60 in the unloading mechanism 50, loosen all the auxiliary jacking shafts 22 located on both sides of the wafer bar 60 in the first direction X, and make the pair of edge strips 62 fall to the bottom respectively.
  • the unloading mechanism 50 is fixed, and the movement of the suspension arm 23 can drive the wafer bar 60 to return to the opening bin 10 to continue cutting another pair of side strips 62 .
  • the other pair of side strips 62 falls into the unloading mechanism 50 .
  • the unloading mechanism 50 returns to the initial position.
  • both the loading mechanism 40 and the unloading mechanism 50 may extend parallel to the first direction X. In one embodiment, the loading mechanism 40 and the unloading mechanism 50 may be arranged perpendicular to the second direction Y. In one embodiment, both the loading mechanism 40 and the unloading mechanism 50 can slide along the second direction Y independently.
  • the loading mechanism 40 may include a loading platform 41 arranged away from the square bin 10 and fixed on one end of the mobile platform 30 in the second direction Y, and a loading platform 41 arranged close to the square bin 10 and connected to the loading platform.
  • 41 can coordinate the material preparation platform 42 that uses.
  • the loading platform 41 and the material preparation platform 42 may extend along the first direction X and both operate independently of each other.
  • Both the material loading platform 41 and the material preparation platform 42 are provided with a material feeding track 43 with the same specification and structure and arranged coaxially. Therefore, the wafer bar 60 moved to the loading track 43 of the loading table 41 can move from the loading table 41 to the material preparation table 42 along the loading track 43 .
  • the feeding track 43 may extend along the first direction X.
  • the height position of the material preparation table 42 is constant, and correspondingly, the height of the feeding track 43 on the material preparation table 42 is constant.
  • the material preparation table 42 can move along the first direction X and/or the second direction Y, but cannot move up and down along the third direction Z.
  • the loading platform 41 can move up and down along the third direction Z, but cannot move along the first direction X and/or the second direction Y.
  • the height of the loading track 43 on the material preparation platform 42 may be higher than the height of the initial position of the loading track 43 on the loading platform 41 .
  • the feeding mechanism 40 may also include a feeding turntable for transferring the wafer bar 60 to be removed from the skin.
  • the feeding turntable may be located on the side of the loading table 41 away from the open warehouse 10 and connected to the loading table 41. (See the double dot dashed line structure in Figure 1).
  • the height of the feeding turntable should not be too high, so that the initial position of the feeding turntable 41 (for example, the height of the initial position) needs to be the same as
  • the height of the loading turntable is suitable (for example, at the same level as the height of the loading turntable), and the height of the wafer bar 60 transferred from the loading turntable is lower than the initial position of the material preparation table 42 (for example, , initial height).
  • the loading table 41 can automatically rise to the same height as the material preparation table 42, and then the wafer bar 60 is transferred to the material preparation table 42 through the feeding track 43 .
  • two clamping pieces 421 are also provided on the material preparation table 42 , and the clamping pieces 421 are used as manipulators for grabbing the wafer bar 60 .
  • the clip that is set close to the square bin 10 can be called the first clip 421
  • the clip that is far away from the square bin among the two clips 421 can be called the second clip 421.
  • each clamping member 421 may include two clamping jaws that are oppositely disposed in the second direction Y and whose inner walls are C-like structures.
  • the upper and lower sections of each jaw are respectively provided with a rubber pad 424 protruding from the inner wall of the jaw toward the center of the wafer bar 60, and the rubber pad 424 can directly contact the outer wall of the wafer bar 60 for clamping.
  • the feeding track 43 placed on the material preparation platform 42 runs through the fastening area surrounded by the opposite jaws along the first direction X.
  • the feeding track 43 includes a plurality of drum-like rubber rollers arranged along the first direction X.
  • the rubber rollers may be evenly arranged along the first direction X, but not limited thereto.
  • all the rubber rollers are arranged obliquely upward, that is, all the rubber rollers are arranged obliquely at an acute angle with respect to the second direction Y, and a pair of rubber rollers oppositely arranged in the second direction Y are arranged along the second direction Y.
  • the direction between the second direction Y and the third direction Z extends toward the wafer rod, so as to make point contact with the outer surface of the wafer rod 60, so as to improve the sliding effect of the wafer rod 60 on the feeding rail 43 and reduce the wafer rod 60.
  • the sliding resistance of rod 60 on feeding track 43 is not limited thereto.
  • the feeding track 43 on the material preparation platform 42 can also include a stopper 422 for positioning the wafer bar 60, and the stopper 422 can be fixedly arranged on the material feeding track 43 on the material preparation platform 42 close to the opening.
  • a stopper 422 is set so as to position the wafer bar 60 at the position where the top clamping mechanism 20 will clamp the wafer bar 60, so as to ensure that the top clamping mechanism 20 is accurately clamped. Wafer stick 60.
  • the first clamping member 421 close to the stopper 422 can move along the second direction Y, but cannot move along the first direction X, in order to locate the position where it clamps the end of the wafer bar 60 close to the stopper 422 .
  • a gripper in the second clamping member 421 away from the stopper 422 is provided with a pull rod 423 , the pull rod 423 has an L-shaped structure, and one end of the pull rod 423 is fixed on the second clamping member 421 .
  • One gripper is close to the side surface of the feeding table 41, and the other end of the pull rod 423 is suspended.
  • the pull rod 423 extends from one end of the pull rod 423 along a first direction X toward the loading table, and then extends along a second direction Y toward the unloading table 50 to the other end of the pull rod 423 .
  • the second clamping member 421 can move along the first direction X and the second direction Y, that is, the second clamping member 421 can be tightened or expanded along the second direction Y synchronously with the first clamping member 421 to clamp Or loosen the wafer bar 60 .
  • the second clamping member 421 can also move along the second direction Y, so that the second clamping member 421 pulls the wafer rod 60 through the pull rod 423 to move toward the stopper 422 along the feeding track 43 until the wafer
  • the round bar 60 is abutted against by the block 422 and fixed on the material preparation platform 42 . After the wafer bar 60 is fixed, the second clamping member 421 returns to its original position.
  • the first clamping member 421 and the second clamping member 421 are tightened synchronously to clamp the wafer bar 60 , and drive the wafer bar 60 to move in a straight line toward the center axis of the square bar 61 , that is, toward the opening position of the square bin 10 Move, merge with the top clamping mechanism 20 waiting in advance at the spatial position between the open bin 10 and the mobile platform 30, as shown in FIG. 2 .
  • the initial position of the second clamping member 421 and the fixed position of the first clamping member 421 are arranged symmetrically with respect to the midline of the length of the wafer rod 60 , so as to ensure the balance of the wafer rod 60 during clamping.
  • the unloading mechanism 50 is disposed at an end of the moving platform 30 away from the loading mechanism 40 in the second direction Y.
  • the unloading mechanism 50 and the loading mechanism 40 may be symmetrically arranged on both sides of the mobile platform 30 in the second direction Y.
  • the unloading mechanism 50 includes an unloading platform 51 partially fixed on the mobile platform 30 and a collection box 52 for collecting the edge skin 62 .
  • the unloading platform 51 may be located above the collecting box 52 in the third direction Z, and both the unloading platform 51 and the collecting box 52 may operate independently of each other.
  • the unloading table 51 can move up and down in the third direction Z, and can also move in the second direction Y, but cannot move in the first direction X.
  • the blanking table 51 can move vertically up and down in the third direction Z to receive the square bar 61 and move it to the blanking turntable (as shown in the double dotted line structure in Figure 1), the blanking turntable can be connected with the lower turntable. Table 51 is connected.
  • a blanking track 53 may be provided on the blanking platform 51 .
  • the shape, structure and material of the blanking track 53 and the loading track 43 are the same.
  • the unloading track 53 may also include a plurality of rubber rollers arranged along the first direction X.
  • the rubber roller may have a cylindrical-like structure.
  • the rubber rollers may be evenly arranged along the first direction X, but not limited thereto.
  • the rubber rollers are arranged horizontally, that is, the upper surface and the lower surface of the rubber rollers may be parallel to the plane defined by the first direction X and the second direction Y.
  • the blanking track 53 may be configured to carry square bars 61 . In order to ensure the stability of the square bar 61 on the blanking track 53, all rubber rollers on the blanking track 53 are required to be set horizontally, and the cooperation between the square bar 61 and the blanking track 53 is shown in Figure 5.
  • a plurality of sets of stops for preventing the square bar 61 from shifting are provided at the end of the blanking track 53 in the first direction X that is close to the square bin 10. plate 54.
  • the baffles 54 may be arranged at intervals along the first direction X, and the baffles 54 may be arranged on both sides of the unloading rail 53 .
  • the baffles 54 arranged on both sides of the blanking track 53 can be arranged facing each other in the second direction Y, or can be arranged in a misplaced position, as long as the purpose of preventing the deviation of the square bar 61 can be achieved.
  • the mobile platform 30 further includes a sliding platform 31 disposed outside the bin 10 , and the sliding platform 31 can extend along the second direction Y.
  • the second direction Y may be perpendicular to the first direction X.
  • the slide table 31 may be arranged symmetrically with respect to the linear axis where the central axis of the square bar 61 is located.
  • the length of the unloading platform 51 may not be less than the length of the collecting box 52 , and the length of the unloading platform 51 may be approximately the same as the sum of the lengths of the loading platform 41 and the material preparation platform 42 .
  • Two placement grooves 521 may extend parallel along the first direction X and are disposed on opposite sides of the collection box 52 in the second direction Y, and the distance between the placement grooves 521 is not greater than the width of the square bar 61 .
  • the collection box 52 can be moved to the position directly below the wafer bar 60 placed outside the opening bin 10, and the two placements of the collection box 52
  • the slots 521 may be arranged symmetrically with respect to the length axis of the wafer bar 60 , and the side skins 62 on both sides may respectively fall into the two placement slots 521 .
  • the collection box 52 is always placed at the above-mentioned position for collecting the scraps 62 until the two groups of scraps 62 in the wafer bar 60 are completely collected by the slot 521 . Then, the collection box 52 drives the edge skin 62 to retreat to its initial position, that is, the end position of the sliding bar 31 away from the feeding platform 41 .
  • the unloading platform 51 is driven by an external force to move towards the position where the square rod 61 is located, that is, towards the position between the open square bin 10 and the sliding platform 31, until the lower The material track 53 is positioned directly below the square bar 61.
  • the unloading table 51 moves vertically upwards along the third direction Z until the rubber roller in the unloading track 53 is completely in contact with the square rod 61, and then the top clamping mechanism 20 is released.
  • the top clamping mechanism 20 can keep the position still after the square bar 61 is released, waiting for the next group of wafer bars 60 to be stripped.
  • the unloading table 51 drives the square bar 61 down to the initial height along the third direction Z, and then retreats along the second direction Y to a position coaxial with the unloading turntable. So far, the unloading work of the square bar 61 is completed.
  • the unloading table 51 receives the square bar 61 and retracts
  • the new wafer bar 60 to be removed on the material preparation table 42 is clamped by the two clamping members 421 and gradually moved to where the top clamping mechanism 20 is located.
  • the wafer rod 60 is pushed against the end face of the square rod 61 in the wafer rod 60 by the main jacking shaft 21 in the jacking mechanism 20, and then any group of the wafer rod 60 is pushed against by the auxiliary jacking shaft 22
  • the opposite end surface of the side skin 62 ; the clamping member 421 opens the clamping jaws to release the wafer bar 60 .
  • the position of the clamping member 421 is still, and the clamping mechanism 20 is driven so that the suspension arm 23 drives the main jacking shaft 21 and the auxiliary jacking shaft 22 with the wafer bar 60 to move to the opening along the first direction X together.
  • the top clamping mechanism 20 drives the wafer bar 60 to be placed in the opening bin 10
  • the four side doors of the opening bin 10 are closed, and the cutting and descaling operation is performed.
  • the clamping member 421 on the material preparation table 42 is still opened, and the empty material preparation table 42 returns to its initial position, waiting for another wafer bar 60 to be stripped.
  • a method for finding a square for a wafer bar using the system as described in any one of the above, said method comprising the following steps:
  • each group of relatively set side skins 62 is cut in sequence in the opening bin 10, and after cutting each group of relatively set side skins 62 , the group of side skins 62 is collected between the opening bin 10 and the mobile platform 30;
  • the method further includes loading the wafer bar 60 Be fixed in the material preparation table 42 of loading mechanism 40, the step of fixing wafer bar 60 in the material preparation platform 42 of loading mechanism 40 includes:
  • the second clamping member close to the loading table drives the wafer bar to move toward the end of the material preparation table close to the opening bin.
  • the step of sending the wafer bar from the loading table of the feeding mechanism to the preparation table along the feeding track includes:
  • Loading platform 41 automatically rises to the same height as material preparation platform 42.
  • the wafer bar 60 is moved from the loading platform 41 to the material preparation platform 42 along the feeding track 43. At this time, the two clamps 421 in the material preparation platform 42 are all in an open state, and accordingly, the loading platform 41 falls to The original height position is ready to be connected to another wafer bar 60 transferred from the loading turntable.
  • the method may further include: after the wafer bar 60 is completely transferred to the preparation table 42, the two jaws of the second clamping member 421 on the side close to the loading table 41 move along the second direction Y Move towards each other, so that the width of the second clamping member 421 is reduced and does not contact the outer surface of the wafer rod 60, and the pull rod 423 and the wafer rod 60 arranged on the second clamping member 421 are close to the side of the loading table 41
  • the end faces are directly opposite to each other;
  • the pull rod 423 is brought into contact with the end surface of the wafer rod 60 by the second clamp 421 close to the side of the loading table 41, and the wafer rod 60 is pulled by the pull rod 423 to move toward the open bin 10 along the feeding track 43 until the wafer rod 423
  • the end face of the round rod 60 far away from the feeding table 41 is against the stopper 422 provided on the feeding rail 43 on the material preparation table 42, thereby completing the positioning of the wafer rod 60 on the material preparation table 42;
  • the wafer bar 60 is driven by the preparation table 42 to move along the second direction Y to the door of the opening bin 10 near the sliding table 31, that is, to be preset in advance between the opening bin 10 and the sliding bar 31
  • the area between the main top shaft 21 and the auxiliary top shaft 22 which are arranged oppositely.
  • the method further includes: after the loading mechanism 40 loads another wafer bar 60 to be descaled on the bin opening of the opening bin 10 close to the moving platform 30, the top clamping mechanism 20 Clamping the wafer bar 60, the steps of the top clamping mechanism 20 clamping the wafer bar 60 include:
  • the top clamping mechanism 20 is preset between the square bin 10 and the slide table 31 in advance, and the two sets of main jacking shafts 21 and auxiliary jacking shafts 22 face each other in the first direction X and are suspended on the top of the wafer bar 60 at both ends.
  • Make the suspension arm 23 drive the main jacking shaft 21 and the auxiliary jacking shaft 22 to move to a position coaxial with the wafer bar 60;
  • the top clamping mechanism 20 drives the wafer bar 60 to pass through the space between the clamping pieces 421 and enter into the opening bin 10 for cutting.
  • the whole material preparation platform 42 is moved along the second direction Y and returned to its initial position, waiting for the loading of the next group of wafer rods 60 .
  • the step of obtaining the edgeless square bar 61 by the blanking mechanism 50 includes: collecting the edge 62 by the collection box 52, and the step of collecting the edge 62 by the collection box 52 includes:
  • the top frame mechanism 20 drives the wafer bar 60 out of the opening bin 10 and moves to the position where the wafer bar 60 is loaded and handed over, that is, moves to the opening bin 10 and the sliding table 31 between.
  • the collection box 52 is moved from below the unloading table 51 to just below the wafer bar 60 that is taken out of the square bin 10, and the two placing grooves 521 in the collection box 52 are respectively located at two sides of the axis of the wafer bar 60. side.
  • the auxiliary top shaft 22 is released synchronously and the opposite side skin 62 is synchronously dropped into the placement groove 521 corresponding thereto; the collection box 52 is fixed at this position.
  • the step of obtaining the square bar without edge 61 through the unloading mechanism 50 further includes: collecting the square bar without edge 61 after all the aligned edges are collected.
  • the step of collecting the square stick 61 without edge skin includes:
  • the unloading table 51 is moved along the second direction Y to directly below the square bar 61 .
  • the unloading table 51 is raised along the third direction Z until it contacts with the lower end surface of the square bar 61 .
  • Table 1 shows the comparison of the time taken for any group of wafer bars 60 to be loaded, squared, trimmed 62 and unloaded, and the equipment utilization rate. It can be seen from Table 1 that the square opening time of each group of wafer bars is shortened to 18-22 minutes, and the equipment utilization rate is increased to 95-97%.
  • the loading of the wafer bar to be squared and the unloading of the wafer bar after descaling are carried out on different sides, and the next round of wafer bar to be opened can be carried out synchronously.
  • the loading of square wafer rods and the unloading of the previous round of peeled wafer rods can not only improve the safety of silicon rod turnover, but also make the loading and unloading work seamless, high production efficiency, and shorten the overall processing time to 18-22min, and increase the equipment utilization rate to 95-97%.
  • the use of separately arranged edge skin collection structure can reduce the collision between the edge skins and between the edge skin and the crystal square rod, and ensure the quality of the silicon rod.
  • the wafer ingot squaring control system and control method provided by the present invention solve the problem of low production efficiency and serious silicon ingot bumping caused by the same side operation of wafer ingot loading and wafer square ingot unloading in the prior art. technical problem.

Abstract

一种晶圆棒（60）开方系统及方法，晶圆棒（60）开方系统包括：开方仓（10），用于去除晶圆棒（60）的边皮（62）；以及移动平台（30），在第一方向上置于开方仓（10）的一侧。移动平台（30）上设有上料机构（40）和下料机构（50），上料机构（40）和下料机构（50）分别设置在移动平台（30）的在与第一方向不同的第二方向上相对的两侧，上料机构（40）能够在下料机构（50）收集边皮（62）并将去除边皮（62）后的方棒（61）移走的同时将待开方的另一晶圆棒（60）送至开方仓（10）处。

Description

晶圆棒开方系统及方法
相关申请的交叉引用
本申请要求于2022年1月26日提交的中国专利申请第202210094054.3号的优先权的权益，该中国专利申请的内容通过引用全部包含于此。
技术领域
本发明属于单晶硅棒加工技术领域，尤其是涉及一种晶圆棒开方系统及方法。
背景技术
在晶圆棒开方过程中，现有设备通过在同一条滑动轨道上进行操作，上料和下料是同侧进行，也就是说，在开方前的晶圆棒上料及开方后的晶圆棒下料都是使用同一个机械手进行取放，机械手在下料抓取的同时无法进行上料周转，这样上下料的过程就存在工时浪费的情况，无法进行充分的衔接，使得加工效率低，设备稼动率低。同时，由于设备结构设计不合理，导致开方边皮下料时边皮之间容易磕碰，且在晶方棒下料周转过程中也容易磕碰或崩损。
发明内容
在本发明的一些实施例中，一种晶圆棒开方控制系统，包括：用于去除晶圆棒边皮的开方仓以及置于开方仓端部的移动平台；移动平台配设有上料机构和下料机构，上料机构和下料机构异侧设置在开方仓两侧，上料机构能够在下料机构收集所有边皮并将开方后的晶圆棒移走时同步将新的待开方的晶圆棒送至开方仓处。
在本发明的一个实施例中，开方仓中配设有用于顶固晶圆棒的顶夹机构，顶夹机构包括被悬吊设置的主顶轴和副顶轴；
主顶轴用于顶固晶圆棒中的方棒所在端面；
副顶轴用于顶固晶圆棒中对位设定的所述边皮所在端面；
主顶轴和副顶轴可一同沿开方仓的长度方向移动至移动平台处。
在本发明的一个实施例中，移动平台包括置于开方仓外部的滑动台，上料机构和下料机构均与开方仓长度方向平行并垂直于滑动台长度方向设置，上料机构和下料机构独立地沿滑动台长度方向滑动设置。
在本发明的一个实施例中，上料机构包括：
固设于滑动台一端的上料台；
和靠近开方仓一侧设置并与上料台配合的备料台；
上料台和备料台均配设有同轴设置的上料轨道；
在备料台上还设有两组用于抓取晶圆棒的夹固件；
置于备料台中的上料轨道的位置一定，并高于置于上料台中的上料轨道的初始位置；且上料台可沿竖直方向上下移动，以使置于上料台上的晶圆棒沿上料轨道移动至备料台中。
在本发明的一个实施例中，夹固件包括两个相对设置且内侧壁均为C型结构的夹爪；置于备料台中的上料轨道贯穿夹爪围成的卡固区域设置。
在本发明的一个实施例中，在备料台中的上料轨道上还设有用于定位晶圆棒的挡块，挡块被设于备料台中的上料轨道靠近开方仓一端设置；
靠近挡块的夹固件可沿备料台宽度方向移动；
远离挡块的夹固件可沿备料台的宽度以及其长度方向移动。
在本发明的一个实施例中，远离挡块的夹固件设有拉杆，拉杆受其所在的夹固件带动以拉动晶圆棒朝靠近挡块一端移动，并使晶圆棒被挡块抵顶固定在备料台上；
拉杆为L型结构，沿备料台的长度方向水平设置，其一端固设于远离挡块的夹固件靠近上料台的侧壁面上，另一端悬空设置。
在本发明的一个实施例中，下料机构被设于滑动台中远离上料机构的一端，包括部分固设于滑动台的下料台和用于收集边皮的收集箱；
下料台位于收集箱的上方且独立于收集箱被控制；
下料台可竖直上下移动，以接取开方后的晶圆棒并使其移至下料周转台。
在本发明的一个实施例中，下料台设有下料轨道；
下料轨道与上料轨道均配设有若干橡胶滚轮；
下料轨道中的橡胶滚轮均为水平设置；
上料轨道中的橡胶滚轮均为斜向上相向设置；
下料轨道靠近开方仓一端设有若干组用于防止开方后的晶圆棒偏移的挡板，挡板沿下料轨道长度方向并排间隙设置在下料轨道两侧。
在本发明的一个实施例中，沿收集箱宽度方向设有两个并排设置的放置槽，放置槽之间的间隔距离不大于开方后的晶圆棒的宽度；
在任一组对位设置的边皮下落时收集箱被移动至置于开方仓外部的晶圆棒的正下方，并使两个放置槽相对于晶圆棒的长度轴线对称设置。
本发明提供了一种晶圆棒开方控制方法，采用如上任一项的控制系统，步骤包括：
基于晶圆棒中对位边皮的组数在开方仓中依次对每一组对位边皮进行切割，并在每完成一组对位边皮的切割后都在开方仓与移动平台之间对该组边皮进行收集；
控制下料机构获取无边皮的晶圆棒，并同时控制上料机构上载新的待开方的晶圆棒于开方仓处。
在本发明的一个实施例中，晶圆棒被上载至开方仓之前，还包括将晶圆棒固定在备料台中，步骤包括：
控制晶圆棒从上料台中沿上料轨道送至备料台中；
控制备料台中靠近上料台一侧的夹固件带动晶圆棒朝靠近开方仓一端移动；
使晶圆棒远离上料台的一侧端面抵顶置于上料轨道的挡块；
控制所有夹固件夹取晶圆棒；
驱动上料台带动晶圆棒移动至开方仓靠近移动平台一侧仓门处。
在本发明的一个实施例中，在顶夹机构夹取晶圆棒的过程中，步骤包括：
顶夹机构被空置悬吊在开方仓与移动平台之间，并预置在晶圆棒两端；
控制主顶轴顶固晶圆棒中预设的方棒所在端面位置；
控制副顶轴顶固晶圆棒中任一组对位边皮所在端面；
顶夹机构带动晶圆棒穿过夹固件并进入开方仓中准备切割；
备料台带动张开的夹固件回撤。
在本发明的一个实施例中，在收集边皮过程中，包括：
控制收集箱从下料台的下方移至被带离出开方仓的晶圆棒的正下方；
松开副顶轴并使对位边皮下落至与其对应设置的放置槽中；
重复上述步骤，直至收集完所有对位边皮；
控制收集箱回撤至其初始位置。
在本发明的一个实施例中，在收集所有对位边皮后，还包括收取无边皮的晶圆棒，包括：
控制下料台移至晶圆棒的正下方；
驱动下料台上升至与晶圆棒的下端面接触；
松开主顶轴使晶圆棒放置在下料台上；
控制下料台带动晶圆棒返回至其初始位置。
本发明提供了一种晶圆棒开方系统，其包括：开方仓，用于去除晶圆棒的边皮；以及移动平台，在第一方向上置于开方仓的一侧。移动平台上设有上料机构和下料机构，上料机构和下料机构分别设置在移动平台的在与第一方向不同的第二方向上相对的两侧，上料机构能够在下料机构收集边皮并将去除边皮后的晶圆棒移走的同时将待开方的另一晶圆棒送至开方仓处。
本发明提供了一种晶圆棒开方方法，采用如上的晶圆棒开方系统，晶圆棒开方方法包括：基于晶圆棒的相对设置的边皮的组数，在开方仓中依次对每一组相对设置的边皮进行切割，并在对每组相对设置的边皮进行了切割后，在开方仓与移动平台之间对组边皮进行收集；通过下料机构获取无边皮的晶圆棒，并同时通过上料机构将新的待去除边皮的另一晶圆棒上载于开方仓处。
附图说明
图1是本发明一实施例的一种晶圆棒开方控制系统的俯视图；
图2是本发明一实施例的上料时备料台与顶夹机构的配合的剖视图；
图3是本发明一实施例的备料台与晶圆棒配合的俯视图；
图4是本发明一实施例的备料台与晶圆棒配合的剖视图；
图5是本发明一实施例的下料台与晶圆棒配合的剖视图；
图6是本发明一实施例的收边皮时收集箱与顶夹机构的配合的俯视 图；
图7是本发明一实施例的下料时下料台与顶夹机构的配合的剖视图。附图标记说明：
10、开方仓            20、顶夹机构        21、主顶轴
22、副顶轴            23、悬吊臂          30、移动平台
31、滑动台            40、上料机构        41、上料台
42、备料台            421、夹固件         422、挡块
423、拉杆             43、上料轨道        50、下料机构
51、下料台            52、收集箱          53、下料轨道
54、挡板              60、晶圆棒          61、方棒
62、边皮              424、橡皮垫         521、放置槽
具体实施方式
下面结合附图和具体实施例对本发明进行详细说明。
本实施例提出一种晶圆棒开方系统，如图1所示，晶圆棒开方系统可以包括用于去除晶圆棒60的边皮的开方仓10以及置于开方仓10的一侧的移动平台30。这里术语“开方”意指通过高速运动的金刚线对硅棒进行摩擦，切出方锭，从而达到切割目的。
在一个实施例中，晶圆棒60含有四条晶线，包括四个边皮62和一个方棒61(如图6所示)，但不限于此。晶圆棒60可以包括六个边皮和一个方棒。晶圆棒60的其他结构为本领域人员常识，附图省略。下面以晶圆棒60含有四条晶线为例进行描述。
在一个实施例中，移动平台30可以与开方仓10在第一方向X上间隔设置，即，移动平台30可以在第一方向X上置于开方仓10的一侧。第一方向X可以是开方仓10延伸所沿的方向，即，开方仓10的长度方向。
在移动平台30上设有用于将待切割边皮的晶圆棒60准备运送至开方仓10的上料机构40和用于将经切割处理的晶圆棒60从开方仓10处取出的下料机构50。上料机构40和下料机构50可以设置在移动平台30的两侧，即，上料机构40和下料机构50可以分别设置在移动平台30的在与第一方向X不同的第二方向Y上相对的两侧，上料机构40能够在下料机构50收集所有边皮62并将方棒61(去除所有边皮后的晶圆棒)移走的同时 将待去除边皮的另一晶圆棒60送至开方仓10靠近移动平台30的入口处。在一个实施例中，上料机构40能够在下料机构50收集四个边皮62并将方棒61移走的同时将待去除边皮的另一晶圆棒60送至开方仓10靠近移动平台30的入口处。
在一个实施例中，开方仓10可以为四方均为活动式结构的仓门所围成的加工腔，顶夹机构20可以设置在加工腔中。顶夹机构20悬吊设置在晶圆棒60的在第一方向X上相对的两侧处以用于顶固晶圆棒60端部。如图2所示，顶夹机构20可以包括被悬吊臂23悬吊设置且分别设置在开放仓10的在第一方向X上相对的两侧处的两组主顶轴21和副顶轴22。每组主顶轴21和副顶轴22中，副顶轴22可以设置在主顶轴21的相对侧面处。
在一个实施例中，每组主顶轴21和副顶轴22可以包括两个主顶轴21和四个副顶轴22，如图1和图2中所示，两个主顶轴21可以布置在第二方向Y上，四个副顶轴22可以包括布置在第二方向Y上的两个副顶轴22和布置在与第一方向X和第二方向Y不同的另一方向(例如，第三方向)上的两个副顶轴22。在一个实施例中，每组主顶轴21和副顶轴22包括一个主顶轴21和两个副顶轴22。在一个实施例中，每组主顶轴21和副顶轴22包括一个主顶轴21和四个副顶轴22。主顶轴21的中心轴和方棒61的中心轴可以共线，以用于顶固方棒61的相对的端面；副顶轴22可以与晶圆棒60中的边皮62对准，以用于顶固晶圆棒60中的边皮62的相对的端面。主顶轴21和副顶轴22可以分别由两套控制系统控制，也即是，主顶轴21和副顶轴22可以相互独立操作。如图2中所示，主顶轴21和副顶轴22可以一同受悬吊臂23带动沿第一方向X移动至移动平台30处。
在顶固晶圆棒60的过程中，主顶轴21率先与晶圆棒60中的方棒61的端面接触并顶固夹紧；待主顶轴21稳定地顶固到方棒61后，副顶轴22与晶圆棒60中任一对设置在方棒的相对两侧处的边皮62的端面接触，并逐步顶紧固定。待该对边皮62被切割完毕后，悬吊臂23的运动可以带动主顶轴21、副顶轴22和晶圆棒60移至开方仓10和移动平台30之间的转接区域。下料机构50中移至晶圆棒60的正下方，松开位于晶圆棒60的在第一方向X的两侧处的所有副顶轴22，并使该对边皮62分别下落至下料机构50中。下料机构50固定不动，悬吊臂23的运动可以带动晶圆棒60 返回开方仓10中，继续切割另一对边皮62。晶圆棒60再移出开方仓10后，另一对边皮62下落至下料机构50中。下料机构50返回初始位置。
在一个实施例中，上料机构40和下料机构50可以均平行于第一方向X延伸。在一个实施例中，上料机构40和下料机构50可以垂直于第二方向Y设置。在一个实施例中，上料机构40和下料机构50均可以独立地沿第二方向Y滑动。
在一个实施例中，上料机构40可以包括远离开方仓10设置且固设于移动平台30在第二方向Y上的一端的上料台41和靠近开方仓10设置并与上料台41可配合使用的备料台42。上料台41和备料台42可以沿第一方向X延伸且均彼此独立地操作。上料台41和备料台42上均设置有同一规格和结构、并同轴设置的上料轨道43。因此，移动到上料台41的上料轨道43上的晶圆棒60可以沿上料轨道43从上料台41移动至备料台42上。上料轨道43可以沿第一方向X延伸。
在一个实施例中，备料台42的高度位置固定不变，相应地，备料台42上的上料轨道43的高度是固定不变的。换句话说，备料台42可以沿第一方向X和/或第二方向Y移动，但是不能沿第三方向Z上下移动。上料台41可以沿第三方向Z上下移动，但不能沿第一方向X和/或第二方向Y移动。为了确保晶圆棒60通过上料台41移至备料台42上，备料台42上的上料轨道43的高度可以高于上料台41上的上料轨道43的初始位置的高度。上料机构40还可以包括用于传送待去除边皮的晶圆棒60的上料周转台，上料周转台可以位于上料台41的远离开放仓10的一侧且与上料台41连接(见图1中的双点虚线结构)。考虑到上料周转台的在第一方向X上的长度及生产成本的影响，上料周转台的高度不能太高，从而使得上料台41的初始位置(例如，初始位置的高度)需要与上料周转台的高度相适配(例如，与上料周转台的高度位于同一水平处)，进而导致从上料周转台传送的晶圆棒60的高度低于备料台42的初始位置(例如，初始高度)。在晶圆棒60从上料周转台移至上料台41后，上料台41可以自动上升至与备料台42同高位置，再通过上料轨道43将晶圆棒60传送至备料台42上。
如图3中所示，在备料台42上还设有两个夹固件421，夹固件421作为机械手用于抓取晶圆棒60。两个夹固件421中的靠近开方仓10设置的 夹固件可以被称为第一夹固件421，并且两个夹固件421中的远离开方仓设置的夹固件可以被称为第二夹固件421。
如图4中所示，每夹固件421可以包括在第二方向Y上相对设置且内侧壁均为类C型结构的两个夹爪。每个夹爪的上段部和下段部上分别设有从夹爪的内壁朝向晶圆棒60的中心突出橡皮垫424，橡皮垫424可以直接与晶圆棒60的外壁面接触，以用于夹取晶圆棒60。置于备料台42上的上料轨道43沿第一方向X贯穿相对设置的夹爪所围成的卡固区域。上料轨道43包括沿第一方向X排列的多个类圆鼓形的橡胶滚轮。在一个实施例中，橡胶滚轮可以沿第一方向X均匀排列，但不限于此。在剖视图中，所有橡胶滚轮均为斜向上相向设置，即，所有橡胶滚轮均为相对于第二方向Y以锐角倾斜地设置，并且在第二方向Y上相对设置的一对橡胶滚轮沿着第二方向Y和第三方向Z之间的朝向晶圆棒的方向延伸，以便于与晶圆棒60的外侧表面点接触，以提高晶圆棒60在上料轨道43的滑动效果，降低晶圆棒60在上料轨道43上的滑动阻力。
如图3中所示，在备料台42上的上料轨道43还可以包括用于定位晶圆棒60的挡块422，挡块422可以固定设置在备料台42上的上料轨道43靠近开方仓10的一端处，设置挡块422，以便于将晶圆棒60定位在与顶夹机构20将要在其处夹取晶圆棒60的位置处，以保证顶夹机构20精准地顶固晶圆棒60。
在一个实施例中，靠近挡块422的第一夹固件421可以沿第二方向Y移动，而不能沿第一方向X移动，目的是定位其夹取晶圆棒60靠近挡块422一端的位置。
在一个实施例中，远离挡块422的第二夹固件421中的一个抓夹上设有拉杆423，拉杆423具有L型结构，拉杆423的一端固设于第二夹固件421中的所述一个抓夹靠近上料台41的侧表面上，拉杆423的另一端悬空设置。拉杆423从拉杆423的所述一端沿第一方向X朝向上料台延伸，然后沿第二方向Y朝向下料台50延伸到拉杆423的所述另一端。第二夹固件421可以沿第一方向X和第二方向Y移动，也即是，第二夹固件421既可以与第一夹固件421同步地沿第二方向Y收紧或扩展，以夹取或松开晶圆棒60。与第一夹固件421不同，第二夹固件421还可以沿第二方向Y 移动，使得第二夹固件421通过拉杆423来拉动晶圆棒60沿上料轨道43朝向挡块422移动，直到晶圆棒60被挡块422抵顶并固定在备料台42上。在晶圆棒60固定好后，第二夹固件421再返回至其初始位置处。第一夹固件421和第二夹固件421同步收紧以夹取晶圆棒60，带动晶圆棒60朝方棒61的中心轴所在直线移动，也即是朝开方仓10的仓口位置处移动，与提前静候在开方仓10和移动平台30之间的空间位置处的顶夹机构20汇合，如图2中所示。第二夹固件421的初始位置与第一夹固件421的固定位置相对于晶圆棒60的长度的中线对称设置，目的是保证夹取时晶圆棒60的平衡。
如图1所示，下料机构50被设于移动平台30的在第二方向Y上远离上料机构40的一端。在一个实施例中，下料机构50和上料机构40可以对称地设置在移动平台30的在第二方向Y上的两侧。下料机构50包括部分固设于移动平台30上的下料台51和用于收集边皮62的收集箱52。下料台51可以在第三方向Z上位于收集箱52的上方且下料台51和收集箱52均可以相互独立地操作。下料台51可以在第三方向Z上上下移动，也可以沿第二方向Y移动，但不可以沿第一方向X移动。下料台51可以在第三方向Z上竖直地上下移动，以接取方棒61并使其移至下料周转台(如图1中双点虚线结构)，下料周转台可以与下料台51连接。
下料台51上可以设有下料轨道53。下料轨道53与上料轨道43的形状、结构和材料相同。下料轨道53也可以包括沿第一方向X排列的多个橡胶滚轮。在一个实施例中，橡胶滚轮可以为类圆柱形结构。在一个实施例中，橡胶滚轮可以沿第一方向X均匀排列，但不限于此。在剖视图中，橡胶滚轮均为水平设置，即，橡胶滚轮的上表面和下表面可以平行于由第一方向X和第二方向Y限定的平面。下料轨道53可以被构造为承载方棒61。为了保证方棒61在下料轨道53上的稳定性，要求下料轨道53上的所有橡胶滚轮均为水平设置，方棒61与下料轨道53的配合如图5所示。
为了保证方棒61被放置在下料轨道53上的位置的精准性，在下料轨道53的在第一方向X上靠近开方仓10的一端设有多组用于防止方棒61偏移的挡板54。挡板54可以沿第一方向X彼此间隔地布置，挡板54可以布置在下料轨道53的两侧。设置在下料轨道53两侧的挡板54可以在第二 方向Y上彼此面对地设置，也可以错位设置，只要可达到防止方棒61偏移的目的即可。
在一个实施例中，如图1中所示，移动平台30还包括置于开方仓10外部的滑动台31，该滑动台31可以沿第二方向Y延伸。在一个实施例中，第二方向Y可以垂直于第一方向X。滑动台31可以关于方棒61的中心轴所在直线轴对称地设置。
如图1和图6所示，下料台51的长度可以不小于收集箱52的长度，下料台51的长度可以与上料台41和备料台42的长度之和大致相同。两个放置槽521可以沿第一方向X平行地延伸且设置在收集箱52的在第二方向Y上相对的两侧处，放置槽521之间的间隔距离不大于方棒61的宽度。在收集任一组相对设置的下落的边皮62的过程中，收集箱52可以移动至置于开方仓10外部的晶圆棒60的正下方的位置处，且收集箱52的两个放置槽521可以相对于晶圆棒60的长度轴线对称设置，两侧的边皮62可以分别落入两个放置槽521中。收集箱52一直放置在收集边皮62的上述位置处，直至晶圆棒60中的两组边皮62完全被放置槽521收集完毕。然后，收集箱52再带动边皮62回撤到其初始位置处，也即是位于滑动条31远离上料台41的端部位置。
如图7所示，在收集箱52回撤的同时，下料台51被外力驱动朝向方棒61所在的位置移动，即朝向在开方仓10和滑动台31之间的位置移动，直至下料轨道53位于方棒61的正下方。下料台51沿第三方向Z竖直向上移动直至下料轨道53中的橡胶滚轮完全与方棒61接触，再松开顶夹机构20。顶夹机构20可以在松开方棒61后保持位置不动，等待下一组待去除边皮的晶圆棒60。下料台51带动方棒61沿第三方向Z向下行至初始高度，再沿第二方向Y回撤至与下料周转台同轴位置处，至此，完成方棒61的下料工作。
在下料台51收接方棒61回撤的同时，置于备料台42上的新的待去除边皮的晶圆棒60被两个夹固件421夹紧并被逐步移至顶夹机构20所在位置处，晶圆棒60被顶夹机构20中的主顶轴21顶固该晶圆棒60中的方棒61端面，随后，副顶轴22再顶固该晶圆棒60的任一组相对设置的边皮62的端面；夹固件421张开夹爪，放开晶圆棒60。此时，夹固件421位置不 动，而顶夹机构20被驱动以使悬吊臂23带动带有晶圆棒60的主顶轴21和副顶轴22，一同沿第一方向X移动至开方仓10内。待顶夹机构20带动晶圆棒60置于开方仓10内后，开方仓10的四侧仓门关闭，进行切割去边皮操作。与此同时，备料台42上夹固件421仍然张开不变，空置的备料台42返回至其初始位置，等待待去除边皮的另一晶圆棒60。
一种晶圆棒开方方法，采用如上任一项所述的系统，所述方法包括以下步骤：
基于晶圆棒60中相对设置的边皮62的组数，在开方仓10中依次对每一组相对设置边皮62进行切割，并在对每组相对设置的边皮62进行了切割后，在开方仓10与移动平台30之间对该组边皮62进行收集；
通过下料机构50获取无边皮的方棒61，并同时通过上料机构40将待去除边皮的另一晶圆棒60上载于开方仓10靠近移动平台30的仓口处。
在一个实施例中，在通过上料机构40将待去除边皮的另一晶圆棒60上载于开方仓10靠近移动平台30的仓口处之前，所述方法还包括将晶圆棒60固定到上料机构40的备料台42中，将晶圆棒60固定到上料机构40的备料台42中的步骤包括：
将晶圆棒从上料机构的上料台沿上料轨道送至备料台上；
在备料台上的夹固件中的靠近上料台的第二夹固件带动所述晶圆棒朝向备料台的靠近所述开方仓的一端移动。
在一个实施例中，将晶圆棒从上料机构的上料台中沿上料轨道送至备料台上的步骤包括：
将晶圆棒60从上料周转台传送到上料台41上；
上料台41自动上升至与备料台42同一高度处。
将晶圆棒60从上料台41沿上料轨道43移动至备料台42中，此时，备料台42中的两个夹固件421均处于张开状态，相应地，上料台41下落至原始高度位置，准备再接入从上料周转台中传送的另一晶圆棒60。
在一个实施例中，所述方法还可以包括：待晶圆棒60完全传送到备料台42上后，靠近上料台41一侧的第二夹固件421的两个夹爪沿第二方向Y朝向彼此移动，使得第二夹固件421的宽度减小且不与晶圆棒60的外侧表面接触，并使设置在第二夹固件421上的拉杆423与晶圆棒60靠近上料 台41的端面正相对设置；
由靠近上料台41一侧的第二夹固件421带动拉杆423与晶圆棒60的所述端面接触，通过拉杆423拉动晶圆棒60沿上料轨道43朝向开方仓10移动，直至晶圆棒60的远离上料台41的端面抵顶设置在备料台42上的上料轨道43上的挡块422，进而使晶圆棒60在备料台42上定位完成；
使靠近上料台41一侧的第二夹固件421朝向上料台41移动，直至其与第一夹固件421沿晶圆棒60长度中线对称设置，使所有夹固件421(例如，第一夹固件和第二夹固件)收缩并夹取晶圆棒60；
通过备料台42带动晶圆棒60沿第二方向Y移动至开方仓10靠近滑动台31一侧的仓门处，即，移动至提前预设在位于开方仓10和滑动条31之间的相对设置的主顶轴21和副顶轴22之间的区域。
在一个实施例中，所述方法还包括：在通过上料机构40将待去除边皮的另一晶圆棒60上载于开方仓10靠近移动平台30的仓口处后，顶夹机构20夹取晶圆棒60，顶夹机构20夹取晶圆棒60的步骤包括：
使顶夹机构20提前预设在开方仓10与滑动台31之间，并使两组主顶轴21和副顶轴22在第一方向X上彼此相对且悬吊在晶圆棒60的两端处。使悬吊臂23带动主顶轴21和副顶轴22移动至与晶圆棒60同轴心高度的位置；
先使主顶轴21顶固晶圆棒60中预设的方棒61的端面；再使副顶轴22顶固晶圆棒60中任一组相对设置的边皮62的端面；
使顶夹机构20完全夹紧晶圆棒60的两端，备料台42中的夹固件421的夹爪缓慢向外张开以松开晶圆棒60；
再使顶夹机构20带动晶圆棒60穿过夹固件421之间的空间区域并进入开方仓10中准备切割。同时，使备料台42整体沿第二方向Y移动并返回至其初始位置处，等待下一组晶圆棒60的上料。
在一个实施例中，通过下料机构50获取无边皮的方棒61的步骤包括：由收集箱52收集边皮62，由收集箱52收集边皮62的步骤包括：
当边皮62被切割后，由顶架机构20带动晶圆棒60从开方仓10中移出并移至晶圆棒60上料交接的位置处，即移至开方仓10和滑动台31之间。
使收集箱52从下料台51的下方移至被带离出开方仓10的晶圆棒60 的正下方，并使收集箱52中的两个放置槽521分别位于晶圆棒60轴线两侧。
同步松开副顶轴22并使相对设置的边皮62同步下落至与其对应设置的放置槽521中；收集箱52固定在该位置不动。
重复上述步骤，直至收集完另外一组对位边皮62后，再使收集箱52回撤至其初始位置。
在本发明的一个实施例中，通过下料机构50获取无边皮的方棒61的步骤还包括：在收集完所有对位边皮后，收取无边皮的方棒61。收取无边皮的方棒61的步骤括：
使下料台51沿第二方向Y移至方棒61的正下方。
再使下料台51沿第三方向Z上升，直至与方棒61的下端面接触。
松开主顶轴21使方棒61放置在下料台51上的下料轨道53上，待方棒61放置稳定后，使下料台51下行至其初始高度的位置，并带动方棒61返回至下料台51的初始位置处。
此时，已经放置在备料台42上的另一晶圆棒60被移至顶夹机构20的正下方。
采用上述方法与采用现有技术相比，表1示出了任一组晶圆棒60上料、开方、收边皮62和下料后所用的时间的对比以及设备稼动率的对比。从表1中可以看出，每一组晶圆棒开方的时间缩短至18-22min，设备稼动率提高至95-97％。
表1本方法与现有技术获得的技术效果
Figure PCTCN2022134286-appb-000001
与现有技术相比，在本发明的实施例中，待开方的晶圆棒上料和去边皮后的晶圆棒下料是采用异侧传输，且可同步进行下一轮待开方晶圆棒的上料和上一轮去边皮晶圆棒的下料，不仅可提高硅棒周转的安全性，亦可使上下料工作无缝隙衔接，生产效率高，使整体加工时间缩短至18-22min，并使设备稼动率提高至95-97％。采用分开设置的边皮收集结构，可降低边皮之间以及边皮与晶方棒之间的磕碰，保证硅棒质量。本发明提供的晶圆 棒开方控制系统及控制方法解决了现有技术中由于晶圆棒的上料和晶方棒的下料为同侧操作而导致的生产效率低、硅棒磕碰严重的技术问题。
以上对本发明的实施例进行了详细说明，所述内容仅为本发明的较佳实施例，不能被认为用于限定本发明的实施范围。凡依本发明申请范围所作的均等变化与改进等，均应仍归属于本发明的专利涵盖范围之内。

Claims (15)

  1. 一种晶圆棒开方系统，其特征在于，包括：
    开方仓，用于去除所述晶圆棒的边皮；以及
    移动平台，在第一方向上置于所述开方仓的一侧，
    其中，所述移动平台上设有上料机构和下料机构，所述上料机构和所述下料机构分别设置在所述移动平台的在与所述第一方向不同的第二方向上相对的两侧，所述上料机构能够在所述下料机构收集所述边皮并将去除所述边皮后的所述晶圆棒移走的同时将待开方的另一晶圆棒送至所述开方仓处。
  2. 根据权利要求1所述的晶圆棒开方系统，其特征在于，所述开方仓包括在所述第一方向上悬吊设置以用于顶固所述晶圆棒的顶夹机构，所述顶夹机构包括主顶轴和副顶轴，
    所述主顶轴用于顶固所述晶圆棒的端面，
    所述副顶轴用于顶固所述晶圆棒中的所述边皮的相对端面，
    所述主顶轴和所述副顶轴能够一同沿所述第一方向移动至所述移动平台处。
  3. 根据权利要求2所述的晶圆棒开方系统，其特征在于，所述上料机构包括：
    上料台，固设于所述移动平台在所述第二方向上的一端；以及
    备料台，靠近所述开方仓设置并与所述上料台配合，
    其中，所述上料台和所述备料台上均设置有同轴设置的上料轨道，
    在所述备料台上还设有两个用于抓取所述晶圆棒的夹固件，
    所述备料台上的所述上料轨道的高度是固定不变的，并高于所述上料台上的所述上料轨道的初始位置的高度；且所述上料台被构造为沿竖直方向上下移动，以使置于所述上料台上的所述晶圆棒沿所述上料轨道移动至所述备料台上。
  4. 根据权利要求3所述的晶圆棒开方系统，其特征在于，所述夹固件中的每个包括在所述第二方向上相对设置且内侧壁均为类C型 结构的两个夹爪，所述备料台上的所述上料轨道沿所述第一方向贯穿所述夹爪围成的卡固区域。
  5. 根据权利要求3所述的晶圆棒开方系统，其特征在于，在所述备料台上的所述上料轨道包括于定位所述晶圆棒的挡块，所述挡块固定设置在所述备料台上的所述上料轨道靠近所述开方仓的一端处，
    所述夹固件中的靠近所述挡块的夹固件被构造为沿所述第二方向移动，
    所述夹固件中的远离所述挡块的夹固件被构造为沿所述第一方向和所述第二方向移动。
  6. 根据权利要求5所述的晶圆棒开方系统，其特征在于，远离所述挡块的所述夹固件上设有拉杆，所述拉杆在远离所述挡块的所述夹固件的带动下拉动所述晶圆棒朝向所述挡块移动，并使所述晶圆棒被所述挡块抵顶固定在所述备料台上，
    所述拉杆具有L型结构，所述拉杆的一端固设于远离所述挡块的所述夹固件的靠近所述上料台的侧表面上，所述拉杆的另一端悬空设置。
  7. 根据权利要求3至4和6中的任一项所述的晶圆棒开方系统，其特征在于，所述下料机构被设于所述移动平台的远离所述上料机构的一端，所述下料机构包括部分固设于所述移动平台上的下料台和用于收集所述边皮的收集箱，
    所述下料台在与所述第一方向和所述第二方向不同的第三方向上位于所述收集箱的上方且独立于所述收集箱进行操作，
    所述下料台被构造为在所述第三方向上上下移动，以接取去除所述边皮后的所述晶圆棒并使其移至下料周转台。
  8. 根据权利要求7所述的晶圆棒开方系统，其特征在于，所述下料台上设有下料轨道，
    所述下料轨道与所述上料轨道均包括多个橡胶滚轮，
    所述下料轨道的所述橡胶滚轮均为水平设置，
    所述上料轨道的所述橡胶滚轮均为斜向上相向设置，
    所述下料轨道靠近所述开方仓一端设有用于防止去除所述边皮 后的所述晶圆棒偏移的多组挡板，所述挡板沿所述第一方向彼此间隔地布置并且设置在所述下料轨道的两侧。
  9. 根据权利要求8所述的晶圆棒开方系统，其特征在于，所述收集箱包括两个放置槽，所述放置槽可以沿所述第一方向平行地延伸且设置在所述收集箱的在所述第二方向上相对的两侧处，所述放置槽之间的间隔距离不大于去除所述边皮后的所述晶圆棒的宽度，
    在每组相对设置的所述边皮下落前所述收集箱被移动至置于所述开方仓外部的所述晶圆棒的正下方，并使两个所述放置槽相对于所述晶圆棒的中心轴对称设置。
  10. 根据权利要求1或2所述的晶圆棒开方系统，其特征在于，所述移动平台包括置于所述开方仓外部的滑动台，所述上料机构和所述下料机构均与所述第一方向平行并垂直于所述第二方向设置，所述上料机构和所述下料机构独立地沿所述第二方向滑动设置。
  11. 一种晶圆棒开方方法，其特征在于，采用如权利要求6所述的晶圆棒开方系统，所述晶圆棒开方方法包括：
    基于所述晶圆棒的相对设置的所述边皮的组数，在所述开方仓中依次对每一组相对设置的所述边皮进行切割，并在对每组相对设置的所述边皮进行了切割后，在所述开方仓与所述移动平台之间对所述组边皮进行收集；
    通过所述下料机构获取无所述边皮的所述晶圆棒，并同时通过所述上料机构将新的待去除边皮的另一晶圆棒上载于所述开方仓处。
  12. 根据权利要求11所述的晶圆棒开方方法，其特征在于，在通过所述上料机构将待去除所述边皮的所述另一晶圆棒上载于所述开方仓靠近所述移动平台的所述仓口处之前，所述晶圆棒开方方法还包括将所述晶圆棒固定到所述上料机构的所述备料台上，将所述晶圆棒固定到所述上料机构的所述备料台上的步骤包括：
    将所述晶圆棒从所述上料机构的所述上料台沿所述上料轨道送至所述备料台；
    通过所述备料台上的所述夹固件中的靠近所述上料台的夹固件带动所述晶圆棒朝向所述备料台的靠近所述开方仓的一端移动；
    使所述晶圆棒的远离所述上料台的端面抵顶置于设置在所述备料台上的所述上料轨道的挡块；
    通过所有所述夹固件夹取所述晶圆棒；
    使所述备料台带动所述晶圆棒移动至所述开方仓的靠近所述移动平台的仓门处。
  13. 根据权利要求12所述的晶圆棒开方方法，其特征在于，通过所有所述顶夹机构夹取所述晶圆棒的步骤包括：
    使所述顶夹机构空置悬吊在所述开方仓与所述移动平台之间，并预先设置在所述晶圆棒两端处；
    使所述主顶轴顶固所述晶圆棒的端面；
    使所述副顶轴顶固所述晶圆棒中任一组相对设置的所述边皮的端面；
    使所述顶夹机构带动所述晶圆棒穿过所述夹固件之间的空间区域并进入所述开方仓中准备切割；
    所述备料台带动张开的所述夹固件回撤。
  14. 根据权利要求12或13所述的晶圆棒开方方法，其特征在于，所述下料机构包括部分固设于所述移动平台上的下料台和用于收集所述边皮的收集箱，
    其中，在所述开方仓与所述移动平台之间对所述组边皮进行收集的步骤包括：
    使所述收集箱从所述下料台的下方移至被带离出所述开方仓的所述晶圆棒的正下方；
    松开所述副顶轴并使相对设置的所述边皮下落至所述收集箱的与所述边皮对应设置的放置槽中；
    重复上述步骤，直至收集完所有对位边皮；
    使所述收集箱回撤至其初始位置。
  15. 根据权利要求14所述的晶圆棒开方方法，其特征在于，通过所述下料机构获取无所述边皮的所述晶圆棒的步骤包括：
    使所述下料台移至所述晶圆棒的正下方；
    使所述下料台上升至与所述晶圆棒的下端面接触；
    松开所述主顶轴使所述晶圆棒放置在所述下料台上；
    使所述下料台带动所述晶圆棒返回至其初始位置。
PCT/CN2022/134286 2022-01-26 2022-11-25 晶圆棒开方系统及方法 WO2023142639A1 (zh)

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